A cooling chamber turnover device and method for a semiconductor apparatus

Abstract

This invention discloses a cooling chamber flipping device and method for semiconductor equipment, belonging to the field of semiconductor equipment technology. The flipping device includes a base plate, with two side plates symmetrically arranged above the base plate. Each side plate has a guide groove on its side wall, which includes a vertical groove and an arc-shaped groove that are connected. The inner arc side of the arc-shaped groove faces the vertical groove, and one end of the arc-shaped groove is located in the middle of the vertical groove. A fixing plate assembly is provided between the two side plates. The fixing plate assembly includes an L-shaped plate. The vertical section of the L-shaped plate has two sets of guide rollers from top to bottom, which are used to cooperate with the guide groove. The horizontal section of the L-shaped plate is located at the top of the vertical section, and the top of the horizontal section has several first positioning pins. This invention, by setting a guide groove on the side plate formed by the connection of the vertical groove and the arc-shaped groove, and the guide rollers rolling and limiting the movement, realizes an orderly compound movement of the cooling chamber, which first vertically lifts and then flips and opens, solving the problem of difficult manual lifting and disassembly in the narrow maintenance space of semiconductor equipment.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor equipment technology, and particularly relates to a cooling chamber flipping device and method for semiconductor equipment. Background Technology

[0002] In semiconductor vacuum processing equipment, the transfer cavity is the core module for transferring wafers between different process chambers. To prevent thermal deformation, oxidation, or process parameter drift of high-temperature wafers during transfer, a cooling station is typically integrated inside the transfer cavity. This station cools the wafers after high-temperature processes, ensuring that the wafer exiting the cavity is below the equipment's maximum operating temperature. This cooling station is an integrated module combining water-cooling channels, a wafer carrier platform, sealing components, and a positioning structure, weighing approximately 20 kg. It is a core functional component of the transfer cavity. During long-term operation, the cooling station must maintain cleanliness to ensure product yield. Seals will age and wear out, therefore periodic shutdowns for disassembly and maintenance are necessary. This includes cleaning, leak detection, consumable replacement, and precision calibration—essential procedures for the daily operation and maintenance of semiconductor equipment.

[0003] Due to the constraints of the compact overall layout, the periphery of the transmission cavity integrates a large number of process pipelines, vacuum valve assemblies, and electrical modules, leaving extremely narrow maintenance and operation space, barely enough for one worker to work sideways, with no extra operational margin. The existing cooling station adopts an embedded installation structure, locked to the cavity by positioning pins and fixing bolts. The entire assembly and disassembly process relies on manual labor: during installation, workers must lift the 20kg cooling unit upwards throughout the process, maintaining the raised posture to accurately align it with the positioning hole on the bracket. After the positioning pin is fully inserted into place, the fixing bolt is tightened with one hand. The disassembly process is the reverse, also requiring the unit to be lifted throughout the process to prevent the parts from falling and being bumped.

[0004] In actual operation and maintenance, a single person cannot complete the entire disassembly and assembly process independently. Two workers are required to work together: one person crouches on the side of the vacuum chamber, supporting the cooling station with both hands throughout the process, while the other person squeezes into the narrow space behind the supporter, bending over to complete the bolt removal and alignment operations. Lifting a 20kg component manually for extended periods is extremely physically demanding on the operators, and the alignment of the positioning pins requires repeated fine-tuning of the component's position. The entire routine maintenance operation takes up to 2 hours, significantly increasing equipment downtime, directly reducing production line uptime, and causing production capacity losses.

[0005] In addition, existing disassembly and assembly methods pose a high risk of equipment damage. When operators lift the cooling station, the component itself obstructs the view of the vacuum chamber and mounting bracket, making it impossible to clearly observe the alignment of the positioning pins and the contact surface of the chamber. During the lifting of heavy objects, hand movements and deviations are prone to occur, and the metal casing of the cooling station is easily scratched against the inner wall of the vacuum chamber and the surface of the mounting bracket, resulting in scratches and dents. The vacuum chamber is a high-precision vacuum sealing component; scratches on the inner wall will damage the flatness of the sealing surface, increasing the risk of vacuum leakage. Wear on the bracket surface will reduce the assembly positioning accuracy of the cooling station, leading to a decrease in the uniformity of wafer cooling temperature and affecting product yield. In summary, the existing purely manual disassembly and assembly maintenance solution has multiple drawbacks, including high operational difficulty, high labor costs, long maintenance cycles, and easy damage to precision cavity components, making it difficult to meet the high-efficiency and low-damage operation and maintenance requirements of semiconductor mass production equipment. Summary of the Invention

[0006] Based on the technical problems existing in the prior art, the present invention provides a cooling chamber flipping device and method for semiconductor equipment.

[0007] According to a first aspect of the technical solution of the present invention, a cooling chamber flipping device for a semiconductor device is provided, comprising a base plate, two side plates symmetrically arranged above the base plate, each side plate having a guide groove on its side wall, the guide groove including a vertical groove and an arc groove connected to each other, the inner arc side of the arc groove facing the vertical groove, one end of the arc groove being located in the middle of the vertical groove, a fixing plate assembly being provided between the two side plates, the fixing plate assembly including an L-shaped plate, the vertical section of the L-shaped plate having two sets of guide rollers from top to bottom, the two sets of guide rollers being used to cooperate with the guide groove, the horizontal section of the L-shaped plate being located at the top of the vertical section, the top of the horizontal section having a plurality of first positioning pins.

