A high-precision temperature control method based on series PID for double-layer TEC and related device

Abstract

The application discloses a double-layer TEC high-precision temperature control method based on series connection PID and related devices, which are used for improving the high-precision constant temperature capability of a temperature control platform. The application method is applied to a temperature control system, and the method comprises the following steps: obtaining a target temperature; controlling a temperature collection module to collect an outer ring initial temperature from a uniform temperature annular heat insulation layer; calculating an outer ring driving current of an outer ring TEC control loop according to the target temperature and the outer ring initial temperature, and controlling the outer ring TEC to output an outer ring temperature according to the outer ring driving current; controlling the temperature collection module to collect an inner ring initial temperature from a temperature collection point of the temperature control platform; when the difference between the inner ring initial temperature and the target temperature is less than a preset deviation, taking the outer ring driving current as a reference, calculating an inner ring driving current of an inner ring TEC control loop through the inner ring initial temperature and the target temperature; and driving the inner ring TEC according to the inner ring driving current to precisely regulate the inner ring initial temperature, so that an inner ring temperature is obtained.

Description

Technical Field

[0001] This application relates to the field of precision temperature control, and in particular to a high-precision temperature control method and related device based on a series PID dual-layer TEC. Background Technology

[0002] Applications such as semiconductor chip testing typically require temperature-controlled platforms to provide a stable, constant temperature environment to reduce the impact of temperature fluctuations on the product testing process. Existing temperature control platforms generally include a temperature acquisition module, a TEC (thermal energy dissipation device), and a corresponding PID control loop. Some systems also incorporate water-cooling structures to dissipate heat from the TEC's heat-generating components.

[0003] Existing temperature control systems for temperature-controlled platforms typically employ a single PID controller and a single TEC (Temperature Control Unit) scheme. A temperature acquisition module collects the platform temperature, and the PID control loop adjusts the TEC's drive current based on the deviation between the acquired and target temperatures, achieving closed-loop temperature control. Some systems also incorporate water cooling or filtering to improve temperature control stability.

[0004] However, a single PID control loop needs to handle both wide-range temperature regulation and small-deviation precision temperature regulation simultaneously, making it difficult to balance temperature regulation response speed and steady-state control accuracy. In a dual-layer TEC structure, thermal coupling interference can easily occur between the two TEC layers, affecting the synergistic temperature regulation effect. At the same time, control methods based on single-point temperature feedback cannot reflect the overall temperature state of the temperature control platform, and the time required to recover stability after environmental disturbances or load changes is relatively long, affecting the temperature uniformity and high-precision constant temperature capability of the temperature control platform. Summary of the Invention

[0005] To address the aforementioned technical issues, this application provides a dual-layer TEC high-precision temperature control method and related device based on series PID, which is used to improve the high-precision constant temperature capability of the temperature control stage.

[0006] The technical solution provided in this application is described below:

[0007] The first aspect of this application provides a high-precision temperature control method based on a dual-layer TEC (Variable Temperature Controller) system using a series PID controller. The method is applied to a temperature control system, which includes: Temperature acquisition module, outer loop TEC control loop, inner loop TEC control loop, uniform temperature ring insulation layer, temperature control platform; The uniform temperature annular insulation layer is provided between the outer ring TEC control circuit and the inner ring TEC control circuit. The heat absorption end of the outer ring TEC corresponding to the outer ring TEC control circuit is attached to the uniform temperature annular insulation layer, and the heat absorption end of the inner ring TEC corresponding to the inner ring TEC control circuit is attached to the temperature control platform. The outer ring TEC control loop and the inner ring TEC control loop are connected in series. The temperature measurement points of the temperature acquisition module are respectively set on the surface of the uniform temperature annular insulation layer and the temperature control platform. The temperature measurement points are set at multiple points. The method includes: Obtain the target temperature; The temperature acquisition module is controlled to acquire the initial temperature of the outer ring from the uniform temperature annular insulation layer; The outer loop drive current of the outer loop TEC control loop is calculated based on the target temperature and the initial temperature of the outer loop, and the outer loop TEC outputs the outer loop temperature based on the outer loop drive current; The temperature acquisition module is controlled to acquire the initial temperature of the inner ring from the temperature acquisition point of the temperature control platform; When the difference between the initial temperature of the inner ring and the target temperature is less than a preset deviation, the inner ring drive current of the inner ring TEC control loop is calculated based on the outer ring drive current, using the initial temperature of the inner ring and the target temperature. The inner ring TEC is driven by the inner ring drive current to precisely adjust the initial temperature of the inner ring, thereby obtaining the inner ring temperature.

[0008] Optionally, after the temperature acquisition module acquires the initial temperature of the inner ring from the temperature acquisition point of the temperature control platform, the method further includes: When the difference between the initial temperature of the inner loop and the target temperature is greater than a preset deviation, the inner loop TEC control loop is limited, so that the temperature control system is controlled through the outer loop TEC control loop.

[0009] Optionally, after precisely adjusting the initial temperature of the inner ring by driving the inner ring TEC according to the inner ring drive current to obtain the inner ring temperature, the method further includes: Continuously monitor the real-time temperature of the temperature-controlled platform; Calculate the real-time deviation between the real-time temperature and the target temperature; When the real-time deviation is greater than the preset deviation, the inner loop TEC control loop is controlled to limit the amplitude, so that the temperature control system is controlled through the outer loop TEC control loop.

[0010] Optionally, after precisely adjusting the initial temperature of the inner ring by driving the inner ring TEC according to the inner ring drive current to obtain the inner ring temperature, the method further includes: Continuously monitor the real-time temperature of the temperature-controlled platform; The real-time temperature is mapped to a preset PID parameter table to determine the reference PID control parameters corresponding to the real-time temperature. The preset PID parameter table is used to control the control parameters of the outer loop TEC control loop and the inner loop TEC control loop. Obtain the PID control record of the temperature range corresponding to the real-time temperature; Determine the historical temperature control error from the PID control records; The baseline PID control parameters are corrected based on the historical temperature control error to obtain the target PID control parameters.

[0011] Optionally, the temperature control system further includes a water-cooled heat dissipation substrate, which is attached to the heat dissipation end of the outer ring TEC. The temperature measurement points of the temperature acquisition module are set at multiple points on the water-cooled heat dissipation substrate, which is used to monitor the heat dissipation status of the temperature control system.

