Epoxy plastic packaging material production quality closed loop control method and system

Abstract

The embodiment of the present application provides a kind of epoxy plastic sealing material production quality closed loop control method and system, belong to process control technical field.The method comprises: obtaining quality detection sample in epoxy plastic sealing material production process, and determining quality state according to quality detection sample;When quality state meets preset adjustment condition, the mixing temperature adjustment information is determined according to quality state, and the mixing temperature is adjusted based on mixing temperature adjustment information;According to the material flow state corresponding to the mixing temperature after adjustment, the stable response boundary corresponding to the mixing temperature adjustment is determined;After obtaining the quality detection sample after stable response boundary, the verification result corresponding to the mixing temperature adjustment is determined according to the quality detection sample after stable response boundary, and the current mixing temperature is kept or the mixing temperature is re-adjusted according to the verification result.The present application scheme filters effective quality feedback through stable response boundary, avoids repeated temperature adjustment, and improves the stability of epoxy plastic sealing material production quality.

Description

Technical Field

[0001] This invention relates to the field of process control technology, specifically to a closed-loop control method and system for the production quality of epoxy molding compounds. Background Technology

[0002] Epoxy molding compounds are key materials used in the packaging of semiconductor devices. Their production typically involves multiple steps, including raw material mixing, melt blending, cooling, crushing, and subsequent processing. Among these, the blending process significantly impacts the melt state of the epoxy resin system, the degree of filler dispersion, and the pre-reaction state of the material. Changes in blending temperature directly affect the flow properties and curing characteristics of the epoxy molding compound. Therefore, in actual production, it is usually necessary to adjust the blending process parameters based on the finished product testing results to ensure that different batches of products meet quality requirements.

[0003] In existing quality control methods for epoxy molding compound production, samples are typically obtained after a certain production process is completed, and the product quality is judged by testing indicators such as the spiral flow length and gelation time of the samples. When deviations are found in the test results, production parameters such as mixing temperature are adjusted based on the quality test results to improve the quality of subsequent products. However, due to the continuous nature of the epoxy molding compound production process and the existence of a certain amount of material retention inside the mixing equipment, there is a time delay between the execution of production parameter adjustments and their actual impact on the quality of subsequent finished products. In other words, after the mixing temperature changes, some material located inside the production equipment or in the conveying path may still be affected by the process conditions before the adjustment.

[0004] In the above situation, existing control methods typically rely on the sequential testing time to directly use subsequent test results for feedback and judgment, making it difficult to accurately distinguish whether the tested samples have already reflected the current adjusted production state. When the adjusted process conditions have not yet fully taken effect on subsequent materials, the quality deviations obtained from continuous testing may still originate from the production process before the adjustment. If the mixing parameters are adjusted again based on this, the same quality deviation is easily fed back repeatedly, leading to excessive adjustment of the mixing temperature and even causing fluctuations in product quality.

[0005] Therefore, in the existing quality control process of epoxy molding compound production, it is urgent to solve the problem of how to accurately judge whether the quality test results have corresponded to the adjusted production status after the production parameters are adjusted, so as to avoid the problem of repeated adjustments to the mixing parameters due to the lag in quality feedback. Summary of the Invention

[0006] The purpose of this invention is to provide a closed-loop control method and system for epoxy molding compound production quality, so as to at least solve the problem of delayed quality feedback after the adjustment of mixing parameters in the prior art, which leads to repeated adjustments of mixing parameters.

[0007] To achieve the above objectives, the first aspect of the present invention provides a closed-loop control method for the production quality of epoxy molding compound. The method includes: acquiring quality inspection samples during the epoxy molding compound production process and determining the quality status based on the quality inspection samples; when the quality status meets preset adjustment conditions, determining mixing temperature adjustment information based on the quality status and adjusting the mixing temperature based on the mixing temperature adjustment information; determining a stable response boundary corresponding to the mixing temperature adjustment based on the material flow state corresponding to the adjusted mixing temperature; acquiring quality inspection samples after the stable response boundary and determining a verification result corresponding to the mixing temperature adjustment based on the quality inspection samples after the stable response boundary; and maintaining the current mixing temperature or readjusting the mixing temperature based on the verification result.

[0008] A second aspect of the present invention provides a closed-loop control system for the production quality of epoxy molding compound. The system includes: a data acquisition unit for acquiring quality inspection samples during the epoxy molding compound production process and determining the quality status based on the quality inspection samples; a temperature adjustment unit for determining mixing temperature adjustment information based on the quality status when the quality status meets preset adjustment conditions, and adjusting the mixing temperature based on the mixing temperature adjustment information; a boundary determination unit for determining a stable response boundary corresponding to the mixing temperature adjustment based on the material flow state corresponding to the adjusted mixing temperature; and a correction unit for acquiring quality inspection samples after the stable response boundary, determining the verification result corresponding to the mixing temperature adjustment based on the quality inspection samples after the stable response boundary, and maintaining the current mixing temperature or readjusting the mixing temperature based on the verification result.

