Linear array lidar chip, configuration method and device thereof, equipment and medium

Abstract

The application discloses a linear array laser radar chip, a configuration method and device thereof, an electronic device and a computer readable storage medium. The linear array laser radar chip comprises: a photodetector array comprising a plurality of detection unit groups arranged at intervals along a first direction, each detection unit group comprising a plurality of macro-pixel units arranged at intervals along a second direction, the first direction being perpendicular to the second direction; and a configuration register connected to the photodetector array, used for controlling the working states of the plurality of detection unit groups and the macro-pixel units. The application realizes flexible configuration of the working mode of the linear array laser radar chip.

Description

Technical Field

[0001] This application relates to the field of lidar technology, and more specifically, to a linear array lidar chip and its configuration method, apparatus, electronic device, and computer-readable storage medium. Background Technology

[0002] When a linear array lidar chip is in operation, the working mode needs to be preset. That is, in the macro pixel unit array, the position and number of macro pixel units participating in the operation are selected, and the corresponding number of addressable time-to-digital converter units are bound to these macro pixel units to form a data information processing path.

[0003] However, in related technologies, linear array LiDAR chips have poor configuration flexibility and a complex configuration process. Once the working mode is set, it is difficult to adjust, and it is impossible to flexibly select macro-pixel units to participate in the work according to actual needs.

[0004] Therefore, how to achieve flexible configuration of the working modes of linear array lidar chips is a technical problem that needs to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this application is to provide a linear array lidar chip, its configuration method, device, electronic device, and computer-readable storage medium, which realizes flexible configuration of the working mode of the linear array lidar chip.

[0006] To achieve the above objectives, this application provides a linear array lidar chip, comprising: A photodetector array includes multiple detection unit groups arranged at intervals along a first direction, each detection unit group comprising multiple macropixel units arranged at intervals along a second direction, wherein the first direction and the second direction are perpendicular to each other; A configuration register connected to the photodetector array is used to control the operating status of the multiple detection unit groups and the macropixel units.

[0007] Optionally, it also includes a time-to-digital converter unit corresponding to each of the detection unit groups, for receiving the electrical signal output by the macro-pixel unit in the corresponding detection unit group and converting the electrical signal into a digital quantization signal; The configuration register corresponds one-to-one with the detection unit group and is used to control whether the corresponding detection unit group is activated, and to specify the macro pixel unit that is connected to the corresponding time-to-digital converter unit in the activated detection unit group.

[0008] Optionally, the configuration register includes a first control bit and a second control bit. The first control bit is used to control whether the corresponding detection unit group is activated, and the second control bit is used to specify the macro pixel unit connected to the corresponding time-to-digital converter unit in the activated detection unit group.

[0009] Optionally, the number of the second control bits satisfies a preset condition, wherein the preset condition is: 2 n ≥j, where n is the number of the second control bits, and j is the number of macropixel units contained in each of the detection unit groups.

[0010] Optionally, the photodetector array includes a single-photon avalanche diode array.

[0011] To achieve the above objectives, this application provides a method for configuring a linear array lidar chip, comprising: Determine the target state of each detection unit group in the photodetector array; wherein, the target state includes being activated and not being activated; In the group of detection units where the target state is activated, target macro-pixel units for communication with the corresponding time-to-digital converter units are identified; wherein, the group of detection units corresponds one-to-one with the time-to-digital converter units. Based on the target state of each detection unit group and the target macro-pixel unit, configure the configuration register corresponding to each detection unit group; wherein, the detection unit group and the configuration register correspond one-to-one.

[0012] Optionally, configuring the configuration register corresponding to each detection unit group based on the target state of each detection unit group and the target macropixel unit includes: Configure the first control bit in the configuration register corresponding to the activated probe unit group as the first state value, and configure the first control bit in the configuration register corresponding to the inactive probe unit group as the second state value. Based on the position of the target macro-pixel unit in the activated detection unit group within its respective detection unit group, configure the second control bit in the configuration register corresponding to the activated detection unit group.

[0013] Optionally, configuring the second control bit in the configuration register corresponding to the activated detection unit group based on the position of the target macro-pixel unit in its respective detection unit group includes: The position number of the target macropixel unit in the activated detection unit group is converted into a binary code. The second control bit in the configuration register corresponding to the activated probe unit group is configured based on the binary encoding.

