Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component including a main body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer, and an external electrode including a metal layer in contact with one end of the internal electrode and an electrode layer disposed on the metal layer, the electrode layer including a conductive metal and glass. The main body includes a groove portion in which the one end of the internal electrode is spaced apart from one surface of the main body, and the metal layer includes a first region disposed in the groove portion and a second region disposed on the one surface of the main body. In a cross section of the main body, a length Lp1 at which the first region and the one end of the internal electrode contact each other is less than a length Lp2 at which the first region and the second region contact each other.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2025-0032827, filed on March 13, 2025, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are chip capacitors mounted on printed circuit boards of various types of electronic products, such as imaging devices (including liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, and mobile phones, and can be used to charge or discharge them.

[0004] MLCCs are used as components in a variety of electronic devices due to their small size, high capacitance, and ease of installation.

[0005] Recently, with the miniaturization and high performance of electronic devices, multilayer ceramic capacitors have also tended to be miniaturized and have higher capacitance. Therefore, ensuring the high reliability of multilayer ceramic capacitors has become increasingly important.

[0006] Typically, to reduce the thickness of the inner electrode, it may be necessary to use metal powder particles that are finer than those used in existing technologies. However, when using fine metal powder particles, the shrinkage initiation temperature may become lower, which can lead to differences in the shrinkage behavior between the inner electrode and the dielectric layer. In this case, the shrinkage rate of the inner electrode may be greater than that of the dielectric layer, resulting in reduced connectivity between the inner and outer electrodes. Summary of the Invention

[0007] One aspect of this disclosure is to provide a multilayer electronic component with excellent reliability.

[0008] Another aspect of this disclosure is the suppression of peeling and delamination of the external electrode.

[0009] Another aspect of this disclosure is to reduce the contact resistance between the inner electrode and the outer electrode.

[0010] However, the aspects of this disclosure are not limited to those set forth herein, and will be more readily understood in the process of describing specific exemplary embodiments of this disclosure.

[0011] According to one aspect of this disclosure, a multilayer electronic component is provided, the multilayer electronic component comprising: a body including a dielectric layer and inner electrodes alternately disposed with respect to the dielectric layer; and an outer electrode including a metal layer contacting one end of the inner electrode and an electrode layer disposed on the metal layer, the electrode layer comprising a conductive metal and glass. The body may include a groove in which one end of the inner electrode is spaced apart from a surface of the body, and the metal layer includes a first region disposed in the groove and a second region disposed on the one surface of the body. In a cross-section of the body, the length Lp1 of the first region and the one end of the inner electrode contacting each other may be less than the length Lp2 of the first region and the second region contacting each other.

[0012] According to an example embodiment of this disclosure, the shape of the metal layer of the external electrode disposed in a first region of the groove of the body can be controlled, thereby improving the reliability of the multilayer electronic assembly.

[0013] According to exemplary embodiments of this disclosure, peeling and delamination of the external electrode can be suppressed.

[0014] According to an example embodiment of this disclosure, the contact resistance between the inner electrode and the outer electrode can be reduced.

[0015] However, the various advantages and effects of this disclosure are not limited to those set forth herein, and will be more readily understood in the process of describing specific exemplary embodiments of this disclosure. Attached Figure Description

[0016] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1 This is a schematic perspective view of a multilayer electronic assembly including a main body according to an exemplary embodiment of the present disclosure; Figure 2 It is along Figure 1 A schematic cross-sectional view of line I-I'; Figure 3 It is along Figure 1 A schematic cross-sectional view taken from line II-II'; Figure 4 yes Figure 1 An exploded view of the main body; Figure 5 yes Figure 2 Enlarged view of the K1 region excluding the electrodes; Figure 6 yes Figure 2 A magnified view of the K1 region; Figure 7The image was obtained by scanning a portion of the cross-section corresponding to the K1 region using a scanning electron microscope (SEM); and Figure 8 This corresponds to another exemplary embodiment of the present disclosure. Figure 2 The illustration. Detailed Implementation

[0017] In the following description, exemplary embodiments of the present disclosure are illustrated with reference to the accompanying drawings. However, the present disclosure may be exemplified in many different forms and should not be construed as limited to the specific exemplary embodiments set forth herein. Additionally, exemplary embodiments of the present disclosure may be provided to describe the present disclosure more completely to those skilled in the art. Therefore, for clarity of description, the shape and size of elements in the drawings may be exaggerated, and elements denoted by the same reference numerals in the drawings may be the same elements.

[0018] For clarity of this disclosure, parts irrelevant to the description have been omitted, and dimensions (e.g., lengths) have been enlarged to clearly indicate layers and regions. Throughout the specification, similar parts having the same function within the same area are indicated by similar reference numerals. Throughout the specification, unless otherwise expressly stated, when an element is referred to as "comprising" or "including," it means that it may also include other elements, but does not exclude other elements.

