Display motherboard manufacturing method, display motherboard, and cutting apparatus

Abstract

The application discloses a display mother plate preparation method, a display mother plate and a cutting device. The display mother plate preparation method comprises the following steps: providing a glass substrate, and forming a display mother plate to be processed on one side of the glass substrate, wherein the display mother plate to be processed comprises a first edge defect part, and the glass substrate comprises a first part covered by the first edge defect part; placing the glass substrate and the display mother plate to be processed on a bearing surface of a bearing table of the cutting device, and cutting the glass substrate and the display mother plate to be processed by using a cutting head in the cutting device, so as to remove the first edge defect part of the display mother plate to be processed and the corresponding first part of the glass substrate, wherein the cutting head can be arranged away from or close to the bearing table, and the cutting head and the bearing table can be relatively moved along a direction parallel to the bearing surface; and the display mother plate to be processed and the glass substrate are peeled off from each other by using a laser peeling process. The cutting head can cut and remove the first edge defect part at different positions, so that the process target of stable peeling is achieved.

Description

Technical Field

[0001] This application belongs to the field of display technology, and in particular relates to a method for preparing a display motherboard, a display motherboard, and a cutting device. Background Technology

[0002] In recent years, display technology has developed rapidly, with flexible and bendable displays seeing significant improvements in both screen size and display quality. Currently, the manufacturing process for display motherboards involves first coating a glass substrate with polyimide to form a flexible substrate, then forming a display functional layer on the flexible substrate, and finally using laser lift-off to peel the flexible display device (including the substrate and display functional layer) from the glass substrate to form the desired display motherboard. However, due to limitations in existing display motherboard manufacturing processes and equipment, the yield rate of display motherboard production cannot meet requirements.

[0003] Therefore, there is an urgent need for a new method for preparing display motherboards, display motherboards, and cutting equipment. Summary of the Invention

[0004] This application provides a method for preparing a display motherboard, a display motherboard, and a cutting device. The cutting head can cut and remove the first edge defect at different positions to achieve the process goal of stable peeling. It eliminates the need for frequent adjustments to the upstream or downstream processes to eliminate the influence of the first edge defect, reduces the risk of process changes, and improves the yield of the display motherboard.

[0005] This application provides a method for preparing a display motherboard, comprising: providing a glass substrate and forming a display motherboard to be processed on one side of the glass substrate, the display motherboard to be processed including a central region and an edge region at least partially surrounding the central region, wherein the display motherboard to be processed includes a first edge defect portion in the edge region, and the glass substrate includes a first portion covered by the first edge defect portion; placing the glass substrate and the display motherboard to be processed on the bearing surface of a stage of a cutting device, and cutting the glass substrate and the display motherboard to be processed using a cutting head in the cutting device to remove the first edge defect portion of the display motherboard to be processed and the first portion corresponding to the glass substrate, wherein the cutting head and the stage are disposed opposite to each other, the cutting head can be disposed away from or close to the stage, and the cutting head and the stage can move relative to each other in a direction parallel to the bearing surface; and using a laser peeling process to peel the display motherboard to be processed and the glass substrate apart.

[0006] According to one aspect of this application, between the steps of placing the glass substrate and the display motherboard to be processed on the support surface of the stage of the cutting equipment, and cutting the glass substrate and the display motherboard to be processed using the cutting head in the cutting equipment to remove the first edge defect portion of the display motherboard to be processed and the first portion corresponding to the glass substrate, and the step of peeling the display motherboard to be processed and the glass substrate apart using a laser peeling process, the method further includes: forming a first protective layer on the side of the display motherboard to be processed away from the glass substrate.

[0007] According to one aspect of this application, in the step of providing a glass substrate and forming a display motherboard to be processed on one side of the glass substrate, the display motherboard to be processed including a central region and an edge region disposed at least partially around the central region, wherein the edge region of the display motherboard to be processed includes a first edge defect portion, and the glass substrate includes a first portion covered by the first edge defect portion: the display motherboard to be processed includes a substrate and a functional layer disposed on the side of the substrate opposite to the glass substrate.

[0008] According to one aspect of this application, in the step of placing the glass substrate and the display motherboard to be processed on the bearing surface of the stage of a cutting device, and using a cutting head in the cutting device to cut the glass substrate and the display motherboard to be processed to remove the first edge defect portion of the display motherboard to be processed and the corresponding first portion of the glass substrate, wherein the cutting head and the stage are disposed opposite to each other, the cutting head can be disposed away from or close to the stage, and along a direction parallel to the bearing surface, and the cutting head and the stage can move relative to each other, the step includes: placing the glass substrate and the display motherboard to be processed on the bearing surface of the stage of a cutting device, and cutting the glass substrate and the display motherboard to be processed in a direction parallel to the bearing surface. The plate is placed on the support surface of the stage of the cutting equipment, and the laser cutting head in the cutting equipment cuts the glass substrate and the display motherboard to be processed to remove the first edge defect of the display motherboard to be processed and the corresponding first part of the glass substrate. The laser cutting head and the stage are arranged opposite to each other. The laser cutting head can be arranged away from or close to the stage, and the laser cutting head and the stage can move relative to each other in a direction parallel to the support surface. Preferably, at least two laser cutting heads in the cutting equipment are used to cut the glass substrate and the display motherboard to be processed simultaneously.

