Method for processing the shape of a printed circuit board, printed circuit board and related device

Abstract

This application discloses a method for processing the outline of a printed circuit board, a printed circuit board, and related apparatus, including: obtaining the target outline dimensions of multiple processing units in the printed circuit board; processing a set of opposite edges of the processing units to form a first set of outline edges corresponding to the target outline dimensions; performing mechanical depth-controlled cutting on a first surface of the processing unit to form a pre-cut groove for retaining the bottom connection layer; and performing laser cutting on the second surface opposite the first surface to form a second set of outline edges corresponding to the target outline dimensions, thereby obtaining a printed circuit board that meets the target outline dimensions. By combining mechanical depth-controlled cutting on the first surface with laser cutting on the second surface, the final cutting stage of the board is transformed from high-cutting-force mechanical processing to low-force laser processing, reducing the stress and displacement risks of ultra-small-sized boards during the cutting process, thus meeting the requirements for dimensional accuracy.

Description

Technical Field

[0001] This application relates to the field of printed circuit board technology, and in particular to a method for processing the outline of a printed circuit board, a printed circuit board, and related apparatus. Background Technology

[0002] As PCBA electronic assembly continues to evolve towards higher integration and miniaturization, customers are placing higher demands on the size, thickness, and shape accuracy of printed circuit board products. Especially in some ultra-small products, the finished printed circuit board must meet design requirements of both length and width less than 2.5mm, thickness greater than 3.0mm, and shape accuracy of ±0.05mm. For such thick, small-sized, high-precision printed circuit boards, existing shape processing technologies present significant challenges in terms of processing fixation and dimensional control.

[0003] In current printed circuit board (PCB) shaping processes, for products with internal positioning holes, they are typically fixed using these holes and auxiliary fixtures, and the shaping is completed by mechanical cutting. For products without internal positioning holes, two sides are typically machined first, and then the product unit is further fixed by applying adhesive tape to the entire board before machining the remaining two sides. For products of a certain size, the large contact area between the adhesive tape and the product unit provides a certain degree of adhesion, thus counteracting the cutting force generated by the milling cutter rotation during subsequent machining.

[0004] However, when the length and width dimensions of the finished printed circuit board are both less than 2.5mm, the effective contact area between the tape and the product unit is significantly reduced due to the small product unit area. This results in insufficient adhesive force from the tape, making it difficult to counteract the cutting force generated by the milling cutter rotation during the shaping process. This can easily lead to product unit displacement, processing deviation, and loss of shape accuracy control. Therefore, existing mechanical shaping methods that rely on positioning holes or tape-assisted fixing are unsuitable for printed circuit board products with no positioning holes, extremely small finished dimensions, and large board thickness. Summary of the Invention

[0005] This application provides a method for processing the outline of a printed circuit board, a printed circuit board, and related devices, which can reduce the risk of stress and displacement of ultra-small size boards during the cutting process, thereby meeting the requirements for dimensional accuracy.

[0006] One technical solution adopted in this application is: providing a method for processing the outline of a printed circuit board, the method comprising: Obtain the target external dimensions of multiple cells to be processed in the printed circuit board to be processed; The outer shape of a set of opposite edges of the unit to be processed is processed to form a first set of outer shape edges corresponding to the target outer shape size; On the first surface of the unit to be processed, the second set of opposite sides are mechanically cut to a depth based on a preset cutting depth to form a pre-cut groove for retaining the bottom connecting layer of the groove; On the second side opposite to the first side, the connecting layer is laser-cut to form a second set of outer edges corresponding to the target outer dimensions, thereby obtaining a printed circuit board that meets the target outer dimensions.

[0007] Another technical solution adopted in this application is: the shape of the printed circuit board meets the following conditions: the length and width of the printed circuit board are both less than 2.5mm; the board thickness is greater than 3.0mm; the shape accuracy is ±0.05mm; there are no positioning holes in the board; the shape processing steps of the printed circuit board are as described in any of the above-mentioned printed circuit board shape processing methods.

[0008] Another technical solution adopted in this application is: providing an electronic device, the electronic device comprising: Memory, used to store executable program code; A processor is configured to call and run the executable program code from the memory, causing the electronic device to perform the printed circuit board outline processing method as described in any of the preceding descriptions.

[0009] Another technical solution adopted in this application is: providing a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the printed circuit board outline processing method as described in any of the above claims.

