Control method, device and medium of cross-region multi-chip automatic sorting system

Abstract

The application relates to the technical field of semiconductor package detection and automatic sorting control, and provides a control method, equipment and medium of a cross-region multi-chip automatic sorting system. The method filters target chips from multiple chips, reads the suction nozzle working state of a multi-suction nozzle sorting moving device, counts the total number and arrangement order of currently available idle suction nozzles, and determines the number of the first idle suction nozzle in the order. The sorting device is controlled to move to the corresponding position, the first idle suction nozzle is aligned with the center of the first target chip, a synchronous suction operation of multiple target chips is performed according to the matching relationship between the continuous number of target chips and the number of idle suction nozzles, the occupation state and position coordinates of each acupoint of the target tray corresponding to the target chip are obtained through a chip detection positioning unit, the first suction nozzle carrying the chip is aligned with the first acupoint, and the sorting is completed after the tray is filled with target chips. The method improves the whole-line production capacity.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging inspection and automated sorting control technology, and in particular to a control method, equipment and medium for a cross-regional multi-chip automated sorting system. Background Technology

[0002] In the field of semiconductor chip inspection and sorting, existing chip sorting equipment generally adopts a single-chip pick-up and single-chip placement operation mode, and the sorting efficiency is far lower than the front-end inspection speed, becoming a core bottleneck restricting the overall production capacity. Existing sorting control methods cannot effectively utilize the parallel operation capability of multi-nozzle sorting devices, lack matching and scheduling logic for continuously arranged chips and continuous empty spaces, resulting in low nozzle resource utilization and inability to adapt to the high-speed sorting requirements of large batches of chips. Summary of the Invention

[0003] This application provides a control method, equipment, and medium for a cross-regional multi-chip automatic sorting system, aiming to solve the problem that in the field of semiconductor chip detection and sorting, existing chip sorting equipment generally adopts a single-chip pick-up and single-chip placement operation mode, and the sorting efficiency is far lower than the front-end detection speed, which has become the core bottleneck restricting the overall production capacity.

[0004] In a first aspect, embodiments of this application provide a control method for a cross-regional multi-chip automated sorting system, applied to a cross-regional multi-chip automated sorting system, including a pallet-carrying unit to be sorted, a target pallet-carrying unit, a multi-nozzle sorting moving device, a chip detection and positioning unit, and a sorting control unit; the method includes: The system acquires an overall image of the tray to be sorted, obtains chip quality judgment results for multiple chips, and determines the grade detection information for each chip based on the overall image and chip quality judgment results. In the overall image, the system uses an image positioning algorithm to identify the planar position coordinates of each chip in the tray coordinate system. Based on the grade detection information and planar position coordinates, the system establishes a mapping relationship between chip position and detection results. Based on the detection results, the system filters out target chips from multiple chips, obtains row and column information based on the position coordinates of each target chip, and determines the start and end positions and consecutive quantity of consecutively arranged target chips based on the row and column information. The system reads the working status of the nozzles of the multi-nozzle sorting mobile device, counts the total number and order of currently available idle nozzles, and determines the number of the first idle nozzle in the order. Based on the position coordinates of the first target chip and the number of the idle nozzle, a motion path is generated, and the sorting device is controlled to move to the corresponding position so that the center of the first idle nozzle coincides with the center of the first target chip. Based on the matching relationship between the number of consecutive target chips and the number of idle nozzles, the system performs synchronous pick-up operations on multiple consecutive target chips. The chip detection and positioning unit obtains the occupancy status and position coordinates of each acupoint on the target tray corresponding to the target chip, and identifies the start and end positions and the number of consecutive empty acupoints on the tray. The sorting device is controlled to move so that the first chip-carrying nozzle aligns with the first empty cavity. Based on the matching relationship between the number of consecutive empty cavities and the number of chips carried, multiple target chips are placed synchronously until the tray is full of target chips, and the sorting is completed.

[0005] In some embodiments, the step of selecting target chips from multiple chips based on detection results, obtaining row and column information based on the position coordinates of each target chip, and determining the start and end positions and the number of consecutive target chips based on the row and column information includes: selecting target chips of corresponding levels according to preset sorting targets, traversing all target chips in the order of the pallet rows and columns; identifying consecutive adjacent target chip segments in the row and column direction, and recording the start and end row and column positions and the total number of consecutive chips for each segment of consecutive target chips.

[0006] In some embodiments, the step of performing a synchronous pick-up operation of multiple consecutive target chips based on the matching relationship between the number of consecutive target chips and the number of idle nozzles includes: taking the smaller value between the current number of consecutive target chips and the number of idle nozzles as the single pick-up quantity, triggering the corresponding number of idle nozzles to synchronously perform vacuum pick-up actions, and completing the pickup of multiple consecutive target chips.

[0007] In some embodiments, the step of obtaining the occupancy status and position coordinates of each acupoint on the target tray corresponding to the target chip through the chip detection and positioning unit, and identifying the start and end positions and the number of consecutive empty acupoints on the tray, includes: acquiring an overall image of the tray corresponding to the target chip, identifying the chip occupancy status of each acupoint, and marking all empty acupoints without chips; traversing all empty acupoints in the order of rows and columns of the tray, identifying consecutive adjacent empty acupoint segments, and recording the start and end row and column positions of each segment and the total number of consecutive empty acupoints.

[0008] In some embodiments, the control of the sorting moving device to align the first chip-carrying nozzle with the first empty space includes: generating a motion path based on the position coordinates of the first empty space, controlling the chip-carrying sorting device to move above the target tray, so that the first chip-carrying nozzle in the sorting sequence is aligned with the center of the first empty space.

[0009] In some embodiments, the step of performing a synchronous placement operation of multiple target chips based on the matching relationship between the number of consecutive empty spaces and the number of chips carried, until the tray is filled with target chips and the sorting is completed, includes: taking the smaller value between the current number of consecutive empty spaces and the number of chips carried as the single placement quantity, triggering the corresponding number of suction nozzles to synchronously perform vacuum breaking placement actions, and completing the continuous placement of multiple target chips; and cyclically executing the target chip suction and placement process until all spaces in the tray corresponding to the target chip are filled with target chips, and then completing the sorting task.

[0010] Secondly, this application provides a computer device including a processor, a memory, and a computer program stored in the memory and executable by the processor. The memory stores a strategy model, and the computer program, when executed by the processor, implements the method provided in any embodiment of this application.

[0011] Thirdly, this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, causes the processor to implement the method provided in any embodiment of this application.

[0012] The provided method has the following beneficial effects: First, sorting efficiency is significantly improved. By identifying continuously arranged target chips and continuous empty spaces, and matching multiple suction nozzle devices, multiple chips can be picked up and placed simultaneously, greatly reducing the number of back-and-forth movements of the sorting device, effectively increasing the sorting cycle time, narrowing the speed difference with the front-end inspection process, and improving the overall production capacity of the line.

[0013] Secondly, the nozzle resource utilization rate is high. The number of chips in a single operation is dynamically matched according to the number of continuous chips and the number of idle nozzles, maximizing the use of available nozzle resources, avoiding nozzle idleness and waste, and improving the operating efficiency of the sorting device.

[0014] Third, it has strong adaptability to different scenarios. The control method can be adapted to sorting devices with different numbers of suction nozzles, as well as trays with different specifications and chip arrangements. It can flexibly support various sorting scenarios such as sorting good products and classifying defective products of different grades, and has strong versatility.

