An in-situ mechanical tensile measurement device

Abstract

The present application relates to the technical field of micro-nano mechanics measurement, and particularly relates to an in-situ mechanical tensile measurement device. The in-situ mechanical tensile measurement device comprises a substrate, a thermal driving displacement loading module, a sample support module, a sample clamping module and a micro-force measurement module. The thermal driving displacement loading module is arranged on the substrate, and the sample support module is arranged on the substrate. The sample clamping module is connected with the sample support module and the substrate. Since the rigidity coefficient of the plurality of sensitive spring cantilever structures gradually decreases in the direction away from the thermal driving displacement loading module, the bending rigidity of the fixed end of the micro-force measurement module is large, so the deformation is small, and the bending rigidity of the free end is small, so the deformation is large, thereby significantly improving the elastic stability of the sensitive spring cantilever structure. By adjusting at least one of the number, length, width and thickness of the sensitive spring cantilever structure in the micro-force measurement module, the rigidity coefficient of the micro-force measurement module can be changed to adapt to the rigidity requirement of different samples.

Description

Technical Field

[0001] This invention relates to the field of micro-nano mechanical measurement technology, and in particular to an in-situ mechanical tensile measurement device. Background Technology

[0002] In-situ mechanical testing techniques at the micro- and nanoscale are crucial for studying the mechanical behavior, deformation mechanisms, and failure modes of materials at this scale, and are of significant value for the development of high-performance materials and the structural design and optimization of microelectronic devices. Applying mechanical loads and measurements to microscale samples in microscopic environments such as optical microscopes, scanning electron microscopes (SEM), transmission electron microscopes (TEM), and Raman spectroscopy systems allows for real-time correlation between the microstructural evolution and mechanical response of samples, representing a cutting-edge direction in experimental mechanics.

[0003] Currently, existing in-situ mechanical testing devices mainly fall into two categories: one is compatible equipment modified from commercial nanoindenters or micro-tensile stages, and the other is dedicated integrated modules designed for specific microscopic platforms. However, existing technologies still have the following shortcomings: the stiffness of the microforce sensor is not adjustable or has a narrow adjustment range. The elastic modulus and strength of different tested materials (such as metal thin films, ceramics, polymers, and biological tissues) vary greatly, requiring the testing device to have variable microforce sensor stiffness. However, conventional devices use a fixed structure, and the microforce sensor stiffness is singular, which cannot adapt to the stiffness requirements of different samples, easily leading to measurement inaccuracies or premature sample damage. Summary of the Invention

[0004] This invention provides an in-situ mechanical tensile measurement device to solve the problem that existing in-situ mechanical testing devices cannot adapt to the stiffness requirements of micro-force sensors for different samples, which can easily lead to measurement inaccuracies or premature sample damage.

[0005] This invention provides an in-situ mechanical tensile measuring device, comprising: Base; A thermally driven displacement loading module is disposed on the substrate; A sample support module is disposed on the substrate and is arranged at an interval from the thermally driven displacement loading module; A sample clamping module is connected to the sample support module and the substrate; A micro-force measurement module is disposed between the sample support module and the thermally driven displacement loading module. The micro-force measurement module includes a contact portion and multiple sensitive spring cantilever structures, which are connected in series. One sensitive spring cantilever structure closer to the thermally driven displacement loading module is connected to the thermally driven displacement loading module, and the contact portion is connected to one sensitive spring cantilever structure farther from the thermally driven displacement loading module. Along the direction away from the thermally driven displacement loading module, the stiffness coefficient of the multiple sensitive spring cantilever structures gradually decreases. The thermally driven displacement loading module is used to drive the micro-force measurement module to move closer to the sample support module through thermal expansion, so that the contact part contacts the sample support module, thereby transmitting the displacement loading to the sample support module and realizing the displacement loading of the specimen.

[0006] According to an in-situ mechanical tensile measuring device provided by the present invention, the sensitive spring cantilever structure includes a first connecting arm and a second connecting arm. One end of the first connecting arm is connected to the second connecting arm of the next sensitive spring cantilever structure. One end of the first connecting arm away from the thermally driven displacement loading module is connected to the contact portion. The other end of the first connecting arm is connected to the second connecting arm. The second connecting arm close to the thermally driven displacement loading module is connected to the thermally driven displacement loading module.

