Motor, camera module and electronic device

Abstract

The application provides a motor, a camera module and an electronic device, relates to the technical field of terminals, and can realize heat dissipation of an image sensor and improve heat dissipation effect. In the motor, the movable first hard plate is designed to be hollow, a heat dissipation through hole is formed, the image sensor can contact the heat dissipation device through the heat dissipation through hole, and an auxiliary heat dissipation part is designed in the heat dissipation device, so that the heat dissipation area is increased, and the heat dissipation effect is improved.

Description

Technical Field

[0001] This application relates to the field of terminal technology, and in particular to a motor, camera module and electronic device. Background Technology

[0002] With the widespread use of smartphones, tablets, and other electronic devices, users have increasingly higher demands for the shooting quality of these devices. When shooting with electronic devices, camera shake is unavoidable and can affect image quality; therefore, image stabilization mechanisms are necessary in camera modules.

[0003] In related technologies, image stabilization (OIS) motors are used to drive the image sensor to move within its plane to compensate for shake.

[0004] The image sensor is the main heat-generating component of a camera module. Excessive image sensor temperature not only affects its own imaging performance but also impacts surrounding optical components. Therefore, it is essential to design a heat dissipation device within the motor to cool the image sensor. Summary of the Invention

[0005] This application provides a motor, a camera module, and an electronic device that can dissipate heat from an image sensor and improve the heat dissipation effect.

[0006] In a first aspect, embodiments of this application provide a motor. The motor includes: a housing, a first electrical connector, a second electrical connector, a drive mechanism, a heat dissipation device, and a base. The first electrical connector includes a movable first rigid plate for supporting and electrically connecting an image sensor. The housing is a thermally conductive housing. The heat dissipation device is located on the side of the drive mechanism facing the first rigid plate. The housing and the base form a receiving cavity, within which the drive mechanism, the heat dissipation device, and the first rigid plate are located. The drive mechanism drives the first rigid plate to move within the plane of the first rigid plate. A heat dissipation through-hole is formed on the first rigid plate, allowing the image sensor to contact the heat dissipation device through the through-hole. The heat dissipation device includes a heat dissipation device body and an auxiliary heat dissipation portion formed on the heat dissipation device body, the auxiliary heat dissipation portion increasing the heat dissipation area.

[0007] The heat generated by the image sensor can be directly transferred to the heat dissipation device, and the auxiliary heat dissipation part of the heat dissipation device can be combined to increase the heat dissipation area, thereby improving the heat dissipation effect of the image sensor.

[0008] According to the first aspect, the heat sink body includes a heat sink base plate, which is located between the first rigid plate and the drive mechanism, and the image sensor is in contact with the heat sink base plate.

[0009] According to the first aspect, or any implementation of the first aspect above, a protrusion is formed on the heat dissipation base plate, protruding from the heat dissipation base plate toward the image sensor. The protrusion is located within the heat dissipation through-hole of the Haloxylon ammodendron tree and is in contact with the image sensor. In this way, in some cases, normal assembly of the image sensor and the first hardware can be guaranteed.

[0010] According to the first aspect, or any implementation thereof, the heat sink body includes a heat sink base plate and a heat conduction plate. The heat sink base plate is located between the first rigid plate and the driving mechanism, and the heat conduction plate is located between the image sensor and the first rigid plate. The heat sink base plate and the heat conduction plate are in contact through heat dissipation holes. The heat from the image sensor is first transferred to the heat sink base plate through the heat conduction plate, achieving efficient heat dissipation.

[0011] According to the first aspect, or any implementation of the first aspect above, the heat-conducting plate is formed with a heat-conducting bump protruding from the heat-conducting plate toward the heat-dissipating base plate, the heat-conducting bump being located in the heat dissipation through hole and in contact with the heat dissipation base plate.

[0012] According to the first aspect, or any implementation thereof, the vertical projection of the image sensor onto the first rigid board covers the heat dissipation vias. This allows for a smaller planar dimension of the heat dissipation vias, increasing the wiring area of ​​the first rigid board while ensuring heat dissipation, ensuring the wiring spacing meets requirements, and reducing or even eliminating interference between wiring traces.

[0013] According to the first aspect, or any implementation of the first aspect above, the vertical projection of the image sensor on the first rigid plate is located within the vertical projection of the heat-conducting plate on the first rigid plate. In this way, the bottom of the image sensor is in complete contact with the heat-conducting plate, improving heat dissipation efficiency.

[0014] According to the first aspect, or any implementation thereof, the auxiliary heat dissipation unit includes a comb-shaped heat dissipation structure, which is connected to at least one end of the heat dissipation base plate. Since the comb-shaped heat dissipation structure has a large surface area, thus increasing the heat dissipation area, it can improve the heat dissipation effect. Simultaneously, when the image sensor moves at high speed, the comb-shaped heat dissipation structure forms thermal convection with the surrounding gas, which can increase the thermal convection effect, thereby improving the heat dissipation efficiency, i.e., it can efficiently dissipate heat.

[0015] According to the first aspect, or any implementation thereof, the heat dissipation device further includes a first thermally conductive silicone grease layer disposed on the inner surface of the housing, at least a portion of which is disposed opposite to the comb-shaped heat dissipation structure. Thus, heat dissipated by the comb-shaped heat dissipation structure can be conducted to the housing through the first thermally conductive silicone grease layer, and then dissipated from the housing, further improving heat dissipation efficiency. Simultaneously, the first thermally conductive silicone grease layer also serves to protect the comb-shaped heat dissipation structure from impact.