[0014] To achieve the above objectives, this application provides a linear array lidar chip configuration device, comprising: The first determining module is used to determine the target state of each detection unit group in the photodetector array; wherein, the target state includes being activated and not being activated; The second determining module is used to determine, in the group of detection units in the target state of being activated, the target macro-pixel unit for communication with the corresponding time-to-digital converter unit; wherein, the group of detection units corresponds one-to-one with the time-to-digital converter unit; The configuration module is used to configure the configuration register corresponding to each of the detection unit groups according to the target state of each detection unit group and the target macro pixel unit; wherein, the detection unit group and the configuration register correspond one-to-one.

[0015] To achieve the above objectives, this application provides an electronic device, comprising: Memory, used to store computer programs; A processor is used to execute the computer program to implement the steps of the linear array lidar chip configuration method described above.

[0016] To achieve the above objectives, this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the linear array lidar chip configuration method described above.

[0017] The linear array lidar chip provided in this application controls the operating status of multiple detection unit groups and macropixel units within each detection unit group by setting a configuration register connected to the photodetector array. Users only need to configure the configuration register to flexibly adjust the operating mode of the entire photodetector array, eliminating the need for complex hardware binding and reconfiguration during chip manufacturing or each mode switch, significantly reducing configuration complexity. Furthermore, since the configuration register can independently control the operating status of each detection unit group, users can flexibly select the number of detection unit groups participating in operation according to the needs of the actual application scenario. This enables flexible switching between any number of working lines, from a small number to the full number of working lines. In addition, since the configuration register can also control the operating status of macropixel units within each detection unit group, users can flexibly select the specific macropixel units participating in detection within each detection unit group. Different detection unit groups can select macropixel units at the same or different positions to combine, thereby forming diverse detection modes to meet the needs of different application scenarios. This application also discloses a linear array lidar chip configuration method, apparatus, electronic device, and computer-readable storage medium, which can achieve the same technical effects.

[0018] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. The drawings are used to provide a further understanding of this disclosure and constitute a part of the specification. They are used together with the following detailed description to explain this disclosure, but do not constitute a limitation of this disclosure. In the drawings: Figure 1 This is a structural diagram of a linear array lidar chip according to an exemplary embodiment; Figure 2 This is a structural diagram of a photodetector array according to an exemplary embodiment; Figure 3 This is a structural diagram of another linear array lidar chip according to an exemplary embodiment; Figure 4 This is a schematic diagram illustrating a linear array lidar chip in 96-line operating mode according to an exemplary embodiment; Figure 5This is a schematic diagram illustrating a linear array lidar chip in 48-line operating mode according to an exemplary embodiment; Figure 6 This is a schematic diagram illustrating a linear array lidar chip in 32-line operating mode according to an exemplary embodiment; Figure 7 This is a schematic diagram illustrating a linear array lidar chip in 24-line operating mode according to an exemplary embodiment; Figure 8 This is a schematic diagram illustrating a linear array lidar chip in 64-line operating mode according to an exemplary embodiment; Figure 9 This is a schematic diagram illustrating a linear array lidar chip in 16-line operating mode according to an exemplary embodiment; Figure 10 This is a flowchart illustrating a method for configuring a linear array lidar chip according to an exemplary embodiment; Figure 11 This is a structural diagram illustrating a linear array lidar chip configuration device according to an exemplary embodiment; Figure 12 This is a structural diagram of an electronic device according to an exemplary embodiment. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0021] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0022] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] This embodiment discloses a linear array lidar chip, such as Figure 1As shown, the device includes a photodetector array 10, which includes a plurality of detection unit groups 101 arranged at intervals along a first direction. Each detection unit group includes a plurality of macropixel units arranged at intervals along a second direction, wherein the first direction and the second direction are perpendicular to each other.

[0024] The photodetector array 10 is an ordered array of semiconductor photodetector devices, specifically a single-photon avalanche diode (SPAD) array. The first direction can be horizontal, and the second direction can be vertical; that is, the detector unit groups 101 are arranged horizontally, and the macropixel units in each detector unit group 101 are arranged vertically. A macropixel unit is the basic detection unit in the photodetector array, containing at least one photodetector element used to detect photons and output the corresponding electrical signal. The size of the photodetector array 10 can be flexibly adjusted according to the application scenario. The number of detector unit groups in the first direction can be set to [16, 192], and the number of macropixel units in each detector unit group in the second direction can be set to [7, 40].

