Semiconductor wire bonding unwinding rotation amount control mechanism and semiconductor wire bonding machine

CN122766366APending Publication Date: 2026-09-15RADIUM GOD TECH (XIAN) CO LTD
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Patent Information

Application Number
CN202610851217.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-06-12
Publication Date
2026-09-15

AI Technical Summary

Technical Problem

[0004]本发明的目的在于提供一种半导体焊线放线转动量控制机构及半导体焊线机,用以解决现有放线装置无稳定阻尼易松线断丝、被动送线适配性差、线材易跑偏折丝、单点光电检测不稳、电机脉冲计量误差大、功能分散占地调试繁琐的技术缺陷

Benefits of technology

1、通过阻尼座有效抑制线盘惯性窜动与超速转动,从根源杜绝松线、断丝不良问题;依托胶轮摩擦传动实现焊线可控式精准进给,配合导向限位结构约束线材输送轨迹,避免走线偏移、弯折;借助矩阵光纤实时监测线材通断状态,可快速触发停机保护;采用随压胶轮直接联动编码器采集放线数据,彻底规避传统电机脉冲计量因丢步、打滑产生的计量偏差,可适配多规格半导体焊线加工工况,有效提升半导体封装焊线作业的精度与运行稳定性。

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Abstract

The application discloses a kind of semiconductor wire bonding wire unwinding rotation amount control mechanism and semiconductor wire bonding machine, mechanism includes wire unwinding base plate;Along the direction of wire, wire unwinding rotation shaft assembly, wire feeding assembly, adjustable single-wire positioner, wire unwinding detection assembly and wire unwinding control assembly are sequentially arranged, wire reel is sleeved on the outside of wire unwinding rotation shaft assembly;The wire unwinding rotation shaft assembly provides rotary damping through damping seat, inhibits wire reel inertia overspeed, avoids loose wire, broken wire defect;Wire feeding assembly realizes accurate active friction wire feeding by relying on stepper motor and elastic top tight rubber wheel;Adjustable single-wire positioner passes through guide sleeve and roller shaft Regular wire material conveying track;Wire unwinding detection assembly utilizes matrix optical fiber to monitor wire material state in real time, realizes broken wire linkage stop machine protection;Wire unwinding control assembly collects wire unwinding rotation amount by direct-encoder with pressure rubber wheel, eliminates traditional pulse metering slip, step loss error.The application is adapted to multiple specifications welding wire working condition, significantly improves the precision and operating stability of semiconductor packaging welding operation.
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Description

Technical Field

[0001] This invention belongs to the field of semiconductor packaging equipment technology, specifically relating to a semiconductor wire bonding and wire feeding rotation control mechanism and a semiconductor wire bonding machine. Background Technology

[0002] Semiconductor packaging wire bonding relies on metal wires to achieve electrical conduction between the chip and the substrate. The wire feeding accuracy directly determines the packaging yield. Existing wire bonding machines are equipped with simple wire feeding devices, relying only on a simple rotating bearing wire support reel. Lacking a stable damping structure, the reel is prone to overspeed rotation due to inertia during feeding, leading to wire loosening and wire breakage. Traditional wire feeding methods often use passive wire delivery, making precise control of the feeding force impossible and resulting in poor adaptability to different wire diameters and materials. Conventional wire feeding mechanisms lack independent wire limiting and guiding structures, making it easy for small-diameter wires to deviate and run off course, increasing the risk of wire breakage.

[0003] Meanwhile, most common wire breakage detection devices on the market use a single photoelectric sensor, which has insufficient recognition stability and cannot quickly shut down the wire feeding mechanism after a wire breakage. The wire length measurement often relies on motor pulse conversion, which is affected by slippage and step loss, resulting in large measurement errors. It is difficult to accurately determine the solder joint material and welding conditions. The overall wire feeding device has low integration, with damping adjustment, active wire feeding, limit guidance, wire breakage monitoring, and rotation acquisition functions scattered. The equipment occupies a large space and is cumbersome to assemble and debug, which cannot meet the needs of high-precision and high-stability semiconductor wire bonding mass production operations. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor wire bonding feed rotation control mechanism and a semiconductor wire bonding machine to solve the technical defects of existing feed devices, such as lack of stable damping leading to wire loosening and breakage, poor adaptability of passive wire feeding, easy wire deviation and breakage, unstable single-point photoelectric detection, large motor pulse metering error, and dispersed functions, large footprint, and cumbersome debugging.

[0005] To achieve the above objectives, this application provides the following technical solution: In a first aspect, this application provides a semiconductor wire bonding and unwinding rotation control mechanism, comprising: Laying out base plate; A wire feeding rotating shaft assembly is fixed to one side of the wire feeding base plate, and a wire spool is fitted on the outside of the wire feeding rotating shaft assembly; wherein, the wire feeding rotating shaft assembly has an internal elastic wheel core and a damping seat, the damping seat is coaxially sleeved on the end of the elastic wheel core, the elastic wheel core is used to support the wire spool, and the damping seat applies wire feeding damping to the rotation of the elastic wheel core and the wire spool; A wire feeding assembly is fixed to the wire feeding base plate and arranged on the wire output side of the wire feeding rotating shaft assembly; wherein, the wire feeding assembly has a built-in stepper motor, a rubber wheel and a compression spring, the stepper motor is connected to the rubber wheel through a drive, the compression spring is assembled on the movable end of the rubber wheel and applies a pressing force to it, and the wire is fed by friction of the rubber wheel, thus forming an active friction wire feeding structure; An adjustable single-line limiter is fixed to the wire feeding base plate and arranged on the wire outlet side of the wire feeding assembly; wherein, the adjustable single-line limiter has a built-in guide sleeve and roller, the guide sleeve and roller cooperate to adapt to different specifications of wire and limit the wire conveying path; A wire laying detection component is fixed to the wire laying base plate and arranged on the wire exit side of the adjustable single wire limiter; wherein, the wire laying detection component has a built-in matrix optical fiber, which is used to detect the passing wire and identify the wire continuity status in real time. A wire feeding control component is fixed to the wire feeding base plate and arranged on the wire output side of the wire feeding detection component; wherein, the wire feeding control component has a built-in encoder and a pressure roller, and the pressure roller is connected to the encoder for transmission. After the wire is led out from the wire reel, it passes through the wire feeding assembly, the adjustable single wire limiter, and the wire release detection assembly in sequence, and finally presses against the surface of the pressure roller, causing the pressure roller to rotate synchronously with the encoder; wherein, the matrix optical fiber controls the start and stop of the wire feeding assembly according to the wire detection signal, and the encoder collects the wire release rotation in real time.

[0006] In an optional embodiment, the wire feeding rotary shaft assembly further includes: Deep groove ball bearings, snap rings, bearing sleeves, wheel core pressure shafts, coil springs, and spring pressure rings; The elastic wheel core passes through the inner ring of the deep groove ball bearing, and the snap ring is engaged with the elastic wheel core to axially position the deep groove ball bearing; The coil spring is fitted into the elastic wheel core, and the spring pressure ring locks the coil spring, so that the coil spring and the elastic wheel core are relatively fixed. The wheel core pressure shaft is fixedly installed at the tail end of the elastic wheel core; The deep groove ball bearing is embedded in the inner cavity of the bearing sleeve, and the damping seat is fastened to the outer wall of the bearing sleeve.

