Display panel, preparation method thereof and display device

Abstract

Embodiments of the present application disclose a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, an isolation structure, a first encapsulation layer, a light blocking part, a plurality of light emitting devices and a plurality of light color conversion parts. At least part of the orthogonal projection of the isolation structure on the substrate is located between the orthogonal projection of the light emitting area of adjacent light emitting devices on the substrate. At least part of the first encapsulation layer is located on the side of the light emitting device away from the substrate. The first encapsulation layer is provided with a first opening. The orthogonal projection of the first opening on the substrate overlaps with the orthogonal projection of the isolation structure on the substrate, and forms a first overlapping area. The light color conversion part is located on the side of the first encapsulation layer away from the corresponding light emitting device. The light blocking part is located on the side of the isolation structure away from the substrate. The orthogonal projection of the light blocking part on the substrate overlaps with the first overlapping area. The embodiments of the present application can improve the display effect of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) display technology is considered the most promising next-generation display technology. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angle, and fast response speed.

[0003] However, the performance of current OLED display panels needs improvement. Summary of the Invention

[0004] In order to overcome the technical problems mentioned in the above technical background, this application provides a display panel and its manufacturing method and display device, which aim to improve the performance of the display panel.

[0005] This application provides a display panel, including:

[0006] substrate; An isolation structure is disposed on the substrate; Multiple light-emitting devices, wherein at least a portion of the orthographic projection of the isolation structure onto the substrate is located in the gap between the orthographic projections of the light-emitting areas of adjacent light-emitting devices onto the substrate; The first encapsulation layer, at least a portion of which is located on the side of the light-emitting device away from the substrate, has a first opening. The orthographic projection of the first opening onto the substrate overlaps with the orthographic projection of the isolation structure onto the substrate, forming a first overlapping area. Multiple light color conversion units are located on the side of the first encapsulation layer away from the corresponding light-emitting device; The light-blocking part is located on the side of the isolation structure away from the substrate, and the orthographic projection of the light-blocking part on the substrate overlaps with the first overlapping area.

[0007] This application also provides a method for manufacturing a display panel, including: An isolation structure is formed on the substrate; A light-emitting functional layer, a second electrode layer, and a first encapsulation layer are sequentially prepared. The orthographic projection of the light-emitting functional layer on the substrate covers the orthographic projection of the isolation structure on the substrate. The orthographic projection of the second electrode layer on the substrate covers the orthographic projection of the isolation structure on the substrate. The orthographic projection of the first encapsulation layer on the substrate covers the orthographic projection of the isolation structure on the substrate. The light-emitting functional layer, the second electrode layer, and the first encapsulation layer on the side of the isolation structure away from the substrate are etched to form a first opening in the first encapsulation layer; the orthographic projection of the first opening on the substrate overlaps with the orthographic projection of the isolation structure on the substrate, and forms a first overlapping area. A light-blocking portion is formed on the side of the isolation structure away from the substrate; the orthographic projection of the light-blocking portion on the substrate overlaps with the first overlapping region; A light-color conversion section is formed on the side of the first encapsulation layer away from the substrate.

[0008] This application also provides a method for manufacturing a display panel, including: An isolation structure is formed on the substrate; A light-emitting functional layer, a second electrode layer, and a first encapsulation layer are sequentially prepared. The orthographic projection of the light-emitting functional layer on the substrate covers the orthographic projection of the isolation structure on the substrate. The orthographic projection of the second electrode layer on the substrate covers the orthographic projection of the isolation structure on the substrate. The orthographic projection of the first encapsulation layer on the substrate covers the orthographic projection of the isolation structure on the substrate. A light color conversion section is formed on the side of the first encapsulation layer opposite to the substrate; A second encapsulation layer is formed on the side of the light color conversion section away from the substrate; The light-emitting functional layer, the second electrode layer, the first encapsulation layer, and the second encapsulation layer on the side of the isolation structure away from the substrate are etched to form a first opening in the first encapsulation layer and a second opening in the second encapsulation layer. The first opening and the corresponding second opening are connected. The orthographic projection of the first opening on the substrate overlaps with the orthographic projection of the isolation structure on the substrate, forming a first overlapping area. A light-blocking portion is formed on the side of the isolation structure away from the substrate; the orthogonal projection of the light-blocking portion on the substrate overlaps with the first overlapping region.

[0009] This application also provides a display device, which includes the display panel provided in this application, or the display panel prepared by the preparation method of the display panel provided in this application.

[0010] In this embodiment, the first encapsulation layer is provided with a first opening. The orthographic projection of the first opening on the substrate overlaps with the orthographic projection of the isolation structure 12 on the substrate, forming a first overlapping area. The light-blocking part is located on the side of the isolation structure away from the substrate 11. The orthographic projection of the light-blocking part on the substrate overlaps with the first overlapping area. That is, at least part of the first encapsulation layer between the isolation structure and the light-blocking part is removed, so that the distance between the isolation structure and the light-blocking part is closer or in contact. This improves or avoids the problem of light from the sub-pixel passing through the encapsulation layer, light-emitting material, cathode material, etc. between the isolation structure and the light-blocking part and entering the adjacent sub-pixel, causing light crosstalk, and improves the display effect. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a cross-sectional structural diagram of a display panel in related technologies.

[0013] Figure 2 This is a cross-sectional structural diagram of a display panel provided in an embodiment of this application.

[0014] Figure 3 This is a top view of a display panel provided in an embodiment of this application.

[0015] Figure 4 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application.

[0016] Figure 5 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application.

[0017] Figure 6 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application.

[0018] Figure 7 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application.

[0019] Figure 8 This is a top view of another display panel provided in an embodiment of this application.

[0020] Figure 9 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application.

[0021] Figure 10 This is a top view of another display panel provided in an embodiment of this application.

[0022] Figure 11 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application.

[0023] Figure 12 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application.

[0024] Figure 13 This is a top view of another display panel provided in an embodiment of this application.

[0025] Figure 14This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application.

[0026] Figure 15 This is a schematic diagram of a pixel circuit provided in an embodiment of this application.

[0027] Figure 16 This is a flowchart of a method for manufacturing a display panel according to an embodiment of this application.

[0028] Figure 17 This is a schematic diagram of at least some steps in the fabrication process of a display panel fabrication method provided in this application embodiment.

[0029] Figure 18 This is a schematic diagram of at least some steps in the fabrication process of another method for fabricating a display panel provided in this application embodiment.

[0030] Figure 19 This is a flowchart of another method for preparing a display panel provided in an embodiment of this application.

[0031] Figure 20 This is a schematic diagram of at least some steps in the fabrication process of another method for fabricating a display panel provided in this application embodiment.

[0032] Figure 21 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0035] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. It should be noted that, unless otherwise specified, different features in the embodiments of this application can be combined with each other.

[0036] For ease of understanding, the accompanying diagram shows the mutually orthogonal X-axis, Y-axis, and Z-axis. The direction along the X-axis is called the X-direction, the direction along the Y-axis is called the Y-direction, and the direction along the Z-axis is called the Z-direction. The Z-direction is the normal direction relative to the plane containing the X and Y directions. Furthermore, a view where various elements are observed parallel to the plane containing the X and Y directions is called a top view. Alternatively, the planes in the X and Y directions can be planes parallel to the display surface of the display panel, and the Z-direction can be a direction parallel to the thickness direction of the display panel.

[0037] For certain elements, terms such as "above" or "over" are sometimes used when describing the position of an element located in the Z direction, and "below" or "under" are used when describing the position of an element located in the opposite direction. Furthermore, when using terms such as "above," "over," "below," "under," and "relative" to define the positional relationship between two elements, this includes not only the state where the two elements are directly connected, but also the state where the two elements are separated by gaps or other elements. Additionally, the terms "first," "second," and "third," etc., are used only for distinguishing descriptions and should not be construed as indicating or implying relative importance or order. At least one may include one or more. At least one may include one or more. At least part may include part or all. The first direction and the second direction intersect, for example, they may be perpendicular. At least one may include one or more. Connection may include direct connection or indirect connection. Equal or identical means equal or identical within a reasonable range of errors such as manufacturing errors, process errors, and measurement errors.

[0038] Figure 1 This is a cross-sectional structural diagram of a display panel in the related art. In the related art, there are encapsulation layers, light-emitting materials, cathode materials, etc. between the isolation structure and the light-blocking part. This causes light from a sub-pixel in an adjacent sub-pixel to pass through the encapsulation layer, light-emitting material, cathode material, etc. between the isolation structure and the light-blocking part and enter the adjacent sub-pixel, resulting in optical crosstalk.

[0039] To address the aforementioned issues, this application provides a display panel. Figure 2 This is a cross-sectional structural diagram of a display panel provided in an embodiment of this application. Figure 3 This is a top view of a display panel provided in an embodiment of this application. Figure 2 Can be along Figure 3 Cross-sectional view along the BB direction. See also... Figure 2 and Figure 3 The display panel 10 includes: a substrate 11, an isolation structure 12, a first encapsulation layer 14, a light-blocking part 19, a plurality of light-emitting devices 13, and a plurality of light color conversion parts.

