Flexible circuit board EMI shielding layer punching and integrating manufacturing method, jig and equipment

Abstract

This invention discloses a method, fixture, and equipment for integrated punching and bonding of EMI shielding layers on flexible circuit boards. The manufacturing method includes the following steps: releasing a roll of EMI shielding film via a feeding device and conveying it to a bonding area via a drive shaft; pre-capturing images of the flexible circuit board at a preset punching position using a vision alignment system, and then capturing images of the EMI shielding film conveyed to the preset punching position, calculating the offset, and performing position correction; activating a vacuum generator to generate negative pressure through the suction hole array at the bottom of the punch device; driving the punch device to move downwards to contact the EMI shielding film for punching, with the negative pressure at its bottom adsorbing the punched EMI shielding film and continuing to move downwards, until it reaches the flexible circuit board for pressurized heating and bonding. This invention improves material utilization and process accuracy.

Description

Technical Field

[0001] This invention relates to the field of flexible printed circuit board manufacturing technology, specifically to a method, fixture, and equipment for the integrated fabrication of EMI shielding layers on flexible circuit boards. Background Technology

[0002] As electronic products develop towards higher frequencies, higher speeds, and higher densities, electromagnetic interference (EMI) problems are becoming increasingly prominent. Flexible printed circuit boards (FPCs) typically require the lamination of EMI shielding layers in specific areas to suppress signal interference. Traditional processes generally employ a two-step method: "die-cutting first, then lamination." This involves pre-die-cutting rolls of EMI shielding film into individual sheets, which are then picked up by operators or semi-automatic equipment and attached to designated areas on the FPC.

[0003] This traditional method has the following significant drawbacks: Significant material waste: Pre-die cutting generates a large amount of edge waste, resulting in low material utilization and high costs.

[0004] Limited process precision: The cumulative error of secondary alignment (first die-cut alignment, then bonding alignment) is large, making it difficult to achieve high-precision bonding below ±0.3mm.

[0005] Low production efficiency: Separation of processes leads to slow production cycle, reliance on manual operation, and poor consistency.

[0006] The process is complex, involving multiple independent devices and transportation links, which increases management costs and potential quality risks.

[0007] Therefore, the industry urgently needs a new EMI shielding layer manufacturing technology that can integrate processes, improve material utilization, and increase automation. Summary of the Invention

[0008] This invention provides a method, fixture, and equipment for the integrated fabrication of EMI shielding layers on flexible circuit boards, improving material utilization and process precision.

[0009] In a first aspect, the present invention provides a method for integrated fabrication of EMI shielding film on a flexible circuit board, comprising the following steps: Feeding and unwinding: The roll of EMI shielding film is released by the feeding device and conveyed to the bonding area via the drive shaft; Visual positioning: The visual alignment system is used to pre-acquire images of the flexible circuit board at the preset punching position, and then images of the EMI shielding film delivered to the preset punching position are acquired. The offset is calculated and the position is corrected. Negative pressure adsorption preparation: Turn on the vacuum generator to generate negative pressure through the air intake hole array at the bottom of the punch device; Punching and holding pressure: The driving punch moves down to contact the EMI shielding film for punching. The negative pressure at its bottom adsorbs the punched EMI shielding film and continues to move down to the flexible circuit board for pressurization and heating bonding.

[0010] Secondly, the present invention provides an integrated punching and bonding equipment for EMI shielding layers of flexible circuit boards, which includes a punching device. The punching device is characterized in that an air pipe hole is opened in the body of the punching device, and an air suction hole array is opened at the bottom of the punching body. The air pipe hole and the air suction hole array are interconnected to form a negative pressure adsorption channel. The other end of the tracheal port is connected to an external vacuum pump or negative pressure gas source via a tracheal connector and a gas delivery pipe. The punch body punches and cuts the EMI shielding film. The negative pressure at its bottom adsorbs the punched EMI shielding film and continues to move downwards to the flexible circuit board for pressure heating and bonding.

