Control method of test equipment and test equipment

Abstract

The application relates to a control method of a test device and the test device, the test device comprising a temperature control system, the temperature control system comprising a refrigerant temperature control unit, the refrigerant temperature control unit comprising a first temperature control module, the first temperature control module comprising a reversing mechanism, and a first compressor, a first condenser, a first expansion valve and a load evaporator which are sequentially arranged in a first refrigerant circuit, the first compressor being communicated with the first condenser and the load evaporator via the reversing mechanism, the reversing mechanism having a first state for controlling refrigeration of the first temperature control module and a second state for controlling heating of the first temperature control module. The technical scheme of the application can improve the temperature cycle test efficiency of the test device.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and in particular to control methods and testing equipment for testing equipment. Background Technology

[0002] Temperature cycling testing, also known as high and low temperature cycling testing, is used to evaluate the adaptability and reliability of chips / wafers under different temperature change conditions. One important indicator of temperature cycling testing is the cycle rate, which represents the time it takes for the test equipment to complete one cycle of high and low temperatures. Conventional test equipment often uses refrigerant cooling for temperature control. Temperature cycling testing includes cooling tests and heating tests; in both methods, the test temperature gradually changes between the lowest and highest temperatures over a relatively large temperature range.

[0003] During temperature cycling tests, a method of precise temperature control is typically achieved by using a refrigerant compressor and a heating module to counteract each other's heat. However, this method results in some of the heat used for heating or the cooling used for cooling being offset, leading to increased energy consumption and slower temperature control. Furthermore, if the refrigerant compressor is shut down during the heating phase, the waiting time caused by starting and stopping the compressor increases the testing time and energy consumption. Summary of the Invention

[0004] Based on this, in order to improve the testing efficiency of temperature cycling testing equipment, this application proposes a control method for testing equipment and testing equipment.

[0005] In a first aspect, this application proposes a control method for a testing device, the testing device including a temperature control system, the temperature control system including a refrigerant temperature control unit, the refrigerant temperature control unit including a first temperature control module, the first temperature control module including a reversing mechanism, and a first compressor, a first condenser, a first expansion valve and a load evaporator sequentially located in a first refrigerant circuit, the first compressor being connected to the first condenser and the load evaporator via the reversing mechanism, the reversing mechanism having a first state of controlling the first temperature control module to cool and a second state of controlling the first temperature control module to heat;

[0006] The control method includes the following steps:

[0007] S1. Obtain the temperature cycle test data of the test equipment. The temperature cycle test data includes the test type and the test temperature range. The test type includes heating test and / or cooling test.

[0008] S2. Determine multiple temperature measurement intervals obtained by dividing the test temperature range, each of the temperature measurement intervals having a matching mode command and a target liquid outlet temperature; the multiple temperature measurement intervals are arranged in ascending order, the mode command of the first part of the temperature measurement intervals is a cooling command to instruct the reversing mechanism to switch to the first state, and the mode command of the remaining part of the temperature measurement intervals arranged later is a heating command to instruct the reversing mechanism to switch to the second state;

[0009] S3. Entering the testing phase, during the testing phase, the actual production temperature of the temperature control system is acquired, and the temperature control system is controlled to operate according to the actual production temperature and the test type, and the actual production temperature is gradually increased or decreased within the test temperature range according to the temperature change method corresponding to the test type; when the actual production temperature is within each of the temperature measurement intervals, the switching mechanism is controlled to switch states according to the mode command matched by the temperature measurement interval, and the first temperature control module is controlled to operate according to the target liquid outlet temperature matched by the temperature measurement interval.

[0010] In some embodiments, the temperature control system includes an electric heater. In step S2, when the test type is a heating test, the cooling capacity corresponding to the target liquid outlet temperature matched by each of the previously arranged temperature measurement intervals is less than the heating capacity of the electric heater; and / or, when the test type is a cooling test, the cooling capacity corresponding to the target liquid outlet temperature matched by each of the previously arranged temperature measurement intervals is greater than the heating capacity of the electric heater.

[0011] In some embodiments, in step S2, when the test type is a heating test, the target liquid outlet temperature is the same in each of the previously arranged temperature measurement intervals, and the cooling capacity corresponding to the first temperature control module is the smallest, while the heating capacity of the electric heater is the largest; and / or, when the test type is a cooling test, the target liquid outlet temperature is the same in each of the previously arranged temperature measurement intervals, and the cooling capacity corresponding to the first temperature control module is the largest, and the electric heater is turned off.

[0012] In some embodiments, in step S2, the test type is a temperature rise test, and in the remaining temperature measurement intervals arranged later, the target liquid outlet temperature of each temperature measurement interval is the upper limit temperature of the temperature measurement interval.

[0013] In some embodiments, step S3 further includes:

[0014] When the actual production temperature reaches the target limit temperature of each of the temperature measurement intervals, the first temperature control module and the electric heater are controlled to work so that the actual production temperature is maintained at the target limit temperature for a set time.

[0015] Wherein, if the test type is a heating test, the target limit temperature is the upper limit temperature of the corresponding temperature measurement range; if the test type is a cooling test, the target limit temperature is the lower limit temperature of the corresponding temperature measurement range.

[0016] In some embodiments, in step S1, the test type includes a heating test or a cooling test, and the temperature cycle test data also includes a temperature recovery type, which includes heating recovery or cooling recovery. The heating recovery and cooling recovery are the opposite of the temperature change methods indicated by the cooling test and the heating test, respectively.

[0017] Step S2 further includes:

[0018] Determine multiple regeneration intervals divided by the test temperature range, and a mode command and target outlet temperature that match each of the regeneration intervals.

[0019] After step S3, the method further includes:

[0020] S4. Entering the recovery stage, during the recovery stage, the actual production temperature of the temperature control system is obtained, and the temperature control system is controlled to work according to the actual production temperature, and the actual production temperature is gradually increased or decreased within the test temperature range according to the temperature change method corresponding to the recovery type; when the actual production temperature is within each of the recovery intervals, the first temperature control module is controlled to work according to the target liquid outlet temperature matched by the recovery interval.

[0021] In some embodiments, the temperature control system includes an electric heater. In step S4, if the temperature recovery type is cooling recovery, the electric heater is turned off, and the mode command matched for each temperature recovery interval is a cooling command.

[0022] If the temperature recovery type is a rising temperature recovery, the electric heater is turned on, and / or the mode command matched for each temperature recovery zone is a heating command.

[0023] In some embodiments, the plurality of regeneration intervals include a first regeneration interval and a second regeneration interval. If the regeneration type is cooling regeneration, the temperature of the first regeneration interval is higher than the temperature of the second regeneration interval. The target liquid outlet temperature corresponding to the first regeneration interval is the maximum operating liquid outlet temperature of the first temperature control module, and the target liquid outlet temperature corresponding to the second regeneration interval is the lower limit temperature of the test temperature range.

