PI film quick release device with installation self-checking function

Abstract

The application provides a PI film quick release device with installation self-checking function. It is related to the technical field of silver sintering and is used for detachably installing the PI film between the pressure head of the sintering equipment and the workpiece, comprising a frame, a quick release mechanism, a force sensing unit, a displacement sensing unit and a controller. The PI film is fixed on the frame and provided with wedge-shaped notches at both ends. The quick release mechanism comprises a mounting seat, an ejection spring and a limiting buckle, the mounting seat is provided with a sliding groove, the frame is slidably arranged in the sliding groove, and the engaging end of the limiting buckle is matched with the wedge-shaped notches. When the frame is pushed into the predetermined locking position, the limiting buckle is clamped into the wedge-shaped notches, resisting the pushing force of the ejection spring and eliminating the length direction cooperation gap. After the PI film is replaced and installed and locked by the frame, the controller controls the pressure head to contact the PI film with low pressure load before formal sintering, judges the installation abnormity according to the force and displacement data, prohibits the start of sintering and alarms when the abnormity occurs, and significantly reduces the high-temperature sintering defect risk caused by poor installation.

Description

Technical Field

[0001] This invention belongs to the field of silver sintering technology, specifically relating to a quick-release device for PI film with installation self-test function. Background Technology

[0002] In the silver sintering process, a release membrane is needed between the product and the mold to isolate the workpiece from the pressure head. Due to its high-temperature resistance, dimensional stability, and good release properties, PI film is gradually replacing disposable Teflon film in this application. To meet the needs of mass production, the PI film is usually pre-fixed to a frame, which is then detachably installed into the sintering equipment via a quick-release mechanism. A new PI film is replaced after each sintering cycle.

[0003] However, while the quick-release mechanism brings convenience in replacement, it also introduces new problems: each time the PI film is replaced, the operator must manually push the frame containing the new PI film into the groove and lock it with the limit buckle. This installation action is susceptible to human error—the frame may not be pushed into the predetermined locking position, or the limit buckle may not be fully engaged with the wedge-shaped notch, resulting in an abnormal locking state of the frame. This abnormality is difficult to judge directly by the naked eye after installation. At room temperature, the frame can still maintain its posture by relying on the spring force and the buckle cooperation, but after entering the formal sintering stage, under the combined effect of high temperature environment and process pressure, the poorly locked frame will shift or tilt, resulting in uneven stress on the PI film and uneven pressure on the product workpiece, causing a decrease in the yield of batch products.

[0004] Therefore, there is an urgent need for a PI film quick-release device that can automatically determine whether there is an installation abnormality in the quick-release mechanism after the PI film replacement and installation is completed and before the formal sintering begins, and prevent the equipment from starting when an abnormality is detected, thus preventing defects from entering the sintering stage. Summary of the Invention

[0005] In view of the above-mentioned defects or deficiencies in the prior art, a quick-release device for PI film with installation self-test function is provided for detachably installing PI film between the pressure head and the workpiece of a sintering equipment, comprising: A frame on which the PI film is fixed, and the frame has wedge-shaped notches at both ends in the length direction perpendicular to the disassembly and assembly direction. The quick-release mechanism includes: a mounting base with a groove along the disassembly / assembly direction, wherein the frame is slidably disposed within the groove; an ejector spring disposed between the mounting base and the frame, which is in a compressed state when the frame is locked, applying an outward thrust to the frame along the disassembly / assembly direction; and a limiting buckle disposed on the mounting base, wherein its engaging end is adapted to the shape of the wedge-shaped notch. When the frame is pushed into the predetermined locking position along the groove, the limiting buckle engages with the corresponding wedge-shaped notch from both ends of the frame along the length direction, limiting the displacement of the frame in the disassembly / assembly direction to resist the thrust of the ejector spring. At the same time, the wedge-shaped engagement between the engaging end and the wedge-shaped notch eliminates the fit gap of the frame in the length direction, thereby centering the frame in the length direction. A force sensing unit is used to sense the force applied to the PI membrane by the pressure head; A displacement sensing unit is used to sense the displacement of the pressure head; The controller, electrically connected to the force sensing unit and the displacement sensing unit, is configured to: after the PI membrane has been replaced and installed and the frame has been locked by the quick-release mechanism, and before the sintering equipment performs formal sintering, control the pressure head to move towards and contact the PI membrane with a preset low-pressure load, and determine whether there is an installation abnormality in the PI membrane and / or the quick-release mechanism based on the data collected by the force sensing unit and the displacement sensing unit during the contact process; if there is an installation abnormality, the controller will prevent the sintering equipment from starting the formal sintering program and output an alarm signal.

[0006] According to the technical solution provided in this application, there are multiple pressure heads, and the number of PI films is the same as the number of pressure heads. Each PI film is respectively arranged in a one-to-one correspondence with each pressure head, and each PI film is independently arranged on the frame corresponding to a substrate to be sintered. The frame is also provided with multiple PI film clamping springs that correspond one-to-one with each PI film. Each PI film clamping spring presses and fixes the edge of the corresponding PI film to the frame, so that each PI film is kept in a taut state.

[0007] According to the technical solution provided in this application, there are multiple force sensing units, each force sensing unit is configured to correspond to one pressure head, and is used to independently sense the force applied to the corresponding PI membrane by the corresponding pressure head; there are multiple displacement sensing units, each displacement sensing unit is configured to correspond to one pressure head, and is used to independently sense the displacement of the corresponding pressure head.

[0008] According to the technical solution provided in this application, the controller is specifically configured for: First-level judgment: During the process of controlling each pressure head to move towards the corresponding PI film with the low pressure load, the contact critical displacement value of each pressure head when it first contacts the corresponding PI film is obtained, and the dispersion between each contact critical displacement value is calculated. When the dispersion exceeds a preset dispersion threshold, it is determined that the quick-release mechanism has an installation abnormality, and the second-level judgment is skipped; When the dispersion does not exceed the preset dispersion threshold, the slope of the force-displacement curve corresponding to each pressure head within the preset displacement range after contact is further obtained, and the slope dispersion between each curve slope is calculated; if the slope dispersion exceeds the preset slope dispersion threshold, it is determined that the quick-release mechanism has an installation abnormality, and the second-level judgment is skipped. Second-level judgment: Based on the data collected by each force sensing unit and each displacement sensing unit during the contact process, the actual force-displacement curve corresponding to each pressure head is generated, and each actual force-displacement curve is compared with the preset installation qualification benchmark feature one by one; when the deviation between the actual force-displacement curve corresponding to any pressure head and the installation qualification benchmark feature exceeds the preset threshold, it is determined that the PI membrane corresponding to the pressure head has an installation abnormality, and the workstation number corresponding to the PI membrane is indicated in the alarm signal.

[0009] According to the technical solution provided in this application, the controller is configured to: only when the first-level judgment determines that the quick-release mechanism has an installation abnormality, the controller is configured to: When it is determined that there is an installation abnormality in the quick-release mechanism, the abnormal mode of the quick-release mechanism is determined according to the spatial distribution of the contact critical displacement values ​​corresponding to each pressure head. If each of the contact critical displacement values ​​shows a monotonically increasing or monotonically decreasing trend along the length direction, it is determined that the frame is tilted in the length direction and the corresponding end of the limiting buckle is not engaged in place. If the distribution of each of the contact critical displacement values ​​does not show a monotonic trend along the length direction, and there are differences between the values, then it is determined that the ejector spring is not compressed evenly or that there are foreign objects in the groove.

[0010] According to the technical solution provided in this application, the controller is configured to: only when the second-level judgment determines that a certain PI film has an installation abnormality. Perform a rebound detection action on the pressure head corresponding to the PI film: control the pressure head to rise upward at a preset unloading speed and a preset rebound detection distance, and then move downward at a preset loading speed until it re-contacts the PI film; Obtain the reset contact displacement value when the pressure head re-contacts the PI film, and calculate the difference between the reset contact displacement value and the contact critical displacement value as the rebound hysteresis displacement; Obtain the preset working temperature of the formal sintering process, and based on the preset working temperature and the known stiffness-temperature relationship of the PI film material, convert the rebound hysteresis displacement into the predicted high-temperature rebound hysteresis displacement of the PI film at the preset working temperature. When the predicted high-temperature rebound hysteresis displacement is greater than the preset high-temperature rebound hysteresis threshold, it is determined that the installation abnormality of the PI membrane is caused by insufficient tension reserve of the PI membrane under high-temperature conditions, and the alarm signal indicates that the abnormality can be eliminated by replacing the PI membrane. When the predicted high-temperature rebound hysteresis displacement is not greater than the preset high-temperature rebound hysteresis threshold, it is determined that the installation abnormality of the PI film is caused by insufficient clamping force of the PI film clamping spring, and the alarm signal indicates that the corresponding PI film clamping spring needs to be checked or adjusted.

[0011] According to the technical solution provided in this application, the controller is further configured to: perform symmetry detection on the pressure heads that were not determined to have installation abnormalities in the second-level judgment after the second-level judgment is completed. After generating the actual force-displacement curves corresponding to each of the pressure heads, two pressure heads whose positions on the frame are symmetrical about the length direction are identified as a symmetrical pressure head pair. For at least one pair of symmetrical pressure heads, the two actual force-displacement curves are aligned in the same coordinate system with their respective contact initiation points as the origin. Determine whether the force values ​​at the same displacement increment after the two aligned curves come into contact are consistent. If the force deviation at a certain displacement increment exceeds the sensor's inherent noise level, it is determined that the PI membrane corresponding to at least one of the pressure heads in the group of symmetrical pressure head pairs has inconsistent tension due to differences in installation methods, and the alarm signal indicates that the installation status of the PI membrane at the group of symmetrical workstations needs to be checked.

[0012] According to the technical solution provided in this application, when the symmetry detection determines that an installation abnormality exists, the controller is configured to: The pressure head that meets the following conditions is identified as a normal pressure head: the deviation between the actual force-displacement curve corresponding to the pressure head and the installation qualification benchmark feature does not exceed the preset threshold, and the symmetrical pressure head pair to which the pressure head belongs is not determined to have an installation abnormality in the symmetry detection. Obtain the slope of the actual force-displacement curve of each of the two pressure heads in the symmetrical pressure head pair that is determined to have an installation abnormality within a preset displacement range after contact. The slopes of the two curves are compared with the slopes of the actual force-displacement curve corresponding to at least one of the normal pressure heads. A pressure head whose curve slope is inconsistent with that of a normal pressure head is identified as having an installation abnormality, and the corresponding workstation number of the pressure head is indicated in the alarm signal.

