PCB-free embedded cold plate component integration structure and manufacturing method thereof

Abstract

The application discloses a PCB-plate-embedded cold plate component integrated structure and a manufacturing method thereof, relates to the technical field of component integration and heat management, and aims to solve the problems of poor heat dissipation, redundant structure, low reliability and limited integrated density of the existing technology based on the PCB-plate integrated mode. The device comprises a cold plate body, a micro-channel heat dissipation flow channel integrated in the cold plate body, a component embedding cavity provided on the cold plate body and provided with an insulating layer on the inner wall, and an electrical connection channel processed in the cold plate body and provided with a reference ground plane or a shielding structure for restraining electromagnetic fields and suppressing crosstalk, so as to ensure the high-speed signal integrity. The wall thickness of the cold plate body between the component embedding cavity and the micro-channel heat dissipation flow channel is 1-3 mm. The core computing power components are directly embedded in the component embedding cavity of the cold plate body, so that the heat dissipation efficiency, integrated density and reliability are greatly improved. The application can be used for high-computing-power component integration and heat management.

Description

Technical Field

[0001] This invention relates to the field of component integration and thermal management technology for high-performance computing devices, specifically to a PCB-free embedded cold plate component integration structure and its manufacturing method. Background Technology

[0002] With the explosive growth in demand for space computing power, space computing satellites need to integrate a large number of high-performance computing components (such as CPUs, GPUs, and ASIC chips). These components have high power density and require urgent heat dissipation. Current methods for integrating components in space computing satellites generally rely on printed circuit boards (PCBs) as the carrier, which presents the following technical problems:

[0003] I. Heat dissipation bottleneck: The thermal conductivity of PCB board is low (the thermal conductivity of conventional FR-4 material is only 0.2-0.3W / (m·K)). The heat generated by the components must first be conducted to the PCB through the solder pads, and then transferred from the PCB to the cold plate. The high thermal resistance can easily lead to high temperature failure of components, which limits the improvement of computing power density.

[0004] 2. Structural redundancy: The PCB board itself occupies the effective space of the satellite and requires additional fixing structures and connectors to connect the cold plate, which increases the weight of the satellite and the assembly complexity.

[0005] III. Reliability Risks: Micro-vibrations and high / low temperature cycles in the space environment can easily lead to solder joint fatigue, poor contact, or even PCB warping and deformation at the connection points between the PCB board and the cold plate, affecting the stability of the electrical connection of components.

[0006] IV. Integration Density Limitations: The number of wiring layers and pin spacing on the PCB board limit the integration density of components, making it difficult to meet the core requirements of "lightweight, high density, and high reliability" for space computing satellites.

[0007] In summary, existing PCB-based integration methods are no longer suitable for the development trend of high computing power, high reliability, and miniaturization in space computing satellites. There is an urgent need for a component integration and heat dissipation solution that breaks through the limitations of PCB boards. Summary of the Invention

[0008] This invention aims to overcome the shortcomings of existing technologies by providing a PCB-free embedded cold plate component integration structure and its manufacturing method, thereby solving the problems of poor heat dissipation, structural redundancy, low reliability, and limited integration density mentioned in the background art. This structure achieves direct integration of components with the cold plate, combining high thermal conductivity, lightweight, high reliability, and high density.

[0009] To achieve the above objectives, the present invention provides the following technical solution:

[0010] In a first aspect, the present invention provides a PCB-free embedded cold plate component integration structure, comprising:

[0011] The cold plate body is made of a high thermal conductivity metal material, and microchannel heat dissipation channels are integrated within the cold plate body.

[0012] At least one component mounting cavity is formed on the cold plate body for mounting core computing power components; the inner wall of the component mounting cavity is provided with an insulating layer;

[0013] An electrical connection channel is directly machined inside the cold plate body to replace the wiring function of the printed circuit board; one end of the electrical connection channel is electrically connected to the pin of the core computing power component embedded in the component mounting cavity, and the other end extends to the edge of the cold plate body.

[0014] The electrical connection channel has a reference ground plane structure or shielding structure for confining electromagnetic fields and suppressing crosstalk to ensure the integrity of high-speed signals.

