A vacuum interface type metal thin film shield conductive structure

Abstract

The application discloses a vacuum interface type metal thin film shielding conductive structure and belongs to the technical field of conductive transmission and electromagnetic shielding conductors. The structure comprises a metal pipe, an internal vacuum cavity formed in the metal pipe, an inner wall continuous conductive film arranged on the inner wall of the metal pipe, and a first sealing end and a second sealing end arranged at the axial two ends of the internal vacuum cavity. The first sealing end and the second sealing end are plug-shaped sealing members and block the internal vacuum cavity. The metal pipe forms an end extension section outside the first sealing end and the second sealing end for conductive connection. The inner wall continuous conductive film continuously extends along the inner wall of the metal pipe in the corresponding regions of the end extension section and the internal vacuum cavity and forms a conductive path. The metal pipe serves as a shielding boundary outside the conductive path. The structure can be connected to a low-voltage direct-current power supply line, a conventional power supply line and a high-voltage or transmission level line as a conductive transmission section, so that the application in the cross-ordinary power transmission scene is realized without changing the core structure.

Description

Technical Field

[0001] This invention belongs to the field of conductive transmission and electromagnetic shielding conductor technology, specifically relating to a vacuum interface type metal thin film shielding conductive structure. Background Technology

[0002] Existing conventional power transmission typically uses solid conductors, stranded conductors, or composite conductors made of copper, aluminum, or their alloys as the main conductor. In scenarios such as low-voltage DC power supply, household or equipment power supply, and high-voltage cable transmission, transmission loss is reduced, temperature rise is controlled, and anti-interference ability is improved by increasing the conductor cross-sectional area, selecting low-resistivity materials, optimizing the stranded wire structure, adding insulation layers, or setting external shielding layers. However, the conductive path of the above-mentioned methods still mainly relies on the metal conductor body. When the line length increases, the load type changes, or the voltage level increases, there may still be problems such as large material consumption, increased structural weight, significant heat generation, and insufficient electromagnetic interference control.

[0003] In the field of conductive and shielding structures, some solutions use metal tubes, metal sheaths, shielding layers, or hollow conductor structures to improve mechanical protection, shielding effect, or heat dissipation conditions. However, such solutions usually use the metal tube as an external protective component, grounding shield, or load-bearing component, and the conductive function is still mainly undertaken by the tube wall itself, the conventional conductor inside the tube, or the external conductive layer. For ordinary power transmission, existing solutions do not make full use of the controlled space inside the metal tube to form a stable and continuous internal conductive interface, and therefore it is difficult to simultaneously take into account the structural coordination between the conductive path, shielding boundary, dielectric environment, and end connection.

[0004] Therefore, without simply relying on increasing the conductor cross-sectional area, adding an external shielding layer, or stacking composite conductors, how to make the internal space of the metal tube participate in the conductive interface design, so that the conductive path can extend continuously along the internal interface of the tube and can be reliably connected to the external power supply and load ends at both ends, is a problem that needs to be further solved in this field. Summary of the Invention

[0005] The technical problem to be solved by this invention is to provide a vacuum interface type metal thin film shielding conductive structure that forms an internal vacuum cavity inside a metal tube and sets a continuous conductive film on the inner wall of the metal tube. This solves the problems of existing ordinary conductors mainly relying on solid or stranded metal bodies for conductivity, resulting in large material consumption and structural weight, and difficulty in simultaneously addressing transmission loss, temperature rise, and anti-interference capabilities in long-distance or different voltage level scenarios. Furthermore, this structure can be used as a conductive transmission section in low-voltage DC, conventional power supply, and high-voltage or transmission-level lines.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a vacuum interface type metal thin film shielding conductive structure for ordinary power transmission, comprising a metal tube, an internal vacuum cavity formed inside the metal tube, a continuous conductive film disposed on the inner wall of the metal tube, and a first sealing end and a second sealing end respectively disposed at both axial ends of the internal vacuum cavity; the first sealing end and the second sealing end are both plug-shaped seals, which seal the internal vacuum cavity to keep the internal vacuum cavity sealed; the metal tube forms end extensions for conductive connection on the outer side of the first sealing end and the outer side of the second sealing end, respectively; the continuous conductive film on the inner wall extends continuously along the inner wall of the metal tube in the end extensions and the corresponding areas of the internal vacuum cavity to form a conductive path; the metal tube serves as a shielding boundary outside the conductive path.

