Wearable device and packaging method thereof

Abstract

The application belongs to the technical field of wearable devices, and particularly relates to a wearable device and a packaging method thereof. The wearable device comprises a shell, a battery module, a circuit board assembly and a sealing assembly. The shell has an inner cavity. The battery module is arranged in the inner cavity. The circuit board assembly is electrically connected with the battery module, and at least a part of the circuit board assembly extends to an area outside the battery module. The sealing assembly divides the inner cavity into a first area and a second area. The battery module is located in the first area, and at least a part of the circuit board assembly is located in the second area. The second area is filled with a sealing filling medium to coat the circuit board assembly in the second area. The application can simplify battery disassembly, improve battery life and safety.

Description

Technical Field

[0001] This application belongs to the field of wearable device technology, specifically relating to a wearable device and its packaging method. Background Technology

[0002] With the development of electronic device miniaturization technology, ring-shaped wearable devices (such as smart rings) have been widely used in health monitoring, identity recognition and other fields due to their small size and portability.

[0003] Currently, resin potting is widely used in the industry to ensure the stability of internal components (such as batteries and circuit boards) in confined spaces and to achieve waterproof sealing. However, the use of resin potting can lead to difficulties in battery disassembly, and the constrained expansion of the battery can generate internal stress, affecting battery life and safety. Summary of the Invention

[0004] The purpose of this application is to provide a wearable device and its packaging method, which can simplify battery disassembly, improve battery life and safety.

[0005] A first aspect of this application provides a wearable device, comprising: a housing having an inner cavity; a battery module disposed in the inner cavity; a circuit board assembly electrically connected to the battery module, wherein at least a portion of the circuit board assembly extends beyond the area where the battery module is located; and a sealing assembly dividing the inner cavity into a first region and a second region, wherein the battery module is located in the first region, at least a portion of the circuit board assembly is located in the second region, and the second region is filled with a sealing filling medium to cover the circuit board assembly within the second region.

[0006] In one exemplary embodiment of this application, the sealing component is a barrier member, and the periphery of the barrier member is in interference fit with the inner wall surface of the housing.

[0007] In one exemplary embodiment of this application, the inner wall surface of the housing is provided with a slot, and the barrier is embedded in the slot.

[0008] In one exemplary embodiment of this application, the sealing assembly is an integrally formed partition protrusion on the inner wall surface of the housing and extending inward, the partition protrusion extending along the inner wall surface of the housing and dividing the inner cavity into the first region and the second region.

[0009] In one exemplary embodiment of this application, the sealing assembly is a pre-set partition, the pre-set partition and the sealing filling medium are separate structures, and the pre-set partition is located between the first region and the second region.

[0010] In one exemplary embodiment of this application, at least one buffer is provided in the first region, and the buffer is disposed between the battery module and the inner wall surface of the housing.

[0011] A second aspect of this application provides a packaging method for a wearable device, comprising the following steps: providing a housing, the housing being annular and having an inner cavity, the housing having an injection port; placing a battery module and a circuit board assembly into the inner cavity; providing a barrier member and placing the barrier member into the inner cavity, the periphery of the barrier member being abutted against the inner wall surface of the housing to divide the inner cavity into a first region and a second region, a portion of the battery module and the circuit board assembly being located in the first region, another portion of the circuit board assembly being located in the second region, and the injection port communicating with the second region; injecting a sealing filler medium into the second region through the injection port; curing the sealing filler medium to cover the circuit board assembly located in the second region; and leveling the sealing filler medium overflowing from the injection port so that the overflowing sealing filler medium is flush with the inner surface of the housing.

[0012] A third aspect of this application provides a method for packaging a wearable device, comprising the following steps: providing a first housing portion, wherein an inwardly protruding partition protrusion is integrally formed on the inner wall surface of the first housing portion; disposing a battery module in one side region of the partition protrusion of the first housing portion, and disposing at least partially in the other side region of the partition protrusion of the first housing portion; electrically connecting the battery module and the circuit board assembly; injecting potting compound into the other side region where the battery module is not disposed, to cure the circuit board assembly; coupling a second housing portion to the first housing portion to seal the circuit board assembly and the battery module.

[0013] A fourth aspect of this application provides a packaging method for a wearable device, comprising the following steps: providing a housing having an inner cavity; placing a circuit board assembly into the inner cavity; providing a spacer mold, placing the spacer mold into the inner cavity, the spacer mold occupying a first space in the inner cavity, and the periphery of the spacer mold being abutted against the inner wall surface of the housing; injecting a sealing filling medium into the area of ​​the inner cavity other than the first space; curing the sealing filling medium to cover the circuit board assembly; removing the spacer mold to form a first region; and placing a battery module into the first region and electrically connecting it to the circuit board assembly.

[0014] This application provides a method for packaging a wearable device, comprising the following steps: providing a housing having an inner cavity; disposing a battery module and a circuit board assembly in the inner cavity; injecting a first sealing medium into a predetermined location in the inner cavity and curing the first sealing medium to form a pre-placed partition, the pre-placed partition dividing the inner cavity into a first region accommodating the battery module and a second region accommodating at least a portion of the circuit board assembly, wherein the periphery of the pre-placed partition is abutting against the inner wall surface of the housing; injecting a second sealing medium into the second region; and curing the second sealing medium to cover the circuit board assembly located in the second region.

[0015] The wearable device and its packaging method described in this application have at least the following beneficial effects:

[0016] This application divides the inner cavity of the housing into a first region and a second region by setting a sealing component. The battery module is located in the first region, and the sealing medium is filled in the second region to cover the portion of the circuit board assembly located in the second region. Thus, the sealing component confines the sealing medium within the second region, preventing the sealing medium from entering the first region where the battery module is located. This provides two advantages: firstly, the battery module is not constrained by the sealing medium, facilitating disassembly and maintenance; secondly, the first region provides free expansion space for the battery module, reducing the likelihood of constraint stress during charging, discharging, or temperature changes, thereby improving battery cycle life and safety. Regarding the packaging method, this application provides multiple process paths to form the sealing component, including barrier insertion, split housing fastening, occupier mold removal, and pre-formed partition molding. Each method confines the filling range of the sealing medium to the second region, achieving precise packaging of the portion of the circuit board assembly located within the second region. Furthermore, the process is flexible and can adapt to the manufacturing needs of wearable devices with different structural forms.