[0015] The wall thickness of the cold plate body formed between the component mounting cavity and the microchannel heat dissipation channel is 1-3mm.

[0016] Furthermore, the reference ground plane structure is a stripline structure, which includes a signal line groove formed in the cold plate body and a grounding metal encapsulation cover plate covering the signal line groove. The signal line groove and the grounding metal encapsulation cover plate together form the upper and lower reference ground planes.

[0017] Furthermore, the reference ground plane structure is a grounded coplanar waveguide structure, which includes a signal line slot formed in the body of the cold plate. The metal of the cold plate body is retained on both sides of the signal line slot as a ground plane, and a precise gap is formed between the ground plane and the side wall of the signal line slot.

[0018] Furthermore, the shielding structure is a micro-coaxial structure, which includes a coaxial line embedded in the body of the cold plate with an outer insulating layer, and the outer conductor of the coaxial line is electrically connected to the body of the cold plate.

[0019] Furthermore, it also includes a flexible conductive stress relief structure, which is connected between the pins of the core computing power component and the electrical connection channel, and its shape is Ω-shaped, S-shaped or serpentine.

[0020] Furthermore, the material of the cold plate body is an aluminum silicon carbide composite material.

[0021] Furthermore, it also includes: a sealing structure disposed at the edge of the component mounting cavity, the sealing structure including a positioning pin hole and a sealing groove, the sealing groove being filled with aerospace-grade high-temperature resistant sealant; and / or

[0022] The bus interface is located at the edge of the cold plate body and is connected to an external bus. The bus interface integrates a 360° circumferential shielding structure.

[0023] Furthermore, the core computing power components are packages of CPU, GPU, or ASIC chips.

[0024] Furthermore, the surface of the cold plate body is also provided with surface conductive lines for mounting auxiliary components, and the surface conductive lines have an insulating protective layer.

[0025] Secondly, the present invention also provides a method for manufacturing the PCB-free embedded cold plate component integration structure as described above, comprising the following steps:

[0026] S1. Preparation of the cold plate body: Aluminum silicon carbide composite material is selected to process the component mounting cavity, microchannel heat dissipation channel, electrical connection channel and surface conductive line, and an insulating layer is sprayed on the inner wall of the component mounting cavity. Positioning pin holes and sealing grooves are processed on the edge of the component mounting cavity. Bus interface is set on the edge of the cold plate body.

[0027] S2. Pre-processing components: Gold plating is performed on the pins of the core computing power components;

[0028] S3. Embedding and Connection: The core computing power components are embedded in the component embedding cavity, and their pins are aligned with the electrical connection channel through a flexible conductive stress relief structure of Ω-type, S-type or serpentine bend, and reflow soldering is performed using aerospace-grade lead-free solder;

[0029] S4. Fixing and sealing: Insert the positioning pin into the positioning pin hole, fill the sealing groove with aerospace-grade high-temperature resistant sealant and cure it;

[0030] S5. Surface integration: Auxiliary components are mounted on the surface of the cold plate body, and electrical connections are achieved through surface conductive lines on the surface of the cold plate body;

[0031] S6. Testing: Perform electrical continuity testing, insulation resistance testing, and thermal resistance testing on the installed components.

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] 1) Significantly improved heat dissipation performance: Since the components are in direct contact with the high thermal conductivity cold plate, the thermal resistance is reduced by more than 60% compared with the PCB solution, which can support the power density of computing components to be increased to more than 50W / cm², avoiding high temperature failure in the space environment.

[0034] 2) Lightweight and miniaturized: By eliminating the PCB board and related adapters and fixing structures, the weight of the computing module is reduced by 30%-40%, the volume is reduced by 25%-35%, and the effective payload ratio is increased;

[0035] 3) Significantly improved signal integrity and reliability: By constructing a three-dimensional transmission line, adding stress relief structure and integrating entry filter, not only are the risks of PCB warpage and solder joint fatigue eliminated, but thermomechanical stress is also decoupled in the full temperature range (-50℃-125℃), and the eye diagram quality and low crosstalk of high-speed signals are guaranteed. The overall mean time between failures (MTBF) is increased to more than 100,000 hours.

