Optical device and projection device

Abstract

The present application provides an optical device, which comprises a light receiving element and a wavelength conversion element. The light receiving element is disposed on a first side of a virtual plane. The wavelength conversion element comprises a substrate, a wavelength conversion layer and a counterweight structure. The substrate comprises a wavelength conversion region, a non-wavelength conversion region and a geometric center, the wavelength conversion region surrounds the geometric center, and a top surface of the substrate is located on the virtual plane. The wavelength conversion layer is disposed on the wavelength conversion region. A first distance is between the light receiving element and a top surface of the wavelength conversion layer, a second distance is between the light receiving element and the top surface of the substrate, the first distance is less than the second distance, and the top surface is located on the first side of the virtual plane. The counterweight structure is connected to the substrate and located on a second side of the virtual plane, the first side being opposite to the second side. In addition, a projection device comprising the optical device is also mentioned. The optical device and the projection device of the present application can improve the conversion efficiency of the wavelength conversion element.

Description

Technical Field

[0001] This invention relates to an optical device and a projection device including the optical device. Background Technology

[0002] Current wavelength conversion elements (e.g., phosphor wheels) have multiple structures (e.g., counterweights or heat dissipation structures) and wavelength conversion elements on their substrates. These structures and wavelength conversion elements can be disposed on the same side of the substrate and protrude from it, with the thickness of the structures exceeding the thickness of the wavelength conversion element. To achieve optimal conversion efficiency, a specific distance must be maintained between the light-receiving element and the wavelength conversion element. However, during the assembly of the light-receiving element and the wavelength conversion element, interference between the light-receiving element and multiple structures can occur, leading to damage to the light-receiving element and / or the wavelength conversion element. Alternatively, to prevent the light-receiving element from colliding with multiple structures of the wavelength conversion element, the light-receiving element cannot be spaced at a specific distance from the wavelength conversion element, resulting in poor conversion efficiency.

[0003] The "Background Art" paragraph is only used to help understand the content of this invention. Therefore, the content disclosed in the "Background Art" paragraph may include some prior art that is not known to those skilled in the art. The content disclosed in the "Background Art" paragraph does not mean that the content or the problem to be solved by one or more embodiments of this invention was known or recognized by those skilled in the art before this application was filed. Summary of the Invention

[0004] The present invention provides an optical device and a projection device that can improve the conversion efficiency of wavelength conversion elements.

[0005] Other objects and advantages of the present invention can be further understood from the technical features disclosed herein.

[0006] To achieve one or more of the above-mentioned objectives, or other objectives, an optical device according to one embodiment of the present invention includes a light-receiving element and a wavelength conversion element. The light-receiving element is disposed on a first side of a virtual plane. The wavelength conversion element includes a substrate, a wavelength conversion layer, and a counterweight structure. The substrate includes a wavelength conversion region and a geometric center, the wavelength conversion region surrounding the geometric center, and the top surface of the substrate is located on the virtual plane. The wavelength conversion layer is disposed on the wavelength conversion region. A first distance exists between the light-receiving element and the top surface of the wavelength conversion layer, and a second distance exists between the light-receiving element and the top surface of the substrate. The first distance is smaller than the second distance, and the top surface is located on the first side of the virtual plane. The counterweight structure is connected to the substrate and located on a second side of the virtual plane, with the first side relative to the second side.

[0007] To achieve one or more of the above-mentioned objectives or other objectives, a projection device according to one embodiment of the present invention includes an illumination system, a light valve module, and a lens module. The illumination system provides an illumination beam and includes a light source module and an optical device. The light source module provides a laser beam. The optical device includes a light-receiving element and a wavelength conversion element. The light-receiving element is disposed on the transmission path of the laser beam from the light source module and is located on a first side of a virtual plane. The wavelength conversion element is disposed on the transmission path of the laser beam from the light-receiving element and is used to convert the laser beam into a converted beam, wherein the illumination beam includes at least one of the laser beam and the converted beam. The wavelength conversion element includes a substrate, a wavelength conversion layer, and a counterweight structure. The substrate includes a wavelength conversion region and a geometric center, the wavelength conversion region surrounding the geometric center, and the top surface of the substrate is located on the virtual plane. The wavelength conversion layer is disposed on the wavelength conversion region. A first distance exists between the light-receiving element and the top surface of the wavelength conversion layer, and a second distance exists between the light-receiving element and the top surface of the substrate, the first distance being smaller than the second distance, and the top surface being located on a first side of the virtual plane. The counterweight structure is connected to the substrate and located on a second side of the virtual plane, with the first side relative to the second side. A light valve module is positioned in the path of the illumination beam to convert it into an image beam. A lens module is positioned in the path of the image beam to project the image beam out of the projection device.

[0008] Based on the above, the optical device and projection device of the embodiments of the present invention have at least one of the following advantages: the top surface of the wavelength conversion layer of the light-receiving element and the wavelength conversion element is located on a first side of the virtual plane, the counterweight structure is located on a second side of the virtual plane, and the top surface of the substrate is located on the virtual plane, and a specific distance can be spaced between the light-receiving element and the wavelength conversion element. Therefore, the wavelength conversion element has better conversion efficiency. Furthermore, when the wavelength conversion element rotates relative to the light-receiving element, or during the assembly of the optical device, collisions between the light-receiving element and the substrate and the counterweight structure can be avoided, preventing damage. Attached Figure Description

[0009] Figure 1 This is a block diagram of a projection device according to an embodiment of the present invention.

[0010] Figure 2 yes Figure 1 Exploded view of the wavelength conversion element.