[0019] In the accompanying drawings, the X direction can be defined as a first direction, a stacking direction, or a thickness direction; the Y direction can be defined as a second direction or a length direction; and the Z direction can be defined as a third direction or a width direction.

[0020] Multilayer electronic components Figure 1 This is a schematic perspective view of a multilayer electronic assembly including a main body, according to an exemplary embodiment of the present disclosure.

[0021] Figure 2 It is along Figure 1 A schematic cross-sectional view taken from line I-I'.

[0022] Figure 3 It is along Figure 1 A schematic cross-sectional view taken from line II-II'.

[0023] Figure 4 yes Figure 1 An exploded view of the main body.

[0024] Figure 5 yes Figure 2 A magnified view of the K1 region excluding the external electrode.

[0025] Figure 6 yes Figure 2 A magnified view of the K1 region.

[0026] Figure 7 The image was obtained by scanning a portion of the cross section corresponding to the K1 region using a scanning electron microscope (SEM).

[0027] In the following text, reference will be made to Figures 1 to 7 A multilayer electronic component 100 according to an exemplary embodiment of the present disclosure is described in detail. Furthermore, multilayer ceramic capacitors (MLCCs) are described as examples of multilayer electronic components, but the present disclosure is not limited thereto, and the multilayer electronic components of the present disclosure can be various electronic products formed using ceramic materials, such as inductors, piezoelectric elements, varistors, thermistors, etc.

[0028] A multilayer electronic component 100 according to an exemplary embodiment of the present disclosure may include a body 110 and external electrodes 131 and 132. The body 110 may include a dielectric layer 111 and internal electrodes 121 and 122 alternately disposed with respect to the dielectric layer 111.

[0029] The outer electrode 131 may include a metal layer 131a in contact with one end of at least one of the inner electrodes 121 and an electrode layer 131b disposed on the metal layer 131a. The outer electrode 132 may include a metal layer 132a in contact with one end of at least one of the inner electrodes 122 and an electrode layer 132b disposed on the metal layer 132a. The electrode layers 131b and 132b may include a conductive metal M1 and glass GL.

[0030] The main body 110 may include a groove H1, in which one end of the inner electrode 121 is spaced apart from the third surface 3 of the main body 110. The metal layer 131a may include a first region P1 disposed in the groove H1 and a second region P2 disposed on the third surface 3 of the main body 110. In the cross-section of the main body 110, the length Lp1 in which one end of the first region P1 and at least one of the inner electrode 121 contacts each other may be less than the length Lp2 in which the first region P1 and the second region P2 contact each other.

[0031] Similarly, the body 110 may include a groove H1 in which one end of the inner electrode 122 is spaced apart from the fourth surface 4 of the body 110. The metal layer 132a may include a first region P1 disposed in the groove H1 and a second region P2 disposed on the fourth surface 4 of the body 110. In the cross-section of the body 110, the length Lp1 in which one end of the first region P1 and at least one of the inner electrode 122 contacts each other may be less than the length Lp2 in which the first region P1 and the second region P2 contact each other.

[0032] Figure 5 yes Figure 2 An enlarged view of region K1 excluding external electrodes 131 and 132. (Refer to...) Figure 5The body 110 may include a groove H1 in which one end of the inner electrode 121 is spaced apart from the third surface 3 of the body 110. The inner electrodes 121 and 122 and the dielectric layer 111 may be formed using different materials, potentially leading to differences in shrinkage behavior between the inner electrodes 121 and 122 and the dielectric layer 111 during sintering. Therefore, the body 110 may include a groove H1 in which one end of the inner electrode 121 is spaced apart from the third surface 3 of the body 110 and / or one end of the inner electrode 122 is spaced apart from the fourth surface 4 of the body 110. The groove H1 may cause a problem of deteriorated connectivity between the inner electrodes 121 and 122 and the outer electrodes 131 and 132. In the prior art, to solve this problem, an additional polishing process is used, such as sandblasting, to remove the portion of the dielectric layer protruding relative to one end of the inner electrode 121 or 122. In this disclosure, the outer electrodes 131 and 132 may include metal layers 131a and 132a, and the metal layers 131a and 132a may respectively include a first region P1 disposed in the groove H1 and a second region P2 disposed on the third surface 3 and the fourth surface 4 of the body 110, thereby improving the connectivity between the inner electrodes 121 and 122 and the outer electrodes 131 and 132 without the need for additional polishing processes.

[0033] In addition, the length Lp1 of the first region P1 and one end of the inner electrodes 121 and 122 in contact with each other can be less than the length Lp2 of the first region P1 and the second region P2 in contact with each other, thereby suppressing the peeling and delamination of the outer electrodes 131 and 132 and reducing the contact resistance between the inner electrodes 121 and 122 and the outer electrodes 131 and 132.

