A flexible temperature measuring sensor for a generator stator core and a preparation method thereof

Abstract

This invention discloses a flexible temperature sensor for generator stator cores that resists magnetic field interference and its fabrication method. The sensor includes a flexible substrate, a temperature-sensitive conductive pattern, and a magnetic field shielding film. The flexible substrate is a PI substrate, possessing flexibility and waterproof properties. The temperature-sensitive conductive pattern is a platinum conductive pattern formed on the surface of the flexible substrate. The temperature-sensitive conductive pattern detects temperature based on the resistance effect, with its resistance increasing with temperature. The magnetic field shielding film is a permalloy film covering the corresponding area of ​​the temperature-sensitive conductive pattern. It diverts external magnetic fields based on the magnetic flux diversion effect, reducing interference from external magnetic fields on the temperature-sensitive conductive pattern. This invention solves the core technical problems of existing temperature sensors for generator stator cores, such as insufficient temperature sensitivity, weak anti-interference capability in strong magnetic field environments, difficulty in adapting to curved surface arrays, and poor adaptability to high humidity environments.

Description

Technical Field

[0001] This invention relates to the field of temperature sensor technology, and in particular to a flexible temperature sensor resistant to magnetic field interference suitable for generator stator cores and its preparation method. Background Technology

[0002] As a crucial data foundation for hydropower stations moving towards unmanned operation and shutdown, high-coverage and high-precision condition monitoring technology is key to achieving panoramic condition awareness of hydropower stations. It is essential for identifying potential hazards in hydropower units, reducing operation and maintenance costs, and ensuring the safe and stable operation of the units. However, current condition monitoring methods still rely primarily on traditional rigid sensors, which have numerous installation limitations and poor adaptability. Power supply and communication methods remain mainly based on active power supply and wired communication, resulting in large footprints, potential for confusion, and difficulty in adjustment, posing significant safety hazards. Furthermore, the high humidity and high magnetic field environment of hydropower stations can interfere with sensor performance. In some scenarios, sensor power supply, communication, and installation are difficult, and wired methods limit the application of condition monitoring, resulting in insufficient monitoring coverage and making it difficult to achieve comprehensive data collection from hydropower unit equipment.

[0003] Flexible electronics, characterized by high integration and distributed convergence, is an emerging electronic technology involving the fabrication of electronic devices made of organic or inorganic materials on flexible or ductile substrates. This technology, with its unique flexibility / ductility and efficient, low-cost manufacturing processes, has broad application prospects in fields such as information, energy, medicine, and defense. Flexible sensors, on the other hand, refer to sensors made of flexible thin-film materials. They possess excellent flexibility and ductility, even being able to be bent or folded freely. Furthermore, their structures are flexible and diverse, allowing for arbitrary arrangement according to measurement requirements and convenient integration with complex curved surfaces.

[0004] The manufacturing process for flexible devices is compatible with traditional microelectronics manufacturing processes. Functional layers and electrode layers of flexible devices can be fabricated using semiconductor device manufacturing processes (such as thin-film deposition and photolithography), thereby improving the stability and reliability of the devices. Furthermore, inkjet printing technology enables the fabrication of large-area flexible electronic devices, which have already been applied in fields such as solar cells and OLED displays.

[0005] In summary, the fabrication of temperature sensors on flexible substrates that are flexible, surface-mountable, and suitable for humid and magnetic field interference environments is of great significance. It is necessary to design a flexible temperature sensor with magnetic field interference resistance suitable for generator stator cores and its fabrication method. Summary of the Invention

[0006] The purpose of this invention is to overcome the above-mentioned shortcomings and provide a flexible temperature sensor for generator stator core that is resistant to magnetic field interference and its preparation method, so as to solve the core technical problems of existing temperature sensors for generator stator cores, such as insufficient temperature measurement sensitivity, weak anti-interference ability in strong magnetic field environment, difficulty in adapting to array layout of curved surfaces, and poor adaptability to high humidity environment.

