An IGBT forming processing tool clamp

Abstract

The application discloses a tool clamp for IGBT forming processing, and relates to the technical scheme as follows: a base is fixed on a processing table, a supporting seat is fixedly connected to the upper end surface of the base, a lower die seat is fixedly installed above the supporting seat, a liftable pressing plate is arranged above the base, an upper die seat is fixedly installed on the bottom wall of the pressing plate and coaxially corresponds to the lower die seat, a floating plate is arranged outside the lower die seat, a sliding sleeve is fixedly connected to the bottom wall of the floating plate, the sliding sleeve is slidingly sleeved outside the supporting seat, a fixing sleeve is fixedly installed on the upper end surface of the base, the fixing sleeve is sleeved outside the supporting seat, and a slot is formed between the fixing sleeve and the supporting seat for inserting and moving the sliding sleeve to lift and lower. The liftable floating plate is provided, coaxial sliding guide structures are arranged during processing, the circumferential limiting of the lifting process of the floating plate is realized, deviation, jamming and circumferential deflection are effectively avoided, and the coaxiality of die closing is effectively improved.

Description

Technical Field

[0001] This invention relates to the field of IGBT molding mechanism technology, and more specifically, to a tooling fixture for IGBT molding processing. Background Technology

[0002] IGBTs are core power devices in the power electronics field. The processes in their module production, such as housing pressing, substrate shaping, and sealing ring pressing, all require precision pressing using specialized tooling. This places extremely high demands on mold coaxiality and pressing stability. Currently, IGBT molding tooling with floating buffer structures generally uses single-point guide pillars to limit and guide the floating plate. The core problems are: circumferential swaying and jamming easily occur during the floating plate's lifting and lowering process; the coaxiality of the upper and lower molds is difficult to guarantee; uneven circumferential buffering force and lack of precise pressing stroke limits mean that the rigid impact at the moment of mold closing can easily cause cracking and chipping of thin-walled IGBT components and ceramic substrates; and poor workpiece dimensional consistency makes it difficult to meet the high-precision batch processing requirements of high-quality IGBT components.

[0003] Therefore, a solution needs to be proposed to address this problem. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the present invention aims to provide a tooling fixture for IGBT molding and processing. By setting up a liftable floating plate, the circumferential limit of the floating plate's lifting process can be achieved through a coaxially set sliding guide structure during processing, effectively improving the coaxiality of the mold closing.

[0005] The above-mentioned technical objective of the present invention is achieved through the following technical solution: a tooling fixture for IGBT molding and processing includes a base fixed on a processing table, a support seat fixedly connected to the upper end face of the base, a lower mold seat fixedly installed above the support seat, a liftable pressure plate provided above the base, and an upper mold seat coaxially corresponding to the lower mold seat fixedly installed on the bottom wall of the pressure plate; a floating plate is sleeved on the outside of the lower mold seat, a sliding sleeve is fixedly connected to the bottom wall of the floating plate, the sliding sleeve is slidably sleeved on the outside of the support seat, a fixing sleeve is fixedly installed on the upper end face of the base, the fixing sleeve is sleeved on the outside of the support seat, and a slot is formed between the fixing sleeve and the support seat for the sliding sleeve to be inserted and moved up and down.

[0006] By adopting the above technical solution, during the stamping process of the pressure plate, the sliding sleeve and the slot form a coaxial nested sliding structure, which can circumferentially limit the floating plate, reduce the swaying and jamming of the floating plate during the lifting and lowering process, and improve the coaxiality of the upper and lower dies during the stamping process. The floating plate can move downward together with the pressure plate, which can effectively weaken the rigid impact at the moment of die closing, reduce the occurrence of workpiece cracking and chipping due to excessive instantaneous impact force, and improve the processing quality of the workpiece.

[0007] The present invention is further configured such that: four support rods are fixedly connected to the upper end face of the base, the four support rods are positioned corresponding to the four corners of the floating plate, and the floating plate is provided with through holes for the support rods to pass through.

