Computing nodes and computing devices

Abstract

This application provides a computing node and a computing device. The computing node includes a housing, a first heat dissipation device, a plurality of first heat-dissipating components, a second heat dissipation device, and a second heat-dissipating component. The housing includes a base plate; the first heat dissipation device and the plurality of first heat-dissipating components are disposed within the housing; the first heat dissipation device is attached to and connected to the base plate, and the plurality of first heat-dissipating components are connected to the side of the first heat dissipation device opposite to the base plate, and all the plurality of first heat-dissipating components dissipate heat through the first heat dissipation device. The second heat dissipation device and the second heat-dissipating component are disposed within the housing, and the second heat dissipation device can dissipate heat for the second heat-dissipating component. The computing node provided by this application has a neat internal layout and is convenient for assembly and maintenance.

Description

Technical Field

[0001] This application relates to the field of server technology, and more particularly to a computing node and computing device. Background Technology

[0002] Servers, as core devices for data storage, processing, and transmission, are widely used in various scenarios.

[0003] With the rapid development of cloud computing, artificial intelligence, and other fields, servers are iterating towards higher density and higher power, resulting in a significant increase in the number of integrated components. This increases the power consumption and heat dissipation of these components. Cold plates can be used to dissipate heat from these components, thereby increasing heat dissipation efficiency. The cold plate contacts the components to be cooled, and coolant is introduced from outside the server into the cold plate through pipes, dissipating heat from the components through coolant circulation. However, the large number of components requiring cold plate cooling results in a large number of cold plates within the server. These components are dispersed and vary in height, leading to a somewhat cluttered arrangement of the cold plates. The pipes connecting to these cold plates also occupy space within the server, and the different routes of the pipes connecting to different cold plates can cause problems such as tangling and compression, further contributing to the messy cold plate layout. The large number of cold plates and pipes can also obstruct components, hindering server assembly and maintenance.

[0004] In related technologies, the internal layout of servers is messy and the ease of server assembly and maintenance is poor. Summary of the Invention

[0005] This application provides a computing node and a computing device. The computing node has a well-organized internal layout and is easy to assemble and maintain.

[0006] In a first aspect, embodiments of this application provide a computing node, including a housing, a first heat dissipation device, a plurality of first heat-dissipating components, a second heat dissipation device, and a second heat-dissipating component. The first heat dissipation device and the plurality of first heat-dissipating components are disposed within the housing; the first heat dissipation device is attached to and connected to a base plate, and the plurality of first heat-dissipating components are connected to the side of the first heat dissipation device facing away from the base plate. All of the plurality of first heat-dissipating components dissipate heat through the first heat dissipation device. The second heat dissipation device and the second heat-dissipating component are disposed within the housing, and the second heat dissipation device is capable of dissipating heat from the second heat-dissipating component.

[0007] The computing node provided in this application embodiment comprises a first heat dissipation device, a second heat dissipation device, a housing, and multiple first and second heat-dissipating components. The housing includes a base plate; the first heat dissipation device and multiple first heat-dissipating components are disposed within the housing. All multiple first heat-dissipating components are connected to and dissipate heat through the first heat dissipation device, reducing the number of components in the computing node and allowing for a more organized internal layout. The first heat dissipation device also serves as a structural component connecting the multiple first heat-dissipating components, further reducing the number of structural components used to fix the first heat-dissipating components and improving the internal organization of the computing node. The first heat dissipation device is attached to and connected to the base plate, which provides support and enhances the structural stability of the first heat dissipation device. The multiple first heat-dissipating components are connected to the side of the first heat dissipation device facing away from the base plate. The weight of the multiple first heat-dissipating components and the force of the connection between the first heat-dissipating components and the first heat dissipation device prevent deformation of the first heat-dissipating components away from the base plate, thereby further improving the structural stability of the first heat dissipation device. Multiple primary heat-dissipating components are connected to the side of the primary heat dissipation device facing away from the base plate, which improves the ease of assembly and maintenance of the computing node. The second heat dissipation device and the second heat-dissipating component are housed within the casing. The second heat dissipation device dissipates heat from the second heat-dissipating component, making full use of the space within the computing node and further improving the regularity of the computing node layout. Additionally, the computing node has fewer structural components, further enhancing the ease of assembly and maintenance.

[0008] In one possible implementation, the computing node provided in this application includes a housing comprising a partition, a base plate and a partition spaced apart along a first direction, forming a first accommodating space between the base plate and the partition, and a second accommodating space formed on the side of the partition away from the base plate; a first heat dissipation device and a plurality of first heat-dissipating components are disposed in the first accommodating space; a second heat dissipation device and a second heat-dissipating component are disposed in the second accommodating space. By dividing the accommodating cavity within the housing into a first accommodating space and a second accommodating space stacked along the first direction by the partition, the components in the computing node can form a regular layered structure on both sides of the partition, which can make full use of the space of the computing node along the first direction and further improve the regularity of the internal layout of the computing node.

[0009] In one possible implementation, the computing node provided in this application embodiment has an abutment boss on the side of the first heat dissipation device facing the first heat-dissipating component, corresponding to at least a portion of the first heat-dissipating component. The size of the abutment boss along a first direction is adapted to the distance between the first heat-dissipating component and the first heat dissipation device. By setting abutment bosses with different protrusion sizes, different abutment bosses abut against the corresponding first heat-dissipating components, ensuring reliable contact between the first heat-dissipating component and the first heat dissipation device, thereby enabling the first heat dissipation device to have a better heat dissipation effect.