[0034] In the following, each of the components included in the multilayer electronic assembly 100 according to an exemplary embodiment of the present disclosure will be described.

[0035] In the body 110, the dielectric layer 111 and the internal electrodes 121 and 122 may be stacked alternately.

[0036] The specific shape of the main body 110 is not limited. However, as Figure 1 As shown, the body 110 may have a hexahedral shape or a shape similar to a hexahedron. During the sintering process, the ceramic powder particles included in the body 110 may shrink, so that the body 110 may not have a hexahedral shape with perfect straight lines, but may have a generally hexahedral shape.

[0037] The main body 110 may have: a first surface 1 and a second surface 2, which are opposite to each other in the thickness direction; a third surface 3 and a fourth surface 4, which are connected to the first surface 1 and the second surface 2, and are opposite to each other in the length direction; and a fifth surface 5 and a sixth surface 6, which are connected to the first surface 1 to the fourth surface 4, and are opposite to each other in the width direction.

[0038] Because the dielectric layer 111, including the edge regions where the inner electrodes 121 and 122 are not disposed, is stacked in the thickness direction, a step difference can be caused by the thickness of the inner electrodes 121 and 122, such that the corners connecting the first surface 1 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 and / or the corners connecting the second surface 2 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may shrink relative to the first surface 1 or the second surface 2 towards the center of the body 110 in the first direction. Optionally, due to the shrinkage behavior of the body 110 during the sintering process, the corners connecting the first surface 1 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 and / or the corners connecting the second surface 2 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may shrink relative to the first surface 1 or the second surface 2 towards the center of the body 110 in the thickness direction. Optionally, to prevent edge chipping defects, etc., additional processes may be performed to round the corners connecting the various surfaces of the body 110. Therefore, the corners connecting the first surface 1 to the third surface 3, the fourth surface 4, the fifth surface 5 and the sixth surface 6 and / or the corners connecting the second surface 2 to the third surface 3, the fourth surface 4, the fifth surface 5 and the sixth surface 6 may have a rounded shape.

[0039] To suppress the step difference caused by the inner electrodes 121 and 122, the edge portions 114 and 115 can be formed as follows: the inner electrodes 121 and 122 can be stacked and then cut to expose the two side surfaces of the capacitor forming portion Ac in the third direction (width direction). Thereafter, one or two or more dielectric layers can be stacked on the two side surfaces of the capacitor forming portion Ac in the third direction (width direction). In this case, the portions connecting the first surface 1 to the fifth surface 5 and the sixth surface 6, and the portions connecting the second surface 2 to the fifth surface 5 and the sixth surface 6, do not need to be shrunk.

[0040] The plurality of dielectric layers 111 included in the main body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other, such that the boundary between adjacent dielectric layers 111 is not easily identifiable without using a scanning electron microscope (SEM). The number of stacked dielectric layers is not limited, and may be determined in consideration of the size of the multilayer electronic component 100. For example, the main body 110 may be formed by stacking 400 or more dielectric layers 111.

[0041] The dielectric layer 111 may be formed by: preparing a ceramic slurry including ceramic powder particles, an organic solvent and a binder, applying the ceramic slurry onto a carrier film and drying the same to prepare a ceramic green sheet, then sintering the ceramic green sheet. The ceramic powder particles are not limited as long as a sufficient capacitance can be obtained therewith, and may be, for example, barium titanate (BaTiO3)-based ceramic powder particles. As a more specific example, the barium titanate (BaTiO3)-based ceramic powder particles may be BaTiO3, (Ba 1- x Ca x )TiO3 (0<x<1), Ba(Ti 1-y Ca y )O3 (0<y<1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0<x<1, 0<y<1) and Ba(Ti 1- y Zr y )O3 (0<y<1), one or more of the foregoing.

[0042] In addition, the average thickness td of the dielectric layers 111 is not limited, and may be, for example, 0.01 μm to 10 μm. Further, the average thickness td of the dielectric layers 111 may be arbitrarily set according to desired characteristics or applications. For example, for small-sized IT (information technology) electronic components, in order to achieve miniaturization and high capacitance, the average thickness td of at least one of the plurality of dielectric layers 111 may be less than or equal to 0.4 μm.

[0043] Here, the average thickness td of the dielectric layer 111 can refer to the dimension of the dielectric layer 111 disposed between the inner electrodes 121 and 122 in the first direction. For example, the average thickness td of the dielectric layer 111 can be measured by scanning the cross-section of the body 110 in the first and second directions using a SEM at a magnification of 10,000x. More specifically, the average thickness td of the dielectric layer 111 can be measured by measuring the thickness of a dielectric layer 111 at multiple points (e.g., thirty points spaced apart from each other at equal intervals in the second direction) and calculating the average thickness. The thirty points spaced apart from each other at equal intervals can be specified in the capacitor forming section Ac. In addition, the average thickness td of the dielectric layer 111 can be more generalized when such an average measurement is performed on ten dielectric layers 111.

