A multi-specification wafer carrier device

Abstract

This invention discloses a multi-specification wafer carrier device, comprising a support part, a rotating part, a vacuum chuck, and a vacuum system. The support part, rotating part, and vacuum chuck are connected sequentially from bottom to top. The vacuum system is installed inside the support part. The vacuum chuck has multiple air passages and multiple vacuum suction slots corresponding to and connected to the multiple air passages. The multiple vacuum suction slots are distributed at intervals from the inside to the outside. The vacuum system is connected to and communicates with the multiple air passages. This invention, through the multi-zone independent air passage design of the vacuum chuck, allows for rapid switching to adapt to different wafer specifications without replacing components, significantly simplifying the specification switching process and improving the efficiency of multi-specification mixed-line production.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing and manufacturing technology, specifically to a multi-specification wafer carrier device. Background Technology

[0002] In semiconductor manufacturing technology, the wafer carrier is a key component that runs through all core stages of wafer manufacturing, testing, and packaging. Its performance directly determines chip production yield and processing efficiency. The carrier is mainly used to achieve stable wafer support, precise positioning, and efficient transport, and must meet stringent requirements such as ultra-cleanliness, anti-static properties, and high dimensional accuracy.

[0003] With the rapid development of the semiconductor industry, wafers of different specifications and models (such as 6-inch, 8-inch, and 12-inch) are widely used in the production of various types of chips, and multi-specification wafer cross-line processing has become the norm in the industry. Therefore, the compatibility and adaptability of the carrier device with wafers of different sizes has become an important indicator for measuring its performance.

[0004] Currently, existing wafer carrier technologies have the following main shortcomings: 1) Poor compatibility with multiple specifications, and cumbersome specification switching. Traditional wafer-bearing methods mainly involve manually placing a single wafer on a tabletop mat and rolling it. Only one wafer can be fixed and processed at a time, resulting in low processing efficiency. Furthermore, it requires changing special wafer-bearing components for different wafer specifications, which is cumbersome and difficult to adapt to the needs of multi-specification mixed-line mass production.

[0005] 2) Fixed load-bearing structure with insufficient flexibility While some existing carrier devices attempt to support multiple wafers, their fixed carrier structures cannot flexibly adapt to wafers of different sizes.

[0006] 3) Processing and testing efficiency needs to be improved. Traditional single-wafer processing methods are inefficient, while existing multi-wafer carrier devices still have shortcomings in terms of automation of loading and unloading, and rotational positioning accuracy. In scenarios requiring wafer defect detection in conjunction with inspection equipment, the carrier device often struggles to balance load-bearing stability with the demands of high-speed rotation and fine-tuning, thus limiting the improvement of inspection efficiency and accuracy.

[0007] Therefore, providing a multi-specification wafer carrier device that can flexibly adapt to multiple wafer specifications, achieve batch carrying and precise adjustment, and has a stable structure is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0008] In view of this, the present invention provides a multi-specification wafer carrier device to solve the problems of low efficiency and insufficient adaptability of existing devices, especially the inability to flexibly adapt to multi-specification wafers. It can achieve stable carrying of wafers of different specifications and can be combined with a robot to achieve efficient batch processing, improve adjustment accuracy, processing yield and processing inspection efficiency, and simplify specification switching process.

[0009] To achieve the above objectives, the present invention adopts the following technical solution: A multi-specification wafer carrier includes a support part, a rotating part, a vacuum chuck, and a vacuum system. The support part, the rotating part, and the vacuum chuck are connected together from bottom to top. The vacuum system is installed inside the support part. The vacuum chuck has multiple air passages and multiple vacuum suction slots that are respectively connected to the multiple air passages. The multiple vacuum suction slots are distributed at intervals from the inside to the outside. The vacuum system is connected to and communicates with the multiple air passages.

