Table, module and method for manufacturing a table

Abstract

The present application provides a table, the table is equipped with: first plate-like component, it is formed by conductive material; Second plate-like component, it is arranged in the first side of first plate-like component, and is formed by conductive material;Substrate, it is arranged between first plate-like component and second plate-like component;And connecting component, it is used to make first plate-like component and second plate-like component electrically connected, wherein, through hole is formed on the substrate, and connecting component makes first plate-like component and second plate-like component electrically connected in the state of being inserted into through hole.

Description

Technical Field

[0001] This invention relates to tables, modules, and methods for manufacturing tables. Background Technology

[0002] As described in Japanese Patent Application Publication No. 2000-292567, it is known that externally introduced static electricity can damage internal equipment, necessitating countermeasures. In this regard, a method is known to achieve conductivity between metal components using connecting components such as helical springs. Therefore, a structure could be considered whereby a metal component carrying externally introduced static electricity is electrically connected to a metal component serving as ground (GND) using a helical spring or similar device, thereby releasing the static electricity to GND. Summary of the Invention

[0003] The problem that the invention aims to solve However, components such as the coil springs installed inside the instrument are extremely small and may detach from their designated positions due to slight vibrations or impacts caused by the disassembly or assembly of surrounding parts, and thus become embedded in the intended mechanical structure (e.g., inside the analog block). When coil springs become embedded in the mechanical structure of analog blocks, they can become a factor leading to operational malfunctions.

[0004] Technical solutions for solving the problem An embodiment of the present invention includes: a first plate-shaped member formed of a conductive material; a second plate-shaped member disposed on a first side of the first plate-shaped member and also formed of a conductive material; a substrate disposed between the first plate-shaped member and the second plate-shaped member; and a connecting member for electrically connecting the first plate-shaped member and the second plate-shaped member, wherein a through hole is formed on the substrate, and the connecting member electrically connects the first plate-shaped member and the second plate-shaped member when inserted into the through hole. Attached Figure Description

[0005] Figure 1 This is a perspective view of the main parts of the modules provided in the table according to the implementation method, viewed from the rear side.

[0006] Figure 2 This is a cross-sectional view showing the main parts of the internal structure of the table according to the first embodiment.

[0007] Figure 3 This is a schematic side view of the circuit pressure plate.

[0008] Figure 4 This is a schematic top view of the circuit board as seen from the surface side.

[0009] Figure 5 To indicate Figure 2The enlarged cross-sectional view of the periphery of the helical spring is shown.

[0010] Figure 6 This is a cross-sectional view showing the main parts of the internal structure of the table according to the second embodiment.

[0011] Figure 7 This is a cross-sectional view showing the main parts of the internal structure of the table according to the third embodiment.

[0012] Figure 8 A cross-sectional view of the main part of an example to show the internal structure of an existing table. Detailed Implementation

[0013] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Figure 2 In this context, the thickness direction (vertical direction) of Table 100 is taken as the Z-direction. Within the Z-direction, the visible side of Table 100, i.e., the front side, is referred to as the "upper side (surface side)," and the back side is referred to as the "lower side (back side)." Furthermore, Figure 1 The image shows the state where the buffer plate component 9 has been removed from module 1, exposing the substrate 7 and the circuit pressure plate 8. Furthermore, Figure 2 The cross-sectional views shown are schematic diagrams for illustrating the structure and do not accurately represent the position or shape of each structural element. Furthermore, although various technically preferred limitations for carrying out the invention are added to the embodiments described below, the scope of the invention is not limited to the following embodiments and illustrated examples.

[0014] Several embodiments of the present invention will be described below, but most of the structural elements of module 1 and the layer structure of each element set in Table 100 are common in the various embodiments. Therefore, the common parts in the various embodiments will be described first.

[0015] The table 100 described in this implementation is an analog table that displays time by having multiple pointers 3 (in the example shown, the second hand is 3s, the minute hand is 3m, and the hour hand is 3h) point to and display hour markers not shown. Furthermore, the number of pointers in table 100 is not limited to three; for example, it may only have two pointers, the minute hand (3m) and the hour hand (3h), or it may have various function pointers in addition to the three pointers. Table 100 includes, for example... Figure 1The module 1 shown is roughly disc-shaped. Although not shown in the figure, module 1 is housed within a housing with openings at the top and bottom in the Z direction. The opening on the upper side of the housing in the Z direction (the visible side of the watch, the surface side) is closed by a windproof component 11, which is a transparent component (cover component) made of glass or transparent resin material. Furthermore, a rear cover component 12 (see reference) is provided on the bottom side of the housing (the lower side in the Z direction, the back side of the watch 100) to close the opening on the back side. Figure 2 ).

[0016] Module 1 includes multiple drive mechanisms that rotate and drive multiple hands 3 respectively. Each drive mechanism includes a motor (not shown) as the drive source and a gear train mechanism that transmits the driving force of the motor to the hands 3. Each gear train mechanism includes multiple gear assemblies (gears and shafts). For example, the gear train mechanism of the second hand drive mechanism includes gear assemblies of four wheels (second wheel), etc. The gear train mechanism of the minute hand drive mechanism includes gear assemblies of two wheels (minute wheel), etc. The gear train mechanism of the hour hand drive mechanism includes gear assemblies of cross wheels or wheel carriages (hour wheel), etc. In addition, the gear train mechanism may also include gears other than gear assemblies. As long as the gears and shafts are integrated, they can also be separate parts. Furthermore, in the embodiment, the drive mechanism section including the motor or gear assembly (the mechanism structure specified in the embodiment) is referred to as "simulation module 2" as a whole. Figure 2 As shown, the simulation module 2 is disposed on the upper side (upper side in the Z direction) of the substrate 7 described later.

