Semiconductor coating and developing liquid comprehensive management supply system and debugging method

Abstract

The present application relates to the technical field of liquid supply system for semiconductor coating and developing, and discloses a comprehensive management and supply system for liquid chemicals for semiconductor coating and developing and a debugging method, which comprises a solvent circulation and recovery system, a pipeline cleaning system, a glue supply system and a waste outlet. The solvent circulation system comprises a solvent storage unit, a circulating pump and a filter. The circulating pump sucks the liquid chemicals in the solvent storage unit, and the liquid chemicals are filtered by the filter and then returned to the circulating pump through a CRF circulating branch. According to the present application, the functions of solvent circulation and recovery, automatic cleaning and glue supply are integrated. When maintenance is performed, the photoresist solvent can be returned to the circulating pump along the CRF branch, the photoresist solvent can be recycled, the utilization rate of the liquid chemicals can be improved, and the increase of WetPA caused by the retention of the liquid chemicals in the filter can be inhibited. Meanwhile, the standard formula is used to replace manual debugging, and the bubble defects and batch differences caused by incomplete exhaust can be fundamentally eliminated.

Description

Technical Field

[0001] This invention relates to the field of semiconductor coating and developing solution supply system technology, specifically to a comprehensive management and supply system and debugging method for semiconductor coating and developing solutions. Background Technology

[0002] In the photolithography process of semiconductor chips, the coating and developing equipment is responsible for coating the photoresist and developing the solvent. The stability and reliability of the reagent supply system directly affect the wafer process quality. Existing technologies suffer from the following two major pain points:

[0003] Pain Point 1: Improper Filter Replacement and Adjustment. Current technology lacks a standardized adjustment procedure after replacing the photoresist filter. Operators rely on experience for manual operation, which easily leads to:

[0004] 1. Incomplete venting, with residual air bubbles in the pipeline mixing into the photoresist;

[0005] 2. Insufficient wetting of the filter membrane, and production was started before the initial filtration accuracy met the standards;

[0006] 3. There are no unified standards for debugging parameters (pressure, flow rate, time), resulting in poor batch stability.

[0007] The aforementioned problems lead to a decrease in photoresist filtration accuracy, causing coating defects (such as bubbles and particulate contamination), ultimately resulting in wafer surface defects and affecting yield.

[0008] Pain Point 2: Low chemical utilization rate and high wastewater treatment cost. During preventive maintenance shutdowns, residual chemical solutions (photoresist) in the filtration unit and pipelines cannot be effectively recovered and are directly discharged into the wastewater system. This wastes high-value chemicals (photoresist is extremely expensive) and increases wet particulate matter / defects (WetPA) due to long-term retention of chemical solutions in the filter, while also increasing the environmental burden of wastewater treatment. For example, patent document CN110787967A discloses a photoresist coating system with filtration and debubbling mechanisms, but it only solves the bubble problem and does not involve multi-mode switching or chemical solution recovery functions; patent document CN114054287A discloses a photoresist back-suction device, which only controls the liquid column at the supply port, and neither of these can solve the core pain points of the existing technology. Summary of the Invention

[0009] To address the shortcomings of existing technologies, this invention provides a comprehensive management and supply system and debugging method for semiconductor coating and developing chemicals. This solves the problems of existing semiconductor coating and developing chemical supply systems, such as the reliance on manual filter replacement and debugging, lack of standardization leading to process instability, and the high cost waste and environmental burden caused by the inability to effectively recycle chemicals.

