A multi-stage polishing apparatus for wire-cut parts

Abstract

The application belongs to the technical field of polishing equipment, and particularly relates to a multi-stage polishing equipment for wire-cut parts, which comprises a base, first and second polishing mechanisms arranged on the two sides of the base respectively, a part rotating mechanism arranged on the front side of the first polishing mechanism, the first polishing mechanism comprising a mounting frame, a first linear module horizontally arranged on the top of the mounting frame, a first movable frame fixedly connected with a moving table of the first linear module, and a second linear module horizontally arranged on the side wall of the first movable frame. The application has the beneficial effect that the first polishing mechanism can be used for multi-angle and multi-directional profiling polishing of the surface of a workpiece, and is suitable for wire-cut workpieces with different profiles such as planes, curved surfaces and stepped surfaces; the part rotating mechanism can drive the workpiece to rotate, so that the circumferential multi-surface continuous polishing of the same workpiece is realized, and the polishing precision and machining efficiency are improved.

Description

Technical Field

[0001] This invention relates to the field of polishing equipment technology, specifically to a multi-stage polishing device for wire-cut parts. Background Technology

[0002] Wire EDM is a machining method that uses pulsed discharges generated between a continuously moving electrode wire and the workpiece to melt or vaporize the metal material at high temperatures, thus achieving cutting. Because wire EDM is a thermal process, a remelted layer (also known as a white layer) inevitably forms on the surface of the cut workpiece. This remelted layer contains microcracks, pores, and residual stress, and its surface roughness is typically only Ra 1.6μm–3.2μm, and it is riddled with discharge pits and cutting streaks. For applications requiring high surface quality, such as precision molds, aerospace components, and medical devices, the wire-cut workpiece must undergo polishing to remove the remelted layer, improve surface roughness, and eliminate microcracks.

[0003] However, most existing polishing methods are only suitable for exposed flat surfaces and regular curved surfaces. For wire-cut surfaces with complex contours (such as irregular curved surfaces, stepped surfaces, deep and narrow grooves, etc.), traditional mechanical polishing tools are difficult to fit evenly to the workpiece surface, which can easily lead to areas of over-polishing or under-polishing. Secondary fine polishing is required on different equipment, which means that the workpiece needs to be clamped multiple times, affecting polishing efficiency and polishing effect. Summary of the Invention

[0004] The purpose of this invention is to solve the problem that existing polishing equipment has poor polishing efficiency and polishing effect for wire-cut workpieces with complex contours.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A multi-stage polishing device for wire-cut parts includes a base, with a first polishing mechanism and a second polishing mechanism respectively arranged on both sides of the base. A part rotating mechanism is arranged on the front side of the first polishing mechanism. The first polishing mechanism includes a mounting frame, with a first linear module horizontally arranged on the top of the mounting frame. A first movable frame is fixedly connected to the moving platform of the first linear module. A second linear module is horizontally arranged on the side wall of the first movable frame and is perpendicular to the first linear module. A second movable frame is fixedly connected to the moving platform of the second linear module. A first lifting module is arranged on the side of the second movable frame facing the part rotating mechanism. A telescopic shaft is arranged on the side of the lifting platform of the first lifting module facing the part rotating mechanism. The fixed end of the telescopic shaft is rotatably connected to the top of the second movable frame, and the movable end of the telescopic shaft is rotatably connected to the lifting platform of the first lifting module. A polishing motor is vertically fixedly connected to the top of the second movable frame. The rotating shaft of the polishing motor is connected to the fixed end of the telescopic shaft through a belt drive mechanism. A polishing wheel is detachably connected to the bottom of the movable end of the telescopic shaft.

[0007] Furthermore, the polishing wheel is surrounded by a cover, which is semi-cylindrical and located on the side of the polishing wheel away from the part rotation mechanism. The side wall of the cover has openings along the tangent of the polishing wheel.

[0008] Furthermore, the part rotation mechanism includes a rotating motor, which is vertically fixed to the top of the base. The rotating shaft of the rotating motor is detachably connected to a top plate, and a number of limiting pins are vertically arranged on the top of the top plate.

[0009] Furthermore, a first support frame is provided on the side of the rotating motor. A limit cylinder is vertically fixedly connected to the top of the first support frame. The piston rod of the limit cylinder is rotatably connected to an installation ring. A pressure plate is detachably connected to the bottom of the installation ring. Several limit holes are opened at the bottom of the pressure plate. The limit holes are arranged facing the limit pins.

