Heat dissipation structure, projector and electronic device

Abstract

The application relates to a heat dissipation structure, a projector and electronic equipment, the heat dissipation structure comprising a fixing support, an outer shell covering the outside of the fixing support, and electronic devices arranged on the fixing support; hollow structures are arranged on two adjacent or opposite sides of the outer shell to form an air inlet and an air outlet, a first fan is arranged on the fixing support at a position corresponding to the air inlet, and a second fan is arranged on the fixing support at a position corresponding to the air outlet; a first air duct and a second air duct are arranged between the air inlet and the air outlet, the first air duct extends from the air inlet, through the space between the top of the electronic devices and the outer shell, and to the air outlet, and the second air duct extends from the air inlet, through the space between the bottom of the electronic devices and the fixing support, and to the air outlet.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic devices, and more particularly to a heat dissipation structure, a projector, and an electronic device. Background Technology

[0002] Currently, most projector optical engine cooling relies on the overall ID (integrated design) casing as an airflow channel to dissipate the heat generated by the optical engine. However, heat dissipation is heavily influenced by the casing. Changes in the ID design can alter the internal airflow, leading to variations in airflow path and spacing, resulting in inconsistent air resistance. Each ID change necessitates redesigning the cooling system, severely impacting development timelines. Furthermore, utilizing the casing results in a disorganized internal airflow pattern, preventing airflow from effectively reaching and dissipating heat from the components. It also hinders the precise identification of components with high temperatures requiring accelerated cooling. Summary of the Invention

[0003] To address the aforementioned technical problems, this invention provides a heat dissipation structure, a projector, and an electronic device, resolving the issues of chaotic internal airflow and low heat dissipation efficiency in electronic devices.

[0004] To achieve the above objectives, the technical solution adopted in this embodiment of the invention is: a heat dissipation structure, including a fixed bracket, a housing covering the outside of the fixed bracket, and electronic devices disposed on the fixed bracket;

[0005] The outer casing has a hollow structure on two adjacent or opposite sides to form an air inlet and an air outlet. A first fan is provided on the fixed bracket at a position corresponding to the air inlet, and a second fan is provided on the fixed bracket at a position corresponding to the air outlet.

[0006] A first air duct and a second air duct are provided between the air inlet and the air outlet. The first air duct extends from the air inlet, through the space between the top of the electronic device and the outer casing, and to the air outlet. The second air duct extends from the air inlet, through the space between the bottom of the electronic device and the fixed bracket, and to the air outlet.

[0007] Optionally, the electronic device is disposed on the side of the first fan away from the air inlet, and a first heat sink is disposed between the first fan and the electronic device. The air outlet direction of the first heat sink is inclined upward, so that the air blown out by the first fan flows to the top of the electronic device after passing through the first heat sink.

[0008] Optionally, the first heat sink extends along a first direction from the bottom to the top of the electronic device, and in the first direction, the first heat sink includes a first part and a second part, the first part extending in a direction parallel to the first direction, and the second part extending obliquely towards the side closer to the electronic device.

[0009] Optionally, an air guide shroud is provided around the side of the first fan away from the air inlet. The air guide shroud includes a first air guide plate disposed away from the bottom of the housing, and two second air guide plates disposed adjacent to the first air guide plate. The first air guide plate extends obliquely towards the top of the housing.

[0010] Optionally, a second heat sink is provided on the top of the electronic device, and the extension direction of the second heat sink is parallel to the extension direction of the first air duct.

[0011] Optionally, a third heat sink is provided at the bottom of the electronic device, and the extension direction of the third heat sink is parallel to the extension direction of the second air duct.

[0012] This invention also provides a projector, including the heat dissipation structure described above, wherein the projector includes an optical engine module, and the electronic device includes the optical engine module.

[0013] Optionally, it also includes a motherboard disposed below the optical engine module and a power board disposed on one side of the motherboard, wherein the second air duct includes the space between the optical engine module and the motherboard, and the space between the optical engine module and the power board.

[0014] Optionally, a fourth heat sink is provided on the side of the motherboard near the optical engine module, and the extension direction of the fourth heat sink is parallel to the extension direction of the second air duct.

[0015] Optionally, the projector further includes a first adjustment structure, which includes a first processor and a first temperature sensor disposed on the second heat sink. The first temperature sensor is used to sense the temperature of the optical engine module, and the first processor is used to adjust the speed of the first fan and / or the second fan when the temperature sensed by the first temperature sensor exceeds a first preset temperature.