[0010] To achieve the above objectives, the present invention provides the following technical solution:

[0011] A comprehensive management and supply system for semiconductor coating and developing chemicals includes a solvent recycling system, a pipeline cleaning system, a photoresist supply system, and a waste outlet. Photoresist solvent is recycled and filtered by the solvent recycling system before being delivered to the pipeline cleaning system to clean the photoresist supply system. The solvent recycling system includes a solvent storage unit, a circulation pump, and a filter. The circulation pump draws the solvent from the solvent storage unit, filters it, and then returns it to the circulation pump via a CRF circulation branch. The pipeline cleaning system includes a distribution tank and a buffer tank. The photoresist solvent delivered by the circulation pump is filtered and flows out of the distribution tank, sequentially cleaning the buffer tank, the photoresist pump unit, the supply port, and the pipelines between them. The photoresist supply system includes a photoresist tank, which supplies photoresist to the supply port via the photoresist pump unit.

[0012] Preferably, the CRF circulation branch includes a circulation pipeline arranged between the circulation pump and each filter, two self-regulating valves are arranged in parallel on the circulation pipeline, and a collection port is connected to the pipeline and the self-regulating valve at the junction of the circulation pipeline.

[0013] Preferably, the pipeline between the solvent storage unit and the circulation pump is equipped with a pressure regulating valve, the pipeline between the filter and the liquid supply port is respectively equipped with a flow meter and a self-control valve, and a waste discharge pipeline is arranged between the filter and the waste discharge port.

[0014] Preferably, the photoresist pump unit includes a drive pump and a collection box. Two pipelines, independently controlled by an automatic control valve, are arranged between the photoresist tank and the collection box. One of the pipelines is connected to a filter. Both the filter and the collection box are connected to a waste outlet through the automatic control valve and the pipeline. Two pipelines, independently controlled by an automatic control valve, are arranged between the drive pump and the collection box.

[0015] A debugging method for a comprehensive management and supply system for semiconductor coating and developing chemicals involves performing the following steps using the comprehensive management and supply system for semiconductor coating and developing chemicals as described in the above technical solution:

[0016] CRF circulation: When the machine needs to be stopped, the control unit controls the opening and closing of the corresponding automatic control valve, so that the liquid medicine flows out of the filter and enters the CRF branch, and flows back to the circulation pump to realize the chemical recovery and circulation.

[0017] IFF-S Filtration: After the filter is replaced, the control unit controls the opening and closing of the corresponding automatic control valve, so that the liquid in the solvent storage unit is filtered by the filter and delivered to the designated collection port;

[0018] RLC Drainage / Cleaning: When switching processes, maintaining equipment, or changing chemicals, the control unit controls the opening and closing of the corresponding automatic control valve. The photoresist pump unit draws cleaning solvent from the solvent storage unit, filters it through the filter, and flows out of the distribution tank in sequence to clean the buffer tank, photoresist pump unit, liquid supply port and the pipelines between them.

[0019] IFF-R filter element impregnation and venting: By switching the drive pump to vacuum negative pressure mode, the photoresist flows in a directional manner to impregnate and fill the filter element; by switching the drive pump to nitrogen pressurization mode, the photoresist flows and the air and photoresist in the photoresist flow channel are discharged from the exhaust port connected to the collection box.

[0020] Preferably, the process also includes a liquid replenishment and reflux venting step: the drive pump after performing the IFF-R filter element replenishment and venting step is switched to vacuum negative pressure mode to replenish liquid to the filter, collection box and the pipeline before the liquid supply port, eliminate the unwetted dry area, and re-wet the filter; the drive pump is switched to nitrogen pressurization mode to allow the photoresist to return from the collection box to the photoresist tank through the pipeline.

[0021] Preferably, the process also includes a final venting and flushing step for the filter and the liquid supply port: applying nitrogen pressure to the photoresist tank to allow the photoresist to enter from the filter and exit from the waste outlet; closing the automatic control valve between the filter and the waste outlet, continuously applying nitrogen pressure to the photoresist tank, allowing the photoresist to pass through the filter, the collection box and the drive pump in sequence, and be directly discharged from the liquid supply port.