[0010] In one possible implementation, the computing node provided in this application embodiment has a first heat-dissipating component connected to a first heat dissipation device via an elastic connector. The elastic connector reduces stress on the first heat dissipation device while ensuring reliable contact between the first heat-dissipating component and the first heat dissipation device, thereby improving heat transfer efficiency.

[0011] In one possible implementation, the computing node provided in this application embodiment has an elastic thermally conductive element between the first heat-dissipating component and the first heat dissipation device. The elastic thermally conductive element can improve the heat conduction efficiency between the first heat-dissipating component and the first heat dissipation device, resulting in better heat dissipation performance of the first heat dissipation device. The elastic thermally conductive element can also buffer stress on the first heat dissipation device, further improving its heat dissipation effect.

[0012] In one possible implementation, the computing node provided in this application embodiment includes a first heat dissipation device comprising multiple heat dissipation plates, each heat dissipation plate having connecting lugs, and adjacent heat dissipation plates being connected via these connecting lugs. Dividing the first heat dissipation device into multiple heat dissipation plates, each heat dissipation plate having a relatively small external profile, results in smaller deformation of the heat dissipation plate due to stress. Furthermore, some stress can be released at the connection points of the heat dissipation plates, thereby further improving the structural stability of the first heat dissipation device.

[0013] In one possible implementation, the computing node provided in this application embodiment has a first heat dissipation device with multiple hollowed-out portions, and a portion of the first heat-dissipating component has a protrusion on the side facing the first heat dissipation device. The protrusion passes through the hollowed-out portions and is gap-fitted with the hollowed-out portions. The hollowed-out portions can relieve stress, thereby improving the internal regularity of the computing node and the structural stability of the first heat dissipation device.

[0014] In one possible implementation, the computing node provided in this application embodiment further includes a first liquid inlet pipe and a first liquid outlet pipe. The housing includes a side plate, and the first liquid inlet pipe and the first liquid outlet pipe pass through the area of ​​the side plate corresponding to the first accommodating space. The first heat dissipation device is provided with a first flow channel. The first liquid inlet pipe and the first liquid outlet pipe are respectively arranged on both sides of the first heat dissipation device along the second direction, and both the first liquid inlet pipe and the first liquid outlet pipe are connected to the first flow channel. The second direction intersects with the first direction. Multiple first heat-dissipating components are cooled using the same heat dissipation device as the first heat dissipation device. Only one set of coolant flow pipes is needed, which reduces the number of structural components in the computing node and makes the internal layout of the computing node more organized. The first liquid inlet pipe and the first liquid outlet pipe are respectively arranged along the second direction of the first heat dissipation device, which can further improve the internal layout organization of the computing node and the ease of assembly and maintenance.

[0015] In one possible implementation, the computing node provided in this application embodiment has a second heat-dissipating component connected to a partition, and a second heat dissipation device disposed on the side of the second heat-dissipating component away from the partition.

[0016] In one possible implementation, the computing node provided in this application further includes a second inlet pipe and a second outlet pipe. The housing includes a side plate, and the second inlet pipe and the second outlet pipe pass through the area of ​​the side plate corresponding to the second accommodating space. The second heat dissipation device is provided with a second flow channel, and both the second inlet pipe and the second outlet pipe are connected to the second flow channel. The second inlet pipe and the second outlet pipe are staggered from the first inlet pipe and the first outlet pipe along a first direction, which can avoid the second outlet pipe and the second inlet pipe from entanglement or compression with the first inlet pipe and the first outlet pipe, further improving the internal layout regularity and assembly and maintenance convenience of the computing node.

[0017] In one possible implementation, the computing node provided in this application embodiment has a second heat-dissipating component that is the main control module of the computing node, and multiple first heat-dissipating components that are storage modules, management modules, signal control modules, or communication modules.

[0018] Secondly, embodiments of this application provide a computing device, including a housing and the aforementioned computing node, wherein the computing node is disposed within the housing. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of a computing node provided in an embodiment of this application;

[0021] Figure 2 An exploded view of a computing node provided in an embodiment of this application;

[0022] Figure 3 A side view of a computing node provided in an embodiment of this application;

[0023] Figure 4 A schematic diagram of the layout of computing nodes provided in an embodiment of this application;

[0024] Figure 5 A schematic diagram of the structure of the first heat dissipation device and the first heat-dissipating component in the computing node provided in the embodiments of this application;

[0025] Figure 6A schematic diagram showing the connection between the first heat-dissipating component and the first heat dissipation device in a computing node provided in an embodiment of this application;

[0026] Figure 6a Another connection diagram between the first heat-dissipating component and the first heat dissipation device in a computing node provided in an embodiment of this application;

[0027] Figure 7 This is a schematic diagram of the structure of the first heat dissipation device in the computing node provided in the embodiments of this application;

[0028] Figure 8 An exploded view of the first heat dissipation device in a computing node provided in an embodiment of this application;

[0029] Figure 9 Another schematic diagram of the structure of the first heat dissipation device in the computing node provided in the embodiments of this application;

[0030] Figure 10 A schematic diagram of the layout of the housing and piping in the computing node provided in the embodiments of this application;

[0031] Figure 11 A schematic diagram of the structure of a computing device provided in an embodiment of this application.