[0011] Thirdly, the present invention provides a ejector pin fixture, which includes a base and a cover plate. The base is provided with a tooling positioning pin, and the cover plate is provided with a tooling positioning hole that cooperates with the tooling positioning pin. The base is also provided with a plurality of ejector pins corresponding to the ejector pin holes of the flexible circuit board, and the cover plate is provided with a plurality of ejector pin holes. When the base and the cover plate are closed, the ejector pins penetrate the ejector pin holes of the flexible circuit board, the ejector pin holes covering the EMI shielding film on the flexible circuit board, and enter the ejector pin holes of the cover plate. Beneficial effects

[0012] 1) This invention uses roll-to-roll raw materials for direct punching and bonding, bonding only the required area of ​​the board surface, avoiding waste of die-cutting scraps and significantly improving the utilization rate of EMI materials. It innovatively integrates punching and bonding into a continuous operation, replacing the traditional separate and complex process of die-cutting followed by bonding, greatly simplifying the production process and achieving process integration and simplification.

[0013] 2) The FPC automatic punching and bonding machine enables automated operation, ensuring high-precision bonding (±0.2mm), reducing reliance on operators, and improving production efficiency and product consistency.

[0014] 3) The unique ejector pin fixture combined with the high-pressure air gun design enables rapid and clean non-contact peeling of the EMI carrier film, solving the problems of low efficiency and easy damage to products caused by traditional manual peeling.

[0015] 4) The method of this invention is designed to take into account both EMI shielding film materials with and without protective film, which expands the applicability of the process, helps to reduce costs, and enhances process adaptability. Attached Figure Description

[0016] Figure 1 This is a schematic flowchart of a flexible circuit board EMI shielding film stamping and bonding integrated manufacturing method provided in Embodiment 1 of the present invention; Figure 2 This is a schematic diagram of the internal structure of the EMI shielding film roll provided by the present invention; Figure 3 This is a schematic diagram of the slitting structure of a specific EMI shielding film roll provided by the present invention; Figure 4 This is a schematic diagram of the structure of an integrated EMI shielding film punching and pasting device for flexible circuit boards provided in Embodiment 5 of the present invention; Figure 5 This is a schematic diagram of the punch device provided by the present invention; Figure 6 This is a schematic diagram of the bottom structure of the punch device provided by the present invention; Figure 7 This is a schematic diagram of the structure of the flexible circuit board provided by the present invention, in which several FPC patterns are set on the entire flexible circuit board before the EMI shielding film is attached; Figure 8 This is a schematic diagram of the structure of the flexible circuit board provided by the present invention, in which several FPC patterns are set on the entire circuit board and before the carrier film is peeled off after the EMI shielding film is attached. Figure 9 This is a schematic diagram of the structure of the flexible circuit board provided by the present invention after the carrier film is peeled off, in which several FPC patterns are set on the entire flexible circuit board. Figure 10 This is a schematic diagram of the structure of a pin fixture provided in Embodiment 6 of the present invention; Figure 11 This is a schematic diagram of the structure of the ejector pin fixture base provided by the present invention; Figure 12 This is a schematic diagram of the structure of the ejector pin fixture cover plate provided by the present invention. Detailed Implementation

[0017] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0018] See Figure 1 This is a flowchart illustrating an integrated fabrication method for EMI shielding film on a flexible circuit board according to Embodiment 1 of the present invention, which includes the following steps: Customized EMI shielding film roll cutting steps: Match the cutting feed width to the design width of a single EMI shielding film. The cutting feed width is the design width plus the preset process margin.

[0019] In this step, a roll of EMI shielding film composite material with a width of 250mm is used as the raw material. (See also...) Figure 2 The typical structure of this EMI shielding film includes, from top to bottom, a protective film 10a, an adhesive layer 10b (conductive adhesive layer or conductive coating layer), a metal layer 10c (such as copper foil, conductive cloth, etc. shielding layer), an insulating layer 10d, and a bottom carrier film 10e (i.e., the bottom protective film).

[0020] Based on the design width of a single EMI shielding film 10 on the target product, the wide raw material is pre-cut. The cutting rules are designed to leave reasonable process margins for subsequent punching, as follows: When the feed design width of a single EMI part is ≤ 10mm, the cutting width is the design width + process margin of 6mm (i.e., an increase of 3mm on one side).

[0021] When 10mm < feed design width ≤ 20mm, the slitting width is the design width + process edge distance of 8mm (4mm increase on each side).