[0008] A further improvement of the present invention is that: a connecting plate is horizontally provided on the top of each side plate, and a second positioning pin is provided on the top of each connecting plate.

[0009] A further improvement of the present invention is that: a linear motion mechanism is provided below the base plate, the output end of the linear motion mechanism is vertically arranged through the base plate, a cavity is opened in the middle of the vertical section of the L-shaped plate, the fixed plate assembly also includes a hinge pin, the hinge pin is horizontally arranged in the cavity, and the hinge pin is connected to the output end of the linear motion mechanism through a connecting rod.

[0010] A further improvement of the present invention is that: gaskets are provided on both sides of the vertical section.

[0011] A further improvement of the present invention is that protective covers are provided on the outer surfaces of the two side plates and on the outer wall away from the horizontal section.

[0012] A further improvement of the present invention is that the linear motion mechanism is a cylinder assembly, the cylinder assembly includes a cylinder, a first connector and a second connector, the first connector is provided at the air inlet of the cylinder opening chamber, and the second connector is provided at the air inlet of the cylinder closing chamber, the first connector and the second connector are respectively connected to the air circuit assembly.

[0013] A further improvement of the present invention is that the output end of the linear motion mechanism is a double elbow joint.

[0014] A further improvement of the present invention is that the hinge pin is in clearance fit with the connecting rod, and the guide groove is in clearance fit with the guide roller.

[0015] A further improvement of the present invention is that the pneumatic assembly includes three first pneumatic connectors, a three-position five-way valve, two Y-type connectors, two second pneumatic connectors, a first pilot-operated exhaust throttle valve, a second pilot-operated exhaust throttle valve, and two third pneumatic connectors. The three first pneumatic connectors are connector IN, connector C, and connector O, respectively. One side of the three-position five-way valve has connector IN, and the other side of the three-position five-way valve has connectors C and O, respectively. Connectors C and O are each connected to an independent end of a Y-type connector. The Y-type connector includes a first Y-type connector and a second Y-type connector. The first end of the first Y-type connector passes through a... The second pneumatic connector is connected to the first end of the first pilot-operated exhaust throttle valve, and the second end of the first Y-type connector is connected to the second end of the second pilot-operated exhaust throttle valve. The first end of the second Y-type connector is connected to the second end of the first pilot-operated exhaust throttle valve, and the second end of the second Y-type connector is connected to the first end of the second pilot-operated exhaust throttle valve via a second pneumatic connector. The third end of the first pilot-operated exhaust throttle valve is connected to the second connector via a third pneumatic connector, and the third end of the second pilot-operated exhaust throttle valve is connected to the first connector via a third pneumatic connector.

[0016] According to a second aspect of the present invention, a method for flipping a cooling chamber in a semiconductor device is provided, comprising the following steps based on the above-described cooling chamber flipping device: Step S1: Position and fix the cooling chamber on the horizontal section of the L-shaped plate using the first positioning pin. In the initial state, both sets of guide rollers are located on the upper part of the vertical groove of the guide groove, and the cooling chamber maintains a vertical working posture. Step S2: Drive the fixed plate assembly to move downward in the vertical direction, and the two sets of guide rollers roll downward synchronously along the vertical groove, causing the cooling chamber to descend vertically; Step S3: When the upper guide roller moves to the position where the vertical groove and the arc groove are connected, the upper guide roller enters the arc groove and rolls along its trajectory, while the lower guide roller continues to move downward along the vertical groove. The fixed plate assembly rotates outward with the lower guide roller as the pivot axis, causing the cooling chamber to rotate and unfold from the vertical posture to the maintenance posture. Step S4: Drive the fixed plate assembly to move vertically upward, the lower guide roller rolls upward along the vertical groove, the upper guide roller rolls backward along the arc groove, and the fixed plate assembly flips inward about the lower guide roller as the axis of rotation, thereby driving the cooling chamber to gradually return from the maintenance posture to the vertical posture. Step S5: After the upper guide rollers retract into the vertical groove, the two sets of guide rollers roll upwards synchronously along the vertical groove, causing the cooling chamber to rise vertically and return to the initial vertical working posture.

[0017] Compared with the prior art, the above-mentioned technical solution of the present invention has the following beneficial technical effects: 1. This invention solves the problems of difficult manual lifting and disassembly and poor alignment accuracy in the narrow maintenance space of semiconductor equipment, by setting a composite guide groove composed of vertical grooves and arc grooves connected on the side plate, and using two sets of guide rollers on the L-shaped plate for rolling limit, and using a first positioning pin to achieve precise positioning and installation of the cooling chamber. This enables the cooling chamber to first rise and fall vertically and then flip open and close in an orderly composite motion, thus solving the problems of difficult manual lifting and disassembly and poor alignment accuracy in the narrow maintenance space of semiconductor equipment. It also avoids metal parts scraping against the vacuum chamber and mounting bracket during disassembly and assembly, effectively reducing the difficulty of maintenance operations and improving the protection effect of the chamber components.

