Power conversion device

Abstract

The power conversion device includes a semiconductor module comprising: a plurality of upper arm modules that constitute upper arm circuits of upper and lower arm circuits and are electrically connected in parallel with each other; and a plurality of lower arm modules that constitute lower arm circuits of the upper and lower arm circuits and are electrically connected in parallel with each other. The plurality of upper arm modules and the plurality of lower arm modules are disposed on a substrate. A portion of at least one of the plurality of upper arm modules and the plurality of lower arm modules is disposed in a first column and a second column correspondingly adjacent to the first column. The first column and the second column are formed along a first direction. The plurality of upper arm modules have first terminals, and the plurality of lower arm modules have second terminals. The first terminals and the second terminals extend in a direction orthogonal to the substrate. Positive wiring connecting the plurality of first terminals to each other and negative wiring connecting the plurality of second terminals to each other are arranged and extend parallel to each other along the first direction.

Description

Technical Field

[0001] This invention relates to an electric power conversion device. Background Technology

[0002] Power conversion devices are preferably miniaturized as much as possible when mounted in vehicles. For example, Patent Document 1 discloses a structure in which upper and lower arm modules are arranged relative to the direction in which each busbar extending the UVW phase extends. By implementing such a structure, the projected area of ​​the semiconductor module in the power conversion device is reduced, thereby achieving miniaturization.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: International Publication No. 2023 / 058381 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] In the structure described in Patent Document 1, if the number of parallel upper and lower arm modules increases, the problem of increased inductance arises.

[0008] Methods for solving problems

[0009] A power conversion device includes a semiconductor module comprising: a plurality of upper arm modules that constitute upper arm circuits of upper and lower arm circuits and are electrically connected in parallel with each other; and a plurality of lower arm modules that constitute lower arm circuits of the upper and lower arm circuits and are electrically connected in parallel with each other. The plurality of upper arm modules and the plurality of lower arm modules are disposed on a substrate. A portion of at least one of the upper arm modules and the plurality of lower arm modules is disposed in a first column and a second column correspondingly adjacent to the first column. The first column and the second column are formed along a first direction. The plurality of upper arm modules have first terminals, and the plurality of lower arm modules have second terminals. The first terminals and the second terminals extend in a direction orthogonal to the substrate. Positive wiring connecting the plurality of first terminals to each other and negative wiring connecting the plurality of second terminals to each other are arranged parallel to each other along the first direction.

[0010] Invention Effects

[0011] It can provide a power conversion device that balances reduced inductance and miniaturization. Attached Figure Description

[0012] Figure 1 This is a circuit diagram of a power conversion device.

[0013] Figure 2This is a perspective view showing a semiconductor module on a wiring substrate according to the first embodiment of the present invention.

[0014] Figure 3 This is a cross-sectional view showing the configuration structure of the semiconductor module and cooling component according to the first embodiment of the present invention.

[0015] Figure 4 This is a diagram illustrating the configuration structure of the semiconductor module and cooling components as observed from a third party according to the first embodiment of the present invention.

[0016] Figure 5 This is a diagram illustrating the configuration structure of the semiconductor module and busbar as viewed from a third party according to the first embodiment of the present invention.

[0017] Figure 6 This is a diagram illustrating the configuration structure of the semiconductor module and busbar as viewed from a third party according to the first embodiment of the present invention.

[0018] Figure 7 This is a diagram illustrating the configuration structure of the semiconductor module, cooling components, and busbars as observed from a third party according to the second embodiment of the present invention.

[0019] Figure 8 This is a perspective view showing the configuration of semiconductor modules on a wiring substrate according to the first and second embodiments of the present invention.

[0020] Figure 9 These are configuration examples, first variations, and second variations of the semiconductor module according to the first embodiment of the present invention.

[0021] Figure 10 These are the third to fifth modifications of the first embodiment of the present invention.

[0022] Figure 11 These are configuration examples and sixth variations of the semiconductor module according to the second embodiment of the present invention.

[0023] Figure 12 These are the seventh and eighth modifications of the second embodiment of the present invention.

[0024] Figure 13 This is the ninth variation of the second embodiment of the present invention.

[0025] Figure 14 This is a diagram showing the configuration structure of the semiconductor module as observed from a third party in the comparative example. Detailed Implementation

[0026] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The following description and drawings are for illustrative purposes only, and appropriate omissions and simplifications have been made for clarity. The present invention can also be implemented in various other ways. Unless otherwise specified, each constituent element may be a single element or a plurality of elements.

[0027] To facilitate understanding of the invention, the positions, sizes, shapes, and extents of the constituent elements shown in the accompanying drawings may not represent their actual positions, sizes, shapes, or extents. Therefore, the invention is not necessarily limited to the positions, sizes, shapes, and extents disclosed in the accompanying drawings.