[0007] According to the in-situ mechanical tensile measuring device provided by the present invention, the first connecting arm and the second connecting arm are integrally formed, the width of the first connecting arm and the width of the second connecting arm are equal, the thickness of the first connecting arm and the thickness of the second connecting arm are equal; the first connecting arm and the second connecting arm are perpendicular, and two adjacent first connecting arms are parallel to each other.

[0008] According to the in-situ mechanical tensile measuring device provided by the present invention, the width and thickness of the plurality of sensitive spring cantilever structures gradually decrease along the direction away from the thermally driven displacement loading module.

[0009] According to the present invention, an in-situ mechanical tensile measuring device is provided, wherein the substrate comprises: substrate; Two first fixed bases are spaced apart on the substrate, and the thermally driven displacement loading module is connected to the two first fixed bases.

[0010] According to the present invention, an in-situ mechanical tensile measuring device is provided, wherein the thermally driven displacement loading module comprises: A drive displacement loading member is connected to the second connecting arm near the thermally driven displacement loading module; Two first fixed ends are respectively disposed on two first fixed bases; At least two first connecting parts are provided on both sides of the driving displacement loading member. One end of the first connecting part is connected to the driving displacement loading member, and the other end of the first connecting part is connected to the corresponding first fixed end. The driving displacement loading member and the first connecting parts are used for thermal expansion after being energized.

[0011] According to an in-situ mechanical tensile measuring device provided by the present invention, two first connecting portions are respectively provided on both sides of the driving displacement loading member, the first connecting portions on both sides of the driving displacement loading member are symmetrically arranged, and the first connecting portions form an acute angle with the driving displacement loading member.

[0012] According to an in-situ mechanical tensile measuring device provided by the present invention, the substrate further includes two second fixed bases and one third fixed base, the second fixed bases and the third fixed base are both disposed on the substrate, and the third fixed base is located between the two second fixed bases; The sample support module includes: A sample support frame has a through hole inside, and the sample clamping module is disposed within the through hole and connected to the third fixing base. Two second fixing ends are respectively disposed on two second fixing bases and located on both sides of the sample support frame; At least four support spring cantilever arms are provided, which are connected to the sample support frame and the corresponding second fixed end.

[0013] According to an in-situ mechanical tensile measuring device provided by the present invention, the sample clamping module and the sample support frame are connected by a support beam.

[0014] According to an in-situ mechanical tensile measuring device provided by the present invention, a first clamping end is provided on the side of the sample support frame away from the micro-force measuring module, and a second clamping end is provided on the side of the sample clamping module away from the micro-force measuring module. The first clamping end and the second clamping end are opposite to each other and spaced apart, and a sample clamping area is formed between the first clamping end and the second clamping end. A detection hole is provided on the substrate, and the detection hole is located below the sample clamping area.

[0015] The in-situ mechanical tensile measuring device provided by this invention features a multi-sensory spring cantilever structure with gradually decreasing stiffness coefficients along the direction away from the thermally driven displacement loading module. This results in high bending stiffness at the fixed end of the micro-force measuring module, leading to small deformation, while the free end exhibits low bending stiffness and large deformation, thus significantly improving the elastic stability of the sensitive spring cantilever structure. By adjusting at least one of the number, length, width, and thickness of the sensitive spring cantilever structure in the micro-force measuring module, the stiffness coefficient of the micro-force measuring module can be altered to suit the stiffness requirements of different samples. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a top view schematic diagram of the in-situ mechanical tensile measuring device provided by the present invention.

[0018] Figure 2 This is a top view of the substrate provided by the present invention.

[0019] Figure 3 This is a side view of the substrate provided by the present invention.

[0020] Figure 4 This is a top view of the sample clamping module provided by the present invention.