[0013] According to the technical solution provided in this application, the preset low-pressure load is determined in the following way: Obtain the clamping force of the PI film clamping spring applied to the edge of the PI film; Based on the spring clamping force, a preset ratio of the spring clamping force is taken as the upper limit of the preset low pressure load, and the preset ratio is less than 1, so that the low pressure load does not exceed the spring clamping force.

[0014] According to the technical solution provided in this application, the preset ratio is not greater than the static friction coefficient between the PI film pressing spring and the PI film.

[0015] Compared with the prior art, the beneficial effects of this application are as follows: First, a low-pressure contact self-check intercepts installation defects in the quick-release mechanism before sintering: After the quick-release mechanism locks the PI film frame but before formal sintering begins, the controller controls the pressure head to contact the PI film with a preset low-pressure load. Force and displacement sensing units collect data during the contact process to determine if there are any installation abnormalities in the quick-release mechanism. If an abnormality is found, the sintering equipment is prohibited from starting and an alarm signal is output. This design advances the detection of installation defects from the sintering process to before sintering begins, preventing frame displacement or tilting caused by inadequate locking of the quick-release mechanism under high temperature and high pressure conditions, thus preventing uneven stress on the PI film and product yield loss.

[0016] Secondly, the self-testing process does not damage the PI membrane: the indenter makes contact with the membrane using a preset low-pressure load, the amplitude of which is far lower than the process pressure during formal sintering. This low-pressure load is only used to achieve light contact between the indenter and the PI membrane to collect test data. The PI membrane only experiences minimal elastic deformation during the contact process and will not undergo plastic deformation or breakage. Therefore, the self-testing itself does not affect the normal use of the PI membrane in subsequent formal sintering.

[0017] Secondly, the wedge-shaped notches and the limiting buckles work together to eliminate positioning gaps: wedge-shaped notches are set at both ends of the frame, and the engaging end of the limiting buckle is adapted to the shape of the wedge-shaped notches. When the frame is pushed into the predetermined locking position, the engaging end engages with the wedge-shaped notch, and the wedge-shaped engagement eliminates the fit gap of the frame in the length direction, so that the frame is automatically centered in the length direction. From a structural perspective, this provides a stable detection benchmark for the self-inspection of the locking state of the quick-release mechanism. Attached Figure Description

[0018] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 A diagram showing the installation location of the PI film quick-release device with installation self-test function provided in this application on the sintering equipment; Figure 2 A schematic diagram of the PI film quick-release device with installation self-test function provided in this application; Figure 3 A diagram illustrating the insertion and removal process of the framework provided for this application; Figure 4 Provided for this application Figure 2 The hidden mounting base is shown in the structural diagram of the limiting assembly. Figure 5 A partially enlarged view of the limiting assembly and wedge-shaped notch provided in this application; Figure 6 A schematic diagram of the wedge-shaped notch and PI film clamping spring provided in this application; Figure 7 A diagram showing the relative positions of the pressure head and the PI film quick-release device provided in this application.

[0019] The text labels in the image represent: 1. Upper mold; 2. Frame; 3. Tray; 4. Lower mold; 5. Mounting base; 51. Ejection spring; 52. Lifting and returning spring; 53. Slide groove; 6. Limit combination; 61. Toggle lever; 62. Limit buckle; 7. Wedge notch; 8. PI film clamping spring; 9. Pressure head. Detailed Implementation

[0020] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0021] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0022] As mentioned in the background section, this application proposes a quick-release device for PI film with a self-testing installation function, used to detachably install the PI film between the pressure head 9 of the sintering equipment and the workpiece. Figure 1-7 As shown, it includes: The frame 2, on which the PI film is fixed, has wedge-shaped notches 7 at both ends of the frame 2 in the length direction perpendicular to the disassembly and assembly direction; The quick-release mechanism includes: a mounting base 5 with a groove 53 along the disassembly / assembly direction, wherein the frame 2 is slidably disposed within the groove 53; an ejector spring 51 disposed between the mounting base 5 and the frame 2, which is in a compressed state when the frame 2 is locked, applying an outward thrust along the disassembly / assembly direction to the frame 2; and a limiting buckle 62 disposed on the mounting base 5, wherein its engaging end is adapted to the shape of the wedge-shaped notch 7. When the frame 2 is pushed into the predetermined locking position along the groove 53, the limiting buckle 62 engages with the corresponding wedge-shaped notch 7 from both ends of the frame 2 along the length direction, limiting the displacement of the frame 2 in the disassembly / assembly direction to resist the thrust of the ejector spring 51. At the same time, the wedge-shaped engagement between the engaging end and the wedge-shaped notch 7 eliminates the fit gap of the frame 2 in the length direction, thereby centering the frame 2 in the length direction. A force sensing unit is used to sense the force applied to the PI membrane by the pressure head 9; A displacement sensing unit is used to sense the displacement of the pressure head 9; The controller, electrically connected to the force sensing unit and the displacement sensing unit, is configured to: after the PI membrane is replaced and installed and the frame 2 is locked by the quick-release mechanism, and before the sintering equipment performs formal sintering, control the pressure head 9 to move towards and contact the PI membrane with a preset low-pressure load, and determine whether there is an installation abnormality in the PI membrane and / or the quick-release mechanism based on the data collected by the force sensing unit and the displacement sensing unit during the contact process; if there is an installation abnormality, the controller will prevent the sintering equipment from starting the formal sintering program and output an alarm signal.

[0023] In a preferred embodiment, there are multiple pressure heads 9, and the number of PI films is the same as the number of pressure heads 9. Each PI film is respectively arranged in a one-to-one correspondence with each pressure head 9, and each PI film is independently arranged on the frame 2 corresponding to a substrate to be sintered. The frame 2 is also provided with multiple PI film clamping springs 8 corresponding to each PI film. Each PI film clamping spring 8 clamps and fixes the edge of the corresponding PI film to the frame 2, so that each PI film is kept in a taut state.

[0024] In a preferred embodiment, there are multiple force sensing units, each force sensing unit is configured to correspond to one pressure head 9, and is used to independently sense the force applied to the corresponding PI film by the corresponding pressure head 9; there are multiple displacement sensing units, each displacement sensing unit is configured to correspond to one pressure head 9, and is used to independently sense the displacement of the corresponding pressure head 9.

[0025] Specifically, the sintering equipment includes an upper mold 1, a pressure head 9, a quick-release device for the PI film assembly, a lower mold 4, and a tray 3. The upper mold 1 serves as a fixing device for the pressure head 9 and also transmits the pressure applied by the loading cylinder to the workpiece. Below the pressure head 9 is the quick-release device for the PI film assembly. The tray 3 is used to place the workpiece to be sintered and is located on the heating plate of the lower mold 4. The quick-release device for the PI film assembly consists of two main parts: the PI film assembly and the quick-release mechanism.

[0026] The PI film assembly includes a frame 2, PI films, and PI film clamping springs 8. The frame 2 is a rigid, rectangular substrate on which the PI films are fixed. Multiple PI films are used, each corresponding to a substrate to be sintered and independently arranged on the frame 2 to avoid interference between products. The frame 2 has multiple PI film clamping springs 8 corresponding to each PI film. Each PI film clamping spring 8 clamps and fixes the edge of the corresponding PI film to the frame 2, keeping the PI films taut. The frame 2 has wedge-shaped notches 7 at both ends along its length perpendicular to the assembly / disassembly direction. The wedge-shaped notches 7 are adapted to the engaging shape of the limiting buckle 62 described below.

[0027] The quick-release mechanism includes a mounting base 5, an ejector spring 51, a limiting assembly 6, a clamping screw, and a lifting and returning spring 52. The mounting base 5 is fixed to the sintering equipment and has one at each end of the frame 2 along its length. Each mounting base 5 has a U-shaped groove 53 on its inner side along the disassembly / assembly direction. The frame 2 is slidably positioned within the groove 53 for sliding in and out during disassembly / assembly. The inner side of the groove 53 is chamfered to reduce frictional resistance. The ejector spring 51 is located between the mounting base 5 and the frame 2. The end of the mounting base 5 has a mounting hole with a threaded post fixed inside. The ejector spring 51 is fitted onto this threaded post, with the spring's natural length greater than the length of the threaded post. The threaded post provides a guide for the extension and retraction of the ejector spring 51. When the frame 2 is locked, the ejector spring 51 is in a compressed state, with one end abutting against the end of the mounting base 5 and the other end abutting against the frame 2, applying an outward thrust to the frame 2 along the disassembly / assembly direction. The limiting assembly 6 includes a lever 61 and a limiting buckle 62. The limiting buckle 62 is mounted on the mounting base 5, and its engaging end is adapted to the shape of the wedge-shaped notch 7 on the frame 2. The lever 61 is fixed on the limiting buckle 62 and extends outward to a position that can be manually accessed for manual operation to release the lock. The lifting return spring 52 is mounted on the mounting base 5. Each mounting base 5 has two lifting return springs 52 on its upper surface. The lower end of the lifting return spring 52 is fixed to the upper surface of the mounting base 5, and the upper end is engaged with the corresponding rib of the sintering equipment. The elastic extension direction of the lifting return spring 52 is perpendicular to the disassembly and assembly direction and also perpendicular to the length direction of the frame 2, that is, it is set along the mold closing direction of the sintering equipment.