[0016] Optionally, the projector further includes a second adjustment structure, which includes a second processor and a second temperature sensor disposed on the second fan. The second temperature sensor is used to sense the temperature at the air outlet, and the second processor is used to adjust the speed of the first fan and / or the second fan when the temperature sensed by the second temperature sensor exceeds a second preset temperature.

[0017] Optionally, the projector further includes a backlight structure that provides a light source for the optical engine module, the backlight structure being disposed on the side of the fixed bracket opposite to the first fan;

[0018] The projector also includes a fifth heat sink connected to the backlight structure. The fifth heat sink is located on the side of the second fan near the housing. The second air duct includes the space between the backlight structure and the optical engine module.

[0019] Optionally, a dimming structure is provided between the backlight structure and the light-incident side of the optical engine module. The dimming structure includes a light funnel, and a sixth heat sink is provided on the first surface of the light funnel near the top of the housing.

[0020] Optionally, an L-shaped air guide plate is provided on the first surface. The L-shaped air guide plate is located on the side of the sixth heat sink away from the first fan. The cross-section of the L-shaped air guide plate in the direction parallel to the top of the outer casing is L-shaped.

[0021] The L-shaped air guide plate includes a first guide plate and a second guide plate. The first guide plate is perpendicular to the direction from the first fan to the optomechanical module. The second guide plate is located on the side of the first guide plate away from the second fan. The angle between the first guide plate and the second guide plate is greater than or equal to 90 degrees.

[0022] Optionally, the projector further includes a third adjustment structure, which includes a third processor and a third temperature sensor disposed on the backlight structure. The third temperature sensor is used to sense the temperature of the backlight structure, and the third processor is used to adjust the speed of the first fan and / or the second fan when the temperature sensed by the third temperature sensor exceeds a third preset temperature.

[0023] This invention also provides an electronic device including the heat dissipation structure described above.

[0024] The beneficial effects of this invention are as follows: The heat dissipation structure provided in this embodiment includes a fixed bracket, a housing covering the outside of the fixed bracket, and electronic components mounted on the fixed bracket. Furthermore, the heat dissipation structure includes a first air duct and a second air duct disposed between an air inlet and an air outlet. The first air duct passes through the top of the electronic components to dissipate heat from the top of the electronic components, and the second air duct passes through the bottom of the electronic components to dissipate heat from the bottom of the electronic components. This avoids placing all electronic components at the bottom or top, causing internal heat accumulation, and the dual air ducts provide balanced heat dissipation, improving heat dissipation efficiency. Attached Figure Description

[0025] Figure 1 A schematic diagram illustrating a projector in an embodiment of the present invention;

[0026] Figure 2 A schematic diagram illustrating a projector in an embodiment of the present invention;

[0027] Figure 3 A schematic diagram illustrating a projector in an embodiment of the present invention;

[0028] Figure 4 A schematic diagram illustrating a projector in an embodiment of the present invention;

[0029] Figure 5 A schematic diagram illustrating a projector in an embodiment of the present invention;

[0030] Figure 6 A schematic diagram illustrating a projector in an embodiment of the present invention;

[0031] Figure 7 This is a schematic diagram illustrating a projector in an embodiment of the present invention. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0033] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0034] The features such as "parallel," "perpendicular," and "identical" used in the embodiments of this disclosure include features in the strict sense of "parallel," "perpendicular," and "identical," as well as cases where "approximately parallel," "approximately perpendicular," and "approximately identical" include certain tolerances. Taking into account the measurement and the tolerances associated with the measurement of a specific quantity (e.g., limitations of the measurement system), they represent the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of said value.

[0035] Furthermore, throughout this document, unless otherwise defined, the terms “substantially,” “essentially,” “approximately,” and “about” are used to describe and explain small variations. When used with an event or situation, these terms can cover situations where the event or situation occurs precisely or approximately. For example, when used with a numerical value, these terms can include a range of variation of the numerical value less than or equal to 10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term “substantially coplanar” can refer to two surfaces arranged along the same plane within a micrometer range, for example, within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm.

[0036] refer to Figures 1-7 This embodiment provides a heat dissipation structure, including a fixed bracket 2, a housing 1 covering the outside of the fixed bracket 2, and electronic devices disposed on the fixed bracket 2;

[0037] The outer casing 1 has a hollow structure on two adjacent or opposite sides to form an air inlet 101 and an air outlet 102. A first fan 4 is provided on the fixed bracket 2 at a position corresponding to the air inlet 101, and a second fan 5 is provided on the fixed bracket 2 at a position corresponding to the air outlet 102.

