A high signal-to-noise ratio flexible sleep monitoring band of signal processing package

Abstract

The application discloses a high signal-to-noise ratio flexible sleep monitoring belt of signal processing package and belongs to the technical field of medical health monitoring and intelligent wearable equipment. The monitoring belt comprises a flexible sensing assembly, a nearby conditioning circuit board, a conductive shielding envelope and a multi-core cable. The flexible sensing assembly is arranged on a flexible base material and is used for sensing human physiological signals. The nearby conditioning circuit board is tightly connected with the flexible sensing assembly, and high-impedance signals are conditioned into low-impedance signals on site and then output. The conductive shielding envelope comprises a sensing shielding layer for wrapping the sensor and an internal electromagnetic shielding layer for wrapping the circuit board, and the two are electrically connected to form a Faraday cage so as to inhibit external electromagnetic interference. The multi-core cable is used for connecting external equipment. The application combines the near-end conditioning and the system-level shielding, effectively reduces the parasitic capacitance attenuation and electromagnetic interference coupling of the high-resistance signal transmission path, helps to improve the signal-to-noise ratio of the collected weak physiological signals and the system anti-interference ability, and can be used for sleep health monitoring.

Description

Technical Field

[0001] This invention relates to the field of medical and health monitoring and smart wearable device technology, specifically to a high signal-to-noise ratio flexible sleep monitoring band with signal processing encapsulation. Background Technology

[0002] With increasing public awareness of sleep health, the demand for non-invasive sleep monitoring devices is growing. Flexible piezoelectric sensors, especially polyvinylidene fluoride (PVDF) piezoelectric film sensors, have become the mainstream technology in this field due to their high sensitivity, good flexibility, and ability to detect subtle physiological vibrations in the human body.

[0003] However, PVDF piezoelectric sensors output a weak, high-impedance charge signal when subjected to deformation. In existing conventional packaging and signal transmission schemes, a long cable is typically used to connect the sensor to the back-end processing circuitry. This architecture has significant drawbacks: First, the parasitic capacitance introduced by the long transmission cable shuns and attenuates the already weak charge signal, leading to decreased system sensitivity. Second, the high-impedance signal transmission path easily acts as an antenna, coupling with power frequency and radio frequency electromagnetic interference in the environment, potentially drowning out subtle physiological signals such as cardiopulmonary activity. Furthermore, friction and bending of the sensor and cable during use can introduce interference artifacts. These factors collectively limit the accuracy and signal-to-noise ratio of sleep monitoring data.

[0004] To address the aforementioned issues, there is an urgent need for a flexible sleep monitoring band with high signal-to-noise ratio that incorporates signal processing, thus resolving the problems associated with traditional methods. Summary of the Invention

[0005] The purpose of this invention is to provide a high signal-to-noise ratio flexible sleep monitoring band with signal processing encapsulation. By combining proximal conditioning and system-level shielding, it effectively reduces parasitic capacitance attenuation and electromagnetic interference coupling in the high-impedance signal transmission path, which helps to improve the signal-to-noise ratio of weak physiological signal acquisition and the system's anti-interference capability, and can be used for sleep health monitoring.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A high signal-to-noise ratio flexible sleep monitoring band with signal processing encapsulation, comprising: The system includes a flexible sensing component, a proximity conditioning circuit board, a conductive shielding envelope, and a multi-core cable. The flexible sensing component is connected to the proximity conditioning circuit board. The conductive shielding envelope is disposed on the outer side of the flexible sensing component and the proximity conditioning circuit board. The proximity conditioning circuit board is connected to an external device through the multi-core cable. The flexible sensing component includes a flexible substrate and a flexible sensor component. The flexible sensor component is disposed on the flexible substrate and connected to the proximity conditioning circuit board. The flexible sensor component is used to sense human physiological signals. The proximity conditioning circuit board is used to condition the signals collected by the flexible sensor assembly and convert them into low-impedance signals. The conductive shielding envelope includes a sensing shielding layer and an internal electromagnetic shielding layer. The sensing shielding layer is disposed on the outside of the flexible sensing component, and the internal electromagnetic shielding layer is disposed on the outside of the proximity conditioning circuit board. The conductive shielding envelope is used to suppress the coupling of external electromagnetic interference to the charge signal.

