A method for preparing a hand-shaped integrated printed flexible conductive film

Abstract

The application relates to a hand-shaped integrated printing flexible conductive film preparation method and belongs to the technical field of flexible conductive films; in view of the problems that traditional flexible conductive films are prone to strain concentration, conductive performance failure and poor structural adaptability in the scene of complex curved surfaces and repeated movements of hands; according to a three-dimensional model, hand joint bending deformation data is divided into a low strain area and a high strain area; then a multi-material continuous printing process is adopted on the same flexible substrate to respectively print linear high-conductive lines and wave-shaped tensile-resistant lines; and a micro-crease structure capable of releasing pre-strain is introduced in the joint area, so that the conductive film still maintains stable resistance when being attached to the hand bending, gripping and twisting; the creativity of the application lies in that the hand-shaped conductive film is no longer regarded as a simple plane printing pattern, but integrated preparation is realized according to the real movement law of the hand, that is, "structure partition-material partition-function partition", so that the attachment, bending resistance, signal stability and multi-point sensing capability are simultaneously improved.

Description

Technical Field

[0001] This invention relates to the field of flexible conductive film technology, and in particular to a method for preparing a hand-shaped integrated printed flexible conductive film. Background Technology

[0002] Flexible electronic devices are becoming crucial support for smart wearables, rehabilitation medicine, and human-computer interaction. The hand, with its rich movements and sensitive touch, is one of the most valuable contact areas for these devices. Research on flexible conductive films for the hand has involved various conductive materials such as silver nanowires, liquid metals, and carbon nanotubes, as well as molding methods such as screen printing and inkjet printing. The goal is to create a thin film that can both adhere to the palm and transmit clear electrical signals with finger movements.

[0003] However, current manufacturing approaches often treat the entire hand as a flat printing plate, uniformly spreading conductive lines of the same material, line type, and thickness across the entire substrate. This approach ignores the fact that the hand itself is a complex curved surface composed of multiple moving areas, and also avoids the differences in the way different areas are subjected to force. Therefore, in actual wear, it is difficult to coordinate the fit between the membrane and the skin, and the degree of matching between the lines and movements.

[0004] The core factor truly determining whether a conductive film can operate stably over the long term is the difference in strain states across different areas of the hand. The center of the palm experiences minimal deformation in most movements, making it a low-strain area; the finger joints are repeatedly stretched and compressed when bent, making them a high-strain area; and the fingertips primarily bear pressure and contact when grasping objects, making them a sensory area. Taking the everyday action of clenching a fist as an example, the skin on the surface of the finger joints can be stretched by more than 30%, while the palm remains almost unchanged at the same time. If the conductive circuitry uses the same routing and paste in both areas, the circuitry at the joints will quickly experience resistance drift or even breakage due to repeated stretching, while the circuitry in the palm will suffer from excessive redundancy, reducing overall conductivity. Furthermore, the contact signal at the fingertips will be submerged in noise caused by structural deformation.

[0005] Therefore, how to make the structure, material formulation, and functional positioning of the conductive film on the same flexible substrate correspond to the actual stress state of different areas of the hand, so that it can maintain stable electrical performance and clear sensing signals during bending, gripping, twisting and other actions, has become the key issue to promote the practical application of hand-shaped integrated printed flexible conductive film. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a method for preparing a flexible conductive film with integrated hand shape printing, which can solve the problem that the flexible conductive film cannot adapt to the complex deformation of the hand joint, resulting in a decrease in conductivity or even breakage and failure.