[0038] A first air duct and a second air duct are provided between the air inlet 101 and the air outlet 102 (for reference). Figure 5 The dashed arrow 100 indicates the location of the first air duct, and the dashed arrow 200 indicates the location of the second air duct. The first air duct extends from the air inlet 101, through the space between the top of the electronic device and the outer casing 1, and to the air outlet 102. The second air duct extends from the air inlet 101, through the space between the bottom of the electronic device and the fixed bracket 2, and to the air outlet 102.

[0039] It should be noted that the fixed bracket 2 and the outer shell 1 together form a sealed cavity, and the first air duct and the second air duct are formed by the fixed bracket 2, the outer shell 1, and the electronic components disposed within the fixed bracket 2. With the cooperation of the first fan 4 and the second fan 5, the air entering the sealed cavity from the air inlet 101 is driven to flow through the first air duct and the second air duct respectively, and then discharged from the air outlet 102.

[0040] The heat dissipation structure provided in this embodiment of the invention is provided with a first air duct and a second air duct. The first air duct includes the space between the electronic device and the top of the outer casing 1, and the second air duct includes the space between the bottom of the electronic device and the fixed bracket 2. In this way, the heat from both the top and bottom of the electronic device will be reduced, and the electronic device will be evenly cooled, thus improving the heat dissipation efficiency.

[0041] It should be noted that the number of heat-generating electronic devices mounted on the fixed bracket 2, as well as the location of the heat-generating electronic devices, can be set according to actual needs. However, regardless of whether the electronic devices are located near the top of the outer casing 1 or near the bottom of the fixed bracket 2, they can be dissipated through the first air duct and the second air duct to avoid the accumulation of internal heat.

[0042] The fixed bracket 2 is a box structure with an open top. The fixed bracket 2 includes a bottom wall and side walls around the bottom wall. The side walls of the fixed bracket 2 are provided with a first ventilation opening 21 for exposing the first fan 4. In the direction perpendicular to the bottom wall, the first ventilation opening 21 includes a first sub-ventilation opening for the first fan 4 and a second sub-ventilation opening located on the side of the first sub-ventilation opening near the bottom wall. Part of the air entering from the air inlet 101 on the outer shell 1 enters the first air duct through the first fan 4 and part of the air enters the second air duct through the second sub-ventilation opening.

[0043] The side wall of the fixed bracket 2 is also provided with a second ventilation opening for exposing the second fan 5. A sealing plate 2001 is provided around the second ventilation opening. The sealing plate 2001 facilitates the flow of air entering the housing along the first air duct and the second air duct, and discharges from the second fan, and then discharges from the air outlet 102 on the housing 1 corresponding to the second ventilation opening, thereby avoiding internal heat accumulation and improving heat dissipation efficiency.

[0044] For example, the sealing plate 2001 may contact the housing 1 to form a sealed air outlet channel between the housing 1 and the fixed bracket 2.

[0045] In this embodiment, the first air duct is used to dissipate heat to the top area of ​​the outer casing 1, and the second air duct is used to dissipate heat to the bottom area of ​​the outer casing 1. The two air ducts do not interfere with each other. The air entering from the air inlet 101 flows to the air outlet 102 according to the preset flow direction, without generating turbulence, thus improving the heat dissipation efficiency.

[0046] It should be noted that the air inlet 101 and the air outlet 102 are provided on opposite sides of the outer casing 1, which increases the length of the first air duct and the second air duct and improves the heat dissipation efficiency.

[0047] In an exemplary embodiment, the electronic device is disposed on the side of the first fan 4 away from the air inlet 101, and a first heat sink 1001 is disposed between the first fan 4 and the electronic device. The air outlet direction of the first heat sink 1001 is inclined upward, so that the air blown out by the first fan 4 flows to the top of the electronic device after passing through the first heat sink 1001.

[0048] The first heat sink 1001 increases the heat dissipation area and improves the heat dissipation efficiency. The air outlet direction of the first heat sink 1001 is inclined upward, that is, the air entering from the air inlet 101 will flow towards the electronic device after passing through the first fan 4, and will flow towards the top of the outer casing 1, thereby guiding the air entering the first air duct.

[0049] It should be noted that the number of the first heat sink 1001 can be set according to actual needs.