[0008] By adopting the above technical solution, the floating plate will slide along the support rod during the lifting process. The support rods at the four corners can further limit the circumferential movement of the floating plate, effectively improving the stability of the floating plate during the lifting process and further improving the mold closing accuracy.

[0009] The present invention is further configured such that: a plurality of limiting rods arranged in a ring array are fixedly connected to the upper end face of the base, and a plurality of limiting holes are provided on the floating plate for the limiting rods to pass through.

[0010] By adopting the above technical solution, the limit rods distributed in a ring array can limit the floating plate from multiple positions in the circumference. Combined with the sliding structure formed by the central sliding sleeve and slot, the ability to resist circumferential deflection during the lifting and lowering of the floating plate is further improved, ensuring the stability of the lifting and lowering of the floating plate and further improving the coaxiality of the mold closing.

[0011] The present invention is further configured such that: an upper pressure ring is fixedly connected to the bottom wall of the pressure plate, and a lower pressure ring corresponding to the position of the upper pressure ring is fixedly connected to the upper end face of the floating plate.

[0012] By adopting the above technical solution, the upper pressure ring and the lower pressure ring make contact first when the mold is closed, forming a pre-pressure buffer during the stamping process, thus avoiding direct rigid impact between the upper mold base and the workpiece.

[0013] The present invention is further configured such that buffer pads are provided on the sides of the upper pressure ring and the lower pressure ring that are close to each other.

[0014] By adopting the above technical solution, the buffer pad can buffer the impact during mold closing, reduce the impact force during the stamping process, and reduce the risk of the workpiece being cracked and chipped.

[0015] The invention is further configured such that: a negative pressure air chamber is provided inside the support base, and a negative pressure connector is provided on the side wall of the support base, the negative pressure connector is connected to the negative pressure air chamber, and the negative pressure connector is used to connect to an external negative pressure air source; a plurality of vertically penetrating vacuum adsorption holes are provided on the lower mold base, and a docking air hole connected to the negative pressure stabilizing air chamber is provided on the upper end face of the support base, the docking air hole and the vacuum adsorption hole are positioned one-to-one and connected to each other.

[0016] By adopting the above technical solution, after placing the workpiece on the lower mold base before processing, air can be drawn out by the negative pressure air source to form a negative pressure suction at the vacuum adsorption hole, which stably adsorbs and fixes the workpiece on the lower mold base, avoiding displacement of the workpiece during processing and further ensuring processing accuracy.

[0017] In summary, the present invention has the following beneficial effects: This invention forms a multi-circumferential limiting structure by setting a sliding sleeve and slot coaxially nested outside the support base. With the help of guide rods or limiting rods distributed on the periphery, it can stably guide the lifting and lowering process of the floating plate, effectively reducing the swaying, jamming and circumferential deflection of the floating plate during lifting and lowering, and greatly improving the coaxiality of the upper and lower molds when they are closed. Meanwhile, the present invention, through the use of a liftable floating plate and a buffer structure, can effectively weaken the rigid impact at the moment of mold closing, reduce the probability of cracking and chipping of IGBT thin-walled components and ceramic substrates, and meet the needs of high-precision batch processing of high-quality IGBT components. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the structure of the present invention; Figure 3 This is a schematic diagram of the internal structure of the present invention.

[0019] In the diagram: 1. Base; 2. Support seat; 3. Lower mold seat; 4. Pressure plate; 5. Floating plate; 6. Sliding sleeve; 7. Fixing sleeve; 8. Slot; 9. Support rod; 10. Limiting rod; 11. Limiting hole; 12. Upper pressure ring; 13. Lower pressure ring. Detailed Implementation

[0020] To enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of this application can be combined with each other.

[0021] In the description of this invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0022] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "set up / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0023] The present invention will now be described in detail with reference to the accompanying drawings.

