Protective housing, surface treatment method for protective housing, and signal processing module

Abstract

The application provides a protective shell, a surface treatment method of the protective shell and a signal processing module, which can prolong the scalding perception time of a human hand and reduce the risk of an operator being scalded by the protective shell when plugging or unplugging the signal processing module. The protective shell comprises a metal shell and a heat insulation layer. An outer surface of the metal shell has a contact area, and the heat insulation layer is arranged on the contact area. The heat insulation layer is provided with a plurality of grooves, and openings of the plurality of grooves are located on a surface of the heat insulation layer away from the metal shell.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to a protective casing, a surface treatment method for the protective casing, and a signal processing module. Background Technology

[0002] With the explosive growth of data traffic, network devices need higher port density and faster port speeds to cope with the demand. This requires signal processing modules in network devices to have higher speed characteristics. To meet the demand for higher speeds, the power consumption of signal processing modules has become increasingly higher, and the internal operating temperature of the signal processing modules has also become higher. This makes the protective shell of the signal processing modules feel noticeably hot, increasing the risk of operators being burned by the protective shell when plugging and unplugging the signal processing modules. Summary of the Invention

[0003] This application provides a protective shell, a surface treatment method for the protective shell, and a signal processing module, which can extend the time for a person to perceive heat and reduce the risk of burns to the operator from the protective shell when inserting or removing the signal processing module.

[0004] Firstly, this application provides a protective housing, including a metal shell and a heat insulation layer. The outer surface of the metal shell has a contact area, and the heat insulation layer is disposed in the contact area. The heat insulation layer has multiple grooves, and the openings of the multiple grooves are all located on the surface of the heat insulation layer opposite to the metal shell. In this embodiment, by providing multiple grooves on the heat insulation layer, the surface of the heat insulation layer opposite to the metal shell is roughened. On the one hand, this increases the heat dissipation area of ​​the heat insulation layer, thereby improving the heat insulation performance of the heat insulation layer and reducing the temperature perceived by the human hand. On the other hand, it reduces the contact area between the human hand and the surface of the protective housing when the operator plugs and unplugs the signal processing module, prolongs the time the human hand feels the heat, reduces the sensation of burns, and thus helps to reduce the risk of burns to the human hand from the protective housing, achieving burn-free hot-plugging of the signal processing module.

[0005] In one possible implementation, the cross-sectional area of ​​each groove remains constant in the direction from the surface of the insulation layer away from the metal housing towards the metal housing. For example, the cross-sectional shape of each groove perpendicular to the outer surface of the metal housing can be rectangular or square.

[0006] In one possible implementation, the cross-sectional area of ​​each groove gradually decreases in the direction from the surface of the insulation layer away from the metal housing towards the metal housing. For example, the cross-sectional shape of each groove perpendicular to the outer surface of the metal housing is trapezoidal or triangular.

[0007] In one possible implementation, a plurality of grooves are spaced apart along a first direction, and each groove extends along a second direction intersecting the first direction. In this configuration, the multiple grooves are periodically arranged along the first direction to increase the heat dissipation area of ​​the insulation layer, thereby improving the insulation performance of the insulation layer, reducing the perceived temperature of the hand, extending the time the hand feels hot, reducing the sensation of burns, and thus helping to reduce the risk of burns from the protective shell, enabling burn-free hot-swappable signal processing module operation.

[0008] In one possible implementation, the plurality of grooves includes a plurality of first grooves and a plurality of second grooves. Along a first direction, the first grooves are spaced apart, and along a second direction, the plurality of second grooves are spaced apart, wherein the second direction intersects the first direction. This configuration, on the one hand, further increases the heat dissipation area of ​​the heat insulation layer, thereby improving the heat insulation performance of the heat insulation layer and reducing the temperature perceived by the human hand. On the other hand, it further reduces the contact area between the operator's hand and the surface of the protective shell when the signal processing module is plugged in or unplugged, thereby further extending the heat perception temperature of the hand on the protective shell, reducing the sensation of burns, and further reducing the risk of burns from the protective shell, thus achieving burn-free hot-plugging of the signal processing module.

