Method for manufacturing a connected circuit board structure

Abstract

The application discloses a manufacturing method of a connected circuit board structure, which comprises the following steps: a pre-step of providing two substrates, each of which comprises a through hole and a conductive copper column; a setting step of setting a peelable film and a prepreg on the surface of one of the substrates; a groove forming step of forming a groove away from the surface of the substrate from the peelable film; a filling step of filling conductive paste in the groove; a first pressing step of pressing the substrate with the peelable film, the prepreg and the conductive paste to solidify the conductive paste and form a conductive connection structure; and a second pressing step of pressing the substrate with the prepreg and the conductive connection structure and the other substrate. The manufacturing method of the connected circuit board structure can solve the problem of low process yield caused by the high depth-diameter ratio in the prior manufacturing method of the circuit board structure.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a circuit board structure, and more particularly to a method for manufacturing a connecting circuit board structure. Background Technology

[0002] In existing circuit board manufacturing methods, a high aspect ratio can easily lead to low process yield. For example, a high aspect ratio can cause drill bits to break, resulting in product scrap, or the copper thickness of the electroplated holes may not meet requirements, thus affecting product quality. Summary of the Invention

[0003] This invention discloses a manufacturing method for a connecting circuit board structure, which is mainly used to improve the problem of low process yield when the aspect ratio is too high in the existing circuit board structure manufacturing method.

[0004] One embodiment of the present invention discloses a method for manufacturing a connected circuit board structure, comprising: a pre-processing step of providing two substrates, each substrate including a through-hole penetrating the substrate and a conductive copper pillar located in the through-hole; a setting step of setting a peelable film and a semi-cured sheet on the surface of one of the substrates; a groove forming step of forming a groove from the surface of the peelable film away from the substrate, wherein the conductive copper pillar is exposed from the groove; a filling step of filling the groove with a conductive paste; a first pressing step of pressing the substrates having the peelable film, semi-cured sheet and conductive paste formed thereon to cure the conductive paste to form a conductive connection structure; a removal step of removing the peelable film; and a second pressing step of pressing the substrate having the semi-cured sheet and conductive connection structure formed thereon with the other substrate, such that the conductive connection structure connects the two conductive copper pillars of the two substrates and forms a connected circuit board structure.

[0005] Optionally, in each substrate, the diameter of the via is between 0.15 mm and 0.35 mm, and the depth of the via is between 3 mm and 6 mm.

[0006] Optionally, the ratio between the depth and diameter of the through hole is between 8.57 and 40.

[0007] Optionally, in the groove forming step, the groove includes an annular sidewall and a bottom wall, the annular sidewall being formed by a peelable film and a prepreg together, and the bottom wall being formed by a conductive copper pillar.

[0008] Optionally, in the groove forming step, the groove is formed by laser; wherein the conductive connection structure tapers in the direction from one substrate to the other substrate.

[0009] Optionally, in the groove forming step, the groove is formed by mechanical drilling; wherein the width of the conductive connection structure is uniform.

[0010] Optionally, in the first pressing step, the prepreg has not yet been cured, and in the second pressing step, the prepreg is cured to form an insulating layer between the two substrates.

[0011] Optionally, the height of the conductive connection structure is between 50 micrometers and 250 micrometers.

[0012] Optionally, in the first pressing step, a temperature between 80°C and 150°C and a pressure of 15 kg / cm² are used. 2 Up to 30 kg / cm 2 The pressure between them is maintained for 5 to 100 seconds.

[0013] Optionally, in the second pressing step, a temperature between 20°C and 250°C and a pressure of 5 kg / cm² are used. 2 Up to 35 kg / cm 2 The pressure between them is maintained for 200 to 360 minutes.

