A method and apparatus for temperature control of a liquid cooling system
Patent Information
- Application Number
- CN202611008097.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-07-07
- Publication Date
- 2026-09-11
AI Technical Summary
但是,这种仅依赖节温阀进行单变量调节的方法,温度控制精度低
[0010]This application discloses a temperature control method, apparatus, device, medium, and product for a liquid cooling system. Based on the temperature deviation between the actual and desired temperatures of the target equipment, it generates the pulse width variation of a temperature control signal using a proportional-integral-derivative (PID) control algorithm. Then, with the goal of bringing the target equipment temperature closer to the desired temperature, and combining the mapping relationship between valve angles and the temperature control signal, it determines the target valve angle, thereby regulating the liquid flow rate in the cold and hot circuits and driving the target equipment temperature towards the desired temperature. This application also obtains the temperature drop rate deviation by comparing the actual and desired temperature drop rates, and determines the change in the number of liquid cooling pumps using a PID control algorithm. With the goal of bringing the target equipment temperature drop rate closer to the desired temperature drop rate, and combining the data change, it determines the target number of pumps to be activated, thereby regulating the number of activated liquid cooling pumps and driving the target equipment temperature drop rate towards the desired temperature drop rate. In other words, this application uses a dual closed-loop control logic—temperature deviation driving valve angle regulation and temperature drop rate deviation driving liquid cooling pump quantity regulation—to ensure the matching of the target equipment temperature with the desired temperature and the stability of the temperature control process, thereby improving the temperature control accuracy of the liquid cooling system.
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Figure CN122732977A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of temperature control technology, and in particular relates to a temperature control method and device for a liquid cooling system. Background Technology
[0002] A liquid cooling system is a heat dissipation system that uses a coolant as the heat transfer medium to transfer and dissipate the heat generated by a target device to the external environment. In many applications, the object being cooled requires high stability and accuracy of its operating temperature. Excessive temperature can lead to performance degradation, data distortion, or even shutdown and damage, while excessively low temperature can cause the coolant to solidify and equipment startup failures. Therefore, precise temperature control of the target device through a liquid cooling system is crucial to ensuring the equipment's operating efficiency and reliability.
[0003] Currently, temperature control of liquid cooling systems is generally achieved through a coolant circulation loop connecting the target device and the heat dissipation equipment. This involves monitoring the real-time temperature of the target device and using a thermostatic valve as the control element. By controlling the valve's angle, the circulation path or flow rate of the coolant is altered. However, this method, relying solely on the thermostatic valve for single-variable regulation, results in low temperature control accuracy. Summary of the Invention
[0004] This application provides a temperature control method and device for a liquid cooling system, which can improve the temperature control accuracy of the liquid cooling system.
[0005] On one hand, embodiments of this application provide a temperature control method for a liquid cooling system. The coolant circulation loop of the liquid cooling system includes a cold circuit and a hot circuit. The liquid flow distribution between the cold circuit and the hot circuit is adjusted by the valve angle of a thermostatic valve. Multiple liquid cooling pumps are configured at the heat exchange front end of the cold circuit. The method includes: Based on the temperature deviation between the current actual temperature and the desired temperature of the target device obtained in advance, the pulse width change of the temperature control signal is determined by the proportional-integral-derivative control algorithm. The target valve angle is determined based on the relationship between the actual temperature and the desired temperature, the pulse width change, and the mapping relationship between the valve angle and the temperature control signal. Based on the temperature drop rate deviation between the current actual temperature drop rate and the expected temperature drop rate of the target device obtained in advance, the change in the number of liquid cooling pumps is determined through the proportional-integral-derivative control algorithm. Based on the relationship between the actual temperature drop rate and the expected temperature drop rate, as well as the change in quantity, the target number of liquid cooling pumps to be turned on is determined. The temperature control of the target device is driven based on the target valve angle and the number of target valves opened.
[0006] On the other hand, embodiments of this application provide a temperature control device for a liquid cooling system. The coolant circulation loop of the liquid cooling system includes a cold path and a hot path. The liquid flow distribution between the cold path and the hot path is adjusted by the valve angle of a thermostatic valve. The heat exchange front end of the cold path is equipped with multiple liquid cooling pumps, including: The control signal module is used to determine the pulse width change of the temperature control signal based on the temperature deviation between the current actual temperature and the desired temperature of the target device obtained in advance, through a proportional-integral-derivative control algorithm. The valve angle module is used to determine the target valve angle based on the relationship between the actual temperature and the desired temperature, the pulse width change, and the mapping relationship between the valve angle and the temperature control signal. The temperature drop parameter module is used to determine the change in the number of liquid cooling pumps based on the temperature drop rate deviation between the current actual temperature drop rate and the expected temperature drop rate of the target device, obtained in advance, through the proportional-integral-derivative control algorithm. The liquid cooling pump quantity module is used to determine the target number of liquid cooling pumps to be turned on based on the relationship between the actual temperature drop rate and the expected temperature drop rate, as well as the quantity change. The temperature control module is used to drive the temperature control of the target device according to the target valve angle and the number of target openings.
[0007] In another aspect, embodiments of this application provide a temperature control device for a liquid cooling system. The device includes a memory and a program or instructions stored in the memory and executable on a processor. When the program or instructions are executed by the processor, they implement a temperature control method for a liquid cooling system as provided in any of the embodiments of this application described above.
[0008] In another aspect, embodiments of this application provide a computer storage medium on which a program or instruction is stored. When the program or instruction is executed by a processor, it implements a temperature control method for a liquid cooling system as provided in any of the embodiments of this application described above.
[0009] In another aspect, embodiments of this application provide a computer program product in which instructions are executed by the processor of an electronic device, causing the electronic device to perform a temperature control method for a liquid cooling system as provided in any of the embodiments of this application described above.
[0010] This application discloses a temperature control method, apparatus, device, medium, and product for a liquid cooling system. Based on the temperature deviation between the actual and desired temperatures of the target equipment, it generates the pulse width variation of a temperature control signal using a proportional-integral-derivative (PID) control algorithm. Then, with the goal of bringing the target equipment temperature closer to the desired temperature, and combining the mapping relationship between valve angles and the temperature control signal, it determines the target valve angle, thereby regulating the liquid flow rate in the cold and hot circuits and driving the target equipment temperature towards the desired temperature. This application also obtains the temperature drop rate deviation by comparing the actual and desired temperature drop rates, and determines the change in the number of liquid cooling pumps using a PID control algorithm. With the goal of bringing the target equipment temperature drop rate closer to the desired temperature drop rate, and combining the data change, it determines the target number of pumps to be activated, thereby regulating the number of activated liquid cooling pumps and driving the target equipment temperature drop rate towards the desired temperature drop rate. In other words, this application uses a dual closed-loop control logic—temperature deviation driving valve angle regulation and temperature drop rate deviation driving liquid cooling pump quantity regulation—to ensure the matching of the target equipment temperature with the desired temperature and the stability of the temperature control process, thereby improving the temperature control accuracy of the liquid cooling system.