[0010] Furthermore, the mounting ring has a reset hole on its side wall, and the piston rod of the limiting cylinder has a spring pin horizontally arranged on its side wall. The movable end of the spring pin is hemispherical, and the spring pin is detachably connected to the reset hole.

[0011] Furthermore, the second polishing mechanism includes a second support frame, a pair of support plates are provided on the front side of the second support frame, a placement plate is detachably connected to the top of the support plate, a contour groove is provided on the top of the placement plate, a through groove is provided at the bottom of the contour groove, and slots are provided on both sides of the placement plate.

[0012] Furthermore, a connecting plate is horizontally fixed between the opposing sidewalls of the support plate, a lower connecting pipe is vertically slidably connected to the middle of the connecting plate, a lower diverter is detachably connected to the top of the lower connecting pipe, a spring is provided between the bottom of the lower diverter and the connecting plate, and a recycling bin is provided at the bottom of the lower connecting pipe.

[0013] Furthermore, a second lifting module is vertically installed on the top of the second support frame. The lifting platform of the second lifting module is fixedly connected to a lifting seat. A sleeve is fixedly connected to the top of the lifting seat. An upper connecting pipe is fixedly connected inside the sleeve. An upper diverter is detachably connected to the bottom of the upper connecting pipe. A three-way valve is installed at the top of the upper connecting pipe.

[0014] Furthermore, the upper diverter and the lower diverter are arranged facing each other, and both the upper diverter and the lower diverter have sealing rings on their facing end faces. The initial height of the lower diverter is higher than the bottom height of the contour groove.

[0015] Furthermore, the bottom and top of the first support frame are fixedly connected with a plurality of first reinforcing ribs, and the bottom and top of the second support frame are fixedly connected with a plurality of second reinforcing ribs.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] 1. The present invention provides a multi-stage polishing device for wire-cut parts. By setting a first polishing mechanism, it can perform multi-angle and multi-directional contour polishing on the surface of the workpiece, adapting to wire-cut workpieces with different contours such as planes, curved surfaces and stepped surfaces; the part rotation mechanism can drive the workpiece to rotate, realizing continuous circumferential multi-face polishing of the same workpiece without repeated disassembly and repositioning, thus improving polishing accuracy and processing efficiency.

[0018] 2. The multi-stage polishing equipment for wire EDM parts of the present invention, by providing a second polishing mechanism, can form a closed abrasive channel after the upper and lower flow dividers are closed, so that the abrasive enters the deep hole of the workpiece surface through the upper flow divider under pressure, polishes the inner wall of the deep hole, removes the remelted layer and microcracks left on the inner wall of the deep hole by wire EDM, thereby performing fine polishing on the deep hole of the workpiece, and further improving the polishing quality and polishing precision. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of a multi-stage polishing device for wire-cut parts according to the present invention.

[0020] Figure 2 This is a schematic diagram of the first polishing mechanism of a multi-stage polishing device for wire-cut parts according to the present invention.

[0021] Figure 3This is a schematic diagram of the part rotation mechanism of a multi-stage polishing device for wire-cut parts according to the present invention.

[0022] Figure 4 This is a schematic diagram of the second polishing mechanism of a multi-stage polishing device for wire-cut parts according to the present invention.

[0023] Figure 5 This is an enlarged schematic diagram of section A of a multi-stage polishing device for wire-cut parts according to the present invention.

[0024] Figure 6 This is a front view schematic diagram of the second polishing mechanism of a multi-stage polishing device for wire-cut parts according to the present invention.