[0040] An isolation structure 12 is disposed on a substrate 11. At least a portion of the isolation structure 12 is projected onto the substrate 11 in the gap between the projections of the light-emitting areas of adjacent light-emitting devices 13 onto the substrate 11.

[0041] At least a portion of the first encapsulation layer 14 is located on the side of the light-emitting device 13 away from the substrate 11. The first encapsulation layer 14 is provided with a first opening 14d. The orthographic projection of the first opening 14d on the substrate 11 overlaps with the orthographic projection of the isolation structure 12 on the substrate 11, forming a first overlapping region a1.

[0042] The light-color conversion unit 18 is located on the side of the first encapsulation layer 14 away from the corresponding light-emitting device 13. The light-blocking unit 19 is located on the side of the isolation structure 12 away from the substrate 11, and the orthographic projection of the light-blocking unit 19 on the substrate 11 overlaps with the first overlapping region a1.

[0043] The light-blocking portion 19 can be disposed between adjacent light color conversion portions 18 to avoid light crosstalk between adjacent sub-pixels and / or to avoid light crosstalk between adjacent light color conversion portions 18. For example, the light-blocking portion can be in contact with the light color conversion portion 18.

[0044] The first encapsulation layer 14 is provided with a first opening 14d, which is equivalent to removing at least a portion of the first encapsulation layer 14 between the isolation structure 12 and the light-blocking part 19, so that the distance between the isolation structure 12 and the light-blocking part 19 is closer or in contact, thereby improving or preventing the problem of light from the sub-pixel passing through the encapsulation layer, light-emitting material, cathode material, etc. between the isolation structure and the light-blocking part and entering the adjacent sub-pixel, causing light crosstalk.

[0045] In this embodiment, the first encapsulation layer 14 is provided with a first opening 14d. The orthographic projection of the first opening 14d on the substrate 11 overlaps with the orthographic projection of the isolation structure 12 on the substrate 11, forming a first overlapping region a1. The light-blocking part 19 is located on the side of the isolation structure 12 away from the substrate 11. The orthographic projection of the light-blocking part 19 on the substrate 11 overlaps with the first overlapping region a1. That is, at least a portion of the first encapsulation layer 14 between the isolation structure 12 and the light-blocking part 19 is removed, so that the distance between the isolation structure 12 and the light-blocking part 19 is closer or in contact. This improves or avoids the problem of light from the sub-pixel passing through the encapsulation layer, light-emitting material, cathode material, etc. between the isolation structure and the light-blocking part and entering the adjacent sub-pixel, causing light crosstalk.

[0046] For example, the light color conversion unit 18 can convert the emitted color of the corresponding light-emitting device 13 into a corresponding color. For example, the light color conversion unit 18 may include quantum dots. Quantum dots of different sizes can be provided as needed, and the incident color light can be converted by exciting the quantum dots. For example, the quantum dots in the light color conversion units 18 that convert different colors have different sizes, and / or the materials in the light color conversion units 18 that convert different colors are different.

[0047] For example, the plurality of light-emitting devices 13 may include a first light-emitting device 13a and a second light-emitting device 13b. The plurality of light color conversion units 18 may include a first light color conversion unit 18a and a second light color conversion unit 18b that convert different colors.

[0048] The first color conversion unit 18a may be located on the side of the first light-emitting device 13a facing away from the substrate 11, and the second color conversion unit 18b may be located on the side of the second light-emitting device 13b facing away from the substrate 11. For example, the light from the first light-emitting device 13a is converted into light of a first color, such as red light, after passing through the first color conversion unit 18a, and the light from the second light-emitting device 13b is converted into light of a second color, such as green light, after passing through the second color conversion unit 18b.

[0049] For example, the light-emitting device 13 includes a first electrode 131, a light-emitting structure 132, and a second electrode 133 sequentially stacked along a direction Z away from the substrate 11. For example, one of the first electrode 131 and the second electrode 133 can be an anode, and the other can be a cathode. For example, the first electrode 131 can be an anode, and the second electrode 133 can be a cathode.

[0050] For example, the light-emitting structure 132 of the first light-emitting device 13a and the light-emitting structure 132 of the second light-emitting device 13b are made of the same material. For example, the light-emitting structure 132 of the first light-emitting device 13a and the light-emitting structure 132 of the second light-emitting device 13b are fabricated simultaneously.

[0051] For example, the first light-emitting device 13a and the second light-emitting device 13b emit the same color. For example, the first light-emitting device 13a and the second light-emitting device 13b may emit white, or the first light-emitting device 13a and the second light-emitting device 13b may emit blue.

[0052] For example, see Figure 2 Along the thickness direction Z of the substrate 11, the distance D1 between the side of the light color conversion section 18 facing away from the substrate 11 and the substrate 11 is greater than the distance D2 between the side of the isolation structure 12 facing away from the substrate 11 and the substrate 11. This arrangement forms a light color conversion section 18 with a larger thickness and an isolation structure 12 with a smaller thickness, in order to meet the requirements of light color conversion and film formation.

[0053] The thickness of the isolation structure 12 cannot be too thick; otherwise, the thicker the metal deposited to form the isolation structure, the greater the stress on the film layer, leading to peeling, cracking, and warping, ultimately preventing film formation. The light and color conversion section 18 cannot be too thin; otherwise, the light and color conversion effect will be poor.

[0054] For example, along the thickness direction Z of the substrate 11, the thickness of the light color conversion section 18 is greater than or equal to 3 micrometers and less than or equal to 5 micrometers. For example, the thickness of the light color conversion section 18 can be 3 μm, 3.5 μm, 4 μm, 4.5 μm, or 5 μm, etc.

[0055] For example, the thickness of the isolation structure 12 along the thickness direction Z of the substrate 11 is less than or equal to 1 μm. For example, the thickness of the isolation structure 12 can be 1 μm, 0.95 μm, 0.9 μm, 0.85 μm, 0.8 μm, etc.

[0056] For example, along the thickness direction Z of the substrate 11, the thickness of the light color conversion part 18 is greater than the thickness of the isolation structure 12.

[0057] For example, see Figure 2 Along the thickness direction Z of the substrate 11, the distance D3 between the side of the light color conversion section 18 facing the substrate 11 and the substrate 11 is less than or equal to the distance D2 between the side of the isolation structure 12 facing away from the substrate 11 and the substrate 11. This arrangement can reduce the thickness of the display panel.

[0058] For example, the first opening 14d penetrates the first encapsulation layer 14 along the thickness direction Z of the substrate 11, and the isolation structure 12 contacts the light-blocking part 19. This arrangement can minimize the risk of light from the sub-pixel passing through the encapsulation layer, light-emitting material, cathode material, etc. between the isolation structure and the light-blocking part and entering the adjacent sub-pixel, thus reducing the risk of light crosstalk.

[0059] For example, the orthographic projection of the side of the isolation structure 12 facing away from the substrate 11 onto the substrate 11 lies within the orthographic projection of the first opening 14d onto the substrate 11. For example, the orthographic projection area of ​​the side of the isolation structure 12 facing away from the substrate 11 onto the substrate 11 is less than or equal to the orthographic projection area of ​​the first opening 14d onto the substrate 11. This arrangement increases the contact area between the isolation structure 12 and the light-blocking portion 19, which helps reduce the risk of optical crosstalk.

[0060] For example, the isolation structure 12 includes an insulating material. For example, the isolation structure 12 includes a light-transmitting material or an opaque material. For example, the light-emitting structure 132 may include at least two light-emitting units 132a and at least one charge-generating layer 132b stacked along the thickness direction Z of the substrate 11. The isolation structure 12 can isolate at least a portion of the charge-generating layer between adjacent light-emitting devices, reducing the lateral leakage current of the charge-generating layer and reducing power consumption. Figure 3 This is a top view schematic diagram of another display panel provided in an embodiment of this application. See also... Figure 3The isolation structure 12 may include a plurality of spaced-apart isolation substructures 125 arranged in an array. For example, the second electrodes 133 of adjacent light-emitting devices 13 may be interconnected in a grid-like structure. For example, the first encapsulation layers 14 may be interconnected in a grid-like structure. For example, the isolation structure 12 is insulated from the second electrodes 133, i.e., not electrically connected. For example, a charge-generating layer 132b may be provided between adjacent light-emitting units 132a. For example, at least two light-emitting units 132a emit the same color. The light-emitting unit 132a may include a light-emitting material layer.

[0061] For example, the light-blocking portion 19 includes a black organic material, such as a black insulating organic material. This arrangement avoids light crosstalk between adjacent sub-pixels and / or light crosstalk between adjacent light color conversion portions 18.

