A circuit board laminator and a method and system for controlling the temperature of a hot platen thereof

Abstract

This invention discloses a circuit board laminator and its hot press plate temperature control method and system. The control method includes acquiring the hot press plate detection temperature and the hot press plate set temperature of the circuit board laminator; calculating the control temperature of the hot oil circulation inlet of the circuit board laminator based on a first temperature deviation between the hot press plate detection temperature and the hot press plate set temperature; acquiring the hot oil circulation inlet detection temperature of the circuit board laminator; calculating the opening control signal of the electric regulating valve of the secondary hot oil circulation loop of the circuit board laminator based on a second temperature deviation between the control temperature of the hot oil circulation inlet and the hot oil circulation inlet detection temperature; and controlling the opening of the electric regulating valve of the secondary hot oil circulation loop of the circuit board laminator according to the opening control signal to adjust the hot oil circulation inlet detection temperature to achieve the hot oil circulation inlet control temperature. This invention solves the problems of slow response speed, low control accuracy, and large susceptibility to interference in existing hot press plate temperature control methods.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, and in particular to a circuit board laminator and its hot press plate temperature control method and system. Background Technology

[0002] In the circuit board manufacturing process, laminators are used to press multiple layers of circuit board materials together to form a complete circuit board. The hot press plate is a key component of the laminator, and the accuracy and stability of its temperature control directly affect the lamination quality and production efficiency. However, existing hot press plate temperature control systems suffer from low temperature control accuracy due to simplistic control strategies or inaccurate algorithms, leading to significant temperature fluctuations during lamination and insufficient temperature control precision. Furthermore, existing hot press plate temperature control systems exhibit slow response times to temperature changes or external disturbances, resulting in lag in temperature regulation and impacting production efficiency. In actual production, the heating plate temperature is affected by various factors, such as changes in ambient temperature and equipment operating status. These disturbances can cause instability in the temperature control of the hot press plate temperature control system, affecting product quality.

[0003] In summary, existing hot press temperature control systems suffer from problems such as slow response speed, low control accuracy, and susceptibility to interference, making it difficult to meet the high precision and high efficiency requirements of modern circuit board manufacturing. Summary of the Invention

[0004] This invention provides a circuit board laminator and a method and system for controlling the temperature of its hot press plate, in order to solve the problems of slow response speed, low control accuracy and great susceptibility to interference in existing hot press plate temperature control methods.

[0005] In one embodiment, a method for controlling the temperature of the hot press plate of a circuit board laminator is provided, the method comprising the following steps: The hot press plate detection temperature and the hot press plate set temperature of the circuit board laminator are obtained, and a first temperature deviation between the hot press plate detection temperature and the hot press plate set temperature is determined. Based on the first temperature deviation, the control temperature of the hot oil circulation inlet of the circuit board laminator is obtained; The detection temperature of the hot oil circulation inlet of the circuit board laminator is obtained, and a second temperature deviation between the control temperature of the hot oil circulation inlet and the detection temperature of the hot oil circulation inlet is determined. Based on the second temperature deviation, the opening control signal of the electric regulating valve of the secondary thermal cycle circuit of the circuit board laminator is output. According to the opening control signal, the opening of the electric regulating valve of the secondary hot circulation loop of the circuit board laminator is controlled to adjust the detected temperature of the hot oil circulation inlet to reach the control temperature of the hot oil circulation inlet.

[0006] In one embodiment, the control temperature of the hot oil circulation inlet of the circuit board laminator is obtained based on the first temperature deviation; specifically including: Based on the first temperature deviation between the pressure plate detection temperature and the hot plate set temperature, a first-stage proportional-integral-differential operation is performed to obtain the control temperature of the hot oil circulation inlet of the circuit board laminator.

[0007] In one embodiment, based on the second temperature deviation, an opening control signal for the electrically controlled regulating valve of the secondary thermal cycle loop of the circuit board laminator is output, specifically including: Based on the second temperature deviation between the control temperature of the hot oil circulation inlet and the detection temperature of the hot oil circulation inlet, a second-stage proportional-integral-differential operation is performed to obtain the operation output value; based on the operation output value, the opening control signal of the electric regulating valve of the secondary hot circulation loop of the circuit board laminator is determined.

[0008] In one embodiment, the expression for the opening control signal of the electric regulating valve is as follows: valve_output= f (u2) Wherein, valve_output is the opening control signal, and u2 is the calculated output value. f This is a positive correlation mapping function between the opening control signal and the calculated output value.