[0011] Figure 3 yes Figure 1 Top view of the wavelength conversion element.

[0012] Figure 4 It corresponds Figure 2 A cross-sectional schematic diagram of the optical device.

[0013] Figure 5This is a schematic diagram of a wavelength conversion element according to an embodiment of the present invention.

[0014] Figure 6 It corresponds Figure 5 A cross-sectional schematic diagram of the optical device.

[0015] Figure 7 This is a cross-sectional schematic diagram of an optical device according to an embodiment of the present invention.

[0016] Figure 8 This is a schematic diagram of a wavelength conversion element according to an embodiment of the present invention.

[0017] Figure 9 It corresponds Figure 8 A cross-sectional schematic diagram of the optical device.

[0018] Figure 10 This is a schematic diagram of a wavelength conversion element according to an embodiment of the present invention.

[0019] Figure 11 yes Figure 10 A cross-sectional view of the wavelength conversion element.

[0020] List of reference numerals

[0021] D1: Axial direction

[0022] D2: Radial

[0023] H1: First distance

[0024] H2: Second distance

[0025] H3, H6: Third distance

[0026] H4, H5, H9, H10, H11, H12, H13: Distance

[0027] H7, H8: Thickness

[0028] P1: Wavelength conversion region

[0029] P2: Non-wavelength conversion region

[0030] S1: Top surface

[0031] S2, S3, 262: Top surface

[0032] S4, S6: Surface

[0033] S51: First surface

[0034] S52: Second surface

[0035] VP: Virtual Plane

[0036] VP1: First side

[0037] VP2: Second side

[0038] XYZ: Rectangular coordinates

[0039] 100: Projection device

[0040] 110: Lighting System

[0041] 111: Light Source Module

[0042] 112: Optical devices

[0043] 113: Light receiving element

[0044] 120: Light valve module

[0045] 130: Lens Module

[0046] 200, 200a, 200b, 200c, 200d: Wavelength conversion elements

[0047] 210:Substrate

[0048] 211: Geometric Center

[0049] 213: Groove

[0050] 214: Edge

[0051] 220: Wavelength conversion layer

[0052] 230: Counterweight Structure

[0053] 231: Depressed structure

[0054] 232: Counterweight

[0055] 233, 251: Base Plate

[0056] 234, 252: Sidewall

[0057] 240: Non-wavelength conversion component

[0058] 250a, 250b, 250c, 250d: Heat dissipation structure

[0059] 260: Motor

[0060] 261: Shaft

[0061] 270: Adhesive layer

[0062] 280: Additional Layer

[0063] 300: Illumination beam

[0064] 310: Laser beam

[0065] 320: Beam Conversion

[0066] 400: Image beam. Detailed Implementation

[0067] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are merely for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the present invention.

[0068] Figure 1 This is a block diagram of a projection device according to an embodiment of the present invention. Figure 2 yes Figure 1 Exploded view of the wavelength conversion element. Figure 3 yes Figure 1 Top view of the wavelength conversion element. Figure 4 It corresponds Figure 2 A cross-sectional schematic diagram of the optical device. Some structural details are omitted here, and Cartesian coordinates (XYZ) are provided for ease of component description. Please also refer to... Figures 1 to 4 The projection device 100 (such as a projector) includes an illumination system 110, a light valve module 120, and a lens module 130. The illumination system 110 provides an illumination beam 300 and includes a light source module 111 and an optical device 112. The light source module 111 provides a laser beam 310. The optical device 112 includes a light-receiving element 113 and a wavelength conversion element 200. The light-receiving element 113 is disposed in the transmission path of the laser beam 310 from the light source module 111. The wavelength conversion element 200 is disposed in the transmission path of the laser beam 310 from the light-receiving element 113 and is used to convert the laser beam 310 into a converted beam 320. The illumination beam 300 includes at least one of the laser beam 310 and the converted beam 320. The light valve module 120 is disposed in the transmission path of the illumination beam 300 and is used to convert the illumination beam 300 into an image beam 400. The lens module 130 is positioned on the transmission path of the image beam 400 to project the image beam 400 out of the projection device 100.

[0069] The light source module 111 may include, for example, a light-emitting diode (LED) element, a laser diode (LD) element, or a combination thereof, and may be a single light-emitting element or an array of light-emitting elements. The light valve module 120 may include, for example, one of a reflective light modulator such as a liquid crystal on silicon panel (LCoS panel) or a digital micromirror device (DMD). In some embodiments, the light valve module 120 may also include one of a transmissive light modulator such as a transparent liquid crystal panel, an electro-optic modulator, a magneto-optic modulator, or an acousto-optic modulator (AOM). The embodiments of the present invention do not limit the type or form of the light valve module 120. The method by which the light valve module 120 converts the illumination beam 300 into the image beam 400 is described in detail, and its implementation is well-taught, suggested, and illustrated by knowledge of the art. Therefore, it will not be elaborated further. In this embodiment, there is one light valve module 120, such as a projection device using a single digital micromirror element, but in other embodiments not shown, there may be multiple light valve modules 120.

[0070] Lens module 130 may include, for example, a combination of one or more optical lenses having diopter, such as various combinations of non-planar lenses including biconcave lenses, biconvex lenses, concave-convex lenses, convex-concave lenses, plano-convex lenses, and plano-concave lenses. In one embodiment, lens module 130 may further include planar, concave, or convex optical lenses for projecting image beam 400 onto a projection target (e.g., a wall or projection screen). Embodiments of the present invention do not limit the type or form of the (projection) lens module 130.