[0015] Fourth, it operates stably and accurately. The scheduling logic based on continuous row and column segments is clear and controllable, which can effectively avoid chip misplacement and omission, ensure sorting accuracy, and meet the high-speed and high-precision sorting requirements of semiconductor chips.

[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic flowchart illustrating the steps of a control method for a cross-regional multi-chip automatic sorting system according to an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a cross-regional multi-chip automated sorting system provided in one embodiment of this application; Figure 3 This is a schematic block diagram of the control system of a cross-regional multi-chip automatic sorting system provided in one embodiment of this application; Figure 4 This is a schematic block diagram of the structure of a computer device provided in an embodiment of this application.

[0019] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] The flowchart shown in the attached diagram is for illustrative purposes only and does not necessarily include all content and operations / steps, nor does it necessarily have to be performed in the order described. For example, some operations / steps can be broken down, combined, or partially merged, so the actual execution order may change depending on the actual situation.

[0022] It should be understood that, in order to clearly describe the technical solutions of the embodiments of the present invention, the terms "first" and "second" are used in the embodiments of the present invention to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and the terms "first" and "second" are not necessarily different.

[0023] It should be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0024] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0025] In the field of semiconductor chip inspection and sorting, existing chip sorting equipment generally adopts a single-chip pick-up and single-chip placement operation mode, and the sorting efficiency is far lower than the front-end inspection speed, becoming a core bottleneck restricting the overall production capacity. Existing sorting control methods cannot effectively utilize the parallel operation capability of multi-nozzle sorting devices, lack matching and scheduling logic for continuously arranged chips and continuous empty spaces, resulting in low nozzle resource utilization and inability to adapt to the high-speed sorting requirements of large batches of chips.

[0026] To solve the above problem, please refer to Figure 1 This application provides a control method for a cross-regional multi-chip automated sorting system, applicable to systems such as... Figure 2 The cross-regional multi-chip automated sorting system shown includes a pallet carrying unit to be sorted, a target pallet carrying unit, a multi-nozzle sorting moving device, a chip detection and positioning unit, and a sorting control unit.

[0027] The cross-regional multi-chip automated sorting system used in this method includes a pallet carrier unit to be sorted, a target pallet carrier unit, a multi-nozzle sorting moving device, a chip detection and positioning unit, and a sorting control unit.

[0028] The sorting pallet carrying unit is used to carry the chip pallets that have completed appearance inspection. The pallets have several chip placement slots arranged in a matrix, with each slot corresponding to an IC chip. The target pallet carrying unit is used to carry the sorted shipping pallets or classification storage pallets. The pallets also have standard slots arranged in a matrix for storing the sorted chips according to their grade.

[0029] The multi-nozzle sorting mobile device is a linear pick-up mechanism with multiple sets of independent nozzles, such as... Figure 2As shown, the multi-nozzle sorting and moving device includes several vacuum nozzle assemblies arranged linearly at equal intervals. The center-to-center distance between each nozzle assembly matches the center-to-center distance between adjacent acupoints on the tray, allowing multiple nozzles to simultaneously align with multiple acupoints arranged consecutively in the same row. Each nozzle assembly is independently equipped with a vacuum generator and an electromagnetic control valve, enabling it to independently perform suction and placement actions, or to synchronously perform batch operations. The multi-nozzle sorting and moving device is driven by an XYZ three-axis motion module, allowing it to move across areas between the tray to be sorted and the target tray to complete the chip transfer operation.

[0030] The chip detection and positioning unit includes an industrial area array camera and an image acquisition and processing module, which are used to acquire full-area images of the tray, identify the appearance quality level of the chip and the position coordinates of each acupoint, and transmit the detection data and position data to the sorting control unit.

[0031] The sorting control unit is electrically connected to the multi-nozzle sorting mobile device, the chip detection and positioning unit, and the pallet conveying mechanism, and is used to execute sorting scheduling logic, motion path planning, nozzle action control, and full-process cycle management.

[0032] The control method for the cross-regional multi-chip automated sorting system includes steps S101 to S104. Details are as follows: Step S101. Acquire an overall image of the tray to be sorted, obtain chip quality judgment results corresponding to multiple chips, and determine the grade detection information of each chip based on the overall image and chip quality judgment results; in the overall image, identify the planar position coordinates of each chip in the tray coordinate system through an image positioning algorithm, establish a mapping relationship between chip position and detection results based on grade detection information and planar position coordinates, filter out target chips from multiple chips based on detection results, obtain row and column information based on the position coordinates corresponding to each target chip, and determine the start and end positions and consecutive quantity of continuously arranged target chips based on row and column information.

[0033] Specifically, the chip detection and positioning unit first performs full-area image acquisition on the tray to be sorted. Then, it uses a preset appearance defect detection algorithm to classify the quality of each chip and obtain the grade label for each chip, including categories such as good, first-level defective, second-level defective, and empty. At the same time, the visual positioning algorithm identifies the reference mark points of the tray, establishes the tray's planar coordinate system, calculates the X and Y plane coordinates corresponding to each acupoint, as well as the row index and column index corresponding to each acupoint, and establishes a one-to-one mapping relationship of "acupoint row and column index - planar coordinates - chip grade".

[0034] Subsequently, based on the target category of the current sorting task, target chips of the corresponding level are selected from all chips. The distribution of target chips is scanned row by row and column by column according to the preset traversal order to identify consecutive adjacent target chip segments in the row or column direction. For each consecutive target chip segment, its starting row number, starting column number, ending row number, ending column number, and the total number of chips contained in the segment are recorded to generate a list of consecutive target chip segments, which serves as the scheduling basis for subsequent pick-up operations.

[0035] The chip detection and positioning unit obtains the detection results and position coordinates of each chip on the sorting tray, specifically including: First, after the pallet to be sorted is positioned by the conveyor and the positioning sensor is triggered, the industrial area array camera of the chip detection and positioning unit acquires an overall grayscale image of the pallet to be sorted under the illumination of a ring light source. The image is then processed by an image preprocessing algorithm to correct lens distortion, enhance grayscale contrast, and filter Gaussian noise, thereby eliminating positioning errors caused by reflections on the pallet surface and optical distortion of the lens.

[0036] Subsequently, the pre-trained neural network model for detecting chip appearance defects is invoked to perform chip-by-chip detection and inference for each acupoint area in the image, and output the quality judgment result of each chip, including four levels of detection information: good product, first-level defective product (such as slight scratches, minor chipping at the edges and corners), second-level defective product (such as large-area defects, electrode misalignment, functional failure), and empty material; different levels correspond to different sorting targets, and the target level can be flexibly specified through the human-machine interface according to production needs.

[0037] Simultaneously, two pre-set circular reference markers are identified at the diagonal positions of the tray in the image. A two-dimensional rectangular coordinate system of the tray is established with the two reference points as the origin and reference points. Combining the total number of acupoint rows and columns on the tray with the pre-set standard acupoint center spacing, the X and Y plane position coordinates of each acupoint in the tray coordinate system are calculated through affine transformation. For each acupoint, a unique row and column index (row number i, column number j) is assigned synchronously, where i is an integer from 1 to the total number of rows M, and j is an integer from 1 to the total number of columns N.