[0044] The main body 110 may include: a capacitor forming portion Ac disposed in the main body 110, the capacitor forming portion Ac having capacitance by including a first inner electrode 121 and a second inner electrode 122 configured to be opposite to each other and a dielectric layer 111 disposed between the first inner electrode 121 and the second inner electrode 122; and covering portions 112 and 113 disposed on the upper and lower portions of the capacitor forming portion Ac in a first direction.

[0045] Furthermore, the capacitor forming portion Ac can be a portion that contributes to the capacitance of the capacitor, and can be formed by repeatedly stacking multiple first inner electrodes 121 and multiple second inner electrodes 122 with the dielectric layer 111 between the first inner electrodes 121 and the second inner electrodes 122.

[0046] Cover portions 112 and 113 may include an upper cover portion 112 disposed on the upper part of the capacitor forming portion Ac in the thickness direction and a lower cover portion 113 disposed on the lower part of the capacitor forming portion Ac in the thickness direction.

[0047] The upper cover portion 112 and the lower cover portion 113 can be formed by stacking one or two or more dielectric layers 111 on the upper and lower surfaces of the capacitor forming portion Ac in the thickness direction, respectively, and can be used to substantially prevent the inner electrodes 121 and 122 from being damaged due to physical stress and / or chemical stress.

[0048] The upper cover 112 and the lower cover 113 do not include the inner electrodes 121 and 122, and may include the same material as the dielectric layer 111.

[0049] In other words, the upper cover 112 and the lower cover 113 may include ceramic materials, and may include, for example, barium titanate (BaTiO3) based ceramic materials.

[0050] The thickness of each of the covers 112 and 113 is not limited. However, in order to more easily achieve miniaturization and high capacitance of multilayer electronic components, the thickness tc of each of the covers 112 and 113 may be less than or equal to 15 μm.

[0051] The average thickness tc of each of the covers 112 and 113 may refer to the dimension of each of the covers 112 and 113 in the first direction, and may be a value obtained by averaging the dimensions of each of the covers 112 and 113 in the first direction measured at five points spaced apart from each other at equal intervals on the upper or lower part of the capacitor forming part Ac.

[0052] In addition, edge portions 114 and 115 may be respectively provided on the side surface of capacitor forming portion Ac.

[0053] Edge portions 114 and 115 may include a first edge portion 114 disposed on one side surface of the capacitor forming portion Ac in the width direction and a second edge portion 115 disposed on the other side surface of the capacitor forming portion Ac in the width direction. That is, edge portions 114 and 115 may be disposed on two side surfaces of the capacitor forming portion Ac in the width direction, respectively.

[0054] like Figure 3 As shown, the edges 114 and 115 may refer to the area between the two ends of each of the first inner electrode 121 and the second inner electrode 122 and the outer surface of the body 110 in a cross section cut along the width-thickness direction of the body 110.

[0055] Edges 114 and 115 can be used to prevent damage to the inner electrodes 121 and 122 due to physical and / or chemical stress.

[0056] Edges 114 and 115 can be formed by coating conductive paste onto a ceramic green sheet (excluding the portion of the ceramic green sheet on which edge 114 or 115 will be formed) to form internal electrodes 121 and 122.

[0057] In addition, in order to suppress the step difference caused by the inner electrodes 121 and 122, the edge portions 114 and 115 can be formed in the following manner: the inner electrodes 121 and 122 can be stacked and then cut to expose the two side surfaces of the capacitor forming portion Ac in the third direction (width direction). Thereafter, one dielectric layer or two or more dielectric layers can be stacked on the two side surfaces of the capacitor forming portion Ac in the third direction (width direction).

[0058] The width of each of the edge portions 114 and 115 is not limited. However, in order to more easily achieve miniaturization and high capacitance of multilayer electronic components, the average width of each of the edge portions 114 and 115 may be less than or equal to 15 μm.

[0059] The average width of each of the edge portions 114 and 115 may be the average size in the third direction of the regions of the inner electrodes 121 and 122 spaced apart from the fifth surface 5, or the average size in the third direction of the regions of the inner electrodes 121 and 122 spaced apart from the sixth surface 6, and may be the average size in the third direction of the dimensions of each of the edge portions 114 and 115 measured at five points spaced apart from each other at equal intervals on the side surface of the capacitor forming portion Ac.

[0060] Therefore, in the example embodiment, the average size of the regions of the inner electrodes 121 and 122 spaced apart from the fifth surface 5 and the sixth surface 6 in the third direction may be less than or equal to 15 μm.