[0025] In the diagram: 1. Base; 2. First polishing mechanism; 201. Mounting frame; 202. First linear module; 203. First movable frame; 204. Second linear module; 205. Second movable frame; 206. First lifting module; 207. Polishing motor; 208. Belt drive mechanism; 209. Telescopic shaft; 210. Polishing wheel; 211. Cover; 212. Opening; 3. Second polishing mechanism; 301. Second support frame; 302. Second lifting module; 303. Second reinforcing rib; 304. Lifting seat; 305. Sleeve; 306. Three-way valve; 07. Upper diverter; 308. Support plate; 309. Placement plate; 310. Contouring groove; 311. Through groove; 312. Sealing ring; 313. Connecting plate; 314. Lower connecting pipe; 315. Lower diverter; 316. Spring; 317. Recovery bin; 318. Upper connecting pipe; 4. Parts rotation mechanism; 401. Rotating motor; 402. Top plate; 403. Limiting pin; 404. First support frame; 405. Limiting cylinder; 406. Mounting ring; 407. Pressure plate; 408. Limiting hole; 409. Reset hole; 410. First reinforcing rib. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Please see Figures 1-6This embodiment of a multi-stage polishing device for wire-cut parts includes a base 1. A first polishing mechanism 2 and a second polishing mechanism 3 are respectively arranged on both sides of the base 1. The first polishing mechanism 2 is used to polish the wire-cut contour edges of the workpiece, and the second polishing mechanism 3 is used to polish the deep holes of the workpiece. A part rotation mechanism 4 is arranged on the front side of the first polishing mechanism 2 to drive the part to rotate. The first polishing mechanism 2 includes a mounting frame 201. A first linear module 202 is horizontally arranged on the top of the mounting frame 201. A first movable frame 203 is fixedly connected to the movable stage of the first linear module 202. A second linear module 204 is horizontally arranged on the side wall of the first movable frame 203. The second linear module 204 is perpendicular to the first linear module 202. The second linear module 204 is fixedly connected to a second movable frame 205. A first lifting module 206 is provided on the side of the second movable frame 205 facing the part rotation mechanism 4. A telescopic shaft 209 is provided on the side of the lifting platform of the first lifting module 206 facing the part rotation mechanism 4. The fixed end of the telescopic shaft 209 is rotatably connected to the top of the second movable frame 205, and the movable end of the telescopic shaft 209 is rotatably connected to the lifting platform of the first lifting module 206. A polishing motor 207 is vertically fixedly connected to the top of the second movable frame 205. The rotating shaft of the polishing motor 207 is connected to the fixed end of the telescopic shaft 209 through a belt drive mechanism 208. A polishing wheel 210 is detachably connected to the bottom of the movable end of the telescopic shaft 209. The wire-cut workpiece is placed on the part rotating mechanism 4 and clamped and fixed; the first polishing mechanism 2 is activated, and the first linear module 202 and the second linear module 204 drive the polishing wheel 210 to move in two mutually perpendicular directions in the horizontal plane, so that the polishing wheel 210 moves to the edge of the wire-cut contour of the workpiece; the first lifting module 206 drives the lifting platform to rise and fall, driving the movable end of the telescopic shaft 209 and the polishing wheel 210 to move in the vertical direction, so that the polishing wheel 210 contacts the side wall of the workpiece; the polishing motor 207 drives the telescopic shaft 209 to rotate through the belt drive mechanism 208, so that the polishing wheel 210 rotates accordingly, polishing the workpiece. The wire-cut contour edges of the workpiece are polished; during polishing, the part rotation mechanism 4 drives the workpiece to rotate intermittently or continuously, rotating the different wire-cut contour edges of the workpiece sequentially to the working position of the polishing wheel 210, realizing continuous polishing of multiple circumferential surfaces; through the linkage of the first linear module 202, the second linear module 204 and the first lifting module 206, the polishing wheel 210 moves along the contour trajectory of the workpiece to complete the contour polishing of the exposed cut surface; after the contour edges of the workpiece are polished, the deep holes of the workpiece are polished by the second polishing mechanism 3, thereby realizing multi-stage polishing of the workpiece and effectively improving polishing efficiency and polishing accuracy.

[0028] The polishing wheel 210 is surrounded by a cover 211, which is semi-cylindrical and located on the side of the polishing wheel 210 away from the workpiece rotation mechanism 4. An opening 212 is formed on the side wall of the cover 211 along the tangential direction of the polishing wheel 210. During polishing, the cover 211 surrounds the side of the polishing wheel 210 away from the workpiece, blocking the debris and dust generated during polishing. The opening 212, along the tangential direction of the polishing wheel 210, connects to an external negative pressure system. During polishing, debris and dust generated during polishing are promptly removed through the opening 212, keeping the working area clean and preventing debris from scratching the polished surface.