[0007] Furthermore, the continuous conductive film on the inner wall is continuously distributed circumferentially along the inner wall of the metal tube and is attached to the inner wall of the metal tube.

[0008] Furthermore, the internal vacuum cavity extends along the axial direction of the metal tube and is located in the inner space enclosed by the continuous conductive film on the inner wall.

[0009] Furthermore, the first sealing end and the second sealing end are embedded in the cavity of the metal tube and respectively block the axial ends of the internal vacuum cavity. The end extension section and the tube body portion corresponding to the internal vacuum cavity are continuous extensions of the same metal tube.

[0010] Furthermore, the vacuum interface type metal thin film shielded conductive structure serves as a conductive transmission segment in a low-voltage DC power supply line, connecting the low-voltage DC power supply or mobile phone charging power supply to the mobile phone or small electronic device. The operating voltage of the low-voltage DC power supply line is 5V or 12V.

[0011] Furthermore, the vacuum interface type metal thin film shielded conductive structure serves as a conductive transmission segment in a conventional power supply line, connecting the conventional power supply to the household or equipment load, wherein the conventional power supply is a 220V or 380V power supply terminal.

[0012] Furthermore, the vacuum interface type metal thin film shielded conductive structure serves as a conductive transmission segment in a high-voltage or transmission-level line, connecting the high-voltage power supply end or transmission end to the remote load or distribution end, wherein the operating voltage of the high-voltage power supply end or transmission end is 1kV to 5kV.

[0013] The beneficial effects achieved by the present invention using the above solution are as follows: 1. This invention relies on the dielectric environment of the internal vacuum cavity and the axially continuous conductive structure of the continuous conductive film on the inner wall to reduce conduction impedance, working heat generation and transmission loss.

[0014] 2. This invention uses a metal tube as a structural support and outer shielding boundary, and works in conjunction with an internal vacuum cavity to improve electromagnetic shielding performance and reduce the impact of external electromagnetic interference on power and signal transmission.

[0015] 3. The continuous conductive film on the inner wall of the present invention is attached to the inner wall of the metal tube and the internal vacuum cavity is sealed by the sealing structure at both ends. It can be adapted to low voltage and low current, conventional power supply and high voltage transmission scenarios, and improve the conductivity stability during long-term use. Attached Figure Description

[0016] Figure 1 This is a cross-sectional schematic diagram of the vacuum interface type metal thin film shielding conductive structure of the present invention.

[0017] Figure 2 This is a connection diagram of the vacuum interface type metal thin film shielded conductive structure of the present invention applied to a low-voltage DC power supply scenario.

[0018] Figure 3 This is a connection diagram of the vacuum interface type metal thin film shielded conductive structure of the present invention applied to a conventional power supply scenario.

[0019] Figure 4 This is a connection diagram of the vacuum interface type metal thin film shielded conductive structure of the present invention applied to high voltage or transmission level scenarios.

[0020] Among them, 100 is a vacuum interface type metal thin film shielded conductive structure; 110 is a metal tube; 120 is an internal vacuum cavity; 130 is a continuous conductive film on the inner wall; 140 is a first sealing end; 150 is a second sealing end; 200 is a low-voltage DC power supply or a mobile phone charging power supply; 210 is a mobile phone or a small electronic device; 300 is a conventional power supply; 310 is a household or equipment load; 400 is a high-voltage power supply end or transmission end; 410 is a remote load or distribution end. Detailed Implementation

[0021] The technical solution of the present invention will be further described below with reference to the accompanying drawings.

[0022] It should be understood that the following embodiments are used to illustrate the present invention and are not intended to limit the scope of protection of the present invention; Where there is no conflict, the technical features of the various embodiments can be combined with each other.