[0038] Finally, the row and column indices and planar position coordinates of each acupoint are bound one by one with the corresponding chip-level detection information to construct a mapping data table between chip position and detection results, which is stored in the internal memory of the sorting control unit for real-time access by subsequent scheduling logic.

[0039] This embodiment enables precise mapping between chip quality information and position information, providing a reliable data foundation for subsequent continuous segment recognition and precise nozzle alignment.

[0040] Step S102. Read the working status of the nozzles of the multi-nozzle sorting mobile device, count the total number and arrangement order of the currently available idle nozzles, and determine the number of the first idle nozzle in the order; generate a motion path according to the position coordinates of the first target chip and the number of the idle nozzle, control the sorting device to move to the corresponding position, so that the center of the first idle nozzle coincides with the center of the first target chip, and perform synchronous pick-up operation of multiple consecutive target chips according to the matching relationship between the number of consecutive target chips and the number of idle nozzles.

[0041] Specifically, the sorting control unit reads the working status of each nozzle on the multi-nozzle sorting mobile device in real time, including idle status, loading status, and fault status, counts the total number of currently available idle nozzles, and determines the number and relative position of the first idle nozzle according to the physical arrangement order of the nozzles.

[0042] Based on the starting position of the current continuous target chip segment to be executed, the planar coordinates of the first target chip are calculated. Combined with the relative position offset of the first idle nozzle, the motion path of the multi-nozzle sorting moving device is generated. The three-axis motion module is controlled to move the sorting device above the tray to be sorted, so that the center of the first idle nozzle is precisely aligned with the center of the first target chip. At this time, the remaining idle nozzles arranged after the first idle nozzle will be aligned with the subsequent continuously arranged target chips in sequence.

[0043] After alignment is completed, the smaller value between the number of chips in the current continuous target chip segment and the number of available idle nozzles is taken as the number of chips to be picked up in this operation. The corresponding number of nozzles are then triggered to simultaneously open the vacuum, completing the synchronous pickup of multiple continuous target chips. After pickup is completed, the nozzle status is updated, marking the nozzle that performed the pickup as loaded, and the chip mapping table of the tray to be sorted is updated, marking the picked-up acupoints as empty.

[0044] In this embodiment, obtaining the total number of nozzles and the number of idle nozzles of the multi-nozzle sorting mobile device, and controlling the sorting mobile device to move so that the first idle nozzle aligns with the first target chip, specifically includes: the sorting control unit reads the analog signal of the vacuum pressure sensor and the digital feedback signal of the electromagnetic control valve of each nozzle on the multi-nozzle sorting mobile device in real time through the industrial IO bus, and comprehensively judges the working status of each nozzle: nozzles with vacuum pressure lower than the set threshold and control valve in the closed state are judged to be in the idle state; nozzles with vacuum pressure higher than the set adsorption threshold and control valve in the open state are judged to be in the material-loaded state; nozzles with abnormal vacuum pressure fluctuations or no response from the control valve are judged to be in the fault state.

[0045] Count the total number of all idle nozzles and sort them according to their physical arrangement on the module. Determine the number of the first idle nozzle in the sorting order and its relative position offset in the coordinate system of the sorting device.

[0046] Take the highest priority segment of consecutive target chips from the list of consecutive target chip segments, extract the row and column index of the first target chip, and query the mapping table to obtain the X and Y coordinates of the chip in the tray coordinate system. Combined with the relative position offset of the first idle nozzle, the chip coordinates in the tray coordinate system are converted into the motion target coordinates in the device global coordinate system through the coordinate system transformation matrix.

[0047] The sorting control unit sends interpolation motion commands to the three-axis motion module, controlling the multi-nozzle sorting moving device to move along the X and Y axes to directly above the target position, and then descend along the Z axis to the set suction height. After the movement is in place, the X and Y axis positions are finely adjusted through closed-loop correction of visual positioning, so that the center of the first idle nozzle is precisely aligned with the center of the upper surface of the first target chip, with the alignment accuracy controlled within ±0.02mm to ensure suction stability.

[0048] Through the status reading and alignment control in this embodiment, precise matching between the nozzle resources and the target chip can be achieved, ensuring the accuracy of the position and the reliability of the adsorption in batch suction.

[0049] Step S103. Obtain the occupancy status and position coordinates of each acupoint on the target tray corresponding to the target chip through the chip detection and positioning unit, and identify the start and end positions and the number of consecutive empty acupoints on the tray.

[0050] Specifically, for the target tray used to store the target chip, the chip detection and positioning unit acquires a full-area image of the tray, identifies whether a chip is placed in each acupoint, obtains the occupancy status of each acupoint, and combines the tray coordinate system to obtain the row and column index and planar coordinates of each empty acupoint.

[0051] Following the same traversal order as the sorting end, the distribution of empty spaces is scanned row by row and column by column to identify consecutive adjacent empty space segments. The starting row number, starting column number, ending row number, ending column number, and total number of empty spaces for each segment are recorded to generate a list of consecutive empty space segments, which serves as the scheduling basis for subsequent placement operations.

[0052] This step can be executed in parallel with step S101, or it can be executed after the chip is picked up. It can be flexibly adjusted according to the equipment layout and cycle time requirements to shorten the overall sorting cycle.

[0053] Step S104. Control the sorting moving device to move so that the first suction nozzle carrying the chip aligns with the first empty cavity. Based on the matching relationship between the number of consecutive empty cavities and the number of chips carried, perform a synchronous placement operation of multiple consecutive target chips until the tray is filled with target chips and the sorting is completed.

[0054] Specifically, the sorting control unit counts the number of nozzles carrying target chips on the current multi-nozzle sorting mobile device and determines the number and position of the first material-carrying nozzle according to the arrangement order; based on the starting position of the current continuous cavity segment to be filled, it calculates the planar coordinates of the first cavity and generates a motion path; it controls the multi-nozzle sorting mobile device to move from the area to be sorted pallet to the target pallet area, so that the center of the first material-carrying nozzle is precisely aligned with the center of the first cavity, and the subsequent material-carrying nozzles are aligned with the subsequent continuous cavities in sequence.

[0055] After alignment is completed, the smaller value between the number of holes in the current continuous empty segment and the current number of material-carrying nozzles is taken as the number of chips to be placed in this operation. The corresponding number of nozzles are then triggered to simultaneously close the vacuum and release the material, thus completing the synchronous placement of multiple target chips. After placement is completed, the nozzle status is updated to idle, and the hole mapping table of the target tray is updated to mark the placed holes as occupied.

[0056] The process of steps S101 to S104 is executed repeatedly, continuously picking up target chips from the tray to be sorted and placing them on the target tray until all the slots of the target tray are filled with target chips, completing the sorting task of the current target tray, and the target tray flows out of the equipment to enter the next process; if there are multiple trays to be sorted or multiple target trays, the above process is repeated after switching the trays to achieve batch continuous sorting across regions.

[0057] In some embodiments, the step of selecting target chips from multiple chips based on detection results, obtaining row and column information based on the position coordinates of each target chip, and determining the start and end positions and the number of consecutive target chips based on the row and column information includes: selecting target chips of corresponding levels according to preset sorting targets, traversing all target chips in the order of the pallet rows and columns; identifying consecutive adjacent target chip segments in the row and column direction, and recording the start and end row and column positions and the total number of consecutive chips for each segment of consecutive target chips.

