Method for manufacturing a wiring circuit substrate

Abstract

Provided is a manufacturing method of a wiring circuit substrate capable of manufacturing a wiring circuit substrate capable of being thinned and planarized, and a manufacturing method of a semiconductor package and a manufacturing method of an electronic device including the manufacturing method of the wiring circuit substrate. The wiring circuit substrate has a first insulating layer, a second insulating layer disposed on one surface side of the first insulating layer, a first conductor layer disposed on the other surface of the first insulating layer, and a second conductor layer embedded in the second insulating layer. The manufacturing method of the wiring circuit substrate includes a step of applying a liquid resin composition to form the first insulating layer, and a step of attaching a film-shaped resin composition to form the second insulating layer.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a wiring circuit board, a method for manufacturing a semiconductor package, and a method for manufacturing an electronic device. Background Technology

[0002] A wiring circuit board for mounting semiconductor chips is manufactured, for example, by laminating conductive portions such as wiring and various insulating layers onto a substrate. The conductive portions and insulating layers are patterned, for example, by photolithography.

[0003] As a wiring circuit board, for example, a wiring circuit board for mounting a magnetic head has been proposed. This wiring circuit board includes: a metal support substrate; an insulating layer formed on the metal support substrate; a wiring formed on the insulating layer and electrically connected to the magnetic head; another wiring formed on the insulating layer, disposed at a distance from the first wiring, and electrically connected to the magnetic head; a one-sided semiconductive layer formed to cover the first wiring and electrically connected to the metal support substrate; and a other-sided semiconductive layer formed to cover the other wiring and electrically connected to the metal support substrate, with the one-sided semiconductive layer and the other-sided semiconductive layer spaced apart (see Patent Document 1).

[0004] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2008-270828 Summary of the Invention

[0005] The technical problem that the invention aims to solve As electronic devices with built-in wiring circuit boards become smaller and more powerful, there is a demand to make the wiring circuit boards slightly thinner and flatter.

[0006] The purpose of this invention is to provide a method for manufacturing a wiring circuit board capable of being thinned and planarized, a method for manufacturing a semiconductor package including the method for manufacturing the wiring circuit board, and a method for manufacturing an electronic device.

[0007] Technical solutions for solving technical problems In order to solve the above-mentioned technical problems, the inventors conducted in-depth research and found that the above-mentioned technical problems could be solved, thereby completing the present invention with the following main purpose.

[0008] That is, the present invention includes the following.

[0009] [1] A method for manufacturing a wiring circuit board, the wiring circuit board comprising: First insulating layer; A second insulating layer is disposed on one side of the first insulating layer; A first conductor layer is disposed on the other side of the first insulating layer; The second conductor layer is embedded in the second insulating layer. The manufacturing method of the wiring circuit board includes the following steps: The process of coating the liquid resin composition to form the first insulating layer, and The process of attaching a film-like resin composition to form the second insulating layer.

[0010] [2] According to the method for manufacturing a wiring circuit board described in [1], wherein the liquid resin composition is a polyimide resin composition. The film-like resin composition comprises a layer in the ethyl phase formed from an epoxy resin composition.

[0011] [3] The method for manufacturing a wiring circuit board according to [1] or [2], wherein the step of attaching the film-like resin composition is performed after the step of coating the liquid resin composition.

[0012] [4] A method for manufacturing a wiring circuit board according to any one of [1] to [3], wherein the second conductor layer in the wiring circuit board has a through hole. The method for manufacturing the wiring circuit board includes: a step of forming the through-hole in the second conductor layer. The process of forming the through-hole in the second conductor layer is performed between the process of coating the liquid resin composition and the process of attaching the film resin composition.

[0013] [5] The method for manufacturing a wiring circuit board according to [4] wherein the second conductor layer is a metal core layer.

[0014] [6] A method for manufacturing a wiring circuit board according to any one of [1] to [5], wherein, in the wiring circuit board, the second conductor layer is in contact with the first insulating layer.

[0015] [7] A method for manufacturing a wiring circuit board according to any one of [1] to [6], wherein, in the wiring circuit board, the second conductor layer is a metal core layer having through holes. The wiring circuit board has an interlayer connection portion disposed within the through hole and a third conductor layer disposed on the side of the second insulating layer opposite to the side of the first insulating layer. In the wiring circuit board, the first conductor layer and the third conductor layer are electrically connected through the interlayer connection portion. In the wiring circuit board, a second insulating layer exists between the interlayer connection portion and the metal core layer.

[0016] [8] A method for manufacturing a wiring circuit board according to any one of [1] to [6], wherein the first insulating layer and the second insulating layer have different coefficients of linear expansion in the wiring circuit board.

[0017] [9] A method for manufacturing a semiconductor package, comprising the method for manufacturing a wiring circuit substrate as described in any one of [1] to [8].

