Differential transmission structure, signal transmission system and method for manufacturing the same

Abstract

The application discloses a differential transmission structure, a signal transmission system and a manufacturing method thereof. The structure comprises at least two transmission modules and two port modules. The transmission module comprises a hollow first outer conductor with an air cavity inside, a first inner conductor suspended in the cavity through a first support body, and at least two transmission modules are cascaded to form a differential transmission path in the signal transmission direction. The port module comprises a second outer conductor, a second inner conductor and a second support body with the same structure, which are electrically connected to both ends of the differential transmission path, respectively. Through the modular cascaded hollow differential transmission structure, long-distance low-loss high-speed transmission is realized by air medium, and the processing flexibility and cost controllability are considered.

Description

Technical Field

[0001] This application relates to the field of communication transmission technology, and in particular to a differential transmission structure, a signal transmission system and a method for manufacturing the same. Background Technology

[0002] As high-speed communication and computing systems evolve towards higher transmission rates, single-channel transmission rates have reached the hundreds of Gbps level. In such systems, the physical distance between signal transceiver components is typically several centimeters to tens of centimeters.

[0003] Currently, mainstream high-speed transmission solutions in the industry primarily utilize planar transmission lines on printed circuit boards (such as microstrip lines, striplines, or coplanar waveguides) to achieve electrical interconnection between various functional modules within the system. However, when the transmission distance exceeds 10 centimeters, the insertion loss of traditional planar transmission lines increases under high-frequency signals, and crosstalk easily occurs between adjacent signal lines, leading to an increase in data transmission error rate and making it difficult to meet the requirements of long-distance high-speed connections within equipment. Furthermore, for transmission structures with lengths ranging from several centimeters to tens of centimeters, if an integral processing method is adopted, limitations in the size and precision of the processing equipment result in difficulties in processing, low material utilization, and long development cycles and high costs during version iterations.

[0004] Therefore, how to achieve long-distance, low-loss, high-speed signal transmission while reducing processing difficulty, improving material utilization, shortening development cycle, and reducing manufacturing costs has become an urgent technical problem to be solved. Summary of the Invention

[0005] In view of the above problems, this application proposes a differential transmission structure, a signal transmission system and its manufacturing method. Through a modular cascaded hollow differential transmission structure, long-distance low-loss high-speed transmission is achieved with air as the medium, while taking into account both processing flexibility and cost controllability.

[0006] Firstly, a differential transmission structure is provided, including at least two transmission modules and two port modules; The transmission module includes a first outer conductor, a first inner conductor, and a first support. The first outer conductor is a hollow structure with an internal air cavity. The first inner conductor is suspended in the air cavity of the first outer conductor by the first support, and the first inner conductor is insulated from the first outer conductor. At least two transmission modules are cascaded sequentially along the signal transmission direction to form a differential transmission path of a preset distance. The first inner conductors of at least two transmission modules are electrically connected to form a differential inner transmission path, and the first outer conductors of at least two transmission modules are electrically connected to form a differential outer transmission path. The port module includes a second outer conductor, a second inner conductor, and a second support. The second outer conductor is a hollow structure with an internal air cavity. The second inner conductor is suspended in the air cavity of the second outer conductor by the second support and is insulated from the second outer conductor. The two port modules are electrically connected to two transmission modules located at both ends of the differential transmission path, respectively. The second outer conductor of the port module is electrically connected to the first outer conductor of the adjacent transmission module, and the second inner conductor of the port module is electrically connected to the first inner conductor of the adjacent transmission module.

[0007] In some embodiments, the differential transmission structure is disposed on a substrate, and the substrate is further provided with a first signal transceiver component and a second signal transceiver component, and the distance between the first signal transceiver component and the second signal transceiver component is greater than a first preset distance, the first preset distance being 10 centimeters; The port module includes a first port module and a second port module. The first port module is used to connect to the first signal transceiver component, and the second port module is used to connect to the second signal transceiver component.

[0008] In some embodiments, the differential transmission structure further includes a converter module disposed on the substrate, and two adjacent transmission modules are cascaded through the converter module. The converter module is a planar transmission line with a trace length less than a second preset distance, and the second preset distance is less than the first preset distance.

[0009] In some embodiments, a wedge connection is made between the first inner conductors of two adjacent transmission modules so that the first outer conductors of the two adjacent transmission modules are connected; a wedge connection is made between the second inner conductor of the port module and the first inner conductor of the adjacent transmission module so that the second outer conductor of the port module is connected to the first outer conductor of the adjacent transmission module.

[0010] In some embodiments, the differential transmission structure further includes a connection module, wherein two adjacent transmission modules are electrically connected through the connection module, and / or, the port module is electrically connected to an adjacent transmission module through the connection module; The connection module is wedge-shaped connected to the adjacent transmission module and / or port module.

[0011] In some embodiments, the connection module includes a third outer conductor, a third inner conductor, and a third support. The third outer conductor is a hollow structure with an internal air cavity. The third inner conductor is suspended in the air cavity of the third outer conductor by the third support, and the third inner conductor is insulated from the third outer conductor. The third inner conductor of the connection module is wedge-shaped connected to the first inner conductor of the transmission module, so that the third outer conductor of the connection module and the first outer conductor of the transmission module are connected and conductive; and / or the third inner conductor of the connection module is wedge-shaped connected to the second inner conductor of the port module, so that the third outer conductor of the connection module and the second outer conductor of the port module are connected and conductive.

[0012] In some embodiments, the second support of the port module includes an insulating dielectric layer and a support column. The insulating dielectric layer is fixedly disposed inside the second outer conductor in a direction parallel to the substrate. The second inner conductor is disposed on one side of the insulating dielectric layer and is tenon-jointed to the insulating dielectric layer. The support column is disposed on the other side of the insulating dielectric layer and between the second outer conductor in a direction perpendicular to the substrate.

[0013] In some embodiments, the transmission module is a transmission module with a preset standard length, the preset standard length including a, 2a, 3a and 5a, where a is a preset standard size; at least two transmission modules with different preset standard lengths are cascaded along the signal transmission direction to form a differential transmission path of the required total length.

[0014] In a second aspect, a signal transmission system is provided, including a differential transmission structure as described in the first aspect, a substrate, a first signal transceiver component, and a second signal transceiver component. The differential transmission structure, the first signal transceiver component, and the second signal transceiver component are disposed on the substrate, and the two port modules of the differential transmission structure are respectively connected to the first signal transceiver component and the second signal transceiver component to form a differential signal transmission path between the first signal transceiver component and the second signal transceiver component.

