An evaporation system

Abstract

The present application belongs to the technical field of evaporation equipment, and particularly relates to an evaporation system. The evaporation system comprises an evaporation crucible for heating and sublimating evaporation material, a nozzle arranged on the evaporation crucible, and a laser device arranged opposite to the crucible. The nozzle is used for spraying the sublimated evaporation material outward, and a plurality of nozzles are arranged on the evaporation crucible. The laser device comprises a laser generating mechanism for generating a laser beam, an imaging mechanism, and a control mechanism for controlling the laser generating mechanism and the imaging mechanism. The control mechanism controls the imaging mechanism to shoot at least one nozzle and generate picture information. The imaging mechanism is further used for judging whether the nozzle is blocked according to the picture information and generating a judgment result. When the judgment result is yes, the control mechanism controls the laser generating mechanism to emit a laser beam to the corresponding nozzle, so that the laser beam at least partially melts the evaporation material on the nozzle. The present application can ablate the evaporation material blocking the nozzle by the laser beam, and improves the production efficiency of the evaporation system.

Description

Technical Field

[0001] This invention belongs to the technical field of vapor deposition equipment, and particularly relates to a vapor deposition system. Background Technology

[0002] In the existing manufacturing process of display panels, a vapor deposition process is typically required to deposit film layers. For example, in the manufacturing of organic light-emitting diode (OLED) display panels, the formation of the organic light-emitting film layer depends on the vapor deposition process.

[0003] During the vapor deposition process, the evaporation crucible on the vapor deposition line is heated by electric heating to heat the organic material inside the crucible, causing it to change from a solid state to a gaseous state. The gaseous organic material is then sprayed out of the evaporation crucible through the nozzle on the evaporation crucible and finally condenses onto the glass substrate to form an organic film layer.

[0004] However, when the vaporized organic material overflows from the nozzle, it easily adheres to both the inside and outside of the nozzle due to factors such as the temperature difference between the inside and outside of the evaporation crucible and the material's inherent properties. As the evaporation time increases, the organic material gradually accumulates on the nozzle, eventually causing blockage. Especially when there are multiple nozzles on the same evaporation crucible, blockage in one nozzle will cause a change in the internal pressure of the crucible, thus affecting the normal evaporation process of other nozzles. This situation may lead to uneven thickness distribution of the deposited film on the substrate, affecting the quality and production capacity of the display panel products. Summary of the Invention

[0005] The purpose of this application is to provide a vapor deposition system that addresses the problem of how to avoid nozzle clogging.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0007] In a first aspect, a vapor deposition system is provided, comprising: an evaporation crucible for heating and sublimating a vapor deposition material, a nozzle disposed on the evaporation crucible, and a laser device disposed opposite to the crucible. The nozzle is used to eject the sublimated vapor deposition material outward, and multiple nozzles are disposed on the evaporation crucible. The laser device includes a laser generating mechanism for generating a laser beam, an imaging mechanism, and a control mechanism for controlling the laser generating mechanism and the imaging mechanism. The control mechanism controls the imaging mechanism to capture an image of at least one of the nozzles and generate image information. The imaging mechanism is also used to determine whether any of the nozzles is blocked based on the image information and generate a determination result. When the determination result is yes, the control mechanism controls the laser generating mechanism to emit a laser beam towards the corresponding nozzle, so that the laser beam at least partially melts the vapor deposition material on the nozzle.

[0008] In some embodiments, the vapor deposition system further includes a first moving mechanism for moving the laser device along a first direction.

[0009] In some embodiments, the first moving mechanism includes a first guide rail arranged along a first direction, a first slider slidably disposed on the first guide rail, and a first driver for driving the first slider to slide along the first guide rail. The control mechanism is also used to control the first driver. The laser device further includes a bracket connected to the first slider. The laser generating mechanism, the imaging mechanism, and the control mechanism are all arranged on the bracket.

[0010] In some embodiments, the vapor deposition system further includes a second moving mechanism for moving the first guide rail along a second direction to move the laser device along the second direction, wherein the first direction and the second direction are arranged alternately.

[0011] In some embodiments, the second moving mechanism includes a second guide rail arranged along a second direction, a second slider slidably disposed on the second guide rail, and a second driver for driving the second slider to slide along the second guide rail. The first guide rail is connected to the second slider, and the control mechanism is further used to control the second driver.

[0012] In some embodiments, the nozzles are spaced apart on the same surface of the crucible and spaced apart along the first direction.

[0013] In some embodiments, the vapor deposition system further includes a temperature sensor for monitoring the temperature of the nozzle and generating temperature information, and the control mechanism controls the laser generating mechanism based on the temperature information.

[0014] In some embodiments, the heating temperature range of the laser generating mechanism is 300 to 400 degrees Celsius.

[0015] In some embodiments, the imaging mechanism includes a CCD camera and a processor connected to the CCD camera for analyzing the image information.