[0018]

[10] A method for manufacturing an electronic device, comprising the method for manufacturing a semiconductor package as described in [9].

[0019] Invention Effects According to the present invention, a method for manufacturing a wiring circuit board capable of being thinned and planarized, a method for manufacturing a semiconductor package including the method for manufacturing the wiring circuit board, and a method for manufacturing an electronic device are provided. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of one embodiment of a wiring circuit board.

[0021] Figure 2A This is one of the schematic diagrams illustrating a method for manufacturing a wiring circuit board.

[0022] Figure 2B This is a schematic diagram (part two) illustrating an example of a method for manufacturing a wiring circuit board.

[0023] Figure 2C This is a schematic diagram (Part 3) illustrating an example of a method for manufacturing a wiring circuit board.

[0024] Figure 2D This is a schematic diagram (fourth in a series) illustrating an example of a method for manufacturing a wiring circuit board.

[0025] Figure 2E This is a schematic diagram (Part 5) illustrating an example of a method for manufacturing a wiring circuit board.

[0026] Figure 2F This is a schematic diagram (six) illustrating an example of a method for manufacturing a wiring circuit board.

[0027] Figure 2G This is a schematic diagram (part seven) illustrating an example of a method for manufacturing a wiring circuit board.

[0028] Figure 2HThis is a schematic diagram (eighth one) illustrating an example of a method for manufacturing a wiring circuit board.

[0029] Figure 2I This is a schematic diagram (nine) illustrating an example of a method for manufacturing a wiring circuit board.

[0030] Figure 2J This is a schematic diagram (of ten) illustrating an example of a method for manufacturing a wiring circuit board.

[0031] Figure 3 This is a schematic diagram of another embodiment of the wiring circuit board.

[0032] Figure 4 This is a schematic diagram of another embodiment of the wiring circuit board.

[0033] Figure 5 This is a schematic diagram of another embodiment of the wiring circuit board.

[0034] Figure 6 This is a schematic diagram of another embodiment of the wiring circuit board.

[0035] Explanation of reference numerals in the attached figures 1 Second conductor layer 1a Through hole 2 First Insulation Layer 2a Through hole 3 First Conductor Layer 4 Third Insulation Layer 4a Through hole 5. Fourth conductor layer 6. Fourth Insulation Layer 16 Fourth Insulation Layer 26 Fourth Insulation Layer 6a Through hole 7 Second Insulation Layer 7a Through hole 8 Third conductor layer 9. Fifth Insulation Layer 19 Fifth Insulation Layer 29 Fifth Insulation Layer 9a Through hole 10. Interlayer connection. Detailed Implementation

[0036] (Manufacturing method of wiring circuit board) The method for manufacturing the wiring circuit board of the present invention is a method for manufacturing a wiring circuit board having a first insulating layer, a second insulating layer, a first conductor layer and a second conductor layer.

[0037] In the wiring circuit board, the second insulating layer is disposed on one side of the first insulating layer.

[0038] In the wiring circuit board, the first conductor layer is disposed on the other side of the first insulating layer.

[0039] In the wiring circuit board, the second conductor layer is embedded with the second insulating layer.

[0040] The method for manufacturing a wiring circuit board includes: a step of coating a liquid resin composition to form a first insulating layer; and a step of attaching a film-like resin composition to form a second insulating layer.

[0041] Among the resin materials used to manufacture insulating layers for wiring circuit boards, there are resin materials that can planarize the insulating layer but are difficult to thin, and resin materials that can thin the insulating layer but are difficult to planarize, making it difficult to achieve both planarization and thinning of the insulating layer.

[0042] In the method for manufacturing the wiring circuit board of the present invention, a step of coating a liquid resin composition is used to form the first insulating layer. Here, if the step of coating a liquid resin composition is used to form the insulating layer, the insulating layer obtained from the liquid resin composition can be made thinner.

[0043] Furthermore, in the method for manufacturing the wiring circuit board of the present invention, a step of attaching a film-like resin composition is used to form the second insulating layer. Here, if the step of attaching a film-like resin composition is used to form the insulating layer, the insulating layer obtained from the film-like resin composition can be planarized.

[0044] Therefore, if the wiring circuit board manufacturing method of the present invention is used, it is possible to manufacture wiring circuit boards that can be thinned and planarized.

[0045] There are no particular limitations on the coating method when coating liquid resin compositions; examples include spin coating, spray coating, dip coating, roller coating, slot coating, etc.

[0046] After coating the liquid resin composition, heating is performed, for example. There are no particular restrictions on the heating temperature and heating time, as long as the first insulating layer is formed.

[0047] There are no particular limitations on the bonding method for attaching the film-like resin composition; for example, methods such as pressing the film-like resin composition under reduced pressure can be cited. As for pressing, for example, hot pressing can be cited. The method of pressing the film-like resin composition under reduced pressure can be performed, for example, using a vacuum lamination apparatus.