[0017] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.

[0018] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0020] Figure 1 A schematic diagram of the wearable device is shown from a frontal viewing angle.

[0021] Figure 2 A three-dimensional structural diagram of the wearable device is shown.

[0022] Figure 3 A schematic cross-sectional view of the second region filled with the sealing filling medium is shown.

[0023] Figure 4 A schematic diagram of the structure of a wearable device without a sealing filler medium is shown.

[0024] Figure 5 A cross-sectional structural diagram of a wearable device without a sealing filler medium is shown.

[0025] Figure 6 A schematic diagram of a packaging method for a wearable device with a barrier element disposed in the inner cavity is shown.

[0026] Figure 7 A schematic diagram of the packaging method for wearable devices with a split housing component is shown.

[0027] Figure 8 A schematic diagram of a packaging method for wearable devices under a placeholder mold is shown.

[0028] Figure 9 A schematic diagram of a packaging method for a wearable device in which a pre-placed partition is formed in the cavity is shown.

[0029] Explanation of reference numerals in the attached figures: 100, Housing; 110, Inner cavity; 111, First region; 112, Second region; 200, Battery module; 300, Circuit board assembly; 400, Sealing assembly; 410, Barrier component; 420, Pre-installed partition component; 500, Sealing filling medium; 600, Buffer component. Detailed Implementation

[0030] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0031] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0032] In this application, unless otherwise expressly specified and limited, the terms "assembly," "connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0033] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0034] This application provides a wearable device, which can be a ring-shaped electronic device worn on a user's limbs or neck, such as a smart ring, smart bracelet, or smart necklace. For ease of description, a smart ring will be used as an example below.

[0035] Among them, see Figures 1 to 3 As shown, the wearable device includes a housing 100, a battery module 200, a circuit board assembly 300, and a sealing assembly 400.

[0036] The shell 100 may have a closed annular structure, with an inner cavity 110 formed inside, which extends circumferentially along the shell 100. The shell 100 may be made of materials such as metal, plastic or ceramic, and its cross-sectional shape may be circular, rectangular or irregular.

[0037] In other embodiments, the housing 100 may also be a C-shaped structure with an opening.

[0038] See Figure 3As shown, the battery module 200 is disposed in the inner cavity 110 and is used to power the circuit board assembly 300 and other electronic components. The battery module 200 can be an arc-shaped soft-pack battery, such as a lithium-ion battery, a solid-state battery, or a supercapacitor. The curvature of the battery module 200 matches the curvature of the inner wall surface of the housing 100 to make full use of the space in the inner cavity 110.

[0039] See Figure 3 As shown, the circuit board assembly 300 is electrically connected to the battery module 200. The circuit board assembly 300 may include a flexible circuit board (FPC) or a rigid circuit board (PCB) and various electronic components soldered on it, such as Bluetooth chips, sensors, antennas, etc.

[0040] The battery module 200 and the circuit board assembly 300 are arranged sequentially along the extension direction of the inner cavity 110 (i.e., the circumferential direction of the housing 100), and at least a portion of the circuit board assembly 300 extends beyond the area where the battery module 200 is located in the extension direction, meaning that the two are partially offset in the extension direction of the inner cavity 110. This arrangement provides a clear spatial boundary between the battery module 200 and the circuit board assembly 300, facilitating the sealing assembly 400 to divide the inner cavity 110 into a first region 111 and a second region 112 at this boundary location.

[0041] For other embodiments where the housing 100 is non-circular (such as straight, arc, or irregular shape), the extending direction of the inner cavity 110 is the length direction or the contour extending direction of the housing 100. The battery module 200 and the circuit board assembly 300 are also partially staggered along this extending direction to achieve regional separation.

[0042] See Figure 3 As shown, a sealing assembly 400 is disposed in the inner cavity 110, dividing the inner cavity 110 into a first region 111 and a second region 112. The sealing assembly 400 is located between the first region 111 and the second region 112, and the periphery of the sealing assembly 400 is in contact with the inner wall surface of the housing 100. The battery module 200 is located in the first region 111, and at least a portion of the circuit board assembly 300 is located in the second region 112. The second region 112 is filled with a sealing filler medium 500, which is used to cover the portion of the circuit board assembly 300 located in the second region 112 to achieve waterproof, dustproof, and vibration-resistant protection for this portion of the circuit board assembly 300. The sealing filler medium 500 can be a flowable curable material such as hot melt adhesive, UV adhesive, epoxy resin, or silicone.

[0043] The presence of the sealing component 400 confines the sealing filling medium 500 within the second region 112 during injection and curing, preventing it from entering the first region 111 that houses the battery module 200. Consequently, the surface of the battery module 200 and the connection points of the tabs (i.e., the metal conductive terminals led out from the battery cells) remain unsealed, facilitating subsequent disassembly and maintenance, and providing free space for the volume expansion of the battery module 200 during charging, discharging, or temperature changes, thus mitigating the problem of constrained stress.

[0044] The specific structure and formation of the sealing assembly 400 are further explained below in conjunction with different implementation methods.

[0045] Example 1 See Figures 3 to 5 As shown, the sealing assembly 400 is a separately configured barrier 410. The barrier 410 and the housing 100 are separate structures; that is, the barrier 410 is manufactured independently of the housing 100 and then assembled into the inner cavity 110. The barrier 410 is fixed in the inner cavity 110 by an interference fit, and its periphery is tightly fitted to the inner wall surface of the housing 100. The material of the barrier 410 can be silicone, rubber, plastic, or metal; a material with a certain degree of elasticity is used to enhance the sealing effect.