[0007] In an optional embodiment, the wire feeding assembly further includes: Bearings, pins, second snap rings, gears, wire feeding follower bearing housing, first rotating shaft, motor mounting plate, and second rotating shaft; The stepper motor is fixed to the motor mounting plate, and the output shaft of the stepper motor is coaxially connected to the first rotating shaft; The gears and rubber wheels are fixedly mounted on the first and second rotating shafts, respectively, and the two sets of gears mesh with each other to achieve power transmission. Bearings are fitted at both ends of the second rotating shaft, and axial positioning is achieved by a second snap ring; The second rotating shaft is mounted on the wire-feeding follower bearing seat via a pin hinge, and the compression spring is housed in the cavity of the wire-feeding follower bearing seat.

[0008] In an optional embodiment, the adjustable single-wire limiter further includes: Limit rod connector, limit rod fixing component, and set screw; The roller is coaxially inserted into the inner cavity of the guide sleeve, and a fourth retaining spring is snapped into the end of the roller. The fourth retaining spring is used to axially position the roller. The other end of the roller is inserted into the mounting hole of the limiting rod fixing part and locked by the set screw; The limiting rod fixing component and the limiting rod connecting component are rigidly fastened together as one unit.

[0009] In an optional embodiment, the wire-laying detection component further includes: Self-adhesive black cloth, magnet, inner baffle, outer cover, photoelectric mounting plate, and wire feeding block; The magnets are respectively assembled and fixed on the inner sidewalls of the inner baffle and the outer cover plate; The self-adhesive black cloth is adhered to and covers the outer side of the outer cover plate; The matrix optical fiber is fixed to the surface of the optoelectronic mounting plate, and the optoelectronic mounting plate is locked and fixed to the inner baffle as a whole. The wire feeding blocks are respectively fastened to the wire routing areas of the inner baffle and the outer cover plate.

[0010] In an optional embodiment, the wire feeding control component further includes: Flange bearings, tension springs, spring adjusting rods, bearings, lever shafts, encoder wheels, handles, connecting rods, tension spring connecting seats, tension spring pins, tension spring adjusting seats, encoder body seats, encoder clamping rings, limit rod connecting parts, limit rod fixing parts, third rotating shafts, conduit clamping seats, thick tube pressure plates, thin tube pressure plates, and square tube clamping plates. The encoder is clamped and locked to the encoder body by the encoder clamping ring. The output shaft of the encoder is coaxially fixedly assembled with the encoder wheel. The handle is connected to the outer end face of the encoder wheel and is used to manually adjust the rotation state of the encoder wheel. The flange bearings are respectively mounted on both sides of the encoder body, and the lever shaft passes between the flange bearings on both sides and rotates with them; The tension spring adjusting seat is fixedly mounted on the encoder body seat, the spring adjusting rod is threadedly assembled in the tension spring adjusting seat, the tension spring connecting seat is fixed to the outer wall of the lever shaft, and the two ends of the tension spring are respectively hooked between the spring adjusting rod and the tension spring connecting seat through the tension spring pin; The lever shaft is connected to the third rotating shaft via the connecting rod, and a bearing is fitted on the outer side of the third rotating shaft to form a rotational fit. The limiting rod connector and the limiting rod fixing component are locked together as one unit and are fixed to the side of the encoder body base as a whole; The conduit clamp is fixedly disposed on the outside of the wire feeding control assembly. The thick tube pressure plate, the thin tube pressure plate and the square tube clamping plate are respectively pressed and fixed on the conduit clamp to achieve clamping and positioning of the conduit.

[0011] In one optional embodiment, the flange bearings are respectively disposed on the left and right sides of the encoder body and are fastened together. The lever shaft is coaxially mounted on the inner rings of the two sets of flange bearings, forming a rotating pair. The lever shaft is connected to the third rotating shaft via the connecting rod; The pressure roller and the bearing are coaxially sleeved on the shaft of the third rotating shaft. A third retaining spring is engaged at the shoulder of the third rotating shaft. The third retaining spring is used to axially limit the pressure roller and the bearing. The tension spring adjusting seat is fixedly connected to the surface of the encoder body seat; The spring adjusting rod is installed inside the tension spring adjusting seat by a threaded connection. The tension spring connecting seat is fastened to the outer wall of the lever shaft; One end of the tension spring is attached to the tension spring connecting seat via a tension spring pin, and the other end of the tension spring is attached to the end of the spring adjusting rod.

[0012] In one optional embodiment, the wire feeding assembly is provided with an adjusting set screw, which is threadedly fitted into the threaded hole of the wire feeding follower bearing seat. The rod end face of the adjusting set screw presses against one end face of the compression spring, and the other end of the compression spring abuts against the rotating shaft seat on the side of the rubber wheel. The rotary adjusting screw can axially feed and compress the spring, change the compression deformation of the spring, and adjust the clamping force transmitted from the spring to the rubber wheel, thereby adjusting the clamping friction between the rubber wheel and the threaded wire.

[0013] In one optional embodiment, the damping seat is adjustablely mounted on the bearing sleeve, and the damping seat is in relative contact with the end of the elastic wheel core; The frictional damping force between the damping seat and the elastic wheel core can be changed by adjusting the assembly and locking stroke of the damping seat to match the wire feeding speed under different working conditions, so that the wire spool rotates at a uniform speed and smoothly during the wire feeding process.

[0014] A second aspect of this application provides a semiconductor wire bonding machine, comprising: The wire bonding machine frame and the welding head are provided, and the wire bonding machine frame is equipped with the semiconductor wire bonding and feeding rotation control mechanism as described above. The semiconductor wire bonding and feeding rotation control mechanism is fixedly mounted on the wire inlet installation position of the wire bonding machine frame, and the welding head is arranged at the output end of the semiconductor wire bonding and feeding rotation control mechanism. The wire fed by the semiconductor wire bonding rotation control mechanism is directly connected to the wire routing channel of the welding head, realizing controllable damped wire bonding.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. The damping seat effectively suppresses the inertial movement and overspeed rotation of the wire reel, eliminating problems such as loose wire and broken wire at the source; the friction drive of the rubber wheel enables controllable and precise feeding of the wire bonding, and the guide limit structure constrains the wire conveying trajectory to avoid wire deviation and bending; the matrix optical fiber monitors the wire on / off status in real time and can quickly trigger the shutdown protection; the encoder directly linked to the pressure roller collects wire feeding data, completely avoiding the measurement deviation caused by step loss and slippage in traditional motor pulse metering, which can be adapted to the processing conditions of various specifications of semiconductor wire bonding, effectively improving the accuracy and operational stability of semiconductor packaging wire bonding operations.

[0016] 2. A complete set of support and positioning components, including deep groove ball bearings and snap rings, are installed. The snap rings provide precise axial positioning of the deep groove ball bearings, ensuring the coaxial rotation of the elastic wheel core. The wire spool spring and spring pressure ring work together to lock the wire spool, and the wheel core pressure shaft reinforces the tail end of the shaft. The bearing sleeve supports the bearing and damping seat, ensuring high coaxiality and low radial runout during operation. The damping friction transmission is stable for a long time, and the wire spool rotates at a uniform speed during mass continuous production, significantly reducing the defect rate of fine metal welding wire breaking due to tension.

[0017] 3. The stepper motor is fixed to the motor mounting plate, and the gear meshing smoothly transmits the driving force; the two ends of the second rotating shaft are equipped with bearings and are axially limited by the second snap ring, so the rotation is smooth and there is no sway; the rotating shaft pin is connected to the wire feeding follower bearing seat, and the compression spring is stably housed in the seat body. The overall transmission rigidity is high, the fit clearance is small, the rubber wheel clamping state is stable, the wire feeding is uniform and continuous, and the wire slippage and feed rate fluctuation problems are effectively avoided.