[0018] 2. This invention achieves rapid alignment and installation of the flipping device and the semiconductor equipment cavity by horizontally setting a connecting plate at the top of each side plate and setting a second positioning pin at the top of the connecting plate. This results in high-precision assembly and fixing of the entire device, solving the problems of difficult alignment and large deviation in assembly position of the flipping device. It effectively improves the installation efficiency and positioning accuracy of the device, ensures the correspondence between the guide groove movement trajectory and the cavity installation position, and avoids movement jamming and component scratching caused by assembly deviation.

[0019] 3. This invention uses a linear motion mechanism set below the base plate, and a connecting rod and hinge pin to transmit linear power to the fixed plate assembly. The hinge pin is arranged in the cavity of the vertical section of the L-shaped plate to realize the hinge transmission, which realizes the transformation of linear reciprocating motion into a composite motion of lifting and flipping of the cooling chamber. This solves the problems of high physical consumption and low operating efficiency of manually driving the cooling chamber. The overall transmission structure is compact, suitable for narrow installation space, and can stably output power to drive the heavy-duty cooling chamber to complete the opening and closing action.

[0020] 4. This invention uses a shim fixed at the top of the horizontal section of the L-shaped plate as a buffer layer between the cooling chamber and the fixed plate to achieve soft contact and friction reduction protection of the assembly surface. This solves the problems of hard contact between the cooling chamber and the metal fixed plate, which easily causes scratches and wear, and poor fit of the assembly surface. It can effectively protect the mounting base of the cooling chamber, avoid scratches during disassembly and assembly, and buffer vibrations during movement, thereby improving assembly stability and component lifespan.

[0021] 5. This invention provides a protective cover on the outer side of the two side plates and on the outer wall away from the horizontal section. The protective cover encloses the moving area and transmission components of the device, thus achieving physical isolation and protection of the internal moving mechanism. This solves the problem of personal injury and component damage caused by tools or limbs accidentally entering the moving area during operation and maintenance. It can effectively avoid safety risks such as pinching and bumping during movement, while preventing dust and foreign objects from falling into the guide groove and hinge parts, reducing component wear, and improving the operational safety and service life of the device.

[0022] 6. This invention uses a cylinder assembly as a linear motion mechanism. The air ports of the cylinder opening and closing chambers are respectively equipped with a first connector and a second connector and connected to the air circuit assembly. This enables the cooling chamber to be driven to complete the opening and closing action using clean and dry air as a power source. This solves the problem that electric drive mechanisms are not suitable for semiconductor vacuum clean environments and are prone to particulate contamination. It is compatible with the general CDA air source in semiconductor plants, and the power output is stable and clean, which can meet the cleanliness requirements of semiconductor equipment. At the same time, the pneumatic drive has a fast response speed and low operation and maintenance costs.

[0023] 7. This invention sets the output end of the linear motion mechanism as a double elbow joint and uses a double hinge structure to connect the output end and the connecting rod, realizing adaptive angle deflection compensation during the transmission process. This solves the problems of off-center load and motion jamming caused by changes in the motion trajectory angle during the reciprocating transmission of the connecting rod. It can automatically offset assembly errors and motion angle deviations, reduce wear and stress concentration at the hinge parts, ensure smooth and stable transmission, and effectively improve the service life and operational reliability of the transmission components.

[0024] 8. This invention sets the hinge pin and connecting rod to a clearance fit, and the guide groove and guide roller to a clearance fit. By using a reasonable clearance allowance to adapt to dimensional deviations and thermal deformation during the movement process, the smooth rolling of the guide roller and the flexible rotation of the hinge pin are achieved. This solves the problems of motion jamming and high frictional resistance caused by excessively small fit clearances. It can effectively reduce the wear of moving parts, improve motion accuracy and running stability, reduce the frequency of component maintenance and replacement, and extend the overall service life of the device.

[0025] 9. This invention constructs an air circuit assembly by using a three-position five-way valve in conjunction with two sets of pilot-operated exhaust throttle valves. The air circuit is connected in an orderly manner through Y-type connectors and multiple sets of pneumatic connectors, enabling independent adjustment of the opening and closing speed of the cooling chamber, start and stop at any position, and self-locking function in case of power failure or air failure. This solves the safety hazards of parts falling and uncontrollable movement speed after the pneumatic mechanism loses pressure. It can precisely adjust the movement speed of lifting and tilting, ensuring smooth and shock-free movement. At the same time, it automatically locks in the case of pressure loss, effectively improving the operational safety and reliability of the device.

[0026] 10. This invention achieves standardized and orderly movement of the cooling chamber opening and closing process by adopting an opening step of vertical descent followed by flipping and unfolding, and a closing step of reverse flipping followed by vertical lifting. This solves the problems of non-standardized manual disassembly and assembly procedures, easy bumps and scratches, and low operating efficiency. The opening and closing of the cooling chamber can be completed smoothly in a narrow maintenance space without the need for manual lifting of heavy objects. This effectively reduces the operational difficulty and physical exertion of maintenance personnel, and improves the efficiency and consistency of maintenance work. Attached Figure Description