[0062] For example, the cross-section of the light-blocking portion 19 perpendicular to the substrate 11 can be trapezoidal or rectangular. For example, the area of ​​the orthogonal projection of the side of the light-blocking portion 19 away from the substrate 11 onto the substrate 11 can be greater than, less than, or equal to the area of ​​the orthogonal projection of the side of the light-blocking portion 19 close to the substrate 11 onto the substrate 11.

[0063] For example, the side of the light-blocking part 19 facing away from the substrate 11 is flush with the side of the light color conversion part 18 facing away from the substrate 11.

[0064] Figure 4 A cross-sectional structural schematic diagram of another display panel provided in an embodiment of this application. For example, see... Figure 4 The light-blocking portion 19 includes a main body portion 19a, and further includes a reflective layer 19b or a light-blocking layer 19b located on the sidewall of the main body portion 19a facing the light-color conversion portion 18. That is, a reflective layer 19b or a light-blocking layer 19b may be provided on the sidewall of the main body portion 19a. For example, the main body portion 19a may include an organic material. For example, the main body portion 19a may include photoresist, which may be a high-resolution photoresist, enabling smaller patterning. For example, the reflective layer 19b may include a metal, such as titanium or aluminum. For example, the light-blocking layer 19b may include a black organic material, such as a black matrix. The main body portion 19a may include a light-transmitting material or an opaque material. For example, the cross-section of the main body portion 19a perpendicular to the substrate 11 may be trapezoidal or rectangular. For example, the area of ​​the orthographic projection of the side of the main body portion 19 facing away from the substrate 11 onto the substrate 11 may be greater than, less than, or equal to the area of ​​the orthographic projection of the side of the main body portion 19 close to the substrate 11 onto the substrate 11. For example, the side of the main body 19a facing away from the substrate 11 is flush with the side of the light color conversion part 18 facing away from the substrate 11.

[0065] Figure 4 The light transmittance of the organic material in the main body 19a is higher than that of the organic material in the main body 19a. Figure 2 The black organic material in the middle light-blocking section 19 Figure 4The central body 19a can easily achieve target graphics, which is beneficial to improving pixel resolution (PPI). Figure 2 The black organic material in the middle light-blocking section 19 is quite thick and has too much light absorption, causing the light from the exposure machine to be absorbed, making it difficult to form a target pattern.

[0066] For example, the side of the light-blocking portion 19 facing away from the substrate 11 is flush with the side of the light color conversion portion 18 facing away from the substrate 11. This arrangement avoids light crosstalk between adjacent sub-pixels and / or light crosstalk between adjacent light color conversion portions 18.

[0067] For example, the display panel also includes a second encapsulation layer 20, which is located on the side of the light color conversion section 18 away from the substrate 11; For example, the second encapsulation layer 20 is located on the side of the light-blocking portion 19 that is away from the substrate 11.

[0068] For example, the side of the second encapsulation layer 20 away from the substrate 11 includes a first sub-region 21d and a second sub-region 21e. The orthographic projection of the first sub-region 21d on the substrate 11 overlaps with the orthographic projection of the light-emitting area of ​​the light-emitting device 13 on the substrate 11, and the orthographic projection of the second sub-region 21e on the substrate 11 overlaps with the orthographic projection of the isolation structure 12 on the substrate 11. The first sub-region 21d and the second sub-region 21e are located in the same plane (for example, the plane may be parallel to the substrate 11) and are continuously arranged.

[0069] For example, the display panel also includes a light filter layer 21, which is located on the side of the second encapsulation layer 20 and the light blocking portion 19 away from the substrate 11.

[0070] For example, the filter layer 21 includes a first filter layer 21a, a second filter layer 21b, and a third filter layer 21c, each with different filter colors. The area where the orthographic projections of the first filter layer 21a, the second filter layer 21b, and the third filter layer 21c on the substrate 11 all overlap overlaps with the orthographic projection of a first overlapping area a1 on the substrate 11. The first overlapping area a1 corresponds to a non-emitting area. In the non-emitting area, the overlap of the first filter layer 21a, the second filter layer 21b, and the third filter layer 21c can function as a black matrix. With this arrangement, it is unnecessary to set a black matrix on the same layer as the filter layer 21.

[0071] For example, the first filter layer 21a may be located on the side of the first color conversion section 18a facing away from the substrate 11, and the second filter layer 21b may be located on the side of the second color conversion section 18b facing away from the substrate 11. Light of a first color (e.g., red light) can pass through the first filter layer 21a, while light of other colors cannot pass through the first filter layer 21a. Light of a second color (e.g., green light) can pass through the second filter layer 21b, while light of other colors cannot pass through the second filter layer 21b. Light of a third color (e.g., blue light) can pass through the third filter layer 21c, while light of other colors cannot pass through the third filter layer 21c.

[0072] For example, the display panel also includes a light-transmitting portion 18c, and the plurality of light-emitting devices 13 also includes a third light-emitting device 13c.

[0073] The light-transmitting portion 18c is located on the side of the first encapsulation layer 14 and the third light-emitting device 13c facing away from the substrate 11. Light from the third light-emitting device 13c can pass directly through the light-transmitting portion 18c. The light-transmitting portion 18c does not affect the color of the light from the third light-emitting device 13c. The light-transmitting portion 18c may not include quantum dots.

[0074] For example, the light transmission section 18c and the light color conversion section 18 are arranged in the same layer.

[0075] For example, the light-emitting structure of the first light-emitting device 13a and the light-emitting structure of the third light-emitting device 13c are made of the same material. For example, the light-emitting structure 132 of the first light-emitting device 13a, the light-emitting structure 132 of the second light-emitting device 13b, and the light-emitting structure 132 of the third light-emitting device 13c are fabricated simultaneously.

[0076] For example, the first light-emitting device 13a, the second light-emitting device 13b, and the third light-emitting device 13c emit blue light.

[0077] In some embodiments, the display panel further includes a third color conversion unit located on the side of the first encapsulation layer 14 and the third light-emitting device 13c facing away from the substrate 11. That is, the light-transmitting portion 18c is replaced by the third color conversion unit. For example, the light emitted by the first light-emitting device 13a, the second light-emitting device 13b, and the third light-emitting device 13c is white.

[0078] For example, the first encapsulation layer 14 includes inorganic materials.

[0079] Figure 5 A cross-sectional structural schematic diagram of another display panel provided in an embodiment of this application. For example, see... Figure 5 The light-blocking portion 19 includes a reflective layer or a light-blocking layer. For example, the light-blocking portion 19 or the reflective layer includes titanium, aluminum, or a black organic material. For example, the light-blocking portion 19 or the light-blocking layer includes a black organic material, such as a black matrix.

[0080] Figure 2 The black organic material in the middle light-blocking section 19 is relatively thick. Figure 5 The black organic material in the middle light-blocking section 19 is relatively thin. Figure 5 The mid-light section 19 can easily achieve target graphics, which is beneficial for achieving high pixel resolution (PPI).

[0081] For example, the display panel also includes a second encapsulation layer 20, which is located on the side of the light color conversion section 18 away from the substrate 11. The second encapsulation layer 20 is provided with a second opening (corresponding to the area where the first opening 14d is located), and the first opening 14d communicates with the corresponding second opening; the orthographic projection of the second opening on the substrate 11 overlaps with the orthographic projection of the first opening 14d on the substrate 11, forming a second overlapping area; the orthographic projection of the light-blocking section 19 on the substrate 11 overlaps with the second overlapping area.

[0082] For example, the second encapsulation layer 20 includes an inorganic material, such as silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON).

[0083] For example, the second encapsulation layer 20 is in contact with the first encapsulation layer 14. This arrangement allows the second encapsulation layer 20 and the first encapsulation layer 14 to form a closed structure, which can completely enclose the light color conversion part 18, preventing external water and oxygen from entering the light color conversion part 18, and thus improving the encapsulation effect.

[0084] For example, a second encapsulation layer 20 is provided between the light-blocking portion 19 and the light-color conversion portion 18. For example, the second encapsulation layer 20 is provided between the sidewall of the light-blocking portion 19 facing the light-color conversion portion 18 and the sidewall of the light-color conversion portion 18 facing the light-blocking portion 19. The second encapsulation layer 20 includes a connected first portion 201 and a second portion 202. The first portion 201 is located on the side of the light-color conversion portion 18 facing away from the substrate 11, and the second portion 202 is located between the light-blocking portion 19 and the light-color conversion portion 18. The second portion 202 is inclined or vertically disposed relative to the first portion 201. The first portion 201 is located on the side of the second portion 202 away from the substrate 11.

