Method of manufacturing a ring

Abstract

The application relates to a manufacturing method of a ring, comprising the following steps: constructing a ring with a partial outer wall and a partial inner wall in the radial direction, forming a first mounting space along the bending direction of the partial inner wall, forming a second mounting space along the bending direction of the partial inner wall, and making the first mounting space and the second mounting space communicate with each other, and finally filling the first mounting space and the second mounting space with a sealing material. The ring manufactured by the method can accommodate different electronic components in the first mounting space and the second mounting space when the ring needs to accommodate electronic components, the first mounting space and the second mounting space combine the partial outer wall and the partial inner wall to position the electronic components, and the assembly of the ring is simplified.

Description

Technical Field

[0001] This application relates to the field of wearable device technology, and in particular to a method for manufacturing a ring. Background Technology

[0002] Smart rings, as an emerging wearable device, are gradually gaining market favor due to their features such as being imperceptible to wear and enabling 24-hour health monitoring. Most smart rings in this technology consist of a structure that assembles core electronic components such as batteries, motherboards, and NFC into a ring-shaped metal casing.

[0003] Currently, the main body of smart rings is composed of a metal inner and outer shell. The assembly method is to first assemble core electronic components such as batteries, motherboards, and NFC into the inner or outer shell, and then assemble the outer or inner shell. This main structure is not convenient for positioning electronic components and soldering operations between electronic components, which affects production efficiency and product assembly yield. Summary of the Invention

[0004] Based on this, the purpose of this application is to provide a method for manufacturing a ring to facilitate the positioning and assembly of electronic components.

[0005] According to one aspect of this application, a method for manufacturing a ring is provided, comprising the following steps:

[0006] Construct a ring with a radially distributed outer wall and a radially distributed inner wall, and...

[0007] A first mounting space is formed by extending along the curvature direction of the outer wall of the portion, and a second mounting space is formed by extending along the curvature direction of the inner wall of the portion, such that the first mounting space and the second mounting space are interconnected.

[0008] The potting material should be applied to fill at least the first mounting space and the second mounting space.

[0009] In one embodiment, when forming the first mounting space and the second mounting space, the first mounting space and the second mounting space are offset in the circumferential direction of the ring.

[0010] In one embodiment, before applying the potting material to at least fill the first mounting space and the second mounting space, a battery is installed in one of the first mounting space and the second mounting space, an electronic component is installed in the other of the first mounting space and the second mounting space, and the battery is electrically connected to the electronic component.

[0011] In one embodiment, prior to installing the battery or the electronic component, a support component for supporting the battery or the electronic component is installed within the first mounting space or the second mounting space.

[0012] In one embodiment, the method further includes the operation of mounting a communication component in the first mounting space or the second mounting space, and electrically connecting the communication component to the battery and the electronic components.

[0013] In one embodiment, after the communication component is attached to one side of the battery along its thickness direction and the two are electrically connected, the two are installed in the first mounting space or the second mounting space.

[0014] In one embodiment, when the potting material is applied to at least fill the first mounting space and the second mounting space, the potting material is applied to cover the battery, the electronic components, and the communication components.

[0015] In one embodiment, the method further includes forming a light-transmitting hole in the outer wall or the inner wall of the portion.

[0016] In one embodiment, the electronic component is installed such that it covers the light-transmitting hole.

[0017] In one embodiment, the ring is made of metal or a metal alloy, and / or the potting material is a transparent resin.

[0018] The aforementioned ring manufacturing method involves constructing a ring with a radially distributed outer wall and a radially distributed inner wall. A first mounting space is formed by extending along the curvature of the outer wall, and a second mounting space is formed by extending along the curvature of the inner wall. The first and second mounting spaces are interconnected, resulting in a ring with a hollow structure. When electronic components need to be installed inside, the battery and electronic components can be respectively installed into the first and second mounting spaces, facilitating installation. Furthermore, the first and second mounting spaces form a spatial limit, facilitating the positioning of electronic components. The hollow structure also facilitates the soldering of the battery and electronic components. After assembly, the ring can be directly encapsulated with glue, making assembly convenient. Attached Figure Description

[0019] Figure 1 A schematic diagram of the structure of the ring constructed in the ring manufacturing method provided in an embodiment of this application. Figure 1 .