[0014] In summary, the manufacturing method of the interconnected circuit board structure of the present invention can effectively improve the problem of low process yield when the aspect ratio is too high in the existing circuit board structure manufacturing method by means of the technical solution of "first pressing step, pressing the substrate on which the peelable film, the prepreg and the conductive paste are formed to form the conductive connection structure" and "second pressing step, pressing the substrate on which the prepreg and the conductive connection structure are formed to another substrate to form the conductive connection structure connected to the two conductive copper pillars of the two substrates and forming the interconnected circuit board structure".

[0015] To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and drawings are only for illustrating the invention and are not intended to limit the scope of protection of the invention in any way. Attached Figure Description

[0016] Figure 1 This is a flowchart illustrating a method for manufacturing a connected circuit board structure according to an embodiment of the present invention.

[0017] Figure 2 This is a schematic diagram of the preliminary steps in the manufacturing method of the interconnected circuit board structure according to an embodiment of the present invention.

[0018] Figure 3 This is a schematic diagram illustrating the setup steps of a manufacturing method for a connected circuit board structure according to an embodiment of the present invention.

[0019] Figure 4This is a schematic diagram of the groove forming step in the manufacturing method of the interconnected circuit board structure according to an embodiment of the present invention.

[0020] Figure 5 This is a schematic diagram of the filling step in the manufacturing method of the interconnected circuit board structure according to an embodiment of the present invention.

[0021] Figure 6 This is a schematic diagram of the first pressing step in the manufacturing method of the interconnected circuit board structure according to an embodiment of the present invention.

[0022] Figure 7 This is a schematic diagram of the removal step in the manufacturing method of the interconnected circuit board structure according to an embodiment of the present invention.

[0023] Figure 8 This is a schematic diagram of the second lamination step in the manufacturing method of the interconnected circuit board structure according to an embodiment of the present invention.

[0024] Figure 9 This is a schematic diagram of the interconnected circuit board structure according to an embodiment of the present invention.

[0025] Figure 10 This is an exploded view of the interconnected circuit board structure according to an embodiment of the present invention. Detailed Implementation

[0026] The following specific embodiments illustrate the implementation of the "manufacturing method of the interconnected circuit board structure" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated beforehand. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0027] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the associated listed items.

[0028] [Manufacturing method for interconnected circuit board structures]

[0029] Please see Figure 1 As shown, Figure 1This is a flowchart illustrating a method for manufacturing a connected circuit board structure according to an embodiment of the present invention. One embodiment of the present invention provides a method for manufacturing a connected circuit board structure. The method includes a pre-processing step S110, a setting step S120, a groove forming step S130, a filling step S140, a first pressing step S150, a removal step S160, and a second pressing step S170. Of course, the method for manufacturing the connected circuit board structure may include other steps as needed, and the present invention does not impose limitations thereon.

[0030] Please see Figure 2 As shown, Figure 2 This is a schematic diagram of the preliminary steps in the manufacturing method of the interconnected circuit board structure according to an embodiment of the present invention. In the preliminary step S110, two substrates 1 are provided, each substrate 1 including at least one through-hole 11 penetrating the substrate and at least one conductive copper pillar 12 located in the through-hole 11. For ease of explanation, each substrate 1 is presented as a single layer, but in practical applications, each substrate 1 can be a stacked structure (or multilayer board) formed by overlapping multiple insulating layers and multiple circuit layers. Furthermore, in this embodiment, each substrate 1 includes two through-holes 11 and two conductive copper pillars 12 as an example, but the present invention is not limited thereto. In other embodiments, each substrate 1 may include one or more through-holes 11 and conductive copper pillars 12.

[0031] In each of the substrates 1 described in this embodiment, the aperture D of the through hole 11 can be between 0.15 mm and 0.35 mm, and the depth H1 of the through hole 11 can be between 3 mm and 6 mm, but the present invention is not limited thereto. Alternatively, the ratio between the depth H1 and the aperture D of the through hole 11 can be between 8.57 and 40.

