Copper-embedded block substrate manufacturing method

Abstract

The present application relates to a kind of buried copper block substrate manufacturing method, including core plate preparation, core plate slot hole, core plate paste high temperature debonding glue film, plug copper block, laser window, core plate paste resist glue film, superimposed PP or resin glue film press, separate the resin layer of press, carry out resin grinding, the production of circuit and surface treatment.The manufacturing method of the present application can ensure that the copper block can be smoothly buried by setting the pyrolytic adhesion material and the diverse material that can be pressed in a traditional way, ensure that the resin can flow, not only the production speed is fast, but also can effectively prevent copper block from falling off, improve the efficiency and quality of resin grinding, reduce cost.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging, such as printed circuit boards, substrates and / or packaging substrates, and particularly to a method for embedding copper blocks when manufacturing printed circuit boards and / or substrates. Background Technology

[0002] PCB, or Printed Circuit Board, is an important electronic component. It serves as the support for electronic components and the carrier for their electrical connections. Because it is manufactured using electronic printing technology, it is called a "printed" circuit board. Embedded copper blocks on PCBs are used to solve the problem of high heat dissipation. Embedded copper blocks are small pieces of high thermal conductivity copper metal that are passively embedded in local areas of multilayer core boards to specifically solve the problem of local heat dissipation on PCBs.

[0003] The prior art application, number 2021030583826.X, entitled "A Simple Double-Sided Embedded Copper Block Product Structure and Manufacturing Method Thereof," discloses a simple double-sided embedded copper block product structure and manufacturing method, including a double-sided PCB board; slots are formed on the double-sided PCB board, and several grooves are formed on the inner walls of the four sides of the slots; the grooves penetrate the upper and lower surfaces of the double-sided PCB board; an embedded copper base is placed in the slot; and resin is filled between the embedded copper base and the inner wall of the slot. This invention application ensures that the copper base can be smoothly embedded by setting corrugated groove edges and slots of a predetermined size. When plugging the holes, the corrugations on the groove edges provide lateral support to the copper base, and the gaps in the corrugated recesses allow resin to flow in, thus not only speeding up the manufacturing process but also effectively preventing the copper block from falling off. However, this invention application has the following shortcomings:

[0004] First, the filling capacity of the insulation layer after lamination is low, which easily leads to voids or poor air bubbles.

[0005] Secondly, the materials used for filling are relatively limited; they can only be resin or ink.

[0006] Third, the inner walls of the slots must be uniformly formed with several grooves, which is a complex structure and process, and is difficult to process. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to avoid the shortcomings of the prior art and provide a method for manufacturing a copper-embedded substrate. The manufacturing method of the present invention is specifically provided for use when embedding copper blocks in circuit boards and / or substrates. By setting a pyrolytic adhesive material and a variety of materials that can be bonded by traditional methods, the manufacturing method of the present invention ensures that the copper block can be successfully embedded and that the resin can flow in. It not only has a fast manufacturing speed, but also effectively prevents the copper block from falling off, improves the efficiency and quality of resin grinding, and reduces costs.

[0008] The technical solution adopted by the present invention to solve the aforementioned technical problem is as follows:

[0009] A method for manufacturing a copper-embedded substrate is provided, comprising the following steps:

[0010] Step A, Core board preparation: The core board includes a core layer and a first metal layer connected to the upper and lower surfaces of the core layer respectively;

[0011] Step B, Core board slotting: Slotting holes are machined into the core board according to the size of the copper block;

[0012] Step C, applying high-temperature de-adhesive film to the core board: using equipment to press the film onto the core board, so that the high-temperature de-adhesive film is adhered to any of the first metal layers of the core board;

[0013] Step D, inserting copper blocks: insert copper blocks into the slots of the core board, and attach the bottom of the copper blocks to the high-temperature adhesive film;

[0014] Step E, laser window opening: use a laser to burn away the gaps around the copper block that need to be filled;

[0015] Step F, applying resist film to the core board: using equipment to press the film and apply it to the core board, so that the resist film is adhered to another first metal layer of the core board;

[0016] Step G, laminating PP or resin film: Lay PP or pure resin film on the high-temperature debonding membrane, and place the laminated structure into the press for lamination.

[0017] Step H, Separating the pressed resin layer: Manually peeling off the pressed resin layer, high-temperature de-adhesion film, and adhesive-resistant film;

[0018] Step 1, Resin Grinding: Grind off the resin above the first metal layer to remove the resin residue on the core board surface;

[0019] Step J, Fabrication of Circuitry and Surface Treatment: Fabrication of the circuitry layer and surface treatment layer.