[0020] Figure 2 An exploded view (unsealed) of a ring manufactured by the ring manufacturing method provided in an embodiment of this application.

[0021] Figure 3 A schematic diagram of the structure of a ring manufactured by the ring manufacturing method provided in an embodiment of this application. Figure 1 (Unsealed).

[0022] Figure 4 This is a schematic diagram illustrating the assembly of a communication component and a battery into a single unit in a ring manufacturing method provided in an embodiment of this application.

[0023] Figure 5 This is a schematic diagram illustrating the process of installing a ring, comprising a communication component and a battery, into a ring in a method for manufacturing a ring according to an embodiment of this application.

[0024] Figure 6 This is a schematic diagram illustrating the installation of electronic components into a ring in a method for manufacturing a ring according to an embodiment of this application.

[0025] Figure 7 A schematic diagram of the structure of a ring manufactured by a ring manufacturing method provided in another embodiment of this application. Figure 1 (Unsealed).

[0026] Figure 8 An exploded view (unsealed) of a ring manufactured by a ring manufacturing method provided in another embodiment of this application.

[0027] Figure 9 A cross-sectional view (unsealed) of a ring manufactured by a ring manufacturing method provided in an embodiment of this application.

[0028] Figure 10 A schematic diagram of the structure of the ring constructed in the ring manufacturing method provided in an embodiment of this application. Figure 2 .

[0029] Figure 11 A side view of a ring constructed in a ring manufacturing method provided in an embodiment of this application.

[0030] Figure 12 This is a schematic diagram of the electronic components used in a ring manufacturing method provided in an embodiment of this application.

[0031] Figure 13 A schematic diagram of the structure of a ring manufactured by the ring manufacturing method provided in an embodiment of this application. Figure 2 (Unsealed).

[0032] Figure 14 for Figure 10 An enlarged schematic diagram of region A in the middle.

[0033] Figure 15 for Figure 13 A magnified view of region B in the middle.

[0034] Figure 16 for Figure 8 A magnified view of region C in the middle.

[0035] Figure 17 A schematic diagram of the structure of a ring manufactured by the ring manufacturing method provided in an embodiment of this application. Figure 3 (Unsealed).

[0036] Figure 18 for Figure 17 A magnified diagram of region D in the middle.

[0037] Figure 19 for Figure 7 A magnified view of region E in the middle.

[0038] Figure 20 This is a schematic diagram illustrating the process of potting a ring containing electronic components, a battery, and a communication component in a ring manufacturing method provided in an embodiment of this application.

[0039] Figure 21 A schematic diagram of the structure of a ring manufactured by the ring manufacturing method provided in an embodiment of this application (already sealed).

[0040] Figure 22 A schematic diagram of the structure of a ring manufactured by a ring manufacturing method provided in another embodiment of this application (already sealed).

[0041] Explanation of reference numerals in the attached figures:

[0042] 10. Ring; 100. Finger ring; 101. Part of the outer wall; 102. Part of the inner wall; 1021. Plane; 103. First mounting space; 104. Second mounting space; 105. Connecting hole; 106. Supporting structure; 1061. Bearing component; 1061a. Bearing rib; 1061b. Stepped surface; 107. Light-transmitting hole; 200. Electronic component; 210. Main circuit board; 211. Optical sensing element; 220. Sub-circuit board; 230. Flexible flat cable; 300. Battery; 400. Communication component; 500. Encapsulating material. Detailed Implementation

[0043] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0044] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0045] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0046] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0047] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0048] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0049] One embodiment of this application provides a method for manufacturing a ring. The ring manufactured by this method is worn on a user's finger for decoration and aesthetic purposes. It also enables 24-hour intelligent health monitoring and auxiliary functions such as payment and card swiping.

[0050] According to the manufacturing method provided in this application, firstly construct a... Figure 1 The ring 100 shown serves as the skeleton of the ring 10, has a ring-shaped structure, and is made of metal or metal alloy, such as titanium alloy or stainless steel, which makes it have high strength and is not easily deformed.