[0028] The positions and fits of the components are as follows: Frame 2 slides into the mounting seats 5 on both sides along the disassembly / assembly direction via slide groove 53. When frame 2 is pushed into the predetermined locking position along slide groove 53, limit buckles 62 engage with corresponding wedge-shaped notches 7 from both ends of frame 2 along its length, limiting the displacement of frame 2 in the disassembly / assembly direction to resist the thrust of ejector spring 51. At the same time, the wedge-shaped engagement between the engaging end and the wedge-shaped notch 7 eliminates the fit gap of frame 2 in the length direction, making frame 2 centrally positioned in the length direction, further fixing the PI film and the product and pressure head 9 with central symmetry. In the locked state, ejector spring 51 is compressed, continuously applying an outward thrust to frame 2 along the disassembly / assembly direction. This thrust is resisted by the engagement of limit buckles 62 and wedge-shaped notches 7, and frame 2 is stably locked in the predetermined locking position. Lifting and returning spring 52 is compressed when the mold is closed, and assists the entire PI film assembly quick-release device in resetting through elastic restoring force when the mold is opened. When the PI film needs to be replaced, manually move lever 61 to disengage the limit buckle 62 from the wedge-shaped notch 7 of frame 2, releasing the lock on frame 2. At this time, the ejector spring 51 extends instantly, pushing frame 2 outward a preset distance along the slide groove 53 under the guidance of the threaded post, making it easy for the operator to grab and pull out frame 2. After removing frame 2, remove the PI film clamping springs 8 one by one, replace the PI film, and tighten the clamping springs again. During installation, push frame 2 with the new PI film installed along the slide groove 53. After it is in place, the limit buckle 62 automatically engages with the wedge-shaped notch 7, and the ejector spring 51 is compressed, completing the locking.

[0029] The working process of the sintering equipment is as follows: Pre-sintering stage: The pressure head 9, the quick-release device of the PI film assembly, and the tray 3 are not in contact with each other, and the center of the pressure head 9, the PI film, and the product are symmetrical. The lower mold 4 gradually rises while simultaneously heating the product, pressing against the quick-release device of the PI film assembly, while the upper mold 1 remains stationary. The lifting and returning spring 52 is gradually compressed until the mold closing is complete. At this point, the pressure head 9 has not yet contacted the PI film, but the product is in contact with the PI film.

[0030] Sintering stage: The upper mold 1, the quick-release device for the PI film assembly, and the lower mold 4 are in contact with each other. The pressure head 9 of the upper mold 1 moves downward under the action of the loading cylinder, passes through the hollow area of ​​the frame 2, and transmits pressure evenly to the product through the PI film until sintering is completed after a certain period of time.

[0031] Furthermore, the force sensing unit is used to sense the force applied to the PI membrane by the pressure head 9, and can be a piezoresistive force sensor, a piezoelectric force sensor, or a strain gauge force sensor. The force sensing unit is installed on the force transmission path of the pressure head 9, for example, at the connection between the pressure head 9 and the drive mechanism, or at the end face of the pressure head 9 in contact with the PI membrane. The displacement sensing unit is used to sense the displacement of the pressure head 9, and can be a grating ruler, a magnetic grating ruler, a laser displacement sensor, or a wire displacement sensor, and is installed on the side of the pressure head 9 or on a component that moves synchronously with the pressure head 9. The number of force sensing units and displacement sensing units can be set according to actual needs. In this embodiment, when there are multiple pressure heads 9, the number of both units is the same as the number of pressure heads 9 and they are set one-to-one, which will be further explained in subsequent embodiments.

[0032] The controller is the core of the device's control system and can be a PLC, industrial computer, or embedded controller. The controller is electrically connected to the force sensing unit and the displacement sensing unit. On one hand, it receives analog or digital signals collected by the force sensing unit and on the other hand, it sends control commands to the drive mechanism of the pressure head 9. The complete process of the controller performing self-test judgment is as follows.

[0033] The first step is for the controller to determine whether the self-test trigger conditions are met. The trigger conditions are that the PI film has been replaced and installed, and frame 2 is locked by the quick-release mechanism. The replacement and installation of the PI film is complete when the operator has removed the old PI film from frame 2, fixed the new PI film to frame 2 using the PI film clamping spring 8, and pushed frame 2 into mounting base 5 along the slide groove 53. Frame 2 being locked by the quick-release mechanism means that the limit latch 62 has engaged with the wedge-shaped notch 7, the ejector spring 51 is compressed, and frame 2 is stably locked in the predetermined locking position. The controller can confirm whether the trigger conditions are met in the following ways: receiving a signal from the proximity switch or micro switch on mounting base 5; when the switch detects that the limit latch 62 has engaged, it outputs a locking completion signal; or the operator manually presses the confirmation button after installation, and the controller determines that the trigger conditions are met upon receiving the confirmation signal.

[0034] The second step involves the controller controlling the pressure head 9 to move towards and contact the PI membrane with a preset low-pressure load after the triggering condition is met. The preset low-pressure load refers to a force value with an amplitude much lower than the pressure of the actual sintering process. The actual sintering process pressure is typically in the tens of kilonewtons range, while the low-pressure load amplitude is only between a few Newtons and tens of Newtons. Its specific determination method will be explained in detail in subsequent embodiments. The purpose of the low-pressure load is solely to achieve effective contact between the pressure head 9 and the PI membrane for data collection, without causing plastic deformation or mechanical damage to the PI membrane. The controller controls the movement of the pressure head 9 by sending a motion command to the drive mechanism of the pressure head 9, causing it to move downwards at a preset low speed. The drive mechanism can be a servo motor-driven lead screw mechanism, a hydraulic cylinder, or a pneumatic cylinder. During the downward movement of the pressure head 9, the controller reads the displacement value collected by the displacement sensing unit and the force value collected by the force sensing unit in real time.

[0035] Thirdly, the controller uses data collected by the force sensing unit and displacement sensing unit during the contact process to determine if there are any installation abnormalities in the PI membrane and quick-release mechanism. The contact process refers to the entire process from the downward movement of the pressure head 9 to the pressure head 9 contacting the PI membrane with a low-pressure load and continuing to compress a preset small displacement. The data collected by the controller includes the unloaded segment data of the pressure head 9 before contacting the PI membrane and the contact segment data after contacting the PI membrane. The basic principle of the judgment is that the locking state of the quick-release mechanism and the installation state of the PI membrane will be reflected in the force-displacement response of the pressure head 9 when it contacts the PI membrane through mechanical transmission. For example, if the quick-release mechanism is not locked in place, causing the frame 2 to tilt, the displacement value of the pressure head 9 when it contacts the PI membrane at different positions will be different, and the dispersion between the critical contact displacement values ​​of each pressure head 9 will be larger. If the PI membrane is not taut, the slope of the force-displacement curve after the pressure head 9 contacts the PI membrane will be lower than the normal value, showing that the slope of the force-displacement curve is lower in the initial contact stage. If there are wrinkles in the PI membrane, identifiable high-frequency fluctuations will be superimposed on the force-displacement curve. If the PI membrane is missing, the force sensing unit will not detect a valid force signal when the pressure head 9 reaches the expected contact position. By analyzing these force-displacement response characteristics, the controller can infer the installation status. The specific judgment algorithm will be explained step by step in subsequent steps.

[0036] Fourth, if the controller determines that there is an installation abnormality, it will prevent the sintering equipment from starting the formal sintering program and output an alarm signal. The prevention of startup can be achieved by the controller sending a prohibition signal to the main control system of the sintering equipment, or by directly cutting off the power supply circuits to the heating and loading systems. The alarm signal can be output by displaying a pop-up window on the human-machine interface showing the abnormality type and workstation number, triggering an audible and visual alarm device, or sending alarm information to the upper-level management system via the MES system interface. If the controller determines that there is no installation abnormality, it will allow the sintering equipment to start the formal sintering program normally.

[0037] The technical advantage of this implementation lies in that by inserting a low-pressure contact self-inspection step after the quick-release mechanism is locked and before formal sintering, the timing of detecting installation defects is advanced from the sintering process to before sintering begins. If the quick-release mechanism is not locked in place or there are abnormalities in the PI film installation, the self-inspection can promptly detect and prevent the equipment from entering the high-temperature and high-pressure sintering stage, avoiding product scrap due to the amplification of poor installation during sintering. The technical principle is that the installation state is reflected in the force-displacement response through mechanical transmission. By analyzing this response, the installation state can be inferred in reverse, forming a closed-loop installation quality verification mechanism. The self-inspection uses a low-pressure load, the amplitude of which is controlled within a range that will not damage the PI film, ensuring that the self-inspection itself will not disrupt the existing installation state or cause irreversible damage to the PI film, thus guaranteeing the safety and repeatability of the self-inspection.

[0038] Furthermore, the number of pressure heads 9 is multiple, and the specific number can be flexibly configured according to production needs, such as four, six, or eight. The number of PI films is the same as the number of pressure heads 9, with each PI film corresponding to one pressure head 9, i.e., one pressure head 9 corresponds to one PI film, and one PI film corresponds to one pressure head 9. Each PI film is independently arranged on the frame 2, corresponding to a substrate to be sintered, and the PI films are separated from each other and not connected. This independent layout allows each PI film to work independently when multiple products are sintered simultaneously, and the state of one PI film will not affect adjacent PI films, avoiding mutual interference between products. From an operational perspective, when one PI film is damaged or needs to be replaced, the operator only needs to replace that PI film, and the remaining PI films can continue to be used, reducing consumable costs and maintenance time. The frame 2 is also equipped with multiple PI film clamping springs 8, each corresponding to one PI film. The PI film clamping spring 8 is a flexible metal sheet, one end of which is fixed to the frame 2 by a clamping screw, and the other end is pressed against the edge area of ​​the PI film. The PI film clamping spring 8 utilizes its own elastic restoring force to press the edge of the PI film it covers onto the surface of the frame 2, keeping the PI film taut. A taut state means that the PI film is flattened on the frame 2 with appropriate tension, a smooth surface without slack, sagging, or wrinkles. Maintaining the PI film's taut state is a prerequisite for ensuring that the pressure head 9 evenly transmits pressure to the product surface through the PI film during formal sintering. Each PI film clamping spring 8 works independently, responsible for fixing its corresponding PI film, and the clamping force of each spring does not affect the others. When replacing the PI film, the operator simply lifts the PI film clamping spring 8, removes the old PI film, inserts the cut new PI film, and then presses the PI film clamping spring 8 back to complete the replacement of a single PI film; the operation is simple and quick. The multi-station independent layout provides the structural basis for independent sensing and judgment at each station. Since each pressure head 9 corresponds to one PI film, and each PI film is fixed by an independent PI film clamping spring 8, the installation state of each PI film is independent of each other. Therefore, during self-testing, the controller can control each pressure head 9 to contact its corresponding PI membrane, obtain independent force and displacement data for each station, thereby enabling individual judgment of each station and precise location of abnormal stations.