[0017] Static electricity can enter the interior of the watch 100 from the outside. For example, static electricity first enters from the pointer shaft 30 (shaft). The pointer shaft 30 is, for example, a shaft component made of carbon tool steel (SK material) and is arranged along the Z direction (the vertical direction of the watch). The pointer shaft 30 is supported by the gear train plate 4, etc., so that it can rotate about the axis center, and the second hand 3s is fixed to the free end side (upper side in the Z direction) of the pointer shaft 30. The gear train plate 4 is arranged on the lower side (lower side in the Z direction) of the main plate (main plate) 5 and supports the lower end of the pointer shaft 30. Without any static electricity countermeasures, the static electricity entering from the pointer shaft 30 flows to the base plate 7 through internal components, etc. The base plate 7 is equipped with delicate electronic components such as LSI (Large Scale Integration) (not shown), and such components may be damaged when static current reaches the base plate 7.

[0018] like Figure 2As shown, approximately the lower half of the pointer shaft 30 is inserted into the cylindrical member 31. The cylindrical member 31 is a generally cylindrical component, such as a conductive component made of a metal material like stainless steel. The base end side (lower side in the Z direction) of the cylindrical member 31 is fixed to the center wheel clamp 6 by pressing or other means. The center wheel clamp 6 is made of a metal material like stainless steel, and in this embodiment, it is a second plate-shaped component made of a conductive material. The center wheel clamp 6 is disposed between the main clamp 5 and the wheel train clamp 4. Although it does not directly contact the pointer shaft 30, it supports a portion of the pointer shaft 30 in the vertical direction (Z direction) via the conductive cylindrical member 31. Thus, the center wheel clamp 6 is electrically connected to the pointer shaft 30 via the cylindrical member 31, and static electricity entering from the pointer shaft 30 flows to the center wheel clamp 6.

[0019] To prevent static current from the outside from flowing to the substrate 7, the center wheel clamp 6 is configured in an electrically floating state relative to the GND potential. Furthermore, in the embodiments shown below, it is configured to release static electricity flowing to the center wheel clamp 6 to a first plate-shaped member having a GND potential and formed of a conductive material. The first plate-shaped member having a GND potential is either a circuit pressure plate 8 (first and second embodiments) or a rear cover member 12 (third embodiment).

[0020] Furthermore, the two wheels 32 (the cylindrical portions of the two wheels) of the wheel train mechanism constituting the minute hand drive mechanism are coaxially arranged on the outside of the cylindrical member 31. Also, the cylindrical carriage 33 of the wheel train mechanism constituting the hour hand drive mechanism is coaxially arranged on the outside of the cylindrical portions 32 of the two wheels. The minute hand 3m is fixed to the free end side (upper side in the Z direction) of the cylindrical portion 32 of the two wheels. Furthermore, the hour hand 3h is fixed to the free end side (upper side in the Z direction) of the carriage 33.

[0021] like Figure 2 As shown, a display plate-shaped member 15 is disposed on the upper side (upper side in the Z direction) of the main plate 5. The display plate-shaped member 15 may include, for example, a dial or calendar disc guard. In the case of the stacked structure in the Z direction of the windproof member 11 to the back cover member 12 in Table 100 of the embodiment, the display plate-shaped member 15 is disposed on the lower side of the windproof member 11, the main plate 5 is disposed on the lower side of the display plate-shaped member 15, and a center wheel plate 6 is disposed on the lower side of the main plate 5. Furthermore, a wheel train plate 4 is disposed on the lower side of the center wheel plate 6, a base plate 7 is disposed on the lower side of the wheel train plate 4, a circuit pressure plate 8 is disposed on the lower side of the base plate 7, and the back cover member 12 is disposed on the lower side of the circuit pressure plate 8, separated by a buffer plate member 9. Furthermore, the components from the display plate component 15 to the buffer plate component 9 are not components that overlap in all parts in the plane direction, but rather overlap as a whole while avoiding components to be installed by means of holes or cuts.

[0022] The main clamping plate 5 and the wheel clamping plate 4 are, for example, plate-shaped components formed of resin or the like. In the embodiment, the wheel clamping plate 4 is disposed between the center wheel clamping plate 6, which is a second plate-shaped component, and the substrate 7, and is a third plate-shaped component formed of a non-conductive material. Furthermore, the main clamping plate 5 is a fourth plate-shaped component disposed on the side opposite to the substrate 7 of the center wheel clamping plate 6, which is a second plate-shaped component. As described above, the substrate 7 is disposed between the circuit pressure plate 8, which is a first plate-shaped component, and the center wheel clamping plate 6, which is a second plate-shaped component. Although not shown in the figure, various electronic components are appropriately mounted on the substrate 7. Furthermore, a through hole 71 extending in the thickness direction is formed on the substrate 7 in the embodiment. A connecting member for electrically connecting the circuit pressure plate 8, which is a first plate-shaped component, and the center wheel clamping plate 6, which is a second plate-shaped component, is disposed in the through hole 71. In the embodiment, the connecting member is a helical spring 10. Furthermore, the connecting member is not limited to any component that can electrically connect the first plate-shaped component and the second plate-shaped component.

[0023] The buffer plate component 9 is formed of a resin or the like that having a cushioning effect, and is an elastic plate-shaped component laminated on the back side (opposite to the first side) of the circuit pressure plate 8 in the Z direction downward direction. The buffer plate component 9 presses substantially evenly against the entire circuit pressure plate 8 disposed on the visible side of the buffer plate component 9, and has the effect of absorbing external impacts. Figure 2 As shown, a protrusion 92 is appropriately provided on the surface of the buffer plate member 9 opposite to the rear cover member 12 in the embodiment. The number and arrangement of the protrusions 92 are not particularly limited, but it is preferable that the protrusions 92 are at least provided in the portion corresponding to the position where the coil spring 10 (described later) is located. This effectively holds the coil spring 10, which is to be pushed upwards in the Z direction, thereby enabling the coil spring 10 to reliably connect (electrically connect) the center wheel clamp 6 and the circuit pressure plate 8. Furthermore, although the embodiment illustrates a case where the protrusion 92 is formed on the lower surface in the Z direction (the side opposite to the rear cover member 12), the protrusion 92 may also be provided on the opposite surface of the buffer plate member 9 (the upper surface in the Z direction). Additionally, an opening 91 is formed in a portion of the buffer plate member 9 that extends through the surface and the back side, allowing the contact tongue 81 of the circuit pressure plate 8 to protrude from the opening toward the rear cover member 12 side 91.