[0022] The present invention has the following beneficial effects:

[0023] This integrated management and supply system for semiconductor coating and developing chemicals combines solvent recycling, automatic cleaning, and photoresist supply functions. During maintenance, it can return residual photoresist solvent in filters and pipelines to the circulation pump via the CRF branch for reuse, avoiding long-term retention of chemicals in the filters that leads to increased wet particles / defects. It also significantly improves the utilization rate of chemicals and reduces waste liquid treatment costs. At the same time, the system can automatically perform solvent rinsing and venting according to a preset path, replacing manual adjustments with standardized formulas. This fundamentally eliminates bubble defects and batch differences caused by incomplete venting, ultimately forming a compact and clean closed loop, which significantly improves the stability of the photoresist supply process and equipment uptime. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the solvent recycling system of the present invention;

[0025] Figure 2 This is a schematic diagram of the pipeline cleaning system of the present invention;

[0026] Figure 3 This is a schematic diagram of the adhesive supply system of the present invention;

[0027] Figure 4 This is a schematic diagram of the actual application state of the solvent recycling system of the present invention;

[0028] Figure 5 This is a schematic diagram of the photoresist flow during the filter element impregnation and collection box venting steps of the present invention (the red solid line indicates the pipeline where the photoresist is located).

[0029] Figure 6 This is a schematic diagram of the photoresist flow during the liquid replenishment, wetting, reflux, and degassing steps of the present invention (the red solid line represents the pipeline where the photoresist is located).

[0030] Figure 7 This is a schematic diagram of the photoresist flow during the final exhaust and liquid supply port rinsing steps of the filter of the present invention (the red solid line represents the pipeline where the photoresist is located).

[0031] In the diagram: 1. Solvent storage unit; 2. Pressure regulating valve; 3. Circulation pump; 4. Filter; 5. Flow meter; 6. Liquid supply port; 7. Waste discharge port; 8. Automatic control valve; 9. Optical resist pump unit; 10. Distribution tank; 11. Optical resist tank; 12. Buffer tank; 13. Drive pump; 14. Collection box; 15. Collection port. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] Example 1

[0034] A comprehensive management and supply system for semiconductor coating and developing chemicals includes a solvent recycling system, a pipeline cleaning system, a photoresist supply system, and a waste outlet 7. The photoresist solvent is recycled and filtered by the solvent recycling system before being delivered to the pipeline cleaning system to clean the photoresist supply system. The solvent recycling system includes a solvent storage unit, a circulation pump, and a filter. The circulation pump draws solvent from the solvent storage unit, filters it, and then returns it to the circulation pump via a CRF circulation branch. The pipeline cleaning system includes a distribution tank and a buffer tank. The photoresist solvent delivered by the circulation pump is filtered and flows out of the distribution tank, sequentially cleaning the buffer tank, the photoresist pump unit, the supply port, and the pipelines between them. The photoresist supply system includes a photoresist tank, which supplies photoresist to the supply port via the photoresist pump unit.

[0035] like Figure 1-3As shown, in this technical solution, through the solvent circulation system, during maintenance shutdowns, the residual solvent in the pipelines and filter 4 is no longer directly discharged, but can be returned to the circulation pump 3 for reuse through a branch. This saves solvent costs and significantly reduces waste liquid treatment volume and environmental burden. Simultaneously, the continuous flow of solvent avoids the wet particulate increase (WetPA) defect caused by long-term retention. The pipeline cleaning system can automatically draw in solvent and sequentially flush the distribution tank 10, buffer tank 12, light-resist pump unit 9, supply port 6, and all pipelines along a set path. This transforms manual operation into a standardized formula executed automatically by the equipment, ensuring that the venting, wetting, and rinsing after each filter 4 replacement are thorough and consistent, fundamentally solving the problem of bubble and particulate contamination caused by improper commissioning and incomplete venting. The entire system integrates glue supply and cleaning into a closed loop, avoiding external contamination. Meanwhile, this design allows for automatic switching between multiple operating modes (glue supply, cleaning, and recycling). In terms of hardware, it achieves integrated liquid management with a compact structure and high cleanliness by sharing pumps and pipelines, which can significantly improve process stability and equipment uptime.