[0061] The inner electrodes 121 and 122 may be alternately disposed with the dielectric layer 111. For example, the first inner electrode 121 and the second inner electrode 122 (a pair of electrodes with different polarities) may be disposed opposite each other with the dielectric layer 111 disposed between the first inner electrode 121 and the second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 may be electrically isolated from each other by the dielectric layer 111 disposed between them. In this case, the inner electrodes 121 and 122 may be alternately disposed with the dielectric layer 111 in a first direction.

[0062] The first inner electrode 121 may be spaced apart from the fourth surface 4 and may extend toward the third surface 3. The second inner electrode 122 may be spaced apart from the third surface 3 and may extend toward the fourth surface 4. The first inner electrode 121 may be electrically connected to the first outer electrode 131 on the third surface 3, and the second inner electrode 122 may be electrically connected to the second outer electrode 132 on the fourth surface 4.

[0063] The conductive metal included in the inner electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti and alloys thereof, preferably Ni, but this disclosure is not limited thereto.

[0064] The method for forming the internal electrodes 121 and 122 is not limited. For example, the internal electrodes 121 and 122 can be formed by coating a conductive paste comprising a conductive metal onto a ceramic green sheet and sintering it. Screen printing or gravure printing can be used as a method for coating the conductive paste for forming the internal electrodes, but this disclosure is not limited thereto.

[0065] The average thickness te of each of the inner electrodes 121 and 122 is not limited, and can be, for example, from 0.01 μm to 3 μm. Furthermore, the average thickness te of each of the inner electrodes 121 and 122 can be arbitrarily set according to desired characteristics or applications. For example, for small-sized IT electronic components, to achieve miniaturization and high capacitance, the average thickness te of at least one of the multiple inner electrodes 121 and 122 can be less than or equal to 0.4 μm.

[0066] Here, the average thickness *te* of the inner electrodes 121 and 122 can be measured by scanning the cross-section of the body 110 in the first and second directions using a SEM at a magnification of 10,000x. More specifically, the thickness of each of the inner electrodes 121 and 122 can be measured at multiple points (e.g., thirty points spaced apart from each other at equal intervals in the second direction) to calculate its average value. The thirty points spaced apart from each other at equal intervals can be specified in the capacitor forming section *Ac*. Furthermore, when such an average value measurement is performed on ten inner electrodes 121 or ten inner electrodes 122, the average thickness of each of the inner electrodes 121 and 122 can be more generalized.

[0067] The external electrodes 131 and 132 may include metal layers 131a and 132a that are in contact with one end of the internal electrodes 121 and 122. The external electrodes 131 and 132 may also include electrode layers 131b and 132b respectively disposed on the metal layers 131a and 132a, the electrode layers 131b and 132b including conductive metal M1 and glass GL.

[0068] The main body 110 may include a groove H1, in which one end of the inner electrode 121 is spaced apart from the third surface 3 of the main body 110. The metal layer 131a may include a first region P1 disposed in the groove H1 and a second region P2 disposed on the third surface 3 of the main body 110. Similarly, the main body 110 may include a groove H1, in which one end of the inner electrode 122 is spaced apart from the fourth surface 4 of the main body 110. The metal layer 132a may include a first region P1 disposed in the groove H1 and a second region P2 disposed on the fourth surface 4 of the main body 110.

[0069] like Figure 2 As shown, the external electrodes 131 and 132 may include a first external electrode 131 disposed on the third surface 3 and a second external electrode 132 disposed on the fourth surface 4. The first external electrode 131 is connected to the first internal electrode 121, and the second external electrode 132 is connected to the second internal electrode 122.

[0070] In this example embodiment, a structure is described in which a multilayer electronic component 100 has two external electrodes 131 and 132, but the number and shape of the external electrodes 131 and 132 may be changed depending on the form of the internal electrodes 121 and 122 or for other purposes.

[0071] Figure 6 is Figure 2 an enlarged view of the K1 region. The K1 region shows an enlarged portion of a part where the first external electrode 131 is disposed. The first external electrode 131 may differ from the second external electrode 132 in that: the first external electrode 131 is disposed on the third surface 3, and the second external electrode 132 is disposed on the fourth surface 4. However, the first external electrode 131 and the second external electrode 132 may be identical in structure. The following description is based on the first external electrode 131, and is considered to include the description related to the second external electrode 132.

[0072] Each of the metal layers 131a and 132a may include a first region P1 disposed in the groove H1 and a second region P2 disposed on the third surface 3 or the fourth surface 4 of the body 110. In a cross-section of the body 110, an average contact length Lp1 between one end of at least one of the internal electrodes 121 or at least one of the internal electrodes 122 and the first region P1 may be less than an average contact length Lp2 between the first region P1 and the second region P2. In this case, the cross-section of the body 110 may be a cross-section of the body 110 along the length direction and the thickness direction.