[0022] When 20mm < feed design width ≤ 30mm, the slitting width is the design width + process edge distance 10mm (5mm increase on each side).

[0023] When 30mm < feed design width ≤ 40mm, the cutting width is the design width + 14mm (7mm increase on each side).

[0024] After slitting, EMI shielding film rolls of a specific width are obtained for use in integrated equipment.

[0025] Fangbang series EMI filters are preferred, as their protective film is easy to peel off after lamination.

[0026] Pretreatment of the pin area of ​​flexible circuit board and EMI shielding film.

[0027] In this step, as shown in the figure, several FPC patterns 20 are set on the entire flexible circuit board 2, corresponding to each FPC pattern area that needs to be bonded with the EMI shielding film. A circular pin hole 21 with a diameter of 2.0 mm is pre-opened on the waste area outside the effective boundary of the FPC pattern; this hole plays a key positioning and pinning role in the subsequent peeling process.

[0028] The external dimensions of the single EMI shielding film 10 are larger than the effective graphic edge of its corresponding flexible circuit board, by 0.5 mm on each side, to ensure complete coverage of the corresponding pin hole 21 on the FPC.

[0029] The design of a single EMI shielding film extends outward by at least one pin area, which corresponds to and covers the pin holes of the FPC. The adhesive film layer, metal layer, and insulating layer of the pin area of ​​the single EMI shielding film have pin holes for the EMI shielding film at the positions of the pin holes of the FPC. The protective film and carrier film of the single EMI shielding film do not have pin holes and are in a complete sheet form.

[0030] Feeding and unwinding: The roll of EMI shielding film is released through the feeding device and conveyed to the bonding area via the drive shaft.

[0031] In this step, as shown in the figure, EMI shielding film rolls of a specific width are conveyed to the waste recycling drive shaft via the feeding device 300 and several feeding drive shafts, and then recycled by the waste recycling device 400.

[0032] The EMI shielding film between the feeding drive shaft and the waste recycling drive shaft is located below the punch device 100, and the heating bonding platform is located below the EMI shielding film strip 1, so that the punch body 100, the EMI shielding film strip 1, and the heating bonding platform 200 of the punch device are in the same position in the longitudinal direction.

[0033] Before the EMI shielding film tape 1 enters the bonding area, the protective film is recovered by the protective film recovery device 401, exposing the adhesive film layer 10b.

[0034] The feed length and pull distance (pull distance) are automatically calculated based on the dimensions of each EMI unit. For example: when the feed length is <10mm, the pull distance is set to 2mm; when the feed length is 10-20mm, the pull distance is set to 2.5mm; and when the feed length is 20-30mm, the pull distance is set to 3mm. This ensures the stability and accuracy of material feeding.

[0035] Visual positioning: The flexible circuit board at the preset punching position is pre-captured using a visual alignment system. Then, the EMI shielding film delivered to the preset punching position is also pre-captured, and the offset is calculated and the position is corrected.

[0036] In this step, the computer control of vision alignment is an automated process of "image acquisition - feature recognition - coordinate calculation - motion compensation - closed-loop verification". It deeply integrates machine vision algorithms, precision mechanical motion control, and programmable logic control, and is the core technology guarantee for achieving ±0.2mm high-precision bonding, improving material utilization and production efficiency.

[0037] The control process of the vision alignment system for the FPC automatic punching and pasting equipment is as follows: 1. System startup and initialization: The device is powered on, the vision system loads preset parameters (such as MARK point template, alignment accuracy tolerance ±0.2mm, etc.), and each motion axis returns to zero.

[0038] 2. FPC loading and fixing: The flexible printed circuit board (FPC) to be processed is fixed on a high-precision motion platform by vacuum adsorption or clamps.

[0039] 3. Acquire FPC reference coordinates: The heated bonding platform moves the FPC, bringing pre-designed positioning marks (MARK points) on the FPC into the field of view of an industrial camera. The camera's CCD lens captures images of the MARK points.