[0016] According to the first aspect, or any implementation thereof, the base has a base sidewall, and the heat dissipation device further includes a second thermally conductive silicone grease layer and a metal insert. The second thermally conductive silicone grease layer is located on the side surface of the base sidewall facing the comb-shaped heat dissipation structure and is in contact with the comb-shaped heat dissipation structure. The metal insert is embedded in the base sidewall, with one side of the metal insert in contact with the second thermally conductive silicone grease layer and the other side communicating with the outside of the base. In this way, part of the heat from the comb-shaped heat dissipation structure can be quickly conducted to the outside of the motor through the second thermally conductive silicone grease layer and the metal insert, thereby improving the heat dissipation efficiency.

[0017] According to the first aspect, or any implementation of the first aspect above, the auxiliary heat dissipation unit further includes an auxiliary heat dissipation plate; the auxiliary heat dissipation plate is connected to the comb-shaped heat dissipation structure. In this way, the auxiliary heat dissipation plate and the comb-shaped heat dissipation structure cooperate to increase the heat dissipation area, thereby improving the heat dissipation effect.

[0018] According to the first aspect, or any implementation of the first aspect above, the comb-shaped heat dissipation structure is bent towards the top of the housing and connected to the auxiliary heat dissipation plate, with the top of the housing facing the base. In this way, the heat dissipation effect can be improved by reducing the gap between the auxiliary heat dissipation plate and the top of the housing.

[0019] According to the first aspect, or any of the above implementations of the first aspect, the auxiliary heat sink, the comb-shaped heat dissipation structure, and the heat sink base plate are located on the same plane.

[0020] According to the first aspect, or any implementation thereof, a third thermally conductive silicone grease layer is provided on the surface of the auxiliary heat sink facing the top of the housing, and the third thermally conductive silicone grease layer is in contact with the top of the housing. Thus, heat conducted from the image sensor to the auxiliary heat sink can be quickly conducted to the housing via the third thermally conductive silicone grease layer, and then dissipated to the outside by the housing, improving heat dissipation efficiency.

[0021] According to the first aspect, or any implementation of the first aspect above, the auxiliary heat dissipation part includes a recess formed in the heat dissipation base plate, and the first rigid plate and the image sensor are located in the recess. In this way, by providing the recess, the heat dissipation area of ​​the heat dissipation device is increased, thereby improving the heat dissipation effect.

[0022] According to the first aspect, or any implementation of the first aspect above, at least one end of the heat dissipation base plate has a bent portion that bends from the top of the housing toward the drive mechanism. By providing this bent portion, the heat dissipation area is increased, thereby improving the heat dissipation effect.

[0023] According to the first aspect, or any implementation of the first aspect above, the first electrical connector further includes a first flexible board and a second rigid board. One end of the first flexible board is connected to the first rigid board, and the other end of the first flexible board is connected to the second rigid board. The first flexible board bends the second rigid board to the opposite side of the first rigid board. The auxiliary heat dissipation part is provided with a clearance area to avoid the first flexible board. In this way, the first flexible board is bent through the clearance area.

[0024] According to the first aspect, or any implementation of the first aspect above, at least one end of the heat dissipation device body is formed with an auxiliary bending block, the auxiliary bending block is located in the avoidance area, and the surface of the auxiliary bending block is a smooth curved surface. In this way, the auxiliary bending block can provide positioning and guidance for the bending of the first flexible board, which is convenient for assembly; the auxiliary bending block can also disperse the bending stress, so that the bending stress is evenly distributed over a larger area, reducing damage to the first flexible board.

[0025] Secondly, embodiments of this application provide a camera module, including: a lens, an image sensor, and a motor according to the first aspect above or any implementation of the first aspect above, wherein the image sensor is located on the light-emitting side of the lens and the image sensor is fixed on the first electrical connector of the motor.

[0026] According to the second aspect, the camera module also includes a prism located on the light-incident side of the lens, which is used to reflect the incident light back to the lens.

[0027] Thirdly, embodiments of this application provide an electronic device. The electronic device includes a device housing and a camera module disposed inside the device housing, which is an implementation of the second aspect or any of the second aspects described above. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0029] Figure 2 for Figure 1 An exploded view of the electronic device shown.

[0030] Figure 3 This is a schematic diagram illustrating the structure of a periscope camera module within an electronic device.

[0031] Figure 4 A three-dimensional structural schematic diagram of a motor from one perspective, provided for an embodiment of this application;

[0032] Figure 5 for Figure 4 An exploded view of the motor shown;

[0033] Figure 6 for Figure 4 A top view of the motor shown;

[0034] Figure 7 for Figure 4 A cross-sectional view of the motor shown along the AA' direction;

[0035] Figure 8 for Figure 4 The diagram shows the internal structure of the motor.

[0036] Figure 9 This is a schematic diagram of a heat dissipation device provided in an embodiment of this application;

[0037] Figure 10 This is a schematic diagram of another heat dissipation device provided in an embodiment of this application;

[0038] Figure 11 for Figure 10 The diagram shows the structure of the heat dissipation device and the housing.

[0039] Figure 12 This is a schematic diagram of another heat dissipation device provided in an embodiment of this application;

[0040] Figure 13 for Figure 12 The diagram shows the structure of the heat dissipation device and the housing.

[0041] Figure 14 This is a schematic diagram of another heat dissipation device provided in an embodiment of this application;

[0042] Figure 15 for Figure 14 The diagram shows the structure of the heat dissipation device and the housing.

[0043] Figure 16 This is a schematic diagram of the internal structure of another motor provided in an embodiment of this application;

[0044] Figure 17 for Figure 15 A schematic diagram of the heat dissipation device for the motor shown.