[0058] In this embodiment, the process of selecting target chips from multiple chips based on detection results, obtaining row and column information based on the position coordinates of each target chip, and determining the start and end positions and the number of consecutive target chips based on the row and column information specifically includes the following steps: First, based on the target level set for the current sorting task, all chips with the target level are selected from the chip mapping data table and marked as target chips, while chips of other levels are marked as non-target chips.

[0059] Subsequently, a row-first traversal order is adopted, starting from the first row and first column of the tray, and traversing each acupoint row by row from left to right. During the traversal, when the first target chip is detected, the row number and column number of the acupoint are recorded as the starting position of the current continuous segment, and the traversal continues. If the next adjacent acupoint is also a target chip, it is determined to be continuous, and the number of continuous segments is accumulated. If a non-target chip is encountered or the end of the row is reached, the current continuous segment is determined to end, and the ending row number, ending column number, and the total number of continuous chips accumulated for the segment are recorded. The segment is then stored in the continuous target chip segment list.

[0060] After completing a row traversal, proceed to the next row and repeat the above recognition process until all rows of the tray have been traversed, resulting in a complete list of continuous target chip segments. Each element in the list contains three attributes: starting row and column, ending row and column, and number of consecutive segments.

[0061] In an optional implementation, a column-first traversal order can be used to identify continuous target chip segments in the column direction according to the arrangement direction of the suction nozzles, and adapt to the vertically arranged suction nozzle modules. The rule for continuous determination is: if the row and column index difference between adjacent acupoints is 1 and there is no non-target chip interval in between, it is determined to be continuous.

[0062] Through the continuous segment recognition logic of this embodiment, scattered target chips can be aggregated into continuous units that can be picked up in batches, providing a scheduling basis for multi-nozzle synchronous operation, maximizing the number of chips picked up in a single operation, and improving the nozzle utilization rate.

[0063] In some embodiments, the step of performing a synchronous pick-up operation of multiple consecutive target chips based on the matching relationship between the number of consecutive target chips and the number of idle nozzles includes: taking the smaller value between the current number of consecutive target chips and the number of idle nozzles as the single pick-up quantity, triggering the corresponding number of idle nozzles to synchronously perform vacuum pick-up actions, and completing the pickup of multiple consecutive target chips.

[0064] In this embodiment, the step of performing synchronous pick-up operations on multiple consecutive target chips based on the matching relationship between the number of consecutive target chips and the number of idle nozzles specifically includes the following process: Let N_chip be the number of chips in the currently selected continuous target chip segment, and N_nozzle be the number of currently available continuous idle nozzles. Take the smaller value of the two, N_pick=min(N_chip,N_nozzle), as the actual number of chips picked up in this pick-up operation.

[0065] Starting with the first idle nozzle, select N_pick consecutive idle nozzles and simultaneously send an opening command to the vacuum control valves corresponding to these N_pick nozzles, so that the nozzles generate a vacuum negative pressure at the same time and adsorb the target chip below; after a preset suction stabilization delay, read the vacuum pressure value of the corresponding nozzle, confirm that all nozzles have reached the set suction pressure threshold, and determine that the suction is successful.

[0066] After successful pickup, the multi-nozzle sorting device is controlled to rise along the Z-axis to a safe operating height. At the same time, the system status is updated: the status of the N_pick nozzles involved in pickup is updated to the loaded status, the status of the corresponding N_pick acupoints on the sorting tray is updated to empty, and the picked chip segments are removed from the list of continuous target chip segments. If not all chips in a segment are picked up, the starting position and quantity of the remaining continuous segments are updated, and the device waits for the next pickup.

[0067] If an abnormal vacuum pressure is detected in a nozzle, the nozzle is marked as temporarily faulty, the number of available nozzles is recalculated, and the matching and picking logic is executed again to ensure chip pickup reliability.

[0068] The matching and suction logic in this embodiment can maximize the use of currently idle suction nozzle resources in each suction action, reduce the number of empty nozzle runs, and increase the sorting quantity per unit time.

[0069] In some embodiments, the step of obtaining the occupancy status and position coordinates of each acupoint on the target tray corresponding to the target chip through the chip detection and positioning unit, and identifying the start and end positions and the number of consecutive empty acupoints on the tray, includes: acquiring an overall image of the tray corresponding to the target chip, identifying the chip occupancy status of each acupoint, and marking all empty acupoints without chips; traversing all empty acupoints in the order of rows and columns of the tray, identifying consecutive adjacent empty acupoint segments, and recording the start and end row and column positions of each segment and the total number of consecutive empty acupoints.

[0070] In this embodiment, the step of obtaining the occupancy status and position coordinates of each acupoint on the target tray corresponding to the target chip through the chip detection and positioning unit, and identifying the start and end positions and the number of consecutive empty acupoints on the tray, specifically includes the following process: Once the target tray is in place and the positioning sensor is triggered, the chip detection and positioning unit acquires an overall image of the target tray. Using the same image preprocessing and coordinate system establishment method as in Example 1, the row and column indexes and planar position coordinates of each acupoint are obtained.

[0071] The occupancy status of each acupoint is determined by a template matching image recognition algorithm: if the acupoint area has image features such as chip electrodes and edges, and the matching degree with the chip template is higher than a set threshold, it is marked as occupied; if the acupoint area has no chip features, and the matching degree with the empty acupoint template is higher than a set threshold, it is marked as vacant.

[0072] Following the same row-first traversal order as the sorting end, all acupoints are traversed row by row starting from the first row and first column to identify consecutive adjacent empty acupoint segments: when the first empty acupoint is detected, its row and column index is recorded as the starting position of the consecutive empty acupoint segment, and the traversal continues to the next row. If the adjacent acupoints are empty, the number is accumulated until an occupied acupoint or the end of the row is encountered. The ending row and column position of the segment and the total number of consecutive empty acupoints are recorded and stored in the list of consecutive empty acupoint segments.

[0073] After traversal, the list of consecutive empty segments is sorted by row number in ascending order and column number in ascending order. The consecutive empty segments that are at the beginning of the list and have a longer length are selected as placement targets to reduce the moving distance of the sorting device.

[0074] Through the hole continuous segment identification in this embodiment, a precise match can be formed with the continuous chip segments at the sorting end, enabling batch placement and improving the operational efficiency of the placement process.

[0075] In some embodiments, the control of the sorting moving device to align the first chip-carrying nozzle with the first empty space includes: generating a motion path based on the position coordinates of the first empty space, controlling the chip-carrying sorting device to move above the target tray, so that the first chip-carrying nozzle in the sorting sequence is aligned with the center of the first empty space.

[0076] In this embodiment, the control of the sorting and moving device to align the first chip-carrying nozzle with the first empty space specifically includes the following process: The sorting control unit counts the nozzles currently in the loading state on the multi-nozzle sorting mobile device, sorts them according to their physical arrangement, and determines the number of the loading nozzle at the top of the sort and its relative position offset.

[0077] Take the highest priority continuous cavity segment from the list of continuous cavities, extract the row and column index of its first cavity position, query the coordinate mapping table of the target pallet, and obtain the X and Y plane coordinates of the cavity position in the pallet coordinate system; combine the relative position offset of the first loading nozzle, and convert it to the placement target coordinates in the global coordinate system of the device through the coordinate system transformation matrix.