[0051] Please continue reading. Figure 1 The ring 100 has a partial outer wall 101 and a partial inner wall 102 in its radial direction. The partial inner wall 102 is an annular surface that is closer to the central axis of the ring 100 in the radial direction and is used to contact the user's finger. The partial outer wall 101 is an annular surface that is farther from the central axis in the radial direction of the ring 100.

[0052] In the embodiments of this application, when constructing the ring 100, a first mounting space 103 is formed by extending along the bending direction of a portion of the outer wall 101, and a second mounting space 104 is formed by extending along the bending direction of a portion of the inner wall 102. The first mounting space 103 and the second mounting space 104 are interconnected to accommodate electronic components that are subsequently installed.

[0053] It should be noted that during the construction of ring 100, the basic dimensional accuracy of ring 100, such as inner diameter, outer diameter, and wall thickness, must be ensured to facilitate subsequent wearing and assembly. CNC turning, metal injection molding, or 3D printing can be used to construct ring 100.

[0054] Furthermore, considering the need to optimize the connection paths of electronic components, in a preferred embodiment, the first mounting space 103 and the second mounting space 104 are not arranged radially opposite each other in the ring 100, but are offset in the circumferential direction of the ring 100, making the ring 100 a hollow structure. For example, the first mounting space 103 can occupy half of the space of the ring 100, while the second mounting space 104 occupies the other half. This design of offsetting the first mounting space 103 and the second mounting space 104 can maximize the use of the arcuate space of the ring 100, avoid the first mounting space 103 and the second mounting space 104 from interfering with each other radially, thereby allowing larger electronic components to be accommodated within a limited wall thickness.

[0055] Furthermore, based on this staggered arrangement, a connecting hole 105 can be made at the junction of part of the outer wall 101 and part of the inner wall 102, according to design requirements. This connecting hole 105 passes through the first mounting space 103 and the second mounting space 104, thereby enabling the first mounting space 103 and the second mounting space 104 to communicate with each other. The process of making the connecting hole 105 can be micro-hole drilling or laser drilling to ensure smooth hole walls and avoid damage to the wires of electronic components that subsequently pass through.

[0056] After the ring 100 is constructed, the assembly of electronic components begins. In the embodiments of this application, such as... Figure 2 and Figure 3 As shown, the electronic components of the ring 10 include an electronic component 200 and a battery 300, etc. Therefore, the manufacturing method of the ring 10 provided in this application also includes the operation of installing the electronic component 200 and the battery 300, etc., inside the ring 100. Specifically, it includes: installing the battery 300 in one of the first mounting space 103 and the second mounting space 104; and installing the electronic component 200 in the other of the first mounting space 103 and the second mounting space 104.

[0057] More specifically, as an example, electronic component 200 can be installed in the first mounting space 103, and battery 300 can be installed in the second mounting space 104. Please refer to [reference needed]. Figure 2The battery 300 is typically a rechargeable micro lithium-ion battery 300 or a solid-state battery 300, generally in the shape of a flat, arc-shaped sheet to fit the annular structure of the ring 100. When inserting the battery 300, align it with the second mounting space 104 and then place it smoothly inside. Since the bottom and side walls of the second mounting space 104 can limit the position of the battery 300, it can be initially positioned after being placed in the second mounting space 104 and is not easily shaken. If necessary, a small amount of thermally conductive adhesive or double-sided tape can be applied to the back of the battery 300 to temporarily fix it in the second mounting space 104 and prevent displacement during subsequent operations. Of course, in other embodiments, the battery 300 can also be inserted into the first mounting space 103, and the installation steps are the same as those for inserting it into the second mounting space 104, which will not be repeated here.

[0058] After the battery 300 is installed into the second mounting space 104, the next step is to install the electronic component 200 into the first mounting space 103. The electronic component 200 serves as the core control and signal processing unit of the ring 10, and includes a circuit board and sensors and various detection elements integrated on the circuit board. During installation, the electronic component 200 is aligned with the first mounting space 103 and placed smoothly into it. The side walls of the first mounting space 103 also act as a limiting force for the electronic component 200. After installation, the orientation of the electronic component 200 can be checked to ensure it is correct, such as whether its solder pads are facing upwards, to facilitate soldering. Similarly, when the electronic component 200 can be installed into the second mounting space 104, the battery 300 is correspondingly installed into the first mounting space 103. The installation steps for the electronic component 200 into the second mounting space 104 are the same as those for the first mounting space 103, and will not be repeated here.