[0046] The barrier 410 extends radially or obliquely along the housing 100, dividing the inner cavity 110 into two sides in the circumferential direction. One side is a first region 111 that accommodates the battery module 200, and the other side is a second region 112 that accommodates at least a portion of the circuit board assembly 300.

[0047] A glue injection port is provided on the housing 100 at the position corresponding to the second region 112. The sealing filler 500 is injected into the second region 112 through the glue injection port and, after curing, covers the second part of the circuit board assembly 300. After curing, the sealing filler 500 in the glue injection port can be leveled by scraping, grinding, or applying glue to make its surface flush with the inner surface of the housing 100. This design allows for direct glue injection using the existing glue injection port on the housing 100, eliminating the need for additional glue injection channels and simplifying the encapsulation process. Furthermore, the leveling process ensures that the surface of the sealing filler 500 at the glue injection port is flush with the inner surface of the housing 100, reducing discomfort that may be caused by material protrusions or depressions at the glue injection port. It also ensures the flatness and appearance consistency of the inner surface of the housing 100, reducing pressure or friction on the user's skin during long-term wear due to local unevenness.

[0048] To facilitate electrical connection between the circuit board assembly 300 and the battery module 200, a channel for the circuit board assembly 300 to pass through can be provided on the barrier 410.

[0049] For example, see Figure 5As shown, a portion of the circuit board assembly 300 is located within the second region 112, while another portion extends through the channel on the barrier 410 into the first region 111, and is electrically connected to the battery module 200 located within the first region 111. This channel can be located at the root, middle, or edge of the barrier 410, and its shape is adapted to the cross-sectional profile of the circuit board assembly 300. After the circuit board assembly 300 passes through the channel, the remaining peripheral portion of the barrier 410 remains in contact with the inner wall surface of the housing 100 to maintain the regional isolation effect between the first region 111 and the second region 112. After the electrical connection is completed and the sealing filling medium 500 is injected and cured, if there are gaps at the channel, sealant can be injected to seal them.

[0050] To further enhance the assembly stability and sealing reliability of the barrier 410, a slot can be provided on the inner wall of the housing 100. During assembly, the edge of the barrier 410 is embedded in the slot, making it less prone to displacement when subjected to the injection pressure of the sealing filling medium 500, and ensuring a tighter fit.

[0051] See Figure 5 As shown, a buffer 600 may also be provided within the first region 111. The buffer 600 is sandwiched between the battery module 200 and the inner wall of the housing 100, for example, it may be provided on both sides or the circumferential end of the battery module 200 in the thickness direction. The buffer 600 may be foam, silicone pad, or spring sheet (micro elastic sheet or corrugated elastic sheet, providing support while reserving compression space), used to absorb the impact of external vibration on the battery module 200. At the same time, when the battery module 200 expands in volume due to charging, discharging or temperature changes, the buffer 600 can provide a certain compression space, reducing the internal stress generated by the rigid constraint of the inner wall of the housing 100 on the battery module 200.

[0052] It should be noted that the thickness of the buffer 600 can be 0.2 to 0.3 mm, for example, 0.2 mm, 0.25 mm, or 0.3 mm. Using this thickness can ensure the buffering effect.

[0053] Furthermore, the buffer 600 can also be a gel-like material or a microstructured elastomer. For example, a thermally conductive gel, which combines cushioning and thermal conductivity; or a silicone film with micro-bumps on its surface, which can provide variable stiffness.

[0054] Example 2 The sealing assembly 400 may be a partition protrusion (not shown) integrally formed from the inner wall surface of the housing 100 and extending inward. The partition protrusion extends along the inner wall surface of the housing 100, dividing the inner cavity 110 into a first region 111 and a second region 112.

[0055] The direction of extension of the partition protrusion can be selected according to the layout requirements of the battery module 200 and the circuit board assembly 300.

[0056] In one example, the partition protrusion extends along the axial direction of the housing 100, that is, the direction of extension of the partition protrusion is parallel to the central axis of the annular housing 100. At this time, the partition protrusion divides the inner cavity 110 circumferentially into a first region 111 and a second region 112 that are adjacent to each other on the left and right sides, respectively, with the battery module 200 and the circuit board assembly 300 located in the left and right side regions.

[0057] In another example, the partition protrusion extends circumferentially along the housing 100, that is, the partition protrusion is arranged around the inner wall surface of the annular housing 100. In this case, the partition protrusion radially divides the inner cavity 110 into a first region 111 and a second region 112 arranged inside and outside, for example, the battery module 200 is located in the radially inner region and the circuit board assembly 300 is located in the radially outer region.

[0058] In another example, the partition protrusion can also extend radially along the housing 100, that is, the partition protrusion extends inward from the inner wall surface of the housing 100 in the radial direction to form a partition arranged axially. In this case, the partition protrusion divides the inner cavity 110 axially into a first region 111 and a second region 112 that are adjacent vertically or front-to-back, with the battery module 200 and the circuit board assembly 300 located in the two regions at different axial positions.

[0059] It should be noted that the partition protrusion can also extend obliquely along the housing 100, that is, the extension direction of the partition protrusion forms an angle with both the axial and circumferential directions of the housing 100. In this case, the partition protrusion divides the inner cavity 110 into a first region 111 and a second region 112 that are obliquely distributed along the extension path of the inner cavity 110, which is suitable for scenarios where the battery module 200 and the circuit board assembly 300 are arranged diagonally in space.

[0060] The housing 100 can have a split structure (which can be manufactured using metal injection molding (MIM) process), and can include a first housing portion (not shown in the figure) and a second housing portion (not shown in the figure), which can be fastened together. The partition protrusion is integrally formed on the inner wall surface of the first housing portion. The advantage of using a split housing 100 structure is that the battery module 200 and the circuit board assembly 300 can be placed on both sides of the partition protrusion before the housing 100 is fastened together, which facilitates the installation and positioning of internal components.