[0050] It should be noted that a hollow structure is provided in the first area of ​​one side of the outer casing 1 to form the air inlet 101. The area of ​​the first fan 4 in the first area is smaller than the area of ​​the first area. In order to avoid the first air duct and the second air duct from interfering with each other, the first air duct and the second air duct independently dissipate heat to their respective areas. The air from the first fan 4 flows from the first air duct to the second fan 5, and the air entering the second air duct also enters from the air inlet 101. Therefore, the first area is divided into a first sub-area and a second sub-area. The first sub-area is directly opposite the first fan 4, and the second sub-area is located below the first sub-area. The air entering from the first sub-area enters the first air duct via the first fan 4, and the air entering from the second sub-area enters the second air duct. The first air duct and the second air duct are independent of each other and do not interfere with each other.

[0051] It should be noted that the first heat sink 1001 includes multiple sub-heat sinks arranged at intervals and side by side. A baffle is provided at the bottom of the first heat sink 1001 to prevent air from flowing out from the bottom of the first heat sink 1001. A baffle is provided on the side of the first heat sink 1001 away from the first fan 4 or in contact with the side wall of the electronic device. In this way, the air entering the first heat sink 1001 can only flow out from the top of the first heat sink 1001. Under the guiding effect of the first heat sink 1001, the independence of the first air duct and the second air duct is effectively guaranteed.

[0052] It should be noted that the first fan 4 and the second fan 5 are staggered. In some embodiments, the first fan 4 and the second fan 5 are arranged diagonally (the outer casing 1 is a cubic structure), which increases the length of the first air duct and the second air duct and improves the heat dissipation efficiency.

[0053] refer to Figure 7 In an exemplary embodiment, the first heat sink 1001 extends along a first direction from the bottom to the top of the electronic device, and in the first direction, the first heat sink 1001 includes a first portion 10011 and a second portion 10012. Figure 7 The first part 10011 and the second part 10012 are distinguished by a dashed line (it should be understood that this dashed line does not exist in the actual structure). The extension direction of the first part 10011 is parallel to the first direction. The second part 10012 extends obliquely toward the side closer to the electronic device, that is, the side of the second part 10012 closer to the electronic device is constructed as an inclined surface that is obliquely arranged toward the electronic device.

[0054] It should be noted that in the first direction (reference) Figure 5 In the Y direction (as shown in the image), dividing the first heat sink 1001 into a first part 10011 and a second part 10012 can guide the airflow from the first fan 4 without excessively increasing the airflow in the second direction perpendicular to the first direction (see reference). Figure 5 The thickness in the X direction (from the first fan 4 to the electronic device).

[0055] For example, the angle between the first part 10011 and the second part 10012 can be set according to actual needs, as long as it can guide the air blown out by the first fan 4 to flow to the top of the electronic device.

[0056] For example, the included angle between the first portion 10011 and the second portion 10012 is an acute angle.

[0057] In an exemplary embodiment, an air guide shroud 7 is provided around the side of the first fan 4 away from the air inlet 101. The air guide shroud 7 includes a first air guide plate disposed away from the bottom of the outer casing 1, and two second air guide plates disposed adjacent to the first air guide plate. The first air guide plate extends obliquely toward the top of the outer casing 1.

[0058] The area of ​​the opening of the air guide shroud 7 facing the first fan 4 is smaller than the area of ​​the opening of the air guide shroud 7 facing the electronic device. Furthermore, the second air guide plate is arranged parallel to the second direction (from the first fan 4 to the electronic device), and the first air guide plate is inclined upwards, i.e., inclined towards the top of the outer casing 1, thereby controlling the airflow from the first fan 4 to flow inclined upwards, i.e., towards the top of the electronic device.

[0059] In an exemplary embodiment, a second heat sink 1002 is provided on the top of the electronic device, and the extending direction of the second heat sink 1002 is parallel to the extending direction of the first air duct.

[0060] The second heat sink 1002 increases the heat dissipation area on the top of the electronic device, and the extension direction of the second heat sink 1002 is parallel to the extension direction of the first air duct, that is, it extends towards the second fan 5. This can guide the air flowing through the first air duct, so that the air flowing through the first air duct is discharged from the second fan 5, avoiding accumulation inside and improving heat dissipation efficiency.

[0061] For example, the number of the second heat sink 1002 can be set according to actual needs.