[0010] This application provides a method for processing the outline of a printed circuit board. The method includes: obtaining the target outline dimensions of multiple processing units in the printed circuit board; processing a set of opposite edges of the processing units to form a first set of outline edges corresponding to the target outline dimensions; mechanically controlling the depth of cutting a second set of opposite edges on a first surface of the processing unit based on a preset cutting depth to form a pre-cut groove for retaining the bottom connection layer; and laser cutting the connection layer on a second surface opposite to the first surface to form a second set of outline edges corresponding to the target outline dimensions, thereby obtaining a printed circuit board that meets the target outline dimensions. By combining mechanically controlling the depth of cutting on the first surface with laser cutting on the second surface, the final cutting stage of the board is transformed from high-cutting-force mechanical processing to low-force laser processing, reducing the risk of stress and displacement for ultra-small boards during the cutting process, thus meeting the requirements for dimensional accuracy. Attached Figure Description

[0011] Figure 1 This is a flowchart illustrating the first embodiment of the printed circuit board outline processing method of this application; Figure 2This is a schematic flowchart of the second embodiment of the printed circuit board outline processing method of this application; Figure 3 This is an exemplary schematic diagram of the structure of the printed circuit board to be processed in the method for processing the outline of the printed circuit board of this application; Figure 4a A side view of the mechanical depth-controlled cutting of the first surface of the unit to be processed in the second embodiment is shown; Figure 4b A side view of the laser cutting of the second side of the unit to be processed in the second embodiment is shown; Figure 5 This is a flowchart illustrating the third embodiment of the printed circuit board outline processing method of this application; Figure 6a A side view of the mechanical depth-controlled cutting of the first surface of the unit to be processed in the third embodiment is shown; Figure 6b A side view of the laser cutting of the second side of the unit to be processed in the third embodiment is shown; Figure 7 This is an exemplary structural block diagram of an electronic device using the printed circuit board outline processing method of this application; Figure 8 This is an exemplary structural block diagram of a computer-readable storage medium for the method of processing the outline of a printed circuit board according to this application. Detailed Implementation

[0012] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0013] This embodiment takes into account that in the existing printed circuit board (PCB) outline processing, for products without internal positioning holes, the existing process generally uses the following method for outline processing: first, two sides of the product outline are processed, then adhesive tape is applied to the entire board to assist in fixing the product unit, and then the remaining two sides are processed. This method is suitable for products with a certain external dimension because the product unit area is relatively large, and there is a large contact area between the adhesive tape and the product unit, which can provide a certain adhesive fixing force, thereby offsetting the cutting force brought by the rotation of the milling cutter during subsequent mechanical cutting.

[0014] However, when the product size is further reduced to less than 2.5mm in both length and width, the effective contact area between the tape and the product unit decreases significantly due to the small product unit area, resulting in a reduction in the adhesive force generated by the tape. During subsequent machining of the remaining edges, the fixing force provided by the tape is insufficient to effectively counteract the cutting force generated by the milling cutter's rotation. This can easily lead to displacement, wobbling, or even loss of fixation of the product unit, causing problems such as machining deviation, loss of boundary dimension control, and decreased machining accuracy, making it difficult to meet the ±0.05mm surface accuracy requirement.

[0015] Furthermore, for such thick, small-sized, high-precision products, if conventional mechanical milling methods are still used to complete all the outer edge machining, not only are the clamping and fixing capabilities required to be high, but the remaining edge machining process is also more prone to affecting the dimensional consistency of the finished product due to uneven force, board vibration, or positioning inaccuracy. Therefore, existing mechanical shape machining solutions that rely on positioning holes or tape-assisted fixing are difficult to apply to printed circuit board products with no internal positioning holes, finished product length and width dimensions of less than 2.5mm, board thickness greater than 3.0mm, and an outer shape accuracy requirement of ±0.05mm.

[0016] Based on this, this embodiment proposes a processing method that combines mechanical depth control and laser cutting to solve the problems of ultra-small size and high shape accuracy. Specifically, a set of opposite edges are first shaped, and the second set of opposite edges are mechanically depth-controlled cut on the first surface and laser cut on the second surface. This method can reduce the mechanical stress in the final cutting stage and reduce the dependence on the positioning holes in the plate, thereby achieving high-precision shape processing under the condition of no positioning holes in the plate.