[0011] Furthermore, this application can also set the integral range and effective signal of the integral term corresponding to the temperature deviation / temperature drop rate deviation based on the integral term characteristics of the proportional-integral-derivative control algorithm in the dual closed-loop control logic, thereby constraining the cumulative effect of temperature deviation / temperature drop rate deviation and avoiding temperature overshoot and liquid cooling flow rate fluctuation caused by redundant accumulation of integral terms. Attached Figure Description
[0012] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0013] Figure 1 This is a schematic flowchart of a temperature control method for a liquid cooling system provided in an embodiment of this application; Figure 2 This is a schematic diagram of the actual temperature curve provided in the embodiments of this application; Figure 3 This is a flowchart illustrating the outer loop control logic provided in an embodiment of this application; Figure 4 This is a flowchart illustrating the anti-integral saturation logic provided in an embodiment of this application; Figure 5 This is a schematic diagram illustrating the principle of temperature control provided in an embodiment of this application; Figure 6 This is a schematic diagram of the structure of a temperature control device for a liquid cooling system provided in an embodiment of this application; Figure 7This is a schematic diagram of the structure of a temperature control device for a liquid cooling system provided in an embodiment of this application. Detailed Implementation
[0014] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.
[0015] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.
[0016] First, the terms and concepts involved in one or more embodiments of this application will be explained.
[0017] A liquid cooling system is a heat dissipation control system that uses coolant as the heat transfer medium and constructs a circulation loop to achieve heat absorption, transfer and dissipation. Its working principle is to transfer the heat generated by the target equipment to the coolant, and then dissipate the heat to the external environment through the circulation loop.
[0018] Coolant is the heat transfer medium used in liquid cooling systems to carry and transfer heat.
[0019] Heat dissipation equipment refers to the equipment in a liquid cooling system used to dissipate the heat carried by the coolant to the external environment, such as cooling radiators and plate heat exchangers.
[0020] The target device refers to the object to which the liquid cooling system dissipates heat.
[0021] The coolant circulation loop is a coolant channel in a liquid cooling system, consisting of pipes, valves, pumps, target equipment interfaces, heat dissipation equipment interfaces, etc., used to constrain the flow path of the coolant.
[0022] A thermostatic valve is a control element used in a liquid cooling system to regulate the circulation of coolant.
[0023] The valve angle refers to the angle between the valve and the valve seat reference plane in a thermostatic valve (with a value range of 0 degrees to 90 degrees), which is a parameter used to characterize the effective cross-sectional area of the coolant flow channel.
[0024] Liquid flow rate refers to the volume of coolant passing through the cross-section of the liquid cooling system's circulation loop per unit time.
[0025] The cold circuit refers to a branch circuit in the coolant circulation loop used to achieve the function of cooling and heat dissipation. It is usually connected in series with heat dissipation equipment. The coolant exchanges heat with the external environment in this circuit, releases the heat absorbed by the target equipment, cools down, and then flows back to the target equipment to complete the heat dissipation.
[0026] The hot circuit refers to a branch circuit in the coolant circulation loop used to maintain temperature or assist in heating. It usually does not pass through heat dissipation equipment. The coolant does not exchange heat in this circuit and maintains its original temperature state. By distributing the flow with the cold circuit, it prevents the target equipment temperature from becoming too low.
[0027] The heat exchange front end is the pipeline section and auxiliary components located in front of the heat dissipation equipment (heat exchange components) in the cold circuit of the liquid cooling system. It is the pre-channel for the coolant to enter the heat exchange process. The liquid cooling pump is configured here to directly drive the coolant into the heat exchange process, ensuring the response speed of heat dissipation regulation.
[0028] A liquid-cooled pump is a fluid transport device that provides power for the flow of coolant. It uses mechanical work to give the coolant kinetic energy, forming a directional and continuous flow in the circulation loop.
[0029] The Proportional-Integral-Derivative (PID) control algorithm calculates the control deviation between the current state and the desired state of the system, and performs coordinated calculations of the proportional (P), integral (I), and derivative (D) components of this deviation to generate an adjustment quantity, which is used to drive the actuator (such as adjusting the valve angle of the thermostat or changing the number of liquid cooling pumps that are turned on).
[0030] Temperature control signal refers to the electrical signal (usually a PWM signal) generated by the proportional-integral-derivative control algorithm to drive the thermostat valve. Its parameter changes (such as pulse width duty cycle) directly correspond to the adjustment command of the thermostat valve valve angle.
[0031] The pulse width change refers to the change in the duty cycle of the pulse width of the temperature control signal relative to the initial state or the previous moment (usually expressed as a percentage). It is calculated by the PID algorithm based on the temperature deviation, and the magnitude of the pulse width change characterizes the adjustment range of the valve angle.
[0032] A liquid cooling system is a heat dissipation system that uses a coolant as the heat transfer medium to transfer and dissipate the heat generated by a target device to the external environment. In many applications, the object being cooled requires high stability and accuracy of its operating temperature. Excessive temperature can lead to performance degradation, data distortion, or even shutdown and damage, while excessively low temperature can cause the coolant to solidify and equipment startup failures. Therefore, precise temperature control of the target device through a liquid cooling system is crucial to ensuring the equipment's operating efficiency and reliability.
[0033] Currently, temperature control of liquid cooling systems is generally achieved through a coolant circulation loop connecting the target device and the heat dissipation equipment. This involves monitoring the real-time temperature of the target device and using a thermostatic valve as the control element. By controlling the valve's angle, the circulation path or flow rate of the coolant is altered. However, this method, relying solely on the thermostatic valve for single-variable regulation, results in low temperature control accuracy.
[0034] To address the aforementioned technical problems, this application provides a temperature control method, apparatus, device, and computer program product based on a liquid cooling system. In the temperature control method for a liquid cooling system provided in this application embodiment, a dual-branch coolant circulation loop (cold and hot circuits) is constructed. The flow distribution of the cold / hot circuits is controlled by the angle of the thermostatic valve, and the liquid cooling flow rate of the coolant is adjusted by the number of liquid cooling pumps. This forms a dual closed-loop collaborative control logic that controls the valve angle for temperature deviation and the number of pumps for temperature drop rate deviation. Combined with a PID control algorithm, this drives the actual temperature towards the desired temperature and suppresses fluctuations during the temperature control process, thereby improving temperature control accuracy.
[0035] It should be noted that the application scenarios described in the above embodiments of this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided by the embodiments of this application. Those skilled in the art will understand that with the emergence of new application scenarios, the technical solutions provided by the embodiments of this application are also applicable to similar technical problems. The temperature control method for a liquid cooling system provided in the embodiments of this application can be applied to various application scenarios that require precise temperature control.