[0009] Through the above technical solution, this invention analyzes the quality status of quality inspection samples during the epoxy molding compound production process. When a quality deviation is detected, the corresponding mixing temperature adjustment information is determined. Combined with the adjusted material flow state, a stable response boundary is determined, ensuring that the quality feedback process matches the actual process adjustment state. By verifying the mixing temperature adjustment effect using only quality inspection samples after the stable response boundary, the delayed detection results corresponding to materials before adjustment or materials in the transition stage are avoided from repeatedly triggering temperature adjustments, thereby reducing quality fluctuations caused by excessive correction of mixing parameters. Simultaneously, based on the verification results, the current mixing temperature is maintained or readjusted, achieving dynamic closed-loop control in the epoxy molding compound production process, improving the accuracy of quality control and the stability of the production process.

[0010] Other features and advantages of the embodiments of the present invention will be described in detail in the following detailed description section. Attached Figure Description

[0011] The accompanying drawings are provided to further illustrate embodiments of the present invention and form part of the specification. They are used together with the following detailed description to explain the embodiments of the present invention, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a flowchart of the steps of a closed-loop control method for epoxy molding compound production quality provided by one embodiment of the present invention; Figure 2 This is a schematic diagram illustrating the change in mass deviation after mixing temperature adjustment with cumulative output mass, provided by one embodiment of the present invention. Figure 3 This is a system structure diagram of a closed-loop control system for epoxy molding compound production quality provided in one embodiment of the present invention; Figure 4 This is an internal structural diagram of a computer device provided in one embodiment of the present invention. Detailed Implementation

[0012] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0013] like Figure 1 As shown, embodiments of the present invention provide a closed-loop control method for the production quality of epoxy molding compounds, the method comprising: Step S1: Obtain quality inspection samples during the epoxy molding compound production process, and determine the quality status based on the quality inspection samples.

[0014] Specifically, the spiral flow length and gelation time corresponding to the quality test sample are obtained; the spiral flow length and the gelation time are compared with the corresponding preset quality ranges respectively; when the spiral flow length and the gelation time both exceed the corresponding preset quality ranges and the deviation direction meets the preset same-direction condition, the corresponding quality state is determined as an abnormal mixing temperature state.

[0015] In this embodiment of the invention, after the epoxy molding compound has undergone mixing, cooling, and crushing, a quality inspection sample is obtained at a preset sampling location. The quality inspection sample corresponds to the epoxy molding compound output at the current production stage and is used to reflect the impact of the mixing process on the material's flow properties and curing properties. Performance testing is performed on the quality inspection sample to obtain its corresponding spiral flow length and gelation time.

[0016] The spiral flow length characterizes the melt flow capability of the epoxy molding compound under specified temperature and pressure conditions, while the gelation time characterizes the time required for the epoxy molding compound to transition from a flowing state to a gelled state under specified heating conditions. By simultaneously obtaining the spiral flow length and the gelation time, the problem that a single quality indicator cannot accurately reflect the impact of mixing temperature changes on the material state is avoided.

[0017] Furthermore, the spiral flow length is compared with the corresponding first preset mass range, and the gelation time is compared with the corresponding second preset mass range. For example, under the current epoxy molding compound formulation and production conditions, the first preset mass range corresponding to the spiral flow length is set to 90mm~120mm, and the second preset mass range corresponding to the gelation time is set to 40s~70s. When the detected spiral flow length is less than 90mm and the gelation time is less than 40s, it is determined that both deviate from the corresponding preset mass range and the deviation direction is consistent.

[0018] Furthermore, when both the spiral flow length and the gelation time exceed the corresponding preset mass range, and their deviation directions meet the preset same-direction condition, the corresponding mass state is determined to be an abnormal mixing temperature state. The preset same-direction condition is used to determine whether multiple mass indicators collectively reflect the material state shift caused by changes in mixing temperature. For example, a decrease in spiral flow length and a shortening of gelation time indicate that the material may have an excessively high mixing thermal history, leading to an increased degree of pre-reaction.

[0019] The above method converts the quality inspection results into a quality status related to the mixing temperature, providing a basis for subsequent determination of mixing temperature adjustment information. The quality status is not limited to a combination of the two indicators mentioned above; as long as multiple quality indicators can jointly reflect the influence of the mixing temperature, the relevant inspection indicators and corresponding preset quality ranges are all within the scope of this solution.