[0009] In one embodiment, the expression for the output value of the operation is as follows: u2=Kp2*e2+Ki2*integral2+Kd2*derivative2 Where u2 is the output value of the operation, Kp2 is a preset proportional constant, e2 is the second temperature deviation, Ki2 is a preset integral constant, integral2 is an integral term related to the second temperature deviation, Kd2 is a preset differential constant, and derivative2 is a differential term related to the second temperature deviation.

[0010] In one embodiment, a hot press plate temperature control system for a circuit board laminator is provided. The hot press plate temperature control system includes: a controller, a first temperature sensor, a second temperature sensor, and an electric regulating valve. The controller is connected to the first temperature sensor, which is used to acquire the detected temperature of the hot press plate of the circuit board laminator. The controller is also connected to the second temperature sensor, which is used to acquire the detected temperature of the hot oil circulation inlet of the circuit board laminator. The controller is connected to the electric regulating valve, which is disposed in the secondary hot circulation loop of the circuit board laminator. The controller is used to implement the hot press plate temperature control method.

[0011] In one embodiment, a circuit board laminator is provided, comprising: a hot press, a primary boiler, and a secondary boiler. The hot oil circulation inlet of the hot press is connected to the hot oil circulation outlet of the secondary boiler, and the hot oil circulation inlet of the secondary boiler is connected to the hot oil circulation outlet of the primary boiler. The secondary boiler includes a secondary hot circulation loop, and an electrically adjustable valve is installed on the secondary hot circulation loop. The electrically adjustable valve is used to adjust its opening degree according to the hot press plate temperature control method.

[0012] In one embodiment, a second temperature sensor is provided on the connecting branch between the hot oil circulation inlet of the hot press equipment and the hot oil circulation outlet of the secondary boiler equipment, for obtaining the detection temperature of the hot oil circulation inlet of the circuit board laminator; a first temperature sensor is provided on the main frame of the hot press equipment, for obtaining the detection temperature of the hot platen of the circuit board laminator.

[0013] In one embodiment, the secondary thermal circulation loop includes: a first shut-off valve, a second shut-off valve, and a circulation pump. The first port of the first shut-off valve is connected to the hot oil circulation inlet of the hot press equipment. The second port of the first shut-off valve is connected to the first port of the circulation pump. The second port of the circulation pump is connected to the first port of the electric regulating valve. The second port of the electric regulating valve is connected to the first port of the second shut-off valve. The second port of the second shut-off valve is connected to the hot oil circulation outlet of the hot press equipment.

[0014] In one embodiment, a third temperature sensor is provided on the connecting branch between the hot oil circulation outlet of the hot press equipment and the hot oil circulation inlet of the secondary boiler equipment. This sensor is used to acquire the detected temperature of the hot oil circulation outlet of the circuit board laminator and to calculate the opening control signal of the electric regulating valve of the secondary hot circulation loop of the circuit board laminator by combining the control temperature of the hot oil circulation inlet and the detected temperature of the hot oil circulation inlet.