[0029] The part rotation mechanism 4 includes a rotation motor 401, which is vertically fixed to the top of the base 1. The rotating shaft of the rotation motor 401 is detachably connected to a top plate 402, and a number of limiting pins 403 are vertically arranged on the top of the top plate 402. During polishing, the workpiece is placed on the top plate 402, and the workpiece is positioned by inserting the limiting pins 403 on the top of the top plate 402 into the positioning holes at the bottom of the workpiece. The rotation motor 401 drives the top plate 402 and the workpiece to rotate intermittently or continuously around the vertical axis, rotating the different wire-cut contour edges of the workpiece to the working position of the polishing wheel 210 in sequence, so as to achieve continuous polishing of multiple surfaces in the circumferential direction.

[0030] A first support frame 404 is provided on the side of the rotating motor 401. A limit cylinder 405 is vertically fixedly connected to the top of the first support frame 404. The piston rod of the limit cylinder 405 is rotatably connected to an mounting ring 406. A pressure plate 407 is detachably connected to the bottom of the mounting ring 406. Several limit holes 408 are opened at the bottom of the pressure plate 407. The limit holes 408 are arranged facing the limit pins 403. After the workpiece is positioned on the top plate 402, the piston rod of the limiting cylinder 405 extends, driving the mounting ring 406 and the pressure plate 407 to move downwards. The limiting hole 408 at the bottom of the pressure plate 407 aligns with the limiting pin 403 at the top of the top plate 402. The pressure plate 407 presses down to the top of the workpiece, and the limiting pin 403 passes through the positioning hole at the bottom of the workpiece and inserts into the limiting hole 408 of the pressure plate 407, pressing and fixing the workpiece between the top plate 402 and the pressure plate 407. This prevents the workpiece from shifting or falling off during rotation and polishing, improving the stability and safety of the clamping.

[0031] The mounting ring 406 has a reset hole 409 on its side wall. A spring pin is horizontally mounted on the piston rod side wall of the limiting cylinder 405. The movable end of the spring pin is hemispherical, and the spring pin is detachably connected to the reset hole 409. During polishing, the workpiece rotates under the drive of the rotating motor 401. At this time, the limiting pin 403 drives the pressure plate 407 and the mounting ring 406 to rotate synchronously. When the mounting ring 406 rotates, the wall of the reset hole 409 pushes the hemispherical movable end of the spring pin to retract and disengage from the reset hole 409. As the mounting ring 406 continues to rotate, the hemispherical movable end of the spring pin rolls along the outer wall of the mounting ring 406. When the mounting ring 406 rotates 360°, the reset hole 409 rotates again to the position of the spring pin, and the spring pin automatically pops out under the spring force and re-engages in the reset hole 409. This ensures that the initial position of the limiting hole 408 on the pressure plate 407 is always aligned with the limiting pin 403.

[0032] The second polishing mechanism 3 includes a second support frame 301. A pair of support plates 308 are provided on the front side of the second support frame 301. A placement plate 309 is detachably connected to the top of the support plate 308. A contour groove 310 is formed on the top of the placement plate 309, and a through groove 311 is formed at the bottom of the contour groove 310. Slots are formed on both sides of the placement plate 309. The workpiece after preliminary polishing is placed in the contour groove 310 on the top of the placement plate 309. The contour of the contour groove 310 matches the shape of the workpiece to position it. The deep holes of the workpiece (such as cooling holes, positioning holes, wire threading holes, etc.) are opposite to the through groove 311, so that the abrasive can enter the deep hole through the through groove 311 for polishing. The slots on both sides of the placement plate 309 facilitate the insertion and removal of the workpiece.

[0033] A connecting plate 313 is horizontally fixedly connected between the opposing sidewalls of the support plate 308. A lower connecting pipe 314 is vertically slidably connected to the middle of the connecting plate 313. A lower diverter 315 is detachably connected to the top of the lower connecting pipe 314. A spring 316 is provided between the bottom of the lower diverter 315 and the connecting plate 313. A recovery bin 317 is provided at the bottom of the lower connecting pipe 314. A second lifting module 302 is vertically installed on the top of the second support frame 301. A lifting seat 304 is fixedly connected to the lifting platform of the second lifting module 302. A sleeve 305 is fixedly connected to the top of the lifting seat 304. An upper connecting pipe 318 is fixedly connected inside the sleeve 305. An upper diverter 307 is detachably connected to the bottom of the upper connecting pipe 318. A three-way valve 306 is provided at the top of the upper connecting pipe 318. After the workpiece is positioned in the contour groove 310, the second lifting module 302 drives the lifting seat 304 and sleeve 305 to move downwards. The upper connecting pipe 318 drives the upper diverter 307 to descend, aligning with the lower diverter 315 at the upper and lower ends of the deep hole respectively. The spring 316 provides an upward elastic thrust to the lower diverter 315, ensuring that the upper diverter 307 and the lower diverter 315 are in close contact with the workpiece. The abrasive is introduced through the three-way valve 306 and flows along the upper connecting pipe 318 and the upper diverter 307. The abrasive flows into the deep hole and enters the workpiece's deep hole for polishing. Then it flows into the lower diverter 315, and through the lower connecting pipe 314 into the recovery chamber 317 for collection. After polishing, the end of the three-way valve 306 connected to the abrasive is closed, and high-pressure gas is introduced into the other end. The high-pressure gas pushes the abrasive remaining in the pipe and deep hole into the recovery chamber 317 for recycling. Through the above steps, the deep hole of the workpiece can be finely polished, further improving the polishing quality and precision. At the same time, the abrasive can be recycled and reused, reducing costs.