[0018] 4. The adjustable single-line limiter adopts a roller and guide sleeve cooperation wire routing structure. The fourth snap ring limits the axial movement of the roller to prevent it from coming out. The end of the roller is tightened and locked to the limit rod fixing part by the set screw. The fixing part and the connecting part are rigidly and tightly fixed as a whole. The device is easy to disassemble and debug. It can be adapted to different wire diameters to adjust the limit gap. The wire conveying trajectory is reliably constrained, with no deviation or bending. It reduces wire bonding material loss and improves the consistency of lead wire bonding forming dimensions.

[0019] 5. The wire laying detection component is equipped with inner and outer baffles, a photoelectric mounting plate, and a light-shielding self-adhesive black cloth. The magnetic baffles are fixed by magnets for easy disassembly and maintenance. The matrix fiber is firmly assembled on the photoelectric mounting plate. The wire laying blocks regulate the wire routing path. The light-shielding structure shields against external stray light interference. The sensitivity and anti-interference of the matrix fiber's continuity detection are superior to those of a single photoelectric sensor. The wire breakage signal response is rapid, instantly triggering the wire laying to stop, preventing damage to the welding head during dry welding.

[0020] 6. The encoder achieves a ring-locking fixation through the encoder clamping ring, ensuring strong assembly stability. The encoder wheel is equipped with a manual adjustment handle, allowing for manual calibration and adjustment of the mechanism's working conditions. The flange bearing provides reliable rotational support for the lever shaft, and the tension spring and spring adjustment rod work together to output a controllable and stable clamping force. The third rotating shaft is powered through a linkage transmission, and with multiple specifications of pressure plates, it can adapt to the clamping requirements of different types of conduits. The overall structure has a high degree of integration and adjustable clamping force, ensuring that the conduit is always firmly clamped and operates without deviation.

[0021] 7. The assembly and limiting structure of the lever shaft and the third rotating shaft is optimized. The flange bearing forms a high-precision rotary motion pair, and the connecting rod can smoothly and accurately transmit torque. The pressure roller on the third rotating shaft and the bearing are axially limited by the third snap ring, and there is no axial movement or offset during operation. The tension spring assembly is tightly assembled, and the tension spring outputs a constant tension force to the lever shaft, so that the pressure roller always tightly presses the welding wire, effectively eliminating the relative slippage between the rubber roller and the wire during the metering and acquisition stage, and ensuring accurate and stable detection data of wire rotation.

[0022] 8. The adjustable set screw enables continuous adjustment of the clamping spring force. The set screw engages with the thread of the wire feeding follower bearing seat. Rotating the set screw can precisely change the compression deformation of the compression spring, thereby accurately controlling the clamping friction force between the rubber wheel and the wire bonding contact surface. It can match the optimal clamping load for different materials and wire diameter specifications such as gold wire and aluminum wire, avoiding the problem of excessive clamping force flattening fine wires and insufficient clamping force causing wire feeding slippage. It is suitable for the large-scale production conditions of multi-specification semiconductor packaging.

[0023] 9. The damping seat is equipped with an adjustable assembly structure. By changing the assembly locking stroke, the frictional damping torque of the contact surface between the damping seat and the elastic wheel core can be adjusted. The damping output can be matched and adapted to both high and low speed wire feeding conditions, avoiding the disadvantages of insufficient damping torque causing the wire spool to overspeed and spin out, and excessive damping torque causing plastic deformation of the welding wire. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figures 1-2 A three-dimensional schematic diagram of a semiconductor wire bonding and feeding rotation control mechanism provided by the present invention; Figures 3-4 A schematic diagram of the wire feeding rotation shaft assembly in a semiconductor wire bonding wire feeding rotation control mechanism provided by the present invention; Figures 5-6 A schematic diagram of the wire feeding assembly in a semiconductor wire bonding wire feeding rotation control mechanism provided by the present invention; Figures 7-9 A schematic diagram of the wire feeding control component in a semiconductor wire bonding wire feeding rotation control mechanism provided by the present invention; Figures 10-11 This is a schematic diagram of the wire feeding detection component in a semiconductor wire bonding wire feeding rotation control mechanism provided by the present invention; Figures 12-13 An adjustable single-wire limiter is provided in a semiconductor wire bonding rotation control mechanism according to the present invention. In the diagram: 1. Wire feeding rotating shaft assembly; 101. Deep groove ball bearing; 102. First circlip; 103. Bearing sleeve; 104. Elastic wheel core shaft; 105. Wheel core pressure shaft; 106. Wire reel spring; 107. Spring pressure ring; 108. Damping seat; 2. Wire feeding assembly; 201. Stepper motor; 202. First bearing; 203. Pin; 204. Second circlip; 205. Compression spring; 206. Gear; 207. Glue 208. Roller; 209. Wire feeding follower bearing housing; 210. First rotating shaft; 211. Motor mounting plate; 212. Second rotating shaft; 3. Wire feeding control assembly; 301. Flange bearing; 302. Wire feeding encoder; 303. Tension spring; 304. Third snap ring; 305. Spring adjusting rod; 306. Second bearing; 307. Lever shaft; 308. Follower pressure roller; 309. First guide sleeve; 310. Handle; 311. Connecting rod 312. Encoder wheel; 313. Tension spring connecting seat; 314. Tension spring pin; 315. Tension spring adjusting seat; 316. First roller; 317. Encoder body seat; 318. Encoder clamping ring; 319. First limit rod connecting piece; 320. First limit rod fixing piece; 321. Third rotating shaft; 322. Conduit clamping seat; 323. Coarse tube pressure plate; 324. Thin tube pressure plate; 325. Square tube clamping plate; 4. Wire laying inspection Components: 401. Self-adhesive black cloth; 402. Magnet; 403. Matrix optical fiber; 404. Inner baffle; 405. Outer cover plate; 406. Photoelectric mounting plate; 407. Cable feeding block; 5. Adjustable single-line limiter; 501. Fourth snap ring; 502. Second limit rod connector; 503. Second limit rod fixing piece; 504. Second guide sleeve; 505. Second roller; 506. Top screw; 6. Cable reel; 7. Cable feeding base plate. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0028] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0029] To address the technical deficiencies mentioned in the background section, this embodiment provides a semiconductor wire bonding rotation control mechanism and a semiconductor wire bonding machine.