[0007] Furthermore, the flexible sensor assembly is a strip-shaped flexible piezoelectric sensor. The strip-shaped flexible piezoelectric sensor is connected to the proximity conditioning circuit board. The strip-shaped flexible piezoelectric sensor is used to collect human micro-motion signals. The strip-shaped flexible piezoelectric sensor is disposed on the flexible substrate. A first electrode layer is disposed on the side of the strip-shaped flexible piezoelectric sensor that contacts the flexible substrate. A positive electrode layer is disposed on the outside of the strip-shaped flexible piezoelectric sensor. A sensing shielding layer is disposed on the outside of the positive electrode layer. An insulating protective layer is disposed on the outside of the sensing shielding layer. The sensing shielding layer and the first electrode layer are grounded. The positive electrode layer is connected to the proximity conditioning circuit board.

[0008] Furthermore, the flexible sensor assembly includes a strip-shaped flexible piezoelectric sensor and a strip-shaped flexible piezoresistive sensor. The strip-shaped flexible piezoelectric sensor and the strip-shaped flexible piezoresistive sensor are connected to the proximity conditioning circuit board. The strip-shaped flexible piezoelectric sensor is used to collect human body micro-motion signals, and the strip-shaped flexible piezoresistive sensor is used to collect human body force or posture signals. The strip-shaped flexible piezoelectric sensor and the strip-shaped flexible piezoresistive sensor are arranged side by side on the flexible substrate or arranged on both sides of the flexible substrate. A first electrode layer is provided on the side of the strip-shaped flexible piezoelectric sensor and the strip-shaped flexible piezoresistive sensor that contacts the flexible substrate. A positive electrode layer is provided on the outside of the strip-shaped flexible piezoelectric sensor and the strip-shaped flexible piezoresistive sensor. A sensing shield layer is provided on the outside of the positive electrode layer. An insulating protective layer is provided on the outside of the sensing shield layer. The sensing shield layer and the first electrode layer are grounded. The positive electrode layer is connected to the proximity conditioning circuit board.

[0009] Furthermore, an insulating sealant is provided on the outer side of the proximity conditioning circuit board, an internal electromagnetic shielding layer is provided on the outer side of the insulating sealant, and a plastic protective shell is provided on the outer side of the internal electromagnetic shielding layer. The plastic protective shell has openings corresponding to the flexible substrate and the flexible sensor assembly. The flexible sensor assembly extends into the interior of the plastic protective shell and is connected to the proximity conditioning circuit board through a hard-soft connection node. The contact portion between the flexible sensor and the insulating sealant forms an equipotential contact point for conducting the inner and outer Faraday cages.

[0010] Furthermore, the proximity conditioning circuit board integrates a first-stage signal amplification circuit, and the signal input terminal of the proximity conditioning circuit board is connected to the positive electrode layer, which is used to perform preliminary filtering and amplification of the acquired signal at a position close to the flexible sensor component.

[0011] Furthermore, the equivalent parasitic capacitance of the trace between the signal input terminal of the proximity conditioning circuit board and the positive electrode layer is less than or equal to 50pF, or the geometric wiring distance between the proximity conditioning circuit board and the positive electrode layer is less than or equal to 50mm.

[0012] Furthermore, the first-stage signal amplification circuit is any one of a charge amplifier, a transimpedance amplifier, or a high input impedance voltage amplifier.

[0013] In summary, the present invention has at least one of the following beneficial technical effects: First, by closely integrating the near-end conditioning circuit with the flexible sensor component, impedance transformation and signal conditioning are achieved near the signal generation source, which effectively reduces the attenuation of the high-impedance original signal caused by the parasitic capacitance of the long transmission path, and helps to improve the system's sensitivity and signal-to-noise ratio for acquiring weak physiological signals.

