Liquid cooling heat dissipation structure for phased array antenna terminal

CN122739769APending Publication Date: 2026-09-11CHENGDU T RAY TECH CO LTD +1
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Patent Information

Application Number
CN202611131926.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-07-29
Publication Date
2026-09-11

AI Technical Summary

Technical Problem

1、系统复杂度高:需要集成泵、管路、换热器、冷却液分配单元(CDU)等额外组件,难以将液冷系统与整机进行一体化设计

Benefits of technology

1、本发明显著降低系统复杂度,实现高度集成化;通过将液冷组件直接内置于相控阵天线平板背部,实现了液冷设备与整机的一体化设计;相较于传统方案,无需额外配置外置的液冷机、散热器及复杂的管路分配单元(CDU),大幅简化了系统架构,满足了设备小型化、便携化的发展需求;

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Abstract

This invention discloses a liquid-cooled heat dissipation structure for a phased array antenna terminal, comprising: a liquid-cooled heat sink and several liquid-cooled components; the liquid-cooled heat sink and liquid-cooled components are mounted on the back of the antenna mounting plate of the phased array antenna terminal; the liquid-cooled heat sink and liquid-cooled components are connected by water pipes; coolant flows out from the liquid-cooled heat sink, passes through all the liquid-cooled components in sequence, and returns to the liquid-cooled heat sink, thereby achieving heat dissipation and cooling of the phased array antenna terminal. This invention achieves integrated design of the liquid cooling equipment and the entire system by directly embedding the liquid-cooled components on the back of the phased array antenna plate, significantly reducing system complexity and achieving high integration.
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Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for planar phased array antennas, and more particularly to a liquid cooling structure for phased array antenna terminals. Background Technology

[0002] With the continuous development of technology, the increasing integration of flat-panel phased array antenna terminals and the miniaturization of terminal equipment are industry trends.

[0003] For traditional liquid-cooled equipment, phased array antennas require additional liquid cooling measures, necessitating the external configuration of liquid cooling equipment at the antenna terminal, thus inevitably increasing system complexity. External coolant cooling devices, such as liquid chillers and radiators, provide the cooling source for the coolant. Currently, the industry is developing phased array antenna terminal equipment towards simpler architecture, simplified equipment, rapid assembly, and easy maintenance.

[0004] Current liquid cooling designs for phased array antenna terminals typically involve fabricating flow channels inside the substrate and then using brazing or friction stir welding. This method has high design and manufacturing costs and low reusability. Furthermore, leaks can severely damage internal electronic components.

[0005] Traditional phased array antennas combine liquid cooling plates and liquid cooling channels (for cooling function) with the antenna's load-bearing structure, simultaneously satisfying both liquid cooling and product mechanical performance requirements. This presents significant challenges in manufacturing and design, making it difficult to reduce the overall weight. Therefore, liquid cooling in phased array antennas often suffers from the following drawbacks: 1. High system complexity: It requires the integration of additional components such as pumps, pipelines, heat exchangers, and coolant distribution units (CDU), making it difficult to integrate the liquid cooling system with the whole machine.

[0006] 2. The reliability risk is relatively high; if a leak occurs, it will cause significant damage to the product.

[0007] 3. High cost: The design and manufacturing costs are higher than those of natural heat dissipation or air cooling.

[0008] 4. It has disadvantages in both weight and size, which is not convenient for the portable use requirements of phased array antenna terminals. Summary of the Invention

[0009] Technical objective: To address the shortcomings of existing technologies, this invention discloses a liquid-cooled heat dissipation structure for phased array antenna terminals. By directly embedding the liquid-cooling components into the back of the phased array antenna flat panel, the liquid-cooling equipment and the whole machine are integrated into a single design, significantly reducing system complexity and achieving high integration.

[0010] Technical solution: To achieve the above technical objectives, the present invention adopts the following technical solution.

[0011] A liquid-cooled heat dissipation structure for a phased array antenna terminal includes: a liquid-cooled heat sink and several liquid-cooled components; The liquid-cooled radiator and liquid-cooled assembly are mounted on the back of the antenna mounting plate of the phased array antenna terminal; the liquid-cooled radiator and liquid-cooled assembly are connected by water pipes. The coolant flows out from the liquid-cooled radiator, passes through all the liquid-cooling components in sequence, and then returns to the liquid-cooled radiator, thus achieving heat dissipation and cooling of the phased array antenna terminal.

