A water-cooled semiconductor package structure

Abstract

This invention discloses a water-cooled semiconductor packaging structure, including a mounting base and a chip body disposed on the mounting base. The top of the mounting base has a mounting recess that mates with the chip body. Top limiting components are provided on both the left and right sides of the inner cavity of the mounting recess. This invention relates to the field of semiconductor packaging technology. This water-cooled semiconductor packaging structure, through the mounting base, mounting recess, top limiting components, and front and rear limiting components, can stably fix the chip body in the mounting recess while adapting to the mounting of chips of various sizes. It has strong applicability and effectively ensures a long service life of the chip body after installation. The inlet and outlet flanges provide water guiding conditions for the mounting base, thereby facilitating water cooling of the chip body and further improving the heat dissipation speed of the chip body.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, specifically to a water-cooled semiconductor packaging structure. Background Technology

[0002] Traditional water-cooled semiconductor packaging structures are typically fixed to the circuit board by electric soldering and rely solely on airflow for heat dissipation, resulting in poor heat dissipation performance during use.

[0003] As described in application number 202210493049.X, a semiconductor packaging structure uses a copper plate to guide the heat of the semiconductor chip into the interior of a heat-conducting rod, allowing the heat-conducting rod to dissipate heat. A cooling fan is used to improve the heat dissipation efficiency of the heat-conducting rod, thereby achieving a highly efficient heat dissipation function for the device. This facilitates the removal of heat from the semiconductor chip inside the device, prevents the device from affecting heat dissipation, and improves the functionality of the device.

[0004] Based on the search of the above information, it can be seen that it mainly uses air conduction for heat dissipation, which has low heat dissipation efficiency. Furthermore, relying solely on compression to fix the semiconductor chip can easily lead to the semiconductor chip becoming loose or damaged by compression, affecting its normal service life. Summary of the Invention

[0005] (a) Technical problems to be solved

[0006] To address the shortcomings of existing technologies, this invention provides a water-cooled semiconductor packaging structure that solves the problems of low heat dissipation efficiency and easy loosening or damage to semiconductor chips, which affect their normal service life.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, the present invention provides the following technical solution: a water-cooled semiconductor packaging structure, comprising a mounting base and a chip body disposed on the mounting base, wherein the top of the mounting base is provided with a mounting recess, and the mounting recess is used in conjunction with the chip body, and top limiting components are provided on both the left and right sides of the inner cavity of the mounting recess, and front and rear limiting components are provided between the two top limiting components and the chip body, wherein the front and rear limiting components are used to limit the position of the chip body in the front-rear direction, and the top limiting components are used to limit the position of the front and rear limiting components in the numerical direction; The mounting base is connected to an inlet flange and an outlet flange on its left and right sides, respectively.

[0009] The present invention is further configured such that: the mounting base includes a heat-conducting shell and a mounting base plate, the mounting base plate is fixedly connected to the bottom of the heat-conducting shell, and the left and right sides of the mounting base plate are both fixedly connected to a perforated assembly plate; The inlet flange and outlet flange are respectively connected to the left and right sides of the heat-conducting shell; The mounting notch is located at the top of the heat-conducting housing.

[0010] The present invention is further configured such that: the top limiting assembly includes a piston plate, a limiting plate is fixedly connected to the top of the piston plate, a plurality of guide rods are provided through the surface of the limiting plate, a sealing plate is fixedly connected to one end of the plurality of guide rods, a trapezoidal locking block is fixedly connected to one side of the sealing plate, and a first spring is sleeved on the outer periphery of the guide rods, and the two ends of the first spring are respectively in contact with the opposite sides of the sealing plate and the limiting plate; The mounting recess has slots on both the left and right sides that are adapted to the trapezoidal block.

[0011] The invention is further configured such that: the piston plate is slidably installed inside the heat-conducting housing, and an annular groove is formed on the outer periphery of the piston plate, and a sealing gasket is provided inside the annular groove.

[0012] The present invention is further configured such that: a plurality of support rods are fixedly connected to the left and right sides of the top of the mounting base plate, a grid plate is fixedly connected to the top of the plurality of support rods, a pad frame is fixedly connected to the top of the grid plate, a sealing gasket is provided on the top of the pad frame, the grid plate, the pad frame and the sealing gasket are all slidably installed inside the heat-conducting shell, and the top of the sealing gasket is in contact with the bottom of the piston plate.

