Laser processing file merging method, apparatus and device

Abstract

This application relates to a method, apparatus, and computer device for merging laser processing files. The method includes: acquiring a first laser processing file, which is used to process a layered workpiece; extracting processing layer information from the first laser processing file if it is detected to be incomplete; querying a second laser processing file carrying the processing layer information, wherein the second laser processing file and the first laser processing file are used to process the same layer in the layered workpiece; and merging the first laser processing file and the second laser processing file to obtain a merged file. This method can improve laser processing efficiency.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a method, apparatus and computer device for merging laser processing documents. Background Technology

[0002] When accepting a commission for laser processing, the client usually provides the laser processing files, and the processor imports these files into the laser processing equipment and controls the equipment to perform processing based on the imported files.

[0003] With technological advancements, existing laser processing equipment can now support processing an entire layer based on a single, complete file. However, the laser processing files provided by the client may still be fragmented. Therefore, currently, these fragmented files must be imported into the laser processing equipment one by one; that is, each file is processed before the next is imported, until all files are processed. This means that what could have been done with a single file now requires multiple processing steps, resulting in low laser processing efficiency. Summary of the Invention

[0004] Therefore, it is necessary to provide a laser processing file merging method, apparatus, and computer equipment that can improve the efficiency of laser processing in addressing the aforementioned technical problems.

[0005] In a first aspect, this application provides a method for merging laser processing documents, wherein the multilayer board includes a multilayer substrate, and the method includes:

[0006] Obtain the first laser processing file, which is used to process the layered workpiece;

[0007] If the first laser processing file is found to be incomplete, the processing layer information is extracted from the first laser processing file;

[0008] Query the second laser processing file that carries processing layer information. The second laser processing file and the first laser processing file are used to process the same layer in the workpiece with a layered structure.

[0009] The first laser processing file and the second laser processing file are merged to obtain a merged file.

[0010] In one embodiment, the first laser processing file and the second laser processing file are merged to obtain a merged file, including:

[0011] Extract processing sequence feature information from the first laser processing file and the second laser processing file, respectively;

[0012] Based on the characteristic information of each processing sequence and the preset processing sequence, the first laser processing file and the second laser processing file are sorted.

[0013] The first laser processing file and the second laser processing file are merged according to their order to obtain a merged file.

[0014] In one embodiment, processing sequence feature information is extracted from the first laser processing file and the second laser processing file, respectively, including:

[0015] Obtain the first filename of the first laser processing file and the second filename of each of the second laser processing files;

[0016] Extract at least one of process identification information and process step information from the first file name and each of the second file names as processing sequence feature information.

[0017] In one embodiment, the processing sequence feature information includes first processing area information and second processing area information; the processing sequence feature information is obtained from the first laser processing file and the second laser processing file, respectively, including:

[0018] Extract the first processing site information from the first laser processing file, and extract the second processing site information from the second laser processing file;

[0019] Based on the preset processing area range, determine the first processing area information corresponding to the first processing point information, and the second processing area information corresponding to the second processing point information.

[0020] In one embodiment, if the first laser processing file is detected to be incomplete, processing layer information is extracted from the first laser processing file, including:

[0021] Obtain the first filename of the first laser processing file;

[0022] If no target suffix is ​​detected in the first file name, the first laser processing file is determined to be incomplete.

[0023] Extract the processing layer information from the first filename.

[0024] In one embodiment, the second laser processing file includes a target burning file; after querying the second laser processing file carrying processing layer information, the method further includes:

[0025] Identify the target substrate indicated by the processing layer information;

[0026] Control the laser processing equipment to burn the target substrate based on the burn-in file.

[0027] In one embodiment, after controlling the laser processing equipment to burn the target substrate based on the burn-in file, and after merging the first laser processing file and the second laser processing file to obtain a merged file, the method further includes:

[0028] Control the laser processing equipment to locate the target based on the exposed target points after burning;

[0029] The laser processing equipment, after being positioned, performs laser processing on the target substrate based on the merged file.

[0030] In one embodiment, after querying a second laser processing file carrying processing layer information, the method further includes:

[0031] Extract site size information from the first laser processing file and the second laser processing file;

[0032] Based on the site size information, target sites whose size exceeds a preset size threshold are queried from the first laser processing file and the second laser processing file.

[0033] In the first and second laser processing files, add local target markers for the target sites.

[0034] Secondly, this application also provides a laser processing document merging device, comprising:

[0035] The acquisition module is used to acquire a first laser processing file, which is used to process the layered workpiece.

[0036] The extraction module is used to extract processing layer information from the first laser processing file when the first laser processing file is detected to be incomplete;

[0037] The query module is used to query a second laser processing file that carries processing layer information. The second laser processing file and the first laser processing file are used to process the same layer in a workpiece with a layered structure.

[0038] The merge module is used to merge the first laser processing file and the second laser processing file to obtain a merged file.

[0039] Thirdly, this application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0040] Obtain the first laser processing file, which is used to process the layered workpiece;

[0041] If the first laser processing file is found to be incomplete, the processing layer information is extracted from the first laser processing file;

[0042] Query the second laser processing file that carries processing layer information. The second laser processing file and the first laser processing file are used to process the same layer in the workpiece with a layered structure.