[0025] For example, such as Figure 2 As shown, the photodetector array has 96 detector unit groups 101 arranged in the first direction and 13 macropixel units arranged in the second direction, forming a basic layout framework of 96×13. Each macropixel unit consists of 48 tiny photosensitive points (pixels) in 8 rows and 6 columns, with a physical size of 10μm×10μm for each photosensitive point.

[0026] The linear array lidar chip in this embodiment also includes a configuration register 301 connected to the photodetector array 10, which is used to control the working state of the plurality of detection unit groups 101 and the macro pixel units.

[0027] The configuration register 301 is a storage unit for storing control bit information. It is connected to the photodetector array 10 and is used to control the activation state of each detection unit group 101 and the selection relationship of macropixel units. By writing different state values ​​into the configuration register 301, the operating state of the corresponding detection unit group 101 and the selection relationship of macropixel units can be controlled. Through the configuration register 301, the operating mode can be flexibly adjusted solely through software programming without modifying the hardware circuitry.

[0028] The linear array lidar chip provided in this application embodiment controls the operating status of multiple detection unit groups and macropixel units within each detection unit group by setting a configuration register connected to the photodetector array. Users only need to configure the configuration register to flexibly adjust the operating mode of the entire photodetector array, eliminating the need for complex hardware binding and reconfiguration during chip manufacturing or each mode switch, significantly reducing configuration complexity. Furthermore, since the configuration register can independently control the operating status of each detection unit group, users can flexibly select the number of detection unit groups participating in operation according to the needs of the actual application scenario. This enables flexible switching between operating modes with any number of lines, from a small number to the full number of lines. In addition, since the configuration register can also control the operating status of macropixel units within each detection unit group, users can flexibly select the specific macropixel units participating in detection within each detection unit group. Different detection unit groups can select macropixel units at the same or different positions to form diverse detection modes, meeting the needs of different application scenarios.

[0029] Based on the above embodiments, as a preferred implementation method, such as... Figure 3 As shown, the linear array lidar chip also includes a time-to-digital converter unit 201 corresponding to each of the detection unit groups 101, used to receive the electrical signals output by the macro-pixel units in the corresponding detection unit group 101, perform time-to-digital conversion processing on the electrical signals, and generate corresponding digital quantization signals; the configuration register 301 corresponds to each of the detection unit groups 101, used to control whether the corresponding detection unit group 101 is activated, and to specify the macro-pixel units connected to the corresponding time-to-digital converter unit 201 in the activated detection unit group 101.

[0030] Each Time-to-Digital Converter (TDC) unit 201 corresponds to a fixed detector unit group 101. It receives the electrical pulse signals output by the macro-pixel units selected in that detector unit group 101 and converts the photon time-of-flight into a digitally quantized signal. The number of TDC units 201 is the same as the number of detector unit groups 101, ensuring a one-to-one correspondence and providing each detector unit group 101 with an independent signal processing channel, thus avoiding signal contention and resource conflicts between different detector unit groups 101. The number of configuration registers 301 is also the same as the number of detector unit groups 101, with each configuration register 301 independently controlling its corresponding detector unit group 101.

[0031] As a possible implementation, the configuration register 301 includes a first control bit and a second control bit. The first control bit is used to control whether the corresponding detection unit group 101 is activated, and the second control bit is used to specify the macro pixel unit connected to the corresponding time-to-digital converter unit 201 in the activated detection unit group 1101.

[0032] In this configuration register, the first control bit occupies one bit in the configuration register 301, while the second control bit occupies multiple bits in the configuration register 3011. The first control bit controls the operating state of the corresponding probe unit group 101. When the first control bit is in the first state value, the corresponding probe unit group 1011 is activated, and the second control bit is also activated, enabling the selection function of the macropixel unit. When the first control bit is in the second state value, the corresponding probe unit group 101 is turned off, and all macropixel units in the probe unit group 101 and the corresponding time-to-digital converter unit 201 are in a sleep state, while the second control bit is not activated. This design allows the inactive probe unit group to automatically enter a low-power mode, reducing the overall power consumption of the chip. When the probe unit group is activated and the second control bit is activated, the binary code of the second control bit is used to specify one or more macropixel units from the multiple macropixel units of the probe unit group to communicate with the corresponding time-to-digital converter unit. Since the second control bits of each probe unit group are independent of each other, different probe unit groups can select macropixel units at the same or different positions, realizing flexible configuration of any mode.