[0024] The circuit pressure plate 8 is formed of a conductive material and functions as a first plate-shaped component in both the first and second embodiments. For example... Figure 1As shown, the main body 80 of the circuit plate 8 is fixed to the substrate 7 disposed on the upper side in the Z direction. Furthermore, the upper side in the Z direction of the circuit plate 8 (the surface side of Table 100, the side opposite to the substrate) is defined as the first side. A center wheel clamp 6, as a second plate-shaped component, is disposed (stacked) on the first side (surface side) of the circuit plate 8. The circuit plate 8 has a contact tongue 81 that is electrically connected to the rear cover component 12, which functions as GND. The contact tongue 81 stands upright on the back side opposite to the first side of the main body 80 and protrudes from the opening 91 of the buffer plate component 9 toward the rear cover component 12. The contact tongue 81 contacts the rear cover component 12, causing the circuit plate 8 to have a GND potential.

[0025] In addition, such as Figure 1 As shown, in the embodiment, an engraving portion 83, inscribed with various markings, is formed on the surface of the back side of the main body portion 80 of the circuit pressure plate 8, on the Z-direction downward side, which serves as the back cover member 12. For example... Figure 3 As shown in the side view, the circuit plate 8 is a thin metal plate, etc., which has the property of warping toward the surface on which the engraving is performed when an engraving process is performed on a surface. Figure 3 The diagram shows that the circuit plate 8 warps by a warp amount α. When the circuit plate 8 warps toward the side where the engraving process is performed (the back side, which is the opposite side of the first side in the embodiment), it is possible that the coil spring 10 cannot reliably contact the circuit plate 8. Therefore, in the embodiment, dot-marking is performed on the surface of the circuit plate 8 on the first side opposite to the side where the engraving portion 83 is formed to form a dot-marking portion 85 (see reference). Figure 4 Therefore, even if the circuit plate 8 warps due to the formation of the engraving portion 83, the warping on both the surface and the back side will cancel each other out, thereby improving the connection between the helical spring 10 and the circuit plate 8.

[0026] Next, each embodiment will be described in detail. First, the first embodiment, which includes module 1, has a structure where the first plate-shaped component is a circuit pressure plate 8. This first plate-shaped component is electrically connected to the center wheel clamping plate 6, which is a second plate-shaped component, via a helical spring 10 as a connecting component. In this case, the length of the helical spring 10 in the Z direction is set to be slightly longer than the length of the center wheel clamping plate 6 to the circuit pressure plate 8 in the Z direction, so that the helical spring 10 is configured to reliably contact the center wheel clamping plate 6 and the circuit pressure plate 8. Figure 2 As shown, through holes for inserting the helical spring 10 in the Z direction are respectively provided on the wheel system clamping plate 4 and the base plate 7, which are located between the circuit pressure plate 8, which is the first plate-shaped component, and the center wheel clamping plate 6, which is the second plate-shaped component.

[0027] That is, as described above, a through hole 71 is formed on the substrate 7. Furthermore, on the wheel clamping plate 4, which serves as a third plate-shaped component, a cylindrical support portion 41 is vertically provided along the through-hole 71 at a position corresponding to the through hole 71 on the substrate 7. The cylindrical support portion 41 is a cylindrical portion that internally supports the helical spring 10, which serves as a connecting component. At least a portion of the helical spring 10 and the cylindrical support portion 41 supporting the helical spring 10 is inserted into the through hole 71 of the substrate 7. In this embodiment, the cylindrical support portion 41 is a support structure provided between the circuit pressure plate 8, which serves as a first plate-shaped component, and the center wheel clamping plate 6, which serves as a second plate-shaped component. The cylindrical support portion 41, as a support structure, supports the helical spring 10, which serves as a connecting component, in an upright state and maintains this upright state. Figure 2 In the example shown, a cylindrical support portion 41 is formed on the surface and back side of the gear train clamp 4. The cylindrical support portion 41 has a small diameter portion 42 on the lower side (back side) of the gear train clamp 4 in the Z direction, which is smaller than the upper side (surface side). The through hole 71 has a diameter at least large enough to accommodate the small diameter portion 42 inserted into the cylindrical support portion 41 of the gear train clamp 4. The coil spring 10 and the small diameter portion 42 are inserted into the through hole 71.

[0028] One end of the helical spring 10 disposed within the cylindrical support portion 41 abuts against the center wheel clamp 6 disposed on the upper side of the wheel train clamp 4 in the Z direction. Furthermore, the length of the helical spring 10 in the Z direction is longer than the length of the cylindrical support portion 41 in the Z direction, and the other end of the helical spring 10 protrudes from the end (lower end in the Z direction) of the cylindrical support portion 41 (small diameter portion 42). When the circuit pressure plate 8 is disposed on the lower side of the wheel train clamp 4 and the base plate 7 in the Z direction, the other end of the helical spring 10, inserted into the cylindrical support portion 41, abuts against the surface side (first surface side) of the circuit pressure plate 8 (see reference). Figure 5 Thus, the center wheel clamping plate 6 and the circuit pressure plate 8 are electrically connected via a helical spring 10. Furthermore, in Figure 1 In the diagram, a helical spring 10, which abuts against the surface side (first surface side) of the circuit pressure plate 8 but does not appear on the back side of module 1, is shown by a dashed line. Figure 1 This is always a schematic diagram and does not accurately represent the installation position of the helical spring 10 as a connecting component. Furthermore, in the embodiment, the electrical connection position of the helical spring 10 between the circuit pressure plate 8 (first plate-shaped member) and the center wheel clamping plate 6 (second plate-shaped member) is an example and is not limited to the example shown in the figure.