[0027] The accompanying drawings are provided to better understand the invention and are not intended to unduly limit the scope of the invention. Wherein: Figure 1 This is a schematic diagram showing the connection between a cooling chamber flipping device for semiconductor equipment and a cooling chamber according to the present invention; Figure 2 This is a schematic diagram of the structure of a cooling chamber flipping device for semiconductor equipment according to the present invention; Figure 3 This is a schematic diagram showing the position of the connecting rod in a cooling chamber flipping device for semiconductor equipment according to the present invention; Figure 4 This is a schematic diagram of the cylinder assembly in a cooling chamber flipping device for semiconductor equipment according to the present invention; Figure 5 This is a schematic diagram of the structure of a fixed plate assembly in a cooling chamber flipping device for semiconductor equipment according to the present invention; Figure 6 This is a schematic diagram illustrating the working process of a cooling chamber flipping device for semiconductor equipment according to the present invention; Figure 7 This is a schematic diagram of the connection relationship of the air path components in a cooling chamber flipping device for semiconductor equipment according to the present invention; Figure 8 This is a schematic diagram of the working principle of the air path assembly in a cooling chamber flipping device for semiconductor equipment according to the present invention; Figure 9 This is a schematic diagram of the structure of a cooling chamber flipping device for semiconductor equipment of the present invention when no linear motion mechanism is provided; Figure 10This is a schematic diagram of the structure of a protective cover in a cooling chamber flipping device for semiconductor equipment according to the present invention.

[0028] Explanation of reference numerals in the attached drawings: 1-Linear motion mechanism; 2-Base plate; 3-First side plate; 4-Second side plate; 5-Fixed plate assembly; 6-Pneumatic circuit assembly; 7-Connecting rod; 8-Guide groove; 9-Connecting plate; 12-Cylinder; 13-First connector; 14-Second connector; 51-L-shaped plate; 52-Guide roller; 53-Hinge pin; 54-Washer; 55-First positioning pin; 61-First pneumatic connector; 62-Three-position five-way valve; 63-Y-type connector; 64-Second pneumatic connector; 65-First pilot-operated exhaust throttle valve; 66-Second pilot-operated exhaust throttle valve; 67-Third pneumatic connector; 81-Vertical groove; 82-Arc-shaped groove; 91-Second positioning pin. Detailed Implementation

[0029] The following description, in conjunction with the accompanying drawings, illustrates exemplary embodiments of the present invention, including various details to aid understanding. These details should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the invention. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0030] This invention discloses a cooling chamber flipping device and method for semiconductor equipment, belonging to the field of semiconductor equipment technology. The flipping device includes a base plate, with two side plates symmetrically arranged above the base plate. Each side plate has a guide groove on its side wall, which includes a vertical groove and an arc-shaped groove that are connected. The inner arc side of the arc-shaped groove faces the vertical groove, and one end of the arc-shaped groove is located in the middle of the vertical groove. A fixing plate assembly is provided between the two side plates. The fixing plate assembly includes an L-shaped plate. The vertical section of the L-shaped plate has two sets of guide rollers from top to bottom, which are used to cooperate with the guide groove. The horizontal section of the L-shaped plate is located at the top of the vertical section, and the top of the horizontal section has several first positioning pins. This invention, by setting a guide groove on the side plate formed by the connection of the vertical groove and the arc-shaped groove, and the guide rollers rolling and limiting the movement, realizes an orderly compound movement of the cooling chamber, which first vertically lifts and then flips and opens, solving the problem of difficult manual lifting and disassembly in the narrow maintenance space of semiconductor equipment.

[0031] The technical solution of the present invention will be described below with reference to the embodiments and accompanying drawings.

[0032] Example 1 like Figure 1-10As shown, a cooling chamber flipping device for semiconductor equipment is provided, which includes a base plate 2. Two side plates are symmetrically arranged above the base plate 2. Each side plate has a guide groove 8 on its side wall. The guide groove 8 includes a vertical groove 81 and an arc groove 82 that are connected to each other. The inner arc side of the arc groove 82 faces the vertical groove 81. One end of the arc groove 82 is located in the middle of the vertical groove 81. A fixing plate assembly 5 is provided between the two side plates. The fixing plate assembly 5 includes an L-shaped plate 51. The vertical section of the L-shaped plate 51 is provided with two sets of guide rollers 52 from top to bottom. The two sets of guide rollers 52 are used to cooperate with the guide groove 8. The horizontal section of the L-shaped plate 51 is located at the top of the vertical section. The top of the horizontal section is provided with a plurality of first positioning pins 55. The base plate 2 serves as the overall support base for the device. Two side plates are vertically and symmetrically fixed to the upper surface of the base plate 2 by bolts. These two side plates are the first side plate 3 and the second side plate 4, ensuring uniform force distribution and symmetrical motion trajectory. The guide groove 8 is a trajectory constraint structure. The vertical groove 81 is used to constrain the vertical lifting and lowering path of the guide roller 52, realizing the vertical lifting and lowering of the cooling chamber. The arc-shaped groove 82 is used to constrain the flipping path of the guide roller 52, realizing the rotational opening and closing of the cooling chamber. The two are connected to form a composite motion track of "lifting first, then flipping". The fixed plate assembly 5 is the support mounting base for the cooling chamber. The vertical section of the L-shaped plate 51 is the mounting carrier for the guide and transmission structure, and the horizontal section is the mounting surface for the cooling chamber. The two sets of guide rollers 52 are respectively embedded in the guide grooves 8 of the two side plates, rolling with the groove walls to significantly reduce motion friction resistance. The first positioning pin 55 is vertically fixed to the upper surface of the horizontal section for precise insertion with the positioning hole at the bottom of the cooling chamber, realizing rapid alignment and installation of the cooling chamber and ensuring assembly position accuracy. During operation, the power-driven fixed plate assembly 5 descends, and the upper and lower sets of guide rollers 52 first roll vertically downwards along the vertical groove 81, causing the entire cooling chamber to descend vertically. When the upper guide roller 52 reaches the junction of the vertical groove 81 and the arc-shaped groove 82, the upper guide roller 52 enters the arc-shaped groove 82 and rolls along the arc-shaped trajectory, while the lower guide roller 52 continues to descend along the vertical groove 81 to the bottom of the groove. At this point, the fixed plate assembly 5 rotates outwards using the lower guide roller 52 as the pivot axis, causing the cooling chamber to rotate from a vertical working posture to a horizontal maintenance posture. This structure, through the purely mechanical trajectory constraint of the composite guide groove, allows the opening and closing of the cooling chamber to be completed without manual lifting in a confined equipment maintenance space. This effectively avoids metal parts scraping against the vacuum chamber and mounting bracket during disassembly and assembly, significantly reducing the difficulty of maintenance operations and improving work efficiency.