[0012] Preferably, the liquid cooling assembly and the antenna mounting plate are provided with thermal pads to reduce the temperature difference on the antenna mounting plate.

[0013] Preferably, the liquid cooling assembly includes an assembly shell, liquid cooling channels, a turbulence-inducing structure, and a fixing disc buckle; the assembly shell has two parallel liquid cooling channels, one end of which is connected to the other end, and the coolant forms a unidirectional laminar flow in the liquid cooling channels; the liquid cooling channels are provided with a turbulence-inducing structure, which is snapped into the liquid cooling channels by the fixing disc buckle, and then connected to the liquid cooling connector and then to the liquid cooling radiator.

[0014] Preferably, the turbulence structure is formed by snapping together several turbulence units. Each turbulence unit includes a pair of turbulence components arranged in parallel, with a hollow frustum structure between the turbulence components. The hollow frustum structure is placed laterally and adopts a fixed bending angle. The two sides of the turbulence components are connected to other turbulence units through snap-fit ​​connectors.

[0015] Preferably, the number of turbulence-inducing units is calculated based on the coolant flow rate and velocity, and the calculation formula includes: , Where M is the number of turbulence elements, D is the spacing between turbulence elements, and L is the length of the turbulence structure. H is the yield strength of the material of the turbulence element, and H is the safety factor. Let be the density of the coolant, and v be the coolant flow rate. The water-blocking area of ​​the turbulence-disrupting structure, The cross-sectional area of ​​the disturbance structure under stress. It is the angle between the turbulence structure and the direction of coolant flow.

[0016] Preferably, the liquid cooler is provided with several expandable pipe interfaces, and each liquid cooling component is connected to the liquid cooler through a pair of expandable pipe interfaces.

[0017] Beneficial effects: 1. This invention significantly reduces system complexity and achieves high integration; by directly embedding the liquid cooling component into the back of the phased array antenna flat panel, the liquid cooling device and the whole machine are integrated into one design; compared with the traditional solution, there is no need to configure an external liquid cooler, heat sink and complex piping distribution unit (CDU), which greatly simplifies the system architecture and meets the development needs of equipment miniaturization and portability. 2. This invention significantly reduces processing costs and improves manufacturing efficiency; it eliminates the heat dissipation milling process required for traditional air cooling, and only thin plates are needed for antenna mounting plates; at the same time, it avoids the high-cost brazing or friction stir welding process required for processing flow channels inside the substrate in traditional liquid cooling solutions; it not only reduces material costs, but also simplifies the design process and significantly shortens the manufacturing cycle. 3. This invention greatly improves heat dissipation efficiency and temperature uniformity; by implanting a turbulence structure in the liquid cooling component pipeline, the coolant is forced to change from laminar flow to turbulent flow, and the strong mixing of the fluid greatly enhances the heat transfer perpendicular to the flow direction, thus significantly improving the heat exchange efficiency. 4. This invention enhances system reliability and reduces leakage risk; it adopts a modular liquid cooling component design, avoiding the leakage risks caused by the flow channel processing inside the substrate in traditional solutions; once a component malfunctions, it can be replaced independently without directly causing damage to the internal core electronic components, significantly improving the operational reliability of the equipment in harsh environments. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 for Figure 1 A schematic diagram of the liquid-cooled heat sink in the diagram; Figure 3 for Figure 1 A schematic diagram of the liquid cooling component in the diagram; Figure 4 for Figure 3 A schematic diagram of the overall turbulence structure in the middle; Figure 5 for Figure 3 A partial schematic diagram of the turbulence structure in the diagram; Figure 6 This is a schematic diagram of the assembly process of the turbulence unit cross-section; Figure 7 This is a three-dimensional structural schematic diagram of the turbulence unit; Figure 8 This is a schematic diagram of the assembly process of the liquid cooling components; Figure 9 This is a schematic diagram showing the locking mechanism of the fixed disc buckle before and after locking. Figure 10 This is a schematic diagram of coolant flow in a liquid cooling channel; Among them, 1 is a liquid cooling radiator, 11 is an expandable pipeline interface, 2 is a liquid cooling component, 21 is a component shell, 22 is a liquid cooling flow channel, 23 is a turbulence structure, 231 is a turbulence unit, 2311 is a turbulence component, 2312 is a hollow frustum structure, 2313 is a snap-fit ​​component, 3 is a water pipeline, 4 is an antenna mounting plate, and 5 is a thermal pad. Detailed Implementation