[0014] Secondly, a Faraday cage structure was formed by constructing a conductive shielding envelope covering the high-impedance input path from the sensor to the conditioning circuit. This structure helps to suppress the direct coupling of external electromagnetic fields to charge signals and reduce electrostatic interference caused by factors such as body friction, thereby enhancing the stability and anti-interference capability of signal transmission and providing a structural basis for accurately extracting physiological information in complex electromagnetic environments.

[0015] Furthermore, the dual-sensor composite structure provided by this invention can collaboratively collect multi-dimensional information such as human cardiopulmonary micro-vibrations and body posture. The synchronous local conditioning and unified extraction of piezoelectric and piezoresistive sensor signals enrich the monitoring dimensions while maintaining the simplicity of system integration and the convenience of cable connection, taking into account both the comfort of wearable use and the feasibility of mass production. Attached Figure Description

[0016] Figure 1This is a schematic diagram of the high signal-to-noise ratio flexible sleep monitoring strip structure of the present invention; Figure 2 This is a schematic diagram of the high signal-to-noise ratio flexible sleep monitoring strip of the present invention; Figure 3 This is a schematic diagram of the flexible sensing component structure; Figure 4 This is a cross-sectional view of the flexible sensing component; Figure 5 A schematic diagram of the circuit board structure for convenient adjustment; Figure 6 This is a schematic diagram comparing the amplitude and intensity of sleep belts in the prior art with that of the sleep belt in this application.

[0017] Reference numerals: 1. Flexible sensing component; 100. Flexible substrate; 101. Flexible-rigid bonding node; 102. Long strip flexible piezoelectric sensor; 103. Long strip flexible piezoresistive sensor; 104. Sensing shielding layer; 105. First electrode layer; 106. Positive electrode layer; 107. Insulating protective layer; 2. Proximity conditioning circuit board; 201. Plastic protective shell; 202. Internal electromagnetic shielding layer; 203. Insulating sealant; 204. Equipotential contact point; 205. Upper protective shell; 206. Lower protective shell; 3. Multi-core cable; 4. External equipment. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0019] like Figure 1 and Figure 2 As shown, the present invention provides a high signal-to-noise ratio flexible sleep monitoring band with signal processing packaging, including: a flexible sensing component 1, a proximity conditioning circuit board 2, a conductive shielding envelope, and a multi-core cable 3. The flexible sensing component 1 is connected to the proximity conditioning circuit board 2. The conductive shielding envelope is disposed on the outside of the flexible sensing component 1 and the proximity conditioning circuit board 2. The proximity conditioning circuit board 2 is connected to an external device 4 through the multi-core cable. like Figure 3 and Figure 4 As shown, the flexible sensing component 1 includes a flexible substrate 100 and a flexible sensor component. The flexible sensor component is disposed on the flexible substrate 100 and connected to the proximity conditioning circuit board 2. The flexible sensor component is used to sense human physiological signals. The proximity conditioning circuit board 2 is used to condition the signal collected by the flexible sensor assembly and convert it into a low impedance signal. The conductive shielding envelope includes a sensing shielding layer 104 and an inner electromagnetic shielding layer 202. The sensing shielding layer 104 is disposed on the outside of the flexible sensing component 1, and the inner electromagnetic shielding layer 202 is disposed on the outside of the proximity conditioning circuit board 2. The conductive shielding envelope is used to suppress the coupling of external electromagnetic interference to the charge signal.

[0020] This invention provides two structural designs for flexible sensor assemblies, including: The first type is as follows: the flexible sensor assembly is a strip-shaped flexible piezoelectric sensor 102. The strip-shaped flexible piezoelectric sensor 102 is connected to the proximity conditioning circuit board 2. The strip-shaped flexible piezoelectric sensor 102 is used to collect human micro-motion signals. The strip-shaped flexible piezoelectric sensor 102 is disposed on the flexible substrate 100. A first electrode layer 105 is disposed on the side of the strip-shaped flexible piezoelectric sensor 102 that contacts the flexible substrate 100. A positive electrode layer 106 is disposed on the outside of the strip-shaped flexible piezoelectric sensor 102. A sensing shielding layer 104 is disposed on the outside of the positive electrode layer 106. An insulating protective layer 107 is disposed on the outside of the sensing shielding layer 104. The sensing shielding layer 104 and the first electrode layer 105 are grounded. The positive electrode layer 106 is connected to the proximity conditioning circuit board 2.