[0020] Step S2: When the quality status meets the preset adjustment conditions, determine the mixing temperature adjustment information according to the quality status, and adjust the mixing temperature based on the mixing temperature adjustment information.

[0021] Specifically, when the quality state meets the preset adjustment conditions, the mixing temperature adjustment information is determined based on the quality state, including: determining the mixing temperature adjustment direction based on the quality deviation direction corresponding to the quality state; determining the mixing temperature adjustment amount based on the quality deviation degree corresponding to the quality state; and generating the mixing temperature adjustment information based on the mixing temperature adjustment direction and the mixing temperature adjustment amount.

[0022] Furthermore, adjusting the mixing temperature based on the mixing temperature adjustment information includes: determining a target mixing temperature based on the mixing temperature adjustment information; obtaining the temperature difference between the current mixing temperature and the target mixing temperature, and determining a transition temperature adjustment amount based on the temperature difference; and performing phased control of the temperature regulation device of the mixing equipment according to the transition temperature adjustment amount, so that the actual mixing temperature is gradually adjusted to the target mixing temperature.

[0023] In this embodiment of the invention, when the quality state determined in step S1 is an abnormal mixing temperature state, it is further determined whether the quality state meets preset adjustment conditions. The preset adjustment conditions are used to limit whether the current quality deviation belongs to an abnormal state that can be improved by adjusting the mixing temperature. For example, when the spiral flow length is lower than the corresponding preset lower limit of the quality range, and the gelation time is also lower than the corresponding preset lower limit of the quality range, it is determined that the current quality state meets the preset adjustment conditions, and the mixing temperature adjustment process is initiated.

[0024] Furthermore, the direction of mixing temperature adjustment is determined based on the direction of mass deviation corresponding to the aforementioned mass state. Specifically, when both the spiral flow length and gelation time are below the corresponding preset mass range, it indicates that the epoxy molding compound is subjected to excessive heat during mixing, increasing the degree of material pre-reaction; therefore, lowering the mixing temperature is determined as the corresponding adjustment direction. Conversely, when both the spiral flow length and gelation time are above the corresponding preset mass range, it indicates that the material is not sufficiently heated; therefore, raising the mixing temperature is determined as the corresponding adjustment direction.

[0025] Furthermore, the mixing temperature adjustment amount is determined based on the degree of quality deviation corresponding to the quality state. The degree of quality deviation is determined according to the deviation between the quality test results and a preset quality range. For example, if the current spiral flow length is 85mm, which is lower than the preset lower limit of 90mm, the deviation is relatively small; when the spiral flow length is 70mm, the deviation increases, corresponding to a larger temperature adjustment amount. To avoid excessive temperature changes causing further fluctuations in the material state, the mixing temperature adjustment amount is limited to a preset adjustment range, for example, setting the single temperature adjustment amount to 1℃~5℃.

[0026] Furthermore, mixing temperature adjustment information is generated based on the mixing temperature adjustment direction and the mixing temperature adjustment amount. This mixing temperature adjustment information includes a target mixing temperature and a corresponding temperature adjustment direction. For example, if the current mixing temperature is 90°C, and the temperature adjustment direction is determined to decrease based on the mass condition, and the temperature adjustment amount is determined to be 3°C, then mixing temperature adjustment information with a target mixing temperature of 87°C is generated.

[0027] Furthermore, the target mixing temperature is determined based on the mixing temperature adjustment information, the temperature difference between the current mixing temperature and the target mixing temperature is obtained, and the transition temperature adjustment amount is determined based on the temperature difference. Since epoxy molding compounds typically contain a high proportion of inorganic fillers, the overall heat capacity of the mixed material is large. If the equipment temperature is directly adjusted to the target value, it can easily cause a lag in the actual material temperature change or local temperature fluctuations. Therefore, the overall adjustment process is divided into multiple temperature transition stages based on the temperature difference. For example, if the current mixing temperature is 90℃, the target mixing temperature is 87℃, and the temperature difference is 3℃, the temperature is adjusted sequentially by a transition temperature adjustment amount of 1℃ per stage.

[0028] The temperature regulation device of the mixing equipment is controlled in stages according to the transition temperature adjustment amount, so that the actual mixing temperature is gradually adjusted to the target mixing temperature, and the adjusted mixing temperature state is used as the basis for determining the stable response boundary.