[0045] Figure 18 for Figure 17 The side view of the heat dissipation device shown;

[0046] Figure 19 This is a schematic diagram of another heat dissipation device provided in an embodiment of this application;

[0047] Figure 20 for Figure 4 Another exploded view of the motor shown;

[0048] Figure 21 for Figure 20 A cross-sectional view of the motor shown;

[0049] Figure 22 This is a three-dimensional structural diagram of the heat-conducting plate provided in an embodiment of this application. Detailed Implementation

[0050] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0051] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0052] The terms "first" and "second," etc., used in the specification and claims of this application are used to distinguish different objects, not to describe a specific order of objects. For example, "first target object" and "second target object," etc., are used to distinguish different target objects, not to describe a specific order of target objects.

[0053] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0054] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more. For example, multiple processing units means two or more processing units; multiple systems means two or more systems.

[0055] Furthermore, the mathematical concepts mentioned in the embodiments of this application, such as parallel and perpendicular, are limitations specific to the current technological level, rather than absolute and strict mathematical definitions. Slight deviations are permissible; approximations of parallelism or perpendicularity are acceptable. For example, "A and B are parallel" means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 and 10 degrees. Similarly, "A and B are perpendicular" means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 and 100 degrees.

[0056] This application provides an electronic device, which can be a consumer electronics product. Examples include, but are not limited to, mobile phones, portable Android devices (PADs), notebook computers (Notebooks), ultra-mobile personal computers (UMPCs), walkie-talkies, netbooks, point-of-sale (POS) machines, personal digital assistants (PDAs), wearable devices, virtual reality (VR) devices, and augmented reality (AR) devices.

[0057] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. (Refer to...) Figure 1 As shown, taking a mobile phone as an example, the electronic device may include a screen 1 and a device housing 2. One side surface of the screen 1 is used to display image information, and this side surface of the screen 1 is usually defined as its front, while the other side surface opposite to its front is its back. The device housing 2 surrounds the periphery and back of the screen 1, and is used to support and fix the screen 1 and provide protection. The front of the screen 1 is exposed outside the device housing 2 so that the user can view the content displayed on the screen 1 or perform input operations on the electronic device.

[0058] Typically, the surface on one side where screen 1 is located is defined as the front of the electronic device, and the surface on the other side of the electronic device opposite to its front is defined as its back.

[0059] Figure 2 for Figure 1 An exploded view of the electronic device shown. (Refer to...) Figure 2 As shown, the device housing 2 of the electronic device may include a mid-frame 21 and a back cover 22. The mid-frame 21 is connected between the screen 1 and the back cover 22. The screen 1 is supported on the front of the mid-frame 21 (the side of the mid-frame 21 facing the front of the electronic device), and the back cover 22 is connected to the back of the mid-frame 21 (the side of the mid-frame 21 facing the back of the electronic device, or the side of the mid-frame 21 facing the back cover 22). The screen 1 is typically supported entirely on the mid-frame 21 to ensure its strength and stability, meeting the usage requirements. The back cover 22 is typically connected to the mid-frame 21 by overlapping. The mid-frame 21 and the back cover 22 form an accommodating space, within which components such as the main circuit board 200, camera module 100, battery (not shown), and microphone (not shown) are housed.

[0060] The mid-frame 21 may include a mid-plate portion 211 and a border portion 212. The mid-plate portion 211 is located between the screen 1 and the back cover 22, and is generally arranged parallel to the screen 1 and the back cover 22. The border portion 212 surrounds the periphery of the mid-plate portion 211. The border portion 212 may, for example, be perpendicular to the surface of the mid-plate portion 211. The screen 1 and the back cover 22 may both be located within the area enclosed by the border portion 212. For example, the border portion 212 and the mid-plate portion 211 may be an integrally formed structure.

[0061] The camera module 100 and the main circuit board 200 can be mounted on the mid-frame 21, for example, on the back of the mid-plate portion 211 of the mid-frame 21. The main circuit board 200 can be the core circuit board (a circuit board integrating major components such as a processor, system chip, and power chip) within the electronic device, and the camera module 100 can be electrically connected to the main circuit board 200. For example, the camera module 100 can be equipped with a female BTB (Board-to-board) connector, and the main circuit board 200 can be equipped with a male BTB connector. Electrical connection between the camera module 100 and the main circuit board 200 is achieved by inserting the female connector into the male connector. The main circuit board 200 may, for example, be equipped with a processor that controls the camera module 100 to capture images. When a user inputs a shooting command, the processor receives the command and controls the camera module 100 to capture images of the target object according to the command.

[0062] It should be noted that Figure 2 The diagram shows an electronic device with one camera module 100. However, in practical applications, the number of camera modules 100 in an electronic device is not limited to one; there can be two or more. When there are multiple camera modules 100, they can be arranged arbitrarily along the planar direction of the camera modules 100. For example, multiple camera modules 100 can be arranged at intervals along the X direction in the diagram, or at intervals along the Y direction in the diagram, or arranged in an array along both the X and Y directions in the diagram, etc.

[0063] The camera module 100 can be a rear camera or a front camera. As the name suggests, a rear camera means that the camera module 100 is positioned with its light-incident surface facing the back cover 22. In this case, the back cover 22 can have a light-transmitting hole, and the light-incident surface of the camera module 100 is exposed in the light-transmitting hole. The camera module 100 collects the ambient light from the side where the back of the electronic device is located. In contrast to the rear camera, a front camera means that the camera module 100 is positioned with its light-incident surface facing the screen 1. In this case, the area on the screen 1 corresponding to the light-incident surface of the camera module 100 can be a light-transmitting area, and the ambient light from the side where the front of the electronic device is located shines on the light-incident surface of the camera module 100 through the light-transmitting area of ​​the screen 1.