[0021] The second type is: such as Figure 2 As shown, the flexible sensor assembly includes a strip-shaped flexible piezoelectric sensor 102 and a strip-shaped flexible piezoresistive sensor 103. The strip-shaped flexible piezoelectric sensor 102 and the strip-shaped flexible piezoresistive sensor 103 are connected to the proximity conditioning circuit board 2. The strip-shaped flexible piezoelectric sensor 102 is used to collect micro-motion signals from the human body, and the strip-shaped flexible piezoresistive sensor 103 is used to collect force or posture signals from the human body. The strip-shaped flexible piezoelectric sensor 102 and the strip-shaped flexible piezoresistive sensor 103 are arranged side-by-side on the flexible substrate 100, or the strip-shaped flexible piezoelectric sensor 102 and the strip-shaped flexible piezoresistive sensor 103 are arranged side-by-side on the flexible substrate 100. 103 is disposed on both sides of the flexible substrate 100; a first electrode layer 105 is disposed on the side of the elongated flexible piezoelectric sensor 102 and the elongated flexible piezoresistive sensor 103 that contacts the flexible substrate 100; a positive electrode layer 106 is disposed on the outside of the elongated flexible piezoelectric sensor 102 and the elongated flexible piezoresistive sensor 103; a sensing shielding layer 104 is disposed on the outside of the positive electrode layer 106; an insulating protective layer 107 is disposed on the outside of the sensing shielding layer 104; the sensing shielding layer 104 and the first electrode layer 105 are grounded; and the positive electrode layer 106 is connected to the nearest conditioning circuit board 2.

[0022] like Figure 5 As shown, an insulating sealant 203 is provided on the outer side of the proximity conditioning circuit board 2. An internal electromagnetic shielding layer 202 is provided on the outer side of the insulating sealant 203. A plastic protective shell 201 is provided on the outer side of the internal electromagnetic shielding layer 202. The plastic protective shell 201 is an injection-molded structure or a snap-fit ​​structure composed of an upper protective shell 205 and a lower protective shell 206. The plastic protective shell 201 has openings corresponding to the flexible substrate 100 and the flexible sensor assembly. The flexible sensor assembly extends into the interior of the plastic protective shell 201 and is connected to the proximity conditioning circuit board 2 through a flexible-rigid bonding node 101. The contact portion between the flexible sensor and the insulating sealant 203 forms an equipotential contact point 204 for conducting the inner and outer Faraday cages.

[0023] The proximity conditioning circuit board 2 integrates a first-stage signal amplification circuit. The signal input terminal of the proximity conditioning circuit board 2 is connected to the positive electrode layer 106, which is used to perform preliminary filtering and amplification of the acquired signal at a position close to the flexible sensor component.

[0024] The equivalent parasitic capacitance of the trace between the signal input terminal of the proximity conditioning circuit board 2 and the positive electrode layer 106 is less than or equal to 50pF, or the geometric wiring distance between the proximity conditioning circuit board 2 and the positive electrode layer 106 is less than or equal to 50mm.

[0025] The first-stage signal amplification circuit is any one of a charge amplifier, a transimpedance amplifier, or a high input impedance voltage amplifier.

[0026] This invention provides three embodiments to describe in detail the specific implementation components of the high signal-to-noise ratio flexible sleep monitoring band described above for signal processing encapsulation: Example 1: Basic near-end amplification and single-sided shielding structure This embodiment provides a high signal-to-noise ratio flexible sleep monitoring band with signal processing packaging, which includes a flexible sensing component 1, a proximity conditioning circuit board 2, a conductive shielding envelope, and a multi-core cable 3.