[0030] The present invention will now be described in further detail with reference to the accompanying drawings: like Figures 1-13 As shown, in a first aspect of the present invention, a semiconductor wire bonding feed rotation control mechanism is provided, comprising a feed base plate 7; a feed rotation shaft assembly 1 fixedly disposed on one side of the feed base plate 7, with a wire reel 6 fitted on the outer side of the feed rotation shaft assembly 1; wherein the feed rotation shaft assembly 1 contains an elastic wheel spindle 104 and a damping seat 108, the damping seat 108 being coaxially fitted on the end of the elastic wheel spindle 104, the elastic wheel spindle 104 supporting the wire reel 6, and the damping seat 108 applying feed damping to the rotation of the elastic wheel spindle 104 and the wire reel 6. The wire feeding assembly 2 is fixed to the wire feeding base plate 7 and arranged on the wire output side of the wire feeding rotary shaft assembly 1. The wire feeding assembly 2 includes a stepper motor 201, a rubber wheel 207, and a compression spring 205. The stepper motor 201 is connected to the rubber wheel 207 via a transmission connection. The compression spring 205 is mounted on the movable end of the rubber wheel 207 and applies a clamping force to it. The wire is fed by friction from the rubber wheel 207, forming an active friction wire feeding structure. An adjustable single-wire limiter 5 is fixed to the wire feeding base plate 7 and arranged on the wire output side of the wire feeding assembly 2. The adjustable single-wire limiter... The adjustable single-wire limiter 5 has a built-in second guide sleeve 504 and a second roller 505, which cooperate to adapt to different specifications of wire and limit the wire conveying path. The wire feeding detection component 4 is fixed to the wire feeding base plate 7 and arranged on the wire output side of the adjustable single-wire limiter 5. The wire feeding detection component 4 has a built-in matrix optical fiber 403, which is used to detect the passing wire in real time and identify the wire continuity status. The wire feeding control component 3 is fixed to the wire feeding base plate 7 and arranged on the wire output side of the wire feeding detection component 4. On the side; wherein, the wire feeding control component 3 has a built-in wire feeding encoder 302 and a pressure roller 308, and the pressure roller 308 is connected to the wire feeding encoder 302 for transmission; after the wire is led out from the wire reel 6, it passes through the wire feeding component 2, the adjustable single wire limiter 5, and the wire feeding detection component 4 in sequence, and finally presses against the surface of the pressure roller 308, and drives the pressure roller 308 and the wire feeding encoder 302 to rotate synchronously; wherein, the matrix optical fiber 403 controls the start and stop of the wire feeding component 2 according to the wire detection signal, and the wire feeding encoder 302 collects the wire feeding rotation amount in real time.

[0031] In practice, a wire reel 6 is coaxially mounted on the outside of the wire feeding rotating shaft assembly 1. The wire reel 6 is the winding carrier of semiconductor bonding wire. The entire roll of fine bonding wire is wound around the outside of the wire reel 6. After the bonding wire is led out from the wire reel 6, it passes through the adjustable single wire limiter 5, the wire feeding assembly 2, and the wire feeding detection assembly 4 in sequence according to the preset path, and finally abuts against the surface of the pressure roller 308 inside the wire feeding control assembly 3. The wire movement drives the pressure roller 308 to rotate synchronously, thereby realizing the real-time acquisition of the wire feeding rotation amount.

[0032] The wire feeding rotating shaft assembly 1 applies constant frictional damping to the wire reel 6 using a built-in damping structure, suppressing overspeed rotation of the reel 6 due to inertia and preventing wire loosening and breakage. The wire feeding assembly 2, as the active power source, drives the rubber wheel 207 to traction the welding wire forward via a stepper motor 201. The adjustable single-wire limiter 5 guides and constrains welding wires of different diameters and materials, preventing deviation and bending during wire feeding. The wire feeding detection assembly 4 uses a matrix optical fiber 403 to monitor the wire continuity in real time. Once a wire break or missing wire occurs, it immediately outputs an electrical signal to control the wire feeding assembly 2 to stop operating, achieving safety protection. The wire feeding control assembly 3 accurately collects the wire feeding rotation amount through the wire feeding encoder 302, calculates the wire feeding length, and provides accurate data support for the semiconductor bonding process.

[0033] In this embodiment, the wire feeding rotating shaft assembly 1 is fixedly installed on one side of the wire feeding base plate 7. It is mainly used to support the wire reel 6 and provide controllable frictional damping for the rotational movement of the wire reel 6, so as to ensure that the wire feeding process is uniform and stable. The wire feeding rotating shaft assembly 1 is composed of a deep groove ball bearing 101, a first retaining ring 102, a bearing sleeve 103, an elastic wheel core shaft 104, a wheel core pressure shaft 105, a wire reel spring 106, a spring pressure ring 107, and a damping seat 108.

[0034] Furthermore, the flexible wheel spindle 104 is the main rotating shaft of the wire feeding rotating shaft assembly 1. It is made of high-strength alloy steel and has the characteristics of wear resistance, deformation resistance and high rotational accuracy. The flexible wheel spindle 104 is inserted into the inner ring of the deep groove ball bearing 101. The deep groove ball bearing 101 serves as a standard rotational support component, which greatly reduces the frictional resistance during the rotation of the flexible wheel spindle 104 and ensures smooth rotation.

[0035] A first retaining ring 102 is installed at the corresponding position on the shaft of the elastic wheel spindle 104. The first retaining ring 102 is engaged in the annular groove of the elastic wheel spindle 104, which axially limits the deep groove ball bearing 101 and restricts the deep groove ball bearing 101 from moving axially, ensuring that the relative position of the bearing and the spindle remains fixed and improving the overall assembly stability.

[0036] The deep groove ball bearing 101 is integrally embedded in the inner cavity of the bearing sleeve 103. The bearing sleeve 103 is a cylindrical support seat, fixed on the wire feeding base plate 7, providing external mounting support for the deep groove ball bearing 101 and the elastic wheel spindle 104. A wire reel spring 106 is fitted and embedded on the outside of the elastic wheel spindle 104. The wire reel spring 106 has elastic tensioning capability and can fit tightly with the inner hole of the wire reel 6. A spring pressure ring 107 is provided on the outside of the wire reel spring 106. The spring pressure ring 107 axially presses the wire reel spring 106, so that the wire reel spring 106 and the elastic wheel spindle 104 form a rigid fixed structure, which can ensure that the wire reel 6 and the elastic wheel spindle 104 rotate synchronously, prevent the wire reel 6 from spinning freely or slipping, and ensure that the wire feeding action is completely synchronized with the rotation of the main shaft.

[0037] At the tail end of the elastic wheel spindle 104, a wheel core pressure shaft 105 is fixedly installed. The wheel core pressure shaft 105 is fixed to the elastic wheel spindle 104 by means of thread locking or interference fit, which strengthens the tail end of the elastic wheel spindle 104 and further completes axial limiting to prevent axial displacement of the main shaft during long-term rotation, thereby improving the reliability of the equipment for long-term continuous operation.

[0038] The damping seat 108 is fastened to the outer wall of the bearing sleeve 103. The damping seat 108 is coaxially arranged on the outer side of the end of the elastic wheel spindle 104, and the inner end face of the damping seat 108 is in contact with the end face of the elastic wheel spindle 104.

[0039] When the elastic wheel spindle 104 rotates synchronously with the wire spool 6, a sliding friction force is generated between the damping seat 108 and the elastic wheel spindle 104. This friction force is the wire feeding damping, which can counteract the inertial force generated by the rotation of the wire spool 6 and prevent the wire spool 6 from continuing to rotate at excessive speed after the wire feeding tension disappears. This prevents problems such as loose welding wire, tangling, and pulling breakage from the root.

[0040] Furthermore, the damping seat 108 is mounted on the bearing sleeve 103 using an adjustable assembly structure. Operators can adjust the contact pressure between the damping seat 108 and the elastic wheel spindle 104 by adjusting the assembly locking stroke of the damping seat 108, thereby adjusting the magnitude of the frictional damping force between the two.

[0041] For different operating conditions such as low-speed and high-speed wire feeding in semiconductor wire bonding production, corresponding damping torques can be matched: when the wire feeding speed is slow, the damping force is reduced to decrease the operating load; when the wire feeding speed is fast, the damping force is increased to strongly suppress the inertial rotation of the wire reel. This adjustable damping structure can adapt to various wire feeding conditions, so that the wire reel 6 maintains a uniform rotation speed under all operating conditions, and the wire bonding tension is uniform and stable.