[0007] To solve the above-mentioned technical problems, the technical solution of the present invention is: a method for preparing a hand-shaped integrated printed flexible conductive film, the innovation of which is as follows: the specific preparation method is as follows: S101: Acquire three-dimensional scanning data of the hand, process the three-dimensional scanning data of the hand using a support vector machine algorithm, extract the geometric features of the hand surface, and construct a three-dimensional model of the hand based on the geometric features of the hand surface; S102: Based on the three-dimensional model of the hand, extract the bending deformation data of the hand joints. If the bending deformation data of the hand joints is greater than a preset deformation threshold, the area corresponding to the bending deformation data of the hand joints is determined to be a high strain area. If the bending deformation data of the hand joints is less than or equal to the preset deformation threshold, the area corresponding to the bending deformation data of the hand joints is determined to be a low strain area. S103: For the high strain zone and the low strain zone, the random forest algorithm is used for feature classification to determine the wavy line structure corresponding to the high strain zone and the straight line structure corresponding to the low strain zone. S104: Obtain the wavy circuit structure and the straight circuit structure, match the first conductive paste according to the wavy circuit structure, and match the second conductive paste according to the straight circuit structure; S105: Continuous printing is performed on a pre-established flexible substrate using the first conductive paste and the second conductive paste to obtain an initial conductive film containing different conductive materials; S106: Introduce a micro-wrinkled structure for the high-strain region of the initial conductive film to release the pre-strain of the high-strain region and obtain a hand-shaped integrated flexible conductive film.

[0008] The advantages of this invention are: This invention discloses a method for preparing a hand-shaped integrated printed flexible conductive film. It addresses the problems of strain concentration, conductivity failure, and poor structural adaptability that traditional flexible conductive films often exhibit under complex hand curvature and repetitive joint movements. This invention divides the bending deformation data of hand joints into low-strain and high-strain regions based on a three-dimensional model. Then, using a multi-material continuous printing process on the same flexible substrate, it prints linear high-conductivity lines and wavy tensile-resistant lines respectively. Furthermore, it introduces a micro-fold structure in the joint area to release pre-strain, ensuring the conductive film maintains stable resistance even when the hand is bent, grasped, or twisted. The innovation of this invention lies in not treating the hand-shaped conductive film as a simple planar printed pattern, but rather achieving integrated preparation of "structural partitioning—material partitioning—functional partitioning" based on the actual movement patterns of the hand, thereby simultaneously improving fit, bending resistance, signal stability, and multi-point sensing capabilities. Attached Figure Description

[0009] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0010] Figure 1 This is a flowchart of a method for preparing a hand-shaped integrated printed flexible conductive film according to the present invention.

[0011] Figure 2 This is a refinement of the core algorithm processing for a hand-shaped integrated printed flexible conductive film preparation method of the present invention.

[0012] Figure 3 This is a schematic diagram of the structure of a hand-shaped integrated printed flexible conductive film according to the present invention.

[0013] Figure 4 This is a side view of a hand-shaped integrated printed flexible conductive film according to the present invention.

[0014] Figure 5 This is a cross-sectional view of a hand-shaped integrated printed flexible conductive film according to the present invention. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0016] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0017] like Figures 1 to 2 The method for preparing a hand-shaped integrated printed flexible conductive film is shown below: S101: Acquire three-dimensional scanning data of the hand, process the three-dimensional scanning data of the hand using a support vector machine algorithm, extract the geometric features of the hand surface, and construct a three-dimensional model of the hand based on the geometric features of the hand surface.

[0018] S101 specifically involves: acquiring three-dimensional hand scan data, organizing the point cloud data into an n×3 dimensional coordinate matrix as input, establishing a nonlinear mapping relationship using a radial basis kernel function through a support vector machine algorithm, using the hand joint protrusion region, fingertip region, and palm flat region as classification targets, constructing an optimal classification hyperplane to divide the point cloud into key geometric regions and non-key regions, outputting the region label of each point and its corresponding local curvature value, normal vector direction, and surface gradient geometric feature parameters, and constructing a three-dimensional hand model based on the aforementioned hand surface geometric features.

[0019] S102: Based on the three-dimensional model of the hand, extract the bending deformation data of the hand joints. If the bending deformation data of the hand joints is greater than a preset deformation threshold, the area corresponding to the bending deformation data of the hand joints is determined to be a high strain area. If the bending deformation data of the hand joints is less than or equal to the preset deformation threshold, the area corresponding to the bending deformation data of the hand joints is determined to be a low strain area.

[0020] S102 specifically involves: extracting hand joint bending deformation data based on the aforementioned three-dimensional hand model. This data refers to the change A of the angle formed by adjacent bone segments on both sides of each joint relative to the natural extended state when the hand performs clenching, opening, and pinching actions, as well as the displacement D of the skin mesh vertex on the outer side of the joint along the bone normal direction. A is in degrees, and D is in millimeters. The two are weighted using K = 0.6 × A + 0.4 × D × 10 to obtain a comprehensive deformation value K. Using interphalangeal joints, metacarpophalangeal joints, and wrist joints as sampling points on the three-dimensional hand model, the K value of each sampling point is calculated frame by frame. A preset deformation threshold is set to 30. If the K value of a sampling point is greater than 30, the area corresponding to that sampling point is determined to be a high-strain area; if the K value is less than or equal to 30, the area corresponding to that sampling point is determined to be a low-strain area.