[0064] The camera module 100 can be structured in either a vertical or periscope manner. As consumers demand higher shooting performance from electronic devices, camera modules 100 are increasingly trending towards higher pixel counts and larger apertures. To enhance zoom performance, the length of the camera module 100 along its optical axis is typically quite large. Furthermore, to meet the demand for ultra-thin electronic devices, camera modules 100 with folded optical paths, i.e., periscope camera modules, have been developed. Periscope camera modules, by adding prisms, allow the optical axis of the lens of the camera module 100 to be aligned with the plane of the electronic device, thereby reducing the size of the camera module 100 in the thickness direction (i.e., the Z-direction) of the electronic device while maintaining the optical path length.

[0065] Figure 3 This is a schematic diagram of a periscope camera module within an electronic device. (Refer to...) Figure 3 As shown, the camera module includes a prism 110, a lens 120, an image sensor 130, and a motor 140, which are arranged sequentially along the optical path of the camera module. Ambient light is reflected by the prism 110, then passes through the lens 120, and forms an image on the image sensor 130 on the light-emitting side of the lens 120. The motor 140 drives the image sensor 130 to move within its plane to perform displacement compensation, preventing blurring of the captured image, improving image clarity, and achieving optical image stabilization.

[0066] The camera module may also include a filter 150, which can be fixed to the motor 140 via a support frame 160. The filter 150 and the image sensor 130 are disposed opposite each other, and the filter 150 is located between the photosensitive surface of the image sensor 130 and the light-emitting side of the lens 120. The filter 150 can be bonded to the support frame 160, which can be a frame structure surrounding the filter 150.

[0067] The filter 150 can filter out certain wavelengths of light, allowing only certain wavelengths to pass through. This can reduce some ghosting and stray light, and also provide some protection for the image sensor 130. For example, the filter 150 can be an infrared filter, which can filter out infrared light while allowing other wavelengths of light to pass through.

[0068] In some embodiments, the image sensor 130 may be a charge-coupled device (CCD), a complementary metal oxide semiconductor (CMOS), or a thin film transistor (TFT), etc.

[0069] As is well known, the image sensor is the main heat-generating component of a camera module. Excessive image sensor temperature not only affects its own imaging performance but also impacts surrounding optical components. Therefore, it is essential to cool the image sensor by incorporating a heat dissipation device within the motor.

[0070] In related technologies, one scenario involves the image sensor being fixed to a stationary component. In this case, cooling can be achieved by applying or attaching thermally conductive material to the bottom of the image sensor. Another scenario is where, due to limitations in the thickness direction of the electronic device, it's impossible to place thermally conductive material on the bottom of the image sensor, as this would increase its thickness. Therefore, the image sensor is typically positioned on the side of the drive mechanism away from the lens. This brings the image sensor closer to the bottom metal component, allowing for cooling through a small gap. However, when the image sensor is located on the side of the drive mechanism facing the lens, it is far from the metal housing and base, making cooling impossible using the aforementioned two methods. Therefore, in this case, a heat dissipation device is needed to reduce the image sensor's temperature.

[0071] Based on the above-mentioned technical problems, the embodiments of this application hollow out the first rigid plate, set a heat dissipation base plate on the side of the first rigid plate away from the image sensor, and increase the heat dissipation area by auxiliary heat dissipation part to achieve the heat dissipation effect of the image sensor.

[0072] The motor provided in this application embodiment can be applied to different types of camera modules, such as periscope, main camera, and wide-angle cameras. The following description, using a motor applied in a periscope camera module as an example, details the structure of the motor provided in this application embodiment.

[0073] In this embodiment, the specific structure of the motor will be described below with reference to the accompanying drawings.

[0074] like Figures 4 to 8 As shown, the motor includes: a housing 141, a first electrical connector 1421, a second electrical connector 1422, a drive mechanism, a heat dissipation device 149, and a base 148. The first electrical connector 1421 includes a movable first rigid plate 14211 for supporting and electrically connecting the image sensor 130. The heat dissipation device 149 is located on the side of the drive mechanism facing the first rigid plate 14211. The housing 141 and the base 148 form a receiving cavity, within which the drive mechanism, heat dissipation device 149, and first rigid plate 14211 are located. The drive mechanism drives the first rigid plate 14211 to move within its plane. The first rigid plate 14211 has a heat dissipation through hole 142110, through which the image sensor 130 can contact the heat dissipation device 149. The heat dissipation device 149 may include a heat dissipation device body and an auxiliary heat dissipation part formed on the heat dissipation device body, the auxiliary heat dissipation part being used to increase the heat dissipation area. In this way, the heat generated by the image sensor 130 can be directly transferred to the heat dissipation device 149, and the heat dissipation area can be increased by combining the auxiliary heat dissipation part of the heat dissipation device 149, thereby improving the heat dissipation effect of the image sensor 130.

[0075] For example, the driving mechanism may include a first carrier 143, a second carrier 144, a first coil 145, a second coil 146, and a magnetic element 147; a first rigid plate 14211 is fixedly connected to a first side of the first carrier 143, the first coil 145 is fixed to a second side of the first carrier 143 and electrically connected to a first electrical connector 1421, the first side and the second side being opposite sides of the first carrier 143; the second carrier 144 is located on the side of the first coil 145 away from the first carrier 143, the magnetic element 147 is fixed to the second carrier 144, and the first carrier 143 and the second carrier 144 are movably connected; a base 148 is located on the side of the second carrier 144 away from the first carrier 143, and the second electrical connector 147... 1422 is fixed to the base 148 and electrically connected to the first electrical connector 1421. The second coil 146 is fixed to the side of the base 148 facing the second carrier 144 and electrically connected to the second electrical connector 1422. The second carrier 144 is movably connected to the base 148. The first coil 145 is used to drive the first carrier 143 to move relative to the second carrier 144 in a first direction (which can be the Z direction or the X direction, depending on the requirements) under the action of the magnetic component 147. The second coil 146 is used to drive the second carrier 144 to move relative to the base 148 in a second direction (which can be the X direction or the Z direction, depending on the requirements) under the action of the magnetic component 147.