[0033] Specifically, each side plate has a horizontally mounted connecting plate 9 at its top, and each connecting plate 9 has a second positioning pin 91 at its top. The connecting plates 9 are horizontally fixed to the top end face of the side plate by bolts or welding. The connecting plates 9 of the two side plates are on the same horizontal plane, increasing the contact area between the flipping device and the mounting surface of the semiconductor equipment cavity, thus improving the overall installation stability and load-bearing capacity of the device. The second positioning pins 91 are vertically fastened to the upper surface of the connecting plates 9, corresponding one-to-one with the positioning holes at the bottom of the equipment cavity. During installation, the second positioning pins 91 are inserted into the corresponding positioning holes in the cavity, enabling rapid alignment of the entire flipping device on the semiconductor equipment without repeated position adjustments. This also ensures the relative positional accuracy of the device guide groove 8 and the cavity mounting position, preventing assembly deviations that could cause the guide roller 52 to jam or deviate from its trajectory. This structure effectively improves the installation efficiency and assembly accuracy of the device, ensures the positional accuracy of the flipping action, and reduces the debugging cost of on-site installation.

[0034] Specifically, a linear motion mechanism 1 is provided below the base plate 2. The output end of the linear motion mechanism 1 is vertically arranged through the base plate 2. A cavity is opened in the middle of the vertical section of the L-shaped plate 51. The fixed plate assembly 5 also includes a hinge pin 53, which is horizontally arranged in the cavity. The hinge pin 53 is connected to the output end of the linear motion mechanism 1 through a connecting rod 7. The linear motion mechanism 1 is fixed to the lower surface of the base plate 2 by mounting bracket bolts. Its output end is a retractable power end, which passes vertically upward through the clearance hole opened on the base plate 2 and is hinged to the lower end of the connecting rod 7. The upper end of the connecting rod 7 extends into the cavity of the vertical section of the L-shaped plate 51. The hinge pin 53 horizontally passes through the hinge hole at the upper end of the connecting rod 7 and the two side walls of the L-shaped plate 51, hinged the connecting rod 7 and the L-shaped plate 51 into one unit. The two ends of the hinge pin 53 are axially limited by threads or snap rings. The cavity is used to embed and accommodate the hinge structure of the connecting rod 7 and the hinge pin 53, so that the transmission structure does not occupy additional external space, reducing the overall size of the device and adapting to the narrow installation environment of semiconductor equipment. The hinge pin 53 serves as a hinge shaft, enabling adaptive rotation of the connecting rod 7 and the fixed plate assembly 5, converting the linear reciprocating power of the linear motion mechanism 1 into a composite motion of lifting and flipping of the fixed plate assembly 5. The connecting rod 7 plays the role of power transmission and stroke connection, compensating for the positional difference between the linear motion trajectory and the flipping motion trajectory, ensuring smooth transmission without jamming. During operation, the output end of the linear motion mechanism 1 retracts downward, pulling the connecting rod 7 downward synchronously, causing the fixed plate assembly 5 to first descend vertically and then flip outward; when the output end extends upward, it pushes the connecting rod 7 upward synchronously, causing the fixed plate assembly 5 to first flip inward and then rise vertically to reset. This transmission structure is compact and simple, with stable power transmission, and can stably drive a 20kg heavy-duty cooling chamber to complete the opening and closing action. No manual force is required throughout the process, greatly reducing the physical exertion and operational threshold for maintenance personnel.

[0035] Specifically, gaskets 54 are fixedly provided on both sides of the vertical section. When the vertical section has a cavity, gaskets 54 are also provided on the inner two walls of the cavity. The gaskets 54 are made of polytetrafluoroethylene (PTFE) and are fastened to the surface of the vertical section of the L-shaped plate 51 by bonding or laying them flat with micro screws.

[0036] Specifically, protective covers are provided on the outer surfaces of the two side plates and the outer wall on the side away from the horizontal section. These protective covers, made of sheet metal or engineering plastic, are detachably fixed to the outer surfaces of the two side plates and the outer wall of the back of the device (the side away from the horizontal section) by bolts, completely enclosing the exposed areas of all moving parts, including the guide groove 8, guide roller 52, and hinge transmission. The protective covers serve two purposes: firstly, they provide safety protection by physically isolating the moving parts from the external environment, preventing personnel or tools from accidentally entering the moving area during maintenance, thus avoiding injuries such as pinching or bumping, and preventing damage to precision moving parts such as the guide roller 52 and guide groove 8 from external impacts; secondly, they provide dust protection, preventing dust and particulate matter from falling into the guide groove 8 and hinge area, avoiding the accumulation of foreign matter that could cause movement jamming and component wear, and maintaining movement accuracy and smooth operation. This structure significantly improves the safety performance of the device, reduces maintenance safety risks, and reduces the erosion of moving parts by external foreign matter, extending the maintenance cycle and service life of the device.