[0007] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: A flexible temperature sensor for generator stator cores, resistant to magnetic field interference, includes a flexible substrate, a temperature-sensitive conductive pattern, and a magnetic field shielding film. The flexible substrate is a PI substrate, which has both flexibility and waterproof properties; The temperature-sensitive conductive pattern is a conductive pattern made of platinum metal, formed on the surface of a flexible substrate. The temperature-sensitive conductive pattern achieves temperature detection based on the resistance effect, and its resistance value increases with the increase of temperature. The anti-magnetic shielding film is a permalloy film that covers the corresponding area of ​​the temperature-sensitive conductive pattern. Based on the magnetic flux diversion effect, it guides away the external magnetic field and reduces the interference of the external magnetic field on the temperature-sensitive conductive pattern.

[0008] Preferably, the linewidth of the temperature-sensitive conductive pattern is 90 μm.

[0009] Preferably, a Ti transition layer is provided between the temperature-sensitive conductive pattern and the PI substrate, the Ti transition layer being used to improve the adhesion between the platinum metal and the PI substrate.

[0010] Preferably, the resistance value R0 of the platinum resistance thermometer corresponding to the temperature-sensitive conductive pattern at 0°C conforms to the formula R. t =R0(1+αt+βt²), where R t Let α be the resistance value of the platinum resistance thermometer at t℃, α be the first-order temperature coefficient, and β be the second-order temperature coefficient.

[0011] Preferably, the sensor has a bendable, surface-mount structure that can be attached to the curved surface of the generator stator core.

[0012] Preferably, multiple sensors are arranged as sensor units to form a sensor array skin, and the sensor array skin is a 4×3 array structure containing 12 sensor units.

[0013] Preferably, in the 4×3 array structure, one end of each sensor unit is connected to a common electrode, and the other end of each sensor unit leads out an independent electrode. By selecting the common electrode and any independent electrode, signal acquisition of any one of the 12 sensor units can be achieved.

[0014] Preferably, the anti-magnetic shielding film is attached to the surface of each sensor unit of the sensor array skin.

[0015] In addition, this invention also discloses a method for preparing a flexible temperature sensor resistant to magnetic field interference suitable for generator stator cores, which includes the following steps: S1. Clean the silicon wafer substrate; S2. Spin-coat a PMMA sacrificial layer onto the cleaned silicon wafer substrate, and then perform a heat curing process. S3. Spin-coat the PI precursor onto the cured PMMA sacrificial layer, and then perform a heating imidization treatment to form the PI substrate. S4. Photoresist spin coating, exposure and development are performed sequentially on the PI substrate surface to form patterned photoresist windows. S5. A temperature-sensitive conductive pattern is formed by sputtering within the photoresist window using a magnetron sputtering process. After completion, excess photoresist is removed to obtain a temperature-sensitive conductive pattern on the PI substrate. S6. Anneal the PI substrate with the temperature-sensitive conductive pattern. S7. Peel the PI substrate along with the temperature-sensitive conductive pattern from the silicon substrate to obtain the flexible temperature sensor body. S8. A permalloy antimagnetic shielding film is attached to the corresponding area of ​​the temperature-sensitive conductive pattern to obtain the antimagnetic interference flexible temperature sensor.

[0016] Further, step S1 specifically involves: ultrasonically cleaning the silicon wafer in acetone for 30 minutes, then rinsing it with alcohol and deionized water in sequence, and finally drying it with an air gun.

[0017] Further, step S2 specifically involves: spin-coating a PMMA sacrificial layer onto a silicon wafer, and then heating it on a heating platform at 180°C for 5 minutes after spin-coating.

[0018] Further, step S3 specifically involves: spin-coating the PI precursor onto the PMMA sacrificial layer at a rotation speed of 3000 rpm / min and a spin-coating time of 60 s, for a total of two spin-coatings; after spin-coating, placing it on a heating platform at 120°C for 60 s, and then placing it in a coating machine at 230°C for 3 h to complete the imidization of the PI precursor.