[0032] Explanation of reference numerals in the attached figures:

[0033] 10. Compute nodes;

[0034] 100. First heat dissipation device;

[0035] 110. Abutting boss; 120. Reference surface;

[0036] 130. Heat sink; 131. Connecting lug; 140. Hollowed-out section; 150. First flow channel;

[0037] 200. Second heat dissipation device;

[0038] 300, shell; 300a, first receiving space; 300b, second receiving space;

[0039] 310. Base plate; 320. Partition plate; 330. Side plate; 331. First side plate; 332. Second side plate;

[0040] 333, Third side plate; 3331, First mounting hole; 3332, Second mounting hole;

[0041] 334. Fourth side panel; 340. Top cover;

[0042] 410, First component to be cooled; 410a, Heat-generating device; 410b, Supporting structure;

[0043] 411, Storage module; 4111, First memory; 4112, Second memory;

[0044] 412. Management module; 413. Signal control module; 414. Communication module;

[0045] 420, Second heat sink; 420a, Main control module; 421, Motherboard; 422, Memory;

[0046] 500. Flexible connector; 510. Fastener; 511. Screw; 512. Nut; 520. Helical spring;

[0047] 600. Flexible thermal conductive component;

[0048] 710. First inlet pipe; 720. First outlet pipe;

[0049] 810. Second inlet pipe; 820. Second outlet pipe;

[0050] 20. Enclosure; 21. Mounting position;

[0051] 1000. Computing equipment;

[0052] X, first direction; Y, second direction; Z, third direction. Detailed Implementation

[0053] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0054] To better understand the computing nodes provided in the embodiments of this application, the terms involved in this application will be briefly explained below.

[0055] RAID card: The full English name is Redundant Array of Independent Disks Card. A RAID card is a hardware controller in a server that manages multiple storage devices to implement disk array functionality. It is a core storage management component connecting the motherboard and the storage devices. RAID cards manage multiple storage devices to form a disk array, improving read and write speeds and ensuring data security through redundancy mechanisms.

[0056] Retimer card: The full English name is Signal Retiming Optimization Card, and the full Chinese name is Retiming Board. A retimer card is a module used in servers to optimize high-speed signal transmission. Its function is to repair attenuation and distortion problems in high-speed signal transmission, and to reshape the signal through retiming technology to ensure signal integrity.

[0057] LANSW Card: full English name is Local Area Network Switch Card. LANSW Card is a hardware card integrating local area network switching functions in a server, which is equivalent to a miniaturized local area network switch and used for server local area network construction, port expansion and data forwarding.

[0058] Embodiments of the present application provide a computing node and a computing device, wherein the interior of the computing node is regularly arranged, and the computing node has good convenience in assembly and maintenance.

[0059] The computing node may be a high-density server, a tower server, a rack server, a whole cabinet server, etc. Among them, the rack server can be configured with different functional cards according to different requirements, and has the advantages of high flexibility and wide application range.

[0060] Hereinafter, the specific structure of the computing node will be described by taking a rack server as an example.

[0061] Figure 1 is a schematic structural diagram of a computing node provided by an embodiment of the present application. Figure 2 is an exploded schematic diagram of a computing node provided by an embodiment of the present application. Figure 3 is a side view of a computing node provided by an embodiment of the present application. Figure 4 is a layout schematic diagram of a computing node provided by an embodiment of the present application.

[0062] Refer to Figures 1 to 4 as shown, the computing node 10 includes a first heat dissipation device 100, a second heat dissipation device 200, a housing 300, a plurality of first to-be-dissipated components 410 and a second to-be-dissipated component 420. The housing 300 includes a bottom plate 310 and a partition plate 320 arranged at intervals along a first direction X; a first accommodation space 300a is formed between the bottom plate 310 and the partition plate 320, and a second accommodation space 300b is formed on a side of the partition plate 320 facing away from the bottom plate 310. The first heat dissipation device 100 and the plurality of first to-be-dissipated components 410 are disposed in the first accommodation space 300a; the plurality of first to-be-dissipated components 410 are all connected to the first heat dissipation device 100 and dissipate heat through the first heat dissipation device 100. The second heat dissipation device 200 and the second to-be-dissipated component 420 are disposed in the second accommodation space 300b, and the second heat dissipation device 200 can dissipate heat for the second to-be-dissipated component 420.

[0063] The housing 300 may be a cuboid structure, and the housing 300 has a first direction X, a second direction Y and a third direction Z. The first direction X is the height direction, the second direction Y is the width direction, and the third direction Z is the length direction. The dimension of the housing 300 along the first direction X is in the unit of U, and 1U is approximately equal to 44.45 mm. The dimension of the housing 300 along the first direction X may be 1U, 2U, 3U, 4U or the like.

[0064] The housing 300 includes a base plate 310, side plates 330, and a top cover 340. The base plate 310 can be a rectangular structure. The four side plates 330 surround the periphery of the base plate 310 and are connected to the base plate 310. The four side plates 330 can be a first side plate 331, a second side plate 332, a third side plate 333, and a fourth side plate 334. The top cover 340 is connected to the side of the four side plates 330 facing away from the base plate 310 along a first direction X. The base plate 310, the four side plates 330, and the top cover 340 form a receiving cavity.