[0009] In one possible implementation, the heat transfer coefficient of the insulation layer is 0.03 W / (m²). 2 ·K) to 0.5W / (m 2 Between ·K). Under this setting, the thermal conductivity of the insulation layer is low, thereby reducing the heat-sensing temperature of the protective shell to the operator's hands and reducing the risk of burns from the protective shell when the operator plugs or unplugs the signal processing module.

[0010] In one possible implementation, the protective shell further includes a protective layer located in the contact area and disposed on the surface of the heat insulation layer facing away from the metal shell. The protective layer has multiple recesses, the openings of which are all located on the surface of the protective layer facing away from the heat insulation layer. Each recess corresponds to a groove. With this configuration, since each recess of the protective layer corresponds to a groove, the shape of the protective layer and the shape of the heat insulation layer fit together, preventing the protective layer from affecting the heat insulation effect of the heat insulation layer and ensuring heat insulation.

[0011] In one possible implementation, the hardness of the protective layer is greater than that of the insulation layer. With this configuration, the protective layer can increase the structural strength of the insulation layer, preventing damage, detachment, and chipping of the grooves in the insulation layer during use, thereby ensuring good insulation performance.

[0012] In one possible implementation, the protective housing further includes an adhesive layer located in the contact area and connected between the metal casing and the insulation layer. It is understood that the adhesive layer increases the adhesion to the outer surface of the metal casing. By providing an adhesive layer between the insulation layer and the metal casing, the adhesion between the insulation layer and the metal casing can be improved, ensuring reliable connection between the insulation layer and the metal casing, thereby preventing the insulation layer from detaching and helping to ensure good thermal insulation performance.

[0013] In one possible implementation, the outer surface of the base metal casing is roughened. This configuration increases the roughness of the outer surface of the metal casing, thereby increasing the adhesion of the outer surface and improving the reliability of the connection between the insulation layer and the metal casing.

[0014] Secondly, this application also provides a signal processing module, including a signal processing component and a protective housing as described in any of the preceding claims, wherein the signal processing component is mounted inside the metal housing. It is understood that the protective housing can protect and support the signal processing component to prevent damage to it.

[0015] In one possible implementation, the signal processing module is either an optical module or an electrical module. When the signal processing module is an optical module, during the signal conversion process, the signal receiver of the signal processing component in the optical module, after receiving the optical signal from the corresponding fiber optic adapter, converts the optical signal into an electrical signal and then transmits the electrical signal to the signal transmitter of the signal processing component in the optical module. Upon receiving the electrical signal, the signal transmitter of the signal processing component in the optical module converts the electrical signal back into an optical signal, which is then emitted by the fiber optic adapter corresponding to the signal transmitter of the signal processing component in the optical module, thereby achieving photoelectric signal conversion. When the signal processing module is an electrical module, during the signal conversion process, the signal receiver of the signal processing component in the electrical module, after receiving the electrical signal from the corresponding fiber optic adapter, converts the electrical signal back into an optical signal and then transmits the optical signal to the signal transmitter of the signal processing component in the electrical module. Upon receiving the optical signal, the signal transmitter of the signal processing component in the electrical module converts the optical signal back into an electrical signal, which is then emitted by the fiber optic adapter corresponding to the signal transmitter of the signal processing component in the electrical module, thereby achieving photoelectric signal conversion.

[0016] Thirdly, this application also provides a surface treatment method for a protective casing, comprising: providing a metal casing, the outer surface of which has a contact area; forming a heat insulation layer in the contact area, the heat insulation layer having a plurality of grooves, the openings of the plurality of grooves being located on the surface of the heat insulation layer opposite to the metal casing.

[0017] The surface treatment method for the protective shell provided in this application forms a heat insulation layer in the contact area of ​​the metal shell and forms multiple grooves on the heat insulation layer. This roughens the surface of the heat insulation layer away from the metal shell. On the one hand, it increases the heat dissipation area of ​​the heat insulation layer, thereby improving the heat insulation performance of the heat insulation layer and reducing the temperature perceived by the human hand. On the other hand, it reduces the contact area between the human hand and the surface of the protective shell when the operator plugs and unplugs the signal processing module, prolongs the time for the human hand to perceive the heat, reduces the feeling of burn, and thus helps to reduce the risk of burns to the human hand from the protective shell, enabling the hot-plugging of the signal processing module without burns.

