A support structure for liquid crystal module assembly and an assembly method

Abstract

The application discloses a support structure and an assembling method for liquid crystal module assembly. The support structure for liquid crystal module assembly comprises a first side structure and a second side structure matched with each other. The first side structure is arranged on a first bonding surface of a first assembling module, and the second side structure is arranged on a second bonding surface of a second assembling module. The first side structure comprises a convex point part and a flow guiding limiting part arranged on the first bonding surface. The convex point parts are uniformly arranged at intervals. The second side structure comprises a matching part matched with the flow guiding limiting part. After the first side structure is matched with the second side structure, a controlled gap is formed between the first bonding surface and the second bonding surface. The controlled gap is used for realizing uniform distribution and limiting control of adhesive. The convex point part arranged on the first bonding surface forms the controlled gap, realizes uniform distribution of the thickness of the adhesive, improves the reliability of bonding of the TP cover plate and the backlight module, and the flow guiding limiting part and the matching part can prevent the adhesive from overflowing along the plane edge.

Description

Technical Field

[0001] This invention relates to the field of liquid crystal display technology, and in particular to a support structure and assembly method for assembling liquid crystal modules. Background Technology

[0002] As a core component of various display devices, LCD modules are widely used in automotive displays, industrial control equipment, digital products, and other fields. The precision of their assembly process and the stability of their structure directly determine the performance and lifespan of the display products. During the assembly of LCD modules, the TP cover plate and backlight module are typically bonded together using adhesive to achieve structural fixation and protect the display function. As the display industry moves towards thinner, lighter, higher-precision, and more reliable designs, the market is placing higher demands on the bonding precision, structural support, and assembly efficiency of LCD modules.

[0003] In the current assembly of LCD modules, the industry's conventional dispensing assembly method is to directly glue the bonding surface of the TP cover plate to the top surface of the backlight module's baffle using adhesive. Both bonding surfaces are flat, hard surfaces. After dispensing, the adhesive is spread and cured between the two surfaces by pressing, forming an adhesive layer.

[0004] However, since both bonding surfaces are flat, the adhesive is squeezed without restraint between the two hard surfaces during pressing. The thickness of the adhesive layer depends on variable factors such as pressing pressure or adhesive viscosity, resulting in differences in adhesive thickness and flatness. This can easily cause the adhesive to overflow along the edge of the surface or even penetrate into the backlight module, which will not only affect the display effect but also reduce the bonding reliability between the TP cover and the backlight module. Summary of the Invention

[0005] The purpose of this invention is to provide a support structure and assembly method for assembling liquid crystal modules, thereby solving the problem of low bonding reliability caused by the fact that the bonding surfaces of existing liquid crystal modules are all planar.

[0006] To achieve this objective, the present invention adopts the following technical solution: A support structure for assembling a liquid crystal module includes a first side structure and a second side structure that cooperate with each other. The first side structure is disposed on a first bonding surface of a first assembly module, and the second side structure is disposed on a second bonding surface of a second assembly module. The first side structure includes a protrusion portion and a flow guiding and limiting portion disposed on the first bonding surface. The protrusion portions are evenly spaced apart, and the flow guiding and limiting portion is located between two adjacent protrusion portions and is parallel to the edge of the first bonding surface. The second side structure includes a mating part that matches the flow guiding and limiting part. After the first side structure and the second side structure mate, a controlled gap is formed between the first mating surface and the second mating surface. The controlled gap is used to achieve uniform distribution and limiting control of the adhesive. Optionally, the first assembly module has a backlight barrier for bonding and adhering to the second assembly module, the top surface of the backlight barrier being the first bonding surface.

[0007] Optionally, the top of the protrusion is rounded, the protrusion is a PET pad attached to the first bonding surface, or the protrusion is a protrusion integrally die-cast with the first assembly module.

[0008] Optionally, the flow guiding and limiting part includes a flow guiding section, a buffer section, and a limiting section. The flow guiding section has a V-shaped groove structure and is located in the center of the gap between two adjacent protrusions. The buffer section has an inverted trapezoidal groove structure and is located on both sides of the flow guiding section. The limiting section has a U-shaped groove structure and is located between the flow guiding section and the buffer section, for connecting the flow guiding section and the buffer section.

[0009] Optionally, the depth of the limiting section is less than the depth of the guide section and the buffer section.