[0021] S103: For the high-strain zone and the low-strain zone, a random forest algorithm is used for feature classification to determine the wavy line structure corresponding to the high-strain zone and the straight line structure corresponding to the low-strain zone.

[0022] S103 specifically involves using strain monitoring slices of completed lines from historical engineering cases as training samples. For each sample, six features are extracted: mean strain, strain gradient, local peak-valley frequency, directional deflection angle, area aspect ratio, and boundary curvature. The actual measured line paving morphology is used as a label. Lines with a curvature radius less than 50m and exhibiting periodic undulations more than twice along the line are labeled as wavy, while those with a curvature radius greater than 200m and a directional deflection angle less than 5 degrees are labeled as linear. The total number of samples is no less than 2000, and the training samples are divided in a 7:3 ratio. The system consists of a decision set and a validation set. A random forest is set with 100 decision trees and a maximum depth of 12. The Gini coefficient is used as the splitting criterion. The probabilities p1 and p2 of each strain zone being classified as either wavy or linear are output. For high-strain zones, if p1 is not less than 0.6, the zone is classified as wavy; otherwise, it undergoes manual verification. For low-strain zones, if p2 is not less than 0.6, the zone is classified as linear; otherwise, it undergoes manual verification. Finally, the classification results are backfilled onto the route plan according to the region number, forming a structural distribution where high-strain zones correspond to wavy patterns and low-strain zones correspond to linear patterns.

[0023] S104: Obtain the wavy circuit structure and the straight circuit structure, match the first conductive paste according to the wavy circuit structure, and match the second conductive paste according to the straight circuit structure.

[0024] S104 specifically involves sampling the pre-fabricated wavy and straight circuit structures using a parameter calibrator. Target ductility a1 and target adhesion a2 are read from the wavy circuit structure, and target impedance b1 and target curing degree b2 are read from the straight circuit structure. All four parameters are linearly normalized to the 0-1 range according to their respective ranges. The a1 and a2 values ​​of the wavy circuit, along with the impedance and curing degree measured at the same measuring point, are combined to form the first attribute vector V1=[a1,a2,b1',b2']. The linear lines b1 and b2, along with the supplementary measured ductility and adhesion, are combined to form a second attribute vector V2 = [a1', a2', b1, b2]. Both vectors are four-dimensional. The preset slurry library is a collection of historical slurry data entered in batches. In addition to recording the amount of silver powder and resin, each candidate slurry sample is also linked to its measured ductility, adhesion, impedance value, and degree of cure on a standard test piece, and normalized according to the same rules to form a sample attribute vector Vs, which is also four-dimensional. The Euclidean distance calculation formula is used.

[0025] Calculate the first distance value d1 and the second distance value d2 between V1, V2 and each Vs respectively, set the distance threshold to 0.15, first screen out candidate samples below the threshold, and then select the smallest distance from the screening results to determine the first conductive paste and the second conductive paste respectively; if no sample is below the threshold, backtrack to take the global minimum distance sample and mark it with an alarm; then extract the first viscosity value n1 of the first conductive paste and the second viscosity value n2 of the second conductive paste, use n1 to match the printing station of the wavy line and n2 to match the printing station of the straight line, generate the target paste matching scheme and send it to the printing parameter scheduling module of the subsequent step S105 for process execution.

[0026] S105: Continuous printing is performed on a pre-established flexible substrate using the first conductive paste and the second conductive paste to obtain an initial conductive film containing different conductive materials.