[0020] In step B, the slot is 0.075 to 0.1 mm larger than each side of the copper block.

[0021] In step D, the gaps between the periphery of the copper block and the slots in the core plate are uniform.

[0022] Compared with the prior art, the beneficial effects of the method for manufacturing a copper-embedded substrate of the present invention are as follows:

[0023] I. The manufacturing method of this invention improves the reliability of the copper-embedded area and does not cause voids after filling;

[0024] Second, the thickness of the insulation layer is better controlled after lamination, and the insulation layer has a stronger filling capacity.

[0025] Third, the amount of resin to be ground after filling is smaller, which greatly reduces the difficulty of grinding;

[0026] Fourth, the manufacturing method of this invention improves the efficiency and quality of resin grinding and reduces costs;

[0027] 5. Removing protective films such as the release film and the adhesive barrier film does not require additional mechanical processing; they can be directly peeled off.

[0028] VI. In addition to resin or ink, ABF film or PP prepreg can also be used as filler materials;

[0029] 7. By using adhesive release film and adhesive resistance film, the areas of the PCB substrate that do not need to be printed can be isolated during the manufacturing of embedded copper block circuit boards, effectively playing a role in isolation and protection.

[0030] In summary, the manufacturing method of this invention, by setting pyrolytic adhesive materials and using a variety of materials that can be bonded using traditional methods, ensures that the copper block can be successfully embedded and that the resin can flow in. This not only speeds up the manufacturing process but also effectively prevents the copper block from falling off, improving the efficiency and quality of resin grinding and reducing costs. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the orthographic projection of the core board used in this invention;

[0032] Figure 2 This is a schematic diagram of the main sectional view of the multilayer core board in orthographic projection;

[0033] Figure 3 This is a schematic diagram of the orthographic projection of the slotted holes on the core board;

[0034] Figure 4 This is a top-view diagram of the slotted holes on the core board;

[0035] Figure 5 This is a schematic diagram of the orthographic projection of the main cross-section of the core board with the high-temperature adhesive film and copper blocks attached.

[0036] Figure 6 This is a schematic diagram of the orthographic projection of the main cross-section of the core board with the resist film attached.

[0037] Figure 7 This is a schematic diagram of the orthographic projection of the pressing of PP or resin film in step G.

[0038] Figure 8 This is a schematic diagram of the orthographic projection of the main section of the core board after separating and pressing the resin layer in step H.

[0039] Figure 9 This is a schematic diagram of the orthographic projection of the main section of the core board after resin grinding in step I.

[0040] Figure 10 This is a schematic diagram of the orthographic projection of the core board after step J circuitry and surface treatment. Detailed Implementation

[0041] The present invention will now be described in further detail with reference to the accompanying drawings.

[0042] See Figures 1 to 10 The present invention also provides a method for manufacturing a copper-embedded substrate, comprising the following steps:

[0043] Step A, Core Board Preparation: See Figure 1 The core board includes a core layer 101 and a first metal layer 102 connected to the upper and lower surfaces of the core layer 101, respectively. The core board, also called CCL, is commonly known as copper clad laminate (CCL) and is a core raw material for manufacturing printed circuit boards (PCBs). Figure 2 As shown, the core board can also be a substrate that has been laminated multiple times.

[0044] Step B, Core board slotting: See Figure 3 and Figure 4 The core board is machined with slotted holes 108, which are correspondingly machined according to the size of the copper block 109. The slotted holes 108 are 0.075 to 0.1 mm larger than the copper block on one side, that is, the length and width of the slotted holes 108 need to be 0.15 to 0.2 mm larger than the length and width of the copper block 109. The process of making the slotted holes is the same as the existing technology, and will not be described in detail here.

[0045] Step C, applying high-temperature adhesive film to the core board: See Figure 5 The equipment is used to press the film and bond it to the core board, so that the high-temperature de-adhesive film 103 is adhered to any of the first metal layers 102 of the core board; the high-temperature de-adhesive film 103 is tacky at room temperature, and its tackiness decreases after the temperature exceeds 200°C, making it easy to separate; the structure of the high-temperature de-adhesive film 103 includes a base film material of PI polyimide and a synthetic adhesive layer, the synthetic adhesive layer is bonded to the first metal layer 102, and there is also a thin release agent layer on the PI layer;

[0046] Step D, insert copper blocks: See Figure 5 Insert the copper block 109 into the slot 108 of the core board, and stick the bottom of the copper block 109 onto the high-temperature de-adhesive film 103; the gap between the copper block 109 and the slot 108 of the core board should be uniform; the copper block 109 is placed before layout, which can save time of placing the copper block during layout compared to the conventional process; the copper block is also called copper base.