[0015] This invention provides a circuit board laminator and its hot press plate temperature control method and system. First, based on a first temperature deviation between the detected temperature and the set temperature of the hot press plate, the control temperature of the hot oil circulation inlet of the circuit board laminator is calculated. Then, based on a second temperature deviation between the control temperature and the detected temperature of the hot oil circulation inlet, the opening control signal of the electric regulating valve of the secondary hot circulation loop of the circuit board laminator is calculated. This is equivalent to employing a cascaded two-stage temperature control. The purpose of the first-stage temperature control is to ensure that the detected temperature of the hot press plate reaches the set temperature, achieving overall temperature regulation of the entire circuit board laminator. The purpose of the second-stage temperature control is to ensure that the detected temperature of the hot oil circulation inlet reaches the control temperature. This two-stage temperature control effectively reduces temperature fluctuations and improves temperature control accuracy. Through these two cascaded temperature controls, an opening control signal is generated to control the opening of the electric regulating valve of the secondary hot circulation loop of the circuit board laminator. Using this opening control signal to directly control the opening of the electric regulating valve enables rapid response to temperature changes and improves the system's response speed. When the detected temperature at the hot oil circulation inlet deviates from the control temperature, the opening of the electric regulating valve can be quickly adjusted to bring the temperature back to the set range. This helps reduce temperature regulation lag and improve production efficiency. By real-time monitoring of the hot press plate's detected temperature and the hot oil circulation inlet's detected temperature, data feedback is provided, and the first and second temperature deviations are calculated in real time, forming a closed-loop control. When the system is subjected to external disturbances, the opening control signal can be adjusted promptly to maintain the temperature stability of the hot press plate. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a flowchart of a hot platen temperature control method for a circuit board laminator according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the hot press plate temperature control system of a circuit board laminator in one embodiment of the present invention; Figure 3 This is a schematic diagram of a circuit board laminator according to one embodiment of the present invention; Figure 4 This is a schematic diagram of a hot press machine in the unloaded state of the oil cylinder according to one embodiment of the present invention; Figure 5 This is a schematic diagram of a hot press machine in the working state of the oil cylinder according to an embodiment of the present invention; Figure 6This is a schematic diagram of the secondary heat circulation loop of the secondary boiler equipment in the circuit board laminator in one embodiment of the present invention; Figure 7 This is a schematic diagram of the cascaded temperature control logic in one embodiment of the present invention; Label Explanation: 1. Rear vacuum door; 2. Rear vacuum chamber; 3. Front vacuum door; 4. Left side plate; 5. Lower crossbeam; 6. Piston cylinder; 7. Movable platform; 8. Hot press plate; 9. Upper crossbeam; 10. Right side plate; 11. Insulation plate; 12. Boiler; 13. Electric regulating valve; 14. Third temperature sensor; 15. Second shut-off valve; 16. First temperature sensor; 17. Second temperature sensor; 18. First shut-off valve; 19. Circulating pump; 20. Third shut-off valve; 21. Fourth shut-off valve; 22. Controller; 31. Hot press equipment; 32. Primary boiler equipment; 33. Secondary boiler equipment. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] It should be understood that the invention can be embodied in various forms and should not be construed as being limited to the embodiments set forth herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, for clarity, the dimensions and relative dimensions of layers and regions may be exaggerated. The same reference numerals denote the same elements throughout.

[0020] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this invention, the first element, component, area, layer, or portion discussed below may be referred to as the second element, component, area, layer, or portion.

[0021] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below,” “under,” or “below” other elements or features will be oriented “above” other elements or features. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0022] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0023] To fully understand this invention, detailed structures and steps will be presented in the following description to illustrate the technical solution proposed by this invention. Preferred embodiments of the invention are described in detail below; however, in addition to these detailed descriptions, the invention may have other embodiments.

[0024] In one embodiment, a method for controlling the temperature of the hot press plate of a circuit board laminator is provided, such as... Figure 1 As shown, the hot press plate temperature control method includes the following steps: S101, obtain the hot plate detection temperature and hot plate setting temperature of the circuit board laminator, and determine the first temperature deviation between the plate detection temperature and the hot plate setting temperature; Based on the first temperature deviation, the control temperature of the hot oil circulation inlet of the circuit board laminator is obtained; The hot press plate detection temperature refers to the actual temperature of the hot press plate set in the sealed cavity of the circuit board laminator. The hot press plate set temperature is the target temperature that the hot press plate in the sealed cavity needs to reach when the laminator performs lamination on the circuit board. By detecting the hot press plate detection temperature of the circuit board laminator, the hot press plate set temperature is subtracted from the hot press plate detection temperature to obtain the first temperature deviation between the hot press plate detection temperature and the hot press plate set temperature. Based on the first temperature deviation, the control temperature of the hot oil circulation inlet of the circuit board laminator can be calculated. The hot oil circulation inlet of the circuit board laminator is the injection inlet for inputting hot oil into the laminator.

[0025] S102, obtain the detection temperature of the hot oil circulation inlet of the circuit board laminator, and determine the second temperature deviation between the control temperature of the hot oil circulation inlet and the detection temperature of the hot oil circulation inlet; Based on the second temperature deviation, output the opening control signal of the electric regulating valve of the secondary thermal cycle loop of the circuit board laminator; The detected temperature of the hot oil circulation inlet refers to the actual temperature of the hot oil injected into the laminator. The control temperature of the hot oil circulation inlet calculated in the previous step refers to the target temperature that the hot oil injected into the laminator should reach. By subtracting the detected temperature of the hot oil circulation inlet from the control temperature, a second temperature deviation is obtained. This second temperature deviation can be used to calculate the opening control signal of the electric regulating valve of the secondary hot oil circulation loop of the circuit board laminator. The electric regulating valve of the secondary hot oil circulation loop is used to control the flow rate of hot oil flowing into the circuit board laminator from the hot oil circulation inlet.

[0026] S103, according to the opening control signal, control the opening of the electric regulating valve of the secondary hot circulation loop of the circuit board laminator to adjust the detected temperature of the hot oil circulation inlet to reach the control temperature of the hot oil circulation inlet.