[0010] Optionally, the mating part is a fitting protrusion attached to the second mating surface. The shape of the fitting protrusion matches the flow guiding and limiting part, and the thickness of the fitting protrusion is less than the distance from the bottom of the groove structure of the flow guiding and limiting part to the top of the protrusion.

[0011] This invention also provides a liquid crystal module assembly method, which uses the support structure for liquid crystal module assembly as described above for auxiliary assembly, and includes the following steps: Step S1: Provide a first assembly module with a first side structure and a second assembly module with a second side structure, and respectively obtain the effective support height of the protrusion, the groove volume of the flow guiding and limiting part, the occupied volume of the mating part after being embedded in the flow guiding and limiting part, and the flow performance parameters of the adhesive at the assembly temperature. Step S2: Take the area between two adjacent protrusions as a dispensing unit, and determine the target dispensing amount of each dispensing unit according to the controlled gap volume, the adhesive volume that the guide and limiting part can accommodate, and the occupied volume of the mating part. Step S3: According to the target dispensing amount, apply the adhesive in sections to the guide section of each dispensing unit, and leave an interval area for gas to be discharged between two adjacent adhesive sections. Step S4: The second assembly module and the first assembly module are initially aligned and pre-pressed with the first pressing pressure so that the mating part enters the flow guiding and limiting part, and the mating part and the bottom of the groove of the flow guiding and limiting part are kept apart. During the pre-pressing process, the adhesive flows from the flow guiding section through the limiting section to the buffer section. Step S5: Press the second assembly module area by area along the extension direction of the flow guiding and limiting part, so that each pressing area changes from an unpressed state to a pre-pressed state in sequence, so as to drive the gas between the first pressing surface and the second pressing surface to the unpressed area or buffer section. Step S6: After completing the area-by-area pressing, press the entire surface with a second pressing pressure greater than the first pressing pressure until the top of each protrusion abuts against the second bonding surface, so that a controlled gap is formed between the first bonding surface and the second bonding surface, which is defined by the effective support height of the protrusion. Step S7: During the overall pressing process, obtain the pressing displacement, pressing pressure and gap detection results at different positions. Based on the relationship between the pressing displacement and pressing pressure and the gap difference at different positions, determine whether the adhesive has been filled. Step S8: After determining that the adhesive has been filled, maintain the second pressing pressure to pre-cure the adhesive, then release the pressing pressure and finally cure the adhesive to complete the bonding assembly of the first assembly module and the second assembly module.

[0012] Optionally, in step S3, the adhesive segments are spaced apart along the extension direction of the guide segment, and the amount of adhesive applied near the end of the flow path is less than the amount of adhesive applied near the beginning of the flow path, so that the adhesive filling speed at different positions during the pressing process tends to be consistent.

[0013] Optionally, in steps S4 to S6, the adhesive is first spread in a predetermined direction within the guide section of the V-shaped trough structure, and then enters the buffer section of the inverted trapezoidal trough structure through a limiting section with a smaller trough depth; the limiting section throttles the adhesive, and the buffer section is used to accommodate excess adhesive caused by errors in the amount of adhesive applied or local dimensional errors in the bonding surface.

[0014] Optionally, in step S7, when the change in the pressing displacement under constant pressing pressure is less than a first preset threshold and the gap difference at different detection positions is less than a second preset threshold, it is determined that the adhesive filling is complete; or, when the curve of the change between pressing pressure and pressing displacement shows a characteristic inflection point that represents the formation of stable support by the protrusion, it is determined that the pressing end point has been reached.

[0015] Compared with the prior art, the present invention has the following beneficial effects: In the support structure for assembling a liquid crystal module provided in this embodiment of the invention, when the first assembly module and the second assembly module are aligned along the bonding direction, the protruding part abuts against the second bonding surface, and the mating part is embedded in the groove of the flow guiding and limiting part, thereby forming a controlled gap between the first bonding surface and the second bonding surface. The controlled gap provides a space for the adhesive to be contained, and the flow guiding and limiting part guides the flow of the adhesive. The adhesive is not excessively squeezed by disordered pressure within the controlled gap, and it makes full contact with the first bonding surface and the second bonding surface, ensuring that the adhesive is evenly distributed within the controlled gap and preventing overflow into non-target areas. At the same time, it can avoid the problem of uneven thickness caused by unconstrained extrusion of adhesive in the planar pressing method, and improve the reliability of bonding between the TP cover plate and the backlight module. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0018] Figure 1 This is a schematic diagram of a support structure for assembling a liquid crystal module.