[0039] Furthermore, there are multiple force sensing units, the same number as the number of pressure heads 9. Each force sensing unit corresponds to one pressure head 9 and is used to independently sense the force applied by the corresponding pressure head 9 to the corresponding PI membrane. Similarly, there are multiple displacement sensing units, the same number as the number of pressure heads 9. Each displacement sensing unit corresponds to one pressure head 9 and is used to independently sense the displacement of the corresponding pressure head 9. During the self-test process, the controller controls each pressure head 9 to move towards and contact its corresponding PI membrane with a preset low-pressure load. Each force sensing unit and each displacement sensing unit synchronously collects the force and displacement data of their respective pressure heads 9. The controller receives a set of multi-channel data, with each channel corresponding to a station, containing a data sequence of the force and displacement values ​​of the pressure head 9 at that station changing over time. These multi-channel data provide independent displacement information for each station in calculating the critical contact displacement value, provide independent force and displacement correspondence for each station in generating force-displacement curves, provide cross-comparison data between multiple stations for dispersion analysis, provide comparison data between station pairs that are centrally symmetrical about the length direction of frame 2 for symmetry detection, and provide station-by-station judgment basis for locating abnormal stations.

[0040] The multi-station independent sensing configuration is closely integrated with the multi-station independent layout mechanical structure. Since each PI membrane is fixed by an independent PI membrane clamping spring 8, each pressure head 9 can move independently. Combined with the independent force and displacement sensing capabilities of each pressure head 9, each station constitutes an independent detection sub-unit. The detection sub-units do not interfere with each other, and the control logic can independently analyze the data from each station to obtain the force-displacement curve characteristics of the PI membrane at that station. Simultaneously, the control logic can also cross-compare the data from each station. For example, it can compare the contact critical displacement values ​​of each station to determine if the quick-release mechanism is tilted, compare the force-displacement curves of symmetrical stations to determine if the installation method is consistent, and compare the slope of the curves of each station to determine if the tension of each PI membrane is uniform.

[0041] In a preferred embodiment, the controller is specifically configured to: First-level judgment: During the process of controlling each pressure head 9 to move towards the corresponding PI film with the low pressure load, the contact critical displacement value of each pressure head 9 when it first contacts the corresponding PI film is obtained, and the dispersion between each contact critical displacement value is calculated. When the dispersion exceeds a preset dispersion threshold, it is determined that the quick-release mechanism has an installation abnormality, and the second-level judgment is skipped; When the dispersion does not exceed the preset dispersion threshold, the slope of the force-displacement curve corresponding to each pressure head 9 within the preset displacement range after contact is further obtained, and the slope dispersion between each curve slope is calculated; if the slope dispersion exceeds the preset slope dispersion threshold, it is determined that the quick-release mechanism has an installation abnormality, and the second-level judgment is skipped. Second-level judgment: Based on the data collected by each force sensing unit and each displacement sensing unit during the contact process, the actual force-displacement curve corresponding to each pressure head 9 is generated, and each actual force-displacement curve is compared with the preset installation qualification benchmark feature one by one; when the deviation between the actual force-displacement curve corresponding to any pressure head 9 and the installation qualification benchmark feature exceeds the preset threshold, it is determined that the PI membrane corresponding to the pressure head 9 has an installation abnormality, and the workstation number corresponding to the PI membrane is indicated in the alarm signal.

[0042] Specifically, the controller divides the self-test judgment into two levels: a first-level judgment and a second-level judgment, which are executed sequentially. The first-level judgment is used to detect whether there is an installation abnormality in the quick-release mechanism. If an abnormality is found, the second-level judgment is skipped, and an alarm signal is output directly. If no abnormality is found in the first-level judgment, the second-level judgment is executed to detect whether there is an installation abnormality in the PI film itself at each station. When neither level of judgment detects an abnormality, the self-test passes, and the controller allows the sintering equipment to start the formal sintering process.

[0043] The specific execution process of the first-level judgment is as follows.

[0044] First, the controller controls each pressure head 9 to move towards the corresponding PI membrane with a preset low-pressure load. During the movement, the controller synchronously collects the output data of each force sensing unit and each displacement sensing unit at a preset sampling frequency. The sampling frequency can be between 200Hz and 1000Hz; in this embodiment, 200Hz is used, meaning that data from all channels is collected every 5 milliseconds. The collected raw data are the force value time series and displacement value time series of each channel. The controller presets a contact determination force threshold, which is slightly higher than the inherent noise level of the force sensing unit. The force sensing unit's output is not zero under no-load conditions, exhibiting slight noise fluctuations. The contact determination force threshold is set to three to five times the noise fluctuation amplitude; in this embodiment, it is set to three times the root mean square noise value. When, at a certain sampling moment, the output value of the force sensing unit corresponding to a certain pressure head 9 first exceeds the contact determination force threshold, the controller determines that the pressure head 9 has contacted the PI membrane at that moment and records the output value of the displacement sensing unit corresponding to that pressure head 9 at that moment as the critical contact displacement value for that pressure head 9. The critical contact displacement value reflects the amount of displacement traversed by the pressure head 9 from its initial position to its first contact with the PI film. The controller acquires the critical contact displacement values ​​corresponding to all pressure heads 9 in the manner described above.

[0045] Then, the controller calculates the dispersion between each contact critical displacement value. The dispersion is calculated by first calculating the arithmetic mean of all contact critical displacement values, then calculating the square of the difference between each contact critical displacement value and the arithmetic mean, summing all squares and dividing by the number of contact critical displacement values ​​to obtain the variance, and finally taking the square root of the variance to obtain the standard deviation. The standard deviation is the dispersion index used in this embodiment. The larger the standard deviation, the greater the difference in contact height at each station, and the more likely the locking state of the quick-release mechanism is abnormal. The controller compares the calculated dispersion with a preset dispersion threshold. The preset dispersion threshold is determined during the calibration phase before the device leaves the factory by recording the standard deviation of the contact critical displacement values ​​under each normal installation, taking the statistical upper limit of these standard deviations. In this embodiment, the preset dispersion threshold is the mean of the standard deviations under normal installation plus three times the standard deviation. If the calculated dispersion exceeds the preset dispersion threshold, the controller determines that the quick-release mechanism has an installation abnormality, skips the second-level judgment, directly outputs an alarm signal, and prohibits the sintering equipment from starting. If the dispersion does not exceed a preset dispersion threshold, the controller further acquires the force-displacement data of each pressure head 9 within a preset displacement interval after contact. The preset displacement interval after contact refers to the displacement interval traversed by the pressure head 9 as it continues to move downwards a preset distance from the displacement point corresponding to the critical contact displacement value. The preset distance can be a value between 0.05mm and 0.2mm; in this embodiment, it is 0.1mm. The controller extracts force and displacement value data pairs whose displacement values ​​fall within this interval from the force value time series and displacement value time series of each pressure head 9, using these as the force-displacement data of that pressure head 9 within the preset displacement interval after contact. For each pressure head 9, the controller calculates the slope of the force-displacement curve corresponding to that pressure head 9 within the preset displacement interval after contact based on the extracted force-displacement data. The calculation method employs least squares linear fitting. Specifically, with displacement as the independent variable and force as the dependent variable, a univariate linear regression is performed on multiple sets of intercepted displacement-force data to fit a straight line of the form F = k·d + b, where F is the force value, d is the displacement value, k is the slope, and b is the intercept. The fitted slope k is the slope of the curve corresponding to the pressure head 9, reflecting the support stiffness of the PI membrane at this station after contact. The controller calculates the slope dispersion among all curve slopes, using the same method as the aforementioned dispersion calculation, i.e., calculating the standard deviation of all curve slopes. The slope dispersion is compared with a preset slope dispersion threshold, which is also determined through statistical analysis of data from multiple normal installations during the pre-shipment calibration phase. If the slope dispersion exceeds the preset slope dispersion threshold, the controller determines that there is an installation abnormality in the quick-release mechanism, skips the second-level judgment, directly outputs an alarm signal, and prohibits the sintering equipment from starting. If neither the dispersion nor the slope dispersion exceeds the corresponding threshold, the controller determines that there is no installation abnormality in the quick-release mechanism and continues to execute the second-level judgment.

[0046] The specific execution process of the second-level judgment is as follows.

[0047] Based on the force-displacement data of each pressure head 9 acquired in the first-level judgment, the controller generates the actual force-displacement curve corresponding to each pressure head 9. The generation method is as follows: using the displacement value collected by the displacement sensing unit as the abscissa and the force value synchronously collected by the force sensing unit as the ordinate, all sampling points within the preset displacement interval after contact are arranged in ascending order of displacement value, resulting in a sequence of force-displacement curves, which is the actual force-displacement curve corresponding to that pressure head 9. The curve includes the complete force-displacement correspondence from the contact critical displacement value to the end of the preset displacement interval after contact.

[0048] The controller compares each actual force-displacement curve with a preset installation qualification benchmark feature. This benchmark feature is pre-established and stored in the controller through calibration experiments before the device leaves the factory; the specific establishment method will be explained in subsequent embodiments. In this embodiment, the installation qualification benchmark feature includes a benchmark slope range, which is the range of values ​​that the slope of the PI membrane's force-displacement curve should fall into within the preset displacement interval after contact under normal installation conditions. The benchmark slope range is obtained by statistically analyzing multiple normal installation data from calibration experiments, and is taken as the mean of the normal installation slope plus or minus three standard deviations.

[0049] The specific comparison method is as follows: For each pressure head 9, the controller extracts the curve slope within a preset displacement interval after contact from the actual force-displacement curve of that pressure head 9. The extraction method is the same as the method used to calculate the curve slope in the first-level judgment, employing least squares linear fitting. The extracted curve slope is compared with the reference slope range to determine whether the curve slope falls within the reference slope range. If the curve slope of a pressure head 9 is less than the lower limit of the reference slope range, it indicates that the support stiffness of the PI membrane at that station is too low under pressure, possibly due to the PI membrane not being tensioned. If the curve slope of a pressure head 9 is greater than the upper limit of the reference slope range, it indicates that the support stiffness of the PI membrane at that station is too high under pressure, possibly due to excessive tension of the PI membrane or an excessively large PI membrane thickness.