[0043] The first laser processing file and the second laser processing file are merged to obtain a merged file.

[0044] Fourthly, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, performs the following steps:

[0045] Obtain the first laser processing file, which is used to process the layered workpiece;

[0046] If the first laser processing file is found to be incomplete, the processing layer information is extracted from the first laser processing file;

[0047] Query the second laser processing file that carries processing layer information. The second laser processing file and the first laser processing file are used to process the same layer in the workpiece with a layered structure.

[0048] The first laser processing file and the second laser processing file are merged to obtain a merged file.

[0049] Fifthly, this application also provides a computer program product, including a computer program that, when executed by a processor, performs the following steps:

[0050] Obtain the first laser processing file, which is used to process the layered workpiece;

[0051] If the first laser processing file is found to be incomplete, the processing layer information is extracted from the first laser processing file;

[0052] Query the second laser processing file that carries processing layer information. The second laser processing file and the first laser processing file are used to process the same layer in the workpiece with a layered structure.

[0053] The first laser processing file and the second laser processing file are merged to obtain a merged file.

[0054] The aforementioned laser processing file merging method, apparatus, and computer equipment, by acquiring a first laser processing file used for processing layered workpieces, and extracting processing layer information from the first laser processing file when incompleteness is detected, thus determining the substrate; then, by querying a second laser processing file carrying processing layer information, which is used to process the same layer in the layered workpiece as the first laser processing file, the second laser processing file is identified as processing the same layer in the layered workpiece as the first laser processing file; furthermore, by merging the first and second laser processing files, a merged file is obtained, merging multiple scattered files processing the same layer in the layered workpiece. Based on this merged file, the laser processing equipment can complete the processing of the same layer in one go, thus avoiding the tedious process of importing and processing multiple scattered files one by one. In this way, the operation that originally required multiple calls and processing is simplified to a single call and processing, thus significantly improving the efficiency of laser processing. Attached Figure Description

[0055] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0056] Figure 1 This is a flowchart illustrating a laser processing file merging method in one embodiment;

[0057] Figure 2 This is a flowchart illustrating a laser processing file merging method in another embodiment;

[0058] Figure 3 This is a schematic diagram of a scenario in one embodiment where the same layer contains multiple processing areas;

[0059] Figure 4 This is a structural block diagram of a laser processing document merging device in one embodiment;

[0060] Figure 5 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0061] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0062] In one exemplary embodiment, such as Figure 1 As shown, a method for merging laser processing files is provided. This embodiment illustrates the application of this method to a terminal, where the terminal can be, but is not limited to, various personal computers, laptops, smartphones, tablets, IoT devices, and portable wearable devices. IoT devices can include smart speakers, smart TVs, smart air conditioners, smart in-vehicle devices, projection devices, etc. Portable wearable devices can include smartwatches, smart bracelets, head-mounted devices, etc. Head-mounted devices can be virtual reality (VR) devices, augmented reality (AR) devices, smart glasses, etc. It is understood that this method can also be applied to a server, and can also be applied to a system including a terminal and a server, and implemented through the interaction between the terminal and the server. In this embodiment, the method includes the following steps S10-S30. Wherein:

[0063] Step S10: Obtain the first laser processing file, which is used to process the layered workpiece.

[0064] In this context, a laser processing file can refer to a digital file used to guide and control laser processing equipment to perform laser processing operations on layered workpieces. A laser processing file may include at least one of the following: design drawings, processing parameters, and path planning related to laser processing.

[0065] A layered workpiece can refer to a workpiece composed of multiple layers of substrates stacked together. In some feasible embodiments, a layered workpiece can refer to a PCB (Printed Circuit Board).

[0066] In some feasible implementations, laser processing may include at least one of laser drilling, laser cutting, etc.

[0067] For each workpiece, the memory can store multiple corresponding laser processing files, and the first laser processing file can be any one of these laser processing files.

[0068] In the processing of layered workpieces, to ensure the processing accuracy of each layer and the alignment accuracy between layers, the next layer's substrate is typically stacked on top of the previously processed layer after each layer is processed. The laser processing equipment then continues processing on the next substrate, and so on, layer by layer, until all layers of the layered workpiece are completed. During the stacking process between different layers, the laser processing equipment needs to stop or wait; therefore, the processing information for different layers is usually stored in different laser processing files. When the same layer contains multiple processing areas, although the different processing areas need to be repositioned, this repositioning step is also performed by the laser processing equipment. Therefore, existing laser processing equipment can achieve continuous processing of different processing areas within the same layer. However, the processing design for different processing areas may be completed separately. Therefore, the laser processing files provided by the client are often fragmented, with separate files created for different processing areas within the same layer. Currently, these fragmented files can only be imported into the laser processing equipment one by one; that is, each file is processed before the next file is imported, until all files are processed. In this case, what would normally be a single file to process the entire layer now requires multiple processing steps, resulting in low efficiency in laser processing.