[0034] The upper diverter 307 and the lower diverter 315 are arranged facing each other. Both the upper diverter 307 and the lower diverter 315 have sealing rings 312 on their facing end faces. The initial height of the lower diverter 315 is higher than the bottom height of the contour groove 310. When the upper diverter 307 descends to mate with the lower diverter 315, the sealing rings 312 on both end faces press against the upper and lower surfaces of the workpiece to form a seal. The initial height of the lower diverter 315 is higher than the bottom height of the contour groove 310, ensuring that when the lower diverter 315 is not mates with the upper diverter 307, its top is always higher than the bottom surface of the placement plate 309. This prevents the lower diverter 315 from being too low, which could result in a gap between it and the bottom of the workpiece, thus preventing abrasive leakage.

[0035] The bottom and top of the first support frame 404 are fixedly connected with several first reinforcing ribs 410, and the bottom and top of the second support frame 301 are fixedly connected with several second reinforcing ribs 303. The first reinforcing ribs 410 and the second reinforcing ribs 303 respectively reinforce the structure of the first support frame 404 and the second support frame 301, improving the rigidity and stability of each support frame during equipment operation, ensuring the positioning accuracy and smooth operation of each moving part during polishing, and extending the service life of the equipment.

[0036] Working principle: The wire-cut workpiece is placed on the part rotating mechanism 4 and clamped and fixed; the first polishing mechanism 2 is started, and the first linear module 202 and the second linear module 204 drive the polishing wheel 210 to move in two mutually perpendicular directions in the horizontal plane, so that the polishing wheel 210 moves to the edge of the wire-cut contour of the workpiece; the first lifting module 206 drives the lifting platform to rise and fall, which drives the movable end of the telescopic shaft 209 and the polishing wheel 210 to move in the vertical direction, so that the polishing wheel 210 contacts the side wall of the workpiece; the polishing motor 207 drives the telescopic shaft 209 to rotate through the belt transmission mechanism 208, so that the polishing wheel 210 rotates accordingly. The workpiece's wire-cut contour edges are polished. During polishing, the part rotation mechanism 4 drives the workpiece to rotate intermittently or continuously, rotating different wire-cut contour edges of the workpiece sequentially to the working position of the polishing wheel 210, achieving continuous circumferential multi-faceted polishing. Through the linkage of the first linear module 202, the second linear module 204, and the first lifting module 206, the polishing wheel 210 moves along the contour trajectory of the workpiece to complete the contour polishing of the exposed cut surface. After the contour edges of the workpiece are polished, the deep holes of the workpiece are polished by the second polishing mechanism 3, thereby achieving multi-stage polishing of the workpiece and effectively improving polishing efficiency and polishing accuracy.