[0024] In some embodiments, the refrigerant temperature control unit further includes a second temperature control module, the second temperature control module including a second compressor, a second condenser and a second expansion valve located sequentially in the second refrigerant circuit, the first condenser being located in the second refrigerant circuit and thermally coupled to the second refrigerant circuit; the second condenser having a heat exchange pipeline for flowing heat exchange medium, the heat exchange pipeline being thermally coupled to the second refrigerant circuit; the second temperature control module further includes a second reversing valve or a circulation pump, the second reversing valve connecting the second compressor to the second condenser and the first condenser, the circulation pump bypassing the exhaust end and return end of the second compressor, for guiding the refrigerant from the second condenser to the first condenser;

[0025] The control method further includes the following steps:

[0026] S5. When the reversing mechanism is controlled to switch to the first state, the second compressor is activated and the cooling medium is circulated in the heat exchange pipeline of the second condenser. At the same time, the circulating pump is either turned off or the second reversing valve is controlled to switch to the third state, which guides the refrigerant in the second refrigerant circuit from the second compressor to the second condenser.

[0027] S6. When the reversing mechanism is controlled to switch to the second state, the heating medium flows in the heat exchange pipeline, and the circulation pump is turned on and the second compressor is turned off, or the second compressor is turned on and the second reversing valve is controlled to switch to the fourth state, which guides the refrigerant of the second refrigerant circuit from the second compressor to the first condenser.

[0028] Secondly, this application proposes a testing device, including a temperature control system, the temperature control system including a refrigerant temperature control unit, the refrigerant temperature control unit including a first temperature control module, the first temperature control module including a reversing mechanism, and a first compressor, a first condenser, a first expansion valve and a load evaporator located sequentially in a first refrigerant circuit, the first compressor being connected to the first condenser and the load evaporator via the reversing mechanism;

[0029] The reversing mechanism can switch between a first state and a second state; in the first state, the reversing mechanism guides the refrigerant in the first refrigerant circuit from the first compressor to the first condenser so that the load evaporator cools; in the second state, the reversing mechanism guides the refrigerant in the first refrigerant circuit from the first compressor to the load evaporator so that the load evaporator heats.

[0030] The temperature control system is capable of performing the control method as described in the first aspect.

[0031] Compared with the prior art, this application has the following beneficial effects:

[0032] The control method and testing equipment described above, during temperature cycling tests, in the case of a heating test, switch the state of the reversing mechanism during the rise from low to high temperature, allowing the first temperature control module to switch from cooling to heating for rapid heating. This avoids reduced testing efficiency due to the waiting time of starting and stopping the refrigerant compressor, and also avoids increased energy consumption or reduced efficiency due to thermal incompatibility between the refrigerant compressor and the heating module. Similarly, in the case of a cooling test, during the fall from high to low temperature, switch the state of the reversing mechanism to switch the first temperature control module from heating to cooling for rapid cooling, again avoiding increased energy consumption or reduced efficiency due to thermal incompatibility between the refrigerant compressor and the heating module. Furthermore, regardless of whether it is a heating or cooling test, dividing the test temperature range into multiple measurement intervals facilitates gradual heating or cooling of the actual production temperature, avoiding temperature overshoot and ensuring more stable temperature control. Attached Figure Description

[0033] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0034] Figure 1 This is a schematic diagram of the composition of a temperature control system according to some embodiments;

[0035] Figure 2 This is a schematic diagram of the composition of a temperature control system according to some embodiments;

[0036] Figure 3 This is a schematic diagram of the temperature control system in some other embodiments;

[0037] Figure 4 This is a flowchart illustrating the control method of a test device in some embodiments;

[0038] Figure 5 This is a flowchart illustrating the control method of the test equipment in some other embodiments.

[0039] The reference numerals in the detailed embodiments are as follows:

[0040] 100. Temperature control system; L1. First refrigerant circuit; L2. Second refrigerant circuit; 10. First temperature control module; 11. Reversing mechanism; 11a. First reversing valve; 12. First compressor; 13. First condenser; 14. First expansion valve; 15. Load evaporator; 16. Liquid outlet temperature sensor; 16a. Heating temperature sensor; 16b. Cooling temperature sensor; 20. Electric heater; 30. Second temperature control module; 31. Second compressor; 32. Second condenser; 32a. Heat exchange pipeline; 33. Second expansion valve; 34. Second reversing valve; 35. Circulation pump; L3. Circulation bypass. Detailed Implementation

[0041] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0042] In the description of this application, it should be understood that, where they appear, the terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0043] Furthermore, where applicable, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0044] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., shall be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral part; they may refer to a mechanical connection or an electrical connection; they may refer to a direct connection or an indirect connection through an intermediate medium; they may refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0045] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0046] It should be noted that, if an element is described as "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is described as "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0047] To facilitate understanding, the testing equipment in the embodiments of this application will be introduced first.

[0048] Please refer to Figure 1 The test equipment in this embodiment includes a temperature control system 100. The temperature control system 100 includes a refrigerant temperature control unit, which includes a first temperature control module 10. The first temperature control module 10 includes a reversing mechanism 11, and a first compressor 12, a first condenser 13, a first expansion valve 14, and a load evaporator 15 sequentially located in the first refrigerant circuit L1. The first compressor 12 is connected to the first condenser 13 and the load evaporator 15 via the reversing mechanism 11. The reversing mechanism 11 has a first state for controlling the first temperature control module 10 to cool and a second state for controlling the first temperature control module 10 to heat.

[0049] Specifically, the testing equipment can be sorting testing equipment, probe station equipment, aging testing equipment, etc., used for performance testing of semiconductor devices such as chips or wafers. The testing equipment also includes a testing terminal for providing a testing environment for the semiconductor devices. The load evaporator 15 is used to regulate the temperature of the testing terminal.

[0050] The testing terminal can be a test head, test chamber, preheating plate, feed shuttle, wafer carrier tray, etc. The test chamber is a cavity structure that provides testing space, and multiple chips or wafers can be stored within it. A load evaporator 15 can be arranged within the test space to regulate the testing temperature. The test head is a pressure head structure that can press down against the chip, directly contacting it to regulate its temperature. A refrigerant flow path can be provided within the load evaporator 15, using refrigerant flowing through it to cool the refrigerant in the flow path. This refrigerant flow path connects to the piping inside the test head, regulating its temperature. The preheating plate is a structure that carries the chip and regulates its temperature. A refrigerant flow path connects to the piping inside the preheating plate, regulating its temperature. The feed shuttle is a structure that transports the chip. A refrigerant flow path connects to the piping inside the feed shuttle, regulating its temperature. A wafer carrier is a device that holds a wafer by adsorption. The coolant flow path can be connected to the pipeline inside the wafer carrier, and the test temperature of the wafer is adjusted by the coolant.

[0051] Specifically, when the reversing mechanism 11 is in the first state, it can guide the refrigerant in the first refrigerant circuit L1 from the first compressor 12 to the first condenser 13, so that the load evaporator 15 cools the test terminal. When the reversing mechanism 11 is in the second state, it can guide the refrigerant in the first refrigerant circuit L1 from the first compressor 12 to the load evaporator 15, so that the load evaporator 15 heats the test terminal.

[0052] Thus, during the temperature cycle test, as the temperature rises from a low temperature to a high temperature, the first temperature control module 10 can switch from a cooling state to a heating state by switching the state of the reversing mechanism 11. During this process, the first compressor 12 does not need to be stopped, and the heat generated by the first temperature control module 10 is used to accelerate the temperature rise, which helps to shorten the temperature cycle time of the test equipment and improve the test efficiency.