[0033] As a feasible implementation, the number of the second control bits satisfies a preset condition, which is: 2. n ≥j, where n is the number of the second control bits, and j is the number of macropixel units contained in each of the detection unit groups.

[0034] The preset condition ensures that the number of encoded states of the second control bit is not less than the number of macropixel units in each probe unit group, thereby enabling the allocation of a unique binary code to each macropixel unit and achieving the selection of any macropixel unit. Figure 2 Taking a photodetector array as an example, each detector unit group contains 13 macropixel units (i.e., j=13), and the number n of the second control bits needs to satisfy 2. n ≥13, the number of the second control bits n can be selected as 4, that is, each configuration register contains a total of 4 control bits. It can be seen that the above preset conditions can ensure that the chip has full addressing capability for all macro-pixel units in the detection unit group, avoiding the problem of not being able to select some macro-pixel units due to insufficient encoding space.

[0035] For example, the 96-line working mode is as follows: Figure 4As shown, all detection units are activated. The 48-line operating mode is as follows. Figure 5 As shown, the row is activated in alternating order, with the activated row numbers being: 1, 3, 5, ..., 95. The 32-line working mode is as follows... Figure 6 As shown, the lines are activated every two rows, with the activated row numbers being 1, 4, 7..., 94. The 24-line working mode is as follows... Figure 7 As shown, activation occurs at intervals of 3 rows, with the activated row numbers being: 1, 5, 9..., 95. The 64-line working mode is as follows... Figure 8 As shown, the activated row numbers are: 1, 2, 4, 7, ..., 94, 95. The 16-line working mode is as follows... Figure 9 As shown, the activated row numbers are: 1, 2, 13, 14, ..., 85, 86.

[0036] It is understood that, in some embodiments, if two or more macropixel units in a detection unit group are connected to a time-to-digital converter unit, the number of bits occupied by the second control bit is A×n, where 2 n ≥j, where A is the specified number of macropixel units.

[0037] The linear array lidar chip provided in this application provides a corresponding configuration register and time-to-digital converter (TD-SCDMA) unit for each detection unit group in the photodetector array. The configuration register controls whether the corresponding detection unit group is activated and, when activated, controls the macro-pixel units in that detection unit group that are connected to the corresponding TD-SCDMA unit. Users can independently control the working state of each detection unit group simply by configuring the configuration register corresponding to each detection unit group. When a detection unit group is needed to operate, its corresponding configuration register is set to the active state; when a detection unit group is not needed, its corresponding configuration register is set to the deactivated state. This allows for flexible selection of any number of detection unit groups without complex binding and configuration processes, thus simplifying the configuration process. Furthermore, for an activated detection unit group, the user can also specify one of the multiple macro-pixel units contained in that detection unit group to be connected to the corresponding TD-SCDMA unit through the configuration register. Since the selection of macro-pixel units for each detection unit group is independent, users can select different macro-pixel units for different detection unit groups according to actual needs, thereby achieving flexible working mode configuration.

[0038] The linear array LiDAR chip described in this embodiment can be applied to LiDAR systems, which can be used in robotic products such as lawnmowers, unmanned delivery vehicles, robotic dogs, and humanoid robots, significantly improving the robot's environmental perception and work adaptability. Specifically, in lawnmower applications, the chip flexibly selects the number of detection unit groups participating in the operation through configuration registers, switching between different working modes such as lawn boundary detection and obstacle recognition. Simultaneously, the second control bit selects macro-pixel units with lower light crosstalk to participate in detection, effectively reducing optical noise caused by direct sunlight or ground reflection and improving detection stability. In unmanned delivery vehicle applications, the chip supports simultaneous operation of all detection unit groups, enabling the acquisition of high-density point cloud data and accurate identification of pedestrians, vehicles, and obstacles at a distance, providing reliable environmental information for path planning. In applications involving robotic dogs and humanoid robots, the complex motion postures and varied operating environments of these robots necessitate the chip's arbitrary programmable mode configuration capability. This allows the robot to dynamically adjust the position and range of its region of interest based on its current posture and task requirements. For example, when the robot is walking with its head down, the lower detection unit group can be activated to detect obstacles on the ground; when the robot is looking up, the upper detection unit group can be activated to detect the environment ahead. Furthermore, because the chip uses a first control bit to put inactive detection unit groups and their corresponding time-to-digital converter units into a sleep state, it significantly reduces the overall power consumption of the chip. For the aforementioned mobile robot products that rely on battery power, this effectively extends the working time after a single charge.