[0010] Furthermore, the support includes a base, a lead screw stepper motor, two guide rail assemblies, a connecting post assembly, and a floating joint assembly. The base is hollow inside. The rotating part is mounted on the top of the base. The lead screw stepper motor is mounted on the bottom surface inside the base via a motor mounting bracket. Both guide rail assemblies are vertically mounted on the bottom surface inside the base. The connecting post assembly is located inside the base and horizontally mounted on the two guide rail assemblies. The air passage slip ring assembly of the vacuum system is vertically mounted on the bottom surface inside the base and passes through the center of the connecting post assembly. The extension ends of multiple air pipes mounted on the air passage slip ring assembly are respectively connected to multiple air passages. The floating joint assembly is fixedly connected to the connecting post assembly and threadedly connected to the extension end of the lead screw shaft of the lead screw stepper motor.

[0011] Furthermore, the support also includes two photoelectric switches and a limiting lever. The two photoelectric switches are respectively mounted on the side of the base via a switch mounting plate and are distributed vertically at intervals. The limiting lever is mounted on the receiving post assembly and is distributed correspondingly between the two photoelectric switches.

[0012] Furthermore, the guide rail assembly includes a guide rail mounting bracket, a linear guide rail, and a slider. The guide rail mounting bracket is vertically mounted on the inner bottom surface of the base, such that the two guide rail mounting brackets and the lead screw stepper motor are arranged in a triangular pattern. The linear guide rail is mounted inside the guide rail mounting bracket. The slider is fitted onto the linear guide rail. The connecting post assembly is fixedly connected to the slider via an adapter block. The floating joint assembly includes a joint fixing seat, a joint inner ring, two first pin shafts, a joint mandrel, and two second pin shafts. The joint fixing seat is mounted on the connecting post assembly. The joint inner ring is located on the... The two first pin shafts are symmetrically screwed into the two sides of the connector fixing seat, and the optical shaft sections of the two first pin shafts are centered and inserted into the two sides of the inner ring of the connector; the connector mandrel is located inside the inner ring of the connector; the two second pin shafts are symmetrically screwed into the other two sides of the inner ring of the connector, and the optical shaft sections of the two second pin shafts are centered and inserted into the two sides of the connector mandrel, so that the two first pin shafts and the two second pin shafts are arranged in a cross shape; the lead screw shaft extension end of the lead screw stepper motor is threadedly connected to the center hole of the connector mandrel.

[0013] Furthermore, the contact pin assembly includes a contact pin ring, a first contact pin group, a second contact pin group, and two air tube assemblies. The contact pin ring is fixedly connected to the connector fixing seat. The contact pin ring is fixedly connected to the slider via the adapter block. The air passage slip ring assembly vertically penetrates the center of the contact pin ring. The first contact pin group includes multiple first contact pins, and the second contact pin group includes multiple second contact pins. The multiple first contact pins are respectively vertically fixed to the top surface of the contact pin ring and arranged in a triangular pattern. The multiple first contact pins respectively penetrate the rotating... The system comprises a base and a vacuum suction cup; a plurality of second connecting posts are vertically fixed to the top surface of the connecting ring and arranged in a triangular pattern, with the plurality of second connecting posts located outside the plurality of first connecting posts; the plurality of second connecting posts are located outside the base and penetrate the vacuum suction cup; two air tube assemblies are arranged spirally around the center of the connecting ring, one end of each air tube assembly is connected to the vacuum pumping device of the vacuum system, and the other end of each air tube assembly is connected to the first connecting post group and the second connecting post group, respectively.

[0014] Furthermore, a PEEK connector is installed at the top of each of the first connector posts and at the top of each of the second connector posts.

[0015] Furthermore, the gas path slip ring assembly includes a rotary manifold block and a gas tube sleeve. The fixing part of the rotary manifold block is installed on the inner bottom surface of the base. The fixing part of the rotary manifold block is connected and communicates with the vacuum pumping device of the vacuum system. The gas tube sleeve is fitted and fixed on the rotating part of the rotary manifold block. The outer periphery of the gas tube sleeve has multiple longitudinal holes communicating with its interior, so that multiple gas tubes pass through the multiple longitudinal holes and extend to the outside of the gas tube sleeve.