[0071] In this embodiment, the wavelength conversion element 200 is, for example, a transmissive phosphor wheel, a reflective phosphor wheel, or a scattering phosphor wheel. The light-receiving element 113 is a lens, for example, a focusing lens. Figure 4 The light-receiving element 113 is schematically illustrated; however, the embodiment of the present invention does not limit the type of the light-receiving element 113. The light-receiving element 113 of the optical device 112 is disposed on the first side VP1 of the virtual plane VP. The wavelength conversion element 200 includes a substrate 210, a wavelength conversion layer 220, and a counterweight structure 230. The substrate 210 includes a geometric center 211 (marked at...). Figure 3The substrate 210 has a wavelength conversion region P1 located on its top surface S1. The wavelength conversion region P1 is, for example, arc-shaped, annular, or circular-fan-shaped, and surrounds the geometric center 211. The top surface S1 of the substrate 210 is located on a virtual plane VP. The substrate 210 is, for example, an aluminum substrate or an aluminum alloy substrate. A wavelength conversion layer 220 is disposed on the wavelength conversion region P1. The wavelength conversion layer 220 has a top surface S2 on the side facing away from the substrate 210. A distance H10 exists between the top surface S2 of the wavelength conversion layer 220 and the top surface S1 of the substrate 210. A first distance H1 exists between the light-receiving element 113 and the top surface S2 of the wavelength conversion layer 220. A second distance H2 exists between the light-receiving element 113 and the top surface S1 of the substrate 210. The first distance H1 is smaller than the second distance H2, and the difference between the second distance H2 and the first distance H1 is distance H10, which is approximately the thickness of the wavelength conversion layer 220 protruding from the top surface S1 of the substrate 210. The top surface S2 of the wavelength conversion layer 220 is located on the first side VP1 of the virtual plane VP. The counterweight structure 230 is connected to the substrate 210 and located on the second side VP2 of the virtual plane VP. The first side VP1 (facing the laser beam 310) of the virtual plane VP is opposite to the second side VP2. That is, in this embodiment, the wavelength conversion layer 220 and the counterweight structure 230 are located on opposite sides of the top surface S1 of the substrate 210. The virtual plane VP is parallel to the XY plane, and the first side VP1 is located above the second side VP2 on the Z-axis. The substrate 210 in this embodiment is, for example, a hollow disk.

[0072] To ensure optimal conversion efficiency of the wavelength conversion layer 220, the top surface S2 of the light-receiving element 113 and the wavelength conversion layer 220 need to be spaced at a specific distance, so that the focal point formed by the laser beam 310 from the light source module 111 after passing through the light-receiving element 113 is located on the top surface S2 of the wavelength conversion layer 220. Figure 1 and Figure 4 As shown, during the assembly of the projection device 100 / illumination system 110 / optical device 112, the specific distance between the light-receiving element 113 and the top surface S2 of the wavelength conversion layer 220 will change due to the assembly tolerances between various components in the optical path (such as lenses or mirrors in the illumination system 110). Since the assembly tolerances of each projection device 100 / illumination system 110 / optical device 112 may differ, during the assembly of the optical device 112, the light-receiving element 113 can be moved relative to the wavelength conversion element 200 along the axial direction D1 (i.e., the Z-axis) of the substrate 210 by a gap adjustment mechanism (not shown) to adjust the first distance H1. In this embodiment, the first distance H1 is the distance of the focal point formed after the laser beam 310 passes through the light-receiving element 113, for example, 0.7 mm.

[0073] In existing wavelength conversion elements, the top surface of the substrate and / or the counterweight structure can be closer to the light-receiving element than the top surface of the wavelength conversion layer. Therefore, during the assembly of the projection device / lighting system, operators must consider the position of the top surface of the substrate and / or the counterweight structure when adjusting the position of the light-receiving element, which may prevent the light-receiving element from being adjusted to the optimal position, resulting in poor conversion efficiency of the wavelength conversion layer. In this embodiment, the first distance H1 is smaller than the second distance H2, and the counterweight structure 230 is located on the second side VP2 of the virtual plane VP. Therefore, compared to other elements and structures of the wavelength conversion element 200 (such as the substrate 210, the counterweight structure 230, etc.), the top surface S2 of the wavelength conversion layer 220 is closest to the light-receiving element 113. Therefore, during the assembly of the projection device 100, the lighting system 110, and the optical device 112, when the operator adjusts the distance between the light-receiving element 113 and the top surface S2, there is no need to consider the positions of other components (such as the counterweight structure 230). The light-receiving element 113 can be adjusted to the optimal position, maintaining the optimal distance between the light-receiving element 113 and the wavelength conversion layer 220, so that the wavelength conversion layer 220 has better conversion efficiency. Compared with conventional wavelength conversion elements, the conversion efficiency of the wavelength conversion element 200 in this embodiment can be improved by at least 5%. At the same time, after the assembly of the projection device 100, the lighting system 110, and the optical device 112 is completed, when the wavelength conversion element 200 rotates relative to the light-receiving element 113, it can prevent the light-receiving element 113 from colliding with the top surface S1 of the substrate 210 and the counterweight structure 230, thus avoiding damage to the light-receiving element 113 and / or the wavelength conversion element 200.