[0059] Finally, the electrical connection step is performed, which involves electrically connecting the electronic component 200 and the battery 300 to form a power supply circuit. Specifically, a micro soldering tool can be used to pass the wires or metal contacts connecting the positive and negative terminals of the battery 300 through the connection hole 105 and then solder them to the corresponding power pads on the electronic component 200; alternatively, the flexible circuit board extension on the electronic component 200 can be passed through the connection hole 105 and connected to the electrodes of the battery 300. After soldering, it is ensured that the electronic component 200 can obtain the electrical energy required for operation from the battery 300.

[0060] This structure, in which the first mounting space 103 and the second mounting space 104 are staggered along the circumference of the ring 100, has significant advantages: First, this layout facilitates the placement of all electronic components within the ring. When assembling electronic components, the battery 300 and the electronic component 200 can be inserted from the first mounting space 103 and the second mounting space 104 respectively, making installation convenient. Moreover, the hollow structure of the ring 100 facilitates the soldering of the battery 300 and the electronic component 200, making assembly convenient.

[0061] Secondly, the first mounting space 103 and the second mounting space 104 themselves provide precise mechanical positioning for the electronic components 200 and the battery 300, simplifying the alignment work during the assembly process.

[0062] Furthermore, the configuration of the connection hole 105 provides the shortest electrical connection path between the battery 300 and the electronic component 200. This not only reduces the amount of wires used and lowers material costs, but more importantly, it allows this critical electrical connection process to be completed using automated equipment (such as an automatic spot welding machine). Because the welding point is fixed and clearly visible, it avoids the drawbacks of messy wires and difficulty in automated operation during assembly under the traditional structure, greatly improving production efficiency and product consistency.

[0063] Finally, this layout helps to distribute heat, with the heat generated by the battery 300 during operation mainly dissipating towards the inner wall 102, while the heat generated by the electronic components 200 during operation mainly dissipates towards the outer wall 101, improving wearing comfort.

[0064] Furthermore, in order to give ring 10 more functions, such as Figure 4 As shown, the ring 10 also includes a communication component 400, which, under the control of the electronic component 200, enables auxiliary functions beyond health monitoring. For example, the communication component 400 could be an NFC (Near Field Communication) chip for payment, card swiping, and other functions. In use, the user simply wears the ring 10 and brings it close to a payment terminal or door lock to complete the payment or unlock the lock, thus enabling the ring 10 to have multiple functions beyond health monitoring, greatly facilitating user convenience. Therefore, the manufacturing method of the ring 10 also includes installing the communication component 400 in the first mounting space 103 or the second mounting space 104, and electrically connecting the communication component 400 to the battery 300 and the electronic component 200.

[0065] Considering that NFC chips are typically flat and relatively large, and the battery 300 used in the ring 10 is also typically flat, in order to make more efficient use of space, please refer to [the relevant documentation] when installing the communication component 400. Figure 4The communication component 400 can be attached to one side of the battery 300 along its thickness direction and electrically connected. Then, the two can be installed together as a whole in the first mounting space 103 or the second mounting space 104. That is, the battery 300 and the communication component 400 are stacked and can be bonded together by welding or conductive adhesive, so that the battery 300 can also supply power to the communication component 400.

[0066] Thus, by pre-assembling the battery 300 and communication component 400 into a single unit, subsequent assembly processes are greatly simplified, the number of independent operations in confined installation spaces is reduced, and assembly accuracy and efficiency are improved. Furthermore, this stacked structure significantly reduces the axial dimension of the ring 100, eliminating the need for a substantial increase in size to accommodate a large NFC chip, thereby ensuring the overall compactness and aesthetics of the ring 10. Simultaneously, because the communication component 400 is closely attached to the battery 300, the electrical connection path between the two is extremely short, improving connection reliability. It should be noted that the communication component 400 can be attached to either the side of the battery 300 facing the central axis of the ring 100 or the side of the battery 300 facing away from the central axis of the ring 100; this is not limited here.