[0065] The partition 320 can be disposed between the upper cover 340 and the bottom plate 310 along the first direction X, and the partition 320 can be connected to the four side plates 330. A first receiving space 300a is formed between the partition 320 and the bottom plate 310, and a second receiving space 300b is formed between the partition 320 and the upper cover 340.

[0066] There are multiple first heat-dissipating components 410, which can be storage modules 411, management modules 412, signal control modules 413, or communication modules 414. Storage modules 411 can be, for example, memory devices. Figure 2 The diagram schematically illustrates eight first memories 4111 and four second memories 4112. The eight first memories 4111 can be assembled in a common housing, and the four second memories 4112 can be assembled in a separate housing. The management module 412 can be a RAID card, the signal control module 413 can be a retimer card, and the communication module 414 can be a LANSW card. These first heat-dissipating components 410 generate heat during operation, which can be dissipated by the first heat dissipation device 100.

[0067] Specifically, multiple first heat-dissipating components 410 are connected to the first heat dissipation device 100. The first heat dissipation device 100 can dissipate heat from the multiple first heat-dissipating components 410. Since all the multiple first heat-dissipating components 410 dissipate heat through the first heat dissipation device 100, the number of components in the computing node 10 is reduced. Fewer components allow for a more organized internal layout of the computing node 10. The first heat dissipation device 100 can also simultaneously serve as a structural component connecting the multiple first heat-dissipating components 410, further reducing the number of structural components used to fix the first heat-dissipating components 410 in the computing node 10 and improving the organization of the internal layout of the computing node 10.

[0068] The second heat-dissipating component 420 can be the main control module 420a. The projected area of ​​the main control module 420a along the first direction X is close to the sum of the projected areas of the multiple first heat-dissipating components 410 along the first direction X. Therefore, by arranging the second heat-dissipating component 420 and the second heat dissipation device 200 for dissipating heat from the second heat-dissipating component 420 in the second accommodating space 300b, the space of the computing node 10 along the first direction X can be fully utilized, and the regularity of the arrangement of the computing node 10 can be further improved.

[0069] The housing 300 is divided into a first receiving space 300a and a second receiving space 300b by a partition 320, which are stacked along the first direction X. The first receiving space 300a is used to arrange the first heat-dissipating component 410 and the first heat dissipation device 100 in the computing node 10. The second receiving space 300b is used to arrange the second heat-dissipating component 420 and the second heat dissipation device 200 in the computing node 10. This allows the components in the computing node 10 to form a regular layered structure, further improving the regularity of the internal layout of the computing node 10.

[0070] In addition, the heat dissipation of multiple first heat-dissipating components 410 is similar, while the heat dissipation of the main control module 420a is greater than that of these first heat-dissipating components 410. The main control module 420a uses a separate second heat dissipation device 200 for heat dissipation, which can also prevent the heat of the main control module 420a from being transferred to the first heat-dissipating components 410, thereby improving the heat dissipation effect of the computing node 10.

[0071] When assembling computing node 10, the first heat dissipation device 100 and multiple first heat-dissipating components 410 are assembled and placed in the first receiving space 300a. A partition 320 is connected to the side plate 330, and the partition 320 separates a second receiving space 300b. The second heat dissipation device 200 and the second heat-dissipating components 420 are then placed in the second receiving space 300b for assembly. The first heat dissipation device 100 and the multiple first heat-dissipating components 410 do not interfere with the assembly of the second heat dissipation device 200 and the second heat-dissipating components 420, thus making the computing node 10 highly convenient to assemble. Furthermore, since multiple first heat-dissipating components 410 are connected to the same first heat dissipation device 100, the number of structural components in the computing node 10 is reduced, decreasing the assembly steps and further improving the ease of assembly of the computing node 10.

[0072] When maintaining computing node 10, there are fewer structural components in computing node 10, and the number of structural components that need to be removed is also smaller, which can improve the ease of maintenance of computing node 10.

[0073] The computing node 10 provided in this application embodiment includes a first heat dissipation device 100, a second heat dissipation device 200, a housing 300, and multiple first heat-dissipating components 410 and second heat-dissipating components 420. The housing 300 includes a base plate 310 and a partition plate 320 spaced apart along a first direction X; a first accommodating space 300a is formed between the base plate 310 and the partition plate 320, and a second accommodating space 300b is formed on the side of the partition plate 320 facing away from the base plate 310. The first heat dissipation device 100 and multiple first heat-dissipating components 410 are disposed in the first accommodating space 300a; all multiple first heat-dissipating components 410 are connected to the first heat dissipation device 100 and dissipate heat through the first heat dissipation device 100. The multiple first heat-dissipating components 410 dissipate heat through the first heat dissipation device 100, thereby reducing the number of components in the computing node 10 and making the internal layout of the computing node 10 more organized. The first heat dissipation device 100 can also simultaneously serve as a structural component connecting multiple first heat-dissipating components 410, reducing the number of structural components used to fix the first heat-dissipating components 410 in the computing node 10 and further improving the regularity of the internal layout of the computing node 10. The second heat dissipation device 200 and the second heat-dissipating component 420 are disposed in the second receiving space 300b. The second heat dissipation device 200 can dissipate heat from the second heat-dissipating component 420, making full use of the space of the computing node 10 along the first direction X, and further improving the regularity of the layout of the computing node 10. By dividing the receiving cavity inside the housing 300 into a first receiving space 300a and a second receiving space 300b stacked along the first direction X by the partition 320, the components in the computing node 10 can form a regular layered structure on both sides of the partition 320, further improving the regularity of the internal layout of the computing node 10. In addition, the computing node 10 has fewer structural components, which can improve the convenience of assembly and maintenance of the computing node 10.