[0027] The flexible sensing component 1 includes a flexible substrate 100 and a flexible sensor component disposed on the flexible substrate 100. In this embodiment, the flexible sensor component is a long strip-shaped flexible piezoelectric sensor 102, specifically a polyvinylidene fluoride (PVDF) piezoelectric film sensor, which has extremely high sensitivity and flexibility, and can effectively sense the minute mechanical vibrations of breathing and heartbeat during human sleep, and convert them into weak original charge signals. The flexible substrate 100 can be made of fabric or thermoplastic polyurethane film, which has good flexibility and durability, and is easy to lay under the mattress or bed sheet.

[0028] The proximity conditioning circuit board 2 is directly electrically connected to the signal output terminal of the elongated flexible piezoelectric sensor 102 via a short-distance trace. The proximity conditioning circuit board 2 integrates a first-stage signal amplification circuit, which locally conditions and converts the high-impedance raw charge signal into a low-impedance signal for output, near the flexible sensor assembly. The "short-distance trace" here is strictly defined as follows: the geometric wiring length between the signal input terminal of the proximity conditioning circuit board 2 and the signal output terminal of the elongated flexible piezoelectric sensor 102 is less than or equal to 50 mm, or the equivalent parasitic capacitance of this trace is less than or equal to 50 pF. In actual design, it can even be controlled to an extremely low level below 10 pF, thereby effectively preventing the weak charge signal from being absorbed and attenuated by the parasitic capacitance of the wires along the transmission path. The proximity conditioning circuit board 2 can be a rigid printed circuit board or a flexible printed circuit board. The first-stage signal amplification circuit can be any one of a charge amplifier, a transimpedance amplifier, or a high input impedance voltage amplifier, preferably a charge amplifier, which can directly convert the weak charge signal generated by the piezoelectric sensor into a voltage signal, and its gain is not affected by changes in the sensor's own capacitance.

[0029] The conductive shielding envelope includes a sensing shielding layer 104 and an internal electromagnetic shielding layer 202, which are used to completely wrap the entire high-impedance signal transmission path from the elongated flexible piezoelectric sensor 102 to the signal input terminal of the nearest conditioning circuit board 2, forming a Faraday cage structure to suppress the coupling of external electromagnetic interference to the original charge signal.

[0030] Specifically, the elongated flexible piezoelectric sensor 102 has a first electrode layer 105 and a positive electrode layer 106 disposed opposite to each other. The first electrode layer 105 is disposed on the side of the elongated flexible piezoelectric sensor 102 that contacts the flexible substrate 100, and the positive electrode layer 106 is disposed on the outer side of the elongated flexible piezoelectric sensor 102. A sensing shielding layer 104 is disposed on the outer side of the positive electrode layer 106, and an insulating protective layer 107 is disposed on the outer side of the sensing shielding layer 104. The sensing shielding layer 104 and the first electrode layer 105 are electrically connected through conductive silver paste or metallized vias to achieve equipotential grounding. The positive electrode layer 106 serves as a signal output terminal, connected to the signal input terminal of the nearest conditioning circuit board 2. After the sensing shielding layer 104 is grounded, it can effectively shield the high-resistivity signal source area of ​​the elongated flexible piezoelectric sensor 102.

[0031] An internal electromagnetic shielding layer 202 is provided on the outer side of the proximity conditioning circuit board 2. Specifically, an insulating sealant 203 is applied to the outer side of the proximity conditioning circuit board 2 for protection and fixation. The internal electromagnetic shielding layer 202 is then positioned outside the insulating sealant 203, and a plastic protective shell 201 is further positioned outside the internal electromagnetic shielding layer 202. The plastic protective shell 201 has openings corresponding to the flexible substrate 100 and the flexible sensor assembly. A long, strip-shaped flexible piezoelectric sensor 102 extends into the interior of the plastic protective shell 201 and is connected to the proximity conditioning circuit board 2 via a rigid-flexible connection node 101. The plastic protective shell 201 can be injection molded or have a snap-fit ​​structure between the upper and lower shells. The contact portion between the flexible sensor assembly and the insulating sealant 203 forms an equipotential contact point 204, which is used to conduct electricity between the inner and outer sensing shielding layers 104 and the internal electromagnetic shielding layer 202. This electrically connects the sensing shielding layer 104 on the elongated flexible piezoelectric sensor 102 with the internal electromagnetic shielding layer 202 outside the nearby conditioning circuit board 2, forming a complete Faraday cage closed loop. The internal electromagnetic shielding layer 202 can be a conductive coating disposed on the inner wall of the plastic protective shell 201, or a grounded copper foil layer disposed between the layers of the nearby conditioning circuit board 2.