[0017] In some embodiments, please refer to Figure 1 , Figure 1 This is a schematic flowchart of the first embodiment of the printed circuit board outline processing method of this application. It should be noted that if substantially the same result is achieved, the method of this application is not necessarily identical. Figure 1 The illustrated process sequence is limited. For example... Figure 1 As shown, the method for processing the outline of the printed circuit board includes: S101, Obtain the target external dimensions of multiple units to be processed in the printed circuit board to be processed.

[0018] The target external dimensions can be determined according to product design requirements, including the long side and the wide side dimensions, to define the processing positions and finished dimensions of each side of the printed circuit board. In an exemplary embodiment, the processed printed circuit board can be an ultra-small board with both its length and width less than 2.5 mm and its thickness greater than 3.0 mm, while achieving an external shape accuracy of ±0.05 mm.

[0019] S102, perform shape processing on a set of opposite edges of the unit to be processed to form a first set of shape edges corresponding to the target shape size.

[0020] As an example, each processed printed circuit board may include multiple processing units, and each processing unit may include two sets of opposite sides. A set of opposite sides may be two opposite long sides or two opposite wide sides, which can be selected based on the unit arrangement direction, processing path, and board support conditions.

[0021] S103, on the first surface of the unit to be processed, the second set of opposite sides are mechanically cut to control the depth based on a preset cutting depth to form a pre-cut groove for retaining the bottom connecting layer of the groove.

[0022] The cutting depth is less than the thickness of the plate of the unit to be processed, in order to retain the connecting layer at the bottom of the pre-cut groove.

[0023] In one exemplary embodiment, a mechanical depth-controlled cut is performed on the first surface of the unit to be processed by the second set of opposite edges of the uncut shape, and the mechanical depth-controlled cut cuts into the plate thickness according to the cutting depth, thereby forming a pre-cut groove that retains the bottom connection layer, and the boundary of the pre-cut groove corresponds to the target shape size.

[0024] In another exemplary embodiment, to compensate for alignment errors during the flipping process and improve the shape accuracy control capability of ultra-small size plates, the boundary of the pre-cut groove can be extended by a predetermined amount along the plate surface direction and inward from the target shape size to form the boundary of the pre-cut groove extending inward from the plate. Therefore, even if there is a certain alignment deviation in the laser cutting of the second side, the area of ​​the pre-cut groove can still cover the laser-cut area, thereby reducing the risk of cutting offset or dimensional deviation caused by flipping alignment errors.

[0025] S104, on the second side opposite to the first side, the connecting layer is laser-cut to form a second set of outer edges corresponding to the target outer dimensions, thereby obtaining a printed circuit board that meets the target outer dimensions.

[0026] As an example, after the processing unit is flipped over, the connecting layer at the position corresponding to the pre-cut groove can be laser-cut from the second side opposite to the first side of the processing unit to form a second set of outer edges corresponding to the target outer dimensions, thus separating the board through and obtaining an ultra-small printed circuit board that meets the target outer dimensions. The second set of outer edges formed by laser cutting can serve as the final outer dimensions, thereby controlling the size and tolerance of the final product through laser cutting precision. This ensures that the long and wide sides of the ultra-small printed circuit board are both less than 2.5mm; the board thickness is greater than 3.0mm; the outer dimension accuracy is ±0.05mm; and there are no positioning holes inside the board. By performing mechanical depth-controlled cutting on one side of the printed circuit board and laser cutting on the other side, the processing process that originally required mechanical through-cutting can be decomposed into partial depth mechanical removal and laser cutting through the remaining connecting layer. This reduces the effect of mechanical cutting force on the board, minimizes the displacement risk of the ultra-small board during processing, and improves the outer dimension processing precision and processing stability.

[0027] This embodiment obtains the target external dimensions of multiple processing units in a printed circuit board (PCB). It then performs external processing on a set of opposite edges of each processing unit to form a first set of external edges corresponding to the target external dimensions. On the first surface of the processing unit, it performs mechanical depth-controlled cutting on a second set of opposite edges based on a preset cutting depth to form a pre-cut groove for retaining the bottom connection layer. On the second surface opposite the first surface, it performs laser cutting on the connection layer to form a second set of external edges corresponding to the target external dimensions, resulting in a PCB that meets the target external dimensions. By combining mechanical depth-controlled cutting on the first surface with laser cutting on the second surface, the final cutting stage of the board is transformed from high-cutting-force mechanical processing to low-force laser processing, reducing the stress and displacement risks of ultra-small boards during the cutting process, thereby meeting the dimensional accuracy requirements.