[0036] The following describes a temperature control method for a liquid cooling system provided in an embodiment of this application. In practical applications, the executing entity of the temperature control method for a liquid cooling system in this embodiment can be a terminal device, such as a desktop computer, a laptop computer, or a remote device similar to a server. Of course, the executing entity in this embodiment can also be a software entity, such as a client or software program installed on a terminal device. The specific type of executing entity corresponding to the technical solution provided in this embodiment is not strictly limited here. It can be flexibly selected according to the actual application scenario and actual needs. For example, in this application, a temperature controller can be used to control the liquid cooling system to achieve temperature control, and the controlled objects are the valve angle of the thermostatic valve and the number of liquid cooling pumps opened.
[0037] The following describes specific embodiments of a temperature control method, apparatus, electronic device, storage medium, and computer program product for a liquid cooling system provided in this application. First, a temperature control method for a liquid cooling system is described.
[0038] Figure 1 A schematic flowchart illustrating a temperature control method for a liquid cooling system according to an embodiment of this application is shown. Figure 1 As shown, the coolant circulation loop of the liquid cooling system includes a cold circuit and a hot circuit. The liquid flow distribution of the cold circuit and the hot circuit is regulated by the valve angle of the thermostatic valve. Multiple liquid cooling pumps are configured at the heat exchange front end of the cold circuit. The temperature control method of the liquid cooling system includes steps S100 to S104.
[0039] S100: Based on the temperature deviation between the current actual temperature and the desired temperature of the target device obtained in advance, the pulse width change of the temperature control signal is determined through a proportional-integral-derivative control algorithm.
[0040] S101: Determine the target valve angle based on the relationship between the actual temperature and the desired temperature, the pulse width change, and the mapping relationship between the valve angle and the temperature control signal.
[0041] In one or more embodiments of this application, in order to accurately control the liquid flow distribution in the cold and hot circuits through the target valve angle in subsequent steps, so that the coolant circulation state conforms to the temperature control requirements of the desired temperature, driving data is provided for the temperature loop. In steps S100 and S101, this application needs to determine the pulse width change of the temperature control signal based on the temperature deviation between the actual temperature and the desired temperature through a PID control algorithm, and adjust the valve angle of the thermostatic valve based on the pulse width change.
[0042] Specifically, this application determines the temperature deviation based on the pre-obtained actual temperature of the target device and the preset desired temperature. If the desired temperature of the target device is not a fixed value, the current desired temperature in the desired temperature curve needs to be obtained. This temperature deviation is input into the PID control algorithm, and the pulse width change is obtained through proportional, integral, and derivative operations. Based on this pulse width change and the relationship between the actual temperature and the desired temperature, the current temperature control signal is determined, and the target valve angle is determined according to the mapping relationship between the valve angle and the temperature control signal.
[0043] It should be noted that, in order to achieve temperature control of the target equipment by adjusting the valve angle of the thermostat based on temperature deviation within a temperature loop (outer loop), this application requires prior acquisition of the target equipment's current actual temperature. This application does not limit the method of acquiring the actual temperature; it can be set according to actual needs. For example, the actual temperature of the target equipment can be collected in real time using temperature sensors deployed on the target equipment or its main heat-generating areas, and then transmitted to a server, temperature controller, or other actuators after analog-to-digital conversion. This application does not specifically limit the type and acquisition frequency of the temperature sensor; they can be flexibly selected based on the temperature control accuracy and the target equipment's operating temperature range to ensure the accuracy and stability of temperature acquisition. This application does not limit the specific form of the temperature control signal; it can be set according to actual needs, such as pulse width duty cycle (e.g., 28V PWM wave), and the temperature control signal can be transmitted via discrete commands and a communication bus. The larger the valve angle biased towards the cold circuit, the larger the cross-sectional area of the coolant flowing through the cold circuit, and the greater the flow rate of coolant through the pipes in the cold circuit. Similarly, the larger the valve angle biased towards the hot circuit, the larger the cross-sectional area of the coolant flowing through the hot circuit, and the greater the flow rate of coolant through the pipes in the hot circuit. In other words, the distribution of liquid flow between the cold and hot circuits is controlled by the valve angle of the thermostatic valve, thereby achieving temperature control. This application does not limit the range of valve angle values; it can be set according to actual needs. For example, the valve angle range can be 0 degrees to 90 degrees, and when the valve angle is 0 degrees, the thermostatic valve is in the fully open state for the cold circuit; when the valve angle is 90 degrees, the thermostatic valve is in the fully open state for the hot circuit.
[0044] In equations (1), (2) and (3), This refers to the actual temperature. The desired temperature; This refers to temperature deviation. This refers to the change in pulse width. This is the proportionality coefficient; The integral coefficient; These are the differential coefficients; For immediate response deviation; This is the integral term representing the cumulative effect of temperature deviation; This represents the rate of change of temperature deviation. For the target valve angle; This is the initial valve angle (e.g., set to 45 degrees) or the valve angle at the previous moment; For conversion factors, such as calculating every 20ms and The high output ratio of the screen (pulse width duty cycle), then That is, 20; The duty cycle of the cooling circuit PWM signal in the temperature control signal; This represents the duty cycle of the thermal PWM signal in the temperature control signal. A value of 1 indicates that the valve is in the fully open cold circuit state, at which point the valve angle is 0 degrees. A value of 1 indicates that the hot circuit is fully open, at which point the valve angle is 90 degrees.
[0045] In order to accurately match the temperature control requirements, realize the directional distribution of liquid flow between the cold and hot circuits, and ensure the accuracy and stability of the outer loop temperature control, in one or more embodiments of this application, this application can determine the target temperature control signal based on the relationship between the actual temperature and the desired temperature, as well as the pulse width change, and then determine the target valve angle corresponding to the target temperature control signal based on the mapping relationship between the valve angle and the temperature control signal.
[0046] Based on the relationship between the actual temperature and the desired temperature, and the pulse width variation, a target temperature control signal is determined to drive the target equipment temperature to approach the desired temperature. This includes: when the actual temperature is greater than the desired temperature, a target temperature control signal is determined based on the pulse width variation to adjust the valve angle of the thermostat valve to open towards the cold path; when the actual temperature is less than the desired temperature, a target temperature control signal is determined based on the pulse width variation to adjust the valve angle of the thermostat valve to open towards the hot path; when the actual temperature is equal to the desired temperature, the temperature deviation is zero, and the current valve angle is maintained.
[0047] S102: Based on the temperature drop rate deviation between the current actual temperature drop rate and the expected temperature drop rate of the target device obtained in advance, the change in the number of liquid cooling pumps is determined through the proportional-integral-derivative control algorithm.
[0048] S103: Determine the target number of liquid cooling pumps to be turned on based on the relationship between the actual temperature drop rate and the expected temperature drop rate, as well as the change in quantity.