[0069] For example, before performing laser processing on the workpiece, a first laser processing file can be selected from the storage path corresponding to the workpiece. The first laser processing file can be selected randomly or according to any selection rules; this embodiment does not impose any restrictions on this.

[0070] In some feasible implementations, the workpiece to be processed can be a multi-layer plate structure, with each layer corresponding to one or more laser processing files.

[0071] Step S20: If the first laser processing file is detected to be incomplete, extract the processing layer information from the first laser processing file.

[0072] A complete laser processing file indicates that it contains all the processing information required for the corresponding processing layer to perform laser processing; an incomplete laser processing file indicates that it does not contain all the processing information required for the corresponding processing layer to perform laser processing.

[0073] Processing layer information can refer to information used to identify the processing layer corresponding to the first laser processing file. For example, if the processing layer information is "first layer," it means that the first laser processing file is used to process the first layer. If multiple laser processing files are used to process the same layer, then the multiple laser processing files used to process the same layer have the same processing layer information.

[0074] Processing layer information can be set in at least one of the following: file name, file content, and file attributes. The processing layer information can be added by pre-defining at least one of the following: file content template, file naming rules, and file attribute types. For example, the file content template can be specified to include a "Processing Layer:" field, and the information after the "Processing Layer:" field is the processing layer information. Alternatively, the official names of laser processing files can be specified to follow the format "Processing Layer-Process-Step," and the information before the first hyphen is the processing layer information. Or, the file attributes can be specified to include a processing layer attribute item, and the content of this attribute item is the processing layer information. In this way, when extracting processing layer information, it can be retrieved from the corresponding position in the first laser processing file according to the pre-defined rules.

[0075] For example, after obtaining the first laser processing file, it can be checked whether the first laser processing file is complete. If the first laser processing file is found to be complete, it can be directly imported into the laser processing equipment without merging the laser processing files, and the laser processing equipment can be controlled to complete the laser processing of the processing layer based on the first laser processing file. If the first laser processing file is found to be incomplete, the processing information of the processing layer needs to be further improved. Therefore, the processing layer information can be extracted from the first laser processing file to determine the processing layer whose processing information needs to be improved.

[0076] As an example, the method for detecting whether the first laser processing file is complete may include: querying complete file identification information from the first laser processing file; if complete file identification information is found from the first laser processing file, the first laser processing file is determined to be complete; if complete file identification information is not found from the first laser processing file, the first laser processing file is determined to be incomplete.

[0077] The complete file identification information refers to a marker used to confirm whether a laser processing file contains all the processing information required for the corresponding processing layer to achieve laser processing. The complete file identification information can be set in at least one of the file name, file content, and file attributes. The complete file identification information can be added manually or automatically generated after automatically detecting the completeness of the laser processing file's information.

[0078] As another example, the method for detecting whether the first laser processing file is complete may include: obtaining the complete pattern of the processing layer corresponding to the first laser processing file, and then comparing the similarity between the pattern in the first laser processing file and the complete pattern; if the similarity is higher than a preset similarity threshold, the first laser processing file is determined to be complete; if the similarity is not higher than the preset similarity threshold, the first laser processing file is determined to be incomplete.

[0079] Step S30: Query the second laser processing file carrying processing layer information. The second laser processing file and the first laser processing file are used to process the same layer in the workpiece with the layer structure.

[0080] The second laser processing file can refer to the laser processing file of the same layer in the workpiece with the same layer structure as the first laser processing file. There can be one or more second laser processing files.

[0081] The same layer can refer to a composite board layer composed of a prepreg layer and a resin layer, or it can refer to a single board layer composed of a prepreg layer or a resin layer.

[0082] For example, after determining the processing layer information, the second processing layer information can be extracted from the corresponding position of each laser processing file under the storage path corresponding to the workpiece to be processed, according to the pre-defined position of the processing layer information. The second processing layer information is then compared with the processing layer information of the first laser processing file to determine whether each laser processing file carries the same processing layer information as the first laser processing file. The laser processing file carrying the same processing layer information as the first laser processing file is identified as the second laser processing file.

[0083] Step S40: Merge the first laser processing file and the second laser processing file to obtain a merged file.

[0084] For example, after retrieving the second laser processing file, these laser processing files used for processing the same layer in a layered workpiece can be parsed to extract processing data such as processing paths, processing parameters, and coordinate information. Then, according to preset merging rules, the processing data from the first and second laser processing files are integrated to generate a merged file containing complete processing information for that layer. This file can be directly imported into the laser processing equipment to complete the processing of the same layer in one go. In this way, there is no need to import and process scattered files multiple times, significantly improving processing efficiency. The entire process requires no manual intervention and is completely automated by the system, ensuring the accuracy and executability of the merged file.

[0085] The preset merging rules can be set according to the actual situation, such as coordinate alignment, processing order optimization, etc., and this embodiment does not impose any restrictions on them.