[0029] By employing the above methods, the direction and magnitude of targeted mixing temperature adjustments are determined based on the quality status. Furthermore, a gradual temperature adjustment is implemented, taking into account the thermal response characteristics of the epoxy molding compound during mixing, to prevent further deviations in material quality status due to sudden temperature changes. The methods for determining the temperature adjustment direction and amount, as well as the phased adjustment strategy, are all within the scope of this solution. While ensuring closed-loop adjustment of the mixing temperature based on quality status, specific adjustment parameters can be matched according to different formulations and production conditions.

[0030] Preferably, after the upstream temperature control section performs a transitional temperature adjustment, if the corresponding jacket return water temperature difference gradually decreases and the main engine torque recovers to the preset stable range after a short period of fluctuation, then it is determined that the temperature control section has completed heat load release, and the temperature adjustment is performed on the next temperature control section according to the material conveying direction. If the jacket return water temperature difference continues to be higher than the preset temperature difference threshold, then the current temperature of the downstream temperature control section is maintained, and the single-stage adjustment amount of the upstream temperature control section is reduced. This ensures that the temperature changes in each temperature control section match the actual heat absorption process of the high-filler material, avoiding the superposition of local thermal processes caused by simultaneous changes in multiple temperature control sections, while not changing the subsequent processing logic of determining the stable response boundary based on the material flow state.

[0031] Step S3: Determine the stable response boundary corresponding to the adjustment of the mixing temperature based on the material flow state corresponding to the adjusted mixing temperature.

[0032] Specifically, the material flow status is obtained when the mixing temperature adjustment is completed; the material response process after the mixing temperature adjustment is determined based on the material flow status. The material proportion corresponding to the adjusted mixing temperature is determined based on the material response process; when the material proportion corresponding to the adjusted mixing temperature reaches the preset stable ratio, the corresponding material flow position is determined as the stable response boundary.

[0033] Furthermore, the process of achieving a preset stable ratio for the material proportion corresponding to the adjusted mixing temperature includes: obtaining the effective retention volume and material conveying speed of the mixing equipment; determining the material response volume after the mixing temperature adjustment based on the effective retention volume and the material conveying speed; determining the material proportion corresponding to the adjusted mixing temperature based on the ratio of the material response volume to the total volume of the corresponding material flow area; and determining that the stable response condition is met when the material proportion corresponding to the adjusted mixing temperature reaches the preset stable ratio.

[0034] Furthermore, determining the corresponding material flow position as the stable response boundary includes: obtaining the material homogenization state parameters corresponding to the material flow position; determining the stable flow position of the material corresponding to the adjusted mixing temperature based on the material homogenization state parameters; correcting the position where the proportion of the material corresponding to the adjusted mixing temperature reaches a preset stable ratio based on the stable flow position; and determining the corrected material flow position as the stable response boundary.

[0035] In this embodiment of the invention, after the mixing temperature adjustment is completed, the material flow state corresponding to the completion of the mixing temperature adjustment is obtained. The completion of the mixing temperature adjustment refers to the time point at which the actual mixing temperature reaches the target mixing temperature and remains within a preset stable range, rather than the time point at which the temperature adjustment command is issued. Due to the thermal inertia of the equipment and material retention during the epoxy molding compound mixing process, there is a time difference between the control action of the temperature adjustment device and the actual effect of the adjusted mixing temperature on the material. Therefore, the material state when the actual mixing temperature is stable is used as the starting point for response analysis.

[0036] The material flow state includes the material retention state inside the mixing equipment, the material conveying speed, and the positional relationship of the material moving from the mixing area to the subsequent processing area. Based on the material flow state, the material response process after adjusting the mixing temperature is determined to describe the propagation process of the adjusted mixing temperature in the continuously produced material.

[0037] Furthermore, the material proportion corresponding to the adjusted mixing temperature is determined based on the material response process. Specifically, the effective holding volume and material conveying speed of the mixing equipment are obtained. The effective holding volume characterizes the material storage space within the mixing equipment that actually participates in the temperature response process, and is determined based on the equipment's structural dimensions, screw conveying area, and material holding capacity under normal production conditions. The material conveying speed characterizes the material conveying capacity through the mixing area per unit time.

[0038] Based on the effective retention volume and the material conveying speed, the material response volume after adjusting the mixing temperature is determined. For example, if the effective retention volume of the mixing equipment is 30L and the material conveying speed is 5L / min, then when the adjusted mixing temperature affects the material flowing backward from the mixing zone, it needs to travel the corresponding material conveying distance to gradually form a new stable state. The corresponding material response area is determined based on the actual equipment length, conveying speed, and material capacity of subsequent processing steps in the actual production process.