[0027] Specifically, when the detected temperature of the hot oil circulation inlet is lower than the control temperature of the hot oil circulation inlet, the opening of the electric regulating valve is increased by the opening control signal, thereby increasing the flow rate of hot oil flowing into the hot oil circulation inlet of the circuit board laminator and raising the detected temperature of the hot oil circulation inlet to the control temperature of the hot oil circulation inlet; when the detected temperature of the hot oil circulation inlet is higher than the control temperature of the hot oil circulation inlet, the opening of the electric regulating valve is decreased by the opening control signal, thereby reducing the flow rate of hot oil flowing into the hot oil circulation inlet of the circuit board laminator and lowering the detected temperature of the hot oil circulation inlet to the control temperature of the hot oil circulation inlet.

[0028] The hot press plate temperature control method of this embodiment has the following advantages: First, the control temperature of the hot oil circulation inlet of the circuit board laminator is calculated based on the first temperature deviation between the detected temperature of the hot press plate and the set temperature of the hot press plate. Then, the opening control signal of the electric regulating valve of the secondary hot circulation loop of the circuit board laminator is calculated based on the second temperature deviation between the control temperature of the hot oil circulation inlet and the detected temperature. This is equivalent to using a cascaded two-stage temperature control. The purpose of the first-stage temperature control is to make the detected temperature of the hot press plate reach the set temperature of the hot press plate, so as to realize the overall temperature regulation of the entire circuit board laminator. The purpose of the second-stage temperature control is to make the detected temperature of the hot oil circulation inlet reach the control temperature. Through two-stage temperature control, temperature fluctuations can be effectively reduced and temperature control accuracy can be improved.

[0029] Secondly, through two cascaded temperature controls, an opening control signal is generated for the electric regulating valve in the secondary thermal circulation loop of the circuit board laminator. This signal directly controls the opening of the electric regulating valve, enabling rapid response to temperature changes and improving system responsiveness. When the detected temperature at the hot oil circulation inlet deviates from the control temperature, the opening of the electric regulating valve can be quickly adjusted to bring the temperature back within the set range. This helps reduce temperature regulation lag and improve production efficiency.

[0030] Third, by real-time monitoring of the hot press plate temperature and the hot oil circulation inlet temperature, data feedback is provided to calculate the first and second temperature deviations in real time, forming a closed-loop control. When the system is subjected to external disturbances, the opening control signal can be adjusted in a timely manner to maintain the temperature stability of the hot press plate.

[0031] In one embodiment, step S101 involves obtaining the control temperature of the hot oil circulation inlet of the circuit board laminator based on the first temperature deviation; specifically including: Based on the first temperature deviation between the pressure plate detection temperature and the hot plate set temperature, a first-stage proportional-integral-differential operation is performed to obtain the control temperature of the hot oil circulation inlet of the circuit board laminator.

[0032] The expression for performing the first-order proportional-integral-differential operation can be: Δ=Kp1*e1+Ki1*integral1+Kd1*derivative1 In the formula, Δ is the control temperature of the hot oil circulation inlet of the circuit board laminator, e1 is the first temperature deviation, Kp1 is the preset proportional constant, integral1 is the integral term related to the first temperature deviation, Ki1 is the preset integral constant, derivative1 is the differential term related to the first temperature deviation, and Kd1 is the preset differential constant.

[0033] The hot press plate temperature control method of this embodiment uses a first-stage proportional-integral-differential operation on the first temperature deviation to obtain the control temperature of the hot oil circulation inlet of the circuit board laminator, and reliably determines the target temperature that the hot press plate in the sealed cavity needs to reach when the circuit board is laminating.

[0034] In one embodiment, step S102, based on the second temperature deviation, outputs an opening control signal for the electric regulating valve of the secondary thermal cycle loop of the circuit board laminator, specifically including: Based on the second temperature deviation between the control temperature of the hot oil circulation inlet and the detection temperature of the hot oil circulation inlet, a second-stage proportional-integral-differential operation is performed to obtain the operation output value; based on the operation output value, the opening control signal of the electric regulating valve of the secondary hot circulation loop of the circuit board laminator is determined.

[0035] Specifically, by performing a second-stage proportional-integral-differential operation on the second temperature deviation, the calculated output value directly related to the opening control signal of the electric regulating valve in the secondary thermal cycle loop was obtained.