[0016] In some embodiments, the laser generating mechanism includes a laser for generating the laser beam and an angle adjuster connected to the laser.

[0017] The beneficial effect of this application is that, when the judgment result is yes, the control mechanism controls the laser generating mechanism to emit a laser beam towards the corresponding nozzle, so that the laser beam at least partially melts the vapor-deposited material on the nozzle. When the laser beam irradiates the blocked nozzle, the heat of the laser beam can be conducted to the vapor-deposited material attached to the nozzle, and the vapor-deposited material melts slowly due to the heat. At the same time, since the evaporation crucible generates gas pressure on the nozzle, when the vapor-deposited material at the nozzle melts to a certain extent, the gas pressure in the evaporation crucible will force open the vapor-deposited material attached to the nozzle, thereby eliminating the blockage of the nozzle. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or exemplary technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram illustrating the principle of the laser device of the vapor deposition system provided in this application moving to the left side of the evaporation crucible;

[0020] Figure 2 This is a schematic diagram illustrating the principle of the laser device of the vapor deposition system provided in this application moving to the right side of the evaporation crucible;

[0021] Figure 3 This is a three-dimensional structural schematic diagram of the evaporation crucible and nozzle provided in another embodiment of this application.

[0022] The following are the labeling elements in the figure:

[0023] 100. Evaporation system; 11. Evaporation crucible; 12. Nozzle; 21. First guide rail; 22. Second guide rail; 201. First moving mechanism; 202. Second moving mechanism; 30. Laser device; 31. Laser beam. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the scope of this application.

[0025] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly or indirectly attached to that other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," etc., indicate orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, and are for ease of description only, not to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0026] To address the issue in existing technologies where the amount of vapor-deposited material at the nozzle continuously increases during the vapor deposition process, potentially leading to a reduction in nozzle diameter or even partial blockage, this technology aims to improve the overall quality of the display panel. This is because such increases can negatively impact the stability of the vapor deposition process and cause uneven material ejection rates, resulting in inconsistent film thickness distribution on the substrate.

[0027] Please see Figures 1 to 3 This application provides a vapor deposition system 100, comprising: an evaporation crucible for heating and sublimating a vapor deposition material, a nozzle 12 disposed on the evaporation crucible, and a laser device 30 disposed opposite to the crucible. The nozzle 12 is used to spray the sublimated vapor deposition material outwards, and multiple nozzles 12 are disposed on the evaporation crucible. It is understood that the vapor deposition material can be Yb (ytterbium), Ag (silver), and / or Mg (magnesium), and can be selected according to actual conditions; no limitation is made here.

[0028] The laser device 30 includes a laser generating mechanism for generating a laser beam 31, an imaging mechanism, and a control mechanism for controlling the laser generating mechanism and the imaging mechanism. The control mechanism controls the imaging mechanism to capture images of at least one of the nozzles 12 and generate image information. The imaging mechanism is also used to determine whether any of the nozzles 12 are blocked based on the image information and generate a judgment result. For example, the imaging mechanism can periodically capture images of each nozzle 12 during the evaporation cycle, such as every five minutes. In one capture, it can capture images of one nozzle 12, two nozzles 12, or more nozzles 12. In this embodiment, the imaging mechanism captures one nozzle 12 at a time, analyzes the image information formed by capturing the nozzles 12, and generates a judgment result based on the analysis results.

[0029] If the judgment result is negative, the control mechanism does not need to control the laser generating mechanism to heat the nozzle 12;

[0030] When the determination result is yes, the control mechanism controls the laser generating mechanism to emit a laser beam 31 towards the corresponding nozzle 12, so that the laser beam 31 at least partially melts the vapor-deposited material on the nozzle 12. It is understood that when the laser beam 31 irradiates the blocked nozzle 12, the heat of the laser beam 31 can be conducted to the vapor-deposited material attached to the nozzle 12, causing the vapor-deposited material to melt slowly. Simultaneously, because the evaporation crucible 11 generates gas pressure on the nozzle 12, when the vapor-deposited material at the nozzle 12 has melted to a certain extent, the gas pressure inside the evaporation crucible 11 will force open the vapor-deposited material attached to the nozzle 12, thereby eliminating the blockage of the nozzle 12.

[0031] Please see Figures 1 to 3 It is understandable that when the nozzle 12 switches from a blocked state to a ventilated state, the laser beam 31 does not need to completely melt the vapor-deposited material adhering to the nozzle 12. It only needs to partially melt the vapor-deposited material, and with the gas pressure inside the evaporation crucible 11, the nozzle 12 can be deblocked. Of course, the laser generating mechanism can also be used to directly and completely melt the vapor-deposited material adhering to the inner wall of the nozzle 12.