[0013] The present invention is further configured such that: a plurality of push rods are fixedly connected to the top of the piston plate, and the top of the push rods is in contact with the top of the inner cavity of the heat-conducting housing.

[0014] The present invention is further configured such that: the front and rear limiting components include a docking plate, the top of the docking plate is fixedly connected to an installation frame, the top of the installation frame is provided with a plurality of pins, and the bottom of the trapezoidal block is provided with a pin hole for cooperating with the pins, and a second spring is fixedly connected between the bottom end of the pin and the top of the docking plate. Several square grooves are provided on the front and rear sides of the top of the docking plate. A square frame is slidably installed inside the square groove. A third spring is fixedly connected between the top of the inner cavity of the square frame and the top of the docking plate.

[0015] The present invention is further configured such that: the bottom of a portion of the square is in contact with the top of the chip body, and the remaining portion of the square is located on the front and rear sides of the chip body respectively.

[0016] (III) Beneficial Effects

[0017] This invention provides a water-cooled semiconductor packaging structure. It has the following advantages: (1) By setting up the mounting base, mounting recess, top limiting component and front and rear limiting component, the present invention can stably limit and fix the chip body in the mounting recess, while adapting to the installation and fixing of chip bodies of various sizes. It has strong applicability and effectively ensures the long service life of the chip body after installation. By setting up the water inlet flange and water outlet flange, water guiding conditions are provided for the mounting base, thereby providing convenient conditions for water cooling of the chip body and further improving the heat dissipation speed of the chip body.

[0018] (2) The present invention can realize convenient disassembly and assembly between the top limiting component and the mounting base by setting up the piston plate, limiting plate, guide rod, sealing plate, trapezoidal block and slot. With the setting of annular groove and sealing gasket, the water-proof effect of piston plate is guaranteed. With the setting of top rod, support rod, grid plate, gasket frame and sealing gasket, the stability of piston plate installation position is guaranteed, while further enhancing the water-proof effect of piston plate and ensuring long-term stable use of device.

[0019] (3) The present invention enables the trapezoidal block to limit the left and right sides of the docking plate by setting the docking plate, mounting frame, pin, second spring and pin hole. With the setting of several square slots, square frames and third spring, the top of the chip body can be squeezed by squeezing the square frame. The square frame that does not contact the chip body is located on the front and rear sides of the chip body, which can limit the front and rear of the chip body and provide convenient conditions for limiting and fixing chip bodies of different sizes. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the external structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the present invention; Figure 3 This is a top view of the present invention; Figure 4 This is a schematic diagram showing the connection of the mounting base plate, support rod, grid plate, gasket frame, and sealing gasket structure of the present invention; Figure 5 This is a schematic diagram of the top limiting component of the present invention; Figure 6 This is a schematic diagram of the front and rear limiting components of the present invention; In the diagram, 1. Mounting base; 2. Chip body; 3. Mounting notch; 4. Top limiting component; 5. Front and rear limiting components; 6. Inlet flange; 7. Outlet flange; 8. Heat-conducting shell; 9. Mounting base plate; 10. Perforated assembly plate; 11. Piston plate; 12. Limiting plate; 13. Guide rod; 14. Sealing plate; 15. Trapezoidal block; 16. First spring; 17. Slot; 18. Annular groove; 19. Sealing gasket; 20. Support rod; 21. Mesh plate; 22. Gasket frame; 23. Sealing gasket; 24. Top rod; 25. Connecting plate; 26. Mounting frame; 27. Pin; 28. Pin hole; 29. ​​Square groove; 30. Square frame; 31. Second spring; 32. Third spring. Detailed Implementation

[0021] The technical solutions of the present invention will now be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention.

[0022] Please see Figure 1-6 The present invention provides the following technical solution: a water-cooled semiconductor packaging structure, including a mounting base 1, a chip body 2, a top limiting component 4 and a front and rear limiting component 5, wherein the mounting base 1 includes a heat-conducting shell 8 and a mounting base plate 9, the mounting base plate 9 is fixedly connected to the bottom of the heat-conducting shell 8, and the left and right sides of the mounting base plate 9 are both fixedly connected to a perforated assembly plate 10.

[0023] As a preferred option, in order to facilitate the installation and positioning of the chip body 2, the top of the heat-conducting housing 8 is provided with an installation recess 3, and the installation recess 3 is used in conjunction with the chip body 2.