[0047] Step E, Laser Windowing: See Figure 5 The gaps around the copper block 109 that need to be filled are burned off using a laser; the laser windowing process is the same as existing technology and will not be described in detail here.

[0048] Step F, applying the resist film to the core board: The resist film 104 is adhered to the core board using a pressing device, thus attaching it to the other first metal layer 102 of the core board. The resist film 104 is tacky at room temperature and can withstand a high temperature of 240℃ and a pressure of 450 PSI. PSI is an imperial unit of pressure, meaning pound force per square inch. The resist film 104 consists of a base film material of PI polyimide and a synthetic adhesive layer, which is bonded to the other first metal layer 102. After applying the resist film 104, the core board is flipped so that the high-temperature release adhesive film 103 is on top and the resist film 104 is on the bottom. Figure 6 As shown;

[0049] Step G, laminating and pressing the PP or resin film: See [link / reference] Figure 7 PP or pure resin film is stacked on the high-temperature de-adhesion membrane 103. The stacked structure is then placed in a press for pressing. In this way, PP or resin can be filled into the gaps of the slots 108 around the copper block 109. The filling material used in this invention can be resin or ink, or ABF film or PP prepreg can be used. ABF film (Ajinomoto Build-up Film) is a high-performance epoxy resin-based insulating film.

[0050] Step H, separating the pressed resin layers: See Figure 8 The resin layer is manually peeled off and pressed. The high-temperature de-adhesion membrane 103 reduces the adhesion after high-temperature pressing, allowing for good separation. The adhesive barrier membrane 104 is also removed simultaneously.

[0051] Step I, resin grinding: See Figure 8 and Figure 9 The resin 107 above the first metal layer 102 is ground off to remove residual resin from the core board surface, facilitating subsequent manufacturing processes. Compared to traditional processes, the resin grinding method of this invention leaves less resin or ink residue; only a small area above the filling gaps requires grinding, resulting in a smaller grinding volume and lower grinding difficulty. Figure 8 As shown, the resin 107 that needs to be ground only has a small portion of the first metal layer 102 exposed through a window, and the resin will not stick to the copper surface, whereas in the prior art, resin would stick to the copper surface.

[0052] Step J, Fabrication of circuitry and surface treatment: See Figure 10 The fabrication of the circuit layer and the surface treatment layer are the same as existing technologies, and will not be described in detail here.

[0053] The above-described embodiments are merely preferred embodiments of the present invention, and are described in a relatively specific and detailed manner. However, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements are all within the scope of protection of the present invention. Therefore, all equivalent transformations and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.

Claims

1. A method for manufacturing a copper-embedded substrate, characterized in that, Includes the following steps: Step A, Core board preparation: The core board includes a core layer and a first metal layer connected to the upper and lower surfaces of the core layer respectively; Step B, Core board slotting: Slotting holes are machined into the core board according to the size of the copper block; Step C, applying high-temperature de-adhesive film to the core board: using equipment to press the film onto the core board, so that the high-temperature de-adhesive film is adhered to any of the first metal layers of the core board; Step D, inserting copper blocks: insert copper blocks into the slots of the core board, and attach the bottom of the copper blocks to the high-temperature adhesive film; Step E, laser window opening: use a laser to burn away the gaps around the copper block that need to be filled; Step F, applying resist film to the core board: using equipment to press the film and apply it to the core board, so that the resist film is adhered to another first metal layer of the core board; Step G, laminating PP or resin film: Lay PP or pure resin film on the high-temperature debonding membrane, and place the laminated structure into the press for lamination. Step H, Separating the pressed resin layer: Manually peeling off the pressed resin layer, high-temperature de-adhesion film, and adhesive-resistant film; Step 1, Resin Grinding: Grind off the resin above the first metal layer to remove the resin residue on the core board surface; Step J, Fabrication of Circuitry and Surface Treatment: Fabrication of the circuitry layer and surface treatment layer.

2. The method for manufacturing a copper-embedded substrate according to claim 1, characterized in that: In step B, the slot is 0.075 to 0.1 mm larger than each side of the copper block.

3. The method for manufacturing a copper-embedded substrate according to claim 1, characterized in that: In step D, the gaps between the periphery of the copper block and the slots in the core plate are uniform.

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