[0012] Optionally, the temperature control system's uniform annular insulation layer includes a uniform temperature region and an annular insulation region, with the annular insulation region surrounding the uniform temperature region, and the outer ring TEC and the inner ring TEC transferring heat through the uniform temperature region.

[0013] Optionally, controlling the temperature acquisition module to acquire the initial temperature of the outer ring from the uniform temperature annular insulation layer includes: The temperature acquisition module is controlled to acquire the first feedback temperature of each temperature measuring point of the uniform temperature annular insulation layer. After smoothing and filtering all the first feedback temperatures, the average value of all the first feedback temperatures is calculated to obtain the initial temperature of the outer ring.

[0014] Optionally, controlling the temperature acquisition module to acquire the initial temperature of the inner ring from the temperature acquisition point of the temperature control platform includes: The temperature acquisition module is controlled to acquire the second feedback temperature of each temperature measuring point on the temperature control platform. After smoothing and filtering all the second feedback temperatures, the average value of all the second feedback temperatures is calculated to obtain the initial temperature of the inner loop.

[0015] A second aspect of this application provides a high-precision temperature control device based on a series PID controller with dual-layer TEC, the device comprising: Processor, memory, input / output units, and bus; The processor is connected to the memory, the input / output unit, and the bus; The memory stores a program, which the processor invokes to execute the first aspect and any one of the optional methods in the first aspect.

[0016] A third aspect of this application provides a computer-readable storage medium on which a program is stored, which, when executed on a computer, performs the methods of the first aspect and any one of the first aspects.

[0017] As can be seen from the above technical solutions, this application has the following advantages: By setting a uniform temperature annular insulation layer between the outer loop TEC control loop and the inner loop TEC control loop, and collecting the temperatures of the uniform temperature annular insulation layer and the temperature control platform respectively, the outer loop TEC control loop calculates the outer loop drive current based on the target temperature and the initial temperature of the outer loop to pre-adjust the temperature. When the difference between the initial temperature of the inner loop and the target temperature is less than the preset deviation, the inner loop drive current is calculated based on the outer loop drive current, and the inner loop TEC precisely adjusts the temperature of the temperature control platform. This forms a series control process that combines the outer loop pre-adjustment and the inner loop precise temperature adjustment, thereby improving the temperature control accuracy of the temperature control platform. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of an embodiment of the temperature control system in this application; Figure 2 This is a schematic flowchart of an embodiment of the dual-layer TEC high-precision temperature control method based on cascaded PID in this application; Figure 3 This is a schematic flowchart of another embodiment of the dual-layer TEC high-precision temperature control method based on cascaded PID in this application; Figure 4 This is a schematic diagram of an embodiment of the high-precision temperature control method for dual-layer TEC based on cascaded PID in this application, which monitors and corrects the inner ring temperature. Figure 5 This is a schematic diagram of an embodiment of the dual-layer TEC high-precision temperature control device based on cascaded PID in this application. Detailed Implementation

[0020] It should be noted that this embodiment does not limit the executing entity of the dual-layer TEC high-precision temperature control method based on series PID. Any device with computing power and capable of data interaction with the temperature control system can serve as the executing entity of this method. To facilitate the description of the control process of this scheme, the following embodiment uses a terminal as the executing entity. The terminal refers to the host computer of the temperature control system, which is used to interact with the temperature control system and perform corresponding data calculations and control processing.

[0021] The technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0022] Please see Figure 1 This application first provides a high-precision temperature control method based on a dual-layer TEC system using cascaded PID control. This method is applied to a temperature control system, which includes: Temperature acquisition module 1, outer loop TEC control loop 2, inner loop TEC control loop 3, uniform temperature ring insulation layer 4, temperature control platform 5; The uniform temperature annular heat insulation layer 4 is provided between the outer ring TEC control circuit 2 and the inner ring TEC control circuit 3. The heat absorption end of the outer ring TEC corresponding to the outer ring TEC control circuit 2 is attached to the uniform temperature annular heat insulation layer 4, and the heat absorption end of the inner ring TEC corresponding to the inner ring TEC control circuit 3 is attached to the temperature control platform 5. The outer ring TEC control loop 2 and the inner ring TEC control loop 3 are connected in series. The temperature measurement points of the temperature acquisition module 1 are respectively set on the surface of the uniform temperature annular insulation layer 4 and the temperature control platform 5. The temperature measurement points are set at multiple points. The temperature control system also includes a water-cooled heat dissipation substrate 6, which is attached to the heat dissipation end of the outer ring TEC. The temperature measurement points of the temperature acquisition module 1 are set at multiple points on the water-cooled heat dissipation substrate, and the water-cooled heat dissipation substrate is used to monitor the heat dissipation status of the temperature control system.

[0023] The temperature control system's uniform annular insulation layer 4 includes a uniform temperature region and an annular insulation region. The annular insulation region surrounds the uniform temperature region, and the outer ring TEC and the inner ring TEC transfer heat through the uniform temperature region.

[0024] Specifically, the temperature acquisition module 1 includes temperature acquisition units corresponding to the uniform temperature annular insulation layer 4, the temperature control platform 5, and the water-cooled heat dissipation substrate 6, respectively. Each temperature acquisition unit acquires temperature data at its location through multiple corresponding temperature measurement points. Each temperature measurement point uses a platinum resistance thermometer, and the thermometer forms a temperature conduction relationship with the corresponding structural surface, so that the acquired temperature data represents the temperature state at the corresponding location. The temperature acquisition module 1 collects the temperature data generated by each temperature measurement point and transmits the temperature data to the terminal.

[0025] In one specific embodiment, the temperature acquisition module 1 includes three sets of PT1000 platinum resistance temperature measuring units. These three sets of units are respectively positioned corresponding to the uniform temperature annular insulation layer 4, the temperature control platform 5, and the water-cooled heat dissipation substrate 6. Each set of PT1000 platinum resistance temperature measuring units includes multiple temperature measuring points. The temperature acquisition module 1 generates temperature feedback data for the corresponding location based on the temperature data from each measuring point and transmits the temperature feedback data to the terminal. In another embodiment, the temperature acquisition module 1 uses PT10000 platinum resistance temperature measuring units to acquire the temperature data at each measuring point, thereby improving the accuracy of the temperature data acquisition.