[0021] Figure label: 100, Substrate; 110, Base plate; 111, Detection hole; 120, First fixed base; 130, Second fixed base; 140, Third fixed base; 200, Thermally driven displacement loading module; 210, Driven displacement loading component; 220, First fixed end; 230, First connecting part; 300, Sample support module; 310, Sample support frame; 311, First clamping end; 320, Second fixed end; 330, Support spring cantilever; 340, Support beam; 400, Sample clamping module; 410, Second clamping end; 500, Micro-force measurement module; 510, Contact part; 520, Sensitive spring cantilever structure; 521, First connecting arm; 522, Second connecting arm; 600, Sample. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0023] The following is combined Figures 1 to 4 The specific structure of the in-situ mechanical tensile measuring device of the present invention is described.

[0024] like Figure 1 and Figure 2 As shown, the in-situ mechanical tensile measurement device includes a base 100, a thermally driven displacement loading module 200, a sample support module 300, a sample clamping module 400, and a micro-force measurement module 500. The thermally driven displacement loading module 200 is disposed on the base 100, and the sample support module 300 is disposed on the base 100 and arranged at intervals from the thermally driven displacement loading module 200. The sample clamping module 400 is connected to the sample support module 300 and the substrate 100. The micro-force measurement module 500 is disposed between the sample support module 300 and the thermally driven displacement loading module 200. The micro-force measurement module 500 includes a contact part 510 and multiple sensitive spring cantilever structures 520. The multiple sensitive spring cantilever structures 520 are connected in series. Among them, the sensitive spring cantilever structure 520 closer to the thermally driven displacement loading module 200 is connected to the thermally driven displacement loading module 200, and the contact part 510 is connected to the sensitive spring cantilever structure 520 further away from the thermally driven displacement loading module 200. Along the direction away from the thermally driven displacement loading module 200, the stiffness coefficient of the multiple sensitive spring cantilever structures 520 gradually decreases.

[0025] The thermally driven displacement loading module 200 is used to drive the micro-force measurement module 500 to move closer to the sample support module 300 through thermal expansion, so that the contact part 510 contacts the sample support module 300, thereby transmitting the displacement loading to the sample support module 300 and realizing the displacement loading of the sample 600.

[0026] The in-situ mechanical tensile measuring device provided by this invention has a relatively large bending stiffness for the sensitive spring cantilever structure 520 on the side closer to the thermally driven displacement loading module 200 (i.e., the fixed end side), resulting in a relatively small deformation under stress. On the other hand, the bending stiffness of the sensitive spring cantilever structure 520 on the side farther from the thermally driven displacement loading module 200 (i.e., the free end side) is relatively small, resulting in a relatively large deformation under stress. This improves the overall elastic stability of the sensitive spring cantilever structure 520 during displacement loading.

[0027] By adjusting at least one parameter among the number, length, width, and thickness of the sensitive spring cantilever structures 520 in the micro-force measurement module 500, the overall stiffness coefficient of the micro-force measurement module 500 can be changed, thereby enabling the in-situ mechanical tensile measurement device to adapt to the stiffness requirements of samples with different elastic moduli and strengths. The thermally driven displacement loading module 200 expands under heat, generating displacement that pushes one of the sensitive spring cantilever structures 520 connected to it in the micro-force measurement module 500 to move. This displacement is transmitted sequentially through multiple series-connected sensitive spring cantilever structures 520, causing the contact portion 510 to move closer to the sample support module 300 until the contact portion 510 contacts the sample support module 300, thereby transferring the displacement load to the sample support module 300 and achieving tensile testing of the sample 600.

[0028] In one embodiment of the present invention, such as Figure 1 As shown, the sensitive spring cantilever structure 520 includes a first connecting arm 521 and a second connecting arm 522. The first connecting arm 521 is arranged along a first direction, that is, along... Figure 1 The upper and lower direction is set in the middle, and the second connecting arm 522 is set along the second direction, that is, along the middle. Figure 1 The left and right directions are arranged; by setting the first connecting arm 521 and the second connecting arm 522 perpendicular to each other, the sensitive spring cantilever structure 520 can convert the displacement loading along the second direction into elastic deformation along the first direction when subjected to force, thereby obtaining a longer equivalent force arm within a limited space. One end of the first connecting arm 521 is connected to the second connecting arm 522 of the next sensitive spring cantilever structure 520, and the end of the first connecting arm 521 away from the thermally driven displacement loading module 200 (i.e. Figure 1 One end of the leftmost first connecting arm 521 is connected to the contact portion 510, and the other end of the first connecting arm 521 is connected to the second connecting arm 522. The second connecting arm 522, which is closer to the thermally driven displacement loading module 200, is... Figure 1The rightmost second connecting arm 522 is connected to the thermally driven displacement loading module 200; multiple sensitive spring cantilever structures 520 are connected in series through their respective first connecting arms 521 and second connecting arms 522 to form a continuous elastic transmission structure.