[0049] In one or more embodiments of this application, in order to precisely control the liquid cooling flow rate of the coolant by the target number of pumps activated in subsequent steps, so that the coolant circulation state conforms to the temperature control requirements of the desired temperature drop rate, driving data is provided for the temperature drop rate loop. In steps S102 and S103, this application needs to determine the change in the number of liquid cooling pumps based on the temperature deviation between the actual temperature drop rate and the desired temperature drop rate using a PID control algorithm, and adjust the number of liquid cooling pumps activated based on this change in number.
[0050] Specifically, this application determines the temperature drop rate deviation based on the pre-obtained actual temperature drop rate of the target device and the preset expected temperature drop rate (if the expected temperature drop rate of the target device is not a fixed value, the current expected temperature drop rate in the expected temperature drop rate curve needs to be obtained). This temperature drop rate deviation is input into the PID control algorithm, and the change in the number of liquid cooling pumps is obtained through proportional, integral, and derivative operations. Based on this change in number, and combined with the relationship between the actual temperature drop rate and the expected temperature drop rate, the current target number of pumps to be activated is determined.
[0051] It should be noted that, in order to adjust the number of liquid cooling pumps based on the temperature rate deviation within the temperature rate loop (inner loop) to achieve temperature control of the target equipment, this application requires prior acquisition of the target equipment's current actual temperature rate drop. This application does not limit the method of acquiring the actual temperature rate drop; it can be set according to actual needs, such as by continuously collecting multiple actual temperatures to measure the current temperature change trend of the target equipment and obtain the target equipment's current actual temperature rate drop. In one or more embodiments of this application, after starting the liquid cooling system, the actual temperature of the target equipment needs to be collected in real time, and the actual temperature of the target equipment over time needs to be recorded, generating an actual temperature curve; the slope of the tangent line of the actual temperature curve at the current acquisition time, or the slope of the line connecting the actual temperatures corresponding to the previous acquisition time and the current acquisition time, is determined as the target equipment's current actual temperature rate drop.
[0052] Figure 2 A schematic diagram of the actual temperature curve provided in this application embodiment is shown in the figure. This actual temperature curve records three data points: A, B, and C. The horizontal axis represents the time change (in seconds) after the liquid cooling system is started, and the vertical axis represents the actual temperature. This application is based on A(0, B (8, ) and C(15, Three data points were collected to construct the actual temperature curve, as shown by the dashed line in the figure. This application does not limit the specific method for determining the actual temperature drop rate; it can be set according to actual needs. For example, the slope of AB... , as the actual rate of temperature drop at point B; the slope of BC Let C be the actual rate of temperature drop at point C; assuming point D represents the current moment, then the slope from C to D at the previous moment can be used as the reference point. The actual temperature drop rate at point D can be determined as the actual temperature drop rate at point D. Alternatively, the slope of the tangent at point D can be determined based on the actual temperature curve, which can then be used as the actual temperature drop rate at point D. Furthermore, this application can also obtain the desired temperature curve (shown as the solid line in the figure) before the liquid cooling system is started, and compare and demonstrate the process of driving the target device temperature to conform to the desired temperature through the dual closed-loop temperature control architecture.
[0053] Under otherwise unchanged conditions, the number of liquid cooling pumps activated is positively correlated with the liquid cooling flow rate of the coolant, and the temperature drop rate is also positively correlated with the liquid cooling flow rate. That is, the more liquid cooling pumps activated and the higher the liquid cooling flow rate, the higher the temperature drop rate. In other words, the liquid cooling flow rate of the coolant is controlled by adjusting the number of liquid cooling pumps activated, thereby controlling the temperature drop rate. This application does not limit the initial and total number of liquid cooling pumps activated; these can be set according to actual needs, such as setting the initial activation number to 1 and the total number to 4. To accurately match the temperature drop rate control requirements and achieve directional control of the liquid cooling flow rate, ensuring the accuracy and stability of the inner ring temperature drop rate, in one or more embodiments of this application, in response to the actual temperature drop rate exceeding the desired temperature drop rate, a reduction in the number of liquid cooling pumps activated is determined, and based on the increased number of liquid cooling pumps activated, a target activation number for controlling the reduction in liquid cooling flow rate is determined; that is, the number of liquid cooling pumps activated is reduced according to the change in quantity, and the reduction is equal to the change in quantity. In response to the actual temperature drop rate being less than the expected temperature drop rate, the number of liquid cooling pumps to be activated is determined, and based on the decrease in the number of liquid cooling pumps activated, a target number of pumps to be activated to regulate the increase in liquid cooling flow rate is determined; that is, the number of liquid cooling pumps activated is increased according to the change in quantity, and the increase in quantity is equal to the change in quantity. When the actual temperature drop rate equals the expected temperature drop rate, the temperature drop rate deviation is zero, and the current number of pumps activated is maintained.
[0054] S104: Drive the temperature control of the target device according to the target valve angle and the number of target openings.
[0055] In one or more embodiments of this application, the thermostat and the liquid cooling pump in the liquid cooling system can be adjusted according to the target valve angle and the target number of openings to drive the temperature control of the target device. The temperature controller can incorporate a temperature control model that controls the liquid cooling flow rate and valve angle to regulate temperature control components involved in the inner and outer loops, such as thermostat valves.
[0056] In the above-mentioned temperature control method for liquid cooling system, the temperature control of liquid cooling system in this application is divided into two links: temperature loop and temperature drop rate loop, so as to achieve accurate and stable temperature control through the cooperative architecture of temperature loop and temperature drop rate loop.
[0057] In step S101, this application defines the temperature deviation as a directed parameter. For example, the positive direction indicates the actual temperature is greater than the desired temperature, and the corresponding pulse width adjustment direction is to increase the pulse width duty cycle of the cold path. The negative direction indicates the actual temperature is less than the desired temperature, and the corresponding pulse width adjustment direction is to increase the pulse width duty cycle of the hot path. That is, this application can determine the pulse width adjustment direction based on the relationship between the actual temperature and the desired temperature to directionally regulate the temperature control signal and achieve temperature control of the outer loop. In one or more embodiments of this application, this application can determine the pulse width adjustment direction of the coolant circulation loop based on the relationship between the actual temperature and the desired temperature, and adjust the current temperature control signal of the coolant circulation loop according to the pulse width adjustment direction and the amount of pulse width change to obtain the target temperature control signal.
[0058] This application does not limit the physical meaning of the pulse width adjustment direction; it can be set according to actual needs. Following the example of step S101, when... A value of 1 indicates that the valve is in the fully open cold circuit state, at which point the valve angle is 0 degrees. A value of 1 indicates that the hot circuit is fully open, at which point the valve angle is 90 degrees. That is, the larger the pulse width duty cycle, the more the corresponding branch of the coolant circulation loop tends to be fully open. Therefore, in one or more embodiments of this application, when the actual temperature is lower than the desired temperature, the duty cycle of the temperature control signal corresponding to the cold circuit will be reduced, and the duty cycle of the temperature control signal corresponding to the hot circuit will be increased, as the direction of pulse width adjustment. Similarly, when the actual temperature is higher than the desired temperature, the duty cycle of the temperature control signal corresponding to the cold circuit will be increased, and the duty cycle of the temperature control signal corresponding to the hot circuit will be decreased, as the direction of pulse width adjustment.