[0019] Further, step S4 specifically involves: spin-coating photoresist onto the PI substrate surface, and then curing it on a heating platform at 95°C for 1 minute after spin-coating; placing the mask on a lithography machine for 8 seconds of ultraviolet exposure; after exposure, soaking in developer for 30-70 seconds for development, then rinsing with deionized water for 30 seconds, and drying with an air gun to remove the ultraviolet-exposed photoresist portion, thus forming a patterned photoresist window.

[0020] Furthermore, in step S5, the target material for magnetron sputtering is Pt and Ti, wherein Ti is sputtered as a transition layer between the PI substrate and the Pt layer; the sputtering power is set to 65W and the sputtering time is set to 20min; after magnetron sputtering is completed, excess photoresist is washed away with acetone.

[0021] Further, step S6 specifically involves: placing the PI substrate with the temperature-sensitive conductive pattern into an annealing furnace for 3 hours, with the annealing process starting at 50°C and increasing by 30°C every 30 minutes.

[0022] Further, step S7 specifically involves: using thermal release tape to peel the PI substrate along with the temperature-sensitive conductive pattern off the silicon wafer, placing it on a heating platform for high-temperature heating, so that the thermal release tape separates from the sensor, thus completing the peeling process.

[0023] Furthermore, it also includes the mounting and installation steps for the flexible temperature array skin, specifically: A1. Mount the temperature sensor onto the corresponding position on the flexible circuit board using conductive silver paste to ensure normal sensor signal transmission. A2. Wipe the skin mounting area on the surface of the generator stator core clean with ethanol and water to remove any residual liquid; A3. Mix the epoxy resin adhesive according to the ratio, apply the adhesive evenly to the skin mounting surface, and then attach it to the corresponding position of the stator core. Let it stand for 24 hours to allow the adhesive to fully cure. A4. After the adhesive has fully cured, connect the flexible sensor array skin to the signal acquisition and communication module using a flexible flat cable. A5. Apply a permalloy antimagnetic shielding film to each sensing unit position on the sensor array skin to complete the magnetic field shielding.

[0024] Beneficial effects of this invention: 1. This invention uses platinum metal, which has excellent temperature coefficient of resistance and oxidation resistance, as a temperature-sensitive material. Combined with a fine mask pattern design with a linewidth of 90μm, it significantly increases the amount of resistance change corresponding to a unit temperature change, and significantly improves the temperature measurement sensitivity of the sensor. It can accurately capture the tiny temperature fluctuations of the generator stator core and achieve high-precision real-time temperature monitoring.

[0025] 2. This invention uses a permalloy thin film with high magnetic permeability as an anti-magnetic field shielding layer. Based on the magnetic flux diversion effect, it can preferentially guide the external magnetic field away, which greatly reduces the signal interference of the strong magnetic field environment of the hydropower station on the platinum-sensitive conductive pattern. It completely solves the problem of sensor temperature measurement accuracy deviation and data distortion under strong magnetic field conditions, and ensures the long-term stability and accuracy of temperature measurement data.

[0026] 3. This invention uses PI material as a flexible substrate, which has excellent flexibility, bendability and waterproof performance, so that the sensor can form a bendable, surface-mount structure. It can flexibly and tightly fit the complex curved surface of the generator stator core, completely solving the problems of traditional rigid sensors such as many installation restrictions, poor adaptability to curved surfaces and loose fit. On-site installation and operation are convenient.

[0027] 4. The sensor units of this invention can be spliced ​​to form a 4×3 array-type sensor skin. It adopts an optimized wiring design of a single common electrode + multiple independent electrodes. By selecting the common electrode and any independent electrode, the detection signal of any one of the 12 sensor units can be quickly retrieved. This realizes multi-point, distributed, full-coverage temperature monitoring of the generator stator core, which greatly improves the coverage of hydropower unit status monitoring. At the same time, it avoids the defects of traditional wired wiring methods, such as large footprint, messy wiring, difficulty in adjustment, and safety hazards.

