Network mounting structure for thermal management and stability improvement of IT infrastructure equipment

Abstract

The present invention provides a network installation structure for heat management and stability improvement of IT infrastructure equipment, embodiments provide a system consisting of a frame, a cooling liquid supply and a dryer for optimizing temperature and humidity management of equipment for high-performance IT infrastructure environments such as data centers, server rooms, telecommunication equipment rooms, etc. and relates to a network installation structure for improving heat control and stability of IT infrastructure equipment, thereby being able to prevent overheating of IT equipment, humidity control and efficient recovery of cooling energy.

Description

Technical Field

[0001] The following embodiments provide a system consisting of a frame, coolant supply, and dryer for optimizing temperature and humidity management of equipment used in high-performance IT infrastructure environments such as data centers, server rooms, and telecommunications equipment rooms, as well as network architecture for thermal management and stability improvement of IT infrastructure equipment. These devices enable overheating, humidity control, and efficient recovery of cooling energy from IT equipment. Background Technology

[0002] IT infrastructure equipment generates a lot of heat during operation, and excessive heat accumulation can lead to poor system performance and equipment failure.

[0003] Conventional IT equipment cooling primarily uses air cooling, which has low heat dissipation efficiency and high power consumption. Furthermore, humidity issues during the cooling process may cause additional equipment damage.

[0004] Traditional IT infrastructure equipment thermal management is limited by air cooling, resulting in poor cooling performance in high-temperature environments. If humidity is not properly controlled during the cooling process, internal corrosion and performance degradation may occur due to moisture.

[0005] In addition, the energy required for cooling is very large, resulting in high management costs, and all the energy (waste heat) used for cooling is wasted.

[0006] To address this problem, the present invention provides a networked installation structure that utilizes a coolant supply and a dryer to effectively manage the heat of IT equipment and achieve coolant recovery.

[0007] Existing technical documents

[0008] Patent documents

[0009] (Patent Document 1) KR 10-2533552 B

[0010] (Patent Document 2) KR 10-1811430 B

[0011] (Patent Document 3) KR 10-2265088 B Summary of the Invention

[0012] The problem that the invention aims to solve

[0013] The problem this invention seeks to solve is to effectively manage heat generation in IT infrastructure equipment by combining cooling and drying functions to improve equipment stability, prevent overheating, maximize cooling efficiency through a coolant supply connected to the frame, utilize Peltier elements for effective cooling, achieve coolant recovery, and prevent equipment damage due to humidity by supplying dry air inside the equipment during the drying period. It provides a network mounting structure for improving the thermal management and stability of IT infrastructure equipment.

[0014] means for solving problems

[0015] According to one embodiment, a frame with a predetermined support structure is provided; a plurality of settling seat platforms are provided on the frame; a coolant supply connected to the saddle for cooling equipment located on the upper settling frame; and a dryer for supplying dry air to the upper part of the settling platform; it provides a network mounting structure for improving the thermal management and stability of IT infrastructure equipment.

[0016] In addition, the coolant supply should include: a first water tank for receiving and storing tap water; a Peltier element connected to the bottom of the first water tank for heating the water in the first water tank; a first water pipe connecting the first water tank to the sedimentation platform; a second water tank for storing hot water via the sedimentation platform; a second water pipe leading from the seating platform to the second water tank; heat sinks connected to the heating surface of the Peltier element; a third water tank housing the heat sinks; a third water pipe connecting one side of the second water tank to the third water tank; and a fourth water pipe for discharging water from the third water tank. The water discharged through the fourth water pipe can be configured as hot water for use in the facility.

[0017] Furthermore, the dryer comprises: a first hopper containing desiccant; a first agitator disposed in the first hopper; a first feed pipe extending from the lower part of the first hopper; a second hopper connected to the lower part of the first supply pipe; a second agitator disposed in the second hopper; a second feed pipe extending from the lower part of the second hopper; a second feed pipe placed at the bottom of the second supply pipe; a first exhaust pipe with a diameter decreasing towards the bottom; placed at the bottom of the first gradient pipe; a second inclined pipe with a diameter increasing towards the bottom; a third supply pipe leading from the bottom of the second gradient pipe to the first hopper; an air supply pipe connected to the point between the first and second exhaust pipes; an air pump supplying air through the air supply pipe; a filter unit located inside the first hopper but placed at the top of the connection point between the first agitator and the third feed pipe; a cooler for cooling the first hopper; a heater for heating the second hopper; and an exhaust pipe placed at the top of the first hopper; and can be configured to dry and cool the air supplied by the air pump and discharge it.

[0018] Furthermore, the network installation structure for thermal management and stability improvement of IT infrastructure equipment includes processors, memory, communication modules, and non-temporary storage media. The processor executes programs stored in the non-temporary storage media to reuse and sell equipment and components used to build IT infrastructure. This involves retrieving historical information from a database of monitored equipment; receiving monitoring information from sensor modules installed in the monitored equipment; selecting equipment to be replaced from among the monitored equipment based on the historical and monitoring information; calculating the initial depreciation rate of the replaced equipment based on the historical and monitoring information; retrieving the basic unit price of the equipment to be replaced from the database; calculating the initial selling price based on the standard unit price and the initial depreciation rate; if the initial selling price is lower than a reference value, designating the equipment to be replaced as scrapped equipment; and if the initial selling price is higher than a threshold, designating the equipment to be replaced as equipment for sale. It can be managed according to reuse and refurbishment methods for selling equipment and components used in IT infrastructure construction.