[0074] like Figures 2 to 4 As shown, the substrate 210 also includes a non-wavelength conversion region P2. The wavelength conversion element 200 may include a non-wavelength conversion member 240 for reflecting the laser beam 310 or allowing the laser beam 310 to pass through the non-wavelength conversion member 240. The non-wavelength conversion member 240 is disposed on the non-wavelength conversion region P2 (blue light region). The non-wavelength conversion member 240 and the wavelength conversion layer 220 surround the geometric center 211. The top surface S3 of the non-wavelength conversion member 240 is located on the first side VP1 of the virtual plane VP, and has a distance H11 between it and the top surface S1 of the substrate 210. The first distance H1 is less than or equal to the distance H4 between the light-receiving element 113 and the non-wavelength conversion member 240. The distance H11 is the thickness of the non-wavelength conversion member 240 protruding from the top surface S1, and is the difference between the second distance H2 and the distance H4. In this embodiment, the distance H4 is equal to the first distance H1, and the distance H11 is equal to the distance H10. That is, the top surface S2 of the wavelength conversion layer 220 is coplanar with the top surface S3 of the non-wavelength conversion element 240. In other embodiments not shown, the distance H4 may be greater than the first distance H1, and the distance H11 may be less than the distance H10. For example, the non-wavelength conversion element 240 is coplanar with the top surface S1 of the substrate 210 (located on the virtual plane VP).

[0075] In this embodiment, since the first distance H1 is equal to the distance H4, when the wavelength conversion element 200 rotates and the non-wavelength conversion element 240 is positioned below the light-receiving element 113 (the non-wavelength conversion element 240 is disposed on the transmission path of the laser beam 310 from the light-receiving element 113), the non-wavelength conversion element 240 will not collide with the light-receiving element 113. The laser beam 310 from the light source module 111 ( Figure 1 The focal point formed after passing through the light-receiving element 113 can be located on the top surface S3 of the non-wavelength conversion element 240, thus giving the non-wavelength conversion element 240 better optical efficiency. In other words, in this embodiment, the light-receiving element 113 maintains an optimal distance from both the wavelength conversion layer 220 and the non-wavelength conversion element 240, thereby giving both the wavelength conversion layer 220 and the non-wavelength conversion element 240 better efficiency simultaneously. Compared to wavelength conversion elements where the top surface of the non-wavelength conversion element is not coplanar with the top surface of the wavelength conversion layer, the wavelength conversion element 200 of this embodiment has better operating efficiency.

[0076] In this embodiment, the non-wavelength conversion element 240 is, for example, a reflective lens with a coating (e.g., a blue light reflective coating or an anti-reflective coating) to reflect the laser beam 310. In one embodiment, the substrate 210 may have a groove 213 disposed in the non-wavelength conversion region P2, and the bottom of the groove 213 has an opening. The non-wavelength conversion element 240 is disposed within the groove 213. Thus, the thickness of the non-wavelength conversion element 240 in the axial direction D1 of the substrate 210 may be greater than the thickness of the wavelength conversion layer 220 in the axial direction D1, and may be greater than the distance H11. In other embodiments not shown, the non-wavelength conversion element 240 may be a penetrating lens to allow the laser beam 310 to penetrate the opening of the substrate 210. The wavelength conversion layer 220 is used to convert the laser beam 310 into a converted beam 320. In this embodiment, the wavelength conversion layer 220 is a fluorescent sheet. The fluorescent sheet includes, but is not limited to, green fluorescent sheets, yellow fluorescent sheets, other colored fluorescent sheets, and combinations thereof, to convert the laser beam 310 into fluorescent beams of different colors. In other embodiments not shown, the wavelength conversion layer 220 may be formed by curing a wavelength conversion adhesive applied to the substrate 210. In other embodiments, the wavelength conversion element 200 may not include a non-wavelength conversion element 240.

[0077] The light-receiving element 113 is used to focus the laser beam 310 from the light source module 111 onto a specific area of ​​the wavelength conversion element 200 (such as the top surface S2 of the wavelength conversion layer 220 and the top surface S3 of the non-wavelength conversion element 240). Figure 1 and Figure 4As shown, taking a reflective fluorescent color wheel as an example, when the non-wavelength conversion element 200 is located on the transmission path of the laser beam 310 from the light-receiving element 113, the non-wavelength conversion element 240 reflects the laser beam 310 and transmits it out of the optical device 112 via the light-receiving element 113. At this time, the illumination beam 300 output by the illumination system 110 to the light valve module 120 is the laser beam 310. When the wavelength conversion layer 220 is located on the transmission path of the laser beam 310 from the light-receiving element 113, the wavelength conversion layer 220 converts the laser beam 310 into a corresponding converted beam 320 and transmits it out of the optical device 112 via the light-receiving element 113. At this time, the illumination beam 300 output by the illumination system 110 to the light valve module 120 is the converted beam 320. Therefore, when the wavelength conversion element 200 rotates, one of the non-wavelength conversion element 240 and the wavelength conversion layer 220 is located on the transmission path of the laser beam 310 at different time periods, so that the illumination beam 300 is either the laser beam 310 or the conversion beam 320 at different time periods.