[0028] (First implementation method and overall structure)

[0029] ( Figure 1 )

[0030] The power conversion device 1 is electrically connected to the motor 2 and the battery 3. The power conversion device 1 has a smoothing capacitor 4, a semiconductor module 5, and a drive device 7. The semiconductor module 5 of each phase of UVW has: a plurality of upper arm modules 5a, which constitute the upper arm circuit of the upper and lower arm circuits and are electrically connected in parallel with each other; and a plurality of lower arm modules 5b, which constitute the lower arm circuit of the upper and lower arm circuits and are electrically connected in parallel with each other.

[0031] The following describes the upper arm module 5a and lower arm module 5b of the AC wiring based on the U phase. However, the description of the upper arm module 5a and lower arm module 5b connected to the AC wiring of the V and W phases is omitted because they have the same structure as the U phase.

[0032] Multiple upper arm modules 5a connected in parallel are connected to a positive busbar 61P through a first terminal 9a. Additionally, multiple upper arm modules 5a connected in parallel are connected to an AC busbar 62U through an AC terminal 13.

[0033] Multiple lower arm modules 5b connected in parallel are connected to a negative busbar 61N through a second terminal 9b. Additionally, multiple lower arm modules 5b connected in parallel are connected to an AC busbar 62U through an AC terminal 13.

[0034] The power conversion device 1 converts the DC power input from the battery 3 into AC power through the switching action in the upper arm module 5a and the lower arm module 5b. The power conversion device 1 then outputs the converted AC power to the motor 2.

[0035] Furthermore, for the sake of circuit diagrams, the upper arm module 5a and the lower arm module 5b are shown as two modules connected in parallel. However, as will be shown later, in this embodiment, the upper arm module 5a and the lower arm module 5b are four modules connected in parallel.

[0036] ( Figure 2 )

[0037] On the wiring board 8, a plurality of upper arm modules 5a and a plurality of lower arm modules 5b are disposed. In the structure of the present invention, the plurality of upper arm modules 5a and the plurality of lower arm modules 5b are respectively arranged in four columns along a predetermined column formed in a first direction.

[0038] On the planar direction of the wiring substrate 8, in a second direction orthogonal to the first direction, there are alternating columns of upper arm modules 5a and columns of lower arm modules 5b, each corresponding to one of the U-phase busbars, V-phase busbars, and W-phase busbars formed on the wiring substrate 8, arranged in 6 columns respectively. Although not shown in the figure, between the columns of upper arm modules 5a and the columns of lower arm modules 5b, there are a plurality of first water channels 41, which will be described later.

[0039] Multiple upper arm modules 5a and multiple lower arm modules 5b, each having a cooling surface 6 oriented in the plane direction of the wiring substrate 8 in a direction orthogonal to the first direction, i.e., the second direction.

[0040] Multiple upper arm modules 5a each have a first terminal 9a, and multiple lower arm modules 5b each have a second terminal 9b. The first terminals 9a and the second terminals 9b are connected to the wiring substrate 8 along a third direction, which is orthogonal to the first direction and the second direction and orthogonal to the wiring substrate 8. In addition, the first terminals 9a and the second terminals 9b are arranged in rows along the first direction and are arranged opposite each other in the second direction.

[0041] This allows for a reduction in the volume (projected area) of the semiconductor module in the power conversion device 1. Furthermore, when the output of the power conversion device 1 changes, the layout can be altered without changing the number of water channels while maintaining cooling performance.

[0042] ( Figure 3 )

[0043] Wiring board 8 ( Figure 2 It has a U-phase busbar, a V-phase busbar, a W-phase busbar, a positive busbar 61P, and a negative busbar 61N as AC output busbars. Furthermore, in Figure 3 In this paper, taking the U-phase AC busbar 62U in the AC output busbar as a reference, the configuration structure of the upper arm module 5a and the lower arm module 5b with the cooling components is described. The V-phase busbar and the W-phase busbar are omitted, but the same applies in the structure that includes the V-phase busbar and the W-phase busbar respectively.

[0044] via AC terminal 13 ( Figure 1The upper arm module 5a and lower arm module 5b, which are electrically connected to the AC busbar 62U, are each held on both sides by a first water channel 41, which serves as a cooling component. Thus, the semiconductor module 5, which has semiconductor elements 30, is cooled by refrigerant flowing within the first water channel 41.

[0045] The upper arm module 5a is connected to the positive busbar 61P in the wiring board 8 and has a first terminal 9a as a terminal through which positive current flows. The lower arm module 5b is connected to the negative busbar 61N in the wiring board 8 and has a second terminal 9b as a terminal through which negative current flows.