[0016] Furthermore, the rotating part includes a housing, a torque motor, a spindle, a collar, a partition plate, and a top cover. The torque motor is installed in the inner cavity of the housing. The spindle is located inside the inner cavity and connected to the moving part of the torque motor. The spindle has a through hole through which the first connecting post passes. The bottom wall of the outer ring of the collar is fastened to the step of the inner cavity, and the top wall of the outer ring of the collar is pressed by a first collar retaining ring. The inner wall of the inner ring of the collar is fitted onto the spindle, and the top wall of the inner ring of the collar is close to the step of the spindle. The bottom wall of the inner ring of the collar is pressed by a second collar retaining ring. The partition plate is installed inside the spindle. The top cover is installed at the top of the housing and located around the spindle.

[0017] Furthermore, the rotating part also includes an absolute grating ruler and a reading head, the absolute grating ruler being fitted onto the mandrel; the reading head is mounted on the housing via a reading head mounting plate and corresponds to the position of the absolute grating ruler.

[0018] Furthermore, the vacuum suction cup has a first through hole for the first contact post to pass through and a second through hole for the second contact post to pass through; each of the air passages is connected to the corresponding vacuum suction groove through a connecting hole; the bottom of the vacuum suction cup has a recess for placing the air tube.

[0019] Therefore, the present invention provides a multi-specification wafer carrier device, which has the following advantages compared with the prior art: 1) Flexible adaptation to multiple specifications, simplifying the switching process This invention utilizes a vacuum suction cup with multiple air channels spaced outwards and corresponding connected vacuum suction slots. Combined with an internal vacuum system in the support unit, it achieves independent control of multiple zones. By simply switching different vacuum air channels to select the corresponding carrier area, it can quickly adapt to wafers of different sizes and thicknesses, such as 6-inch, 8-inch, and 12-inch wafers, without replacing the entire carrier unit or making complex mechanical adjustments. Compared to existing technologies that require replacing dedicated carrier components or switching mechanical parts, this invention significantly simplifies the specification switching process, substantially improves the efficiency of multi-specification mixed-line production, and effectively solves the technical pain point of cumbersome single-specification adaptation or switching in existing devices.

[0020] 2) The support structure is compact, and the coordination between drive and guidance is highly precise. This invention integrates a lead screw stepper motor, two guide rail assemblies, and a pneumatic slip ring assembly within the base. The two guide rail assemblies and the lead screw stepper motor are arranged in a triangular configuration, achieving a compact layout of the support while ensuring structural rigidity and guiding accuracy. The floating joint assembly employs a cross-shaped arrangement of dual-axis pins, providing slight flexibility compensation in rigid transmission. This effectively eliminates installation errors and off-center loads on the lead screw stepper motor, protecting the motor and improving the smoothness and repeatability of the lifting action. It also ensures smooth sliding of the connecting pin assembly along the guide rail assembly, preventing jamming.

[0021] 3) Decoupling of loading / unloading from load-bearing functions improves system reliability. This invention achieves complete decoupling between wafer loading / unloading and the process support function by vertically raising and lowering the wafer mounting post assembly along a guide rail assembly under the drive of a lead screw stepper motor, combined with the multi-zone adsorption function of a vacuum chuck. The wafer mounting post assembly can descend below the rotating part, ensuring no interference during high-speed rotation. This allows for independent optimization and control of the loading / unloading and the rotational support actions, avoiding the timing constraints caused by functional coupling in traditional solutions, and significantly improving the flexibility and overall reliability of the system's timing.

[0022] 4) Group control of connecting columns allows for flexible selection of support points. This invention achieves independent vacuum adsorption switching between the two sets of bonding posts by arranging them in inner and outer rings, with each ring connected to a vacuum system via an independent gas pipe assembly. The first bonding post group in the inner ring is slightly lower than the second bonding post group in the outer ring. By selecting different gas paths for vacuuming, the switching between the two sets of bonding posts can be achieved, adapting to the support point requirements of wafers of different sizes. This design has a simple structure and clear control logic, further enhancing the device's flexibility in adapting to wafers of different sizes.