[0053] In some embodiments, continue to refer to Figure 1 The first temperature control module 10 includes an outlet temperature sensor 16. The outlet temperature sensor 16 is installed on the first refrigerant circuit L1 between the load evaporator 15 and the reversing mechanism 11, and on the first refrigerant circuit L1 between the load evaporator 15 and the first expansion valve 14.

[0054] The outlet temperature sensor 16 is used to collect the temperature of the refrigerant flowing into the load evaporator 15, and the collected data is used as the actual outlet temperature of the refrigerant.

[0055] Specifically, the outlet temperature sensor 16 located on the first refrigerant circuit L1 between the load evaporator 15 and the reversing mechanism 11 is a heating temperature sensor 16a. The heating temperature sensor 16a is used to collect the refrigerant temperature flowing into the load evaporator 15 when the first temperature control module 10 is heating (when the reversing mechanism 11 is in the second state). The outlet temperature sensor 16 located on the first refrigerant circuit L1 between the load evaporator 15 and the first expansion valve 14 is a cooling temperature sensor 16b, used to collect the refrigerant temperature flowing into the load evaporator 15 when the first temperature control module 10 is cooling (when the reversing mechanism 11 is in the first state).

[0056] In practical applications, the outlet temperature sensor 16 acquires the refrigerant temperature (referred to as the outlet temperature) flowing into the load evaporator 15 in each working mode of the first temperature control module 10, so as to adjust the opening of the first expansion valve 14 in real time according to the temperature, so that the temperature reaches the required temperature, thereby enabling the first temperature control module 10 to achieve the corresponding temperature control capability.

[0057] In one specific embodiment, the reversing mechanism 11 includes a first reversing valve 11a, through which the first compressor 12 is connected to the first condenser 13 and the load evaporator 15.

[0058] Specifically, the first reversing valve 11a is a four-way reversing valve with four ports: a, b, c, and d. Ports a and d are connected to the exhaust port and return port of the first compressor 12, respectively. Port c is connected to the first condenser 13, and port b is connected to the load evaporator 15.

[0059] In the first state, the first reversing valve 11a connects ports a and c, and ports b and d. The high-temperature refrigerant discharged from the first compressor 12 first passes through the first condenser 13, and then cools at the load evaporator 15. In the second state, the first reversing valve 11a connects ports a and b, and ports d and c. The high-temperature refrigerant discharged from the first compressor 12 first passes through the load evaporator 15, and then heats at the load evaporator 15.

[0060] At this point, the refrigerant flow direction is switched through the first reversing valve 11a, which has a simple structure and is easy to implement.

[0061] In other embodiments, the reversing mechanism 11 can also realize the function of the first reversing valve 11a by setting a reversing flow path and setting multiple solenoid valves on the reversing flow path, thereby realizing the switching of the refrigerant flow direction.

[0062] In some embodiments, refer to Figure 1 The temperature control system 100 also includes an electric heater 20. The electric heater 20 can be installed at the test terminal or at the load evaporator 15. The electric heater 20 can provide heat during the high-temperature stage, accelerating the test terminal to reach the high-temperature test temperature. If the electric heater 20 is installed at the load evaporator 15, the arrangement of the electric heater 20 can be simplified, and the electric heater 20 and the first temperature control module 10 can be installed and removed from the test equipment as a whole.

[0063] In some embodiments, such as Figure 2 and Figure 3 As shown, the refrigerant temperature control unit also includes a second temperature control module 30. The second temperature control module 30 includes a second compressor 31, a second condenser 32, and a second expansion valve 33, which are sequentially located in the second refrigerant circuit L2. The first condenser 13 is located in the second refrigerant circuit L2 and is thermally coupled to the first refrigerant circuit L1 and the second refrigerant circuit L2. The second condenser 32 has a heat exchange pipe 32a for flowing heat exchange medium, and the heat exchange pipe 32a is thermally coupled to the second refrigerant circuit L2. The second temperature control module 30 also includes a second reversing valve 34 or a circulation pump 35. The second reversing valve 34 connects the second compressor 31 to the second condenser 32 and the first condenser 13. The circulation pump 35 bypasses the exhaust end and the return end of the second compressor 31 and is used to guide the refrigerant from the second condenser 32 to the first condenser 13.

[0064] like Figure 2 As shown, the second temperature control module 30 includes a second reversing valve 34, which has a third state and a fourth state. When the second reversing valve 34 is in the third state, it connects the discharge end of the second compressor 31 to the second condenser 32, guiding the refrigerant from the second compressor 31 to the second condenser 32. When the second reversing valve 34 is in the fourth state, it connects the discharge end of the second compressor 31 to the first condenser 13, guiding the refrigerant from the second compressor 31 to the first condenser 13.

[0065] When the reversing mechanism 11 is in the first state, the first temperature control module 10 cools, and the second reversing valve 34 switches to the third state. At this time, the exhaust end of the second compressor 31 is connected to the second condenser 32, and the return end of the second compressor 31 is connected to the first condenser 13. The first condenser 13 acts as an intermediate heat exchanger, with a portion of its internal piping located in the first refrigerant circuit L1 and another portion located in the second refrigerant circuit L2, achieving thermal coupling (i.e., heat exchange) between the first refrigerant circuit L1 and the second refrigerant circuit L2. Simultaneously, cooling medium flows through the heat exchange pipe 32a, and its cooling capacity condenses the refrigerant in the second condenser 32, causing the refrigerant in the second refrigerant circuit L2 to absorb heat from the refrigerant in the first refrigerant circuit L1 at the first condenser 13, thereby improving the cooling capacity of the first temperature control module 10.

[0066] When the reversing mechanism 11 is in the second state, the first temperature control module 10 heats the air, the second reversing valve 34 switches to the fourth state, the exhaust end of the second compressor 31 is connected to the first condenser 13, and the return end of the second compressor 31 is connected to the second condenser 32. The high-temperature refrigerant discharged from the second compressor 31 heats the refrigerant in the first refrigerant circuit L1 in the first condenser 13, improving the heating capacity of the first temperature control module 10. At the same time, the heating medium flows in the heat exchange pipe 32a, which can increase the return gas temperature of the second compressor 31 and prevent liquid from being carried in the return gas of the second compressor 31.

[0067] In summary, when the second temperature control module 30 is equipped with the second reversing valve 34, it can utilize the refrigerant on the second refrigerant circuit L2 to heat or cool the refrigerant in the first condenser 13, greatly improving the external temperature control capability of the refrigerant at the load evaporator 15 and accelerating the heating / cooling of the test terminal. Simultaneously, during the temperature cycle test, the second compressor 31 remains running to avoid repeated start-stop cycles, which helps improve test efficiency.

[0068] like Figure 3 As shown, when the second temperature control module 30 is equipped with a circulation pump 35, the second temperature control module 30 includes a circulation bypass L3, which bypasses the second compressor 31 and directly connects it between the second condenser 32 and the first condenser 13, so that the circulation pump 35, the first condenser 13, the second expansion valve 33 and the second condenser 32 are connected end to end in sequence to form a third refrigerant circuit.

[0069] When the reversing mechanism 11 is in the first state, the first temperature control module 10 cools, the circulating pump 35 is turned off and the second compressor 31 is turned on, and the cooling medium flows in the heat exchange pipeline 32a. The high-temperature refrigerant discharged by the second compressor 31 first exchanges heat with the cooling medium in the heat exchange pipeline 32a at the second condenser 32, and then cools the refrigerant in the first refrigerant circuit L1 at the first condenser 13, thereby improving the cooling effect of the first temperature control module 10.