[0032] Understandably, in the display manufacturing field, especially in the production of organic light-emitting diodes (OLEDs), vacuum evaporation technology is a key process for achieving high-precision organic thin film deposition. The evaporation crucible 11, as the heating element of the system, primarily functions to heat the solid evaporation material (such as organic light-emitting materials, electron transport materials, or metallic materials) to its sublimation temperature, transforming it into a gaseous material. The evaporation crucible 11 can employ resistance heating or induction heating, with internal temperatures reaching 300-1200℃, selectable depending on the specific material. For example, the sublimation temperature of organic materials is approximately 300℃, while the sublimation of metallic Mg requires a higher temperature (approximately 600-700℃). The evaporation crucible 11 is typically made of high-temperature resistant and corrosion-resistant metals or ceramics, such as tungsten (melting point 3422℃), molybdenum (melting point 2623℃), or alumina (Al2O3, melting point 2072℃), to ensure the structural stability of the evaporation crucible 11 during prolonged high-temperature operation.

[0033] Please see Figures 1 to 3In this embodiment, the evaporation crucible 11 is made of alumina, which has a melting point of 2072°C, enabling it to support medium to high temperature evaporation processes, such as the evaporation of organic materials (e.g., OLED light-emitting layers, sublimation temperature 300-500°C), aluminum (melting point 660°C), or zinc (melting point 420°C). In the resistance heating system, the alumina crucible can operate stably at 1500-1800°C, meeting the requirements of display manufacturing and optical coating. Alumina exhibits strong resistance to acids, alkalis, and most metal vapors, and remains stable even against some corrosive gases (such as HF). This characteristic makes it particularly suitable for processes requiring high-purity films, such as OLED light-emitting material deposition, without introducing impurities (impurity content <0.01%) due to crucible reactions.

[0034] Alumina has a density of only 3.95 g / cm³. 3 Alumina is significantly lighter than tungsten and molybdenum; for example, a 1-liter alumina crucible weighs approximately 4 kg. This lightweight characteristic facilitates installation, replacement, and transportation, reducing the overall weight and design complexity of vapor deposition equipment. Alumina also exhibits excellent thermal shock resistance, withstanding rapid heating and cooling above 500°C without cracking. Please refer to [link / reference]. Figures 1 to 3 Optionally, nozzles 12 can be mounted on top of the evaporation crucible 11. Their function is to spray the sublimated gaseous vapor deposition material onto the surface of a substrate (such as a glass or flexible plastic substrate) in a controlled manner to form a uniform functional film layer, such as the light-emitting layer, electron transport layer, or metal electrode layer in an OLED. Multiple nozzles 12 can be designed, typically arranged linearly or in a two-dimensional array along the length of the evaporation crucible 11, with the number ranging from 10 to 100, depending on the substrate size and evaporation rate requirements. For example, the evaporation crucible 11 can be 1.5 meters wide, and the number of nozzles 12 can reach 50-80, with a spacing of 20-30 mm. The nozzle orifice diameter is typically between 0.5-2 mm and can be manufactured using precision machining techniques (such as laser drilling) to ensure the uniformity and directionality of the vapor flow.

[0035] Please see Figures 1 to 3 The laser device 30 enables non-contact declogging of the nozzle 12. Compared with traditional methods for resolving nozzle clogging (such as mechanical scraping, chemical cleaning, or shutdown for replacement), laser cleaning has significant advantages: non-contact operation, high efficiency and speed, and automated control. The laser device 30 can be positioned above or to the side of the evaporation crucible 11, opposite the nozzle 12, with an adjustable distance (e.g., 50-200mm) to adapt to different process requirements. In this embodiment, the laser device 30 is located on the side of the evaporation crucible 11.

[0036] Please see Figures 1 to 3The imaging mechanism is used to detect the clogging status of nozzle 12 and provide a basis for assessment. The imaging mechanism typically includes a high-resolution CCD camera (5 to 20 million pixels), an infrared sensor, or a microscope lens with a resolution down to the micrometer level (e.g., 5 μm), suitable for capturing minute changes on the surface of nozzle 12. The imaging mechanism can be equipped with a light source (such as an LED ring light or infrared light) to enhance image contrast, especially under low-light conditions in a vacuum environment. The imaging mechanism operates through timed scanning or trigger modes, capturing images of a single nozzle 12 at a time and generating digital image data. Image processing algorithms (such as edge detection, grayscale analysis, or machine learning models) analyze image features, such as brightness variations in the nozzle 12 aperture or the contours of deposits. If an anomaly is detected (e.g., aperture reduction of more than 50%), it is determined to be clogged, and a "yes / no" judgment is generated.

[0037] Please see Figures 1 to 3 In some embodiments, the vapor deposition system 100 further includes a first moving mechanism 201, which is used to move the laser device 30 along a first direction. In this embodiment, the first direction is a horizontal direction, which can be represented as X.