[0059] Figure 3 This is a flowchart illustrating the outer loop control logic provided in an embodiment of this application, as shown below. Figure 3 As shown, the outer loop control logic includes steps S300 to S315, as follows: S300: Liquid cooling system starts up, obtains the desired temperature that the liquid cooling system needs to meet.
[0060] S301: Obtain the current valve angle or temperature control signal of the thermostatic valve.
[0061] S302: Determine the coolant circulation loop status of the cold and hot circuits based on the current valve angle or temperature control signal.
[0062] S303: Determine whether the coolant circulation loop is in the fully open state.
[0063] For example, when If the current valve angle is 0 degrees, the coolant circulation loop is in the fully open state, and step S304 is executed; if the coolant circulation loop is not in the fully open state, step S307 is executed.
[0064] S304: Determine whether the actual temperature is greater than the current expected temperature; If yes, proceed to step S305; otherwise, proceed to step S306.
[0065] S305: Maintain the current valve angle to keep the cold circuit fully open.
[0066] S306: Adjust the valve angle at a preset rate of change to rotate the thermostat valve in the hot circuit.
[0067] After executing steps S305 and S306, the actual temperature after adjustment needs to be collected in real time, so that the temperature control result can be output when the actual temperature is consistent with the expected temperature (the deviation is within the preset range).
[0068] S307: Determine whether the coolant circulation loop is in the hot-circuit fully open state.
[0069] For example, when If the current valve angle is 90 degrees, the coolant circulation loop is in a fully open hot circuit state, and step S309 is executed; if the coolant circulation loop is not in a fully open hot circuit state, then step S311 is executed.
[0070] S308: Determine if the actual temperature is lower than the current expected temperature; If yes, proceed to step S309; otherwise, proceed to step S310.
[0071] S309: Maintain the current valve angle to keep the hot circuit fully open.
[0072] S310: Adjust the valve angle at a preset rate of change to rotate the thermostat valve in the cold circuit.
[0073] After executing steps S309 and S310, the actual temperature after adjustment needs to be collected in real time, so that the temperature control result can be output when the actual temperature is consistent with the expected temperature (the deviation is within the preset range).
[0074] S311: Determine whether the coolant circulation loop is not in a fully open cold circuit or a fully open hot circuit.
[0075] For example, when and If none of the values are equal to 1, or if the current valve angle is between 0 and 90 degrees, the coolant circulation loop is not in the fully open cold circuit or fully open hot circuit state, and step S312 is executed; if the coolant circulation loop is in the fully open hot circuit or fully open cold circuit state, then return to step S303.
[0076] S312: Determine whether the actual temperature is greater than the current expected temperature; If yes, proceed to step 313; otherwise, proceed to step 314.
[0077] S313: Adjust the valve angle at a preset rate of change to rotate the thermostat valve in the cold circuit.
[0078] S314: Determine whether the actual temperature is lower than the current expected temperature; If yes, proceed to step 315; otherwise, return to step 307.
[0079] S315: Adjust the valve angle at a preset rate of change to rotate the thermostat valve in the hot circuit.
[0080] After executing steps S313 and S315, the actual temperature after adjustment needs to be collected in real time, so that the temperature control result can be output when the actual temperature is consistent with the expected temperature (the deviation is within the preset range).
[0081] Furthermore, to avoid integral saturation caused by excessive accumulation of the integral term in the temperature loop PID control, and to prevent excessive pulse width change output from causing large fluctuations in the valve angle, thereby avoiding temperature overshoot or decreased temperature control stability of the target equipment and ensuring the accuracy and stability of the temperature control signal output, this application can specifically optimize the constraint logic of the temperature deviation integral term. Specifically, in one or more embodiments of this application, a first integral range and a first valid signal for the cumulative effect integral term of the temperature deviation can be set. Under the constraints of the first integral range and the first valid signal, the pulse width change is determined based on the temperature deviation using a proportional-integral-derivative (PID) control algorithm.
[0082] Similarly, to avoid integral saturation caused by excessive accumulation of the integral term in the PID control of the temperature drop rate loop, and to prevent frequent activation of the liquid cooling pump due to calculation distortion of the quantity change, thereby avoiding temperature drop fluctuations caused by sudden changes in liquid cooling flow rate and ensuring the stability of liquid cooling pump regulation, this application can adopt an integral term constraint strategy consistent with the temperature loop. That is, in one or more embodiments of this application, a second integral range and a second effective signal of the integral term of the cumulative effect of the temperature drop rate can be set, so that under the constraint of the second integral range and the second effective signal, the quantity change can be determined according to the temperature drop rate deviation through a proportional-integral-derivative control algorithm.
[0083] It should be noted that the first and second valid signals are used to eliminate the integral term in the PID control algorithm. This application does not limit the specific implementation of these valid signals, such as through hardware logic level signals, software instruction flags, status fields in communication protocol frames, or timer trigger signals. Essentially, it controls whether the integral term participates in the PID calculation by activating / disabling logic to avoid integral residue or excessive accumulation. In one or more embodiments of this application, a constant coefficient for the integral term can be additionally set. As a valid signal, this constant coefficient is set to 1 when the liquid cooling system is running to retain the integral term; when the liquid cooling system is stopped, this constant coefficient is set to 0 to remove the integral term. The first and second integral ranges are used to constrain the range of action of the integral term. By setting the upper and lower limits of the integral term, the continuous accumulation of the integral term when the deviation is too large or in the nonlinear region is prevented, effectively suppressing the integral saturation phenomenon.
[0084] Figure 4 This is a flowchart illustrating the anti-integral saturation logic provided in an embodiment of this application. Figure 4 As shown, the execution process of this anti-integral saturation logic includes steps S400 to S408: S400: Is the liquid cooling system running? If yes, proceed to step S401; if no, proceed to step S402.
[0085] S401: Set the constant coefficient to 1.
[0086] S402: Set the constant coefficient to 0 to switch from PID control to PD control.
[0087] Under the constraint of the integral range (from the lower integral limit to the upper integral limit), the output magnitude of the PID control algorithm is adjusted: S403: Is the integral term less than the lower limit of integration? If yes, proceed to step S404; if no, proceed to step S405.
[0088] S404: The integral term is output according to the lower limit of integration.
[0089] S405: Is the integral term greater than the upper limit of integration? If yes, proceed to step S406; if no, proceed to step S407.
[0090] S406: The integral term is output according to the upper limit of the integral.
[0091] S407: Directly output the integral term.
[0092] S408: Temperature control completed.