[0023] like Figure 1 As shown, this embodiment provides a vacuum interface type metal thin film shielded conductive structure 100.

[0024] The vacuum interface type metal thin film shielded conductive structure 100 includes a metal tube 110, an internal vacuum cavity 120, a continuous conductive film 130 on the inner wall, a first sealing end 140, and a second sealing end 150.

[0025] The metal tube 110 is a hollow tubular metal component extending along the axial direction, and the internal vacuum cavity 120 is formed in the cavity of the metal tube 110. The first sealing end 140 and the second sealing end 150 are both plug-shaped seals, which are embedded in the cavity of the metal tube 110 and located at the two axial ends of the internal vacuum cavity 120, respectively, to seal the internal vacuum cavity 120 and keep the internal vacuum cavity 120 in a sealed state.

[0026] The metal tube 110 continues to extend axially outside the first sealing end 140 and the second sealing end 150, respectively, thereby forming an end extension for connecting the external input end and the external output end.

[0027] The end extension section and the tube portion corresponding to the internal vacuum cavity 120 are continuous extensions of the same metal tube 110 and participate in the conductive connection.

[0028] A continuous conductive film 130 is disposed on the inner wall of the metal tube 110 and extends continuously along the inner wall of the metal tube 110 in the corresponding regions of the end extension section and the internal vacuum cavity 120, so that the inner wall of the metal tube 110 forms a conductive path that can conduct between the two end extension sections.

[0029] In other words, the first sealing end 140 and the second sealing end 150 are used to seal the internal vacuum cavity 120, rather than to separate the metal tube 110 or the continuous conductive film 130 on the inner wall into multiple segments that are disconnected from each other.

[0030] In this embodiment, the metal tube 110 serves as both a structural support and an external shielding boundary.

[0031] The internal vacuum chamber 120 is located between the first sealing end 140 and the second sealing end 150, which can reduce the influence of the air medium on the internal conductive interface and form a relatively closed transmission environment with the metal tube 110.

[0032] The continuous conductive film 130 on the inner wall is attached to the inner wall of the metal tube 110, and is continuously distributed in the circumferential direction and penetrates in the axial direction, so that the current can be transmitted between one end extension and the other end extension of the metal tube 110 along the continuous conductive film 130 on the inner wall.

[0033] In actual use, the external power supply is connected to the end extension of one end of the metal tube 110, and the external load is connected to the end extension of the other end of the metal tube 110, so that the vacuum interface type metal thin film shielded conductive structure 100 is connected between the external power supply and the load as a conductive transmission structure.

[0034] like Figure 2As shown, in one embodiment of low-voltage DC power supply, a vacuum interface type metal thin film shielded conductive structure 100 is connected between the low-voltage DC power supply or mobile phone charging power supply 200 and the mobile phone or small electronic device 210, and the end extensions at both ends of the structure 100 are respectively connected to the low-voltage DC power supply or mobile phone charging power supply 200 and the mobile phone or small electronic device 210.

[0035] The low-voltage DC power supply or mobile phone charging power supply 200 can be a 5V or 12V DC power supply terminal, and the mobile phone or small electronic device 210 can be used as a low-voltage load terminal.

[0036] In use, the current is transmitted from the power supply end to the load end through the structure 100, and the continuous conductive film 130 on the inner wall of the structure 100 participates in the conduction as a conductive path.

[0037] against Figure 2 The low-voltage DC power supply implementation shown can be used to test DC resistance, conduction stability, and small current conduction capability.

[0038] DC resistance testing is used to evaluate the equivalent conduction state of structure 100 after it is connected to a low-voltage power supply line. Continuity stability testing is used to evaluate whether there are abnormal intermittent conditions under repeated switching, bending arrangements, or continuous operation. The low-current conduction capability test is used to evaluate the adaptability of low-current transmission in scenarios such as mobile phone charging or power supply of small electronic devices.

[0039] The above tests are used to confirm the basic conduction performance of structure 100 in low-voltage, low-current scenarios.