[0042] The wire spool 6 is directly fitted onto the outside of the elastic wheel spindle 104 and is tightened and fixed by the wire spool spring 106. The wire spool 6 rotates synchronously with the elastic wheel spindle 104 to complete the continuous unwinding operation of the welding wire.

[0043] The wire feeding assembly 2 is fixedly installed on the wire feeding base plate 7 and arranged on the wire output side of the wire feeding rotating shaft assembly 1. It includes a stepper motor 201, a first bearing 202, a pin 203, a second retaining ring 204, a compression spring 205, a gear 206, a rubber wheel 207, a wire feeding follower bearing seat 208, a first rotating shaft 209, a motor mounting plate 210, and a second rotating shaft 211.

[0044] The motor mounting plate 210 is a dedicated mounting base for the stepper motor 201. It is fixed to the wire feeding base plate 7 by bolts to ensure that the stepper motor 201 is fixed in the mounting position and runs without shaking. As a power source, the stepper motor 201 has the characteristics of precise start and stop, controllable speed and fast response speed, which is fully compatible with the precision wire feeding requirements of semiconductor micro bonding wires.

[0045] The output shaft of the stepper motor 201 is rigidly connected to the first rotating shaft 209 via a coaxial connection. When the stepper motor 201 operates, it directly drives the first rotating shaft 209 to rotate synchronously. Gears 206 are fixedly installed on the first rotating shaft 209 and the second rotating shaft 211, respectively. The two sets of gears 206 mesh with each other to form a gear pair transmission structure. The rotation of the first rotating shaft 209 is transmitted to the second rotating shaft 211 through the meshing gears 206, achieving smooth and synchronous power transmission.

[0046] The rubber wheel 207 is fixedly mounted on the second rotating shaft 211. The rubber wheel 207 is made of high wear-resistant and anti-slip rubber material, and the surface is set with anti-slip texture to increase the friction coefficient between it and the micro-welding wire. The welding wire is pulled to move by the rotational friction force of the rubber wheel 207, thus forming an active friction wire feeding structure.

[0047] The two ends of the second rotating shaft 211 are respectively equipped with the first bearing 202, which forms a rotational support for the second rotating shaft 211 and reduces the rotational friction of the shaft. The second snap ring 204 is installed in the groove at the shaft end of the second rotating shaft 211. The second snap ring 204 realizes the axial limit of the second rotating shaft 211 and the first bearing 202, preventing the shaft and bearing from moving axially during operation and ensuring that the rotational position of the rubber wheel 207 remains constant.

[0048] The wire feeding follower bearing housing 208 is the overall support housing of the wire feeding assembly 2. The second rotating shaft 211 is hinged to the wire feeding follower bearing housing 208 by a pin 203, so that the second rotating shaft 211 and the rubber wheel 207 have a slight swing adjustment capability.

[0049] The compression spring 205 is housed in the internal cavity of the wire feeding follower bearing seat 208. One end of the compression spring 205 abuts against the cavity wall, and the other end presses against the rotating shaft seat corresponding to the rubber wheel 207, continuously applying an elastic pressing force to the rubber wheel 207, so that the two sets of rubber wheels 207 are clamped together, ensuring that the welding wire is firmly clamped between the rubber wheels.

[0050] The wire feeding follower bearing housing 208 has a through-hole threaded hole. An adjusting screw is screwed into the hole, and the end face of the adjusting screw presses tightly against one end face of the compression spring 205. By rotating the adjusting screw, the operator can achieve the axial feed and retraction of the adjusting screw: when the adjusting screw is fed forward, it compresses the compression spring 205, increasing the compression deformation of the compression spring 205, and the spring's output clamping force increases accordingly, increasing the clamping friction of the rubber wheel 207 on the bonding wire; when the adjusting screw is retracted, the deformation of the compression spring 205 decreases, and the clamping friction decreases simultaneously. This adjustment structure can flexibly match different types of semiconductor bonding wires: for extremely fine gold wires and aluminum wires with relatively soft material, the clamping force is reduced to avoid deformation and breakage of the bonding wire caused by the rubber wheel; for bonding wires with thicker diameter and higher hardness, the clamping force is increased to prevent the wire from slipping or the feed from stopping during the wire feeding process. Therefore, the wire feeding assembly 2 is compatible with semiconductor bonding wires of various materials and diameters, with a wide range of adaptability and strong wire feeding stability.

[0051] During the overall operation, the stepper motor 201 starts, stops, and adjusts its speed according to the instructions of the control system. It drives the rubber wheel 207 to rotate through the gear 206 and relies on friction to drive the welding wire forward at a constant speed, thus completing the active wire feeding action.

[0052] In this embodiment, the adjustable single-wire limiter 5 is fixedly installed on the wire feeding base plate 7, located on the wire output side of the wire feeding assembly 2. Its function is to limit and guide the delivery path of the semiconductor bonding wire, correct wire deviation, and adapt to bonding wires of different diameters. It is a key component to ensure straight wire delivery and avoid bending damage.

[0053] Specifically, the adjustable single-wire limiter 5 includes a fourth retaining ring 501, a second limit rod connector 502, a second limit rod fixing member 503, a second guide sleeve 504, a second roller 505, and a set screw 506. The second guide sleeve 504 and the second roller 505 cooperate to form the wire guide body. The second roller 505 is coaxially inserted into the inner cavity of the second guide sleeve 504. The welding wire passes through the gap between the second guide sleeve 504 and the second roller 505. The guide structure constrains the left and right position of the wire to prevent the welding wire from shifting or twisting during the conveying process.

[0054] A fourth retaining ring 501 is fitted into an annular groove at one end of the second roller 505. The fourth retaining ring 501 axially limits the second roller 505 to prevent it from coming out of the second guide sleeve 504 during operation, thus ensuring the long-term stable operation of the guide structure.

[0055] The other end of the second roller 505 is inserted into the mounting hole of the second limiting rod fixing member 503. The set screw 506 is installed in the threaded hole on the side wall of the second limiting rod fixing member 503. After the set screw 506 is tightened, its end presses against the outer wall surface of the second roller 505, thereby locking the second roller 505 against the second limiting rod fixing member 503 and preventing the roller from rotating or displacing.

[0056] The second limiting rod fixing part 503 and the second limiting rod connecting part 502 are rigidly fastened together by bolt locking. The second limiting rod connecting part 502 serves as an external mounting base and is fixed on the wire feeding base plate 7, realizing the positioning and installation of the entire adjustable single wire limiter 5. This limiting structure is easy to disassemble, assemble, and debug. The operator can fine-tune the fit clearance between the second roller 505 and the second guide sleeve 504 according to the actual wire diameter specifications to ensure smooth wire passage without significant shaking. After the limiting constraint, the wire feeding trajectory is regular, effectively reducing the loss of fine wires due to deviation and bending, and improving the yield of semiconductor packaging processes.

[0057] In this embodiment, the wire feeding detection component 4 is fixedly installed on the wire feeding base plate 7, located on the wire output side of the adjustable single wire limiter 5. It detects the passing semiconductor bonding wire in real time, identifies the continuity and presence of the wire, and controls the wire feeding component 2 to start and stop according to the detection signal, thereby realizing the functions of wire breakage protection and wire shortage shutdown.