[0019] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application. Example

[0020] As attached Figure 1 As shown, a liquid-cooled heat dissipation structure for a phased array antenna terminal in this embodiment includes: a liquid-cooled heat sink and several liquid-cooled components. The liquid-cooled radiator 1 and the liquid-cooled assembly 2 are mounted on the back of the antenna mounting plate 4 of the phased array antenna terminal; the liquid-cooled radiator and the liquid-cooled assembly are connected by a water pipe; the coolant flows out from the liquid-cooled radiator, passes through all the liquid-cooled assemblies in sequence, and returns to the liquid-cooled radiator, thereby achieving heat dissipation and cooling of the phased array antenna terminal. In this invention, the antenna mounting plate is used to mount and fix the phased array antenna plate.

[0021] The liquid cooling assembly and the antenna mounting plate are equipped with a thermal pad 5, which is a graphene thermal pad. When the phased array antenna terminal is working, a large temperature difference forms between the mounting surface of the liquid cooling assembly and the other array surfaces. By using a graphene thermal pad, temperature uniformity is achieved within the plane, thereby reducing the temperature difference of the plate. This invention utilizes a graphene thermal pad to achieve temperature uniformity within the plane, effectively reducing the temperature difference on the antenna plate surface and preventing localized overheating.

[0022] As attached Figure 2 As shown, the liquid-cooled radiator is equipped with several expandable piping interfaces. Each liquid-cooling component is connected to the radiator via a pair of expandable piping interfaces; that is, the radiator's inlet is connected to one expandable piping interface via a water pipe, and its outlet is connected to another expandable piping interface via a water pipe. The liquid-cooled radiator uses a water-cooled finned radiator, and the specific model is selected according to the actual application scenario. The number of expandable piping interfaces and liquid-cooling components can be increased to meet different overall system cooling requirements.

[0023] The liquid cooling assembly is used to provide a cold source for heat exchange of the phased array antenna. When the coolant flows through the liquid cooling assembly, it forms a laminar flow in the internal pipes. (See attached image) Figure 10As shown, in laminar flow, the fluid flows in stratified layers, with no mixing between the layers. Heat transfer perpendicular to the flow direction relies primarily on molecular conduction, and the thermal conductivity of a fluid is typically much lower than its convective heat transfer capacity. In contrast, the intense mixing of fluids in turbulent flow greatly enhances heat transfer. Therefore, it is necessary to induce a transition from laminar to turbulent flow within the pipe to significantly improve heat transfer efficiency. The main solution of this invention to this problem is to implant a flow-inducing device in the liquid cooling component piping to promote turbulence within the pipe.

[0024] As attached Figure 3 -Appendix Figure 9 As shown, the liquid cooling assembly includes an assembly housing 21, a liquid cooling channel 22, a turbulence structure 23, and a fixing disc buckle; the assembly housing has two parallel liquid cooling channels, one end of which is connected to the other end, and the other end is connected to the liquid cooling radiator, and the coolant forms a unidirectional laminar flow in the liquid cooling channels; the liquid cooling channel is provided with a turbulence structure, which is snapped into the liquid cooling channel by the fixing disc buckle, and then connected to the liquid cooling connector and then to the liquid cooling radiator.

[0025] The turbulence-disrupting structure is formed by snapping together several turbulence-disrupting units 231. Each turbulence-disrupting unit includes a pair of parallel turbulence-disrupting components 2311, with a hollow frustum structure 2312 between the turbulence-disrupting components 2311. The hollow frustum structure 2312 is placed laterally with a fixed bending angle, its lower surface abutting against the turbulence-disrupting component 2311, and its upper surface for coolant flow. The two sides of the turbulence-disrupting component 2311 are connected to other turbulence-disrupting units via snap-fit ​​members 2313. In this embodiment, the snap-fit ​​members have slots, and adjacent turbulence-disrupting components are fixedly connected via these slots. The number of turbulence-disrupting units is calculated based on the coolant flow rate and velocity, using the following formula: , Where M is the number of turbulence elements, D is the spacing between turbulence elements, and L is the length of the turbulence structure. H is the yield strength of the material of the turbulence element, and H is the safety factor. Let be the density of the coolant, and v be the coolant flow rate. The water-blocking area of ​​the turbulence-disrupting structure, The cross-sectional area of ​​the disturbance structure under stress. The angle between the turbulence structure and the direction of coolant flow is related to the hollow frustum structure 2312.