[0074] In one possible implementation, the first heat dissipation device 100 is attached to and connected to the base plate 310, and a plurality of first heat dissipation components 410 are connected to the side of the first heat dissipation device 100 away from the base plate 310.

[0075] The first heat dissipation device 100 can be connected to the base plate 310 by screws or rivets. Alternatively, it can be connected by welding, bonding, or other methods. The first heat dissipation device 100 simultaneously dissipates heat from multiple first heat-dissipating components 410. The first heat dissipation device 100 has a large projected area along the first direction X. By ensuring the first heat dissipation device 100 is in close contact with the base plate 310, the base plate 310 can provide some support, preventing deformation and improving the structural stability of the first heat dissipation device 100.

[0076] Multiple first heat-dissipating components 410 are connected to one side of the base plate 310 of the first heat dissipation device 100. When the calculation node 10 is set up, the height direction (that is, the first direction X) of the calculation node 10 is usually vertical. Therefore, the weight of the multiple first heat-dissipating components 410 and the force of the connection between the first heat-dissipating components 410 and the first heat dissipation device 100 can be used as the pressure applied to the first heat dissipation device 100. This pressure can prevent the first heat-dissipating components 410 from deforming away from the base plate 310, thereby further improving the structural stability of the first heat dissipation device 100.

[0077] Furthermore, multiple first heat-dissipating components 410 are connected to the side of the first heat dissipation device 100 opposite to the base plate 310. When one of the first heat-dissipating components 410 is damaged, it is only necessary to remove the damaged first heat-dissipating component 410 from the first heat dissipation device 100 and replace it with a new one, without having to remove the entire first heat dissipation device 100, thus making the maintenance of the computing node 10 more convenient. When assembling the computing node 10, the first heat dissipation device 100 is first connected to the base plate 310, and then multiple first heat-dissipating components 410 are connected to the first heat dissipation device 100. The outline dimensions of the first heat-dissipating components 410 are smaller than those of the first heat dissipation device 100. The installation of the first heat-dissipating components 410 is all done visually, making the assembly of the computing node 10 more convenient.

[0078] Figure 5 This is a schematic diagram of the structure of the first heat dissipation device and the first heat-dissipating component in the computing node provided in the embodiments of this application.

[0079] See Figure 5 As shown, in one possible implementation, the first heat dissipation device 100 has an abutment boss 110 on the side facing the first heat dissipation component 410 and in the area corresponding to at least a portion of the first heat dissipation component 410. The size of the abutment boss 110 along the first direction X is adapted to the distance between the first heat dissipation component 410 and the first heat dissipation device 100.

[0080] The first heat dissipation device 100 has a reference surface 120 and an abutment boss 110 protruding from the reference surface 120 toward the partition plate 320. The distances between different first heat-dissipating components 410 and the base plate 310 are different; for example, the distance between the Retimer card and the base plate 310 is 5 mm, the distance between the first memory 4111 and the base plate 310 is 6 mm, the distance between the second memory 4112 and the base plate 310 is 7.2 mm, and the distance between the LANSW card and the base plate 310 is 4 mm. The dimension between the reference surface 120 of the first heat dissipation device 100 and the side of the first heat dissipation device 100 facing the base plate 310 can be 3 mm, which is smaller than the distance between the plurality of first heat-dissipating components 410 and the base plate 310.

[0081] Therefore, multiple abutment protrusions 110 can be provided on the side of the first heat dissipation device 100 facing the partition 320. The protrusion size of these abutment protrusions 110 can be set according to different distances between the first heat dissipation component 410 and the base plate 310. For example, the abutment protrusion 110 corresponding to the Retimer card protrudes 2mm from the reference plane (the difference between 5mm and 3mm), the abutment protrusion 110 corresponding to the first memory 4111 protrudes 3mm from the reference plane (the difference between 6mm and 3mm), the abutment protrusion 110 corresponding to the second memory 4112 protrudes 4.2mm from the reference plane (the difference between 7.2mm and 3mm), and the abutment protrusion 110 corresponding to the LANSW card protrudes 1mm from the reference plane (the difference between 4mm and 3mm). By setting abutment bosses 110 with different protrusion sizes, different abutment bosses 110 abut against the corresponding first heat dissipation component 410, so that the first heat dissipation component 410 can reliably contact the first heat dissipation device 100, so that the first heat dissipation device 100 has a better heat dissipation effect.

[0082] Figure 6 This is a schematic diagram showing the connection between the first heat-dissipating component and the first heat dissipation device in a computing node provided in an embodiment of this application.