[0009] According to one aspect of this application, in the step of placing the glass substrate and the display motherboard to be processed on the bearing surface of the stage of the cutting equipment, and using the cutting head in the cutting equipment to cut the glass substrate and the display motherboard to be processed to remove the first edge defect portion of the display motherboard to be processed and the first portion corresponding to the glass substrate, wherein the cutting head and the stage are disposed opposite to each other, the cutting head can be disposed away from or close to the stage, and the cutting head and the stage can move relative to each other in a direction parallel to the bearing surface, the step includes: after aligning the glass substrate and the display motherboard to be processed using the alignment component in the cutting equipment, placing the glass substrate and the display motherboard to be processed on the bearing surface of the stage of the cutting equipment according to the alignment result.

[0010] According to one aspect of this application, in the step of placing the glass substrate and the display motherboard to be processed on the support surface of the stage of the cutting equipment, and cutting the glass substrate and the display motherboard to be processed using the cutting head in the cutting equipment to remove the first edge defect portion of the display motherboard to be processed and the first portion corresponding to the glass substrate, wherein the cutting head and the stage are disposed opposite to each other, the cutting head can be disposed away from or close to the stage, and the cutting head and the stage can move relative to each other in a direction parallel to the support surface, the step includes: placing the glass substrate and the display motherboard to be processed on the support surface of the stage of the cutting equipment, and cutting the glass substrate and the display motherboard to be processed using the cutting head in the cutting equipment to remove the first edge defect portion of the display motherboard to be processed and the first portion corresponding to the glass substrate, while simultaneously using a dust collection component located on the stage to perform dust collection.

[0011] Another aspect of this application provides a display motherboard, which is prepared using the display motherboard preparation method described in any of the above embodiments.

[0012] Another aspect of this application provides a cutting device for the display motherboard preparation method described in any of the above embodiments. The cutting device includes: a stage for supporting and fixing a glass substrate and a display motherboard to be processed, the stage including a support surface; and a cutting head disposed opposite to the stage, the cutting head being disposed away from or close to the stage and being movable relative to the stage along a direction parallel to the support surface.

[0013] According to another aspect of this application, the cutting head includes a laser cutting head or a metal blade cutting head; preferably, the laser cutting head and the laser energy adjustment unit are electrically connected; preferably, the cutting device includes at least two cutting heads; preferably, the cutting device further includes a fixed frame and a first moving power unit disposed on the fixed frame, the first moving power unit being connected to the cutting head to drive the cutting head to move along the fixed frame; preferably, the cutting device further includes a first rotating power unit, the first rotating power unit being connected to the platform to drive the platform to rotate in a direction parallel to the bearing surface; preferably, the cutting device further includes a dust collection assembly disposed on the platform; preferably, the dust collection assembly includes a vacuum suction component, the suction port of the vacuum suction component being disposed on the bearing surface.

[0014] According to another aspect of this application, the cutting device further includes an alignment component for positioning and aligning the display motherboard to be processed; preferably, the alignment component includes an image analysis and processing unit and an image acquisition unit; preferably, the image acquisition unit includes a camera.

[0015] Compared with the prior art, the display motherboard preparation method provided in this embodiment of the invention uses a cutting device to cut the glass substrate and the display motherboard to be processed, so as to remove the first edge defect portion of the display motherboard to be processed and the corresponding first part of the glass substrate, thereby eliminating the influence of the first edge defect portion on the subsequent laser lift-off effect. Specifically, the first edge defect portion may be due to the discrepancy between the actual position and the design position of the edge of the film layer in each process, causing the film layer to exceed the substrate boundary, resulting in an over-standard residual film portion formed at the edge of the display motherboard to be processed. After removing this part, the lift-off effect of the laser lift-off process can be improved, the process error tolerance can be increased, and the cutting head and the stage can move relative to each other in a direction parallel to the bearing surface, so that the cutting head can cut and remove the first edge defect portion at different positions, achieving the process goal of stable lift-off. It is not necessary to frequently adjust the front-end or current process to eliminate the influence of the first edge defect portion, reducing the risk of process change and improving the preparation yield of the display motherboard. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a flowchart of a display motherboard preparation method provided in one embodiment of the present invention;

[0018] Figures 2 to 5 This is a schematic diagram of the structure obtained during the preparation process of the display motherboard preparation method provided in this embodiment of the invention.

[0019] In the attached image:

[0020] 10-Glass substrate; 11-First part; 20-Display motherboard to be processed; 21-First edge defect section; 30-Cutting equipment; 31-Cutting head; 32-Stage; 33-Dust collection assembly; 34-Alignment assembly; 35-Fixing frame; 36-First moving power unit; 40-First protective layer; F-Bearing surface; ZA-Central area; BA-Edge area. Detailed Implementation

[0021] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0022] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0023] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0024] Various modifications and variations can be made to this application without departing from its spirit or scope, which will be apparent to those skilled in the art. Therefore, this application is intended to cover modifications and variations falling within the scope of the corresponding claims (the claimed technical solutions) and their equivalents. It should be noted that the embodiments provided in this application can be combined with each other without contradiction.