[0037] Specifically, the linear motion mechanism 1 is a cylinder assembly, which includes a cylinder 12, a first connector 13, and a second connector 14. The first connector 13 is located at the air inlet of the open chamber of the cylinder 12, and the second connector 14 is located at the air inlet of the closed chamber of the cylinder 12. The first connector 13 and the second connector 14 are respectively connected to the air circuit assembly 6. The cylinder body of the cylinder 12 is vertically fixed to the lower surface of the base plate 2 by a mounting bracket. The piston rod of the cylinder 12 is the power output end, which passes upward through the base plate 2 and connects to the lower end of the connecting rod 7. The first connector 13 and the second connector 14 are both pneumatic quick-connect connectors, which are respectively sealed and screwed onto the two air ports of the cylinder 12. The other end is sealed and connected to the corresponding output end of the air circuit assembly 6 through a pneumatic air pipe. Cylinder 12 is the pneumatic actuator of the tilting device, powered by clean dry air (CDA) commonly used in semiconductor plants. It outputs linear driving force through the extension and retraction of the piston rod. The pneumatic drive is oil-free and free of particulate contamination, fully meeting the requirements of semiconductor cleanrooms. The first connector 13 and the second connector 14 are used to achieve a quick-sealing connection between the air inlet of cylinder 12 and the air pipe, ensuring the airtightness of the air circuit and facilitating disassembly, maintenance, and component replacement. During operation, the air circuit assembly 6 supplies air to the first connector 13 and exhausts air from the second connector 14. Air entering the opening chamber of cylinder 12 pushes the piston downward, causing the cooling chamber to open. Similarly, air entering the closing chamber of cylinder 12 pushes the piston upward, causing the cooling chamber to close and reset. The pneumatic drive method is compatible with existing air sources in semiconductor plants, requiring no additional power unit. It offers fast response, stable operation, and is more suitable for vacuum and clean semiconductor equipment environments compared to electric drives. It also boasts low maintenance costs and high reliability.

[0038] Specifically, the output end of the linear motion mechanism 1 is a double-toggle joint. The lower end of the double-toggle joint is threadedly fastened to the piston rod end of the cylinder 12, and the upper end is hinged to the lower end of the connecting rod 7, forming two swingable hinge nodes. The double-toggle joint is an adaptive hinge structure used to connect the cylinder piston rod and the connecting rod 7. It can automatically compensate for angular deviations and radial loads generated during transmission, avoiding jamming of the cylinder piston rod due to force misalignment and wear of seals, ensuring smooth transmission of linear power. At the same time, it can offset trajectory deviations caused by part machining errors and assembly errors, reduce stress concentration of moving parts, and prevent deformation and breakage of the hinged parts due to hard force. This structure effectively improves the adaptive capability of the transmission structure, reduces motion jamming and part wear, extends the service life of the cylinder and connecting rod, ensures the smoothness and stability of the flipping action, and reduces the precision requirements of part machining and assembly, effectively controlling production costs.

[0039] Specifically, the hinge pin 53 is clearance-fitted with the connecting rod 7, and the guide groove 8 is clearance-fitted with the guide roller 52. The outer diameter of the hinge pin 53 is slightly smaller than the inner diameter of the hinge hole at the upper end of the connecting rod 7, forming a reasonable rotational fit clearance; the outer diameter of the guide roller 52 is slightly smaller than the width of the guide groove 8, forming a reasonable rolling fit clearance. The clearance fit between the hinge pin 53 and the connecting rod 7 ensures that the connecting rod 7 can rotate flexibly around the hinge pin 53 without jamming, perfectly adapting to angle changes during the flipping process, while also accommodating minor thermal deformation and processing errors of the parts, preventing the hinge from seizing or jamming due to changes in equipment operating temperature; the clearance fit between the guide groove 8 and the guide roller 52 ensures that the guide roller 52 can roll smoothly within the guide groove 8, reducing frictional resistance and operating noise, while also compensating for dimensional deviations caused by part processing and assembly, preventing the roller from getting stuck in the groove. Through a reasonable clearance fit design, the frictional resistance and wear of moving parts are effectively reduced, the smoothness of operation is improved, and faults such as movement jamming and abnormal noise are reduced. At the same time, it adapts to the temperature changes of the working environment, improving the reliability of the device and its overall service life.