[0070] When the reversing mechanism 11 is in the second state, the second temperature control module 30 heats, the second compressor 31 stops, and the circulation pump 35 starts, with the heating medium flowing through the heat exchange pipeline 32a. The refrigerant in the third refrigerant circuit circulates under the action of the circulation pump 35. After absorbing heat from the heating medium at the second condenser 32, the refrigerant releases heat at the first condenser 13 to heat the refrigerant in the first refrigerant circuit L1, thereby improving the heating effect of the first temperature control module 10.

[0071] At this time, by setting the circulation pump 35, the cooling and heating functions of the second temperature control module 30 on the first temperature control module 10 can be taken into account, thereby improving the heating / cooling rate of the test equipment, shortening the temperature cycle time, and improving the test efficiency.

[0072] Understandably, since the refrigerant temperature control unit includes the aforementioned first temperature control module 10, stopping the refrigerant temperature control unit requires shutting down the first compressor 12; starting the refrigerant temperature control unit requires turning on the first compressor 12. Similarly, when the refrigerant temperature control unit includes the aforementioned first temperature control module 10 and second temperature control module 30, stopping the refrigerant temperature control unit requires shutting down the first compressor 12 and second compressor 31; starting the refrigerant temperature control unit requires turning on the first compressor 12 and second compressor 31.

[0073] Based on the test equipment in any of the above embodiments, please refer to Figure 4 The control method for the testing equipment proposed in this application includes:

[0074] S1. Obtain temperature cycling test data from the test equipment. The temperature cycling test data includes the test type and test temperature range. The test type includes heating test and / or cooling test.

[0075] The test temperature range is the temperature measurement interval of the temperature cycling test, determined by the lowest test temperature t1 and the highest test temperature t2 of the temperature cycling test, with the test temperature range being [t1, t2]. The heating test is used to indicate that the first temperature control mode gradually increases the temperature, and the cooling test is used to indicate that the first temperature control mode gradually decreases the temperature.

[0076] S2. Determine multiple temperature measurement intervals obtained by dividing the test temperature range. Each temperature measurement interval has a unique matching mode command and target outlet temperature. These multiple temperature measurement intervals are arranged in ascending order. The mode commands of the first-arranged temperature measurement intervals are used to instruct the reversing mechanism 11 to switch to the first state of cooling command, and the mode commands of the remaining temperature measurement intervals arranged later are used to instruct the reversing mechanism 11 to switch to the second state of heating command.

[0077] Specifically, multiple production levels can be set within the test temperature range according to actual needs, and the test temperature range can be divided into multiple temperature measurement intervals based on these production levels. For example, within the test temperature range of [-60℃, 160℃], multiple production levels are set, such as -60℃, -30℃, 0℃, 25℃, 60℃, 90℃, 120℃, and 160℃. Based on these production levels, the test temperature range is divided into seven temperature measurement intervals: [-60℃, -30℃], (-30℃, 0℃), (0℃, 25℃), (25℃, 60℃), (60℃, 90℃), (90℃, 120℃), and (120℃, 160℃). It is worth noting that the temperature measurement intervals defined for cooling tests and heating tests can be the same or different.

[0078] Each temperature measurement range is matched with a mode command, which is used to instruct the reversing mechanism 11 to switch states, thereby switching the working mode of the first temperature control module 10. Specifically, the mode command can be a cooling command to instruct the reversing mechanism 11 to switch to the first state to control the first temperature control module 10 to cool, or a heating command to instruct the reversing mechanism 11 to switch to the second state to control the first temperature control module 10 to heat.

[0079] The multiple temperature measurement intervals are arranged in ascending order of temperature. The first intervals in the arrangement are designated as cooling test intervals, and the remaining intervals are designated as heating test intervals. The mode command matched for the cooling test intervals is a cooling command, and the mode command matched for the heating test intervals is a heating command. There can be one or more cooling test intervals. There can also be one or more heating test intervals. It is worth noting that the order of the temperature measurement intervals is different from the test order.

[0080] Specifically, the temperature of a certain production setting is used as the reference temperature. The temperature range below this reference temperature is designated as the cooling test range, and its mode command is the cooling command. The temperature range above the reference temperature is designated as the heating test range, and its mode command is the heating command. Continuing from the above, if the test temperature range of [-60℃, 160℃] is divided into the above 7 temperature measurement ranges, the production setting of 25℃ can be used as the reference temperature. The earlier temperature measurement ranges of [-60℃, -30℃], (-30℃, 0℃], and (0℃, 25℃] will all be used as the cooling test ranges, and the later temperature measurement ranges of (25℃, 60℃], (60℃, 90℃], (90℃, 120℃], and (120℃, 160℃) will all be used as the heating test ranges.

[0081] In some embodiments, the reference temperature can be any temperature value in the range of 20°C to 30°C, without any specific limitation.

[0082] The target outlet temperature refers to the ideal temperature of the refrigerant entering the load evaporator 15 in the first refrigerant circuit L1. The actual temperature of the refrigerant entering the load evaporator 15 is called the actual outlet temperature. The actual outlet temperature can be, but is not limited to, obtained by the outlet temperature sensor 16 mentioned above. In one application, when the first temperature control module 10 is cooling, the actual outlet temperature is collected by the cooling temperature sensor 16b. When the first temperature control module 10 is heating, the actual outlet temperature is collected by the heating temperature sensor 16a.

[0083] S3. Enter the testing phase. During the testing phase, the actual production temperature of the temperature control system 100 is obtained. The temperature control system is controlled to work according to the actual production temperature and the test type. The actual production temperature is gradually increased or decreased within the test temperature range according to the temperature change method corresponding to the test type. When the actual production temperature is within each temperature measurement interval, the reversing mechanism 11 is controlled to switch states according to the mode command matched by the temperature measurement interval. The first temperature control module 10 is controlled to work according to the target liquid outlet temperature matched by the temperature measurement interval.

[0084] The actual production temperature of the temperature control system 100 is the actual temperature at which it is produced, and the actual temperature at which it acts on the test terminal. Specifically, this actual production temperature can be collected by a temperature sensor installed at the test terminal, or by a temperature sensor installed at the load evaporator 15.

[0085] Specifically, the actual production temperature of the first temperature control module 10 can be controlled to gradually increase or decrease according to preset rules. The specific content of the preset rules is not limited. In one example, the preset rule is that the amount of change in the actual production temperature per unit time is a preset value. In another example, the preset rule is that the rate of temperature change in the actual production temperature is a preset value.

[0086] The operation of the first temperature control module 10 is controlled according to the actual production temperature. Specifically, when the actual production temperature is within each temperature measurement range, the reversing mechanism 11 is controlled to switch states according to the mode command matching the temperature measurement range, and the opening degree of the first expansion valve 14 in the first temperature control module 10 is adjusted according to the target liquid outlet temperature, so that the actual liquid outlet temperature of the first temperature control module 10 reaches the target liquid outlet temperature.