[0038] Optionally, the introduction of the first moving mechanism 201 enables the laser device 30 to have horizontal mobility, ensuring that it can cover the multiple nozzles 12 arranged along the first direction on the evaporation crucible 11. In the evaporation system 100, the nozzles 12 are typically arranged at intervals along the length of the evaporation crucible 11, with the spacing determined by the process design. For example, the length of the evaporation crucible 11 may be 2 meters, the nozzle spacing may be 25 mm, and the total number may reach 80. The first moving mechanism 201 realizes the horizontal movement of the laser device 30 through a linear motion platform. The movement range is typically matched with the length of the evaporation crucible 11 (e.g., 2-2.5 meters), and the positioning accuracy can reach ±0.01 mm, ensuring that the laser beam 31 is aligned with the center of the nozzles 12.

[0039] Please see Figures 1 to 3 The moving speed and acceleration of the first moving mechanism 201 can be determined according to the actual situation. For example, if there are a total of 50 nozzles 12 with a spacing of 40mm and a moving range of 2 meters, and if it is required to complete the scanning of all nozzles 12 within 10 seconds, the average speed needs to reach 200mm / s, and the acceleration may be 500mm / s. 2 In addition, the first moving mechanism 201 has a quick reset function, which allows it to quickly return to its initial position after completing one cleaning operation, preparing it for the next task.

[0040] Please see Figures 1 to 3 Optionally, the first moving mechanism 201 can be adapted to a vacuum environment (10 -4 Up to 10 -6Pa) and high temperature conditions. The first moving mechanism 201 may be equipped with a dust cover or vacuum seal to prevent vapor deposition of the vapor-deposited material, thereby extending its service life. The first moving mechanism 201 may also integrate a vibration damping device to reduce mechanical vibration during movement by means of springs or dampers, ensuring the stability of the laser device 30 during high-speed movement (e.g., 50 mm / s).

[0041] Please see Figures 1 to 3 In some embodiments, the first moving mechanism 201 includes a first guide rail 21 arranged along a first direction, a first slider slidably disposed on the first guide rail 21, and a first driver for driving the first slider to slide along the first guide rail 21. The control mechanism is also used to control the first driver. The laser device 30 also includes a bracket connected to the first slider. The laser generating mechanism, the imaging mechanism, and the control mechanism are all arranged on the bracket.

[0042] Please see Figures 1 to 3 Optionally, the first guide rail 21 is the core support structure of the first moving mechanism 201. It can be a linear guide rail, fixed to the main frame of the vapor deposition system 100 in the horizontal direction (first direction). The first guide rail 21 can be a crossed roller guide rail or a ball guide rail. Crossed roller guide rails have high rigidity and low friction characteristics, making them suitable for high-load applications; ball guide rails are less expensive and suitable for medium-precision requirements. The length of the first guide rail 21 is designed according to the size of the evaporation crucible 11. For example, in an evaporation crucible 11 that is 2 meters wide, the guide rail length can be 2.2 meters to cover all nozzles 12 with a margin. The surface of the first guide rail 21 may be hardened (such as carburizing or nitriding) to a hardness of HRC60 or higher, providing excellent corrosion resistance and high-temperature resistance to avoid volatile contamination in a vacuum environment and ensure wear resistance and long-term stability.

[0043] Please see Figures 1 to 3 The first slider is slidably mounted on the first guide rail 21 and can incorporate precision ball bearings or rollers to ensure low friction (coefficient of friction <0.01) and high stability. The first slider can be made of aluminum alloy or stainless steel, with a polished or coated surface (such as DLC diamond-like carbon coating) to reduce wear and improve corrosion resistance. The slider size must match the weight and volume of the laser device 30. For example, if the total weight of the laser device 30 is 5 kg, the slider's load-bearing capacity may be designed to be above 10 kg to ensure safety. The fit accuracy between the first slider and the guide rail can reach the micrometer level (e.g., ±5 μm) to meet the high requirements of laser alignment.

[0044] Please see Figures 1 to 3The first driver is the power source for the moving mechanism and can be an electric motor, commonly including stepper motors, brushless DC motors, or servo motors. Stepper motors are known for their low cost and simple control, with a step resolution of 0.01mm, but their dynamic response is relatively slow; servo motors, on the other hand, offer higher precision (position error <0.001mm) and faster response (acceleration up to 1000mm / s²). 2 Suitable for high-performance applications. In vacuum environments, the servo motor may employ a brushless design to avoid brush wear and contamination. The motor housing may be equipped with heat sinks or water-cooling jackets to maintain an operating temperature below 80°C. The first driver can drive the first slider via a transmission system, such as a ball screw (5mm pitch, efficiency >90%) to convert rotary motion into linear motion, or a synchronous belt (20mm bandwidth, tensile strength >500N) to achieve high-speed transmission.