[0023] 5) Excellent wafer protection, effectively reducing wafer breakage rate. In this invention, each die-attachment post is topped with a PEEK die-attachment head. This material has excellent wear resistance, chemical corrosion resistance, and low particle generation characteristics. When in contact with the back of the wafer, it effectively prevents mechanical scratches and particulate contamination, while ensuring the consistency of the wafer's horizontal orientation. Combined with the uniform zoned adsorption force control of the vacuum chuck, the risk of wafer breakage during the process is significantly reduced, which is beneficial to improving the processing yield.

[0024] 6) Reliable air circuit sealing and conductivity under continuous rotation conditions This invention employs a rotary manifold block and a gas tube sleeve to form a gas path slip ring assembly. The fixed and rotating parts can rotate relative to each other with low rotational resistance. The gas holes in the fixed and rotating parts correspond one-to-one. The gas tube sleeve has longitudinal holes and is a hollow structure, allowing the gas tube to pass through the longitudinal holes and exit along the hollow of the gas tube sleeve. This structure enables stable supply of multiple gas paths and reliable evacuation of the vacuum circuit under continuous rotation conditions, effectively avoiding gas tube entanglement caused by rotation and ensuring the continuity and sealing of the gas path in the rotating mechanism.

[0025] 7) High-precision rotary positioning, adaptable to diverse process requirements The rotating part of this invention adopts a torque motor direct drive scheme, combined with an absolute linear encoder and a reading head for position feedback, to achieve high-precision positioning and micro-angle adjustment in the circumferential direction. Compared with traditional transmission methods, the direct drive scheme eliminates backlash and error accumulation in intermediate transmission links, enabling more precise speed control and angle positioning, and can flexibly adapt to the different requirements of different wafer sizes and different processing steps for rotational speed and stopping accuracy.

[0026] 8) Supports high-speed rotational inspection, improving inspection efficiency. In this invention, the bonding post assembly can be recessed below the rotating part without affecting its high-speed rotation. This allows the device to directly perform high-speed rotational scanning inspection after wafer mounting, in conjunction with inspection equipment. Compared to existing technologies that require transferring the wafer to dedicated inspection equipment, this invention reduces the wafer transfer step, effectively improving the efficiency and accuracy of wafer defect detection.

[0027] 9) High degree of automation, reducing reliance on manual labor and operating costs. This invention utilizes a lead screw stepper motor to drive the lifting and lowering of the wafer assembly, in conjunction with a robotic arm, to automate the loading and unloading of wafers of different sizes. The entire loading and unloading process requires no manual intervention, significantly improving processing and inspection efficiency and adapting to the needs of large-scale mass production and mixed-line production. Furthermore, the device features a rational structural design with highly modular components, facilitating installation, debugging, and maintenance, thus reducing equipment usage and maintenance costs. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0029] Figure 1 The attached figure is a schematic diagram of the overall structure of a multi-specification wafer carrier device provided by the present invention; Figure 2The attached figure is a front view of a multi-specification wafer carrier device provided by the present invention; Figure 3 The attached figure is a schematic diagram of the overall structure of the support portion provided by the present invention; Figure 4 The attached figure is a schematic diagram of the support portion provided by the present invention after the base is removed; Figure 5 The attached figure is a top view of the support portion provided by the present invention; Figure 6 The attached figure is a perspective view of the splice post assembly provided by the present invention; Figure 7 The attached figure is a front view of the splice post assembly provided by the present invention; Figure 8 The attached figure is a bottom view of the splice post assembly provided by the present invention; Figure 9 The attached figure is a three-dimensional structural schematic diagram of the floating joint assembly provided by the present invention; Figure 10 The attached figure is a top view of the floating joint assembly provided by the present invention; Figure 11 The attached figure is a three-dimensional structural schematic diagram of the air slip ring assembly provided by the present invention; Figure 12 The attached figure is a three-dimensional structural schematic diagram of the rotating part provided by the present invention; Figure 13 The attached figure is a cross-sectional view of the rotating part provided by the present invention; Figure 14 The attached figure is a bottom view of the rotating part provided by the present invention; Figure 15 The attached figure is a top perspective view of the vacuum suction cup provided by the present invention; Figure 16 The attached image is... Figure 15 A magnified structural diagram of part A in the middle; Figure 17 The attached figure is a bottom view of the vacuum suction cup provided by the present invention. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] like Figure 1-17As shown, this invention discloses a multi-specification wafer carrier device, including a support part 1, a rotating part 2, a vacuum chuck 3, and a vacuum system. The support part 1, rotating part 2, and vacuum chuck 3 are connected together from bottom to top, and in this embodiment, they are fixed by screws. The vacuum system is installed inside the support part 1. The vacuum chuck 3 has multiple air passages 31 and multiple vacuum suction slots 32 that are respectively connected to the multiple air passages 31. The multiple vacuum suction slots 32 are distributed at intervals from the inside to the outside. The vacuum system is connected to the multiple air passages 31. This invention uses the vacuum chuck 3 to set multiple air passages 31 that are distributed at intervals from the inside to the outside and correspondingly connected vacuum suction slots 32, and works with the vacuum system inside the support part 1 to achieve independent control of multiple zones. It can quickly switch to adapt to different specifications of wafers without replacing any parts, which significantly simplifies the specification switching process and effectively solves the technical pain point of the existing device's cumbersome single specification adaptation or switching, greatly improving the efficiency of multi-specification mixed production.

