Anodizing apparatus and method of adjusting the same

Abstract

The application discloses an anodic oxidation equipment and a process adjusting method thereof. The anodic oxidation equipment comprises a box body, a cathode plate, a shielding frame and a driving assembly. A workpiece placing space is arranged in an oxidation tank in the box body. The cathode plate is arranged in the oxidation tank. The shielding frame is arranged in the oxidation tank and is placed along a first direction with the cathode plate. The shielding frame is located between the cathode plate and the workpiece placing space. The shielding frame comprises a fixing frame and a plurality of shielding plates. At least part of the shielding plates is movable relative to the fixing frame. The driving assembly is in transmission connection with the at least part of the shielding plates to adjust the rotation angle of the at least part of the shielding plates. The anodic oxidation equipment of the embodiment of the application drives the shielding plates to rotate relative to the fixing frame through the driving assembly, so that the shielding range of the shielding plates between the workpieces and the cathode plate changes, the current path between the workpieces and the cathode plate at the corresponding positions changes, and then the influence of the current density between the workpieces and the cathode plate at the corresponding positions on the growth rate of the oxidation film can be adjusted.

Description

Technical Field

[0001] This invention relates to the field of anodizing technology, and in particular to anodizing equipment and its process adjustment method. Background Technology

[0002] In related technologies, anodizing equipment typically uses graphite as the cathode plate. Graphite suffers from rapid heating and uneven heat generation, leading to significant temperature differences in the electrolyte within the anodizing tank and potentially causing disordered current distribution. This uneven current distribution disrupts the current density distribution around the workpiece, directly affecting the growth rate of the oxide film on its surface. For example, areas with concentrated current exhibit faster oxide film growth, while areas with sparse current show slower growth, resulting in uneven oxide film thickness on the workpiece surface. Therefore, effectively improving the uniformity of the oxide film thickness has become a pressing technical problem. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, one object of this invention is to provide an anodizing apparatus that, by driving a shielding plate to rotate relative to a fixed frame via a drive assembly, changes the shielding range of the shielding plate between the workpiece and the cathode plate. This alters the current path between the workpiece and the cathode plate at the corresponding position, thereby adjusting the influence of the current density between the workpiece and the cathode plate on the oxide film growth rate, thus regulating the oxide film thickness and improving the uniformity of the overall workpiece oxide film thickness within the oxidation tank.

[0004] The present invention also proposes a process adjustment method for the above-mentioned anodizing equipment.

[0005] An anodizing apparatus according to a first aspect of the present invention includes: a housing, wherein an oxidation tank is provided inside the housing, and the oxidation tank has a workpiece placement space; a cathode plate disposed in the oxidation tank; a shielding frame disposed in the oxidation tank and placed along a first direction with the cathode plate, the shielding frame being located between the cathode plate and the workpiece placement space, the shielding frame including a fixing frame and a plurality of shielding plates, the fixing frame being fixed to the housing, the plurality of shielding plates being mounted on the fixing frame, at least some of the shielding plates being movable relative to the fixing frame; and a drive assembly being tractively connected to at least some of the shielding plates to adjust the rotation angle of at least some of the shielding plates, the rotation axis of the shielding plates extending in a vertical direction.

[0006] According to an embodiment of the present invention, the anodizing apparatus includes a housing and a cathode plate. The oxidation tank within the housing has a workpiece placement space, and the cathode plate is disposed within the oxidation tank. The cathode plate serves as an electric field emitting end, and the workpiece acts as the anode. Under the action of an applied current, an oxide film can be generated on the surface of the workpiece. Furthermore, by positioning a shielding frame between the cathode plate and the workpiece placement space, the shielding frame includes a fixed frame and multiple shielding plates. A driving assembly drives at least some of the shielding plates to rotate relative to the fixed frame. This increases the rotation angle of the shielding plates relative to the fixed frame, thereby reducing the projected area of ​​the shielding plates along a first direction and reducing the shielding range of the shielding plates between the corresponding workpiece and the cathode plate. This increases the current path within the area, thereby increasing the... The current density in this region can increase the thickness of the oxide film on the workpiece in this region. Alternatively, the rotation angle of the shielding plate relative to the fixing frame can be reduced to increase the projected area of ​​the shielding plate along the first direction, thereby increasing the shielding range of the shielding plate between the corresponding workpiece and the cathode plate, blocking more current paths, reducing the current density in this region, and thinning the oxide film thickness of the workpiece in this region. By differentially adjusting the rotation angle of at least some shielding plates, the overall current density in the oxidation tank can be better balanced, thereby making the growth rate of the oxide film on the workpiece at different locations in the oxidation tank tend to be consistent, so that the oxide film thickness on the workpiece surface is more uniform, which is beneficial to improving the yield of the workpiece and the versatility of the process.

[0007] In addition, by enabling the drive assembly to rotate at least part of the shielding plate relative to the fixed frame, the shielding range can be changed simply by adjusting the rotation angle of the shielding plate for workpieces of different sizes or shapes, or for different process requirements. This allows for quick adaptation to different production conditions, making the anodizing equipment compatible with workpieces of various sizes and improving the versatility of the anodizing equipment.

[0008] According to some embodiments of the present invention, the fixing frame includes a fixing base and a plurality of mounting rods. The fixing base is fixed to the bottom wall of the oxidation tank, and the plurality of mounting rods are fixed on the fixing base and arranged at intervals along a second direction. The first direction, the second direction, and the up-down direction intersect each other in pairs, and the plurality of shielding plates are rotatably mounted on the plurality of mounting rods respectively.

[0009] According to some embodiments of the present invention, each of the mounting rods is provided with a plurality of shielding plates spaced apart in the vertical direction.

[0010] According to some embodiments of the present invention, each of the shielding plates includes a sleeve and a shielding portion, the sleeve being connected to the shielding portion, and the sleeve being rotatably fitted onto the mounting rod.

[0011] According to some embodiments of the present invention, the driving assembly includes a rotary motor, the output end of which is connected to the sleeve; or, the driving assembly includes an adjusting gear, which is sleeved on the sleeve and fixedly connected to the sleeve; or, the driving assembly includes a rotary motor and an adjusting gear, the rotary motor and the adjusting gear being located at opposite ends of the sleeve in the vertical direction, the output end of the rotary motor being connected to one end of the sleeve in the vertical direction, and the adjusting gear being sleeved on the other end of the sleeve in the vertical direction and fixedly connected to the sleeve.

[0012] According to some embodiments of the present invention, each of the shielding plates is controlled independently.

[0013] According to some embodiments of the present invention, the workpiece placement space is provided with the shielding frame and the cathode plate on both sides along the first direction; and / or, the workpiece placement space is provided with a hanger for mounting the workpiece.