[0045] The control mechanism can be connected to the first driver via cable or wireless signal (such as a Wi-Fi module). After receiving the positioning information from the imaging mechanism, it calculates the target position of the first slider and sends a drive command. For example, if the imaging mechanism detects that the 20th nozzle 12 is blocked, the control mechanism will drive the first slider to move to that position at a speed of 100 mm / s, with a positioning time of approximately 8 seconds. The bracket, serving as the carrier of the laser device 30, connects to the first slider. The bracket is typically a rigid frame structure, which can be made of welded aluminum alloy or processed from carbon fiber composite materials to balance lightweight and strength. The laser generating mechanism, imaging mechanism, and control mechanism are mounted on the bracket, allowing for a reasonable layout. For example, the laser generating mechanism can be located at the bottom of the bracket to be close to the nozzle 12, and the imaging mechanism can be located at the top of the bracket to obtain the best field of view.

[0046] Please see Figures 1 to 3 In some embodiments, the support can integrate a cooling system to reduce the temperature of the laser generating mechanism and the control mechanism by circulating coolant (such as deionized water at a flow rate of 1 L / min), ensuring stability during long-term operation.

[0047] In some embodiments, the vapor deposition system 100 further includes a second moving mechanism 202, which is used to move the first guide rail 21 along a second direction (vertical direction) so that the laser device 30 moves along the second direction. The first direction and the second direction are arranged alternately. In this embodiment, the first direction is perpendicular to the second direction, and the second direction can be represented as the Y direction.

[0048] Please see Figures 1 to 3Understandably, the second moving mechanism 202 enables the laser device 30 to move in two dimensions. The first direction (horizontal) and the second direction (vertical) are typically at a 90-degree angle, forming a motion system similar to an XY platform. This allows the laser device 30 to horizontally cover multiple nozzles 12 while vertically adjusting its height to optimize the focal length of the laser beam 31 or adapt to different evaporation crucible 11 heights. For example, during the vapor deposition process, the height of the nozzles 12 may vary due to machining tolerances or installation differences (e.g., ±5mm). The second moving mechanism 202 can adjust the laser device 30 to the optimal working distance (e.g., 50-100mm) to ensure that the laser beam 31 is focused on the blocked area.

[0049] Please see Figures 1 to 3 The moving speed and load capacity of the second moving mechanism 202 also need to be matched with the laser device 30. For example, if the total weight of the laser device 30 is 5kg and the total weight of the first guide rail 21 and the first slider is 10kg, then the second moving mechanism 202 needs to support a load of at least 15kg and the moving speed range can be 20-50mm / s, which is sufficient to meet the needs of rapid adjustment.

[0050] Please see Figures 1 to 3 In some embodiments, the second moving mechanism 202 may integrate a height sensor (such as a laser rangefinder with a resolution of 0.01 mm) to monitor the distance between the laser device 30 and the nozzle 12 in real time and feed it back to the control mechanism for closed-loop adjustment.

[0051] In some embodiments, the second moving mechanism 202 includes a second guide rail 22 arranged along a second direction, a second slider slidably disposed on the second guide rail 22, and a second driver for driving the second slider to slide along the second guide rail 22. The first guide rail 21 is connected to the second slider, and the control mechanism is also used to control the second driver.

[0052] Please see Figures 1 to 3 Optionally, the second guide rail 22 can be a ball bearing guide rail or a linear bearing guide rail, and its length can be selected according to actual needs. For example, in a system where the height of the evaporation crucible 11 varies by 30 mm, the length of the second guide rail 22 may be 50-100 mm. The material of the second guide rail 22 can be high-strength steel (such as 40Cr, hardness HRC50) or aluminum alloy (7075-T6), and the surface can be anodized or nitrided to resist corrosion and high-temperature oxidation in a vacuum environment.

[0053] The second slider is slidably mounted on the second guide rail 22. It may contain built-in ball bearings to ensure low friction (friction force <5N) and high load capacity (load capacity >20kg). The second slider is connected to the first guide rail 21 by bolts, welding, or snap-fit, forming a "T" or "L" shaped motion structure. A shock-absorbing pad (such as a 2mm thick rubber pad) can be added at the connection point to absorb vibration. The smooth sliding of the second slider is crucial for the vapor deposition system 100. Preloaded ball bearings (preload force 10-20N) can reduce gaps and ensure a movement accuracy of ±0.02mm. In a vacuum environment, the second slider may use self-lubricating materials (such as a PTFE coating) or dry lubricants to avoid the evaporation and contamination of traditional lubricating oils.

[0054] Please see Figures 1 to 3 The second actuator is similar to the first actuator and can be a servo motor, linear motor, or pneumatic actuator. Linear motors feature zero backlash and high response speed (acceleration > 2000 mm / s²). 2 The advantages of the first drive make it suitable for high-precision fine-tuning; the servo motor is driven by a ball screw (2mm pitch) or rack and pinion, offering better cost-effectiveness. In a vacuum environment, the second drive can be oil-free and may be equipped with magnetic coupling drive or a vacuum-sealed motor to prevent gas leakage. The power of the second drive can be 50-100W, depending on the load and speed requirements. The movement of the second slider is controlled by a control mechanism, which, in conjunction with the first drive, achieves two-dimensional coordinate positioning.