[0087] It should be noted that for each temperature measurement interval of the mode command (cooling command), the target outlet liquid temperature can be the same or different. For each temperature measurement interval of the mode command (heating command), the target outlet liquid temperature can be the same or different. Generally, the higher the temperature of the measurement interval, the higher the target outlet liquid temperature. In related technologies, if temperature cycle testing is performed, during the heating phase, the refrigerant compressor and the heating module (such as the heating element) work simultaneously. Some of the heat generated by the heating module is offset by the cooling capacity of the refrigerant compressor, resulting in a slower heating rate or increased energy consumption. Similarly, if during the cooling phase, the refrigerant compressor and the heating module work simultaneously, some of the cooling capacity generated by the refrigerant compressor is offset by the heat generated by the heating module, resulting in a slower cooling rate or increased energy consumption. If the refrigerant compressor is turned off during the heating phase, relying solely on the heating module for heating, but then needs to be turned on again during the cooling phase, the start-up and shutdown process of the refrigerant compressor not only involves a long waiting time but also consumes more energy than under stable operating conditions.

[0088] In temperature cycling tests, the above control method, during the heating test from low to high temperature, switches the state of the reversing mechanism 11 to switch the first temperature control module 10 from cooling to heating. In heating mode, the heat generated does not need to offset the cooling, resulting in faster heating and less waiting time and energy consumption due to starting and stopping the refrigerant temperature control unit. In cooling tests, during the temperature drop from high to low temperature, the reversing mechanism 11 switches the first temperature control module 10 from heating to cooling. In cooling mode, the cooling does not need to offset the heat, improving test efficiency and reducing energy consumption. Furthermore, dividing the test temperature range into multiple measurement intervals facilitates gradual heating or cooling of the actual production temperature, avoiding temperature overshoot and ensuring more stable temperature control.

[0089] In some embodiments, the temperature control system 100 further includes an electric heater 20. The electric heater 20 may be located at the test terminal or at the load evaporator 15. The electric heater 20 generates heat when energized.

[0090] In one embodiment, in step S2, when the test type is a heating test, the cooling capacity corresponding to the target liquid outlet temperature matched by each of the pre-arranged partial temperature measurement intervals is less than the heating capacity of the electric heater 20; and / or, when the test type is a cooling test, the cooling capacity corresponding to the target liquid outlet temperature matched by each of the pre-arranged partial temperature measurement intervals is greater than the heating capacity of the electric heater 20.

[0091] The cooling capacity of the first temperature control module 10 is the same as the cooling capacity of the load evaporator 15. As mentioned above, the test temperatures corresponding to the earlier temperature measurement intervals are lower, and their corresponding mode commands are cooling commands. In this case, the load evaporator 15 is used for cooling. The cooling capacity corresponding to the target liquid outlet temperature refers to the cooling capacity generated by the negative pressure evaporator.

[0092] When the test type is a temperature rise test, and the actual production temperature is within the pre-arranged temperature measurement ranges, the temperature cycle test is in the early stage of temperature rise. In this stage, controlling the cooling capacity of the load evaporator 15 to be less than the heating capacity of the electric heater 20 can reduce the heat consumed by the electric heater 20 to resist the cooling capacity, thereby ensuring that the actual production temperature rises, accelerating the temperature cycle test process, improving test efficiency, and reducing energy consumption.

[0093] When the test type is a cooling test, and the actual production temperature is within the pre-arranged temperature measurement ranges, the temperature cycling test is in the late cooling stage. In this stage, the cooling capacity of the load evaporator 15 is controlled to be greater than the heating capacity of the electric heater 20 (for example, the heating capacity of the electric heater 20 is 0, i.e., the electric heater 20 is off). This reduces the amount of cooling energy consumed by the load evaporator 15 to resist the electric heater 20, ensuring the actual production temperature decreases. It also accelerates the rate of temperature decrease, improves test efficiency, and reduces energy consumption.

[0094] Understandably, the above embodiments are based on the premise of not considering heat exchange at ambient temperature. If the influence of ambient temperature on temperature cycling test is considered, in the early stage of heating up, the ambient temperature (usually room temperature) is higher than the actual production temperature. The cooling capacity of the load evaporator 15 should be less than the sum of the heating capacity of the electric heater 20 and the heating capacity generated by the ambient temperature due to the heat transfer temperature difference, so as to ensure that the test terminal temperature rises. In the later stage of cooling down, the cooling capacity of the load evaporator 15 should be greater than the sum of the heating capacity of the electric heater 20 and the heating capacity generated by the ambient temperature due to the heat transfer temperature difference, so as to ensure that the actual production temperature falls.

[0095] In a further embodiment, in step S2, when the test type is a temperature rise test, the target liquid outlet temperature of each of the pre-arranged partial temperature measurement intervals is the same, and the cooling capacity corresponding to the first temperature control module 10 is the smallest, while the heating capacity of the electric heater 20 is the largest.

[0096] It is worth noting that the cooling capacity provided by the load evaporator 15 varies depending on the outlet liquid temperature. The amount of cooling capacity is related not only to the opening degree of the first expansion valve 14, but also to the refrigerant flow rate through the first expansion valve 14 per unit time. Tests can determine the outlet liquid temperature of the load evaporator 15 under the condition of maximum cooling capacity (maximum operating temperature) and the outlet liquid temperature under the condition of minimum cooling capacity (minimum operating temperature). Experiments have verified that the outlet liquid temperature under the maximum operating condition is higher than the outlet liquid temperature under the minimum operating condition.

[0097] In other words, when the test type is a heating test, and the actual production temperature is located within the pre-arranged temperature measurement intervals (i.e., the actual production temperature is located within the refrigeration test intervals), the first temperature control module 10 is controlled according to the operating parameters corresponding to the minimum refrigeration capacity condition. This configuration ensures, on the one hand, that the refrigeration capacity generated by the first temperature control module 10 is at its minimum level during the early stages of the heating test, reducing the heat consumed by the electric heater 20 to offset the cooling capacity, improving energy utilization, and accelerating test efficiency. On the other hand, the target liquid outlet temperature is the same in each temperature measurement interval, simplifying the control of the first temperature control module 10.

[0098] In addition, in the early stage of the heating test, controlling the electric heater 20 to operate at maximum heating capacity (controlling the electric heater 20 to operate at maximum power) helps to accelerate the heating rate and improve the testing efficiency.

[0099] In some embodiments, during a certain temperature measurement range in the testing phase, the electric heater 20 first operates at maximum power and then reduces power. For example, in the temperature measurement range of [-60℃, -30℃], the electric heater 20 operates at maximum power at -60℃, which has the fastest heating rate. When the test temperature approaches -30℃, such as -40℃, the electric heater 20 reduces power to decrease the heating rate and avoids heating up too quickly and exceeding the target temperature.

[0100] In some embodiments, when the test type is a temperature rise test, the mode switching is performed at a reference temperature (e.g., 25°C) across the entire test temperature range, such as [-60°C, 160°C]. The electric heater 20 can operate continuously across the entire test temperature range or stop operating near the reference temperature. More preferably, the electric heater 20 stops operating after the first temperature control module 10 has completely switched from cooling mode to heating mode. For example, the first temperature control module 10 starts switching states at the reference temperature (e.g., 25°C) and only completes the state switching when the test temperature rises to 40°C, at which point the electric heater 20 stops operating.

[0101] In a further embodiment, when the test type is a cooling test, the target liquid outlet temperature is the same in each of the pre-arranged partial temperature measurement intervals, and the cooling capacity corresponding to the first temperature control module 10 is the largest, so the electric heater 20 is turned off.