[0019] Figure 2 for Figure 1 A magnified view of part A in the middle.

[0020] Figure 3 This is a schematic diagram of the back side structure of a support structure for assembling a liquid crystal module.

[0021] Figure 4 This is a partial structural diagram of the first assembly module and the second assembly module.

[0022] Figure 5 This is a partial structural cross-sectional view of the first and second assembly modules after assembly.

[0023] Figure 6 for Figure 5 A magnified view of part B in the middle.

[0024] Illustration: 1. First assembly module; 11. Protrusion part; 12. Flow guiding and limiting part; 121. Flow guiding section; 122. Buffer section; 123. Limiting section; 2. Second assembly module; 21. Mating part. Detailed Implementation

[0025] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0026] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.

[0027] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0028] Example 1: like Figures 1-6 As shown, this embodiment of the invention provides a support structure for assembling a liquid crystal module, applicable to scenarios where the TP cover plate and the backlight module are bonded together. In existing assembly processes, the TP cover plate and the backlight module are usually assembled by planar bonding and adhesive bonding. However, this assembly method has the defects of glue overflow and low bonding reliability. Therefore, this embodiment aims to provide a support structure that can effectively avoid glue overflow due to compression bonding and ensure bonding reliability through structural improvements.

[0029] like Figure 1 , Figure 2 and Figure 3As shown, in this embodiment, the support structure for assembling the liquid crystal module includes a first side structure and a second side structure that cooperate with each other. The first side structure is disposed on the first bonding surface of the first assembly module 1, and the second side structure is disposed on the second bonding surface of the second assembly module 2. The first side structure includes a protrusion portion 11 and a flow guiding and limiting portion 12 disposed on the first bonding surface. The protrusion portions 11 are evenly spaced, and the flow guiding and limiting portion 12 is located between two adjacent protrusion portions 11 and parallel to the edge of the first bonding surface. The second side structure includes a mating portion 21 that matches the flow guiding and limiting portion 12. After the first side structure and the second side structure are mated, a controlled gap is formed between the first bonding surface and the second bonding surface. The controlled gap is used to achieve uniform distribution and limiting control of the adhesive.

[0030] Specifically, the first assembly module 1 is a backlight module, and the second assembly module 2 is a TP cover plate. The surface of the second assembly module 2 has a first bonding surface and a second bonding surface. The top surface where the backlight baffle of the backlight module is bonded to the TP cover plate is the first bonding surface, and the edge of the surface where the TP cover plate is bonded to the backlight module is the second bonding surface. The first side structure on the first bonding surface and the second side structure on the second bonding surface cooperate to achieve precise positioning of the TP cover plate and improve bonding accuracy. The first side structure consists of several protrusions 11 formed on the first bonding surface. The protrusions 11 are evenly distributed at intervals on the top surface of the backlight baffle to stably and coplanarly support the TP cover plate. The first side structure also includes flow guiding and limiting portions 12 formed between adjacent protrusions 11. The flow guiding and limiting portions 12 are parallel to the edge of the first bonding surface and are used to guide the flow of adhesive and limit its range. The second side structure is a mating part 21 that is provided on the second mating surface and cooperates with the flow guiding and limiting part 12. When the first assembly module 1 and the second assembly module 2 are aligned along the mating direction, the mating part 21 is embedded in the groove of the flow guiding and limiting part 12, thereby forming a controlled gap between the first mating surface and the second mating surface.

[0031] During assembly, adhesive is applied to the first bonding surface, specifically in the area between the protrusions 11 and the flow-guiding and limiting portion 12. The TP cover plate is then aligned and pressed against the backlight module. During adhesive curing, the bonding pressure is maintained to ensure the adhesive fully fills the controlled gap and cures, thus completing the assembly of the LCD module. Due to the guiding effect of the flow-guiding and limiting portion 12, the adhesive can diffuse evenly around the protrusions. Simultaneously, the protrusions 11, evenly and spaced on the top surface of the backlight baffle, ensure that the first and second bonding surfaces remain parallel while forming a controlled gap between them, providing space for the adhesive. The flow-guiding and limiting portion 12 guides the flow of the adhesive, preventing it from being excessively squeezed by disordered pressure within the controlled gap. This ensures the adhesive evenly fills the entire gap and makes full contact with both the first and second bonding surfaces, guaranteeing uniform distribution within the controlled gap and preventing overflow into non-target areas. Therefore, by setting the protrusion part 11 on the first bonding surface to form a controlled gap, the uniform distribution of adhesive thickness is achieved, avoiding the problem of uneven thickness caused by unrestrained extrusion of adhesive in the planar pressing method, and improving the reliability of bonding between the TP cover plate and the backlight module; at the same time, the flow guiding and limiting part 12 and the mating part 21 can effectively restrict the flow of adhesive, prevent adhesive from overflowing or penetrating into the backlight module along the edge of the plane, and avoid affecting the display effect of the liquid crystal module.

