A method for preparing a flexible wearable temperature control fabric

Abstract

The present application relates to the field of refrigeration devices and daily necessities, and particularly relates to a preparation method of a flexible wearable temperature control fabric. The flexible wearable temperature control fabric mainly comprises a polyimide heat insulation base, multiple pairs of micro semiconductor PN junctions, a heat-conducting fiber fabric layer, a flexible heat dissipation layer, a flexible circuit, a control chip and a power supply. The micro semiconductor PN junctions are connected to the control chip in a series or parallel array manner through the flexible circuit, are encapsulated in the polyimide heat insulation base, and are connected to the power supply. The hot end of the micro semiconductor PN junctions is attached to the flexible heat dissipation layer, and the cold end of the micro semiconductor PN junctions is attached to the heat-conducting fiber fabric layer and is attached to a heat-conducting block. The present application can achieve the effect of rapid cooling, can meet the cooling needs of long-time work and travel by being equipped with the power supply, and can guarantee the flexible characteristic and meet the high refrigeration effect by using the characteristics of small volume, small contact surface and large refrigeration power density of the micro semiconductor PN junctions.

Description

[0001] This application is a divisional application of a Chinese invention patent application. The original application was filed on November 23, 2023, with application number 202311574645.1 and invention title: A flexible wearable temperature-controlled fabric and its preparation method. Technical Field

[0002] This invention relates to the field of refrigeration devices and daily necessities, specifically to a method for preparing a flexible wearable temperature-controlled fabric. Background Technology

[0003] The first physical effect of direct thermoelectric energy conversion—the Seebeck effect—was discovered in 1821. This is a thermoelectric power generation effect caused by a temperature difference generating a thermoelectric potential. Over the next 30 years, the Pertier effect and the Thomson effect were discovered, forming a complete system describing the physical effects of direct thermoelectric energy conversion. Thomson established the correlation between the three thermoelectric effects based on thermodynamic theory, constructing the thermodynamic foundation for the interconversion of thermoelectric energy. However, it wasn't until the 1950s that thermoelectric power generation and refrigeration technologies began to be practically applied, mainly due to the lack of high-performance thermoelectric materials. In the 1950s, thanks to the establishment of semiconductor theory and its successful application in the development of thermoelectric materials, the performance of semiconductor thermoelectric materials was significantly improved. The dimensionless thermoelectric figure of merit (ZT) of various systems such as Bi₂Te₃, PbTe, and SiGe reached or approached 1.0. For the next half-century, thermoelectric conversion technology has played an irreplaceable role in fields such as space power and localized refrigeration.

[0004] Semiconductor thermoelectric cooling technology is an energy conversion technology that utilizes the Peltier effect of semiconductor materials to achieve cooling or heating. It is widely used in optoelectronics, electronics, biomedicine, and consumer appliances. The core component of thermoelectric cooling technology is the thermoelectric cooling device (TEC), also known as a thermoelectric cooler or thermoelectric cooling unit. A thermoelectric cooling device typically consists of several pairs of p- and n-type semiconductor thermocouples connected in series. When a DC power supply is applied, one end of the thermoelectric cooling device will cool down, while the other end will simultaneously heat up. Through heat exchangers and other heat transfer methods, the hot end of the device continuously dissipates heat, while the cold end continuously absorbs heat from the working environment. It is worth noting that this phenomenon is completely reversible; simply changing the direction of the current will cause the heat to transfer in the opposite direction. Therefore, a single thermoelectric cooling device can simultaneously perform both cooling and heating functions.