[0085] For example, the light-blocking portion 19 has a recessed shape on the side facing away from the substrate 11. For example, a first light-filtering layer 21a, a second light-filtering layer 21b, and a third light-filtering layer 21c are stacked within the recess of the recessed light-blocking portion 19. This arrangement allows the first light-filtering layer 21a, the second light-filtering layer 21b, and the third light-filtering layer 21c to fill or flatten the recess of the light-blocking portion 19, which helps to reduce the thickness of the display panel. For example, see... Figure 5The light-blocking portion 19 includes a first sub-portion 191 and a second sub-portion 192, with the first sub-portion 191 located on the side of the second sub-portion 192 closest to the substrate 11. For example, the second sub-portion 192 may be inclined or vertically disposed relative to the first sub-portion 191. The orthographic projection of the first sub-portion 191 onto the substrate 11 overlaps with the orthographic projection of the isolation structure 12 onto the substrate 11. For example, along the thickness direction Z of the substrate 11, the distance between the side of the first sub-portion 191 facing away from the substrate 11 and the substrate 11 is less than the distance between the side of the light color conversion portion 18 facing away from the substrate 11 and the substrate 11.

[0086] Figure 6 A cross-sectional structural schematic diagram of another display panel provided in an embodiment of this application. For example, see... Figure 6 The first encapsulation layer includes at least one inorganic encapsulation layer and at least one organic encapsulation layer stacked along the thickness direction Z of the substrate. This arrangement can effectively isolate the light-emitting device 13 and the light-color conversion unit 18, thereby improving the encapsulation and isolation effects of the light-emitting device 13 and the light-color conversion unit 18.

[0087] For example, see Figure 6 The first encapsulation layer 14 includes a first inorganic encapsulation layer 141. For example, the material of the first inorganic encapsulation layer 141 may include one or more of silicon oxide and silicon nitride.

[0088] For example, see Figure 6 The first encapsulation layer 14 further includes a first organic encapsulation layer 142, which is located on the side of the first inorganic encapsulation layer 141 facing away from the substrate 11. For example, along the thickness direction Z of the substrate 11, the thickness of the first organic encapsulation layer 142 is less than the thickness of the light color conversion section 18. This arrangement can effectively isolate the light-emitting device 13 and the light color conversion section 18, avoiding the poor isolation and encapsulation effects of a single-layer first inorganic encapsulation layer 141.

[0089] For example, see Figure 6 The first encapsulation layer 14 further includes a second inorganic encapsulation layer 143, which is located on the side of the first organic encapsulation layer 142 facing away from the substrate 11. This arrangement can effectively isolate the light-emitting device 13 and the light color conversion unit 18, thereby improving the encapsulation effect of the light-emitting device 13 and the light color conversion unit 18.

[0090] For example, light-emitting devices may include organic light-emitting devices.

[0091] Figure 7 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application. For example, see... Figure 3The isolation structure 12 includes a conductive material and is electrically connected to the second electrode 133 of the light-emitting device 13. The light-blocking part 19 includes a reflective metallic material; the isolation structure 12 is electrically connected to the light-blocking part 19. This arrangement reduces the impedance of the signal corresponding to the second electrode 133 of the light-emitting device 13, which helps to reduce power consumption. For example, the isolation structure 12 includes an opaque material. Figure 8 This is a top view of another display panel provided in an embodiment of this application. For example, the orthographic projection of the isolation structure 12 onto the substrate 11 is a grid pattern.

[0092] For example, the isolation structure 12 encloses and forms a plurality of isolation openings, and at least a portion of the light-emitting device 13 is located within the corresponding isolation opening.

[0093] Figure 9 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application. Figure 10 This is a top view schematic diagram of another display panel provided in an embodiment of this application. For example, see... Figure 9 and Figure 10 The first encapsulation layer 14 includes a plurality of spaced first encapsulation portions; the first encapsulation portions are located on the side of the corresponding light-emitting device 13 away from the substrate 11.

[0094] For example, the first packaging section corresponds one-to-one with the light-emitting device 13, and different light color conversion sections 18 correspond to different first packaging sections.

[0095] For example, the second encapsulation layer 20 includes a plurality of spaced second encapsulation portions; the second encapsulation portions are located on the side of the corresponding first encapsulation portion away from the substrate 11, and the second encapsulation portions are in contact with the corresponding first encapsulation portions.

[0096] The plurality of first packaging portions include a plurality of first packaging portions 14a corresponding to a plurality of first light-emitting devices 13a, a plurality of first packaging portions 14b corresponding to a plurality of second light-emitting devices 13b, and a plurality of first packaging portions 14c corresponding to a plurality of third light-emitting devices 13c. The first packaging portion 14a of the first light-emitting device 13a is disposed on the side of the corresponding first light-emitting device 13a away from the substrate 11, the first packaging portion 14b of the second light-emitting device 13b is disposed on the side of the corresponding second light-emitting device 13b away from the substrate 11, and the first packaging portion 14c of the third light-emitting device 13c is disposed on the side of the corresponding third light-emitting device 13c away from the substrate 11.

[0097] The plurality of second packaging portions include a plurality of second packaging portions 20a corresponding to a plurality of first light-emitting devices 13a, a plurality of second packaging portions 20b corresponding to a plurality of second light-emitting devices 13b, and a plurality of second packaging portions 20c corresponding to a plurality of third light-emitting devices 13c. The second packaging portion 20a of the first light-emitting device 13a is disposed on the side of the corresponding first light-emitting device 13a away from the substrate 11, the second packaging portion 20b of the second light-emitting device 13b is disposed on the side of the corresponding second light-emitting device 13b away from the substrate 11, and the second packaging portion 20c of the third light-emitting device 13c is disposed on the side of the corresponding third light-emitting device 13c away from the substrate 11.

[0098] For example, the first light color conversion section 18a is located between the first encapsulation section 14a and the second encapsulation section 20a corresponding to the first light-emitting device 13a. For example, the first encapsulation section 14a and the second encapsulation section 20a corresponding to the first light-emitting device 13a are in contact, forming a closed structure enclosing the first light color conversion section 18a. For example, the second light color conversion section 18b is located between the first encapsulation section 14b and the second encapsulation section 20b corresponding to the second light-emitting device 13b. For example, the first encapsulation section 14b and the second encapsulation section 20b corresponding to the second light-emitting device 13b are in contact, forming a closed structure enclosing the second light color conversion section 18b. For example, the light transmission section 18c is located between the first encapsulation section 14c and the second encapsulation section 20c corresponding to the third light-emitting device 13c. For example, the first encapsulation section 14c and the second encapsulation section 20c corresponding to the third light-emitting device 13c are in contact, forming a closed structure enclosing the light transmission section 18c.

[0099] For example, the isolation structure 12 is located on one side of the substrate 11 and encloses multiple isolation openings, including multiple first isolation openings 12a, multiple second isolation openings 12b, and multiple third isolation openings 12c. Multiple light-emitting devices 13 are located on one side of the substrate 11, and each light-emitting device 13 includes multiple first light-emitting devices 13a, multiple second light-emitting devices 13b, and multiple third light-emitting devices 13c. The first light-emitting devices 13a are disposed corresponding to the first isolation opening 12a, the second light-emitting devices 13b are disposed corresponding to the second isolation opening 12b, and the third light-emitting devices 13c are disposed corresponding to the third isolation opening 12c. In one embodiment, one light-emitting device 13 is disposed corresponding to one isolation opening; for example, the first light-emitting device 13a is disposed one-to-one with the first isolation opening 12a, the second light-emitting device 13b is disposed one-to-one with the second isolation opening 12b, and the third light-emitting device 13c is disposed one-to-one with the third isolation opening 12c. At least a portion of the first light-emitting device 13a is disposed within a corresponding first isolation opening 12a, at least a portion of the second light-emitting device 13b is disposed within a corresponding second isolation opening 12b, and at least a portion of the third light-emitting device 13c is disposed within a corresponding third isolation opening 12c. In another embodiment, multiple light-emitting devices 13 are correspondingly disposed with one isolation opening; for example, multiple light-emitting devices with the same emission color are corresponding to one isolation opening.

[0100] In one example, see Figure 6 The isolation structure 12 includes an isolation portion 122 and a blocking portion 121 stacked sequentially along a direction away from the substrate 11 (i.e., the Z direction). The width of the blocking portion 121 is greater than the width of the isolation portion 122. Therefore, the two ends of the blocking portion 121 protrude compared to the sides of the isolation portion 122, and this shape of the isolation structure 12 is also referred to as a hanging shape. The isolation portion 122 and the blocking portion 121 are made of different materials, and the etching rate of the blocking portion 121 is lower than that of the isolation portion 122. The material of the isolation portion 122 includes a conductive material, specifically including at least one of aluminum (Al), aluminum alloys, and aluminum alloys including at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The blocking portion 121 can be a single-layer structure or a multi-layer structure. When the blocking portion 121 is a single-layer structure, the material of the blocking portion 121 can include at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy. The blocking portion 121 has a multi-layer structure (for example, it includes a second sub-blocking portion 121b and a first sub-blocking portion 121a stacked sequentially along a direction away from the substrate 11, see [reference]). Figure 9In the case of [missing information], one layer of the blocking portion 121 may be made of at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy, and the other layer of the blocking portion 121 may be made of a conductive oxide or an inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO). For example, the orthographic projection of the side of the isolation portion 122 away from the substrate onto the substrate 11 is located within the orthographic projection of the blocking portion 121 onto the substrate 11. For example, the orthographic projection area of ​​the side of the isolation portion 122 away from the substrate onto the substrate 11 is smaller than the orthographic projection area of ​​the blocking portion 121 onto the substrate 11.