[0019] In addition, the steps for calculating the first depreciation rate of the equipment to be replaced are as follows: read the standard depreciation rate and warranty period for each equipment model from the database; calculate the service life of the equipment based on the historical information of the equipment to be replaced; Calculate the second depreciation rate D according to the formula; return the second depreciation rate to the first depreciation rate; and (k = depreciation base, p) used = Equipment usage period, p warranty =Warranty Period) The steps for calculating the first selling price based on the standard unit price and the first depreciation rate are: read the standard selling cost for each equipment model from the database; calculate the probability of each part malfunctioning based on the monitoring information of the equipment to be replaced; designate the part as the replacement part; read the replacement cost of the replacement part from the database; P sell =P unit ×D-∑C replace -C sell Calculate the second selling price P according to the formula. sell ; and returning the second selling price to the first selling price (P unit =Second selling price, C replace = Parts replacement cost, C sell = Cost of Sales).

[0020] According to one embodiment, the device can be controlled by a computer program stored on a medium in combination with hardware to perform any of the methods described above.

[0021] Invention Effects

[0022] According to one embodiment, real-time monitoring can accurately assess the condition of equipment, prevent unnecessary equipment replacement, and reduce maintenance costs.

[0023] Furthermore, by calculating accurate depreciation rates based on equipment historical information and sensor data, fair and reasonable prices can be set for used equipment.

[0024] In addition, it can effectively separate sellable equipment from equipment that needs to be discarded, preventing unnecessary disposal and achieving efficient recycling of IT resources.

[0025] Furthermore, by analyzing information such as the input current, magnetic field, and temperature distribution of specific components, the probability of anomalies for each component can be calculated, thereby minimizing the occurrence of faults through early detection.

[0026] Furthermore, by promoting the reuse of old equipment, the cost of purchasing new equipment can be reduced, as can the operating costs of enterprise IT infrastructure.

[0027] Furthermore, the efficient reuse and reasonable resale of IT equipment and components will become possible, thereby helping to improve the economy and sustainability of IT infrastructure construction and maintenance.

[0028] In addition, coolant supply enables more efficient heat dissipation compared to traditional air cooling.

[0029] In addition, Peltier elements and heat sinks enable rapid temperature control.

[0030] In addition, dryers can be used to prevent corrosion and damage caused by moisture and extend the service life of equipment.

[0031] In addition, desiccant and air circulation system enable stable humidity management.

[0032] In addition, the hot water generated during the cooling process is used as hot water in the facility to save energy. Attached Figure Description

[0033] Figure 1 A replication system for reusing and selling equipment and components is shown, comprising a network installation structure for thermal management and stability improvement of IT infrastructure equipment according to an embodiment of the present invention.

[0034] Figure 2 This is a flowchart illustrating a method for reusing and selling devices and components including network installation structures according to embodiments of the present invention, for thermal management and stability improvement of IT infrastructure equipment.

[0035] Figure 3 This is a flowchart illustrating the steps of calculating the initial depreciation rate for the reuse and sale of equipment and components comprising a network installation structure, according to an embodiment of the present invention, for the thermal management and stability improvement of IT infrastructure equipment.

[0036] Figure 4 and Figure 5 These are drawings illustrating a network installation structure for improving thermal management and stability of IT infrastructure equipment according to an embodiment of the present invention.

[0037] Explanation of reference numerals in the attached figures

[0038] 1: Equipment;

[0039] 2: Equipment;

[0040] 3: Database;

[0041] S100: Read historical information from the monitored device;

[0042] S200: Steps for receiving monitoring information;

[0043] S300: Select the procedure for replacing the equipment;

[0044] S400: Calculate the first depreciation rate;

[0045] S410: Reads the standard depreciation rate and warranty period for each device model;

[0046] S420: Steps for calculating device duration;

[0047] S430: The calculation stage of the second depreciation rate D;

[0048] S440: The second depreciation step returns the first depreciation rate mentioned above;

[0049] S500: The stage for reading the standard unit price;

[0050] S600: Calculates the initial selling price;

[0051] S710: When the initial sales price is below a threshold: specify the equipment to be replaced as the step to scrap the equipment;

[0052] S720: When the initial selling price is higher than the threshold: Specify the equipment to be replaced as the step to sell the equipment;

[0053] 41: Framework;

[0054] 42: Landing rack;

[0055] 511: First water tank;

[0056] 512: Second water tank;

[0057] 513: Third water tank;

[0058] 52: Peltier components;

[0059] 531: The first water pipe;

[0060] 532: The second water pipe;

[0061] 533: The third water pipe;

[0062] 534: The 4th water pipe;

[0063] 54: Heat sink;

[0064] 611: First hopper;

[0065] 612: Second hopper;

[0066] 621: First air supply duct;

[0067] 622: Second air supply duct;

[0068] 623: The third air supply duct;

[0069] 631: First inclined tube;

[0070] 632: The second inclined pipe;

[0071] 641: Gas supply pipeline;

[0072] 642: Exhaust pipe;

[0073] 65: Filter section. Detailed Implementation

[0074] The embodiments are described in detail below with reference to the accompanying drawings. However, various modifications can be made to the embodiments, and therefore the scope of the patent application is not limited to or restricted by these embodiments. Any changes, equivalents, or substitutions to the embodiments should be understood to be included within the scope of the claims.

[0075] The specific structural or functional descriptions of the embodiments are provided for illustrative purposes only and may be modified and implemented in various forms. Therefore, the embodiments are not limited to a particular form of disclosure, and the scope of this specification includes changes, uniformities, or substitutions incorporated into the descriptive concepts.

[0076] Terms such as "first" or "second" can be used to describe various components, but the interpretation of these terms should only be used to distinguish one component from another. For example, the first component can be named the second component, and similarly, the second component can be named the first component.

[0077] When a component is said to be "connected" to another component, it should be understood that it may be directly connected to or connected to another component, but there may be another component between them.

[0078] The terminology used in the embodiments is for illustrative purposes only and should not be construed as restrictive. Singular expressions include plural expressions unless the context clearly implies otherwise. In this specification, the terms "comprising" or "having" should be understood to mean the presence of the functions, numbers, steps, actions, components, parts, or combinations thereof described herein, and should not exclude the presence or addition of one or more other functions or numbers, steps, actions, components, parts, or combinations thereof.