[0028] 5. The PI substrate used in this invention has excellent waterproof and moisture-proof performance, which can be adapted to the harsh operating environment of high humidity in hydropower stations; the platinum sensitive material has inherent advantages such as high temperature resistance, oxidation resistance and long service life. Combined with the preparation scheme compatible with traditional microelectronic manufacturing processes, it ensures the working stability and service life of the sensor under the long-term operation of hydropower units, and solves the problem of insufficient sensor reliability and easy failure in high humidity environment. Attached Figure Description

[0029] Figure 1 This is a top view of the wiring configuration of the sensor skin array in this invention; Figure 2 The manufacturing process of the sensor in this invention is as follows; Figure 3 This is a schematic diagram of the mounting of the antimagnetic field layer in this invention; Figure 4 This is a complete structural diagram of the present invention. Detailed Implementation

[0030] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0031] Example 1: A flexible temperature sensor for generator stator core that resists magnetic field interference, comprising a flexible substrate, a temperature-sensitive conductive pattern, and a magnetic field shielding film; The flexible substrate is a PI substrate, which has both flexibility and waterproof properties; The temperature-sensitive conductive pattern is a conductive pattern made of platinum metal, formed on the surface of a flexible substrate. The temperature-sensitive conductive pattern achieves temperature detection based on the resistance effect, and its resistance value increases with the increase of temperature. The anti-magnetic shielding film is a permalloy film that covers the corresponding area of ​​the temperature-sensitive conductive pattern. Based on the magnetic flux diversion effect, it guides away the external magnetic field and reduces the interference of the external magnetic field on the temperature-sensitive conductive pattern.

[0032] The linewidth of the temperature-sensitive conductive pattern is 90 μm.

[0033] A Ti transition layer is provided between the temperature-sensitive conductive pattern and the PI substrate, and the Ti transition layer is used to improve the adhesion between the platinum metal and the PI substrate.

[0034] The platinum resistance thermometer corresponding to the temperature-sensitive conductive pattern has a resistance value R0 of 100Ω at 0℃, and its resistance value is related to temperature according to the formula R. t =R0(1+αt+βt²), where R t Let α be the resistance value of the platinum resistance thermometer at t℃, α be the first-order temperature coefficient, and β be the second-order temperature coefficient.

[0035] The sensor has a bendable, surface-mount structure that can be attached to the curved surface of the generator stator core.

[0036] Multiple sensors are arranged as sensor units to form a sensor array skin. The sensor array skin is a 4×3 array structure containing 12 sensor units.

[0037] In the 4×3 array structure, one end of each sensor unit is connected to a common electrode, and the other end of each sensor unit leads out an independent electrode. By selecting between the common electrode and any independent electrode, signal acquisition can be achieved from any one of the 12 sensor units.

[0038] The anti-magnetic shielding film is attached to the surface of each sensor unit of the sensor array skin.

[0039] In this embodiment, the flexible temperature sensor comprises a substrate, a temperature-sensitive pattern, and an anti-magnetic field film. The substrate is made of polyimide (PI), possessing excellent flexibility and water resistance. The conductive pattern is made of platinum, exhibiting a good temperature coefficient of resistance and oxidation resistance. The mask's linewidth of only 90 μm significantly enhances the temperature sensor's sensitivity; the resistance change is substantial for every 1°C temperature change. The anti-magnetic field film is made of permalloy, possessing high permeability. The sensor's operating principle primarily relies on the resistance-to-thermal effect; the resistance of the platinum-sensitive conductive pattern increases with temperature. Furthermore, the magnetic field is diverted by the permalloy film due to flux diversion, thereby reducing the influence of the magnetic field on the platinum conductive pattern.

[0040] Figure 1 This is a schematic diagram of the flexible temperature sensor array in this invention. The array is a 4×3 array, with one end of each sensor unit connected as an electrode and the other end of each sensor unit led out as an electrode. Any one of the 12 sensors can be selected through a common electrode and any sensor electrode.