[0101] In some embodiments, reference Figure 7 The isolation structure 12 may further include a base 123 located on the side of the isolation portion 122 near the substrate 11. The base 123 protrudes relative to the isolation portion 122 in the direction toward the isolation opening, and the orthographic projection of the isolation portion 122 on the substrate 11 lies within the orthographic projection of the base 123 on the substrate 11. The material of the base 123 may include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb). For example, the orthographic projection of the side of the isolation portion 122 near the substrate 11 on the substrate 11 lies within the orthographic projection of the base 123 on the substrate 11. For example, the orthographic projection area of ​​the side of the isolation portion 122 near the substrate 11 on the substrate 11 is smaller than the orthographic projection area of ​​the base 123 on the substrate 11.

[0102] In one embodiment, the display panel 10 may further include a pixel defining layer 17, on which an isolation structure 12 is disposed. The pixel defining layer 17 has pixel openings 17a communicating with isolation openings. Specifically, the pixel defining layer 17 has a first pixel opening communicating with a first isolation opening 12a, a second pixel opening communicating with a second isolation opening 12b, and a third pixel opening communicating with a third isolation opening 12c. The areas of the orthographic projections of the first, second, and third pixel openings onto the substrate 11 may be the same or different. The shapes of the orthographic projections of the pixel openings and their corresponding isolation openings onto the substrate 11 may be the same or different. Generally, the area of ​​the orthographic projection of the isolation opening onto the substrate 11 is larger than the area of ​​the orthographic projection of the pixel opening communicating with that isolation opening onto the substrate 11. The orthographic projections of the pixel openings of the light-emitting device 13 onto the substrate 11 overlap with the orthographic projections of the isolation openings onto the substrate 11. The pixel defining layer 17 is made of an inorganic material, such as an inorganic insulating material formed by using at least one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0103] For example, the pixel defining layer includes a pixel defining portion that encloses and forms a plurality of pixel openings 17a. The pixel openings 17a expose at least a portion of the first electrode 131, and at least a portion of the light-emitting structure 132 of the light-emitting device 13 is located at the corresponding pixel opening 17a. The pixel openings 17a are connected to the corresponding isolation openings. For example, the pixel defining portion may be located between the isolation structure 12 and the substrate 11. For example, for the same light-emitting device, the orthographic projection of the light-emitting area on the substrate 11 coincides with the orthographic projection of the pixel opening 17a on the substrate 11, that is, they have the same shape and the same size.

[0104] In some embodiments, the pixel defining layer 17 includes an organic insulating material.

[0105] In one implementation, see Figure 7 The pixel limiting layer 17 includes multiple sub-layers, including a first sub-layer 171 and a second sub-layer 172 stacked sequentially along the direction away from the substrate 11, that is, the pixel limiting layer 17 can adopt a double-layer design.

[0106] For example, the first sublayer exhibits better film-forming properties than the second sublayer. That is, under the same thickness conditions, the first sublayer can better cover the stepped structure formed by the first electrode compared to the second sublayer, without causing cracks. Conversely, to achieve the same stepped coverage effect, the thickness of the first sublayer needs to be thinner than that of the second sublayer, meaning the thickness requirement for the first sublayer is relatively low, which is beneficial for product thinning. Furthermore, better film-forming properties are reflected in the better coverage of the formed film, making it denser and more effective at isolating moisture.

[0107] For example, the second sublayer has better etching resistance than the first sublayer. Since the side of the pixel defining layer 17 facing away from the substrate 11 will be etched during the display panel manufacturing process, by selecting a material with stronger etching resistance as the second sublayer, the etching resistance of the pixel defining layer 17 can be improved, further enhancing the reliability of the display panel.

[0108] For example, the first sublayer and the second sublayer are made of different materials. For instance, the first sublayer is made of silicon nitride, and the second sublayer is made of silicon oxide.

[0109] For example, the thickness of the first sublayer is greater than or equal to 1000 angstroms and less than or equal to 5000 angstroms. For instance, the thickness of the first sublayer is 1000 angstroms, 2000 angstroms, 3000 angstroms, 4000 angstroms, 5000 angstroms, etc.

[0110] For example, the thickness of the second sublayer is greater than or equal to 500 angstroms and less than or equal to 3000 angstroms. For instance, the thickness of the second sublayer is 500 angstroms, 1000 angstroms, 2000 angstroms, 3000 angstroms, etc.

[0111] In another embodiment, the isolation structure 12 is disposed within the recess of the pixel limiting layer 17. Alternatively, the pixel limiting layer 17 may not be provided in the display panel 10, and the isolation structure 12 may be disposed on one side of the substrate 11, with the isolation structure 12 in contact with one side of the substrate 11.

[0112] The first light-emitting device 13a, the second light-emitting device 13b, and the third light-emitting device 13c each emit light of different colors. Each of these devices includes a first electrode 131, a light-emitting structure 132, and a second electrode 133 stacked together. The first electrode 131 is disposed on the substrate 11, and a pixel defining layer 17 covers the end of the first electrode 131. A pixel opening is provided on the pixel defining layer 17, through which the first electrode 131 is exposed. The light-emitting structure 132 of the first light-emitting device 13a, the second light-emitting device 13b, and the third light-emitting device 13c covers the sidewall of the pixel opening of the pixel defining layer 17 and the side of the pixel defining layer 17 facing away from the substrate 11. Each light-emitting structure 132 is located within the pixel opening and is in contact with the first electrode 131.

[0113] The second electrodes 133 of the first light-emitting device 13a, the second light-emitting device 13b, and the third light-emitting device 13c respectively cover the corresponding light-emitting structure 132. The second electrodes 133 are electrically connected to the isolation structure 12. For example, the second electrodes 133 are connected to the isolation portion 122 of the isolation structure 12, and / or the second electrodes 133 are connected to the base portion 123 of the isolation structure 12. Specifically, when the isolation structure 12 includes a three-layer structure of a blocking portion 121, an isolation portion 122, and a base portion 123, the second electrodes 133 can extend to the side surface of the base portion 123 facing away from the substrate 11 to connect with the base portion 123. In this case, the second electrodes 133 may or may not be connected to the isolation portion 122, as can be seen in [reference needed]. Figure 7 .

[0114] The first electrode 131 can be an anode, and the second electrode 133 can be a cathode. The first electrode 131 of each light-emitting device 13 can be connected to the pixel circuit through a via, so that the pixel circuit drives the light-emitting device 13 to emit light.

[0115] The first electrode 131 may include a multilayer structure, such as a reflective layer and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer, respectively. The reflective layer can be formed, for example, using silver, a metallic material with excellent light reflectivity. Each conductive oxide layer can be formed, for example, from a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide). The second electrode 133 is formed, for example, from a metallic material such as an alloy of magnesium and silver (MgAg).

[0116] The light-emitting structure 132 of at least one of the first light-emitting devices 13a, the second light-emitting device 13b, and the third light-emitting device 13c includes a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL stacked along a direction away from the substrate 11 (i.e., the Z direction). The light-emitting structure 132 may include a single light-emitting material layer EML or a stacked light-emitting structure including multiple light-emitting material layers EML. For example, the light-emitting unit 132a may include a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL stacked along a direction away from the substrate 11 (i.e., the Z direction).

[0117] In order for the light-emitting structure 132 to emit light, a pixel voltage is provided to the first electrode 131 and a common voltage is provided to the second electrode 133, forming a potential difference between the first electrode 131 and the second electrode 133, so that the light-emitting structure 132 disposed between the first electrode 131 and the second electrode 133 emits light. In one embodiment, if a potential difference is formed between the first electrode 131 and the second electrode 133 of the first light-emitting device 13a, the light-emitting material layer EML of the light-emitting structure 132 emits blue light; if a potential difference is formed between the first electrode 131 and the second electrode 133 of the second light-emitting device 13b, the light-emitting material layer EML of the light-emitting structure 132 emits green light; and if a potential difference is formed between the first electrode 131 and the second electrode 133 of the third light-emitting device 13c, the light-emitting material layer EML of the light-emitting structure 132 emits red light.

[0118] In this configuration, the pixel voltage of the first electrode 131 is provided by the pixel circuit 1, and the common voltage of the second electrode 133 is provided by the isolation structure 12. Specifically, the second electrode 133 is electrically connected to the isolation structure 12, and the common voltage is supplied to the second electrode 133 by providing the isolation structure 12. That is, the isolation structure 12 has the function of supplying a common voltage to the second electrode 133.