[0025] This application provides a method for preparing a display motherboard, a display motherboard, and a cutting device 30. The following will be described in conjunction with the accompanying drawings. Figures 1 to 4 Various embodiments of the display motherboard preparation method, the display motherboard, and the cutting equipment 30 will be described.

[0026] Please see Figure 1 This application provides a method for preparing a display motherboard, comprising:

[0027] S110: A glass substrate 10 is provided, and a display motherboard 20 to be processed is formed on one side of the glass substrate 10. The display motherboard 20 to be processed includes a central region ZA and an edge region BA disposed at least partially around the central region ZA. In the edge region BA, the display motherboard 20 to be processed includes a first edge defect portion 21. The glass substrate 10 includes a first portion 11 covered by the first edge defect portion 21. Figure 2 As shown;

[0028] S120: The glass substrate 10 and the display motherboard 20 to be processed are placed on the bearing surface F of the stage 32 of the cutting equipment 30, and the glass substrate 10 and the display motherboard 20 to be processed are cut using the cutting head 31 in the cutting equipment 30 to remove the first edge defect portion 21 of the display motherboard 20 to be processed and the corresponding first portion 11 of the glass substrate 10. The cutting head 31 and the stage 32 are arranged opposite to each other. The cutting head 31 can be arranged away from or close to the stage 32, and the cutting head 31 and the stage 32 can move relative to each other in a direction parallel to the bearing surface F. Figure 3 As shown;

[0029] S130: The display motherboard 20 and the glass substrate 10 to be processed are separated using a laser lift-off process, such as... Figure 4 As shown.

[0030] The display motherboard preparation method provided in this embodiment of the invention uses a cutting device 30 to cut the glass substrate 10 and the display motherboard 20 to be processed, so as to remove the first edge defect 21 of the display motherboard 20 to be processed and the corresponding first part 11 of the glass substrate 10, thereby eliminating the influence of the first edge defect 21 on the subsequent laser lift-off effect. Specifically, the first edge defect 21 may be due to the film layer exceeding the substrate boundary due to the actual position of the edge of each process film layer not matching the design position, resulting in an over-standard residual film part formed at the edge of the display motherboard 20 to be processed. After removing this part, the lift-off effect of the laser lift-off process can be improved, and the process error tolerance can be increased. Along the direction parallel to the bearing surface F, the cutting head 31 and the stage 32 can move relative to each other, so that the cutting head 31 can cut and remove the first edge defect 21 at different positions, achieving the process goal of stable lift-off. It is not necessary to frequently adjust the front-end or current process to eliminate the influence of the first edge defect 21, reducing the risk of process change and improving the preparation yield of the display motherboard.

[0031] In step S110, the glass substrate 10 is used to temporarily support the display motherboard 20 to be processed. Then, a laser lift-off process is needed to peel the glass substrate 10 and the display motherboard 20. The display motherboard 20 may include a substrate and functional layers located on the substrate. Specifically, the functional layers may include an array layer, a light-emitting layer, an encapsulation layer, and a touch layer. During the fabrication of the array layer, light-emitting layer, encapsulation layer, and touch layer, due to fabrication process errors and alignment errors, some of the film layers may form morphologies that do not meet the preset requirements at the edges of the display motherboard 20, i.e., first edge defects 21. The irregular morphology and position of the first edge defects 21 may directly contact the glass substrate 10, affecting the subsequent laser lift-off effect.

[0032] Optionally, the display motherboard 20 to be processed can be further processed by cutting and other processes to form multiple display panels. For example, the display motherboard 20 to be processed can be cut into more than 100 display panels.

[0033] The display panel provided in the embodiments of the present invention can be an organic light-emitting diode (OLED) display panel, a quantum dot light-emitting diode (QLED) panel, or a micro flat panel display panel (Micro-OLED or Micro-LED), etc.

[0034] Optionally, the array layer may include a driving circuit. For example, the array layer may include a first conductive layer, a second conductive layer, and a third conductive layer disposed on one side of the substrate and stacked thereon. An insulating layer is disposed between adjacent conductive film layers. Exemplarily, the pixel driving circuit disposed on the array layer includes a transistor and a storage capacitor. The transistor includes an active layer, a gate, a source, and a drain. The materials of the source and gate may include one or more combinations of molybdenum, titanium, aluminum, copper, etc. The gate of the transistor is typically used to receive a control signal, causing the transistor to turn on or off under the control of the control signal. One of the source and drain of the thin-film transistor is connected to the light-emitting unit to control the normal light emission of the light-emitting unit.

[0035] The storage capacitor includes a first plate and a second plate. As an example, the gate and the first plate can be located in a first conductive layer, the second plate can be located in a second conductive layer, and the source and drain can be located in a third conductive layer.

[0036] Optionally, the functional layer may also include a light-emitting functional layer and an encapsulation layer disposed on the side of the array layer away from the substrate, wherein at least one film layer in the light-emitting functional layer and the encapsulation layer may be formed using IJP (Inkjet printing) technology.