[0014] A process adjustment method for an anodizing apparatus according to a second aspect of the present invention, wherein the anodizing apparatus is an anodizing apparatus according to a first aspect of the present invention, the process adjustment method comprising: Step 1: Construct the position code of the workpiece before oxidation: Generate the position code of the workpiece before oxidation based on the product 2D code of the workpiece and the corresponding hanging rod code; Step 2: Generate film thickness matrix of the oxidized workpiece: Detect the film thickness of the oxide film on the oxidized workpiece, and generate the film thickness matrix based on the workpiece's position code and the film thickness. Step 3: Adjust the rotation angle of the shielding plate: Based on the film thickness matrix diagram in Step 2, analyze and calculate the specific position of the workpiece whose film thickness needs to be adjusted. Calculate the rotation angle of the shielding plate corresponding to the workpiece based on the relationship between the rotation angle of the shielding plate and the film thickness, and control the drive assembly to adjust the rotation angle of the shielding plate at the corresponding position.

[0015] According to the process adjustment method of the anodizing equipment of the present invention, by providing the above-mentioned anodizing equipment, the workpiece position of the area with thicker or thinner film can be determined more accurately, and the rotation angle of the shielding plate at the corresponding position can be adjusted by the drive component to adjust the current density at the corresponding workpiece position more accurately, thereby adjusting the thickness of the oxide film on the workpiece and effectively improving the uniformity of the film thickness of the workpiece.

[0016] According to some embodiments of the present invention, generating a position code for the workpiece before oxidation based on the product 2D code and the corresponding hanger code includes: collecting the product 2D code of the workpiece and the hanger code, hanger code, and fly rod code of the workpiece; binding the product 2D code of the workpiece with the hanger code, hanger code, and fly rod code of the workpiece to generate the position code of the workpiece before oxidation; and / or, the film thickness matrix diagram includes: different film thickness value regions are represented by different colors, and the colors are red, orange, green, blue, and gray in descending order of the film thickness.

[0017] According to some embodiments of the present invention, in step three, the relationship between the rotation angle of the shielding plate and the film thickness satisfies: ; Where δ is the film thickness, K is the Faraday constant coefficient, with a value ranging from 96485 C / mol to 96500 C / mol, J is the current density, t is the oxidation time, η is the current efficiency, and c 液 Where θ is the electrolyte concentration, T is the temperature, θ is the rotation angle of the shielding plate, n is the shielding coefficient, and the value of n ranges from 0.25 to 1, W is the width of the shielding plate in the second direction, S is the distance between the mounting rod and the cathode plate in the first direction, and L is the length of the shielding plate in the vertical direction.

[0018] Additional aspects and advantages of the present invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of an anodizing apparatus according to some embodiments of the present invention; Figure 2 yes Figure 1 A schematic diagram of the anodizing equipment from another angle; Figure 3 yes Figure 1 A schematic diagram of the anodizing equipment from another angle; Figure 4 yes Figure 1 A cross-sectional view of the anodizing equipment in the middle; Figure 5 yes Figure 1 A schematic diagram of the shielding frame in the anodizing equipment; Figure 6 yes Figure 5 A schematic diagram of the shielding frame from another angle; Figure 7 yes Figure 6 Enlarged view of point A in the middle; Figure 8 yes Figure 1 A schematic diagram of the mounting bracket in the anodizing equipment; Figure 9 yes Figure 1 A schematic diagram of a portion of the cathode plate structure in an anodizing device; Figure 10 yes Figure 9 A schematic diagram of a portion of the cathode plate structure from another angle; Figure 11 This is an assembly diagram of a portion of the structure of the shielding frame and a portion of the drive assembly in an anodizing apparatus according to other embodiments of the present invention. Figure 12 yes Figure 11 A schematic diagram of the assembly of a portion of the shielding frame and a portion of the drive assembly from another angle; Figure 13 yes Figure 11 A schematic diagram of the adjusting gear in the drive assembly; Figure 14 yes Figure 11 Enlarged view of point A in the middle; Figure 15 This is a schematic flowchart of a process adjustment method for anodizing equipment according to some embodiments of the present invention; Figure 16 This is a matrix diagram of the film thickness of the workpiece after anodizing equipment treatment before process adjustment; Figure 17 It is a film thickness matrix diagram of the workpiece after being processed by an anodizing equipment with process adjustments according to some embodiments of the present invention.

[0020] Figure label: 100. Anodizing equipment; 10. Box body; 1. Oxidation tank; 11. Workpiece placement space; 12. Hanging rack; 121. Rack body; 122. Hanging branches; 2. Cathode plate; 21. Cathode graphite rod; 22. Support base; 3. Shielding frame; 311. Fixed top plate; 312. Mounting rod; 32. Shielding plate; 321. Sleeve; 322. Shielding part; 4. Drive assembly; 41. Rotary motor; 42. Adjusting gear; 43. Dial; 44. Connecting rod. Detailed Implementation

[0021] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0022] The following is for reference. Figures 1-10 An anodizing apparatus 100 according to an embodiment of the present invention is described.

[0023] Reference Figures 1-4 According to an embodiment of the first aspect of the present invention, an anodizing apparatus 100 includes a housing 10, a cathode plate 2, a shielding frame 3, and a drive assembly 4. The housing 10 is provided with an oxidation tank 1, which has a workpiece placement space 11. The cathode plate 2 is disposed in the oxidation tank 1, and the shielding frame 3 is disposed in the oxidation tank 1 and placed along a first direction (e.g., the e1 direction in the figures) with the cathode plate 2. The shielding frame 3 is located between the cathode plate 2 and the workpiece placement space 11. The shielding frame 3 includes a fixed frame and a plurality of shielding plates 32. The fixed frame is fixed to the housing 10, and the plurality of shielding plates 32 are mounted on the fixed frame. At least some of the shielding plates 32 are movable relative to the fixed frame. The drive assembly 4 is connected to at least some of the shielding plates 32 to adjust the rotation angle of at least some of the shielding plates 32. The rotation axis of the shielding plates 32 extends in the vertical direction, and the first direction intersects with the vertical direction.

[0024] The ability of at least some of the shielding panels 32 to move relative to the fixed frame can include the following situations: for example, some of the shielding panels 32 can move relative to the fixed frame; or, for example, all of the shielding panels 32 can move relative to the fixed frame.

[0025] It should be explained that the workpiece placement space 11 refers to the space that accommodates and places the workpiece.

[0026] Anodizing refers to the electrochemical oxidation of metals or alloys. Aluminum and its alloys form an oxide film on a workpiece under the action of an applied current in a suitable electrolyte and under specific process conditions.