[0093] Since the liquid cooling flow rate is a direct influencing factor on the temperature drop rate, in one or more embodiments of this application, this application establishes a quantitative correlation between the number of liquid cooling pumps, the liquid cooling flow rate, and the temperature drop rate, so as to clarify the mapping relationship between the valve angle and the temperature control signal, and the mapping relationship between the number of liquid cooling pumps turned on and the temperature drop rate.
[0094] The mapping relationship between the calibrated valve angle and the temperature control signal is as follows: First, based on the cross-sectional area of the coolant flowing through the thermostatic valve, the time it takes for the coolant to circulate through the coolant loop, and the pipe length, a first correspondence is established between the liquid flow rate and the temperature deviation. Second, based on this first correspondence and the difference between the cross-sectional areas of the coolant flowing through the cold and hot circuits, a second correspondence is established between the temperature drop rate and the valve angle. Finally, based on this second correspondence, the mapping relationship between the valve angle and the temperature control signal is pre-calibrated. In other words, this application calibrates the mapping relationship between the valve angle and the temperature control signal by establishing the correspondence between the liquid flow rate, valve angle, and temperature deviation. Furthermore, by adjusting the valve angle of the liquid cooling system, the cross-sectional area of the pipes in the hot / cold circuits is adjusted, thereby achieving temperature control of the target equipment.
[0095] Assume a basic temperature drop rate of a liquid cooling pump (in units of...) V1 is the base temperature drop rate of two liquid cooling pumps (V2 > V1). By increasing the number of liquid cooling pumps, the total flow rate is increased, thereby improving the heat dissipation capacity. V3 is the base temperature drop rate of three liquid cooling pumps (V3 > V2), and so on.
[0096] In equations (4) to (7), For liquid flow rate; This refers to the liquid cooling flow rate; This is the cross-sectional area through which the coolant passes in the thermostat valve. This refers to the cross-sectional area through which the coolant passes in the cold circuit piping. This is the cross-sectional area of the coolant in the hot-running pipe; Let be the radius of the valve through which the coolant can pass. Equation (5) characterizes the first correspondence between liquid flow rate and temperature deviation; This represents the actual rate of temperature drop. This refers to the length of the pipe. The diameter of the pipe; This refers to the time it takes for the coolant to flow through the coolant circulation loop. The density of the coolant; fThe Darcy friction factor describes the frictional losses in pipe flow and open channel flow. Equation (7) characterizes the second correspondence between the temperature drop rate and the valve angle. The physical meanings of other parameters will not be elaborated here; please refer to the relevant explanations in steps S100 and S101.
[0097] The mapping relationship between the number of liquid cooling pumps activated and the rate of temperature drop is as follows: According to the pressure drop formula of the liquid cooling system (such as the Darcy-Weisbach formula), substituting into equation (5), the mapping relationship between pressure drop and liquid cooling flow rate can be obtained, namely equation (8). Since the number of liquid cooling pumps turned on is a direct factor affecting pressure drop, and pressure drop is related to liquid cooling flow rate, this application can control the temperature drop rate of the target equipment by adjusting the number of liquid cooling pumps turned on.
[0098] For example, the operating temperature of the liquid cooling system is set to 25°C, the coolant type is AF65, and the coolant density is 1.08g / L. The pipeline is 10m long, 0.25m in diameter, has a valve passage radius of 0.1m, and a Darcy friction coefficient of 0.079. The liquid cooling pump is not in its limit state (operating normally). Under continuous coolant flow conditions, the temperature change is as follows: when N (number of liquid cooling pumps operating) = 1, ΔT = 5℃; when N = 2, ΔT = 8.5℃; when N = 3, ΔT = 10℃. The relationship between the liquid cooling pump and pressure drop is as follows: When a pump is turned on and N=1, the parameter values are integrated and substituted into the pressure drop formula to calculate ΔP1 as 43628 Pa. When two pumps are turned on, and N=2, ΔP2 is 126085 Pa. When three pumps are turned on, and N=3, ΔP3 is 174512 Pa. That is, as the number N of liquid cooling pumps turned on gradually increases, the pressure gradually increases; and the pressure drop is related to the liquid cooling flow rate. As the number of liquid cooling pumps turned on increases, the pressure gradually increases, and the liquid cooling flow rate also gradually increases. This application can induce a pressure drop between the coolant tank and the cooling pipes by changing the number of liquid cooling pumps turned on, thereby controlling the liquid flow rate by changing the pressure drop and achieving temperature drop rate control in the inner loop.
[0099] According to this embodiment, the control logic of the liquid cooling system of this application is to increase the number of pumps turned on in the liquid pump load cold circuit, increase the bus pressure, thereby increasing the liquid cooling flow rate and the heat exchange rate of the coolant, and accelerating the temperature drop rate; conversely, reducing the number of pumps turned on in the cold circuit can reduce the bus pressure, thereby reducing the coolant flow rate and the heat exchange rate of the coolant, and reducing the temperature drop rate.
[0100] It should be noted that this application does not limit the method of acquiring parameters such as coolant tank level, coolant tank pressure, and current valve angle. For example, parameter values can be acquired through various sensors, such as valve angle controllers, valve position sensors for acquiring valve angles, pressure sensors for determining coolant tank pressure based on the number of liquid cooling pumps opened and the liquid cooling flow rate, and level sensors for determining liquid level based on the number of liquid cooling pumps opened and the liquid cooling flow rate.
[0101] Figure 5 A schematic diagram illustrating the principle of temperature control provided in this application embodiment, as shown below. Figure 5 As shown, this application acquires the pressure of the coolant tank through pressure sensor 501; acquires the coolant tank level through level sensor 502; acquires the actual temperature of the target equipment through temperature sensor 503; and acquires the valve angle through valve position sensor 504, thereby determining the actual temperature drop rate. This application can then determine the temperature control strategy based on the dual closed-loop temperature control architecture, using temperature controller 505 to determine the temperature control strategy based on various parameters, thus achieving temperature control and temperature drop rate control of the target equipment. Specifically, the temperature loop's control logic is based on the temperature deviation between the actual and desired temperatures, outputting the pulse width change of the thermostat's temperature control signal to control the valve angle and change the liquid flow rate of the liquid cooling system, thereby achieving directional temperature control of the target equipment. The temperature drop rate loop's control logic is based on the temperature drop rate deviation between the actual and desired temperature drop rates, outputting the change in the number of liquid cooling pumps, and controlling the number of liquid cooling pumps activated based on the data change, thereby changing the liquid cooling flow rate / liquid flow rate, thus achieving precise control of the temperature fluctuation of the target equipment.
[0102] Based on the above-described temperature control method for a liquid cooling system, this application also provides a specific embodiment of a temperature control device for a liquid cooling system.
[0103] like Figure 6 As shown, Figure 6 This is a schematic diagram of a temperature control device for a liquid cooling system provided in an embodiment of this application. The device 600 includes a control signal module 601, a valve angle module 602, a temperature drop parameter module 603, a liquid cooling pump quantity module 604, and a temperature control module 605.