[0046] ( Figure 4 , Figure 5 )

[0047] The upper arm module 5a has a first terminal 9a and an AC terminal 13. The lower arm module 5b has a second terminal 9b and an AC terminal 13. Multiple first water channels 41, second water channels 42, and third water channels 43 are connected to the upper arm modules 5a and lower arm modules 5b respectively, which are respectively sandwiched in the middle. The first water channels 41 extend along a first direction, while the second water channels 42 and third water channels 43 extend along a second direction.

[0048] like Figure 5 As shown, the multiple upper arm modules 5a and multiple lower arm modules 5b are respectively configured to sandwich AC busbars 62U, 62V, and 62W extending along a first direction, and are positioned opposite each other. The AC busbars 62U, 62V, and 62W are electrically connected to the AC terminals 13 of the multiple upper arm modules 5a and multiple lower arm modules 5b, respectively. Furthermore, in subsequent figures, the AC busbars 62U, 62V, and 62W are indicated by shading.

[0049] In addition, such as Figure 4 As shown, the distance 35 between the connection center 35 of the first terminal 9a of each of the multiple upper arm modules 5a arranged along the first direction to the positive busbar 61P (i.e., the upper arm center of gravity position 35a) and the connection center 35 of the connection center 35 of the second terminal 9b of each of the multiple lower arm modules 5b arranged along the first direction to the negative busbar 61N (i.e., the lower arm center of gravity position 35b) is shorter than before. By shortening the distance 35 between the centers of gravity, the area where the positive busbar 61P and the negative busbar 61N run parallel is increased, which increases the mutual inductance and thus reduces the inductance. In addition, in Figure 4 For ease of explanation, only the upper arm center of gravity position 35a and the lower arm center of gravity position 35b of the AC busbar 62U are shown in the diagram.

[0050] Regarding this point, use Figure 14 The comparative examples (conventional examples) shown are described in detail below. Figure 14In the comparative example, multiple upper arm modules 5a and multiple lower arm modules 5b are arranged in the same column. Furthermore, the positive busbar 61P and the negative busbar 61N partially overlap and run parallel, but they do not run parallel within the length range indicated by the dashed arrow 70. Therefore, in the comparative example, a large mutual inductance cannot be achieved in the section where the positive busbar 61P and the negative busbar 61N do not run parallel, and the inductance between the smoothing capacitor 4 and the semiconductor module 5 cannot be sufficiently reduced. Additionally, the increasing number of parallel semiconductor modules results in a longer dashed arrow 70 section where the positive busbar 61P and the negative busbar 61N do not run parallel.

[0051] If the distance 35 between the center of gravity positions 35a and 35b of the upper arm and lower arm is shortened, the length of the dashed arrow 70 can also be shortened. Therefore, by making Figure 4 The distance 35 between the centers of gravity shown is shorter than before, which can lengthen the parallel section between the positive busbar 61P and the negative busbar 61N, increase the mutual inductance, and help reduce the inductance.

[0052] ( Figure 6 )

[0053] Figure 6 This indicates the positional relationship between the positive busbar 61P and the negative busbar 61N, and between the upper arm module 5a and the lower arm module 5b. On the wiring board 8 ( Figure 2 In the circuit, the positive busbar 61P and the negative busbar 61N overlap in a planar manner. For example... Figure 6 As shown, the parallel extensions of the positive busbar 61P and the negative busbar 61N in the first direction can be larger than those in the prior art, and can increase mutual inductance.

[0054] In the second direction, the distance at which the positive busbar 61P and the negative busbar 61N cannot run parallel is the distance between the first terminal 9a of the upper arm module 5a and the second terminal 9b of the lower arm module 5b, which are opposite each other in the second direction. This distance is equivalent to... Figure 4 The distance between the centers of gravity is 35 as shown. By reducing this distance, the mutual inductance can be increased, and the main circuit inductance can be reduced. In other words, by reducing the area where the positive busbar 61P and the negative busbar 61N do not overlap, the main circuit inductance is reduced.

[0055] This allows for faster switching speeds in semiconductor module 5 and improved power conversion efficiency. Furthermore, even with an increase in the number of semiconductor modules 5 connected in parallel, the distance between their centers of gravity 35 does not increase, thus suppressing an increase in inductance. Additionally, with... Figure 6 Similarly, it can also be a structure in which the positive busbar 61P and the negative busbar 61N are interchanged.

[0056] Furthermore, by setting the structure in this way, for example, when the number of upper arm modules 5a and lower arm modules 5b changes when the output changes, the length can be changed as long as the number of first water channels 41 is not changed, so no further design is needed and the cooling performance can be maintained.

[0057] (Second Implementation)

[0058] ( Figure 7 )

[0059] In the second embodiment, the positions of the plurality of upper arm modules 5a and the plurality of lower arm modules 5b are the same as in the first embodiment, but the orientation of their respective electrode surfaces (cooling surfaces) faces the first direction. The first water channel 41 extends along the second direction, and the second water channel 42 and the third water channel 43, which are connected to the first water channel 41, extend along the first direction.