[0119] Figure 11 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application. See also... Figure 11 The display panel 10 also includes a first encapsulation layer 14, which includes a plurality of first encapsulation portions. Each encapsulation portion is located on the side of the second electrode 133 facing away from the substrate 11, and extends through the sidewall of the isolation structure 12 to the side of the isolation structure 12 facing away from the substrate 11. For example, the orthographic projection of the first opening 14d on the substrate 11 lies within the orthographic projection of the side of the isolation structure 12 facing away from the substrate 11 on the substrate 11. For example, the orthographic projection area of ​​the first opening 14d on the substrate 11 is smaller than the orthographic projection area of ​​the side of the isolation structure 12 facing away from the substrate 11 on the substrate 11. This arrangement improves the encapsulation effect.

[0120] For example, in a cross-section perpendicular to the substrate 11 and passing through the central axis of the adjacent light-emitting device, the lateral dimension L1 of the light-blocking portion 19 on the side near the isolation structure 12 is greater than or equal to half of the lateral dimension L2 of the isolation structure 12 on the side away from the substrate 11. This arrangement ensures a larger contact area between the light-blocking portion 19 and the isolation structure 12, which is beneficial for ensuring the reliability of the connection between the light-blocking portion 19 and the isolation structure 12 and preventing easy separation of the film layer.

[0121] For example, the first encapsulation portion includes a first segment 51 and a second segment 52 that are interconnected. The first segment 51 is located within the isolation opening and disposed on the side of the light-emitting structure 132 facing away from the substrate 1. The second segment 52 is located on the side of the isolation structure 12 facing the isolation opening. The surface of the first segment 51 facing away from the substrate 1 and the surface of the second segment 52 facing away from the isolation structure 12 are at least partially interconnected to enclose and form a gap space 500. See also Figure 11 .

[0122] Figure 12 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application. For example, see [link to example]. Figure 12 The surface of the first segment 51 facing away from the substrate 1 and the surface of the second segment 52 facing away from the isolation structure 3 may not be connected.

[0123] For example, the display panel 10 further includes a first organic encapsulation layer 142 and a second inorganic encapsulation layer 143. The first organic encapsulation layer 142 covers the first inorganic encapsulation layer 141, and the second inorganic encapsulation layer 143 covers the second encapsulation layer 15. Both the first inorganic encapsulation layer 141 and the second inorganic encapsulation layer 143 are inorganic materials, and the materials of the first inorganic encapsulation layer 141 and the second inorganic encapsulation layer 143 include at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The first organic encapsulation layer 142 is an organic insulating material, such as epoxy resin, acrylic resin, or other resin materials. For example, the first encapsulation portion includes a first inorganic encapsulation layer 141, a first organic encapsulation layer 142, and a second inorganic encapsulation layer 143 stacked together.

[0124] For example, the first opening 14d penetrates the first inorganic encapsulation layer 141, the first organic encapsulation layer 142, and the second inorganic encapsulation layer 143.

[0125] For example, the display panel 10 may also include at least one film layer such as a touch layer, a polarizer, a color filter substrate, and a protective cover. This film layer may also be bonded to the display panel via an adhesive layer such as OCA (Optical Clear Adhesive).

[0126] The substrate 11 can be a flexible substrate or a rigid substrate. The flexible substrate may include organic materials, such as organic insulating materials, such as polyimide. The rigid substrate may include a glass substrate.

[0127] For example, the light-blocking portion 19 is projected onto the substrate 11 in a grid pattern.

[0128] For example, the second electrode 133 may include an electrode portion 133a and an auxiliary electrode 133b stacked along the thickness direction of the substrate 11. For example, the electrode portion 133a may include a metal, such as at least one of nitrile metal and silver. For example, the auxiliary electrode 133b may include a metal oxide, such as indium tin oxide (ITO) or indium zinc oxide (IZO). The auxiliary electrode 133b may be located on the side of the electrode portion 133a near or away from the substrate 11. The auxiliary electrode 133b may be in contact with the isolation structure 12, for example, through electrical connection.

[0129] Figure 13 This is a top view schematic diagram of another display panel provided in an embodiment of this application. The display panel 10 can be an organic light-emitting diode (OLED) display panel or a quantum dot light-emitting diode (QLED) display panel. The display panel 10 includes a display area AA with display function and a non-display area NA.

[0130] The display area AA of the display panel 10 can be rectangular, square, circular, oval, or other shapes.

[0131] The display area AA includes a plurality of pixels PX arranged in the X and Y directions. Each pixel PX includes a plurality of sub-pixels SPX displaying different colors. In some embodiments, a pixel PX includes a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. For example, the first sub-pixel SPX1 is a red sub-pixel, the second sub-pixel SPX2 is a green sub-pixel SPX2, and the third sub-pixel SPX3 is a blue sub-pixel SPX3. In some embodiments, in addition to sub-pixels SPX1, SPX2, and SPX3, a pixel PX also includes sub-pixels SPX that emit white or other colors of light.

[0132] A sub-pixel (SPX) includes a pixel circuit and a light-emitting device driven by the pixel circuit to emit light of the corresponding color. The first sub-pixel (SPX1) includes a first light-emitting device, the second sub-pixel (SPX2) includes a second light-emitting device, and the third sub-pixel (SPX3) includes a third light-emitting device. One pixel circuit drives at least one light-emitting device to emit light. For example, the display area AA includes a normal display area and a light-transmitting display area. The light-transmitting display area is a display area set according to a corresponding sensor and has light-transmitting properties, while the normal display area is a display area not set according to a corresponding sensor. In the normal display area, one pixel circuit drives one light-emitting device to emit light, and in the light-transmitting display area, one pixel circuit drives one or more light-emitting devices to emit light.

[0133] Figure 14 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application. The display panel 10 includes a pixel circuit layer and a planarization layer 191 located on a substrate 11. The pixel circuit layer includes pixel circuits for driving the light-emitting device 13 to emit light. Figure 14 A transistor 181 in the pixel circuit is shown. A via is provided in the planarization layer 191, and the first electrode 131 is electrically connected to the transistor 181 in the pixel circuit layer through the via. Furthermore, the pixel circuit layer also includes at least one insulating layer, which may include at least one of an inorganic layer and an organic layer. In addition, the display panel 10 also includes scan lines providing scan signals Scan and data lines providing data signals Data to the pixel circuit.

[0134] Figure 15 This application provides a schematic diagram of the pixel circuit structure in an embodiment. (For reference only.) Figure 15The pixel circuit includes a driving transistor T1 and a data transistor T2. The source of the data transistor T2 is connected to the data line that provides the data signal Data, the gate of the data transistor T2 is connected to the scan line that provides the scan signal Scan, and the drain of the data transistor T2 is connected to the gate of the driving transistor T1. The two ends of the storage capacitor C1 are respectively connected to the gate and the source of the driving transistor T1, and the drain of the driving transistor T1 is connected to the light-emitting device 13. Figure 15 This is one implementation of a pixel circuit; the pixel circuit described in this application is not limited to... Figure 15 The 2T1C pixel circuit shown can also be other pixel circuits, such as 7T1C, 8T1C pixel circuits, etc.

[0135] This application provides a method for manufacturing a display panel. Figure 16 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application. Figure 17 This is a schematic diagram of at least some steps in the fabrication process of a display panel fabrication method provided in this application embodiment. This display panel fabrication method can be used to fabricate the display panel described in the above embodiments, for example... Figures 2 to 4 , Figures 6 to 8 , Figure 11 Etc. See also. Figure 16 and Figure 17 The method for manufacturing this display panel includes: Step S110: Form an isolation structure on the substrate.

[0136] Step S120: Sequentially prepare the light-emitting functional layer, the second electrode layer, and the first encapsulation layer. The orthographic projection of the light-emitting functional layer on the substrate covers the orthographic projection of the isolation structure on the substrate. The orthographic projection of the second electrode layer on the substrate covers the orthographic projection of the isolation structure on the substrate. The orthographic projection of the first encapsulation layer on the substrate covers the orthographic projection of the isolation structure on the substrate.

[0137] The light-emitting functional layer 132' can be used to form the light-emitting structure 132 of the light-emitting device 13. The second electrode layer 133' can be used to form the second electrode 133 of the light-emitting device 13. The first encapsulation layer 14 can be formed by ALD (Atomic Layer Deposition) and CVD (Chemical Vapor Deposition). Step S120 can simultaneously prepare the light-emitting structure 132 of the first light-emitting device 13a, the second light-emitting device 13b, and the third light-emitting device 13c. Step S120 can simultaneously prepare the second electrode 133 of the first light-emitting device 13a, the second electrode 133 of the second light-emitting device 13b, and the second electrode 133 of the third light-emitting device 13c. Step S120 can simultaneously prepare the first encapsulation portion 14a of the first light-emitting device 13a, the first encapsulation portion 14b of the second light-emitting device 13b, and the first encapsulation portion 14c of the third light-emitting device 13c. A light-emitting functional layer is fabricated over the entire surface, followed by a second electrode layer, and then a first encapsulation layer. For example, the light-emitting functional layer covers the isolation opening, the second electrode layer covers the isolation opening, and the first encapsulation layer covers the isolation opening.