[0050] When the slope of the curve corresponding to a certain pressure head 9 exceeds the reference slope range, that is, the deviation of the curve slope from the qualified installation reference characteristic exceeds a preset threshold, the controller determines that the PI membrane corresponding to the pressure head 9 has an installation abnormality and indicates the station number corresponding to the PI membrane in the alarm signal. The station number is the position number of each pressure head 9 on the frame 2, which is pre-stored in the controller and corresponds one-to-one with each pressure head 9. When the slope of the curves of all pressure heads 9 falls within the reference slope range, the controller determines that there is no installation abnormality for each PI membrane, and the second-level judgment is passed.

[0051] The technical advantage of this implementation lies in its two-stage progressive judgment: first, the overall locking state of the quick-release mechanism is assessed, followed by the individual installation state of the PI membrane at each workstation, ensuring consistency between the judgment logic and the physical causal relationship. The first-stage judgment employs dual-indicator verification using contact critical displacement dispersion and curve slope dispersion. This detects anomalies in the quick-release mechanism from two independent dimensions: initial contact height and post-compression support stiffness, eliminating the risk of missed detection by a single indicator. The second-stage judgment compares the force-displacement curve of each workstation with a statistically based benchmark slope range. This benchmark slope range is determined by the statistical distribution of multiple normal installation data, possessing clear statistical significance and effectively distinguishing between normal fluctuations and abnormal deviations. The technical principle is that an abnormal locking of the quick-release mechanism simultaneously or separately affects the initial contact height and post-compression support stiffness of each workstation; these two physical quantities complement each other. An abnormal PI membrane installation primarily affects the force-displacement response characteristics of that workstation, manifested as a curve slope deviating from the normal statistical range.

[0052] In a preferred embodiment, the controller is configured to: only when the first-level determination indicates that the quick-release mechanism has an installation abnormality, When it is determined that there is an installation abnormality in the quick-release mechanism, the abnormal mode of the quick-release mechanism is determined according to the spatial distribution of the contact critical displacement value corresponding to each pressure head 9. If each of the contact critical displacement values ​​shows a monotonically increasing or monotonically decreasing trend along the length direction, it is determined that the frame 2 is tilted in the length direction and the corresponding end of the limiting buckle 62 is not engaged in place. If the distribution of each of the contact critical displacement values ​​does not show a monotonic trend along the length direction, and there are differences between the values, then it is determined that the ejector spring 51 is not compressed evenly or that there are foreign objects in the slide groove 53.

[0053] Specifically, the controller pre-stores the spatial position information of each pressure head 9 on the frame 2, including the station number of each pressure head 9 and its position coordinates along the length of the frame 2. The length direction is the left-right direction of the frame 2, perpendicular to the assembly / disassembly direction. The position coordinates can be based on the center of the length direction of the frame 2 as the origin, with left being negative and right being positive, or they can be numbered sequentially with one end of the frame 2 as the origin. In this embodiment, the center of the length direction of the frame 2 is taken as the zero point, and the position coordinates of each pressure head 9 are recorded in millimeters.

[0054] The specific execution process for identifying abnormal patterns in quick-release mechanisms is as follows.

[0055] The first step involves the controller arranging each pressure head 9 according to its position coordinates along the length direction from smallest to largest, resulting in a sequence of contact critical displacement values ​​arranged in an orderly manner along the length direction. Each element in the sequence contains two pieces of information: the position coordinates of the pressure head 9 and the corresponding contact critical displacement value.

[0056] The second step involves the controller determining whether the sequence exhibits a monotonically increasing or decreasing trend along its length. The determination of a monotonically increasing trend utilizes linear regression analysis. Specifically, the position coordinates of each pressure head 9 along its length are used as the independent variable, and the corresponding critical contact displacement value is used as the dependent variable. A univariate linear regression using the least squares method is employed to fit a straight line of the form D = a·x + b, where D is the critical contact displacement value, x is the position coordinate along the length, a is the slope of the fitted line, and b is the intercept. The sign and magnitude of the slope 'a' reflect the trend of the critical contact displacement value along its length; a positive 'a' indicates an increasing displacement value from left to right, and a negative 'a' indicates a decreasing displacement value from left to right.

[0057] The controller calculates the goodness of fit between the fitted line and each data point, using the coefficient of determination (R²) as the indicator of goodness of fit. The R² is calculated as follows: first, the sum of squares of all critical contact displacement values ​​is calculated, i.e., the sum of squares of the differences between each displacement value and the mean displacement; then, the sum of squares of the residuals that cannot be explained by the fitted line is calculated, i.e., the sum of squares of the differences between each actual displacement value and the corresponding predicted value on the fitted line; finally, the sum of squares of the residuals is subtracted from the sum of squares, and then divided by the sum of squares to obtain R². The value of R² ranges from 0 to 1; the closer it is to 1, the better the linear fit, and the more significant the monotonic trend of the displacement values ​​along the length direction.

[0058] The controller compares the calculated R² with a preset trend judgment threshold. The trend judgment threshold is set to 0.85, and the specific value in this embodiment is determined based on statistical analysis of multiple normal and abnormal installation test data. If R² is greater than 0.85 and the absolute value of the slope a is greater than the preset minimum slope threshold, it indicates that the contact critical displacement value has a significant monotonic trend along the length direction, and the controller determines that frame 2 is tilted in the length direction. The preset minimum slope threshold is used to eliminate false trends with slopes close to zero caused by measurement noise, and is set to one-tenth of the fluctuation range of the contact critical displacement value of each station under normal installation conditions. At this time, the controller determines that the limit buckle 62 at the corresponding end is not engaged. Specifically, if the slope is positive, it indicates that the displacement value at the positive end of the length direction is too large, the frame 2 at that end is too high, and the limit buckle 62 at that end is not engaged; if the slope is negative, it indicates that the displacement value at the negative end of the length direction is too large, the frame 2 at that end is too high, and the limit buckle 62 at that end is not engaged. The controller indicates in the alarm signal that the end that is not properly engaged needs to have its limit latch 62 checked.

[0059] Thirdly, if R² is not greater than the trend judgment threshold, or the absolute value of slope a is not greater than the minimum slope threshold, it indicates that the spatial distribution of the contact critical displacement value does not have a monotonic trend along the length direction, and the spatial distribution of each value is scattered and irregular. However, the first-level judgment has already determined that the dispersion or slope dispersion exceeds the standard, and there are significant differences between the values, thus ruling out the possibility that the frame 2 is normal overall. The controller determines that the abnormality is caused by uneven compression of the ejector spring 51 or the presence of foreign objects in the slide 53. When the ejector spring 51 is unevenly compressed, the spring's thrust on each position of the frame 2 is inconsistent, and the frame 2 produces irregular posture deviations under the thrust, resulting in irregular differences in the height of the PI film surface at each station. When there are foreign objects in the slide 53, the frame 2 is raised at certain positions, and the contact critical displacement value shows random deviations. The controller indicates in the alarm signal that the installation status and compression uniformity of the ejector spring 51 need to be checked, and the interior of the slide 53 needs to be cleaned.

[0060] The technical advantage of this implementation lies in its ability to automatically distinguish between two abnormal modes: tilting of the quick-release mechanism and uneven spring movement or foreign objects, by analyzing the spatial distribution trend of the critical contact displacement value along the length of frame 2 using linear regression. The technical principle is that, as a rigid body, the posture change caused by the failure of one end of the latch is a rotational tilt around the other end, with the displacement value at each station changing linearly along the length. The posture change caused by uneven spring movement or foreign objects is a localized irregular deformation, with no linear trend in the displacement value. The goodness of fit R² of the linear regression can quantify the significance of this trend, enabling automatic differentiation between the two abnormal modes.

[0061] In a preferred embodiment, the controller is configured to: only when the second-level determination indicates that a certain PI film has an installation abnormality. Perform a rebound detection action on the pressure head 9 corresponding to the PI film: control the pressure head 9 to rise upward at a preset unloading speed and a preset rebound detection distance, and then move downward at a preset loading speed until it re-contacts the PI film; Obtain the reset contact displacement value when the pressure head 9 re-contacts the PI film, and calculate the difference between the reset contact displacement value and the contact critical displacement value as the rebound hysteresis displacement; Obtain the preset working temperature of the formal sintering process, and based on the preset working temperature and the known stiffness-temperature relationship of the PI film material, convert the rebound hysteresis displacement into the predicted high-temperature rebound hysteresis displacement of the PI film at the preset working temperature. When the predicted high-temperature rebound hysteresis displacement is greater than the preset high-temperature rebound hysteresis threshold, it is determined that the installation abnormality of the PI membrane is caused by insufficient tension reserve of the PI membrane under high-temperature conditions, and the alarm signal indicates that the abnormality can be eliminated by replacing the PI membrane. When the predicted high-temperature rebound hysteresis displacement is not greater than the preset high-temperature rebound hysteresis threshold, it is determined that the installation abnormality of the PI film is caused by insufficient clamping force of the PI film clamping spring 8, and the alarm signal indicates that the corresponding PI film clamping spring 8 needs to be checked or adjusted.

[0062] Specifically, after the second-level judgment determines that there is an installation abnormality in the PI membrane at a certain workstation, the force-displacement curve of that workstation deviates from the installation qualification benchmark characteristics. There are two possible reasons for the deviation: First, the PI membrane has insufficient tension reserve under high-temperature conditions. That is, although the PI membrane may be in a taut state at room temperature, it will soften and relax in the high-temperature environment of formal sintering, resulting in an inability to maintain sufficient tension to uniformly transmit pressure. Second, the clamping force of the PI membrane clamping spring 8 is insufficient. That is, the clamping force of the spring on the edge of the PI membrane is insufficient, and the edge of the PI membrane will undergo slight displacement under the spring when compressed. The two reasons require different solutions. For the former, simply replacing the PI membrane is sufficient, while for the latter, adjusting or replacing the PI membrane clamping spring 8 is necessary.