[0061] During assembly, the battery module 200 is first placed on one side of the partition protrusion, and the circuit board assembly 300 is placed on the other side of the partition protrusion. Then, the second housing part is fastened to the first housing part to form a complete housing 100. After fastening, the periphery of the partition protrusion fits against the inner wall surface of the second housing part, achieving a sealed separation between the first region 111 and the second region 112.

[0062] Understandably, the partition protrusion eliminates the need for additional barrier 410, resulting in a simpler structure and better assembly.

[0063] In addition, the partition protrusion can be a ring protrusion, a partition plate, or a stepped structure, and the specific design can be made according to different structures.

[0064] To facilitate electrical connection between the battery module 200 and the circuit board assembly 300, a wiring channel can be pre-set on the partition protrusion. The wiring channel can be formed during the molding of the first housing part, for example, by creating a notch or through hole at the base of the partition protrusion. After the electrical connection is completed, the wiring channel can be sealed with sealant.

[0065] Similarly, a buffer 600 can also be provided in the first region 111, sandwiched between the battery module 200 and the inner wall of the housing 100, to provide vibration cushioning and expansion space. The buffer 600 can be pre-installed in the first region 111 before the battery module 200 is placed, or it can be directly pasted onto the surface of the battery module 200 and installed together.

[0066] Example 3 The process involves using a placeholder mold (not shown in the figure) and removing the mold after the sealing filling medium 500 has cured. In the final product, the sealing component 400 is not a solid barrier, but rather consists of an interface, step, or trace of material density change left after the placeholder mold is removed. This interface is located between the first region 111 and the second region 112 and is in contact with the inner wall surface of the housing 100 (due to the mold adhering to the inner wall during curing, a tight contact surface is formed).

[0067] A portion of the circuit board assembly 300 is located within the second region 112 and is covered by a sealing filling medium 500. The battery module 200 is located within the first region 111. The first region 111 and the second region 112 are naturally separated by the end face of the curing medium. This boundary serves as a sealing and isolation function equivalent to a solid barrier.

[0068] Since the battery module 200 is installed after the sealing filling medium 500 has cured and the placeholder mold has been removed, the installation path of the battery module 200 is not obstructed by the barrier. After the battery module 200 is installed in the first area 111, it is electrically connected to the circuit board assembly 300 via wires or flexible ribbon cables. To facilitate electrical connection, connection terminals can be reserved on the circuit board assembly 300 or a section of ribbon cable can be extended for soldering or plugging after the battery module 200 is installed.

[0069] It should be noted that the placeholder mold can be a removable temporary component such as a Teflon block, a soluble core mold, or a metal core puller. After the sealing filling medium 500 is cured, the placeholder mold can be removed by means of heating to dissolve or mechanical extraction to form a cavity structure, and then the battery module 200 is placed in the cavity structure.

[0070] To protect the battery module 200, a buffer 600 can be provided within the first region 111 before or after the battery module 200 is installed. For example, before the battery module 200 is installed, a piece of foam or silicone pad can be attached to the inner wall of the housing 100 in the first region 111. After the battery module 200 is installed, the buffer 600 is clamped between the battery module 200 and the housing 100. Buffers 600 can also be provided on both sides of the battery module 200.

[0071] The housing 100 can be a single-piece structure or a separate structure to facilitate the placement of the circuit board assembly 300 and the spacer mold. If a separate structure is used, the internal components can be placed before fastening, referring to the description of the separate structure above.

[0072] Understandably, using a spacer mold makes the cavity structure regular in shape, which is most suitable for the battery module 200, and the resin encapsulation can be completed in one go.

[0073] Example 4 See Figure 5 As shown, the sealing assembly 400 is a pre-installed partition 420. The pre-installed partition 420 is located between the first region 111 and the second region 112, and is installed in the inner cavity 110 before the sealing filling medium 500. The pre-installed partition 420 can be formed from a first sealing medium that is injected and cured first, which can be the same or different material from the subsequently injected second sealing medium (i.e., the sealing filling medium 500). The periphery of the pre-installed partition 420 is in contact with the inner wall surface of the housing 100, and its position can be predetermined according to the layout of the battery module 200 and the circuit board assembly 300.

[0074] It should be noted that a glue injection port is provided on the housing 100 at the position corresponding to the second region 112. The second sealing medium is injected into the second region 112 through the glue injection port and, after curing, covers the second part of the circuit board assembly 300. The second sealing medium at the glue injection port is flush with the outer surface of the housing 100 after being leveled. This arrangement allows for direct glue injection using the existing glue injection port on the housing 100, eliminating the need for additional glue injection channels and simplifying the encapsulation process. Furthermore, the leveling process ensures that the surface of the sealing medium 500 at the glue injection port is flush with the inner surface of the housing 100, reducing discomfort that may be caused by material protrusions or depressions at the glue injection port. It also ensures the flatness and appearance consistency of the inner surface of the housing 100, reducing pressure or friction on the user's skin during long-term wear due to local unevenness.

[0075] To facilitate the passage of the circuit board assembly 300 into the second region 112, a pre-set wiring channel can be pre-installed on the pre-set partition 420. The wiring channel can be formed by: placing a removable mandrel at a predetermined position before injecting the first sealing medium; removing the mandrel after the first sealing medium has cured, thus forming the wiring channel; or by machining through holes or notches into the pre-set partition 420 after it has cured. The battery module 200 and the first part of the circuit board assembly 300 can be located on the same side of the pre-set partition 420 (i.e., within the first region 111) and electrically connected. The second part of the circuit board assembly 300 passes through the wiring channel into the second region 112. After the electrical connection is completed, if there are gaps in the wiring channel, they can be sealed with sealant to maintain the regional isolation effect.

[0076] A buffer 600 can also be provided within the first region 111. The buffer 600 can be pre-placed within the first region 111 before the battery module 200 is installed, or it can be attached to the surface of the battery module 200 and installed together. The specific arrangement of the buffer 600 can be referred to the aforementioned embodiment.