[0039] This application discloses a method for configuring a linear array lidar chip. (See also...) Figure 10 A flowchart illustrating a method for configuring a linear array lidar chip according to an exemplary embodiment is shown below. Figure 10 As shown, it includes: S101: Determine the target state of each detection unit group in the photodetector array; wherein, the target state includes being activated and not being activated; In this step, the user or upper-level controller determines the target state of each detection unit group based on the detection requirements of the actual application scenario. For example, when high-density point clouds are needed for detailed environment modeling, all detection unit groups are determined to be in an active state; when power consumption needs to be reduced to extend battery life, only some detection unit groups are determined to be in an active state, and the rest are determined to be inactive; when only obstacles within a specific angle range are of interest, the detection unit groups corresponding to that angle range are determined to be in an active state, and the rest are determined to be inactive, forming a region of interest pattern.

[0040] S102: In the group of detection units in the target state that is activated, determine the target macro-pixel unit for communication with the corresponding time-to-digital converter unit; wherein, the group of detection units corresponds one-to-one with the time-to-digital converter unit; Each detection unit group uniquely corresponds to a time-to-digital converter (TD-RCD) unit. This TD-RCD unit receives the electrical signal output by the selected macropixel unit in the corresponding detection unit group and performs time-to-digital conversion on the signal to generate a digitally quantized signal. The target macropixel unit refers to the macropixel unit selected and connected to the corresponding TD-RCD unit among the multiple macropixel units contained in the activated detection unit group. In this embodiment, only one macropixel unit in each detection unit group is connected to the corresponding TD-RCD unit at any given time.

[0041] In this step, the user or upper-level controller determines the target macropixel unit for each activated detection unit group based on the optical environment and anti-crosstalk requirements of the detection scene.

[0042] S103: Configure the configuration register corresponding to each detection unit group according to the target state of each detection unit group and the target macro pixel unit; wherein, the detection unit group and the configuration register correspond one-to-one.

[0043] The configuration register is a register unit that stores configuration information. Each probe unit group uniquely corresponds to one configuration register, which is used to control the working state of the probe unit group and the selection relationship of macro-pixel units. Users can set the state of the probe unit group and specify the target macro-pixel unit by writing different status values ​​to the configuration register. The introduction of the configuration register allows the configuration of the entire chip's operating mode to be completed through software programming without modifying the hardware circuit.

[0044] In this step, based on the target state (activated or inactive) of each detection unit group determined in S101 and the target macro-pixel units in each activated detection unit group determined in S102, the configuration register corresponding to each detection unit group is written. Through this step, working modes with arbitrary working lines and arbitrary regions of interest can be quickly and flexibly configured according to the needs of different application scenarios.

[0045] As a feasible implementation, configuring the configuration register corresponding to each detection unit group according to the target state and the target macro pixel unit of each detection unit group includes: configuring the first control bit in the configuration register corresponding to the detection unit group in the activated state to a first state value, and configuring the first control bit in the configuration register corresponding to the detection unit group in the inactive state to a second state value; configuring the second control bit in the configuration register corresponding to the detection unit group in the activated state according to the position of the target macro pixel unit in its respective detection unit group.

[0046] The first control bit in the configuration register controls whether the probe unit group is activated, occupying one bit. The first status value is the binary value corresponding to the active state, such as the binary digit 1; the second status value is the binary value corresponding to the deactivated state, such as the binary digit 0. The second control bit in the configuration register specifies the target macropixel unit, occupying multiple bits, the number of bits depending on the number of macropixel units contained in each probe unit group.

[0047] In this embodiment, when the target state of the detection unit group is activated, the first control bit of the configuration register corresponding to the detection unit group is set to the first state value, thereby activating the detection unit group and putting the corresponding time-to-digital converter unit into operation. Simultaneously, the second control bit is activated, enabling the gating function of the macro-pixel unit. Then, the second control bit is configured according to the position of the target macro-pixel unit within the detection unit group. When the target state of the detection unit group is deactivated, the first control bit of the configuration register corresponding to the detection unit group is set to the second state value. At this time, the detection unit group is deactivated, with all macro-pixel units and their corresponding time-to-digital converter units in a dormant state. The second control bit is not activated, and its value is invalid.