[0048] After the film-like resin composition is applied, heating is performed, for example. There are no particular limitations on the heating temperature and heating time, as long as the second insulating layer is formed.

[0049] There are no particular limitations on the liquid resin composition, but polyimide resin compositions are preferred.

[0050] The film-like resin composition is not particularly limited, but preferably includes a layer in the ethylenically modified state formed from an epoxy resin composition. The film thickness of the film-like resin composition is not particularly limited, for example, it is 1 mm. μ m or more, preferably 3 μ m or more; in addition, for example, 35 μ Below m, preferably 20 μ Below m.

[0051] The film-like resin composition can be a laminated structure of an epoxy resin composition in a grade B state layer and other layers. Examples of other layers include a layer containing a polyimide resin. In this case, the polyimide resin layer can be a grade B state layer. The polyimide resin layer can, for example, contain components other than polyimide resin.

[0052] There are no particular limitations on the polyimide resin composition, for example, as long as it is a polyimide resin composition that can be used to form an insulating layer of a wiring circuit board.

[0053] The polyimide resin composition can be a thermosetting resin composition or a photosensitive resin composition.

[0054] There are no particular limitations on the epoxy resin composition, for example, as long as it is an epoxy resin composition that can be used to form an insulating layer of a wiring circuit board.

[0055] The epoxy resin composition can be a thermosetting resin composition or a photosensitive resin composition. When the epoxy resin composition is a photosensitive resin composition, it may include, for example, an acid-modified epoxy acrylate resin as a resin component other than the epoxy resin.

[0056] In the manufacturing method of wiring circuit board, it is preferable to perform the step of attaching film resin composition after the step of coating liquid resin composition.

[0057] When the second conductor layer has a through-hole, the method for manufacturing the wiring circuit board preferably includes a step of forming the through-hole in the second conductor layer. In this case, the step of forming the through-hole in the second conductor layer is preferably performed between the step of coating the liquid resin composition and the step of attaching the film-like resin composition.

[0058] There are no particular limitations on the method for forming through holes in the second conductor layer; for example, selective etching, laser processing, etc., can be cited.

[0059] The process of applying the film-like resin composition is preferably performed by filling the through-holes in the second conductor layer with the film-like resin composition. Therefore, even with through-holes, the flatness of the formed second insulating layer is excellent. Consequently, a wiring circuit board with excellent flatness can be obtained.

[0060] In a wiring circuit board, for example, the second conductor layer is in contact with the first insulating layer. In this case, the second conductor layer is not completely embedded in the second insulating layer. That is, in a wiring circuit board, the second conductor layer may not be completely embedded in the second insulating layer.

[0061] In the circuit wiring substrate, the thickness of the first insulating layer is not particularly limited, but from the viewpoint of making the circuit wiring substrate thinner, 30 mm is preferred. μ m or less, more preferably 25 μ Below m. There is no particular limitation on the lower limit of the thickness of the first insulating layer; for example, the thickness of the first insulating layer may be 1. μ m or more.

[0062] In the following discussion Figure 1 In the wiring circuit board shown, the thickness of the first insulating layer refers to the thickness of the first insulating layer at the location sandwiched between the second conductor layer and the first conductor layer.

[0063] In the circuit wiring substrate, the thickness of the second insulating layer is not particularly limited, but from the viewpoint of making the circuit wiring substrate thinner, 30 mm is preferred. μ m or less, more preferably 25 μ Below m. There is no particular limitation on the lower limit of the thickness of the second insulating layer; for example, the thickness of the second insulating layer can be 1. μ m or more.

[0064] In the following discussion Figure 1 In the wiring circuit board shown, the thickness of the second insulating layer refers to the thickness of the second insulating layer located between the second conductor layer and the third conductor layer.

[0065] The second conductor layer is preferably a metal core layer. This reduces warpage of the wiring circuit board. Furthermore, it improves the operability of the wiring circuit board and allows for further thinning of the board's thickness.

[0066] Metal core layers are, for example, elements used to ensure the rigidity of wiring circuit boards.

[0067] There are no particular limitations on the material used for the metal core layer; examples include Cu, Cu alloys, Al, stainless steel, FeNi alloys such as 42 alloy, and combinations thereof. However, from the viewpoint of thermal and electrical conductivity, Cu, Cu alloys, Al, and stainless steel are preferred.

[0068] There are no particular limitations on the thickness of the metal core layer, for example, it can be 10. μ m or more, preferably 15 m μ m or more; in addition, for example, 500 μ Below m, preferably 300 μ Below m.

[0069] As an embodiment of the wiring circuit board, for example, embodiments that satisfy the following (1) to (4) can be cited.

[0070] (1): The second conductor layer is a metal core layer with through holes.

[0071] (2): The wiring circuit board has an interlayer connection portion disposed in a through hole of a metal core layer and a third conductor layer disposed on a surface of a second insulating layer opposite to the side of the first insulating layer.