[0062] In an exemplary embodiment, a third heat sink 1003 is provided at the bottom of the electronic device, and the extending direction of the third heat sink 1003 is parallel to the extending direction of the second air duct.

[0063] The third heat sink 1003 increases the heat dissipation area at the bottom of the electronic device, and the third heat sink 1003 guides the airflow through the second air duct, so that the air entering from the air inlet 101 flows through the second air duct to the second fan 5.

[0064] For example, the number of the third heat sink 1003 can be set according to actual needs.

[0065] This invention also provides a projector, including the heat dissipation structure described above, wherein the projector includes an optical engine module 3, and the electronic device includes the optical engine module 3.

[0066] For example, the mounting bracket 2 is provided with a notch for exposing the lens 1011 of the optical engine module 3.

[0067] In an exemplary embodiment, the projector further includes a motherboard 300 disposed below the optical engine module 3, and a power board 6 disposed on one side of the motherboard 300. The second air duct includes the space between the optical engine module 3 and the motherboard 300, and the space between the optical engine module 3 and the power board 6.

[0068] For example, the optical engine module 3 at least partially covers the motherboard 300 to save space, and the space between the motherboard 300 and the optical engine module 3 forms part of the second air duct, which is beneficial to the heat dissipation of the motherboard 300.

[0069] For example, the optical engine module 3 at least partially covers the power board 6 to save space, and the space between the power board 6 and the optical engine module 3 forms part of the second air duct, which is beneficial for the heat dissipation of the power board 6.

[0070] In an exemplary embodiment, a fourth heat sink 1004 is provided on the side of the motherboard 300 near the optical engine module 3, and the extending direction of the fourth heat sink 1004 is parallel to the extending direction of the second air duct.

[0071] For example, the optical engine module 3 is assembled as a single modular unit. The optical engine module 3 includes an internal circulation heat dissipation section, the interior of which has a closed cavity. The closed cavity is provided with a circulation channel, and at least one powered fan is installed at one node of the circulation channel. When powered on, the powered fan accelerates the airflow within the circulation channel to speed up heat dissipation. An LCD screen module, lens, etc., are disposed within the circulation channel. The air blown by the powered fan is discharged to the outside of the optical engine module 3 via the third heat sink 1003, and flows through the second air duct to the second fan 5 and is then discharged to the outside of the projector.

[0072] It should be noted that the projector may also include other electronic components that can generate heat. In order to improve heat dissipation efficiency, these electronic components can be placed in the first air duct and / or the second air duct.

[0073] For example, refer to Figure 6In the extending direction of the second air duct, the fourth heat sink 1004 has a first side and a second sidewall disposed opposite to each other. The first sidewall has a first corner 1101 disposed near the optomechanical module, and the second sidewall has a second corner 1102 disposed near the optomechanical module. At least one of the first corner 1101 and the second corner 1102 is rounded. This serves to guide the airflow in the second air duct.

[0074] For example, refer to Figure 6 In the extension direction of the second air duct, the third heat sink 1003 has a third sidewall away from the second fan 5. The sidewall of the third sidewall near the motherboard 300 has a third corner 1103, which is rounded to guide the airflow of the second air duct.

[0075] In an exemplary embodiment, the projector further includes a first adjustment structure, which includes a first processor and a first temperature sensor 201 disposed on the second heat sink 1002. The first temperature sensor 201 is used to sense the temperature of the optical engine module 3, and the first processor is used to adjust the speed of the first fan 4 and / or the second fan 5 when the temperature sensed by the first temperature sensor 201 exceeds a first preset temperature.

[0076] The first preset temperature can be 45 degrees, but is not limited to this.

[0077] By setting the first adjustment structure, the speed of the first fan 4 and / or the second fan 5 can be adjusted in real time according to the temperature of the optical engine module 3. For example, when the temperature sensed by the first temperature sensor 201 exceeds the first preset temperature, the speed of the first fan 4 and / or the second fan 5 is increased to accelerate the airflow in the first air duct and improve the heat dissipation efficiency.

[0078] In an exemplary real-time mode, the projector further includes a second adjustment structure, which includes a second processor and a second temperature sensor (reference) disposed on the second fan 5. Figure 4 The second temperature sensor is located on the central area 202 of the second fan 5 (but is not limited thereto). The second temperature sensor is used to sense the temperature at the air outlet 102. The second processor is used to adjust the speed of the first fan 4 and / or the second fan 5 when the temperature sensed by the second temperature sensor exceeds the second preset temperature.