[0032] Please see Figure 3 As shown, Figure 3 This is a schematic diagram of the setup steps in the manufacturing method of the interconnected circuit board structure according to an embodiment of the present invention. In the setup step S120, a peelable film 2 and a semi-cured sheet 3 are disposed on the surface of one of the substrates 1. The semi-cured sheet 3 is disposed between the peelable film 2 and the substrate 1. The semi-cured sheet 3 can be, for example, a glass fiber cloth impregnated with epoxy resin, but the present invention is not limited thereto.

[0033] Please see Figure 4 As shown, Figure 4This is a schematic diagram of the groove forming step in the manufacturing method of the interconnected circuit board structure according to an embodiment of the present invention. In the groove forming step S130, a groove 4 is formed from the surface of the peelable film 2 away from the substrate 1, and the conductive copper pillar 12 is exposed from the groove 4. In the groove forming step S130, the groove 4 includes an annular sidewall 41 and a bottom wall 42. The annular sidewall 41 is formed by the peelable film 2 and the prepreg 3 together, and the bottom wall 42 is formed by the conductive copper pillar 12. Furthermore, in the groove forming step S130, the groove 4 penetrates through the peelable film 2 and the prepreg 3.

[0034] Please see Figure 5 As shown, Figure 5 This is a schematic diagram of the filling step in the manufacturing method of the interconnected circuit board structure according to an embodiment of the present invention. In the filling step S140, a conductive paste 5 is filled into the groove 4. The conductive paste may be, for example, copper paste, but the present invention is not limited thereto. Furthermore, the conductive paste 5 may be substantially flush with the peelable film 2, but the present invention is not limited thereto. Alternatively, the surface of the conductive paste 5 may be slightly lower than the peelable film 2.

[0035] Please see Figure 6 As shown, Figure 6 This is a schematic diagram of the first lamination step in the manufacturing method of the interconnect circuit board structure according to an embodiment of the present invention. In the first lamination step S150, the substrate on which the peelable film 2, the prepreg 3, and the conductive paste 5 are formed are laminationd to cure the conductive paste 5 into a conductive connection structure 5'. The height H2 of the conductive connection structure 5' can be between 50 micrometers and 250 micrometers, but the present invention is not limited thereto. The peelable film 2 can protect the prepreg 3 in the first lamination step S150, and the surface of the prepreg 3 is not exposed from the peelable film 2. In the first lamination step S150, a temperature between 80°C and 150°C and a pressure of 15 kg / cm² can be used. 2 Up to 30 kg / cm 2 The pressure between them is pressed together for 5 to 100 seconds, but the invention is not limited thereto.

[0036] It is worth mentioning that in the groove forming step S130 of this embodiment, the groove 4 can be formed by laser, and the conductive connection structure 5' is tapered along the direction from one of the substrates 1 to the other substrate 1, but the present invention is not limited thereto. Similarly, in this embodiment, the groove 4 is tapered along the direction from one of the substrates 1 to the other substrate 1.

[0037] In another embodiment, the groove forming step S130 can be performed by mechanical drilling to form the groove 4, and the width W of the conductive connection structure 5' is uniform (e.g., Figure 9 and Figure 10 (As shown). Since the shape of the conductive connection structure 5' can correspond to the shape of the groove 4, in other words, the width of the groove 4 is also consistent. However, the groove 4 is not limited to being formed by mechanical drilling.

[0038] Please see Figure 7 As shown, Figure 7 This is a schematic diagram of the removal step in the manufacturing method of the interconnected circuit board structure according to an embodiment of the present invention. In the removal step S160, the peelable film 2 is removed. Since the peelable film 2 is removed after the removal step S160, the height of the groove 4 can be slightly reduced, and the annular sidewall 41 of the groove 4 is formed only by the prepreg 3.

[0039] Please see Figure 8 As shown, Figure 8 This is a schematic diagram of the second lamination step in the manufacturing method of the interconnected circuit board structure according to an embodiment of the present invention. In the second lamination step S170, the substrate on which the prepreg 3 and the conductive connection structure 5' are formed is laminated with another substrate 1, so that the conductive connection structure 5' is connected to the two conductive copper pillars 12 of the two substrates 1 and forms an interconnected circuit board structure 100.