[0079] Unless otherwise defined, all terms used herein, including technical or scientific terms, shall have the same meaning as commonly understood by one of ordinary skill in the art to which the embodiments pertain. Terms such as those defined in common dictionaries shall be interpreted as having the meaning consistent with their meaning in the relevant descriptive context and shall not be interpreted in an ideal or overly formal sense unless expressly defined herein.

[0080] Furthermore, when describing the accompanying drawings, regardless of the drawing code, the same reference numerals should be assigned to the same elements, and identical repetitive descriptions should be omitted. When describing embodiments, detailed descriptions should be omitted if it is determined that a specific description of the relevant technical notifications may unnecessarily obscure the essential points of the embodiment.

[0081] The shapes, sizes, proportions, angles, and quantities disclosed in the accompanying drawings are used to illustrate embodiments of the invention. These shapes, sizes, proportions, angles, and quantities are illustrative and not limiting to the matters shown. Furthermore, in describing the invention, detailed descriptions should be omitted if it is determined that a detailed description of relevant known art might unnecessarily obscure the essential points of the invention. When using terms such as "comprising," "already," and "completed" as used in this specification, additional parts may be added unless "only" is used. This includes cases where components are represented in the singular but include the plural, unless specifically stated otherwise.

[0082] When interpreting components, even if not explicitly stated, they will be interpreted as including the error magnitude.

[0083] If the description of the positional relationship is described as “~above,” “~top,” “~below,” “~side,” etc., then one or more other parts may be located between these two parts, unless “immediately” or “directly” is used.

[0084] The expressions for "end", "both ends", "one end", "the other end", and "side end" of a component can be interpreted as referring to at least one end of the component.

[0085] The dimensions and thicknesses of each configuration shown in the figure are for illustrative purposes only, and the invention is not necessarily limited to the size and thickness of the structures shown.

[0086] The term "return" as used in the description of this invention may refer to the output / return / return of the result value of a method / procedure / function used in a specified programming language / structure.

[0087] Each feature in the various embodiments of the present invention can be combined with each other in part or in whole, and as those skilled in the art will fully understand, they can be technically linked and driven together, and each embodiment can be performed independently of each other or together in an associated relationship.

[0088] According to one embodiment, the device includes a processor, a memory, a communication module, and a non-temporary storage medium. A program stored in the non-temporary storage medium is executed by the processor. In a method for reusing and selling equipment and components used to build IT infrastructure, step S100 reads historical information of the monitored equipment from a database; receives monitoring information from a sensor module S200 installed in the monitored equipment; selects equipment to be replaced from the monitored equipment based on the historical and monitoring information (stage S300); calculates the initial depreciation rate of the replaced equipment based on the historical and monitoring information (stage S400); reads the standard unit price of the equipment to be replaced from a database (stage S500); calculates the initial selling price based on the standard unit price and the initial depreciation rate (stage S600); if the initial selling price is lower than a reference value: designates the equipment to be replaced as equipment to be disposed of (stage S710); and if the initial selling price is higher than the reference value: designates the equipment to be replaced as equipment for sale (stage S720). This provides a method for reusing and selling equipment and components used in IT infrastructure construction.

[0089] In one embodiment of the present invention, the historical information (installation date, model name, installation point, person in charge, cumulative usage time, etc.) of the monitored device (the device that needs maintenance) is recorded / updated in the database.

[0090] The monitored equipment can be equipped with a large number of units, which can refer to the equipment installed and managed at various sites.

[0091] Read historical information of the monitored devices from database S100; read historical record information from the database.

[0092] In one embodiment of the invention, various sensor modules are connected to each monitored device, and the sensor modules are connected / attached to the monitored device itself and / or sub-components of the monitored device to monitor the device / component.

[0093] Data from the sensor module can be recorded / updated in the database.

[0094] Receive monitoring information from the sensor module S200 installed in the monitored device; receive monitoring information (detection value data) from the sensor module and / or the database.

[0095] Based on the aforementioned historical and monitoring information, select the equipment phase S300 that needs to be replaced from the monitored equipment; specify the monitoring equipment that has reached its replacement cycle based on historical information, or determine that it needs to be repaired / replaced or meets specific replacement requirements based on monitoring information.

[0096] Based on the historical and monitoring information of the replaced equipment, calculate the initial depreciation rate of the replaced equipment in stage S400; calculate the initial depreciation rate of each selected replacement equipment.

[0097] Read the standard unit price of the equipment to be replaced from the S500 database; read the standard unit price (new sales price, etc.) of the selected equipment to be replaced.

[0098] The initial selling price is calculated based on the standard unit price and the initial depreciation rate S600; reflecting the basic unit price and the first depreciation rate, the first selling price is calculated, which is the selling price of the equipment to be replaced.

[0099] If the initial selling price is lower than the reference value: step S710 designates the equipment to be replaced as equipment to be disposed of; if the initial selling price is higher than the reference value: step S720 designates the equipment to be replaced as equipment to be sold; if the initial selling price is deemed unprofitable due to being lower than the prescribed standard value (if the profit is low or may be damaged due to distribution costs, engineering costs, etc., higher than the selling price at the time of sale), the replacement equipment should be designated as equipment to be disposed of and disposed of; if it is deemed profitable, it can be designated as equipment to be sold and sold / installed at the demand location.

[0100] At this point, the equipment can be sold by replacing some parts, resetting the data, or removing (cleaning) dust.