[0040] The image processing module identifies the center of the MARK point and calculates its precise coordinates (X_fpc, Y_fpc) and angle (θ_fpc) in the machine coordinate system. X_fpc represents the horizontal (usually left-right) coordinate of the center of the positioning mark (MARK point) on the FPC in the machine coordinate system, reflecting the offset distance of the FPC relative to the machine origin on the horizontal axis. Y_fpc represents the vertical (usually front-back) coordinate of the center of the positioning mark (MARK point) on the FPC in the machine coordinate system, reflecting the offset distance of the FPC relative to the machine origin on the vertical axis. θ_fpc (angle) represents the rotation angle (yaw angle) of the positioning mark (MARK point) on the FPC relative to the reference axis of the machine coordinate system, reflecting whether the FPC has tilted on the adsorption platform and the specific angle of tilt.

[0041] 4. EMI shielding film roll loading and pre-positioning: Load the slit EMI shielding film roll 1 into the feeding device 300 and pull it to the punching station.

[0042] 5. Acquire EMI reference coordinates: The camera moves above the preset positioning mark (MARK point) on the EMI tape. The camera captures and identifies the MARK point of the EMI tape, and calculates its coordinates (X_emi, Y_emi) and angle (θ_emi) in the machine coordinate system.

[0043] 6. Calculate position offset: The vision control system compares the coordinates (X_fpc, Y_fpc, θ_fpc) of the FPC with the coordinates (X_emi, Y_emi, θ_emi) of the EMI tape, and calculates the translational deviation (ΔX, ΔY) and rotational deviation (Δθ) in the X and Y directions.

[0044] 7. Accuracy Judgment: Determine whether the calculated offset (ΔX, ΔY, Δθ) is within the set tolerance range (e.g., ±0.1mm).

[0045] 8. Closed-loop compensation and confirmation: If the alignment is OK: the offset is within the tolerance range, and the vision system sends an "alignment complete" signal to the programmable logic controller (PLC) control system.

[0046] If the alignment is NG (out of tolerance), the offset exceeds the acceptable limit. The vision system converts the offset into compensating motion commands for the high-precision motion heating bonding platform (adjusting the FPC position) and / or the feeding device (adjusting the EMI tape position). After the platform performs fine-tuning, the process returns to step 5, re-acquires the EMI image for alignment confirmation, and forms a closed-loop control until the accuracy meets the standard, achieving high-precision pre-alignment of the EMI tape with the target position on the FPC.

[0047] Negative pressure adsorption preparation: Turn on the vacuum generator to generate negative pressure through the air intake hole array at the bottom of the punch device.

[0048] In this step, the vacuum generating device can be a vacuum pump or a negative pressure gas source.

[0049] Punching and holding pressure: The driving punch moves down to contact the EMI shielding film for punching. The negative pressure at its bottom adsorbs the punched EMI shielding film and continues to move down to the flexible circuit board for pressurization and heating bonding.

[0050] In this step, after receiving the "alignment complete" signal, the PLC controls the integrated punching module to drive the punch device to move downward, completing the online punching of individual EMI shielding film units from the EMI shielding film roll. At the moment the punching action is completed, the punched individual EMI units (pcs EMI) are firmly sucked by the air suction hole at the bottom of the punch body to prevent displacement.

[0051] Subsequently, the punch die continues to move downwards with the adsorbed PCS EMI until it contacts the FPC already placed on the heat-bonding platform 200. Since the working platform where the FPC is located has been preheated to 80-100°C (preferably 90°C), when the PCS EMI comes into contact with the heated FPC, the adhesive layer 10b of the EMI shielding film develops initial tack upon contact with a temperature above 80°C, thus firmly bonding the PCS EMI to the designated position on the FPC. Punching and bonding are completed in the same station within a continuous cycle, achieving true "integration".

[0052] The positioning and repeatability accuracy of the entire stamping process can be controlled within ±0.2mm. The smallest EMI unit size that can be processed is 3mm × 3mm, and the largest is 30mm × 60mm. During processing, the short side direction should be used as the feeding direction of the tape roll.

[0053] Embodiment 2 of the present invention provides a method for integrated punching and bonding of EMI shielding film on flexible circuit boards, based on Embodiment 1, except that the punching and pressing steps are followed by the following hot pressing curing step: The flexible circuit board with the EMI shielding film applied is transferred into the fast pressing mechanism.