[0015] Thirdly, a method for manufacturing a signal transmission system is provided, comprising: Provide a substrate; At least two transmission modules and two port modules are formed on the substrate. Each transmission module includes a first outer conductor, a first inner conductor, and a first support. The first outer conductor is a hollow structure with an internal air cavity. The first inner conductor is suspended within the air cavity of the first outer conductor by the first support, and the first inner conductor is insulated from the first outer conductor. Each port module includes a second outer conductor, a second inner conductor, and a second support. The second outer conductor is a hollow structure with an internal air cavity. The second inner conductor is suspended within the air cavity of the second outer conductor by the second support, and the second inner conductor is insulated from the second outer conductor. The transmission module and the port module are peeled off from the substrate; A substrate is provided, on which a first signal transceiver component and a second signal transceiver component are disposed, and the distance between the first signal transceiver component and the second signal transceiver component is greater than a first preset distance, wherein the first preset distance is 10 centimeters. At least two of the transmission modules are cascaded and assembled on the substrate along the signal transmission direction to form a differential transmission path of a predetermined total length, and the two port modules are respectively installed at both ends of the differential transmission path to form a differential transmission structure. The two port modules of the differential transmission structure are electrically connected to the first signal transceiver component and the second signal transceiver component, respectively.

[0016] The technical solutions provided in this application embodiment have at least the following technical effects or advantages: This application provides a differential transmission structure, signal transmission system, and manufacturing method thereof. By cascading at least two transmission modules along the signal transmission direction to form a differential transmission path of a predetermined distance, the transmission modules and port modules employ a hollow structure with internal air cavities. The inner conductor is suspended within the air cavity by a support structure. Due to the low dielectric constant of air, insertion loss of high-frequency signals during transmission is effectively reduced. Simultaneously, the shielding cavity formed by the outer conductor effectively constrains the electromagnetic field distribution. Combined with the dual-conductor structure of the differential inner and outer transmission paths, electromagnetic coupling between adjacent signal lines is effectively suppressed, reducing crosstalk and ensuring signal integrity. This achieves long-distance, low-loss, high-speed signal transmission. Furthermore, by splitting the signal transmission traces into multiple standardized transmission and port modules for cascading, the total length of the differential transmission path can be flexibly configured according to system requirements, avoiding material waste caused by overall processing. Each module can be independently processed, mass-produced, and flexibly replaced, effectively reducing processing difficulty, shortening the development cycle, and lowering manufacturing costs.

[0017] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0018] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings: Figure 1 This is a schematic diagram of a differential transmission structure provided in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a transmission module provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of a transmission module provided in an embodiment of this application; Figure 4 This is a schematic diagram illustrating an application scenario of a differential transmission structure provided in an embodiment of this application; Figure 5 This is one of the connection diagrams of a differential transmission structure provided in the embodiments of this application; Figure 6 This is a second connection diagram of a differential transmission structure provided in an embodiment of this application; Figure 7 This is a side view of a transmission module provided in an embodiment of this application; Figure 8 This is a schematic diagram showing the dimensions of a transmission module provided in an embodiment of this application; Figure 9 This is a top view of a transmission module provided in an embodiment of this application; Figure 10 This is the third connection diagram of a differential transmission structure provided in the embodiments of this application; Figure 11 This is a structural breakdown diagram of a connection module provided in an embodiment of this application; Figure 12 This is a schematic diagram of a cascaded combination structure of a differential transmission structure provided in an embodiment of this application; Figure 13 This is a partial structural diagram of a port module provided in an embodiment of this application; Figure 14 This is a partial structural side view of a port module provided in an embodiment of this application; Figure 15 This is a flowchart of a manufacturing method for a signal transmission system provided in an embodiment of this application. Detailed Implementation

[0019] To better understand the above technical solutions, the following will describe the above technical solutions in detail with reference to the accompanying drawings and specific implementation methods. It should be understood that the embodiments of this disclosure and the specific features in the embodiments are detailed descriptions of the technical solutions of this application, rather than limitations on the technical solutions of this application. Unless otherwise specified, the embodiments of this application and the technical features in the embodiments can be combined with each other.

[0020] In the hardware layout of mainstream high-speed network equipment such as servers and switches, standardized interface devices such as quad-small form-factor pluggable (QSFP) connectors and quad-small form-factor pluggable (QSFP) sockets are typically mounted on the edge of the motherboard printed circuit board (PCB) or around the main chip. The front-end pluggable optical module is then connected to the motherboard via these standardized interfaces. In practical applications, the signal transmission distance between the main chip and the pluggable optical module is typically several centimeters to tens of centimeters.

[0021] Currently, for the aforementioned transmission distances, mainstream industry solutions primarily employ planar transmission lines on printed circuit boards (such as microstrip lines, striplines, or coplanar waveguides) to achieve electrical interconnection between the main chip and pluggable optical modules. However, traditional planar transmission lines use solid dielectric materials as the signal transmission medium, resulting in significant dielectric loss during high-frequency signal transmission. Furthermore, as signal rates increase to the hundreds of Gbps level, electromagnetic coupling between adjacent signal lines intensifies, easily generating crosstalk and leading to an increased data transmission error rate. When the transmission distance exceeds a certain length, these insertion loss and crosstalk problems worsen further, making it difficult to guarantee signal integrity and thus limiting the direct transmission distance of electrical signals.

[0022] To overcome the distance limitations of planar transmission lines, related technologies typically employ a photoelectric conversion digital signal processor (PDS) in conjunction with optical transmission. This involves converting electrical signals into optical signals for transmission. The PDS handles signal modulation, demodulation, equalization compensation, and encoding / decoding; however, it requires advanced semiconductor manufacturing processes, resulting in complex design, high power consumption, and high cost. Furthermore, the introduction of the photoelectric conversion stage increases the complexity of the system architecture and, to some extent, sacrifices module pluggability and maintenance flexibility.

[0023] Therefore, in order to solve the above-mentioned technical problems, this application provides a differential transmission structure, which forms a differential transmission path of a preset distance by cascading at least two transmission modules along the signal transmission direction, and uses the hollow structure of an air cavity as the transmission medium. While ensuring low loss and low crosstalk transmission performance, it also achieves flexibility in processing and manufacturing and cost control.

[0024] Figure 1 This is a schematic diagram of a differential transmission structure provided in an embodiment of this application, as shown below. Figure 1 As shown, the differential transmission structure 100 includes at least two transmission modules 110 and two port modules 120.

[0025] Figure 2This is a schematic diagram of the structure of a transmission module provided in an embodiment of this application, such as... Figure 2 As shown, the transmission module 110 includes a first outer conductor 111, a first inner conductor 112, and a first support 113. The first outer conductor 111 is a hollow structure with an internal air cavity. The first inner conductor 112 is suspended within the air cavity of the first outer conductor 111 by the first support 113, and the first inner conductor 112 is insulated from the first outer conductor 111. See also Figure 1 At least two transmission modules 110 are cascaded sequentially along the signal transmission direction X to form a differential transmission path of a preset distance. The first inner conductors 112 of at least two transmission modules 110 are electrically connected to form an internal differential transmission path, and the first outer conductors 111 of at least two transmission modules 110 are electrically connected to form an external differential transmission path.