[0077] The housing 100 can be a one-piece structure. Since the battery module 200 and the circuit board assembly 300 are both installed into the inner cavity 110 before or after the pre-placed partition 420 is formed, and the pre-placed partition 420 is formed by injecting a liquid medium and then solidifying, there is no need to reserve space for fastening. Therefore, the one-piece housing 100 can meet the assembly requirements. Of course, if space is limited or assembly needs to be simplified, the housing 100 can also adopt a split structure.

[0078] This application also provides various packaging methods for wearable devices, corresponding to the manufacturing processes of the above-described structural embodiments. The following is a detailed description with reference to the accompanying drawings and flowcharts.

[0079] When the corresponding sealing assembly 400 is a separately configured barrier element 410, see [reference needed]. Figure 6 As shown, its packaging method includes the following steps: Step S11, provide housing 100, housing 100 having an inner cavity 110.

[0080] The housing 100 can be annular or C-shaped, and has an internal cavity 110 extending circumferentially. A glue injection port is provided on the housing 100, penetrating the wall thickness of the housing 100, and its location corresponds to the subsequently formed second region 112. The housing 100 can be made of metal (such as titanium alloy, stainless steel), engineering plastic, or ceramic. The cross-sectional shape of the internal cavity 110 can be rectangular, circular, or irregular, and its inner wall surface can be pre-machined with grooves or positioning steps for positioning the blocking member 410.

[0081] Step S12: Place the battery module 200 and circuit board assembly 300 into the inner cavity 110.

[0082] The battery module 200 and circuit board assembly 300 are placed into the inner cavity 110. The battery module 200 can be selected as an arc-shaped soft-pack lithium battery, a solid-state battery, or a supercapacitor, and its curvature matches the curvature of the inner wall of the housing 100. The circuit board assembly 300 may include a flexible circuit board (FPC) and electronic components soldered thereon, such as Bluetooth chips, sensors, antennas, etc. The circuit board assembly 300 can be divided along its length into a first part (the end area near the battery module 200, used for electrical connection) and a second part (the main body area away from the battery module 200, to be sealed and encapsulated). During placement, the battery module 200 and the first part of the circuit board assembly 300 are adjacent to or in contact with each other to facilitate subsequent electrical connection. The two can be arranged sequentially along the extension direction of the inner cavity 110, or other relative positional relationships can be adopted according to the shape of the housing 100.

[0083] Step S13: Insert the barrier 410 and place it into the inner cavity 110.

[0084] A barrier element 410 is provided, which is a component manufactured independently of the housing 100. The material can be silicone, rubber, plastic, or metal, and a material with a certain degree of elasticity is used to enhance the sealing fit. A trace channel is formed on the barrier element 410. The trace channel can be a through-hole extending through the thickness direction of the barrier element 410, or a notch extending inward from the edge of the barrier element 410. The cross-sectional shape and size of the trace channel are adapted to the corresponding section cross-section of the circuit board assembly 300 to allow the circuit board assembly 300 to pass through with minimal gaps.

[0085] During assembly, the second part of the circuit board assembly 300 (i.e., the section away from the battery module 200) is first passed through the wiring channel from one side of the barrier 410, so that it extends out from the other side of the barrier 410. At this time, the battery module 200 and the first part of the circuit board assembly 300 are located on the same side of the barrier 410, and the second part of the circuit board assembly 300 is located on the other side of the barrier 410.

[0086] Subsequently, the barrier 410, through which the circuit board assembly 300 is inserted, is placed entirely into the inner cavity 110 of the housing 100 and pushed to a predetermined position. This predetermined position is located between the battery module 200 and the second part of the circuit board assembly 300. The periphery of the barrier 410 is tightly fitted to the inner wall surface of the housing 100 through an interference fit. If the inner wall surface of the housing 100 is provided with a groove, the edge of the barrier 410 is embedded in the groove to enhance axial positioning and sealing effect.

[0087] Thus, the barrier 410 divides the inner cavity 110 into a first region 111 and a second region 112. The first portion of the battery module 200 and the circuit board assembly 300 is located in the first region 111, and the second portion of the circuit board assembly 300 is located in the second region 112.

[0088] It is understood that after the barrier 410 is placed in the inner cavity 110, the process may also include electrically connecting the battery module 200 and the circuit board assembly 300, that is, within the first region 111, electrically connecting the positive and negative terminals of the battery module 200 to the corresponding pads of the first part of the circuit board assembly 300. The connection method may be laser spot welding, ultrasonic welding, or conductive adhesive bonding. This step may also be completed in advance in step S12, that is, the electrical connection is completed before or after the battery module 200 and the circuit board assembly 300 are placed into the inner cavity 110, and before the barrier 410 is placed in.

[0089] In addition, before injecting the sealing filling medium 500, check whether there are any unfilled gaps in the wiring channels. If so, inject a small amount of sealant (such as UV glue or silicone) into the gaps and allow it to cure to further ensure the sealing and isolation between the first region 111 and the second region 112.

[0090] Step S14: Inject sealing filling medium 500 into the second region 112.

[0091] Secure the housing 100 to the dispensing fixture with the dispensing port facing upwards or in a position conducive to dispensing. Use a dispensing machine or dispensing pump to inject flowing sealing filler medium 500 into the second region 112. The sealing filler medium 500 can be a flowable and curable material such as hot melt adhesive, UV-curable adhesive, epoxy resin, or silicone sealant. The amount of dispensing should be sufficient to fill the second region 112 and completely submerge the second part of the circuit board assembly 300 located within it. During dispensing, the barrier 410 adheres to the inner wall of the housing 100, preventing the sealing filler medium 500 from flowing into the first region 111. If a small amount of medium seeps into the gap between the wiring channel and the circuit board assembly 300, it can be addressed in subsequent steps.

[0092] Step S15: Curing of the sealing and filling medium at 500°C.

[0093] Based on the material properties of the sealing filler medium 500, an appropriate curing method is used to cure it. For example, UV curing adhesives are cured by ultraviolet light irradiation, hot melt adhesives are cured by cooling, and thermosetting resins are cured by heating. After curing, the sealing filler medium 500 forms a solid encapsulation that tightly wraps the second part of the circuit board assembly 300 located in the second region 112, achieving waterproof, dustproof, and vibration-resistant protection.