[0026] Multiple temperature measuring points are set on the surface of the uniform-temperature annular insulation layer 4, distributed at temperature acquisition positions corresponding to the uniform-temperature area, to acquire the temperature change of the uniform-temperature annular insulation layer 4 after temperature adjustment by the outer ring TEC. Multiple temperature measuring points are set on the surface of the temperature control platform 5, distributed at different temperature acquisition positions on the platform, to acquire the temperature change at different locations on the platform. By using multiple temperature measuring points to generate multi-point temperature data for the corresponding structure, the terminal can determine the corresponding temperature control data based on the temperature data from multiple acquisition positions.

[0027] The outer loop TEC control loop 2 includes a PID control unit for calculating the control quantity of the outer loop TEC and a drive circuit for driving the outer loop TEC. The outer loop TEC control loop 2 receives control data output from the terminal and adjusts the current output of the drive circuit according to the control quantity generated by the PID control unit, thereby causing the outer loop TEC to change the temperature of the uniform temperature annular insulation layer 4. The drive circuit changes the operating state of the outer loop TEC by adjusting its drive current, enabling the outer loop TEC to perform the temperature pre-adjustment process of the temperature control system.

[0028] The inner-loop TEC control loop 3 includes a PID control unit for calculating the control quantity of the inner-loop TEC and a drive circuit for driving the inner-loop TEC. The inner-loop TEC control loop 3 determines the control quantity of the inner-loop TEC based on the temperature data corresponding to the temperature control platform 5, and adjusts the drive current of the inner-loop TEC to compensate for temperature changes in the temperature control platform 5. The drive circuits corresponding to the inner-loop TEC and the outer-loop TEC are set separately, enabling the outer-loop TEC and inner-loop TEC to be driven according to the control quantities output by their respective control loops.

[0029] In one specific implementation, the drive circuits corresponding to the outer loop TEC and the inner loop TEC respectively employ independent H-bridge drive circuits. The two H-bridge drive circuits adjust the outer loop drive current and the inner loop drive current respectively based on the control quantities formed by the corresponding control loops. The H-bridge drive circuits use PWM modulation to adjust the drive output, adjusting the TEC drive current by changing the output state corresponding to the PWM control signal, thus enabling the outer loop TEC and the inner loop TEC to adjust their current according to the corresponding temperature control requirements.

[0030] The drive circuits corresponding to the outer ring TEC and the inner ring TEC are each equipped with power limiting functions. The terminal limits the output power of the drive circuit according to the corresponding TEC power limiting threshold. In one specific embodiment, the maximum output power of the inner ring TEC is limited to 30% of the rated power of the inner ring TEC, so that the inner ring TEC performs micro-power compensation during precise temperature adjustment and limits temperature overshoot or reverse heating caused by excessive output power of the inner ring TEC.

[0031] In another embodiment, the drive circuits corresponding to the outer loop TEC and the inner loop TEC adopt linear voltage-regulated drive circuits. The linear voltage-regulated drive circuits adjust the drive current of the TEC according to the control quantity formed by the corresponding control loop to reduce the ripple of the drive current.

[0032] A control data association is established between the outer loop TEC control loop 2 and the inner loop TEC control loop 3. The outer loop TEC control loop 2 controls the temperature of the uniform temperature annular insulation layer 4 and generates an outer loop control output. The inner loop TEC control loop 3 combines the outer loop control output with the temperature data corresponding to the temperature control platform 5 to control the inner loop TEC. Thus, the outer loop TEC pre-adjusts the temperature of the temperature control system, and the inner loop TEC precisely adjusts the temperature of the temperature control platform 5 based on the temperature control formed by the outer loop TEC, so that the temperature control processes of the two TECs form a series control relationship.

[0033] The uniform temperature zone is located on the heat transfer path between the outer ring TEC and the inner ring TEC. The temperature regulation effect generated by the outer ring TEC is transferred to the location of the inner ring TEC through the uniform temperature zone. An annular heat insulation zone surrounds the uniform temperature zone to limit lateral heat transfer between the uniform temperature zone and the surrounding structure, concentrating the temperature regulation effect transferred through the uniform temperature zone onto the temperature control area corresponding to the temperature control platform 5. The inner ring TEC further adjusts the temperature of the temperature control platform 5 based on the temperature state transferred through the uniform temperature zone.

[0034] The water-cooled heat dissipation substrate 6 has a heat dissipation channel inside for the flow of cooling medium. The heat generated by the outer ring TEC heat dissipation end is transferred to the water-cooled heat dissipation substrate 6 and then carried away by the cooling medium flowing through the heat dissipation channel. Multiple temperature measuring points set on the water-cooled heat dissipation substrate 6 acquire temperature data at different locations. The temperature acquisition module 1 transmits the corresponding temperature data to the terminal, so that the terminal can determine the heat dissipation status of the temperature control system based on the temperature change of the water-cooled heat dissipation substrate 6.

[0035] When the temperature control method starts to execute, the terminal initializes the temperature control system, obtains the target temperature corresponding to the current temperature control process, and sets the PID control parameters and TEC power limiting threshold corresponding to the outer loop TEC control loop 2 and the inner loop TEC control loop 3, so that each control loop and the corresponding TEC enter the control state of the current temperature control process.

[0036] The terminal is also used to record the real-time temperature of the temperature control platform 5 and generate a real-time temperature curve, receive adjustment data for PID control parameters, and monitor the operating status of the outer loop TEC and inner loop TEC. The terminal determines the operating status of the temperature control system based on the temperature deviation and TEC drive current. When the temperature deviation exceeds the corresponding threshold or the TEC drive current is abnormal, the terminal generates an alarm signal and triggers the corresponding protection control.

[0037] Based on the above structure, the outer ring TEC pre-adjusts the temperature of the uniform temperature ring insulation layer 4, and the inner ring TEC precisely adjusts the temperature of the temperature control platform 5 based on the outer ring temperature control. It also forms corresponding temperature feedback through multi-point temperature measurement, so that the outer ring TEC control loop 2 and the inner ring TEC control loop 3 form a series control relationship, thereby improving the temperature control accuracy of the temperature control platform 5.

[0038] Please see Figure 2 This application provides an embodiment of a high-precision temperature control method based on a series PID dual-layer TEC, which includes: S201, Obtain the target temperature; The target temperature is used to determine the temperature state that the temperature control platform 5 needs to reach, and serves as the control target when the outer loop TEC control loop 2 and the inner loop TEC control loop 3 execute temperature control. The terminal acquires the input temperature setting data, determines the target temperature from the temperature setting data, and writes the target temperature into the control data corresponding to the current temperature control process.