[0058] Furthermore, the wire-laying detection component 4 includes a self-adhesive black cloth 401, a magnet 402, a matrix optical fiber 403, an inner baffle 404, an outer cover 405, a photoelectric mounting plate 406, and a wire-laying stop 407. The inner baffle 404 and the outer cover 405 form the main protective frame of the detection component, and the two interlock to form a closed detection cavity. Magnets 402 are respectively installed and fixed at corresponding positions on the inner sidewalls of the inner baffle 404 and the outer cover 405. Relying on the magnetic attraction force of the magnets 402, the inner baffle 404 and the outer cover 405 can be quickly spliced ​​and attached without the need for additional bolts, which greatly simplifies the equipment disassembly, assembly, and maintenance process, and makes daily maintenance more convenient.

[0059] A self-adhesive black cloth 401 is bonded and covered to the entire outer surface of the outer cover plate 405. The self-adhesive black cloth 401 is a high light-blocking material, which can effectively block natural light, equipment lights and other stray light sources in the workshop environment, avoid external light from interfering with the operation of internal optical detection components, and improve detection accuracy and anti-interference ability.

[0060] The photoelectric mounting plate 406 is a dedicated mounting plate for optical components. It is fixedly mounted on the inner side of the inner baffle 404 by locking bolts. The matrix fiber 403 is fixed on the surface of the photoelectric mounting plate 406. The matrix fiber 403 is composed of multiple fiber optic sensing unit arrays. Compared with traditional single photoelectric sensors, it has a wider detection coverage and higher recognition sensitivity, and can monitor fine bonding wires in all directions.

[0061] In the wiring areas of the inner baffle 404 and the outer cover 405, wire release blocks 407 are fastened and installed respectively. The wire release blocks 407 form a limiting structure at the entrance and exit of the detection cavity, which regulates the entry and exit path of the welding wire, avoids the welding wire from touching the matrix optical fiber 403, the inner wall of the baffle, and other components, and prevents the wire from being scratched and the detection element from being damaged.

[0062] Under normal operating conditions, the welding wire continuously passes through the detection cavity between the wire feeding blocks 407. The matrix optical fiber 403 captures the wire image and obstruction signal in real time, determining that the wire is in a normal feeding state, and the wire feeding assembly 2 continues to operate. When abnormal situations such as wire breakage or wire depletion occur, the matrix optical fiber 403 detects no wire obstruction inside the cavity and immediately sends a wire breakage / shortage electrical signal to the overall control system. Upon receiving the signal, the control system quickly cuts off the power supply to the stepper motor 201, controlling the wire feeding assembly 2 to stop operating immediately. This linkage mechanism can effectively avoid the occurrence of wire-less spinning and empty welding, protect core equipment such as the welding head, and reduce raw material waste.

[0063] In this embodiment, the wire feeding control component 3 is fixedly installed at the end of the wire feeding base plate 7, located on the wire output side of the wire feeding detection component 4. The wire feeding control component 3 includes a flange bearing 301, a wire feeding encoder 302, a tension spring 303, a third retaining ring 304, a spring adjusting rod 305, a second bearing 306, a lever shaft 307, a pressure roller 308, a first guide sleeve 309, a handle 310, a connecting rod 311, an encoder wheel 312, a tension spring connecting seat 313, a tension spring pin 314, a tension spring adjusting seat 315, a first roller 316, an encoder body seat 317, an encoder clamping ring 318, a first limit rod connecting piece 319, a first limit rod fixing piece 320, a third rotating shaft 321, a wire tube clamping seat 322, a thick tube pressure plate 323, a thin tube pressure plate 324, and a square tube clamping plate 325.

[0064] The encoder main body 317 is locked and fixed on the wire feeding base plate 7. All transmission, detection and adjustment components are installed with the encoder main body 317 as the installation reference. Flange bearings 301 are fastened and assembled on the left and right sides of the encoder main body 317. The two sets of flange bearings 301 are arranged coaxially. The lever shaft 307 is coaxially installed in the inner ring of the two sets of flange bearings 301. The flange bearings 301 provide high-precision rotation support for the lever shaft 307. The two work together to form a stable rotating pair. The lever shaft 307 can rotate flexibly inside the flange bearings 301 without jamming or shaking.

[0065] The tension spring adjusting seat 315 is fixedly connected to the surface of the encoder body seat 317. The spring adjusting rod 305 is installed inside the tension spring adjusting seat 315 by threaded connection. Rotating the spring adjusting rod 305 can change its extension length. The tension spring connecting seat 313 is fastened by welding or bolting to the outer wall of the lever shaft 307. The two ends of the tension spring 303 are respectively hooked between the spring adjusting rod 305 and the tension spring connecting seat 313 through the tension spring pins 314. The tension spring 303 continuously generates tension, pulling the lever shaft 307 to deflect, thereby driving the subsequent structural action. The operator can change the tension of the tension spring 303 by rotating the spring adjusting rod 305, precisely adjusting the spring tension, thereby controlling the clamping force of the pressure roller 308 on the welding wire.

[0066] A connecting rod 311 is fixedly connected to the outer side of the lever shaft 307. When the lever shaft 307 rotates, power transmission is achieved through the connecting rod 311, which drives the third rotating shaft 321 to rotate synchronously. A second bearing 306 is mounted on the outer side of the third rotating shaft 321. The second bearing 306 provides rotational support for the third rotating shaft 321, ensuring smooth rotation. The pressure roller 308 and the second bearing 306 are coaxially mounted on the shaft of the third rotating shaft 321. A third retaining spring 304 is installed at the shoulder of the third rotating shaft 321. The third retaining spring 304 is locked in the shaft retaining groove, which provides comprehensive axial limit for the pressure roller 308 and the second bearing 306, preventing axial movement of the components and ensuring a constant assembly position.

[0067] The first guide sleeve 309 and the first roller 316 cooperate with each other to provide secondary auxiliary guidance and limit the welding wire at the entrance of the wire feeding control component 3, and straighten the wire to enter the bonding position of the pressure roller 308, so as to prevent the wire from deviating from the roller and ensure the stability of metering bonding.

[0068] After the semiconductor bonding wire is delivered from the wire feeding and detection component 4, it finally presses against the surface of the pressure roller 308. Under the action of the tension spring 303, the pressure roller 308 always keeps in close contact with the bonding wire surface. When the bonding wire moves forward, it drives the pressure roller 308 and the third rotating shaft 321 to rotate synchronously by friction. The entire transmission link operates smoothly.

[0069] The wire feeding encoder 302 is fixedly to the encoder body base 317 by an encoder clamping ring 318 in a ring-locking manner. The locking structure is firmly assembled and can prevent the encoder from loosening or shifting during operation. The output shaft of the wire feeding encoder 302 is coaxially fixedly assembled with the encoder wheel 312. The encoder wheel 312 is driven and linked with the third rotating shaft 321, and rotates synchronously with the third rotating shaft 321, thereby driving the code disk inside the wire feeding encoder 302 to rotate. The encoder collects data such as the number of rotations and angles in real time, converts them into wire feeding length, and uploads them to the control system to achieve accurate measurement of wire feeding rotation, completely avoiding the errors caused by step loss and slippage in traditional motor pulse measurement.

[0070] A handle 310 is fixedly connected to the outer end face of the encoder wheel 312. The handle 310 is a manually adjustable component. During the equipment debugging and maintenance phase, the staff can manually rotate the handle 310 to drive the encoder wheel 312 and the wire encoder 302 to rotate, complete zero-point calibration, stroke debugging and other operations, and improve the convenience of equipment debugging.