[0094] After the sealing filler medium 500 has cured, if there is excess sealing filler medium overflowing or recessed at the injection port, the overflowing part can be removed by scraping or grinding, or the recessed part can be filled with glue to make the surface of the sealing filler medium 500 at the injection port flush with or smoothly transition to the corresponding surface of the shell 100. For the annular shell 100, the injection port can be processed to smoothly transition with the inner or outer arc surface to ensure wearing comfort and aesthetic integrity.

[0095] It is worth mentioning that, before or after placing the battery module 200 into the first region 111, a buffer member 600 can be attached to the inner wall of the housing 100 in the first region 111, or the buffer member 600 can be fitted onto the surface of the battery module 200. The buffer member 600 can be made of foam, silicone pads, or spring sheets. After the battery module 200 is installed in the first region 111, the buffer member 600 is clamped between the battery module 200 and the inner wall of the housing 100, serving to absorb vibration and provide buffer space for battery expansion.

[0096] After the above encapsulation is completed, the barrier 410 remains in the inner cavity 110 after the encapsulation is completed, becoming part of the internal structure of the wearable device.

[0097] When the corresponding sealing component 400 is a partition protrusion, see Figure 7 As shown, its encapsulation method may include the following steps: Step S21: Provide a split housing component.

[0098] A first housing portion and a second housing portion are provided, which, when fastened together, form a complete housing 100. An inwardly protruding partition protrusion is integrally formed on the inner wall surface of the first housing portion. The partition protrusion and the first housing portion are made of the same material and integrally formed by processes such as injection molding, casting, or stamping. The partition protrusion extends along the inner wall surface of the first housing portion, and its extension direction can be designed axially, circumferentially, or radially according to the layout of the battery module 200 and the circuit board assembly 300 (see the above description of the structure for details). A wiring channel is pre-set on the partition protrusion, such as a notch opened at the root of the partition protrusion or a through hole penetrating the thickness direction of the partition protrusion. Positioning pins, snap-fit ​​devices, or guide structures can be provided on the fastening surfaces of the first housing portion and the second housing portion to ensure fastening accuracy.

[0099] Step S22: Place the battery module 200 and the circuit board assembly 300.

[0100] The battery module 200 and the circuit board assembly 300 are respectively placed on both sides of the partition protrusion. For example, the battery module 200 is placed on one side of the partition protrusion (later forming the first area 111), and the circuit board assembly 300 is placed entirely on the other side of the partition protrusion (later forming the second area 112). During placement, a small amount of adhesive can be applied to a predetermined position on the inner wall of the first housing portion or a positioning groove can be provided to temporarily fix the battery module 200 and the circuit board assembly 300 and prevent displacement during subsequent fastening.

[0101] Step S23: Electrically connect the battery module 200 and the circuit board assembly 300.

[0102] The battery module 200 and the circuit board assembly 300 are electrically connected. Since they are located on opposite sides of the partition protrusion, the electrical connection can be achieved by a conductive element bridging the partition protrusion. For example, a wiring channel is pre-set on the partition protrusion, and the wires or flexible cables connecting the battery module 200 and the circuit board assembly 300 are passed through the wiring channel and soldered or plugged into the tabs of the battery module 200 and the pads of the circuit board assembly 300 at both ends, respectively. This electrical connection step can be completed after the parts are placed in step S22 and before the housing 100 is fastened, or it can be completed through a reserved operation window after the housing 100 is fastened in step S24.

[0103] Step S24, snap the housing 100 together.

[0104] The second housing portion is aligned and fastened to the first housing portion to form a closed housing 100. After fastening, an inner cavity 110 is formed inside the housing 100. The top edge of the partition protrusion is in contact with the inner wall surface of the second housing portion, thereby completely dividing the inner cavity 110 into a first region 111 and a second region 112. The battery module 200 is located in the first region 111, and the circuit board assembly 300 is located in the second region 112. The fastening method can be snap-fit, screw locking, or laser welding, etc.

[0105] Step S25: Inject sealing filling medium 500 into the second region 112.

[0106] Flowing sealing and filling medium 500 is injected into the second region 112 through a pre-drilled injection port or opening on the housing 100. The injection port may be located on the second housing portion corresponding to the second region 112. The amount of adhesive injected is sufficient to fill the second region 112 and immerse the circuit board assembly 300. The partition protrusion's contact with the second housing portion prevents the medium from flowing into the first region 111.

[0107] Step S26: Curing and sealing the filling medium 500.

[0108] Based on the material properties of the sealing filler medium 500, it is cured in an appropriate manner. After curing, the sealing filler medium 500 forms a solid encapsulation that tightly wraps the circuit board assembly 300 located in the second region 112.

[0109] Understandably, if a gap still exists between the first area 111 and the second area 112 after electrical connection and glue injection on the wiring channel on the partition protrusion, sealant can be injected to seal it and ensure the area isolation effect.

[0110] In addition, before or after placing the battery module 200, a buffer 600 is provided on the inner wall surface of the first region 111 or the surface of the battery module 200, so that it is sandwiched between the two after the battery module 200 is installed.

[0111] For the corresponding temporary mold solution, please refer to [link / reference]. Figure 8 As shown, its packaging method includes the following steps: Step S31, provide housing 100.

[0112] A housing 100 is provided, which is annular or C-shaped and has an internal cavity 110 extending circumferentially therein. A glue injection port is provided on the housing 100, the position of which corresponds to a subsequently formed second region 112. The housing 100 can be an integral annular structure, with an opening at one end or on one sidewall for internal parts to be inserted. The inner wall surface of the housing 100 is smooth or has positioning features.

[0113] Step S32: Insert the circuit board assembly 300.