[0005] Wearable devices refer to portable devices that can be worn on the body or integrated into a user's clothing or accessories. Wearable devices are not merely hardware devices; they achieve powerful functions through software support, data interaction, and cloud interaction. Wearable devices will significantly transform our lives and perceptions. In recent years, global shipments of wearable devices have reached 310 million units, a 16.7% increase from the previous year, indicating a massive market size. With consumption upgrades and the gradual popularization of technologies such as AI, VR, and AR, wearable devices have evolved from single-function devices to multi-functional ones, while also becoming more portable and practical. Smart wearable devices have numerous potential applications in many fields, including healthcare, navigation, social networking, business, and media, and can change future lifestyles through various application scenarios. Summary of the Invention

[0006] The purpose of this invention is to provide a method for preparing a flexible wearable temperature-controlled fabric, which solves the problem in the prior art that it is difficult to adjust the perceived temperature in different scenarios and environments, and can adapt to the needs of work, travel and other uses in different scenarios and environments.

[0007] To achieve the above objectives, the technical solution of the present invention is as follows:

[0008] A flexible wearable temperature-controlled fabric includes a micro-semiconductor PN junction, a flexible circuit, a control chip, a power supply, a flexible heat dissipation layer, a polyimide thermal insulation substrate, a thermally conductive fiber fabric layer, and a thermally conductive block, with the specific structure as follows:

[0009] Micro-semiconductor PN junctions are arranged in an array in a plane to form a micro-semiconductor PN junction array. The micro-semiconductor PN junction array is connected in series or parallel with a control chip through a flexible circuit. The micro-semiconductor PN junction array and the control chip are connected to the power supply through wires.

[0010] A micro-semiconductor PN junction array and a flexible circuit connecting the micro-semiconductor PN junctions are encapsulated between two layers of polyimide thermal insulation substrates arranged in parallel.

[0011] Two layers of polyimide thermal insulation substrates correspond to the cold and hot sides of the micro-semiconductor PN junction array, respectively. A thermally conductive fiber fabric layer is attached to one side of the polyimide thermal insulation substrate corresponding to the cold side of the micro-semiconductor PN junction array, and an array of thermally conductive blocks are attached to the other side of the thermally conductive fiber fabric layer. A flexible heat dissipation layer is attached to the outside of the polyimide thermal insulation substrate corresponding to the hot side of the micro-semiconductor PN junction array.

[0012] The flexible wearable temperature-controlled fabric has a length, width, and height range of 100 micrometers to 500 micrometers for each pair of micro-semiconductor PN junctions.

[0013] The flexible wearable temperature-controlled fabric and flexible circuits are flexible circuit boards with different single-sided, double-sided or multi-layer structures obtained by chemical etching of flexible copper foil.

[0014] The flexible wearable temperature-controlled fabric is powered by a rechargeable lithium battery.

[0015] The flexible wearable temperature-controlled fabric has a polyimide thermal insulation substrate with a polyimide film as the base material and a silicone pressure-sensitive adhesive layer coated on one side. The silicone pressure-sensitive adhesive layer is located on the outside of the polyimide film, and the thickness of the polyimide thermal insulation substrate is on the order of millimeters.

[0016] The flexible wearable temperature-controlled fabric has an array of holes etched on the inner side of the polyimide thermal insulation substrate according to the arrangement of micro-semiconductor PN nodes, with each micro-semiconductor PN node embedded in the array of holes.

[0017] The flexible wearable temperature-controlled fabric has a flexible heat dissipation layer and a thermally conductive fiber fabric layer, both of which are silver fiber fabric layers.

[0018] The flexible wearable temperature-controlled fabric has a heat-conducting block made of foam metal. Each heat-conducting block corresponds one-to-one with a micro-semiconductor PN junction. The length and width of the heat-conducting block are comparable to the corresponding micro-semiconductor PN junction, and the thickness of the heat-conducting block is on the order of millimeters.

[0019] The method for preparing the flexible wearable temperature-controlled fabric includes the following steps:

[0020] (S1) Multiple pairs of micro-semiconductor PN junctions are connected to the control chip via flexible circuitry in a series or parallel array manner;

[0021] (S2) Connect the micro-semiconductor PN junction array and control chip to the power supply;

[0022] (S3) The micro-semiconductor PN junction array and the flexible circuit connecting the micro-semiconductor PN junctions are encapsulated between two layers of polyimide thermal insulation substrate;

[0023] (S4) The cold side of the polyimide thermal insulation substrate is bonded to one side of the thermally conductive fiber fabric layer, and an array of thermally conductive blocks are attached to the other side of the thermally conductive fiber fabric layer.