[0026] Figure 3 This is a schematic diagram of the structure of a transmission module provided in an embodiment of this application, such as... Figure 3 As shown, the port module 120 includes a second outer conductor 121, a second inner conductor 122, and a second support 123. The second outer conductor 121 is a hollow structure with an internal air cavity. The second inner conductor 122 is suspended within the air cavity of the second outer conductor 121 by the second support 123, and the second inner conductor 122 is insulated from the second outer conductor 121. See also... Figure 1 The two port modules 120 are electrically connected to the two transmission modules 110 located at both ends of the differential transmission path, respectively. Specifically, the second outer conductor 121 of the port module 120 is electrically connected to the first outer conductor 111 of the adjacent transmission module 110, and the second inner conductor 122 of the port module 120 is electrically connected to the first inner conductor 112 of the adjacent transmission module 110.

[0027] The aforementioned differential transmission structure uses an air cavity instead of the traditional solid dielectric transmission structure. Leveraging the low dielectric constant of air, it significantly reduces insertion loss during high-frequency, high-speed signal transmission, effectively solving the problem of severe attenuation in long-distance transmission of traditional planar transmission lines. Simultaneously, the enclosed shielded cavity formed by the outer conductor effectively constrains the electromagnetic field propagation range, suppresses electromagnetic coupling crosstalk between adjacent transmission lines, and greatly improves signal integrity in long-distance transmission scenarios. It breaks through the transmission distance limitations of traditional electrical interconnect structures, enabling direct transmission of high-speed, low-error-rate electrical signals in the range of several centimeters to tens of centimeters. Furthermore, it eliminates the need for a photoelectric conversion digital signal processor for signal compensation and photoelectric conversion, simplifying the system hardware architecture, reducing equipment power consumption and hardware costs, while fully retaining the standardized assembly characteristics and maintenance flexibility of pluggable modules.

[0028] It should be noted that hollow transmission structures in related technologies typically employ an integral design. For long-distance transmission structures ranging from several centimeters to tens of centimeters, the following problems exist: Firstly, microelectromechanical systems (MEMS) processes are limited by wafer size, making it difficult to efficiently arrange long-distance transmission structures on a single wafer, resulting in significant waste of wafer area. Secondly, while board-level manufacturing processes can process longer structures, their processing accuracy is poor. In scenarios with stringent electrical performance requirements and frequent version iterations, complex processing and layout designs are needed, leading to long development cycles and high costs. In contrast, the transmission module and port module in this application are small-sized, standardized, independent modules. The uniform size of each module is compatible with precision wafer processing and board-level batch processing, allowing for high-density fabrication within a limited wafer layout, greatly improving material utilization and avoiding the substrate waste problem associated with integral long structures. Furthermore, the standardized small-sized modules offer higher processing accuracy and better consistency, meeting the electrical performance requirements of high-speed differential signals. In practical applications and product iterations, different standard modules can be flexibly selected and combined to form a system based on the required transmission distance. This eliminates the need to redesign layouts and adjust processes for different length specifications, significantly reducing processing difficulty, shortening product development and iteration cycles, and lowering overall manufacturing costs. Furthermore, the modular design supports individual replacement and maintenance of parts, further enhancing the maintainability of the equipment.

[0029] In some embodiments, see Figure 2 and Figure 3 The transmission module 110 may include two first inner conductors 112, which are spaced apart on the first support 113. The port module 120 may include two second inner conductors 122, which are spaced apart on the second support 123. In this configuration, signals can be transmitted independently through the two first inner conductors 112, maintaining symmetrical signal paths. The generated electromagnetic fields can cancel each other out to a certain extent, achieving a balanced signal transmission. This allows for stable transmission of both signals while reducing energy loss and interference. The first support 113 can be made of insulating material, ensuring that the signals between the two first inner conductors 112 can be transmitted independently without affecting each other. The first outer conductor 111 shields the two first inner conductors 112 from the outside, effectively shielding external electromagnetic fields and improving transmission effectiveness and efficiency. Simultaneously, the port module 120 contains two second outer conductors 122 corresponding to the two first inner conductors 112, ensuring that the signals from the two first inner conductors 112 are respectively led out and transmitted to external signal transceiver components, maintaining the integrity and consistency of the differential signal pair, thereby achieving stable differential signal transmission.

[0030] In some embodiments, the first outer conductor 111 of the transmission module 110 is further provided with a window 114, which is spaced apart along the signal transmission direction. This window releases the pressure difference between the internal air cavity of the first outer conductor 111 and the external environment, while also reducing the material usage of the first outer conductor 111 and lowering the overall weight. Furthermore, the window 114 allows observation of the assembly status of the first inner conductor 112 and the first support 113, facilitating quality inspection during manufacturing and subsequent maintenance. The location and size of the window 114 can be optimized according to electromagnetic shielding effectiveness and structural strength requirements to ensure effective shielding of the internal signal transmission by the first outer conductor 111 while releasing air pressure and reducing weight.

[0031] Figure 4 This is a schematic diagram illustrating an application scenario of a differential transmission structure provided in an embodiment of this application, such as... Figure 4 As shown, in some embodiments, the differential transmission structure 100 is disposed on the substrate 200, and the substrate 200 is further provided with a first signal transceiver component 210 and a second signal transceiver component 220, and the distance D between the first signal transceiver component 210 and the second signal transceiver component 220 is greater than a first preset distance D1, where the first preset distance D1 is 10 centimeters. (Combined with...) Figure 1 The port module 120 includes a first port module 121 and a second port module 122. The first port module 121 is used to connect to the first signal transceiver component 210, and the second port module 122 is used to connect to the second signal transceiver component 220. By arranging the modular cascaded differential transmission structure on the substrate 200 and connecting the two sets of signal transceiver components through the port modules at both ends, it can flexibly adapt to long-distance high-speed differential signal transmission scenarios of more than 10 cm. It avoids the defects of traditional integral long transmission structures, such as high processing difficulty, low material utilization, and high iteration cost, and takes into account the application advantages of high-speed transmission performance, mass production, and flexible deployment.

[0032] For example, the substrate 200 can be a motherboard printed circuit board of high-speed network equipment such as servers and switches, and the first signal transceiver component 210 and the second signal transceiver component 220 can be a main chip and a pluggable optical module, respectively, or other functional modules that require long-distance high-speed signal transmission. This application does not limit this.