[0040] like Figure 3 As shown, in a conventional power supply embodiment, a vacuum interface type metal thin film shielded conductive structure 100 is connected between the conventional power supply 300 and the household or equipment load 310, and the end extensions at both ends of the structure 100 are respectively connected to the conventional power supply 300 and the household or equipment load 310.

[0041] The standard power supply 300 can be a 220V or 380V power supply terminal, while the household or equipment load 310 can be a household appliance, industrial equipment or other conventional electrical equipment.

[0042] After structure 100 is connected as a conductive transmission segment in the power supply line, current is transmitted along structure 100 between conventional power supply 300 and household or equipment load 310.

[0043] against Figure 3 The conventional power supply implementation shown can be used to test current carrying capacity, temperature rise, and insulation performance.

[0044] The current-carrying capacity test is used to evaluate the ability of structure 100 to continuously carry current at its rated operating current. The temperature rise test is used to evaluate the heat generation of structure 100 under continuous power supply. Insulation performance testing is used to evaluate the safety suitability of structure 100 in a conventional power supply environment.

[0045] The above tests are used to confirm the current carrying capacity and insulation stability of structure 100 in everyday power supply or equipment power supply scenarios.

[0046] like Figure 4 As shown, in one high-voltage or transmission stage embodiment, a vacuum interface type metal thin film shielded conductive structure 100 is connected between the high-voltage power supply end or transmission end 400 and the remote load or distribution end 410, and the end extensions at both ends of the structure 100 are respectively connected to the high-voltage power supply end or transmission end 400 and the remote load or distribution end 410.

[0047] The high-voltage power supply end or transmission end 400 can be a power supply or transmission end with a voltage level of 1kV to 5kV, and the remote load or distribution end 410 is the corresponding receiving end or distribution end.

[0048] When structure 100 is used as a conductive transmission segment in a high-voltage transmission path, the core structure consisting of metal tube 110, internal vacuum cavity 120, continuous conductive film 130 on inner wall, first sealing end 140 and second sealing end 150 remains unchanged.

[0049] against Figure 4 The high-voltage or transmission stage implementation shown can be tested for withstand voltage, breakdown strength, insulation resistance, and leakage current.

[0050] The withstand pressure test is used to evaluate whether structure 100 can maintain stable operation under preset high pressure conditions; Breakdown strength testing is used to evaluate its ability to withstand high-voltage electric fields; Insulation resistance testing is used to evaluate the insulation status of structure 100 under high voltage conditions; Leakage current testing is used to evaluate the safety and stability of structure 100 during high-voltage transmission.

[0051] The above tests are used to confirm the withstand voltage and insulation stability of structure 100 in high voltage or transmission-grade scenarios.

[0052] The above-mentioned low-voltage DC power supply implementation, conventional power supply implementation, and high-voltage or transmission stage implementation do not change the core composition of the vacuum interface type metal thin film shielded conductive structure 100.

[0053] The differences between the different implementation methods are mainly in the external power supply terminal, load terminal, voltage level and test indicators. The structure 100 itself is still composed of a metal tube 110, an internal vacuum cavity 120, an inner wall continuous conductive film 130 and a sealing structure at both ends, and is connected to the external circuit through the extension section of the metal tube end outside the sealing structure.

[0054] In one alternative embodiment, the metal tube 110 can be selected from different metal tube materials and sizes according to the application scenario, as long as it can form an internal vacuum cavity 120 and carry a continuous conductive film 130 on the inner wall.

[0055] The continuous conductive film 130 on the inner wall can be a continuous metal thin film layer, the thickness, surface continuity and adhesion state of which can be determined according to the target voltage level, target current level and usage environment.

[0056] The first sealing end 140 and the second sealing end 150 may adopt a sealing form that can block both axial ends of the internal vacuum cavity 120 and maintain its sealed state.

[0057] During the preparation and verification process, a metal tube 110 and its internal vacuum cavity 120 can be formed first, and then a continuous conductive film 130 can be formed on the inner wall of the metal tube 110, and sealed through the first sealing end 140 and the second sealing end 150.