[0036] 4) Excellent electromagnetic compatibility: The integrated shielding and filtering design makes this integrated module an independent electromagnetic compatibility unit, which does not interfere with other equipment on the satellite and also has excellent anti-interference capabilities.

[0037] 5) Higher integration density: The layout of conductive lines inside the cold plate is not limited by the number of PCB wiring layers or pin spacing, and can realize three-dimensional embedding of components (such as multi-layer component embedding cavity), increasing the integration density of computing components by more than 50%.

[0038] 6) Adaptable to extreme space environments: The sealed structure and insulation treatment of the cold plate body can adapt to the vacuum, strong radiation and high and low temperature alternating environments of space, without the need for additional protective structures. Attached Figure Description

[0039] Figure 1 Axonometric drawing of an integrated structure of embedded cold-plate components without a PCB board;

[0040] Figure 2 This is a schematic diagram of the internal structure of the cold plate;

[0041] Figure 3 A magnified view of the internal structure of the cold-rolled steel plate.

[0042] Figure 4 This is a schematic diagram of a flexible conductive stress relief structure.

[0043] Figure 5 A schematic diagram of EMC design for the bus interface.

[0044] Reference numerals: 100-Cold plate body; 101-Microchannel heat dissipation channel; 102-Component mounting cavity; 103-Flange interface; 104-Electrical connection channel; 105-Positioning pin hole; 106-Sealing groove; 107-Surface conductive line; 108-Flexible conductive stress relief structure; 109-Bottom filler adhesive; 110-Copper pin post array; 200-Core computing power component; 300-Bus interface; 301-Conductive gasket; 302-Feedthrough capacitor or feedthrough filter; 303-Interface ground; 304-Internal digital ground; 305-Cold plate integrated filter array; 400-External bus. Detailed Implementation

[0045] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0046] like Figures 1 to 5 As shown, the present invention provides a PCB-free embedded cold plate component integration structure, including a cold plate body 100.

[0047] The cold plate body 100 is integrally formed from aluminum silicon carbide (AlSiC) composite material. This material has a thermal conductivity as high as 180 W / (m·K) and a coefficient of thermal expansion (CTE) matching that of silicon chips, enabling it to adapt well to the alternating high and low temperature environment of space. The overall dimensions of the cold plate body 100 are preferably 200mm × 150mm × 30mm. This size is determined based on the external dimensions of the core computing components 200, the layout of the component mounting cavities 102, and the available space. The 200mm and 150mm thicknesses can accommodate one or more GPU chips and their auxiliary circuitry, while the 30mm thickness ensures structural strength while providing sufficient processing space for the microchannel heat dissipation channels 101 and electrical connection channels 104. Of course, the overall dimensions of the cold plate body 100 can be adjusted according to the actual application scenario. Figure 2 As shown, the cold plate body 100 has microchannel heat dissipation channels 101 internally machined for the flow of cooling fluid. The microchannel heat dissipation channels 101 are serpentine in shape, providing a large heat exchange area and low flow resistance, enabling efficient heat dissipation within a limited space. The diameter of the microchannel heat dissipation channels 101 is preferably 2mm, which ensures sufficient cooling fluid flow rate and heat exchange area while maintaining structural strength. The total length is preferably 1.5m, maximizing the heat exchange time between the cooling fluid and the cold plate body within the limited space, thereby improving heat dissipation efficiency. The inlet and outlet of the microchannel heat dissipation channels 101 are equipped with 8mm diameter flange interfaces 103 for docking with external liquid cooling circulation systems. An 8mm diameter is a commonly used interface size in aerospace liquid cooling systems, ensuring cooling fluid flow rate and velocity while also considering the mechanical strength and sealing reliability of the interface, enabling rapid and reliable docking with external liquid cooling circulation systems.