[0033] Figure 5 This is one of the connection diagrams of a differential transmission structure provided in the embodiments of this application, such as... Figure 5 As shown, in some embodiments, the differential transmission structure 100 further includes a transfer module 130 disposed on the substrate 200. Two adjacent transmission modules 110 are cascaded through the transfer module 130. The transfer module 130 is a planar transmission line with a trace length less than a second preset distance D2, and the second preset distance D2 is less than a first preset distance D1.

[0034] When a planar transmission line with a distance less than the first preset distance D1 is already provided on the substrate 200, transmission modules 110 can be cascaded at both ends of the planar transmission line to extend the total length of the overall differential transmission path, thus meeting the long-distance transmission requirements greater than the first preset distance D1. Alternatively, the aforementioned adapter module 130 can also be a newly added short-distance planar transmission line on the substrate 200, used to cross layout obstacles on the substrate or to achieve directional transition between two transmission modules 110. Since the trace length of the adapter module 130 is within the second preset distance D2, the transmission distance of the high-frequency signal on the adapter module 130 is extremely short. The resulting insertion loss and signal distortion can be controlled within an acceptable range. This allows for the mixed deployment of the hollow high-speed transmission structure and the original or newly added planar transmission lines on the substrate while ensuring the signal integrity of the differential transmission path, thereby improving the flexibility of the substrate layout.

[0035] For example, the adapter module 130 can be designed as a planar differential adapter trace in the form of a ground-signal-ground (GSG) structure, which has good short-distance shielding effect and impedance matching characteristics, ensuring the continuity of signal transmission at the module docking point. The transmission module 110 can be assembled onto the transmission line ports at both ends of the adapter module 130 by wire bonding or flip-chip bonding to realize the electrical connection between the transmission module 110 and the adapter module 130. Specifically, the wire bonding method can use metal leads to bond the inner conductor and outer conductor of the transmission module 110 to the corresponding signal pad and ground pad of the adapter module 130, respectively; the flip-chip method can pre-prepare metal bumps on the end face of the transmission module 110, and directly connect the bumps to the corresponding pads of the adapter module 130 by thermoforming or reflow soldering. In the above ways, two transmission modules 110 can be cascaded through the adapter module 130 to form a continuous differential transmission path.

[0036] Figure 6 This is a second connection diagram of a differential transmission structure provided in an embodiment of this application, as shown below. Figure 6 As shown, in some other embodiments, the first inner conductors 112 of two adjacent transmission modules 110 are wedge-shaped connected so that the first outer conductors 111 of the two adjacent transmission modules 110 are connected. Similarly, the second inner conductor 122 of the port module 120 is wedge-shaped connected to the first inner conductor 112 of the adjacent transmission module 110. Figure 6(Not shown), so that the second outer conductor 121 of the port module 120 is connected to the first outer conductor 110 of the adjacent transmission module 110. The wedge-shaped engagement of the inner conductor ensures alignment and tight contact between the outer conductors, guaranteeing electrical continuity of the outer conductor mating surfaces. This wedge connection method eliminates the need for additional connection modules, directly cascading the transmission modules 110, further reducing cost and complexity, while ensuring continuous conduction between the inner and outer conductors, forming a complete differential transmission path.

[0037] For example, such as Figure 6 As shown, both ends of the first inner conductor 112 of the transmission module 110 are pre-set with wedge-shaped connecting portions. The first inner conductors 112 of two adjacent transmission modules 110 complete wedge-shaped interlocking and docking in the first direction through the wedge-shaped connecting portions at both ends. The first direction Z is a vertical direction perpendicular to the substrate 200.

[0038] Figure 7 This is a side view of a transmission module provided in an embodiment of this application, such as... Figure 7 As shown, the transmission module 110 includes an adjacent first transmission module 110a and a second transmission module 110b. The end of the first inner conductor 112a of the first transmission module 110a is provided with an upper wedge-shaped connecting part 1121a, and the end of the first inner conductor 112b of the second transmission module 110b is provided with a lower wedge-shaped connecting part 1121b. The upper wedge-shaped connecting parts 1121a and lower wedge-shaped connecting parts 1121b are mutually engaged and aligned in the first direction Z, realizing the electrical conduction between the first transmission module 110a and the second transmission module 110b. Multiple transmission modules 110 can be cascaded sequentially through this Z-direction wedge-shaped connection method, and can be freely combined to form a hollow high-speed differential transmission structure of arbitrary target length. The structure has high alignment accuracy, good conduction stability, and is easy to cascade, install, and disassemble.

[0039] For example, the upper wedge-shaped connecting portion 1121a and the lower wedge-shaped connecting portion 1121b are matched in size. Taking the second transmission module 110b as an example, if the height of the first inner conductor 112a of the second transmission module 110b in the first direction Z is H0, the width in the second direction Y is W0, and the length in the third direction X is L0. Figure 8 This is a schematic diagram of the dimensions of a transmission module provided in an embodiment of this application, such as... Figure 8As shown, the lower wedge-shaped connecting portion 1121b has a height of H1 in the first direction Z, where H1 < H0, for example, 2H1 = H0; a width of W1 in the second direction Y, where W1 = W0; and a length of L1 in the third direction X, where L1 < L0. The second direction Y and the third direction X are horizontal directions parallel to the substrate, and the first direction Z, second direction Y, and third direction X are perpendicular to each other. The third direction X can be the signal transmission direction. Correspondingly, the upper wedge-shaped connecting portion 1121a has a height of H2 in the first direction Z, where H2 + H1 = H0, for example, H2 = H1; a width of W2 in the second direction Y, where W2 = W0; and a length of L2 in the third direction X, where L2 = L1.

[0040] Figure 9 This is a top view of a transmission module provided in an embodiment of this application, as shown below. Figure 9 As shown, in some embodiments, the wedge-shaped connection between the first inner conductors 112 of two adjacent transmission modules 110 is wedge-shaped connected in the second direction Y. Specifically, as Figure 9 As shown, the transmission module 110 includes adjacent third transmission module 110c and fourth transmission module 110d. The end of the first inner conductor 112c of the third transmission module 110c is provided with a left wedge-shaped connecting portion 1121c, and the end of the first inner conductor 112d of the fourth transmission module 110d is provided with a right wedge-shaped connecting portion 1121d (or the end of the first inner conductor 112c of the third transmission module 110c is provided with a right wedge-shaped connecting portion, and the end of the first inner conductor 112d of the fourth transmission module 110d is provided with a left wedge-shaped connecting portion). The left wedge-shaped connecting portion 1121c and the right wedge-shaped connecting portion 1121d engage and align with each other in the second direction Y, achieving electrical conduction between the third transmission module 110c and the fourth transmission module 110d. Multiple transmission modules 110 are cascaded sequentially via a Y-direction wedge connection, allowing for free combination to form a hollow high-speed differential transmission structure of arbitrary target length. This structure offers high alignment accuracy, good conduction stability, and ease of installation and disassembly.