[0039] Furthermore, based on the ratio between the material response volume and the total volume of the corresponding material flow area, the proportion of material corresponding to the adjusted mixing temperature is determined. For example, when the material volume corresponding to the area affected by the adjusted mixing temperature is 45L, and the total volume of the corresponding material flow area is 50L, the proportion of material corresponding to the adjusted mixing temperature is determined to be 90%. When the proportion of material corresponding to the adjusted mixing temperature reaches a preset stable ratio, the stable response condition is considered met. The preset stable ratio is used to determine whether the adjusted mixing temperature has sufficiently affected the subsequent production materials. For example, the preset stable ratio is set to 85%–95%, and in this embodiment, it is set to 90%. When the proportion of material corresponding to the adjusted mixing temperature reaches 90%, it is considered that the subsequent quality inspection samples can stably reflect the temperature adjustment effect.

[0040] Furthermore, to avoid judgment bias caused by determining the stable response position solely based on the material flow distance, material homogenization state parameters corresponding to the material flow position are obtained. These parameters reflect the mixing stability of the epoxy molding compound between the resin system and inorganic fillers after mixing. Specifically, the material homogenization state parameters are determined based on torque changes, discharge pressure changes, and material temperature fluctuations during the mixing process. For example, in continuous production, when the equipment torque change per unit time is lower than a preset fluctuation range, and the discharge temperature change tends to stabilize, the corresponding material flow position is determined to have reached a homogenized stable state.

[0041] The stable flow position of the material corresponding to the adjusted mixing temperature is determined based on the material homogenization state parameters. The position where the material proportion corresponding to the adjusted mixing temperature reaches a preset stable ratio is then corrected based on this stable flow position. Specifically, if the position where the material proportion reaches the preset stable ratio is located in an unstable material homogenization region, this position is corrected until the material homogenization state reaches a stable position; if the position where the material proportion reaches the preset stable ratio already meets the homogenization stability condition, this position remains unchanged. The corrected material flow position is then determined as the stable response boundary.

[0042] Specifically, the material within the effective retention volume of the mixing equipment when the mixing temperature is adjusted is defined as the pre-adjustment retained material, and the discharge process of the pre-adjustment retained material is tracked along the material conveying direction. As the material continuously flows according to the material conveying speed, the adjusted material entering the mixing equipment gradually replaces the pre-adjustment retained material, and the volume of the adjusted material that has been replaced and flowed to the corresponding material flow position is defined as the material response volume. For any material flow position, the volume previously replaced by the adjusted material at that position is compared with the total volume of the corresponding material flow area to determine the proportion of material corresponding to the adjusted mixing temperature. Thus, the material response volume gradually increases with the actual material flow process and is not predetermined due to production pauses or changes in conveying speed, thereby ensuring that the stable response boundary corresponds to the actual material propulsion state.

[0043] By combining the material retention characteristics, conveying status and homogenization status during the continuous mixing process of epoxy molding compound, the stable response boundary is determined in the above manner. This allows subsequent quality inspection samples to correspond to production materials that have been fully affected by the adjusted mixing temperature, thus avoiding repeated triggering of mixing temperature adjustments by the test results corresponding to materials before adjustment or materials in the transition stage.

[0044] It should be noted that the specific methods for obtaining and the value ranges of the effective retention volume, material conveying speed, preset stable ratio, and material homogenization state parameters are set according to the structure of different mixing equipment, production speed, and epoxy molding compound formulation. As long as the adjusted mixing temperature range can be reflected and the stable response boundary can be determined, all fall within the protection scope of this solution.

[0045] Step S4: Obtain the quality inspection sample after the stable response boundary, and determine the verification result corresponding to the mixing temperature adjustment based on the quality inspection sample after the stable response boundary. Based on the verification result, maintain the current mixing temperature or readjust the mixing temperature.

[0046] Specifically, obtaining quality inspection samples after the stable response boundary and determining the verification result corresponding to the mixing temperature adjustment based on the quality inspection samples after the stable response boundary includes: obtaining continuous quality inspection samples located after the stable response boundary; determining the trend of quality state change after the mixing temperature adjustment based on the quality state and quality inspection result corresponding to each quality inspection sample; determining that the mixing temperature adjustment verification is passed when the quality state corresponding to the continuous quality inspection samples all meet the preset stability conditions, otherwise determining that the mixing temperature adjustment verification is not passed.

[0047] Furthermore, maintaining the current mixing temperature or readjusting the mixing temperature based on the verification result includes: maintaining the current mixing temperature when the verification result is a pass; determining the quality status deviation corresponding to the current mixing temperature based on the quality status of the quality inspection sample after the stable response boundary when the verification result is a fail; determining new mixing temperature adjustment information based on the quality status deviation; and readjusting the mixing temperature based on the new mixing temperature adjustment information.