[0018] In one possible implementation, the step of forming a heat insulation layer in the contact area includes: forming a heat insulation material layer in the contact area; and forming a plurality of grooves on the heat insulation material layer to obtain the heat insulation layer. For example, a laser processing technique can be used to process the heat insulation material layer to form a plurality of grooves on the heat insulation material layer.

[0019] In one possible implementation, after providing a metal housing and before forming a heat insulation layer in the contact area, the surface treatment method for the protective housing further includes: forming an adhesive layer in the contact area, the adhesive layer being bonded between the metal housing and the heat insulation layer. It is understood that by providing an adhesive layer between the heat insulation layer and the metal housing, the adhesion between the heat insulation layer and the metal housing can be improved, ensuring reliable connection between the heat insulation layer and the metal housing, thereby preventing the heat insulation layer from detaching and thus helping to ensure good heat insulation performance of the heat insulation layer.

[0020] In one possible implementation, after providing a metal housing and before forming a heat insulation layer in the contact area, the surface treatment method for the protective housing further includes roughening the outer surface of the metal housing. For example, sandblasting or laser engraving can be used to roughen the outer surface of the metal housing to increase its roughness and adhesion, thereby improving the connection reliability between the heat insulation layer and the metal housing.

[0021] In one possible implementation, after the step of forming the heat insulation layer in the contact area, the surface treatment method of the protective shell further includes: forming a protective layer on the surface of the heat insulation layer facing away from the metal shell, the protective layer having a plurality of recesses, the openings of the plurality of recesses being located on the surface of the protective layer facing away from the heat insulation layer, and each recess corresponding to a groove. It is understood that the protective layer can increase the structural strength of the heat insulation layer, preventing damage, detachment, and chipping of the grooves in the heat insulation layer during use, thereby ensuring good heat insulation performance. Simultaneously, since each recess of the protective layer corresponds to a groove, the shape of the protective layer fits the shape of the heat insulation layer, preventing the protective layer from affecting the heat insulation performance of the heat insulation layer and ensuring good heat insulation performance. Attached Figure Description

[0022] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of a signal processing module provided in an embodiment of this application;

[0024] Figure 2 yes Figure 1 The diagram shows the structure of the protective casing in the signal processing module.

[0025] Figure 3 yes Figure 2 The diagram shows a partial cross-sectional view of the protective housing in the first embodiment.

[0026] Figure 4 yes Figure 3 A partial structural diagram of the heat insulation layer in the protective casing is shown.

[0027] Figure 5 yes Figure 2 The diagram shows a partial cross-sectional structure of the protective casing in the second embodiment.

[0028] Figure 6 yes Figure 5 A partial structural diagram of the heat insulation layer in the protective casing is shown.

[0029] Figure 7 This is a schematic flowchart of a surface treatment method for a protective casing provided in this application;

[0030] Figure 8 This is a schematic diagram of the metal shell structure in step S1;

[0031] Figure 9 This is a schematic diagram of the structure in which an adhesive layer is formed in the contact area;

[0032] Figure 10 This is a schematic diagram of the structure in step S21 where a heat insulation material layer is formed in the contact area;

[0033] Figure 11 This is a schematic diagram of the structure in step S22 where multiple grooves are formed on the heat insulation material layer;

[0034] Figure 12 This is a schematic diagram of the structure in step S3 where a protective layer is formed on the surface of the insulation layer away from the metal shell. Detailed Implementation

[0035] The embodiments of this application are described below with reference to the accompanying drawings.

[0036] Please refer to the following: Figure 1 , Figure 2 and Figure 3 , Figure 1 This is a schematic diagram of the structure of a signal processing module 100 provided in an embodiment of this application. Figure 2 yes Figure 1 The diagram shows the structure of the protective housing 110 in the signal processing module 100. Figure 3 yes Figure 2 The protective housing 110 shown is a partial cross-sectional structural schematic diagram in the first embodiment.