[0029] When the thermally driven displacement loading module 200 expands due to heat, it first pushes the second connecting arm 522 on the right side. This second connecting arm 522 drives the first connecting arm 521 connected to it, thereby sequentially transmitting the displacement to the second connecting arm 522 and the first connecting arm 521 of the next sensitive spring cantilever structure 520, and finally to the contact part 510. During this process, the first connecting arm 521 and the second connecting arm 522 of each sensitive spring cantilever structure 520 can undergo elastic bending deformation, thus smoothly transmitting the input displacement to the free end. By connecting multiple sensitive spring cantilever structures 520 in series, the equivalent stiffness of the micro-force measurement module 500 can be adjusted while maintaining the overall compact structure to adapt to the mechanical testing requirements of different samples.

[0030] In one embodiment of the present invention, the first connecting arm 521 and the second connecting arm 522 are integrally formed, and the width of the first connecting arm 521 and the width of the second connecting arm 522 are both equal, as are the thickness of the first connecting arm 521 and the thickness of the second connecting arm 522. This arrangement facilitates the processing of the sensitive spring cantilever structure 520.

[0031] In a preferred embodiment of the present invention, such as Figure 1 As shown, the first connecting arm 521 is perpendicular to the second connecting arm 522, and adjacent first connecting arms 521 are parallel to each other. Along the direction away from the thermally driven displacement loading module 200, the lengths of the multiple first connecting arms 521 gradually decrease, making the micro-force measurement module 500 generally trapezoidal or pyramidal in shape. The parallelism of adjacent first connecting arms 521 ensures that the sensitive spring cantilever structures 520 do not interfere with each other during elastic deformation, and that the deformation directions remain consistent. The gradual decrease in length along the direction away from the thermally driven displacement loading module 200 results in the first connecting arm 521 on the side closer to the thermally driven displacement loading module 200 being longer, having relatively higher bending stiffness, and generating relatively smaller elastic deformation during displacement loading; while the first connecting arm 521 on the side farther from the thermally driven displacement loading module 200 is shorter, having relatively lower bending stiffness, and generating relatively larger elastic deformation.

[0032] Since the stiffness of each sensitive spring cantilever structure 520 gradually decreases along the transmission direction, the micro-force measurement module 500 is generally trapezoidal or pyramidal in shape, which allows the displacement load to be transmitted smoothly and generates a large displacement response at the contact part 510, while the overall structure can maintain good elastic stability.

[0033] In one embodiment of the present invention, such as Figure 1 As shown, along the direction away from the thermally driven displacement loading module 200, the width and thickness of the multiple sensitive spring cantilever structures 520 gradually decrease. This gradual decrease in width and thickness results in the sensitive spring cantilever structures 520 closer to the thermally driven displacement loading module 200 having a larger width and thickness, thus exhibiting relatively higher bending stiffness and smaller elastic bending deformation under load. Conversely, the sensitive spring cantilever structures 520 further away from the thermally driven displacement loading module 200 have a smaller width and thickness, thus exhibiting relatively lower bending stiffness and larger elastic bending deformation under load.

[0034] In one embodiment of the present invention, an insulating coating is provided on the surface of the contact portion. The insulating coating is made of materials such as alumina and silicon dioxide, which makes the contact portion non-conductive. During loading, the contact portion directly contacts the side of the sample support frame closest to the micro-force measurement module. On the one hand, it transmits the thermal expansion displacement of the heat-driven displacement loading module, thereby realizing the displacement loading of the specimen. On the other hand, the micro-force measurement module itself is compressed, and F can be calculated. 总 = K1* δ1, where δ1 is the reduction of the micro-force measurement module, K1 is the stiffness coefficient of the micro-force measurement module, and K1 can be changed by adjusting one or more parameters of the number, length, width and thickness of the sensitive spring cantilever structure.