[0037] Optionally, the light-emitting functional layer includes a first electrode layer, a light-emitting layer, and a second electrode layer stacked along the direction away from the substrate.

[0038] Optionally, the light-emitting layer includes one or more of the following: an electron injection layer, an electron transport layer, a light-emitting material layer, a hole blocking layer, an electron blocking layer, a hole transport layer, and a hole injection layer. The specific selection depends on the type of light-emitting layer and is not particularly limited. The electron injection layer, electron transport layer, and hole blocking layer can be disposed between the second electrode layer and the light-emitting material layer. The electron blocking layer, hole transport layer, and hole injection layer can be disposed between the first electrode layer and the light-emitting material layer.

[0039] The material of the first electrode layer is generally a material with a high work function to improve hole injection efficiency. It can be gold (Au), platinum (Pt), titanium (Ti), silver (Ag), indium tin oxide (ITO), zinc tin oxide (IZO), or a transparent conductive polymer (such as polyaniline). For example, the first electrode layer can be made of an ITO-Ag-ITO composite material, without any particular limitation.

[0040] The material of the second electrode layer can be one of the following metals: silver (Ag), aluminum (Al), lithium (Li), magnesium (Mg), ytterbium (Yb), calcium (Ca), or indium (In). It can also be an alloy of the aforementioned metals, such as magnesium-silver alloy (Mg / Ag) or lithium-aluminum alloy (Li / Al). This embodiment does not limit the material in this regard.

[0041] Optionally, the encapsulation layer includes a first encapsulation layer, the material of which includes an inorganic material.

[0042] Optionally, the encapsulation layer also includes a second encapsulation layer located on the side of the first encapsulation layer facing away from the substrate. The material of the second encapsulation layer includes an organic material. The organic material can be made of resin or polymeric organic material, and can be formed using IJP (Inkjet printing) technology.

[0043] Optionally, the encapsulation layer may also include a third encapsulation layer located on the side of the second encapsulation layer away from the substrate. The material of the third encapsulation layer includes inorganic materials. Adding an inorganic encapsulation layer outside the organic encapsulation layer can further improve the encapsulation effect of the encapsulation layer. In this embodiment, the material of the third encapsulation layer may be the same as or different from the material of the first encapsulation layer, and there is no special limitation.

[0044] Optionally, the materials of the first encapsulation layer and the third encapsulation layer are the same, so that the first encapsulation layer and the third encapsulation layer can be manufactured using the same equipment, which can simplify the manufacturing process of the display panel.

[0045] Please see Figure 3 In step S120, the cutting device 30 may include a stage 32 and a cutting head 31. The stage 32 is used to support and fix the glass substrate 10 and the display motherboard 20 to be processed. The stage 32 includes a bearing surface F. The cutting head 31 and the stage 32 are arranged opposite to each other. The cutting head 31 may be arranged away from or close to the stage 32. Along the direction parallel to the bearing surface F, the cutting head 31 and the stage 32 may move relative to each other so that the cutting head 31 can cut and remove the first edge defect portion 21 at different positions.

[0046] Optionally, the cutting head 31 can be a laser cutting head 31. Laser cutting can generate an extremely fine and concentrated beam of light, resulting in high cutting precision. This facilitates precise cutting and removal of the first edge defect 21, avoiding any impact on the normal areas of the glass substrate 10 and the display motherboard 20 to be processed. Of course, the cutting head 31 can also be other precision cutting tools, such as metal cutting blades, as long as they meet the required cutting precision.

[0047] In this embodiment, the cutting head 31 can be positioned away from or close to the stage 32. That is, the cutting head 31 can be close to the carrier to cut the glass substrate 10 and the display motherboard 20 to be processed. After the cutting is completed, the cutting head 31 can move away from the stage 32 to facilitate the removal of the glass substrate 10 and the display motherboard 20 to be processed.

[0048] In step S130, the laser lift-off process (LLO) is a technology that uses laser energy to decompose materials. The laser lift-off process uses pulsed laser to irradiate the surface of the material, causing the material to absorb laser energy and instantly reach high temperature decomposition, thereby realizing the separation of the glass substrate 10 and the display motherboard 20 to be processed.

[0049] Optionally, after the laser stripping process, since the display motherboard 20 to be processed has multiple layers of different materials, some layers may adhere to the glass substrate 10 at the edges under laser irradiation. Therefore, DLA (edge ​​stripping) is required to treat the adhesion between the display motherboard 20 and the glass substrate 10. The laser cutting head 31 can be electrically connected to the laser energy adjustment unit, meaning the laser energy adjustment unit can adjust the energy level of the laser cutting head 31, precisely control the cutting depth, form a cutting path, and provide a stripping path for the DLA process.

[0050] Please see Figure 5 In some optional embodiments, between the steps of placing the glass substrate 10 and the display motherboard 20 to be processed on the bearing surface F of the stage 32 of the cutting equipment 30, and cutting the glass substrate 10 and the display motherboard 20 to be processed using the cutting head 31 in the cutting equipment 30 to remove the first edge defect portion 21 of the display motherboard 20 to be processed and the corresponding first portion 11 of the glass substrate 10, and the step of peeling the display motherboard 20 to be processed and the glass substrate 10 apart using a laser peeling process, the following method is further included:

[0051] A first protective layer 40 is formed on the side of the display motherboard 20 facing away from the glass substrate 10.