[0037] The signal processing module 100 provided in this embodiment includes a protective housing 110 and a signal processing component 120, with the signal processing component 120 mounted inside the protective housing 110. The protective housing 110 protects and supports the signal processing component 120 to prevent damage. The signal processing component 120 includes a signal transmitter 121 and a signal receiver 122, which are electrically connected.

[0038] In this embodiment, the signal processing module 100 can be an optical module. During the signal conversion process, after the optical signal is received by the corresponding fiber optic adapter, the signal receiver 122 of the optical module converts the optical signal into an electrical signal and then transmits the electrical signal to the signal transmitter 121 of the optical module. After receiving the electrical signal, the signal transmitter 121 of the optical module converts the electrical signal into an optical signal and then emits it through the fiber optic adapter corresponding to the signal transmitter 121 of the optical module, thereby realizing the conversion of photoelectric signals.

[0039] In some other embodiments, the signal processing module 100 can be an electrical module. During the signal conversion process, after receiving the electrical signal from the corresponding fiber optic adapter, the signal receiver 122 of the electrical module converts the electrical signal into an optical signal and then transmits the optical signal to the signal transmitter 121 of the electrical module. After receiving the optical signal, the signal transmitter 121 of the electrical module converts the optical signal into an electrical signal and then emits it from the fiber optic adapter corresponding to the signal transmitter 121 of the electrical module, thereby realizing the conversion of photoelectric signals.

[0040] In this embodiment, the protective housing 110 includes a metal housing 10, a heat insulation layer 20, an adhesive layer 30, and a protective layer 40. Exemplarily, the metal housing 10 can be made of stainless steel. In some other embodiments, the metal housing 10 can also be made of aluminum alloy. In this embodiment, the metal housing 10 has a contact area 101 and a non-contact area 102 connected to each other. It should be noted that the contact area 101 of the metal housing 10 refers to the area of ​​the outer surface of the metal housing 10 that is touched by the operator's hand when inserting or removing the signal processing module 100. The non-contact area 102 of the metal housing 10 refers to the area of ​​the outer surface of the metal housing 10 that is not touched by the operator's hand when inserting or removing the signal processing module 100.

[0041] Furthermore, the outer surface of the metal casing 10 can be roughened. For example, a sandblasting process can be used to spray abrasive materials such as quartz, diamond, or iron filings onto the outer surface of the metal casing 10 to roughen the surface and thus improve its adhesion. In other embodiments, laser engraving can be used directly to roughen the outer surface of the metal casing 10, forming micro- or nano-structures such as micropores or microgrooves. This increases the surface area and roughness of the outer surface, making it a rough surface and further enhancing its adhesion.

[0042] The tackifying layer 30, the heat insulation layer 20, and the protective layer 40 are all located on the same side of the thickness direction of the metal casing 10. The tackifying layer 30 is disposed on the outer surface of the metal casing 10 and in the contact area 101. In some other embodiments, the tackifying layer 30 may also be disposed in the non-contact area 102. In this embodiment, the tackifying layer 30 is used to increase the adhesion of the outer surface of the metal casing 10. In some other embodiments, the tackifying layer 30 may also be located in the non-contact area 102 of the protective casing 110. In this embodiment, the tackifying layer 30 may be made of an tackifier. The tackifier may be made of materials such as rosin resin, polyterpene resin, dammar resin, petroleum resin, coumarone-indene resin, polystyrene resin, phenolic resin, or xylene resin.

[0043] In some other embodiments, a sandblasting process can be used to spray abrasive materials such as quartz, diamond, or iron shot onto the outer surface of the metal casing 10 to form an adhesive layer 30, thereby improving the adhesion of the outer surface of the metal casing 10. In still other embodiments, the outer surface of the metal casing 10 can be roughened first using processing methods such as laser engraving, and then the adhesive layer 30 can be applied to the outer surface of the metal casing 10. This can further enhance the adhesion of the outer surface of the metal casing 10 and also ensure a reliable connection between the adhesive layer 30 and the metal casing 10.