[0055] The second driver can drive the second slider through a transmission system, such as a ball screw (5mm pitch, >90% efficiency) to convert rotary motion into linear motion, or a synchronous belt (20mm bandwidth, >500N tensile strength) to achieve high-speed transmission.

[0056] Please see Figures 1 to 3 In some embodiments, each of the nozzles 12 is arranged at intervals on the same surface of the evaporation crucible 11 and at intervals along the first direction.

[0057] Optionally, the nozzles 12 are evenly spaced on the upper surface of the evaporation crucible 11 to ensure uniform distribution of the vaporized material onto the substrate surface. For example, the nozzles 12 are mounted on the same plane at the top of the evaporation crucible 11, arranged linearly along a first direction (horizontal direction), with a spacing of 5-50 mm, determined by the substrate size and evaporation rate. For instance, if the evaporation crucible 11 is 2 meters long, the number of nozzles 12 can be 60, with an average spacing of approximately 33 mm, forming a uniform line source effect. The outlet of the nozzles 12 can be a circular hole (1 mm in diameter), a rectangular groove (1 mm × 5 mm), or a conical structure (2 mm inlet, 0.5 mm outlet) to ensure stable flow of the vaporized material.

[0058] Optionally, the nozzle 12 can be made of a high-temperature resistant metal or ceramic, such as molybdenum (temperature resistance 2600℃), tantalum (temperature resistance 3000℃), or zirconium oxide (ZrO2, temperature resistance 2400℃), which has thermal stability and chemical inertness. The nozzle 12 can be manufactured by precision machining (such as electrical discharge machining or laser cutting) with a surface roughness Ra < 0.1 μm to reduce material adhesion.

[0059] Please see Figures 1 to 3 In some embodiments, the vapor deposition system 100 further includes a temperature sensor for monitoring the temperature of the nozzle 12 and generating temperature information, and the control mechanism controls the laser generating mechanism based on the temperature information.

[0060] Optionally, a temperature sensor is used to monitor the temperature of the nozzle 12 in real time to avoid overheating damage during the laser cleaning process. The temperature sensor type can be a thermocouple (e.g., type K, measurement range 0-1300℃), a platinum resistance thermometer (PT100, accuracy ±0.1℃), or an infrared thermometer (response time <0.1s). The sensor can be installed on the bracket of the laser device 30 (10-50mm from the nozzle 12) or directly embedded in the edge of the nozzle 12 (contact measurement). The infrared thermometer operates non-contactly, suitable for vacuum environments, and detects the surface temperature of the nozzle 12 through infrared radiation, generating an analog or digital signal that is transmitted to the control mechanism.

[0061] Optionally, the control mechanism can dynamically adjust the parameters of the laser generating mechanism based on temperature information. For example, if the temperature of the nozzle 12 is close to the material's pyrolysis point (e.g., 350°C) or the safety threshold of the nozzle 12 material (e.g., 1000°C for molybdenum), the control mechanism can reduce the laser power (e.g., from 100W to 50W) or shorten the pulse duration (e.g., from 1ms to 0.5ms) to prevent the nozzle 12 from overheating and deforming.

[0062] Please see Figures 1 to 3 In some embodiments, the temperature sensor can be linked with the imaging mechanism to generate a temperature distribution map of the nozzle 12 using thermal imaging technology, with a resolution of up to 0.05°C. For example, if the temperature in the clogged area of ​​the nozzle 12 is abnormally high (e.g., 50°C higher than the surrounding area), it indicates that the deposit is thick, and the control mechanism can increase the laser power to 150W to accelerate the cleaning process.

[0063] Optionally, the temperature sensor has a relatively high response speed and accuracy. Within 3 seconds of the laser beam 31 cleaning, the temperature can rise rapidly from 200°C to 400°C. The temperature sensor captures the change with a millisecond-level response (e.g., 10ms) and feeds it back to the controller through a PID algorithm.

[0064] Please see Figures 1 to 3In some embodiments, the temperature sensor may be equipped with a calibration module that calibrates monthly using a standard heat source (such as a blackbody furnace) to ensure long-term measurement accuracy (error < ±1°C).

[0065] Please see Figures 1 to 3 In some embodiments, the heating temperature range of the laser generating mechanism is 300 to 400 degrees Celsius, such as 300 degrees Celsius, 310 degrees Celsius, 326 degrees Celsius, 330 degrees Celsius, 360 degrees Celsius, 370 degrees Celsius, 388 degrees Celsius, 392 degrees Celsius, and 400 degrees Celsius. There is no limitation here, and it can be selected according to the actual situation.