[0114] The circuit board assembly 300 is inserted into the inner cavity 110 through the opening of the housing 100 and pushed to a predetermined position. The circuit board assembly 300 has pre-drilled connection terminals for electrical connection with the battery module 200, or a flexible ribbon cable extends from the circuit board assembly 300, with the free end of the cable located near the area where the battery module 200 will be installed. The circuit board assembly 300 can be temporarily fixed within the housing 100 by means of slots, adhesive bonding, or interference fit.

[0115] Step S33: Insert the placeholder mold.

[0116] A placeholder mold is provided, the outer contour of which is substantially the same as or slightly larger than the shape and size of the battery module 200, to occupy the space where the battery module 200 should be during subsequent glue injection. The placeholder mold can be made of metal or plastic, and its surface can be coated with a release agent or mold release agent to facilitate demolding after curing. Alternatively, the placeholder mold can be made of a soluble material and subsequently removed by dissolving.

[0117] The placeholder mold is inserted into the inner cavity 110 through the opening of the housing 100 and pushed to the predetermined installation position of the battery module 200. The periphery of the placeholder mold fits against the inner wall of the housing 100 to occupy the first space in the inner cavity 110. At this time, the area in the inner cavity 110 other than the first space is the second region 112, and a part of the circuit board assembly 300 is located in the second region 112.

[0118] Step S34: Inject 500 units of sealing filling medium.

[0119] The housing 100 is fixed to the dispensing fixture, with the dispensing port positioned for easy dispensing. Flowing sealing and filling medium 500 is injected into the second region 112 through the dispensing port until the medium fills the second region 112 and covers the circuit board assembly 300. During the dispensing process, the fit between the spacer mold and the inner wall of the housing 100 prevents the medium from flowing into the first space.

[0120] Step S35: Curing and sealing the filling medium 500.

[0121] The sealing filler medium 500 is cured according to its material properties. After curing, the sealing filler medium 500 forms a solid encapsulation that tightly wraps around the circuit board assembly 300 and forms a tight interface with the end face of the locating mold.

[0122] After the sealing filler medium 500 has cured and before removing the placeholder mold, the sealing filler medium at the injection port should be leveled so that its surface is flush with the corresponding surface of the housing 100. Leveling can also be performed after removing the placeholder mold and installing the battery.

[0123] Step S36: Remove the placeholder mold.

[0124] After the sealing filling medium 500 has completely cured, the placeholder mold is removed. If the placeholder mold is made of a demoldable material, it is pulled out or pried out of the housing 100 using a tool. After removal, the aforementioned first space is freed up in the inner cavity 110, which is the first region 111 for accommodating the battery module 200. The end face of the cured sealing filling medium 500 and the inner wall of the housing 100 together define the boundary of the first region 111, and this end face constitutes the sealing assembly 400.

[0125] Step S37: Install the battery module 200 and connect it electrically.

[0126] The battery module 200 is inserted into the first region 111 through the opening in the housing 100. The tabs of the battery module 200 are aligned with the connection terminals or flexible cables reserved in the circuit board assembly 300, and electrical connection is achieved by soldering or plugging.

[0127] It is worth mentioning that, before or after the battery module 200 is installed, a buffer 600 is attached to the inner wall of the first region 111, or a buffer 600 is covered on the surface of the battery module 200, so that it is sandwiched between the battery module 200 and the housing 100 after installation.

[0128] In addition, if the opening of the housing 100 remains open after the battery module 200 is installed, the opening can be sealed with an end cap or sealant to complete the overall encapsulation.

[0129] The corresponding scheme involves injecting the first sealing medium at a predetermined location; see [link / reference]. Figure 9 As shown, its encapsulation method may include the following steps: Step S41, provide housing 100.

[0130] The housing 100 is annular or C-shaped, and has an inner cavity 110 extending circumferentially therein. A glue injection port is provided on the housing 100, the position of which corresponds to the subsequently formed second region 112. The housing 100 can be an integral annular structure, and its inner wall surface has markings or structures for positioning the battery module 200 and the circuit board assembly 300.

[0131] Step S42: Insert the battery module 200 and the circuit board assembly 300.

[0132] The battery module 200 and circuit board assembly 300 are placed into the inner cavity 110. During placement, the first part (connection end) of the battery module 200 and the circuit board assembly 300 are close to each other, located in a first preset area in the inner cavity 110; the second part of the circuit board assembly 300 extends from the first part and is located in a second preset area adjacent to the first preset area. A certain gap can be maintained between the two, which is the predetermined position for the subsequent formation of the pre-installed partition 420. For easy positioning, it can be temporarily fixed by means of a clamp or a positioning groove on the inner wall of the housing 100.

[0133] Step S43, forming the pre-installed partition 420 (first injection of adhesive).

[0134] A first sealing medium is injected into a predetermined position within the inner cavity 110 between the battery module 200 and the second part of the circuit board assembly 300. The first sealing medium may be the same as or a different material from the subsequent sealing filling medium 500. The adhesive can be precisely applied to the predetermined position using a dispensing needle, allowing the first sealing medium to flow and fill the gap between the second part of the circuit board assembly 300 and the inner wall of the housing 100 before curing, with its periphery contacting the inner wall surface of the housing 100.

[0135] Subsequently, the first sealing medium is cured using a suitable method to form a solid pre-placed partition 420. The pre-placed partition 420 divides the inner cavity 110 into a first region 111 that accommodates the battery module 200 and the first part of the circuit board assembly 300, and a second region 112 that accommodates the second part of the circuit board assembly 300. The periphery of the pre-placed partition 420 is tightly fitted to the inner wall surface of the housing 100 to form a seal.

[0136] To facilitate the entry of the second portion of the circuit board assembly 300 from the first region 111 into the second region 112, a wiring channel can be reserved during the formation of the pre-installed partition 420. The reservation method includes: placing a removable molding mandrel at a predetermined position before adhesive injection, and removing the mandrel after the first sealing medium has cured to form a through hole; or, after the pre-installed partition 420 has cured, creating the wiring channel through machining. The second portion of the circuit board assembly 300 extends from the first region 111 into the second region 112 via this wiring channel.