[0058] Once completed, tests can be conducted in three scenarios: low-voltage DC power supply, conventional power supply, and high-voltage transmission.

[0059] For low-voltage DC power supply scenarios, the focus is on testing DC resistance, conduction stability, and small current conduction capability. For conventional power supply scenarios, the key testing parameters are current carrying capacity, temperature rise, and insulation performance. For high-voltage or transmission-grade scenarios, the key tests are withstand voltage, breakdown strength, insulation resistance, and leakage current.

[0060] As can be seen from the above implementation method, structure 100 can be connected to low-voltage DC power supply, conventional power supply and high-voltage transmission line respectively, and its conductivity, temperature rise, insulation and withstand voltage performance can be evaluated according to the corresponding test items.

[0061] The above are merely specific embodiments of the present invention and are not intended to limit the invention. For those skilled in the art, any modifications, equivalent substitutions, or improvements made to the above embodiments without departing from the inventive concept should fall within the protection scope of the present invention. The protection scope of the present invention is defined by the claims, and the specification and drawings can be used to interpret the claims.

Claims

1. A vacuum interface type metal thin film shielded conductive structure for general power transmission, characterized by, The device includes a metal tube, an internal vacuum cavity formed inside the metal tube, a continuous conductive film on the inner wall of the metal tube, and a first sealing end and a second sealing end respectively disposed at both axial ends of the internal vacuum cavity. The first sealing end and the second sealing end are both plug-shaped seals that seal the internal vacuum cavity to keep it sealed. The metal tube has end extensions for conductive connection formed on the outer side of the first sealing end and the outer side of the second sealing end, respectively. The continuous conductive film on the inner wall extends continuously along the inner wall of the metal tube in the end extensions and the corresponding areas of the internal vacuum cavity to form a conductive path. The metal tube serves as a shielding boundary outside the conductive path.

2. The vacuum interface type metal thin film shielding conductive structure according to claim 1, characterized in that, The continuous conductive film on the inner wall is continuously distributed circumferentially along the inner wall of the metal tube and is attached to the inner wall of the metal tube.

3. The vacuum interface type metal thin film shielding conductive structure according to claim 1, characterized in that, The internal vacuum cavity extends along the axial direction of the metal tube and is located in the inner space enclosed by the continuous conductive film on the inner wall.

4. The vacuum interface type metal thin film shielding conductive structure according to claim 1, characterized in that, The first sealing end and the second sealing end are embedded in the cavity of the metal tube and respectively block the axial ends of the internal vacuum cavity. The end extension section and the tube body portion corresponding to the internal vacuum cavity are continuous extensions of the same metal tube.

5. The vacuum interface type metal thin film shielding conductive structure according to claim 1, characterized in that, The vacuum interface type metal thin film shielded conductive structure serves as a conductive transmission segment in a low-voltage DC power supply line, connecting the low-voltage DC power supply or mobile phone charging power supply to the mobile phone or small electronic device.

6. The vacuum interface type metal thin film shielding conductive structure according to claim 5, characterized in that, The operating voltage of the low-voltage DC power supply line is 5V or 12V.

7. The vacuum interface type metal thin film shielding conductive structure according to claim 1, characterized in that, The vacuum interface type metal thin film shielded conductive structure serves as a conductive transmission segment in a conventional power supply line, connecting the conventional power source to the household or equipment load.

8. The vacuum interface type metal thin film shielding conductive structure according to claim 7, characterized in that, The conventional power supply is either 220V or 380V.

9. The vacuum interface type metal thin film shielding conductive structure according to claim 1, characterized in that, The vacuum interface type metal thin film shielded conductive structure serves as a conductive transmission segment in a high-voltage or transmission-level line, connecting the high-voltage power supply end or transmission end to the remote load or distribution end.

10. The vacuum interface type metal thin film shielding conductive structure according to claim 9, characterized in that, The operating voltage of the high-voltage power supply end or transmission end is 1kV to 5kV.

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