[0027] S105 specifically involves: acquiring a first conductive paste and a second conductive paste; extracting the paste amounts corresponding to the first and second conductive pastes; determining the printing speed based on the paste amounts using a speed control model. This model takes the paste amount as input and outputs the corresponding printing speed value; the larger the paste amount, the lower the printing speed to ensure coating uniformity; acquiring the printing speed; continuously printing on a pre-established flexible substrate according to the printing speed to obtain an initial conductive film; extracting the film thickness and surface smoothness corresponding to the initial conductive film; acquiring the film thickness and surface smoothness; classifying the film thickness and surface smoothness using a support vector machine algorithm, with classification labels including high-quality film, qualified film, and defective film; obtaining the quality grade corresponding to the initial conductive film; extracting the corresponding typical roughness range and adhesion range based on the quality grade; acquiring roughness and adhesion; simultaneously measuring the sheet resistance of the initial conductive film; and calculating the resistivity corresponding to the initial conductive film based on the film thickness h and sheet resistance Rs. If the resistivity is greater than the preset resistance threshold of 0.5 milliohms·cm, the tension value and dryness of the initial conductive film are extracted. The tension value and dryness are then analyzed and predicted using a decision tree algorithm. The decision tree uses the tension value and dryness as feature inputs and outputs a predicted elongation value. A printing pressure is generated by querying a pressure mapping table based on the elongation. When the elongation is in the range of 2% to 5%, the corresponding printing pressure is 0.3 MPa to 0.6 MPa; when the elongation is greater than 5%, the corresponding printing pressure is 0.6 MPa to 0.9 MPa. The printing pressure is then obtained, and the initial conductive film is pressed and thermally cured according to the printing pressure to obtain the target conductive film. The curing rate corresponding to the target conductive film is extracted. The curing rate is used to determine whether a subsequent curing process is needed; a curing rate greater than 95% is considered a qualified product.

[0028] S106: Introduce a micro-wrinkled structure for the high-strain region of the initial conductive film to release the pre-strain of the high-strain region and obtain a hand-shaped integrated flexible conductive film.

[0029] S106 specifically involves: producing a hand-shaped curved surface mold from the three-dimensional hand model constructed in S101 based on the geometric features of the hand surface; using a hot-pressing process in the high-strain zone of the hand-shaped curved surface mold, attaching the initial conductive film to the mold at 120 to 160°C, so that the micro-fold structure forms a periodic arrangement along the strain direction, with a fold height of 50 to 200 micrometers and a fold spacing of 0.5 to 2 millimeters; by adjusting the hot-pressing time to 30 to 90 seconds and the pressure to 0.1 to 0.5 MPa, ensuring that the initial conductive film with the micro-fold structure is completely attached to the surface of the hand-shaped curved surface mold, and ensuring that the resistance change rate of the conductive layer is less than 15% when the finger is bent at 90 degrees, ultimately obtaining an integrated flexible conductive film that perfectly matches the geometric shape of the hand.

[0030] like Figures 3 to 5 The hand-shaped integrated printed flexible conductive film prepared by the method shown includes a flexible substrate layer, a wavy circuit structure, a straight circuit structure, and a micro-wrinkled structure.

[0031] The flexible substrate is shaped like a hand, with the palm area being a low-strain region and the finger area being a high-strain region.

[0032] A first conductive paste is printed in the low-strain region of the flexible substrate to form a first conductive paste layer, and a second conductive paste is printed in the high-strain region of the flexible substrate to form a second conductive paste layer. The first conductive paste layer and the second conductive paste layer form an integral initial conductive film.

[0033] The wavy circuit structure is set on the first slurry layer; the straight circuit structure is set on the second slurry layer.

[0034] The micro-fold structure is set on the first conductive paste layer and located at the joint of the finger area of ​​the initial conductive film to form a flexible conductive film.

[0035] Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the present invention. Various changes and modifications can be made to the present invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed.