[0044] In this embodiment, the heat insulation layer 20 is disposed in the contact area 101. Specifically, the heat insulation layer 20 is disposed on the surface of the adhesive layer 30 facing away from the metal housing 10. In other words, the adhesive layer 30 connects the heat insulation layer 20 and the metal housing 10. The heat insulation layer 20 is used to reduce the heat-perceived temperature of the protective housing 110 by the operator's hands. It is understood that the adhesive layer 30 can increase the adhesion to the outer surface of the metal housing 10. By providing the adhesive layer 30 between the heat insulation layer 20 and the metal housing 10, the adhesion between the heat insulation layer 20 and the metal housing 10 can be improved, ensuring the reliability of the connection between the heat insulation layer 20 and the metal housing 10, thereby preventing the heat insulation layer 20 from falling off, and thus helping to ensure the good heat insulation effect of the heat insulation layer 20.

[0045] In some other embodiments, the heat insulation layer 20 may be directly disposed on the outer surface of the metal shell 10, and the adhesive layer 30 may not be disposed between the heat insulation layer 20 and the metal shell 10. In this case, the outer surface of the metal shell 10 is directly roughened by processing methods such as laser engraving, and then the heat insulation layer 20 is directly disposed on the outer surface of the metal shell 10. It is understood that after the outer surface of the metal shell 10 is roughened by laser engraving, micro-nano structures such as micropores or micro-grooves are formed on the outer surface of the metal shell 10. The micro-nano structures such as micropores or micro-grooves formed on the outer surface of the metal shell 10 can increase the surface area of ​​the outer surface of the metal shell 10, thereby increasing the contact area between the heat insulation layer 20 and the outer surface of the metal shell 10, thereby improving the adhesion of the heat insulation layer 20 on the outer surface of the metal shell 10, and enabling the heat insulation layer 20 to achieve a reliable connection with the metal shell 10. In some other embodiments, the heat insulation layer 20 may also be disposed in the non-contact area 102, and the embodiments of this application do not limit this. In other embodiments, the heat insulation layer 20 may also be provided on the outer surface of other metal structural components.

[0046] In this embodiment, the heat transfer coefficient of the insulation layer 20 is 0.03 W / (m²). 2 ·K) to 0.5W / (m 2 ·K) between (including endpoint value 0.03W / (m) 2 ·K) and 0.5W / (m 2·K). That is, the insulation layer 20 uses a heat transfer coefficient of 0.03W / (m). 2 ·K) to 0.5W / (m 2 The insulation layer 20 is made of a low thermal conductivity material between 0.5 and 0.6 kJ. For example, the insulation layer 20 may be made of ceramic powder and graphene. It is understood that the material composed of ceramic powder and graphene has a highly porous structure, which can reduce the thermal conductivity of the insulation layer 20, thereby enabling the insulation layer 20 to reduce the heat-perceived temperature of the protective housing 110 by the operator's hands, and reducing the risk of burns from the protective housing 110 when the operator plugs or unplugs the signal processing module 100.

[0047] Furthermore, the thickness of the heat insulation layer 20 is between 100 μm and 400 μm (inclusive of the endpoint values ​​of 100 μm and 400 μm). For example, taking a thickness of 200 μm for the heat insulation layer 20, compared with a protective shell 110 without the heat insulation layer 20, the temperature of the outer surface of the protective shell 110 coated with the heat insulation layer 20 provided in this application is lower, and the time for human hands to perceive the heat is greater than 10 seconds. This can effectively solve the problem of hot hands when operators hot-plug the signal processing module 100, thereby effectively reducing the risk of operators being burned by the protective shell 110.

[0048] Please refer to the following: Figure 3 and Figure 4 , Figure 4 yes Figure 3 A partial structural diagram of the heat insulation layer 20 in the protective casing 110 is shown.