[0048] In this embodiment of the invention, after determining the stable response boundary in step S3, continuous quality inspection samples located after the stable response boundary are obtained. Since the stable response boundary represents the range within which the adjusted mixing temperature has fully affected the subsequent material, the quality inspection samples obtained after this boundary can reflect the actual production state after the current mixing temperature adjustment.

[0049] The continuous quality inspection samples are obtained at a preset sampling interval, which is determined based on the epoxy molding compound production speed and the quality inspection cycle. For example, in continuous production, one quality inspection sample is obtained after each preset quality of product output. In this embodiment, one quality inspection sample is obtained for every 20kg of epoxy molding compound output, and three quality inspection samples are obtained consecutively for verification. By using continuous quality inspection samples for judgment, the influence of instantaneous material fluctuations, detection errors, or uneven local mixing on individual samples is avoided.

[0050] Furthermore, based on the quality status and quality test results of each of the aforementioned quality test samples, the trend of quality status change after the mixing temperature adjustment is determined. The quality status is used to characterize whether the spiral flow length and gelation time are within a preset quality range, and the quality test results are used to record the specific changes in the corresponding test indicators.

[0051] For example, before adjusting the mixing temperature, the spiral flow length of the quality test sample was 80 mm and the gelation time was 35 s, both lower than the corresponding preset quality range. After the mixing temperature was adjusted, three consecutive quality test samples obtained after stabilizing the response boundary had spiral flow lengths of 95 mm, 98 mm, and 100 mm, and gelation times of 50 s, 52 s, and 53 s, respectively, all within the preset quality range. This indicates that the quality status gradually recovered from the abnormal mixing temperature state to the normal state.

[0052] Furthermore, when the quality states of consecutively tested samples all meet the preset stability conditions, the mixing temperature adjustment verification is deemed successful. The preset stability conditions are used to determine whether the adjusted quality state remains stable. For example, setting the spiral flow length and gelation time in three consecutive tested samples to be within the corresponding preset quality range determines that the preset stability conditions are met.

[0053] If any sample in the continuous quality testing fails to meet the preset stability conditions, the mixing temperature adjustment verification is deemed unsuccessful. This indicates that the current mixing temperature adjustment has not restored the epoxy molding compound's quality to the target range, and a new adjustment strategy needs to be determined based on the new quality deviation.

[0054] Furthermore, when the verification result is that the verification is passed, the current mixing temperature is maintained, so that the current mixing temperature is used as a stable production parameter in the subsequent epoxy molding compound production process.

[0055] When the verification result is "verification failed," the quality state deviation corresponding to the current mixing temperature is determined based on the quality state of the quality inspection sample after the stable response boundary. For example, if the adjusted continuous quality inspection sample still shows a low spiral flow length and a short gelation time, the current mixing temperature is determined to be too high; if the spiral flow length is too high and the gelation time is too long, the current mixing temperature is determined to be too low.

[0056] Based on the quality state deviation, new mixing temperature adjustment information is determined, and the mixing temperature is readjusted based on the new mixing temperature adjustment information. During the readjustment process, the target mixing temperature is still generated according to the temperature adjustment method in step S2, and the corresponding stable response boundary is re-determined according to step S3 to form a new quality feedback closed loop.

[0057] By using the above method, feedback judgment is made only using quality test samples that can truly reflect the adjustment effect after the stable response boundary, avoiding repeated temperature correction triggered by the test results of the material before adjustment or the transition material. At the same time, the mixing temperature is maintained or adjusted a second time based on the verification results, thereby improving the quality stability of epoxy molding compound in continuous production process.

[0058] It should be noted that the number of samples for continuous quality testing, the preset stability conditions, and the range for judging the quality state are determined based on the characteristics of the epoxy molding compound formulation, production speed, and quality control requirements. Any situation where the effect of adjusting the mixing temperature can be verified based on the quality testing results after the stability response boundary falls within the protection scope of this solution.

[0059] In one specific embodiment, epoxy molding compound is produced using a continuous mixing method. Before adjusting the mixing temperature, the quality test sample corresponds to a spiral flow length of 78 mm and a gelation time of 34 s, both below the corresponding preset quality range. The deviation of each test result from the lower limit of the corresponding quality range is determined, and normalized according to their respective allowable ranges. The larger normalized deviation is determined as the actual quality deviation. Based on the quality status, the mixing temperature is reduced from 92℃ to 88℃ in stages, with each stage reducing by 1℃.