[0024] A tooling fixture for IGBT molding and processing, such as Figures 1-3 As shown, the system includes a base 1 fixed to a processing table. A support base 2 is fixedly connected to the upper surface of the base 1, and a lower mold base 3 is fixedly installed above the support base 2. A liftable pressure plate 4 is provided above the base 1, and an upper mold base coaxially corresponding to the lower mold base 3 is fixedly installed on the bottom wall of the pressure plate 4. A floating plate 5 is sleeved on the outside of the lower mold base 3, and a sliding sleeve 6 is fixedly connected to the bottom wall of the floating plate 5. The sliding sleeve 6 is slidably sleeved on the outside of the support base 2. A fixing sleeve 7 is fixedly installed on the upper surface of the base 1, and the fixing sleeve 7 is sleeved on the outside of the support base 2. A slot 8 is formed between the fixing sleeve 7 and the support base 2 for the sliding sleeve 6 to be inserted and moved up and down.

[0025] Four support rods 9 are fixedly connected to the upper surface of the base 1. The positions of the four support rods 9 correspond to the four corners of the floating plate 5. The floating plate 5 has through holes for the support rods 9 to pass through. Four covers are fixedly connected to the bottom wall of the pressure plate 4. The positions of the four covers correspond to the positions of the four support rods 9. When the pressure plate 4 is pressed down, the covers will close one by one at the end of the support rod 9 away from the base.

[0026] A number of limiting rods 10 arranged in a ring array are fixedly connected to the upper end face of the base 1, and a number of limiting holes 11 are provided on the floating plate 5 for the limiting rods 10 to pass through. A flange is fixedly provided at the end of the limiting rod 10 away from the base 1, and a boss that abuts against the flange is provided on the inner wall of the limiting hole 10.

[0027] An upper pressure ring 12 is fixedly connected to the bottom wall of the pressure plate 4, and a lower pressure ring 13, corresponding to the position of the upper pressure ring 12, is fixedly connected to the upper end face of the floating plate 5. Both the upper pressure ring 12 and the lower pressure ring 13 have buffer pads on their sides closest to each other; the buffer pads are made of rubber with good elastic deformation capability. Furthermore, the lower mold base 3 and the lower pressure ring 13 can be disassembled and replaced from the support base 2 and the floating plate 5, making them suitable for products of different specifications and thus having a wide range of applications.

[0028] The support base 2 has a negative pressure air chamber inside, and a negative pressure connector is provided on the side wall of the support base 2. The negative pressure connector is connected to the negative pressure air chamber and is used to connect to an external negative pressure air source. The lower mold base 3 has several vertically penetrating vacuum adsorption holes. The upper end face of the support base 2 has a docking air hole that is connected to the negative pressure stabilizing air chamber. The docking air hole and the vacuum adsorption hole are in one-to-one correspondence and interconnected.

[0029] Working principle: Before processing, the IGBT workpiece to be processed is placed in the predetermined position of the lower mold base 3. Then, the external negative pressure air source is turned on to evacuate the negative pressure air chamber. Through the interconnected docking air holes and vacuum adsorption holes, a uniform negative pressure suction force is formed on the upper surface of the lower mold base 3, which stably adsorbs and fixes the IGBT workpiece on the lower mold base 3, avoiding displacement of the workpiece during processing.