[0040] Specifically, the pneumatic assembly 6 includes three first pneumatic connectors 61, a three-position five-way valve 62, two Y-type connectors 63, two second pneumatic connectors 64, a first pilot-operated exhaust throttle valve 65, a second pilot-operated exhaust throttle valve 66, and two third pneumatic connectors 67. The three first pneumatic connectors 61 are connector IN, connector C, and connector O, respectively. One side of the three-position five-way valve 62 is provided with connector IN, and the other side of the three-position five-way valve 62 is provided with connector C and connector O, respectively. Connectors C and O are each connected to an independent end of a Y-type connector 63. The Y-type connector 63 includes a first Y-type connector and a second Y-type connector. The first end of the first Y-type connector passes through a second pneumatic connector 64. The movable connector 64 is connected to the first end of the first pilot-operated exhaust throttle valve 65, and the second end of the first Y-type connector is connected to the second end of the second pilot-operated exhaust throttle valve 66. The first end of the second Y-type connector is connected to the second end of the first pilot-operated exhaust throttle valve 65, and the second end of the second Y-type connector is connected to the first end of the second pilot-operated exhaust throttle valve 66 via a second pneumatic connector 64. The third end of the first pilot-operated exhaust throttle valve 65 is connected to the second connector 14 via a third pneumatic connector 67, and the third end of the second pilot-operated exhaust throttle valve 66 is connected to the first connector 13 via a third pneumatic connector 67. The three first pneumatic connectors 61 are the main external interfaces of the air circuit. Connector IN is used to connect to an external CDA air source, and connectors C and O correspond to the output terminals for closing and opening the air circuit, respectively. The three-position five-way valve 62 is the main control directional valve of the air circuit, which has three working positions: left-position conduction, middle-position depressurization, and right-position conduction. The air circuit connection direction is switched by the energization and de-energization of the electromagnet. In the middle position, all air ports are depressurized. The two Y-type connectors 63 are used for branching and converging of the air circuit, dividing the single air circuit into two circuits, which are respectively connected to the working air chamber of the throttle valve and the pilot control port to realize pilot control logic. The second pneumatic connector 64 and the third pneumatic connector 67 are both quick-connect air pipe connectors, used for air pipe sealing connection between valves and between valves and cylinders to ensure the air tightness of the air circuit. Both the first pilot-operated exhaust throttle valve 65 and the second pilot-operated exhaust throttle valve 66 are integrated valve components, which are composed of a pilot-operated one-way valve and an exhaust throttle valve. When air pressure is introduced into the pilot port, the one-way valve opens to allow the air flow to be interrupted. When the pilot port loses pressure, the one-way valve closes to block the air path. At the same time, the throttle opening can be adjusted by the knob to control the exhaust speed.

[0041] The gas circuit operation process can be divided into three states: Open state: The left-position electromagnet of the three-position five-way valve 62 is energized and conducts, allowing CDA air to enter from connector IN and exit through connector O to the corresponding Y-type connector 63, splitting into two paths: one path enters the pilot port of the second pilot-operated exhaust throttle valve 66, pushing the pilot check valve to open; the other path enters the inlet of the second pilot-operated exhaust throttle valve 66 and is delivered to the first connector 13 via the third pneumatic connector 67, allowing air to enter the opening chamber of cylinder 12 and push the piston downward. Simultaneously, the gas in the closed chamber of cylinder 12 is exhausted through the second connector 14 and the throttling end of the first pilot-operated exhaust throttle valve 65. By adjusting the opening of the throttle valve, the exhaust speed is controlled, thereby controlling the downward speed of the cylinder and achieving smooth opening of the cooling chamber.

[0042] In the closed state: the right-hand solenoid of the three-position five-way valve 62 is energized and conducts, allowing the CDA air source to enter from connector IN, exit through connector C to the corresponding Y-type connector 63, which splits into two paths: one path enters the pilot port of the first pilot-operated exhaust throttle valve 65, pushing the pilot check valve to open; the other path enters the inlet of the first pilot-operated exhaust throttle valve 65, and is delivered to the second connector 14 via the third pneumatic connector 67, allowing air to enter the closed chamber of cylinder 12 and push the piston upward. Simultaneously, the gas in the open chamber of cylinder 12 is exhausted through the throttling end of the first connector 13 and the second pilot-operated exhaust throttle valve 66. Adjusting the throttle valve opening controls the upward speed of the cylinder, achieving smooth closure of the cooling chamber.

[0043] Stop / Pressure Loss Self-Locking State: When the three-position five-way valve 62 is in the neutral position, all air circuits are depressurized, the pilot port air pressure of the two pilot-operated exhaust throttle valves is reduced to zero, the pilot check valve is closed, the gas in the two chambers of the cylinder cannot be discharged, and the piston is locked in the current position; when the equipment is powered off, the three-position five-way valve 62 automatically resets to the neutral position to achieve power failure self-locking; when the plant gas supply is cut off, the pressure of the entire air circuit is reduced to zero, and the pilot check valve closes synchronously to achieve gas failure self-locking.

[0044] This air circuit structure not only allows for independent adjustment of the opening and closing speed of the cooling chamber, ensuring smooth and shock-free movement, but also achieves start / stop at any position and dual self-locking functions for power and air supply interruption. This effectively prevents components from falling, being damaged by impacts, and causing safety accidents due to pressure loss, significantly improving the operational safety and reliability of the device and fully complying with the safety specifications for semiconductor equipment.