[0024] (S5) The hot side of the polyimide thermal insulation substrate is bonded to the flexible heat dissipation layer.

[0025] The design concept of this invention is as follows:

[0026] The flexible wearable temperature-controlled fabric of this invention mainly comprises a polyimide thermal insulation substrate, multiple pairs of micro-semiconductor PN junctions, a thermally conductive fiber fabric layer, a flexible heat dissipation layer, a flexible circuit, a control chip, and a power supply. The micro-semiconductor PN junctions are connected to the control chip in a series or parallel array via the flexible circuit and encapsulated within the polyimide thermal insulation substrate, and connected to the power supply. The hot ends of the micro-semiconductor PN junctions are attached to the flexible heat dissipation layer, and the cold ends are attached to the thermally conductive fiber fabric layer with attached thermally conductive blocks. Using series or parallel connections of the micro-semiconductor PN junctions achieves rapid regional cooling. The power supply meets the cooling needs for extended work and travel. Furthermore, by utilizing the small size, small contact area, and high cooling power density of the micro-semiconductor PN junctions, both flexibility and high cooling efficiency are ensured.

[0027] The advantages and beneficial effects of this invention are as follows:

[0028] 1. The flexible wearable temperature-controlled fabric of the present invention utilizes the cooling characteristics of semiconductor PN junctions to achieve rapid cooling, and can be arranged in a reasonable array for the areas of the human body that require cooling.

[0029] 2. The flexible wearable temperature-controlled fabric heat-conducting block and heat-conducting material of this invention fit the human body, with a compact multi-layer structure that is lightweight and burden-free.

[0030] 3. The flexible wearable temperature-controlled fabric of this invention is equipped with a portable rechargeable lithium battery, which not only ensures daily needs and long battery life, but also allows for reuse and is environmentally friendly and pollution-free. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the flexible wearable temperature-controlled fabric micro-semiconductor PN junction and circuit connection of the present invention.

[0032] Figure 2 This is a schematic diagram of the multi-layer structure of the flexible wearable temperature-controlled fabric of the present invention.

[0033] The labels in the diagram are as follows: 1. Micro-semiconductor PN junction; 2. Flexible circuit; 3. Control chip; 4. Power supply; 5. Flexible heat dissipation layer; 6. Polyimide thermal insulation substrate; 7. Thermally conductive fiber fabric layer; 8. Thermally conductive block. Detailed Implementation

[0034] In the specific implementation process, such as Figures 1-2 As shown, this invention provides a method for preparing a flexible wearable temperature-controlled fabric, the specific process of which is as follows:

[0035] (S1) Multiple pairs of micro semiconductor PN junctions 1 are connected to the control chip 3 via flexible circuit 2 in a series or parallel array manner;

[0036] (S2) Connect the micro semiconductor PN junction array and control chip 3 to the power supply 4;

[0037] (S3) The micro-semiconductor PN junction array and the flexible circuit 2 connecting the micro-semiconductor PN junction 1 are encapsulated between two layers of polyimide thermal insulation substrate 6;

[0038] (S4) The cold side of the polyimide heat insulation substrate 6 is bonded to one side of the heat-conducting fiber fabric layer 7, and an array of heat-conducting blocks 8 are attached to the other side of the heat-conducting fiber fabric layer 7.

[0039] (S5) The hot side of the polyimide heat insulation substrate 6 is bonded to the flexible heat dissipation layer 5.