[0036] In one embodiment, the expression for the opening control signal of the electric regulating valve is as follows: valve_output= f (u2) Wherein, valve_output is the opening control signal, and u2 is the calculated output value. f This is a positive correlation mapping function between the opening control signal and the calculated output value.

[0037] The reason for mapping the calculated output value to the opening control signal is that the calculated output value is a dimensionless value, while the opening control signal of the electric regulating valve is within a certain voltage amplitude range. Different voltages correspond to different openings of the regulating valve. Therefore, it is necessary to map the calculated output value to the preset voltage amplitude range of the opening control signal according to a certain proportional relationship.

[0038] In one embodiment, the expression for the output value of the operation is as follows: u2=Kp2*e2+Ki2*integral2+Kd2*derivative2 Where u2 is the output value of the operation, Kp2 is a preset proportional constant, e2 is the second temperature deviation, Ki2 is a preset integral constant, integral2 is an integral term related to the second temperature deviation, Kd2 is a preset differential constant, and derivative2 is a differential term related to the second temperature deviation.

[0039] In one embodiment, such as Figure 2As shown, a hot press plate temperature control system for a circuit board laminator is provided. The hot press plate temperature control system includes: a controller 22, a first temperature sensor 16, a second temperature sensor 17, and an electric regulating valve 13. The controller 22 is connected to the first temperature sensor 16, which is used to acquire the detected temperature of the hot press plate of the circuit board laminator. The controller 22 is also connected to the second temperature sensor 17, which is used to acquire the detected temperature of the hot oil circulation inlet of the circuit board laminator. The controller 22 is connected to the electric regulating valve 13, which is disposed in the secondary hot circulation loop of the circuit board laminator. The controller 22 is used to implement the hot press plate temperature control method described in any of the preceding embodiments.

[0040] The hot press plate temperature control system of this embodiment has the following advantages: Firstly, a cascaded temperature control strategy employing first-stage proportional-integral-derivative (PID) and second-stage PID operations is adopted. The first-stage PID is responsible for regulating the overall system temperature, while the second-stage PID is responsible for regulating the temperature at the secondary hot oil circulation inlet. This two-stage temperature control enables precise control of the heating plate temperature, reduces temperature fluctuations, and improves temperature control accuracy.

[0041] Secondly, a closed-loop feedback mechanism is adopted. The temperature of the heating plate and the secondary hot oil circulation inlet are detected in real time by the first and second temperature sensors, and the data is fed back to the PID controller used to realize the first and second stage proportional-integral-derivative operations to form closed-loop control. The closed-loop feedback mechanism can effectively reduce the impact of interference on the system and improve the stability and reliability of temperature control.

[0042] Finally, precise control of the electric regulating valve was achieved. The opening degree of the electric regulating valve directly affects the temperature of the hot oil system. The opening control signal, obtained through two-stage proportional-integral-derivative calculations, can adjust the opening degree of the electric regulating valve, thereby achieving precise control of the temperature of the hot oil system.

[0043] In one embodiment, such as Figure 3 As shown, a circuit board laminating machine is provided, comprising: a hot press 31, a primary boiler 32, and a secondary boiler 33, wherein the hot oil circulation inlet L1 of the hot press 31 is connected to the hot oil circulation outlet L2 of the secondary boiler 33, and the hot oil circulation inlet L3 of the secondary boiler 33 is connected to the hot oil circulation outlet L4 of the primary boiler 32; the secondary boiler 33 is provided with a secondary hot circulation loop, and an electric regulating valve is provided on the secondary hot circulation loop; the electric regulating valve is used to adjust the opening degree according to the hot press plate temperature control method.