[0083] See Figure 6 As shown, in one possible implementation, the first heat-dissipating component 410 is connected to the first heat dissipation device 100 via an elastic connector 500.

[0084] The computing node 10 also includes a flexible connector 500, which can be a flexible pin, a flexible clip, etc. Figure 6 In the illustrated embodiment, the elastic connector 500 includes a fastener 510 and a helical spring 520. The fastener 510 includes a screw 511 and a nut 512, with the helical spring 520 sleeved on the nut 512. The screw 511 is inserted into the first heat-dissipating component 410 and the first heat dissipation device 100, and the screw 511 can be threadedly connected to the first heat dissipation device 100. One end of the helical spring 520 abuts against the first heat-dissipating component 410, and the other end abuts against the nut 512. The rebound force of the helical spring 520 can press the first heat-dissipating component 410 onto the first heat dissipation device 100, ensuring good contact between the first heat-dissipating component 410 and the first heat dissipation device 100. In addition, the compression of the helical spring 520 can also prevent the first heat-dissipating component 410 from making hard contact with the first heat dissipation device 100, thereby reducing the stress on the first heat dissipation device 100, preventing the first heat dissipation device 100 from deforming and causing poor contact between the first heat-dissipating component 410 and the first heat dissipation device 100, so that the first heat dissipation device 100 has a better heat dissipation effect.

[0085] Please continue reading Figure 6As shown, an elastic thermally conductive element 600 is provided between the first heat-dissipating component 410 and the first heat dissipation device 100. When an abutment protrusion 110 is provided in the area corresponding to the first heat dissipating component, the elastic thermally conductive element 600 can abut between the first heat-dissipating component 410 and the abutment protrusion 110. The elastic thermally conductive element 600 can be a thermally conductive silicone pad, thermally conductive foam, or thermally conductive gel, etc. The elastic thermally conductive element 600 can improve the heat conduction efficiency between the first heat-dissipating component 410 and the first heat dissipation device 100, so that the first heat dissipation device 100 has a better heat dissipation effect. The elastic thermally conductive element 600 can also buffer the stress on the first heat dissipation device 100, avoid deformation of the first heat dissipation device 100 which would lead to poor contact between the first heat-dissipating component 410 and the first heat dissipation device 100, and further improve the heat dissipation effect of the first heat dissipation device 100.

[0086] In addition, the elastic connector 500 and the elastic heat-conducting component 600 can reduce the stress on the first heat dissipation device 100 and improve the structural stability of the connection between the first heat dissipation device 100 and the first heat-dissipating component 410.

[0087] It is understandable that one, two, or three of the following can be provided at the connection between the first heat-dissipating component 410 and the first heat dissipation device 100: an elastic connector 500, an elastic heat-conducting component 600, and an abutment boss 110.

[0088] Figure 6a This is another schematic diagram showing the connection between the first heat-dissipating component and the first heat dissipation device in a computing node provided in an embodiment of this application.

[0089] See Figure 6a As shown, the first heat-dissipating component 410 includes a support structure 410b and a heat-generating device 410a connected to the support structure 410b. The support structure 410b can be a circuit board in a RAID card, LANSW card, or Retimer card, and the heat-generating device 410a can be a functional component in the same card. The support structure 410b provides connection and support, while the heat-generating device 410a generates heat during operation. The support structure 410b can be a housing for accommodating and mounting a first memory 4111 and a second memory 4112, and the heat-generating device 410a can be either the first memory 4111 or the second memory 4112. When the first heat-dissipating component 410 is connected to the first heat dissipation device 100, the heat-generating device 410a faces and contacts the first heat dissipation device 100. The support structure 410b can be connected to the first heat dissipation device 100 via an elastic connector 500, thereby allowing the heat from the heat-generating device 410a to be transferred to the first heat dissipation device 100 in a timely manner. In addition, an elastic heat-conducting element 600 may be provided between the heating element 410a and the first heat dissipation device 100.

[0090] Figure 7 This is a schematic diagram of the structure of the first heat dissipation device in the computing node provided in the embodiments of this application. Figure 8 An exploded view of the first heat dissipation device in a computing node provided in an embodiment of this application.

[0091] See Figure 7 and Figure 8 As shown, in one possible implementation, the first heat dissipation device 100 includes a plurality of heat dissipation plates 130, each heat dissipation plate 130 having a connecting lug 131, and adjacent heat dissipation plates 130 being connected by the connecting lug 131.

[0092] For example, in Figure 7 and Figure 8 The diagram schematically shows two heat sinks 130, each with a connecting lug 131 on its side facing each other. The two heat sinks 130 are connected by the connecting lug 131. The first heat sink 100 is divided into multiple heat sinks 130, each with a smaller outer profile. As a result, the deformation of the heat sink 130 due to stress is also smaller, and some stress can be released at the connection points of the heat sinks 130. Therefore, the structural stability of the first heat sink 100 can be further improved.

[0093] Please continue reading Figure 7 and Figure 8 As shown, in another possible implementation, the first heat dissipation device 100 is provided with a plurality of hollowed-out portions 140, and a portion of the first heat dissipation component 410 is provided with a protrusion (not shown in the figure) on the side facing the first heat dissipation device 100. The protrusion passes through the hollowed-out portion 140 and is in clearance fit with the hollowed-out portion 140.