[0035] In one embodiment of the present invention, such as Figures 1 to 3 As shown, the substrate 100 includes a base plate 110 and two first fixed bases 120, which are spaced apart on the base plate 110. This arrangement of the two spaced-apart first fixed bases 120 allows the thermally driven displacement loading module 200 to have two independent support points on the base plate 110. This results in more even force distribution on both sides of the thermally driven displacement loading module 200 during thermal expansion, reducing potential deflection or tilting caused by unilateral support. The thermally driven displacement loading module 200 is connected to the two first fixed bases 120. By connecting the thermally driven displacement loading module 200 to the two first fixed bases 120 respectively, the position of the thermally driven displacement loading module 200 relative to the substrate 100 remains fixed. When displacement occurs due to thermal expansion, its output direction can move along the second direction without lateral drift.

[0036] By integrating the thermally driven displacement loading module 200, sample support module 300, sample clamping module 400, and micro-force measurement module 500 onto the substrate 110, the entire device can complete displacement loading and force measurement without the need for external auxiliary equipment. Its overall size can be designed to be relatively compact, making it suitable for in-situ measurement environments in limited spaces, such as optical microscopes, scanning electron microscopes, or transmission electron microscopes.

[0037] In one embodiment of the present invention, such as Figures 1 to 3 As shown, the thermally driven displacement loading module 200 includes a driving displacement loading member 210, two first fixed ends 220, and at least two first connecting portions 230. The driving displacement loading member 210 and the first connecting portions 230 together form a spindle-shaped structure. The spindle-shaped structure ensures a more uniform temperature distribution of the driving displacement loading member 210 after energization, and a more consistent axial distribution of the displacement generated by thermal expansion, reducing unexpected deformation caused by local overheating or abrupt shape changes. The driving displacement loading member 210 is positioned along a second direction, and its central axis is aligned with the central axis of the contact portion 510. Aligning the central axis of the driving displacement loading member 210 with the central axis of the contact portion 510 allows the thrust generated when the driving displacement loading member 210 expands due to heat to be directly transmitted along the axial direction of the contact portion 510, avoiding additional bending moments due to axial offset, thereby reducing energy loss and the possibility of structural distortion.

[0038] The driving displacement loading member 210 is connected to the second connecting arm 522 near the thermally driven displacement loading module 200. Upon power-on, the driving displacement loading member 210 and the first connecting portion 230 undergo thermal expansion, elongating along the second direction and pushing the connected second connecting arm 522 to move along the second direction, thereby causing the subsequent sensitive spring cantilever structure 520 to undergo elastic deformation. Two first fixed ends 220 are correspondingly disposed on two first fixed bases 120. At least one first connecting portion 230 is provided on each side of the driving displacement loading member 210. One end of the first connecting portion 230 is connected to the driving displacement loading member 210, and the other end of the first connecting portion 230 is connected to the corresponding first fixed end 220.

[0039] Preferably, two first connecting portions 230 are respectively provided on both sides of the driving displacement loading member 210. The first connecting portions 230 on both sides of the driving displacement loading member 210 are arranged symmetrically. By symmetrically arranging the first connecting portions 230 on both sides, the constraint forces on both sides of the driving displacement loading member 210 are equal in magnitude and opposite in direction when it is thermally expanded, so that the elongation direction of the driving displacement loading member 210 can be kept on a straight line in the second direction and will not deviate to both sides.

[0040] Furthermore, the first connecting portion 230 forms an acute angle with the driving displacement loading member 210. By adopting the arrangement of the first connecting portion 230 forming an acute angle with the driving displacement loading member 210, when the driving displacement loading member 210 expands due to heat and extends along the second direction (extending to the left), the first connecting portion 230 is inclined relative to the driving displacement loading member 210, thereby decomposing the thrust generated by the driving displacement loading member 210 into a tensile or compressive component along the axial direction of the first connecting portion 230 and a lateral component perpendicular to the first connecting portion 230. After being heated, the drive displacement loading member 210 elongates along the second direction. Since one end of the first connecting part 230 is connected to the drive displacement loading member 210 and the other end is connected to the first fixed end 220, and there is an acute angle between the first connecting part 230 and the drive displacement loading member 210, the elongation displacement of the drive displacement loading member 210 will be transmitted to the first fixed end 220 through the first connecting part 230. While transmitting the displacement, the first connecting part 230 will undergo a certain degree of elastic bending or torsion, which can absorb some of the lateral offset or vibration generated during thermal expansion, making the displacement transmitted to the second connecting arm 522 more stable and reducing the impact of non-axial displacement caused by manufacturing errors or uneven temperature distribution of the drive displacement loading member 210 on the micro-force measurement module 500.