[0048] This implementation achieves independent control of the activation state of the detection unit group and the selection of macro-pixel units through the division of labor and cooperation between the first control bit and the second control bit. It has a simple structure, efficient configuration, and enables the inactive detection unit group to automatically enter a sleep state, reducing overall power consumption.

[0049] As a feasible implementation, configuring the second control bit in the configuration register corresponding to the activated detection unit group based on the position of the target macro pixel unit in the activated detection unit group includes: converting the position number of the target macro pixel unit in the activated detection unit group into a binary code; and configuring the second control bit in the configuration register corresponding to the activated detection unit group based on the binary code.

[0050] The position number refers to the order in which the target macropixel unit is arranged among multiple macropixel units in its respective detector unit group. For example, each detector unit group contains multiple macropixel units spaced apart along the second direction. Each macropixel unit can be assigned a position number from one end to the other, such as 0, 1, 2, ..., j-1, where j is the total number of macropixel units. Binary encoding is the result of representing the position number using binary numbers, with the number of bits equal to the number of bits in the second control bit.

[0051] In this embodiment, for each activated detection unit group, the position number of the target macropixel unit within the detection unit group is first obtained. This position number is then converted into a binary code, and the binary code is directly written into the second control bit of the corresponding configuration register for that detection unit group. Taking a detection unit group containing thirteen macropixel units as an example, the position number ranges from 0 to 12, and the corresponding binary codes are 0000, 0001, 0010, 0011, 0100, 0101, 0110, 0111, 1000, 1001, 1010, 1011, and 1100, respectively. A total of four binary bits are required, which match the four bits of the second control bit.

[0052] Therefore, this embodiment manages the status and target macropixel unit information of each detector unit group uniformly through configuration registers. It only requires determining whether each detector unit group needs to be activated and which macropixel unit to select within each activated detector unit group. Writing this information to the corresponding configuration register completes the entire configuration, reducing the complexity of the configuration operation. Furthermore, this embodiment allows for flexible setting of whether each detector unit group is activated, thereby obtaining any number of scan lines from a single line to the maximum line count. It also allows for flexible setting of the selected target macropixel unit within the detector unit group, enabling flexible configuration of any operating mode and region of interest. Additionally, this embodiment allows for independent selection of target macropixel units for each activated detector unit group. When a macropixel unit is affected by crosstalk from adjacent detector unit groups or ambient light, this macropixel unit can be avoided, and other macropixel units within the same detector unit group that are less affected by crosstalk can be selected as the target macropixel unit, effectively reducing optical crosstalk between pixels.

[0053] The following describes a linear array lidar chip configuration device provided in the embodiments of this application. The linear array lidar chip configuration device described below and the linear array lidar chip configuration method described above can be referred to each other.

[0054] See Figure 11 A structural diagram of a linear array lidar chip configuration device is shown according to an exemplary embodiment, as follows: Figure 11 As shown, it includes: The first determining module 100 is used to determine the target state of each detection unit group in the photodetector array; wherein, the target state includes being activated and not being activated; The second determining module 200 is used to determine, in the group of detection units in which the target state is activated, the target macro-pixel unit for communication with the corresponding time-to-digital converter unit; wherein, the group of detection units corresponds one-to-one with the time-to-digital converter unit; The configuration module 300 is used to configure the configuration register corresponding to each of the detection unit groups according to the target state of each detection unit group and the target macro pixel unit; wherein, the detection unit group and the configuration register correspond one-to-one.

[0055] Therefore, this embodiment manages the status and target macropixel unit information of each detector unit group uniformly through configuration registers. It only requires determining whether each detector unit group needs to be activated and which macropixel unit to select within each activated detector unit group. Writing this information to the corresponding configuration register completes the entire configuration, reducing the complexity of the configuration operation. Furthermore, this embodiment allows for flexible setting of whether each detector unit group is activated, thereby obtaining any number of scan lines from a single line to the maximum line count. It also allows for flexible setting of the selected target macropixel unit within the detector unit group, enabling flexible configuration of any operating mode and region of interest. Additionally, this embodiment allows for independent selection of target macropixel units for each activated detector unit group. When a macropixel unit is affected by crosstalk from adjacent detector unit groups or ambient light, this macropixel unit can be avoided, and other macropixel units within the same detector unit group that are less affected by crosstalk can be selected as the target macropixel unit, effectively reducing optical crosstalk between pixels.