[0060] With such a structure, for example, when the output changes, the semiconductor elements 30 configured in the upper arm module 5a and the lower arm module 5b change ( Figure 3 The number of water channels 41 can be adjusted, but only the number of channels 41 needs to be changed; their length does not need to be changed. Furthermore, the second water channel 42 and the third water channel 43 extend along the first direction, and similarly have the same orientation as the U-phase, V-phase, and W-phase busbars extending along the first direction. This allows for the connection of the first water channel 41 to the second water channel 42 and the third water channel 43 in a vehicle-mounted layout, in the same direction as the connection direction of the U-phase, V-phase, and W-phase busbars.

[0061] Furthermore, in the multiple upper arm modules 5a and multiple lower arm modules 5b sandwiched between each other in the first waterway 41, the semiconductor elements 30 are arranged as close as possible to each other in a manner that corresponds to the U-phase, V-phase, and W-phase busbars that are electrically connected. As a result, the shapes of the U-phase busbar, V-phase busbar, and W-phase busbar, which serve as output busbars, are simplified.

[0062] ( Figure 8 )

[0063] Figure 8 (a) is Figures 2-6 The perspective view of the first embodiment of the present invention described herein. Figure 8 (b) is Figure 7 A perspective view of the second embodiment of the present invention is shown in the illustration. Furthermore, although in... Figure 8 Not illustrated, but the first to third directions described above are... Figure 2 The same as shown.

[0064] Positive current 21 flows to upper arm module 5a. Negative current 22 flows to lower arm module 5b. Positive current 21 flows through positive wiring that electrically connects multiple first terminals 9a to each other, and negative current 22 flows through negative wiring that electrically connects multiple second terminals 9b to each other, and they extend parallel to each other in a first direction.

[0065] Furthermore, in the second embodiment, the cooling surfaces of the plurality of upper arm modules 5a and the plurality of lower arm modules 5b differ from those in the first embodiment, and are oriented in the first direction. Thus, by changing the orientation without altering the positions of the plurality of upper arm modules 5a and the plurality of lower arm modules 5b, layout requirements can be met, and the effects of the present invention can be achieved.

[0066] (First variation, second variation)

[0067] ( Figure 9 )

[0068] Below, in Figures 9-13 The following section describes a configuration example of the upper arm module 5a and the lower arm module 5b. Additionally, in the following... Figure 9 , Figure 10 The modified examples described herein are structural examples of the first embodiment. Figures 11-13 The modified examples described herein are structural examples of the second embodiment.

[0069] The configuration example of upper arm module 5a and lower arm module 5b will be described as a structure corresponding to any one of the three phase busbars: the U-phase busbar, the V-phase busbar, and the W-phase busbar. Furthermore, Figures 9-13 It is from the aforementioned third party to ( Figure 2 The diagram shows the viewpoint from which the observation is made. The vertical direction in the attached diagram is the first direction, and the horizontal direction is the second direction. Additionally, starting from the left side of the attached diagram, the first and second columns are designated as the upper arm module 5a and the lower arm module 5b, respectively; the third column and subsequent columns are omitted from the diagram.

[0070] The configuration example described later is a structure in which a portion of at least one of the plurality of upper arm modules 5a and the plurality of lower arm modules 5b is arranged in a first column and a second column correspondingly adjacent to the first column. Furthermore, the modules arranged in the first and second columns are formed along a first direction.

[0071] Figure 9 (a) is a configuration example of the first embodiment of the present invention. Figure 9 (b) is a first variation of the present invention. Figure 9 (c) is a second variation of the present invention. Figure 9In the configuration example (a), the source electrode surfaces 5c (shown as the shorter side of a pair of opposite sides in a trapezoidal module) of the cooling surfaces of the modules in the first and second columns do not face each other. In other words, in the plurality of upper arm modules 5a and the plurality of lower arm modules 5b arranged along the first direction, the drain electrode surfaces 5d (shown as the longer side of a pair of opposite sides in a trapezoidal module) of the cooling surfaces of the electrodes with high potential sides are arranged opposite each other. In addition, the upper arm module 5a has a structure in which the AC terminal 13 for AC current flows from the upper side in the first direction and the positive terminal 11 (equivalent to the first terminal 9a) for positive current flows from the upper side in the first direction, and the lower arm module 5b has a structure in which the AC terminal 13 for AC current flows from the upper side in the first direction and the negative terminal 12 (equivalent to the second terminal 9b) for negative current flows from the upper side in the first direction.