[0066] The heating temperature range of the laser generating mechanism can be set according to the physical properties of the vapor deposition material. For example, organic materials commonly used in OLED production, such as Alq3 (sublimation temperature approximately 300°C), CBP (sublimation temperature approximately 350°C), or TPBi (sublimation temperature approximately 320°C), can be effectively melted or vaporized within this range. The laser beam 31 rapidly heats the blocking material to its melting or decomposition point through localized high temperature action. For example, organic matter may decompose into CO2, H2O, and a small amount of carbon residue. The cleaning process is usually completed within 3-5 seconds, much faster than traditional mechanical scraping (which takes several minutes) or chemical cleaning (which takes several hours).

[0067] The selection of the temperature range also needs to balance the heat resistance of the nozzle 12 material. For example, the melting point of the molybdenum nozzle 12 is 2623℃, and that of the tantalum nozzle 12 is 3017℃, both far exceeding 400℃. Therefore, the laser beam 31 will not damage the structure of the nozzle 12 during cleaning. However, if the temperature is too high (e.g., exceeding 1000℃), it may cause microscopic deformation or oxidation on the surface of the nozzle 12. In practical applications, the laser generating mechanism may be equipped with a power regulator (e.g., PWM control, frequency 1-100Hz) to adjust the temperature according to the degree of blockage. For example, a slight blockage (thickness <0.1mm) may only require 300℃ and be completed within 10 seconds; a severe blockage (thickness >0.5mm) may require 400℃ and take 15 seconds.

[0068] Please see Figures 1 to 3 In some embodiments, the laser device 30 may support a temperature preset function, allowing users to input the optimal cleaning temperature (e.g., 380°C for Yb) via a touchscreen or host computer software, thereby improving the adaptability of the vapor deposition system 100 to different materials.

[0069] Please see Figures 1 to 3 In some embodiments, the imaging mechanism includes a CCD camera and a processor connected to the CCD camera for analyzing the image information.

[0070] Optionally, a CCD camera (charge-coupled device camera) is a high-sensitivity imaging device that uses charge-coupled technology to convert light signals into electrical signals, enabling it to capture minute features on the surface of the nozzle 12. The camera's sensor typically employs a high-resolution CCD chip, such as 5 megapixels (2592×1944), 10 megapixels (3856×2764), or even higher up to 20 megapixels (5472×3648), with pixel sizes between 2-5 μm and resolution down to the micrometer level (e.g., 5 μm), sufficient to detect minute changes in the nozzle 12 aperture (0.5-2 mm). The lens system is a key component of the camera, and options include microscope lenses (magnification 5x-50x, working distance 10-50 mm), telecentric lenses (distortion <0.1%, suitable for precise measurements), or zoom lenses (focal length 10-100 mm), with an adjustable field of view (e.g., from 5 mm × 5 mm to 20 mm × 20 mm) to adapt to different nozzle 12 sizes and arrangement densities. The camera is equipped with a light source system that provides uniform and controllable illumination. Light source types include LED ring lights (5-20W power, white or infrared light, wavelength 850nm), coaxial light sources (to reduce shadows), or backlights (to enhance aperture contrast), with adjustable light intensity (100-1000 lux), ensuring clear images even in low-light conditions in a vacuum environment or on highly reflective surfaces (such as the molybdenum nozzle 12). Furthermore, the camera housing is made of high-temperature and vacuum-resistant materials (such as SUS304 stainless steel or 6061-T6 aluminum alloy), achieving an IP65 protection rating and capable of withstanding temperatures up to 10... -6 Stable operation at a vacuum level of Pa and a high temperature of 200℃.

[0071] Please see Figures 1 to 3 Optionally, the processor serves as the data processing center of the imaging facility, responsible for receiving image information generated by the CCD camera and performing real-time analysis. The processor can be an embedded microprocessor or a digital signal processor (DSP), with common models including ARM Cortex-A72 (quad-core, 2GHz), NVIDIA Jetson TX2 (GPU computing power 1.5 TFLOPS), or the TIC66x series (multi-core DSP, suitable for image processing). The processor has 4-16GB of memory and 32-128GB of storage, supports high-speed caching (2MB L2 cache) and multi-tasking parallel processing, and a computing power of up to 1 billion floating-point operations per second (1 GFLOPS), ensuring real-time image analysis (latency <50ms). The processor connects to the CCD camera via a high-speed interface, such as USB 3.0, supporting lossless image transmission.

[0072] Please see Figures 1 to 3 In some embodiments, the laser generating mechanism includes a laser for generating the laser beam 31 and an angle adjuster connected to the laser.