[0044] Among them, such as Figure 3 and Figure 4 The hot press equipment 31 shown includes a hot press frame, which comprises a left side plate 4, a right side plate 10, a lower crossbeam 5, and an upper crossbeam 9. The lower crossbeam 5 is located at the lower part of the hot press frame. A plunger cylinder 6 is connected to the lower crossbeam 5 by bolts. The rear vacuum chamber 2 is located at the rear of the hot press frame and is connected to the left side plate 4, right side plate 10, lower crossbeam 5, and upper crossbeam 9 by bolts. The rear vacuum door 1 is connected to the rear vacuum chamber 2 by bolts. The front vacuum door 3 is located at the front of the hot press frame. When the hot press is open, the front vacuum door 3 is located at the lower part of the hot press. When the hot press frame is working, the front vacuum door 3 moves upward to a predetermined position under the action of a belt lifting device located at the upper end of the hot press and closes. When the hot press is working, the left side plate 4, right side plate 10, lower crossbeam 5, upper crossbeam 9, rear vacuum chamber 2, rear vacuum door 1, and front vacuum door 3 together form a sealed cavity. This sealed cavity forms a low vacuum environment under the action of a vacuum pump. like Figure 4 As shown, the movable platform 7 is located on the upper end of the plunger cylinder 6 inside the press cavity. The movable platform 7 and the plunger cylinder 6 are connected by a plate. Multiple hot press plates 8 of the same size are distributed at equal intervals in the vertical direction inside the press cavity. The hot press plates 8 have flow channels that can be heated by hot oil. When the hot press is working, the resin material of the PCB (circuit board) is placed on the hot press plate 8 and is not only heated, but also squeezed by the oil cylinder at the bottom of the press until the predetermined cross-linking reaction is completed. Figure 4 In the middle, two heat insulation plates 11 are located at the lower part of the upper crossbeam 9 of the hot press and the upper part of the movable platform 7, respectively. The main function of the heat insulation plates 11 is to block the heat from the hot plate from being conducted and lost to the press frame.

[0045] Before the PCB laminator starts operating, the plunger cylinder 6 is not extended. Since the hot press platen 8 inside the press has not yet been circulated with high-temperature heating oil, the temperature of the cylinder and the press frame is below 120 degrees Celsius. When the PCB laminator is operating, the PCB bonding resin material is placed on the hot press platen 8. At this time, the plunger cylinder 6 extends upwards under the drive of the hydraulic pump until all the PCBs and their upper and lower hot press plates 8 are in contact with each other, and the cylinder reaches the system's set pressure value. While the plunger cylinder 6 is pressurizing, the hot press platen 8 is heated by the hot oil flowing inside. The press's sealed cavity forms a low-vacuum, high-temperature, and high-pressure environment under the action of the vacuum pump. The PCB resin material undergoes a chemical cross-linking reaction inside the hot press, achieving a tight bond between the resin and the copper foil. Figure 5 As shown, when the hydraulic cylinder is working, it will generate hundreds of tons of thrust to the movable platform 7. The movable platform 7 will press the hot pressure plate 8 upward in sequence to complete the hydraulic cylinder pressure transmission function.

[0046] In this embodiment of the circuit board laminator, due to the two-stage boiler equipment, an electric regulating valve is installed in the secondary heat circulation loop of the secondary boiler equipment. The opening of this electric regulating valve adopts the hot press plate temperature control method of the previous embodiment. The cascaded two-stage temperature control can effectively reduce temperature fluctuations and improve temperature control accuracy. When the detected temperature of the hot oil circulation inlet deviates from the control temperature, the opening of the electric regulating valve can be quickly adjusted to bring the temperature back to the set range. This helps to reduce temperature regulation lag and improve production efficiency.

[0047] In one embodiment, a second temperature sensor is provided on the connecting branch between the hot oil circulation inlet of the hot press equipment and the hot oil circulation outlet of the secondary boiler equipment, for obtaining the detection temperature of the hot oil circulation inlet of the circuit board laminator; a first temperature sensor is provided on the main frame of the hot press equipment, for obtaining the detection temperature of the hot platen of the circuit board laminator.

[0048] Specifically, the temperature of the heating plate and the secondary hot oil circulation inlet are detected in real time by the first and second temperature sensors, and the data is fed back to the PID (Proportional Integral Differential) controller used to realize the first and second stage proportional integral differential operation, forming a closed-loop control. The closed-loop feedback mechanism can effectively reduce the impact of interference on the system and improve the stability and reliability of temperature control.

[0049] In one embodiment, such as Figure 6 As shown, the secondary hot circulation loop includes: an electric regulating valve 13, a first shut-off valve 18, a second shut-off valve 15, and a circulation pump 19. The first port of the first shut-off valve 18 is connected to the hot oil circulation inlet of the hot press equipment, the second port of the first shut-off valve 18 is connected to the first port of the circulation pump 19, the second port of the circulation pump 19 is connected to the first port of the electric regulating valve 13, the second port of the electric regulating valve 13 is connected to the first port of the second shut-off valve 15, and the second port of the second shut-off valve 15 is connected to the hot oil circulation outlet of the hot press equipment.

[0050] Figure 6 In the process, boiler 12 provides the required hot oil to the laminator. The hot oil can flow from boiler 12 along the third shut-off valve 20, electric regulating valve 13, and fourth shut-off valve 21. The opening degree of electric regulating valve 13 affects the flow rate of the primary hot oil circulation. The hot oil from boiler 12 can also form a secondary heat circulation loop through circulating pump 19, first shut-off valve 18, hot press plate 8, second shut-off valve 15, and electric regulating valve 13. The heat transfer oil exchanges heat with the hot press plate 8 when it passes through the internal flow channel of the hot press plate 8.