Claims

1. A method for preparing a hand-shaped integrated printed flexible conductive film, characterized in that: The specific preparation method is as follows: S101: Acquire three-dimensional scanning data of the hand, process the three-dimensional scanning data of the hand using a support vector machine algorithm, extract the geometric features of the hand surface, and construct a three-dimensional model of the hand based on the geometric features of the hand surface; S102: Based on the three-dimensional model of the hand, extract the bending deformation data of the hand joints. If the bending deformation data of the hand joints is greater than a preset deformation threshold, the area corresponding to the bending deformation data of the hand joints is determined to be a high strain area. If the bending deformation data of the hand joints is less than or equal to the preset deformation threshold, the area corresponding to the bending deformation data of the hand joints is determined to be a low strain area. S103: For the high strain zone and the low strain zone, the random forest algorithm is used for feature classification to determine the wavy line structure corresponding to the high strain zone and the straight line structure corresponding to the low strain zone. S104: Obtain the wavy circuit structure and the straight circuit structure, match the first conductive paste according to the wavy circuit structure, and match the second conductive paste according to the straight circuit structure; S105: Continuous printing is performed on a pre-established flexible substrate using the first conductive paste and the second conductive paste to obtain an initial conductive film containing different conductive materials; S106: Introduce a micro-wrinkled structure for the high-strain region of the initial conductive film to release the pre-strain of the high-strain region and obtain a hand-shaped integrated flexible conductive film.

2. The method for preparing a hand-shaped integrated printed flexible conductive film according to claim 1, characterized in that: S101 specifically involves: acquiring three-dimensional hand scan data, organizing the point cloud data into an n×3 dimensional coordinate matrix as input, establishing a nonlinear mapping relationship using a radial basis kernel function through a support vector machine algorithm, using the hand joint protrusion region, fingertip region, and palm flat region as classification targets, constructing an optimal classification hyperplane to divide the point cloud into key geometric regions and non-key regions, outputting the region label of each point and its corresponding local curvature value, normal vector direction, and surface gradient geometric feature parameters, and constructing a three-dimensional hand model based on the aforementioned hand surface geometric features.

3. The method for preparing a hand-shaped integrated printed flexible conductive film according to claim 1, characterized in that: S102 specifically involves: extracting hand joint bending deformation data based on the three-dimensional hand model. The hand joint bending deformation data refers to the change A of the angle formed by adjacent bone segments on both sides of each joint relative to the natural extended state when the hand completes the actions of clenching, opening, and pinching, as well as the displacement D of the vertices of the skin mesh on the outer side of the joint along the bone normal direction. The unit of A is degrees, and the unit of D is millimeters. The two are weighted by K=0.6×A+0.4×D×10 to obtain the comprehensive deformation value K. On the 3D model of the hand, the interphalangeal joints, metacarpophalangeal joints, and wrist joints are used as sampling points. The K value of each sampling point is calculated frame by frame. The preset deformation threshold is set to 30. If the K value of a sampling point is greater than 30, the area corresponding to the sampling point is determined to be a high strain area. If the K value is less than or equal to 30, the area corresponding to the sampling point is determined to be a low strain area.

4. The method for preparing a hand-shaped integrated printed flexible conductive film according to claim 1, characterized in that: S103 specifically involves using strain monitoring slices of completed lines from historical engineering cases as training samples. For each sample, six features are extracted: mean strain, strain gradient, local peak-valley frequency, directional deflection angle, area aspect ratio, and boundary curvature. The actual measured line laying morphology is used as a label. Lines with a curvature radius less than 50m and exhibiting periodic undulations more than twice along the line are labeled as wavy, while those with a curvature radius greater than 200m and a directional deflection angle less than 5 degrees are labeled as linear. The total number of samples is no less than 2000, and they are divided into training samples in a 7:3 ratio. Training and validation sets were used. The random forest was set with 100 decision trees and a maximum depth of 12. The Gini coefficient was used as the splitting criterion to output the probabilities p1 and p2 of each strain zone belonging to the wavy or linear type. For high strain zones, if p1 is not less than 0.6, it is judged as wavy; otherwise, it is manually reviewed. For low strain zones, if p2 is not less than 0.6, it is judged as linear; otherwise, it is manually reviewed. Finally, the classification results were backfilled into the route plan according to the region number to form a structural distribution of high strain zones corresponding to wavy type and low strain zones corresponding to linear type.