[0071] The first limit rod connector 319 and the first limit rod fixing component 320 are locked together and fixed on the side of the encoder main body 317 for limiting and fixing peripheral wiring and auxiliary components. A conduit clamp 322 is fixedly installed on the outside of the wire feeding control component 3. The conduit clamp 322 is the mounting base for the external protective conduit. The thick tube pressure plate 323, the thin tube pressure plate 324, and the square tube pressure plate 325 are respectively pressed and fixed on the conduit clamp 322. The three pressure plates correspond to different specifications and shapes of protective conduits, firmly clamping and positioning the conduit to prevent the conduit from shifting or bending, and protecting the internal circuits and wires.

[0072] In its initial state, the entire roll of semiconductor bonding wire is wound onto the reel 6, which is mounted on the outside of the elastic wheel core shaft 104 of the wire feeding rotary shaft assembly 1. After the equipment is started, frictional damping is generated between the damping seat 108 of the wire feeding rotary shaft assembly 1 and the elastic wheel core shaft 104, which constrains the rotation speed of the reel 6 and prevents inertial overspeed.

[0073] When the stepper motor 201 starts, it drives the rubber wheel 207 to rotate through the gear 206. The rubber wheel 207 clamps the welding wire under the pressure of the compression spring 205. The welding wire is pulled out from the wire spool 6 by friction, thus completing the active wire feeding.

[0074] After the welding wire leaves the wire feeding assembly 2, it immediately enters the adjustable single wire limiter 5, where the second guide sleeve 504 and the second roller 505 work together to constrain the conveying path and correct wire deviation.

[0075] After passing the limit switch, the welding wire continues to move forward and enters the closed cavity of the wire feeding detection component 4. The matrix fiber 403 monitors the status of the wire throughout the process. During normal feeding, the matrix fiber 403 continuously outputs a normal signal, and the wire feeding component 2 keeps running continuously. Once a wire break or missing wire occurs, the matrix fiber 403 immediately triggers a stop signal, the stepper motor 201 stops working, and the wire feeding action terminates.

[0076] After the wire passes through the wire feeding detection component 4, it finally presses against the surface of the pressure roller 308 of the wire feeding control component 3. The tension spring 303 ensures that the pressure roller 308 and the wire are in close contact. The movement of the wire drives the pressure roller 308 and the third rotating shaft 321 to rotate. Through the transmission of the connecting rod 311 and the lever shaft 307, the encoder wheel 312 and the wire feeding encoder 302 are driven to rotate synchronously. The wire feeding encoder 302 collects the wire feeding rotation data in real time, providing accurate length parameters for the downstream semiconductor bonding process.

[0077] The second aspect of the present invention provides a semiconductor wire bonding machine, which is a terminal assembly for semiconductor packaging and bonding, and mainly consists of a wire bonding machine frame, a welding head, and a semiconductor wire bonding and feeding rotation control mechanism as described above.

[0078] The semiconductor wire bonding rotation control mechanism is fixedly mounted on the inlet installation station of the wire bonding machine frame. The installation position is reasonably set according to the overall wiring layout of the machine. The assembly is firm and there is no vibration or displacement during operation. The welding head is arranged at the outlet end of the semiconductor wire bonding rotation control mechanism. The two positions correspond to each other to form a continuous wire bonding transport link.

[0079] The semiconductor bonding wire delivered by the semiconductor bonding wire feeding rotation control mechanism is directly connected to the internal wiring channel of the welding head, and the wire output by the feeding mechanism can be directly supplied to the welding head.

[0080] During operation, the wire feeding mechanism completes all the pre-processing steps such as damped wire feeding, active conveying, trajectory limiting, wire breakage protection, and length measurement. The wire is continuously, stably, and accurately conveyed to the welding head position, and the welding head uses the wire to complete the wire bonding operation between the chip and the substrate.

[0081] Compared to traditional separate equipment, this semiconductor wire bonding machine integrates the wire feeding mechanism into the entire machine frame, eliminating the need for a separate wire feeding auxiliary machine. This results in a smaller overall footprint and a simpler piping and wiring layout. The fixed positions of the wire feeding mechanism and welding head ensure consistent wire length and angle, stable wire delivery, and uniform lead bonding dimensions and tension, significantly improving the yield of semiconductor packaging products. Furthermore, the assembly, debugging, and maintenance processes are simplified, making it suitable for high-volume, continuous production operations in the semiconductor industry.

[0082] This mechanism can be adapted and adjusted according to actual production conditions, wire material, and wire diameter specifications. Overall debugging is convenient and its versatility is excellent. Specifically, by adjusting the assembly locking stroke of the damping seat 108 relative to the bearing sleeve 103, the end face contact pressure between the damping seat 108 and the elastic wheel spindle 104 can be changed, realizing continuous adjustment of the friction damping torque. It can adapt to various high and low speed wire feeding conditions, ensuring that the wire spool 6 rotates at a constant speed throughout the entire process and maintaining stable wire feeding tension. By rotating the adjusting screw of the wire feeding assembly 2, the compression deformation of the compression spring 205 can be changed, adjusting the clamping friction of the rubber wheel 207 on the wire, adapting to the feeding needs of gold wire, aluminum wire, and wires of different diameters, preventing wire slippage while avoiding deformation of fine wires under pressure. By rotating the spring adjusting rod 305, the tension of the tension spring 303 can be changed, precisely controlling the pressing and bonding force of the rubber wheel 308 on the wire, effectively eliminating the relative slippage between the rubber wheel and the wire, and ensuring the accuracy of the wire feeding rotation measurement. Meanwhile, depending on the specifications of the conduit on site, a thick tube clamping plate 323, a thin tube clamping plate 324, or a square tube clamping plate 325 can be selected to achieve stable clamping and positioning of different types of protective conduits. All adjustment functions are integrated into the equipment body, and no auxiliary accessories are required to complete the adaptation to working conditions. The structure is highly practical and adaptable to mass production.

[0083] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A semiconductor wire bonding and unloading rotation control mechanism, characterized in that, include: Laying out base plate; A wire feeding rotating shaft assembly is fixed to one side of the wire feeding base plate, and a wire spool is fitted on the outside of the wire feeding rotating shaft assembly; wherein, the wire feeding rotating shaft assembly has an internal elastic wheel core and a damping seat, the damping seat is coaxially sleeved on the end of the elastic wheel core, the elastic wheel core is used to support the wire spool, and the damping seat applies wire feeding damping to the rotation of the elastic wheel core and the wire spool; A wire feeding assembly is fixed to the wire feeding base plate and arranged on the wire output side of the wire feeding rotating shaft assembly; wherein, the wire feeding assembly has a built-in stepper motor, a rubber wheel and a compression spring, the stepper motor is connected to the rubber wheel through a drive, the compression spring is assembled on the movable end of the rubber wheel and applies a pressing force to it, and the wire is fed by friction of the rubber wheel, thus forming an active friction wire feeding structure; An adjustable single-line limiter is fixed to the wire feeding base plate and arranged on the wire outlet side of the wire feeding assembly; wherein, the adjustable single-line limiter has a built-in guide sleeve and roller, the guide sleeve and roller cooperate to adapt to different specifications of wire and limit the wire conveying path; A wire laying detection component is fixed to the wire laying base plate and arranged on the wire exit side of the adjustable single wire limiter; wherein, the wire laying detection component has a built-in matrix optical fiber, which is used to detect the passing wire and identify the wire continuity status in real time. A wire feeding control component is fixed to the wire feeding base plate and arranged on the wire output side of the wire feeding detection component; wherein, the wire feeding control component has a built-in encoder and a pressure roller, and the pressure roller is connected to the encoder for transmission. After the wire is led out from the wire reel, it passes through the wire feeding assembly, the adjustable single wire limiter, and the wire release detection assembly in sequence, and finally presses against the surface of the pressure roller, causing the pressure roller to rotate synchronously with the encoder; wherein, the matrix optical fiber controls the start and stop of the wire feeding assembly according to the wire detection signal, and the encoder collects the wire release rotation in real time.