[0086] In the aforementioned laser processing file merging method, a first laser processing file is obtained. This first laser processing file is used to process layered workpieces. If the first laser processing file is found to be incomplete, the processing layer information is extracted from it, thus determining the substrate. Then, a second laser processing file carrying processing layer information is queried. This second laser processing file, which, along with the first laser processing file, processes the same layer in the layered workpiece, thus identifying the second laser processing file that processes the same layer as the first laser processing file. Finally, by merging the first and second laser processing files, a merged file is obtained. This merges multiple scattered files processing the same layer in the layered workpiece. Based on this merged file, the laser processing equipment can complete the processing of the same layer in one go, avoiding the tedious process of importing and processing multiple scattered files one by one. Thus, the operation that originally required multiple calls and processing is simplified to a single call and processing, significantly improving the efficiency of laser processing.

[0087] In one exemplary embodiment, such as Figure 2 As shown, the first laser processing file and the second laser processing file are merged to obtain a merged file, including steps S41 to S43. Wherein:

[0088] Step S41: Extract processing sequence feature information from the first laser processing file and the second laser processing file, respectively.

[0089] It should be noted that when multiple laser processing files correspond to the same layer, firstly, in cases of inter-process dependencies, the incomplete completion of a basic process that needs to be finished may prevent subsequent processes from completing smoothly. Secondly, it may increase unnecessary idle travel time, leading to reduced processing efficiency. Thirdly, if close-range areas are processed continuously, it may cause workpiece deformation or a decrease in surface quality.

[0090] Processing sequence characteristic information refers to the information in laser processing documents used to clearly identify and manage the order and priority of the processing tasks corresponding to that document within the overall processing flow. This information helps ensure that each processing step is executed in a predetermined logical order, thereby guaranteeing processing quality and efficiency. Processing sequence characteristic information can be defined based on different standards, such as process sequence, area division, etc.

[0091] As an example, processing sequence feature information may include at least one of the following: process number, process name, region identifier, and dependency relationship. The process number can be a unique identifier used to represent the process order of the current laser processing file within the entire processing flow, such as 1, 2, 3… or p1, p2, p3… The region identifier can be used to identify the specific processing area involved in the current laser processing file, and can be represented by a coordinate range or region number, such as region 1, region 2, region 3… or (x1, y1) to (x2, y2), (x3, y3) to (x4, y4)… The dependency relationship can be used to identify whether the current laser processing file depends on other laser processing files for completion. The dependency relationship should also include the identification information of the dependent laser processing file, such as dependent on laser processing file X, etc.

[0092] Processing sequence feature information can be set in at least one of the following: file name, file content, and file attributes. This processing sequence feature information can be added manually or automatically generated after the laser processing file's information integrity is automatically checked.

[0093] For example, processing sequence feature information can be extracted from specified locations in the first laser processing file and the second laser processing file respectively, according to the pre-defined positions of the processing sequence feature information.

[0094] Step S42: Sort the first laser processing file and the second laser processing file according to the feature information of each processing sequence and the preset processing sequence.

[0095] A preset processing sequence refers to information that is pre-defined to guide the execution order of various processing tasks. The preset processing sequence can be based on various criteria, including area division and process dependencies, to ensure the entire processing process is efficient and orderly. In some feasible implementations, the preset processing sequence can be determined with the goals of minimizing idle paths, minimizing thermal impact, and satisfying all dependencies, thereby helping to optimize processing paths, manage heat-affected zones, and ensure that dependencies between processes are handled correctly.

[0096] For example, the first laser processing file and each of the second laser processing files can be sorted according to the processing sequence feature information corresponding to each laser processing file and the preset processing sequence. For instance, if the processing sequence feature information of laser processing file A1 is B1, the processing sequence feature information of laser processing file A2 is B2, and the processing sequence feature information of laser processing file A3 is B3, and the preset processing sequence is B1, B2, B3, then the sorted order of the laser processing files is A1, A2, A3.

[0097] Step S43: Merge the first laser processing file and the second laser processing file according to their order to obtain a merged file.

[0098] For example, after sorting the laser processing files for the same layer in a workpiece with a layered structure, these laser processing files can be parsed to extract processing data such as processing paths, processing parameters, and coordinate information. Then, according to a preset merging rule, the processing data of the first and second laser processing files are integrated sequentially according to the file order to generate a merged file containing complete processing information for that layer.

[0099] In this embodiment, by clearly defining the processing sequence of each laser processing file, process dependency conflicts can be effectively avoided, ensuring that basic processes are completed first, thus providing a good foundation for subsequent fine processes. A reasonable processing sequence can also optimize the processing path, reduce the idle travel of the laser head, and significantly improve processing efficiency. In addition, considering the thermal effects of materials, scientifically arranging the processing sequence helps to disperse heat accumulation, prevent workpiece deformation and surface quality problems, and ultimately achieve efficient and high-quality laser processing. In this way, not only is production efficiency improved, but the processing accuracy and consistency of the workpiece are also guaranteed.

[0100] In an exemplary embodiment, processing sequence feature information is extracted from the first laser processing file and the second laser processing file, respectively, including:

[0101] Obtain the first filename of the first laser processing file and the second filename of each second laser processing file; extract at least one of the process identification information and process step information from the first filename and each second filename as processing sequence feature information.