[0039] Specifically, the terminal can receive the target temperature through the host computer interface, or it can read pre-configured temperature control task data to obtain the target temperature. After obtaining the target temperature, the terminal provides the target temperature to the corresponding control processes of the outer loop TEC control loop 2 and the inner loop TEC control loop 3, so that the two control loops perform series temperature control based on the same target temperature.

[0040] S202. Control the temperature acquisition module to acquire the initial temperature of the outer ring from the uniform temperature annular insulation layer; The terminal sends temperature acquisition control data to the temperature acquisition module 1, enabling the temperature acquisition module 1 to acquire the temperature data corresponding to the uniform temperature annular insulation layer 4. The uniform temperature annular insulation layer 4 is located between the outer ring TEC and the inner ring TEC. The heat-absorbing end of the outer ring TEC is in contact with the uniform temperature annular insulation layer 4. Therefore, the temperature change of the uniform temperature annular insulation layer 4 can be used to determine the current temperature state of the temperature regulation area corresponding to the outer ring TEC.

[0041] Temperature acquisition module 1 obtains temperature feedback data from temperature measuring points on the surface of the uniform-temperature annular insulation layer 4 and sends the temperature feedback data to the terminal. The terminal determines the initial temperature of the outer ring based on the received temperature feedback data, and the initial temperature of the outer ring serves as the temperature feedback quantity when the outer ring TEC control loop 2 performs temperature control. By acquiring the temperature of the uniform-temperature annular insulation layer 4, the outer ring TEC control loop 2 can perform temperature control on the temperature regulating layer corresponding to the outer ring TEC.

[0042] S203. Calculate the outer loop drive current of the outer loop TEC control loop based on the target temperature and the initial temperature of the outer loop, and control the outer loop TEC to output the outer loop temperature based on the outer loop drive current; The terminal acquires the target temperature and the initial temperature of the outer loop, and calculates the outer loop temperature deviation between the target temperature and the initial temperature. The terminal inputs the outer loop temperature deviation into the outer loop TEC control loop 2. The outer loop TEC control loop 2 performs PID control calculations based on the outer loop temperature deviation to obtain the outer loop control output used to drive the outer loop TEC, and determines the outer loop drive current based on the outer loop control output.

[0043] The outer loop drive current is used to control the temperature regulation function of the outer loop TEC. The terminal controls the operation of the outer loop TEC according to the outer loop drive current, so that the outer loop TEC changes the temperature state of the uniform temperature annular insulation layer 4 through the heat-absorbing end that is attached to the uniform temperature annular insulation layer 4. The outer loop TEC continuously regulates the temperature, so that the temperature of the temperature control system changes towards the temperature state corresponding to the target temperature, thereby outputting the outer loop temperature.

[0044] In this embodiment, the outer ring TEC control loop 2 is responsible for the temperature pre-adjustment of the temperature control system. The outer ring temperature represents the temperature control result formed after the outer ring TEC adjusts the temperature according to the outer ring drive current. Since the outer ring TEC and the inner ring TEC transfer heat through the uniform temperature area of ​​the uniform temperature annular insulation layer 4, the temperature regulation effect formed by the outer ring TEC can provide a temperature basis for the subsequent adjustment of the temperature control platform 5 by the inner ring TEC.

[0045] In one specific embodiment, the terminal configures PID control parameters for wide-range temperature adjustment and anti-disturbance control for the outer loop TEC control loop 2. The outer loop TEC control loop 2 continuously adjusts the outer loop drive current according to the outer loop temperature deviation to pre-adjust the outer loop temperature to a preset deviation range corresponding to the target temperature. In the current embodiment, the preset deviation range is the target temperature ±0.4℃. When the temperature control platform 5 is affected by changes in ambient temperature or load, the outer loop TEC control loop 2 performs temperature pre-adjustment by adjusting the outer loop drive current.

[0046] S204. Control the temperature acquisition module to acquire the initial temperature of the inner ring from the temperature acquisition point of the temperature control platform; The terminal control temperature acquisition module 1 acquires the temperature data corresponding to the temperature control platform 5. The heat absorption end of the inner ring TEC is in contact with the temperature control platform 5. The temperature change of the temperature control platform 5 is used to represent the temperature status of the temperature adjustment area corresponding to the inner ring TEC. Therefore, the temperature acquisition module 1 forms inner ring temperature feedback through the temperature acquisition point of the temperature control platform 5.

[0047] Temperature acquisition module 1 transmits the temperature feedback data corresponding to temperature control platform 5 to the terminal. The terminal determines the initial temperature of the inner loop based on the temperature feedback data. The initial temperature of the inner loop is used to determine the deviation between the current temperature of temperature control platform 5 and the target temperature, and serves as the temperature feedback quantity when the inner loop TEC control loop 3 performs temperature control.

[0048] Therefore, the outer ring TEC control loop 2 is controlled based on the temperature corresponding to the uniform temperature ring insulation layer 4, and the inner ring TEC control loop 3 is controlled based on the temperature corresponding to the temperature control platform 5, so that the two control loops correspond to different temperature adjustment positions.

[0049] S205. When the difference between the initial temperature of the inner ring and the target temperature is less than a preset deviation, the inner ring drive current of the inner ring TEC control loop is calculated based on the outer ring drive current, using the initial temperature of the inner ring and the target temperature. The terminal calculates the temperature difference between the initial temperature and the target temperature of the inner loop and compares this temperature difference with a preset deviation. The preset deviation is used to determine the temperature range within which the inner loop TEC control loop 3 performs precise temperature adjustment. When the temperature difference is less than the preset deviation, the terminal determines that the current temperature of the temperature control platform 5 meets the control conditions of the inner loop TEC control loop 3 and enables the inner loop TEC control loop 3 to participate in the current temperature control.

[0050] In one specific implementation, the temperature difference is determined based on the absolute value of the difference between the initial temperature of the inner loop and the target temperature, with a preset deviation of 0.4℃. When the temperature difference is less than 0.4℃, the terminal enables the inner loop TEC control loop 3 to participate in temperature control, while maintaining the outer loop drive current formed by the outer loop TEC control loop 2 as the control reference.