[0101] In addition, step S400 for calculating the first depreciation rate of the equipment to be replaced is: reading the basic depreciation rate and warranty period for each equipment model from the database S410; Calculate the equipment's service life based on historical information (S420); calculate the second depreciation rate D using the formula (S430); and return the second depreciation rate to the first depreciation rate (S440); (k = depreciation base, p...) used = Equipment usage period, p warranty=Warranty Period) The steps for calculating the first selling price based on the standard unit price and the first depreciation rate are as follows: Read the standard selling cost of each equipment model from the database; calculate the probability of each part malfunctioning based on the monitoring information of the equipment to be replaced; designate the part as the part to be replaced; read the replacement cost of the part to be replaced from the database; based on P sell =P unit ×D-ΣC replace -C sell Formula for calculating the second selling price P sell ; Revert the second selling price to the first selling price (P) unit =Second selling price, C replace = Parts replacement cost, C sell = Cost of Sales).

[0102] Retrieve the standard depreciation rate and warranty period for each equipment model from the database mentioned above; the database also contains the standard depreciation rate and warranty period specified for each equipment model.

[0103] For example, equipment B depreciates at 8% per year and may be designated as having a higher reference depreciation rate, while equipment A depreciates at approximately 5% per year, depending on its useful life.

[0104] The service life of the equipment to be replaced is calculated based on its historical information; the service life of the equipment is calculated based on the installation date and average daily operating time recorded in the historical information.

[0105] If the historical information includes the cumulative usage hours, the usage time of the equipment can also be accurately calculated.

[0106] The second depreciation rate D is calculated according to the formula; the standard depreciation rate (a constant specified for each equipment model) and the secondary depreciation rate are calculated by reflecting the service life and warranty period of the equipment.

[0107] (where k = depreciation base, p) used = Equipment usage period, p warranty =Warranty period)

[0108] The second depreciation rate can be calculated as a value between 0 and 1.

[0109] Table 1 below shows the secondary depreciation rate D values ​​calculated for equipment with a standard depreciation rate of 0.03, 0.05, 0.1, and 0.2, based on a 5-year (1825-day) warranty period and for terms ranging from 3 to 8 years.

[0110] [Table 1]

[0111] 3 4 5 6 7 8 0.03 0.945336 0.933234 0.918452 0.900396 0.878344 0.851409 0.05 0.908894 0.888723 0.864086 0.833994 0.79724 0.752348 0.1 0.817788 0.777446 0.728172 0.667988 0.59448 0.504697 0.2 0.635576 0.554892 0.456344 0.335977 0.18896 0.009394

[0112] Referring to Table 1, the secondary depreciation rate for equipment with a five-year service life and a standard depreciation rate K of 0.05 is calculated to be 0.864086. The second depreciation rate is then reverted to the first depreciation rate; the calculated second depreciation rate is then designated as the first depreciation rate, and the procedure / method / function is terminated.

[0113] The basic sales cost for each equipment model can be retrieved from the database; the standard sales cost for each equipment model can be found in the book, which includes transportation and labor costs incurred during the sales process.

[0114] Based on the monitoring information of the equipment to be replaced, calculate the probability of each component malfunctioning; calculate the probability of each part of the equipment to be replaced malfunctioning.

[0115] Here, if a particular component is defective and cannot function properly, the probability of that component malfunctioning is specified as 1 (100%).

[0116] The stage where the probability of each part being abnormal is greater than the specified reference value is designated as the part to be replaced; if the probability of each part being abnormal is higher than the standard value and failure is expected shortly after sale, then the part will be designated as the part that needs to be replaced.

[0117] Therefore, the reliability of used equipment can be improved by replacing old parts with high failure rates and then selling the equipment.

[0118] Retrieves the replacement cost of the parts to be replaced from the database; calculates the replacement cost of each part, including the purchase cost of the part to be replaced, the labor cost required to replace the part, and the labor time required for the replacement.

[0119] According to P sell =P unit ×D-∑C replace -C sell Formula for calculating P sell The second selling price is calculated by multiplying the basic unit price by the first depreciation rate, adding up all replacement costs for each part (if multiple parts need to be replaced) and subtracting them from the depreciation price, and then subtracting the cost of goods sold to calculate the second selling price, which is the selling price of the equipment to be sold.

[0120] (where P) unit =Second selling price, C replace = Parts replacement cost, C sell = Cost of Sales)

[0121] Restore the second selling price to the first selling price; designate the calculated second selling price as the initial selling price, and terminate the procedure / method / function.

[0122] Therefore, considering the costs of repairing / selling equipment, it is possible to predict whether repairing / selling equipment will result in a loss or a profit.

[0123] Furthermore, the steps for selecting the device to be replaced in the monitoring equipment are as follows: reading the input current information of the monitoring device 1-1 contained in the monitoring information; reading the vibration information of each part of the monitored device contained in the monitoring information; reading the noise information of the monitored device contained in the monitoring information; reading the temperature distribution information of the monitored device contained in the monitoring information; and calculating the abnormal probability of each device based on the vibration information, noise information, and temperature distribution information of each of the above. The steps for calculating the abnormal probability of each device are as follows: classifying the 1-2 input current information (i.e., the data accumulated within a predetermined time period in the 1-1 input current information) into multiple first intervals; classifying the vibration information of each station into cluster 1-1 corresponding to each first part; classifying the noise information into cluster 1-2 corresponding to each first part; classifying the temperature distribution information into cluster 1-3 corresponding to each first segment; calculating the root of the first square mean of the amplitude contained in each 1-1 cluster; converting the noise information contained in the 1-2 clusters into high-speed Fourier transform to generate first-order pairs; and calculating the root of the first square mean of the amplitude contained in the 1-3 clusters. The system calculates the first temperature vector based on the temperature distribution information. It then divides the 1-3 input current information (i.e., measurement data from the last day for the 1-1 input current information) into a second part. It classifies the vibration information of each station into clusters 2-1 corresponding to each second segment. It classifies the noise information into 2-2 clusters corresponding to each second segment. It classifies the temperature distribution information into clusters 2-3 corresponding to each second segment. It calculates the second root mean square of the amplitude contained in each of the 2-1 clusters. It converts the noise information contained in the 2-2 clusters into high-speed Fourier transforms to generate a second order pair. Based on the temperature distribution information contained in the 2-3 clusters, it calculates the second temperature vector. It specifies the ratio between the first and second root mean squares with a first similarity. It calculates the second similarity between the first and second order pairs. It calculates the third similarity between the first and second temperature vectors. If at least one of the first or third similarities is less than a specified reference value, it reads the probability from the database that exceeds the standard corresponding to the minimum value of the first or third similarity and specifies it as the anomaly probability for each device.