[0032] Furthermore, the top of the protrusion 11 is rounded, and the protrusion 11 is a PET pad attached to the first bonding surface, or the protrusion 11 is a protrusion integrally die-cast with the first assembly module 1.

[0033] Specifically, the top of the protrusion 11 is designed with rounded corners to reduce stress concentration when the TP cover plate contacts the protrusion, preventing scratches or localized indentations. Pre-fabricated PET gasket protrusions are attached to the first mating surface. The PET material is flexible and has some cushioning properties, which can absorb localized pressure changes during pressing, avoiding stress concentration at the contact point between the TP cover plate and the protrusion. Using PET gaskets for the protrusion 11 facilitates replacement and adjustment, suitable for small-batch or highly customized needs. In some embodiments, the protrusion 11 can also be a protrusion directly die-cast integrally with the first assembly module 1. By designing a composite mold with microcavities, the first assembly module 1 with the protrusion is formed through injection molding or die casting. The top of the protrusion is rounded to ensure smooth and stable contact between the TP cover plate and the protrusion. The integral die-casting method for the protrusion has the advantages of high consistency and high production efficiency, making it suitable for mass production.

[0034] For example, the height of the protrusion is 0.2mm-0.3mm and the width is 0.2mm-0.25mm. This ensures that the protrusion does not affect the width of the adhesive applied to the backlight baffle, while avoiding excessive thickness of the controlled gap. This ensures high bonding reliability between the first assembly module 1 and the second assembly module 2 while preventing excessive adhesive layer thickness.

[0035] like Figure 2 , Figure 4 , Figure 5 and Figure 6 As shown, in this embodiment of the invention, the flow guiding and limiting part 12 includes a flow guiding section 121, a buffer section 122, and a limiting section 123. The flow guiding section 121 has a V-shaped groove structure and is located in the center of the gap between two adjacent protrusions 11. The buffer section 122 has an inverted trapezoidal groove structure and is located on both sides of the flow guiding section 121. The limiting section 123 has a U-shaped groove structure and is located between the flow guiding section 121 and the buffer section 122, for connecting the flow guiding section 121 and the buffer section 122.

[0036] Specifically, the flow guiding and limiting part 12 is disposed between two adjacent protrusions and parallel to the edge of the bonding surface, used to guide and restrict the flow of adhesive. The flow guiding and limiting part 12 includes a flow guiding section 121, a buffer section 122, and a limiting section 123. During assembly, adhesive is first applied to the first bonding surface, with the adhesive applied at the center of the gap between two adjacent protrusions, without extending to the edge of the top surface of the backlight barrier. Then, when the first assembly module 1 and the second assembly module 2 are pressed together, the adhesive is pressed towards both sides of the top surface of the backlight barrier. The flow guiding section 121 has a V-shaped groove structure and is located at the center of the gap between adjacent protrusions. After the adhesive is applied, the flow guiding section 121 guides the adhesive to flow along the groove, ensuring uniform adhesive distribution between two adjacent protrusions. The buffer section 122 has an inverted trapezoidal groove structure and is located on both sides of the guide section 121. Multiple buffer sections 122 can be arranged on opposite sides of the guide section 121. When the first assembly module 1 and the second assembly module 2 are pressed together, the buffer section 122 can buffer the flow of glue. The glue can enter the buffer section 122 for buffering during pressing, preventing the glue from overflowing instantly. The limiting section 123 has a U-shaped groove structure and is located between the guide section 121 and the buffer section 122. It is used to connect the guide section 121 and the buffer section 122. When the first assembly module 1 and the second assembly module 2 are pressed together, the limiting section 123 can guide the glue from the guide section 121 into the buffer section 122, avoiding irregular flow of glue and thus preventing the glue from exceeding the predetermined area.