[0054] The side of the flexible circuit board with the gold fingers, buttons, and / or pads facing upwards.

[0055] This step prevents damage to delicate structures on the FPC, such as gold fingers, buttons, or solder pads, during the lamination process.

[0056] Pre-compression removes air bubbles, followed by full compression.

[0057] In this step, the pre-compression time is 5 seconds, and the actual pressure parameters are: temperature 180℃ ±5℃, pressure 100 kg, and time 100 seconds.

[0058] This embodiment is for products that require higher bonding strength. After punching, hot pressing and curing can be performed to enhance the adhesion between the EMI shielding film and the FPC.

[0059] Embodiment 3 of the present invention provides an integrated punching and bonding method for flexible circuit board EMI shielding film, based on Embodiment 1, the difference being that a protective film peeling step is included after the punching and pressing steps: S701. Place the flexible circuit board with the EMI shielding film applied onto the electrically insulated base of the ejector fixture.

[0060] In this step, the ejector fixture consists of two parts: a base 31 and a cover plate 32, connected by a hinge 33. The base is made of 10mm bakelite, which has high mechanical strength and anti-static properties, and its main function is to support the FPC. The cover plate is made of 0.15mm thick SUS304 steel, and its main function is to fix the circuit board and press the FPC downward onto the base, ensuring that the ejector pin can effectively lift the EMI protection film.

[0061] S702. The flexible circuit board is pressed onto the base by the cover plate of the tooling positioning hole ejector fixture.

[0062] In this step, tooling positioning pins are set at the four corners of the ejector fixture base, and tooling positioning holes are provided on the cover plate. The FPC is placed between the base and the cover plate and aligned and stacked through the tooling positioning pins 31a of the ejector fixture base, the FPC positioning holes, and the tooling positioning holes on the cover plate.

[0063] S703. The ejector pins fixed on the ejector pin fixture base corresponding to the ejector pin holes pre-drilled on each flexible circuit board lift up the carrier film on the EMI shielding film corresponding to the preset ejector pin holes.

[0064] In this step, a number of ejector pins 31b are provided on the ejector pin fixture base, and ejector pin holes 32b are provided on each ejector pin cover plate. The ejector pins have a diameter of 1.9 mm and a height of 2 mm. The ejector pin hole for each FPC is a circular ejector pin hole with a diameter of 2.0 mm, and the ejector pin hole corresponding to the EMI shielding film covering each FPC is also a circular ejector pin hole with a diameter of 2.0 mm. The ejector pins pass through the ejector pin holes 21 of each FPC, the ejector pin holes 11 of the EMI shielding film, and the ejector pin holes 32b of the cover plate in sequence, thus lifting the carrier film 10e of the EMI shielding film.

[0065] This embodiment is applicable to conventional EMI tapes with a "protective film-adhesive film-metal layer-insulating layer-carrier film" structure. Before stamping the individual EMI shielding film, the protective film has been recycled, leaving only the carrier film, which is lifted up by a ejector pin. It is especially suitable for low-cost EMI tapes with a "adhesive film-metal layer-insulating layer-carrier film" structure (without a protective film), reducing the process of recycling the protective film and simplifying the process.

[0066] S704. Use a high-pressure air gun to blow air onto the edge of the carrier film, and use the airflow to peel the insulating layer of the entire carrier film from the EMI shielding film.

[0067] Embodiment 4 of the present invention provides an integrated punching and bonding method for flexible circuit board EMI shielding film, based on Embodiment 1, the difference being that a protective film peeling step is included after the punching and pressing steps: S711, Waste recycling: After punching is completed, the punch device rises and resets, and the waste is wound and recycled by the waste recycling device.

[0068] See Figure 4 Embodiment 5 of the present invention provides a schematic diagram of a flexible circuit board EMI shielding film stamping and bonding integrated device. The device includes a punch device 100, with an air pipe hole 110 formed within the punch body. An array of suction holes 120 is formed at the bottom of the punch body. The air pipe hole and the suction hole array are interconnected to form a negative pressure adsorption channel. The other end of the air pipe hole 110 is connected to an external vacuum pump or negative pressure air source via an air pipe connector and an air supply pipe. The shape of the punch body is the same as that of a single EMI shielding film.