[0024] As a preferred embodiment, in order to facilitate the top positioning of the chip body 2, the top positioning component 4 includes a piston plate 11. The piston plate 11 is slidably installed inside the heat-conducting housing 8. A positioning plate 12 is fixedly connected to the top of the piston plate 11. Several guide rods 13 are provided through the surface of the positioning plate 12. One end of the several guide rods 13 is fixedly connected to a sealing plate 14. A trapezoidal locking block 15 is fixedly connected to one side of the sealing plate 14. The left and right sides of the inner cavity of the mounting recess 3 are provided with slots 17 that are adapted to the trapezoidal locking block 15. A first spring 16 is sleeved on the outer periphery of the guide rods 13. The two ends of the first spring 16 are in contact with the opposite sides of the sealing plate 14 and the positioning plate 12, respectively.

[0025] As a preferred embodiment, in order to achieve top and front / back positioning of the chip body 2 and ensure the stability of the chip body 2's position, the front / back positioning assembly 5 includes a docking plate 25. A mounting frame 26 is fixedly connected to the top of the docking plate 25. Several pins 27 are provided through the top of the mounting frame 26. The bottom of the trapezoidal block 15 is provided with pin holes 28 that cooperate with the pins 27. A second spring 31 is fixedly connected between the bottom end of the pin 27 and the top of the docking plate 25. Several square grooves 29 are provided on both the front and back sides of the top of the docking plate 25. A square frame 30 is slidably installed inside the square groove 29. A third spring 32 is fixedly connected between the top of the inner cavity of the square frame 30 and the top of the docking plate 25. Specifically, the bottom of part of the square frame 30 is in contact with the top of the chip body 2, and the remaining square frames 30 are located on the front and back sides of the chip body 2.

[0026] As a preferred option, in order to improve the heat dissipation speed of the chip body 2, the left and right sides of the heat-conducting housing 8 are respectively connected to the water inlet flange 6 and the water outlet flange 7.

[0027] To further explain, in order to prevent water leakage from the piston plate 11, an annular groove 18 is provided on the outer periphery of the piston plate 11, and a sealing gasket 19 is provided inside the annular groove 18.

[0028] As a preferred embodiment, in order to further ensure the stability of the piston plate 11 structure, several push rods 24 are fixedly connected to the top of the piston plate 11, and the top of the push rods 24 is in contact with the top of the inner cavity of the heat-conducting housing 8. Several support rods 20 are fixedly connected to the left and right sides of the top of the mounting base plate 9. The top of the several support rods 20 are jointly fixedly connected to a grid plate 21. A gasket 22 is fixedly connected to the top of the grid plate 21. A sealing gasket 23 is provided on the top of the gasket 22. The grid plate 21, the gasket 22 and the sealing gasket 23 are all slidably installed inside the heat-conducting housing 8, and the top of the sealing gasket 23 is in contact with the bottom of the piston plate 11.

[0029] During assembly, the trapezoidal locking block 15 is pushed, which causes the sealing plate 14 to press against the first spring 16, inserting the piston plate 11 into the interior of the heat-conducting housing 8. This causes the vertical inner wall of the heat-conducting housing 8 to press and limit the trapezoidal locking block 15. After the trapezoidal locking block 15 moves into the slot 17, the first spring 16 pushes the sealing plate 14 to make the trapezoidal locking block 15 pass through the slot 17. At this time, the top rod 24 contacts the top of the inner cavity of the heat-conducting housing 8, fixing the mounting base plate 9 to the bottom of the heat-conducting housing 8. During the process, the support rod 20 pushes the mesh plate 21 to make the pad frame 22 press against the sealing washer 23, so that the sealing washer 23 fits tightly against the bottom of the piston plate 11. Finally, bolts are used to pass through the perforated mounting plate 10 to fix the mounting base 1. In use, place the chip body 2 in the mounting recess 3, then place the docking plate 25 above the chip body 2, press the pin 27, the pin 27 presses the second spring 31, and then continue to press the mounting frame 26 downward. After the mounting frame 26 is lowered below the trapezoidal block 15, stop pressing the pin 27, the second spring 31 resets, and pushes the pin 27 into the pin hole 28. During the downward pressing of the mounting frame 26, some of the square frames 30 move upward due to the limiting pressing of the chip body 2. During this process, the square frames 30 stretch the second spring 31. The remaining square frames 30 are located on the front and rear sides of the chip body 2, thus completing the assembly and fixation of the chip body 2. Connect the inlet flange 6 to the external cold water pipe and the outlet flange 7 to the external drainage pipe. When the chip body 2 is working, after the heat is transferred to the heat-conducting shell 8, the external cold water directly exchanges heat with the heat-conducting shell 8, which accelerates the heat dissipation speed of the chip body 2.