[0041] Furthermore, the first fixed end 220, the first connecting portion 230, and the driving displacement loading member 210 are all made of metal or semiconductor material (such as silicon), and the three are connected in sequence to form a conductive path. The two wires are electrically connected to the two first fixed ends 220 respectively. When the wires supply power to the two first fixed ends 220, the current is conducted through the first connecting portion 230 to the driving displacement loading member 210. The driving displacement loading member 210 undergoes thermal expansion, generating a displacement in the second direction (to the left), thereby applying a tensile load to the sample 600.

[0042] In one embodiment of the present invention, such as Figures 1 to 3 As shown, the base 100 also includes two second fixed bases 130 and one third fixed base 140. Both the second fixed bases 130 and the third fixed base 140 are disposed on the base plate 110, with the third fixed base 140 located between the two second fixed bases 130. The sample support module 300 includes a sample support frame 310, two second fixed ends 320, and at least four support spring cantilever arms 330. The sample support frame 310 has through holes and is rectangular. The rectangular frame structure allows the sample support frame 310 to move to the left, approaching a rigid body translation, when subjected to a thrust from the contact portion 510. This allows for tensile loading of the sample 600 via the first clamping end 311 connected to the sample support frame 310 (the second clamping end 410 remains fixed due to its connection to the sample clamping module 400 and the third fixed base 140).

[0043] The sample clamping module 400 is disposed within the through hole, and is connected to the sample support frame 310 via a support beam 340. The support beam 340 connects the sample clamping module 400 and the sample support frame 310, ensuring a relatively fixed positional relationship between them before the support beam 340 is cut, facilitating overall assembly and positioning. Preferably, three support beams 340 are provided: two support beams are positioned along a first direction on both sides of the sample clamping module 400, and the remaining support beam 340 is positioned along a second direction on the side of the sample clamping module 400 closest to the micro-force measurement module 500. Using three support beams 340 to connect the sample clamping module 400 and the sample support frame 310 constrains the sample clamping module 400 in three directions, preventing it from shaking or shifting during assembly and transportation.

[0044] The sample clamping module 400 is disposed within the through hole and connected to the third fixed base 140. Before the formal tensile test, the three support beams 340 are cut using a high-speed cutting tool. At this time, the sample support frame 310 is connected to the second fixed end 320 only through the support spring cantilever 330, while the sample clamping module 400 is fixed to the base 100 through the third fixed base 140. The sample support frame 310 can move relative to the sample clamping module 400. When the contact part 510 pushes the sample support frame 310 to move away from the micro-force measurement module 500, the sample support frame 310 is displaced relative to the sample clamping module 400, thereby applying a tensile load to the specimen clamped between the sample support frame 310 and the sample clamping module 400.

[0045] The second fixed ends 320 are correspondingly disposed on the two second fixed bases 130 and located on both sides of the sample support frame 310. This arrangement of the second fixed ends 320 on both sides of the sample support frame 310 ensures that both sides of the sample support frame 310 are simultaneously constrained when subjected to the thrust from the contact portion 510, thus preventing the sample support frame 310 from deflecting around an axis perpendicular to the base 100 during movement. The support spring cantilever 330 is connected to the sample support frame 310 and the corresponding second fixed ends 320, allowing the sample support frame 310 to undergo elastic displacement relative to the second fixed ends 320. Simultaneously, the support spring cantilever 330 provides restoring force after deformation, providing a certain degree of elastic support to the sample support frame 310 during displacement loading.