[0051] like Figure 7As shown, the cascaded temperature control process in this embodiment includes: The hot plate temperature sensor T3 (i.e., the first temperature sensor) collects the detected temperature of the hot platen of the circuit board laminator. The set temperature of the hot platen is the target temperature T0. Based on the first temperature deviation between the detected temperature of the platen and the set temperature of the hot platen, a first-level PID calculation (i.e., the first-level proportional-integral-derivative operation) is performed to obtain the control temperature of the hot oil circulation inlet of the circuit board laminator. Then, the temperature sensor T1 (i.e., the second temperature sensor) collects the detected temperature of the hot oil circulation inlet of the circuit board laminator. Based on the second temperature deviation between the control temperature of the oil circulation inlet and the detected temperature of the hot oil circulation inlet, a second-level PID calculation (i.e., the second-level proportional-integral-derivative operation) is performed to obtain the opening control signal of the electric regulating valve of the secondary hot circulation loop of the circuit board laminator. Finally, based on the opening control signal, the opening of the electric regulating valve of the secondary hot circulation loop of the circuit board laminator is controlled to adjust the detected temperature of the hot oil circulation inlet to reach the control temperature of the hot oil circulation inlet.

[0052] In this embodiment, considering that the distance between the electric regulating valve 13 and the hot platen 8 is relatively far, the temperature change of the hot platen 8 has a delayed effect on the opening of the electric regulating valve 13, and the oil temperature transmitted to the hot platen 8 is easily affected by the ambient temperature. However, the distance between the second temperature sensor 17 and the electric regulating valve 13 is relatively closer, which can improve the problem of the inconsistency between the set temperature and the actual temperature of the hot platen caused by the lag in heat conduction through the second-stage temperature control. This is equivalent to effectively reducing temperature fluctuations and improving temperature control accuracy through two-stage temperature control.

[0053] In one embodiment, such as Figure 6 As shown, a third temperature sensor 14 is installed on the connecting branch between the hot oil circulation outlet of the hot press equipment and the hot oil circulation inlet of the secondary boiler equipment. This sensor is used to obtain the detected temperature of the hot oil circulation outlet of the circuit board laminator and to calculate the opening control signal of the electric regulating valve of the secondary hot circulation loop of the circuit board laminator by combining the control temperature of the hot oil circulation inlet and the detected temperature of the hot oil circulation inlet.

[0054] Since the third temperature sensor 14 is closest to the electric regulating valve 13, the second-stage temperature control can be achieved by combining the detected temperature of the hot oil circulation outlet obtained by the third temperature sensor 14 with the detected temperature of the hot oil circulation inlet obtained by the second sensor 17. For example, the average detected temperature of the hot oil circulation outlet and the hot oil circulation inlet can be calculated. Subtracting this average detected temperature from the average control temperature of the hot oil circulation inlet / outlet yields the second temperature deviation. Finally, the opening control signal of the electric regulating valve in the secondary hot circulation loop of the circuit board laminator is calculated based on this second temperature deviation.

[0055] In this embodiment of the circuit board laminator, a third temperature sensor is installed at the hot oil circulation outlet of the hot press equipment, and a second sensor is installed at the hot oil circulation inlet of the hot press equipment. The average temperature detected by the two sets of sensors is used to determine the second temperature deviation, thereby obtaining a more accurate opening control signal for the electric regulating valve.

[0056] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A method for controlling the temperature of the hot press plate in a circuit board laminator, characterized in that, The hot press plate temperature control method includes the following steps: The hot press plate detection temperature and the hot press plate set temperature of the circuit board laminator are obtained, and a first temperature deviation between the hot press plate detection temperature and the hot press plate set temperature is determined. Based on the first temperature deviation, the control temperature of the hot oil circulation inlet of the circuit board laminator is obtained; The detection temperature of the hot oil circulation inlet of the circuit board laminator is obtained, and a second temperature deviation between the control temperature of the hot oil circulation inlet and the detection temperature of the hot oil circulation inlet is determined. Based on the second temperature deviation, the opening control signal of the electric regulating valve of the secondary thermal cycle circuit of the circuit board laminator is output. According to the opening control signal, the opening of the electric regulating valve of the secondary hot circulation loop of the circuit board laminator is controlled to adjust the detected temperature of the hot oil circulation inlet to reach the control temperature of the hot oil circulation inlet.