[0037] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-stage polishing apparatus for wire-cut parts, characterized by: The system includes a base (1), on which a first polishing mechanism (2) and a second polishing mechanism (3) are respectively provided on both sides. A part rotating mechanism (4) is provided on the front side of the first polishing mechanism (2). The first polishing mechanism (2) includes a mounting frame (201). A first linear module (202) is horizontally provided on the top of the mounting frame (201). A first movable frame (203) is fixedly connected to the moving platform of the first linear module (202). A second linear module (204) is horizontally provided on the side wall of the first movable frame (203). The second linear module (204) is vertically provided with the first linear module (202). A second movable frame (205) is fixedly connected to the moving platform of the second linear module (204). A first lifting module (206) is provided on the side of the movable frame (205) facing the part rotation mechanism (4). A telescopic shaft (209) is provided on the side of the lifting platform of the first lifting module (206) facing the part rotation mechanism (4). The fixed end of the telescopic shaft (209) is rotatably connected to the top of the second movable frame (205). The movable end of the telescopic shaft (209) is rotatably connected to the lifting platform of the first lifting module (206). A polishing motor (207) is vertically fixedly connected to the top of the second movable frame (205). The rotating shaft of the polishing motor (207) is connected to the fixed end of the telescopic shaft (209) through a belt drive mechanism (208). A polishing wheel (210) is detachably connected to the bottom of the movable end of the telescopic shaft (209).

2. A multi-stage polishing apparatus for wire-cut parts according to claim 1, characterized in that: The polishing wheel (210) is surrounded by a cover (211), which is semi-cylindrical and located on the side of the polishing wheel (210) away from the part rotation mechanism (4). The side wall of the cover (211) is provided with an opening (212) along the tangent of the polishing wheel (210).

3. The multi-stage polishing equipment for wire-cut parts according to claim 1, characterized in that: The part rotation mechanism (4) includes a rotation motor (401), which is vertically fixed to the top of the base (1). The rotating shaft of the rotation motor (401) is detachably connected to a top plate (402), and a number of limit pins (403) are vertically arranged on the top of the top plate (402).

4. The multi-stage polishing equipment for wire-cut parts according to claim 3, characterized in that: The rotating motor (401) is provided with a first support frame (404) on its side. A limit cylinder (405) is vertically fixed to the top of the first support frame (404). The piston rod of the limit cylinder (405) is rotatably connected to an mounting ring (406). A pressure plate (407) is detachably connected to the bottom of the mounting ring (406). A plurality of limit holes (408) are provided at the bottom of the pressure plate (407). The limit holes (408) are arranged facing the limit pins (403).

5. A multi-stage polishing device for wire-cut parts according to claim 4, characterized in that: The mounting ring (406) has a reset hole (409) on its side wall. The piston rod of the limiting cylinder (405) has a spring pin horizontally arranged on its side wall. The movable end of the spring pin is hemispherical. The spring pin is detachably connected to the reset hole (409).

6. A multi-stage polishing device for wire-cut parts according to claim 4, characterized in that: The second polishing mechanism (3) includes a second support frame (301). A pair of support plates (308) are provided on the front side of the second support frame (301). A placement plate (309) is detachably connected to the top of the support plate (308). A contour groove (310) is provided on the top of the placement plate (309). A through groove (311) is provided at the bottom of the contour groove (310). Slots are provided on both sides of the placement plate (309).

7. A multi-stage polishing device for wire-cut parts according to claim 6, characterized in that: A connecting plate (313) is horizontally fixed between the opposing sidewalls of the support plate (308). A lower connecting pipe (314) is vertically slidably connected to the middle of the connecting plate (313). A lower diverter (315) is detachably connected to the top of the lower connecting pipe (314). A spring (316) is provided between the bottom of the lower diverter (315) and the connecting plate (313). A recycling bin (317) is provided at the bottom of the lower connecting pipe (314).

8. A multi-stage polishing device for wire-cut parts according to claim 6, characterized in that: The second support frame (301) is vertically provided with a second lifting module (302). The lifting platform of the second lifting module (302) is fixedly connected with a lifting seat (304). The top of the lifting seat (304) is fixedly connected with a sleeve (305). The inside of the sleeve (305) is fixedly connected with an upper connecting pipe (318). The bottom of the upper connecting pipe (318) is detachably connected with an upper diverter (307). The top of the upper connecting pipe (318) is provided with a three-way valve (306).

9. A multi-stage polishing device for wire-cut parts according to claim 8, characterized in that: The upper diversion connector (307) and the lower diversion connector (315) are arranged facing each other. Both the upper diversion connector (307) and the lower diversion connector (315) are provided with sealing rings (312) on their facing end faces. The initial height of the lower diversion connector (315) is higher than the bottom height of the contour groove (310).

10. A multi-stage polishing device for wire-cut parts according to claim 6, characterized in that: The bottom and top of the first support frame (404) are fixedly connected with a number of first reinforcing ribs (410), and the bottom and top of the second support frame (301) are fixedly connected with a number of second reinforcing ribs (303).

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