[0124] Read the input current information of the monitored device 1-1 contained in the monitoring information; read the input current information of number 1-1 from the ammeter provided / installed for each monitored device, that is, the operating current value of the monitored device.

[0125] 1-1 Input current information may include current values ​​measured over time since the device to be monitored was installed.

[0126] Read the vibration information of each part of the monitored equipment contained in the monitoring information; read the vibration information of each part of the monitored equipment from multiple vibration sensors installed in each part / point of the monitored equipment, that is, the vibration value of each part of the monitored equipment.

[0127] Based on the different measurement methods used for vibration information of each component compared to normal operation, the fault status / probability of the equipment can be predicted.

[0128] Read the noise information of the monitored equipment contained in the monitoring information; read the noise information, i.e. the noise value of the monitored equipment, from the noise sensor installed in the monitored equipment.

[0129] Based on the fact that the measurement method for this noise information is different from that of normal operation, it is possible to predict the fault conditions / probability of the equipment.

[0130] Read the temperature distribution information of the monitored equipment contained in the monitoring information; read the temperature distribution information from the infrared thermal imager that captured the monitored equipment.

[0131] Based on this, the condition of the equipment can be checked according to the abnormal heat generation (heat distribution).

[0132] Based on the vibration, noise, and temperature distribution information of each component, the probability of anomaly for each device is calculated; based on the information collected from various sensor modules, the probability of anomaly for each monitored device is calculated.

[0133] 1-2 Input Current Information, which is the data accumulated over a predetermined time in 1-1 Input Current Information, is divided into Part 1; 1-2 Input Current Information is extracted from the 1-1 Input Current Information accumulated since the installation of each monitoring device, which is the data accumulated over a certain period of time (data during the steady state period), and it is classified into Part 1.

[0134] In other words, among all the collected 1-1 input current information, the data from 1 year and 1 month ago to 1 month ago (1-year data) is designated as 1-2 input current information, and the 1-2 input current information is divided into several first intervals according to the magnitude of the value.

[0135] For example, it can be divided into five first parts: 1-2 input current information from 0 to 5, 1-2 input current information from 5 to 25, 1-2 input current information from 25 to 100, 1-2 input current information from 100 to 300, and 1-2 input current information from 300 or more.

[0136] On the other hand, the vibration information, noise information, and temperature distribution information of each component are recorded / stored in a one-to-one correspondence with each 1-1 input current information.

[0137] In other words, the 1-1 input current information can be data containing timestamps with current values, while the vibration information, noise information, and temperature distribution information of each part can be referenced to the timestamps of the 1-1 input current information.

[0138] For example, the current information 1-1 measured at 11:25:16 on January 22, 2025, along with the vibration information, noise information, and temperature distribution information measured at the same time, can be matched and recorded.

[0139] The vibration information of each station is classified into cluster 1-1 corresponding to each first part; then the vibration information of each part corresponds to the first part and is divided into cluster 1-1.

[0140] In other words, the vibration information of each part is classified according to the 1-2 input current information (timestamp) of Part 1, and divided into 1-1 clusters respectively.

[0141] For example, the values ​​corresponding to the first part (100 to 300 of the 1-2 input current information) measured in parts b, c and d of device A can be designated as cluster 1-1, and the values ​​corresponding to the first part (300 or more of the 1-2 input current information) measured in parts b, c and d of device A can be designated as another cluster 1-1.

[0142] The noise information is classified into clusters 1-2 corresponding to each first part; the temperature distribution information is classified into clusters 1-3 corresponding to each first segment; similar to the above (cluster classification 1-1), the noise information and temperature distribution information are classified into clusters 1-2 and 1-3 respectively.

[0143] Calculate the root of the first square mean of the amplitudes contained in each 1-1 cluster; for each 1-1 cluster, calculate the root of the first square mean (RMS) of the amplitude values ​​contained therein.

[0144] For example, if there are 10 clusters 1-1, then the 10th root mean square of 10 will be calculated.

[0145] The noise information contained in 1-2 clusters is converted into high-speed Fourier transforms to produce first-order pairs; the amplitude and frequency sequence pairs generated by converting the noise data contained therein into high-speed Fourier transforms of each cluster 1-2 are designated as the first sequence pair.

[0146] For example, if cluster 1-2 is 5, then 5xn first-order pairs can be generated.

[0147] The first temperature vector is calculated based on the temperature distribution information contained in 1-3 clusters; the first temperature vector is calculated based on the example of extracting vectors from thermal images described below.

[0148] The 1-3 input current information (i.e., the measurement data of the 1-1 input current information measured in the last day) is divided into two parts; the 1-3 input current information is extracted from the 1-1 input current information accumulated since the installation of each monitoring device, that is, the data accumulated in the most recent day (the data to be checked), and it is classified into two parts.

[0149] In other words, among all the collected 1-1 input current information, the data from the most recent day is designated as 1-3 input current information, and the 1-3 input current information is divided into several second intervals based on the magnitude of the value.

[0150] The vibration information of each station is classified into cluster 2-1 corresponding to each second segment; the noise information is classified into cluster 2-2 corresponding to each second segment; the temperature distribution information is classified into cluster 2-3 corresponding to each second segment; the same method as above (cluster 1-1 is classified into cluster 1-3), the vibration information, noise information and temperature distribution information of each part are divided into clusters 2-1 to 2-3 respectively.