[0078] The multi-nozzle sorting mobile device is controlled to move from a safe height position in the sorting area along a planned obstacle avoidance path to above the target tray. During the movement, the Z-axis is kept at a safe height to avoid collisions with the tray or surrounding mechanisms. After reaching the target position, the Z-axis is controlled to descend to the set placement height. The X and Y axis positions are finely adjusted through visual closed-loop correction to ensure that the center of the chip adsorbed by the first loading nozzle is precisely aligned with the center of the first cavity, and the alignment accuracy meets the tolerance requirements for chip placement.

[0079] The placement alignment control in this embodiment ensures that each chip can accurately fall into the corresponding slot during batch placement, avoiding problems such as misalignment, stacking, and chip dropping, thus guaranteeing sorting yield.

[0080] In some embodiments, the step of performing a synchronous placement operation of multiple target chips based on the matching relationship between the number of consecutive empty spaces and the number of chips carried, until the tray is filled with target chips and the sorting is completed, includes: taking the smaller value between the current number of consecutive empty spaces and the number of chips carried as the single placement quantity, triggering the corresponding number of suction nozzles to synchronously perform vacuum breaking placement actions, and completing the continuous placement of multiple target chips; and cyclically executing the target chip suction and placement process until all spaces in the tray corresponding to the target chip are filled with target chips, and then completing the sorting task.

[0081] In this embodiment, the step of performing a synchronous placement operation of multiple target chips based on the matching relationship between the number of consecutive vacant sites and the number of carried chips, until the tray is full of target chips and the sorting is completed, specifically includes the following process: Let N_hole be the number of holes in the currently selected continuous hole segment, and N_load be the number of nozzles carrying the target chip on the current sorting device. Take the smaller value of the two, N_place=min(N_hole,N_load), as the actual number of chips placed in this placement operation.

[0082] Starting with the first loading nozzle, select N_place loading nozzles in a consecutive sequence, and simultaneously send a closing command to the corresponding vacuum control valve. At the same time, open the vacuum breaking solenoid valve to make the nozzles lose negative pressure and place the chip smoothly into the corresponding cavity below. After a preset placement stabilization delay, control the Z-axis to rise to a safe height. Confirm that the chip has been removed from the nozzle by the vacuum pressure value, and determine that the placement is successful.

[0083] After placement is complete, update the system status: update the status of the N_place suction nozzles involved in placement to idle, update the status of the corresponding N_place acupoints on the target tray to occupied, and remove filled acupoint segments from the list of consecutive empty acupoint segments; if the segment is not completely filled, update the starting position and number of the remaining empty acupoint segments.

[0084] Subsequently, the multi-nozzle sorting mobile device returns to the sorting pallet area and repeatedly executes the suction-placement process from step S101 to step S104, continuously transferring the target chip in the sorting pallet to the target pallet; when the sorting control unit detects that all the acupoints of the target pallet are marked as occupied, it determines that the current target pallet sorting is completed, issues a pallet discharge command, and the target pallet flows out of the equipment through the conveyor mechanism and enters the packaging and shipping stage.

[0085] If the production line is configured with multiple sorting stations and multiple target stations, it can switch between different pallets for sorting through cross-regional scheduling logic to achieve continuous non-stop operation.

[0086] The cyclic placement logic in this embodiment enables fully automated continuous sorting without manual intervention, significantly improving the overall production capacity.

[0087] In some embodiments, such as Figure 2 As shown, taking the sorting of good-quality chips as an example, the multi-nozzle sorting mobile device is equipped with 6 sets of vacuum nozzle assemblies arranged linearly at equal intervals. The center distance between adjacent nozzles is equal to the column distance between the tray slots. Both the tray to be sorted and the target tray are standard IC trays with 10 rows and 8 columns, and one chip is placed in each slot. The tray to be sorted and the target tray are located in two independent workstation areas of the equipment, forming a cross-area sorting layout.

[0088] Before the sorting operation begins, the sorting pallet carries chips that have completed appearance inspection, while the target pallet is empty. Both are loaded into place by conveyor mechanisms.

[0089] The first step is chip detection and data construction: The chip detection and positioning unit acquires full-area images of the two trays respectively, establishes their respective coordinate mapping tables, obtains the grade and position of each chip in the tray to be sorted, and the empty state and position of each acupoint in the target tray; it identifies that the first row, column 2 to column 7 of the tray to be sorted are consecutive good chips, a total of 6 chips, forming a continuous target chip segment.

[0090] The second step is to read the status of the suction nozzles and align them for picking up the chips. The sorting control unit reads that all six suction nozzles are in an idle state, with the first idle nozzle being nozzle number 1. The sorting device is then moved to the top of the first row of the tray to be sorted, so that nozzle number 1 aligns with the first good chip in the second column. At this time, nozzles numbered 2-6 align with the good chips in the third-to-seventh columns in sequence. Simultaneously, the vacuum of the six suction nozzles is turned on, and six consecutive good chips are picked up at once. After confirming that the adsorption is normal, the suction nozzle status is updated to material loading.

[0091] The third step is target tray hole matching: identify the first row of the target tray, column 1 to column 8 as consecutive holes, a total of 8, forming a continuous hole segment.

[0092] Step 4, Alignment and Placement: Control the sorting device to move across the area to the top of the target tray, so that the No. 1 material-carrying suction nozzle is aligned with the first row and first column of empty cavity, and the No. 2-6 suction nozzles are aligned with the second to sixth columns of empty cavity in turn; Simultaneously close the vacuum of the 6 suction nozzles and break the vacuum, and place the 6 chips smoothly into the corresponding cavity. After confirming successful placement, the suction nozzle status is updated to idle.

[0093] Step 5, cyclic operation: After completing this placement, the sorting device returns to the tray to be sorted and continues to identify the next continuous target chip, repeating the above pick-up-placement process; when the first row of sorting is completed, it automatically switches to the second row, and completes the sorting of the entire tray row by row; until all 80 slots of the target tray are filled with good chips, the sorting is determined to be completed, and the target tray is discharged.

[0094] In this embodiment, a single action can complete the simultaneous pick-up and placement of 6 chips. Compared with the single-chip sorting mode, the sorting efficiency is increased by more than 5 times, giving full play to the parallel capability of the multi-nozzle device and effectively solving the production capacity bottleneck problem that the sorting cycle is lower than the detection cycle.

[0095] Understandably, when the sorting target is a first-class defective product, a second-class defective product, or an empty material, simply switch the target level screening conditions and repeat the same control process to achieve the classification and sorting of different types of chips, adapting to various production scenarios.

[0096] In some embodiments, this embodiment provides a cross-regional multi-pallet dynamic scheduling control method based on an improved ant colony algorithm. On the basis of the above embodiments, the path planning for cross-regional sorting of multi-pallets is further optimized to improve sorting efficiency in multi-station scenarios.

[0097] This embodiment is applicable to sorting equipment configured with multiple sorting stations and multiple target stations. The equipment contains M pallets to be sorted and N target pallets distributed in different areas. Traditional sequential sorting requires processing each pallet individually, resulting in long movement paths and numerous ineffective strokes for the sorting device.

[0098] In this embodiment, the sorting control unit incorporates an improved ant colony algorithm scheduling module, and the specific control process is as follows: Global information acquisition: Real-time acquisition of the distribution of continuous target chip segments of all pallets to be sorted, the distribution of continuous cavity segments of all target pallets, and the position coordinates of each pallet in the global coordinate system of the equipment to construct a global sorting task map.