[0028] Please see Figure 2 , Figure 2 This is a flowchart illustrating a second embodiment of the printed circuit board outline processing method of this application. The method includes the following steps: S201, Obtain the target external dimensions of multiple processing units in the printed circuit board to be processed.

[0029] See Figure 3 , Figure 3 This is an exemplary schematic diagram of the structure of the printed circuit board to be processed in the method for processing the outline of the printed circuit board of this application. The processing unit has multiple processing units, with the outer periphery of each unit corresponding to the target outline boundary to be formed. It is understood that the processing unit in this embodiment differs from the conventional processing method where units are fixed via internal positioning holes. No positioning holes are provided inside the processing unit; therefore, during the outline processing, the processing units are not locally fixed using internal positioning holes. Especially when the length and width dimensions of the resulting printed circuit board are relatively small, but the board thickness is relatively large, directly performing mechanical through-cutting on the unprocessed second set of opposite edges can easily cause the processing units to shift due to the large mechanical cutting force, thus affecting the dimensional accuracy.

[0030] Therefore, this embodiment determines the target external dimensions of the processed unit according to the product design requirements. The target external dimensions may include the long side dimension, the wide side dimension, and the corresponding target external boundary of the processed printed circuit board, used to define the processing position of each side and the final finished product size. In some embodiments, the processed printed circuit board can be an ultra-small board, with both its length and width dimensions less than 2.5mm, its thickness greater than 3.0mm, and its external shape accuracy requirement reaching ±0.05mm.

[0031] S202, perform shape processing on a set of opposite edges of the unit to be processed to form a first set of shape edges corresponding to the target shape size.

[0032] S203, obtain the initial external dimensions and the area to be fixed of the unit to be processed.

[0033] As an example, the initial external dimensions of the unit to be processed after the first set of external edges are processed can be obtained, as well as the area to be fixed that can be used for attachment and fixation of the unit to be processed during the processing stage of the second set of external edges. The area to be fixed can be an area of ​​the board surface that is located around the unit to be processed and has not yet been cut, or an area that can be covered by the entire board surface. Since there are no positioning holes inside the unit to be processed, subsequent fixing does not rely on internal holes, but is achieved by attaching the entire board surface.

[0034] S204, the unit to be processed is attached and fixed according to the initial external dimensions and the area to be fixed.

[0035] It should be noted that in traditional solutions, if the remaining two sides are mechanically cut through after securing with tape, the adhesive force provided by the tape is insufficient to offset the cutting force generated by the milling cutter's rotation due to the limited contact area between the ultra-small unit and the tape, thus easily leading to unit misalignment. In this embodiment, however, the tape fixation only needs to be used in conjunction with subsequent depth-controlled cutting and laser cutting, and no longer bears the significant force generated by complete mechanical through-cutting. Therefore, reliable fixation can still be achieved even without positioning holes within the board. The unit to be processed is fixed by tape according to its current shape and the area to be fixed. For example, after processing the first set of outer edges of the unit, tape can be applied to the entire board or the corresponding area to provide overall holding force for each unit in subsequent processing stages.

[0036] S205, on the first side of the unit to be processed, the second set of opposite sides are mechanically cut to control the depth based on a preset cutting depth to form a pre-cut groove for retaining the bottom connecting layer of the groove.

[0037] As an example, mechanical depth control cutting can be performed on the first surface of the unit to be processed for the second set of opposite sides that have not been cut into the shape, so that the mechanical cutting tool cuts into part of the plate thickness and retains the connecting layer at the bottom of the groove, thereby forming a pre-cut groove.

[0038] See Figure 4a , Figure 4aThe diagram shows a side view of the first side of the unit to be processed in the second embodiment, where A can represent the boundary position corresponding to the first side mechanical depth control cut. That is, the first side mechanical depth control does not directly cut through the plate, but removes most of the material thickness while retaining the bottom connecting layer so that the plate remains in an overall connected state at this stage. By transforming the processing process, which originally required mechanical through-cutting, into partial depth mechanical removal on the first side, the cutting force applied to the ultra-small unit during machining can be effectively reduced, avoiding displacement of the unit under attachment and fixing conditions due to mechanical through-cutting.