[0151] Calculate the second square root of the amplitude contained in each of the 2-1 clusters; convert the noise information contained in the 2-2 clusters into high-speed Fourier transforms to generate the second order pair; calculate the second temperature vector based on the temperature distribution information contained in each of the 2-3 clusters; calculate the second order of the square root, the second order pair, and the second temperature vector in the same way as the steps above for calculating the first square root, the first order pair, and the first temperature vector.

[0152] The ratio between the first root mean square and the second root mean square is designated as the first similarity; the second similarity between the first and second order pairs is calculated; and the third similarity between the first and second temperature vectors is calculated; the similarity between the existing data (steady-state data; first root mean square / first order pair / first temperature vector) and the current data (data to be examined; second root mean square / second order pair / second temperature vector) is calculated.

[0153] For example, if the root of the first mean square in steady state is 100 and the root of the second mean square is 250, then the first similarity can be calculated as (1 - |250 - 100| / 250 = 40%).

[0154] Here, traditional methods such as cosine similarity, absolute difference-based similarity, normalized Euclidean distance-based similarity, and exponential decay similarity can be applied to similarity calculation.

[0155] If at least one of the first similarity and the third similarity is less than the specified reference value: read the probability of exceeding the standard corresponding to the minimum of the first similarity and the third similarity from the database and designate it as the anomaly probability for each device; if some calculated similarity values ​​(at least one) are lower than the specified reference value, the probability of exceeding the standard can be read and designated as the probability of an anomaly for the device.

[0156] For example, if the first similarity is 0.2 (20%), the second similarity is 0.96, and the third similarity is 0.97, then the probability value of 0.78 corresponds to the first similarity of 0.2, which is lower than the reference value, and is read from the database and specified as the probability of device malfunction.

[0157] Here, the lower the similarity, the higher the probability of being above the baseline.

[0158] On the other hand, different reference values ​​may be applied to each of the first to third similarity scores.

[0159] In one embodiment of the invention, while calculating the probability of an overall device malfunction, the probability of an malfunction in each part (major part) of the device is also calculated. For this purpose, sensor modules are installed / attached / connected to the device, and sensor modules are also installed / attached / connected to the major components.

[0160] Furthermore, the steps for calculating the probability of an anomaly occurring for each component are as follows: Read the 2-1 input current information of each monitored device portion contained in the monitoring information; read the first magnetic field information of each monitored device portion contained in the monitoring information; divide the 2-1 input current information, i.e., the data accumulated within a predetermined time period, into multiple third parts; classify the first magnetic field information of each component into 3-1 clusters corresponding to the third part; calculate the third root mean square of the magnetic field magnitude contained in each cluster within the 3-1 clusters; divide the 2-3 input current information, i.e., the measured data obtained in the last day of the 2-1 input current information, into a large number of fourth segments; classify the first magnetic field information of each component into clusters 3-2 corresponding to the fourth part; calculate the 4-square root mean square of the magnetic field magnitude contained in each cluster within the 3-2 clusters; specify the ratio between the third root mean square and the fourth root mean square with the fourth similarity; if the fourth similarity is less than the specified reference value: read the probability of exceeding the standard corresponding to the fourth similarity from the database and specify it as the probability of an anomaly occurring in that part.

[0161] Read the input current information of each part of the monitored device contained in the monitoring information 2-1; read the first magnetic field information of each component of the monitored device contained in the monitoring information; measure and read the current of each component and the magnetic field around the component.

[0162] As mentioned above, these values ​​can be accumulated and recorded / stored in a database.

[0163] 2-2 Input current information, which is the data accumulated within a predetermined time period in 2-1 Input current information, is divided into multiple third parts; 2-2 Input current information, which is the data accumulated within a certain time period (data during steady state), is extracted from the 2-1 Input current information accumulated since the installation of each monitoring element, and is classified as the second part.

[0164] In other words, among all the collected 2-1 input current information, the data from 1 year and 1 month ago to 1 month ago (1-year data) is designated as 2-2 input current information, and the 2-2 input current information is divided into several third intervals according to the magnitude of the value.

[0165] The first magnetic field information of each component is divided into 3-1 clusters, corresponding to 3 parts in each cluster; the third square root of the magnetic field magnitude contained in the 3-1 clusters is calculated; the 2-3 input current information, i.e., the measured data of the 2-1 input current information measured in the last day, is divided into a large number of fourth segments; the first magnetic field information of each component is classified into clusters 3-2 corresponding to the fourth part; the four-square root mean of the magnetic field magnitude contained in each cluster in the 3-2 clusters is calculated; the ratio between the third square root mean and the fourth square root mean with the fourth similarity is specified; if the fourth similarity is less than the specified reference value: the probability of exceeding the standard corresponding to the fourth similarity is read from the database and specified as the probability of an outlier in that part; the probability of component anomaly is calculated based on the magnetic field generated around the part, in the same way as calculating the anomaly probability of each of the above devices.

[0166] Furthermore, the steps for calculating the first temperature vector and the second temperature vector are as follows: extracting a first closed curve from the thermal image contained in the temperature distribution information; calculating the first area of ​​the first closed curve; in the first closed curve, the first closed curve is a first closed curve higher than a specified reference value; the first closed curve of the second closed curve; the first closed curve of the second closed curve; the first center of the closed curve; reading the first center temperature of the second closed curve; in the second closed curve, extracting the first stage of the third closed curve, that is, the second closed curve with the highest center temperature; in the second closed curve, except for the third closed curve, the rest are designated as the fourth closed curve; and returning the vector connecting the first city center of the third closed curve and the first city center of the fourth closed curve.

[0167] Extract the first closed curve from the thermal imaging image contained in the temperature distribution information; generate the first closed curve after the thermal image isotherm.

[0168] Here, isotherms may be isotherms representing the quartiles of all temperatures captured in a thermal image.