[0032] The signal, after being conditioned by the first-stage signal amplification circuit, has been converted into a low-impedance signal, significantly enhancing its anti-interference capability. At this point, the output terminal of the nearest conditioning circuit board 2 is connected to the external device 4 via a multi-core cable 3. The multi-core cable 3 includes at least a positive power supply lead, a negative power supply lead, a positive signal output lead, and a negative signal output lead, used to provide operating power to the first-stage signal amplification circuit and transmit the conditioned signal differentially.

[0033] The grounding lead of the sensing shielding layer 104 can be electrically grounded in several ways: it can be connected to the system ground of the nearest conditioning circuit board 2 as an independent shielding pin; or, after being physically shorted to share a common ground with the first electrode layer 105 of the elongated flexible piezoelectric sensor 102, it can be connected together to the system ground of the nearest conditioning circuit board 2. In this way, the grounding method can be flexibly selected according to different pin numbers and wiring requirements.

[0034] Example 2: Double-sided shielding structure The main difference between this embodiment and Embodiment 1 lies in the shielding structure of the elongated flexible piezoelectric sensor 102. When the electromagnetic noise in the sleep environment is extremely severe, a sensing shielding layer 104 can be provided on both the upper and lower surfaces of the elongated flexible piezoelectric sensor 102. Specifically, a sensing shielding layer 104 is provided on the side of the elongated flexible piezoelectric sensor 102 closest to the flexible substrate 100, and another sensing shielding layer 104 is provided on the outside of the positive electrode layer 106. The two sensing shielding layers 104 are physically connected at the edge of the sensor, sandwiching the first electrode layer 105 and the positive electrode layer 106 in the middle. Both sensing shielding layers 104 are systematically connected to the nearest conditioning circuit board 2, providing symmetrical and superior common-mode interference suppression.

[0035] The remaining structure is the same as in Example 1, and will not be described again here.

[0036] Example 3: Piezoelectric-resistance hybrid sensor structure To further enrich the dimensions of sleep monitoring, in addition to monitoring breathing and heart rate, it is also necessary to accurately identify gross motor characteristics such as getting out of bed and turning over. Based on Embodiment 1 or Embodiment 2, this embodiment also includes a long strip flexible piezoresistive sensor 103 in the flexible sensor assembly.

[0037] The elongated flexible piezoelectric sensor 102 and the elongated flexible piezoresistive sensor 103 are arranged on the flexible substrate 100: they can be arranged side by side, with both placed parallel to each other on the same surface of the flexible substrate 100; or, to save space, a multi-layer composite process can be used to place them on the front and back sides of the flexible substrate 100 respectively. The elongated flexible piezoelectric sensor 102 is used to collect micro-motion signals such as human respiration and heartbeat, while the elongated flexible piezoresistive sensor 103 is used to collect macro-motion signals such as human body movement, force, or posture.

[0038] The structure of the elongated flexible piezoresistive sensor 103 is similar to the stacked structure of the elongated flexible piezoelectric sensor 102 in Embodiment 1. Specifically, a first electrode layer 105 is disposed on the side in contact with the flexible substrate 100, a positive electrode layer 106 is disposed on the outer side, a sensing shielding layer 104 is disposed outside the positive electrode layer 106, and an insulating protective layer 107 is disposed outside the sensing shielding layer 104. The sensing shielding layer 104 and the first electrode layer 105 are grounded.