[0040] like Figures 1-2 As shown, the flexible wearable temperature-controlled fabric of the present invention mainly includes a micro-semiconductor PN junction 1, a flexible circuit 2, a control chip 3, a power supply 4, a flexible heat dissipation layer 5, a polyimide thermal insulation substrate 6, a thermally conductive fiber fabric layer 7, and a thermally conductive block 8, with the specific structure as follows:

[0041] The micro-semiconductor PN junctions 1 are arranged in an array in a plane to form a micro-semiconductor PN junction array. The micro-semiconductor PN junction array is connected in series or parallel to the control chip 3 through a flexible circuit 2. The micro-semiconductor PN junction array and the control chip 3 are connected to the power supply 4 through wires.

[0042] The micro-semiconductor PN junction array and the flexible circuit 2 connecting the micro-semiconductor PN junction 1 are encapsulated between two layers of polyimide thermal insulation substrate 6 arranged in parallel.

[0043] Two polyimide thermal insulation substrates 6 correspond to the cold and hot sides of the micro-semiconductor PN junction array, respectively. One side of the thermally conductive fiber fabric layer 7 is attached to the outside of the polyimide thermal insulation substrate 6 corresponding to the cold side of the micro-semiconductor PN junction array, and an array of thermally conductive blocks 8 are attached to the other side of the thermally conductive fiber fabric layer 7. A flexible heat dissipation layer 5 is attached to the outside of the polyimide thermal insulation substrate 6 corresponding to the hot side of the micro-semiconductor PN junction array.

[0044] The following examples further explain or illustrate the content of the present invention.

[0045] Example 1

[0046] In this embodiment, a method for preparing a flexible wearable temperature-controlled fabric includes the following steps:

[0047] 1) 100 miniature semiconductor PN junctions with a size of 0.3×0.3×0.4mm are connected to the control chip via a flexible circuit in a 10×10 array of 10 junctions connected in series and then in parallel.

[0048] Among them, flexible circuits are flexible circuit boards with different single-sided, double-sided or multi-layer structures obtained by chemical etching of flexible copper foil; control chips include analog-to-digital conversion modules, microcontrollers, voltage regulator modules, etc., such as SLM8833, SLM8834, SLM8835, MAX1968.

[0049] 2) Connect the assembled micro-semiconductor PN junction array and control chip to a 9V, 5000mAh rechargeable lithium battery;

[0050] 3) The micro-semiconductor PN junction array and the flexible circuit connecting the micro-semiconductor PN junctions are encapsulated between two 1mm thick polyimide thermal insulation substrates;

[0051] Among them, the polyimide heat insulation substrate is based on a polyimide film, with a high-performance silicone pressure-sensitive adhesive layer coated on one side. The silicone pressure-sensitive adhesive layer is located on the outside of the polyimide film. The inner side of the polyimide heat insulation substrate is etched with array holes according to the arrangement of micro semiconductor PN nodes, and the micro semiconductor PN is embedded in the array holes.

[0052] 4) Attach the cold side of the polyimide thermal insulation substrate to the thermally conductive fiber fabric layer (e.g., silver fiber fabric), and attach 10×10 array thermally conductive blocks that correspond one-to-one with the micro-semiconductor PN junctions.

[0053] The heat-conducting block is made of foamed metal (such as aluminum foam), with length and width dimensions comparable to the corresponding micro-semiconductor PN junction and a thickness of 2mm.

[0054] 5) Lay a flexible heat dissipation layer (e.g., silver fiber fabric) onto the hot side of the polyimide heat insulation substrate.

[0055] The results show that the flexible wearable temperature-regulating fabric of the present invention not only solves the problem of regulating the perceived temperature outdoors, but also ensures the flexibility and improves the wearing comfort. It has the advantages of compact structure, conforming to the human body surface, rapid cooling, lightness and lightness, and long battery life.