[0102] In other words, when the test type is a cooling test, and the actual production temperature is located within the pre-arranged temperature measurement intervals (i.e., the actual production temperature is located within each refrigeration test interval), the first temperature control module 10 is controlled according to the operating parameters corresponding to the maximum cooling capacity condition. This configuration ensures, on the one hand, that the cooling capacity generated by the first temperature control module 10 is at its highest level during the later stages of cooling, thus accelerating the testing efficiency. On the other hand, the target liquid outlet temperature is the same for each temperature measurement interval, simplifying the control of the first temperature control module 10.

[0103] In addition, during the later stages of the cooling test, turning off the electric heater 20 avoids the cold energy consumed by the electric heater 20, which helps to accelerate the cooling rate and improve energy utilization.

[0104] It is worth noting that when the test type is cooling test, when the actual production temperature is located in the following temperature measurement ranges, that is, when the actual production temperature is located in each heating test range, the electric heater 20 can be turned off, and the actual production temperature of the temperature control system 100 can be controlled entirely by the heating of the first temperature control module 10.

[0105] In some embodiments, in step S2, when the test type is a temperature rise test, the target liquid outlet temperature of each of the remaining temperature measurement intervals arranged later is the upper limit temperature of the temperature measurement interval. Specifically, for the temperature measurement intervals arranged later, such as (25℃, 60℃), (60℃, 90℃), (90℃, 120℃), and (120℃, 160℃), the target liquid outlet temperature of (25℃, 60℃) is 60℃, and the target liquid outlet temperature of (90℃, 120℃) is 120℃. In this way, the first temperature control module 10 provides more and more heat in the later stage of temperature rise, which can further accelerate the temperature rise and improve the test efficiency. In other embodiments, there may also be multiple target liquid outlet temperatures in a single temperature measurement interval. For example, in the temperature rise process of (60℃, 90℃), the target liquid outlet temperature is first set to 70℃, and when the temperature rises to 70℃, the target liquid outlet temperature is then set to 90℃, until the limit temperature of the temperature measurement interval is reached.

[0106] In some embodiments, step S3 further includes:

[0107] When the actual production temperature reaches the target limit temperature of each temperature measurement range, the first temperature control module 10 and the electric heater 20 are controlled to operate so that the actual production temperature is maintained at the target limit temperature for a set time. Specifically, if the test type is a heating test, the target limit temperature is the upper limit temperature of the corresponding temperature measurement range; if the test type is a cooling test, the target limit temperature is the lower limit temperature of the corresponding temperature measurement range.

[0108] It should be noted that when the actual production temperature is maintained at the target limit temperature, the testing equipment performs relevant tests on the chip or wafer at that temperature to evaluate its performance. No tests are performed when the actual production temperature rises from the lower limit to the upper limit of the measurement range, or falls from the upper limit to the lower limit.

[0109] For example, during the temperature rise test, if the actual production temperature reaches (0℃, 25℃), the first temperature control module 10 is controlled to operate with the corresponding cooling command and target liquid outlet temperature. When the actual production temperature reaches the upper limit temperature of 25℃, the first temperature control module 10 and the electric heater 20 maintain the actual production temperature at 25℃ for a certain period of time.

[0110] For example, during a cooling test, if the actual production temperature reaches the measurement range of [0℃, 25℃), the first temperature control module 10 is controlled to operate with the corresponding cooling command and target liquid outlet temperature. When the actual production temperature reaches the lower limit temperature of 0℃, the first temperature control module 10 and the electric heater 20 maintain the actual production temperature at 0℃ for a certain period of time.

[0111] At this time, when the actual production temperature reaches the target limit temperature of a certain temperature measurement range, the first temperature control module 10 and the electric heater 20 are controlled to maintain the actual production temperature at the target limit temperature within a set time. This ensures that the test equipment can perform relevant tests on the chip or wafer at the target limit temperature, avoids temperature overshoot caused by control lag or inertia, effectively eliminates the interference of temperature fluctuations on the performance of test samples such as chips and wafers, and greatly improves the accuracy and reliability of temperature cycle test results.

[0112] In some embodiments, refer to Figure 5 In step S1, the test type includes heating test or cooling test, and the temperature cycle test data also includes the temperature recovery type, which includes heating recovery or cooling recovery. Heating recovery and cooling recovery are the opposite of the temperature change methods indicated by cooling test and heating test, respectively.

[0113] Step S2 also includes: determining multiple rewarming intervals divided by the test temperature range, and a mode command and target outlet temperature that match each rewarming interval.

[0114] After step S3, the following also includes:

[0115] S4. Entering the recovery stage, during the recovery stage, the actual production temperature of the temperature control system 100 is obtained, and the first temperature control module 10 is controlled to work according to the actual production temperature, and the actual production temperature is gradually increased or decreased within the test temperature range according to the temperature change method corresponding to the recovery type; when the actual production temperature is in each recovery interval, the first temperature control module 10 is controlled to work according to the target liquid outlet temperature matched by the recovery interval.

[0116] The warm-up phase and the testing phase are different temperature-changing stages within the same test temperature range, but their temperature-changing methods are opposite. When the test type is a heating test, the warm-up phase is used to quickly reduce the actual production temperature from the highest test temperature to the lowest test temperature in preparation for the next heating test stage. In this case, the warm-up type is cooling-to-warm-up. When the test type is a cooling test, the warm-up phase is used to quickly increase the actual production temperature from the lowest test temperature to the highest test temperature in preparation for the next cooling test stage. In this case, the warm-up type is heating-to-warm-up.

[0117] The multiple recirculation zones, divided according to the test temperature range, are each matched with a corresponding mode command and target outlet temperature. Specifically, but not limited to, the same approach as the temperature measurement zones can be adopted, arranging the recirculation zones from lowest to highest temperature. Recirculation zones below the reference temperature are designated as cooling recirculation zones, while those above the reference temperature are designated as heating recirculation zones. The mode command matched for the cooling recirculation zone is a cooling command. The command matched for the heating recirculation zone is a heating command.

[0118] During the heating-up or cooling-down phases, the testing equipment typically does not perform performance testing on the chip or wafer.

[0119] In practical applications, after the testing equipment completes a round of heating or cooling tests, it quickly returns to the starting temperature through a warm-up phase, ready for the next round of testing. Since the first temperature control module 10 can both cool and heat under the control of the reversing mechanism 11, there is no need to shut down the refrigerant temperature control unit, avoiding the time consumption caused by starting and stopping the refrigerant temperature control unit, which helps to improve testing efficiency.

[0120] To simplify control and accelerate temperature recovery, the number of temperature recovery zones is less than the number of corresponding temperature measurement zones.