[0072] exist Figure 9 In the variation of (b), it is to Figure 9 (a) After the configuration of the first and second columns is swapped, the source surfaces 5c, which serve as the low-potential side, are arranged opposite each other in the multiple upper arm modules 5a and multiple lower arm modules 5b. In addition, the upper arm module 5a has an AC terminal 13 and a positive terminal 11 structure from the upper side in the first direction, and the lower arm module 5b has an AC terminal 13 and a negative terminal 12 structure from the upper side in the first direction.

[0073] exist Figure 9 In a variation of (c), the modules arranged in the first and second columns have their high-potential electrode faces and low-potential electrode faces alternately reversed along a first direction. That is, the upper arm module 5a and lower arm module 5b with the drain surface 5d facing each other (large heat dissipation area) and the upper arm module 5a and lower arm module 5b with the source surface 5c facing each other (small heat dissipation area) are alternately and repeatedly arranged in the first and second columns. This equalizes the overall heat dissipation of the semiconductor module.

[0074] (Third to Fifth Variations)

[0075] ( Figure 10 )

[0076] Figure 10 (a) is a third variation of the present invention. Figure 10 (b) is a fourth variation of the present invention. Figure 10 (c) is the fifth variation of the present invention. Figure 10In (a), in the multiple upper arm modules 5a, the source surface 5c and drain surface 5d of each module are arranged facing the same side. Furthermore, the upper arm modules 5a have an AC terminal 13 and a positive terminal 11 structure from the upper side in the first direction, while the lower arm modules 5b have a negative terminal 12 and an AC terminal 13 structure from the upper side in the first direction. Thus, the modules arranged in the first column and a portion of the second column have their source surfaces 5c, which are electrodes with a low potential side, facing the same direction. This results in the same arrangement of the gate signals (not shown) extending in a third direction (towards the front side of the drawing) in each module. Consequently, the wiring pattern of the drive substrate (not shown) becomes simpler, and the layout becomes easier.

[0077] exist Figure 10 In (b), upper arm modules 5a and lower arm modules 5b are arranged alternately. In each of the multiple upper arm modules 5a and multiple lower arm modules 5b, the drain surfaces 5d are arranged opposite each other. Furthermore, in the first direction, upper arm modules 5a and lower arm modules 5b are arranged adjacently and alternately. This shortens the current loop distance and reduces the inductance.

[0078] exist Figure 10 In (c), the first terminal 9a and the second terminal 9b ( Figure 2 The smoothing capacitor 4 is disposed on the side of the upper arm module 5a and the lower arm module 5b respectively. In the multiple upper arm modules 5a and multiple lower arm modules 5b, the drain surfaces 5d are arranged opposite each other. Furthermore, the upper arm module 5a has a structure with a positive terminal 11 and an AC terminal 13 from the upper side in the first direction, and the lower arm module 5b has a structure with a negative terminal 12 and an AC terminal 13 from the upper side in the first direction. In this structure, a smoothing capacitor 4 (not shown) is disposed adjacent to the upper arm module 5a and the lower arm module 5b in the power conversion device 1. The smoothing capacitor 4, disposed on the upper side of the drawing, has a first terminal 9a as the positive terminal 11 and a second terminal 9b as the negative terminal 12. Therefore, the distance between the smoothing capacitor 4 and the first terminal 9a and the second terminal 9b is shortened, thereby reducing the inductance.

[0079] In summary, by adopting Figure 9 (a) Figure 10 (b) Figure 10 The structure (c) achieves the following effect. Among the multiple first water channels 41, a six-column arrangement of the first water channels 41 at both ends (refer to) is provided in the middle, which combines multiple upper arm modules 5a and multiple lower arm modules 5b. Figure 4 The flow rate of refrigerant flowing inside each module is small, but by arranging each module with the source electrode surface 5c with the small heat dissipation facing outward, it can become a cooling structure that corresponds to the state of low flow rate of the first water passage 41 at both ends, and as a whole, it helps to maintain good heat dissipation efficiency.

[0080] In addition, by adopting Figure 9 (a) ~ Figure 9 (c) Figure 10 (a) Figure 10 (c) configuration structure, in which the upper arm module 5a is configured in the first column and the lower arm module 5b is configured in the second column, or the lower arm module 5b is configured in the first column and the upper arm module 5a is configured in the second column, thereby simplifying the shape of the corresponding positive busbar 61P and negative busbar 61N.

[0081] Furthermore, in the above description, the configuration structure of the first and second columns of modules corresponding to the busbar of one phase of the three-phase busbar has been described. However, in other adjacent columns not shown in the figure, for example, the configuration structure of the first and second columns can also be applied to the third and fourth columns for configuration.

[0082] (Sixth variation)

[0083] ( Figure 11 )

[0084] Figures 11-13 This is a configuration example of the second implementation method. Figure 11 (a) is a configuration example of the second embodiment of the present invention. Figure 11 (b) is a sixth variation of the present invention. In the second embodiment, the cooling surfaces of the plurality of upper arm modules 5a and the plurality of lower arm modules 5b face the first direction.