[0056] The preparation method of a flexible wearable temperature-controlled fabric provided by the present invention has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make several improvements and modifications to the present invention without departing from the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A method for preparing a flexible wearable temperature-controlled fabric, characterized in that, The flexible wearable temperature-controlled fabric includes a micro-semiconductor PN junction, flexible circuitry, a control chip, a power supply, a flexible heat dissipation layer, a polyimide thermal insulation substrate, a thermally conductive fiber fabric layer, and thermally conductive blocks. The specific structure is as follows: Micro-semiconductor PN junctions are arranged in an array in a plane to form a micro-semiconductor PN junction array. The micro-semiconductor PN junction array is connected in series or parallel with a control chip through a flexible circuit. The micro-semiconductor PN junction array and the control chip are connected to the power supply through wires. A micro-semiconductor PN junction array and a flexible circuit connecting the micro-semiconductor PN junctions are encapsulated between two layers of polyimide thermal insulation substrates arranged in parallel. Two layers of polyimide thermal insulation substrate correspond to the cold and hot sides of the micro-semiconductor PN junction array, respectively. A thermally conductive fiber fabric layer is attached to one side of the polyimide thermal insulation substrate corresponding to the cold side of the micro-semiconductor PN junction array, and an array of thermally conductive blocks are attached to the other side of the thermally conductive fiber fabric layer. A flexible heat dissipation layer is attached to the outside of the polyimide thermal insulation substrate corresponding to the hot side of the micro-semiconductor PN junction array. The method for preparing the flexible wearable temperature-controlled fabric includes the following steps: (S1) Multiple pairs of micro-semiconductor PN junctions are connected to the control chip via flexible circuitry in a series or parallel array manner; (S2) Connect the micro-semiconductor PN junction array and control chip to the power supply; (S3) The micro-semiconductor PN junction array and the flexible circuit connecting the micro-semiconductor PN junctions are encapsulated between two layers of polyimide thermal insulation substrate; (S4) The cold side of the polyimide thermal insulation substrate is bonded to one side of the thermally conductive fiber fabric layer, and an array of thermally conductive blocks are attached to the other side of the thermally conductive fiber fabric layer. (S5) The hot side of the polyimide thermal insulation substrate is bonded to the flexible heat dissipation layer.

2. The method for preparing the flexible wearable temperature-controlled fabric according to claim 1, characterized in that, The length, width, and height of each pair of micro-semiconductor PN junctions range from 100 micrometers to 500 micrometers.

3. The method for preparing the flexible wearable temperature-controlled fabric according to claim 1, characterized in that, Flexible circuits are flexible circuit boards with different single-sided, double-sided, or multi-layer structures obtained by chemical etching of flexible copper foil.

4. The method for preparing the flexible wearable temperature-controlled fabric according to claim 1, characterized in that, The power supply is a rechargeable lithium battery.

5. The method for preparing the flexible wearable temperature-controlled fabric according to claim 1, characterized in that, The polyimide thermal insulation substrate is made of polyimide film as the base material, with a silicone pressure-sensitive adhesive layer coated on one side. The silicone pressure-sensitive adhesive layer is located on the outside of the polyimide film, and the thickness of the polyimide thermal insulation substrate is in the millimeter range.

6. The method for preparing the flexible wearable temperature-controlled fabric according to claim 5, characterized in that, An array of holes is etched on the inner side of the polyimide thermal insulation substrate according to the arrangement of micro-semiconductor PN junctions, and the micro-semiconductor PN junctions are embedded in the array of holes one by one.

7. The method for preparing the flexible wearable temperature-controlled fabric according to claim 1, characterized in that, The flexible heat dissipation layer and the thermally conductive fiber fabric layer are made of silver fiber fabric.

8. The method for preparing the flexible wearable temperature-controlled fabric according to claim 1, characterized in that, The heat-conducting block is a foam metal block, and each heat-conducting block corresponds one-to-one with a micro-semiconductor PN junction. The length and width of the heat-conducting block are equivalent to the corresponding micro-semiconductor PN junction, and the thickness of the heat-conducting block is on the order of millimeters.

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