[0049] In this embodiment, the heat insulation layer 20 is provided with a plurality of grooves 21. The openings of the plurality of grooves 21 are located on the surface of the heat insulation layer 20 away from the adhesive layer 30. The plurality of grooves 21 are recessed from the surface of the heat insulation layer 20 away from the adhesive layer 30 toward the adhesive layer 30. In this embodiment, the plurality of grooves 21 are spaced apart along a first direction (X-axis direction in the figure). It can also be understood that each groove 21 is periodically repeated along the first direction. Each groove 21 extends along a second direction (Y-axis direction in the figure). Wherein, the second direction intersects the first direction. In addition, the cross-sectional area of ​​each groove 21 remains unchanged in the direction from the surface of the heat insulation layer 20 away from the adhesive layer 30 toward the adhesive layer 30. Wherein, the cross-section of the groove 21 refers to the cross-section of the groove 21 parallel to the outer surface of the metal shell 10. For example, the cross-sectional shape of each groove 21 perpendicular to the outer surface of the metal shell 10 can be rectangular. In some other embodiments, the cross-sectional shape of each groove 21 perpendicular to the outer surface of the metal shell 10 can also be square, and the embodiments of this application do not strictly limit this.

[0050] In this embodiment, by providing multiple grooves 21 on the heat insulation layer 20, the surface of the heat insulation layer 20 facing away from the metal housing 10 is roughened. On the one hand, this increases the heat dissipation area of ​​the heat insulation layer 20, thereby improving the heat insulation performance of the heat insulation layer 20 and reducing the temperature perceived by the human hand. On the other hand, it reduces the contact area between the human hand and the surface of the protective housing 110 when the operator plugs and unplugs the signal processing module 100, prolongs the time for the human hand to perceive the heat, reduces the feeling of burn, and thus helps to reduce the risk of the human hand being burned by the protective housing 110, achieving the operation of the signal processing module 100 without the risk of burns.

[0051] Please continue reading. Figure 3 The protective layer 40 is disposed on the surface of the heat insulation layer 20 facing away from the metal housing 10, and is located in the contact area 101. In other embodiments, the protective layer 40 may also be disposed in the non-contact area 102, and the embodiments of this application are not limited thereto. In this embodiment, the protective layer 40 is disposed on the surface of the heat insulation layer 20 facing away from the adhesive layer 30. The hardness of the protective layer 40 is greater than that of the heat insulation layer 20. It is understood that by providing the protective layer 40 on the surface of the heat insulation layer 20 facing away from the metal housing 10, since the hardness of the protective layer 40 is greater than that of the heat insulation layer 20, the protective layer 40 can increase the structural strength of the heat insulation layer 20, preventing damage, detachment, and chipping of the groove 21 of the heat insulation layer 20 during use, thereby ensuring good heat insulation performance of the heat insulation layer 20.

[0052] Specifically, the protective layer 40 has multiple recesses 41. The openings of the multiple recesses 41 are located on the surface of the protective layer 40 opposite to the heat insulation layer 20. All the multiple recesses 41 are recessed from the surface of the protective layer 40 opposite to the heat insulation layer 20 towards the heat insulation layer 20. Each recess 41 corresponds to a groove 21. That is, the multiple recesses 41 are spaced apart along a first direction, and each recess 41 extends along a second direction. With this arrangement, since each recess 41 of the protective layer 40 corresponds to a groove 21, the shape of the protective layer 40 and the shape of the heat insulation layer 20 fit together, which can prevent the protective layer 40 from affecting the heat insulation effect of the heat insulation layer 20, ensuring good heat insulation performance of the heat insulation layer 20.

[0053] In this embodiment, the protective layer 40 can be made of a material composed of ceramic powder and graphene. That is, the material used to prepare the protective layer 40 is the same as that used to prepare the heat insulation layer 20. With this configuration, the protective layer 40 also has a heat insulation function, which can further reduce the heat-sensing temperature of the protective shell 110 to the operator's hands, thereby further reducing the risk of burns to the operator from the protective shell 110 when plugging or unplugging the signal processing module 100.

[0054] Please refer to the following: Figure 5 and Figure 6 , Figure 5yes Figure 2 The protective housing 110 shown is a partial cross-sectional structural diagram in the second embodiment. Figure 6 yes Figure 5 A partial structural diagram of the heat insulation layer 20 in the protective casing 110 is shown.