5. The method for preparing a hand-shaped integrated printed flexible conductive film according to claim 1, characterized in that: S104 specifically involves: sampling the pre-fabricated wavy and straight circuit structures using a parameter calibrator; reading the target ductility a1 and target adhesion a2 from the wavy circuit structure, and reading the target impedance value b1 and target curing degree b2 from the straight circuit structure; linearly normalizing all four parameters to the 0-1 range according to their respective ranges; and combining a1, a2 of the wavy circuit structure with the impedance and curing degree measured at the same measuring point to form a first attribute vector V1=[a1,a2,b1',b2']. The linear lines b1 and b2, along with the supplementary measured ductility and adhesion, are combined to form a second attribute vector V2 = [a1', a2', b1, b2]. Both vectors are four-dimensional. The preset slurry library is a collection of historical slurry data entered in batches. In addition to recording the amount of silver powder and resin, each candidate slurry sample is also linked to its measured ductility, adhesion, impedance value, and degree of cure on a standard test piece, and normalized according to the same rules to form a sample attribute vector Vs, which is also four-dimensional. The Euclidean distance calculation formula is used. ； Calculate the first distance value d1 and the second distance value d2 between V1, V2 and each Vs respectively. Set the distance threshold to 0.

15. First, screen out the candidate samples below the threshold. Then, select the smallest distance from the screening results and determine them as the first conductive paste and the second conductive paste respectively. If no sample is below the threshold, backtrack to retrieve the global minimum distance sample and mark it with an alarm. Then, extract the first viscosity value n1 of the first conductive paste and the second viscosity value n2 of the second conductive paste. Use n1 to match the printing station of the wavy line and n2 to match the printing station of the straight line to generate a target paste matching scheme and send it to the printing parameter scheduling module of the subsequent step S105 for process execution.

6. The method for preparing a hand-shaped integrated printed flexible conductive film according to claim 1, characterized in that: S105 specifically involves: obtaining a first conductive paste and a second conductive paste, extracting the paste amounts corresponding to the first conductive paste and the second conductive paste, and determining the printing speed based on the paste amounts using a speed control model. This model takes the paste amount as input and outputs the corresponding printing speed value. The larger the paste amount, the lower the printing speed to ensure coating uniformity. The printing speed is obtained, and continuous printing is performed on a pre-established flexible substrate at the specified speed to obtain an initial conductive film. The film thickness and surface smoothness corresponding to the initial conductive film are extracted. The film thickness and surface smoothness are then classified using a support vector machine algorithm, with classification labels including high-quality film, qualified film, and defective film, to obtain the quality grade corresponding to the initial conductive film. Based on the quality grade, the corresponding typical roughness range and adhesion range are extracted. Roughness and adhesion are obtained, and the sheet resistance of the initial conductive film is measured simultaneously. The resistivity corresponding to the initial conductive film is calculated based on the film thickness h and sheet resistance Rs. If the resistivity is greater than the preset resistance threshold of 0.5 milliohms·cm, the tension value and dryness of the initial conductive film are extracted. The tension value and dryness are then analyzed and predicted using a decision tree algorithm. The decision tree uses the tension value and dryness as feature inputs and outputs a predicted elongation value. A printing pressure is generated by querying a pressure mapping table based on the elongation. When the elongation is in the range of 2% to 5%, the corresponding printing pressure is 0.3 MPa to 0.6 MPa; when the elongation is greater than 5%, the corresponding printing pressure is 0.6 MPa to 0.9 MPa. The printing pressure is then obtained, and the initial conductive film is pressed and thermally cured according to the printing pressure to obtain the target conductive film. The curing rate corresponding to the target conductive film is extracted. The curing rate is used to determine whether a subsequent curing process is needed; a curing rate greater than 95% is considered a qualified product.

7. The method for preparing a hand-shaped integrated printed flexible conductive film according to claim 1, characterized in that: S106 specifically involves: producing a hand-shaped curved surface mold from the three-dimensional hand model constructed in S101 based on the geometric features of the hand surface; using a hot-pressing process in the high-strain zone of the hand-shaped curved surface mold, attaching the initial conductive film to the mold at 120 to 160°C, so that the micro-fold structure forms a periodic arrangement along the strain direction, with a fold height of 50 to 200 micrometers and a fold spacing of 0.5 to 2 millimeters; by adjusting the hot-pressing time to 30 to 90 seconds and the pressure to 0.1 to 0.5 MPa, ensuring that the initial conductive film with the micro-fold structure is completely attached to the surface of the hand-shaped curved surface mold, and ensuring that the resistance change rate of the conductive layer is less than 15% when the finger is bent at 90 degrees, ultimately obtaining a hand-shaped integrated flexible conductive film that perfectly matches the geometric shape of the hand.

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