[0121] It is worth noting that each round of temperature cycling test includes a heating phase and a cooling phase. When the test type is a heating test, the temperature cycling test consists of a heating test phase and a cooling recovery phase. Taking the test temperature range [-60℃, 160℃] as an example, the heating test phase involves the temperature control system 100 heating from -60℃ to 160℃, and at specific production temperatures such as -60℃, -30℃, 0℃, 25℃, 60℃, 90℃, 120℃, and 160℃, the testing equipment performs relevant tests on the chip or wafer at those temperatures. The cooling recovery phase involves the temperature control system cooling from 160℃ to -60℃ to prepare for the next heating test phase. During the cooling recovery phase, the testing equipment does not test the chip or wafer. When the test type is a cooling test, the temperature cycling test consists of a cooling test phase and a heating recovery phase. The cooling test phase involves the temperature control system 100 cooling down from 160℃ to -60℃. The testing equipment then tests the chip or wafer at specific production temperatures such as 160℃, 120℃, 90℃, 60℃, 25℃, 0℃, -30℃, and -60℃. The heating / cooling phase involves the temperature control system heating up from -60℃ to 160℃ to prepare for the next cooling test phase. During the heating / cooling phase, the testing equipment does not test the chip or wafer. When the test type consists of both heating and cooling tests, the temperature cycle test comprises a heating test phase and a cooling test phase. It can be understood that during both the heating from -60℃ to 160℃ and cooling from 160℃ to -60℃ processes, the testing equipment needs to test the chip or wafer at specific production temperatures.

[0122] In some embodiments, the temperature control system 100 further includes an electric heater 20. In step S4, if the temperature recovery type is cooling recovery, the electric heater 20 is turned off, and the mode command matched for each temperature recovery zone is a cooling command. If the temperature recovery type is heating recovery, the electric heater 20 is turned on, and / or, the mode command matched for each temperature recovery zone is a heating command.

[0123] When the temperature recovery type is cooling recovery, all recovery zones are cooling recovery zones. At this time, the electric heater 20 is turned off, and the cooling capacity produced by the first temperature control module 10 can be used entirely for cooling the test terminal, which can not only quickly reduce the actual production temperature but also reduce cooling capacity consumption.

[0124] When the temperature recovery type is rising temperature recovery, the electric heater 20 can be turned on to accelerate the temperature rise. Specifically, the electric heater 20 can be controlled to operate at maximum power. When the temperature recovery type is rising temperature recovery, the mode command matching each temperature recovery range can also be set to the heating command, so that the first temperature control module 10 continuously outputs heat throughout the temperature recovery process, thereby accelerating the temperature recovery speed and improving test efficiency.

[0125] In some embodiments, the plurality of reheating intervals include a first reheating interval and a second reheating interval. If the reheating type is cooling reheating, the temperature of the first reheating interval is higher than the temperature of the second reheating interval. The target liquid outlet temperature corresponding to the first reheating interval is the maximum operating liquid outlet temperature of the first temperature control module 10, and the target liquid outlet temperature corresponding to the second reheating interval is the lower limit temperature of the test temperature range.

[0126] When the test type is a heating test and the recovery type is a cooling recovery, two recovery intervals are set: a first recovery interval and a second recovery interval, simplifying control. The higher-temperature first recovery interval uses the maximum operating temperature of the liquid outlet of the first temperature control module 10 as the target liquid outlet temperature, such as -40℃. At this temperature, the first temperature control module 10 can generate the maximum cooling capacity, accelerating the drop of the test terminal from high to low temperature. The lower-temperature second recovery interval uses the lower limit of the test temperature (such as -60℃ in the above example) as the target liquid outlet temperature, allowing the actual production temperature to quickly recover to the starting temperature of the next heating test stage, thus improving testing efficiency.

[0127] As an example, taking a test temperature range of [-60℃, 160℃] as an example, when the temperature recovery type is cooling and recovery, the second temperature recovery range can be [-60℃, -40℃), and the first temperature recovery range can be [-40℃, 160℃].

[0128] In one embodiment, the temperature control system 100 further includes the aforementioned second temperature control module 30, and the control method further includes the following steps:

[0129] S5. When the reversing mechanism 11 is controlled to switch to the first state, the second compressor 31 is activated and the cooling medium flows in the heat exchange pipe 32a of the second condenser 32. At the same time, the circulating pump 35 is shut down or the second reversing valve 34 is controlled to switch to the third state, which guides the refrigerant of the second refrigerant circuit L2 from the second compressor 31 to the second condenser 32.

[0130] S6. When the reversing mechanism 11 is controlled to switch to the second state, the heating medium flows in the heat exchange pipeline 32a, and the circulating pump 35 is turned on and the second compressor 31 is turned off, or the second compressor 31 is turned on and the second reversing valve 34 is controlled to switch to the fourth state, which guides the refrigerant of the second refrigerant circuit L2 from the second compressor 31 to the first condenser 13.

[0131] When the reversing mechanism 11 is in the first state, the first temperature control module 10 provides external cooling. Combined with... Figure 2 If the second temperature control module 30 includes a circulation pump 35, then the circulation pump 35 is turned off, the second compressor 31 is turned on, and cooling medium is introduced into the heat exchange pipeline 32a. The refrigerant generated by the second compressor 31 flows sequentially through the second condenser 32, the second expansion valve 33, and the first condenser 13. The refrigerant in the second refrigerant circuit L2 absorbs the cooling medium's cold energy at the second condenser 32 and transfers it to the refrigerant in the first refrigerant circuit L1 at the first condenser 13, increasing the subcooling of the refrigerant in the first refrigerant circuit L1, improving the cooling capacity of the load evaporator 15, and increasing the heating test efficiency.

[0132] When the reversing mechanism 11 is in the second state, the first temperature control module 10 provides external heating. Combined with... Figure 1 If the second temperature control module 30 includes a circulation pump 35, then the circulation pump 35 is turned on, the second compressor 31 is turned off, and the heating medium is introduced into the heat exchange pipeline 32a. The refrigerant in the third refrigerant circuit circulates under the action of the circulation pump 35, absorbs heat from the heating medium at the second condenser 32, and transfers the heat to the refrigerant in the first refrigerant circuit L1 at the first condenser 13, increasing its superheat and improving the external heating capacity of the load evaporator 15, thus increasing the heating test efficiency.

[0133] When the reversing mechanism 11 is in the first state, the first temperature control module 10 provides external cooling. Combined with... Figure 3 If the second temperature control module 30 includes a second reversing valve 34, then the second reversing valve 34 is switched to the third state, the second compressor 31 is turned on, and cooling medium is introduced into the heat exchange pipeline 32a. In the third state, the second reversing valve 34 guides the refrigerant discharged from the second compressor 31 to flow through the second condenser 32 first, and then through the second expansion valve 33 and the first condenser 13. The refrigerant in the second refrigerant circuit L2 absorbs the cooling medium's cold energy at the second condenser 32, and transfers it to the refrigerant in the first refrigerant circuit L1 at the first condenser 13, thereby increasing the subcooling of the refrigerant in the first refrigerant circuit L1, improving the cooling capacity of the load evaporator 15, and increasing the heating test efficiency.

[0134] When the reversing mechanism 11 is in the second state, the first temperature control module 10 provides external heating. Combined with... Figure 3If the second temperature control module 30 includes a second reversing valve 34, then the second reversing valve 34 is switched to the fourth state, the second compressor 31 is turned on, and heating medium is introduced into the heat exchange pipeline 32a. In the fourth state, the second reversing valve 34 guides the refrigerant discharged from the second compressor 31 to flow through the first condenser 13, and then through the second expansion valve 33 and the second condenser 32. The refrigerant in the second refrigerant circuit L2 first heats the refrigerant in the first refrigerant circuit L1 at the first condenser 13, helping to improve the heating capacity of the load evaporator 15 and accelerate the testing efficiency, and then absorbs the heat of the heating medium at the second condenser 32, increasing the return gas temperature to the second compressor 31.