[0041] Example 2: Resistance temperature detectors (RTDs) measure temperature by utilizing the characteristic that the resistance of a material changes with temperature. When the resistance changes, the instrument displays the corresponding temperature value. RTD sensors are made based on the principle that the resistivity of a conductor or semiconductor changes with temperature. Platinum, a precious metal, is widely used due to its high temperature resistance, good temperature characteristics, and long service life.

[0042] The relationship between the resistance of a platinum resistance thermometer and temperature is non-linear. R t =R0(1+αt+βt²); In the formula, R t Rt represents the resistance of the platinum resistance thermometer at t℃, where α is the first-order temperature coefficient and β is the second-order temperature coefficient. R0 represents the resistance of the platinum resistance thermometer at 0℃. The zero-degree resistance value here is affected by the annealing temperature and annealing time, and can be adjusted in the range of 150-250Ω. However, these processes only affect the overall shift of the sensor's resistance-temperature curve and do not affect sensitivity performance parameters, etc.

[0043] The principle of magnetic flux shunting is an important concept in magnetic circuit design. It is mainly used to shun magnetic flux through a specific path, thereby optimizing the distribution of the magnetic field or achieving a specific function. When there are multiple parallel magnetic permeation paths in a magnetic circuit, the magnetic flux will preferentially pass through the path with lower magnetic reluctance, similar to the shunting behavior of current in a parallel circuit.

[0044] In this embodiment, the fabrication process of the flexible sensor is as follows: 1. Clean the silicon wafer. Place the silicon wafer in acetone and ultrasonically clean it for 30 minutes. After taking it out, rinse it with alcohol, then rinse it with deionized water and blow it dry with an air gun.

[0045] 2. Spin-coat a PMMA sacrificial layer onto the silicon wafer. After spin-coating, heat the wafer at 180°C for 5 minutes. The sacrificial layer has a weak adhesion to the PI, making it easier to remove the sensor from the silicon wafer later.

[0046] 3. Spin coat PI onto the sacrificial layer. Set the image parameters to 3000 rpm / min and the spin coating time to 60s. Spin coat twice. After the spin coating is completed, place the plate on a 120℃ heating platform and heat for 60s.

[0047] 4. After spin coating of PI, place it in a coating machine and heat at 230℃ for 3 hours to imidize the PI precursor.

[0048] 5. Spin-coat photoresist onto the silicon wafer, and after spin-coating, place it on a 95℃ heating platform to cure for 1 minute.

[0049] 6. Place the photomask on the lithography machine and expose it to ultraviolet light for 8 seconds.

[0050] 7. Develop with developer, soak for 30-70 seconds, rinse with deionized water for 30 seconds, and dry with an air gun to remove the photoresist exposed by UV.

[0051] 8. After development, the sensor pattern was created using magnetron sputtering. The target material was Pt and Ti, with Ti serving as a transition layer to improve the adhesion between Pt and PI. The sputtering power was set to 65W, and the sputtering time was set to 20min.

[0052] 9. After magnetron sputtering, excess photoresist is washed away with acetone to obtain the sensor pattern on the PI substrate. 10. Anneal in an annealing furnace for 3 hours, increasing the temperature from 50°C to 30°C every 30 minutes.

[0053] 11. Use thermal release tape to peel the sensor pattern and PI substrate off the silicon wafer, and place it on a heating platform to heat at high temperature. The thermal release tape will then separate from the sensor.

[0054] The specific installation method for the flexible temperature array skin is as follows: 1. Mount the temperature sensor onto the corresponding position on the processed flexible circuit board using conductive silver paste, and ensure that the sensor signal transmission is normal.

[0055] 2. Wipe the stator core surface skin mounting area clean with ethanol and water, and wipe away any residual liquid to ensure a tighter contact at the bonding interface.