[0067] In one alternative embodiment, such as Figure 5 As shown, the battery 300 and communication component 400 can be assembled into a single unit and installed in the second mounting space 104; next, as Figure 6 As shown, the electronic component 200 is then inserted into the first mounting space 103 accordingly. Alternatively, it can be done as follows: Figure 7 and Figure 8 As shown, the battery 300 and the communication component 400 are assembled into a single unit and installed in the first mounting space 103, while the electronic component 200 is installed in the second mounting space 104. Alternatively, the battery 300 can be installed in one of the first mounting space 103 and the second mounting space 104, while the electronic component 200 and the communication component 400 are installed together in the other of the first mounting space 103 and the second mounting space 104. No limitation is made here.

[0068] Corresponding to the aforementioned stacked structure of battery 300 and communication component 400, a preferred embodiment of this application also employs a design with dual connection holes 105. Specifically, as... Figure 9 As shown, there are two connection holes 105, which are respectively opened at two locations where the outer wall 101 and the inner wall 102 meet. The battery 300 and the communication component 400 each have an end point that needs to be electrically connected to the electronic component 200.

[0069] Specifically, regarding the process of electrically connecting the electronic component 200 and the battery 300 based on the structure of the aforementioned dual connection holes 105, please refer again to... Figure 9 After the battery 300 and communication component 400 are stacked together and installed in the second mounting space 104, the electronic component 200 is installed in the first mounting space 103. Then, the electrode terminals (or their lead wires) of the battery 300 are passed through one of the connection holes 105 to reach the first mounting space 103 where the electronic component 200 is located. Finally, the electrode terminals are soldered to the corresponding pads on one end of the electronic component 200 to achieve electrical connection. Alternatively, the flexible connection portion at one end of the electronic component 200 can be passed through the connection hole 105 and connected to the battery 300.

[0070] In the process of electrically connecting the communication component 400 and the electronic component 200, the communication interface end of the communication component 400 (e.g., the two leads of the NFC chip) is first passed through another connection hole 105 so that it also reaches the first mounting space 103. Then, these leads are soldered to the corresponding pads on the other end of the electronic component 200 to achieve electrical connection. Similarly, the connection part on the other end of the electronic component 200 can also be connected to the communication component 400 through another connection hole 105.

[0071] This method of connecting at both ends avoids the space congestion and short-circuit risk caused by concentrating all connecting wires in a single connecting hole 105, making the welding path clearer, easier for automated equipment to identify and operate, and significantly improving the operability and electrical safety of the assembly.

[0072] It is worth noting that, considering that the ring 100 is circular and both the first mounting space 103 and the second mounting space 104 extend along the bending direction, in order to avoid damage caused by bending of the electronic component 200 or the battery 300 after it is installed in the first mounting space 103 or the second mounting space 104, this application further includes the operation of installing a support component 1061 for supporting the battery 300 or the electronic component 200 in the first mounting space 103 or the second mounting space 104 before installing the battery 300 or the electronic component 200.

[0073] For example Figure 10 and Figure 11As shown, at least two sets of support components 1061 arranged along the circumferential direction of the ring 100 are installed on the bottom wall of the first mounting space 103 (i.e., the outer surface of part of the inner wall 102). Each set of support components 1061 includes at least two spaced support ribs 1061a, which are strip-shaped structures protruding from the bottom wall of the first mounting space 103, and their top surfaces are directly used to support the battery 300 or electronic component 200. The most critical feature is that each pair of adjacent sets of support components 1061 are not in the same plane, but are arranged at an angle (e.g., an obtuse angle). This means that the top surfaces of all these support components 1061 together form a support surface that extends along the curvature of the first mounting space 103 but is in the form of a broken line. In this way, the support surface supports the battery 300 or electronic component 200, thereby further positioning the battery 300 or electronic component 200 after it is installed in the first mounting space 103 or the second mounting space 104.