[0094] The hollow portion 140 can avoid the protrusion of the first heat-dissipating component 410 facing the first heat dissipation device 100, thereby improving the space utilization and the regularity of the internal layout of the computing node 10. The gap fit between the protrusion and the hollow portion 140 can prevent the periphery of the hollow portion 140 from contacting the first heat-dissipating component 410, and the hollow portion 140 can also play a role in relieving stress. Thus, while improving the internal regularity of the computing node 10, it can also improve the structural stability of the first heat dissipation device 100.

[0095] Figure 9 This is another schematic diagram of the first heat dissipation device in the computing node provided in the embodiments of this application. Figure 10 This is a schematic diagram of the layout of the housing and piping in the computing node provided in an embodiment of this application.

[0096] See Figures 7 to 10As shown, in one possible implementation, the computing node 10 further includes a first inlet pipe 710 and a first outlet pipe 720, which pass through the area of ​​the side plate 330 corresponding to the first accommodating space 300a; the first heat dissipation device 100 is provided with a first flow channel 150, and the first inlet pipe 710 and the first outlet pipe 720 are respectively provided on both sides of the first heat dissipation device 100 along the second direction Y, and both the first inlet pipe 710 and the first outlet pipe 720 are connected to the first flow channel 150.

[0097] The first heat dissipation device 100 can be a liquid-cooled heat dissipation device. The third side plate 333 has two first mounting holes 3331 along the first direction X corresponding to the area of ​​the first receiving space 300a. The first liquid inlet pipe 710 and the first liquid outlet pipe 720 pass through the first mounting holes 3331 to communicate with the first flow channel 150. When the first heat dissipation device 100 includes multiple heat dissipation plates 130, at least some of the heat dissipation plates 130 are liquid-cooled plates, and the liquid-cooled plates have a first flow channel 150 within them. Figure 9 In the embodiment shown, both heat sinks 130 are liquid cooling plates, and each heat sink 130 has a first flow channel 150. The first liquid inlet pipe 710 can be connected to the first flow channel 150 in both heat sinks 130, and the two first liquid outlet pipes 720 can also be connected to the first flow channel 150 in both heat sinks 130.

[0098] Coolant flows from the first inlet pipe 710 into the first flow channel 150, absorbs the heat transferred from the first heat dissipation component 410 to the first heat dissipation device 100, and then flows out from the first outlet pipe 720. This cycle continues to dissipate heat from the first heat dissipation component 410.

[0099] Multiple first heat-dissipating components 410 are cooled using the same heat dissipation device 100, requiring only one additional set of coolant flow pipes. This results in a smaller number of structural components in the computing node 10 and a more organized internal layout. The first inlet pipe 710 and the first outlet pipe 720 are respectively located along the second direction Y of the first heat dissipation device 100 along the second direction Y. This avoids entanglement and compression between the first outlet pipe 720 and the first inlet pipe 710, further improving the internal layout organization and ease of assembly and maintenance of the computing node 10.

[0100] The specific structure and connection method of the second heat dissipation device 200 and the second heat-dissipating component 420 will be described below.

[0101] Please continue reading Figures 2 to 4 As shown, in one possible implementation, the second heat-dissipating component 420 is connected to the partition 320, and the second heat dissipation device 200 is disposed on the side of the second heat-dissipating component 420 away from the partition 320.

[0102] The second heat sink 420 is the main control module 420a, which includes a motherboard 421, a processor (shielded by the second heat sink), memory 422, and other components mounted on the motherboard 421. The processor, memory 422, and other components on the motherboard 421 are all mounted on and electrically connected to the motherboard 421. Therefore, the motherboard 421 of the second heat sink 420 can be connected to the partition 320, facilitating the assembly and maintenance of the computing node 10. The second heat sink 200 is attached to the processor on the main control module 420a to dissipate heat from the processor.

[0103] Please continue reading Figure 10 As shown, in one possible implementation, the computing node 10 further includes a second inlet pipe 810 and a second outlet pipe 820, which pass through the area of ​​the side plate 330 corresponding to the second accommodating space 300b; the second heat dissipation device 200 is provided with a second flow channel (not shown in the figure), and both the second inlet pipe 810 and the second outlet pipe 820 are connected to the second flow channel.

[0104] The second heat dissipation device 200 can be a liquid cooling heat dissipation device. The third side plate 333 is provided with two second mounting holes 3332 in the area corresponding to the second accommodating space 300b along the first direction X. The second liquid inlet pipe 810 and the second liquid outlet pipe 820 pass through the second mounting holes 3332 to communicate with the second flow channel.

[0105] Coolant flows into the second flow channel from the second inlet pipe 810, absorbs the heat transferred from the second heat dissipation component 420 to the second heat dissipation device 200, and then flows out from the second outlet pipe 820. This cycle continues to dissipate heat from the second heat dissipation component 420.

[0106] The second inlet pipe 810 and the second outlet pipe 820 pass through the area corresponding to the side plate 330 and the second accommodating space 300b. The second inlet pipe 810 and the second outlet pipe 820 are staggered from the first inlet pipe 710 and the first outlet pipe 720 along the first direction X, which can avoid the second outlet pipe 820 and the second inlet pipe 810 from getting tangled or squeezed with the first inlet pipe 710 and the first outlet pipe 720, further improving the internal layout regularity and assembly and maintenance convenience of the computing node 10.