[0036] In this embodiment, the CRF circulation branch includes a circulation pipeline arranged between the circulation pump and each filter 4. Two self-control valves 8 are arranged in parallel on the circulation pipeline. The confluence of the circulation pipeline is also connected to a collection port 15 with the pipeline and the self-control valves 8.

[0037] In this embodiment, a pressure regulating valve 2 is provided in the pipeline between the solvent storage unit 1 and the circulating pump 3, a flow meter 5 and a self-control valve 8 are respectively arranged in the pipeline between the filter 4 and the liquid supply port 6, and a waste discharge pipeline is arranged between the filter 4 and the waste discharge port 7.

[0038] In this embodiment, the photoresist pump unit 9 includes a drive pump 13 and a collection box 14. Two pipelines independently controlled by a self-control valve 8 are arranged between the photoresist tank 11 and the collection box 14, one of which is connected to a filter 4. Both the filter 4 and the collection box 14 are connected to a waste outlet 7 through the self-control valve 8 and the pipeline is connected between the drive pump 13 and the collection box 14. Two pipelines independently controlled by a self-control valve 8 are arranged between them.

[0039] Example 2

[0040] A commissioning method for a comprehensive management and supply system of chemicals for semiconductor coating and developing is described. In practical application, the control unit controls the opening and closing of various self-regulating valves in the supply system to flexibly switch between the following five operating steps. During the switching process, the control unit first pre-adjusts the pipeline pressure and flow rate, and only after the parameters stabilize does it complete the automatic valve switching to avoid chemical impact and flow fluctuations, thus protecting the pipelines and equipment components. The self-regulating valves on different pipelines are designated A, B, C, A1, and A2 to clearly describe the opening and closing of the corresponding pipelines.

[0041] Pure fluid supply procedure (e.g.) Figure 1 As shown): Adapting to the normal coating and developing process, the control unit controls the opening and closing of the corresponding automatic control valve, so that the photoresist in the photoresist tank is drawn by the photoresist pump unit and enters the filter for preliminary filtration. The qualified photoresist after filtration is delivered to the liquid supply port, providing a stable liquid supply for the coating and developing process, ensuring that the photoresist flow rate and purity meet the standards. The automatic control valve before the liquid supply port is open, and the automatic control valve of the CRF branch is closed. The path is: photoresist tank → photoresist pump unit → filter → flow meter → liquid supply port.

[0042] CRF cycle steps (such as...) Figure 4 (As shown): When the PM (partition motor) needs to be stopped, the control unit controls the corresponding automatic control valve to open and close, allowing the photoresist solvent to flow out of the filter outlet and into the CRF branch, returning to the circulation pump. This achieves photoresist solvent recovery and circulation, improving the utilization rate of the photoresist solvent while suppressing the increase in WetPA caused by the retention of photoresist solvent and photoresist in the filter. Valve A2 is open, valve C is open, and the liquid supply port is closed. The path is photoresist solvent through the filter → valve A2 → circulation pump inlet (return circulation).

[0043] IFF-S filtration steps (such as...) Figure 4 As shown): After replacing the filter, the control unit controls the opening and closing of the corresponding automatic control valve, executes the IFF-S function, and after filtration by a dedicated fine filter to remove minute impurities, the solvent is delivered to the designated pipeline or storage unit to ensure that the solvent purity meets the process requirements. Valve A1 and valve B are open, and the path is: solvent from solvent storage unit → filter (removing minute impurities) → valve A1 → valve B → collection port.

[0044] RLC draining / rinsing steps (such as...) Figure 2 As shown): When switching processes, performing equipment maintenance, or changing chemicals, the control unit controls the opening and closing of the corresponding automatic control valve, selectively introducing cleaning fluid to circulate and clean the pipeline. After cleaning, any remaining chemicals or cleaning fluid in the pipeline is discharged to the waste outlet, ensuring the pipeline is clean and residue-free, and preventing contamination from mixing different chemicals. The path is: circulating pump → filter → chemical valve → buffer tank → optical resist pump unit → flow meter → supply port.