[0072] (3): The first conductor layer and the third conductor layer are electrically connected through the interlayer connection.

[0073] (4): There is a second insulating layer between the interlayer connection and the metal core layer.

[0074] In embodiments that satisfy (1) to (4) above, the second insulating layer preferably comprises a layer formed of an epoxy resin composition. Therefore, even when the second insulating layer is formed on a metal core layer with through holes, the flatness of the second insulating layer is excellent.

[0075] In embodiments that satisfy (1) to (4) above, the second insulating layer is preferably an insulating layer obtained by further curing the layer in the B-stage state. As a result, even when the second insulating layer is formed on a metal core layer with through holes, the flatness of the second insulating layer is excellent.

[0076] In embodiments that satisfy (1) to (4) above, the second insulating layer is more preferably an insulating layer obtained by further curing a layer comprising a layer formed of an epoxy resin composition in a B-state state. Therefore, even when the second insulating layer is formed on a metal core layer with through holes, the flatness of the second insulating layer is superior.

[0077] Preferably, the first insulating layer and the second insulating layer have different coefficients of linear expansion. This allows for adjustment of the degree of expansion caused by the temperature of the semiconductor chip and the degree of expansion caused by the temperature of the wiring circuit board, resulting in reduced warping of the wiring circuit board to which the semiconductor chip is connected.

[0078] The coefficient of linear expansion of the first insulating layer is not particularly limited, for example, it can be 10ppm / K to 70ppm / K, preferably 15ppm / K to 50ppm / K.

[0079] The coefficient of linear expansion for the second insulating layer is not particularly limited, but can be, for example, 15ppm / K to 120ppm / K, preferably 40ppm / K to 100ppm / K.

[0080] There is no particular limitation on the absolute value of the difference between the linear expansion coefficient of the first insulating layer and the linear expansion coefficient of the second insulating layer. For example, 5ppm / K to 110ppm / K can be cited, and 25ppm / K to 85ppm / K is preferred.

[0081] Here, the coefficient of linear expansion is the coefficient of linear expansion at temperatures ranging from 25°C to 150°C, which can be determined by thermomechanical analysis (TMA method) based on JIS K 7197.

[0082] If the insulation layer does not contain filler, it is easy to make the insulation layer thinner.

[0083] Therefore, from the viewpoint of achieving a thinner first insulating layer, it is preferable that the first insulating layer is a resin layer without fillers.

[0084] If the insulation layer contains filler, it is easier to planarize the insulation layer.

[0085] Therefore, from the viewpoint of excellent flatness of the second insulating layer, it is preferable that the second insulating layer is a resin layer containing filler.

[0086] When the second insulating layer is a laminated structure, it is sufficient that at least one layer of the laminated structure contains a filler. For example, when the second insulating layer is a laminated structure of a layer formed of an epoxy resin composition and other layers, it can be any of the following (i) to (iii).

[0087] (i): The layer formed by the epoxy resin composition contains filler, and the other layers contain filler.

[0088] (ii): The layer formed by the epoxy resin composition contains filler, while the other layers do not contain filler.

[0089] (iii): The layer formed by the epoxy resin composition does not contain filler, while the other layers contain filler.

[0090] It should be noted that in case (i), the fillers contained in the two layers may be the same or different.

[0091] There are no particular restrictions on the content of filler in the insulation layer when the insulation layer contains filler.

[0092] Inorganic packing materials and organic packing materials can be cited as examples.

[0093] Examples of inorganic fillers include silicon oxide, silicon nitride, aluminum oxide, aluminum nitride, aluminum hydroxide, boron nitride, crystalline silicon dioxide, magnesium carbonate, calcium carbonate, and barium sulfate.

[0094] In the wiring circuit board, it is preferable that the indentation modulus of the second insulating layer at 25°C, measured using the nanoindentation method, is less than that of the first insulating layer at 25°C, also measured using the nanoindentation method. This way, by making the second insulating layer more flexible than the first insulating layer, the second insulating layer can mitigate the impact during the mounting of the wiring circuit board, preventing cracks and wiring breakage within the wiring circuit board.

[0095] The method for determining the indentation modulus is as follows.

[0096] Device: Triboindenter (manufactured by Hysitron Inc.) Sample size: 10×10mm Indenter: Concial (spherical indenter: radius of curvature 10) μ m) Measurement method: Single indentation measurement Measurement temperature: 25℃ Indentation depth of the indenter: 100nm Temperature: 25℃ Analysis: Oliver Pharr analysis based on load-displacement curves The difference between the indentation modulus (EM1) of the first insulating layer and the indentation modulus (EM2) of the second insulating layer (EM1-EM2) is not particularly limited, and for example, it can be 0.5MPa to 5MPa.

[0097] There are no particular limitations on the indentation modulus of the first insulating layer, but 6 MPa to 10 MPa is preferred.