[0027] The anodizing equipment 100 includes a housing 10 and a cathode plate 2. The housing 10 is provided with an oxidation tank 1, which has a workpiece placement space 11. The cathode plate 2 is located in the oxidation tank 1 and can be used as an electric field emitting end. At this time, the workpiece in the workpiece placement space 11 is the anode, and an oxidation reaction occurs under the action of an applied current to form an oxide film on the workpiece.

[0028] By positioning the shielding frame 3 between the cathode plate 2 and the workpiece placement space 11, the shielding frame 3 includes a fixed frame and multiple shielding plates 32. The fixed frame can support and fix the shielding plates 32, making the shielding plates 32 relatively stable in the oxidation tank 1. Since the shielding frame 3 is located between the cathode plate 2 and the workpiece placement space 11, the shielding frame 32 can block the current path between the corresponding workpiece and the cathode plate to a certain extent. This can reduce the current density at the corresponding workpiece, thereby slowing down the oxide film growth rate at the corresponding workpiece and avoiding the problem of excessive local current density on the workpiece surface leading to excessive local oxide film thickness.

[0029] For example, a shielding plate 32 is set in the area with high current density between the workpiece and the cathode plate 2. Since the anodic oxidation reaction rate on the workpiece surface is faster in the area with high current density, the oxide film growth rate is also faster, resulting in a thicker oxide film. The shielding plate 32 can block the current path in this area, reduce the local current density, slow down the growth rate of the oxide film in this area, and reduce the thickness of the oxide film in this area. This can better balance the overall current density in the oxidation tank 1, so that the oxide film thickness on the workpiece surface is more uniform, which is beneficial to improving the yield of the workpiece and the versatility of the process.

[0030] By driving at least part of the shielding plate 32 to rotate relative to the fixed frame with the drive assembly 4 and the rotation axis of the shielding plate 32 extending in the vertical direction, the shielding plate 32 can rotate at a certain angle relative to the fixed frame. This allows the projected area of ​​the shielding plate 32 along the first direction to change the shielding range of the shielding plate 32 between the workpiece and the cathode plate 2. This allows the current density between the workpiece and the cathode plate 2 at the corresponding position to be adjusted, thereby adjusting the growth rate of the oxide film on the workpiece and thus adjusting the thickness of the oxide film on the workpiece.

[0031] For example, in areas where the local current density is low, resulting in a thinner workpiece film, the drive assembly 4 drives the shielding plate 32 to rotate, increasing the rotation angle of the shielding plate 32 relative to the fixed frame. This reduces the projected area of ​​the shielding plate 32 along the first direction, decreasing the shielding range of the shielding plate 32 between the corresponding workpiece and the cathode plate 2. This increases the current path in this area, effectively increasing the current density and thus effectively thickening the workpiece surface film. Conversely, in areas where the local current density is high, resulting in a thicker workpiece film, the drive assembly 4 drives the shielding plate 32 to rotate, decreasing the rotation angle of the shielding plate 32 relative to the fixed frame. This increases the projected area of ​​the shielding plate 32 along the first direction, increasing the shielding range of the shielding plate 32 between the corresponding workpiece and the cathode plate 2. This shields the current path in this area, reducing the current density and slowing down the growth rate of the oxide film on the corresponding workpiece, thus effectively thinning the oxide film thickness.

[0032] By driving at least part of the shielding plate 32 to rotate relative to the fixed frame and adjusting the rotation angle of the shielding plate 32, the shielding range of the shielding plate 32 between the workpiece and the cathode plate 2 can be adjusted to specifically adjust the current density in the oxidation tank 1. This can better balance the current density in the oxidation tank 1, making the growth rate of the oxide film on the workpiece surface tend to be consistent, thereby improving the uniformity of the oxide film thickness and improving the consistency of product processing and the yield rate.

[0033] By driving at least a portion of the shielding plate 32 to rotate relative to the fixed frame using the drive assembly 4, stepless adjustment of the rotation angle of the shielding plate 32 relative to the fixed frame can be achieved, thereby enabling fine-tuning of the projected area of ​​the shielding plate 32 along the first direction. For example, compared to translational or snap-fit ​​adjustment, the rotary type can continuously change the projected area of ​​the shielding plate 32 along the first direction, thereby enabling stepless adjustment of the shielding range of the shielding plate 32 between the workpiece and the cathode plate 2. This facilitates fine-tuning of the current density within the oxidation tank 1.

[0034] For example, the shielding frame 3 is made of acid-resistant insulating material, which can resist the corrosion of acidic electrolyte, extend its service life, and also give the shielding frame 3 good insulation performance, so as to avoid the shielding frame 3 itself generating an electrolytic reaction that would interfere with the electric field in the oxidation tank 1.

[0035] Furthermore, by including a fixed frame and multiple shielding plates 32 in the shielding frame 3, with at least some shielding plates 32 movable relative to the fixed frame, the shielding range of the shielding plates 32 between the corresponding workpiece and the cathode plate 2 can be changed simply by adjusting the rotation angle of the shielding plates 32 to accommodate workpieces of different sizes or shapes, or different process requirements. This allows for rapid adaptation to different production conditions without the need to replace the entire shielding frame 3, effectively shortening tooling changeover time, reducing production costs, and enabling the anodizing equipment 100 to be compatible with workpieces of various sizes, thus improving the versatility of the anodizing equipment 100. For example, this allows the shielding frame 3 to be well-compatible with existing anodizing production lines, resulting in low facility investment and effectively reducing manufacturing costs.

[0036] In the description of this invention, "a plurality of" means two or more.

[0037] According to an embodiment of the present invention, the anodizing equipment 100 includes a housing 10 and a cathode plate 2. The oxidation tank 1 within the housing 10 has a workpiece placement space 11, and the cathode plate 2 is disposed within the oxidation tank 1. The cathode plate 2 can serve as an electric field emitting end, and the workpiece is the anode. Under the action of an applied current, an oxide film can be generated on the surface of the workpiece. Furthermore, by positioning a shielding frame 3 between the cathode plate 2 and the workpiece placement space 11, the shielding frame 3 includes a fixed frame and multiple shielding plates 32. A driving assembly 4 drives at least some of the shielding plates 32 to rotate relative to the fixed frame, thereby increasing the rotation angle of the shielding plates 32 relative to the fixed frame to reduce the projected area of ​​the shielding plates 32 along the first direction, thus reducing the shielding range of the shielding plates 32 between the corresponding workpiece and the cathode plate 2, so that the area... Increasing the number of internal current paths increases the current density in this area, thereby thickening the oxide film thickness of the workpiece in this area. Alternatively, reducing the rotation angle of the shielding plate 32 relative to the fixed frame increases the projected area of ​​the shielding plate 32 along the first direction, thereby increasing the shielding range of the shielding plate 32 between the corresponding workpiece and the cathode plate 2, blocking more current paths, reducing the current density in this area, and thinning the oxide film thickness of the workpiece in this area. By differentially adjusting the rotation angle of at least some of the shielding plates 32, the overall current density in the oxidation tank 1 can be better balanced, thereby making the growth rate of the oxide film of the workpiece at different positions in the oxidation tank 1 more consistent, so that the oxide film thickness on the workpiece surface is more uniform, which is beneficial to improving the yield of the workpiece and the versatility of the process.