[0052] It should be noted that the first protective layer 40 is used to protect the functional layer of the display motherboard 20 to be processed in the subsequent laser peeling process, so as to avoid the impurities generated by the laser peeling process from affecting the functional layer. The first protective layer 40 needs to be prepared after the cutting head 31 cuts the glass substrate 10 and the display motherboard 20 to be processed, so as to avoid the first protective layer 40 being cut together, and to avoid the problem of film peeling between the first protective layer 40 and the display motherboard 20 to be processed during the cutting process, so as to ensure the coverage and protection effect of the first protective layer 40 on the display motherboard 20 to be processed, and avoid aggravating the premature separation abnormality of the product.

[0053] After the laser ablation process is completed, the first protective layer 40 can be removed as needed.

[0054] In some optional embodiments, the step of placing the glass substrate 10 and the display motherboard 20 to be processed on the bearing surface F of the stage 32 of the cutting equipment 30, and using the cutting head 31 in the cutting equipment 30 to cut the glass substrate 10 and the display motherboard 20 to be processed to remove the first edge defect portion 21 of the display motherboard 20 to be processed and the corresponding first portion 11 of the glass substrate 10, wherein the cutting head 31 and the stage 32 are arranged opposite to each other, the cutting head 31 can be arranged away from or close to the stage 32, and the cutting head 31 and the stage 32 can move relative to each other in a direction parallel to the bearing surface F, includes:

[0055] The glass substrate 10 and the display motherboard 20 to be processed are placed on the bearing surface F of the stage 32 of the cutting equipment 30, and the glass substrate 10 and the display motherboard 20 to be processed are cut by the laser cutting head 31 in the cutting equipment 30 to remove the first edge defect portion 21 of the display motherboard 20 to be processed and the corresponding first portion 11 of the glass substrate 10. The laser cutting head 31 and the stage 32 are arranged opposite to each other. The laser cutting head 31 can be arranged away from or close to the stage 32, and the laser cutting head 31 and the stage 32 can move relative to each other in a direction parallel to the bearing surface F.

[0056] In this embodiment, a laser can be used to cut the glass substrate 10 and the display motherboard 20 to be processed. The laser energy adjustment unit can adjust the energy of the laser cutting head 31 to precisely control the cutting depth and improve the cutting accuracy.

[0057] Optionally, at least two laser cutting heads 31 in the cutting equipment 30 can be used to cut the glass substrate 10 and the display motherboard 20 to be processed simultaneously. It is understood that the more laser cutting heads 31 working at the same time, the higher the corresponding working efficiency. Of course, the number of laser cutting heads 31 should not be too many. Too many will lead to excessive costs, and interference between the laser cutting heads 31 is also likely. Optionally, the cutting equipment 30 includes two, three or four laser cutting heads 31.

[0058] Please see Figure 3In some optional embodiments, the steps of placing the glass substrate 10 and the display mother plate 20 to be processed on the bearing surface F of the stage 32 of the cutting equipment 30, and cutting the glass substrate 10 and the display mother plate 20 to be processed using the cutting head 31 in the cutting equipment 30 to remove the first edge defect portion 21 of the display mother plate 20 to be processed and the first portion 11 corresponding to the glass substrate 10, wherein the cutting head 31 and the stage 32 are arranged opposite to each other, the cutting head 31 can be arranged away from or close to the stage 32, and the cutting head 31 and the stage 32 can move relative to each other in a direction parallel to the bearing surface F, include: aligning the glass substrate 10 and the display mother plate 20 to be processed using the alignment component 34 in the cutting equipment 30, and then placing the glass substrate 10 and the display mother plate 20 to be processed on the bearing surface F of the stage 32 of the cutting equipment 30 according to the alignment result.

[0059] It should be noted that alignment marks are usually provided on the display motherboard 20 to be processed. The alignment component 34 can obtain the position of the alignment marks on the display motherboard 20 to be processed through image acquisition elements such as cameras, thereby determining the position of the display motherboard 20 to be processed. Then, based on the actual position of the display motherboard 20 to be processed and the alignment result, the display motherboard 20 to be processed is accurately placed on the bearing surface F of the stage 32.

[0060] The alignment component 34 can be located at the four corners of the stage 32 to avoid affecting the placement of the glass substrate 10 and the display motherboard 20 to be processed.

[0061] Please see Figure 3 In some optional embodiments, the step of placing the glass substrate 10 and the display motherboard 20 to be processed on the bearing surface F of the stage 32 of the cutting equipment 30, and using the cutting head 31 in the cutting equipment 30 to cut the glass substrate 10 and the display motherboard 20 to be processed to remove the first edge defect portion 21 of the display motherboard 20 to be processed and the corresponding first portion 11 of the glass substrate 10, wherein the cutting head 31 and the stage 32 are arranged opposite to each other, the cutting head 31 can be arranged away from or close to the stage 32, and the cutting head 31 and the stage 32 can move relative to each other in a direction parallel to the bearing surface F, includes:

[0062] The glass substrate 10 and the display motherboard 20 to be processed are placed on the bearing surface F of the stage 32 of the cutting equipment 30, and the glass substrate 10 and the display motherboard 20 to be processed are cut by the cutting head 31 in the cutting equipment 30 to remove the first edge defect portion 21 of the display motherboard 20 to be processed and the first portion 11 corresponding to the glass substrate 10. At the same time, the dust suction component 33 located on the stage 32 is used for dust suction.