[0137] Step S44: Electrically connect the battery module 200 and the circuit board assembly 300.

[0138] Within the first region 111, the tabs of the battery module 200 are electrically connected to the corresponding pads of the first part of the circuit board assembly 300. This step can be completed after step S42 and before step S43, or after the pre-formed partition 420 is formed in step S43.

[0139] Step S45: Inject the second sealing medium into the second region 112.

[0140] A flowing second sealing medium (i.e., sealing filler medium 500) is injected into the second region 112 through the injection port. The second sealing medium fills the second region 112, immersing the second portion of the circuit board assembly 300. A pre-positioned partition 420 prevents the second sealing medium from flowing into the first region 111.

[0141] Step S46: Curing the second sealing medium.

[0142] The second sealing medium is cured to form a protective coating on the second part of the circuit board assembly 300.

[0143] It should be noted that after the second sealing medium has cured, the sealing filling medium at the injection port is leveled so that its surface is flush with the corresponding surface of the housing 100.

[0144] Understandably, if there are gaps in the wiring channels, sealant can be injected to seal them and ensure area isolation.

[0145] In addition, before or after the battery module 200 is placed into the first region 111, a buffer 600 is provided between the battery module 200 and the inner wall of the housing 100.

[0146] This application divides the inner cavity 110 of the housing 100 into a first region 111 that accommodates the battery module 200 and a second region 112 that accommodates at least a portion of the circuit board assembly 300 by providing a sealing component 400 within the inner cavity 110. The sealing filling medium 500 is confined within the second region 112, providing waterproof, dustproof, and vibration-resistant sealing protection to the portion of the circuit board assembly 300 located within the second region 112, while the first region 111 containing the battery module 200 remains open without any sealing medium. This structure, on the one hand, allows the battery module 200 to be unconstrained by the sealing medium, facilitating independent disassembly and maintenance; on the other hand, it provides free space for the volume expansion of the battery module 200 during charging, discharging, or temperature changes, effectively releasing internal stress, improving battery cycle life and safety, and achieving a balance between circuit protection performance and battery maintainability.

[0147] In the description of this specification, references to terms such as "some embodiments," "exemplarily," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0148] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and description of this application should fall within the scope of this patent application.

Claims

1. A wearable device, comprising: include: The shell has an internal cavity; The battery module is disposed in the inner cavity; A circuit board assembly electrically connected to the battery module, and at least a portion of the circuit board assembly extends outside the area where the battery module is located; A sealing assembly divides the inner cavity into a first region and a second region, wherein the battery module is located in the first region, at least a portion of the circuit board assembly is located in the second region, and the second region is filled with a sealing filling medium to cover the circuit board assembly within the second region.

2. The wearable device of claim 1, wherein, The sealing component is a barrier element, and the periphery of the barrier element is in interference fit with the inner wall surface of the housing.

3. The wearable device according to claim 2, characterized in that, The inner wall of the housing is provided with a slot, and the barrier is embedded in the slot.

4. The wearable device according to claim 1, characterized in that, The sealing assembly is an integrally formed partition protrusion on the inner wall surface of the housing, which extends inward and divides the inner cavity into the first region and the second region.

5. The wearable device according to claim 1, characterized in that, The sealing assembly is a pre-installed partition, which is a separate structure from the sealing filling medium, and the pre-installed partition is located between the first region and the second region.

6. The wearable device according to any one of claims 1 to 5, characterized in that, At least one buffer is provided in the first area, and the buffer is located between the battery module and the inner wall of the housing.

7. A packaging method for a wearable device, characterized in that, Includes the following steps: A housing is provided, the housing being annular and having an inner cavity, and an injection port is provided on the housing; The battery module and circuit board assembly are placed into the cavity; A barrier is provided and placed in the inner cavity. The periphery of the barrier is attached to the inner wall surface of the housing to divide the inner cavity into a first region and a second region. A portion of the battery module and the circuit board assembly are located in the first region, and another portion of the circuit board assembly is located in the second region. The injection port is connected to the second region. A sealing and filling medium is injected into the second region through the injection port; The sealing filler medium is cured to cover the circuit board assembly located in the second region; The overflowing sealing filler at the injection port is leveled so that the overflowing sealing filler is flush with the inner surface of the housing.

8. A packaging method for a wearable device, characterized in that, Includes the following steps: A first housing portion is provided, wherein an inwardly protruding partition protrusion is integrally formed on the inner wall surface of the first housing portion; The battery module is disposed on one side of the partition protrusion of the first housing portion, and the circuit board assembly is at least partially disposed on the other side of the partition protrusion of the first housing portion. Electrically connect the battery module and the circuit board assembly; Inject potting compound into the area on the other side where the battery module is not located to cure the circuit board assembly; The second housing portion is coupled to the first housing portion to seal the circuit board assembly and the battery module.

9. A packaging method for a wearable device, characterized in that, Includes the following steps: A housing is provided, the housing having an internal cavity; Place the circuit board assembly into the cavity; A spacer mold is provided, and the spacer mold is placed into the inner cavity. The spacer mold occupies a first space in the inner cavity, and the periphery of the spacer mold is in contact with the inner wall surface of the shell. Inject a sealing filling medium into the area of ​​the inner cavity other than the first space; The sealing filler medium is cured to encapsulate the circuit board assembly; Remove the placeholder mold to form the first region; The battery module is placed in the first area and electrically connected to the circuit board assembly.

10. A packaging method for a wearable device, characterized in that, Includes the following steps: A housing is provided, the housing having an internal cavity; The battery module and circuit board assembly are housed within the cavity; A first sealing medium is injected into a predetermined position in the inner cavity and the first sealing medium is cured to form a pre-placed partition. The pre-placed partition divides the inner cavity into a first region for accommodating the battery module and a second region for accommodating at least a portion of the circuit board assembly, and the periphery of the pre-placed partition is in contact with the inner wall surface of the housing. Inject the second sealing medium into the second region; The second sealing medium is cured to cover the circuit board assembly located in the second region.

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