[0032] Specifically, the support part 1 includes a base 11, a lead screw stepper motor 12, two guide rail assemblies 13, a connecting post assembly 14, and a floating joint assembly 15. The base 11 is hollow inside. In this embodiment, the outer contour of the base 11 is projected as a hexagon and has three protruding ears. It is also machined with countersunk through holes and threaded through holes for fixing and leveling the overall structure. The rotating part 2 is installed on the top of the base 11. The lead screw stepper motor 12 is installed on the inner bottom surface of the base 11 through a motor mounting bracket. Both guide rail assemblies 13 are vertically installed on the inner bottom surface of the base 11. The connecting post assembly 14 is located inside the base 11 and is horizontally installed on the two guide rail assemblies. On component 13; the air path slip ring assembly 4 of the vacuum system is vertically installed on the inner bottom surface of the base 11 and passes through the center of the wafer post assembly 14; the extension ends of multiple air pipes 5 installed on the air path slip ring assembly 4 are respectively connected to multiple air path channels 31; the floating joint assembly 15 is fixedly connected to the wafer post assembly 14 and threadedly connected to the extension end of the lead screw shaft of the lead screw stepper motor 12. The wafer post assembly 14 can move vertically up and down along the linear guide rail 13 under the drive of the lead screw stepper motor 12 to complete the lifting and lowering of the wafer, and can be lowered below the rotating part 2 to ensure that the rotating part 2 rotates at high speed without causing interference.

[0033] Specifically, the support part 1 also includes two photoelectric switches 16 and a limit lever 17. The two photoelectric switches 16 are respectively mounted on the side of the base 11 through the switch mounting plate and are distributed vertically at intervals. The limit lever 17 is mounted on the receiving post assembly 14 and is distributed between the two photoelectric switches 16. The limit lever 17 moves up and down with the receiving post assembly 14. The limit lever 17 cooperates with the two photoelectric switches 16 to realize the triggering action of the up and down position signals.

[0034] Understandably, a baffle is installed on the open side wall of the base 11 to conceal the decoration. A cable holder is also installed on the inner bottom surface of the base 11 to secure cables and air pipes.