[0039] S206, on the second side opposite to the first side, determine the position of the connecting layer, and determine the laser cutting parameters based on the position of the connecting layer.

[0040] As an example, the unit to be processed can be flipped to a second side opposite the first side, and the position of the connecting layer corresponding to the pre-cut groove can be obtained to determine the processing area and corresponding parameters for laser cutting. The laser cutting parameters may include at least one of the following: laser cutting path, cutting energy, cutting width, and cutting depth. Since the mechanical depth-controlled cutting on the first side has already removed most of the plate thickness, the laser cutting on the second side can be performed only on the remaining connecting layer, reducing the laser cutting burden and improving cutting stability and dimensional control.

[0041] S207, according to the laser cutting parameters, the connecting layer is laser cut to form the second set of outer edges, thereby obtaining a printed circuit board that meets the target outer dimensions.

[0042] As an example Figure 4b A side view of the laser cutting of the second side of the unit to be processed in the second embodiment is shown. Figure 4b The two dashed areas in the diagram can represent the possible laser cutting position deviations under different flipping alignment errors. However, since the first side in this embodiment has been pre-cut with a pre-cut groove through mechanical depth control cutting, the laser cutting of the second side acts on the thinner connecting layer area. Therefore, even if there is a certain flipping alignment error, the laser cutting can still complete the cutting and shaping of the opposite sides, allowing the unit to be processed to be separated from the whole board, forming an ultra-small printed circuit board that meets the target external dimensions.

[0043] Furthermore, in some embodiments, when mechanically controlling the depth of the first face of the second set of opposite edges, by extending a preset inward extension amount along the board surface direction based on the target outline boundary, alignment errors during the flipping process can be compensated, thereby improving the dimensional control capability of ultra-small, thick printed circuit boards. Please refer to [link to relevant documentation]. Figure 5 , Figure 5This is a flowchart illustrating a third embodiment of the printed circuit board outline processing method of this application. The method includes the following steps: S501: Obtain the target external dimensions of multiple cells to be processed in the printed circuit board to be processed.

[0044] S502, perform shape processing on a set of opposite edges of the unit to be processed to form a first set of shape edges corresponding to the target shape size.

[0045] S503, Obtain the initial external dimensions of the unit to be processed, and the area to be fixed.

[0046] S504, the unit to be processed is attached and fixed according to the initial external dimensions and the area to be fixed.

[0047] S505, based on the position of the target shape dimension corresponding to the second set of opposite sides, the cutting boundary of the pre-cut groove is determined by extending the inward extension amount along the plate surface direction.

[0048] As an example, see Figure 6a , Figure 6a The diagram shows a side view of the first face of the unit to be processed in the third embodiment, where A1 can represent the boundary position corresponding to the first face mechanical depth control cut, and the length of A1 is greater than... Figure 4a The length of A in the figure, i.e., the mechanical depth control cutting boundary of the first face, extends beyond the target shape boundary and into the plate, thus forming an additional pre-removal area inside the target shape boundary. That is, with... Figure 4a compared to, Figure 6a Instead of limiting the mechanical depth-controlled cutting boundary of the first side to the target shape boundary, a certain extension is reserved inwards, so that the coverage area of ​​the pre-cut groove on the plate surface is larger than the final finished product boundary. Therefore, when the unit to be processed is laser-cut from the second side after flipping, even if there is a certain error in the flipping alignment, the laser cutting path can still fall within the coverage area of ​​the pre-cut groove formed on the first side. This can effectively reduce the situation where the laser cutting deviates from the pre-cutting area, cuts into the entire thick plate, or forms local residue, thereby improving the cutting reliability after flipping and the consistency of the final shape dimensions.

[0049] In some embodiments, the step of determining the extension amount may include: The positioning reference position of the first side of the unit to be processed and the positioning reference position of the second side of the unit to be processed after flipping are obtained. Based on the positional deviation between the positioning reference positions of the first and second sides, the alignment error of the unit to be processed during the flipping process is determined. Based on the target external dimensions, the preset external dimensions accuracy requirements, and the alignment error, the preset in-plate extension amount is determined; when the preset in-plate extension amount is greater than the preset maximum allowable extension amount, the preset in-plate extension amount is set to the preset maximum allowable extension amount.