[0078] like Figure 3 and Figure 4 As shown, the counterweight structure 230 includes a recessed structure 231 and a counterweight block 232 (e.g., a copper sheet). On the virtual plane VP, the orthographic projection of the recessed structure 231 onto the virtual plane VP is concentric with the substrate 210. The counterweight block 232 is disposed within the recessed structure 231. The recessed direction of the recessed structure 231 is parallel to the laser beam 310 from the light source module 111. Figure 1The incident wavelength conversion element 200 is oriented in the direction of the light (i.e., parallel to the Z-axis and axial direction D1). The recessed structure 231 includes a sidewall 234 and a base plate 233. The sidewall 234 surrounds the base plate 233 and is perpendicularly connected to the base plate 233 and the substrate 210. The base plate 233 is parallel to the substrate 210 and has a surface S6 facing the light-receiving element 113. The distance between the surface S6 and the light-receiving element 113 on the axial direction D1 of the substrate 210 is greater than a second distance H2. There is a distance H13 between the surface S6 of the recessed structure 231 and the top surface S1 of the substrate 210. The distance H13 can be greater than, equal to, or less than the distance H10, and the distance H13 can be less than or equal to the thickness H7 of the substrate 210 on the axial direction D1. A counterweight 232 is disposed on the surface S6 of the base plate 233. The substrate 210 and the recessed structure 231 can be integrally formed. In this embodiment, the recessed structure 231 is, for example, an inwardly concave circle formed by stamping the original substrate to form a hollow disk-shaped substrate 210 and the recessed structure 231. This embodiment eliminates the need for a counterweight ring protruding from the top surface S1 of the substrate 210, thus reducing costs. The thickness H8 of the recessed structure 231 protruding from the substrate 210 in the direction away from the light-receiving element 113 is less than or equal to the thickness H7 of the substrate 210 in the axial direction D1. Thickness H8 is the depth of the recessed structure 231 (i.e., the recessed depth of the recessed structure 231 relative to the top surface S1 and the virtual plane VP). Thickness H8 can be, for example, equal to the distance H10. Thickness H7 can be 0.7 mm. In other embodiments not shown, thickness H8 is less than thickness H7. In other embodiments not shown, the recessed structure 231 can be formed by processes such as die casting or CNC machining.

[0079] like Figure 2 and Figure 4As shown, the wavelength conversion element 200 also includes a motor 260, whose shaft 261 protrudes from the geometric center 211 of the substrate 210, with a portion of the shaft 261 located on the first side VP1 of the virtual plane VP. The maximum width of the orthographic projection of the light-receiving element 113 onto the virtual plane VP is less than the radius of the substrate 210. The shaft 261 and the orthographic projection of the light-receiving element 113 onto the virtual plane VP do not overlap. That is, the shaft 261 and the orthographic projection of the light-receiving element 113 onto the virtual plane VP are offset, therefore, the light-receiving element 113 will not collide with the shaft 261 when the wavelength conversion element 200 rotates or when the optical device 112 is assembled. The shaft 261 has a top surface 262 located on the first side VP1 of the virtual plane VP. In this embodiment, the distance H5 between the top surface 262 of the shaft 261 and the top surface S1 of the substrate 210 is greater than or equal to a second distance H2. Preferably, the distance H5 is greater than the second distance H2 and less than the sum of the first distance H1 and the second distance H2, to avoid the rotating shaft 261 occupying too much space in the optical device 112. In other embodiments not shown, the distance H5 may be less than the second distance H2. In this embodiment, the motor 260 contacts the counterweight structure 230, and the contact area between the motor 260 and the counterweight structure 230 is less than or equal to the area of ​​the surface S6 of the base plate 233 of the recessed structure 231 of the counterweight structure 230.

[0080] The wavelength conversion element 200 may further include three adhesive layers 270 and an additional layer 280. The non-wavelength conversion element 240 is connected to the substrate 210 via two adhesive layers 270, and the motor 260 is connected to the base plate 233 of the recessed structure 231 of the counterweight structure 230 via one adhesive layer 270. The additional layer 280 is, for example, an adhesive layer or a reflective layer. In this embodiment, the additional layer 280 is an adhesive layer and is disposed within the wavelength conversion region P1 to fix the wavelength conversion layer 220 to the substrate 210. The adhesive layer is, for example, a photocurable adhesive, a UV adhesive, or a high-heat-resistant adhesive. In this embodiment, the difference between the second distance H2 and the first distance H1 (i.e., distance H10) is the sum of the thickness of the wavelength conversion layer 220 and the thickness of the additional layer 280. In other embodiments not shown, the additional layer 280 may be a reflective layer and is disposed on the entire top surface S1 of the substrate 210. A reflective layer can be used to reflect the laser beam 310, replacing the non-wavelength conversion element 240. The reflective layer located in the non-wavelength conversion region P2 is, for example, a scattering layer or a diffuser layer, which can be formed by mixing a colloid with titanium dioxide (TiO2), aluminum oxide (Al2O3), or other metal oxides. The reflective layer located below the wavelength conversion layer 220 is, for example, a metal plating (such as an aluminum, silver, or dielectric film with a thickness of less than 5 micrometers), or the aforementioned scattering or diffuser layer.

[0081] Figure 5This is a schematic diagram of a wavelength conversion element according to an embodiment of the present invention. Figure 6 It corresponds Figure 5 A cross-sectional schematic diagram of the optical device is shown here, schematically illustrating two radial directions D2 parallel to the X-axis, with some structural details omitted. Please also refer to... Figures 4 to 6 The wavelength conversion element 200a in this embodiment is different from that in the aforementioned embodiment ( Figure 4 Similar to the wavelength conversion element 200, the difference lies in that the wavelength conversion element 200a in this embodiment further includes a heat dissipation structure 250a. The heat dissipation structure 250a is connected to the substrate 210 and has a third distance H3 between it and the light receiving element 113, the third distance H3 being greater than or equal to the first distance H1. Multiple heat dissipation structures 250a can be located on the radial direction D2 of the substrate 210 between the wavelength conversion region P1 and the geometric center 211, between the wavelength conversion region P1 and the edge 214 of the substrate 210, or both of the above positions. When the third distance H3 is greater than the second distance H2, the heat dissipation structure 250a is located on the second side VP2. When the third distance H3 is less than the second distance H2, the heat dissipation structure 250a is located on the first side VP1.