[0085] exist Figure 11 In (a), in the plurality of upper arm modules 5a and the plurality of lower arm modules 5b, the source surface 5c and drain surface 5d of each module are arranged facing a first direction. The plurality of upper arm modules 5a are arranged in the first direction, and similarly, the plurality of lower arm modules 5b are arranged in the first direction. The source surface 5c and drain surface 5d of each upper arm module 5a and lower arm module 5b are arranged in the same direction.

[0086] exist Figure 11 In (b), the first terminal 9a and the second terminal 9b are adjacent to each other in the second direction. Figure 11 (b) and Figure 11 (a) The upper arm module 5a and the lower arm module 5b are configured in the same position, but the source surface 5c and the drain surface 5d are relative to each other. Figure 11 (a) In the opposite orientation, the drain surface 5d is arranged facing the smooth capacitor 4 (not shown). In the multiple upper arm modules 5a and multiple lower arm modules 5b, the positions of the AC terminals 13 are not adjacent. Therefore, in order to connect the AC busbars 62U extending in the first direction to each other, AC busbars 62U extending in the second direction are provided.

[0087] (Seventh and Eighth Variations)

[0088] ( Figure 12 )

[0089] Figure 12 (a) is the seventh variation of the present invention. Figure 12 (b) is the eighth variation of the present invention. Figure 12 In (a), multiple upper arm modules 5a are arranged in a first direction, and similarly, multiple lower arm modules 5b are arranged in the first direction. The multiple upper arm modules 5a arranged in the first column repeat the structure of their respective source surfaces 5c facing each other. Similarly, the multiple lower arm modules 5b arranged in the second column also repeat the structure of their respective source surfaces 5c facing each other.

[0090] exist Figure 12 In (b), the structure of repeated source electrode surfaces 5c facing each other is similar to... Figure 12 (a) The configuration is the same, but in the first and second columns, the upper arm module 5a and the lower arm module 5b are arranged alternately. This simplifies the structure of the AC busbar 62U connected to the adjacent AC terminals 13 in the first and second columns. Furthermore, Figure 7 The distance between the upper arm center of gravity position 35a and the lower arm center of gravity position 35b shown becomes shorter.

[0091] (Ninth variation)

[0092] ( Figure 13 )

[0093] The source surfaces 5c and drain surfaces 5d of the multiple upper arm modules 5a and multiple lower arm modules 5b are arranged in opposite directions. In other words, in the multiple upper arm modules 5a and multiple lower arm modules 5b adjacent in the second direction, the surfaces of the electrodes with high potential and the surfaces of the electrodes with low potential in their respective cooling surfaces are alternately reversed along the second direction. As a result, the heat dissipation from the modules in each first water channel 41 becomes uniform. Furthermore, in the second direction, the AC terminals 13 in the multiple upper arm modules 5a and multiple lower arm modules 5b are not adjacent, therefore, in order to connect the AC busbars 62U extending in the first direction to each other, an AC busbar 62U extending in the second direction is provided.

[0094] In summary, by adopting Figure 11 , Figure 12 (b) Figure 13 The configuration structure has multiple upper arm modules 5a and multiple lower arm modules 5b, each having an AC output terminal arranged in a row along a first direction, thus enabling the AC busbar 62U connected to the AC output terminal to be in a straight line shape.

[0095] In addition, by adopting Figure 11 (a) Figure 12In the configuration structure of (b), the AC output terminals of multiple upper arm modules 5a and the AC output terminals of multiple lower arm modules 5b are adjacent to each other in the second direction, so the shape of the AC busbar 62U connected to the AC output terminals is simplified.

[0096] In addition, by adopting Figure 12 (a) and Figure 12 (b) configuration structure, in which the surface of each cooling surface with the electrode on the high potential side and the surface of the electrode on the low potential side are arranged to alternately reverse along the first direction, so that the drain surface 5d with more heat dissipation is on the outside to cope with the flow rate of the first water channel 41, thereby improving the cooling efficiency.

[0097] In addition, by adopting Figure 11 , Figure 12 (a) Figure 13 The configuration structure, in the modules configured in the first and second columns, has an upper arm module 5a configured in the first column and a lower arm module 5b configured in the second column, thus simplifying the shape of the positive busbar 61P and the negative busbar 61N.

[0098] According to the embodiments of the present invention described above, the following effects are achieved.