[0104] The control signal module is used to determine the pulse width change of the temperature control signal based on the temperature deviation between the current actual temperature and the desired temperature of the target device, using a proportional-integral-derivative control algorithm. The valve angle module is used to determine the target valve angle based on the relationship between the actual temperature and the desired temperature, the pulse width change, and the mapping relationship between the valve angle and the temperature control signal. The temperature drop parameter module is used to determine the change in the number of liquid cooling pumps based on the temperature drop rate deviation between the current actual temperature drop rate and the expected temperature drop rate of the target device, obtained in advance, through the proportional-integral-derivative control algorithm. The liquid cooling pump quantity module is used to determine the target number of liquid cooling pumps to be turned on based on the relationship between the actual temperature drop rate and the expected temperature drop rate, as well as the quantity change. The temperature control module is used to drive the temperature control of the target device according to the target valve angle and the number of target openings.
[0105] In one feasible implementation, the valve angle module is specifically used to determine a target temperature control signal based on the relationship between the actual temperature and the desired temperature, as well as the pulse width change; and to determine the target valve angle corresponding to the target temperature control signal based on the mapping relationship between the valve angle and the temperature control signal.
[0106] In one feasible implementation, the valve angle module is specifically used to determine the pulse width adjustment direction of the coolant circulation loop based on the relationship between the actual temperature and the desired temperature; and to adjust the current temperature control signal of the coolant circulation loop based on the pulse width adjustment direction and the pulse width change to obtain the target temperature control signal.
[0107] In one feasible implementation, the valve angle module is specifically used to, when the actual temperature is less than the desired temperature, reduce the duty cycle of the temperature control signal corresponding to the cold circuit and increase the duty cycle of the temperature control signal corresponding to the hot circuit as the pulse width adjustment direction; when the actual temperature is greater than the desired temperature, increase the duty cycle of the temperature control signal corresponding to the cold circuit and decrease the duty cycle of the temperature control signal corresponding to the hot circuit as the pulse width adjustment direction.
[0108] In one feasible implementation, the control signal module is specifically used to set a first integral range and a first effective signal for the cumulative effect integral term of the temperature deviation; under the constraints of the first integral range and the first effective signal, the pulse width change is determined according to the temperature deviation using a proportional-integral-derivative control algorithm.
[0109] In one feasible implementation, the liquid cooling pump quantity module is specifically configured to: determine an increase in the number of liquid cooling pumps to be turned on in response to the actual temperature drop rate being less than the expected temperature drop rate; determine a decrease in the number of liquid cooling pumps to be turned on in response to the actual temperature drop rate being greater than the expected temperature drop rate; and determine the target number of pumps to be turned on based on the increase or decrease in the number of liquid cooling pumps to be turned on.
[0110] In one feasible implementation, the control signal module is specifically used to determine a first correspondence between the liquid flow rate and the temperature deviation based on the cross-sectional area through which the coolant passes in the thermostatic valve, the time the coolant spends flowing through the coolant circulation loop, and the pipe length; to determine a second correspondence between the temperature drop rate and the valve angle based on the first correspondence and the difference between the cross-sectional area through which the coolant passes in the cold circuit pipe and the cross-sectional area through which the coolant passes in the hot circuit pipe; and to calibrate the mapping relationship between the valve angle and the temperature control signal based on the second correspondence.
[0111] In one feasible implementation, the data acquisition module is specifically used to acquire the actual temperature of the target device over time after the liquid cooling system is turned on, and generate an actual temperature curve; determine the tangent slope of the actual temperature curve at the current acquisition time, or the slope of the line connecting the actual temperature at the previous acquisition time and the current acquisition time, as the current actual temperature drop rate of the target device.
[0112] In one feasible implementation, the temperature drop parameter module is specifically used to set a second integral range and a second effective signal for the cumulative effect integral term of the temperature drop rate; under the constraints of the second integral range and the second effective signal, the quantity change is determined according to the temperature drop rate deviation by a proportional-integral-derivative control algorithm.
[0113] Figure 7 A schematic diagram of the hardware structure of the temperature control device for the liquid cooling system provided in this application embodiment is shown.
[0114] The temperature control device in a liquid cooling system may include a processor 701 and a memory 702 storing computer program instructions.
[0115] Specifically, the processor 701 may include a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits that can be configured to implement the embodiments of this application.
[0116] Memory 702 may include mass storage for data or instructions. For example, and not limitingly, memory 702 may include a hard disk drive (HDD), floppy disk drive, flash memory, optical disk, magneto-optical disk, magnetic tape, or Universal Serial Bus (USB) drive, or a combination of two or more of these. Where appropriate, memory 702 may include removable or non-removable (or fixed) media. Where appropriate, memory 702 may be internal or external to the integrated gateway disaster recovery device. In a particular embodiment, memory 702 is non-volatile solid-state memory.
[0117] In a specific embodiment, the memory 702 can be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 702 can store the operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 702 and is called and executed by the processor 701. The processor 701 reads and executes the computer program instructions stored in the memory 702 to implement any of the temperature control methods of the liquid cooling system in the above embodiments.
[0118] In one example, the temperature control device for the liquid cooling system may further include a communication interface 703 and a bus 710. For example, Figure 7 As shown, the processor 701, memory 702, and communication interface 703 are connected through bus 710 and complete communication with each other.
[0119] The communication interface 703 is mainly used to realize communication between various modules, devices, units and / or equipment in the embodiments of this application.
[0120] Bus 710 includes hardware, software, or both, that couples components of an online data traffic metering device together. For example, and not limitingly, the bus may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), HyperTransport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an Infinite Bandwidth Interconnect, a Low Pin Count (LPC) bus, a memory bus, a Microchannel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local (VLB) bus, or other suitable buses, or combinations of two or more of these. Where appropriate, bus 710 may include one or more buses. Although specific buses are described and illustrated in embodiments of this application, any suitable bus or interconnect is contemplated herein.
[0121] The temperature control device of this liquid cooling system can execute the temperature control method of the liquid cooling system in this application embodiment based on the temperature deviation and the temperature drop rate deviation, thereby achieving a combination of Figure 1 The temperature control method for the liquid cooling system is described.
[0122] Furthermore, in conjunction with the temperature control method for the liquid cooling system described in the above embodiments, this application embodiment can provide a computer storage medium for implementation. This computer storage medium stores computer program instructions; when these computer program instructions are executed by a processor, they implement any of the temperature control methods for the liquid cooling system described in the above embodiments.
[0123] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transfer medium that can be used to store information accessible by a computing device.
[0124] The computer instructions stored in the storage medium of the above embodiments are used to cause the computer to execute the temperature control method of the liquid cooling system as described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.
[0125] This application also provides a computer program product, including a computer program that, when executed, implements a temperature control method for any of the liquid cooling systems described in the above embodiments.