[0035] Specifically, the guide rail assembly 13 includes a guide rail mounting bracket, a linear guide rail, and a slider. The guide rail mounting bracket is vertically installed on the inner bottom surface of the base 11, so that the two guide rail mounting brackets and the lead screw stepper motor 12 are arranged in a triangle. The linear guide rail is installed inside the guide rail mounting bracket. The slider is fitted onto the linear guide rail. The connector post assembly 14 is fixedly connected to the slider via an adapter block. The adapter block is L-shaped, with one side connected to the slider by a screw and the other side connected and fixed to the connector post assembly 14 by a screw. The floating joint assembly 15 includes a joint fixing seat 151, a joint inner ring 152, two first pin shafts 153, a joint mandrel 154, and two second pin shafts 155. The joint fixing seat 151 is installed on the connector post assembly 14. The joint inner ring 152 is located on the joint fixing seat 153. Inside the U-shaped groove of 51; the threaded sections of the two first pin shafts 153 are symmetrically screwed into both sides of the connector fixing seat 151, and the optical shaft sections of the two first pin shafts 153 are centeredly inserted into both sides of the inner ring 152 of the connector; the connector mandrel 154 is located inside the inner ring 152 of the connector; the threaded sections of the two second pin shafts 155 are symmetrically screwed into the other two sides of the inner ring 152 of the connector, and the optical shaft sections of the two second pin shafts 155 are centeredly inserted into both sides of the connector mandrel 154, so that the two first pin shafts 153 and the two second pin shafts 155 are arranged in a cross shape, which can provide a small amount of flexibility in rigid transmission to compensate for the installation error of the motor, eliminate off-center load, and protect the motor; the lead screw shaft extension end of the lead screw stepper motor 12 is threadedly connected to the center hole of the connector mandrel 154.

[0036] Specifically, the connector assembly 14 includes a connector ring 141, a first connector group, a second connector group, and two air tube assemblies 142. The connector ring 141 is fixedly connected to the connector fixing seat 151. The connector ring 141 is fixedly connected to the slider via an adapter block. The air path slip ring assembly 4 vertically penetrates the center of the connector ring 141. The first connector group includes multiple first connectors 143, and the second connector group includes multiple second connectors 144. The multiple first connectors 143 are vertically fixed on the top surface of the connector ring 141 and arranged in a triangular pattern. The multiple first connectors 143 penetrate the rotating part 2 and the vacuum suction cup 3. The multiple second connectors 144 are vertically fixed on the top surface of the connector ring 141 and arranged in a triangular pattern. The plate posts 144 are located outside the multiple first plate posts 143, and the height of the first plate posts 143 is slightly lower than the height of the second plate posts 144. The multiple second plate posts 144 are located outside the base 11 and pass through the vacuum suction cup 3. Two air tube assemblies 142 are arranged spirally around the center of the plate ring 141. The air tube assembly 142 is composed of an air tube connector, a Y-shaped connector and an air tube, which can meet the requirements of the plate posts moving up and down without pulling the air tube. One end of each of the two air tube assemblies 142 is connected to the vacuum pumping equipment of the vacuum system, and the other end of each of the two air tube assemblies 142 is connected to the first plate post group and the second plate post group respectively. By selecting different air tube assemblies 142 for vacuuming, the switching of the two sets of plate posts can be realized.

[0037] Specifically, each first die post 143 and each second die post 144 is equipped with a die head 145 made of PEEK material. This material has good wear resistance, chemical corrosion resistance and low particle generation characteristics. When in contact with the back of the wafer, it can effectively prevent mechanical scratches and particulate contamination, while ensuring the consistency of the wafer's horizontal orientation. This significantly reduces the risk of wafer breakage during the process and helps to improve the yield of the finished product.

[0038] Specifically, the air circuit slip ring assembly 4 includes a rotary manifold block 41 and an air tube sleeve 42. The fixed part of the rotary manifold block 41 is installed on the inner bottom surface of the base 11. The fixed part of the rotary manifold block 41 is connected to the vacuum pumping equipment of the vacuum system. The air tube sleeve 42 is fitted and fixed on the rotating part of the rotary manifold block 41. The rotating part rotates due to the drive of the air tube 5. The outer periphery of the air tube sleeve 42 has multiple longitudinal holes 421 that communicate with its hollow interior, so that multiple air tubes 5 pass through the multiple longitudinal holes 421 and extend to the outside of the air tube sleeve 42, realizing the conduction of the rotary air circuit without the problem of air tube 5 getting tangled due to rotation.