[0051] The terminal acquires the outer loop drive current corresponding to the outer loop TEC control loop 2 and uses it as the control reference for the inner loop TEC control loop 3. Simultaneously, the terminal determines the inner loop temperature deviation based on the initial and target temperatures of the inner loop and performs PID control calculations on this deviation using the inner loop TEC control loop 3. The inner loop TEC control loop 3 determines the corresponding control output based on the control reference formed by the outer loop drive current and calculates the inner loop drive current based on this control output.

[0052] The terminal configures PID control parameters for precise compensation of small deviations in the inner loop TEC control loop 3. The inner loop TEC control loop 3 determines the control output corresponding to precise temperature adjustment based on the temperature deviation between the initial temperature and the target temperature of the inner loop, and calculates the inner loop drive current based on the temperature control formed by the outer loop drive current, so that the inner loop TEC performs micro-power temperature compensation.

[0053] By controlling the correlation between the outer loop drive current and the inner loop temperature deviation, the inner loop TEC control loop 3 performs subsequent temperature control on the temperature control platform 5 based on the temperature regulation state already formed by the outer loop TEC, so that the control output of the outer loop TEC control loop 2 participates in the control calculation of the inner loop TEC control loop 3, thereby forming a series control relationship between the outer loop TEC control loop 2 and the inner loop TEC control loop 3.

[0054] S206. Drive the inner ring TEC according to the inner ring drive current to precisely adjust the initial temperature of the inner ring and obtain the inner ring temperature.

[0055] The terminal controls the operation of the inner loop TEC based on the inner loop drive current. The inner loop TEC regulates the temperature of the temperature control platform 5 through the heat absorption end that is in contact with the temperature control platform 5, so that the temperature of the temperature control platform 5 changes further towards the target temperature based on the temperature control formed by the outer loop TEC.

[0056] The inner-loop TEC control loop 3 determines the temperature regulation function of the inner-loop TEC based on the temperature deviation between the initial temperature and the target temperature. It changes the output of the inner-loop TEC by altering the inner-loop drive current, enabling the inner-loop TEC to precisely regulate the temperature of the temperature-controlled platform 5. The temperature control result of the temperature-controlled platform 5 after temperature regulation by the inner-loop TEC is taken as the inner-loop temperature.

[0057] In one specific embodiment, the inner loop TEC control loop 3 aims to stabilize the inner loop temperature within ±0.05℃ of the target temperature as the precision temperature control target. The terminal continuously adjusts the inner loop drive current based on the temperature feedback corresponding to the temperature control platform 5, so that the inner loop TEC performs small deviation compensation based on the temperature pre-adjustment formed by the outer loop TEC, and keeps the inner loop temperature within the precision temperature control range corresponding to the target temperature.

[0058] In this embodiment, the initial temperature of the outer ring is determined by the temperature of the uniform annular heat insulation layer 4, and the outer ring TEC is controlled to perform temperature pre-adjustment based on the target temperature and the initial temperature of the outer ring. When the initial temperature of the inner ring corresponding to the temperature control platform 5 meets the preset deviation, the inner ring drive current is determined based on the outer ring drive current, and the inner ring TEC performs precise temperature adjustment on the temperature control platform 5, so that the outer ring TEC control loop 2 and the inner ring TEC control loop 3 form a series control, thereby improving the temperature control accuracy of the temperature control platform 5.

[0059] Please see Figure 3 This application provides another embodiment of a high-precision temperature control method for a dual-layer TEC system based on cascaded PID controllers, which includes: S301, Obtain the target temperature; Step S301 in this embodiment is similar to step S201 in the previous embodiment, and will not be described in detail here.

[0060] S302. Control the temperature acquisition module to acquire the first feedback temperature of each temperature measuring point of the uniform temperature annular insulation layer. The terminal sends outer ring temperature acquisition control data to the temperature acquisition module 1, causing the temperature acquisition module 1 to read the temperature data of each temperature measuring point on the surface of the uniform temperature annular insulation layer 4. Multiple temperature measuring points on the surface of the uniform temperature annular insulation layer 4 correspond to different temperature acquisition locations. Each temperature measuring point generates a corresponding first feedback temperature based on the temperature at its location and sends this first feedback temperature to the terminal.

[0061] The terminal receives the first feedback temperature corresponding to each temperature measurement point and forms a first feedback temperature set based on the correspondence between the temperature measurement points and the temperature data. The first feedback temperature set is used to reflect the current temperature status at different locations of the uniform temperature annular insulation layer 4, and provides temperature data for determining the initial temperature of the outer ring corresponding to the outer ring TEC control loop 2.

[0062] S303. After smoothing and filtering all the first feedback temperatures, calculate the average value of all the first feedback temperatures to obtain the initial temperature of the outer ring.

[0063] The terminal performs smoothing filtering on the temperature data in the first feedback temperature set to reduce the impact of single temperature fluctuations during temperature acquisition on the initial temperature of the outer loop. Smoothing filtering is used to smooth the first feedback temperature corresponding to each temperature measurement point according to the continuously acquired temperature data. The terminal then uses the smoothed first feedback temperature as the current temperature data for the corresponding temperature measurement point.

[0064] In one specific implementation, the smoothing filter employs a moving average filter. The terminal establishes a temperature data window for each temperature measurement point of the uniform temperature annular insulation layer 4, and continuously updates the first feedback temperature in the temperature data window according to the temperature acquisition sequence. The terminal calculates the average value of each temperature data point within the temperature data window and uses the calculation result as the first feedback temperature after smoothing filtering for the corresponding temperature measurement point, thereby reducing the impact of single temperature fluctuations on the initial temperature of the outer ring.

[0065] The terminal summarizes the first feedback temperature after smoothing and filtering, and calculates the average value based on the sum of the first feedback temperatures and the number of temperature measurement points. The calculated average value is determined as the outer loop initial temperature. The outer loop initial temperature is used to represent the overall temperature state of the temperature regulation area corresponding to the uniform temperature annular insulation layer 4, and is provided to the outer loop TEC control loop 2 to participate in the calculation of the outer loop drive current.

[0066] S304. Calculate the outer loop drive current of the outer loop TEC control loop based on the target temperature and the initial temperature of the outer loop, and control the outer loop TEC to output the outer loop temperature based on the outer loop drive current; Step S304 in this embodiment is similar to step S203 in the previous embodiment, and will not be described in detail here.

[0067] S305. Control the temperature acquisition module to acquire the second feedback temperature of each temperature measuring point of the temperature control platform; The terminal control temperature acquisition module 1 reads the temperature data from each temperature measuring point on the surface of the temperature control platform 5. Multiple temperature measuring points on the surface of the temperature control platform 5 correspond to different temperature acquisition locations on the platform, and each measuring point generates a second feedback temperature based on the temperature at its location.