[0073] The laser converts electrical energy into a high-energy laser beam 31. This laser beam 31 acts on the vapor-deposited material clogging the nozzle 12, causing the material to melt. The laser type can include solid-state lasers (e.g., Nd:YAG, wavelength 1.06μm, suitable for metal ablation), gas lasers (e.g., CO2, wavelength 10.6μm, suitable for organic decomposition), or semiconductor lasers (e.g., 808nm, low cost and high efficiency). The laser power range is 50-200W, and it can operate in continuous wave (CW) or pulsed mode (pulse width 0.1-10ms, frequency 1-100Hz). After being shaped by collimating and focusing lenses, the output laser beam 31 has an adjustable spot diameter (0.1-1mm) and an energy density up to 10^6 kilometres per second. 6 W / cm 2 above.

[0074] Please see Figures 1 to 3 The laser can also be equipped with a cooling system, such as water cooling (flow rate 2-5L / min, cooling capacity 500W) or air cooling (air volume 20CFM), to ensure stable temperature (<50℃) during long-term operation (>1000 hours). The housing is made of high-temperature resistant materials (such as aluminum alloy 7075-T6 or stainless steel SUS316), with an IP66 protection rating, capable of withstanding 10... -6 Stable operation at a vacuum level of Pa and a high temperature of 200℃. The laser has excellent beam quality (M 2 <1.2), a flat-top distribution can be achieved by using a beam shaper (such as a homogenizing mirror), which improves heating uniformity.

[0075] Please see Figures 1 to 3 An angle adjuster, mounted on a bracket, is used to adjust the projection angle of the laser to regulate the emission direction of the laser beam 31, ensuring that the laser beam 31 is precisely aligned with the blockage location. For example, if the blockage is located on the inner wall of the nozzle 12, the angle adjuster can tilt the laser beam 31 by 45°, allowing the laser beam 31 to penetrate deep into the nozzle 12; if the blockage occurs on the surface of the nozzle 12, it maintains vertical irradiation. This flexibility allows the laser generating mechanism to cover multiple nozzles 12 (e.g., 80 nozzles 12, covering a range of 2 meters) without frequently moving the entire laser device 30, thus shortening the cleaning cycle.

[0076] The above are merely optional embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A vapor deposition system, characterized in that, include: An evaporation crucible for heating and sublimating a vapor-deposited material, a nozzle disposed on the evaporation crucible, and a laser device disposed opposite to the crucible. The nozzle is used to spray the sublimated vapor-deposited material outward, and multiple nozzles are disposed on the evaporation crucible. The laser device includes a laser generating mechanism for generating a laser beam, an imaging mechanism, and a control mechanism for controlling the laser generating mechanism and the imaging mechanism. The control mechanism controls the imaging mechanism to capture an image of at least one of the nozzles and generate image information. The imaging mechanism is also used to determine whether any nozzle is blocked based on the image information and generate a determination result. When the determination result is yes, the control mechanism controls the laser generating mechanism to emit a laser beam towards the corresponding nozzle so that the laser beam at least partially melts the vapor-deposited material on the nozzle.

2. The vapor deposition system as described in claim 1, characterized in that: The vapor deposition system further includes a first moving mechanism for moving the laser device along a first direction.

3. The vapor deposition system as described in claim 2, characterized in that: The first moving mechanism includes a first guide rail arranged along a first direction, a first slider slidably disposed on the first guide rail, and a first driver for driving the first slider to slide along the first guide rail. The control mechanism is also used to control the first driver. The laser device also includes a bracket connected to the first slider. The laser generating mechanism, the imaging mechanism, and the control mechanism are all arranged on the bracket.

4. The vapor deposition system as described in claim 3, characterized in that: The vapor deposition system further includes a second moving mechanism for moving the first guide rail along a second direction so that the laser device moves along the second direction, wherein the first direction and the second direction are arranged alternately.

5. The vapor deposition system as described in claim 4, characterized in that: The second moving mechanism includes a second guide rail arranged along a second direction, a second slider slidably disposed on the second guide rail, and a second driver for driving the second slider to slide along the second guide rail. The first guide rail is connected to the second slider, and the control mechanism is also used to control the second driver.

6. The vapor deposition system as described in any one of claims 2-5, characterized in that: The nozzles are arranged at intervals on the same surface of the crucible and at intervals along the first direction.

7. The vapor deposition system according to any one of claims 1-5, characterized in that: The vapor deposition system also includes a temperature sensor, which monitors the temperature of the nozzle and generates temperature information. The control mechanism controls the laser generating mechanism based on the temperature information.

8. The vapor deposition system according to any one of claims 1-5, characterized in that: The heating temperature range of the laser generating mechanism is 300 to 400 degrees Celsius.

9. The vapor deposition system according to any one of claims 1-5, characterized in that: The imaging mechanism includes a CCD camera and a processor connected to the CCD camera for analyzing the image information.

10. The vapor deposition system according to any one of claims 1-5, characterized in that: The laser generating mechanism includes a laser for generating the laser beam and an angle adjuster connected to the laser.

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