[0029] Next, the manufacturing method of Table 100 will be described with a focus on the assembly of module 1. In the case of the first embodiment, when assembling module 1, a wheel train clamping plate 4 is arranged on the lower side of the center wheel clamping plate 6 in the Z direction, and a base plate 7 is arranged on the lower side of the wheel train clamping plate 4 in the Z direction. At this time, the cylindrical support portion 41 (small diameter portion 42 of the cylindrical support portion 41) of the wheel train clamping plate 4 is inserted into the through hole 71 of the base plate 7. Then, with the cylindrical support portion 41 of the wheel train clamping plate 4 exposed from the through hole 71 of the base plate 7 in the lower Z direction, the coil spring 10 is arranged in the through hole 71 and the cylindrical support portion 41. A circuit pressure plate 8 is arranged on the lower side of the base plate 7 in the Z direction, thereby, as Figure 5 As shown, the through hole 71 and the cylindrical support portion 41, in which the helical spring 10 is internally disposed, are blocked by the circuit pressure plate 8, which is pressed against the Z-direction upward by the buffer plate member 9 in a substantially equal manner. In particular, in this embodiment, at least the portion of the buffer plate member 9 corresponding to the helical spring 10 has a protrusion 92. Therefore, the helical spring 10 is firmly pressed in the Z-direction. As a result, the helical spring 10 is stably in contact with the center wheel clamp 6 and the circuit pressure plate 8, thereby allowing the static electricity flowing from the pointer shaft 30 to the center wheel clamp 6 to be released to the circuit pressure plate 8. Furthermore, the static electricity flowing from the center wheel clamp 6 to the circuit pressure plate 8 via the helical spring 10 is further released to the rear cover member 12 via the contact tongue 81 of the circuit pressure plate 8. In the embodiment, even if the back cover component 12, circuit pressure plate 8, and buffer plate component 9 are removed during repairs, the coil spring 10 will not accidentally fall off to the upper side of the Z direction of the substrate 7, thereby preventing the coil spring 10 from getting mixed into the simulation module 2, which is the mechanical structure specified in the embodiment.

[0030] Next, the table involved in the second embodiment is similar to that in the first embodiment, a through hole 71 is provided in the substrate 7 between the circuit pressure plate 8, which is a first plate-shaped member, and the center wheel clamping plate 6a, which is a second plate-shaped member, and at least a portion of the wheel clamping plate 4a is provided ( Figure 6 The small-diameter portion 42a is inserted into the cylindrical support portion 41a of the through hole 71. Furthermore, the helical spring 10a in the second embodiment is a stepped (with a height difference) helical spring with a flange portion 101 formed on one end side (the end that abuts against the center wheel clamping plate 6a, which is a second plate-shaped member), serving as a locking flange portion with a diameter larger than the spring body. In the cylindrical support portion 41a of the wheel clamping plate 4a, a recess 43 is formed in the stepped portion serving as the locking flange portion 101. In the assembled state of this embodiment, the flange portion 101 is disposed within the recess 43 of the wheel clamping plate 4a. Therefore, the helical spring 10a is in a state where it will not slip off the wheel clamping plate 4a.

[0031] Furthermore, on the lower Z-direction surface of the main clamping plate 5a, which serves as the fourth plate-shaped component, a guide shaft portion 51 protruding downward in the Z-direction is erected corresponding to the position where the coil spring 10a, which serves as a connecting component, is disposed. The guide shaft portion 51 is a protrusion inserted into the coil spring 10a along the through-hole 71. In this embodiment, the cylindrical support portion 41a and the guide shaft portion 51 are a support structure disposed between the circuit pressure plate 8, which serves as the first plate-shaped component, and the center wheel clamping plate 6a, which serves as the second plate-shaped component. The cylindrical support portion 41a and the guide shaft portion 51, as support structures, support the coil spring 10a, which serves as a connecting component, in an upright state and maintain its upright state. In this embodiment, a through-hole 61 (second through-hole) is formed in the center wheel clamping plate 6a, which serves as the second plate-shaped component, at a position corresponding to the guide shaft portion 51. In the through-hole 61, the guide shaft portion 51 is inserted from the upper Z-direction to the lower Z-direction. Furthermore, the other structures are the same as in the first embodiment, so the same reference numerals are used to mark the same parts, and the description is omitted.

[0032] In the second embodiment, when assembling module 1, a center wheel clamping plate 6a is arranged on the lower side of the main clamping plate 5a in the Z direction. At this time, the guide shaft portion 51 is inserted into the through hole 61. Then, with the flange portion 101 facing the center wheel clamping plate 6a, the guide shaft portion 51 is inserted into the coil spring 10a, and the wheel train clamping plate 4a is stacked on the lower side of the center wheel clamping plate 6a in the Z direction. At this time, the guide shaft portion 51 and the coil spring 10a are inserted into the cylindrical support portion 41a. Furthermore, the flange portion 101 of the coil spring 10a is disposed in the recess 43. Moreover, a base plate 7 is arranged on the lower side of the wheel train clamping plate 4 in the Z direction. At this time, the cylindrical support portion 41a, with the guide shaft portion 51 and the coil spring 10a inserted, is inserted into the through hole 71. The helical spring 10a protrudes further downward in the Z-direction than the cylindrical support portion 41a (the small-diameter portion 42a of the cylindrical support portion 41a) and the through hole 71. When the circuit pressure plate 8 is arranged on the lower side of the wheel train clamping plate 4a and the base plate 7 in the Z-direction, the other end of the helical spring 10a, which is inserted into the cylindrical support portion 41a, abuts against the surface side (first surface side) of the circuit pressure plate 8. Thus, the center wheel clamping plate 6a and the circuit pressure plate 8 are electrically connected through the helical spring 10a.