[0079] The second preset temperature can be 48 degrees, but is not limited to this.

[0080] By setting the second adjustment structure, the speed of the first fan 4 and / or the second fan 5 can be adjusted in real time according to the temperature of the air outlet 102. For example, when the temperature sensed by the second temperature sensor exceeds the second preset temperature, the speed of the first fan 4 and / or the second fan 5 is increased to accelerate the airflow in the first air duct and / or the second air duct and improve the heat dissipation efficiency.

[0081] In an exemplary embodiment, the projector further includes a backlight structure 8 that provides a light source for the optical engine module 3, the backlight structure 8 being disposed on the side of the fixed bracket 2 opposite to the first fan 4;

[0082] The projector also includes a fifth heat sink 1005 connected to the backlight structure 8. The fifth heat sink 1005 is located on the side of the second fan 5 near the housing 1. The second air duct includes the space between the backlight structure 8 and the optical engine module 3.

[0083] For example, the backlight structure 8 is located within the first air duct to achieve heat dissipation. Furthermore, the provision of the fifth heat sink 1005 increases the heat dissipation area, thereby improving the heat dissipation effect of the backlight structure 8.

[0084] In an exemplary embodiment, a dimming structure is provided between the backlight structure 8 and the light-incident side of the optical engine module 3. The dimming structure includes a light funnel 10, and a sixth heat sink 1006 is provided on the outer side of the light funnel 10.

[0085] The light funnel 10 can converge the light emitted from the backlight structure 8, increasing the amount of light incident on the optomechanical module 3 and improving light utilization. The space between the light funnel 10 and the top of the outer casing 1 forms part of the first air duct, enabling heat dissipation of the light funnel 10. The sixth heat sink 1006 increases the heat dissipation area and improves heat dissipation efficiency. Furthermore, the sixth heat sink 1006 extends towards the second fan 5 to serve a guiding function.

[0086] In an exemplary embodiment, an L-shaped air guide plate 9 is provided on the first surface. The L-shaped air guide plate 9 is located on the side of the sixth heat sink 1006 away from the first fan 4. The cross-section of the L-shaped air guide plate 9 in the direction parallel to the top of the outer casing 1 is L-shaped.

[0087] The L-shaped air guide plate 9 includes a first guide plate 91 and a second guide plate 92. The first guide plate 91 is perpendicular to the direction from the first fan 4 to the optomechanical module 3. The second guide plate 92 is located on the side of the first guide plate 91 away from the second fan 5. The angle between the first guide plate 91 and the second guide plate 92 is greater than or equal to 90 degrees.

[0088] The L-shaped air guide plate 9 improves the stability of the airflow direction in the first air duct, so that the air entering the second air duct flows towards the second fan 5.

[0089] In an exemplary embodiment, the projector further includes a third adjustment structure, which includes a third processor and a third temperature sensor disposed on the backlight structure 8. The third temperature sensor is used to sense the temperature of the backlight structure 8, and the third processor is used to adjust the speed of the first fan 4 and / or the second fan 5 when the temperature sensed by the third temperature sensor exceeds a third preset temperature.

[0090] The third preset temperature can be 48 degrees, but is not limited to this.

[0091] By setting the third adjustment structure, the speed of the first fan 4 and / or the second fan 5 can be adjusted in real time according to the temperature of the backlight structure 8. For example, when the temperature sensed by the third temperature sensor exceeds the third preset temperature, the speed of the first fan 4 and / or the second fan 5 is increased to accelerate the airflow in the first air duct and / or the second air duct and improve the heat dissipation efficiency.

[0092] It should be noted that the first adjustment structure, the second adjustment structure, and the third adjustment structure can be integrated or set independently, and the first processor, the second processor, and the third processor can be integrated or set independently.

[0093] In an exemplary embodiment, the projector further includes a first control structure, which can periodically or in real time acquire signals from the first temperature sensor 201, the second temperature sensor, and the third temperature sensor, and control the projector to automatically shut down or output a shutdown prompt sound or display interface when the temperature value sensed by the first temperature sensor 201 is greater than a first preset temperature, the temperature value sensed by the second temperature sensor is greater than a second preset temperature, and the temperature value sensed by the third temperature sensor is greater than a third preset temperature, so that the user can choose whether to shut down.