[0056] 3. Mix the epoxy resin adhesive according to the ratio, apply the adhesive evenly to the skin mounting surface, and then attach it to the corresponding position of the stator core. Let it stand for 24 hours to allow the adhesive to fully cure.

[0057] 4. After the adhesive has fully cured, use a flexible flat cable to connect the flexible sensor array skin to the signal acquisition and communication modules.

[0058] 5. After attaching the sensor array skin, attach the permalloy film to the position of the sensing unit for magnetic field shielding.

[0059] The above embodiments are merely preferred technical solutions of the present invention and should not be considered as limitations on the present invention. The scope of protection of the present invention should be limited to the technical solutions described in the claims, including equivalent substitutions of the technical features described in the claims. That is, equivalent substitutions and improvements within this scope are also within the scope of protection of the present invention.

Claims

1. A flexible temperature sensor resistant to magnetic field interference suitable for generator stator cores, characterized in that, This includes flexible substrates, temperature-sensitive conductive patterns, and anti-magnetic shielding films; The flexible substrate is a PI substrate, which has both flexibility and waterproof properties; The temperature-sensitive conductive pattern is a conductive pattern made of platinum metal, formed on the surface of a flexible substrate. The temperature-sensitive conductive pattern achieves temperature detection based on the resistance effect, and its resistance value increases with the increase of temperature. The anti-magnetic shielding film is a permalloy film that covers the corresponding area of ​​the temperature-sensitive conductive pattern. Based on the magnetic flux diversion effect, it guides away the external magnetic field and reduces the interference of the external magnetic field on the temperature-sensitive conductive pattern.

2. The flexible temperature sensor for generator stator cores, resistant to magnetic field interference, as described in claim 1, is characterized in that... The linewidth of the temperature-sensitive conductive pattern is 90 μm.

3. The flexible temperature sensor for generator stator cores, resistant to magnetic field interference, as described in claim 1, is characterized in that... A Ti transition layer is provided between the temperature-sensitive conductive pattern and the PI substrate, and the Ti transition layer is used to improve the adhesion between the platinum metal and the PI substrate.

4. The flexible temperature sensor for generator stator cores, resistant to magnetic field interference, as described in claim 1, is characterized in that... The resistance value R0 of the platinum resistance thermometer corresponding to the temperature-sensitive conductive pattern at 0°C, and the relationship between its resistance and temperature, conforms to the formula R. t =R0(1+αt+βt²), where R t Let α be the resistance value of the platinum resistance thermometer at t℃, α be the first-order temperature coefficient, and β be the second-order temperature coefficient.

5. The flexible temperature sensor for generator stator cores, resistant to magnetic field interference, as described in claim 1, is characterized in that... The sensor has a bendable, surface-mount structure that can be attached to the curved surface of the generator stator core.

6. The flexible temperature sensor for generator stator cores, resistant to magnetic field interference, as described in claim 1, is characterized in that... Multiple sensors are arranged as sensor units to form a sensor array skin. The sensor array skin is a 4×3 array structure containing 12 sensor units.

7. The flexible temperature sensor for generator stator cores, resistant to magnetic field interference, as described in claim 6, is characterized in that... In the 4×3 array structure, one end of each sensor unit is connected to a common electrode, and the other end of each sensor unit leads out an independent electrode. By selecting between the common electrode and any independent electrode, signal acquisition can be achieved from any one of the 12 sensor units.

8. The flexible temperature sensor for generator stator cores, resistant to magnetic field interference, as described in claim 6, is characterized in that... The anti-magnetic shielding film is attached to the surface of each sensor unit of the sensor array skin.