[0056] Based on the above embodiments, as a preferred real-time method, the configuration module 300 includes: The first configuration submodule is used to configure the first control bit in the configuration register corresponding to the activated probe unit group as the first state value, and to configure the first control bit in the configuration register corresponding to the inactive probe unit group as the second state value. The second configuration submodule is used to configure the second control bit in the configuration register corresponding to the activated detection unit group according to the position of the target macro pixel unit in its respective detection unit group.

[0057] Based on the above embodiments, as a preferred real-time method, the second configuration submodule is specifically used to: convert the position number of the target macro-pixel unit in the activated detection unit group into a binary code; and configure the second control bit in the configuration register corresponding to the activated detection unit group based on the binary code.

[0058] Regarding the apparatus in the above embodiments, the specific manner in which each module performs its operation has been described in detail in the embodiments related to the method, and will not be elaborated upon here.

[0059] Based on the hardware implementation of the above program modules, and in order to implement the method of the embodiments of this application, the embodiments of this application also provide an electronic device. Figure 12 This is a structural diagram of an electronic device according to an exemplary embodiment, such as... Figure 12 As shown, the electronic device includes: Communication interface 1 enables information exchange with other devices, such as network devices; Processor 2 is connected to communication interface 1 to enable information interaction with other devices. When running a computer program, it executes the linear array lidar chip configuration method provided by one or more of the above-mentioned technical solutions. The computer program is stored in memory 3.

[0060] Of course, in practical applications, the various components in an electronic device are coupled together through bus system 4. It can be understood that bus system 4 is used to achieve communication and connection between these components. In addition to the data bus, bus system 4 also includes a power bus, a control bus, and a status signal bus. However, for clarity, in... Figure 12 The general will label all buses as Bus System 4.

[0061] The memory 3 in this embodiment is used to store various types of data to support the operation of the electronic device. Examples of such data include any computer program used to operate on the electronic device.

[0062] It is understood that memory 3 can be volatile memory or non-volatile memory, or both. Non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), ferromagnetic random access memory (FRAM), flash memory, magnetic surface memory, optical disc, or compact disc read-only memory (CD-ROM); magnetic surface memory can be disk storage or magnetic tape storage. Volatile memory can be random access memory (RAM), which is used as an external cache. By way of example, but not limitation, many forms of RAM are available, such as Static Random Access Memory (SRAM), Synchronous Static Random Access Memory (SSRAM), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SDRAM), Double Data Rate Synchronous Dynamic Random Access Memory (DDRSDRAM), Enhanced Synchronous Dynamic Random Access Memory (ESDRAM), SyncLink Dynamic Random Access Memory (SLDRAM), and Direct Rambus Random Access Memory (DRRAM).The memory 3 described in the embodiments of this application is intended to include, but is not limited to, these and any other suitable types of memory.

[0063] The methods disclosed in the embodiments of this application can be applied to processor 2, or implemented by processor 2. Processor 2 may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by the integrated logic circuit of the hardware in processor 2 or by instructions in the form of software. The processor 2 may be a general-purpose processor, DSP, or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Processor 2 can implement or execute the methods, steps and logic block diagrams disclosed in the embodiments of this application. The general-purpose processor may be a microprocessor or any conventional processor, etc. The steps of the methods disclosed in the embodiments of this application can be directly manifested as being executed by a hardware decoding processor, or being executed by a combination of hardware and software modules in the decoding processor. The software modules may be located in a storage medium, which is located in memory 3. Processor 2 reads the program in memory 3 and completes the steps of the aforementioned method in combination with its hardware.

[0064] When processor 2 executes the program, it implements the corresponding processes in the various methods of the embodiments of this application. For the sake of brevity, these will not be described in detail here.

[0065] In an exemplary embodiment, this application also provides a storage medium, namely a computer storage medium, specifically a computer-readable storage medium, such as a memory 3 that stores a computer program, which can be executed by a processor 2 to complete the steps described in the aforementioned method. The computer-readable storage medium may be a memory such as FRAM, ROM, PROM, EPROM, EEPROM, Flash Memory, magnetic surface memory, optical disc, or CD-ROM.