[0038] In addition, by driving the drive assembly 4 to rotate at least part of the shielding plate 32 relative to the fixed frame, the shielding range can be changed simply by adjusting the rotation angle of the shielding plate 32 for workpieces of different sizes or shapes, or for different process requirements. This allows for quick adaptation to different production conditions, making the anodizing equipment 100 compatible with workpieces of various sizes and improving the versatility of the anodizing equipment 100.

[0039] Reference Figures 3-7 According to some embodiments of the present invention, the fixing frame includes a fixing base and a plurality of mounting rods 312. The fixing base is fixed to the bottom wall of the oxidation tank 1, and the plurality of mounting rods 312 are fixed on the fixing base and arranged at intervals along a second direction (for example, the e2 direction in the figure). The first direction, the second direction and the up and down direction intersect each other. A plurality of shielding plates 32 are rotatably mounted on the plurality of mounting rods 312 respectively.

[0040] By including a fixed base and multiple mounting rods 312 in the fixing frame, the bottom wall of the oxidation tank 1 can provide stable support for the fixed base, and the fixed base can provide stable support for the mounting rods 312, so that the shielding plate 32 is relatively stably located in the oxidation tank 1. Furthermore, by arranging the multiple mounting rods 312 at intervals along the second direction and rotating the multiple shielding plates 32 on the multiple mounting rods 312 respectively, the multiple shielding plates 32 can be arranged at intervals along the second direction, and the rotation angle of each shielding plate 32 can be adjusted independently, so that the overall projected area of ​​the shielding frame 3 in the first direction is larger, which can better adjust the current density in a larger range within the oxidation tank 1, thereby effectively improving the film thickness deviation caused by excessive or insufficient local current density, and thus improving the uniformity of the overall film thickness of the workpiece oxide film.

[0041] For example, the cathode plate 2 includes a support base 22 and a plurality of cathode graphite rods 21. The support base 22 includes two that are arranged opposite each other in the vertical direction. One of the support bases 22 is fixed to the bottom wall of the oxidation tank 1. The plurality of cathode graphite rods 21 are fixed to the support base 22 and arranged at intervals in the second direction. The support base 22 can provide stable support for the cathode graphite rods 21. By fixing one of the support bases 22 to the bottom wall of the oxidation tank 1, the cathode graphite rods 21 can be fixed more stably in the oxidation tank 1.

[0042] Reference Figures 3-7 According to some embodiments of the present invention, each mounting rod 312 is provided with a plurality of shielding plates 32 spaced apart in the vertical direction, which can make the overall projected area of ​​the shielding frame 3 in the first direction larger, so as to better adjust the current density in a larger range in the oxidation tank 1, thereby effectively improving the film thickness deviation caused by excessive or insufficient local current density, and thus improving the uniformity of the overall film thickness of the workpiece oxide film.

[0043] For example, the number of shielding plates 32 spaced along the vertical direction on each mounting rod 312 can be adjusted according to the actual height of the oxidation tank 1 in the vertical direction, so that the overall height of the shielding frame 3 in the vertical direction is not less than the overall height of the workpiece in the vertical direction, so that the projected area of ​​the shielding plate 3 along the first direction can cover the entire workpiece as much as possible, thereby realizing the adjustment of the current density of the workpiece in the vertical direction by the shielding plate 32, avoiding the phenomenon that the local current density of the workpiece located at the top or bottom is too high due to not being shielded by the shielding plate 32, resulting in excessive film thickness, and further improving the uniformity of the overall oxide film thickness of the workpiece.

[0044] For example, the number of shielding plates 32 spaced along the vertical direction on each mounting rod 312 can be 3, 4, 5, 6, etc., and of course, the number of shielding plates 32 is not limited to this.

[0045] In some embodiments, each mounting rod 312 is provided with three shielding plates 32 spaced apart in the vertical direction. Multiple workpieces are hung on the hanger 12. The hanger 12 includes a frame body 121 and ten hanging branches 122. The ten hanging branches 122 are fixed to the frame body 121 and are respectively located on opposite sides of the frame body 121 along the second direction. Five hanging branches 122 are provided on the middle side of the frame body 121 along the second direction. The five hanging branches 122 are arranged at intervals in the vertical direction. By providing each mounting rod 312 with three shielding plates 32 spaced apart in the vertical direction, the workpieces are effectively protected. The three shielding plates 32 allow the shielding frame 3 to effectively cover the workpieces hanging on the five hanging branches 122 arranged in the vertical direction. By driving the corresponding shielding plate 32 to rotate and adjusting the rotation angle of the corresponding shielding plate 32, the current density of the workpieces on the hanging branches 122 at different heights on the same hanging frame 12 can be adjusted. This improves the film thickness deviation caused by excessive or insufficient local current density, thereby enhancing the uniformity of the overall oxide film thickness of the workpieces on the same hanging frame 12.

[0046] Reference Figures 3-7 According to some embodiments of the present invention, each shielding plate 32 includes a sleeve 321 and a shielding part 322, the sleeve 321 is connected to the shielding part 322, and the sleeve 321 is rotatably sleeved on the mounting rod 312.

[0047] By making each shielding plate 32 include a sleeve 321 and a shielding part 322, with the sleeve 321 rotatably sleeved on the mounting rod 312 and connected to the shielding part 322, the sleeve 321 can serve as a carrier for the shielding part 322, providing stable support for the shielding part 322; furthermore, the sleeve 321 sleeved on the mounting rod 312 can increase the contact area between the sleeve 321 and the mounting rod 312, and can also provide circumferential limiting for the sleeve 321. Thus, under the conditions of electrolyte flushing or fluid disturbance in the oxidation tank 1, the shielding part 322 is less likely to shift, and can be positioned more stably in the oxidation tank 1.

[0048] According to some embodiments of the present invention, the anodizing equipment 100 further includes a drive assembly 4, which is disposed outside the oxidation tank 1 and is pulsatorically connected to the shielding plate 32 to drive the movement of the shielding plate 32. By disposing the drive assembly 4 outside the oxidation tank 1 and pulsatorically connecting it to the shielding plate 32, while the drive assembly 4 drives the shielding plate 32 to rotate to adjust the projected area of ​​the shielding plate 32 along the first direction, corrosion of the drive assembly 4 by the electrolyte in the oxidation tank 1 can be avoided, which is beneficial to extending the service life of the drive assembly 4.