[0135] The testing device proposed in this application can execute the control method in the above embodiments and has all the beneficial effects in the above embodiments, which will not be repeated here.

[0136] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0137] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A control method of a test apparatus, characterized by, The testing equipment includes a temperature control system, which includes a refrigerant temperature control unit. The refrigerant temperature control unit includes a first temperature control module. The first temperature control module includes a reversing mechanism and a first compressor, a first condenser, a first expansion valve, and a load evaporator located sequentially in a first refrigerant circuit. The first compressor is connected to the first condenser and the load evaporator via the reversing mechanism. The reversing mechanism has a first state for controlling the first temperature control module to cool and a second state for controlling the first temperature control module to heat. The control method includes the following steps: S1. Obtain the temperature cycle test data of the test equipment. The temperature cycle test data includes the test type and the test temperature range. The test type includes heating test and / or cooling test. S2. Determine multiple temperature measurement intervals obtained by dividing the test temperature range, each of the temperature measurement intervals having a matching mode command and a target liquid outlet temperature; the multiple temperature measurement intervals are arranged in ascending order, the mode command of the first part of the temperature measurement intervals is a cooling command to instruct the reversing mechanism to switch to the first state, and the mode command of the remaining part of the temperature measurement intervals arranged later is a heating command to instruct the reversing mechanism to switch to the second state; S3. Entering the testing phase, during the testing phase, the actual production temperature of the temperature control system is acquired, and the temperature control system is controlled to operate according to the actual production temperature and the test type, and the actual production temperature is gradually increased or decreased within the test temperature range according to the temperature change method corresponding to the test type; when the actual production temperature is within each of the temperature measurement intervals, the switching mechanism is controlled to switch states according to the mode command matched by the temperature measurement interval, and the first temperature control module is controlled to operate according to the target liquid outlet temperature matched by the temperature measurement interval.

2. The control method according to claim 1, characterized in that, The temperature control system includes an electric heater. In step S2, when the test type is a heating test, the cooling capacity corresponding to the target liquid outlet temperature matched by each of the previously arranged temperature measurement intervals is less than the heating capacity of the electric heater; and / or, when the test type is a cooling test, the cooling capacity corresponding to the target liquid outlet temperature matched by each of the previously arranged temperature measurement intervals is greater than the heating capacity of the electric heater.

3. The control method according to claim 2, characterized in that, In step S2, when the test type is a heating test, the target liquid outlet temperature is the same in each of the previously arranged temperature measurement intervals, and the cooling capacity corresponding to the first temperature control module is the smallest, while the heating capacity of the electric heater is the largest; and / or, when the test type is a cooling test, the target liquid outlet temperature is the same in each of the previously arranged temperature measurement intervals, and the cooling capacity corresponding to the first temperature control module is the largest, the electric heater is turned off.

4. The control method according to claim 2, characterized in that, In step S2, when the test type is a temperature rise test, the target liquid outlet temperature of each of the remaining temperature measurement intervals arranged later is the upper limit temperature of that temperature measurement interval.

5. The control method according to claim 2, characterized in that, Step S3 also includes: When the actual production temperature reaches the target limit temperature of each of the temperature measurement intervals, the first temperature control module and the electric heater are controlled to work so that the actual production temperature is maintained at the target limit temperature for a set time. Wherein, if the test type is a heating test, the target limit temperature is the upper limit temperature of the corresponding temperature measurement range; if the test type is a cooling test, the target limit temperature is the lower limit temperature of the corresponding temperature measurement range.

6. The control method according to claim 1, characterized in that, In step S1, the test type includes a heating test or a cooling test; the temperature cycle test data also includes a temperature recovery type, which includes heating recovery or cooling recovery, and the heating recovery and cooling recovery are the opposite of the temperature change methods indicated by the cooling test and the heating test, respectively. Step S2 further includes: Determine multiple regeneration intervals divided by the test temperature range, and a mode command and target outlet temperature that match each of the regeneration intervals. After step S3, the method further includes: S4. Entering the recovery stage, during the recovery stage, the actual production temperature of the temperature control system is obtained, and the temperature control system is controlled to work according to the actual production temperature, and the actual production temperature is gradually increased or decreased within the test temperature range according to the temperature change method corresponding to the recovery type; when the actual production temperature is within each of the recovery intervals, the first temperature control module is controlled to work according to the target liquid outlet temperature matched by the recovery interval.

7. The control method according to claim 6, characterized in that, The temperature control system includes an electric heater. In step S4, if the temperature recovery type is cooling and temperature recovery, the electric heater is turned off, and the mode command matched for each temperature recovery interval is a cooling command. If the temperature recovery type is a rising temperature recovery, the electric heater is turned on, and / or the mode command matched for each of the temperature recovery intervals is a heating command.

8. The control method according to claim 7, characterized in that, The plurality of regeneration intervals include a first regeneration interval and a second regeneration interval. If the regeneration type is cooling regeneration, the temperature of the first regeneration interval is higher than the temperature of the second regeneration interval. The target liquid outlet temperature corresponding to the first regeneration interval is the maximum operating liquid outlet temperature of the first temperature control module, and the target liquid outlet temperature corresponding to the second regeneration interval is the lower limit temperature of the test temperature range.

9. The control method according to claim 1, characterized in that, The refrigerant temperature control unit further includes a second temperature control module, which includes a second compressor, a second condenser, and a second expansion valve located sequentially in the second refrigerant circuit. The first condenser is located in the second refrigerant circuit and thermally coupled to the second refrigerant circuit. The second condenser has a heat exchange pipeline for flowing heat exchange medium, and the heat exchange pipeline is thermally coupled to the second refrigerant circuit. The second temperature control module further includes a second reversing valve or a circulation pump. The second reversing valve connects the second compressor to the second condenser and the first condenser. The circulation pump bypasses the exhaust end and return end of the second compressor and is used to guide the refrigerant from the second condenser to the first condenser. The control method further includes the following steps: S5. When the reversing mechanism is controlled to switch to the first state, the second compressor is activated and the cooling medium is circulated in the heat exchange pipeline of the second condenser. At the same time, the circulating pump is either turned off or the second reversing valve is controlled to switch to the third state, which guides the refrigerant in the second refrigerant circuit from the second compressor to the second condenser. S6. When the reversing mechanism is controlled to switch to the second state, the heating medium flows in the heat exchange pipeline, and the circulation pump is turned on and the second compressor is turned off, or the second compressor is turned on and the second reversing valve is controlled to switch to the fourth state, which guides the refrigerant of the second refrigerant circuit from the second compressor to the first condenser.

10. A testing device, characterized in that, The system includes a temperature control system, which includes a refrigerant temperature control unit. The refrigerant temperature control unit includes a first temperature control module. The first temperature control module includes a reversing mechanism and a first compressor, a first condenser, a first expansion valve, and a load evaporator located sequentially in a first refrigerant circuit. The first compressor is connected to the first condenser and the load evaporator via the reversing mechanism. The reversing mechanism can switch between a first state and a second state; in the first state, the reversing mechanism guides the refrigerant in the first refrigerant circuit from the first compressor to the first condenser so that the load evaporator cools; in the second state, the reversing mechanism guides the refrigerant in the first refrigerant circuit from the first compressor to the load evaporator so that the load evaporator heats. The temperature control system is capable of performing the control method as described in any one of claims 1 to 9.

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