[0126] It should be clarified that this application is not limited to the specific configurations and processes described above and shown in the figures. For the sake of brevity, detailed descriptions of known methods are omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of this application is not limited to the specific steps described and shown. Those skilled in the art can make various changes, modifications, and additions, or change the order of steps, after understanding the spirit of this application.
[0127] The functional blocks shown in the above-described structural diagram can be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, they can be, for example, electronic circuits, application-specific integrated circuits (ASICs), appropriate firmware, plug-ins, function cards, etc. When implemented in software, the elements of this application are programs or code segments used to perform the required tasks. Programs or code segments can be stored on a machine-readable medium or transmitted over a transmission medium or communication link via data signals carried on a carrier wave. "Machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, fiber optic media, radio frequency (RF) links, etc. Code segments can be downloaded via computer networks such as the Internet, intranets, etc.
[0128] It should also be noted that the exemplary embodiments mentioned in this application describe methods or systems based on a series of steps or apparatus. However, this application is not limited to the order of the above steps; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.
[0129] The aspects of this disclosure have been described above with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this disclosure. It should be understood that each block in the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine such that these instructions, executable via the processor of the computer or other programmable data processing apparatus, enable the implementation of the functions / actions specified in one or more blocks of the flowchart illustrations and / or block diagrams. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor, or a field-programmable logic circuit. It is also understood that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can also be implemented by special-purpose hardware performing the specified functions or actions, or can be implemented by a combination of special-purpose hardware and computer instructions.
[0130] The above description is merely a specific implementation of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.
Claims
1. A temperature control method for a liquid cooling system, characterized in that, The coolant circulation loop of the liquid cooling system includes a cold circuit and a hot circuit. The liquid flow distribution between the cold circuit and the hot circuit is controlled by the valve angle of a thermostatic valve. Multiple liquid cooling pumps are configured at the heat exchange front end of the cold circuit. The method includes: Based on the temperature deviation between the current actual temperature and the desired temperature of the target device obtained in advance, the pulse width change of the temperature control signal is determined by the proportional-integral-derivative control algorithm. The target valve angle is determined based on the relationship between the actual temperature and the desired temperature, the pulse width change, and the mapping relationship between the valve angle and the temperature control signal. Based on the temperature drop rate deviation between the current actual temperature drop rate and the expected temperature drop rate of the target device obtained in advance, the change in the number of liquid cooling pumps is determined through the proportional-integral-derivative control algorithm. Based on the relationship between the actual temperature drop rate and the expected temperature drop rate, as well as the change in quantity, the target number of liquid cooling pumps to be turned on is determined. The temperature control of the target device is driven based on the target valve angle and the number of target valves opened.
2. The method according to claim 1, characterized in that, Based on the relationship between the actual temperature and the desired temperature, the pulse width change, and the mapping relationship between the valve angle and the temperature control signal, the target valve angle is determined, including: The target temperature control signal is determined based on the relationship between the actual temperature and the desired temperature, as well as the pulse width change. Based on the mapping relationship between the valve angle and the temperature control signal, the target valve angle corresponding to the target temperature control signal is determined.
3. The method according to claim 2, characterized in that, Based on the relationship between the actual temperature and the desired temperature, and the pulse width variation, a target temperature control signal is determined, including: Based on the relationship between the actual temperature and the desired temperature, the pulse width adjustment direction of the coolant circulation loop is determined; Based on the pulse width adjustment direction and the pulse width change, the current temperature control signal of the coolant circulation loop is adjusted to obtain the target temperature control signal.
4. The method according to claim 3, characterized in that, Based on the relationship between the actual temperature and the desired temperature, the pulse width adjustment direction of the coolant circulation loop is determined, including: When the actual temperature is less than the desired temperature, the duty cycle of the temperature control signal corresponding to the cold circuit will be reduced, and the duty cycle of the temperature control signal corresponding to the hot circuit will be increased, as the direction of the pulse width adjustment. When the actual temperature is greater than the desired temperature, the duty cycle of the temperature control signal corresponding to the cold circuit will be increased, and the duty cycle of the temperature control signal corresponding to the hot circuit will be decreased, as the direction of the pulse width adjustment.
5. The method according to claim 1, characterized in that, Based on the relationship between the actual temperature drop rate and the desired temperature drop rate, and the change in quantity, the target number of liquid cooling pumps to be activated is determined, including: In response to the actual temperature drop rate being less than the expected temperature drop rate, the number of liquid cooling pumps to be activated is determined. In response to the actual temperature drop rate being greater than the expected temperature drop rate, the number of liquid cooling pumps to be turned on is reduced. The target number of pumps to be turned on is determined based on the increase or decrease in the number of liquid cooling pumps to be turned on.
6. The method according to claim 1, characterized in that, Before determining the target valve angle based on the relationship between the actual temperature and the desired temperature, the pulse width change, and the mapping relationship between the valve angle and the temperature control signal, the process includes: Based on the cross-sectional area through which the coolant passes in the thermostatic valve, the time it takes for the coolant to flow through the coolant circulation loop, and the pipe length, a first correspondence between the liquid flow rate and the temperature deviation is determined; Based on the first correspondence and the difference between the cross-sectional area through which the coolant passes in the cold pipe and the cross-sectional area through which the coolant passes in the hot pipe, a second correspondence between the temperature drop rate and the valve angle is determined. Based on the second correspondence, the mapping relationship between the valve angle and the temperature control signal is calibrated.
7. The method according to claim 1, characterized in that, Before determining the pulse width change of the temperature control signal using a proportional-integral-derivative (PID) control algorithm based on the pre-obtained temperature deviation between the current actual temperature and the desired temperature of the target device, the method further includes: The actual temperature of the target device over time after the liquid cooling system is turned on is obtained, and an actual temperature curve is generated; The slope of the tangent line of the actual temperature curve at the current acquisition time, or the slope of the line connecting the actual temperature at the previous acquisition time and the current acquisition time, is determined as the current actual temperature drop rate of the target device.
8. The method according to claim 1, characterized in that, Based on the temperature deviation, the pulse width change is determined using a proportional-integral-derivative (PID) control algorithm, including: Set the first integration range of the cumulative effect integral term of the temperature deviation and the first valid signal; Under the constraints of the first integral range and the first valid signal, the pulse width change is determined by a proportional-integral-derivative control algorithm based on the temperature deviation.
9. The method according to claim 1, characterized in that, Based on the temperature drop rate deviation, the change in the number of liquid cooling pumps is determined using the proportional-integral-derivative (PID) control algorithm, including: Set the second integral range of the cumulative effect integral term of the temperature drop rate and the second effective signal; Under the constraints of the second integral range and the second valid signal, the quantity change is determined by a proportional-integral-derivative control algorithm based on the temperature drop rate deviation.
10. A temperature control device for a liquid cooling system, characterized in that, The device includes: a processor and a memory storing computer program instructions; when the processor executes the computer program instructions, it implements the temperature control method of the liquid cooling system as described in any one of claims 1-9.