[0082] In this embodiment, the heat dissipation structure 250a is located on the radial direction D2 of the substrate 210 between the wavelength conversion region P1 and the edge 214 of the substrate 210. The heat dissipation structure 250a is located on the second side VP2 of the virtual plane VP, that is, the wavelength conversion layer 220 and the heat dissipation structure 250a are located on opposite sides of the top surface S1 of the substrate 210. The heat dissipation structure 250a is a groove recessed from the top surface S1 of the substrate 210 toward the second side VP2, so that the third distance H3 is greater than the second distance H2 and the first distance H1. In other words, thereby, in the projection device 100 / illumination system 110 / optical device 112 ( Figure 1 During the assembly process, when adjusting the distance between the light-receiving element 113 and the top surface S2 of the wavelength conversion layer 220, the operator does not need to consider the height of other components (such as the counterweight structure 230 and the heat dissipation structure 250a). After the projection device 100 / illumination system 110 / optical device 112 is assembled, when the wavelength conversion element 200a rotates relative to the light-receiving element 113, the light-receiving element 113 will not collide with the heat dissipation structure 250a. In this embodiment, the number of heat dissipation structures 250a is, for example, multiple, but not limited to this. In other embodiments not shown, the number of heat dissipation structures 250a may be one.

[0083] In this embodiment, the heat dissipation structure 250a is located radially D2 on the substrate 210 between the wavelength conversion region P1 and the edge 214 of the substrate 210. The heat dissipation structure 250a has a base plate 251 and a sidewall 252 connected to each other, with the sidewall 252 surrounding the base plate 251. The sidewall 252 is connected to the substrate 210, and the base plate 251 is parallel to the top surface S1 of the substrate 210. In this embodiment, the substrate 210 and the heat dissipation structure 250a can be integrally formed. The heat dissipation structure 250a can be formed by stamping the original substrate, so that the thickness H7 of the substrate 210 is greater than or equal to the distance H9 between the base plate 251 of the heat dissipation structure 250a and the top surface S1 of the substrate 210. The distance H9 can be the difference between the third distance H3 and the second distance H2. When the heat dissipation structure 250a is located on the second side VP2, the distance H9 can be greater than, equal to, or less than the distance H10 between the top surface S2 of the wavelength conversion layer 220 and the top surface S1 of the substrate 210. In this embodiment, the heat dissipation structure 250a, the recessed structure 231 and the substrate 210 are integrally formed. The heat dissipation structure 250a and the recessed structure 231 are both recessed in the top surface S1 of the substrate 210, and the wavelength conversion element 200a has only the wavelength conversion layer 220, the rotating shaft 261 and / or the non-wavelength conversion element 240 protruding from the top surface S1 of the substrate 210.

[0084] The base plate 251 of the heat dissipation structure 250a has a surface S4 facing the light-receiving element 113, and a third distance H3 exists between the surface S4 and the light-receiving element 113. The sidewall 252 of the heat dissipation structure 250a includes a first surface S51 and a second surface S52. The first surface S51 is perpendicular to the top surface S1 of the substrate 210 and is a vertical plane. The second surface S52 is not perpendicular to the top surface S1 of the substrate 210 and is inclined relative to the top surface S1 of the substrate 210, forming a slope. The sidewall 252 may also include a plane and / or a curved surface for connecting the first surface S51 and the second surface S52. In this embodiment, the first surface S51 is, for example, a windward surface, and the second surface S52 is, for example, a leeward surface. The airflow generated when the wavelength conversion element 200a rotates clockwise, for example, mostly blows directly onto the first surface S51. The first surface S51 can disturb most of the airflow to create turbulence, thereby improving the heat exchange efficiency between the airflow and the wavelength conversion element 200. With a substrate 210 diameter of 54 mm, compared to... Figure 4 The wavelength conversion element 200a in this embodiment can reduce the temperature by about 5%.

[0085] In the production of the heat dissipation structure 250a of the wavelength conversion element 200a of this embodiment, a protective film (not shown) can be first applied to the substrate used to form the substrate 210, and then a stamping process can be performed to form the heat dissipation structure 250a. After the stamping process is completed, the protective film is removed. In this embodiment, since the second surface S52 of the heat dissipation structure 250a is a slope, the protective film covering the second surface S52 is less likely to break when the stamping process is performed to form the second surface S52. Therefore, the operator can easily remove the protective film covering the top surface S1, the second surface S52, and the bottom plate 251 of the substrate 210 from the second surface S52, thereby simplifying the manufacturing process. The wavelength conversion element 200a of this embodiment is similar to that of the previous embodiment, and will not be described again here.

[0086] Figure 7 This is a schematic cross-sectional view of an optical device according to an embodiment of the present invention, schematically showing two radial directions D2 parallel to the X-axis with some structures omitted. Please also refer to... Figure 6 and Figure 7 The wavelength conversion element 200b in this embodiment is different from that in the aforementioned embodiment ( Figure 6 Similar to the wavelength conversion element 200a), the difference lies in that, in this embodiment, the surface S4 of the base plate 251 of the heat dissipation structure 250b adjacent to the light-receiving element 113 is located on the first side VP1 of the virtual plane VP, and there is a distance H12 between the surface S4 and the top surface S1 of the substrate 210. The third distance H6 between the surface S4 and the light-receiving element 113 is less than the second distance H2. The difference between the third distance H6 and the second distance H2 is the distance H12. The heat dissipation structure 250b is a boss protruding from the top surface S1 of the substrate 210 toward the first side VP1, thus placing the heat dissipation structure 250b on the first side VP1 of the virtual plane VP. When the heat dissipation structure 250b is located on the first side VP1 (i.e., the third distance H6 is less than the second distance H2), the distance H12 is less than or equal to the distance H10 between the top surface S2 and the top surface S1 of the wavelength conversion layer 220. In this embodiment, the third distance H6 is greater than the first distance H1 and less than the second distance H2, and the distance H12 is less than the distance H10. In other embodiments not shown, the third distance H6 may be equal to the first distance H1, and the distance H12 may be equal to the distance H10. The wavelength conversion element 200b in this embodiment is similar to that in the previous embodiments, and will not be described again here.