[0039] Specifically, the rotating part 2 includes a housing 21, a torque motor 22, a spindle 23, a collar 24, a partition plate 25, and a top cover 26. The torque motor 22 is installed in the inner cavity of the housing 21. The spindle 23 is located inside the inner cavity and is connected to the moving part of the torque motor 22. The spindle 23 has a through hole 231 through which the first connecting post 143 passes. The bottom wall of the outer ring of the collar 24 is fastened to the step of the inner cavity, and the top wall of the outer ring of the collar 24 is pressed by the first collar retaining ring 27. The inner wall of the inner ring of the collar 24 is fitted onto the spindle 23, and the top wall of the inner ring of the collar 24 is close to the step of the spindle 23. The bottom wall of the inner ring of the collar 24 is pressed by the second collar retaining ring 28. The partition plate 25 is installed inside the spindle 23. The top cover 26 is installed at the top of the housing 21 and is located on the periphery of the spindle 23.

[0040] Specifically, the rotating part 2 also includes an absolute grating ruler 29 and a reading head 210. The absolute grating ruler 29 is mounted on the spindle 23. The reading head 210 is mounted on the housing 21 via a reading head mounting plate and corresponds to the position of the absolute grating ruler 29, thereby realizing high-precision absolute position detection in the circumferential direction of the rotating part 2.

[0041] Specifically, the vacuum suction cup 3 has a first through hole 33 through which the first contact post 143 passes and a second through hole 34 through which the second contact post 144 passes; each air passage 31 is connected to the corresponding vacuum suction groove 32 through a connecting hole 35; the bottom of the vacuum suction cup 3 has a recess 36 for placing the air supply pipe 5.

[0042] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to in the method section.

[0043] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A multi-specification wafer carrier device, characterized in that, The device includes a support part, a rotating part, a vacuum suction cup, and a vacuum system. The support part, the rotating part, and the vacuum suction cup are connected together from bottom to top. The vacuum system is installed inside the support part. The vacuum suction cup has multiple air passages and multiple vacuum suction slots that are respectively connected to the multiple air passages. The multiple vacuum suction slots are distributed at intervals from the inside to the outside. The vacuum system is connected to and communicates with the multiple air passages respectively.

2. The multi-specification wafer carrier device according to claim 1, characterized in that, The support unit includes a base, a lead screw stepper motor, two guide rail assemblies, a connecting post assembly, and a floating joint assembly. The base is hollow inside. The rotating part is mounted on the top of the base. The lead screw stepper motor is mounted on the bottom surface inside the base via a motor mounting bracket. Both guide rail assemblies are vertically mounted on the bottom surface inside the base. The connecting post assembly is located inside the base and horizontally mounted on the two guide rail assemblies. The air passage slip ring assembly of the vacuum system is vertically mounted on the bottom surface inside the base and passes through the center of the connecting post assembly. The extension ends of multiple air pipes mounted on the air passage slip ring assembly are respectively connected to multiple air passages. The floating joint assembly is fixedly connected to the connecting post assembly and threadedly connected to the extension end of the lead screw shaft of the lead screw stepper motor.

3. The multi-specification wafer carrier device according to claim 2, characterized in that, The support also includes two photoelectric switches and a limiting lever. The two photoelectric switches are respectively mounted on the side of the base via a switch mounting plate and are distributed vertically at intervals. The limiting lever is mounted on the receiving post assembly and is distributed correspondingly between the two photoelectric switches.