[0068] Temperature acquisition module 1 transmits each second feedback temperature to the terminal. The terminal aggregates the second feedback temperatures according to the correspondence of the temperature measurement points, forming a set of second feedback temperatures corresponding to the temperature control platform 5. The set of second feedback temperatures is used to represent the temperature status at different locations on the temperature control platform 5, providing temperature data for determining the initial temperature of the inner loop corresponding to the inner loop TEC control loop 3.

[0069] S306. After smoothing and filtering all the second feedback temperatures, calculate the average value of all the second feedback temperatures to obtain the initial temperature of the inner ring.

[0070] The terminal performs smoothing filtering on each of the second feedback temperatures and reduces the instantaneous temperature fluctuation at individual measurement points based on continuously acquired temperature data. After completing the smoothing filtering for each second feedback temperature, the terminal summarizes the second feedback temperatures during the current temperature acquisition process and calculates the average value of all second feedback temperatures.

[0071] In one specific implementation, the terminal uses a moving average filter to process the second feedback temperature. The terminal establishes a temperature data window for each temperature measuring point of the temperature control platform 5, updates the corresponding temperature data window based on the continuously collected second feedback temperatures, calculates the average value of the temperature data within the temperature data window, and uses the calculation result as the second feedback temperature after smoothing and filtering for the corresponding temperature measuring point.

[0072] The terminal determines the average value of the second feedback temperature as the inner loop initial temperature. The inner loop initial temperature is used to represent the overall temperature status corresponding to multiple temperature acquisition positions of the temperature control platform 5. The terminal determines the current temperature deviation status of the temperature control platform 5 based on the inner loop initial temperature and the target temperature, and determines the control status corresponding to the inner loop TEC control loop 3 accordingly.

[0073] In one specific embodiment, the terminal further divides and aggregates the second feedback temperature into zones based on the distribution of multiple temperature measuring points on the temperature control platform 5, and determines the zone temperature based on the second feedback temperature corresponding to each temperature zone. The terminal generates zone compensation data based on the temperature difference between each zone temperature and the initial temperature of the inner loop, and provides the zone compensation data to the inner loop TEC control loop 3 to participate in the determination of control quantities, so that the inner loop TEC compensates for the temperature differences in different temperature zones of the temperature control platform 5.

[0074] S307. When the difference between the initial temperature of the inner ring and the target temperature is greater than a preset deviation, the inner ring TEC control loop is limited so that the temperature control system is controlled by the outer ring TEC control loop.

[0075] The terminal calculates the difference between the initial temperature and the target temperature of the inner loop and compares the difference with a preset deviation. The preset deviation is used to divide the temperature control range corresponding to the temperature pre-adjustment of the outer loop TEC control loop 2 and the precise temperature adjustment of the inner loop TEC control loop 3.

[0076] When the difference between the initial temperature and the target temperature of the inner loop exceeds a preset deviation, the terminal controls the inner loop TEC control loop 3 to limit its control output. In one specific embodiment, the preset deviation is set to 0.4℃. When the temperature difference exceeds 0.4℃, the terminal maintains the outer loop TEC control loop 2, which adjusts the outer loop drive current according to the initial and target temperatures, so that the current temperature adjustment is performed by the outer loop TEC control loop 2. The outer loop TEC continuously adjusts the temperature of the uniform temperature annular insulation layer 4 according to the outer loop drive current, causing the temperature of the temperature control system to change towards the preset deviation range corresponding to the target temperature.

[0077] S308. When the difference between the initial temperature of the inner ring and the target temperature is less than a preset deviation, the inner ring drive current of the inner ring TEC control loop is calculated based on the outer ring drive current, using the initial temperature of the inner ring and the target temperature. S309. Drive the inner ring TEC according to the inner ring drive current to precisely adjust the initial temperature of the inner ring and obtain the inner ring temperature.

[0078] Steps S308 to S309 in this embodiment are similar to steps S205 to S206 in the previous embodiment, and will not be described in detail here.

[0079] S310. Continuously monitor the real-time temperature of the temperature control platform; After obtaining the inner ring temperature, the terminal continues to control the temperature acquisition module 1 to collect temperature data from the temperature control platform 5, and receives the current temperature corresponding to the temperature control platform 5 according to the temperature monitoring cycle. The terminal determines the currently acquired temperature as the real-time temperature and continuously updates the real-time temperature.

[0080] The real-time temperature is used to indicate the current temperature status of the temperature control platform 5 after precise temperature adjustment by the inner loop TEC. The terminal continuously acquires the real-time temperature during the temperature control process of the inner loop TEC control loop 3, so that the temperature changes of the temperature control platform 5 caused by external temperature changes or load changes can be included in the subsequent temperature deviation judgment process.

[0081] S311. Calculate the real-time deviation between the real-time temperature and the target temperature; The terminal acquires the current real-time temperature and the target temperature, calculates the temperature difference between the real-time temperature and the target temperature, and defines the calculated temperature difference as the real-time deviation. The real-time deviation is used to represent the deviation of the current temperature of the temperature control platform 5 from the target temperature.

[0082] The terminal updates the real-time deviation synchronously after the real-time temperature update, and compares the real-time deviation with the preset deviation to determine whether the temperature control conditions corresponding to the inner loop TEC control loop 3 continue to be met.

[0083] S312. When the real-time deviation is greater than the preset deviation, the inner loop TEC control loop is controlled to limit the amplitude, so that the temperature control system is controlled through the outer loop TEC control loop.

[0084] When the real-time deviation is greater than the preset deviation, the terminal determines that the current temperature of the temperature control platform 5 deviates from the precision temperature adjustment range corresponding to the inner loop TEC control loop 3, and controls the inner loop TEC control loop 3 to limit the control output of the inner loop TEC control loop 3.

[0085] The terminal causes the outer loop TEC control loop 2 to continue adjusting the outer loop drive current according to the target temperature and the temperature state corresponding to the uniform temperature annular insulation layer 4, so that the outer loop TEC can regulate the temperature of the temperature control system. As the temperature control system continues to operate, the terminal continues to monitor the temperature state of the temperature control platform 5, so that the temperature deviation changes continue to participate in the determination of the corresponding control states of the outer loop TEC control loop 2 and the inner loop TEC control loop 3.