[0048] like Figure 1 As shown, on the cold plate body 100, a component mounting cavity 102 is precisely machined according to the shape and pin layout of the core computing power component 200 (e.g., the NVIDIA A100 GPU package). The inner wall of the component mounting cavity 102 is coated with an insulating layer, preferably 100μm thick, made of alumina ceramic to prevent short circuits. The 100μm thickness is chosen to ensure insulation performance without significantly affecting heat conduction efficiency; too thin a layer may result in insufficient insulation, while too thick a layer increases thermal resistance. The wall thickness between the component mounting cavity 102 and the underlying microchannel heat dissipation channel 101 is strictly controlled at 2mm to ensure an optimal heat conduction path. 1-3mm is the preferred range after comprehensively considering structural strength and thermal conductivity; 2mm is the balance point, as too thick a layer increases thermal resistance, while too thin a layer reduces structural strength. The component mounting cavity 102 has a positioning pin hole 105 and a sealing groove 106 machined on its edge to fit the positioning pin and aerospace-grade high-temperature resistant sealant, ensuring the accuracy and sealing of the component mounting.

[0049] The key innovation of this invention lies in the fact that it abandons the traditional PCB board and directly processes the electrical connection channel 104 for high-speed signal transmission inside the cold plate body 100 (e.g., Figure 2 (As shown). The width of the conductive line groove is preferably 0.2 mm. This width is determined according to the characteristic impedance matching requirements of high-frequency signals, ensuring signal transmission quality while matching the spacing of chip pins. The depth is preferably 0.1 mm. This depth allows for signal wiring within the limited space inside the cold plate body, while ensuring that the conductor has sufficient cross-sectional area to reduce signal transmission loss and meet the transmission requirements of high-frequency signals. An insulating layer is provided between the conductive line groove and the cold plate body 100. This insulating layer can be made of polyimide film or LCP film, and the thickness is preferably 10-50 μm. 10 μm is the minimum thickness to ensure sufficient insulation strength in a vacuum environment, preventing breakdown due to potential difference between the cold plate body and the signal line. 50 μm is the upper limit. Excessive thickness will increase thermal resistance and occupy internal space of the cold plate, affecting heat dissipation and wiring density, thus preventing short circuits between the signal line and the cold plate body.

[0050] In this embodiment, the present invention provides a variety of high-frequency transmission line structure options for signals of different frequencies:

[0051] Firstly, for general high-speed signals, a stripline structure is adopted: signal line slots are processed in the cold plate body 100, and a grounded metal encapsulation cover plate (not shown) is covered on top of it, which together with the cold plate body 100 forms a complete upper and lower reference ground plane, constraining the signal line between them.

[0052] Secondly, for medium-frequency signals, a grounded coplanar waveguide structure is adopted: the metal of the cold plate body 100 is retained on both sides of the signal line slot as a ground plane, forming a small gap with the side wall of the signal slot to achieve tight coupling.

[0053] Third, for extremely high frequency signals, a micro coaxial structure is adopted: instead of filling the line slot with conductors, an extremely thin coaxial line covered with a polyimide insulating layer is directly embedded, and its outer conductor is reliably connected to the grounding layer of the cold plate body 100 to achieve full-enclosed shielding.

[0054] In addition, for sensitive parallel signals, a grounded shield wall isolation structure can be added: independent grounding slots are processed between parallel signal slots, filled with conductors and connected to the cold plate ground plane at multiple points to form a physical isolation barrier, effectively suppressing crosstalk.

[0055] For the various signal transmission structures described above, the conductor filling the line slot can be made of smooth rolled copper foil or silver-plated copper strip to reduce high-frequency losses due to the skin effect; the insulating medium is preferably a low-loss, dielectrically stable liquid crystal polymer (LCP) film or a uniform polyimide film. The conductivity of the conductive silver paste filling the slot is preferably ≥5×10⁻⁶. 5 S / m, 5×10 5 S / m is the minimum conductivity threshold required to ensure high-frequency signal transmission. It is determined based on the characteristic impedance matching requirements of high-frequency transmission lines and the reliability standards of aerospace-grade components. It ensures that the signal attenuation during transmission is controlled within an acceptable range to guarantee conductivity performance.

[0056] To cope with the severe temperature cycling from -50°C to 125°C in the space environment, this invention introduces a systematic design to resist thermal mismatch stress. For example... Figure 4 As shown, between the pins of the core computing power component 200 and the electrical connection channel 104 of the cold plate body 100:

[0057] First, the cold plate body 100 itself is made of aluminum silicon carbide composite material, whose CTE matches the silicon chip, reducing thermal mismatch from the source. When the core computing power component 200 needs to be connected to the aluminum alloy structure, a transition gasket made of Kovar alloy or tungsten copper alloy can be added between the chip and the aluminum alloy to form a gradient of thermal expansion coefficient and smoothly transition thermal stress.