[0046] Specifically, there are four support spring cantilever arms 330. Two support spring cantilever arms 330 are respectively provided on both sides of the sample support frame 310. The support spring cantilever arms 330 on both sides of the sample support frame 310 are symmetrically arranged so that when the sample support frame 310 is subjected to thrust, two support spring cantilever arms 330 on each side share the load. The load distribution on each side is more uniform, so that the moving direction of the sample support frame 310 can be kept basically consistent with the second direction during the movement, reducing lateral displacement or jamming caused by uneven force.

[0047] When the contact part 510 pushes the sample support frame 310 to move away from the micro-force measurement module 500, the four support spring cantilever arms 330 undergo elastic bending deformation at the same time. Due to the symmetrical arrangement on both sides, the deformation on both sides of the sample support frame 310 is equal, so the sample support frame 310 can move smoothly in a straight line along the second direction, driving the first clamping end 311 on it away from the second clamping end 410 on the sample clamping module 400, thereby achieving the stretching of the specimen.

[0048] The supporting spring cantilever 330 is composed of multiple L-shaped connecting arms connected in series. The stiffness coefficient K2 of the supporting spring cantilever 330 can be changed by adjusting one or more parameters, including the number, length, width, and thickness of the L-shaped connecting arms. During the tensile test, the tensile force F1 on the specimen is F... 总 -F2, where F2=4 *K2* δ2, and δ2 is the elongation of the specimen.

[0049] In one embodiment of the present invention, such as Figure 1 and Figure 4 As shown, the sample support frame 310 has a first clamping end 311 on the side away from the micro-force measurement module 500, and the sample clamping module 400 has a second clamping end 410 on the side away from the micro-force measurement module 500. The first clamping end 311 and the second clamping end 410 are opposite to each other and spaced apart, forming a sample clamping area between the first clamping end 311 and the second clamping end 410. In use, the sample is clamped between the first clamping end 311 and the second clamping end 410.

[0050] Preferably, both the first clamping end 311 and the second clamping end 410 are triangular tip structures. The triangular tip structure has a relatively sharp apex angle. On the one hand, it serves as a marker point for aligning the two ends of the sample under a microscope, enabling rapid centering. On the other hand, under the action of droplets, the tip clamping surface can provide a liquid bridge, which can provide guidance for the microscale sample and facilitate sample centering.

[0051] In one embodiment of the present invention, a detection hole is provided on the substrate, and the detection hole is located below the sample holding area. The detection hole is a light-transmitting hole or a Raman signal collection window to adapt to the sample stage and chamber interface of optical microscopes, scanning electron microscopes, transmission electron microscopes, and Raman spectroscopy systems.

[0052] In one embodiment of the present invention, the substrate 100, the thermally driven displacement loading module 200, the sample support module 300, the sample clamping module 400, and the micro-force measurement module 500 are manufactured using microelectromechanical systems (MEMS) bulk silicon processing technology or femtosecond laser integrated or quasi-integrated manufacturing, with materials selected from monocrystalline silicon, polycrystalline silicon, nickel alloys, or stainless steel. Since each module unit is formed through standard photolithography and etching, or laser cutting steps, mass production can be achieved. Furthermore, after testing, residual samples or adhesives can be removed by wet cleaning, enabling the device to be reused and significantly reducing the consumable cost per test.

[0053] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An in-situ mechanical tensile measuring device, characterized in that, include: Substrate (100); A thermally driven displacement loading module (200) is disposed on the substrate (100); The sample support module (300) is disposed on the substrate (100) and is arranged at a distance from the thermally driven displacement loading module (200); The sample clamping module (400) is connected to the sample support module (300) and the substrate (100); A micro-force measurement module (500) is disposed between the sample support module (300) and the thermally driven displacement loading module (200). The micro-force measurement module (500) includes a contact part (510) and multiple sensitive spring cantilever structures (520). The multiple sensitive spring cantilever structures (520) are connected in series. One of the sensitive spring cantilever structures (520) closer to the thermally driven displacement loading module (200) is connected to the thermally driven displacement loading module (200), and the contact part (510) is connected to one of the sensitive spring cantilever structures (520) farther away from the thermally driven displacement loading module (200). Along the direction away from the thermally driven displacement loading module (200), the stiffness coefficient of the multiple sensitive spring cantilever structures (520) gradually decreases. The thermally driven displacement loading module (200) is used to drive the micro-force measurement module (500) to move closer to the sample support module (300) by thermal expansion, so that the contact part (510) contacts the sample support module (300), thereby transmitting the displacement loading to the sample support module (300) to realize the displacement loading of the specimen.