[0069] The equipment also includes a heat bonding platform 200 below the punch device, an EMI shielding film feeding device 300 located on one side of the heat bonding platform, a waste recycling device 400 located on the other side of the heat bonding platform, a camera, an image processing module, and a PLC located above the heat bonding platform 200.

[0070] The feeding device 300 and the waste recycling device 400 cooperate to transport the EMI shielding film strip 1 through the drive shaft. The protective film recycling device 401 is set next to the feeding device so that the protective film 10a of the EMI shielding film strip 1 is removed before it enters the bonding area, exposing the adhesive film layer 10b.

[0071] Above the EMI shielding film strip 1 is a punch device 100, and an FPC 2 is placed on a heat-bonding platform 200. The punch body punches the EMI shielding film, and the negative pressure at its bottom adsorbs the punched EMI shielding film and continues to move downwards to the flexible circuit board for pressure heating and bonding. The heat-bonding platform is a temperature-controlled heating platform used to preheat the FPC and improve the bonding effect. Before bonding, the heat-bonding platform preheats the FPC locally or entirely to activate the adhesive layer of the EMI material and improve the initial adhesion. The heat-bonding platform is a high-precision motion platform that moves along the XYZ three-dimensional direction and rotates horizontally. After the punch body punches one EMI shielding film, the punch body resets and rises. The PLC controls the moving platform to the next FPC pattern where the EMI shielding film has not been bonded. Simultaneously, the EMI shielding film strip is moved to the next unpunched EMI shielding film station by the feeding device and the waste recycling device according to the stretch.

[0072] In this embodiment, the camera is a CCD lens 500, used for visual positioning of the heat bonding platform (the area to be bonded); the output end of the CCD lens is connected to an image processing module, which is electrically connected to a PLC, used to control the position movement of the heat bonding platform and / or the feeding device for stamping coordinate compensation. For specific compensation methods, please refer to Embodiment 1, which will not be repeated here.

[0073] See Figure 12This is a schematic diagram of the structure of a pin fixture provided in Embodiment 6 of the present invention. The pin fixture 3 includes a base 31 and a cover plate 32. The base 31 is connected to the cover plate 32 by a hinge 33. A tooling positioning pin 31a is provided on the base, and a tooling positioning hole 32a corresponding to the tooling positioning pin is provided on the cover plate. The base is also provided with a plurality of pins 31b corresponding to the pin holes of the flexible circuit board, and a plurality of pin holes 32b are provided on the cover plate. In use, the entire FPC 2 is first placed on the base 31, and then aligned by the tooling positioning pin 31a entering the tooling positioning hole 32a. When the base 31 and the cover plate 32 are closed, the ejector pin 31b passes through the ejector pin hole 21 of the FPC, the ejector pin hole 11 covering the EMI shielding film on the flexible circuit board, and enters the ejector pin hole 32b of the cover plate, lifting the carrier film 10e covering the EMI shielding film on the flexible circuit board. A high-pressure air gun is used to blow up the edge of the lifted carrier film 10e, and the airflow peels the entire carrier film 10e from the insulating layer 10d of the EMI shielding film.

[0074] This embodiment features a unique ejector tool combined with a high-pressure air gun design, enabling rapid and clean non-contact peeling of the EMI protective film, solving the problems of low efficiency and easy product damage associated with traditional manual peeling.

[0075] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A flexible circuit board EMI shielding film punching and pasting integrated manufacturing method, characterized in that, Includes the following steps: Feeding and unwinding: The roll of EMI shielding film is released by the feeding device and conveyed to the bonding area via the drive shaft; Visual positioning: The visual alignment system is used to pre-acquire images of the flexible circuit board at the preset punching position, and then images of the EMI shielding film delivered to the preset punching position are acquired. The offset is calculated and the position is corrected. Negative pressure adsorption preparation: Turn on the vacuum generator to generate negative pressure through the air intake hole array at the bottom of the punch device; Punching and holding pressure: The driving punch moves down to contact the EMI shielding film for punching. The negative pressure at its bottom adsorbs the punched EMI shielding film and continues to move down to the flexible circuit board for pressurization and heating bonding.