[0045] IFF-R filter element impregnation and degassing steps (such as...) Figure 5-7 (As shown): The IFF-R standard formula is invoked on the equipment's sub-operation panel. The PLC control system automatically executes the following four sub-steps according to a preset sequence. In the glue supply system, AV / 01-AV / 07 distinguish the automatic control valves on different pipelines to clearly describe the opening and closing of the corresponding pipelines:

[0046] Filter cartridge impregnation + collection box venting: The drive pump switches to vacuum mode (VAC) (AV / 01, AV / 06 are turned on), generating negative pressure in the pump chamber, drawing photoresist from the photoresist tank through the filter into the drive pump chamber, achieving initial impregnation and filling of the filter cartridge. Path: Photoresist tank → self-regulating valve AV / 01 → filter → collection box → self-regulating valve AV / 01 → drive pump;

[0047] Switch to nitrogen pressurization mode (open AV / 03, AV / 04). The pressure forces the photoresist to flow, opening the exhaust / drain valve of the collection box (automatic control valve AV / 03). This forces the air accumulated in the flow path out through the exhaust port at the top of the collection box, completing the initial venting and filter flow path cleaning. The path is: drive pump → automatic control valve AV / 04 → collection box → automatic control valve AV / 03 → exhaust port.

[0048] Replenishing liquid and purging: Switch back to vacuum mode (VAC) (open AV / 01, AV / 06), replenish liquid to the filter, collection box and the pipeline before the liquid supply port (ensure the filter element is fully wetted a second time to eliminate unwetted dry areas), and wet the filter again;

[0049] When the flow path is switched to reflux exhaust mode (AV / 04 and AV / 05 are turned on), the photoresist returns from the collection box to the photoresist tank via the reflux pipeline. During the circulation process, residual air bubbles in the pipeline are carried back to the photoresist tank with the liquid flow and naturally degassed, achieving reflux exhaust. The path is: collection box → self-regulating valve AV / 05 → lower reflux pipeline → photoresist tank, closed-loop circulation.

[0050] Final venting and flushing of the filter supply port: Nitrogen pressure is used to push (AV / 01, AV / 02 open), allowing the photoresist in the photoresist tank to enter through the filter. The remaining micro-air bubbles from the first two steps are completely discharged through the vent branch connected to the exhaust port at the top of the filter, completing the final flow stabilization and bubble removal. The path is: Photoresist tank → Automatic control valve AV / 01 → Filter → Automatic control valve AV / 02 → Exhaust port;

[0051] Driven by nitrogen pressure in the photoresist tank (with AV / 01, AV / 04, and AV / 07 open), the photoresist flows from the filter → collection box → drive pump → outlet pipeline → supply port, and is directly discharged from the supply port. This flushes out impurities, microparticles, and residual micro-particles carried during pipeline cleaning, completing a closed loop. The path is: photoresist tank → filter → collection box → drive pump → automatic control valve (AV / 07) → supply port discharge. In a single IFF-R procedure, the three operations of "filter replacement—pipeline venting—supply port cleaning" are completed simultaneously. Impurities and micro-particles are discharged directly from the supply port, preventing deposition in the pipeline or supply port, thus avoiding subsequent supply port blockage and poor dispensing.

[0052] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0053] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A comprehensive management and supply system for semiconductor coating and developing chemicals, characterized in that, The system includes a solvent recycling system, a pipeline cleaning system, a photoresist supply system, and a waste outlet. The photoresist solvent is recycled and filtered by the solvent recycling system and then transported to the pipeline cleaning system to clean the photoresist supply system. The solvent recycling system includes a solvent storage unit, a circulation pump, and a filter. The circulation pump draws the solution from the solvent storage unit, filters it, and then returns it to the circulation pump through the CRF circulation branch. The pipeline cleaning system includes a distribution tank and a buffer tank. The photoresist solvent transported by the circulation pump is filtered and flows out of the distribution tank, sequentially cleaning the buffer tank, the photoresist pump unit, the supply port, and the pipelines between them. The photoresist supply system includes a photoresist tank, which supplies photoresist to the supply port through the photoresist pump unit.