[0055] The protective housing 110 provided in this embodiment differs from the protective housing 110 in the first embodiment described above in that the cross-sectional area of ​​each groove 21 gradually decreases from the surface of the heat insulation layer 20 away from the adhesive layer 30 towards the adhesive layer 30. The cross-sectional shape of each groove 21 perpendicular to the outer surface of the metal housing 10 is trapezoidal. In other embodiments, the cross-sectional shape of each groove 21 perpendicular to the outer surface of the metal housing 10 may also be V-shaped or triangular; the embodiments of this application do not impose strict limitations on this.

[0056] In this embodiment, the plurality of grooves 21 include a plurality of first grooves 21a and a plurality of second grooves 21b. The first grooves 21a are spaced apart along a first direction. The plurality of second grooves 21b are spaced apart along a second direction. Exemplarily, each second groove 21b communicates with a plurality of first grooves 21a. With this arrangement, on the one hand, the heat dissipation area of ​​the heat insulation layer 20 can be further increased, thereby improving the heat insulation performance of the heat insulation layer 20 and reducing the heat-perceived temperature of the human hand. On the other hand, it can further reduce the contact area between the human hand and the surface of the protective shell 110 when the operator plugs or unplugs the signal processing module 100, thereby further extending the heat-perceived temperature of the human hand on the protective shell 110, reducing the sensation of burns, and further reducing the risk of burns from the protective shell 110, thus achieving burn-free hot-plugging of the signal processing module 100. In some other embodiments, each second groove 21b is spaced apart from a first groove 21a; the embodiments of this application do not limit this.

[0057] Please refer to the following: Figure 7 , Figure 8 , Figure 10 , Figure 11 and Figure 12 , Figure 7 This is a schematic flowchart of a surface treatment method for a protective casing 110 provided in this application. Figure 8 This is a schematic diagram of the structure of the metal casing 10 in step S1. Figure 10 This is a schematic diagram of the structure in step S21 where a heat insulation material layer 20a is formed in the contact area 101. Figure 11 This is a schematic diagram of the structure in step S22 where multiple grooves 21 are formed on the heat insulation material layer 20a. Figure 12 This is a schematic diagram of the structure in step S3 where a protective layer 40 is formed on the surface of the heat insulation layer 20 away from the metal shell 10.

[0058] This application also provides a surface treatment method for a protective casing 110, used to treat the outer surface of the metal casing 10 of the protective casing 110 in the first embodiment described above.

[0059] Step S1: A metal housing 10 is provided. The outer surface of the metal housing 10 has a contact area 101.

[0060] In step S2, a heat insulation layer 20 is formed in the contact area 101. The heat insulation layer 20 has multiple grooves 21. The openings of the multiple grooves 21 are all located on the surface of the heat insulation layer 20 opposite to the metal shell 10.

[0061] In this embodiment, the heat insulation layer 20 can be completed through the following steps S21 to S22.

[0062] Step S21: A heat insulation material layer 20a is formed in the contact area 101.

[0063] Step S22: A plurality of grooves 21 are formed on the heat insulation material layer 20a to obtain the heat insulation layer 20. For example, the plurality of grooves 21 can be formed on the heat insulation material layer 20a by laser processing.

[0064] In one possible implementation, after providing a metal housing 10 and before forming the heat insulation layer 20 in the contact area 101, the surface treatment method for the protective housing 110 further includes forming an adhesive layer 30 in the contact area 101. The adhesive layer 30 is connected between the metal housing 10 and the heat insulation layer 20.

[0065] Please see Figure 9 , Figure 9 This is a schematic diagram of the structure in which the adhesive layer 30 is formed in the contact area 101.

[0066] In another possible implementation, after providing a metal housing 10 and before forming the heat insulation layer 20 in the contact area 101, the surface treatment method for the protective housing 110 further includes roughening the outer surface of the metal housing 10. After roughening the outer surface of the metal housing 10, the method may further include forming an adhesive layer 30 in the contact area 101.