[0094] In an exemplary embodiment, the projector further includes a second control structure. The second control structure is used to acquire signals from the first temperature sensor 201, the second temperature sensor, and the third temperature sensor at regular intervals or in real time. When the temperature value sensed by the first temperature sensor 201 is less than a first preset temperature, the temperature value sensed by the second temperature sensor is less than a second preset temperature, and the temperature value sensed by the third temperature sensor is less than a third preset temperature, the second control structure determines whether the temperature sensed by the third temperature sensor of the backlight structure 8 is greater than a fourth preset temperature (the fourth preset temperature is less than the third preset temperature, for example, the fourth preset temperature can be 36 degrees). When the temperature sensed by the third temperature sensor of the backlight structure 8 is greater than the fourth preset temperature, the third control structure adjusts the first fan 4 through the third processor to make the PWM (pulse width modulation signal) of the first fan 4 50%. When the temperature sensed by the third temperature sensor of the backlight structure 8 is less than the fourth preset temperature, the third control structure adjusts the first fan 4 through the third processor to make the PWM (pulse width modulation signal) of the first fan 4 40%. When the temperature value sensed by the first temperature sensor 201 is less than the first preset temperature, the temperature value sensed by the second temperature sensor is less than the second preset temperature, and the temperature value sensed by the third temperature sensor is less than the third preset temperature, it is determined whether the temperature of the optomechanical module 3 sensed by the first temperature sensor 201 is greater than the fifth preset temperature (the fifth preset temperature is less than the first preset temperature, for example, the fifth preset temperature can be 35 degrees). When the temperature of the backlight structure 8 sensed by the first temperature sensor is greater than the fifth preset temperature, the second fan 5 is adjusted by the first processor so that the PWM (pulse width modulation signal) of the second fan 5 is 45%. When the temperature of the optomechanical module 3 sensed by the first temperature sensor 201 is less than the fifth preset temperature, the second fan 5 is adjusted by the first processor so that the PWM (pulse width modulation signal) of the first fan 4 is 35%.

[0095] In an exemplary embodiment, the projector further includes a third control structure, which is used to adjust the first fan 4 and the second fan 5 via a second processor when the temperature sensed by the second temperature sensor is greater than a sixth preset temperature (the sixth preset temperature is less than the second preset temperature, for example, 40 degrees Celsius). The third control structure sets the PWM (pulse width modulation signal) of the first fan 4 to 55% and the PWM (pulse width modulation signal) of the second fan 5 to 55%.

[0096] The third control structure is also used to acquire the temperature values ​​of the first temperature sensor 201, the second temperature sensor, and the third temperature sensor again when the temperature at the air outlet 102 sensed by the second temperature sensor is lower than the sixth preset temperature.

[0097] As shown in the table below, the projector provided in this embodiment uses a first air duct and a second air duct. After the internal heat of the optical engine module 3 stabilizes, the temperature of the air inlet 101 is 25.7℃, and the temperature of the air outlet 102 is 42.2℃, with a temperature rise of 16.5℃. In related technologies, after the internal heat of the optical engine module of a projector stabilizes, the air inlet temperature is 25.3℃, and the air outlet temperature is 46.5℃, with a temperature rise of 21.2℃. The test results show that the temperature rise is reduced by 4.7℃ using the heat dissipation structure in this embodiment, and the heat dissipation efficiency is improved by approximately 22%.

[0098]

[0099] This invention also provides an electronic device including the heat dissipation structure described above.

[0100] This disclosure provides an electronic device, which further includes a memory, a processor, and one or more programs stored in the memory and executable on the processor. When the one or more programs are executed by the processor, the electronic device performs the silicon wafer pick-and-place method as described above.

[0101] In one embodiment, this disclosure also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps in the above method embodiments.

[0102] The aforementioned computer-readable storage medium, since the computer program stored in its memory is executed by the processor to implement the steps in the above-described method embodiments, can similarly bring about the beneficial effects of the above-described silicon wafer placement and removal method, which will not be elaborated here.

[0103] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the methods described above. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, or optical storage, etc. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc.

[0104] The following points need to be explained:

[0105] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0106] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0107] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0108] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A heat dissipating structure, characterized by comprising: It includes a fixed bracket, a housing covering the outside of the fixed bracket, and electronic devices disposed on the fixed bracket; The outer casing has a hollow structure on two adjacent or opposite sides to form an air inlet and an air outlet. A first fan is provided on the fixed bracket at a position corresponding to the air inlet, and a second fan is provided on the fixed bracket at a position corresponding to the air outlet. A first air duct and a second air duct are provided between the air inlet and the air outlet. The first air duct extends from the air inlet, through the space between the top of the electronic device and the outer casing, and to the air outlet. The second air duct extends from the air inlet, through the space between the bottom of the electronic device and the fixed bracket, and to the air outlet.