[0087] Figure 8 This is a schematic diagram of a wavelength conversion element according to an embodiment of the present invention. Figure 9 It corresponds Figure 8 A cross-sectional schematic diagram of the optical device is shown here, schematically illustrating two radial directions D2 parallel to the X-axis, with some structural details omitted. Please also refer to... Figure 6 , Figure 8 and Figure 9The wavelength conversion element 200c in this embodiment is different from that in the aforementioned embodiment ( Figure 6 Similar to the wavelength conversion element 200a), the difference lies in that, in this embodiment, the multiple heat dissipation structures 250c are located on the radial direction D2 of the substrate 210 between the wavelength conversion region P1 and the geometric center 211. Compared to Figure 6 The heat dissipation structure 250c in this embodiment is smaller due to the limited area it is designed for. With a substrate 210 diameter of 54 mm, compared to... Figure 4 The wavelength conversion element 200c in this embodiment can reduce the temperature by about 7%. The wavelength conversion element 200c in this embodiment is similar to that in the previous embodiment, and will not be described again here.

[0088] Figure 10 This is a schematic diagram of a wavelength conversion element according to an embodiment of the present invention. Figure 11 yes Figure 10 A cross-sectional view of the wavelength conversion element is shown here, schematically depicting two radial directions D2 parallel to the X-axis, with some structural details omitted. Please also refer to... Figure 6 , Figure 10 and Figure 11 The wavelength conversion element 200d in this embodiment is different from that in the aforementioned embodiment ( Figure 6 Similar to the wavelength conversion element 200a), the difference lies in that, in this embodiment, a portion of the plurality of heat dissipation structures 250d are located on the radial direction D2 of the substrate 210 between the wavelength conversion region P1 and the geometric center 211, while another portion is located on the radial direction D2 of the substrate 210 between the wavelength conversion region P1 and the edge 214 of the substrate 210. The wavelength conversion element 200d of this embodiment has multiple heat dissipation structures 250d provided on both the inner and outer sides relative to the wavelength conversion region P1, thus achieving good heat dissipation. When the diameter of the substrate 210 is 54 mm, compared to... Figure 4 The wavelength conversion element 200d in this embodiment can reduce the temperature by about 11%. The wavelength conversion element 200d in this embodiment is similar to that in the previous embodiment, and will not be described again here.

[0089] In summary, the optical device and projection device of the embodiments of the present invention have at least one of the following advantages: the top surface of the wavelength conversion layer of the light-receiving element and the wavelength conversion element is located on a first side of the virtual plane, the counterweight structure is located on a second side of the virtual plane, and the top surface of the substrate is located on the virtual plane; and a specific distance can be spaced between the light-receiving element and the wavelength conversion element. Therefore, the wavelength conversion element has better conversion efficiency. Furthermore, when the wavelength conversion element rotates relative to the light-receiving element, or during the assembly of the optical device, collisions between the light-receiving element and the substrate and the counterweight structure can be avoided, preventing damage.

[0090] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. Any simple equivalent changes and modifications made in accordance with the claims and specification of the present invention are still within the scope of this patent. Furthermore, no embodiment or claim of the present invention needs to achieve all the objectives, advantages, or features disclosed in the present invention. In addition, the abstract and title of the invention are only used to assist in patent document retrieval and are not intended to limit the scope of the invention. Moreover, the terms "first," "second," etc., mentioned in this specification or claims are only used to name elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

Claims

1. An optical device, characterized in that, The optical device includes a light-receiving element and a wavelength conversion element, wherein The light-collecting element is disposed on the first side of the virtual plane; The wavelength conversion element includes a substrate, a wavelength conversion layer, and a counterweight structure, wherein... The substrate includes a wavelength conversion region and a geometric center, the wavelength conversion region surrounds the geometric center, and the top surface of the substrate is located on the virtual plane; The wavelength conversion layer is disposed in the wavelength conversion region, wherein a first distance exists between the light-receiving element and the top surface of the wavelength conversion layer, and a second distance exists between the light-receiving element and the top surface of the substrate, the first distance being smaller than the second distance, and the top surface is located on the first side of the virtual plane; and The counterweight structure is connected to the substrate and is located on the second side of the virtual plane, with the first side relative to the second side.

2. The optical device according to claim 1, characterized in that, The wavelength conversion element includes a heat dissipation structure, which is connected to the substrate and has a third distance from the light receiving element, the third distance being greater than or equal to the first distance.

3. The optical device according to claim 2, characterized in that, The third distance is greater than the second distance, and the heat dissipation structure is located on the second side of the virtual plane.

4. The optical device according to claim 2, characterized in that, The thickness of the substrate is greater than or equal to the distance between the heat dissipation structure and the top surface.