[0041] For example, the dimensions of the left wedge-shaped connecting portion 1121c and the right wedge-shaped connecting portion 1121d are matched. Specifically, when the height of the first inner conductor 112c of the third transmission module 110c in the first direction Z is H0, the width in the second direction Y is W0, and the length in the third direction X is L0, the height of the left wedge-shaped connecting portion 1121c in the first direction Z is H3, where H3 = H0; the width of the left wedge-shaped connecting portion 1121c in the second direction Y is W3, where W3 < W0, for example, 2W3 = W0; and the length of the left wedge-shaped connecting portion 1121c in the third direction X is L3, where L3 < L0. Correspondingly, the height of the right wedge-shaped connecting portion 1121d in the first direction Z is H4, where H4 = H0; the width of the lower wedge-shaped connecting portion 1121b in the second direction Y is W4, where W4 + W3 = W0; and the length in the third direction X is L4, where L4 = L3.

[0042] It should be noted that, along the signal transmission direction (X direction), the wedge-shaped connecting portions at both ends of the first inner conductor 112 of the transmission module 110 do not extend beyond the first outer conductor 111.

[0043] In some embodiments, see Figure 8 One end of the first outer conductor 111 may be provided with a groove (not shown in the figure), and the other end is provided with an extension 1111 that matches the groove. When two adjacent transmission modules 110 are cascaded, the extension 1111 at one end of the first outer conductor 111 of the transmission module 110 is inserted into the groove at the other end of the first outer conductor 111 of the adjacent transmission module 110 to realize the connection between the first outer conductors 111 of the two adjacent transmission modules 110. Through the insertion and cooperation of the extension 1111 and the groove, mechanical positioning and structural limiting between adjacent first outer conductors 111 are realized, effectively preventing lateral displacement and separation of the outer conductors at the cascade, ensuring the tight fit and electrical continuity of the outer conductor mating surfaces, and enhancing the overall mechanical strength and vibration resistance of the cascaded structure, thereby improving the reliability of the differential transmission path.

[0044] Figure 10 This is the third connection diagram of a differential transmission structure provided in the embodiments of this application, as shown below. Figure 10 As shown, in some other embodiments, the differential transmission structure 100 further includes a connection module 140, through which two adjacent transmission modules 110 are electrically connected, and / or, the port module 120 is electrically connected to the adjacent transmission module 110 through the connection module 140. Figure 10 (not shown); wherein, the connection module 140 is wedge-shaped connected to the adjacent transmission module 110 and / or port module 120.

[0045] The aforementioned connection module 140, as an independent bridging component, is positioned between two adjacent transmission modules 110 or between a transmission module 110 and a port module 120. It achieves electrical continuity of the inner conductor and mating continuity of the outer conductor through a wedge-shaped connection. Cascading the connection module 140 provides greater connection flexibility and fault tolerance while ensuring transmission performance. Specifically, the length of the connection module 140 along the X-direction of signal transmission can be designed according to actual layout requirements to compensate for spacing errors between adjacent transmission modules 110 or to achieve angular turning connections. Simultaneously, both ends of the connection module 140 form standardized wedge-shaped interfaces with the modules on either side, facilitating rapid assembly and replacement, reducing the requirements for on-site installation accuracy, and improving system maintainability. Furthermore, when a single transmission module 110 or port module 120 fails, only the corresponding module and connection module 140 need to be disassembled and replaced; there is no need to replace the entire differential transmission path, further reducing maintenance costs.

[0046] Figure 11 This is a structural breakdown diagram of a connection module provided in an embodiment of this application, as shown below. Figure 11 As shown, the connection module 140 includes a third outer conductor 141, a third inner conductor 142 and a third support 143. The third outer conductor 142 is a hollow structure with an internal air cavity. The third inner conductor 142 is suspended in the air cavity of the third outer conductor 141 by the third support 143, and the third inner conductor 142 is insulated from the third outer conductor 141. The third inner conductor 142 of the connection module 140 is wedge-shaped connected to the first inner conductor 112 of the transmission module 110, so that the third outer conductor 141 of the connection module 140 and the first outer conductor 111 of the transmission module 110 are connected and conductive; and / or the third inner conductor 142 of the connection module 140 is wedge-shaped connected to the second inner conductor 122 of the port module 120, so that the third outer conductor 141 of the connection module 140 and the second outer conductor 121 of the port module 120 are connected and conductive.

[0047] The connection module 140 adopts the same hollow high-speed transmission structure as the transmission module 110 and the port module 120, that is, the third outer conductor 141 is a hollow structure with an internal air cavity, enabling the connection module 140 to have the same low-loss and low-crosstalk transmission characteristics as the transmission module 110. When the third inner conductor 142 of the connection module 140 is wedge-connected with the first inner conductor 112 of the transmission module 110, the third outer conductor 141 and the first outer conductor 111 are connected, forming a continuous air-medium differential transmission path, avoiding impedance mismatch and signal reflection caused by the introduction of heterogeneous transmission media by the connection module 140; similarly, when the connection module 140 is wedge-connected with the port module 120, the electrical continuity of the differential transmission path can also be maintained. Thus, the entire differential transmission path uses air as the transmission medium, ensuring the consistency of signal transmission characteristics. At the same time, the connection module 140, as a standardized interface component, further enhances the flexibility and scalability of cascaded combinations.

[0048] For example, the two ends of the third inner conductor 142 may be provided with upper wedge-shaped connecting portions, and the two ends of the first inner conductor 112 and the second inner conductor 122 may be provided with matching lower wedge-shaped connecting portions. Electrical connection can be achieved between the third inner conductor 142 and the first inner conductor 112, and between the third inner conductor 142 and the second inner conductor 122, through the upper and lower wedge-shaped connecting portions. Similarly, electrical connection can also be achieved between the third inner conductor 142 and the first inner conductor 112, and between the third inner conductor 142 and the second inner conductor 122, through left and right wedge-shaped connecting portions.

[0049] Figure 12 This is a schematic diagram of a cascaded combination structure of a differential transmission structure provided in an embodiment of this application, as shown below. Figure 12 As shown, in some embodiments, the transmission module 110 is a transmission module with a preset standard length (i.e., the length along the signal transmission direction X). The preset standard length includes a, 2a, 3a and 5a, where a is a preset standard size. At least two transmission modules 110 with different preset standard lengths are cascaded along the signal transmission direction X to form a differential transmission path of the required total length.