[0060] After temperature adjustment, the cumulative discharge mass at the sampling location is used to characterize the material flow process. For example... Figure 2 As shown, in the initial stage of mixing temperature adjustment, the actual quality deviation remains at a high level, and decreases continuously as the material retained before adjustment is gradually discharged. The upper limit of the target deviation is set to 0.30. Based on the effective retention capacity of the mixing equipment, the material conveying speed, and the material homogenization state, it is determined that when the cumulative output mass reaches approximately 175 kg, the material proportion corresponding to the adjusted mixing temperature reaches the preset stable ratio. Therefore, this position is determined as the stable response boundary.

[0061] The test results obtained before the stable response boundary are only used to record quality changes and do not trigger further mixing temperature adjustments. After the stable response boundary, the actual quality deviation continues to decrease gradually and remains stable within the range of 0.12 to 0.20, below the target deviation upper limit. Three consecutive quality test samples were obtained, confirming that their spiral flow length and gelation time were within the corresponding preset quality range. This confirmed that the mixing temperature adjustment verification was successful, and the current mixing temperature was maintained.

[0062] like Figure 3 As shown, this invention provides a closed-loop control system for epoxy molding compound production quality. The system includes: a data acquisition unit for acquiring quality inspection samples during the epoxy molding compound production process and determining the quality status based on the quality inspection samples; a temperature adjustment unit for determining mixing temperature adjustment information based on the quality status when the quality status meets preset adjustment conditions, and adjusting the mixing temperature based on the mixing temperature adjustment information; a boundary determination unit for determining the stable response boundary corresponding to the mixing temperature adjustment based on the material flow state corresponding to the adjusted mixing temperature; and a correction unit for acquiring quality inspection samples after the stable response boundary, determining the verification result corresponding to the mixing temperature adjustment based on the quality inspection samples after the stable response boundary, and maintaining the current mixing temperature or readjusting the mixing temperature based on the verification result.

[0063] In one embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 4As shown, the computer device includes a processor A01, a network interface A02, a memory (not shown), and a database (not shown) connected via a system bus. The processor A01 provides computing and control capabilities. The memory includes internal memory A03 and a non-volatile storage medium A04. The non-volatile storage medium A04 stores an operating system B01, a computer program B02, and a database (not shown). The internal memory A03 provides an environment for the operation of the operating system B01 and the computer program B02 stored in the non-volatile storage medium A04. The network interface A02 is used for communication with external terminals via a network connection. When the computer program B02 is executed by the processor A01, it implements a closed-loop control method for epoxy molding compound production quality.

[0064] Those skilled in the art will understand that all or part of the steps in the methods of the above embodiments can be implemented by a program instructing related hardware. This program is stored in a storage medium and includes several instructions to cause a microcontroller, chip, or processor to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as a USB flash drive, a portable hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0065] The optional embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the embodiments of the present invention are not limited to the specific details described above. Within the scope of the technical concept of the embodiments of the present invention, various simple modifications can be made to the technical solutions of the embodiments of the present invention, and these simple modifications all fall within the protection scope of the embodiments of the present invention. It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, the embodiments of the present invention will not further describe the various possible combinations.

[0066] Furthermore, various different embodiments of the present invention can be combined in any way, as long as they do not violate the spirit of the embodiments of the present invention, they should also be regarded as the content disclosed by the embodiments of the present invention.

Claims

1. A closed-loop quality control method for epoxy molding compound production, characterized in that, The method includes: Obtain quality inspection samples during the epoxy molding compound production process, and determine the quality status based on the quality inspection samples; When the quality state meets the preset adjustment conditions, mixing temperature adjustment information is determined based on the quality state, and the mixing temperature is adjusted based on the mixing temperature adjustment information; wherein... The preset adjustment conditions are used to determine whether the current quality deviation belongs to an abnormal state that can be improved by adjusting the mixing temperature; Based on the material flow state corresponding to the adjusted mixing temperature, the stable response boundary corresponding to the mixing temperature adjustment is determined; wherein... Based on the material flow state corresponding to the adjusted mixing temperature, the stable response boundary corresponding to the adjustment of the mixing temperature is determined, including: obtaining the material flow state corresponding to the completion of the mixing temperature adjustment; determining the material response process after the mixing temperature adjustment based on the material flow state; determining the material proportion corresponding to the adjusted mixing temperature based on the material response process; and determining the corresponding material flow position as the stable response boundary when the material proportion corresponding to the adjusted mixing temperature reaches a preset stable proportion. The process of achieving a preset stable ratio for the material proportion corresponding to the adjusted mixing temperature includes: obtaining the effective retention volume and material conveying speed of the mixing equipment; determining the material response volume after the mixing temperature adjustment based on the effective retention volume and the material conveying speed; determining the material proportion corresponding to the adjusted mixing temperature based on the ratio of the material response volume to the total volume of the corresponding material flow area; determining that the stable response condition is met when the material proportion corresponding to the adjusted mixing temperature reaches the preset stable ratio; wherein, as the material continuously flows according to the material conveying speed, the adjusted material entering the mixing equipment gradually replaces the material retained before adjustment, and the adjusted material volume after replacement and flow to the corresponding material flow position is determined as the material response volume; Determining the corresponding material flow position as the stable response boundary includes: obtaining the material homogenization state parameters corresponding to the material flow position; determining the stable flow position of the material corresponding to the adjusted mixing temperature based on the material homogenization state parameters; correcting the position where the proportion of the material corresponding to the adjusted mixing temperature reaches a preset stable ratio based on the stable flow position; and determining the corrected material flow position as the stable response boundary. Obtain quality inspection samples after the stable response boundary, and determine the verification results corresponding to the mixing temperature adjustment based on the quality inspection samples after the stable response boundary. Maintain the current mixing temperature or readjust the mixing temperature based on the verification results.