[0102] It should be noted that laser processing documents contain a lot of information, and it takes a long time to search and extract information from them. In addition, the same field may have multiple meanings. When it appears alone, it may indicate processing sequence characteristics, but when it appears in a piece of code, it may have other meanings. If information in this piece of code is extracted, information extraction errors will occur.

[0103] The processing sequence feature information includes at least one of process identification information and process step information. The preset processing sequence includes at least one of preset process arrangement order and preset step arrangement order. The process arrangement order can refer to the preset arrangement order of processes, and the step arrangement order can refer to the preset arrangement order of process steps.

[0104] The laser processing of the same layer can involve multiple steps, such as both target burning and drilling. Step identification information refers to specific data or markings used to clearly identify and distinguish each processing step.

[0105] Process step information refers to specific data or markers used to clearly identify and distinguish the execution steps of each processing step. It is understood that multiple laser processing files can carry the same process identification information; in this case, these laser processing files carrying the same process identification information can carry different process step information. For example, a laser processing file can contain processing sequence feature information "A1, A2, B1, B2", where A and B can be process identification information, and 1 and 2 can be process step information. That is, A1 can represent the first step of process A, and B2 can represent the second step of process B.

[0106] For example, the first filename of the first laser processing file and the second filename of each second laser processing file can be obtained first, and then, according to the pre-defined naming rules for the filenames of the laser processing files, at least one of the process identification information and process step information can be extracted from the specified positions in the first filename and the second filename respectively.

[0107] In this embodiment, since the file name contains little information, by setting the processing order feature information in the file name, on the one hand, the query scope can be effectively narrowed and the extraction efficiency of the processing order feature information can be improved; on the other hand, the case where the same field has multiple meanings is rare, so the accuracy of extracting the processing order feature information can be improved.

[0108] In an exemplary embodiment, the processing sequence feature information includes first processing area information and second processing area information; the processing sequence feature information is obtained from the first laser processing file and the second laser processing file, respectively, including:

[0109] Extract first processing point information from the first laser processing file and extract second processing point information from the second laser processing file; determine first processing area information corresponding to the first processing point information and second processing area information corresponding to the second processing point information based on the preset processing area range.

[0110] It should be noted that different laser processing files may be used to process different areas within the same layer. The processing order between these areas may differ, resulting in varying idle travel times and impacting processing efficiency. Furthermore, continuous processing of closely spaced areas may cause workpiece deformation or a decrease in surface quality.

[0111] The processing position information refers to information describing the processing location of the laser on the workpiece, and can be represented by coordinates. The first processing position information can be any one or more processing position information from the first laser processing file. The second processing position information can be any one or more processing position information from the second laser processing file.

[0112] For example, according to the pre-defined positions of the processing point information, the first processing point information can be extracted from a specified position in the first laser processing file, and the second processing point information can be extracted from a specified position in the second laser processing file. Then, based on a preset processing area range, the first processing area information of the processing area into which the first processing point information falls, and the second processing area information of the processing area into which the second processing point information falls, are determined. The preset processing area range can be determined in advance based on the actual processing conditions, complete processing drawings, etc., and this embodiment does not impose any limitations on this.

[0113] In this embodiment, processing is sorted according to the processing area, which can help shorten the idle travel distance, thereby reducing the idle travel time and improving processing efficiency. It can also help control the thermal impact between processing areas that are close to each other, thereby improving the quality of the workpiece.

[0114] In an exemplary embodiment, when the first laser processing file is detected to be incomplete, processing layer information is extracted from the first laser processing file, including: obtaining the first filename of the first laser processing file; determining that the first laser processing file is incomplete if no target suffix is ​​detected from the first filename; and extracting processing layer information from the first filename.

[0115] It should be noted that laser processing documents contain a lot of information, and it takes a long time to search and extract information from them. In addition, the same field may have multiple meanings. When it appears alone, it may indicate processing sequence characteristics, but when it appears in a piece of code, it may have other meanings. If information in this piece of code is extracted, information extraction errors will occur.

[0116] The filename suffix, also known as the file extension, refers to the part after the last dot in the filename and is used to identify the file type and format. The filename suffix may affect whether the file can be opened and used successfully.

[0117] The target suffix refers to the file extension of a laser processing file that can be opened by laser processing equipment, such as ".ex2" or ".drl". When pre-defining file naming rules, only complete laser processing files can be allowed to have the target suffix added, while incomplete files cannot. This effectively prevents incomplete laser processing files from being accidentally opened. Thus, when designing and editing laser processing files, personnel can manually determine or use a program to automatically detect the completeness of the edited files, adding the target suffix to complete files and leaving incomplete files untouched.

[0118] For example, after obtaining the first laser processing file, the first filename of the first laser processing file can be further obtained. Then, it is checked whether the first filename has a suffix. If the first filename does not have a suffix, it can be determined that the target suffix was not detected in the first filename. If the first filename has a suffix, it can be further checked whether the suffix in the first filename is the same as the target suffix. If the suffix in the first filename is the same as the target suffix, it is determined that the first laser processing file is in a complete state, and there is no need to merge it; it can be directly imported into the laser processing equipment. If the suffix in the first filename is different from the target suffix, it is determined that the first laser processing file is in an incomplete state, and the processing layer information can be further extracted from the first filename.