[0169] For example, if the color temperature of each pixel in a thermal image is between 20 and 58 degrees, and the quartile of the quartiles (the value at the 1 / 4 position when all values ​​are sorted in ascending order; the value at the 25th position; or the 25th value if there are values ​​from 1 to 100) is 27 degrees, then the first closed curve of the isotherm can be extracted.

[0170] Calculate the first area of ​​the first closed curve; generate the first region, which is the internal region (number of internal pixels) of each first closed curve.

[0171] In the first closed curve, the first closed curve is the second closed curve whose area is higher than the specified reference value; extract the first closed curve, where the first region is higher than the reference value, and designate it as the second closed curve.

[0172] Calculate the first city center of the second closed curve; generate the first center of each extracted second closed curve.

[0173] Read the first center temperature of the second closed curve; read the first center temperature, which is the temperature that accounts for the largest proportion of the pixel-specific color temperature in the second closed curve.

[0174] For example, if 1,500 out of 5,000 pixels in the second closed curve have a color temperature of 57 degrees, then 57 degrees is designated as the first core temperature.

[0175] When extracting the third closed curve from the second closed curve, the first center temperature is the highest, and the third closed curve is the second closed curve; the second closed curve with the highest temperature in the second closed curve is designated as the third closed curve.

[0176] In the second closed curve, except for the third closed curve, the remaining curves are designated as the fourth closed curve; return the vector connecting the first city center of the third closed curve to the first city center of the fourth closed curve; construct other closed curves with the third closed curve as the center, i.e. the hottest closed curve, connect the vector of the fourth closed curve, and return it as the first temperature vector mentioned above.

[0177] Therefore, the first temperature vector is centered on the city center of the hottest region. By comparing the magnitude and direction of these vectors, we can calculate the similarity between two different data points.

[0178] According to one embodiment, the rack 41 provides a predetermined support structure; a plurality of frames 41 are provided on the seat platform 42; a coolant supply connected to the seat block 42 is used to cool the equipment located in the seat block 42; and a dryer supplies dry air to the upper part of the seat platform 42; it provides a network mounting structure for improving the thermal management and stability of IT infrastructure equipment.

[0179] Rack 41; ground-based support and equipped with a large number of IT infrastructure devices.

[0180] The seat belt 42 forms a predetermined flat shape to provide seating space for the device. When the bottom of the device is in close contact with the seat platform 42, the bottom surface of the device can be cooled by a coolant supply connected to the seat platform 42.

[0181] The coolant supply; a continuous supply of coolant to flow through the inside of the seat platform 42.

[0182] Dryer; sprays cooling / drying air onto equipment to cool it.

[0183] Furthermore, the coolant supply comprises: a first water tank 511 for receiving and storing tap water; a Peltier element portion 52 connected to the base of the first water tank 511 for heating the water in the first water tank 511; a first water pipe 531 connecting the first water tank 511 to the seat platform 42; a second water tank 42 storing hot water via the seat platform 512; a second water pipe 532 connecting the seat platform 42 to the second water tank 512; a heat sink 52 connected to the heating surface of the Peltier element portion 54; a third water tank 54 housing the heat sink 513; a third water pipe 533 connecting one side of the second water tank 512 to the third water tank 513; and a fourth water pipe 534 for discharging water from the third water tank 513. The water discharged through the fourth water pipe 534 can be configured as hot water for use in the facility.

[0184] Figure 4 The structure and working principle of the coolant supply are shown.

[0185] First water tank 511; clean water is supplied by tap water and other water sources.

[0186] Part 52 of the Peltier element; cooling water in the first water tank 511, the cooling surface of the Peltier element part 52 contacts and adheres to the first water tank 511, and cooling fins 54 are formed and adhered to the heating surface.

[0187] The first water pipe 531 should supply sufficient cooling water to the cooling channels provided inside the seat platform 42.

[0188] It is desirable to connect the first water pipe 531 to the lower part of the first water tank 511, and multiple first water pipes 531 can be connected to each base 42.

[0189] The pump can be connected to each of the first pipe 531 to the fourth pipe 534.

[0190] The second water tank 512; heated water (absorbing heat from the equipment) is discharged and stored through the cooling flow path inside the furnace platform 42.

[0191] Second water pipe 532; provides a flow path for conveying water from the cooling flow path of the base 42 to the second water tank 512.

[0192] Heat sink 54; absorbs and dissipates heat generated from the heating surfaces of the Peltier element section 52 and the third water tank 513, which is housed inside.

[0193] Water contained in the second water tank 512 is pumped to the third water tank 513, and in the third water tank 513, the heat sink 54 is still submerged in water (the water level in the third water tank 513 is maintained by the pump and the water level sensor).

[0194] Therefore, the heat generated from the heating surface of the Peltier element component 52 is transferred to the water in the third water tank 513, and the water is further heated.

[0195] The fourth water pipe 534 provides a flow path for draining water from the third water tank 513 after it has been sufficiently heated.

[0196] Therefore, the heat generated by the equipment and the heating surface of the Peltier element 52 can be used to heat water, and the heated water can be used as hot water in the facility where the equipment is installed.

[0197] Furthermore, the dryer comprises: a first hopper 611 for containing desiccant; a first agitator disposed in the first hopper 611; a first feed pipe 621 extending from the lower part of the first hopper 611; a second hopper 612 connected to the lower part of the first supply pipe 621; a second agitator disposed in the second hopper 612; a second feed pipe 622 extending from the lower part of the second hopper 612; a first inclined pipe 631 placed at the bottom of the second supply pipe 622, wherein the pipe diameter decreases towards the bottom; a second inclined pipe 632 placed at the bottom of the first inclined pipe 631, wherein the pipe diameter increases towards the bottom; and a second inclined pipe 632 extending from the second inclined pipe 632. The bottom of pipe 632 is connected to the third supply pipe 623 of the first hopper 611; an air supply pipe 641 is connected to the point between the first inclined pipe 631 and the second inclined pipe 632; an air pump supplies air through the air supply pipe 641; a filter portion 65 is housed inside the first hopper 611 but located at the top of the connection point between the first agitator and the third feed pipe 623; a cooler for cooling the first hopper 611; a heater for heating the second hopper 612; and an air outlet pipe 642 placed on top of the first hopper 611; which can be configured to dry and cool the air supplied by the air pump and discharge it.