[0099] (1) The power conversion device 1 includes a semiconductor module 5, which has: a plurality of upper arm modules 5a, which constitute upper arm circuits of upper and lower arm circuits and are electrically connected in parallel with each other; and a plurality of lower arm modules 5b, which constitute lower arm circuits of upper and lower arm circuits and are electrically connected in parallel with each other. The plurality of upper arm modules 5a and the plurality of lower arm modules 5b are disposed on a substrate 8. A portion of at least one of the modules of the plurality of upper arm modules 5a and the plurality of lower arm modules 5b is disposed in a first column and a second column corresponding to and adjacent to the first column. The first column and the second column are formed along a first direction. The plurality of upper arm modules 5a have first terminals 9a, and the plurality of lower arm modules 5b have second terminals 9b. The first terminals 9a and the second terminals 9b extend in a direction orthogonal to the substrate 8. Positive wiring connecting the plurality of first terminals 9a to each other and negative wiring connecting the plurality of second terminals 9b to each other are arranged parallel to each other along the first direction. Thus, a power conversion device 1 that achieves reduced inductance and miniaturization can be provided.

[0100] (2) The cooling surfaces of the multiple upper arm modules 5a and multiple lower arm modules 5b are oriented in the plane direction of the wiring board 8 in a direction orthogonal to the first direction, i.e., the second direction. Thus, when the output of the power conversion device 1 changes, the layout can be changed while maintaining the cooling performance without changing the number of water channels.

[0101] (3) The first terminal 9a and the second terminal 9b, which are arranged in the first column and the second column, are opposite to each other in the second direction. Thus, the positions of the upper arm center of gravity 35a and the lower arm center of gravity 35b in the first direction are consistent, so that the distance between the centers of gravity 35 is minimized.

[0102] (4) The modules arranged in the first and second columns have their respective cooling surfaces 5c having electrodes on the low-potential side that do not face each other. This improves heat dissipation and achieves low inductance.

[0103] (5) The modules arranged in the first and second columns have their surfaces 5d (with high potential side electrodes) and surfaces 5c (with low potential side electrodes) arranged alternately in a first direction. As a result, heat dissipation is equalized in each module.

[0104] (6) A portion of the modules arranged in the first and second columns have their respective cooling surfaces having electrodes on the low-potential side facing the same direction. As a result, the arrangement of gate signals, etc., extending along the third direction is the same, and the pattern of the drive substrate (not shown) becomes simple.

[0105] (7) In the modules arranged in the first and second columns, the upper arm module 5a is arranged in the first column and the lower arm module 5b is arranged in the second column. As a result, the shapes of the positive busbar 61P and the negative busbar 61N become simple.

[0106] (8) In the modules configured as the first and second columns, the upper arm module 5a and the lower arm module 5b adjacent to each other along the first direction are alternately arranged. This reduces the inductance.

[0107] (9) A smoothing capacitor 4 is disposed adjacent to the upper arm module 5a and the lower arm module 5b, with the first terminal 9a and the second terminal 9b respectively disposed on the side of the smoothing capacitor 4 in the upper arm module 5a and the lower arm module 5b. This reduces the inductance.

[0108] (10) Multiple upper arm modules 5a and multiple lower arm modules 5b, with cooling surfaces 6 facing the first direction. Thus, when the output of the power conversion device 1 changes, the number of water channels changes, but the length of the water channels does not need to change.

[0109] (11) Multiple upper arm modules 5a and multiple lower arm modules 5b each have AC output terminals, which are arranged in a row along the first direction. As a result, the AC busbar 62U can be in a straight line shape, making the layout easier.

[0110] (12) The AC output terminals of the multiple upper arm modules 5a and the AC output terminals of the multiple lower arm modules 5b are adjacent to each other in the second direction. As a result, the shape of the AC busbar 62U can be simplified.

[0111] (13) The first terminal 9a and the second terminal 9b are adjacent to each other in the second direction. As a result, the AC busbar 62U can be made into a straight shape, and the layout becomes easier.

[0112] (14) In the modules arranged in the first and second columns, the surface 5d of the electrode with the high potential side and the surface 5c of the electrode with the low potential side in their respective cooling surfaces are alternately reversed along the first direction. This improves heat dissipation.

[0113] (15) The modules arranged in the first and second columns have their respective cooling surfaces, with the surface 5d having the electrode on the high potential side and the surface 5c having the electrode on the low potential side, alternately reversed along the second direction. As a result, the heat dissipation in the same water channel becomes uniform.

[0114] (16) In the modules arranged in the first and second columns, the upper arm module 5a and the lower arm module 5b are arranged alternately. As a result, the distance 35 between the centers of gravity becomes shorter.

[0115] Furthermore, the present invention is not limited to the embodiments described above, and various modifications and other structures can be combined without departing from its spirit. Additionally, the present invention is not limited to having all the structures described in the above embodiments, but also includes structures in which a portion of the structure has been omitted.