[0074] See Figure 12 Taking the embodiment shown in the figure as an example, the electronic component 200 is installed in the first mounting space 103, and the electronic component 200 includes a main circuit board 210 (e.g., a circuit board integrating core components such as a main control chip and a Bluetooth chip) and at least one secondary circuit board 220 (e.g., a circuit board integrating auxiliary components such as an LED driver circuit). The main circuit board 210 is flexibly connected to the secondary circuit board 220 via a flexible flat cable 230. Correspondingly, as shown in the figure... Figure 13 As shown, during the installation of electronic component 200, one set of support components 1061 supports the rigid main circuit board 210, while another set or more sets of support components 1061 support the equally rigid secondary circuit board 220. Due to the flexibility of the flat cable 230, the main circuit board 210 and the secondary circuit board 220 can be respectively attached to their respective support components 1061. Figure 12 In the embodiment, there are two sub-circuit boards 220, which are located on both sides of the main circuit board 210. The number of carrier components 1061 is three. Of course, the number of sub-circuit boards 220 is not limited and can be set as needed. The number of carrier components 1061 can correspond to the number of circuit boards.

[0075] Thus, through the above design, firstly, reliability issues such as circuit board cracking and solder joint detachment that may occur if a whole rigid circuit board is forcibly bent and stuffed into the bent first mounting space 103 or second mounting space 104 are avoided; secondly, the flexibility of the flexible flat cable 230 perfectly adapts to the bent shape of the ring 100; thirdly, the groove space between the support ribs 1061a in each set of support components 1061 also becomes the flow channel of the potting material during subsequent potting, which can ensure that the potting material quickly fills the space under the main circuit board 210 and the sub-circuit board 220, achieving full encapsulation.

[0076] See Figure 14 Based on the above structure, to further improve the accuracy and convenience of assembly, a stepped surface 1061b is provided between the support component 1061 supporting the main circuit board 210 and the adjacent support component 1061 supporting the secondary circuit board 220 in the first mounting space 103. This stepped surface 1061b can be a vertical surface. During assembly, a portion of the electronic component 200 or battery 3300 abuts against this stepped surface 1061b, thereby securing the electronic component 200 or battery 300. For example, see... Figure 15 ,exist Figure 15 In this embodiment, the end of the sub-circuit board 220 adjacent to the main circuit board 210 abuts against the stepped surface 1061b, thereby providing a physical positioning reference for the sub-circuit board 220. This ensures that the position of the electronic component 200 in the circumferential direction of the ring 100 is accurate, greatly optimizing assembly consistency and the reliability of electrical connections.

[0077] It is understandable that when the support structure 106 is disposed in the second mounting space 104, and the electronic component 200 is mounted in the second mounting space 104, such as Figure 16 As shown, the support structure 106 is correspondingly disposed on the bottom wall of the second mounting space 104 (i.e., the inner surface of part of the outer wall 101), and its structure is similar to that of the support structure 106 when the electronic component 200 is disposed in the first mounting space 103, and will not be described in detail here.

[0078] Furthermore, since one of the core functions of the ring 10 is health monitoring, as shown in the figure, the electronic component 200 has a photosensitive element 211, which is used to contact or irradiate the skin to measure parameters such as heart rate and blood oxygen saturation. In this embodiment, the photosensitive element 211 is integrated on one side of the main circuit board 210. When the electronic component 200 is installed in the first mounting space 103, in order to allow the photosensitive element 211 to irradiate the user's finger skin through a portion of the inner wall 102 of the ring 100 to obtain an accurate optical signal, the manufacturing method of this application also includes the operation of forming a light-transmitting hole 107 in a portion of the inner wall 102.

[0079] Specifically, such as Figure 17 and Figure 18 As shown, firstly, a plane 1021 is machined on a portion of the inner wall 102 of the ring 100 at a position corresponding to the main circuit board 210 in the electronic component 200. This plane 1021 is formed by milling or grinding and is a flat reference surface.

[0080] Then, a light-transmitting hole 107 is further opened on the plane 1021.

[0081] Accordingly, when the electronic component 200 is installed into the first mounting space 103, the electronic component 200 covers the light-transmitting hole 107. Specifically, the main circuit board 210 is aligned with the plane 1021 on part of the inner wall 102, so that the main circuit board 210 covers the light-transmitting hole 107. At the same time, the light-sensing element 211 on the main circuit board 210 is precisely aligned with the light-transmitting hole 107 on the plane 1021. To ensure alignment accuracy, positioning posts or positioning grooves can be provided in the first mounting space 103 to cooperate with positioning holes or positioning edges on the electronic component 200.