[0049] For example, the drive assembly 4 includes a drive motor, a gear set, and a linkage assembly. The output end of the drive motor is connected to the gear set for transmission. The linkage assembly is located between the gear set and the shielding plate 32 and is connected to both the gear set and the shielding plate 32 for transmission. The high speed output by the drive assembly 4 is reduced by the gear set and then driven to rotate the shielding plate 32 through the linkage assembly to adjust the rotation angle of the shielding plate 32 relative to the fixed frame.

[0050] For example, the drive motor has a locked state and an unlocked state. When the drive motor is in the locked state, the output end of the drive motor does not move, so that the shielding plate 32 is fixed relative to the fixed frame to prevent the electrolyte in the oxidation tank 1 from impacting and causing the angle of the shielding plate 32 to shift. When the drive motor is in the unlocked state, the output end of the drive motor drives the shielding plate 32 to rotate relative to the fixed frame to adjust the rotation angle of the shielding plate 32.

[0051] For example, the drive motor can be a stepper motor or a servo motor. Both stepper motors and servo motors can control the speed and torque relatively accurately, thereby enabling precise control of the rotation angle of the shielding plate 32, effectively reducing the rotation angle deviation of the shielding plate 32, which is beneficial to improving the precise adjustment of the current density at different positions in the oxidation tank 1.

[0052] For example, the shielding frame 3 includes a fixed top plate 311, which is located at the top of the housing 10. Part of the drive assembly 4 is located on the side of the fixed top plate 311 facing away from the oxidation tank 1 in the vertical direction. The fixed top plate 311 can support and fix part of the drive assembly 4, and can also isolate part of the drive assembly 4 from the electrolyte in the oxidation tank 1, so as to effectively prevent the electrolyte in the oxidation tank from corroding the drive assembly 4.

[0053] Reference Figure 11 , Figure 12 and Figure 14 According to some embodiments of the present invention, the drive assembly 4 includes a rotary motor 41, the output end of which is connected to the sleeve 321.

[0054] By connecting the output end of the rotary motor 41 to the sleeve 321, the output end of the rotary motor 41 can directly drive the sleeve 321 to rotate synchronously when it rotates, thereby driving the shielding part 322 to rotate relative to the mounting rod 312, so as to realize the adjustment of the rotation angle of the shielding plate 32. This arrangement can also make full use of the space inside the sleeve 321, shorten the power transmission path between the output end of the rotary motor 41 and the sleeve 321, and reduce energy loss during the transmission process.

[0055] The output end of the rotary motor 41 is provided with connecting rods 44 on both sides along the radial direction of the sleeve 321. The connecting rods 44 extend along the radial direction of the sleeve 321 and are fixedly connected to the sleeve 321 so that the output end of the rotary motor 41 is fixedly connected to the sleeve 321.

[0056] For example, the rotary motor 41 has a locked state and an unlocked state. When the rotary motor 41 is in the locked state, the output end of the rotary motor 41 is stationary so that the shielding part 322 is fixed relative to the mounting rod 312 to prevent the electrolyte in the oxidation tank 1 from impacting and causing the angle of the shielding plate 32 to shift. When the rotary motor 41 is in the unlocked state, the output end of the rotary motor 41 drives the shielding part 322 to rotate relative to the mounting rod 312 through the sleeve 321 to adjust the rotation angle of the shielding plate 32.

[0057] Reference Figure 12 and Figure 13 According to some embodiments of the present invention, the drive assembly 4 includes an adjusting gear 42, which is sleeved on and fixedly connected to the sleeve 321. When the adjusting gear 42 rotates, it can directly drive the sleeve 321 to rotate synchronously, thereby causing the shielding part 322 to rotate relative to the mounting rod 312, so as to realize the adjustment of the rotation angle of the shielding plate 32. For example, the adjusting gear 42 is located at the top end of the sleeve 321 in the vertical direction, so that the operator can directly rotate the adjusting gear 42 manually to complete the angle adjustment operation of the shielding plate 32 without the need for an additional drive motor. This simplifies the structure of the drive assembly 4, reduces the number of parts, and lowers the manufacturing cost.

[0058] In some embodiments, in the vertical direction, a scale 43 is provided on the side of the adjusting gear 42 away from the sleeve 321. The scale 43 is coaxially arranged with the adjusting gear 42 and can rotate synchronously with the adjusting gear 42. This allows the angle of rotation of the adjusting gear 42 to be displayed more intuitively, so that the operator can adjust the rotation angle of the shielding plate 32 more accurately.

[0059] For example, a reference scale line can be set on the outer wall of the sleeve 321. When the operator rotates the adjusting gear 42, the current deflection angle of the shielding plate 32 can be read intuitively and accurately by reading the scale line and the scale on the dial 43. This also makes it easier for the operator to accurately adjust the rotation angle of the shielding plate 32.

[0060] Reference Figures 11-14According to some embodiments of the present invention, the drive assembly 4 includes a rotary motor 41 and an adjusting gear 42. The rotary motor 41 and the adjusting gear 42 are located at both ends of the sleeve 321 in the vertical direction. The output end of the rotary motor 41 is connected to one end of the sleeve 321 in the vertical direction, and the adjusting gear 42 is sleeved on the other end of the sleeve 321 in the vertical direction and fixedly connected to the sleeve 321. By positioning the rotary motor 41 and the adjusting gear 42 at both ends of the sleeve 321 in the vertical direction, and connecting one end of the sleeve 321 in the vertical direction to the output end of the rotary motor 41 and fixing the other end to the adjusting gear 42, the output end of the rotary motor 41 can directly drive the sleeve 321 to rotate synchronously when it rotates, thereby driving the shielding part 322 to rotate relative to the mounting rod 312, so as to realize the adjustment of the rotation angle of the shielding plate 32. The adjusting gear 42 can also directly drive the sleeve 321 to rotate synchronously when it rotates, thereby driving the shielding part 322 to rotate relative to the mounting rod 312, so that the operator can directly and manually rotate the adjusting gear 42 to complete the angle adjustment operation of the shielding plate 32.

[0061] By connecting one end of the sleeve 321 to the output end of the rotary motor 41 and the other end to the adjusting gear 42, dual-drive adjustment of the sleeve 321 can be achieved. The angle of the shielding plate 32 can be automatically adjusted by the rotary motor 41, and the angle of the shielding plate 32 can be manually adjusted by the adjusting gear 42. For example, in the case of power failure, maintenance, or maintenance of oxidation tank 1, the angle of the shielding plate 32 can be adjusted by manually rotating the adjusting gear 42.