5. The optical device according to claim 2, characterized in that, The heat dissipation structure includes a base plate and a side wall. The side wall surrounds the base plate and is connected to the substrate. The base plate and the light-receiving element have the third distance. The side wall includes a first surface and a second surface. The first surface is perpendicular to the top surface of the substrate, and the second surface is not perpendicular to the top surface of the substrate.

6. The optical device according to claim 2, characterized in that, The third distance is less than the second distance, and the heat dissipation structure is located on the first side of the virtual plane.

7. The optical device according to claim 2, characterized in that, The number of heat dissipation structures is multiple, and the multiple heat dissipation structures are disposed at any of the following positions in the radial direction of the substrate: (i) Between the wavelength conversion region and the geometric center; (ii) Between the wavelength conversion region and the edge of the substrate; or (iii) The combination of the two above.

8. The optical device according to claim 1, characterized in that, The wavelength conversion element includes a motor, the motor's shaft protruding from the geometric center of the substrate, a portion of the shaft being located on the first side of the virtual plane, and the shaft not overlapping with the orthographic projection of the light-receiving element on the virtual plane.

9. The optical device according to claim 8, characterized in that, The rotating shaft has a top surface located on the first side of the virtual plane, and the distance between the top surface of the rotating shaft and the top surface of the substrate is greater than or equal to the second distance between the light-receiving element and the top surface of the substrate.

10. The optical device according to claim 1, characterized in that, The substrate further includes a non-wavelength conversion region, and the wavelength conversion element includes a non-wavelength conversion component disposed in the non-wavelength conversion region. The non-wavelength conversion component and the wavelength conversion layer surround the geometric center. The top surface of the non-wavelength conversion component is located on the first side of the virtual plane, and the first distance between the light-receiving element and the top surface of the wavelength conversion layer is less than or equal to the distance between the light-receiving element and the non-wavelength conversion component.

11. A projection device, characterized in that, The projection device includes an illumination system, a light valve module, and a lens module, wherein... The lighting system is used to provide a light beam, and the lighting system includes a light source module and optical devices, wherein... The light source module is used to provide a laser beam; The optical device includes a light-receiving element and a wavelength conversion element, wherein The light-collecting element is disposed on the transmission path of the laser beam from the light source module and is located on the first side of the virtual plane; The wavelength conversion element is disposed on the transmission path of the laser beam from the light-receiving element and is used to convert the laser beam into a converted beam. The illumination beam includes at least one of the laser beam and the converted beam. The wavelength conversion element includes a substrate, a wavelength conversion layer, and a counterweight structure. The substrate includes a wavelength conversion region and a geometric center, the wavelength conversion region surrounds the geometric center, and the top surface of the substrate is located on the virtual plane; The wavelength conversion layer is disposed in the wavelength conversion region, wherein a first distance exists between the light-receiving element and the top surface of the wavelength conversion layer, and a second distance exists between the light-receiving element and the top surface of the substrate, the first distance being smaller than the second distance, and the top surface is located on the first side of the virtual plane; and The counterweight structure is connected to the substrate and located on the second side of the virtual plane, with the first side relative to the second side. The light valve module is configured in the transmission path of the illumination beam to convert the illumination beam into an image beam; and The lens module is positioned on the transmission path of the image beam to project the image beam out of the projection device.

12. The projection device according to claim 11, characterized in that, The wavelength conversion element includes a heat dissipation structure, which is connected to the substrate and has a third distance from the light receiving element, the third distance being greater than or equal to the first distance.

13. The projection device according to claim 12, characterized in that, The third distance is greater than the second distance, and the heat dissipation structure is located on the second side of the virtual plane.

14. The projection device according to claim 12, characterized in that, The thickness of the substrate is greater than or equal to the distance between the heat dissipation structure and the top surface.

15. The projection device according to claim 12, characterized in that, The heat dissipation structure includes a base plate and a side wall. The side wall surrounds the base plate and is connected to the substrate. The base plate and the light-receiving element have the third distance. The side wall includes a first surface and a second surface. The first surface is perpendicular to the top surface of the substrate, and the second surface is not perpendicular to the top surface of the substrate.

16. The projection device according to claim 12, characterized in that, The third distance is less than the second distance, and the heat dissipation structure is located on the first side of the virtual plane.

17. The projection device according to claim 12, characterized in that, The number of heat dissipation structures is multiple, and the multiple heat dissipation structures are disposed at any of the following positions in the radial direction of the substrate: (i) Between the wavelength conversion region and the geometric center; (ii) Between the wavelength conversion region and the edge of the substrate; or (iii) The combination of the two above.

18. The projection device according to claim 11, characterized in that, The wavelength conversion element includes a motor, the motor's shaft protruding from the geometric center of the substrate, a portion of the shaft being located on the first side of the virtual plane, and the shaft not overlapping with the orthographic projection of the light-receiving element on the virtual plane.

19. The projection device according to claim 18, characterized in that, The rotating shaft has a top surface located on the first side of the virtual plane, and the distance between the top surface of the rotating shaft and the top surface of the substrate is greater than or equal to the second distance between the light-receiving element and the top surface of the substrate.

20. The projection device according to claim 11, characterized in that, The substrate further includes a non-wavelength conversion region, and the wavelength conversion element includes a non-wavelength conversion component disposed in the non-wavelength conversion region. The non-wavelength conversion component and the wavelength conversion layer surround the geometric center. The top surface of the non-wavelength conversion component is located on the first side of the virtual plane, and the first distance between the light-receiving element and the top surface of the wavelength conversion layer is less than or equal to the distance between the light-receiving element and the non-wavelength conversion component.

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