2. The closed-loop quality control method for epoxy molding compound production according to claim 1, characterized in that, Obtaining quality inspection samples during the epoxy molding compound production process, and determining the quality status based on the quality inspection samples, including: Obtain the spiral flow length and gelation time corresponding to the quality test sample; The spiral flow length and the gelation time are compared with the corresponding preset mass ranges, respectively. When both the spiral flow length and the gelation time exceed the corresponding preset mass range, and the deviation direction meets the preset same-direction condition, the corresponding mass state is determined to be an abnormal mixing temperature state.

3. The closed-loop quality control method for epoxy molding compound production according to claim 1, characterized in that, When the quality state meets the preset adjustment conditions, the mixing temperature adjustment information is determined based on the quality state, including: The direction of mixing temperature adjustment is determined based on the direction of mass deviation corresponding to the aforementioned quality state. The amount of temperature adjustment is determined based on the degree of quality deviation corresponding to the quality state. The mixing temperature adjustment information is generated based on the mixing temperature adjustment direction and the mixing temperature adjustment amount.

4. The closed-loop quality control method for epoxy molding compound production according to claim 3, characterized in that, Adjusting the mixing temperature based on the mixing temperature adjustment information includes: The target mixing temperature is determined based on the mixing temperature adjustment information. Obtain the temperature difference between the current mixing temperature and the target mixing temperature, and determine the transition temperature adjustment amount based on the temperature difference; The temperature regulation device of the mixing equipment is controlled in stages according to the transition temperature adjustment amount, so that the actual mixing temperature is gradually adjusted to the target mixing temperature.

5. The closed-loop quality control method for epoxy molding compound production according to claim 1, characterized in that, Obtain quality inspection samples after the stable response boundary, and determine the verification results corresponding to the mixing temperature adjustment based on the quality inspection samples after the stable response boundary, including: Acquire continuous quality test samples located after the stable response boundary; Based on the quality status and quality test results of each of the aforementioned quality test samples, the trend of quality status change after the mixing temperature adjustment is determined; When the quality status of the samples continuously tested meets the preset stability conditions, the mixing temperature adjustment verification is determined to be passed; otherwise, the mixing temperature adjustment verification is determined to be failed.

6. The closed-loop quality control method for epoxy molding compound production according to claim 5, characterized in that, Based on the verification results, maintain the current mixing temperature or readjust the mixing temperature, including: When the verification result is "verification passed", maintain the current mixing temperature; When the verification result is that the verification fails, the quality state deviation corresponding to the current mixing temperature is determined according to the quality state of the quality test sample after the stable response boundary. New mixing temperature adjustment information is determined based on the quality state deviation, and the mixing temperature is readjusted based on the new mixing temperature adjustment information.

7. A closed-loop control system for epoxy molding compound production quality, characterized in that, The system is used to execute the closed-loop control method for epoxy molding compound production quality according to any one of claims 1-6, the system comprising: The data acquisition unit is used to acquire quality inspection samples during the epoxy molding compound production process and determine the quality status based on the quality inspection samples. A temperature adjustment unit is used to determine mixing temperature adjustment information based on the quality state when the quality state meets the preset adjustment conditions, and to adjust the mixing temperature based on the mixing temperature adjustment information. The boundary determination unit is used to determine the stable response boundary corresponding to the adjustment of the mixing temperature based on the material flow state corresponding to the adjusted mixing temperature. The correction unit is used to acquire the quality inspection sample after the stable response boundary, determine the verification result corresponding to the mixing temperature adjustment based on the quality inspection sample after the stable response boundary, and maintain the current mixing temperature or readjust the mixing temperature based on the verification result.

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