[0076] In this embodiment, when the first coil 145 is energized, it is affected by the magnetic field generated by the magnetic component 147 and experiences an Ampere force in the first direction (which can be determined according to the left-hand rule). Since the first coil 145 is fixed on the first carrier 143, the first carrier 143 moves along the first direction under the action of this Ampere force. Furthermore, since the first electrical connector 1421 is fixed on the first carrier 143 and the image sensor 130 is fixed on the first electrical connector 1421, the image sensor 130 moves along the first direction with the first carrier 143. Thus, a driving design in the first direction, i.e., a moving coil design, is achieved. When the second coil 146 is energized, it is affected by the magnetic field generated by the magnetic component 147 and experiences an Ampere force in the second direction (which can be determined according to the left-hand rule). Since the second coil 146 is fixed on the base 148, under the action of this Ampere force, according to the principle that forces are reciprocal, the second carrier 144 moves along the second direction, thereby driving the first carrier 143 to move along the second direction. Since the first electrical connector 1421 is fixed to the first carrier 143 and the image sensor 130 is fixed to the first electrical connector 1421, the image sensor 130 will move along the second direction with the second carrier 144. In this way, the driving design in the second direction, i.e., the moving magnet design, is realized.

[0077] To achieve closed-loop control, an angle sensing element is set in each driving direction. By detecting and feeding back the displacement in the sensing direction in real time, the image sensor moves to the target position in the corresponding direction, achieving precise compensation for jitter. In some embodiments, the motor also includes a first tunnel magnetoresistive angle sensor and a second tunnel magnetoresistive angle sensor. The first tunnel magnetoresistive angle sensor is fixed to the second side of the first carrier and connected to the first electrical connector, and the second tunnel magnetoresistive angle sensor is fixed to the side of the base facing the second carrier and electrically connected to the second electrical connector.

[0078] When driving in two directions simultaneously, the distance between the angle sensing element (including the aforementioned first tunnel magnetoresistive angle sensor and second tunnel magnetoresistive angle sensor) and the magnetic component changes in the non-sensing direction, causing crosstalk problems in the angle sensing element's sensing. Based on this, this application achieves complete decoupling of the sensing functions of the first tunnel magnetoresistive angle sensor and the second tunnel magnetoresistive angle sensor through a feedback sensing decoupling design.

[0079] Specifically, when the second coil 146 drives the second carrier 144 to move along the X direction, the distance between the second tunnel magnetoresistive angle sensor and the magnetic element 147 changes in the sensing direction, but not in the non-sensing direction. The second carrier 144 drives the first carrier 143 to move, while the first tunnel magnetoresistive angle sensor is fixed to the first carrier 143, and the first tunnel magnetoresistive angle sensor and the magnetic element 147 remain relatively stationary. When the first coil 145 drives the first carrier 143 to move along the Z direction, the second carrier 144 remains stationary, and the distance between the first tunnel magnetoresistive angle sensor and the magnetic element 147 changes in the sensing direction, but not in the non-sensing direction. There is no change in distance between the second tunnel magnetoresistive angle sensor and the magnetic element 147. Therefore, even if driven simultaneously in both directions, the first and second tunnel magnetoresistive angle sensors only experience distance changes with the magnetic element 147 in the corresponding sensing directions, with no interference in the non-sensing directions, thus significantly reducing the impact of sensing crosstalk on the first and second tunnel magnetoresistive angle sensors.

[0080] Correspondingly, the first electrical connector 1421 also includes a first flexible board 14212 and a second rigid board 14213. The first flexible board 14212 is bent from the first side of the first carrier 143 to the second side of the first carrier 143, and the second rigid board 14213 is fixed to the second side of the first carrier 143. The first rigid board 14211 and the second rigid board 14213 are electrically connected through the first flexible board 14212. The first coil 145 and the first tunnel magnetoresistive angle sensor are disposed on the second rigid board 14213. In this way, the first coil 145 and the first tunnel magnetoresistive angle sensor are fixed to the first carrier 143 through the second rigid board 14213, realizing the transmission of power signals and sensing signals. It should be understood that when two first coils 145 are provided, the first flexible board 14212 and the second rigid board 14213 are connected to opposite sides of the first rigid board 14211 to realize electrical connection with the two first coils 145.

[0081] The flexible circuit board involved in this application is a flexible circuit board, and the rigid circuit board is a printed circuit board. The first electrical connector 1421 is a rigid-flex board, which can be combined with the flexible circuit board and the printed circuit board through processes such as lamination, and has the characteristics of both flexible circuit boards and printed circuit boards.

[0082] In this embodiment, the specific structures of the five heat dissipation devices will be described below with reference to the accompanying drawings.