[0063] It is understandable that when the glass substrate 10 and the display motherboard 20 to be processed are cut by the cutting head 31, the directly cut part of the glass substrate 10 and the display motherboard 20 to be processed will generate dust and other foreign objects. These foreign objects may fall on the display motherboard 20 to be processed, affecting the cleanliness of the display motherboard 20. In this embodiment, a dust collection component 33 can be used to adsorb and collect the dust and other foreign objects generated by cutting, thereby reducing the impact of the dust after cutting on the foreign object yield of the display motherboard 20 to be processed.

[0064] Optionally, the dust collection component 33 includes a vacuum cleaner, the dust collection port of which is located on the bearing surface F. The vacuum cleaner creates a vacuum environment by using an electric fan and uses the air pressure difference to collect dust. The vacuum cleaner has strong suction and a high-efficiency filtration system, which can more effectively capture small particles and has stronger cleaning ability. It can quickly remove the dust generated during cutting. The dust collection port of the vacuum cleaner is located on the bearing surface F to facilitate the removal of dust falling on the stage 32. A protective net can be installed at the dust collection port to avoid affecting the glass substrate 10 and the display motherboard 20 to be processed.

[0065] This invention also provides a display motherboard, which is prepared using the display motherboard preparation method described in any of the above embodiments.

[0066] The display motherboard may include a substrate and functional layers located on the substrate. Specifically, the functional layers may include film layers such as array layer, light-emitting layer, encapsulation layer and touch layer.

[0067] Optionally, the display motherboard can be further processed through cutting and other processes to form multiple display panels. For example, the display motherboard can be cut into more than 100 display panels.

[0068] The display motherboard prepared by the above-described display motherboard preparation method has the following advantages: the glass substrate 10 and the display motherboard 20 to be processed are cut by the cutting equipment 30, which removes the first edge defect 21 of the display motherboard 20 to be processed and the first part 11 corresponding to the glass substrate 10. This eliminates the influence of the first edge defect 21 on the subsequent laser peeling effect, so that the edges of the formed display motherboard are regular and meet the requirements, thereby improving the preparation yield of the display motherboard.

[0069] Please see Figure 3 The present invention also provides a cutting device 30 for the display motherboard preparation method in any of the above embodiments. The cutting device 30 includes: a stage 32 for supporting and fixing a glass substrate 10 and a display motherboard 20 to be processed, the stage 32 including a bearing surface F; and a cutting head 31, which is disposed opposite to the stage 32. The cutting head 31 can be disposed away from or close to the stage 32, and the cutting head 31 and the stage 32 can move relative to each other along a direction parallel to the bearing surface F.

[0070] The cutting device 30 provided in this embodiment of the invention includes a stage 32 and a cutting head 31. The cutting device 30 is used to cut the glass substrate 10 and the display motherboard 20 to be processed, so as to remove the first edge defect 21 of the display motherboard 20 and the first part 11 corresponding to the glass substrate 10, thereby eliminating the influence of the first edge defect 21 on the subsequent laser peeling effect. Specifically, the first edge defect 21 may be due to the film layer exceeding the substrate boundary due to the actual position of the edge of each process film layer not matching the design position. This results in an over-standard residual film portion formed at the edge of the display motherboard 20. After removing this part, the peeling effect of the laser peeling process can be improved, and the process error tolerance can be increased. Along the direction parallel to the bearing surface F, the cutting head 31 and the stage 32 can move relative to each other, so that the cutting head 31 can cut and remove the first edge defect 21 at different positions, achieving the process goal of stable peeling. It is not necessary to frequently adjust the front-end or current process to eliminate the influence of the first edge defect 21, reducing the risk of process change and improving the preparation yield of the display motherboard.

[0071] In this embodiment, the cutting head 31 can be positioned away from or close to the stage 32. That is, the cutting head 31 can be close to the carrier to cut the glass substrate 10 and the display motherboard 20 to be processed. After the cutting is completed, the cutting head 31 can move away from the stage 32 to facilitate the removal of the glass substrate 10 and the display motherboard 20 to be processed.

[0072] In some alternative embodiments, the cutting head 31 includes a laser cutting head 31 or a metal blade cutting head 31.

[0073] In this embodiment, the cutting head 31 can be a laser cutting head 31. Laser cutting can generate an extremely fine and concentrated beam of light, resulting in high cutting precision. This facilitates precise cutting and removal of the first edge defect 21, avoiding any impact on the normal areas of the glass substrate 10 and the display motherboard 20 to be processed. Of course, the cutting head 31 can also be other precision cutting tools, such as a metal blade cutting head 31, as long as the required cutting precision is met.