[0119] In this embodiment, since the filename contains relatively little information, including the processing layer information in the filename effectively narrows the search scope and improves the efficiency of extracting the processing layer information. Furthermore, since it's rare for the same field to have multiple meanings, the accuracy of extracting the processing layer information is improved. Additionally, by only allowing complete laser processing files to have the target suffix added, the accidental opening of incomplete laser processing files can be effectively prevented.

[0120] In one exemplary embodiment, the second laser processing file includes a target burning file; after querying the second laser processing file carrying processing layer information, the method further includes:

[0121] Identify the target substrate indicated by the processing layer information; control the laser processing equipment to burn the target substrate based on the burn-in file.

[0122] It should be noted that if the target burning test is not performed during laser processing and the default or preset laser parameters are used directly, it may result in incomplete cutting or excessive burning, uneven energy distribution in complex geometries and large areas, thereby affecting processing accuracy and efficiency.

[0123] In some feasible implementations, such as Figure 3As shown, when the same substrate 302 is divided into multiple processing areas 304, a local target 308 can be set for each processing area 304. When burning the local target 308, positioning can be based on the overall target 306. Similarly, when processing the processing area 304, positioning can be based on the local target 308. When multiple areas to be processed are contained in the same layer, due to differences in material properties, geometry, processing accuracy requirements, and heat-affected zone management, a single target point may not be able to adapt to these changes. This may result in incomplete cutting or over-burning in some areas, loss of details in complex areas, insufficient energy in large areas, insufficient accuracy in critical areas, and deformation and undesirable heat-affected zones due to heat accumulation, ultimately affecting the overall processing quality and efficiency. By setting a local target point for each processing area, parameters such as laser power, speed, and frequency can be dynamically adjusted according to the specific conditions of each area, ensuring that each area achieves the best processing effect. Furthermore, local targets can optimize path planning, reduce idle travel and heat accumulation, improve processing efficiency, and adjust parameters in a timely manner through real-time monitoring and feedback mechanisms to ensure the processing quality and consistency of each area. This not only improves the yield rate but also ensures the overall precision and surface quality of the workpiece.

[0124] Target burning refers to performing small-scale actual processing tests on a target material. Target burning files refer to files used for testing and calibrating laser equipment parameters. These files contain a series of preset processing instructions and parameter settings, designed to verify and optimize the performance and processing effects of the laser equipment through small-scale actual processing tests on the target material.

[0125] For example, before actual processing, the target burning file can be imported into the laser processing equipment. The target substrate is first located from the workpiece to be processed based on the processing layer information. Then, the laser processing equipment is controlled to burn the target substrate based on the target burning file.

[0126] In this embodiment, by conducting target burning tests, parameters such as laser power, speed, and frequency can be precisely adjusted according to specific materials and processing requirements, ensuring that each processing task can be carried out under optimal conditions, thereby improving processing quality and consistency, effectively managing the heat-affected zone, reducing scrap rate, and improving overall production efficiency.

[0127] In an exemplary embodiment, after controlling the laser processing equipment to burn the target substrate based on the burning target file, and after merging the first laser processing file and the second laser processing file to obtain a merged file, the method further includes:

[0128] The laser processing equipment is controlled to locate the target based on the exposed target points after burning; the laser processing equipment is then controlled to perform laser processing on the target substrate based on the merged file.

[0129] For example, after obtaining the merged file and the target substrate has been burned, the laser processing equipment can be controlled to locate the target points exposed after burning, so as to verify and adjust the positioning system of the laser processing equipment; after positioning, the merged file can be imported into the laser processing equipment, and the laser processing equipment can be controlled to perform laser processing on the target substrate based on the merged file.

[0130] In this embodiment, during target burning, a portion of the target substrate is eliminated, exposing the material layer beneath the eliminated area. The target point is positioned below the eliminated area, thus revealing it after burning. Calibration using the target point allows for verification and adjustment of the laser processing equipment's positioning system, ensuring precise movement to the designated position during actual processing. Positioning the target point below the eliminated area not only reduces material waste but also ensures that each processing task is performed under optimal conditions.

[0131] In one exemplary embodiment, after querying a second laser processing file carrying processing layer information, the method further includes:

[0132] Step S31: Extract the site size information from the first laser processing file and the second laser processing file.

[0133] It's important to note that in current processing procedures, when processing needs to be done in different areas on the same layer, laser processing files are typically divided by processing area. One laser processing file usually corresponds to one processing area. Processing within an area often involves positioning first, followed by drilling, cutting, etc. Therefore, target points and processing sites are usually not marked or distinguished in the laser processing file; instead, a certain number of processing sites at the beginning are assumed to be the target points. However, after merging multiple laser processing files into a single merged file, target point positioning for later-processed areas needs to be performed after drilling and cutting in earlier-processed areas. Therefore, target point information also needs to be inserted into the merged file. In this situation, the laser processing equipment struggles to distinguish and identify target points and laser action sites from a large number of processing sites, potentially leading to laser drilling or cutting of the target points and damage to their location.