[0067] Step S3: A protective layer 40 is formed on the surface of the heat insulation layer 20 facing away from the metal casing 10. The protective layer 40 has multiple recesses 41. The openings of the multiple recesses 41 are all located on the surface of the protective layer 40 facing away from the heat insulation layer 20. Each recess 41 corresponds to a groove 21.

[0068] The above are merely some embodiments and implementation methods of this application. The scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A protective casing, characterized in that, It includes a metal shell and a heat insulation layer. The outer surface of the metal shell has a contact area, and the heat insulation layer is disposed in the contact area. The heat insulation layer has multiple grooves, and the openings of the multiple grooves are all located on the surface of the heat insulation layer away from the metal shell.

2. The protective casing according to claim 1, characterized in that, The cross-sectional area of ​​each groove remains constant in the direction from the surface of the insulation layer away from the metal housing towards the metal housing.

3. The protective casing according to claim 1, characterized in that, The cross-sectional area of ​​each groove gradually decreases from the surface of the insulation layer away from the metal housing towards the metal housing.

4. The protective casing according to any one of claims 1 to 3, characterized in that, Along a first direction, a plurality of grooves are spaced apart, and each groove extends along a second direction, which intersects with the first direction.

5. The protective casing according to any one of claims 1 to 3, characterized in that, The plurality of grooves includes a plurality of first grooves and a plurality of second grooves, wherein the first grooves are spaced apart along a first direction, and the plurality of second grooves are spaced apart along a second direction, wherein the second direction intersects the first direction.

6. The protective casing according to any one of claims 1 to 5, characterized in that, The heat transfer coefficient of the insulation layer is 0.03 W / (m²). 2 ·K) to 0.5W / (m 2 Between ·K).

7. The protective casing according to claim 1, characterized in that, The protective housing also includes a protective layer located in the contact area and disposed on the surface of the heat insulation layer away from the metal housing. The protective layer has multiple recesses, the openings of which are all located on the surface of the protective layer away from the heat insulation layer, and each recess corresponds to a groove.

8. The protective casing according to claim 7, characterized in that, The hardness of the protective layer is greater than that of the heat insulation layer.

9. The protective casing according to claim 1, characterized in that, The protective housing also includes an adhesive layer located in the contact area and connected between the metal housing and the heat insulation layer.

10. The protective casing according to claim 1, characterized in that, The outer surface of the metal casing is rough.

11. A signal processing module, characterized in that, It includes a signal processing component and a protective housing according to any one of claims 1 to 10, wherein the signal processing component 120 is mounted on the inner side of the metal housing.

12. The signal processing module according to claim 11, characterized in that, The signal processing module is either an optical module or an electrical module.

13. A surface treatment method for a protective casing, characterized in that, include: A metal housing is provided, the outer surface of which has a contact area; A heat insulation layer is formed in the contact area, and the heat insulation layer has a plurality of grooves, the openings of the plurality of grooves being located on the surface of the heat insulation layer opposite to the metal shell.

14. The surface treatment method for the protective casing according to claim 13, characterized in that, The step of forming a heat insulation layer in the contact area includes: A heat-insulating material layer is formed in the contact area; Multiple grooves are formed on the heat insulation material layer to obtain the heat insulation layer.

15. The surface treatment method for the protective casing according to claim 13, characterized in that, After the step of providing a metal housing and before the step of forming a heat insulation layer in the contact area, the surface treatment method of the protective housing further includes: An adhesive layer is formed in the contact area, and the adhesive layer is connected between the metal shell and the heat insulation layer.

16. The surface treatment method for the protective casing according to claim 13, characterized in that, After the step of providing a metal housing and before the step of forming a heat insulation layer in the contact area, the surface treatment method of the protective housing further includes: The outer surface of the metal casing is roughened.

17. The surface treatment method for the protective casing according to claim 13, characterized in that, After the step of forming a heat insulation layer in the contact area, the surface treatment method of the protective housing further includes: A protective layer is formed on the surface of the heat insulation layer away from the metal shell. The protective layer has a plurality of recesses, the openings of which are all located on the surface of the protective layer away from the heat insulation layer. Each recess corresponds to a groove.

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