[0073] When Lp1 < Lp2 is satisfied, the contact area between the first region P1 and the second region P2 can be increased, thereby improving interface adhesion, and effectively dispersing stress at the interface between the first region P1 and the second region P2 when temperature changes and / or mechanical stress is applied.

[0074] In addition, when Lp1 < Lp2 is satisfied, in the cross-section of the body 110, the first region P1 may have an inverted trapezoidal shape, which may be caused by the groove H1 having an inverted trapezoidal shape and the first region P1 formed in the groove H1. Since the first region P1 has an inverted trapezoidal shape, the contact area between the first region P1 and the second region P2 can be increased, thereby improving interface adhesion, and effectively dispersing stress at the interface when temperature changes and / or mechanical stress is applied. In addition, since the first region P1 has an inverted trapezoidal shape, the first region P1 can gradually disperse current flow between the internal electrodes 121, 122 and the external electrodes 131, 132, thereby reducing current crowding and thus reducing contact resistance.

[0075] Conversely, when Lp1 equals Lp2 and the first region P1 has a rectangular shape, the contact area between the first region P1 and the second region P2 may be reduced. Due to the simple planar structure, peeling and delamination of the outer electrodes 131 and 132 may occur at the interface between the inner electrodes 121 and 122 and the outer electrodes 131 and 132. Furthermore, when the first region P1 has a rectangular shape, current crowding may occur in certain areas when the first region P1 is formed using a sputtering process, which could lead to an increase in local resistance.

[0076] Furthermore, when metal layers 131a and 132a are formed using a sputtering process, if the tank H1 has a rectangular shape, the sputtered metal may not deposit properly on the sidewalls of the tank H1, resulting in uneven formation of metal layers 131a and 132a. Conversely, when the tank H1 has an inverted trapezoidal shape, the sidewalls of the tank H1 can be gently sloping, which promotes the deposition of sputtered metal and allows for more uniform formation of metal layers 131a and 132a.

[0077] The method for controlling the shape of the first region P1 and the groove H1 is not limited. For example, the shape of the groove H1 can be controlled by adjusting the difference in shrinkage behavior between the inner electrodes 121 and 122 and the dielectric layer 111 during sintering, and the shape of the first region P1 can be determined based on the shape of the groove H1.

[0078] In the example embodiment, the length Lp1 of the first region P1 in contact with one end of the inner electrodes 121, 122 may be less than the thickness of one end of the inner electrodes 121, 122, which may be due to the groove H1 being formed into an inverted trapezoidal shape. Here, the thickness of one end of the inner electrodes 121, 122 may refer to the dimension of the inner electrodes 121 and 122 in the X direction. In this document, lengths Lp1 and Lp2 may be average lengths, and the thickness of one end of the inner electrodes 121, 122 may be average thicknesses.

[0079] The ratio between Lp1 and Lp2 is not restricted. For example, the ratio of Lp2 to Lp1 (Lp2 / Lp1) can be greater than or equal to 1.2 and less than or equal to 3.5.

[0080] In the example embodiment, the average thickness Tp2 of the second region P2 can be greater than or equal to 200 nm and less than or equal to 300 nm. Therefore, a uniform conductive path can be ensured, thereby further improving the electrical connectivity between the inner electrodes 121 and 122 and the outer electrodes 131 and 132. Furthermore, sufficient bonding strength between the metal layers 131a and 132a and the electrode layers 131b and 132b can be ensured.

[0081] When the average thickness of the second region P2 is too small, it may be difficult to ensure a uniform conductive path, and the conductivity may decrease. Conversely, when the average thickness of the second region P2 is too large, thermal stress may increase, which may lead to delamination and cracking at the interface.

[0082] The average thickness of the first region P1 is not limited. For example, the average thickness Tp1 of the first region P1 can be greater than or equal to 100 nm and less than or equal to 500 nm.

[0083] Furthermore, the average thickness of each of electrode layers 131b and 132b is not limited. For example, the average thickness Tb of each of electrode layers 131b and 132b can be greater than or equal to 15 μm and less than or equal to 100 μm.

[0084] The average thicknesses of Lp1, Lp2, Tp1, Tp2, Tb, and one end of the internal electrodes 121 and 122 can be obtained by measuring the cross-section of the multilayer electronic assembly 100 at its central portion in the width direction, along its length and thickness directions. Figure 6 As shown. Lp1, Lp2, and Tp1 can all be average values ​​obtained by averaging the values ​​measured from the five first regions P1. The average thickness of one end of the inner electrodes 121 and 122 can be the average thickness (dimension in the first direction) of the ends of the inner electrodes 121 and 122 that are in contact with the five first regions P1. Furthermore, Tp2 can be the average thickness (dimension in the second direction) of the second region P2 measured at five points spaced apart from each other at equal intervals in the thickness direction, and Tb can be the average thickness (dimension in the second direction) of the electrode layers 131b or 132b measured at five points spaced apart from each other at equal intervals in the thickness direction.