[0050] By employing a standard length series of 1, 2, 3, and 5, differential transmission paths of any target length can be flexibly combined according to system requirements. For example, when a long-distance differential transmission structure with a total required length of LT is needed, this length can be obtained simply by combining the standard lengths, i.e., LT = 5a + 3a + 2a + 1a + 2E, where 2E is the length of the port module in the X direction, with the rule being to prioritize the longest standard length. Most commonly used length requirements can be covered by combining a limited number of standard modules, avoiding the layout waste and increased costs associated with designing and manufacturing transmission modules 110 separately for each length. Simultaneously, standard modules can be independently laid out and mass-produced, achieving high-density arrangement on a single wafer, greatly improving material utilization and production efficiency. In actual product iteration, only the number and order of standard module combinations need to be adjusted to adapt to different system specifications, without redesigning the layout and process of the long-distance transmission structure, significantly shortening the development cycle and reducing manufacturing costs.

[0051] Figure 13 This is a partial structural diagram of a port module provided in an embodiment of this application, combined with... Figure 3 and Figure 13 In some embodiments, the second support 123 of the port module 120 includes an insulating dielectric layer 1231 and a support post 1232. The insulating dielectric layer 1231 is fixedly disposed within the second outer conductor 121 along a direction parallel to the substrate 200. The second inner conductor 122 is disposed on one side of the insulating dielectric layer 1231 and is tenon-jointed to the insulating dielectric layer 1231. The support post 132 is disposed on the other side of the insulating dielectric layer 1231 and between it and the second outer conductor 121 along a direction Z perpendicular to the substrate.

[0052] The aforementioned tenon and mortise connection structure firmly connects the second inner conductor 122 to the insulating dielectric layer 1231. Through mechanical interlocking, the displacement of the second inner conductor 122 in both the horizontal and vertical directions is restricted, significantly enhancing the overall structural strength and vibration resistance of the port module 120 and preventing the inner conductor from shifting or detaching due to external impact or thermal stress. Simultaneously, the support column 1232 provides further support for the insulating dielectric layer 1231, further improving the reliability and stability of the second support body 123.

[0053] For example, both the insulating dielectric layer 1231 and the support pillar 1232 are made of insulating materials, such as polyimide, liquid crystal polymer, or silicon dioxide, which are low-loss dielectric materials, to ensure the electrical insulation performance between the second inner conductor 122 and the second outer conductor 121, while reducing the dielectric loss of high-frequency signals in the support structure. Meanwhile, the total volume of the insulating dielectric layer 1231 and the support pillar 1232 accounts for less than 1% of the total volume of the hollow cavity inside the second outer conductor 121, which minimizes the impact of substrate loss on transmission performance, allowing the differential signal to be transmitted primarily in the air medium, thus ensuring the low-loss advantage of the hollow high-speed transmission structure.

[0054] It should be noted that, in some embodiments, the first inner conductor 112 and the first support 113 in the transmission module 110, and the third inner conductor 142 and the third support 143 in the connection module 140, can also be configured as follows: Figure 13 The mortise and tenon joint shown is used to enhance the stability of the inner conductor.

[0055] In some embodiments, the second outer conductor 121 of the port module 120 has a window A at its top, and the end of the second inner conductor 122 connected to the signal transceiver component has a connecting portion 1221 extending in a direction Z perpendicular to the substrate 200. This connecting portion 1221 is connected to the port of the signal transceiver component through the window A. By providing this connecting portion 1221, the differential transmission structure can be vertically interconnected with the signal transceiver component in the Z direction, allowing the port of the signal transceiver component to be directly electrically connected to the second inner conductor 122 in the vertical direction without additional adapters or bends in the wiring, simplifying the wiring layout on the substrate 200 and improving space utilization.

[0056] Figure 14 This is a partial structural side view of a port module provided in an embodiment of this application, such as... Figure 14 As shown, a through hole is provided on the insulating dielectric layer 1231 of the port module 120. A tenon-and-mortise connection is provided on the side of the second inner conductor 122 near the insulating dielectric layer 1231. The tenon-and-mortise connection includes a first tenon-and-mortise connection 1222 located in the through hole and a second tenon-and-mortise connection 1223 located on the other side of the insulating dielectric layer 1231. The first tenon-and-mortise connection 1222 has a dimension of Lm in the signal transmission direction X, and the second tenon-and-mortise connection 1223 has a dimension of Ln in the signal transmission direction X, where Lm < Ln, and the distance between the second tenon-and-mortise connection 1223 and the bottom inner wall of the second outer conductor 121 is d.

[0057] A parallel plate capacitor is formed between the second tenon joint 1223 and the bottom of the second outer conductor 121. The capacitance value of this parallel plate capacitor is closely related to Lm, Ln, and d. In practical design, special attention needs to be paid to the values ​​of Lm, Ln, and d to avoid adverse effects of the parallel plate capacitor on high-frequency signal transmission. Specifically, the capacitance value of the parallel plate capacitor can be approximately expressed as C≈0.0885*εr*S / d, where S is the area between the bottom of the second tenon joint 1223 and the second outer conductor 121, i.e., S≈(Ln)², εr is the dielectric constant of air (εr≈1), and d is the distance between them. This parallel plate capacitor exhibits a certain capacitive reactance to high-frequency signals, with a capacitive reactance value Xc=1 / (2πfC). When the capacitive reactance is too small, high-frequency signals are easily bypassed to the second outer conductor 121, causing signal loss or even short circuit.

[0058] Therefore, in the specific design, the corresponding Nyquist bandwidth, i.e., the maximum frequency f, should first be determined based on the transmission rate of the high-speed signal. Assuming a coding efficiency of 1, the minimum Nyquist bandwidth f of the transmission line = single-channel transmission rate / 2log2(M), where the single-channel transmission rate is the bit rate, and M is the modulation scheme, currently commonly 4 (i.e., PAM4). Based on the determined Nyquist bandwidth f and the capacitive reactance threshold of the parallel plate capacitor, the maximum allowable value Cmax of the parallel plate capacitor can be determined. Then, according to the parallel plate capacitor calculation formula, the maximum allowable value Ln can be calculated under a determined d value. When d is small and cannot meet the capacitive reactance requirements, the second tenon joint 1223 can be removed, leaving only the first tenon joint 1222, to reduce the parallel plate capacitor area, increase the capacitive reactance, and ensure normal transmission of high-frequency signals.

[0059] In some embodiments, the transmission module 110, port module 120, and connection module 140 are all rectangular cavity structures. Table 1 below shows the loss values ​​of a 10cm long planar transmission line and a 10cm long differential transmission structure at different frequencies.