[0083] First implementation method: such as Figures 5 to 9As shown, the main body of the heat dissipation device is a heat dissipation base plate 1491, and the auxiliary heat dissipation part is a comb-shaped heat dissipation structure 14911. In this case, the heat dissipation device 149 includes a heat dissipation base plate 1491 and a comb-shaped heat dissipation structure 14911 extending from at least one end of the heat dissipation base plate 1491. A first rigid plate 14211 is located on the heat dissipation base plate 1491, and the image sensor 130 contacts the heat dissipation base plate 1491 through a heat dissipation through-hole 142110. Thus, the heat generated by the image sensor 130 is transferred to the heat dissipation base plate 1491, and then from the heat dissipation base plate 1491 to the outwardly extending comb-shaped heat dissipation structure 14911, whereby the comb-shaped heat dissipation structure 14911 dissipates the heat. Optionally, the heat dissipation base plate 1491 and the comb-shaped heat dissipation structure 14911 can be made of materials with high thermal conductivity, such as aluminum alloy or copper.

[0084] Because the comb-shaped heat dissipation structure 14911 has a large surface area, i.e., an increased heat dissipation area, it can improve the heat dissipation effect. At the same time, when the image sensor moves at high speed, the comb-shaped heat dissipation structure 14911 forms thermal convection with the surrounding gas, which can increase the thermal convection effect and thus improve the heat dissipation efficiency, i.e., it can efficiently dissipate heat.

[0085] In some embodiments, the heat dissipation device 149 may further include a first thermally conductive silicone grease layer 1493 disposed on the inner surface of the housing 141 (in this embodiment, a metal housing is used, which may be made of copper), with the first thermally conductive silicone grease layer 1493 facing the comb-shaped heat dissipation structure 14911. Thus, the heat dissipated by the comb-shaped heat dissipation structure 14911 can be conducted to the housing 141 through the first thermally conductive silicone grease layer 1493, and then dissipated by the housing 141, further improving heat dissipation efficiency. Simultaneously, the first thermally conductive silicone grease layer 1493 can also act as a shock absorber for the comb-shaped heat dissipation structure 14911. The comb-shaped heat dissipation structure 14911 may or may not be in contact with the first thermally conductive silicone grease layer 1493.

[0086] In some embodiments, the heat dissipation device 149 may further include a second thermally conductive silicone grease layer 1494 disposed on the sidewall of the base and a metal insert 1495 embedded in the sidewall of the base 1481. The comb-shaped heat dissipation structure 14911 is in contact with the second thermally conductive silicone grease layer 1494, and one side of the metal insert 1495 is in contact with the second thermally conductive silicone grease layer 1494, while the other side is connected to the outside of the base. In this way, some of the heat from the comb-shaped heat dissipation structure 14911 can be quickly conducted to the outside of the motor via the second thermally conductive silicone grease layer 1494 and the metal insert 1495, thereby improving heat dissipation efficiency.

[0087] In some embodiments, when a comb-shaped heat dissipation structure 14911 is provided at the position of the heat dissipation device 149 corresponding to the first flexible board 14212, the comb-shaped heat dissipation structure 14911 is provided with an avoidance area 14915 so that the first flexible board 14212 can be bent through the avoidance area 14915.

[0088] In some embodiments, at least one end of the heat dissipation base plate 1491 is formed with an auxiliary bending block 14916, which is located in the avoidance area 14915. The surface of the auxiliary bending block 14916 is a smooth curved surface, allowing the first flexible plate 14212 to be bent along the auxiliary bending block 14916. In this way, the auxiliary bending block 14916 can provide positioning and guidance for the bending of the first flexible plate 14212, facilitating assembly; the auxiliary bending block 14916 can also disperse bending stress, making the bending stress evenly distributed over a larger area, reducing damage to the first flexible plate 14212.

[0089] Furthermore, to ensure proper assembly of the image sensor 130 and the first rigid plate 14211, if the surface of the heat sink 1491 facing the image sensor 130 is on the same plane, a gap may exist between the image sensor 130 and the heat sink 1491. Therefore, in some embodiments, a protrusion 14917 is formed on the heat sink 1491, protruding from the heat sink 1491 towards the image sensor 130, and this protrusion 14917 contacts the image sensor 130. The planar dimensions of the protrusion 14917 (dimensions within the XZ plane shown in the figure) should be smaller than the planar dimensions of the heat dissipation through-hole 142110, so that the protrusion 14917 is located within the heat dissipation through-hole 142110. Specifically, the vertical projection of the heat dissipation through-hole 142110 onto the heat sink 1491 covers the heat dissipation through-hole 142110. Furthermore, the surface of the protrusion 14917 that contacts the image sensor should be a flat surface, the size of which can be greater than, equal to, or smaller than the planar dimension of the image sensor 130. For example, the size of the flat surface is greater than or equal to the planar dimension of the image sensor 130, thereby enabling the entire surface of the image sensor 130 facing the heat dissipation base plate 1491 to contact the protrusion 14917. This allows more heat to be transferred to the heat dissipation base plate 1491, improving heat dissipation efficiency.

[0090] The second implementation method: Unlike the first implementation method of the heat dissipation device, as follows... Figure 10 and Figure 11As shown, the auxiliary heat dissipation unit may further include an auxiliary heat dissipation plate 14912. A comb-shaped heat dissipation structure 14911 at at least one end of the heat dissipation base plate 1491 is bent towards the top of the housing (in the thickness direction of the motor, the housing closer to the image sensor is the top of the housing) and connected to the auxiliary heat dissipation plate 14912. The auxiliary heat dissipation plate 14912 is disposed opposite to the top of the housing. In this way, the heat dissipation effect can be improved by reducing the gap between the auxiliary heat dissipation plate 14912 and the top of the housing.