[0066] Those skilled in the art will understand that all or part of the steps of the above method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it performs the steps of the above method embodiments. The aforementioned storage medium includes various media that can store program code, such as mobile storage devices, ROM, RAM, magnetic disks, or optical disks.

[0067] Alternatively, if the integrated units described above are implemented as software functional modules and sold or used as independent products, they can also be stored in a computer-readable storage medium. Based on this understanding, the technical solutions of the embodiments of this application, or the parts that contribute to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause an electronic device (which may be a personal computer, server, network device, etc.) to execute all or part of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as mobile storage devices, ROM, RAM, magnetic disks, or optical disks.

[0068] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application.

Claims

1. A linear array lidar chip, characterized in that, include: A photodetector array includes multiple detection unit groups arranged at intervals along a first direction, each detection unit group comprising multiple macropixel units arranged at intervals along a second direction, wherein the first direction and the second direction are perpendicular to each other; A configuration register connected to the photodetector array is used to control the operating status of the multiple detection unit groups and the macropixel units.

2. The linear array lidar chip according to claim 1, characterized in that, It also includes a time-to-digital converter unit corresponding to each of the detection unit groups, used to receive the electrical signal output by the macro-pixel unit in the corresponding detection unit group and convert the electrical signal into a digital quantization signal; The configuration register corresponds one-to-one with the detection unit group and is used to control whether the corresponding detection unit group is activated, and to specify the macro pixel unit that is connected to the corresponding time-to-digital converter unit in the activated detection unit group.

3. The linear array lidar chip according to claim 2, characterized in that, The configuration register includes a first control bit and a second control bit. The first control bit is used to control whether the corresponding detection unit group is activated, and the second control bit is used to specify the macro pixel unit that is connected to the corresponding time-to-digital converter unit in the activated detection unit group.

4. The linear array lidar chip according to claim 3, characterized in that, The number of the second control bits meets a preset condition, which is:

2. n ≥j, where n is the number of the second control bits, and j is the number of macropixel units contained in each of the detection unit groups.

5. The linear array lidar chip according to any one of claims 1 to 4, characterized in that, The photodetector array includes a single-photon avalanche diode array.

6. A method for configuring a linear array lidar chip, characterized in that, include: Determine the target state of each detection unit group in the photodetector array; wherein, the target state includes being activated and not being activated; In the group of detection units where the target state is activated, target macro-pixel units for communication with the corresponding time-to-digital converter units are identified; wherein, the group of detection units corresponds one-to-one with the time-to-digital converter units. Based on the target state of each detection unit group and the target macro-pixel unit, configure the configuration register corresponding to each detection unit group; wherein, the detection unit group and the configuration register correspond one-to-one.

7. The linear array lidar chip configuration method according to claim 6, characterized in that, The step of configuring the configuration register corresponding to each detection unit group based on the target state of each detection unit group and the target macro-pixel unit includes: Configure the first control bit in the configuration register corresponding to the activated probe unit group as the first state value, and configure the first control bit in the configuration register corresponding to the inactive probe unit group as the second state value. Based on the position of the target macro-pixel unit in the activated detection unit group within its respective detection unit group, configure the second control bit in the configuration register corresponding to the activated detection unit group.

8. The linear array lidar chip configuration method according to claim 7, characterized in that, The step of configuring the second control bit in the configuration register corresponding to the activated detection unit group based on the position of the target macro-pixel unit in its respective detection unit group includes: The position number of the target macropixel unit in the activated detection unit group is converted into a binary code. The second control bit in the configuration register corresponding to the activated probe unit group is configured based on the binary encoding.

9. A linear array lidar chip configuration device, characterized in that, include: The first determining module is used to determine the target state of each detection unit group in the photodetector array; wherein, the target state includes being activated and not being activated; The second determining module is used to determine, in the group of detection units in the target state of being activated, the target macro-pixel unit for communication with the corresponding time-to-digital converter unit; wherein, the group of detection units corresponds one-to-one with the time-to-digital converter unit; The configuration module is used to configure the configuration register corresponding to each of the detection unit groups according to the target state of each detection unit group and the target macro pixel unit; wherein, the detection unit group and the configuration register correspond one-to-one.

10. An electronic device, characterized in that, include: Memory, used to store computer programs; A processor for executing the computer program to implement the steps of the linear array lidar chip configuration method as described in any one of claims 6 to 8.

11. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed, implements the steps of the linear array lidar chip configuration method as described in any one of claims 6 to 8.

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