[0116] Symbol Explanation

[0117] 1: Power conversion device

[0118] 2: Motor

[0119] 3: Battery

[0120] 4: Smoothing capacitor

[0121] 5: Semiconductor Module

[0122] 5a: Upper arm module

[0123] 5b: Lower arm module

[0124] 5c: Source electrode surface

[0125] 5d: Drain surface

[0126] 6: Cooling surface

[0127] 7: Drive unit

[0128] 8: Wiring board

[0129] 9: Power module terminals

[0130] 9a: First terminal

[0131] 9b: Second terminal

[0132] 11: Positive extreme

[0133] 12: Negative extreme

[0134] 13: AC terminal

[0135] 21: Positive current

[0136] 22: Negative current

[0137] 30: Semiconductor components

[0138] 35: Distance between centers of gravity

[0139] 35a: Upper arm center of gravity position

[0140] 35b: Lower arm center of gravity position

[0141] 41: First Waterway

[0142] 42: Second Waterway

[0143] 43: The Third Waterway

[0144] 61P: Positive busbar

[0145] 61N: Negative busbar

[0146] 62U: AC busbar (U phase)

Claims

1. A power conversion device, characterized in that, The device includes a semiconductor module comprising: multiple upper arm modules that constitute upper arm circuits of the upper and lower arm circuits and are electrically connected in parallel with each other; and multiple lower arm modules that constitute lower arm circuits of the upper and lower arm circuits and are electrically connected in parallel with each other. The plurality of upper arm modules and the plurality of lower arm modules are disposed on the substrate. A portion of at least one of the plurality of upper arm modules and the plurality of lower arm modules is configured in a first column and a second column corresponding to and adjacent to the first column. The first column and the second column are formed along a first direction. The plurality of upper arm modules have a first terminal. The plurality of lower arm modules have a second terminal. The first terminal and the second terminal extend in a direction orthogonal to the substrate. The positive wiring that electrically connects multiple first terminals to each other and the negative wiring that electrically connects multiple second terminals to each other are arranged and extend parallel to each other along the first direction.

2. The power conversion device according to claim 1, characterized in that, The cooling surfaces of the plurality of upper arm modules and the plurality of lower arm modules are oriented in the plane direction of the substrate toward a direction orthogonal to the first direction, namely the second direction.

3. The power conversion device according to claim 2, characterized in that, The first terminal and the second terminal, which are configured in the first column and the second column, are opposite to each other in the second direction.

4. The power conversion device according to claim 2, characterized in that, The modules arranged in the first and second columns have electrodes on the low-potential side of their respective cooling surfaces that do not face each other.

5. The power conversion device according to claim 2, characterized in that, The modules configured in the first and second columns have their respective faces with high-potential electrodes and faces with low-potential electrodes arranged alternately in reverse along the first direction.

6. The power conversion device according to claim 2, characterized in that, The modules configured in the first and second columns have electrodes on their respective cooling surfaces that have a low potential side facing the same direction.

7. The power conversion device according to claim 2, characterized in that, In the modules configured in the first column and the second column, the upper arm module is configured in the first column and the lower arm module is configured in the second column.

8. The power conversion device according to claim 2, characterized in that, In the modules configured in the first column and the second column, the upper arm module and the lower arm module are configured alternately, respectively.

9. The power conversion device according to claim 1, characterized in that, A smoothing capacitor is disposed adjacent to the upper arm module and the lower arm module. The first terminal and the second terminal are respectively disposed on the smoothing capacitor side in the upper arm module and the lower arm module.

10. The power conversion device according to claim 1, characterized in that, The cooling surfaces of the plurality of upper arm modules and the plurality of lower arm modules face the first direction.

11. The power conversion device according to claim 10, characterized in that, The plurality of upper arm modules and the plurality of lower arm modules each have AC output terminals. The AC output terminals are arranged in a row along the first direction.

12. The power conversion device according to claim 11, characterized in that, In the modules configured in the first and second columns, the AC output terminals of the plurality of upper arm modules and the AC output terminals of the plurality of lower arm modules are adjacent to each other in a second direction.

13. The power conversion device according to claim 10, characterized in that, The first terminal and the second terminal are adjacent to each other in the second direction, which is orthogonal to the first direction, in the planar direction of the substrate.

14. The power conversion device according to claim 10, characterized in that, The modules arranged in the first and second columns have their respective cooling surfaces having electrodes on the high-potential side and electrodes on the low-potential side alternately reversed along the first direction.

15. The power conversion device according to claim 10, characterized in that, The modules arranged in the first and second columns have their respective cooling surfaces having electrodes on the high-potential side and electrodes on the low-potential side, which are alternately reversed in the planar direction of the substrate along a second direction orthogonal to the first direction.

16. The power conversion device according to claim 10, characterized in that, The modules configured in the first column and the second column are respectively alternately configured with the upper arm module and the lower arm module.

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