[0033] In the second embodiment, the flange 101 is disposed within the recess 43, thereby reliably preventing the coil spring 10a from falling off when the wheel train clamp 4a is disposed. Thus, with the flange 101 provided at the upper Z-direction end of the coil spring 10a, unlike the first embodiment, as part of the assembly sequence, after the coil spring 10a is disposed on the lower Z-direction side of the center wheel clamp 6a, the wheel train clamp 4a is placed over the coil spring 10a from the lower Z-direction side. Although it is difficult to erect and accurately position the coil spring 10a on an exposed surface, in this embodiment, the guide shaft 51 protrudes from the main clamp 5a at the portion where the coil spring 10a is disposed. Therefore, by inserting the guide shaft 51 into the coil spring 10a, the coil spring 10a can be easily and stably erected. Thus, in the second embodiment, the coil spring 10a can also be stably disposed in contact with the center wheel clamp 6a and the circuit plate 8, allowing static electricity flowing from the pointer 30 to the center wheel clamp 6a to be released to the circuit plate 8. Furthermore, even if the back cover component 12, circuit pressure plate 8, and buffer plate component 9 are removed during repairs, the coil spring 10a will not accidentally fall off to the upper side of the Z direction of the substrate 7, thereby preventing the coil spring 10a from getting into the analog module 2.

[0034] Next, in the table according to the third embodiment, the rear cover member 12 functions as a first plate-shaped member formed of conductive material, and has the following structure: the center wheel clamp 6b, which is a second plate-shaped member, is electrically connected to the rear cover member 12 via a helical spring 10b, which serves as a connecting member. In this case, the length of the helical spring 10b in the Z direction is set to be slightly longer than the length from the center wheel clamp 6b to the rear cover member 12 in the Z direction, so that the helical spring 10b can reliably contact the center wheel clamp 6b and the rear cover member 12. Figure 7 As shown, the helical spring 10b in this embodiment is also a stepped helical spring with a flange portion 101 having a diameter larger than the spring body formed at one end, similar to the second embodiment. Furthermore, by inserting the guide shaft portion 51b into the helical spring 10b to make it upright in the Z direction, and by positioning the flange portion 101 within the recess 43 of the gear train clamping plate 4b, the helical spring 10b is positioned within the cylindrical support portion 41b. Thus, the helical spring 10b is in a state where it will not slip off the gear train clamping plate 4b. In this embodiment, the cylindrical support portion 41b and the guide shaft portion 51b are also support structures positioned between the circuit pressure plate 8b, which is a first plate-shaped member, and the center wheel clamping plate 6b, which is a second plate-shaped member. The cylindrical support portion 41b and the guide shaft portion 51b, as support structures, support the helical spring 10b, which serves as a connecting member, in an upright state and maintain this upright state.

[0035] Furthermore, in the third embodiment, through holes 87 and 93 are formed on the circuit pressure plate 8b and the buffer plate component 9b, respectively, at positions corresponding to the cylindrical support portion 41b (the small diameter portion 42b of the cylindrical support portion 41b) and the through hole 71. Additionally, as... Figure 7 As shown, preferably, the length of the guide shaft portion 51b in the Z direction and the length of the cylindrical support portion 41b are also longer than those in the first embodiment (see reference). Figure 2 ) and the second implementation method (refer to) Figure 6 The guide shaft portion 51 and the cylindrical support portion 41 of the rear cover component 12 can guide the helical spring 10b to the vicinity of the rear cover component 12. Figure 7 The example shows a guide shaft portion 51b and a cylindrical support portion 41b disposed near the surface side (upper side in the Z direction) of the buffer plate component 9b.

[0036] In the third embodiment, when assembling module 1, a center wheel clamping plate 6b is arranged on the lower side of the main clamping plate 5b in the Z direction. At this time, the guide shaft portion 51b is inserted into the through hole 61. Then, with the flange portion 101 facing the center wheel clamping plate 6b, the guide shaft portion 51b is inserted into the coil spring 10b, and the wheel train clamping plate 4b is stacked on the lower side of the center wheel clamping plate 6b in the Z direction. At this time, the guide shaft portion 51b and the coil spring 10b are inserted into the cylindrical support portion 41b, and the flange portion 101 of the coil spring 10b is disposed in the recess 43. Furthermore, a base plate 7 is arranged on the lower side of the wheel train clamping plate 4b in the Z direction. At this time, the cylindrical support portion 41b, with the guide shaft portion 51b and the coil spring 10b inserted, is inserted into the through hole 71. Furthermore, a circuit pressure plate 8b is arranged on the lower side of the base plate 7 in the Z direction. At this time, the cylindrical support portion 41b, in which the guide shaft portion 51b and the coil spring 10b are inserted, is also inserted into the through hole 87 of the circuit pressure plate 8b. Furthermore, a buffer plate component 9b is disposed on the lower side of the circuit pressure plate 8b in the Z direction, and the coil spring 10b is inserted into the through hole 93 of the buffer plate component 9b.

[0037] like Figure 7As shown, in this embodiment, the cylindrical support portion 41b (small diameter portion 42b of the cylindrical support portion 41b) and the guide shaft portion 51b are only provided on the upper side of the buffer plate member 9b in the Z direction, but the coil spring 10b protrudes to the lower side of the lower surface of the buffer plate member 9b in the Z direction. Moreover, when the rear cover member 12 is installed on the housing, the other end of the coil spring 10b abuts against the surface side (first surface side) of the rear cover member 12. Thus, the center wheel clamping plate 6b and the rear cover member 12 are electrically connected through the coil spring 10b. Therefore, in the third embodiment, static electricity flowing from the pointer shaft 30 to the center wheel clamping plate 6b can also be released to the rear cover member 12, which is the first plate-shaped member. Furthermore, even if the rear cover member 12, the circuit pressure plate 8b, and the buffer plate member 9b are removed during repairs, the coil spring 10b will not accidentally fall off to the upper side of the substrate 7 in the Z direction, thereby preventing the coil spring 10b from getting mixed into the analog module 2.