[0063] The rebound detection process is as follows. First, the controller controls the pressure head 9 corresponding to the abnormal PI membrane to rise upwards at a preset unloading speed and a preset rebound detection distance. The unloading speed is between 0.05 mm / s and 0.2 mm / s; in this embodiment, it is 0.1 mm / s. This speed is slow enough to allow the PI membrane sufficient time for elastic rebound response. The preset rebound detection distance is between 0.02 mm and 0.05 mm; in this embodiment, it is 0.03 mm. This distance is much smaller than the length of the preset displacement interval after contact (0.1 mm), only causing the pressure head 9 to disengage from the PI membrane, but the pressure head 9 remains near the PI membrane surface. During the upward movement of the pressure head 9, the controller continuously records the output data of the force sensing unit and the displacement sensing unit at a sampling frequency of 200 Hz. Then, the controller controls the pressure head 9 to move downwards at a preset loading speed until it re-contacts the PI membrane. The loading speed is the same as the unloading speed, 0.1 mm / s. During the downward movement of the pressure head 9, the controller continuously monitors the output value of the force sensing unit. When the output value of the force sensing unit exceeds the contact determination force threshold again, it is determined that the pressure head 9 has re-contacted the PI membrane, and the output value of the displacement sensing unit at that moment is recorded as the reset contact displacement value. The contact determination force threshold is the same as the threshold used in the first-level judgment, and is three times the root mean square value of the force sensing unit noise. The controller calculates the difference between the reset contact displacement value and the previously obtained contact critical displacement value for this station to obtain the rebound hysteresis displacement. The calculation method is to subtract the contact critical displacement value from the reset contact displacement value; the difference is the rebound hysteresis displacement under room temperature conditions.

[0064] Next, the room temperature rebound hysteresis displacement is converted into a predicted value under high-temperature conditions. The controller acquires the preset operating temperature of the formal sintering program. This temperature is the target temperature value set by the sintering process, which is input by the operator through the human-machine interface before sintering or read from the process formula database. In this embodiment, the silver sintering process is used as an example, and the preset operating temperature is usually between 200℃ and 300℃. The controller pre-stores the stiffness-temperature relationship data of the PI film material. This data is obtained through preliminary material testing. Specifically, the testing method is to use a dynamic mechanical analyzer to test the force displacement response of the PI film sample at preset temperature intervals within the range from room temperature to the sintering operating temperature, and record the ratio of the rebound hysteresis displacement of the PI film at each temperature point to the room temperature rebound hysteresis displacement, thus obtaining a temperature-rebound hysteresis ratio relationship curve. In the relationship curve, the horizontal axis is temperature, and the vertical axis is the rebound hysteresis displacement ratio. The ratio at room temperature is 1. The higher the temperature, the softer the PI film material, and the more significant the rebound hysteresis phenomenon, the larger the ratio. The relationship curve is pre-stored in the controller's memory in the form of a data table, which contains multiple temperature points and their corresponding ratios. For temperature values ​​not directly listed in the data table, the controller uses linear interpolation to calculate the corresponding ratio. Specifically, the controller uses the preset operating temperature as an index to look up the corresponding rebound hysteresis ratio from the temperature-rebound hysteresis ratio data table. If the preset operating temperature is exactly equal to a temperature point in the data table, the ratio corresponding to that temperature point is directly read. If the preset operating temperature falls between two temperature points, linear interpolation is performed using these two temperature points as known points to calculate the corresponding ratio. The obtained ratio is denoted as Ktemperature, where Ktemperature is a dimensionless number greater than 1. The controller multiplies the room temperature rebound hysteresis displacement by Ktemperature to obtain the predicted high-temperature rebound hysteresis displacement.

[0065] A high-temperature rebound hysteresis threshold is preset in the controller. This threshold is determined as follows: during the pre-shipment calibration phase, qualified PI film samples are heated to a preset operating temperature and held at thermal equilibrium. The same rebound test is then performed on the samples under high-temperature conditions, and the rebound hysteresis displacement values ​​of multiple sets of qualified PI films at high temperature are recorded. The mean and standard deviation of these values ​​are calculated, and the mean plus three times the standard deviation is taken as the preset high-temperature rebound hysteresis threshold. This threshold directly corresponds to the qualification standard of PI films under high-temperature operating conditions.

[0066] The controller compares the predicted high-temperature springback hysteresis displacement with a preset high-temperature springback hysteresis threshold. When the predicted high-temperature springback hysteresis displacement is greater than the preset high-temperature springback hysteresis threshold, it indicates that the springback hysteresis characteristic of the PI film will significantly deteriorate under the high-temperature working condition of the preset operating temperature, the PI film will exhibit obvious softening and relaxation, and cannot maintain sufficient tension during the sintering process to uniformly transmit pressure. The controller determines that the installation abnormality of the PI film is caused by insufficient tension reserve of the PI film under the high-temperature working condition, and indicates in the alarm signal that the abnormality can be eliminated by replacing the PI film. After receiving the alarm information, the operator removes the PI film at this station and replaces it with a new PI film.

[0067] When the predicted high-temperature springback hysteresis displacement is not greater than the preset high-temperature springback hysteresis threshold, it indicates that the springback hysteresis characteristic of the PI film at high temperature is still within an acceptable range, and the tension reserve of the PI film itself is sufficient under the high-temperature working condition. The deviation of the force-displacement curve from the reference is not caused by the PI film itself, but by insufficient pressing force of the PI film pressing shrapnel 8. When the pressing force of the shrapnel is insufficient, the edge of the PI film is not completely fixed under the shrapnel, and a tiny displacement occurs at the edge of the PI film when the indenter 9 contacts and applies pressure, resulting in an abnormality in the loading section of the force-displacement curve. However, the elastic springback characteristic of the PI film itself is still normal, so the converted predicted high-temperature springback hysteresis displacement is still within the normal range. The controller determines that the installation abnormality of the PI film is caused by insufficient pressing force of the PI film pressing shrapnel 8, and indicates in the alarm signal that the corresponding PI film pressing shrapnel 8 needs to be inspected or adjusted.

[0068] The technical effect of this embodiment is that by converting the room-temperature springback hysteresis displacement into a predicted value under high-temperature working conditions, the judgment conclusion of the springback detection directly corresponds to the actual performance of the PI film in the formal high-temperature sintering environment. In the conventional solution, whether the tension reserve of the PI film is sufficient is judged at room temperature, which cannot reflect the influence of the softening and relaxation of the PI film at high temperature on the tension, and may cause the PI film judged as qualified at room temperature to actually fail during high-temperature sintering. This embodiment uses the known stiffness-temperature relationship of the PI film material for conversion, and realizes the leap from room-temperature detection to high-temperature working condition prediction without adding any additional hardware and detection operations, which makes up for the inherent limitation that room-temperature self-inspection cannot directly reflect high-temperature performance. The technical principle is that as a polymer material, the mechanical properties of the PI film change regularly with the increase of temperature, and there is a definite positive correlation between the springback hysteresis displacement and temperature, and this relationship can be obtained in advance through pre-material testing and stored in the controller.

[0069] In a preferred embodiment, the controller is further configured to: after the second-level judgment is completed, perform symmetry detection on the indenter 9 that is not determined to have an installation abnormality in the second-level judgment: After generating the actual force-displacement curves corresponding to each of the pressure heads 9, two pressure heads 9 whose positions on the frame 2 are symmetrical about the length direction are determined to be a symmetrical pressure head pair. For at least one pair of symmetrical pressure heads, the two actual force-displacement curves are aligned in the same coordinate system with their respective contact initiation points as the origin. Determine whether the force values ​​at the same displacement increment after the two aligned curves come into contact are consistent. If the force deviation at a certain displacement increment exceeds the sensor's inherent noise level, it is determined that the PI membrane corresponding to at least one of the pressure heads 9 in the group of symmetrical pressure head pairs has inconsistent tension due to differences in installation methods, and the alarm signal indicates that the installation status of the PI membrane at the group of symmetrical workstations needs to be checked.

[0070] Specifically, after the controller completes the second-level judgment, it performs a symmetry test on the pressure heads 9 that were not judged to have installation abnormalities in the second-level judgment. The purpose of the symmetry test is to discover the tension inconsistencies between symmetrical workstations caused by differences in installation methods that were not detected by the second-level judgment. The second-level judgment compares the force-displacement curve of each workstation with a preset installation qualification benchmark feature one by one. This benchmark feature is a statistical range. The force-displacement curves of symmetrical workstations may all fall within the qualification range, but there are systematic shape differences between them. This difference reflects the inconsistency of the operator's method when installing the PI membrane at different workstations. The controller pre-stores the spatial position information of each pressure head 9 on the frame 2, including the correspondence of symmetrical workstations. Two pressure heads 9 that are centrally symmetrical about the length direction of the frame 2 form a symmetrical pressure head pair, that is, a pressure head 9 at a certain position on the left and a pressure head 9 at a mirror position on the right are symmetrical workstations. In this embodiment, the total number of pressure heads 9 is even, and all pressure heads 9 can be paired in pairs to form symmetrical pressure head pairs.

[0071] The specific execution process of symmetry detection is as follows.

[0072] The first step is for the controller to determine the range of pressure heads 9 participating in the symmetry detection. The controller iterates through all pressure heads 9, excluding those pressure heads 9 that have already been determined to have installation abnormalities in the second-level judgment, and uses the remaining pressure heads 9 that have not been determined to be abnormal as candidate pressure heads 9 for symmetry detection. The reason for this is that the pressure heads 9 that have already been judged to be abnormal have clearly had problems and do not need to be cross-verified through symmetry detection.

[0073] The second step involves the controller identifying each symmetrical pressure head pair from the candidate pressure heads 9 based on the pre-stored symmetrical workstation correspondences. It then iterates through all pairable symmetrical pressure head pairs and performs detection on each pair.

[0074] The third step involves the controller extracting the actual force-displacement curves corresponding to each pair of symmetrical pressure heads 9. These curves, already generated in the second-level judgment, are directly retrieved in this step without requiring re-collection of data. Using their respective contact start points as the origin, the two force-displacement curves are aligned in the same coordinate system. Specifically, each displacement value in the displacement value sequence of curve A is subtracted from the contact critical displacement value of curve A, and each displacement value in the displacement value sequence of curve B is subtracted from the contact critical displacement value of curve B, ensuring that the displacement coordinates of both curves are zeroed out at their respective contact start points. The contact critical displacement value has already been acquired and stored in the first-level judgment and is retrieved directly here. After alignment, the displacement coordinates of both curves start from zero, eliminating the overall translation of the two curves on the displacement axis caused by differences in PI film thickness or local frame 2 height, allowing for shape comparison of the two curves within the same displacement coordinate system.