[0086] During the operation of the temperature control system, the terminal synchronously acquires the drive current corresponding to the outer loop TEC and inner loop TEC, and monitors the operating status of the outer loop TEC and inner loop TEC in conjunction with real-time temperature monitoring. When the real-time temperature change exceeds the corresponding temperature control range, or when the TEC operating status corresponding to the drive current shows overshoot, reverse heating, or current abnormality, the terminal limits the output power of the corresponding drive circuit according to the TEC power limiting threshold and generates an alarm signal to trigger the protection control of the temperature control system.

[0087] When the real-time deviation recovers to within the preset deviation amount, the terminal releases the current limiting state corresponding to the inner loop TEC control loop 3 and maintains the outer loop drive current as the control reference for the inner loop TEC control loop 3. The terminal determines the current temperature deviation based on the real-time temperature and the target temperature, re-determines the inner loop drive current, and drives the inner loop TEC to perform precise temperature adjustment, so that the outer loop TEC control loop 2 maintains the temperature pre-adjustment basis, and the inner loop TEC control loop 3 performs small deviation precision compensation, thereby re-establishing the two-stage series coordinated control state.

[0088] This embodiment smooths and filters the multi-point temperature data of the uniform temperature annular insulation layer 4 and the temperature control platform 5, and calculates the average value so that the initial temperature of the outer ring and the initial temperature of the inner ring reflect the overall temperature state of the corresponding temperature area. Based on the deviation between the initial temperature or real-time temperature of the inner ring and the target temperature, the inner ring TEC control loop 3 is controlled to limit the amplitude, so that when the temperature deviation exceeds the preset deviation amount, the temperature control system is adjusted by the outer ring TEC control loop 2, thereby improving the stability recovery capability of the temperature control system after temperature disturbance.

[0089] Please see Figure 4 Following steps S206 and S309, this solution will continue to monitor and provide feedback corrections on the inner ring temperature output by the temperature control stage. Specific steps include: S401. Continuously monitor the real-time temperature of the temperature control platform; After the terminal performs precise temperature adjustment on the temperature control platform 5 within the inner ring TEC, it continues to control the temperature acquisition module 1 to collect temperature data from the temperature control platform 5 and updates the current temperature data according to the temperature monitoring cycle. The terminal determines the current temperature data as the real-time temperature, ensuring that the real-time temperature continuously reflects the temperature changes of the temperature control platform 5 during the temperature control process.

[0090] The terminal writes the real-time temperature into the temperature record corresponding to the current temperature control process and incorporates the real-time temperature into the determination of PID control parameters. As the temperature of the temperature control platform 5 changes, the terminal synchronously updates the corresponding real-time temperature, providing temperature data for determining the control parameters corresponding to the current temperature state.

[0091] S402. Map the real-time temperature to a preset PID parameter table to determine the reference PID control parameters corresponding to the real-time temperature. The preset PID parameter table is used to control the control parameters of the outer loop TEC control loop and the inner loop TEC control loop. The terminal reads the preset PID parameter table. The preset PID parameter table establishes a correspondence between temperature data and PID control parameters according to temperature ranges. Each temperature range is configured with corresponding control parameters to adapt the temperature control process when the temperature control system is in different temperature states. Temperature ranges include, but are not limited to, low-temperature range, normal-temperature range, and transition range.

[0092] The terminal matches the real-time temperature with the temperature range in the preset PID parameter table to determine the temperature range to which the real-time temperature belongs, and reads the corresponding PID control parameters for that temperature range. These read PID control parameters are then used as the baseline PID control parameters. The baseline PID control parameters are used to determine the basis for the control parameters of the outer loop TEC control loop 2 and the inner loop TEC control loop 3 under the current temperature conditions.

[0093] S403. Obtain the PID control record of the temperature range corresponding to the real-time temperature; The terminal queries the historical control data of the temperature control system based on the temperature range to which the real-time temperature belongs, and extracts the PID control record corresponding to the current temperature range from the historical control data. The PID control record is used to store the control data and temperature change data generated by the temperature control system during the execution of PID control in the corresponding temperature range.

[0094] The terminal aggregates PID control records based on temperature ranges, ensuring that the acquired PID control records fall within the same temperature control range as the current real-time temperature. This allows for the establishment of a data association between the current baseline PID control parameters and the historical temperature control results for the corresponding temperature range.

[0095] S404. Determine the historical temperature control error from the PID control record; The terminal reads the target temperature and the corresponding temperature control result from the PID control record, and determines the historical temperature control error based on the difference between the target temperature and the temperature control result. The historical temperature control error represents the temperature deviation formed when using historical PID control parameters for temperature control within the corresponding temperature range.

[0096] The terminal collects the temperature deviation data in the PID control record, determines the historical temperature control error corresponding to the current temperature range, and uses the historical temperature control error as the data basis for evaluating the control result of the benchmark PID control parameters, and participates in the correction of the benchmark PID control parameters.

[0097] S405. Correct the reference PID control parameters based on the historical temperature control error to obtain the target PID control parameters.

[0098] The terminal determines the parameter correction amount corresponding to the baseline PID control parameters based on the historical temperature control error, and adjusts the baseline PID control parameters according to the parameter correction amount. The historical temperature control error reflects the historical temperature control deviation of the corresponding temperature range. Therefore, the terminal corrects the baseline PID control parameters corresponding to the current temperature range based on the historical temperature control error, so that the corrected control parameters match the temperature control state of the corresponding temperature range.

[0099] The terminal determines the corrected PID control parameters as the target PID control parameters and provides the target PID control parameters to the corresponding control processes of the outer loop TEC control loop 2 and the inner loop TEC control loop 3, so that the temperature control system updates the PID control parameters according to the current temperature range and historical temperature control errors.

[0100] In another embodiment, the PID control units corresponding to the outer loop TEC control loop 2 and the inner loop TEC control loop 3 adopt fuzzy PID control, adjusting the PID control parameters according to the control state corresponding to the temperature deviation, so that the outer loop TEC control loop 2 and the inner loop TEC control loop 3 are controlled according to the current temperature state. Alternatively, the PID control unit adopts adaptive PID control, updating the PID control parameters according to the temperature feedback data generated during the temperature control process, so that the corresponding control parameters match the current temperature change state of the temperature control system.