[0138] Step S130: Etch the light-emitting functional layer, the second electrode layer, and the first encapsulation layer on the side of the isolation structure away from the substrate to form a first opening in the first encapsulation layer; the orthographic projection of the first opening on the substrate overlaps with the orthographic projection of the isolation structure on the substrate, forming a first overlapping area.

[0139] For example, at least a portion of the first encapsulation layer 14 between the isolation structure 12 and the light-blocking portion 19 is removed, at least a portion of the second electrode layer between the isolation structure 12 and the light-blocking portion 19 is removed, and at least a portion of the light-emitting functional layer between the isolation structure 12 and the light-blocking portion 19 is removed. For example, the isolation structure 12 and the light-blocking portion 19 can be in direct contact.

[0140] Step S140: A light-blocking portion is formed on the side of the isolation structure away from the substrate; the orthogonal projection of the light-blocking portion on the substrate overlaps with the first overlapping area.

[0141] Among them, the light-blocking part 19 can be made using the yellow light process.

[0142] Step S150: A light color conversion section is formed on the side of the first encapsulation layer away from the substrate.

[0143] For example, before, after or simultaneously with the formation of the light color conversion section 18, a light transmission section 18c may be formed on the side of the first encapsulation layer 14 opposite to the substrate 11.

[0144] The method for manufacturing this display panel can be used to manufacture the display panel in the above embodiments. The embodiments of this application have the beneficial effects of the above embodiments, which will not be repeated here. The embodiments of this application can be combined with some or all of the technical features in the above embodiments, which will not be repeated here.

[0145] For example, after forming the light color conversion section, the method further includes forming a second encapsulation layer 20 on the side of the light color conversion section away from the substrate.

[0146] For example, the first opening 14d penetrates the first encapsulation layer 14, the second electrode layer 133', and the light-emitting functional layer 132' along the thickness direction Z of the substrate, and the isolation structure 12 contacts the light-blocking part 19.

[0147] For example, after forming the second encapsulation layer, the method further includes forming a filter layer 21 on the side of the second encapsulation layer 20 away from the substrate 11.

[0148] For example, the light-blocking part includes the main body 19a, and the light-blocking part also includes a reflective layer or a light-blocking layer located on the side of the main body facing the light color conversion part. Figure 18 This is a schematic diagram showing at least some steps of a method for fabricating a display panel according to an embodiment of this application. See also... Figure 4 , Figure 7 , Figure 11 and Figure 18 Step S140 includes: Step S141: Form a main body portion 19a on the side of the isolation structure 12 away from the substrate 11.

[0149] Among them, a high-resolution photoresist pattern is created using a photolithography process to form the main body 19a.

[0150] Step S142: A reflective layer 19b or a light-blocking layer 19b is formed on the side of the main body 19a facing the light-color conversion part 18.

[0151] The reflective layer 19b comprises a metal, such as titanium or aluminum, which can be patterned using a dry etching process. The light-blocking layer 19b may comprise a black matrix material, which can be fabricated using a photolithography process.

[0152] High-resolution organic materials and dry etching with titanium or aluminum are used to solve the problem of insufficient resolution of opaque black photoresist. The main body 19a uses a high-resolution organic material with high light transmittance, which can achieve target patterning and is beneficial to improving pixel resolution (PPI).

[0153] Based on the same inventive concept, this application provides another method for manufacturing a display panel. Figure 19 A flowchart illustrating another method for preparing a display panel according to an embodiment of this application. Figure 20This is a schematic diagram showing at least some steps of another method for fabricating a display panel according to an embodiment of this application. This method can be used to fabricate the display panel described in the above embodiments, for example... Figure 5 , Figure 9 , Figure 10 , Figure 12 Etc. See also. Figure 19 and Figure 20 The method for manufacturing this display panel includes: Step S210: Form an isolation structure on the substrate.

[0154] Step S220: Sequentially prepare the light-emitting functional layer, the second electrode layer, and the first encapsulation layer. The orthographic projection of the light-emitting functional layer on the substrate covers the orthographic projection of the isolation structure on the substrate. The orthographic projection of the second electrode layer on the substrate covers the orthographic projection of the isolation structure on the substrate. The orthographic projection of the first encapsulation layer on the substrate covers the orthographic projection of the isolation structure on the substrate.

[0155] Step S230: A light color conversion section is formed on the side of the first encapsulation layer away from the substrate.

[0156] Step S240: A second encapsulation layer is formed on the side of the light-color conversion section away from the substrate.

[0157] Step S250: Etch the light-emitting functional layer, the second electrode layer, the first encapsulation layer, and the second encapsulation layer on the side of the isolation structure away from the substrate, so as to form a first opening in the first encapsulation layer and a second opening in the second encapsulation layer. The first opening and the corresponding second opening are connected. The orthographic projection of the first opening on the substrate overlaps with the orthographic projection of the isolation structure on the substrate, and forms a first overlapping area.

[0158] For example, at least a portion of the second encapsulation layer between the isolation structure 12 and the light-blocking portion 19 is removed; at least a portion of the first encapsulation layer 14 between the isolation structure 12 and the light-blocking portion 19 is removed; at least a portion of the second electrode layer between the isolation structure 12 and the light-blocking portion 19 is removed; and at least a portion of the light-emitting functional layer between the isolation structure 12 and the light-blocking portion 19 is removed. For example, the isolation structure 12 and the light-blocking portion 19 may be in direct contact.

[0159] Step S260: A light-blocking portion is formed on the side of the isolation structure away from the substrate; the orthogonal projection of the light-blocking portion on the substrate overlaps with the first overlapping area.

[0160] The light-blocking part includes a reflective layer 19b or a light-blocking layer 19b.

[0161] The method for manufacturing this display panel can be used to manufacture the display panel in the above embodiments. The embodiments of this application have the beneficial effects of the above embodiments, which will not be repeated here. The embodiments of this application can be combined with some or all of the technical features in the above embodiments, which will not be repeated here.

[0162] For example, after forming the light-blocking portion, the method further includes forming a light filter layer 21 on the side of the second encapsulation layer 20 and the light-blocking portion 19 that is away from the substrate 11.

[0163] The problem of insufficient resolution of black photoresist can be solved by using dry etching of titanium or aluminum on the side of the light-color conversion section, or by BM (black matrix) photolithography. The high light absorption of black photoresist causes the light from the exposure machine to be absorbed, making it difficult to form the target pattern.

[0164] refer to Figure 21 This application also provides a display device, which includes the display panel provided in the embodiments of this application or a display panel prepared by the preparation method of the display panel provided in the embodiments of this application. The display device may include devices with image processing capabilities, such as mobile phones, desktop computers, laptops, tablets, automotive displays, wearable devices, etc. Because this display device includes the display panel described in this application, the reliability of this electronic device is higher.

[0165] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0166] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0167] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: substrate; An isolation structure is disposed on the substrate; Multiple light-emitting devices, wherein at least a portion of the isolation structure is projected onto the substrate in the gap between the projected light-emitting areas of adjacent light-emitting devices onto the substrate; A first encapsulation layer, at least a portion of which is located on the side of the light-emitting device away from the substrate, wherein the first encapsulation layer has a first opening, and the orthographic projection of the first opening on the substrate overlaps with the orthographic projection of the isolation structure on the substrate, forming a first overlapping area. Multiple light color conversion units are located on the side of the first encapsulation layer opposite to the corresponding light-emitting device; The light-blocking part is located on the side of the isolation structure away from the substrate, and the orthographic projection of the light-blocking part on the substrate overlaps with the first overlapping area.

2. The display panel according to claim 1, characterized in that, Along the thickness direction of the substrate, the distance between the side of the light color conversion part away from the substrate and the substrate is greater than the distance between the side of the isolation structure away from the substrate and the substrate. Preferably, the first opening penetrates the first encapsulation layer along the thickness direction of the substrate, and the isolation structure contacts the light-blocking portion; Preferably, the isolation structure includes an insulating material. Alternatively, the isolation structure comprises a conductive material, and the light-blocking part comprises a reflective metallic material; the isolation structure is electrically connected to the light-blocking part. Preferably, the isolation structure comprises an opaque material.