[0050] As an example, the positioning reference position can be determined based on the first set of machined outer edges, plate surface reference points, or available reference holes / markers on the entire plate. This provides basic data for subsequent calculations of potential offsets during the flipping process, reflecting the relative positional changes of the units to be processed during the flipping process. Alignment error represents the unit positional offset caused by the plate fixing method, attached materials, or the flipping operation itself. The in-plate extension can define the distance the pre-cut groove of the first mechanical depth control cutting extends inwards along the plate surface relative to the target outer edge. This allows the second laser cutting to still cover the pre-cut groove and complete the cutting through the connecting layer even with the existence of flipping alignment errors. Furthermore, to reduce the risk of excessive extension affecting plate dimensions or processing stability, when the preset in-plate extension exceeds the preset maximum allowable extension, the preset in-plate extension is set to the preset maximum allowable extension. The maximum allowable extension can be determined based on the plate's length and width dimensions, plate thickness, processing equipment accuracy, and laser cutting coverage capability, enabling effective compensation for flipping processing deviations without affecting the final product's target outer dimensions.

[0051] S506, according to the cutting depth and the cutting boundary, the second set of opposite sides are mechanically controlled to cut to form a pre-cut groove for retaining the bottom connecting layer of the groove.

[0052] As an example, since the cutting boundary extends inward along the board surface, the resulting pre-cut groove forms an additional pre-removal area along the board surface and inside the target shape boundary. This additional pre-removal area can serve as a cutting buffer area during laser cutting, allowing the laser cutting to complete the cutting of the connecting layer within the pre-removal area without completely coinciding with the first mechanical depth control cutting boundary.

[0053] It is understandable that although the first mechanical depth control cut extends a certain amount into the plate, this extension occurs on the first side of the unit to be processed and does not directly constitute the outer boundary of the final finished plate. In other words, the first mechanical depth control cut can be used to remove most of the plate thickness in advance and provide a low-thickness cutting area for the second laser cutting. The actual outer boundary and dimensional accuracy of the final finished plate are determined by the laser cutting on the second side.

[0054] S507, on the second side opposite to the first side, determine the position of the connecting layer, and determine the laser cutting parameters based on the position of the connecting layer.

[0055] S508, according to the laser cutting parameters, the connecting layer is laser cut to form the second set of outer edges, thereby obtaining a printed circuit board that meets the target outer dimensions.

[0056] As an example, see Figure 6b , Figure 6b A side view of the laser cutting of the second side of the unit to be processed in the third embodiment is shown. Although the mechanical depth-controlled cutting of the first side extends into the board by a certain amount, the laser cutting of the second side still cuts according to the boundary position corresponding to the target shape size. Therefore, the actual shape boundary of the final finished board is defined by the laser cutting of the second side, thereby forming a second set of shape edges that meet the target shape size, and finally obtaining a printed circuit board that meets the target shape.

[0057] Please see Figure 7 , Figure 7 This is an exemplary structural block diagram of an electronic device using the printed circuit board outline processing method of this application. For example... Figure 7 As shown, the electronic device 700 of this application may include a processor 701 and a memory 702, wherein the processor 701 and the memory 702 communicate via a bus. The memory 702 stores program instructions for the outline processing of a printed circuit board. When the program instructions are executed by the processor 701, the processor performs the aforementioned related method steps to implement a printed circuit board outline processing method in the above embodiments.

[0058] Please see Figure 8 , Figure 8 This is an exemplary structural block diagram of a computer-readable storage medium for the method of processing the outline of a printed circuit board according to this application. Figure 8 As shown, the computer-readable storage medium 800 stores a computer program 801. When the computer program 801 is run by a processor on a computer, it causes the computer to perform the aforementioned method steps to implement a printed circuit board outline processing method in the above embodiments.

[0059] The above solution obtains the target external dimensions of multiple units to be processed in the printed circuit board; it performs external processing on a set of opposite edges of the units to be processed, forming a first set of external edges corresponding to the target external dimensions; on the first side of the units to be processed, it performs mechanical depth-controlled cutting on the second set of opposite edges based on a preset cutting depth, forming a pre-cut groove for retaining the bottom connection layer; on the second side opposite the first side, it performs laser cutting on the connection layer, forming a second set of external edges corresponding to the target external dimensions, thus obtaining a printed circuit board that meets the target external dimensions. By combining mechanical depth-controlled cutting on the first side with laser cutting on the second side, the final cutting stage of the board is transformed from high-cutting-force mechanical processing to low-force laser processing, reducing the stress and displacement risks of ultra-small boards during the cutting process, thereby meeting the requirements for external dimensional accuracy.