[0074] Optionally, the laser cutting head 31 and the laser energy adjustment unit are electrically connected. In this embodiment, a laser can be used to cut the glass substrate 10 and the display motherboard 20 to be processed. The laser energy adjustment unit can adjust the energy of the laser cutting head 31 to precisely control the cutting depth and improve the cutting accuracy.

[0075] Optionally, the cutting device 30 includes at least two cutting heads 31. It is understood that the more laser cutting heads 31 working at the same time, the higher the corresponding working efficiency. Of course, the number of laser cutting heads 31 should not be too many. Too many will lead to excessive costs, and interference between the laser cutting heads 31 is also likely. Optionally, the cutting device 30 includes two, three or four laser cutting heads 31.

[0076] Please see Figure 3 Optionally, the cutting device 30 also includes a fixed frame 35 and a first moving power unit 36 ​​disposed on the fixed frame 35. The first moving power unit 36 ​​is connected to the cutting head 31 to drive the cutting head 31 to move along the fixed frame 35. The fixed frame 35 can specifically adopt the structure of a gantry frame, and the first moving power unit 36 ​​can be a servo motor.

[0077] Optionally, the cutting device 30 further includes a first rotating power unit connected to the stage 32 to drive the stage 32 to rotate in a direction parallel to the bearing surface F, thereby correspondingly driving the glass substrate 10 and the display motherboard 20 to be processed to rotate, so that the cutting head 31 can cut different positions of the glass substrate 10 and the display motherboard 20 to be processed. The first rotating power unit can be in the form of a servo motor.

[0078] Please see Figure 3 Optionally, the cutting device 30 also includes a dust collection assembly 33, which is mounted on the platform 32.

[0079] It is understandable that when the glass substrate 10 and the display motherboard 20 to be processed are cut by the cutting head 31, the directly cut part of the glass substrate 10 and the display motherboard 20 to be processed will generate dust and other foreign objects. These foreign objects may fall on the display motherboard 20 to be processed, affecting the cleanliness of the display motherboard 20. In this embodiment, a dust collection component 33 can be used to adsorb and collect the dust and other foreign objects generated by cutting, thereby reducing the impact of the dust after cutting on the foreign object yield of the display motherboard 20 to be processed.

[0080] Optionally, the dust collection component 33 includes a vacuum cleaner, the dust collection port of which is located on the bearing surface F. The vacuum cleaner creates a vacuum environment by using an electric fan and uses the air pressure difference to collect dust. The vacuum cleaner has strong suction and a high-efficiency filtration system, which can more effectively capture small particles and has stronger cleaning ability. It can quickly remove the dust generated during cutting. The dust collection port of the vacuum cleaner is located on the bearing surface F to facilitate the removal of dust falling on the stage 32. A protective net can be installed at the dust collection port to avoid affecting the glass substrate 10 and the display motherboard 20 to be processed.

[0081] Please see Figure 3In some optional embodiments, the cutting device 30 further includes an alignment component 34 for positioning and aligning the display motherboard 20 to be processed;

[0082] It should be noted that alignment marks are usually provided on the display motherboard 20 to be processed. The alignment component 34 can obtain the position of the alignment marks on the display motherboard 20 to be processed through image acquisition elements such as cameras, thereby determining the position of the display motherboard 20 to be processed. Then, based on the actual position of the display motherboard 20 to be processed and the alignment result, the display motherboard 20 to be processed is accurately placed on the bearing surface F of the stage 32.

[0083] The alignment component 34 can be located at the four corners of the stage 32 to avoid affecting the placement of the glass substrate 10 and the display motherboard 20 to be processed.

[0084] Optionally, the alignment component 34 includes an image analysis and processing unit and an image acquisition unit. The image analysis and processing unit is used to analyze the image acquired by the image acquisition unit, which includes the alignment mark of the display motherboard 20 to be processed, to determine the position of the display motherboard 20 to be processed, so that the display motherboard 20 to be processed is accurately placed on the bearing surface F of the stage 32.

[0085] Optionally, the image acquisition unit includes a camera.

[0086] The above are merely specific embodiments of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.

[0087] It should also be noted that the exemplary embodiments mentioned in this application describe methods or systems based on a series of steps or apparatus. However, this application is not limited to the order of the above steps; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

Claims

1. A method for preparing a display master plate, characterized in that, include: A glass substrate is provided, and a display motherboard to be processed is formed on one side of the glass substrate. The display motherboard to be processed includes a central region and an edge region disposed at least partially around the central region. In the edge region, the display motherboard to be processed includes a first edge defect portion, and the glass substrate includes a first portion covered by the first edge defect portion. The glass substrate and the display motherboard to be processed are placed on the support surface of the stage of the cutting equipment, and the cutting head in the cutting equipment is used to cut the glass substrate and the display motherboard to be processed to remove the first edge defect portion of the display motherboard to be processed and the corresponding first portion of the glass substrate. The cutting head and the stage are arranged opposite to each other. The cutting head can be arranged away from or close to the stage, and the cutting head and the stage can move relative to each other in a direction parallel to the support surface. The display motherboard to be processed and the glass substrate are separated by a laser peeling process.