[0026] The assembly process of the liquid cooling component is as follows: combine the turbulence structure with the fixing disc buckle, rotate the fixing disc buckle to lock the slot of the snap-fit ​​part in the turbulence structure with the fixing disc buckle, then install the turbulence structure into the liquid cooling channel, fix the turbulence structure and the liquid cooling channel, and finally install the liquid cooling interface to complete the assembly of the liquid cooling component.

[0027] This invention optimizes the overall weight and size of the device, improving its adaptability to various scenarios. Compared to air-cooling solutions, this liquid-cooling architecture eliminates bulky heat sinks and fan components. Compared to traditional external liquid cooling solutions, it eliminates the need for external cooling equipment. This results in a significant reduction in overall weight and size, while also enabling scalable piping interface design, such as... Figure 2 As shown, it can flexibly adapt to different heat dissipation requirements, improving the product's adaptability to multiple scenarios.

[0028] In the embodiments of this application, the terms "first" and "second" (if they exist) are used only as name identifiers and do not represent the order of first and second.

[0029] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A liquid-cooled heat dissipation structure for a phased array antenna terminal, characterized in that: include: Liquid-cooled radiator and several liquid-cooling components; The liquid-cooled radiator and liquid-cooled assembly are mounted on the back of the antenna mounting plate of the phased array antenna terminal. The liquid-cooled radiator and the liquid-cooled components are connected by water pipes; The coolant flows out from the liquid-cooled radiator, passes through all the liquid-cooling components in sequence, and then returns to the liquid-cooled radiator, thus achieving heat dissipation and cooling of the phased array antenna terminal.

2. The liquid-cooled heat dissipation structure for a phased array antenna terminal according to claim 1, characterized in that: The liquid cooling assembly and the antenna mounting plate are equipped with thermal pads to reduce the temperature difference on the antenna mounting plate.

3. The liquid-cooled heat dissipation structure for a phased array antenna terminal according to claim 1, characterized in that: The liquid cooling assembly includes an assembly shell, liquid cooling channels, a turbulence-inducing structure, and a fixing disc. The assembly shell has two parallel liquid cooling channels, one end of which is connected to the other end, and the other end is connected to the liquid cooling radiator. The coolant forms a unidirectional laminar flow in the liquid cooling channels. The liquid cooling channels are equipped with a turbulence-inducing structure, which is snapped into the liquid cooling channels by the fixing disc, and then connected to the liquid cooling connector and finally to the liquid cooling radiator.

4. The liquid-cooled heat dissipation structure for a phased array antenna terminal according to claim 3, characterized in that: The turbulence structure is formed by connecting several turbulence units. Each turbulence unit includes a pair of turbulence components arranged in parallel, with a hollow frustum structure between the turbulence components. The hollow frustum structure is placed laterally and adopts a fixed bending angle. The two sides of the turbulence components are connected to other turbulence units through snap-fit ​​components.

5. A liquid-cooled heat dissipation structure for a phased array antenna terminal according to claim 3, characterized in that: The number of turbulence units is calculated based on the coolant flow rate and velocity. The calculation formula includes: , Where M is the number of turbulence elements, D is the spacing between turbulence elements, and L is the length of the turbulence structure. H is the yield strength of the material of the turbulence element, and H is the safety factor. Let be the density of the coolant, and v be the coolant flow rate. The water-blocking area of ​​the turbulence-disrupting structure, The cross-sectional area of ​​the disturbance structure under stress. It is the angle between the turbulence structure and the direction of coolant flow.

6. The liquid-cooled heat dissipation structure for a phased array antenna terminal according to claim 1, characterized in that: The liquid cooler is provided with several expandable pipe interfaces, and each liquid cooling component is connected to the liquid cooler through a pair of expandable pipe interfaces.