[0038] like Figure 8 In the existing structure shown, the helical spring 10, which serves as a connecting component, contacts the upper surface of the substrate 7c in the Z direction and is not inserted into the lower surface of the substrate 7c in the Z direction. Furthermore, the cylindrical support portion 41c of the wheel train clamp 4c that holds the helical spring 10 upright is also formed only to the upper surface of the substrate 7c in the Z direction. With the simulation module 2 provided on the upper surface of the substrate 7c in the Z direction as described above, the possibility of the helical spring 10 becoming detached during assembly, disassembly, or other processes due to vibration or impact increases. In contrast, when a portion of the helical spring 10 is inserted into the lower surface of the substrate 7c in the Z direction as described in the above embodiments, even when the back cover component 12, circuit pressure plate 8, or buffer plate component 9 is removed during repair or disassembly of the module 1 or table 100, the helical spring 10 will not accidentally fall to the upper surface of the substrate 7 in the Z direction, thus preventing the helical spring 10 from becoming detached from the simulation module 2.

[0039] As described above, the module 1 of this embodiment and the table 100 including the module 1 include: a circuit pressure plate 8 (or rear cover member 12 in the third embodiment) formed of conductive material as a first plate-shaped member; a center wheel clamping plate 6 formed of conductive material as a second plate-shaped member disposed on the first side (upper side in the Z direction) of the circuit pressure plate 8; a substrate 7 disposed between the circuit pressure plate 8 (first plate-shaped member) and the center wheel clamping plate 6 (second plate-shaped member); and a helical spring 10 as a connecting member for electrically connecting the circuit pressure plate 8 (first plate-shaped member) and the center wheel clamping plate 6 (second plate-shaped member). A through hole 71 is formed in the substrate 7, and the helical spring 10 electrically connects the circuit pressure plate 8 (first plate-shaped member) and the center wheel clamping plate 6 (second plate-shaped member) when inserted into the through hole 71.

[0040] A mechanical structure, such as an analog module 2, is provided on the upper Z-direction of the substrate 7. When a small component, such as a helical spring 10, gets mixed into the mechanical structure, it can become a major cause of various operational malfunctions. For example, the analog module 2 may contain a motor with a rotor magnet. Therefore, when it falls onto the upper Z-direction of the substrate 7, the helical spring 10 may be attracted by the magnet and become mixed into the analog module 2, causing operational malfunctions in various parts. In this respect, in this embodiment, the helical spring 10 protrudes to the lower Z-direction (back side) of the substrate 7. Therefore, even when the back cover component 12, circuit pressure plate 8, and buffer plate component 9 are removed during repairs, the helical spring 10 will not accidentally fall onto the upper Z-direction (surface side) of the substrate 7, thereby preventing the helical spring 10 from getting mixed into the mechanical structure of the analog module 2, etc.

[0041] Furthermore, in this embodiment, the circuit pressure plate 8 or the rear cover member 12, which serves as the first plate-shaped component, has a GND potential, and the center wheel clamp 6, which serves as the second plate-shaped component, is configured in an electrically floating state relative to the GND potential. Thus, static electricity flowing into the center wheel clamp 6 from the pointer 30 can be released via the helical spring 10, which serves as a connecting member, to the circuit pressure plate 8 or the rear cover member 12, which functions as GND.

[0042] Furthermore, in module 1 and table 100 including module 1, a third plate-shaped component made of a non-conductive material may be disposed between the center wheel clamp 6, which is the second plate-shaped component, and the base plate 7. In the embodiment, the third plate-shaped component is, for example, a wheel clamp 4. In the wheel clamp 4, which is the third plate-shaped component, a cylindrical support portion 41 supporting a helical spring 10, which is a connecting component, is erected vertically along the through-hole 71 at a position corresponding to the through-hole 71 of the base plate 7, and at least a portion (small diameter portion 42 in the embodiment) of the helical spring 10 and the cylindrical support portion 41 supporting the helical spring 10 is inserted into the through-hole 71 of the base plate 7. The helical spring 10, which is a connecting component, is difficult to stand upright on a plane by itself. Even if it stands upright by itself, it is a very small component and is easily knocked down or displaced due to vibration or impact when assembling surrounding components. If the helical spring 10 falls down or moves during assembly or disassembly, it may get mixed into the simulation module 2 and become the cause of equipment failure or operation failure. In this respect, in the embodiment, the coil spring 10 is supported not only by the through hole 71 of the substrate 7 but also by the cylindrical support portion 41 of the gear train clamp 4, thereby enabling it to stand stably. Therefore, it is possible to prevent the coil spring 10 from falling off during assembly, etc.

[0043] Furthermore, the coil spring 10, as a connecting component, can also have a flange portion 101 at the end of the center wheel clamp plate 6, which is the second plate-shaped component, as described in the second and third embodiments, serving as a locking flange portion. In this case, a recess 43, which serves as a stepped portion for locking flange portion 101, is formed on the cylindrical support portion 41 of the wheel train clamp plate 4, which is the third plate-shaped component. As a result, when the center wheel clamp plate 6 and the wheel train clamp plate 4 overlap to house the coil spring 10 within the cylindrical support portion 41, the coil spring 10 will not detach regardless of the orientation of the module 1, thereby more reliably preventing the coil spring 10 from falling off.

[0044] Furthermore, in module 1 and Table 100 which includes module 1, a fourth plate-shaped member may also be provided on the side opposite to the side facing the substrate 7 of the center wheel clamping plate 6, which serves as the second plate-shaped member. In the embodiment, the fourth plate-shaped member is the main clamping plate (main plate) 5. In the main clamping plate 5, which serves as the fourth plate-shaped member, as shown in the second and third embodiments, a guide shaft portion 51 may be erected vertically along the through-hole 71 as a protrusion to be inserted into the coil spring 10, corresponding to the arrangement position of the coil spring 10, which serves as a connecting member. In this case, in the center wheel clamping plate 6, which serves as the second plate-shaped member and is arranged on the lower side of the main clamping plate 5 in the Z direction, a second through-hole (through-hole 61) is formed at a position corresponding to the guide shaft portion 51, into which the guide shaft portion 51 is inserted. Thus, when the guide shaft portion 51 is provided as a protrusion, the upright state of the coil spring 10 can be supported more reliably.