[0039] The signal output terminal of the elongated flexible piezoresistive sensor 103 is also connected to the nearest conditioning circuit board 2 via a short-distance trace. In addition to integrating a first-stage signal amplification circuit for conditioning the piezoelectric signal, the nearest conditioning circuit board 2 also integrates a signal conditioning circuit for conditioning the piezoresistive signal, such as a voltage divider circuit or a Wheatstone bridge conditioning circuit. The piezoelectric signal is sent to the first-stage signal amplification circuit for charge amplification, while the piezoresistive signal is sent to the voltage divider or Wheatstone bridge conditioning circuit for processing. The low-impedance signal after processing, along with the power supply line, is integrated into the same multi-core cable 3 and led out, enabling the output of multi-dimensional physiological data from a single cable. This data is used in conjunction with the elongated flexible piezoelectric sensor 102 to achieve composite monitoring of body movement and cardiopulmonary micro-vibrations.

[0040] When a hybrid piezoelectric-resistance structure is adopted, the grounding lead of the sensing shielding layer 104 can be independently connected to the system ground of the nearest conditioning circuit board 2, or it can be physically shorted to the first electrode layer 105 of the long strip flexible piezoelectric sensor 102 and then led out, or it can be physically shorted to the first electrode layer 105 of the long strip flexible piezoresistive sensor 103 and then led out, so as to reduce the number of pins and simplify wiring.

[0041] like Figure 6 As shown, the present invention also provides a schematic diagram comparing the amplitude intensity of the sleep belt in the prior art and the sleep belt of the present application. The first generation sleep belt (blue line) is the sleep belt in the prior art, and the second generation sleep belt (with front magnification, yellow line) is the sleep belt of the present application. In addition, the present invention also provides a table of some amplitude intensities, as shown in Table 1.

[0042] Table 1 Partial Amplitude Intensities

[0043] Embodiments of the present invention may be provided as methods, systems, or computer program products. Therefore, the present invention may take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0044] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0045] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0046] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0047] Contents not described in detail in this specification are prior art known to those skilled in the art. It is hereby indicated that the above description is intended to help those skilled in the art understand this invention, but does not limit the scope of protection of this invention. Any equivalent substitutions, modifications, improvements, or simplifications of the above descriptions that do not depart from the essential content of this invention fall within the scope of protection of this invention.

Claims

1. A high signal-to-noise ratio flexible sleep monitoring band with signal processing encapsulation, characterized in that, include: The system includes a flexible sensing component, a proximity conditioning circuit board, a conductive shielding envelope, and a multi-core cable. The flexible sensing component is connected to the proximity conditioning circuit board. The conductive shielding envelope is disposed on the outer side of the flexible sensing component and the proximity conditioning circuit board. The proximity conditioning circuit board is connected to an external device through the multi-core cable. The flexible sensing component includes a flexible substrate and a flexible sensor component. The flexible sensor component is disposed on the flexible substrate and connected to the proximity conditioning circuit board. The flexible sensor component is used to sense human physiological signals. The proximity conditioning circuit board is used to condition the signals collected by the flexible sensor assembly and convert them into low-impedance signals. The conductive shielding envelope includes a sensing shielding layer and an internal electromagnetic shielding layer. The sensing shielding layer is disposed on the outside of the flexible sensing component, and the internal electromagnetic shielding layer is disposed on the outside of the proximity conditioning circuit board. The conductive shielding envelope is used to suppress the coupling of external electromagnetic interference to the charge signal.

2. The high signal-to-noise ratio flexible sleep monitoring band with signal processing encapsulation according to claim 1, characterized in that, The flexible sensor assembly is a strip-shaped flexible piezoelectric sensor. The strip-shaped flexible piezoelectric sensor is connected to the proximity conditioning circuit board. The strip-shaped flexible piezoelectric sensor is used to collect human micro-motion signals. The strip-shaped flexible piezoelectric sensor is disposed on the flexible substrate. A first electrode layer is disposed on the side of the strip-shaped flexible piezoelectric sensor that contacts the flexible substrate. A positive electrode layer is disposed on the outside of the strip-shaped flexible piezoelectric sensor. A sensing shielding layer is disposed on the outside of the positive electrode layer. An insulating protective layer is disposed on the outside of the sensing shielding layer. The sensing shielding layer and the first electrode layer are grounded. The positive electrode layer is connected to the proximity conditioning circuit board.