3. The display panel according to claim 1, characterized in that, The light-blocking part comprises a black organic material; Alternatively, the light-blocking part includes a main body, and the light-blocking part further includes a reflective layer or a light-blocking layer located on the sidewall of the main body facing the light color conversion part; preferably, the main body includes an organic material; preferably, the reflective layer includes titanium or aluminum; Preferably, the display panel further includes a second encapsulation layer, the second encapsulation layer being located on the side of the light color conversion section opposite to the substrate; Preferably, the second encapsulation layer is located on the side of the light-blocking portion away from the substrate; preferably, the side of the second encapsulation layer away from the substrate includes a first sub-region and a second sub-region, the orthographic projection of the first sub-region on the substrate overlaps with the orthographic projection of the light-emitting area of ​​the light-emitting device on the substrate, and the orthographic projection of the second sub-region on the substrate overlaps with the orthographic projection of the isolation structure on the substrate; the first sub-region and the second sub-region are located on the same plane and are continuously arranged, and the plane is parallel to the substrate.

4. The display panel according to claim 1, characterized in that, The light-blocking part includes a reflective layer or a light-blocking layer; Preferably, the light-blocking part comprises titanium, aluminum, or a black organic material; Preferably, the display panel further includes a second encapsulation layer, the second encapsulation layer being located on the side of the light color conversion section opposite to the substrate; The second encapsulation layer is provided with a second opening, and the first opening communicates with the corresponding second opening; the orthographic projection of the second opening on the substrate overlaps with the orthographic projection of the first opening on the substrate, forming a second overlapping area; the orthographic projection of the light-blocking part on the substrate overlaps with the second overlapping area. Preferably, the second encapsulation layer is in contact with the first encapsulation layer; Preferably, the side of the light-blocking portion facing away from the substrate is grooved; Preferably, a second encapsulation layer is provided between the light-blocking part and the light color conversion part.

5. The display panel according to claim 4, characterized in that, The display panel further includes a light filter layer, which is located on the side of the second encapsulation layer and the light-blocking portion away from the substrate; Preferably, the filter layer includes a first filter layer, a second filter layer, and a third filter layer with different filter colors; the area where the orthographic projections of the first filter layer, the second filter layer, and the third filter layer on the substrate all overlap overlaps with the orthographic projection of the first overlapping area on the substrate; the first filter layer, the second filter layer, and the third filter layer are stacked in the groove of the light-blocking portion, which is groove-shaped; Preferably, the first encapsulation layer comprises an inorganic material, and the second encapsulation layer comprises an inorganic material; Preferably, the first encapsulation layer includes at least one inorganic encapsulation layer and at least one organic encapsulation layer stacked along the thickness direction of the substrate; Preferably, the first encapsulation layer includes a plurality of spaced-apart first encapsulation portions; the first encapsulation portions are located on the side of the corresponding light-emitting device that is away from the substrate; Preferably, the first encapsulation part corresponds one-to-one with the light-emitting device, and different light color conversion parts correspond to different first encapsulation parts; Preferably, the second encapsulation layer includes a plurality of spaced-apart second encapsulation portions; the second encapsulation portions are located on the side of the corresponding first encapsulation portion away from the substrate, and the second encapsulation portions are in contact with the corresponding first encapsulation portions.

6. The display panel according to claim 1, characterized in that, The plurality of light-emitting devices includes a first light-emitting device and a second light-emitting device, and the plurality of color conversion units includes a first color conversion unit and a second color conversion unit that convert different colors. The first light color conversion unit is located on the side of the first light-emitting device that is away from the substrate, and the second light color conversion unit is located on the side of the second light-emitting device that is away from the substrate. The light-emitting device includes a first electrode, a light-emitting structure, and a second electrode, which are sequentially stacked along a direction away from the substrate. The light-emitting structure of the first light-emitting device and the light-emitting structure of the second light-emitting device are made of the same material; Preferably, the display panel further includes a light-transmitting portion, and the plurality of light-emitting devices further includes a third light-emitting device; The light-transmitting portion is located on the side of the first encapsulation layer and the third light-emitting device that is away from the substrate; The light transmission section and the light color conversion section are disposed in the same layer; Preferably, the light-emitting structure of the first light-emitting device and the light-emitting structure of the third light-emitting device are made of the same material; Preferably, the first light-emitting device, the second light-emitting device, and the third light-emitting device emit blue light. Preferably, the light-emitting structure includes at least two light-emitting units and at least one charge-generating layer stacked along the thickness direction of the substrate; Preferably, the isolation structure includes a conductive material, and the isolation structure is electrically connected to the second electrode; the orthographic projection of the isolation structure on the substrate is a grid; the orthographic projection of the light-blocking portion on the substrate is a grid; and the isolation structure is electrically connected to the light-blocking portion. Preferably, the isolation structure includes an isolation portion and a blocking portion stacked sequentially along a direction away from the substrate, wherein the orthographic projection of the side of the isolation portion away from the substrate on the substrate is located within the orthographic projection of the blocking portion on the substrate; Preferably, the isolation structure further includes a base located between the substrate and the isolation portion, wherein the orthographic projection of the side of the isolation portion closer to the substrate onto the substrate lies within the orthographic projection of the base onto the substrate; Preferably, the display panel further includes a pixel defining layer, the pixel defining layer including a pixel defining portion, the pixel defining portion enclosing and forming a plurality of pixel openings; The pixel opening exposes at least a portion of the first electrode, and at least a portion of the light-emitting structure of the light-emitting device is located in the corresponding pixel opening; Preferably, the pixel defining portion is located between the isolation structure and the substrate, and the pixel defining layer comprises an inorganic insulating material; Preferably, the isolation structure encloses an isolation opening, and the pixel opening is connected to the corresponding isolation opening.

7. A method for manufacturing a display panel, characterized in that, include: An isolation structure is formed on the substrate; A light-emitting functional layer, a second electrode layer, and a first encapsulation layer are sequentially fabricated. The orthographic projection of the light-emitting functional layer on the substrate covers the orthographic projection of the isolation structure on the substrate. The orthographic projection of the second electrode layer on the substrate covers the orthographic projection of the isolation structure on the substrate. The orthographic projection of the first encapsulation layer on the substrate covers the orthographic projection of the isolation structure on the substrate. The light-emitting functional layer, the second electrode layer, and the first encapsulation layer on the side of the isolation structure opposite to the substrate are etched to form a first opening in the first encapsulation layer; The orthographic projection of the first opening on the substrate overlaps with the orthographic projection of the isolation structure on the substrate, forming a first overlapping area; A light-blocking portion is formed on the side of the isolation structure opposite to the substrate; The orthographic projection of the light-blocking portion on the substrate overlaps with the first overlapping region; A light color conversion section is formed on the side of the first encapsulation layer opposite to the substrate.

8. The method for manufacturing a display panel according to claim 7, characterized in that, After the light-color conversion unit is formed, it also includes: A second encapsulation layer is formed on the side of the light color conversion section opposite to the substrate; Preferably, the first opening extends through the first encapsulation layer, the second electrode layer, and the light-emitting functional layer along the thickness direction of the substrate, and the isolation structure contacts the light-blocking portion; Preferably, after forming the second encapsulation layer, the method further includes: forming a filter layer on the side of the second encapsulation layer opposite to the substrate; Preferably, the light-blocking portion includes a main body portion, and the light-blocking portion further includes a reflective layer or a light-blocking layer located on the side of the main body portion facing the light color conversion portion; forming the light-blocking portion on the side of the isolation structure away from the substrate includes: A main body portion is formed on the side of the isolation structure opposite to the substrate; A reflective layer or a light-blocking layer is formed on the side of the main body facing the light color conversion part.

9. A method for manufacturing a display panel, characterized in that, include: An isolation structure is formed on the substrate; A light-emitting functional layer, a second electrode layer, and a first encapsulation layer are sequentially fabricated. The orthographic projection of the light-emitting functional layer on the substrate covers the orthographic projection of the isolation structure on the substrate. The orthographic projection of the second electrode layer on the substrate covers the orthographic projection of the isolation structure on the substrate. The orthographic projection of the first encapsulation layer on the substrate covers the orthographic projection of the isolation structure on the substrate. A light color conversion section is formed on the side of the first encapsulation layer opposite to the substrate; A second encapsulation layer is formed on the side of the light color conversion section opposite to the substrate; The light-emitting functional layer, the second electrode layer, the first encapsulation layer, and the second encapsulation layer on the side of the isolation structure opposite to the substrate are etched to form a first opening in the first encapsulation layer and a second opening in the second encapsulation layer. The first opening communicates with the corresponding second opening. The orthographic projection of the first opening on the substrate overlaps with the orthographic projection of the isolation structure on the substrate, forming a first overlapping area. A light-blocking portion is formed on the side of the isolation structure opposite to the substrate; The orthographic projection of the light-blocking portion on the substrate overlaps with the first overlapping area.

10. A display device, characterized in that, The display device includes a display panel as described in any one of claims 1 to 6, or a display panel prepared by the method described in any one of claims 7 to 9.

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