[0198] In one embodiment of the invention, a renewable / recyclable powdered desiccant (desiccant) was used. Since these are known to be absorbed, no detailed description is omitted.

[0199] First hopper 611; desiccant is contained in first agitator; first hopper 611 is cooled by cooler.

[0200] The desiccant stirred in the first hopper 611 is discharged to the lower part through the first feed pipe 621 and conveyed to the second hopper 612.

[0201] A valve is provided on one side of the first supply pipe 621 for regulating the flow rate.

[0202] The second hopper 612; a second agitator; and a burner; are used to heat and agitate the internal desiccant, during which moisture is removed from and expelled (regenerated) from the desiccant.

[0203] The upper side of the second hopper 612 may be equipped with a mesh vent to allow any escaping moisture to escape.

[0204] The desiccant taken from the second hopper 612 is discharged to the lower part through the second supply pipe 622 and sprayed into the air through the third supply pipe 623 through the Venturi effect.

[0205] The first inclined pipe 631 and the second inclined pipe 632 act as venturi tubes, and the flow rate and pressure change. When high-pressure compressed air is supplied from the air supply pipe 641 on the connected side, the hygroscopic powder and air are mixed with the third supply pipe 623 into the first hopper 611.

[0206] The air injected into the first hopper 611 is in a state where the moisture has been removed by the desiccant, and the temperature decreases in the cooling state of the first hopper 611, and is supplied to the seat platform 42 through the filter section 65.

[0207] A filter section 65 is provided to filter the desiccant, preventing it from leaking to the outside.

[0208] The exhaust pipe 642 is equipped with a separate fan so that the cooling / drying air inside the first hopper 611 can be transferred / supplied along the direction of the platform 42.

[0209] An apparatus according to one embodiment includes a processor and a memory. The device according to the embodiment may be the server or terminal described above. The processor may include at least one of the aforementioned devices as shown in the accompanying drawings, or may perform at least one of the aforementioned methods as shown in the accompanying drawings. The memory may store information related to the aforementioned methods, or it may store programs implementing the methods. The memory may be volatile memory or non-volatile memory.

[0210] The processor can run programs and control the device. The program code executed by the processor can be stored in memory. The device can be connected to external devices (e.g., a personal computer or a network) via input / output devices (not shown in the diagram) and can exchange data.

[0211] The above embodiments can be implemented as hardware components, software components, and / or combinations of hardware and software components. For example, the devices, methods, and components described in the embodiments can be implemented using one or more general-purpose or special-purpose computers, such as processors, controllers, arithmetic logic units (ALUs), digital signal processors, microcomputers, field-programmable gate arrays (FPGAs), programmable logic units (PLUs), microprocessors, or any other device capable of executing and responding to instructions. The processing unit can execute an operating system (OS) and one or more software applications executed on the operating system. The processing unit can also access, store, process, and generate data in response to software execution. For ease of understanding, a processing unit can be described as a single processing unit, but those skilled in the art will recognize that a processing unit may comprise multiple processing elements and / or various types of processing elements. For example, a processing unit may include multiple processors or a processor and a controller. Furthermore, other processing configurations, such as parallel processors, may be used.

[0212] The method according to this embodiment can be implemented in the form of program instructions, which can be executed and recorded on a computer-readable medium by various computer means. The computer-readable medium can contain program instructions, data files, data structures, etc., alone or in combination. The program commands recorded on the medium can be specifically designed and configured for the embodiment, or they can be known and available to a computer software craftsman. Examples of computer-readable recording media include magnetic media (such as hard disks, floppy disks, and magnetic tapes), optical media (such as CD-ROMs and DVDs), magneto-optical disk media (such as floppy disks), and hardware devices specifically configured to store and execute program commands (such as ROMs, RAMs, flash memory, etc.). Examples of program instructions include machine code (e.g., code generated by a compiler) and high-level language code (e.g., code executable by a computer using an interpreter). The hardware device can be configured to run as one or more software modules to perform the operation of the embodiment, and vice versa.

[0213] This software may include computer programs, code, instructions, or one or more combinations thereof, and may configure processing units to operate as intended, or may individually or collectively command processing units. Software and / or data may be permanently or temporarily contained in any type of machine, component, physical device, virtual device, computer storage medium, or apparatus, or in transmitted signal waves, so that processing units may interpret them or provide instructions or data to processing units. This software is distributed on networked computer systems and may be stored or executed in a distributed manner. Software and data may be stored on one or more computer-readable recording media.

[0214] Although the above embodiments have been described with limited drawings, those skilled in the art can make various technical modifications and alterations based on the above description. For example, appropriate results may be obtained if the described techniques are performed in a different order than the described methods, and / or if the components of the described systems, structures, devices, circuits, etc., are combined or combined in a different manner than the described methods, or are replaced or substituted by other components or equivalents.

[0215] Therefore, other embodiments, other embodiments, and those equivalent to the patent claims also fall within the scope of the claims described below.

Claims

1. A network installation structure for improving thermal management and stability of IT infrastructure equipment, wherein, The network installation structure for improving thermal management and stability of IT infrastructure equipment includes: a framework that provides a specified support structure; The frame has multiple seat supports; A coolant supply connected to the mounting block for cooling the equipment installed in the mounting block; and A dryer that supplies dry air to the upper part of the sedimentation platform.

Images