2. The semiconductor wire bonding and unwinding rotation control mechanism according to claim 1, characterized in that, The wire feeding rotary shaft assembly also includes: Deep groove ball bearings, snap rings, bearing sleeves, wheel core pressure shafts, coil springs, and spring pressure rings; The elastic wheel core passes through the inner ring of the deep groove ball bearing, and the snap ring is engaged with the elastic wheel core to axially position the deep groove ball bearing; The coil spring is fitted into the elastic wheel core, and the spring pressure ring locks the coil spring, so that the coil spring and the elastic wheel core are relatively fixed. The wheel core pressure shaft is fixedly installed at the tail end of the elastic wheel core; The deep groove ball bearing is embedded in the inner cavity of the bearing sleeve, and the damping seat is fastened to the outer wall of the bearing sleeve.

3. The semiconductor wire bonding and unwinding rotation control mechanism according to claim 1, characterized in that, The wire feeding assembly also includes: Bearings, pins, second snap rings, gears, wire feeding follower bearing housing, first rotating shaft, motor mounting plate, and second rotating shaft; The stepper motor is fixed to the motor mounting plate, and the output shaft of the stepper motor is coaxially connected to the first rotating shaft; The gears and rubber wheels are fixedly mounted on the first and second rotating shafts, respectively, and the two sets of gears mesh with each other to achieve power transmission. Bearings are fitted at both ends of the second rotating shaft, and axial positioning is achieved by a second snap ring; The second rotating shaft is mounted on the wire-feeding follower bearing seat via a pin hinge, and the compression spring is housed in the cavity of the wire-feeding follower bearing seat.

4. The semiconductor wire bonding and unwinding rotation control mechanism according to claim 1, characterized in that, The adjustable single-line limiter also includes: Limit rod connector, limit rod fixing component, and set screw; The roller is coaxially inserted into the inner cavity of the guide sleeve, and a fourth retaining spring is snapped into the end of the roller. The fourth retaining spring is used to axially position the roller. The other end of the roller is inserted into the mounting hole of the limiting rod fixing part and locked by the set screw; The limiting rod fixing component and the limiting rod connecting component are rigidly fastened together as one unit.

5. The semiconductor wire bonding and unwinding rotation control mechanism according to claim 1, characterized in that, The wire laying detection component also includes: Self-adhesive black cloth, magnet, inner baffle, outer cover, photoelectric mounting plate, and wire feeding block; The magnets are respectively assembled and fixed on the inner sidewalls of the inner baffle and the outer cover plate; The self-adhesive black cloth is adhered to and covers the outer side of the outer cover plate; The matrix optical fiber is fixed to the surface of the optoelectronic mounting plate, and the optoelectronic mounting plate is locked and fixed to the inner baffle as a whole. The wire feeding blocks are respectively fastened to the wire routing areas of the inner baffle and the outer cover plate.

6. The semiconductor wire bonding and unwinding rotation control mechanism according to claim 1, characterized in that, The wire feeding control component also includes: Flange bearings, tension springs, spring adjusting rods, bearings, lever shafts, encoder wheels, handles, connecting rods, tension spring connecting seats, tension spring pins, tension spring adjusting seats, encoder body seats, encoder clamping rings, limit rod connecting parts, limit rod fixing parts, third rotating shafts, conduit clamping seats, thick tube pressure plates, thin tube pressure plates, and square tube clamping plates. The encoder is clamped and locked to the encoder body by the encoder clamping ring. The output shaft of the encoder is coaxially fixedly assembled with the encoder wheel. The handle is connected to the outer end face of the encoder wheel and is used to manually adjust the rotation state of the encoder wheel. The flange bearings are respectively mounted on both sides of the encoder body, and the lever shaft passes between the flange bearings on both sides and rotates with them; The tension spring adjusting seat is fixedly mounted on the encoder body seat, the spring adjusting rod is threadedly assembled in the tension spring adjusting seat, the tension spring connecting seat is fixed to the outer wall of the lever shaft, and the two ends of the tension spring are respectively hooked between the spring adjusting rod and the tension spring connecting seat through the tension spring pin; The lever shaft is connected to the third rotating shaft via the connecting rod, and a bearing is fitted on the outer side of the third rotating shaft to form a rotational fit. The limiting rod connector and the limiting rod fixing component are locked together as one unit and are fixed to the side of the encoder body base as a whole; The conduit clamp is fixedly disposed on the outside of the wire feeding control assembly. The thick tube pressure plate, the thin tube pressure plate and the square tube clamping plate are respectively pressed and fixed on the conduit clamp to achieve clamping and positioning of the conduit.

7. The semiconductor wire bonding and unloading rotation control mechanism according to claim 6, characterized in that, The flange bearings are respectively located on the left and right sides of the encoder body and are fastened together. The lever shaft is coaxially mounted on the inner rings of the two sets of flange bearings, forming a rotating pair. The lever shaft is connected to the third rotating shaft via the connecting rod; The pressure roller and the bearing are coaxially sleeved on the shaft of the third rotating shaft. A third retaining spring is engaged at the shoulder of the third rotating shaft. The third retaining spring is used to axially limit the pressure roller and the bearing. The tension spring adjusting seat is fixedly connected to the surface of the encoder body seat; The spring adjusting rod is installed inside the tension spring adjusting seat by a threaded connection. The tension spring connecting seat is fastened to the outer wall of the lever shaft; One end of the tension spring is attached to the tension spring connecting seat via a tension spring pin, and the other end of the tension spring is attached to the end of the spring adjusting rod.

8. The semiconductor wire bonding and unwinding rotation control mechanism according to claim 1, characterized in that, The wire feeding assembly is equipped with an adjusting screw, which is threadedly fitted into the threaded hole of the wire feeding follower bearing seat. The end face of the adjusting screw abuts against one end face of the compression spring, and the other end of the compression spring abuts against the rotating shaft seat on the side of the rubber wheel. The rotary adjusting screw can axially feed and compress the spring, change the compression deformation of the spring, and adjust the clamping force transmitted from the spring to the rubber wheel, thereby adjusting the clamping friction between the rubber wheel and the threaded wire.

9. The semiconductor wire bonding and unloading rotation control mechanism according to claim 1, characterized in that, The damping seat is adjustablely mounted on the bearing sleeve, and the damping seat is in close contact with the end of the elastic wheel core; The frictional damping force between the damping seat and the elastic wheel core can be changed by adjusting the assembly and locking stroke of the damping seat to match the wire feeding speed under different working conditions, so that the wire spool rotates at a uniform speed and smoothly during the wire feeding process.

10. A semiconductor wire bonding machine, characterized in that, include: A wire bonding machine frame and a welding head, wherein the wire bonding machine frame is equipped with a semiconductor wire bonding and feeding rotation control mechanism as described in any one of claims 1 to 9; The semiconductor wire bonding and feeding rotation control mechanism is fixedly mounted on the wire inlet installation position of the wire bonding machine frame, and the welding head is arranged at the output end of the semiconductor wire bonding and feeding rotation control mechanism. The wire fed by the semiconductor wire bonding rotation control mechanism is directly connected to the wire routing channel of the welding head, realizing controllable damped wire bonding.