[0098] There are no particular limitations on the indentation modulus of the second insulating layer, but 3MPa to 8MPa is preferred.

[0099] It should be noted that when the insulating layer is an insulating layer comprising a layer formed of an epoxy resin composition, the compression modulus is, for example, about 3 MPa to 8 MPa.

[0100] When the insulating layer is formed of a polyimide resin composition, the compression modulus is, for example, about 6 MPa to 10 MPa.

[0101] Hereinafter, an example of a wiring circuit board of the present invention manufactured using the manufacturing method of the wiring circuit board of the present invention will be described with reference to the figures.

[0102] Figure 1This is a cross-sectional schematic diagram of an example of a wiring circuit board.

[0103] Figure 1 The wiring circuit board shown has a first insulating layer 2, a second insulating layer 7, a first conductor layer 3, and a second conductor layer 1 as a metal core layer with through holes.

[0104] The second insulating layer 7 is disposed on one side of the first insulating layer 2.

[0105] The first conductor layer 3 is disposed on the other side of the first insulating layer 2.

[0106] The second conductor layer 1 (metal core layer) is embedded in the second insulating layer 7.

[0107] The first insulating layer 2 and the second insulating layer 7 are formed using different resin materials.

[0108] The wiring circuit board also has an interlayer connection portion 10 and a third conductor layer 8.

[0109] The interlayer connection portion 10 is disposed in the through hole of the second conductor layer 1, which serves as the metal core layer.

[0110] The third conductor layer 8 is disposed on the side of the second insulating layer 7 opposite to the side of the first insulating layer 2.

[0111] The first conductor layer 3 and the third conductor layer 8 are electrically connected through the interlayer connection part 10.

[0112] The second insulating layer 7 exists between the interlayer connection portion 10 and the second conductor layer 1, which serves as the metal core layer.

[0113] The wiring circuit board also has a third insulating layer 4, a fourth conductor layer 5, a fourth insulating layer 6, and a fifth insulating layer 9.

[0114] The third insulating layer 4 is disposed on the side of the first conductor layer 3 opposite to the side of the first insulating layer 2. The third insulating layer 4 covers the first conductor layer 3.

[0115] The fourth conductor layer 5 is disposed on the side of the third insulating layer 4 opposite to the side of the first conductor layer 3.

[0116] The fourth insulating layer 6 is disposed on the side of the fourth conductor layer 5 opposite to the side of the third insulating layer 4. The fourth insulating layer 6 covers the fourth conductor layer 5.

[0117] The fifth insulating layer 9 is disposed on the side of the third conductor layer 8 opposite to the side of the second insulating layer 7. The fifth insulating layer 9 covers the third conductor layer 8.

[0118] use Figures 2A to 2J illustrate Figure 1 An example of a method for manufacturing a wiring circuit board is shown.

[0119] First, prepare the second conductor layer 1 (as the metal core layer). Figure 2A ).

[0120] Next, a first insulating layer 2 with a through hole 2a is formed on the other side of the second conductor layer 1. Figure 2B The formation of the first insulating layer 2 having the through hole 2a can be carried out, for example, as follows.

[0121] • A photosensitive liquid resin composition containing photosensitive polyimide is coated onto the second conductor layer 1 (metal core layer) and then dried. • Selective exposure and development of the formed photosensitive polyimide film. Next, a patterned first conductor layer 3 is formed on the first insulating layer 2 and within the through hole 2a. Figure 2C The formation of the first conductor layer 3 can be carried out, for example, as follows.

[0122] • A seed layer (not shown) is formed on the first insulating layer 2. • A photoresist film is formed on the seed layer (not shown). • A resist pattern is formed by selective exposure and development of the photoresist film (partial exposure of the seed layer). • Coating the exposed seed layer • Remove the photoresist film and remove unwanted seed layers. The resulting patterned electroplated coating becomes the first conductor layer 3.

[0123] Through the above steps, a patterned first conductor layer is formed. It should be noted that a portion of the first conductor layer 3 is formed along the inner wall of the through-hole in the first insulating layer 2.

[0124] Next, a third insulating layer 4 with a through hole 4a is formed on the first conductor layer 3. Figure 2D It should be noted that the third insulating layer 4 covers the patterned first conductor layer 3. The formation of the third insulating layer 4 can be performed, for example, by coating a photosensitive liquid resin composition containing photosensitive polyimide and drying it, and selectively exposing and developing the formed photosensitive polyimide film.

[0125] Next, a patterned fourth conductor layer 5 is formed on the third insulating layer 4 and inside the through hole 4a. Figure 2E The formation of the fourth conductor layer 5 can be carried out, for example, as follows.

[0126] • A seed layer (not shown) is formed on the third insulating layer 4. • A photoresist film is formed on the seed layer (not shown). • A resist pattern is formed by selective exposure and development of the photoresist film (partial exposure of the seed layer). • Electroplating is performed on the exposed seed layer. • Remove the photoresist film and remove unwanted seed layers. The resulting patterned electroplated coating becomes the fourth conductor layer 5.