2. The method of claim 1, wherein, The step prior to the feeding and unwinding process also includes a customized slitting step for EMI shielding film rolls: The slitting and feeding width is matched according to the design width of a single EMI shielding film. The slitting and feeding width is the design width plus the preset process margin.

3. The method of claim 2, wherein, The design width of a single EMI shielding film is less than or equal to 10 mm, and the slitting and feeding width is the design width plus 6 mm; the design width of a single EMI shielding film is greater than or equal to 10 mm and less than or equal to 20 mm, and the slitting and feeding width is the design width plus 8 mm. For a single EMI shielding film with a design width greater than or equal to 20mm and less than or equal to 30mm, the slitting feed width is the design width plus 10mm; for a single EMI shielding film with a design width greater than or equal to 30mm and less than or equal to 40mm, the slitting feed width is the design width plus 14mm.

4. The method of claim 1, wherein, Prior to the visual positioning step, a pretreatment step is also included for the pin areas of the flexible circuit board and EMI shielding film: On the surface of the flexible circuit board, corresponding to each area where an EMI shielding film needs to be attached, at least one pin hole is pre-drilled in the waste area outside the effective pattern boundary of the flexible circuit board. The design size of a single EMI shielding film is larger than the effective edge of its corresponding flexible circuit board. The design pattern of a single EMI shielding film extends outward by at least one ejector pin area, which is used to cover the ejector pin hole.

5. The method of claim 1, wherein, Following the punching and synchronous bonding steps, the following hot-pressing curing step is also included: The flexible circuit board with the EMI shielding film applied is transferred into the fast pressing mechanism; The side of the flexible circuit board with the gold fingers, buttons and / or pads facing upwards; Pre-compression removes air bubbles, followed by full compression.

6. The method of claim 5, wherein, The pre-compression time is 5 seconds, and the actual pressure parameters are: temperature 180℃±5℃, pressure 100 kg, and time 100 seconds.

7. The method of claim 1, wherein, The step following the punching and synchronous bonding steps also includes a protective film peeling step: Place the flexible circuit board with the EMI shielding film applied onto the electrically insulated base of the ejector fixture; The flexible circuit board is pressed onto the base by the cover plate of the positioning hole pin fixture; The ejector pins fixed on the ejector pin fixture base corresponding to the ejector pin holes pre-drilled on each flexible circuit board lift up the carrier film on the EMI shielding film corresponding to the pre-drilled ejector pin holes. A high-pressure air gun is used to blow air onto the edge of the carrier film, and the airflow is used to peel the insulating layer of the entire carrier film from the EMI shielding film.

8. A thimble jig characterized by, The device includes a base and a cover plate. The base is equipped with tooling positioning pins, and the cover plate is equipped with tooling positioning holes that mate with the tooling positioning pins. The base is also equipped with several ejector pins that correspond to the ejector pin holes of the flexible circuit board, and the cover plate is equipped with several ejector pin holes. When the base and the cover plate are closed, the ejector pins pass through the ejector pin holes of the flexible circuit board, cover the ejector pin holes of the EMI shielding film on the flexible circuit board, and enter the ejector pin holes of the cover plate.

9. A flexible circuit board EMI shielding layer punching and pressing integrated device, comprising a punch device, characterized in that, The punch body of the stamping device has an air pipe hole, and the bottom of the punch body has an air intake hole array. The air pipe hole and the air intake hole array are interconnected to form a negative pressure adsorption channel. The other end of the tracheal port is connected to an external vacuum pump or negative pressure gas source via a tracheal connector and a gas delivery pipe. The punch body punches and cuts the EMI shielding film. The negative pressure at its bottom adsorbs the punched EMI shielding film and continues to move downwards to the flexible circuit board for pressure heating and bonding.

10. The device as claimed in claim 9, characterized in that, It also includes a heat-bonding platform located below the punch device, an EMI shielding film feeding device located on one side of the heat-bonding platform, a camera, an image processing module, and a programmable logic controller located above the heat-bonding platform; the output end of the camera is connected to the image processing module, and the image processing module is electrically connected to the programmable logic controller to control the position movement of the heat-bonding platform and / or the feeding device for punching coordinate compensation.

Images