[0099] Task node modeling: The picking action of each continuous target chip segment is modeled as a picking node, the placement action of each continuous hole segment is modeled as a placement node, and the standby position of the sorting device is modeled as the starting node, forming a weighted directed graph. The weight of the edge is the weighted sum of the movement distance and the action time between two nodes.

[0100] Improved Ant Colony Algorithm Optimization: An ant colony algorithm with task priority factor is adopted to achieve the shortest total sorting time. The algorithm iteratively solves the optimal pick-and-place task execution order and plans the global movement path of the sorting device. The algorithm also incorporates length matching constraints between empty segments and chip segments, prioritizing the pairing of chip segments with similar lengths with empty segments to reduce the amount of chips remaining in a single action.

[0101] Dynamic path update: During the sorting process, if a new pallet to be sorted is loaded, or a target pallet is fully unloaded, the global task map is updated in real time, and the algorithm is called again to plan the optimal path for the remaining tasks, thus achieving dynamic scheduling.

[0102] The cross-regional multi-pallet dynamic scheduling method in this embodiment can significantly reduce the ineffective movement of the sorting device in complex multi-workstation layouts, improve the overall efficiency of multi-pallet parallel sorting, and is especially suitable for large-volume, multi-category chip sorting production lines.

[0103] In some embodiments, this embodiment provides an adaptive fault-tolerant control method for nozzle failure, which automatically adjusts the sorting strategy when one or more nozzles fail during the sorting process, ensuring that the sorting operation is not interrupted and improving system stability.

[0104] The specific control process in this embodiment is as follows: Real-time fault detection: After each suction or placement action is completed, the vacuum pressure sensor data and control valve feedback signal of each nozzle are read. If the nozzle has abnormalities such as insufficient vacuum or no response from the control valve, the nozzle is automatically marked as faulty and added to the faulty nozzle list.

[0105] Available nozzle reorganization: After eliminating faulty nozzles, recount the remaining available nozzles and identify consecutive empty segments among the remaining available nozzles. Divide the physically consecutive available nozzles into a available nozzle group and record the starting nozzle number and consecutive number of nozzles in each group.

[0106] Dynamic splitting of continuous segments: For continuous target chip segments to be sorted, the excessively long continuous chip segments are split into multiple sub-segments according to the length of the currently available nozzle group. The length of each sub-segment does not exceed the length of the maximum available nozzle group. After splitting, the list of continuous target chip segments is updated, and picking is performed sequentially according to the split sub-segments.

[0107] Placement strategy adaptive adjustment: Similarly, in the placement process, the corresponding length of continuous cavity segment is matched according to the current continuous distribution of the material-carrying nozzles; if the material-carrying nozzles are not continuously distributed due to a malfunction, the alignment offset of the sorting device can be adjusted to align the effective material-carrying nozzles with the continuous cavities, thus completing the placement.

[0108] Fault recovery mechanism: When a faulty nozzle is reset or repaired and returns to normal, it will be automatically reinstated into the available nozzle resources, the nozzle group division will be updated, and the full-load sorting capacity will be restored.

[0109] The fault-tolerant control method in this embodiment can automatically respond to nozzle failure scenarios without manual intervention, avoiding the shutdown of the entire equipment due to a single nozzle failure, and greatly improving the system's uptime and the robustness of the sorting process.

[0110] In some embodiments, this embodiment provides a sorting speed adaptive adjustment method based on front-end detection cycle prediction, so that the sorting cycle and the front-end detection cycle are dynamically matched, avoiding the accumulation of chips to be sorted or the idling of the sorting device, and optimizing the overall line operating efficiency.

[0111] The specific control process in this embodiment is as follows: Inspection cycle time acquisition: Through the production line communication interface, the output cycle time data of the front-end chip inspection equipment is acquired in real time, including the number of inspected chips output per unit time, the loading interval of the pallet to be sorted, and the average inspection speed and fluctuation trend over a recent period.

[0112] Sorting cycle time prediction: Based on the sliding window averaging algorithm, predict the inflow rate of chips to be sorted in the next time period, and calculate the required target sorting cycle time by combining the number of cache trays in the current sorting area.

[0113] Adaptive adjustment of motion parameters: Based on the target sorting cycle time, the motion speed, acceleration and deceleration parameters, and material suction and discharge delay time of the multi-nozzle sorting moving device are dynamically adjusted; when the detection cycle time is accelerated and chips to be sorted accumulate, the motion speed is increased and the motion delay is shortened to improve the sorting cycle time; when the detection cycle time is slowed down and there are insufficient chips to be sorted, the motion speed is reduced and the stabilization delay is extended to reduce equipment energy consumption and mechanical wear.

[0114] Dynamic configuration of nozzle quantity: If the sorting device supports nozzle module expansion, different numbers of nozzles can be activated according to cycle time requirements; some nozzles are activated during low cycle time, and all nozzles are activated during high cycle time, realizing on-demand allocation of resources.

[0115] The adaptive adjustment method in this embodiment can achieve rhythm coordination between the sorting process and the front-end inspection process, avoiding the waste of production capacity caused by the mismatch between the speeds of upstream and downstream processes, while taking into account the economy and service life of equipment operation.

[0116] In some embodiments, this embodiment provides a partition mapping control method for parallel sorting of multi-level chips, which can simultaneously complete the sorting of chips of multiple levels in one round trip, further reducing the number of round trips of the sorting device and improving the overall sorting efficiency.

[0117] In this embodiment, the device is equipped with multiple classification target trays, which correspond to three levels: good products, first-level defective products, and second-level defective products. The three trays are distributed in different areas.

[0118] The specific control process in this embodiment is as follows: Multi-level continuous segment synchronous identification: In the chip mapping table of the pallet to be sorted, continuous segment identification is performed simultaneously for three levels: good products, first-level defective products, and second-level defective products, generating a list of continuous target chip segments for each of the three levels.

[0119] Nozzle partition mapping: The nozzles of the multi-nozzle sorting mobile device are divided into multiple partitions according to their arrangement order. For example, 6 nozzles are divided into three partitions: the first 2, the middle 2, and the last 2. Each partition corresponds to a chip level and independently controls the vacuum on / off.

[0120] Multi-level synchronous pickup: The control sorting device moves above the tray to be sorted. By adjusting the alignment position, the three suction nozzles are respectively aligned with the three levels of continuous target chip segments, and the vacuum suction of the three levels of chips is performed synchronously. The pickup action completes the pickup of multiple levels of chips.

[0121] Cross-regional placement: After picking up, the sorting device moves sequentially to the target tray areas corresponding to the three levels, and places the chips on the corresponding zone nozzles into the continuous cavities of the corresponding level trays; during the placement process, the nozzles that have not reached the corresponding level area remain in a vacuum adsorption state.

[0122] Path optimization and sorting: Based on the location of the three target pallets, the optimal placement order is planned to minimize the total movement path of the sorting device and reduce the time spent on cross-regional movement.

[0123] The multi-level parallel sorting method in this embodiment can combine traditional multiple single-level sorting into one multi-level synchronous sorting, greatly reducing the number of round trips of the sorting device. It is especially suitable for advanced packaging and testing production lines with multiple chip levels and complex classification requirements.