2. The hot press plate temperature control method according to claim 1, characterized in that, Based on the first temperature deviation, the control temperature of the hot oil circulation inlet of the circuit board laminator is obtained; specifically including: Based on the first temperature deviation between the pressure plate detection temperature and the hot plate set temperature, a first-stage proportional-integral-differential operation is performed to obtain the control temperature of the hot oil circulation inlet of the circuit board laminator.

3. The hot press plate temperature control method according to claim 2, characterized in that, Based on the second temperature deviation, an opening control signal is output for the electric regulating valve of the secondary thermal cycle loop of the circuit board laminator, specifically including: Based on the second temperature deviation between the control temperature of the hot oil circulation inlet and the detection temperature of the hot oil circulation inlet, a second-stage proportional-integral-differential operation is performed to obtain the operation output value; based on the operation output value, the opening control signal of the electric regulating valve of the secondary hot circulation loop of the circuit board laminator is determined.

4. The hot press plate temperature control method according to claim 3, characterized in that, The expression for the opening control signal of the electric regulating valve is as follows: valve_output= f (u2) Wherein, valve_output is the opening control signal, and u2 is the calculated output value. f This is a positive correlation mapping function between the opening control signal and the calculated output value.

5. The hot press plate temperature control method according to claim 3, characterized in that, The expression for the output value of the operation is as follows: u2=Kp2*e2+Ki2*integral2+Kd2*derivative2 Where u2 is the output value of the operation, Kp2 is a preset proportional constant, e2 is the second temperature deviation, Ki2 is a preset integral constant, integral2 is an integral term related to the second temperature deviation, Kd2 is a preset differential constant, and derivative2 is a differential term related to the second temperature deviation.

6. A temperature control system for the hot press plate of a circuit board laminator, characterized in that, The hot press plate temperature control system includes: a controller, a first temperature sensor, a second temperature sensor, and an electric regulating valve. The controller is connected to the first temperature sensor, which is used to acquire the detected temperature of the hot press plate of the circuit board laminator. The controller is also connected to the second temperature sensor, which is used to acquire the detected temperature of the hot oil circulation inlet of the circuit board laminator. The controller is connected to the electric regulating valve, which is located in the secondary hot circulation loop of the circuit board laminator. The controller is used to implement the hot press plate temperature control method as described in any one of claims 1 to 5.

7. A circuit board laminating machine, characterized in that, The circuit board laminator includes: a hot press, a primary boiler, and a secondary boiler. The hot oil circulation inlet of the hot press is connected to the hot oil circulation outlet of the secondary boiler, and the hot oil circulation inlet of the secondary boiler is connected to the hot oil circulation outlet of the primary boiler. The secondary boiler is equipped with a secondary heat circulation loop, and an electrically adjustable valve is installed on the secondary heat circulation loop. The electrically adjustable valve is used to adjust the opening degree of the hot press plate temperature control method according to any one of claims 1 to 5.

8. The circuit board laminator according to claim 7, characterized in that, A second temperature sensor is installed on the connecting branch between the hot oil circulation inlet of the hot press equipment and the hot oil circulation outlet of the secondary boiler equipment to obtain the detection temperature of the hot oil circulation inlet of the circuit board laminator; a first temperature sensor is installed on the main frame of the hot press equipment to obtain the detection temperature of the hot platen of the circuit board laminator.

9. The circuit board laminator according to claim 7, characterized in that, The secondary heat circulation loop includes: a first shut-off valve, a second shut-off valve, and a circulation pump. The first port of the first shut-off valve is connected to the hot oil circulation inlet of the hot press equipment. The second port of the first shut-off valve is connected to the first port of the circulation pump. The second port of the circulation pump is connected to the first port of the electric regulating valve. The second port of the electric regulating valve is connected to the first port of the second shut-off valve. The second port of the second shut-off valve is connected to the hot oil circulation outlet of the hot press equipment.

10. The circuit board laminator according to claim 8, characterized in that, A third temperature sensor is installed on the connecting branch between the hot oil circulation outlet of the hot press equipment and the hot oil circulation inlet of the secondary boiler equipment. This sensor is used to acquire the detected temperature of the hot oil circulation outlet of the circuit board laminator and, in combination with the control temperature of the hot oil circulation inlet and the detected temperature of the hot oil circulation inlet, to calculate the opening control signal of the electric regulating valve of the secondary hot circulation loop of the circuit board laminator.

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