2. The method for preparing a display master board according to claim 1, characterized in that, Between the steps of placing the glass substrate and the display motherboard to be processed on the support surface of the stage of the cutting equipment, and cutting the glass substrate and the display motherboard to be processed using the cutting head in the cutting equipment to remove the first edge defect portion of the display motherboard to be processed and the corresponding first portion of the glass substrate, and the step of peeling the display motherboard to be processed and the glass substrate together using a laser peeling process, the method further includes: A first protective layer is formed on the side of the display motherboard to be processed that is away from the glass substrate.

3. The method for preparing a display master board according to claim 1, characterized in that, In the step of providing a glass substrate and forming a display motherboard to be processed on one side of the glass substrate, the display motherboard to be processed including a central region and an edge region at least partially surrounding the central region, the edge region of the display motherboard to be processed including a first edge defect portion, and the glass substrate including a first portion covered by the first edge defect portion: The display motherboard to be processed includes a substrate and a functional layer disposed on the side of the substrate opposite to the glass substrate.

4. The method for preparing a display master board according to claim 1, characterized in that, The step of placing the glass substrate and the display motherboard to be processed on the support surface of the stage of the cutting equipment, and using the cutting head in the cutting equipment to cut the glass substrate and the display motherboard to be processed to remove the first edge defect portion of the display motherboard to be processed and the corresponding first portion of the glass substrate, wherein the cutting head and the stage are arranged opposite to each other, the cutting head can be arranged away from or close to the stage, and the cutting head and the stage can move relative to each other in a direction parallel to the support surface, includes: The glass substrate and the display motherboard to be processed are placed on the support surface of the stage of the cutting equipment, and the glass substrate and the display motherboard to be processed are cut by the laser cutting head in the cutting equipment to remove the first edge defect portion of the display motherboard to be processed and the first portion corresponding to the glass substrate. The laser cutting head and the stage are arranged opposite to each other. The laser cutting head can be arranged away from or close to the stage, and the laser cutting head and the stage can move relative to each other in a direction parallel to the support surface. Preferably, at least two laser cutting heads in the cutting equipment are used to simultaneously cut the glass substrate and the display motherboard to be processed.

5. The method for preparing a display master board according to claim 1, characterized in that, The step of placing the glass substrate and the display motherboard to be processed on the support surface of the stage of the cutting equipment, and using the cutting head in the cutting equipment to cut the glass substrate and the display motherboard to be processed to remove the first edge defect portion of the display motherboard to be processed and the corresponding first portion of the glass substrate, wherein the cutting head and the stage are arranged opposite to each other, the cutting head can be arranged away from or close to the stage, and the cutting head and the stage can move relative to each other in a direction parallel to the support surface, includes: After aligning the glass substrate and the display motherboard to be processed using the alignment component in the cutting equipment, the glass substrate and the display motherboard to be processed are placed on the bearing surface of the stage of the cutting equipment according to the alignment result.

6. The method for preparing a display master board according to claim 1, characterized in that, The step of placing the glass substrate and the display motherboard to be processed on the support surface of the stage of the cutting equipment, and using the cutting head in the cutting equipment to cut the glass substrate and the display motherboard to be processed to remove the first edge defect portion of the display motherboard to be processed and the corresponding first portion of the glass substrate, wherein the cutting head and the stage are arranged opposite to each other, the cutting head can be arranged away from or close to the stage, and the cutting head and the stage can move relative to each other in a direction parallel to the support surface, includes: The glass substrate and the display motherboard to be processed are placed on the support surface of the platform of the cutting equipment, and the cutting head in the cutting equipment is used to cut the glass substrate and the display motherboard to be processed to remove the first edge defect portion of the display motherboard to be processed and the first portion corresponding to the glass substrate. At the same time, the dust collection component located on the platform is used to collect dust.

7. A display motherboard, characterized in that, It is prepared by the display master board preparation method according to any one of claims 1 to 6.

8. A cutting device, characterized in that, The cutting equipment used in the method for preparing a display motherboard according to any one of claims 1 to 6 includes: A stage for supporting and fixing a glass substrate and a display motherboard to be processed, the stage including a support surface; The cutting head is disposed opposite to the platform. The cutting head can be disposed away from or close to the platform, and the cutting head and the platform can move relative to each other in a direction parallel to the bearing surface.

9. The cutting device according to claim 8, characterized in that, The cutting head includes a laser cutting head or a metal blade cutting head; Preferably, the laser cutting head and the laser energy adjustment unit are electrically connected; Preferably, the cutting device includes at least two cutting heads; Preferably, the cutting device further includes a fixed frame and a first moving power unit disposed on the fixed frame, the first moving power unit being connected to the cutting head to drive the cutting head to move along the fixed frame; Preferably, the cutting device further includes a first rotating power unit, which is connected to the platform to drive the platform to rotate in a direction parallel to the bearing surface; Preferably, the cutting device further includes a dust collection component, which is disposed on the platform; Preferably, the dust collection assembly includes a vacuum suction component, and the suction port of the vacuum suction component is located on the bearing surface.

10. The cutting device according to claim 8, characterized in that, The cutting equipment further includes an alignment component for positioning and aligning the display motherboard to be processed; preferably, the alignment component includes an image analysis and processing unit and an image acquisition unit; Preferably, the image acquisition unit includes a camera.

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