[0134] The site size information refers to the size of the processing site. The processing site can include a target point and a laser action point. The target point is typically used by the laser processing equipment to locate the area to be processed, while the laser action point refers to the specific location where the laser beam is focused on the workpiece. The size of the laser action point is usually small due to limitations imposed by the workpiece structure, material, and processing precision. To ensure accurate positioning, the target point is typically much larger than the laser action point; for example, the diameter of the laser action point can be tens of micrometers, but the diameter of the target point usually needs to reach hundreds or even thousands of micrometers.

[0135] For example, after obtaining the second laser processing file, the site size information of each processing site can be extracted from the first laser processing file and the second laser processing file, either before or after merging.

[0136] Step S32: Based on the site size information, query the target sites whose size exceeds the preset size threshold from the first laser processing file and the second laser processing file.

[0137] For example, based on the size information of each site, it is determined whether the size of each processing site exceeds a preset size threshold, and the processing sites whose size exceeds the preset size threshold are identified as target sites.

[0138] The preset size threshold can be determined based on the size of the laser action site, and the preset size threshold can be greater than the size of the laser action site.

[0139] Step S33: In the first laser processing file and the second laser processing file, add local target point markers for the target site.

[0140] For example, after determining the target location, local target point markers can be added to the target location in both the first and second laser processing files. These local target point markers instruct the laser processing equipment to perform a positioning operation. Thus, during subsequent processing, if the laser processing equipment reads the merged file and finds the local target point markers, it can perform region positioning; otherwise, it can proceed with laser processing.

[0141] In this embodiment, by setting a size threshold, the target point can be quickly located from a large number of processing sites, and local target point markers can be added to the target point, thereby ensuring the orderly progress of processing.

[0142] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0143] Based on the same inventive concept, this application also provides a laser processing file merging apparatus for implementing the laser processing file merging method described above. The solution provided by this apparatus is similar to the solution described in the above method; therefore, the specific limitations in one or more embodiments of the laser processing file merging apparatus provided below can be found in the limitations of the laser processing file merging method described above, and will not be repeated here.

[0144] In one exemplary embodiment, such as Figure 4 As shown, a laser processing file merging device is provided, including: an acquisition module 402, an extraction module 404, a query module 406, and a merging module 408, wherein:

[0145] The acquisition module 402 is used to acquire a first laser processing file, which is used to process the layered workpiece.

[0146] Extraction module 404 is used to extract processing layer information from the first laser processing file when the first laser processing file is detected to be incomplete;

[0147] The query module 406 is used to query a second laser processing file that carries processing layer information. The second laser processing file and the first laser processing file are used to process the same layer in the workpiece with the layer structure.

[0148] The merging module 408 is used to merge the first laser processing file and the second laser processing file to obtain a merged file.

[0149] In one exemplary embodiment, the merging module 408 is further configured to:

[0150] Extract processing sequence feature information from the first laser processing file and the second laser processing file, respectively;

[0151] Based on the characteristic information of each processing sequence and the preset processing sequence, the first laser processing file and the second laser processing file are sorted.

[0152] The first laser processing file and the second laser processing file are merged according to their order to obtain a merged file.

[0153] In one exemplary embodiment, the merging module 408 is further configured to:

[0154] Obtain the first filename of the first laser processing file and the second filename of each of the second laser processing files;

[0155] Extract at least one of process identification information and process step information from the first file name and each of the second file names as processing sequence feature information.

[0156] In one exemplary embodiment, the merging module 408 is further configured to:

[0157] Extract the first processing site information from the first laser processing file, and extract the second processing site information from the second laser processing file;

[0158] Based on the preset processing area range, determine the first processing area information corresponding to the first processing point information, and the second processing area information corresponding to the second processing point information.

[0159] In one exemplary embodiment, the extraction module 404 is further configured to:

[0160] Obtain the first filename of the first laser processing file;

[0161] If no target suffix is ​​detected in the first file name, the first laser processing file is determined to be incomplete.

[0162] Extract the processing layer information from the first filename.

[0163] In an exemplary embodiment, the second laser processing file includes a target burning file; the laser processing file merging device further includes a target burning module; after querying the second laser processing file carrying processing layer information, the target burning module is further configured to:

[0164] Identify the target substrate indicated by the processing layer information;

[0165] Control the laser processing equipment to burn the target substrate based on the burn-in file.

[0166] In an exemplary embodiment, the laser processing file merging apparatus further includes a processing module; after controlling the laser processing equipment to burn the target substrate based on the burning file, and after merging the first laser processing file and the second laser processing file to obtain a merged file, the processing module is further configured to:

[0167] Control the laser processing equipment to locate the target based on the exposed target points after burning;

[0168] The laser processing equipment, after being positioned, performs laser processing on the target substrate based on the merged file.