[0075] The fourth step involves the controller determining whether the force values ​​at the same displacement increment after contact are consistent between the two aligned curves. Specifically, within a preset displacement range after contact, a set of equally spaced displacement points are generated with a preset displacement step size of 0.01 mm. For each displacement point, the corresponding force value is obtained from curves A and B. Since the actual collected data points are discrete, linear interpolation is used to calculate the force value corresponding to each displacement point. The specific calculation method of linear interpolation is as follows: for the target displacement value d, find the sampling point in the curve data sequence whose displacement value is closest to d and less than or equal to d, and record its displacement value and force value as (d1, F1). Then find the sampling point whose displacement value is closest to d and greater than or equal to d, and record its displacement value and force value as (d2, F2). The force value F corresponding to the target displacement value d is then the result of F1 + (F2 - F1) × (d - d1) ÷ (d2 - d1).

[0076] For each displacement point, the absolute value of the difference between the force value of curve A and the force value of curve B is calculated as the force deviation at that displacement point. The controller presets a force deviation threshold, which is determined based on the inherent noise level of the force sensing unit. The force sensing unit outputs a small random fluctuation under no-load conditions; the root mean square value of this fluctuation is the noise level. The force deviation threshold is twice the root mean square value of the noise. In this embodiment, the root mean square value of the noise is approximately 0.01 N, and the force deviation threshold is set to 0.02 N. If the force deviation at all displacement points does not exceed the force deviation threshold, it is determined that the two force-displacement curves of the symmetrical pressure head pair have consistent mechanical responses after contact, and there is no tension inconsistency in the symmetrical workstation due to differences in installation methods. If the force deviation at at least one displacement point exceeds the force deviation threshold, it is determined that the PI membrane corresponding to at least one pressure head 9 in the symmetrical pressure head pair has tension inconsistency due to differences in installation methods.

[0077] Differences in installation techniques refer to variations in the pretension applied at different workstations when the operator secures the PI film to the frame 2 using the PI film clamping spring 8. These variations can also be caused by deviations in the position of the clamping spring pressing against the edge of the PI film, resulting in differences in the actual tension of each PI film. While these differences may fall within the acceptable range when compared to a statistical benchmark at a single workstation, they will be detected when comparing shapes between symmetrical workstations due to the disruption of symmetry. The controller will then indicate in an alarm signal that the installation status of the PI film at the symmetrical workstations needs to be checked, prompting the operator to re-check whether the tension of the PI film at that group of workstations is consistent.

[0078] The technical advantage of this implementation lies in the fact that by comparing the force-displacement curves of symmetrical workstations, inconsistencies in installation methods that cannot be detected by single-workstation benchmark comparisons can be identified. The technical principle is that the structural symmetry of the symmetrical workstations on the same frame 2 ensures that the force-displacement responses of both workstations should be highly consistent during normal installation. Inconsistencies caused by differences in operator installation techniques will be amplified and detected during symmetrical comparison. Furthermore, overall offsets caused by batch differences in the PI film itself or environmental factors are offset during comparison because the symmetrical workstations are synchronously affected. Symmetry detection does not rely on external benchmarks; it utilizes the structural symmetry of the device itself as a reference, making it a self-consistent verification mechanism.

[0079] In a preferred embodiment, when the symmetry detection determines that an installation abnormality exists, the controller is configured to: The pressure head 9 that simultaneously meets the following conditions is determined to be a normal pressure head: the deviation between the actual force-displacement curve corresponding to the pressure head 9 and the installation qualification benchmark feature does not exceed the preset threshold, and the symmetrical pressure head pair to which the pressure head 9 belongs is not determined to have an installation abnormality in the symmetry detection. Obtain the slope of the actual force-displacement curve of each of the two pressure heads 9 in the symmetrical pressure head pair that is determined to have an installation abnormality within a preset displacement range after contact. The slopes of the two curves are compared with the slopes of the actual force-displacement curve corresponding to at least one of the normal pressure heads. If the slope of the curve of the pressure head is inconsistent with the slope of the curve of the normal pressure head, the pressure head 9 is determined to have an installation abnormality, and the workstation number corresponding to the pressure head 9 is indicated in the alarm signal.

[0080] Specifically, firstly, the controller identifies the normal pressure head. A normal pressure head must simultaneously meet two conditions: first, the deviation between the actual force-displacement curve corresponding to the pressure head 9 and the installation qualification benchmark characteristic does not exceed a preset threshold, meaning the pressure head 9 is judged as normal in the second-level judgment. Second, the symmetrical pressure head pair to which the pressure head 9 belongs is not judged to have installation abnormalities in the symmetry detection. The controller traverses all pressure heads 9 and identifies those that simultaneously meet both conditions as normal pressure heads. A normal pressure head represents a workstation where the PI membrane installation status is completely normal under the current batch and current installation conditions, and its force-displacement curve can be used as a reference benchmark for judging abnormal workstations. If there is no normal pressure head that meets the conditions, the positioning logic of this embodiment cannot be executed, and the controller indicates in an alarm signal that all symmetrical workstations in that group need to be checked.

[0081] Then, the controller acquires the actual force-displacement curves corresponding to the two pressure heads 9 in the symmetrical pressure head pair determined to have installation abnormalities. These actual force-displacement curves were generated in the second-level judgment and are directly called here. The controller extracts the curve slope within a preset displacement interval after contact from each actual force-displacement curve. The calculation method for the curve slope is consistent with the methods used in the first and second-level judgments: a univariate linear regression is performed on the displacement force data within the preset displacement interval after contact using the least squares method, and the slope of the fitted straight line is the curve slope.

[0082] Next, the controller obtains the slope of the actual force-displacement curve corresponding to at least one normal pressure head, as a reference value for the normal slope. If there are multiple normal pressure heads, the controller takes the arithmetic mean of the slopes of each normal pressure head curve as a reference value for the normal slope to eliminate random fluctuations of a single normal pressure head.

[0083] Finally, the controller compares the curve slopes of the two symmetrical pressure heads 9 with the normal slope reference value. The comparison method is as follows: define the two symmetrical pressure heads 9 as pressure head 1 and pressure head 92, calculate the absolute value of the difference between the curve slope of pressure head 92 and the normal slope reference value, and calculate the absolute value of the difference between the curve slope of pressure head 92 and the normal slope reference value. Compare the two absolute values, and determine the pressure head 9 that is inconsistent with the normal slope reference value as having an installation abnormality, that is, the pressure head 9 whose curve slope deviates significantly from the normal slope reference value. The alarm signal indicates the station number corresponding to this pressure head 9, and the operator can directly locate that station to reinstall or replace the PI membrane.

[0084] The technical advantage of this implementation lies in using the slope of the force-displacement curve of a normal workstation as a dynamic reference benchmark to accurately locate abnormal workstations from a symmetrical workstation pair. The technical principle is that a normal workstation represents the standard state under the current batch and installation conditions, and its curve slope is the most reliable reference value. The curve slope of an abnormal workstation will deviate significantly from the normal reference value. By comparing the degree of deviation between the curve slopes of the two workstations in a symmetrical workstation pair and the normal reference value, it is possible to determine which workstation has experienced an anomaly. This positioning method does not rely on a preset fixed benchmark but uses the normal workstation confirmed in the same self-inspection as a real-time reference, naturally adapting to batch differences and environmental changes.

[0085] In a preferred embodiment, the preset low-pressure load is determined in the following manner: Obtain the clamping force applied by the PI film clamping spring 8 to the edge of the PI film; Based on the spring clamping force, a preset ratio of the spring clamping force is taken as the upper limit of the preset low pressure load, and the preset ratio is less than 1, so that the low pressure load does not exceed the spring clamping force.

[0086] Specifically, the low-pressure load is determined based on the clamping force applied by the PI film clamping spring 8 to the edge of the PI film. The clamping force refers to the normal pressure applied to the edge of the PI film when the PI film clamping spring 8 presses the edge of the PI film against the surface of the frame 2 using its own elastic restoring force. This force value is determined as a rated parameter at the factory of the PI film clamping spring 8 and can be obtained by: reading the rated clamping force value from the manufacturer's specifications of the PI film clamping spring 8, or by measuring the pressure value when the spring clamps the edge of the PI film during the assembly stage using a force sensor. This force value is pre-stored in the controller's memory as a reference parameter for calculating the low-pressure load. Based on the clamping force, a preset proportion of the clamping force is taken as the preset upper limit of the low-pressure load, and the preset proportion is less than 1, so that the low-pressure load does not exceed the clamping force. The physical basis for this is that when the pressure head 9 contacts the PI film with a low-pressure load, the force is transmitted through the PI film to the area where the edge of the PI film is clamped by the spring. If the low-pressure load exceeds the clamping force of the spring clip, the maximum static friction force of the PI film under the spring clip will be exceeded, and the edge of the PI film will slip slightly. Once this slippage occurs, the installation state of the PI film is changed by the self-checking action itself, and the self-checking itself will disrupt the installation state. Therefore, the upper limit of the low-pressure load must not exceed the clamping force of the spring clip.

[0087] In actual operation, the controller reads the pre-stored spring clamping force value, multiplies it by a preset ratio, and obtains the upper limit value of the low-pressure load. During self-test, the controller controls the pressure head 9 to move towards and contact the PI membrane with a force not exceeding this upper limit value. The preset ratio can be between 0.5 and 0.9, which ensures sufficient contact force to obtain reliable test data while leaving a safety margin to prevent PI membrane slippage.

[0088] The technical advantage of this embodiment lies in the fact that by determining the upper limit of the low-pressure load based on the spring clamping force, the self-testing action itself is guaranteed from a physical principle perspective not to damage the installation state of the PI film. The technical principle is that the fixation of the PI film under the spring relies on the static friction force generated by the spring clamping force. As long as the low-pressure load does not exceed the spring clamping force, the static friction force will not be exceeded, the PI film will not slip, and the self-testing process is truly non-destructive.

[0089] In a preferred embodiment, the preset ratio is not greater than the static friction coefficient between the PI film pressing spring 8 and the PI film.

[0090] Specifically, the static friction coefficient between the PI film clamping spring 8 and the PI film is a characteristic of their material interface and can be obtained through a standard friction coefficient test method. During the test, a material sample of the PI film clamping spring 8 is placed on the surface of the PI film material, a normal pressure is applied, and the tangential force required to make the sample begin to slide is measured. The ratio of the tangential force to the normal pressure is the static friction coefficient. This static friction coefficient is pre-stored in the controller's memory.