[0124] Please see Figure 3 As shown, Figure 3 This is a schematic diagram of the control system 200 of the cross-regional multi-chip automated sorting system provided in this application embodiment. The control system 200 of the cross-regional multi-chip automated sorting system is used to execute the steps of the control method of the cross-regional multi-chip automated sorting system shown in the above embodiments. The control system 200 of the cross-regional multi-chip automated sorting system can be a single server or a server cluster, or the control system 200 of the cross-regional multi-chip automated sorting system can be a terminal, such as a handheld terminal, a laptop computer, a wearable device, or a robot.

[0125] like Figure 3As shown, the control system 200 of the cross-regional multi-chip automated sorting system includes: The chip detection unit 201 is used to acquire an overall image of the tray to be sorted, obtain chip quality judgment results corresponding to multiple chips, and determine the grade detection information of each chip based on the overall image and chip quality judgment results. In the overall image, the planar position coordinates of each chip in the tray coordinate system are identified by an image positioning algorithm. The mapping relationship between chip position and detection results is established based on the grade detection information and planar position coordinates. Target chips are selected from multiple chips based on the detection results. Row and column information is obtained based on the position coordinates of each target chip. The start and end positions and consecutive number of consecutively arranged target chips are determined based on the row and column information. The suction operation unit 202 is used to read the working status of the suction nozzles of the multi-nozzle sorting mobile device, count the total number and arrangement order of the currently available idle suction nozzles, and determine the number of the first idle suction nozzle in the order; generate a motion path according to the position coordinates of the first target chip and the number of the idle suction nozzle, control the sorting device to move to the corresponding position, so that the center of the first idle suction nozzle coincides with the center of the first target chip, and perform synchronous suction operation of multiple consecutive target chips according to the matching relationship between the number of consecutive target chips and the number of idle suction nozzles; The tray recognition unit 203 is used to obtain the occupancy status and position coordinates of each acupoint on the target tray corresponding to the target chip through the chip detection and positioning unit, and to identify the start and end positions and the number of consecutive empty acupoints on the tray. The sorting completion unit 204 is used to control the sorting moving device to move so that the first chip-carrying nozzle aligns with the first empty space. Based on the matching relationship between the number of consecutive empty spaces and the number of chips carried, it performs a synchronous placement operation of multiple consecutive target chips until the tray is filled with target chips and the sorting is completed.

[0126] In some embodiments, the step of selecting target chips from multiple chips based on detection results, obtaining row and column information based on the position coordinates of each target chip, and determining the start and end positions and the number of consecutive target chips based on the row and column information includes: selecting target chips of corresponding levels according to preset sorting targets, traversing all target chips in the order of the pallet rows and columns; identifying consecutive adjacent target chip segments in the row and column direction, and recording the start and end row and column positions and the total number of consecutive chips for each segment of consecutive target chips.

[0127] In some embodiments, the step of performing a synchronous pick-up operation of multiple consecutive target chips based on the matching relationship between the number of consecutive target chips and the number of idle nozzles includes: taking the smaller value between the current number of consecutive target chips and the number of idle nozzles as the single pick-up quantity, triggering the corresponding number of idle nozzles to synchronously perform vacuum pick-up actions, and completing the pickup of multiple consecutive target chips.

[0128] In some embodiments, the step of obtaining the occupancy status and position coordinates of each acupoint on the target tray corresponding to the target chip through the chip detection and positioning unit, and identifying the start and end positions and the number of consecutive empty acupoints on the tray, includes: acquiring an overall image of the tray corresponding to the target chip, identifying the chip occupancy status of each acupoint, and marking all empty acupoints without chips; traversing all empty acupoints in the order of rows and columns of the tray, identifying consecutive adjacent empty acupoint segments, and recording the start and end row and column positions of each segment and the total number of consecutive empty acupoints.

[0129] In some embodiments, the control of the sorting moving device to align the first chip-carrying nozzle with the first empty space includes: generating a motion path based on the position coordinates of the first empty space, controlling the chip-carrying sorting device to move above the target tray, so that the first chip-carrying nozzle in the sorting sequence is aligned with the center of the first empty space.

[0130] In some embodiments, the step of performing a synchronous placement operation of multiple target chips based on the matching relationship between the number of consecutive empty spaces and the number of chips carried, until the tray is filled with target chips and the sorting is completed, includes: taking the smaller value between the current number of consecutive empty spaces and the number of chips carried as the single placement quantity, triggering the corresponding number of suction nozzles to synchronously perform vacuum breaking placement actions, and completing the continuous placement of multiple target chips; and cyclically executing the target chip suction and placement process until all spaces in the tray corresponding to the target chip are filled with target chips, and then completing the sorting task.

[0131] It should be noted that those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the control system and each module of the cross-regional multi-chip automatic sorting system described above can be referred to the corresponding contents in the various embodiments of the control method of the cross-regional multi-chip automatic sorting system, and will not be repeated here.

[0132] The control method of the aforementioned cross-regional multi-chip automated sorting system can be implemented as a computer program, which can be used in, for example... Figure 3 It runs on the device shown.

[0133] Please see Figure 4 , Figure 4 This is a schematic block diagram of the structure of a computer device provided in an embodiment of this application. The computer device includes a processor, a memory, and a network interface connected via a device bus, wherein the memory may include a storage medium and internal memory.

[0134] The storage medium can store operating devices and computer programs. The computer program includes program instructions that, when executed, cause the processor to perform any control method for a cross-regional, multi-chip automated sorting system.

[0135] The processor provides computing and control capabilities, supporting the operation of the entire computer device.

[0136] Internal memory provides an environment for the execution of computer programs in non-volatile storage media. When executed by a processor, the computer program enables the processor to perform any control method for a cross-regional multi-chip automated sorting system.

[0137] This network interface is used for network communication, such as sending assigned tasks. Those skilled in the art will understand that... Figure 4 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the terminal to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0138] It should be understood that the processor can be a Central Processing Unit (CPU), but it can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among these, a general-purpose processor can be a microprocessor or any conventional processor.

[0139] In one embodiment, the processor is configured to run a computer program stored in memory to perform the following steps: The system acquires an overall image of the tray to be sorted, obtains chip quality judgment results for multiple chips, and determines the grade detection information for each chip based on the overall image and chip quality judgment results. In the overall image, the system uses an image positioning algorithm to identify the planar position coordinates of each chip in the tray coordinate system. Based on the grade detection information and planar position coordinates, the system establishes a mapping relationship between chip position and detection results. Based on the detection results, the system filters out target chips from multiple chips, obtains row and column information based on the position coordinates of each target chip, and determines the start and end positions and consecutive quantity of consecutively arranged target chips based on the row and column information. The system reads the working status of the nozzles of the multi-nozzle sorting mobile device, counts the total number and order of currently available idle nozzles, and determines the number of the first idle nozzle in the order. Based on the position coordinates of the first target chip and the number of the idle nozzle, a motion path is generated, and the sorting device is controlled to move to the corresponding position so that the center of the first idle nozzle coincides with the center of the first target chip. Based on the matching relationship between the number of consecutive target chips and the number of idle nozzles, the system performs synchronous pick-up operations on multiple consecutive target chips. The chip detection and positioning unit obtains the occupancy status and position coordinates of each acupoint on the target tray corresponding to the target chip, and identifies the start and end positions and the number of consecutive empty acupoints on the tray. The sorting device is controlled to move so that the first chip-carrying nozzle aligns with the first empty cavity. Based on the matching relationship between the number of consecutive empty cavities and the number of chips carried, multiple target chips are placed synchronously until the tray is full of target chips, and the sorting is completed.