2. The in-situ mechanical tensile measuring device according to claim 1, characterized in that, The sensitive spring cantilever structure (520) includes a first connecting arm (521) and a second connecting arm (522). One end of the first connecting arm (521) is connected to the second connecting arm (522) of the next sensitive spring cantilever structure (520). One end of the first connecting arm (521) away from the thermally driven displacement loading module (200) is connected to the contact portion. The other end of the first connecting arm (521) is connected to the second connecting arm (522). The second connecting arm (522) close to the thermally driven displacement loading module (200) is connected to the thermally driven displacement loading module (200).

3. The in-situ mechanical tensile measuring device according to claim 2, characterized in that, The first connecting arm (521) and the second connecting arm (522) are integrally formed. The width of the first connecting arm (521) and the width of the second connecting arm (522) are equal, and the thickness of the first connecting arm (521) and the thickness of the second connecting arm (522) are equal. The first connecting arm (521) is perpendicular to the second connecting arm (522), and two adjacent first connecting arms (521) are parallel to each other.

4. The in-situ mechanical tensile measuring device according to any one of claims 1 to 3, characterized in that, Along the direction away from the thermally driven displacement loading module (200), the width and thickness of the plurality of sensitive spring cantilever structures (520) gradually decrease.

5. The in-situ mechanical tensile measuring device according to any one of claims 1 to 3, characterized in that, The substrate (100) includes: substrate(110); Two first fixed bases (120) are spaced apart on the substrate (110), and the thermally driven displacement loading module (200) is connected to the two first fixed bases (120).

6. The in-situ mechanical tensile measuring device according to claim 5, characterized in that, The thermally driven displacement loading module (200) includes: A drive displacement loading member (210) is connected to the second connecting arm (522) near the thermal drive displacement loading module (200); Two first fixing ends (220) are respectively disposed on two first fixing bases (120); At least two first connecting parts (230) are provided on both sides of the driving displacement loading member (210). One end of the first connecting part (230) is connected to the driving displacement loading member (210), and the other end of the first connecting part (230) is connected to the corresponding first fixed end (220). The driving displacement loading member (210) and the first connecting part (230) are used for thermal expansion after being powered on.

7. The in-situ mechanical tensile measuring device according to claim 6, characterized in that, Two first connecting parts (230) are respectively provided on both sides of the driving displacement loading member (210). The first connecting parts (230) on both sides of the driving displacement loading member (210) are symmetrically arranged, and the first connecting parts (230) form an acute angle with the driving displacement loading member (210).

8. The in-situ mechanical tensile measuring device according to any one of claims 1 to 3, characterized in that, The base (100) further includes two second fixed bases (130) and one third fixed base (140), both the second fixed bases (130) and the third fixed base (140) are disposed on the base plate (110), and the third fixed base (140) is located between the two second fixed bases (130); The sample support module (300) includes: A sample support frame (310) has a through hole inside, and the sample clamping module (400) is disposed in the through hole and connected to the third fixing base (140). Two second fixing ends (320) are respectively disposed on two second fixing bases (130) and located on both sides of the sample support frame (310); At least four support spring cantilever arms (330) are connected to the sample support frame (310) and the corresponding second fixed end (320).

9. The in-situ mechanical tensile measuring device according to claim 8, characterized in that, The sample clamping module (400) and the sample support frame (310) are connected by a support beam (340).

10. The in-situ mechanical tensile measuring device according to claim 8, characterized in that, The sample support frame (310) is provided with a first clamping end (311) on the side away from the micro-force measurement module (500), and the sample clamping module (400) is provided with a second clamping end (410) on the side away from the micro-force measurement module (500). The first clamping end (311) and the second clamping end (410) are opposite to each other and spaced apart, and a sample clamping area is formed between the first clamping end (311) and the second clamping end (410). A detection hole (111) is provided on the substrate (100), and the detection hole (111) is located below the sample clamping area.

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