[0058] Secondly, the chip is not directly soldered to the bottom of the slot, but is connected to the contacts inside the slot through a copper pin array 110 of a specific height. The copper pin array 110 itself absorbs stress due to its aspect ratio. The height of the copper pin array 110 is preferably 0.5-2mm, which provides sufficient flexibility to absorb stress without affecting the stability of the electrical connection.

[0059] Simultaneously, a flexible copper foil strip in an "Ω" shape is forcibly designed as a flexible conductive stress relief structure 108 (e.g., Figure 4 As shown in the figure, it efficiently absorbs thermomechanical stress in three dimensions and completely decouples and protects the chip pads.

[0060] Lead soldering utilizes high-lead solder or nano-silver paste with viscoplastic creep properties to release stress flexibly. After soldering, an underfill adhesive 109 matching its CTE is injected onto the bottom of the chip (e.g., ...). Figure 3 As shown in the figure, it evenly disperses and reduces the shear stress borne by the weld joint.

[0061] like Figure 1 and Figure 5 As shown, a bus interface 300 is provided on the edge of the cold plate body 100. This bus interface 300 integrates a complete electromagnetic compatibility (EMC) design, specifically including the following four parts:

[0062] First, 360° circumferential shielding: The grounding pins of the bus interface 300 and the shielding layer of the incoming cable are connected to the cold plate body 100 in a 360° circumferential low-impedance manner through conductive pads 301, spring clips, or direct soldering. All signals and power supplies are grounded the shielding layer the instant they enter the cold plate body 100.

[0063] Second, the feedthrough filter network: After the signal pin enters the cold plate body 100, it is immediately connected to the internal signal transmission line through the integrated feedthrough capacitor or feedthrough filter 302, and the common-mode or differential-mode interference transmitted along the conductor is filtered out at the physical entrance.

[0064] Third, layered grounding and single-point bridging: an independent "interface ground 303" copper area is divided in the bus interface 300 entry area. This area is connected to the internal digital ground 304 through a single-point bridging to prevent external interference current from spreading over long distances on the ground plane.

[0065] Fourth, cold plate integrated filter array: auxiliary grooves are machined near the entrance section of the signal line slot, embedding sheet ferrite beads and three-terminal capacitors, which are then welded to the conductors inside the slot to form an LC low-pass filter. For the power bus, a high dielectric constant ceramic substrate and the cold plate body 100 are used to form a planar feedthrough filter array.

[0066] Through the above-mentioned quadruple electromagnetic compatibility design, external interference is effectively suppressed, making the integrated module an independent electromagnetic compatibility unit.

[0067] In addition, the surface of the cold plate body 100 is also provided with surface conductive lines 107 (also with an insulating layer). Non-core auxiliary components (such as capacitors and resistors) can be directly mounted on the surface of the cold plate body 100 and electrically interconnected through the surface conductive lines 107, further improving the integration density.

[0068] The manufacturing method provided by the present invention will be described in detail below with reference to the above structural description.

[0069] like Figures 1 to 5 As shown, the present invention also provides a method for manufacturing the above-mentioned PCB-free embedded cold plate component integration structure, comprising the following steps:

[0070] S1. Fabrication of the cold plate body 100: Using aluminum-silicon carbide composite material, a component mounting cavity 102, microchannel heat dissipation channels 101, electrical connection channels 104, and surface conductive lines 107 are formed on the cold plate body 100 through precision machining (machining accuracy controlled within ±0.01mm). A 100μm thick alumina ceramic insulating layer is sprayed onto the inner wall of the component mounting cavity 102. Positioning pin holes 105 and sealing grooves 106 are machined at the edge of the component mounting cavity 102. A bus interface 300 is provided at the edge of the cold plate body 100.