[0037] Furthermore, the depth of the groove in the limiting section 123 is less than the depth of the grooves in the guiding section 121 and the buffer section 122. For example, the groove depth of the guiding section 121 is relatively large. When adhesive is applied between two adjacent protrusions, the guiding section 121 can temporarily store the adhesive, preventing it from spreading disorderly to both sides and facilitating subsequent controlled extrusion. The groove depth of the buffer section 122 is similar to that of the guiding section 121, used to alleviate the adhesive extrusion pressure during pressing. The groove depth of the limiting section 123 is relatively shallow, only used to restrict the flow of adhesive to the edge, and does not require a large amount of adhesive storage or flow space. The positions corresponding to the guiding section 121 and the buffer section 122 are the main positions for bonding the first assembly module 1 and the second assembly module 2. Therefore, by making the groove depths of the guiding section 121 and the buffer section 122 relatively large, more adhesive can be stored, which is beneficial to improving the reliability of the bonding between the first assembly module 1 and the second assembly module 2.

[0038] like Figure 2 , Figure 4 , Figure 5 and Figure 6 As shown, in this embodiment of the invention, the mating part 21 is a fitting protrusion attached to the second mating surface. The shape of the fitting protrusion matches the flow guiding and limiting part 12, and the thickness of the fitting protrusion is less than the distance between the bottom of the groove structure of the flow guiding and limiting part 12 and the top of the protrusion part 11.

[0039] Specifically, the second side structure includes a fitting protrusion disposed on the second mating surface, which matches the flow guiding and limiting portion 12 on the first side structure. The thickness of the fitting protrusion is less than the distance from the bottom of the groove of the flow guiding and limiting portion 12 to the top of the protrusion, thereby forming a controlled gap when the TP cover plate is bonded to the backlight module, ensuring that the TP cover plate does not contact areas other than the top of the protrusion during the pressing process.

[0040] During assembly, adhesive is first applied to the top surface of the backlight baffle of the first assembly module 1, ensuring that the protrusions 11 and the flow guiding and limiting parts 12 are properly positioned. Then, the TP cover plate of the second assembly module 2 is aligned with the first assembly module 1, causing the fitting protrusions to embed into the groove of the flow guiding and limiting part 12. The cooperation between the fitting protrusions and the groove structure of the flow guiding and limiting part 12 limits the fit of the first assembly module 1, improving fit accuracy.

[0041] In practice, the fitting protrusion can be made of a rigid material integrally formed with the second assembly module 2, or it can be in the form of a gasket that can be adhered to the TP cover plate. The shape of the fitting protrusion matches the groove of the flow guiding and limiting part 12, such as V-shaped, inverted trapezoidal or U-shaped, which can be adjusted according to the design requirements of the LCD module.

[0042] Example 2: This invention also provides a liquid crystal module assembly method, applicable to assembling a first assembly module 1 and a second assembly module 2, and using the above-described support structure for liquid crystal module assembly for auxiliary assembly, comprising the following steps: Step S1: Provide a first assembly module 1 with a first side structure and a second assembly module 2 with a second side structure, and respectively obtain the effective support height of the protrusion part 11, the groove volume of the flow guiding and limiting part 12, the occupied volume of the mating part 21 after being embedded in the flow guiding and limiting part 12, and the flow performance parameters of the adhesive at the assembly temperature. For example, a backlight module is provided, and a protrusion 11 and a flow guiding and limiting part 12 are provided on the top surface of the backlight baffle of the backlight module; a TP cover plate is provided, and the surface of the TP cover plate that is bonded to the backlight module is provided with a fitting protrusion that matches the flow guiding and limiting part 12.

[0043] Step S2: Take the area between two adjacent protrusions 11 as a dispensing unit, and determine the target dispensing amount of each dispensing unit according to the controlled gap volume, the adhesive volume that the flow limiting part 12 can accommodate, and the occupying volume of the mating part 21. Specifically, on the top surface of the backlight baffle of the backlight module, in the area of ​​the guide section 121 located in the center of the gap between two adjacent protrusions 11, adhesive is applied according to the pre-designed amount. Application can be done by dotting or spraying to ensure the adhesive is distributed in the center, providing a uniform adhesive layer for subsequent lamination.

[0044] Furthermore, the preset amount of adhesive is applied in segments to the gaps between adjacent protrusions 11, and the amount of adhesive applied in each segment is preset to match the volume of the channel of the guide and limiting part 12, so that the amount of adhesive is matched with the actual adhesive space of each dispensing unit, thereby reducing the problem of local lack of adhesive or excessive adhesive caused by the mismatch between the uniform dispensing amount and the local structural differences.