[0082] After completing the above steps, the light emitted by the photosensitive element 211 can pass perpendicularly through the light-transmitting hole 107 and illuminate the skin of the finger. The reflected light can also be effectively received by the photosensitive element 211. The design of the plane 1021 ensures perpendicular incident and outgoing light, reducing scattering and refraction losses caused by the curved surface, thereby significantly improving the accuracy of optical detection. At the same time, the design of a portion of the inner wall 102 as a plane 1021 makes the contour of the inner wall 102 closer to the contour of the finger. When the user wears the ring 10, the aforementioned plane 1021 can form a stable contact with the finger, thus making the wearing experience more comfortable.

[0083] In another embodiment, such as Figure 7 and Figure 19 As shown, the electronic component 200 is installed in the second mounting space 104. When installing the electronic component 200, it can be directly inserted into the second mounting space 104. The two opposite sidewalls of the second mounting space 104 form an open slot, through which the optical sensing element 211 can directly contact or irradiate the skin, resulting in higher optical coupling efficiency.

[0084] After completing the installation of the above components, as follows: Figure 20 As shown, the manufacturing method of this application also requires the application of potting material 500 to fill at least the first mounting space 103 and the second mounting space 104. The potting material 500 can be a transparent resin. Under a certain high temperature environment, the potting material 500 is in a liquid or gel state, which can flow and at least fill the first mounting space 103 and the second mounting space 104 to completely cover and encapsulate the electronic components 200, battery 300 and communication components 400 in the first mounting space 103 and the second mounting space 104.

[0085] Specifically, in the potting operation, firstly, liquid or gel potting material 500 is injected into the first installation space 103 and the second installation space 104 using potting equipment, ensuring that the potting material 500 completely covers the electronic component 200, the battery 300 and the communication component 400.

[0086] Then, based on the characteristics of the selected potting material 500, the potting material 500 is cooled by means of heating, ultraviolet light irradiation or room temperature standing. After cooling, the potting material 500 becomes solid and encapsulates electronic components such as electronic component 200, battery 300 and communication component 400 in the first mounting space 103 and the second mounting space 104.

[0087] It should be noted that, because the photosensitive element 211 needs to transmit light, when the electronic component 200 integrates the photosensitive element 211, the potting material 500 must be a transparent potting material 500, and the light-transmitting hole 107 must be filled with the potting material 500. This ensures that even after the potting material 500 fills the first mounting space 103 and seals the light-transmitting hole 107, the photosensitive element 211 can still transmit light through the potting material 500 and the light-transmitting hole 107 to the skin surface and receive the light signal reflected from the skin surface. When the photosensitive element 211 needs to be illuminated by external light, the light-transmitting hole 107 can also be formed on part of the outer wall 101, and the light-transmitting hole 107 is also filled with the potting material 500.

[0088] See Figure 19 and Figure 21 In the embodiment shown in the figure, the electronic component 200 is installed in the second mounting space 104, the potting material 500 fills the second mounting space 104, and the photosensitive element 211 can directly contact or irradiate the skin through the transparent potting material 500.

[0089] This potting encapsulation process offers multiple technical benefits: First, the potting material 500 provides physical fixation, preventing electronic components from shifting or falling off when subjected to impact or vibration. Second, the potting material 500 has excellent waterproof, dustproof, and moisture-proof properties, allowing the ring 10 to be used safely in various daily environments (such as handwashing, rain, and sweating during exercise). Third, the encapsulated potting material 500 can evenly conduct the heat generated during component operation to the entire ring 100, providing heat equalization and auxiliary heat dissipation. Fourth, the potting material 500 fills all gaps between the electronic components and the sidewalls of the first mounting space 103 and the second mounting space 104, eliminating internal air and avoiding electrochemical corrosion problems that may result from residual air.

[0090] To further enhance wearing comfort and the product's seamless appearance, the surface of the potting material 500 can be finished after solidification. Specifically, machining methods (such as milling and grinding) or laser cutting can be used to remove excess portions of the potting material 500, aiming to achieve the desired finish. Figure 22 As shown, the inner and outer diameters of the potting material 500 are made to match the inner and outer diameters of the ring 100.