[0071] S2. Pre-processing of components: The pins of the core computing component 200 are gold-plated (5μm thick) to improve conductivity and corrosion resistance. The 5μm plating thickness is chosen to ensure conductivity and corrosion resistance without increasing costs excessively; too thin a layer may not adequately protect the pins, while too thick a layer increases manufacturing complexity. The electrical contact points within the component mounting cavity 102 are also gold-plated to reduce contact resistance.

[0072] S3. Embedding and Connection: The core computing component 200 is embedded in the component embedding cavity 102, and its pins are aligned with the electrical connection channel 104 through the Ω-shaped, S-shaped, or serpentine flexible conductive stress relief structure 108. Reflow soldering is performed using aerospace-grade lead-free solder (Sn-3.0Ag-0.5Cu) to achieve electrical connection between the pins and the electrical connection channel 104. This composition is a typical formula for aerospace-grade lead-free solder, exhibiting good soldering performance and reliability. The peak temperature of reflow soldering is controlled at 230-250℃, and the preheating temperature is 150-180℃.

[0073] S4. Fixing and Sealing: Insert the locating pin into the locating pin hole 105, fill the sealing groove 106 with aerospace-grade high-temperature resistant sealant (such as Dow Corning 995 silicone rubber), and cure at 80°C for 2 hours to ensure the mechanical connection strength and sealing performance between the component and the cold plate body 100. The reason for choosing 80°C for 2 hours of curing is that under this temperature and time condition, Dow Corning 995 silicone rubber can be fully cured without damaging the component.

[0074] S5. Surface integration: Auxiliary components are mounted on the surface of the cold plate body 100, and electrical connections are achieved through the surface conductive lines 107 on the surface of the cold plate body 100. A polyimide protective film is then covered on the surface as an insulating protective layer.

[0075] S6. Testing: Perform electrical continuity testing (continuity resistance ≤ 0.01Ω) and insulation resistance testing (insulation resistance ≥ 10Ω) on the installed components. 9 The electrical connection is tested for on-resistance (≤0.01Ω) and thermal resistance (≤0.1℃ / W from chip junction to cold plate channel) to ensure reliable electrical connection and unobstructed heat dissipation path. The selection criteria for these test parameters are: on-resistance ≤0.01Ω is the low resistance requirement for aerospace-grade electrical connections; insulation resistance ≥10Ω... 9 Ω represents the minimum requirement for aerospace-grade insulation performance; thermal resistance ≤0.1℃ / W is a typical indicator for high-performance heat dissipation structures, and values ​​higher than this may not meet the heat dissipation requirements of high-performance computing chips.

[0076] It should be noted that for computing components with higher power consumption, the material of the cold plate body 100 can be replaced with oxygen-free copper, which has a thermal conductivity as high as 401 W / (m·K), providing stronger heat dissipation capabilities. The selection of oxygen-free copper is based on its extremely high thermal conductivity, making it suitable for ultra-high power consumption scenarios. However, its CTE differs significantly from that of silicon chips, requiring the use of a stress-relieving structure. Furthermore, for multi-chip integration scenarios, multi-layer component mounting cavities 102 can be designed on the cold plate body 100 to achieve three-dimensional computing component integration, further increasing integration density by more than 50%. The conductive lines can be replaced with flexible copper foil, and the microchannel heat dissipation channel 101 can be replaced with a micro-pin rib structure (the micro-pin rib structure further improves heat dissipation efficiency by increasing the heat dissipation area, adapting to ultra-high frequency computing chips), all of which can be modified according to actual needs.

[0077] Through the above design, the present invention successfully realizes the direct integration of components and cold plate, which has the characteristics of high thermal conductivity, lightweight, high reliability and high density, and is perfect for the extreme working environment of high computing power equipment.

[0078] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A PCB-free embedded cold plate component integration structure, characterized in that, include: The cold plate body (100) is made of a high thermal conductivity metal material, and the cold plate body (100) integrates a microchannel heat dissipation channel (101). At least one component mounting cavity (102) is provided on the cold plate body (100) for mounting core computing power components (200); the inner wall of the component mounting cavity (102) is provided with an insulating layer; An electrical connection channel (104) is directly machined inside the cold plate body (100) to replace the wiring function of the printed circuit board; one end of the electrical connection channel (104) is electrically connected to the pin of the core computing power component (200) embedded in the component mounting cavity (102), and the other end extends to the edge of the cold plate body (100). The electrical connection channel (104) has a reference ground plane structure or shielding structure for confining the electromagnetic field and suppressing crosstalk to ensure the integrity of high-speed signals. The wall thickness of the cold plate body (100) formed between the component mounting cavity (102) and the microchannel heat dissipation channel (101) is 1-3 mm.