[0045] For example, the target dispensing amount of the i-th dispensing unit can be determined according to the following formula: ; in, Let Vi1 be the target dispensing amount for the i-th dispensing unit, Vi2 be the controlled gap volume corresponding to the i-th dispensing unit, Vi3 be the volume of adhesive that the guiding and limiting part in the i-th dispensing unit can accommodate, and Vi4 be the occupied volume in the i-th dispensing unit after the mating part is embedded in the guiding and limiting part. Here, the dispensing compensation coefficient is... The dispensing compensation coefficient is determined based on the adhesive viscosity, assembly temperature, flow path length of the dispensing unit, and surface roughness of the first and second bonding surfaces; the higher the adhesive viscosity or the longer the flow path, the higher the corresponding dispensing compensation coefficient. The larger.

[0046] Step S3: According to the target dispensing amount, apply the adhesive in sections to the guide section 121 of each dispensing unit, and leave an interval area for gas to be discharged between two adjacent sections of adhesive. Specifically, each adhesive segment is spaced apart along the extension direction of the guide segment 121, and the amount of adhesive applied near the end of the flow path is less than the amount of adhesive applied near the beginning of the flow path, so that the adhesive filling speed at different positions during the pressing process tends to be consistent, so that the air in the initial stage of pressing has a clear flow and discharge path, and avoids the continuous adhesive strip from forming a closed area in the initial stage of pressing, thereby reducing the phenomenon of air bubbles, voids and adhesive breaks inside the adhesive layer.

[0047] Step S4: The second assembly module 2 and the first assembly module 1 are initially aligned and pre-pressed with the first pressing pressure, so that the mating part 21 enters the flow guiding and limiting part 12, and the mating part 21 and the bottom of the groove of the flow guiding and limiting part 12 are kept apart. During the pre-pressing process, the adhesive flows from the flow guiding section 121 through the limiting section 123 to the buffer section 122. Specifically, the first pressing pressure is set to cause the mating part 21 to enter the flow guiding and limiting part 12, and at least some of the protrusions 11 have not yet fully borne the pressing load of the second assembly module 2; the first pressing pressure is maintained for a preset time so that the adhesive completes the initial spreading before the final adhesive layer thickness is reached.

[0048] For example, the TP cover is pressed onto the backlight module with a preset pressure, so that the top of the protrusion 11 contacts the second bonding surface, and the mating part 21 is embedded in the groove of the flow guiding and limiting part 12 to form a controlled gap. The protrusion 11 can ensure that the pressing depth and pressing pressure of the TP cover are consistent, avoid disorderly diffusion of adhesive, and thus ensure the consistency of adhesive thickness.

[0049] Meanwhile, after the TP cover plate and the backlight module are pressed together, the adhesive is squeezed by the flow guiding and limiting part 12 and the mating part 21, which evenly fills the controlled gap. This is conducive to the orderly diffusion of the adhesive to both sides in the controlled gap, ensuring that the adhesive is evenly distributed and preventing the adhesive from overflowing.

[0050] Step S5: Press the second assembly module 2 in sections along the extension direction of the flow guiding and limiting part 12, so that each pressing area changes from an unpressed state to a pre-pressed state in sequence, so as to drive the gas between the first pressing surface and the second pressing surface to the unpressed area or buffer section 122. Specifically, the second assembly module 2 is first positioned at a preset angle relative to the first assembly module 1. Then, the preset angle is gradually reduced from one end of the second assembly module 2 to the other, causing the pressing contact area to move continuously along the extension direction of the flow-guiding and limiting part 12. When the second assembly module 2 and the first assembly module 1 become nearly parallel, the entire assembly is then pressed together. By pressing the components section by section along the extension direction of the flow-guiding and limiting part 12, the air between the first and second bonding surfaces moves continuously from the pressed area to the unpressed area, reducing the air sealing problem caused by synchronous overall pressing and improving the continuity of the adhesive layer and the venting effect of the bonding area.

[0051] Step S6: After completing the area-by-area pressing, press the entire surface with a second pressing pressure greater than the first pressing pressure until the top of each protrusion 11 abuts against the second bonding surface, so that a controlled gap is formed between the first bonding surface and the second bonding surface, which is limited by the effective support height of the protrusion 11. For example, at least one micro-amplitude reciprocating pressure with an amplitude smaller than the controlled gap height is applied to the second assembly module 2, causing air bubbles in the adhesive to migrate along the guide section 121 and the limiting section 123 to the buffer section 122, and then returning to the second pressing pressure after the micro-amplitude reciprocating pressure is completed.