[0045] Furthermore, in the above embodiments, a buffer plate member 9, which is an elastic plate member, is disposed (layered) on the side of the circuit pressure plate 8, which is the first plate member, opposite to the first side (upper side in the Z direction). Moreover, the buffer plate member 9 in the embodiments has a protrusion 92 at a position corresponding to the placement position of the connecting member. As a result, the circuit pressure plate 8 can be reliably pressed against the side of the helical spring 10, which is the connecting member, and properly abutted.

[0046] Furthermore, in the above embodiments, the first plate-shaped component is either a circuit pressure plate 8 (first and second embodiments) or a back cover component 12 (third embodiment). Therefore, module 1 or any component typically provided in Table 100 can be used as GND without requiring additional special components.

[0047] Furthermore, on the side of the circuit plate 8 opposite to the first side (upper side in the Z direction), there is sometimes an engraving portion 83 with various markings, model numbers, etc. When the circuit plate 8 is a thin metal plate, if the engraving portion 83 is formed on one of its surfaces, the entire plate may warp on the surface where the engraving portion 83 is formed. Especially as shown in the first and second embodiments, when the first plate-shaped member is the circuit plate 8, if the circuit plate 8 warps downward in the Z direction, the connection between the coil spring 10 and the circuit plate 8 may deteriorate. Therefore, when the engraving portion 83 is formed on the side opposite to the first side (upper side in the Z direction) of the circuit plate 8, it is preferable to perform dot-marking on the first side (upper side in the Z direction) of the circuit plate 8. That is, for example, a dot-marking portion 85 is formed on the surface of the first side (upper side in the Z direction) of the circuit plate 8, where the entire surface is engraved. This results in engraving on both the surface and back of the circuit plate 8, thereby counteracting and eliminating warping. Therefore, it can prevent poor connection with the coil spring 10 due to warping.

[0048] Furthermore, while embodiments of the present invention have been described above, the present invention is not limited to the embodiments described herein, and various modifications can be made without departing from its spirit. For example, in the first and second embodiments described above, when dot-printing is performed on the circuit board 8, which is the first plate-shaped component, the range of the dot-printing portion 85 may not be as described above. Figure 4 The component is as shown. For example, the area or periphery of the area where the engraving portion 83 is formed on the opposite side of the first side (upper side in the Z direction) may be formed only in relation to a portion of the area to counteract the influence of the engraving portion 83. Furthermore, since the end side of the circuit plate 8 is fixed to the substrate by screws, no warping occurs. Therefore, the dot-printing process can be performed only on the central part side that is not fixed by screws. Furthermore, it is not necessary to provide the engraving portion 83 on the opposite side of the first side (upper side in the Z direction). Even if the engraving portion 83 is not provided, in order to ensure the connection with the coil spring 10, the engraving process can be performed only on the first side (upper side in the Z direction) to warp the circuit plate 8 toward the first side (upper side in the Z direction). Furthermore, the engraving process performed on the first side (upper side in the Z direction) (dot-printing process in the embodiment) can also be performed on the periphery of the coil spring 10, especially by providing warping toward the first side (upper side in the Z direction) to improve the connection with the coil spring 10. There is no particular limitation on what kind of engraving is performed as the dot-printing process portion 85. However, when the engraving portion 83 is formed on the lower side of the circuit pressure plate 8 in the Z direction, it is preferable to perform more engraving processing on the first side (upper side in the Z direction) than on the engraving portion 83.

[0049] Furthermore, as shown in the above embodiments, the length of the cylindrical support portion 41 that supports the helical spring 10 and keeps it in an upright state is not limited to the example shown in the figure. For example, it may be a structure in which the cylindrical support portion 41 is not inserted into the through hole 71 of the substrate 7, but only the helical spring 10, which serves as a connecting member, is inserted into the through hole 71. In this case, the small diameter portion 42 may not be provided in the cylindrical support portion 41. Furthermore, the size and shape of the cylindrical support portion 41 are not limited to the example shown in the figure, as long as the helical spring 10 can be inserted inside. For example, the cylindrical support portion 41 as a whole may have a small diameter of the same degree as the small diameter portion 42. Furthermore, the diameter of the through hole 71 of the substrate 7 may be increased, and the cylindrical support portion 41 may be inserted into the through hole 71 with the diameter on the upper side of the Z direction remaining unchanged. Moreover, the length of the cylindrical support portion 41b in the Z direction may be shorter than Figure 7 The example shown illustrates this. By shortening the length of the cylindrical support portion 41b, the diameters of the through holes 71 and 81 in the substrate 7 and the circuit pressure plate 8b can also be made smaller than... Figure 7 In the example shown (e.g., slightly larger than the diameter of the coil spring 10b), through holes 71 and 81 are used to limit the coil spring 10b from moving significantly within the through holes 71 and 81.

[0050] Furthermore, for example, as shown in the second and third embodiments described above, when the guide shaft portion 51 is erected as a protrusion inserted into the coil spring 10 from the main clamping plate 5, the length of the guide shaft portion 51 is not limited to the example shown in the figure. For example, the length of the guide shaft portion 51 in the Z direction can be the same in the second and third embodiments. For example, in Figure 6 In the second embodiment shown, the helical spring 10 is guided by the guide shaft portion 51 until it reaches the substrate 7. Therefore, even if the helical spring 10b falls off, it is possible to prevent the helical spring 10 from getting into the simulation module 2 located on the upper side of the Z direction of the substrate 7. Furthermore, the guide shaft portion 51 only needs to be able to stand upright and be positioned until the helical spring 10b is disposed in the cylindrical support portion 41, and it can be shorter than the example shown, as long as the helical spring 10b does not bend or other problems occur midway.

[0051] Furthermore, in the second and third embodiments described above, a stepped helical spring is formed by providing a flange portion 101 to the helical springs 10a and 10b, but the structure of the helical spring is not limited to this. For example, instead of the flange portion 101, an arm portion or the like that that can be attached to the cylindrical support portion 41 of the gear train clamp 4 may be provided at the upper end of the helical spring in the Z direction, thereby securing the helical spring in the cylindrical support portion 41 by placing the flange portion outside the recess.