[0140] In some embodiments, the step of selecting target chips from multiple chips based on detection results, obtaining row and column information based on the position coordinates of each target chip, and determining the start and end positions and the number of consecutive target chips based on the row and column information includes: selecting target chips of corresponding levels according to preset sorting targets, traversing all target chips in the order of the pallet rows and columns; identifying consecutive adjacent target chip segments in the row and column direction, and recording the start and end row and column positions and the total number of consecutive chips for each segment of consecutive target chips.

[0141] In some embodiments, the step of performing a synchronous pick-up operation of multiple consecutive target chips based on the matching relationship between the number of consecutive target chips and the number of idle nozzles includes: taking the smaller value between the current number of consecutive target chips and the number of idle nozzles as the single pick-up quantity, triggering the corresponding number of idle nozzles to synchronously perform vacuum pick-up actions, and completing the pickup of multiple consecutive target chips.

[0142] In some embodiments, the step of obtaining the occupancy status and position coordinates of each acupoint on the target tray corresponding to the target chip through the chip detection and positioning unit, and identifying the start and end positions and the number of consecutive empty acupoints on the tray, includes: acquiring an overall image of the tray corresponding to the target chip, identifying the chip occupancy status of each acupoint, and marking all empty acupoints without chips; traversing all empty acupoints in the order of rows and columns of the tray, identifying consecutive adjacent empty acupoint segments, and recording the start and end row and column positions of each segment and the total number of consecutive empty acupoints.

[0143] In some embodiments, the control of the sorting moving device to align the first chip-carrying nozzle with the first empty space includes: generating a motion path based on the position coordinates of the first empty space, controlling the chip-carrying sorting device to move above the target tray, so that the first chip-carrying nozzle in the sorting sequence is aligned with the center of the first empty space.

[0144] In some embodiments, the step of performing a synchronous placement operation of multiple target chips based on the matching relationship between the number of consecutive empty spaces and the number of chips carried, until the tray is filled with target chips and the sorting is completed, includes: taking the smaller value between the current number of consecutive empty spaces and the number of chips carried as the single placement quantity, triggering the corresponding number of suction nozzles to synchronously perform vacuum breaking placement actions, and completing the continuous placement of multiple target chips; and cyclically executing the target chip suction and placement process until all spaces in the tray corresponding to the target chip are filled with target chips, and then completing the sorting task.

[0145] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, causes the processor to implement the steps of the control method for a cross-regional multi-chip automated sorting system as provided in any embodiment of this application.

[0146] The computer-readable storage medium may be an internal storage unit of the computer device described in the foregoing embodiments, such as the hard disk or memory of the computer device. The computer-readable storage medium may also be an external storage device of the computer device, such as a plug-in hard disk, SmartMediaCard (SMC), SecureDigital (SD) card, or FlashCard equipped on the computer device.

[0147] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A control method for a cross-regional multi-chip automated sorting system, applied to a cross-regional multi-chip automated sorting system, comprising a pallet-carrying unit to be sorted, a target pallet-carrying unit, a multi-nozzle sorting moving device, a chip detection and positioning unit, and a sorting control unit; characterized in that, include: The system acquires an overall image of the tray to be sorted, obtains chip quality judgment results for multiple chips, and determines the grade detection information for each chip based on the overall image and chip quality judgment results. In the overall image, the system uses an image positioning algorithm to identify the planar position coordinates of each chip in the tray coordinate system. Based on the grade detection information and planar position coordinates, the system establishes a mapping relationship between chip position and detection results. Based on the detection results, the system filters out target chips from multiple chips, obtains row and column information based on the position coordinates of each target chip, and determines the start and end positions and consecutive quantity of consecutively arranged target chips based on the row and column information. The system reads the working status of the nozzles of the multi-nozzle sorting mobile device, counts the total number and order of currently available idle nozzles, and determines the number of the first idle nozzle in the order. Based on the position coordinates of the first target chip and the number of the idle nozzle, a motion path is generated, and the sorting device is controlled to move to the corresponding position so that the center of the first idle nozzle coincides with the center of the first target chip. Based on the matching relationship between the number of consecutive target chips and the number of idle nozzles, the system performs synchronous pick-up operations on multiple consecutive target chips. The chip detection and positioning unit obtains the occupancy status and position coordinates of each acupoint on the target tray corresponding to the target chip, and identifies the start and end positions and the number of consecutive empty acupoints on the tray. The sorting device is controlled to move so that the first chip-carrying nozzle aligns with the first empty cavity. Based on the matching relationship between the number of consecutive empty cavities and the number of chips carried, multiple target chips are placed synchronously until the tray is full of target chips, and the sorting is completed.

2. The method according to claim 1, characterized in that, The process of selecting target chips from multiple chips based on detection results, obtaining row and column information based on the position coordinates of each target chip, and determining the start and end positions and the number of consecutive target chips based on the row and column information includes: Select target chips of the corresponding grade according to the preset sorting target, and traverse all target chips in the order of the pallet rows and columns; Identify consecutive adjacent target chip segments in the row and column direction, and record the starting row and column position, ending row and column position, and total number of consecutive chips for each consecutive target chip segment.

3. The method according to claim 1, characterized in that, The step of performing synchronous suction of multiple target chips based on the matching relationship between the number of consecutive target chips and the number of idle nozzles includes: The smaller value between the current number of consecutive target chips and the number of idle nozzles is taken as the number of chips to be picked up in a single operation. This triggers the corresponding number of idle nozzles to simultaneously perform vacuum suction, thus completing the picking up of multiple consecutive target chips.

4. The method according to claim 1, characterized in that, The step of obtaining the occupancy status and position coordinates of each acupoint on the target tray corresponding to the target chip through the chip detection and positioning unit, and identifying the start and end positions and the number of consecutive empty acupoints on the tray, includes: Collect an overall image of the tray corresponding to the target chip, identify the chip occupancy status of each acupoint, and mark all empty acupoints without chips; Traverse all empty spaces in the order of rows and columns of the tray, identify consecutive adjacent empty space segments, and record the starting row and column position, ending row and column position, and total number of consecutive empty spaces for each segment.

5. The method according to claim 1, characterized in that, The control sorting moving device moves to align the first chip-carrying nozzle with the first empty cavity, including: Based on the position coordinates of the first empty cavity, a motion path is generated, and the sorting device carrying the chip is controlled to move above the target tray, so that the first suction nozzle carrying the chip is aligned with the center of the first empty cavity.

6. The method according to claim 1, characterized in that, The step of simultaneously placing multiple target chips based on the matching relationship between the number of consecutive vacant sites and the number of chips carried, until the tray is full of target chips, and then completing the sorting, includes: The smaller value between the current number of consecutive empty holes and the number of chips carried is taken as the number of placements per time, triggering the corresponding number of nozzles to simultaneously perform vacuum-breaking placement actions, thereby completing the continuous placement of multiple target chips. The process of picking up and placing the target chip is repeated until all the slots on the tray corresponding to the target chip are filled with the target chip, and then the sorting task is completed.

7. A computer device, characterized in that, The computer device includes a processor, a memory, and a computer program stored in the memory and executable by the processor, the memory storing a policy model, wherein the computer program, when executed by the processor, implements the method as described in any one of claims 1-6.

8. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, causes the processor to implement the method as described in any one of claims 1-6.

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