[0052] Step S7: During the overall pressing process, obtain the pressing displacement, pressing pressure and gap detection results at different positions. Based on the relationship between the pressing displacement and pressing pressure and the gap difference at different positions, determine whether the adhesive has been filled. Specifically, when the change in pressing displacement under constant pressing pressure is less than the first preset threshold and the gap difference at different detection positions is less than the second preset threshold, the adhesive is determined to be filled; or, when the curve of the change between pressing pressure and pressing displacement shows a characteristic inflection point that indicates the formation of stable support by the protrusion 11, the pressing endpoint is determined to be reached.

[0053] Step S8: After determining that the adhesive has been filled, maintain the second pressing pressure to pre-cure the adhesive, then release the pressing pressure and finally cure the adhesive to complete the bonding assembly of the first assembly module 1 and the second assembly module 2. Specifically, pre-curing includes sequentially and locally curing the adhesive within different dispensing units while maintaining the second pressing pressure, creating initially fixed areas with spaced distribution among the multiple dispensing units. Final curing includes overall curing of all adhesive after releasing the pressing pressure. The local curing proceeds sequentially from the center of the first assembly module 1 towards both ends or from one end to the other, allowing the adhesive in uncured areas to continue flowing and releasing residual stress. During adhesive curing, the pressing pressure of the TP cover plate is maintained, ensuring the adhesive evenly fills the controlled gaps and cures under the constraint of the protrusions and flow-guiding structures, ultimately forming a stable and reliable adhesive layer.

[0054] For example, after assembly, the adhesive layer width, adhesive layer continuity, and adhesive overflow of different dispensing units are detected. The detection results are correlated with the target dispensing amount, first pressing pressure, second pressing pressure, and pressing holding time of the corresponding dispensing unit to correct the target dispensing amount or pressing parameters in the subsequent LCD module assembly process. Through the coordinated operation of target dispensing amount calculation, segmented dispensing, flow guiding and throttling, zone-by-zone venting, staged pressing, pressing state detection, and staged curing, comprehensive control of adhesive usage, flow direction, venting process, adhesive layer thickness, and curing state is achieved.

[0055] Understandably, the pre-set amount of adhesive is applied in segments to the gaps between adjacent protrusions 11, and the amount of adhesive applied in each segment is pre-matched to the volume of the channel of the flow-guiding and limiting part 12. On the first bonding surface of the backlight module, the gap area between every two adjacent protrusions 11 is divided into coating areas. Since the backlight baffles on different sides of the backlight module are of different lengths, the spacing between the protrusions 11 can be matched and arranged according to the length of the backlight baffles. The amount of adhesive applied to each coating area is pre-set according to the volume of the channel of the flow-guiding and limiting part 12 to ensure that the adhesive can fully fill the channel without overflowing during the pressing process.

[0056] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A support structure for assembling a liquid crystal module, characterized in that, It includes a first side structure and a second side structure that cooperate with each other. The first side structure is disposed on the first mating surface of the first assembly module (1), and the second side structure is disposed on the second mating surface of the second assembly module (2). The first side structure includes a protrusion (11) and a flow guiding and limiting part (12) disposed on the first bonding surface. The protrusions (11) are evenly spaced apart, and the flow guiding and limiting part (12) is located between two adjacent protrusions (11) and parallel to the edge of the first bonding surface. The second side structure includes a mating part (21) that matches the flow guiding and limiting part (12). After the first side structure and the second side structure are mated, a controlled gap is formed between the first mating surface and the second mating surface. The controlled gap is used to achieve uniform distribution and limiting control of the adhesive.

2. The support structure for assembling a liquid crystal module according to claim 1, characterized in that, The first assembly module (1) has a backlight barrier for bonding with the second assembly module (2), and the top surface of the backlight barrier is the first bonding surface.

3. The support structure for assembling a liquid crystal module according to claim 2, characterized in that, The top of the protrusion (11) is rounded. The protrusion (11) is a PET pad attached to the first bonding surface, or the protrusion (11) is a protrusion integrally die-cast with the first assembly module (1).

4. The support structure for assembling a liquid crystal module according to claim 1, characterized in that, The flow guiding and limiting part (12) includes a flow guiding section (121), a buffer section (122) and a limiting section (123). The flow guiding section (121) has a V-shaped groove structure and is located in the center of the gap between two adjacent protrusions (11). The buffer section (122) has an inverted trapezoidal groove structure and is located on both sides of the flow guiding section (121). The limiting section (123) has a U-shaped groove structure and is located between the flow guiding section (121) and the buffer section (122) for connecting the flow guiding section (121) and the buffer section (122).