2. The PCB-free embedded cold plate component integration structure according to claim 1, characterized in that, The reference ground plane structure is a stripline structure, which includes a signal line groove opened in the cold plate body (100) and a grounding metal encapsulation cover plate covering the signal line groove. The signal line groove and the grounding metal encapsulation cover plate together form the upper and lower reference ground planes.

3. The PCB-free embedded cold plate component integration structure according to claim 1, characterized in that, The reference ground plane structure is a grounded coplanar waveguide structure, which includes a signal line slot opened in the cold plate body (100). The metal of the cold plate body (100) is retained on both sides of the signal line slot as a ground plane, and a precise gap is formed between the ground plane and the side wall of the signal line slot.

4. The PCB-free embedded cold plate component integration structure according to claim 1, characterized in that, The shielding structure is a micro-coaxial structure, which includes a coaxial line with an outer insulating layer embedded in the cold plate body (100), and the outer conductor of the coaxial line is electrically connected to the cold plate body (100).

5. The PCB-free embedded cold plate component integration structure according to claim 1, characterized in that, It also includes a flexible conductive stress relief structure (108), which is connected between the pin of the core computing power component (200) and the electrical connection channel (104), and its shape is Ω-shaped, S-shaped or serpentine.

6. The PCB-free embedded cold plate component integration structure according to claim 1, characterized in that, The material of the cold plate body (100) is aluminum silicon carbide composite material.

7. The PCB-free embedded cold plate component integration structure according to claim 1, characterized in that, Also includes: A sealing structure is disposed at the edge of the component mounting cavity (102), the sealing structure including a positioning pin hole (105) and a sealing groove (106), the sealing groove (106) being filled with aerospace-grade high-temperature resistant sealant; and / or A bus interface (300) is located on the edge of the cold plate body (100) and connected to an external bus (400). The bus interface (300) integrates a 360° circumferential shielding structure.

8. The PCB-free embedded cold plate component integration structure according to claim 1, characterized in that, The core computing power component (200) is a package of a CPU, GPU, or ASIC chip.

9. The PCB-free embedded cold plate component integration structure according to claim 1, characterized in that, The surface of the cold plate body (100) is also provided with surface conductive lines (107) for mounting auxiliary components, and the surface conductive lines (107) have an insulating protective layer.

10. A method for manufacturing a PCB-free embedded cold plate component integration structure as described in any one of claims 1 to 9, characterized in that, Includes the following steps: S1. Preparation of cold plate body (100): Select aluminum silicon carbide composite material, process the component mounting cavity (102), microchannel heat dissipation channel (101), electrical connection channel (104) and surface conductive line (107), spray an insulating layer on the inner wall of the component mounting cavity (102), process the positioning pin hole (105) and sealing groove (106) on the edge of the component mounting cavity (102), and process the bus interface (300) on the edge of the cold plate body (100). S2. Pre-processing components: Gold plating is performed on the pins of the core computing power components (200); S3. Embedding and connection: The core computing power component (200) is embedded in the component embedding cavity (102), and its pins are aligned with the electrical connection channel (104) through the Ω-shaped, S-shaped or serpentine flexible conductive stress relief structure (108), and reflow soldering is performed using aerospace-grade lead-free solder; S4. Fixing and sealing: Insert the positioning pin into the positioning pin hole (105), fill the sealing groove (106) with aerospace-grade high-temperature resistant sealant and cure it; S5. Surface integration: Auxiliary components are mounted on the surface of the cold plate body (100) and electrically connected through the surface conductive lines (107) on the surface of the cold plate body (100); S6. Testing: Perform electrical continuity testing, insulation resistance testing, and thermal resistance testing on the installed components.

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