2. The integrated management and supply system for semiconductor coating and developing chemicals according to claim 1, characterized in that: The CRF circulation branch includes a circulation pipeline arranged between the circulation pump and each filter. Two self-regulating valves are arranged in parallel on the circulation pipeline. The junction of the circulation pipeline is also connected to the self-regulating valves and has a collection port.

3. The integrated management and supply system for semiconductor coating and developing solutions according to claim 2, characterized in that: The pipeline between the solvent storage unit and the circulation pump is equipped with a pressure regulating valve, and the pipeline between the filter and the liquid supply port is respectively equipped with a flow meter and a self-control valve. The filter and the waste discharge port are both connected by a waste discharge pipeline.

4. The integrated management and supply system for semiconductor coating and developing solutions according to claim 3, characterized in that: The photoresist pump unit includes a drive pump and a collection box. Two pipelines, independently controlled by a self-regulating valve, are arranged between the photoresist tank and the collection box. One of the pipelines is connected to a filter. Both the filter and the collection box are connected to a waste outlet through a self-regulating valve and a pipeline. Two pipelines, independently controlled by a self-regulating valve, are arranged between the drive pump and the collection box.

5. A debugging method for a comprehensive management and supply system for semiconductor coating and developing chemicals, characterized in that, The following steps are performed using the integrated management and supply system for semiconductor coating and developing chemicals as described in any one of claims 1-4: CRF circulation: When the machine needs to be stopped, the control unit controls the opening and closing of the corresponding automatic control valve, so that the liquid medicine flows out of the filter and enters the CRF branch, and flows back to the circulation pump to realize the chemical recovery and circulation. IFF-S Filtration: After the filter is replaced, the control unit controls the opening and closing of the corresponding automatic control valve, so that the liquid in the solvent storage unit is filtered by the filter and delivered to the designated collection port; RLC Drainage / Cleaning: When switching processes, maintaining equipment, or changing chemicals, the control unit controls the opening and closing of the corresponding automatic control valve. The photoresist pump unit draws cleaning solvent from the solvent storage unit, filters it through the filter, and flows out of the distribution tank in sequence to clean the buffer tank, photoresist pump unit, liquid supply port and the pipelines between them. IFF-R filter element impregnation and venting: By switching the drive pump to vacuum negative pressure mode, the photoresist flows in a directional manner to impregnate and fill the filter element; by switching the drive pump to nitrogen pressurization mode, the photoresist flows and the air and photoresist in the photoresist flow channel are discharged from the exhaust port connected to the collection box.

6. The debugging method for the integrated management and supply system of semiconductor coating and developing chemicals according to claim 5, characterized in that: It also includes the replenishment and reflux venting steps: switch the drive pump after performing the IFF-R filter element replenishment and venting steps to vacuum negative pressure mode, replenish the filter, collection box and the pipeline before the liquid supply port with liquid, eliminate the unwetted dry area, and re-wet the filter; switch the drive pump to nitrogen pressurization mode, so that the photoresist returns from the collection box to the photoresist tank through the pipeline.

7. The debugging method for the integrated management and supply system of semiconductor coating and developing chemicals according to claim 6, characterized in that: It also includes the final venting of the filter and flushing of the liquid supply port: applying nitrogen pressure to the photoresist tank to allow the photoresist to enter from the filter and exit from the waste port; closing the automatic control valve between the filter and the waste port, continuously applying nitrogen pressure to the photoresist tank, allowing the photoresist to pass through the filter, collection box and drive pump in sequence, and be directly discharged from the liquid supply port.

Images