[0062] According to some embodiments of the present invention, each shielding plate 32 is independently controlled. By making each shielding plate 32 independently controlled, more precise adjustments can be made based on the film thickness of the workpiece corresponding to each shielding plate 32, so as to effectively change the current density at a single workpiece.

[0063] Reference Figures 1-4 According to some embodiments of the present invention, the position of the cathode plate 2 relative to the oxidation tank 1 along the first direction is adjustable. By making the position of the cathode plate 2 relative to the oxidation tank 1 along the first direction adjustable, the distance between the cathode plate 2 and the anode workpiece can be adjusted according to different working conditions. For example, the distance between the cathode plate 2 and the workpiece can be adjusted according to the workpiece specifications, the number of hangers 12, or process requirements, so as to better adjust the electric field strength.

[0064] For example, based on the adjustable position of the cathode plate 2 relative to the oxidation tank 1 along the first direction, the overall electric field strength and local current density can be adjusted by adjusting the projected area of ​​the shielding plate 32 along the first direction, effectively balancing the current density in the oxidation tank 1 under different working conditions, thereby effectively improving the uniformity of the workpiece film thickness.

[0065] Reference Figures 1-4 According to some embodiments of the present invention, the workpiece placement space 11 is provided with a shielding frame 3 and a cathode plate 2 on both sides along the first direction. By providing a shielding frame 3 and a cathode plate 2 on both sides of the workpiece placement space 11 along the first direction, the current density on both sides of the workpiece can be adjusted synchronously in both directions along the first direction, so that the overall current density in the oxidation tank 1 is more balanced, thereby further improving the uniformity of the workpiece film thickness.

[0066] For example, the workpiece placement space 11 is provided with a hanger 12 for mounting workpieces. The hanger 12 includes a frame body 121 and two rows of hanging branches. The two rows of hanging branches are located on both sides of the frame body 121 along the first direction. Each row of hanging branches includes multiple hanging branches 122, which are arranged at intervals along the vertical direction. Each hanging branch 122 is hung with a workpiece. By providing a shielding frame 3 and a cathode plate 2 on both sides of the workpiece placement space 11 along the first direction, the shielding plates 32 on both sides of the shielding frame 3 can be adjusted in a coordinated manner, so that the current density of the workpiece on both sides along the first direction tends to be consistent, reducing the difference in oxide film growth rate and effectively improving the uniformity of film thickness. Alternatively, the workpieces can be divided into two rows, which are arranged at intervals along the first direction. The shielding frame 3 and cathode plate 2 on both sides along the first direction can be matched with the workpieces on the corresponding hanging branches, realizing the zoned adjustment of the current density of the workpieces on the corresponding hanging branches, thereby effectively improving the uniformity of the workpiece film thickness.

[0067] Reference Figure 2 , Figure 3 and Figure 8 According to some embodiments of the present invention, the workpiece placement space 11 is provided with a hanger 12 for mounting the workpiece. The hanger 12 can serve as a carrier for the workpiece, providing stable support.

[0068] For example, the top of the hanger 12 is provided with a hook, which is hung on the fly rod. The fly rod extends along the second direction and both ends of the fly rod in the axial direction are hung on the side wall of the oxidation tank 1 so that the workpiece is more stably located in the oxidation tank 1.

[0069] For example, the hanging frame 12 includes a frame body 121 and two rows of hanging branches. The two rows of hanging branches are located on both sides of the frame body 121 along the first direction. Each row of hanging branches includes multiple hanging branches 122. The multiple hanging branches 122 are arranged at intervals along the vertical direction. This can make full use of the space in the first direction and the vertical direction, so that the anodizing equipment 100 can process multiple workpieces at the same time and improve the oxidation efficiency.

[0070] For example, the workpiece placement space 11 is provided with a hanger 12 for installing workpieces. The hanger 12 includes a frame body 121 and two rows of hanging branches. The two rows of hanging branches are located on both sides of the frame body 121 along the first direction. By providing a shielding frame 3 and a cathode plate 2 on both sides of the workpiece placement space 11 along the first direction, the cathode plates 2 and shielding frames 3 on both sides can be matched with the workpieces on the corresponding hanging branches, thereby realizing the zoned adjustment of the current density of the workpieces on the corresponding hanging branches, which can effectively improve the uniformity of the workpiece film thickness.

[0071] Reference Figure 15 According to a process adjustment method for an anodizing apparatus according to a second aspect of the present invention, the anodizing apparatus 100 is the anodizing apparatus 100 according to the first aspect of the present invention described above, and the process adjustment method includes: Step 1: Construct the position code of the workpiece before oxidation: Generate the position code of the workpiece before oxidation based on the product 2D code of the workpiece and the corresponding hanging rod code. For example, before oxidation, each workpiece is bound to its own product 2D code and the hanging branch code, hanging frame code, and flying rod code to generate a unique position code for each workpiece and upload it to the server to ensure the position of each workpiece is traceable. Step 2: Generate film thickness matrix of the oxidized workpiece: Detect the film thickness of the oxide film on the oxidized workpiece, and generate a film thickness matrix based on the workpiece's position code and film thickness. For example, the UMP-TK device detects the film thickness data of the oxidized workpiece and generates a film thickness matrix based on the workpiece's position code and film thickness data. Step 3: Adjust the rotation angle of the shielding plate 32: Based on the film thickness matrix diagram in Step 2, analyze and calculate the specific position of the workpiece whose film thickness needs to be adjusted. Calculate the rotation angle of the shielding plate 32 corresponding to the workpiece based on the relationship between the rotation angle of the shielding plate 32 and the film thickness, and control the drive assembly 4 to adjust the rotation angle of the shielding plate 32 at the corresponding position. For example, the UMP-TK equipment analyzes and processes the distribution position of workpieces with different film thicknesses in the oxidation tank 1. Based on the difference between the film thickness of the material at different positions in the oxidation tank 1 and the preset standard value, calculate the specific position of the workpiece whose film thickness needs to be adjusted and the rotation angle of the shielding plate 32, and generate corresponding control commands to send to the drive assembly 4, controlling the drive assembly 4 to drive the shielding plate 32 to rotate.