[0127] Through the above steps, a patterned fourth conductor layer 5 is formed. It should be noted that a portion of the fourth conductor layer 5 is electrically connected to the first conductor layer 3.

[0128] Next, a fourth insulating layer 6 with a through hole 6a is formed on the fourth conductor layer 5. Figure 2F The fourth insulating layer 6 covers the patterned fourth conductor layer 5. The fourth insulating layer 6 can be formed, for example, by coating a photosensitive liquid resin composition containing photosensitive polyimide and drying it, and selectively exposing and developing the formed photosensitive polyimide film.

[0129] Next, a through hole 1a is formed in the second conductor layer 1, which is the metal core layer, from the side opposite to the first insulating layer 2. Figure 2G The formation of the through hole 1a can be carried out, for example, as follows.

[0130] • A photoresist film (not shown) is formed on the surface of the second conductor layer 1, which serves as the metal core layer, on the side opposite to the first insulating layer 2. • A photoresist pattern is formed by selectively exposing and developing the photoresist film (partially exposing the metal core layer). • Perform wet etching on the exposed metal core layer (e.g., wet etching using ferric chloride). • Removal of photoresist film Through the above steps, a through hole 1a is formed in the second conductor layer 1, which serves as the metal core layer.

[0131] Next, after forming a second insulating layer 7 on the second conductor layer 1, which serves as a metal core layer, and by filling the through-hole 1a of the second conductor layer 1, a through-hole 7a is formed in the second insulating layer 7 within the through-hole 1a of the second conductor layer 1. Figure 2H This process can be performed, for example, by attaching a photosensitive epoxy resin film in a bismuth state to the second conductor layer 1, and then selectively exposing and developing the film. Then, heating is performed for further curing (for propyl curing).

[0132] Next, a patterned conductor layer is formed on the second insulating layer 7 and within the through-hole 7a of the second insulating layer 7. Figure 2I The formation of patterned conductor layers can be carried out, for example, as follows.

[0133] A seed layer (not shown) is formed on the second insulating layer 7. • A photoresist film is formed on the seed layer (not shown). • A resist pattern is formed by selective exposure and development of the photoresist film (partial exposure of the seed layer). • Coating the exposed seed layer • Remove the photoresist film and remove unwanted seed layers. Through the above steps, a patterned conductor layer is formed. The portion of the patterned conductor layer that fills the through-holes 7a of the second insulating layer 7 becomes the interlayer connection portion 10. The remaining portion of the patterned conductor layer becomes the third conductor layer 8.

[0134] Next, a fifth insulating layer 9 with through holes 9a is formed on the patterned third conductor layer 8. Figure 2J The fifth insulating layer 9 can be formed, for example, by attaching a photosensitive resin film, which will later become the fifth insulating layer 9, onto the third conductor layer 8, and then selectively exposing and developing the film. By forming the insulating layer using the attachment of the film, an insulating layer with a flat surface can be formed without being affected by the pattern of the third conductor layer 8.

[0135] Through the above steps, we obtain Figure 2J ( Figure 1 The wiring circuit board shown is shown in the figure.

[0136] exist Figure 1 In the wiring circuit board shown, the first insulating layer 2, the third insulating layer 4, and the fourth insulating layer 6 are formed using the same resin material. It should be noted that the first insulating layer, the third insulating layer, and the fourth insulating layer can be formed using the same resin material, or they can be formed using different resin materials.

[0137] In addition, Figure 1 In the wiring circuit board shown, the second insulating layer 7 and the fifth insulating layer 9 are formed using different resin materials. It should be noted that the second insulating layer and the fifth insulating layer can be formed using the same resin material or different resin materials.

[0138] Next, another example of a wiring circuit board will be described.

[0139] Figure 3 This is a cross-sectional schematic diagram of another example of a wiring circuit board.

[0140] Figure 3 The wiring circuit board shown is different except for the fourth insulating layer, in order to be compatible with... Figure 1 The wiring circuit board shown has the same structure.

[0141] Figure 3The fourth insulating layer 16 in the wiring circuit board shown is disposed on the side of the fourth conductor layer 5 opposite to the side of the third insulating layer 4. The fourth insulating layer 16 covers the fourth conductor layer 5.

[0142] The fourth insulating layer 16 can be formed, for example, by attaching a photosensitive resin film, which will later become the fourth insulating layer 16, onto the fourth conductor layer 5, and then selectively exposing and developing the film. By forming the insulating layer using the attachment of the film, an insulating layer with a flat surface can be formed without being affected by the pattern of the fourth conductor layer 5.

[0143] It should be noted that, in Figure 3 In the wiring circuit board shown, the fourth insulating layer 16 and the fifth insulating layer 9 are formed using the same resin material.