[0107] In another possible implementation, the second heat dissipation device 200 can also be a heat pipe. The interior of the heat pipe is a vacuum cavity, and the inner wall of the heat pipe is attached with capillary structures (such as capillary wicks and grooves) and filled with a small amount of two-phase heat dissipation medium. When one end of the heat pipe (evaporation end) contacts the second heat-dissipating component 420 to absorb heat, the heat dissipation medium evaporates into a gaseous state and flows to the other end (condensation end) under the action of the cavity pressure difference. The heat dissipation medium releases heat at the condensation end, condenses into a liquid state, and then flows back to the evaporation end through the capillary action of the inner wall, forming a "evaporation-condensation-recirculation" cycle to achieve heat dissipation. The second heat dissipation device 200 and the first heat dissipation device 100 are two independent components. The layout of the first heat dissipation device 100 does not interfere with the second heat dissipation device 200. The selection of the second heat dissipation device 200 is more flexible and can be selected according to the specific conditions of the internal space of the computing node 10, further improving the regularity of the internal layout of the computing node 10 and the convenience of assembly and maintenance.

[0108] Figure 11 A schematic diagram of the structure of a computing device provided in an embodiment of this application.

[0109] See Figure 11 As shown, the computing device 1000 includes a housing 20 and a computing node 10.

[0110] The housing 20 can be a cuboid structure. The first direction X, the second direction Y, and the third direction Z of the housing 20 are consistent with the first direction X, the second direction Y, and the third direction Z of the computing node 10. The housing 20 has multiple mounting positions 21 arranged along the first direction X, and one computing node 10 can be set in each mounting position 21. The computing nodes 10 in each mounting position 21 can be the same or different.

[0111] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0112] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A computing node, characterized in that, include: The housing includes a base plate; A first heat dissipation device and a plurality of first heat dissipation components are disposed inside the housing; The first heat dissipation device is attached to and connected to the base plate, and a plurality of the first heat dissipation components are connected to the side of the first heat dissipation device away from the base plate. All of the first heat dissipation components are cooled by the first heat dissipation device. The second heat dissipation device and the second heat-receiving component are disposed inside the housing, and the second heat dissipation device can dissipate heat to the second heat-receiving component.

2. The computing node according to claim 1, characterized in that, The housing includes a partition, the partition and the bottom plate are spaced apart along a first direction, a first receiving space is formed between the bottom plate and the partition, and a second receiving space is formed on the side of the partition away from the bottom plate; The first heat dissipation device and a plurality of the first components to be heatd are disposed in the first accommodating space; The second heat dissipation device and the second heat-dissipating component are disposed in the second accommodating space.

3. The computing node according to claim 2, characterized in that, The first heat dissipation device has an abutment protrusion on the side facing the first heat-dissipating component and in the area corresponding to at least a portion of the first heat-dissipating component. The size of the abutment protrusion along the first direction is adapted to the distance between the first heat-dissipating component and the first heat dissipation device.

4. The computing node according to claim 2, characterized in that, The first component to be cooled is connected to the first heat dissipation device via an elastic connector.

5. The computing node according to claim 2, characterized in that, An elastic heat-conducting element is provided between the first heat-dissipating component and the first heat dissipation device.

6. The computing node according to claim 2, characterized in that, The first heat dissipation device includes multiple heat dissipation plates, each heat dissipation plate is provided with connecting lugs, and adjacent heat dissipation plates are connected through the connecting lugs; all of the multiple heat dissipation plates are attached to and connected to the base plate.

7. The computing node according to claim 2, characterized in that, The first heat dissipation device has multiple hollowed-out portions, and some of the first heat dissipation components have protrusions on the side facing the first heat dissipation device. The protrusions pass through the hollowed-out portions and are in clearance fit with the hollowed-out portions.

8. The computing node according to any one of claims 2 to 7, characterized in that, It also includes a first inlet pipe and a first outlet pipe. The housing includes a side plate. The first inlet pipe and the first outlet pipe pass through the side plate in the area corresponding to the first accommodating space. The first heat dissipation device is provided with a first flow channel. The first inlet pipe and the first outlet pipe are respectively provided on both sides of the first heat dissipation device along the second direction. The first inlet pipe and the first outlet pipe are both connected to the first flow channel. The second direction intersects with the first direction.

9. The computing node according to any one of claims 2 to 8, characterized in that, The second heat-dissipating component is connected to the partition plate, and the second heat dissipation device is located on the side of the second heat-dissipating component away from the partition plate.

10. The computing node according to claim 9, characterized in that, It also includes a second inlet pipe and a second outlet pipe. The housing includes a side plate, and the second inlet pipe and the second outlet pipe pass through the area of ​​the side plate corresponding to the second accommodating space. The second heat dissipation device is provided with a second flow channel, and the second inlet pipe and the second outlet pipe are both connected to the second flow channel.

11. The computing node according to any one of claims 1 to 10, characterized in that, The second heat-dissipating component is the main control module of the computing node, and the plurality of the first heat-dissipating components are storage modules, management modules, signal control modules or communication modules.

12. A computing device, characterized in that, It includes a housing and a computing node as described in any one of claims 1 to 11, wherein the computing node is disposed within the housing.

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