2. The heat dissipation structure according to claim 1, characterized in that, The electronic device is disposed on the side of the first fan away from the air inlet, and a first heat sink is disposed between the first fan and the electronic device. The air outlet direction of the first heat sink is inclined upward, so that the air blown out by the first fan flows to the top of the electronic device after passing through the first heat sink.

3. The heat dissipation structure according to claim 2, characterized in that, The first heat sink extends along a first direction from the bottom to the top of the electronic device, and in the first direction, the first heat sink includes a first part and a second part, the first part extending in a direction parallel to the first direction, and the second part extending obliquely towards the side closer to the electronic device.

4. The heat dissipation structure according to claim 2, characterized in that, The first fan is provided with an air guide shroud around the side away from the air inlet. The air guide shroud includes a first air guide plate disposed away from the bottom of the housing, and two second air guide plates disposed adjacent to the first air guide plate. The first air guide plate extends obliquely towards the top of the housing.

5. The heat dissipation structure according to claim 1, characterized in that, The electronic device has a second heat sink on top, and the extension direction of the second heat sink is parallel to the extension direction of the first air duct.

6. The heat dissipation structure according to claim 1, characterized in that, The electronic device has a third heat sink at its bottom, and the extension direction of the third heat sink is parallel to the extension direction of the second air duct.

7. A projector, characterized in that, The projector includes the heat dissipation structure according to any one of claims 1-6, and the electronic device includes the optical engine module.

8. The projector according to claim 7, characterized in that, It also includes a motherboard located below the optical engine module and a power board located on one side of the motherboard. The second air duct includes the space between the optical engine module and the motherboard, and the space between the optical engine module and the power board.

9. The projector according to claim 8, characterized in that, A fourth heat sink is provided on the side of the motherboard near the optical engine module, and the extension direction of the fourth heat sink is parallel to the extension direction of the second air duct.

10. The projector according to claim 7, characterized in that, It also includes a first adjustment structure, which includes a first processor and a first temperature sensor disposed on the second heat sink. The first temperature sensor is used to sense the temperature of the optomechanical module, and the first processor is used to adjust the speed of the first fan and / or the second fan when the temperature sensed by the first temperature sensor exceeds a first preset temperature.

11. The projector according to claim 7, characterized in that, It also includes a second adjustment structure, which includes a second processor and a second temperature sensor disposed on the second fan. The second temperature sensor is used to sense the temperature at the air outlet, and the second processor is used to adjust the speed of the first fan and / or the second fan when the temperature sensed by the second temperature sensor exceeds a second preset temperature.

12. The projector according to claim 7, characterized in that, It also includes a backlight structure that provides a light source for the optical engine module, the backlight structure being disposed on the side of the fixed bracket opposite to the first fan; The projector also includes a fifth heat sink connected to the backlight structure. The fifth heat sink is located on the side of the second fan near the housing. The second air duct includes the space between the backlight structure and the optical engine module.

13. The projector according to claim 12, characterized in that, A dimming structure is provided between the backlight structure and the light-incident side of the optical engine module. The dimming structure includes a light funnel, and a sixth heat sink is provided on the first surface of the light funnel near the top of the housing.

14. The projector according to claim 13, characterized in that, An L-shaped air guide plate is provided on the first surface. The L-shaped air guide plate is located on the side of the sixth heat sink away from the first fan. The cross-section of the L-shaped air guide plate in the direction parallel to the top of the outer casing is L-shaped. The L-shaped air guide plate includes a first guide plate and a second guide plate. The first guide plate is perpendicular to the direction from the first fan to the optomechanical module. The second guide plate is located on the side of the first guide plate away from the second fan. The angle between the first guide plate and the second guide plate is greater than or equal to 90 degrees.

15. The projector according to claim 12, characterized in that, It also includes a third adjustment structure, which includes a third processor and a third temperature sensor disposed on the backlight structure. The third temperature sensor is used to sense the temperature of the backlight structure, and the third processor is used to adjust the speed of the first fan and / or the second fan when the temperature sensed by the third temperature sensor exceeds a third preset temperature.

16. An electronic device, characterized in that, Includes the heat dissipation structure as described in any one of claims 1-6.

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