[0169] In one exemplary embodiment, the laser processing document merging apparatus further includes a marking module; after querying a second laser processing document carrying processing layer information, the marking module is used to:

[0170] Extract site size information from the first laser processing file and the second laser processing file;

[0171] Based on the site size information, target sites whose size exceeds a preset size threshold are queried from the first laser processing file and the second laser processing file.

[0172] In the first and second laser processing files, add local target markers for the target sites.

[0173] Each module in the aforementioned laser processing document merging device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device, or stored in the memory of a computer device as software, so that the processor can call and execute the operations corresponding to each module.

[0174] In one exemplary embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as follows: Figure 5As shown, the computer device includes a processor, memory, input / output interface, communication interface, display unit, and input device. The processor, memory, and input / output interface are connected via a system bus, and the communication interface, display unit, and input device are also connected to the system bus via the input / output interface. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The input / output interface is used for exchanging information between the processor and external devices. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, Near Field Communication (NFC), or other technologies. When executed by the processor, the computer program implements a laser processing file merging method. The display unit is used to form a visually visible image and can be a display screen, projection device, or virtual reality imaging device. The display screen can be an LCD screen or an e-ink screen. The input device of the computer device can be a touch layer covering the display screen, or buttons, trackballs, or touchpads set on the casing of the computer device, or external keyboards, touchpads, or mice, etc.

[0175] Those skilled in the art will understand that Figure 5 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0176] In one embodiment, a computer device is also provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above method embodiments.

[0177] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon that, when executed by a processor, implements the steps in the above method embodiments.

[0178] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps in the above method embodiments.

[0179] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data must comply with relevant regulations.

[0180] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, database, or other media used in the embodiments provided in this application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, artificial intelligence (AI) processors, etc., and are not limited to these.

[0181] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0182] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for merging laser processing documents, characterized in that, The method includes: Obtain a first laser processing file, which is used to process a layered workpiece; If the first laser processing file is detected to be incomplete, the processing layer information is extracted from the first laser processing file; Query the second laser processing file carrying the processing layer information, wherein the second laser processing file and the first laser processing file are used to process the same layer in the layered workpiece; The first laser processing file and the second laser processing file are merged to obtain a merged file.

2. The method according to claim 1, characterized in that, The process of merging the first laser processing file and the second laser processing file to obtain a merged file includes: Extract processing sequence feature information from the first laser processing file and the second laser processing file, respectively; Based on the processing sequence feature information and the preset processing sequence, the first laser processing file and the second laser processing file are sorted; The first laser processing file and the second laser processing file are merged according to their sorting order to obtain a merged file.

3. The method according to claim 2, characterized in that, The step of extracting processing sequence feature information from the first laser processing file and the second laser processing file respectively includes: Obtain the first filename of the first laser processing file and the second filename of each of the second laser processing files; From the first file name and each of the second file names, at least one of the process identification information and process step information is extracted as the processing sequence feature information.

4. The method according to claim 2, characterized in that, The processing sequence feature information includes first processing area information and second processing area information; obtaining the processing sequence feature information from the first laser processing file and the second laser processing file respectively includes: Extract the first processing site information from the first laser processing file, and extract the second processing site information from the second laser processing file; Based on the preset processing area range, determine the first processing area information corresponding to the first processing point information, and the second processing area information corresponding to the second processing point information.

5. The method according to claim 1, characterized in that, The step of extracting processing layer information from the first laser processing file when it is detected that the first laser processing file is incomplete includes: Obtain the first filename of the first laser processing file; If no target suffix is ​​detected in the first filename, the first laser processing file is determined to be incomplete. Extract the processing layer information from the first file name.

6. The method according to any one of claims 1 to 5, characterized in that, The second laser processing file includes a target burning file; after querying the second laser processing file carrying the processing layer information, the method further includes: Determine the target substrate indicated by the processing layer information; The laser processing equipment is controlled to burn the target substrate based on the burn-in file.

7. The method according to claim 6, characterized in that, After the target substrate is burned onto the laser processing equipment based on the burning target file, and after the first laser processing file and the second laser processing file are merged to obtain a merged file, the method further includes: The laser processing equipment is controlled to perform positioning based on the target points exposed after burning. The laser processing equipment, after being positioned, performs laser processing on the target substrate based on the merged file.

8. The method according to any one of claims 1 to 5, characterized in that, After querying the second laser processing file carrying the processing layer information, the method further includes: Extract the site size information from the first laser processing file and the second laser processing file; Based on the site size information, target sites whose size exceeds a preset size threshold are queried from the first laser processing file and the second laser processing file; In the first laser processing file and the second laser processing file, local target point markers are added for the target site.

9. A laser processing document merging device, characterized in that, The device includes: The acquisition module is used to acquire a first laser processing file, which is used to process a layered workpiece. The extraction module is used to extract processing layer information from the first laser processing file when the first laser processing file is detected to be incomplete; The query module is used to query a second laser processing file carrying the processing layer information, wherein the second laser processing file and the first laser processing file are used to process the same layer in the layered workpiece; The merging module is used to merge the first laser processing file and the second laser processing file to obtain a merged file.

10. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 7.

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