[0144] Figure 4 This is a cross-sectional schematic diagram of another example of a wiring circuit board.

[0145] Figure 4 The wiring circuit board shown is different from the fourth and fifth insulating layers, except that it is designed to be compatible with... Figure 1 The wiring circuit board shown has the same structure.

[0146] Figure 4 The fourth insulating layer 26 in the wiring circuit board shown is disposed on the side of the fourth conductor layer 5 opposite to the side of the third insulating layer 4. The fourth insulating layer 26 covers the fourth conductor layer 5.

[0147] Figure 4 The fifth insulating layer 19 in the wiring circuit board shown is disposed on the side of the third conductor layer 8 opposite to the side of the second insulating layer 7. The fifth insulating layer 19 covers the third conductor layer 8.

[0148] The fourth insulating layer 26 can be formed, for example, by attaching a photosensitive resin film, which will later become the fourth insulating layer 26, onto the fourth conductor layer 5, and then selectively exposing and developing the film. By forming the insulating layer using the attachment of the film, an insulating layer with a flat surface can be formed without being affected by the pattern of the fourth conductor layer 5.

[0149] The fifth insulating layer 19 can be formed, for example, by attaching a photosensitive resin film, which will later become the fifth insulating layer 19, onto the third conductor layer 8, and then selectively exposing and developing the film. By forming the insulating layer using the attachment of the film, an insulating layer with a flat surface can be formed without being affected by the pattern of the third conductor layer 8.

[0150] It should be noted that, in Figure 4 In the wiring circuit board shown, the second insulating layer 7, the fourth insulating layer 16, and the fifth insulating layer 29 are formed using the same resin material.

[0151] Figure 5 This is a cross-sectional schematic diagram of another example of a wiring circuit board.

[0152] Figure 5 The wiring circuit board shown is different from the fourth and fifth insulating layers, except that it is designed to be compatible with... Figure 1 The wiring circuit board shown has the same structure.

[0153] Figure 5 The fourth insulating layer 16 in the wiring circuit board shown is disposed on the side of the fourth conductor layer 5 opposite to the side of the third insulating layer 4. The fourth insulating layer 16 covers the fourth conductor layer 5.

[0154] Figure 5 The fifth insulating layer 29 in the wiring circuit board shown is disposed on the side of the third conductor layer 8 opposite to the side of the second insulating layer 7. The fifth insulating layer 29 covers the third conductor layer 8.

[0155] The fourth insulating layer 16 can be formed, for example, by attaching a photosensitive resin film, which will later become the fourth insulating layer 16, onto the fourth conductor layer 5, and then selectively exposing and developing the film. By forming the insulating layer using the attachment of the film, an insulating layer with a flat surface can be formed without being affected by the pattern of the fourth conductor layer 5.

[0156] The fifth insulating layer 29 can be formed, for example, by coating a photosensitive liquid resin composition containing photosensitive polyimide and drying it, and selectively exposing and developing the formed photosensitive polyimide film. By using a liquid resin composition in the formation of the insulating layer, a thin insulating layer can be formed.

[0157] Figure 6 This is a cross-sectional schematic diagram of another example of a wiring circuit board.

[0158] Figure 6 The wiring circuit board shown is different except for the fifth insulating layer, in order to be similar to... Figure 1 The wiring circuit board shown has the same structure.

[0159] Figure 6 The fifth insulating layer 29 in the wiring circuit board shown is disposed on the side of the third conductor layer 8 opposite to the side of the second insulating layer 7. The fifth insulating layer 29 covers the third conductor layer 8.

[0160] The fifth insulating layer 29 can be formed, for example, by coating a photosensitive liquid resin composition containing photosensitive polyimide and drying it, and selectively exposing and developing the formed photosensitive polyimide film. By using a liquid resin composition in the formation of the insulating layer, a thin insulating layer can be formed.

[0161] The material used for the insulating layers (e.g., the first, second, third, fourth, and fifth insulating layers) in the wiring circuit board is not particularly limited, and synthetic resins are examples. Examples of synthetic resins include polyimide resins, epoxy resins, polyether nitrile resins, polyethersulfone resins, polyethylene terephthalate, polyethylene naphthalate, and polyvinyl chloride. From the viewpoint of excellent heat resistance, low linear expansion, and insulation withstand voltage, polyimide resins and epoxy resins are preferred.

[0162] The insulation layer may or may not contain fillers, but when it does not contain fillers, it has excellent insulation properties and excellent suppression of leakage current.

[0163] The insulation layer may or may not contain glass fibers. Insulation layers containing glass fibers, such as glass epoxy resin represented by FR4 (Flame Retardant Type 4), are made by impregnating glass fiber cloth in a synthetic resin.

[0164] There are no particular limitations on the thickness of the insulating layer, for example, it can be 1. μ m or more, preferably 3 μ m or more; in addition, for example, 35 μ Below m, preferably 20 μ Below m.