[0060] Table 1

[0061] As shown in Table 1, at a transmission rate of 224Gbps, the loss of the differential transmission structure provided in this embodiment is 0.34dB / cm, while the loss of a traditional planar transmission line is as high as 3dB / cm, with the former being only about 11% of the latter. At a transmission rate of 448Gbps, the loss of the differential transmission structure provided in this embodiment is 0.46dB / cm, while the loss of a traditional planar transmission line is 5dB / cm, with the former being about 9% of the latter. With the increase in transmission rate, the loss of a traditional planar transmission line increases dramatically. However, the differential transmission structure provided in this embodiment uses air as the transmission medium, which has a dielectric constant close to 1, resulting in extremely low dielectric loss. Furthermore, the closed shielding cavity formed by the outer conductor effectively constrains the electromagnetic field distribution, reducing radiation loss and crosstalk. Therefore, it can maintain excellent transmission performance even at higher frequencies. The above data fully verify the significant advantages of the differential transmission structure provided in this embodiment in long-distance, high-speed transmission scenarios. It can effectively replace traditional planar transmission lines, achieving long-distance, low-loss, and highly reliable high-speed signal transmission.

[0062] Based on the same inventive concept, this application also provides a signal transmission system, see [link to relevant documentation]. Figure 4 The differential transmission structure 100, substrate 200, first signal transceiver component 210 and second signal transceiver component 220 as described in the above embodiments are disposed on substrate 200. The two port modules 120 of differential transmission structure 100 are respectively connected to first signal transceiver component 210 and second signal transceiver component 220 to form a differential signal transmission path S between first signal transceiver component 210 and second signal transceiver component 220.

[0063] Based on the same inventive concept, this application also provides a method for manufacturing a signal transmission system, used to manufacture the signal transmission system described in the above embodiments. Figure 15 This is a flowchart illustrating a manufacturing method for a signal transmission system provided in an embodiment of this application, such as... Figure 15 As shown, the manufacturing method includes: Step S331: Provide a substrate.

[0064] For example, the substrate described above can be a silicon-based substrate, an oxide insulating substrate, a compound semiconductor substrate, a glass substrate, an organic substrate, a ceramic substrate, or a metal substrate, etc., and the present invention does not limit this. The choice of substrate can be determined according to the processing precision, cost budget, and application scenario. For example, silicon-based substrates are suitable for microelectromechanical systems (MEMS) processes, while glass substrates are suitable for board-level manufacturing processes.

[0065] Step S332: Form at least two transmission modules and two port modules on the substrate. The transmission module includes a first outer conductor, a first inner conductor, and a first support. The first outer conductor is a hollow structure with an internal air cavity. The first inner conductor is suspended in the air cavity of the first outer conductor by the first support and is insulated from the first outer conductor. The port module includes a second outer conductor, a second inner conductor, and a second support. The second outer conductor is a hollow structure with an internal air cavity. The second inner conductor is suspended in the air cavity of the second outer conductor by the second support and is insulated from the second outer conductor.

[0066] For example, the fabrication of the aforementioned transmission module and port module can employ at least one of the following: silicon-based microelectromechanical systems (MEMS) technology, board-level manufacturing technology, multi-wafer or board-level bonding transmission line synthesis technology, and 3D additive manufacturing technology. Specifically, silicon-based MEMS technology can precisely fabricate micron-scale structures on silicon wafers through steps such as photolithography, etching, and electroplating; board-level manufacturing technology can realize larger-sized transmission structures on glass or organic substrates; multi-wafer or board-level bonding technology can align and bond multiple wafers or substrates with half-structures to form a complete hollow cavity; and 3D additive manufacturing technology can directly form complex three-dimensional structures through layer-by-layer deposition. During the fabrication process, the first outer conductor and the second outer conductor can be formed by electroplating copper or depositing a metal layer, the first inner conductor and the second inner conductor can be fabricated through similar processes, and the first support and the second support can be formed by depositing an insulating dielectric material and patterning it.

[0067] Step S333: Peel the transmission module and port module off the substrate.

[0068] For example, the transmission module and port module can be removed from the substrate using common semiconductor manufacturing methods (such as wet etching, dry etching, or laser lift-off) or other physicochemical lift-off methods (such as mechanical lift-off, chemical dissolution, etc.). The removed modules need to be cleaned and inspected to ensure structural integrity and electrical performance meet requirements.

[0069] Step S334: Provide a substrate, on which a first signal transceiver component and a second signal transceiver component are provided, and the distance between the first signal transceiver component and the second signal transceiver component is greater than a first preset distance, the first preset distance being 10 centimeters.

[0070] For example, the substrate can be a motherboard printed circuit board for high-speed network equipment such as servers and switches, and the first signal transceiver component and the second signal transceiver component can be a main chip and a pluggable optical module, respectively, or other functional modules that require long-distance high-speed signal transmission.

[0071] Step S335: At least two transmission modules are cascaded and assembled on the substrate along the signal transmission direction to form a differential transmission path of a preset total length, and two port modules are respectively installed at both ends of the differential transmission path to form a differential transmission structure.

[0072] For example, the above-mentioned cascaded assembly can employ at least one of the following methods: upright mounting, flip-chip mounting, or embedded mounting. The upright mounting method uses standard surface mount technology to mount the module onto the substrate and achieves electrical connection through metal wire bonding. The flip-chip method involves preparing metal bumps on the module's end face and directly connecting it to the substrate pads through thermoforming bonding or reflow soldering. The embedded mounting method embeds the module into a pre-reserved groove or cavity in the substrate, achieving coplanar or embedded integration with the substrate. Furthermore, screw mounting, adhesive bonding, and mechanical assembly can be used to assist in fixation, ensuring the reliability of the mechanical connection between the module and the substrate. When it is necessary to cross layout obstacles on the substrate or for modules with large connection spacing, cascading between adjacent transmission modules can also be achieved through adapter modules (such as short-distance planar transmission lines on the substrate).

[0073] Step S336: Electrically connect the two port modules of the differential transmission structure to the first signal transceiver component and the second signal transceiver component, respectively.

[0074] The above manufacturing method allows for the flexible combination and assembly of standardized transmission modules and port modules onto a substrate, forming a long-distance differential transmission path that meets system requirements, while also taking into account high-speed transmission performance, ease of processing and manufacturing, and cost control.

[0075] The technical solutions provided in the above embodiments of this application have at least the following technical effects or advantages: This application provides a differential transmission structure, signal transmission system, and manufacturing method thereof. By cascading at least two transmission modules along the signal transmission direction to form a differential transmission path of a predetermined distance, the transmission modules and port modules employ a hollow structure with internal air cavities. The inner conductor is suspended within the air cavity by a support structure. Due to the low dielectric constant of air, insertion loss of high-frequency signals during transmission is effectively reduced. Simultaneously, the shielding cavity formed by the outer conductor effectively constrains the electromagnetic field distribution. Combined with the dual-conductor structure of the differential inner and outer transmission paths, electromagnetic coupling between adjacent signal lines is effectively suppressed, reducing crosstalk and ensuring signal integrity. This achieves long-distance, low-loss, high-speed signal transmission. Furthermore, by splitting the signal transmission traces into multiple standardized transmission and port modules for cascading, the total length of the differential transmission path can be flexibly configured according to system requirements, avoiding material waste caused by overall processing. Each module can be independently processed, mass-produced, and flexibly replaced, effectively reducing processing difficulty, shortening the development cycle, and lowering manufacturing costs.