[0052] Furthermore, in the second and third embodiments described above, a guide shaft portion 51 is erected vertically from the main clamping plate 5 towards the lower side in the Z direction, and the guide shaft portion 51 is inserted into the helical spring 10 to guide it vertically in the Z direction. However, providing the guide shaft portion 51 is not mandatory. For example, as long as the helical spring 10 can be pre-fixed to the surface of the center wheel clamping plate 6 to make it upright, a structure without the guide shaft portion 51 can be used. In this case, the wheel system clamping plate 4, the base plate 7, the circuit pressure plate 8, etc., are assembled with the helical spring 10 pre-fixed.

[0053] Furthermore, it is not necessary to use the wheel clamp plate 4 (the cylindrical support portion 41 of the wheel clamp plate 4) to support the coil spring 10 up to the lower side of the base plate 7 in the Z direction. For example, even in a location where the cylindrical support portion 41 of the wheel clamp plate 4 cannot be provided, through holes can be provided at corresponding positions on the center wheel clamp plate 6 and the base plate 7, and the guide shaft portion 51, as shown in the second and third embodiments, can be erected from the main clamp plate 5 side, thereby supporting the coil spring 10, which serves as a connecting member, between the center wheel clamp plate 6 and the first plate-shaped member (circuit pressure plate 8 or rear cover member 12). In this case, the circuit pressure plate 8 or the rear cover member 12 can also be electrically connected to the center wheel clamp plate 6 via the coil spring 10.

[0054] Moreover, for example, it is also possible to Figure 2 The cylindrical support 41 of the first embodiment shown extends to the vicinity of the rear cover component 12 to connect the center wheel clamp 6 and the rear cover component 12 via the helical spring 10. In this case, through holes are provided at corresponding locations of each component (i.e., the substrate 7, the circuit pressure plate 8, and the buffer plate component 9) between the center wheel clamp 6 and the rear cover component 12, so that the helical spring 10 and the cylindrical support 41 supporting it can be inserted into these through holes. Even with this structure, the coil spring 10 will not fall off as long as the rear cover component 12 is not removed. Furthermore, even if the helical spring 10 falls off, it will not intrude into the upper side of the substrate 7 in the Z direction. Therefore, it is possible to prevent the helical spring 10 from getting into the simulation module 2.

[0055] Furthermore, for example, the above embodiment illustrates the application of module 1 to table 100, but the device using module 1 is not limited to tables. Module 1 can be any module used in electronic devices where external static current may cause malfunctions when it passes through delicate electronic components mounted on a substrate. For example, the structure shown in the embodiment can be widely applied to various smartwatches, electronic devices that acquire bio-information such as heart rate and blood flow information.

[0056] The above describes several embodiments of the present invention, but the scope of the present invention is not limited to the above embodiments, but includes the scope of the invention as described in the claims and its equivalents.

Claims

1. A table, characterized in that, have: The first plate-shaped component is formed of a conductive material; The second plate-shaped component is disposed on the first side of the first plate-shaped component and is formed of a conductive material; A substrate disposed between the first plate-shaped member and the second plate-shaped member; and A connecting component for electrically connecting the first plate-shaped component and the second plate-shaped component. Through holes are formed on the substrate. When the connecting component is inserted into the through hole, it electrically connects the first plate-shaped component and the second plate-shaped component.

2. The table according to claim 1, characterized in that, The first plate-shaped component has a GND potential, and the second plate-shaped component is configured in an electrically floating state relative to the GND potential.

3. The table according to claim 1, characterized in that, It includes a third plate-shaped component disposed between the second plate-shaped component and the substrate, and is formed of a non-conductive material. On the third plate-shaped component, a cylindrical support portion for supporting the connecting component is vertically provided at a position corresponding to the through hole of the substrate along the through direction of the through hole. The connecting component and at least a portion of the cylindrical support supporting the connecting component are inserted into the through hole of the substrate.

4. The table according to claim 3, characterized in that, The connecting member has an outwardly projecting flange for locking at its end on the side of the second plate-shaped member. A stepped portion is formed on the cylindrical support portion to lock the outwardly protruding flange portion.

5. The table according to claim 1, characterized in that, A fourth plate-shaped member is provided on the opposite side of the second plate-shaped member, which is opposite to the side opposite to the substrate. On the fourth plate-shaped component, corresponding to the configuration position of the connecting component, a protrusion is vertically provided along the through-hole direction, which is inserted into the connecting component. A second through hole is formed in the second plate-shaped component at a position corresponding to the protrusion.

6. The table according to claim 1, characterized in that, An elastic plate-shaped member is disposed on the side of the first plate-shaped member opposite to the first side. The elastic plate-like component has a protrusion at a position corresponding to the configuration position of the connecting component.

7. The table according to claim 1, characterized in that, The first plate-shaped component is a circuit pressure plate or a back cover component.

8. The table according to claim 1, characterized in that, The first plate-shaped component is a circuit pressure plate. An engraved portion with an imprint is formed on the side of the first plate-shaped component opposite to the first side. Dot engraving is performed on the first side of the first plate-shaped component.

9. A module, characterized in that, have: Circuit pressure plate, which is formed of conductive material; The second plate-shaped component is disposed on the first side of the circuit plate and is formed of a conductive material; A substrate disposed between the circuit plate and the second plate-shaped member; and A connecting component for electrically connecting the circuit pressure plate to the second plate-shaped component. A through hole is formed on the substrate, and when the connecting member is inserted into the through hole, the circuit pressure plate is electrically connected to the second plate-shaped member.

10. A method for manufacturing a watch, characterized in that, Includes the following steps: A second plate-shaped component formed of conductive material is configured; The substrate with through holes is positioned above the second plate-shaped member in the direction of gravity. The connecting component is inserted into the through hole of the substrate in an upright position; A first plate-shaped member formed of conductive material is disposed above the substrate in the direction of gravity; and The first plate-shaped component and the second plate-shaped component are electrically connected through the connecting component.

Images