9. A method for preparing a flexible temperature sensor resistant to magnetic field interference suitable for generator stator cores, characterized in that, The method for preparing a flexible temperature sensor resistant to magnetic field interference suitable for generator stator cores according to any one of claims 1 to 8 includes the following steps: S1. Clean the silicon wafer substrate; S2. Spin-coat a PMMA sacrificial layer onto the cleaned silicon wafer substrate, and then perform a heat curing process. S3. Spin-coat the PI precursor onto the cured PMMA sacrificial layer, and then perform a heating imidization treatment to form the PI substrate. S4. Photoresist spin coating, exposure and development are performed sequentially on the PI substrate surface to form patterned photoresist windows. S5. A temperature-sensitive conductive pattern is formed by sputtering within the photoresist window using a magnetron sputtering process. After completion, excess photoresist is removed to obtain a temperature-sensitive conductive pattern on the PI substrate. S6. Anneal the PI substrate with the temperature-sensitive conductive pattern. S7. Peel the PI substrate along with the temperature-sensitive conductive pattern from the silicon substrate to obtain the flexible temperature sensor body. S8. A permalloy antimagnetic shielding film is attached to the corresponding area of ​​the temperature-sensitive conductive pattern to obtain the antimagnetic interference flexible temperature sensor.

10. The preparation method according to claim 9, characterized in that, Step S1 specifically involves: placing the silicon wafer in acetone for ultrasonic cleaning for 30 minutes, then rinsing it with alcohol and deionized water in sequence, and finally drying it with an air gun.

11. The preparation method according to claim 9, characterized in that, Step S2 specifically involves spin-coating a PMMA sacrificial layer onto a silicon wafer, and then heating it on a 180°C heating platform for 5 minutes after spin-coating.

12. The preparation method according to claim 9, characterized in that, Step S3 specifically involves: spin-coating the PI precursor onto the PMMA sacrificial layer at a rotation speed of 3000 rpm / min and a spin-coating time of 60 s, for a total of two spin-coatings; after spin-coating, placing it on a heating platform at 120°C for 60 s, and then placing it in a coating machine at 230°C for 3 h to complete the imidization of the PI precursor.

13. The preparation method according to claim 9, characterized in that, Step S4 specifically involves: spin-coating photoresist onto the PI substrate surface, and then curing it on a heating platform at 95°C for 1 minute after spin-coating; placing the mask on a lithography machine for 8 seconds of ultraviolet exposure. After exposure, soak in developer for 30-70 seconds to develop, then rinse with deionized water for 30 seconds, and blow dry with an air gun to remove the UV-exposed photoresist, forming a patterned photoresist window.

14. The preparation method according to claim 9, characterized in that, In step S5, the magnetron sputtering target is Pt and Ti, wherein Ti is sputtered as a transition layer between the PI substrate and the Pt layer; the sputtering power is set to 65W and the sputtering time is set to 20min; after magnetron sputtering is completed, excess photoresist is washed away with acetone.

15. The preparation method according to claim 9, characterized in that, Step S6 specifically involves placing the PI substrate with the temperature-sensitive conductive pattern into an annealing furnace and annealing it for 3 hours. The annealing process starts at 50°C and increases by 30°C every 30 minutes.

16. The preparation method according to claim 9, characterized in that, Step S7 specifically involves: using thermal release tape to peel the PI substrate along with the temperature-sensitive conductive pattern off the silicon wafer, placing it on a heating platform for high-temperature heating to separate the thermal release tape from the sensor, thus completing the peeling process.

17. The preparation method according to claim 9, characterized in that, It also includes the mounting and installation steps for the flexible temperature array skin, specifically: A1. Mount the temperature sensor onto the corresponding position on the flexible circuit board using conductive silver paste to ensure normal sensor signal transmission. A2. Wipe the skin mounting area on the surface of the generator stator core clean with ethanol and water to remove any residual liquid; A3. Mix the epoxy resin adhesive according to the ratio, apply the adhesive evenly to the skin mounting surface, and then attach it to the corresponding position of the stator core. Let it stand for 24 hours to allow the adhesive to fully cure. A4. After the adhesive has fully cured, connect the flexible sensor array skin to the signal acquisition and communication module using a flexible flat cable. A5. Apply a permalloy antimagnetic shielding film to each sensing unit position on the sensor array skin to complete the magnetic field shielding.

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