[0072] For example, in step two, the specific location where the film thickness needs to be adjusted is calculated based on the film thickness matrix diagram in step one, and the drive component 4 is controlled to adjust the rotation angle of the corresponding shielding plate 32. If the oxide film thickness of the workpiece is high, it indicates that the cathode graphite rod 21 and the corresponding cathode-cathode area of ​​the workpiece are relatively large. The drive component 4 is then controlled to reduce the angle of the corresponding shielding plate 32 to increase the projected area of ​​the shielding plate 32 along the first direction at the corresponding workpiece, that is, to increase the shielding range of the shielding plate 32 at the corresponding workpiece and reduce the cathode-cathode area of ​​the cathode graphite rod 21 and the corresponding cathode-cathode area of ​​the workpiece. In contrast, the growth rate of the oxide film on the surface of the corresponding workpiece is slowed down to reduce the thickness of the oxide film on the corresponding workpiece. If the thickness of the oxide film on the workpiece is small, it indicates that the cathode graphite rod 21 and the corresponding cathode area of ​​the workpiece are relatively small. The control drive component 4 adjusts the angle of the corresponding shielding plate 32 to reduce the projected area of ​​the shielding plate 32 on the corresponding workpiece along the first direction, that is, to reduce the shielding range of the shielding plate 32 on the corresponding workpiece, increase the cathode graphite rod 21 and the corresponding cathode area of ​​the workpiece, accelerate the growth rate of the oxide film, and increase the thickness of the oxide film on the corresponding workpiece.

[0073] For example, when the angle between the shielding plate 32 and the fixed frame is 0°, the shielding range of the shielding plate 32 at the corresponding workpiece is the largest and the oxide film thickness is the smallest. By increasing the angle between the shielding plate 32 and the fixed frame by adjusting the drive assembly 4, the cathode shielding range of the shielding plate 32 at the corresponding workpiece becomes smaller, which can increase the current path between the workpiece and the cathode plate in this area. This can increase the current density in this area, thereby accelerating the oxide film growth rate in this area and increasing the thickness of the oxide film on the workpiece in this area.

[0074] According to the process adjustment method of the anodizing equipment of the present invention, by providing the above-mentioned anodizing equipment 100, the workpiece position of the area with thicker or thinner film can be determined more accurately, and the rotation angle of the corresponding position shielding plate 32 can be adjusted by the drive component 4 to adjust the current density at the corresponding workpiece position more accurately, so as to adjust the thickness of the oxide film of the workpiece, thereby effectively improving the uniformity of the film thickness of the workpiece.

[0075] According to some embodiments of the present invention, generating the position code of the workpiece before oxidation based on the product 2D code of the workpiece and the corresponding hanging rod code includes: collecting the product 2D code of the workpiece and the hanging branch code, hanging rack code, and flying rod code of the workpiece; binding the product 2D code of the workpiece with the hanging branch code, hanging rack code, and flying rod code of the workpiece to generate the position code of the workpiece before oxidation. By associating the 2D code of the workpiece with the codes of the mounting structures such as the hanging branch 122, the hanging frame 12, and the flying rod, a precise mapping between a single workpiece and its mounting point and its spatial position in the oxidation tank can be achieved. This gives each workpiece a unique position code, which can accurately lock the specific spatial coordinates of the workpiece in the oxidation tank 1, providing a reliable positional basis for subsequent film thickness data analysis.

[0076] For example, a workpiece placement space 11 is equipped with a boom, on which five hangers 12 are arranged at intervals along a first direction, numbered from the first hanger to the fifth hanger in the first direction. Each hanger 12 includes a frame body 121 and two rows of hanging branches 122. The frame body 121 extends vertically, and the two rows of hanging branches 122 are located on opposite sides of the frame body 121 along a second direction, namely the first side and the second side. Each row of hanging branches 122 includes five hanging branches 122 arranged at intervals along a vertical direction, numbered from the first layer to the fifth layer of hanging branches 122 in the bottom-to-top direction. Each hanging branch 122 hangs 10 workpieces. In the second direction, and from the frame body 121 towards... On the side wall of the box 10, there are the first to tenth pieces in sequence. The workpieces are hung in the following order: starting from the first piece of the first layer on the first side of the first hanger, the workpieces are loaded sequentially. After the first layer on the first side of the first hanger is full of 10 workpieces, the workpieces are loaded from the first piece of the second layer on the first side of the first hanger. After the fifth hanging branch 122 on the first side of the first hanger is full of 10 workpieces, the workpieces are loaded from the first piece of the first layer on the second side of the first hanger. After all the hanging branches 122 on both sides of the first hanger are full of workpieces, the workpieces are hung from the hanging branches 122 of the second hanger, and so on. After all the five hanging racks 12 in the workpiece placement space 11 are full of workpieces, there are a total of 700 workpieces in the workpiece placement space 11.

[0077] According to some embodiments of the present invention, the film thickness matrix diagram includes: different film thickness value areas are represented by different colors, with the colors from high to low according to the film thickness size being red, orange, green, blue, and gray. By assigning specific colors to different film thickness ranges, it is not necessary to compare values ​​one by one. Workers can quickly distinguish between areas with high, normal, and low film thickness by color, which can effectively shorten the time for reading and judging the diagram and improve the efficiency of on-site operations.

[0078] According to some embodiments of the present invention, in step three, the relationship between the rotation angle of the shielding plate 32 and the film thickness satisfies: Where δ is the film thickness, K is the Faraday constant coefficient, with a value ranging from 96485 C / mol to 96500 C / mol, J is the current density, t is the oxidation time, η is the current efficiency, and c 液 Where θ is the electrolyte concentration, T is the temperature, θ is the rotation angle of the shielding plate 32, n is the shielding coefficient, and the value of n ranges from 0.25 to 1, W is the width of the shielding plate 32 in the second direction, S is the distance between the mounting rod 312 and the cathode plate 2 in the first direction, and L is the length of the shielding plate 32 in the vertical direction. The rotation angle of the shielding plate 32 can be adjusted more precisely to achieve precise adjustment of the film thickness uniformity.

[0079] For example, if the analysis and calculation show that the film thickness of a certain area of ​​the workpiece is too high by about 0.4 μm, the rotation angle of the shielding plate 32 corresponding to that area needs to be increased. The UMP-TK equipment can calculate the required rotation angle of the shielding plate 32 corresponding to the film thickness reduction of 0.4 μm according to the formula, and send a signal to the rotary motor 41 at the corresponding position. After receiving the signal, the rotary motor 41 drives the shielding plate 32 at the corresponding position to make an angle adjustment. Alternatively, during the maintenance of the oxidation tank 1, the operator can manually adjust the adjusting gear 42 at the corresponding position to drive the shielding plate 32 at the corresponding position to make an angle adjustment.

[0080] The following reference Figure 15 A process adjustment method for an anodizing apparatus according to an embodiment of the present invention is described.

[0081] Reference Figure 15 In this embodiment, the process adjustment method for the anodizing equipment includes the following steps: S01. Generate the position code of the workpiece before oxidation based on the product 2D code of the workpiece and the corresponding hanging rod code. S02. Preset operating time for the anodizing equipment 100; S03. Detect the thickness of the oxide film on the oxidized workpiece, and generate a film thickness matrix based on the workpiece's position code and film thickness. S04. Calculate the difference between the maximum and minimum film thickness based on the film thickness matrix diagram. T; according to The size of T is determined by performing the following steps S11 or S21: S11、 T≤3.5μm; like If T≤3.5μm, then perform the following step S12: S12, the shielding plate 32 rotates at the same angle, and the anodizing equipment 100 operates in the current state.