4. A multi-specification wafer carrier device according to claim 2 or 3, characterized in that, The guide rail assembly includes a guide rail mounting bracket, a linear guide rail, and a slider. The guide rail mounting bracket is vertically installed on the inner bottom surface of the base, such that the two guide rail mounting brackets and the lead screw stepper motor are arranged in a triangle. The linear guide rail is installed inside the guide rail mounting bracket. The slider is fitted onto the linear guide rail. The connector post assembly is fixedly connected to the slider via an adapter block. The floating joint assembly includes a joint fixing seat, a joint inner ring, two first pin shafts, a joint mandrel, and two second pin shafts. The joint fixing seat is installed on the connector post assembly. The joint inner ring is located on the joint... The two first pin shafts are symmetrically screwed into the two sides of the connector fixing seat within the U-shaped groove of the fixing seat, and the optical shaft sections of the two first pin shafts are centered and inserted into the two sides of the inner ring of the connector; the connector mandrel is located inside the inner ring of the connector; the two second pin shafts are symmetrically screwed into the other two sides of the inner ring of the connector, and the optical shaft sections of the two second pin shafts are centered and inserted into the two sides of the connector mandrel, so that the two first pin shafts and the two second pin shafts are arranged in a cross shape; the lead screw shaft extension end of the lead screw stepper motor is threadedly connected to the center hole of the connector mandrel.

5. A multi-specification wafer carrier device according to claim 4, characterized in that, The receiving pin assembly includes a receiving ring, a first receiving pin group, a second receiving pin group, and two air tube assemblies. The receiving ring is fixedly connected to the connector fixing seat. The receiving ring is fixedly connected to the slider through the adapter block. The air path slip ring assembly vertically penetrates the center of the receiving ring. The first receiving pin group includes multiple first receiving pins, and the second receiving pin group includes multiple second receiving pins. The multiple first receiving pins are vertically fixed to the top surface of the receiving ring and arranged in a triangular pattern. The multiple first receiving pins penetrate the rotating part and the vacuum suction cup. The multiple second receiving pins are vertically fixed to the top surface of the receiving ring and arranged in a triangular pattern, and the multiple second receiving pins are located outside the multiple first receiving pins. The multiple second receiving pins are located outside the base and penetrate the vacuum suction cup. The two air tube assemblies are arranged spirally around the center of the receiving ring. One end of each air tube assembly is connected to the vacuum pumping device of the vacuum system, and the other end of each air tube assembly is connected to the first receiving pin group and the second receiving pin group, respectively.

6. A multi-specification wafer carrier device according to claim 5, characterized in that, Each of the first and second splice posts is fitted with a splice head made of PEEK material.

7. A multi-specification wafer carrier device according to claim 5, characterized in that, The gas path slip ring assembly includes a rotary manifold block and a gas tube sleeve. The fixing part of the rotary manifold block is installed on the inner bottom surface of the base. The fixing part of the rotary manifold block is connected and communicates with the vacuum pumping equipment of the vacuum system. The gas tube sleeve is fitted and fixed on the rotating part of the rotary manifold block. The outer periphery of the gas tube sleeve has multiple longitudinal holes communicating with its interior, so that multiple gas tubes pass through the multiple longitudinal holes and extend to the outside of the gas tube sleeve.

8. A multi-specification wafer carrier device according to claim 7, characterized in that, The rotating part includes a housing, a torque motor, a spindle, a collar, a partition plate, and a top cover. The torque motor is installed in the inner cavity of the housing. The spindle is located inside the inner cavity and connected to the moving part of the torque motor. The spindle has a through hole through which the first connecting post passes. The bottom wall of the outer ring of the collar is fastened to the step of the inner cavity, and the top wall of the outer ring of the collar is pressed by a first collar retaining ring. The inner wall of the inner ring of the collar is fitted onto the spindle, and the top wall of the inner ring of the collar is close to the step of the spindle. The bottom wall of the inner ring of the collar is pressed by a second collar retaining ring. The partition plate is installed inside the spindle. The top cover is installed at the top of the housing and located around the spindle.

9. A multi-specification wafer carrier device according to claim 8, characterized in that, The rotating part also includes an absolute grating ruler and a reading head. The absolute grating ruler is fitted on the spindle. The reading head is mounted on the housing via a reading head mounting plate and corresponds to the position of the absolute grating ruler.

10. A multi-specification wafer carrier device according to claim 8 or 9, characterized in that, The vacuum suction cup has a first through hole for the first contact post to pass through and a second through hole for the second contact post to pass through; each air passage is connected to the corresponding vacuum suction groove through a connecting hole; the bottom of the vacuum suction cup has a recess for placing the air tube.

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