[0101] This embodiment determines the baseline PID control parameters by mapping the real-time temperature to a preset PID parameter table, and determines the historical temperature control error by combining the PID control records of the corresponding temperature range. Then, the baseline PID control parameters are corrected based on the historical temperature control error, so that the outer loop TEC control loop 2 and the inner loop TEC control loop 3 adopt the target PID control parameters corresponding to the current temperature range and the historical temperature control results, thereby improving the temperature control accuracy of the temperature control system in different temperature ranges.

[0102] The above provides a detailed description of the high-precision temperature control method and system based on series PID for dual-layer TEC in the embodiments of this application. The following will provide a detailed description of the high-precision temperature control device based on series PID for dual-layer TEC.

[0103] Please see Figure 5 This application provides an embodiment of a high-precision temperature control based on a dual-layer TEC using a series PID controller, including: Processor 501, memory 502, input / output unit 503, bus 504; The processor 501 is connected to the memory 502, the input / output unit 503 and the bus 504; The processor 501 specifically executes... Figures 2 to 4 The specific operations corresponding to the steps in the method will not be elaborated here.

[0104] This application also relates to a computer-readable storage medium on which a program is stored, which, when run on a computer, causes the computer to perform any of the methods described above.

[0105] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0106] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection between apparatuses or units through some interfaces, and may be electrical, mechanical, or other forms.

[0107] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0108] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0109] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

Claims

1. A high-precision temperature control method based on a dual-layer TEC system using cascaded PID control, characterized in that, The method is applied to a temperature control system, the system comprising: Temperature acquisition module, outer loop TEC control loop, inner loop TEC control loop, uniform temperature ring insulation layer, temperature control platform; The uniform temperature annular insulation layer is provided between the outer ring TEC control circuit and the inner ring TEC control circuit. The heat absorption end of the outer ring TEC corresponding to the outer ring TEC control circuit is attached to the uniform temperature annular insulation layer, and the heat absorption end of the inner ring TEC corresponding to the inner ring TEC control circuit is attached to the temperature control platform. The outer ring TEC control loop and the inner ring TEC control loop are connected in series. The temperature measurement points of the temperature acquisition module are respectively set on the surface of the uniform temperature annular insulation layer and the temperature control platform. The temperature measurement points are set at multiple points. The method includes: Obtain the target temperature; The temperature acquisition module is controlled to acquire the initial temperature of the outer ring from the uniform temperature annular insulation layer; The outer loop drive current of the outer loop TEC control loop is calculated based on the target temperature and the initial temperature of the outer loop, and the outer loop TEC outputs the outer loop temperature based on the outer loop drive current; The temperature acquisition module is controlled to acquire the initial temperature of the inner ring from the temperature acquisition point of the temperature control platform; When the difference between the initial temperature of the inner ring and the target temperature is less than a preset deviation, the inner ring drive current of the inner ring TEC control loop is calculated based on the outer ring drive current, using the initial temperature of the inner ring and the target temperature. The inner ring TEC is driven by the inner ring drive current to precisely adjust the initial temperature of the inner ring, thereby obtaining the inner ring temperature.

2. The method according to claim 1, characterized in that, After the temperature acquisition module acquires the initial temperature of the inner ring from the temperature acquisition point of the temperature control platform, the method further includes: When the difference between the initial temperature of the inner loop and the target temperature is greater than a preset deviation, the inner loop TEC control loop is limited, so that the temperature control system is controlled through the outer loop TEC control loop.

3. The method according to claim 1, characterized in that, After precisely adjusting the initial temperature of the inner ring by driving the inner ring TEC according to the inner ring drive current to obtain the inner ring temperature, the method further includes: Continuously monitor the real-time temperature of the temperature-controlled platform; Calculate the real-time deviation between the real-time temperature and the target temperature; When the real-time deviation is greater than the preset deviation, the inner loop TEC control loop is controlled to limit the amplitude, so that the temperature control system is controlled through the outer loop TEC control loop.

4. The method according to claim 1, characterized in that, After precisely adjusting the initial temperature of the inner ring by driving the inner ring TEC according to the inner ring drive current to obtain the inner ring temperature, the method further includes: Continuously monitor the real-time temperature of the temperature-controlled platform; The real-time temperature is mapped to a preset PID parameter table to determine the reference PID control parameters corresponding to the real-time temperature. The preset PID parameter table is used to control the control parameters of the outer loop TEC control loop and the inner loop TEC control loop. Obtain the PID control record of the temperature range corresponding to the real-time temperature; Determine the historical temperature control error from the PID control records; The baseline PID control parameters are corrected based on the historical temperature control error to obtain the target PID control parameters.

5. The method according to any one of claims 1 to 4, characterized in that, The temperature control system also includes a water-cooled heat dissipation substrate, which is attached to the heat dissipation end of the outer ring TEC. The temperature measurement points of the temperature acquisition module are set at multiple points on the water-cooled heat dissipation substrate, which is used to monitor the heat dissipation status of the temperature control system.

6. The method according to any one of claims 1 to 4, characterized in that, The temperature control system's uniform temperature annular insulation layer includes a uniform temperature region and an annular insulation region. The annular insulation region surrounds the uniform temperature region, and the outer ring TEC and the inner ring TEC transfer heat through the uniform temperature region.

7. The method according to any one of claims 1 to 4, characterized in that, The control of the temperature acquisition module to acquire the initial temperature of the outer ring from the uniform temperature annular insulation layer includes: The temperature acquisition module is controlled to acquire the first feedback temperature of each temperature measuring point of the uniform temperature annular insulation layer. After smoothing and filtering all the first feedback temperatures, the average value of all the first feedback temperatures is calculated to obtain the initial temperature of the outer ring.

8. The method according to any one of claims 1 to 4, characterized in that, The control of the temperature acquisition module to acquire the initial temperature of the inner ring from the temperature acquisition point of the temperature control platform includes: The temperature acquisition module is controlled to acquire the second feedback temperature of each temperature measuring point on the temperature control platform. After smoothing and filtering all the second feedback temperatures, the average value of all the second feedback temperatures is calculated to obtain the initial temperature of the inner loop.

9. A high-precision temperature control device based on a dual-layer TEC system using cascaded PID control, characterized in that, The device includes: Processor, memory, input / output units, and bus; The processor is connected to the memory, the input / output unit, and the bus; The memory stores a program, which the processor invokes to perform the method as described in any one of claims 1 to 8.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium contains a program that, when executed on a computer, performs the method as described in any one of claims 1 to 8.

Images