5. The support structure for assembling a liquid crystal module according to claim 4, characterized in that, The depth of the groove of the limiting section (123) is less than the depth of the groove of the guide section (121) and the buffer section (122).

6. The support structure for assembling a liquid crystal module according to claim 4, characterized in that, The mating part (21) is a fitting protrusion attached to the second mating surface. The shape of the fitting protrusion matches the flow guiding and limiting part (12), and the thickness of the fitting protrusion is less than the distance between the bottom of the groove structure of the flow guiding and limiting part (12) and the top of the protrusion part (11).

7. A method for assembling a liquid crystal module, characterized in that, The auxiliary assembly using the support structure for assembling a liquid crystal module as described in any one of claims 1-6 includes the following steps: Step S1: Provide a first assembly module (1) with a first side structure and a second assembly module (2) with a second side structure, and respectively obtain the effective support height of the protrusion part (11), the groove volume of the flow guiding and limiting part (12), the occupying volume of the mating part (21) after being embedded in the flow guiding and limiting part (12), and the flow performance parameters of the adhesive at the assembly temperature. Step S2: Take the area between two adjacent protrusions (11) as a dispensing unit, and determine the target dispensing amount of each dispensing unit according to the controlled gap volume, the adhesive volume that the flow limiting part (12) can accommodate, and the occupying volume of the mating part (21) corresponding to each dispensing unit. Step S3: According to the target dispensing amount, the adhesive is applied in sections to the guide section (121) of each dispensing unit, and a gap area for gas to be discharged is reserved between two adjacent sections of adhesive. Step S4: The second assembly module (2) and the first assembly module (1) are initially aligned and pre-pressed with the first pressing pressure so that the mating part (21) enters the flow guiding and limiting part (12) and the mating part (21) and the bottom of the groove of the flow guiding and limiting part (12) are kept apart. During the pre-pressing process, the adhesive flows from the flow guiding section (121) through the limiting section (123) to the buffer section (122). Step S5: Press the second assembly module (2) along the extension direction of the flow limiting part (12) area by area, so that each pressing area changes from an unpressed state to a pre-pressed state in sequence, so as to drive the gas between the first pressing surface and the second pressing surface to the unpressed area or buffer section (122). Step S6: After completing the area-by-area pressing, press the whole body with a second pressing pressure greater than the first pressing pressure until the top of each protrusion (11) abuts against the second bonding surface, so that a controlled gap is formed between the first bonding surface and the second bonding surface, which is defined by the effective support height of the protrusion (11). Step S7: During the overall pressing process, obtain the pressing displacement, pressing pressure and gap detection results at different positions. Based on the relationship between the pressing displacement and pressing pressure and the gap difference at different positions, determine whether the adhesive has been filled. Step S8: After determining that the adhesive has been filled, maintain the second pressing pressure to pre-cure the adhesive, then release the pressing pressure and finally cure the adhesive to complete the bonding assembly of the first assembly module (1) and the second assembly module (2).

8. The liquid crystal module assembly method according to claim 7, characterized in that, In step S3, each adhesive segment is spaced apart along the extension direction of the guide segment (121), and the amount of adhesive applied near the end of the flow path is less than the amount of adhesive applied near the beginning of the flow path, so that the adhesive filling speed at different positions during the pressing process tends to be consistent.

9. The liquid crystal module assembly method according to claim 7, characterized in that, In steps S4 to S6, the adhesive is first spread in a predetermined direction in the guide section (121) of the V-shaped trough structure, and then enters the buffer section (122) of the inverted trapezoidal trough structure through the limiting section (123) with a smaller trough depth; the limiting section (123) throttles the adhesive, and the buffer section (122) is used to accommodate excess adhesive caused by errors in the amount of adhesive applied or local dimensional errors in the bonding surface.

10. The liquid crystal module assembly method according to claim 7, characterized in that, In step S7, when the change in the pressing displacement under constant pressing pressure is less than the first preset threshold and the gap difference at different detection positions is less than the second preset threshold, it is determined that the adhesive filling is completed; or, when the curve of the change between pressing pressure and pressing displacement shows a characteristic turning point that represents the formation of stable support of the protrusion (11), it is determined that the pressing end point has been reached.

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