[0091] In some embodiments, such as Figure 12 and Figure 13 As shown, the heat dissipation device 149 may further include a third thermally conductive silicone grease layer 1496, which is located between the auxiliary heat dissipation plate 14912 and the top of the housing 141. One side of the third thermally conductive silicone grease layer 1496 contacts the auxiliary heat dissipation plate 14912, and the opposite side contacts the top of the housing 141. Thus, the heat conducted from the image sensor to the auxiliary heat dissipation plate 14912 can be quickly conducted to the housing 141 via the third thermally conductive silicone grease layer 1496, and then dissipated to the outside by the housing 141, improving heat dissipation efficiency.

[0092] Understandably, when the third thermal grease layer 1496 is applied, it will create some resistance to the movement of the heat dissipation device 149, increasing the driving force of the motor but improving heat dissipation efficiency and ensuring the imaging quality of the image sensor. When the third thermal grease layer 1496 is not applied, the driving force of the motor will decrease accordingly, improving driving efficiency.

[0093] The third implementation method: Unlike the second implementation method of the heat dissipation device, as follows... Figure 14 and 15 As shown, the heat dissipation base plate 1491 and the auxiliary heat dissipation plate 14912 are located on the same plane. At this time, the heat dissipation area is increased by the auxiliary heat dissipation plate 14912, thereby improving the heat dissipation effect.

[0094] In some embodiments, the housing 141 may be recessed (correspondingly, the filter may protrude from the housing) to reduce the gap between the housing 141 and the auxiliary heat sink 14912, thereby improving the heat dissipation effect.

[0095] The fourth implementation method: such as Figure 16 , Figure 17 and Figure 18As shown, the heat dissipation auxiliary part is a recessed portion 14913 formed on the heat dissipation base plate 1491. At this time, the heat dissipation device 149 includes a heat dissipation base plate 1491 and a recessed portion 14913 formed on the heat dissipation base plate 1491, with the bottom surface of the recessed portion 14913 being a flat surface. A first rigid plate 1422 is located within the recessed portion 14913, and the image sensor contacts the bottom surface of the recessed portion 14913 through a heat dissipation through-hole 142110 on the first rigid plate 14211. Thus, by providing the recessed portion 14913, the heat dissipation area of ​​the heat dissipation device 149 is increased, thereby improving the heat dissipation effect. The recessed portion 14913 can be extruded.

[0096] In some embodiments, the heat dissipation device 149 further includes a bent portion 14914 located at at least one end of the heat dissipation base plate 1491 and bent from the top of the housing toward the drive mechanism. Exemplarily, the bent portions 14914 are respectively provided at opposite ends of the heat dissipation base plate 1491 (e.g., opposite ends in the X direction). By providing the bent portion 14914, the heat dissipation area is increased, thereby improving the heat dissipation effect.

[0097] Additionally, in some embodiments, such as Figure 19 As shown, the heat dissipation device 149 also includes a third thermally conductive silicone grease layer 1496. The third thermally conductive silicone grease layer 1496 is located on the side of the heat dissipation base plate 1491 facing the top of the housing, and the third thermally conductive silicone grease layer 1496 is located on the flat surface of the heat dissipation base plate 1491 excluding the recessed portion 14913, while the third thermally conductive silicone grease layer 1496 is in contact with the housing. Thus, the heat transferred by the heat dissipation base plate 1491 is conducted to the housing through the third thermally conductive silicone grease layer 1496, and then dissipated through the housing, thereby improving the heat dissipation efficiency.

[0098] In the above four embodiments of the heat dissipation device, the planar dimension of the heat dissipation through-hole 142110 on the first rigid board 1421 is larger than the planar dimension of the image sensor. In this case, the effective area of ​​the first rigid board 1421 is relatively small, meaning the wiring area of ​​the first rigid board 1421 is greatly compressed, resulting in smaller spacing between traces on the first rigid board 1421 and interference between traces. Therefore, this application also provides a fifth embodiment of the heat dissipation device to increase the effective area of ​​the first rigid board 1421. The fifth embodiment of the heat dissipation device is described below with reference to the accompanying drawings.

[0099] Fifth embodiment: The heat dissipation device body includes a heat dissipation base plate 1491 and a heat conduction plate 1492, and the heat dissipation auxiliary part can be any of the four embodiments described above. (Refer to...) Figure 20 , Figure 21 and Figure 22As shown, the heat dissipation device 149 includes a heat dissipation base plate 1491, a heat-conducting plate 1492, and a heat dissipation auxiliary part. The heat-conducting plate 1492 is located between the image sensor 130 and the first rigid plate 14211. The heat-conducting plate 1492 has heat-conducting bumps 14921 that protrude from the heat-conducting plate 1492 towards the heat dissipation base plate 1491. The planar dimension of the heat dissipation through-hole 142110 is smaller than the planar dimension of the image sensor 130, and the planar dimension of the heat-conducting bumps 14921 is smaller than or equal to the planar dimension of the heat dissipation through-hole 142110. The heat-conducting bumps 14921 pass through the heat dissipation through-hole 142110 and contact the heat dissipation base plate 1491. Optionally, the heat-conducting plate 1492 can be made of a metal with good thermal conductivity, such as aluminum or aluminum alloy.

[0100] In this embodiment, the heat generated by the image sensor 130 is efficiently transferred to the heat dissipation base plate 1491 via the heat conduction plate 1492, and then transferred from the heat dissipation base plate 1491 to the auxiliary heat dissipation part (such as the comb-shaped heat dissipation structure, auxiliary heat dissipation plate, bending part, etc. mentioned above). The auxiliary heat dissipation part then performs contact or non-contact heat dissipation with the housing 141, allowing the heat generated by the image sensor to dissipate to the outside of the motor. Thus, while ensuring heat dissipation, the planar dimensions of the heat dissipation through-hole 142110 are reduced, thereby relatively increasing the wiring area of ​​the first rigid board 14211, ensuring that the wiring spacing meets the wiring requirements, and reducing or even eliminating interference between wiring traces.