[0040] It is worth mentioning that in the first pressing step S150, the prepreg 3 is not yet cured, and in the second pressing step S170, the prepreg 3 is cured to form an insulating layer 3' located between the two substrates 1. That is, the insulating layer 3' and the conductive connection structure 5' can be located between the two substrates 1, and the two conductive copper pillars 12 of the two substrates 1 can be connected to each other through the conductive connection structure 5'.

[0041] In the second pressing step S170, a temperature between 20°C and 250°C and a pressure of 5 kg / cm² can be used. 2 Up to 35kg / cm 2The pressure between the two substrates is maintained for 200 to 360 minutes, but the present invention is not limited to this. That is, the time of the first pressing step S150 is shorter than the time of the second pressing step S170. Through the first pressing step S150, the conductive paste 5 can be quickly pressed to cure into the conductive connection structure 5', and then the prepreg 3 is cured through the second pressing step S170, so that the two substrates 1 are connected through the insulating layer 3' and the two conductive copper pillars 12 of the two substrates 1 can be connected through the conductive connection structure 5'.

[0042] [Connectable circuit board structure]

[0043] Please see Figures 8 to 10 As shown, Figure 9 This is a schematic diagram of the interconnected circuit board structure according to an embodiment of the present invention, and Figure 10 This is an exploded view of the interconnected circuit board structure according to an embodiment of the present invention. Furthermore... Figure 8 This can also be viewed as a schematic diagram of the interconnected circuit board structure of an embodiment of the present invention.

[0044] This invention also provides a connecting circuit board structure 100. The connecting circuit board structure can be obtained by performing the aforementioned manufacturing method for a connecting circuit board structure, but this invention is not limited thereto. The connecting circuit board structure 100 includes two substrates 1, an insulating layer 3', and at least one conductive connection structure 5'.

[0045] Each of the substrates 1 includes at least one through-hole 11 penetrating the substrate 1 and at least one conductive copper pillar 12 located in the through-hole 11. In each of the substrates 1, the diameter D of the through-hole 11 can be between 0.15 mm and 0.35 mm, and the depth H1 of the through-hole 11 can be between 3 mm and 6 mm, but the present invention is not limited thereto. The ratio between the depth H1 and the diameter D of the through-hole 11 can be greater than 8, but the present invention is not limited thereto. Alternatively, the ratio between the depth H1 and the diameter D of the through-hole 11 can be between 8.57 and 40.

[0046] The insulating layer 3' is located between the two substrates 1, and the insulating layer 3' and the conductive copper pillar 12 of one of the substrates 1 define a groove 4. Specifically, the groove 4 includes an annular sidewall 41 and a bottom wall 42, the annular sidewall 41 being formed by the insulating layer 3', and the bottom wall 42 being formed by one of the metal pads 121 of the conductive copper pillar 12.

[0047] The groove 4 can be a laser groove (e.g., Figure 8As shown), and the width W of the conductive connection structure 5' tapers along the direction from one of the substrates 1 toward the other substrate 1. Alternatively, the groove 4 can be a machine-drilled groove (e.g. Figure 9 and Figure 10 As shown in the figure, the width W of the conductive connection structure 5' is consistent.

[0048] The conductive connection structure 5' is located in the groove 4 and is connected to the two conductive copper pillars 12 of the two substrates 1. The height H2 of the conductive connection structure 5' can be between 50 micrometers and 250 micrometers, but the present invention is not limited thereto. Alternatively, the height H2 of the conductive connection structure 5' can be between 100 micrometers and 200 micrometers.

[0049] In this embodiment, the interconnected circuit board structure 100 includes two conductive connection structures 5' as an example, but the present invention is not limited thereto. In other embodiments, the number of conductive connection structures 5' may be one or more.