[0060] In the several embodiments provided in this application, it should be understood that the disclosed methods, electronic devices, and storage media can be implemented in other ways. For example, the device embodiments described above are merely illustrative; for instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection of devices or units may be electrical, mechanical, or other forms.

[0061] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment, depending on actual needs.

[0062] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0063] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute all or part of the steps of the printed circuit board outline processing method described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0064] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A method of shaping a printed circuit board, characterized by, The method for processing the outline of the printed circuit board includes: Obtain the target external dimensions of multiple cells to be processed in the printed circuit board to be processed; The outer shape of a set of opposite edges of the unit to be processed is processed to form a first set of outer shape edges corresponding to the target outer shape size; On the first surface of the unit to be processed, the second set of opposite sides are mechanically cut to a depth based on a preset cutting depth to form a pre-cut groove for retaining the bottom connecting layer of the groove; On the second side opposite to the first side, the connecting layer is laser-cut to form a second set of outer edges corresponding to the target outer dimensions, thereby obtaining a printed circuit board that meets the target outer dimensions.

2. The method of claim 1, wherein, The step of mechanically controlling the depth of the second set of opposite edges based on a preset cutting depth to form a pre-cut groove for retaining the bottom connecting layer includes: Based on the preset cutting depth and the preset extension within the plate, the second set of opposite edges are mechanically cut to control the depth, forming a pre-cut groove for retaining the bottom connecting layer of the groove.

3. The method of claim 2, wherein, The process of mechanically controlling the depth of the second set of opposite edges to form a pre-cut groove for retaining the bottom connecting layer of the retaining groove, based on a preset cutting depth and a preset extension within the plate, includes: Based on the position of the target shape corresponding to the second set of opposite sides, the cutting boundary of the pre-cut groove is determined by extending the inward extension amount along the plate surface direction. Based on the cutting depth and the cutting boundary, the second set of opposite sides are mechanically cut to control the depth, forming a pre-cut groove for retaining the bottom connecting layer of the groove.

4. The method according to claim 2 or 3, characterized in that, The steps for determining the extension amount include: Obtain the positioning reference position of the first side of the unit to be processed, and the positioning reference position of the second side of the unit to be processed after flipping; Based on the positional deviation between the positioning reference position of the first surface and the positioning reference position of the second surface, the alignment error of the unit to be processed during the flipping process is determined. Based on the target external dimensions, the preset external dimensions accuracy requirements, and the alignment error, the preset internal extension amount is determined; when the preset internal extension amount is greater than the preset maximum allowable extension amount, the preset internal extension amount is set to the preset maximum allowable extension amount.

5. The method according to claim 3 or 4, characterized in that, The extension within the preset plate is less than or equal to 0.15 mm.

6. The method of claim 1, wherein, The connecting layer is laser-cut on the second surface opposite to the first surface to form a second set of external edges corresponding to the target external dimensions, including: Determine the position of the connecting layer, and determine the laser cutting parameters based on the position of the connecting layer; According to the laser cutting parameters, the connecting layer is laser-cut to form the second set of outer edges.

7. The method of claim 1, wherein, After the step of processing a set of opposite edges of the unit to be processed to form a first set of external edges corresponding to the target external dimensions, and before the step of mechanically controlling the depth of cutting a second set of opposite edges on the first surface of the unit to be processed based on a preset cutting depth to form a pre-cut groove for retaining the bottom connecting layer of the groove, the following steps are included: Obtain the initial external dimensions and the area to be fixed of the unit to be processed; The unit to be processed is attached and fixed according to the initial external dimensions and the area to be fixed.

8. A printed circuit board, characterized by The printed circuit board has the following shape requirements: both the long side and the wide side are less than 2.5 mm; the board thickness is greater than 3.0 mm; the shape accuracy is ±0.05 mm; there are no positioning holes inside the board; the shape processing steps of the printed circuit board are the shape processing method of the printed circuit board as described in any one of claims 1 to 7.

9. An electronic device, comprising: The electronic device includes: Memory, used to store executable program code; A processor is configured to call and run the executable program code from the memory, causing the electronic device to perform the method for processing the outline of a printed circuit board as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the method for processing the outline of a printed circuit board as described in any one of claims 1 to 7.

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