[0076] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of this application may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0077] Similarly, it should be understood that, in order to simplify this disclosure and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of this application, various features of this application are sometimes grouped together in a single embodiment, figure, or description thereof. However, this method of disclosure should not be interpreted as reflecting an intention that the claimed application requires more features than are expressly recited in each claim. Rather, as reflected in the following claims, inventive aspects lie in fewer than all features of a single foregoing disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into that detailed description, wherein each claim itself is a separate embodiment of this application.

[0078] It should be noted that the above embodiments are illustrative of this application and not restrictive of this application, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims.

Claims

1. A differential transmission structure, characterized by, It includes at least two transmission modules and two port modules; The transmission module includes a first outer conductor, a first inner conductor, and a first support. The first outer conductor is a hollow structure with an internal air cavity. The first inner conductor is suspended in the air cavity of the first outer conductor by the first support, and the first inner conductor is insulated from the first outer conductor. At least two transmission modules are cascaded sequentially along the signal transmission direction to form a differential transmission path of a preset distance. The first inner conductors of at least two transmission modules are electrically connected to form a differential inner transmission path, and the first outer conductors of at least two transmission modules are electrically connected to form a differential outer transmission path. The port module includes a second outer conductor, a second inner conductor, and a second support. The second outer conductor is a hollow structure with an internal air cavity. The second inner conductor is suspended in the air cavity of the second outer conductor by the second support and is insulated from the second outer conductor. The two port modules are electrically connected to two transmission modules located at both ends of the differential transmission path, respectively. The second outer conductor of the port module is electrically connected to the first outer conductor of the adjacent transmission module, and the second inner conductor of the port module is electrically connected to the first inner conductor of the adjacent transmission module.

2. The differential transmission structure of claim 1, wherein, The differential transmission structure is disposed on the substrate, and the substrate is further provided with a first signal transceiver component and a second signal transceiver component, and the distance between the first signal transceiver component and the second signal transceiver component is greater than a first preset distance, which is 10 centimeters. The port module includes a first port module and a second port module. The first port module is used to connect to the first signal transceiver component, and the second port module is used to connect to the second signal transceiver component.

3. The differential transmission structure of claim 2, wherein, The differential transmission structure further includes a converter module disposed on the substrate. Two adjacent transmission modules are cascaded through the converter module. The converter module is a planar transmission line with a trace length less than a second preset distance, and the second preset distance is less than the first preset distance.

4. The differential transmission structure of claim 1, wherein, The first inner conductors of two adjacent transmission modules are connected in a wedge shape so that the first outer conductors of the two adjacent transmission modules are connected and conductive; the second inner conductor of the port module is connected in a wedge shape with the first inner conductor of the adjacent transmission module so that the second outer conductor of the port module is connected and conductive with the first outer conductor of the adjacent transmission module.

5. The differential transmission structure of claim 1, wherein, The differential transmission structure further includes a connection module, wherein two adjacent transmission modules are electrically connected through the connection module, and / or, the port module is electrically connected to an adjacent transmission module through the connection module; The connection module is wedge-shaped connected to the adjacent transmission module and / or port module.

6. The differential transmission structure according to claim 5, characterized in that, The connection module includes a third outer conductor, a third inner conductor, and a third support. The third outer conductor is a hollow structure with an internal air cavity. The third inner conductor is suspended in the air cavity of the third outer conductor by the third support, and the third inner conductor is insulated from the third outer conductor. The third inner conductor of the connection module is wedge-shaped connected to the first inner conductor of the transmission module, so that the third outer conductor of the connection module and the first outer conductor of the transmission module are connected and conductive; and / or the third inner conductor of the connection module is wedge-shaped connected to the second inner conductor of the port module, so that the third outer conductor of the connection module and the second outer conductor of the port module are connected and conductive.

7. The differential transmission structure according to claim 2, characterized in that, The second support of the port module includes an insulating dielectric layer and a support column. The insulating dielectric layer is fixedly disposed inside the second outer conductor in a direction parallel to the substrate. The second inner conductor is disposed on one side of the insulating dielectric layer and is tenon-jointed to the insulating dielectric layer. The support column is disposed on the other side of the insulating dielectric layer and between the second outer conductor in a direction perpendicular to the substrate.

8. The differential transmission structure according to claim 1, characterized in that, The transmission module is a transmission module with a preset standard length, which includes a, 2a, 3a and 5a, where a is a preset standard size; at least two transmission modules with different preset standard lengths are cascaded along the signal transmission direction to form a differential transmission path of the required total length.

9. A signal transmission system, characterized in that, The system includes a differential transmission structure as described in any one of claims 1 to 8, a substrate, a first signal transceiver component, and a second signal transceiver component. The differential transmission structure, the first signal transceiver component, and the second signal transceiver component are disposed on the substrate, and the two port modules of the differential transmission structure are respectively connected to the first signal transceiver component and the second signal transceiver component to form a differential signal transmission path between the first signal transceiver component and the second signal transceiver component.

10. A method for manufacturing a signal transmission system, characterized in that, include: Provide a substrate; At least two transmission modules and two port modules are formed on the substrate. Each transmission module includes a first outer conductor, a first inner conductor, and a first support. The first outer conductor is a hollow structure with an internal air cavity. The first inner conductor is suspended within the air cavity of the first outer conductor by the first support, and the first inner conductor is insulated from the first outer conductor. Each port module includes a second outer conductor, a second inner conductor, and a second support. The second outer conductor is a hollow structure with an internal air cavity. The second inner conductor is suspended within the air cavity of the second outer conductor by the second support, and the second inner conductor is insulated from the second outer conductor. The transmission module and the port module are peeled off from the substrate; A substrate is provided, on which a first signal transceiver component and a second signal transceiver component are disposed, and the distance between the first signal transceiver component and the second signal transceiver component is greater than a first preset distance, wherein the first preset distance is 10 centimeters. At least two of the transmission modules are cascaded and assembled on the substrate along the signal transmission direction to form a differential transmission path of a predetermined total length, and the two port modules are respectively installed at both ends of the differential transmission path to form a differential transmission structure. The two port modules of the differential transmission structure are electrically connected to the first signal transceiver component and the second signal transceiver component, respectively.

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