[0050] The conductive connection structure 5' can be formed by curing copper paste. Each of the conductive copper pillars 12 also includes two metal pads 121 located at its two ends, and the conductive connection structure 5' is connected to one of the metal pads 121 of one of the conductive copper pillars 12 and one of the metal pads 121 of the other conductive copper pillar 12.

[0051] [Beneficial Effects of the Embodiments of the Invention]

[0052] One of the beneficial effects of the present invention is that the manufacturing method of the interconnected circuit board structure of the present invention can effectively improve the problem of low process yield when the aspect ratio is too high in the existing circuit board structure manufacturing method by means of the technical solution of "first pressing step, pressing the substrate on which the peelable film, the prepreg and the conductive paste are formed to form the conductive connection structure" and "second pressing step, pressing the substrate on which the prepreg and the conductive connection structure are formed to another substrate to form the conductive connection structure connected to the two conductive copper pillars of the two substrates and forming the interconnected circuit board structure".

[0053] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made based on the description and drawings of the present invention are included within the protection scope of the present invention.

Claims

1. A method for manufacturing a connecting circuit board structure, characterized in that, The manufacturing method of the interconnected circuit board structure includes: The preliminary step involves providing two substrates, each substrate comprising a through-hole extending through the substrate and a conductive copper pillar located in the through-hole; The setup step involves setting a peelable film and a half-cured sheet on the surface of one of the substrates; In the groove forming step, a groove is formed from the surface of the peelable film away from the substrate; wherein the conductive copper pillar is exposed from the groove; In the filling step, a conductive paste is filled into the groove; The first pressing step involves pressing the substrate on which the peelable film, the prepreg and the conductive paste are formed, so that the conductive paste is cured to form a conductive connection structure. The removal step involves removing the peelable membrane; and In the second lamination step, the substrate with the prepreg and the conductive connection structure is laminated to another substrate, so that the conductive connection structure is connected to the two conductive copper pillars of the two substrates and forms a connected circuit board structure.

2. The manufacturing method of the interconnected circuit board structure according to claim 1, characterized in that, In each of the substrates, the diameter of the through hole is between 0.15 mm and 0.35 mm, and the depth of the through hole is between 3 mm and 6 mm.

3. The manufacturing method of the interconnected circuit board structure according to claim 1, characterized in that, The ratio between the depth and diameter of the through hole is between 8.57 and 40.

4. The manufacturing method of the interconnected circuit board structure according to claim 1, characterized in that, In the groove forming step, the groove includes an annular sidewall and a bottom wall. The annular sidewall is formed by the peelable film and the prepreg together, and the bottom wall is formed by the conductive copper pillar.

5. The manufacturing method of the interconnected circuit board structure according to claim 1, characterized in that, In the groove forming step, the groove is formed by laser; wherein the conductive connection structure tapers in a direction from one of the substrates toward the other substrate.

6. The manufacturing method of the interconnected circuit board structure according to claim 1, characterized in that, In the groove forming step, the groove is formed by mechanical drilling; wherein the width of the conductive connection structure is uniform.

7. The manufacturing method of the interconnected circuit board structure according to claim 1, characterized in that, In the first pressing step, the prepreg has not yet been cured, and in the second pressing step, the prepreg is cured to form an insulating layer between the two substrates.

8. The manufacturing method of the interconnected circuit board structure according to claim 1, characterized in that, The height of the conductive connection structure is between 50 micrometers and 250 micrometers.

9. The method for manufacturing the interconnected circuit board structure according to claim 1, characterized in that, In the first pressing step, a temperature between 80°C and 150°C and a pressure of 15 kg / cm² are used. 2 Up to 30 kg / cm 2 The pressure between them is maintained for 5 to 100 seconds.

10. The method for manufacturing the interconnected circuit board structure according to claim 1, characterized in that, In the second pressing step, a temperature between 20°C and 250°C and a pressure of 5 kg / cm² are used. 2 Up to 35 kg / cm 2 The pressure between them is maintained for 200 to 360 minutes.

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