[0085] Metal layers 131a and 132a can be sputtered layers formed using a sputtering process. When metal layers 131a and 132a are formed using a plating process, the first region P1 may not be sufficiently formed in the tank H1, thus potentially failing to adequately ensure electrical connectivity between the inner electrodes 121 and 122 and the outer electrodes 131 and 132. Conversely, when using a sputtering process, metal layers 131a and 132a can be uniformly deposited in the tank H1, thereby maximizing electrical connectivity between the inner electrodes 121 and 122 and the outer electrodes 131 and 132.

[0086] In an example embodiment, metal layers 131a and 132a may include one or more of Ni, Ti, and Au.

[0087] Electrode layers 131b and 132b may be disposed on metal layers 131a and 132a, and may include conductive metal M1 and glass GL.

[0088] A conductive metal M1 can be provided to ensure electrical connectivity, and at least a portion of the conductive metal M1 can be in direct contact with the metal layers 131a and 132a.

[0089] The glass GL may be configured to ensure bonding strength with the body 110, and at least a portion of the glass GL may be in direct contact with the body 110. In an example embodiment, electrode layers 131b and 132b may be configured to completely cover metal layers 131a and 132a, and the glass GL may be used to prevent the outer electrodes 131 and 132 from warping.

[0090] Materials with excellent electrical conductivity can be used as conductive metal M1 included in electrode layers 131b and 132b. For example, conductive metal M1 may include one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0091] Since the metal layers 131a and 132a are formed using a sputtering process, the metal layers 131a and 132a can have an amorphous structure or a fine and uniform grain structure with a grain size ranging from a few nanometers to hundreds of nanometers.

[0092] In the example embodiment, metal layers 131a and 132a may have an amorphous structure.

[0093] In the example embodiment, the average grain size of each of the metal layers 131a and 132a may be less than or equal to 50 nm.

[0094] Figure 7 The image was obtained by scanning a portion of the cross-section corresponding to the K1 region using SEM. (See reference...) Figure 7 It can be confirmed that the metal layer 131a has a fine and uniform grain structure.

[0095] In the example embodiment, the external electrodes 131 and 132 may further include plating layers 131c and 132c disposed on the electrode layers 131b and 132b.

[0096] Platings 131c and 132c can be used to improve mounting characteristics. The type of each of platings 131c and 132c is not limited, and each of platings 131c and 132c can be one or more of Ni, Sn, Pd and alloys thereof, and can be formed as multiple layers.

[0097] As a more specific example of plating layers 131c and 132c, plating layers 131c and 132c can be Ni plating layers or Sn plating layers. Plating layers 131c and 132c can have the form in which Ni plating layers and Sn plating layers are sequentially formed on electrode layers 131b and 132b, or have the form in which Sn plating layers, Ni plating layers, and Sn plating layers are sequentially formed on electrode layers 131b and 132b. Additionally, plating layers 131c and 132c can include multiple Ni plating layers and / or multiple Sn plating layers.

[0098] The average thickness Tc of each of coatings 131c and 132c is not limited, for example, it can be greater than or equal to 3 μm and less than or equal to 20 μm.

[0099] In an example embodiment, inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122 alternately disposed in the thickness direction, with a dielectric layer 111 between the first inner electrode 121 and the second inner electrode 122. Body 110 may include: a first surface 1 and a second surface 2, opposite to each other in the thickness direction; a third surface 3 and a fourth surface 4, connected to the first surface 1 and the second surface 2, opposite to each other in the length direction; and a fifth surface 5 and a sixth surface 6, connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4, opposite to each other in the width direction. Outer electrodes 131 and 132 may include a first outer electrode 131 disposed on the third surface 3 and a second outer electrode 132 disposed on the fourth surface 4, the first outer electrode 131 connected to the first inner electrode 121, and the second outer electrode 132 connected to the second inner electrode 122.

[0100] Figure 8 It is a multilayer electronic component 100' according to another exemplary embodiment of this disclosure and Figure 2 The corresponding diagram. It should be understood that, unless otherwise stated, Figure 8 The components shown and their reference numerals correspond to the above description of the multilayer electronic assembly 100.

[0101] Reference Figure 8 Metal layers 131a' and 132a' may be configured to extend onto a portion of the first surface 1 and a portion of the second surface 2. The first metal layer 131a' may cover the third surface 3 and may be configured to extend beyond the extension line E1 of the first surface 1 and the extension line E2 of the second surface 2 onto a portion of the first surface 1 and a portion of the second surface 2. The second metal layer 132a' may cover the fourth surface 4 and may be configured to extend beyond the extension line E1 of the first surface 1 and the extension line E2 of the second surface 2 onto a portion of the first surface 1 and a portion of the second surface 2.