[0030] During processing, the pressure plate 4 drives the upper mold base to move downward. During the downward movement of the upper mold base, the upper pressure ring 12 on the bottom wall of the pressure plate 4 first contacts the lower pressure ring 13 on the upper end face of the floating plate 5. The buffer pad initially weakens the impact force between the upper pressure ring 12 and the lower pressure ring 13. Then, the pressure plate 4 continues to press down, driving the floating plate 5 to move downward synchronously. During the downward movement of the floating plate 5, the sliding sleeve 6 at the center position slides downward along the slot 8 between the fixed sleeve 7 and the support base 2. With the help of the support rods 9 at the corners or the limit rods 10 distributed in a ring array, the floating plate 5 is subject to multiple circumferential limits, ensuring that the floating plate 5 always descends smoothly in the preset direction. This effectively avoids the floating plate 5 from swaying, jamming, or circumferential deflection during its descent, ensuring the coaxiality of the mold closing between the upper mold base and the lower mold base 3. During the downward movement of the floating plate 5, the lower mold base 3 on the support base 2 and the workpiece to be processed on the lower mold base 3 will remain in place until the upper mold base and the lower mold base 3 complete the mold closing, completing the pressing and molding process of the IGBT workpiece.

[0031] During mold closing, the floating plate 5 moves downward synchronously with the pressure plate 4, which weakens the rigid impact at the moment of mold closing. Combined with the buffering effect of the buffer pad, this significantly reduces the risk of cracking and chipping of IGBT thin-walled components and ceramic substrates, effectively improving the consistency of workpiece forming dimensions and meeting the high-precision batch processing requirements of high-quality IGBT components. After processing, the pressure plate 4 returns to its original position, and the floating plate 5 moves upward and returns to its original position accordingly. The processed workpiece can then be removed by disconnecting the negative pressure air source.

[0032] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions falling within the scope of the present invention's concept are within the scope of protection of the present invention. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A tooling fixture for IGBT molding and processing, comprising a base (1) fixed on a processing table, characterized in that: A support base (2) is fixedly connected to the upper end face of the base (1). A lower mold base (3) is fixedly installed above the support base (2). A liftable pressure plate (4) is provided above the base (1). An upper mold base coaxially corresponding to the lower mold base (3) is fixedly installed on the bottom wall of the pressure plate (4). A floating plate (5) is sleeved on the outside of the lower mold base (3). A sliding sleeve (6) is fixedly connected to the bottom wall of the floating plate (5). The sliding sleeve (6) is slidably sleeved on the outside of the support base (2). A fixing sleeve (7) is fixedly installed on the upper end face of the base (1). The fixing sleeve (7) is sleeved on the outside of the support base (2). A slot (8) is formed between the fixing sleeve (7) and the support base (2) for the sliding sleeve (6) to be inserted and moved up and down.

2. The tooling fixture for IGBT molding and processing according to claim 1, characterized in that: Four support rods (9) are fixedly connected to the upper end face of the base (1). The four support rods (9) correspond to the four corners of the floating plate (5). The floating plate (5) has through holes for the support rods (9) to pass through.

3. The tooling fixture for IGBT molding and processing according to claim 1, characterized in that: The upper end face of the base (1) is fixedly connected with several limiting rods (10) arranged in a ring array, and the floating plate (5) is provided with several limiting holes (11) for the limiting rods (10) to pass through.

4. The tooling fixture for IGBT molding and processing according to claim 1, characterized in that: An upper pressure ring (12) is fixedly connected to the bottom wall of the pressure plate (4), and a lower pressure ring (13) corresponding to the position of the upper pressure ring (12) is fixedly connected to the upper end face of the floating plate (5).

5. The tooling fixture for IGBT molding and processing according to claim 4, characterized in that: Both the upper pressure ring (12) and the lower pressure ring (13) have buffer pads on the side closest to each other.

6. The tooling fixture for IGBT molding and processing according to claim 1, characterized in that: The support base (2) has a negative pressure air chamber inside, and a negative pressure connector is provided on the side wall of the support base (2). The negative pressure connector is connected to the negative pressure air chamber and is used to connect to an external negative pressure air source. The lower mold base (3) has several vertically penetrating vacuum adsorption holes. The upper end face of the support base (2) has a docking air hole that is connected to the negative pressure stabilizing air chamber. The docking air hole and the vacuum adsorption hole are in one-to-one correspondence and interconnected.

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