[0165] Materials used as conductor layers (e.g., first conductor layer, second conductor layer, third conductor layer, fourth conductor layer) and interlayer connections in wiring circuit boards can include, for example, metallic materials. Examples of metallic materials include copper, nickel, gold, solder, and alloys thereof.

[0166] There are no particular limitations on the thickness of the conductor layer, for example, it can be 3. μ m or more, preferably 5 μ m or more; in addition, for example, 50 μ Below m, preferably 30 μ Below m.

[0167] Wiring circuit boards can also have a seed layer. The seed layer is used as a conductive layer for electroplating.

[0168] Materials that can be used as seed layers include, for example, copper, chromium, nickel, and their alloys.

[0169] (Manufacturing method of semiconductor package) The method for manufacturing a semiconductor package of the present invention includes the method for manufacturing a wiring circuit substrate of the present invention.

[0170] Semiconductor packages, for example, contain semiconductor chips that are connected to a wiring circuit board.

[0171] Semiconductor packages include, for example, a sealing resin that seals a semiconductor chip.

[0172] Examples of semiconductor packages include: FC-CSP (Flip Chip-Chip Scale Package), MIS-BGA (Molded Interconnect Substrate-Ball Grid Array) package, ETS-BGA (Embedded Trace Substrate-Ball Grid Array) package, Fan-out type WLP (Wafer Level Package), Fan-in type WLP, Fan-out type PLP (Panel Level Package), Fan-in type PLP, FC-BGA type (Flip Chip-Ball Grid Array), and high-end 2.5D and 3D packages.

[0173] (Manufacturing methods for electronic devices) The method for manufacturing the electronic device of the present invention includes the method for manufacturing the semiconductor package of the present invention.

[0174] As electronic devices, there are no particular limitations. Examples include ICT infrastructure equipment such as servers, routers, supercomputers, mainframes, and workstations; antennas such as GPS antennas, wireless base station antennas, millimeter-wave antennas, and RFID antennas; communication equipment such as mobile phones, smartphones, PHS, PDAs, and tablet terminals; digital devices such as personal computers, televisions, digital cameras, digital camcorders, POS terminals, wearable terminals, and digital media players; vehicle-mounted electronic equipment such as electronic control systems, vehicle-mounted communication equipment, car navigation equipment, millimeter-wave radar, and vehicle-mounted camera modules; semiconductor testing equipment and high-frequency measuring devices; etc.

Claims

1. A method for manufacturing a wiring circuit board, characterized in that, The wiring circuit board has: First insulating layer; A second insulating layer is disposed on one side of the first insulating layer; A first conductor layer is disposed on the other side of the first insulating layer; The second conductor layer is embedded in the second insulating layer. The method for manufacturing the wiring circuit board includes: The process of coating a liquid resin composition to form the first insulating layer; as well as The process of attaching a film-like resin composition to form the second insulating layer.

2. The method for manufacturing a wiring circuit board according to claim 1, wherein, The liquid resin composition is a polyimide resin composition. The film-like resin composition comprises a layer in the ethyl phase formed from an epoxy resin composition.

3. The method for manufacturing a wiring circuit board according to claim 1, wherein, The process of applying the liquid resin composition is performed after the process of coating the liquid resin composition.

4. The method for manufacturing a wiring circuit board according to claim 1, wherein, The second conductor layer in the wiring circuit board has through holes. The method for manufacturing the wiring circuit board includes the step of forming the through-hole in the second conductor layer. The process of forming the through-hole in the second conductor layer is performed between the process of coating the liquid resin composition and the process of attaching the film resin composition.

5. The method for manufacturing a wiring circuit board according to claim 4, wherein, The second conductor layer is a metal core layer.

6. The method for manufacturing a wiring circuit board according to claim 1, wherein, In the wiring circuit board, the second conductor layer is in contact with the first insulating layer.

7. The method for manufacturing a wiring circuit board according to claim 1, wherein, In the wiring circuit substrate, the second conductor layer is a metal core layer with through holes. The wiring circuit board has an interlayer connection portion disposed within the through hole and a third conductor layer disposed on the side of the second insulating layer opposite to the side of the first insulating layer. In the wiring circuit board, the first conductor layer and the third conductor layer are electrically connected through the interlayer connection portion. In the wiring circuit board, a second insulating layer exists between the interlayer connection portion and the metal core layer.

8. The method for manufacturing a wiring circuit board according to claim 1, wherein, In the wiring circuit substrate, the first insulating layer and the second insulating layer have different coefficients of linear expansion.

9. A method for manufacturing a semiconductor package, characterized in that, A method for manufacturing a wiring circuit board comprising any one of claims 1 to 8.

10. A method for manufacturing an electronic device, characterized in that, A method for manufacturing a semiconductor package as described in claim 9.

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