Claims

1. A water-cooled semiconductor packaging structure, comprising a mounting base (1) and a chip body (2) disposed on the mounting base (1), characterized in that: The mounting base (1) has a mounting recess (3) at the top, and the mounting recess (3) is used in conjunction with the chip body (2). Top limiting components (4) are provided on both the left and right sides of the inner cavity of the mounting recess (3). Front and rear limiting components (5) are provided between the two top limiting components (4) and the chip body (2). The front and rear limiting components (5) are used to limit the position of the chip body (2) in the front and rear direction, and the top limiting components (4) are used to limit the position of the front and rear limiting components (5) in the numerical direction. The mounting base (1) is connected to an inlet flange (6) and an outlet flange (7) on its left and right sides, respectively.

2. The water-cooled semiconductor packaging structure according to claim 1, characterized in that: The mounting base (1) includes a heat-conducting shell (8) and a mounting base plate (9). The mounting base plate (9) is fixed to the bottom of the heat-conducting shell (8), and perforated mounting plates (10) are fixed to both the left and right sides of the mounting base plate (9). The inlet flange (6) and outlet flange (7) are respectively connected to the left and right sides of the heat-conducting shell (8); The mounting notch (3) is located on the top of the heat-conducting housing (8).

3. The water-cooled semiconductor packaging structure according to claim 2, characterized in that: The top limiting assembly (4) includes a piston plate (11), and a limiting plate (12) is fixedly connected to the top of the piston plate (11). A plurality of guide rods (13) are provided through the surface of the limiting plate (12). One end of the plurality of guide rods (13) is fixedly connected to a sealing plate (14). A trapezoidal block (15) is fixedly connected to one side of the sealing plate (14). A first spring (16) is sleeved on the outer periphery of the guide rods (13). The two ends of the first spring (16) are respectively in contact with the opposite side of the sealing plate (14) and the limiting plate (12). The mounting recess (3) has slots (17) on both the left and right sides of the inner cavity that are adapted to the trapezoidal card block (15).

4. The water-cooled semiconductor packaging structure according to claim 3, characterized in that: The piston plate (11) is slidably installed inside the heat-conducting housing (8). An annular groove (18) is provided on the outer periphery of the piston plate (11), and a sealing gasket (19) is provided inside the annular groove (18).

5. A water-cooled semiconductor packaging structure according to claim 3, characterized in that: Several support rods (20) are fixedly connected to the top left and right sides of the mounting base plate (9). The top of several support rods (20) are fixedly connected to a grid plate (21). A pad frame (22) is fixedly connected to the top of the grid plate (21). A sealing gasket (23) is provided on the top of the pad frame (22). The grid plate (21), the pad frame (22) and the sealing gasket (23) are all slidably installed inside the heat-conducting housing (8), and the top of the sealing gasket (23) is in contact with the bottom of the piston plate (11).

6. The water-cooled semiconductor packaging structure according to claim 3, characterized in that: The piston plate (11) is fixedly connected to a number of push rods (24), and the top of the push rods (24) is in contact with the top of the inner cavity of the heat-conducting shell (8).

7. A water-cooled semiconductor packaging structure according to claim 3, characterized in that: The front and rear limiting components (5) include a docking plate (25), the top of which is fixedly connected to a mounting frame (26). A plurality of pins (27) are provided through the top of the mounting frame (26), and the bottom of the trapezoidal block (15) is provided with pin holes (28) that cooperate with the pins (27). A second spring (31) is fixedly connected between the bottom end of the pins (27) and the top of the docking plate (25). Several square grooves (29) are provided on the front and rear sides of the top of the docking plate (25). A square frame (30) is slidably installed inside the square groove (29). A third spring (32) is fixedly connected between the top of the inner cavity of the square frame (30) and the top of the docking plate (25).

8. A water-cooled semiconductor packaging structure according to claim 7, characterized in that: The bottom of part of the frame (30) is in contact with the top of the chip body (2), and the remaining parts of the frame (30) are located on the front and rear sides of the chip body (2).

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