[0091] In this way, when the user wears the ring, they will not feel any obvious depression or protrusion on the inner wall 102, eliminating the feeling of foreign objects; at the same time, from the outside, the outer surface of the ring 10 is also a smooth surface, which greatly enhances the aesthetics of the product.

[0092] It is understandable that in some other embodiments, the ring 10 may only include the ring 100 and the potting material 500, without the battery 300, electronic component 200 and communication component 400, so that the ring only serves an aesthetic and decorative purpose. In this case, the manufacturing method of the ring 10 involves constructing the ring 100 and forming the first mounting space 103 and the second mounting space 104 on the ring 100, and then filling the first mounting space 103 and the second mounting space 104 with the potting material 500. When it is necessary to modify the ring 10 into a smart ring that can realize 24-hour health intelligent monitoring function and payment, card swiping and other functions, the potting material 500 is removed, and the electronic component 200, battery 300 and communication component 400 are installed in the ring, and then the potting material 500 is used to cover the electronic component 200, battery 300 and communication component 400.

[0093] In summary, the ring 10 manufacturing method provided in this application constructs a ring 100 having a radially portioned outer wall 101 and a portioned inner wall 102, extending along the curvature direction of the portioned outer wall 101 to form a first mounting space 103, and extending along the curvature direction of the portioned inner wall 102 to form a second mounting space 104, with the first mounting space 103 and the second mounting space 104 interconnected. Finally, a potting material 500 is applied to at least fill the first mounting space 103 and the second mounting space 104, reducing the number of components and simplifying welding and assembly. While ensuring product structural strength and appearance consistency, it greatly optimizes the utilization of internal space, thereby simplifying the assembly process, improving the reliability of electrical connections, and enhancing the accuracy of health monitoring. Simultaneously, this method allows adjustment of the ring 100 size and potting ratio according to the size of electronic components such as the battery 300, electronic component 200, and communication component 400, offering high flexibility and effectively overcoming the shortcomings of existing ring manufacturing methods.

[0094] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0095] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method of manufacturing a ring, characterized by, Includes the following steps: Construct a ring with a radially distributed outer wall and a radially distributed inner wall, and... A first mounting space is formed by extending along the curvature direction of the outer wall of the portion, and a second mounting space is formed by extending along the curvature direction of the inner wall of the portion, such that the first mounting space and the second mounting space are interconnected. The potting material should be applied to fill at least the first mounting space and the second mounting space.

2. The production method according to claim 1, characterized by, When forming the first mounting space and the second mounting space, the first mounting space and the second mounting space are offset in the circumferential direction of the ring.

3. The production method according to claim 1 or 2, characterized by, Before applying the potting material to at least fill the first mounting space and the second mounting space, the battery is installed in one of the first mounting space and the second mounting space, the electronic component is installed in the other of the first mounting space and the second mounting space, and the battery and the electronic component are electrically connected.

4. The manufacturing method according to claim 3, characterized in that, Before installing the battery or the electronic component, the method further includes installing a support component for supporting the battery or the electronic component within the first mounting space or the second mounting space.

5. The manufacturing method according to claim 4, characterized in that, It also includes the operation of installing the communication component in the first mounting space or the second mounting space, and electrically connecting the communication component to the battery and the electronic components.

6. The manufacturing method according to claim 5, characterized in that, After attaching the communication component to one side of the battery along its thickness direction and electrically connecting the two, install the two in the first installation space or the second installation space.

7. The manufacturing method according to claim 6, characterized in that, When the potting material is used to fill at least the first mounting space and the second mounting space, the potting material is used to cover the battery, the electronic components and the communication components.

8. The manufacturing method according to claim 3, characterized in that, It also includes the operation of forming a light-transmitting hole on the outer wall or the inner wall of the portion.

9. The manufacturing method according to claim 8, characterized in that, When installing the electronic component, the electronic component is made to cover the light-transmitting hole.

10. The manufacturing method according to claim 1, characterized in that, The ring is made of metal or metal alloy, and / or the potting material is transparent resin.

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