[0082] S21, T > 3.5 μm; like If T > 3.5 μm, then proceed with step S22 as follows: S22. Analyze and calculate the specific position of the workpiece whose film thickness needs to be adjusted based on the film thickness matrix diagram in step S03, and calculate the rotation angle of the shielding plate 32 corresponding to the workpiece based on the relationship between the rotation angle of the shielding plate 32 and the film thickness. S23, Control drive component 4 to adjust the rotation angle of the shielding plate 32 at the corresponding position; Return to step S01 above.

[0083] Reference Figure 16 and Figure 17 , Figure 16 This is a matrix diagram of the film thickness of the workpiece after anodizing in an anodizing equipment 100 before process adjustment. Figure 17 This is a film thickness matrix diagram of a workpiece after being processed by an anodizing apparatus 100 with process adjustments according to some embodiments of the present invention. Figure 16 It can be seen that before the process adjustment, the overall film thickness distribution of the workpiece was chaotic, with significant differences in film thickness between different areas and different workpieces, and obvious areas of excessively thick or thin film, resulting in poor film thickness uniformity. From Figure 17 It can be seen that the film thickness difference of this batch of workpieces has been adjusted to within 2.5μm. The anodizing equipment 100 and its process adjustment method in this embodiment can effectively balance the current density in different areas of the oxidation tank 1, which can better improve the problem of uneven film thickness and excessive overall deviation of the workpieces, and effectively improve the uniformity of the film thickness of the workpieces.

[0084] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0085] In the description of this invention, "first feature" and "second feature" may include one or more of the features.

[0086] In the description of this invention, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or it may include the first and second features not being in direct contact but being in contact through another feature between them.

[0087] In the description of this invention, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicating that the first feature is at a higher horizontal level than the second feature.

[0088] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0089] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An anodizing apparatus, characterized in that, include: The box body contains an oxidation tank, and the oxidation tank has a workpiece placement space. A cathode plate is disposed within the oxidation tank; A shielding frame is disposed in the oxidation tank and placed along a first direction with the cathode plate. The shielding frame is located between the cathode plate and the workpiece placement space. The shielding frame includes a fixed frame and a plurality of shielding plates. The fixed frame is fixed to the housing, and the plurality of shielding plates are installed on the fixed frame. At least some of the shielding plates are movable relative to the fixed frame. A drive assembly is kinetically connected to at least a portion of the shielding plate to adjust the rotation angle of at least a portion of the shielding plate, the rotation axis of the shielding plate extending in the vertical direction.

2. The anodizing equipment according to claim 1, characterized in that, The fixing frame includes a fixing base and multiple mounting rods. The fixing base is fixed to the bottom wall of the oxidation tank. The multiple mounting rods are fixed on the fixing base and arranged at intervals along the second direction. The first direction, the second direction, and the up and down direction intersect each other. The multiple shielding plates are rotatably mounted on the multiple mounting rods.

3. The anodizing equipment according to claim 2, characterized in that, Each of the mounting rods is provided with a plurality of shielding plates spaced apart in the vertical direction.

4. The anodizing equipment according to claim 2, characterized in that, Each of the shielding plates includes a sleeve and a shielding part, the sleeve being connected to the shielding part, and the sleeve being rotatably fitted onto the mounting rod.

5. The anodizing equipment according to claim 4, characterized in that, The drive assembly includes a rotary motor, the output end of which is connected to the sleeve. Alternatively, the drive assembly includes an adjusting gear, which is sleeved on the sleeve and fixedly connected to the sleeve; Alternatively, the drive assembly includes a rotary motor and an adjusting gear, the rotary motor and the adjusting gear being located at opposite ends of the sleeve in the vertical direction, the output end of the rotary motor being connected to one end of the sleeve in the vertical direction, and the adjusting gear being sleeved on the other end of the sleeve in the vertical direction and fixedly connected to the sleeve.

6. The anodizing equipment according to claim 1, characterized in that, Each of the aforementioned shielding panels is independently controlled.

7. The anodizing equipment according to claim 1, characterized in that, The workpiece placement space is provided with the shielding frame and the cathode plate on both sides along the first direction; And / or, the workpiece placement space is provided with a hanger for mounting the workpiece.

8. A process adjustment method for anodizing equipment, characterized in that, The anodizing equipment is the anodizing equipment according to any one of claims 1-7, and the process adjustment method includes: Step 1: Construct the position code of the workpiece before oxidation: Generate the position code of the workpiece before oxidation based on the product 2D code of the workpiece and the corresponding hanging rod code; Step 2: Generate film thickness matrix of the oxidized workpiece: Detect the film thickness of the oxide film on the oxidized workpiece, and generate the film thickness matrix based on the workpiece's position code and the film thickness. Step 3: Adjust the rotation angle of the shielding plate: Based on the film thickness matrix diagram in Step 2, analyze and calculate the specific position of the workpiece whose film thickness needs to be adjusted. Calculate the rotation angle of the shielding plate corresponding to the workpiece based on the relationship between the rotation angle of the shielding plate and the film thickness, and control the drive assembly to adjust the rotation angle of the shielding plate at the corresponding position.

9. The process adjustment method for anodizing equipment according to claim 8, characterized in that, The process of generating the position code of the workpiece before oxidation based on the product 2D code and the corresponding hanging rod code includes: collecting the product 2D code of the workpiece and the hanging branch code, hanging rack code, and flying rod code of the workpiece; binding the product 2D code of the workpiece with the hanging branch code, hanging rack code, and flying rod code of the workpiece to generate the position code of the workpiece before oxidation. And / or, the film thickness matrix diagram includes: different film thickness value regions are represented by different colors, and the colors from high to low according to the size of the film thickness are red, orange, green, blue, and gray.

10. The process adjustment method for the anodizing equipment according to claim 8, characterized in that, In step three, the relationship between the rotation angle of the shielding plate and the film thickness satisfies: ; Where δ is the film thickness, K is the Faraday constant coefficient, with a value ranging from 96485 C / mol to 96500 C / mol, J is the current density, t is the oxidation time, η is the current efficiency, and c 液 Where θ is the electrolyte concentration, T is the temperature, θ is the rotation angle of the shielding plate, n is the shielding coefficient, and the value of n ranges from 0.25 to 1, W is the width of the shielding plate in the second direction, S is the distance between the mounting rod and the cathode plate in the first direction, and L is the length of the shielding plate in the vertical direction.

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