[0102] In this configuration, since metal layers 131a' and 132a' can extend onto a portion of the first surface 1 and a portion of the second surface 2, they can cover the corners of the body 110, thereby easily ensuring sufficient thickness of each of the outer electrodes 131' and 132' at the corners of the body 110 and improving moisture resistance reliability. As an example, metal layers 131a' and 132a' can also be configured to extend onto a portion of the fifth surface 5 and a portion of the sixth surface 6. Furthermore, electrode layers 131b and 132b of the outer electrodes 131 and 132, as well as plating layers 131c and 132c, can extend onto a portion of the first surface 1 and a portion of the second surface 2, and can further extend onto a portion of the fifth surface 5 and a portion of the sixth surface 6.

[0103] While exemplary embodiments have been shown and described above, those skilled in the art will readily understand that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

[0104] Furthermore, the term "example embodiment" as used herein does not refer to the same example embodiment, but is provided to emphasize a particular feature or characteristic that differs from a particular feature or characteristic of another example embodiment. However, the example embodiments provided herein are considered to be implementable by combining them in whole or in part. For example, an element described in a particular example embodiment, even if not described in another example embodiment, may be understood as a description relating to another example embodiment, unless a contrary or contradictory description is provided therein.

[0105] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to limit the exemplary embodiments. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise.

[0106] Numerical ranges are combined and / or interchanged with each other, throughout this specification and claims. Unless the context otherwise requires, these ranges are identified and include all subranges contained herein. For example, all ranges disclosed herein include endpoints, and endpoints may be combined independently of each other.

[0107] As used herein throughout the specification and claims, approximate language may be used to modify any quantitative description, allowing for variations in that quantitative description without resulting in a change in its underlying function. Therefore, values ​​modified by one or more terms (e.g., “about” and “basic”) are not limited to the specified precise values.

Claims

1. A multilayer electronic component, comprising: The main body includes a dielectric layer and internal electrodes alternately disposed with the dielectric layer; as well as The outer electrode includes a metal layer in contact with one end of the inner electrode and an electrode layer disposed on the metal layer, the electrode layer comprising a conductive metal and glass. The main body includes a groove, in which one end of the inner electrode is spaced apart from a surface of the main body, and the metal layer includes a first region disposed in the groove and a second region disposed on the surface of the main body. In the cross-section of the main body, the length Lp1 of the first region and the end of the inner electrode in contact with each other is less than the length Lp2 of the first region and the second region in contact with each other.

2. The multilayer electronic component according to claim 1, wherein, In the cross-section of the main body, the first region has an inverted trapezoidal shape.

3. The multilayer electronic component according to claim 1, wherein, Lp1 is less than the thickness of one end of the inner electrode.

4. The multilayer electronic component according to claim 1, wherein, The ratio of Lp2 to Lp1 is greater than or equal to 1.2 and less than or equal to 3.

5.

5. The multilayer electronic component according to claim 1, wherein, The average thickness Tp2 of the second region is greater than or equal to 200 nm and less than or equal to 300 nm.

6. The multilayer electronic assembly according to claim 1, wherein, The average thickness Tp1 of the first region is greater than or equal to 100 nm and less than or equal to 500 nm.

7. The multilayer electronic assembly according to claim 1, wherein, The metal layer comprises one or more selected from the group consisting of Ni, Ti and Au.

8. The multilayer electronic component according to claim 1, wherein, The metal layer has an amorphous structure.

9. The multilayer electronic assembly according to claim 1, wherein, The metal layer has an average grain size of less than or equal to 50 nm.

10. The multilayer electronic assembly according to claim 1, wherein, The external electrode also includes a plating layer disposed on the electrode layer.

11. The multilayer electronic assembly according to claim 1, wherein, The inner electrode includes a first inner electrode and a second inner electrode alternately arranged in the thickness direction, and the dielectric layer is located between the first inner electrode and the second inner electrode. The body includes: a first surface and a second surface, opposite to each other in the thickness direction; a third surface and a fourth surface, connected to the first surface and the second surface, opposite to each other in the length direction; and a fifth surface and a sixth surface, connected to the first surface to the fourth surface, opposite to each other in the width direction. The external electrode includes: a first external electrode disposed on the third surface, the first external electrode being connected to the first internal electrode; and a second external electrode disposed on the fourth surface, the second external electrode being connected to the second internal electrode.

12. The multilayer electronic assembly according to claim 11, wherein, The cross-section of the main body is the cross-section of the main body in the length direction and the thickness direction.

13. The multilayer electronic assembly according to claim 11, wherein, The metal layer is configured to extend onto a portion of the first surface and a portion of the second surface.

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