[0101] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A motor, characterized in that, include: The device comprises a housing, a first electrical connector, a second electrical connector, a drive mechanism, a heat dissipation device, and a base. The first electrical connector includes a movable first rigid plate for supporting and electrically connecting an image sensor. The housing is a thermally conductive housing. The heat dissipation device is located on the side of the drive mechanism facing the first rigid plate. The housing and the base form a receiving cavity, and the drive mechanism, the heat dissipation device, and the first rigid plate are located within the receiving cavity. The drive mechanism is used to drive the first rigid plate to move within the plane of the first rigid plate. The first rigid plate has heat dissipation holes, through which the image sensor can contact the heat dissipation device; wherein, the heat dissipation device includes a heat dissipation device body and an auxiliary heat dissipation part formed on the heat dissipation device body, the auxiliary heat dissipation part being used to increase the heat dissipation area.

2. The motor according to claim 1, characterized in that, The heat sink body includes a heat sink base plate, which is located between the first rigid plate and the driving mechanism, and the image sensor is in contact with the heat sink base plate.

3. The motor according to claim 2, characterized in that, The vertical projection of the image sensor onto the first rigid plate is located within the heat dissipation through-hole.

4. The motor according to claim 2, characterized in that, A protrusion is formed on the heat dissipation base plate, protruding from the heat dissipation base plate toward the image sensor. The protrusion is located inside the heat dissipation through hole of the saxaul tree and is in contact with the image sensor.

5. The motor according to claim 1, characterized in that, The heat sink body includes a heat sink base plate and a heat conduction plate. The heat sink base plate is located between the first rigid plate and the driving mechanism, and the heat conduction plate is located between the image sensor and the first rigid plate. The heat sink base plate and the heat conduction plate are in contact through the heat dissipation through hole.

6. The motor according to claim 5, characterized in that, The heat-conducting plate has heat-conducting protrusions that protrude from the heat-conducting plate toward the heat-dissipating base plate. The heat-conducting protrusions are located in the heat-dissipating through holes and are in contact with the heat-dissipating base plate.

7. The motor according to claim 5 or 6, characterized in that, The vertical projection of the image sensor onto the first rigid plate covers the heat dissipation hole.

8. The motor according to any one of claims 5-7, characterized in that, The vertical projection of the image sensor onto the first rigid plate lies within the vertical projection of the heat-conducting plate onto the first rigid plate.

9. The motor according to any one of claims 2-8, characterized in that, The auxiliary heat dissipation part includes a comb-shaped heat dissipation structure, which is connected to at least one end of the heat dissipation base plate.

10. The motor according to claim 9, characterized in that, The heat dissipation device further includes a first thermally conductive silicone grease layer disposed on the inner surface of the housing, at least a portion of the first thermally conductive silicone grease layer being disposed opposite to the comb-shaped heat dissipation structure.

11. The motor according to claim 9, characterized in that, The base has a base sidewall, and the heat dissipation device further includes a second thermally conductive silicone grease layer and a metal insert. The second thermally conductive silicone grease layer is located on the side surface of the base sidewall facing the comb-shaped heat dissipation structure and is in contact with the comb-shaped heat dissipation structure. The metal insert is embedded in the base sidewall, with one side of the metal insert in contact with the second thermally conductive silicone grease layer and the other side communicating with the outside of the base.

12. The motor according to claim 9, characterized in that, The auxiliary heat dissipation unit further includes an auxiliary heat dissipation plate; the auxiliary heat dissipation plate is connected to the comb-shaped heat dissipation structure.

13. The motor according to claim 12, characterized in that, The comb-shaped heat dissipation structure is bent toward the top of the housing and then connected to the auxiliary heat dissipation plate, with the top of the housing opposite to the base.

14. The motor according to claim 12, characterized in that, The auxiliary heat sink, the comb-shaped heat dissipation structure, and the heat dissipation base plate are located on the same plane.

15. The motor according to any one of claims 12-14, characterized in that, A third thermally conductive silicone grease layer is provided on the surface of the auxiliary heat sink facing the top of the housing, and the third thermally conductive silicone grease layer is in contact with the top of the housing.

16. The motor according to any one of claims 2-8, characterized in that, The auxiliary heat dissipation section includes a recess formed in the heat dissipation base plate, and the first rigid plate and the image sensor are located in the recess.

17. The motor according to claim 16, characterized in that, At least one end of the heat dissipation base plate has a bent portion that bends from the top of the housing toward the drive mechanism.

18. The motor according to any one of claims 1-17, characterized in that, The first electrical connector further includes a first flexible board and a second rigid board. One end of the first flexible board is connected to the first rigid board, and the other end of the first flexible board is connected to the second rigid board. The first flexible board bends the second rigid board to the opposite side of the first rigid board. The auxiliary heat dissipation section is provided with a clearance area to avoid the first flexible circuit board.

19. The motor according to claim 18, characterized in that, At least one side of the heat dissipation device body is provided with an auxiliary bending block, which is located in the avoidance area and has a smooth curved surface.

20. A camera module, characterized in that, include: The lens, the image sensor, and the motor as described in any one of claims 1-19, wherein the image sensor is located on the light-emitting side of the lens and the image sensor is fixed to a first electrical connector of the motor.

21. The camera module according to claim 20, characterized in that, The camera module also includes a prism located on the light-incident side of the lens, which is used to reflect incident light back to the lens.

22. An electronic device, characterized in that, Includes a device housing and a camera module as described in claim 20 or 21 disposed inside the device housing.

Images