[0091] The physical basis is that the clamping force applied by the PI film clamping spring 8 to the edge of the PI film is denoted as N, and the static friction coefficient between them is denoted as μ. Therefore, the maximum static friction force that the PI film can withstand under the spring is μ multiplied by N. When the low-pressure load applied to the PI film by the pressure head 9 does not exceed the maximum static friction force, the PI film will not slide under the spring. The upper limit of the low-pressure load is a preset ratio multiplied by N; therefore, a preset ratio less than or equal to μ is sufficient to ensure that the low-pressure load does not exceed the maximum static friction force.

[0092] In actual operation, the controller reads the pre-stored spring clamping force value and static friction coefficient value, and calculates the upper limit of the low-pressure load as the spring clamping force multiplied by the static friction coefficient. During self-test, the controller controls the pressure head 9 to move towards and contact the PI film with a force not exceeding this upper limit. Since the static friction coefficient is usually between 0.3 and 0.8, it naturally meets the condition that the preset ratio is less than 1.

[0093] The technical advantage of this embodiment lies in directly linking the preset proportion of low-pressure load with the static friction coefficient of the material interface, thus providing a clear physical basis for determining the upper limit of the low-pressure load rather than an empirical value. The technical principle is that the slippage threshold of the PI film under the spring sheet is determined by the maximum static friction force, which equals the spring sheet clamping force multiplied by the static friction coefficient. Using the static friction coefficient as the preset proportion, the maximum static friction force can be used as the upper limit of the low-pressure load. This ensures effective physical contact during self-testing while mechanically preventing PI film slippage.

[0094] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A quick-release device for PI film with self-inspection function, used for detachably installing a PI film between the pressure head (9) of a sintering equipment and the workpiece, characterized in that, include: The frame (2) has the PI film fixed on it, and the frame (2) has wedge-shaped notches (7) at both ends of the length direction perpendicular to the disassembly and assembly direction. The quick-release mechanism includes: a mounting base (5) with a groove (53) along the disassembly / removal direction, wherein the frame (2) is slidably disposed within the groove (53); an ejector spring (51) disposed between the mounting base (5) and the frame (2), which is in a compressed state when the frame (2) is locked, and applies an outward thrust to the frame (2) along the disassembly / removal direction; and a limiting buckle (62) disposed on the mounting base (5), wherein its engaging end is adapted to the shape of the wedge-shaped notch (7); When the frame (2) is pushed into the predetermined locking position along the slide (53), the limiting buckle (62) engages with the corresponding wedge notch (7) from both ends of the frame (2) in the length direction, restricting the displacement of the frame (2) in the disassembly and assembly direction to resist the thrust of the ejection spring (51). At the same time, the wedge-shaped engagement between the engaging end and the wedge notch (7) eliminates the engagement gap of the frame (2) in the length direction, so that the frame (2) is centered in the length direction. A force sensing unit is used to sense the force applied to the PI membrane by the pressure head (9); A displacement sensing unit is used to sense the displacement of the pressure head (9); The controller, electrically connected to the force sensing unit and the displacement sensing unit, is configured to: after the PI membrane is replaced and installed and the frame (2) is locked by the quick-release mechanism, and before the sintering equipment performs formal sintering, control the pressure head (9) to move towards and contact the PI membrane with a preset low-pressure load, and determine whether there is an installation abnormality in the PI membrane and / or the quick-release mechanism based on the data collected by the force sensing unit and the displacement sensing unit during the contact process; if there is an installation abnormality, prohibit the sintering equipment from starting the formal sintering program and output an alarm signal; The controller is specifically configured to: First-level judgment: During the process of controlling each pressure head (9) to move towards the corresponding PI film with the low pressure load, the contact critical displacement value corresponding to each pressure head (9) when it first contacts the corresponding PI film is obtained, and the dispersion between each contact critical displacement value is calculated. When the dispersion exceeds a preset dispersion threshold, it is determined that the quick-release mechanism has an installation abnormality, and the second-level judgment is skipped; When the dispersion does not exceed the preset dispersion threshold, the slope of the force-displacement curve corresponding to each pressure head (9) within the preset displacement range after contact is further obtained, and the slope dispersion between each curve slope is calculated; if the slope dispersion exceeds the preset slope dispersion threshold, it is determined that the quick-release mechanism has an installation abnormality, and the second-level judgment is skipped. Second-level judgment: Based on the data collected by each force sensing unit and each displacement sensing unit during the contact process, the actual force-displacement curve corresponding to each pressure head (9) is generated, and each actual force-displacement curve is compared with the preset installation qualification benchmark feature one by one; when the deviation between the actual force-displacement curve corresponding to any pressure head (9) and the installation qualification benchmark feature exceeds the preset threshold, it is determined that the PI membrane corresponding to the pressure head (9) has an installation abnormality, and the work station number corresponding to the PI membrane is indicated in the alarm signal.

2. The PI film quick-release device with installation self-test function according to claim 1, characterized in that, The number of pressure heads (9) is multiple, and the number of PI films is the same as the number of pressure heads (9). Each PI film is respectively set in correspondence with each pressure head (9), and each PI film is independently arranged on the frame (2) corresponding to a substrate to be sintered. The frame (2) is also provided with multiple PI film clamping springs (8) corresponding to each PI film. Each PI film clamping spring (8) clamps and fixes the edge of the corresponding PI film to the frame (2), so that each PI film is kept in a taut state.

3. The PI film quick-release device with installation self-test function according to claim 2, characterized in that, The number of force sensing units is multiple, and each force sensing unit is set to correspond to one pressure head (9) for independently sensing the force applied to the corresponding PI membrane by the corresponding pressure head (9); the number of displacement sensing units is multiple, and each displacement sensing unit is set to correspond to one pressure head (9) for independently sensing the displacement of the corresponding pressure head (9).

4. The quick-release device for PI film with installation self-test function according to claim 1, characterized in that, The controller is configured to: only when the first-level determination indicates that the quick-release mechanism has an installation abnormality, When it is determined that there is an installation abnormality in the quick-release mechanism, the abnormal mode of the quick-release mechanism is determined according to the spatial distribution of the contact critical displacement value corresponding to each pressure head (9); If each of the contact critical displacement values ​​shows a monotonically increasing or monotonically decreasing trend along the length direction, it is determined that the frame (2) is tilted in the length direction and the corresponding end of the limiting buckle (62) is not engaged in place. If the distribution of each contact critical displacement value does not have a monotonic trend along the length direction, and there are differences between the values, then it is determined that the ejector spring (51) is not compressed evenly or that there are foreign objects in the groove (53).

5. The quick-release device for PI film with installation self-test function according to claim 1, characterized in that, The controller is configured to: only when the second-level judgment determines that a certain PI film has an installation abnormality. Perform a rebound detection action on the pressure head (9) corresponding to the PI film: control the pressure head (9) to rise upward at a preset unloading speed and a preset rebound detection distance, and then move downward at a preset loading speed until it re-contacts the PI film; Obtain the reset contact displacement value when the pressure head (9) re-contacts the PI film, and calculate the difference between the reset contact displacement value and the contact critical displacement value as the rebound hysteresis displacement; Obtain the preset working temperature of the formal sintering process, and based on the preset working temperature and the known stiffness-temperature relationship of the PI film material, convert the rebound hysteresis displacement into the predicted high-temperature rebound hysteresis displacement of the PI film at the preset working temperature. When the predicted high-temperature rebound hysteresis displacement is greater than the preset high-temperature rebound hysteresis threshold, it is determined that the installation abnormality of the PI membrane is caused by insufficient tension reserve of the PI membrane under high-temperature conditions, and the alarm signal indicates that the abnormality can be eliminated by replacing the PI membrane. When the predicted high-temperature rebound hysteresis displacement is not greater than the preset high-temperature rebound hysteresis threshold, it is determined that the installation abnormality of the PI film is caused by insufficient clamping force of the PI film clamping spring (8), and the alarm signal indicates that the corresponding PI film clamping spring (8) needs to be checked or adjusted.

6. The quick-release device for PI film with installation self-test function according to claim 1, characterized in that, The controller is also configured to: perform symmetry detection on the pressure head (9) that was not determined to have an installation abnormality in the second-level judgment after the second-level judgment is completed. After generating the actual force-displacement curves corresponding to each of the pressure heads (9), two pressure heads (9) whose positions on the frame (2) are symmetrical about the length direction are determined to be a pair of symmetrical pressure heads. For at least one pair of symmetrical pressure heads, the two actual force-displacement curves are aligned in the same coordinate system with their respective contact initiation points as the origin. Determine whether the force values ​​at the same displacement increment after the two aligned curves come into contact are consistent. If the force deviation at a certain displacement increment exceeds the inherent noise level of the sensor, it is determined that the PI membrane corresponding to at least one of the pressure heads (9) in the group of symmetrical pressure head pairs has inconsistent tension due to differences in installation methods, and the alarm signal indicates that the installation status of the PI membrane in the group of symmetrical workstations needs to be checked.

7. The quick-release device for PI film with installation self-test function according to claim 6, characterized in that, When the symmetry detection determines that an installation abnormality exists, the controller is configured to: The pressure head (9) that simultaneously meets the following conditions is determined to be a normal pressure head: the deviation between the actual force-displacement curve corresponding to the pressure head (9) and the installation qualification benchmark feature does not exceed the preset threshold, and the symmetrical pressure head pair to which the pressure head (9) belongs is not determined to have an installation abnormality in the symmetry detection; Obtain the slope of the actual force-displacement curve of each of the two pressure heads (9) in the symmetrical pressure head pair that is determined to have an installation abnormality within the preset displacement range after contact; The slopes of the two curves are compared with the slopes of the actual force-displacement curve corresponding to at least one of the normal pressure heads. The pressure head (9) whose curve slope is inconsistent with the curve slope of the normal pressure head is determined to be an installation abnormal pressure head (9), and the work station number corresponding to the pressure head (9) is indicated in the alarm signal.

8. The PI film quick-release device with installation self-test function according to claim 2, characterized in that, The preset low-pressure load is determined in the following way: Obtain the clamping force applied by the PI film clamping spring (8) to the edge of the PI film; Based on the spring clamping force, a preset ratio of the spring clamping force is taken as the upper limit of the preset low pressure load, and the preset ratio is less than 1, so that the low pressure load does not exceed the spring clamping force.

9. The quick-release device for PI film with installation self-test function according to claim 8, characterized in that, The preset ratio is not greater than the static friction coefficient between the PI film pressing spring (8) and the PI film.

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