3. The high signal-to-noise ratio flexible sleep monitoring band with signal processing encapsulation according to claim 1, characterized in that, The flexible sensor assembly includes a strip-shaped flexible piezoelectric sensor and a strip-shaped flexible piezoresistive sensor. The strip-shaped flexible piezoelectric sensor and the strip-shaped flexible piezoresistive sensor are connected to the proximity conditioning circuit board. The strip-shaped flexible piezoelectric sensor is used to collect micro-motion signals from the human body, and the strip-shaped flexible piezoresistive sensor is used to collect force or posture signals from the human body. The strip-shaped flexible piezoelectric sensor and the strip-shaped flexible piezoresistive sensor are arranged side-by-side on the flexible substrate or on both sides of the flexible substrate. A first electrode layer is provided on the side of the strip-shaped flexible piezoelectric sensor and the strip-shaped flexible piezoresistive sensor that contacts the flexible substrate. A positive electrode layer is provided on the outer side of the strip-shaped flexible piezoelectric sensor and the strip-shaped flexible piezoresistive sensor. A sensing shield layer is provided on the outer side of the positive electrode layer. An insulating protective layer is provided on the outer side of the sensing shield layer. The sensing shield layer and the first electrode layer are grounded. The positive electrode layer is connected to the proximity conditioning circuit board.

4. A high signal-to-noise ratio flexible sleep monitoring band with signal processing encapsulation according to claim 2 or 3, characterized in that, An insulating sealant is provided on the outer side of the proximity conditioning circuit board. An internal electromagnetic shielding layer is provided on the outer side of the insulating sealant. A plastic protective shell is provided on the outer side of the internal electromagnetic shielding layer. The plastic protective shell has openings corresponding to the flexible substrate and the flexible sensor assembly. The flexible sensor assembly extends into the interior of the plastic protective shell and is connected to the proximity conditioning circuit board through a hard-soft connection node. The contact portion between the flexible sensor and the insulating sealant forms an equipotential contact point for conducting the inner and outer Faraday cages.

5. The high signal-to-noise ratio flexible sleep monitoring band with signal processing encapsulation according to claim 4, characterized in that, The proximity conditioning circuit board integrates a first-stage signal amplification circuit. The signal input terminal of the proximity conditioning circuit board is connected to the positive electrode layer, which is used to perform preliminary filtering and amplification of the acquired signal at a position close to the flexible sensor component.

6. The high signal-to-noise ratio flexible sleep monitoring band with signal processing encapsulation according to claim 5, characterized in that, The equivalent parasitic capacitance of the trace between the signal input terminal of the proximity conditioning circuit board and the positive electrode layer is less than or equal to 50pF, or the geometric wiring distance between the proximity conditioning circuit board and the positive electrode layer is less than or equal to 50mm.

7. The high signal-to-noise ratio flexible sleep monitoring band with signal processing encapsulation according to claim 6, characterized in that, The first-stage signal amplification circuit is any one of a charge amplifier, a transimpedance amplifier, or a high input impedance voltage amplifier.

8. The high signal-to-noise ratio flexible sleep monitoring band with signal processing encapsulation according to claim 4, characterized in that, The plastic protective shell is an injection-molded structure or a snap-fit ​​structure consisting of an upper protective shell and a lower protective shell.

9. A high signal-to-noise ratio flexible sleep monitoring band with signal processing encapsulation according to claim 5, characterized in that, The multi-core cable includes a positive power supply lead, a negative power supply lead, a positive signal output lead, and a negative signal output lead, which are used to provide operating power to the first-stage signal amplification circuit and transmit the conditioned signal in a differential manner.

10. A high signal-to-noise ratio flexible sleep monitoring band with signal processing encapsulation according to claim 5, characterized in that, The sensing shielding layer is provided with a grounding lead, which is connected to the system ground of the nearest conditioning circuit board.

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