[0045] Example 2 This embodiment provides a method for flipping a cooling chamber in a semiconductor device, which uses a cooling chamber flipping device described in Embodiment 1, and includes the following steps: Step S1: The cooling chamber is positioned and fixed on the horizontal section of the L-shaped plate (51) by the first positioning pin (55). In the initial state, both sets of guide rollers (52) are located on the upper part of the vertical groove (81) of the guide groove (8), and the cooling chamber maintains a vertical working posture. Step S2: Drive the fixed plate assembly (5) to move downward in the vertical direction, and the two sets of guide rollers (52) roll downward in sync along the vertical groove (81), causing the cooling chamber to descend vertically; Step S3: When the upper guide roller (52) moves to the position where the vertical groove (81) and the arc groove (82) are connected, the upper guide roller (52) enters the arc groove (82) and rolls along its trajectory, while the lower guide roller (52) continues to move downward along the vertical groove (81). The fixed plate assembly (5) rotates outward with the lower guide roller (52) as the pivot axis, causing the cooling chamber to rotate and unfold from the vertical posture to the maintenance posture. Step S4: Drive the fixed plate assembly (5) to move up vertically, the lower guide roller (52) rolls upward along the vertical groove (81), the upper guide roller (52) rolls backward along the arc groove (82), and the fixed plate assembly (5) rotates inward in the opposite direction with the lower guide roller (52) as the axis of rotation, thereby driving the cooling chamber to gradually return from the maintenance posture to the vertical posture; Step S5: After the upper guide roller (52) retracts into the vertical groove (81), the two sets of guide rollers (52) roll upward along the vertical groove (81) in sync, driving the cooling chamber to rise vertically and reset to the initial vertical working posture.

[0046] Specifically, in step S1, the cooling chamber is positioned and fixed on the horizontal section of the L-shaped plate 51 by the first positioning pin 55. The gasket 54 is placed between the cooling chamber and the mounting contact surface of the L-shaped plate 51 to buffer friction and prevent metal-to-metal contact. The entire flipping device is aligned and fixed to the semiconductor device cavity by the second positioning pin 91 on the top of the connecting plate 9 to ensure the positional accuracy of the guide groove 8's movement trajectory and the cavity mounting position. In the initial state, the linear motion mechanism 1, i.e., the cylinder assembly, is at the top dead center position. The closed chamber of the cylinder 12 is in the intake state, and the open chamber is in the exhaust state. The piston rod extends upward and is lifted by the connecting rod 7 and the hinge pin 53 to keep the fixed plate assembly 5 in a high position. Both sets of guide rollers 52 are located on the upper part of the vertical groove 81 of the guide groove 8. The cooling chamber maintains a vertical working posture, which is precisely corresponding to the internal working position of the transmission cavity.

[0047] Specifically, in step S2, when the fixed plate assembly 5 is driven to move downwards in the vertical direction, the pneumatic circuit assembly 6 switches its working state: the three-position five-way valve 62 switches to the left position, and the external CDA air source is connected to the air circuit through the IN connector of the first pneumatic connector 61. After being output through the O connector, it flows into the corresponding Y-type connector 63 and splits into two paths: one path enters the pilot port of the second pilot-operated exhaust throttle valve 66, pushing the pilot check valve to open; the other path enters the working air circuit of the second pilot-operated exhaust throttle valve 66 through the second pneumatic connector 64, and then is delivered to the first connector 13 through the third pneumatic connector 67 to supply air to the opening chamber of the cylinder 12. At the same time, the gas in the closed chamber of the cylinder 12 flows back through the second connector 14 and is discharged at a speed adjusted through the throttling end of the first pilot-operated exhaust throttle valve 65. The downward speed of the cylinder can be precisely controlled by adjusting the opening of the throttle valve. The piston of cylinder 12 descends at a constant speed, and the double elbow joint at its output end pulls the connecting rod 7 to move vertically downward. The connecting rod 7 drives the L-shaped plate 51 to move down synchronously through the hinge pin 53. The two sets of guide rollers 52 roll smoothly along the inner wall of the vertical groove 81 on both side plates. The vertical groove 81 constrains the movement trajectory, ensuring that the cooling chamber descends vertically without lateral deviation. The clearance fit between the guide rollers 52 and the guide groove 8 can adapt to the machining error and thermal deformation of the parts, greatly reducing the frictional resistance of the movement, and driving the cooling chamber to descend smoothly and vertically as a whole.

[0048] Specifically, in step S3, when the upper guide roller 52 moves to the position where the vertical groove 81 and the arc groove 82 are connected, the lower guide roller 52 is still in the lower section of the vertical groove 81; the piston of the cylinder 12 continues to move downward to pull the connecting rod 7, the upper guide roller 52 enters the arc groove 82 and rolls along its inner arc side trajectory, and the lower guide roller 52 continues to move downward along the vertical groove 81 until the bottom limit position of the groove; at this time, the fixed plate assembly 5 rotates outward with the lower guide roller 52 as the pivot axis, the hinge pin 53 and the connecting rod 7 adaptively rotate to compensate for the change in transmission angle, and the double elbow joint at the cylinder output end cancels the radial off-center load force during the transmission process, avoids piston jamming and seal wear, and ensures that the flipping process is smooth and without jamming. Finally, the cooling chamber flips and unfolds from a vertical position to a horizontal maintenance position. At this time, the three-position five-way valve 62 can be switched to the middle position, all air circuits are depressurized, the pilot ports of the two sets of pilot-operated exhaust throttle valves lose pressure, the internal one-way valve closes, the gas in the two chambers of cylinder 12 cannot flow, and the piston is locked in the current position, realizing the start and stop function at any position and the self-locking function of power failure and gas failure, so as to prevent the cooling chamber from falling accidentally. Maintenance personnel do not need to manually lift heavy objects, and can directly perform maintenance operations such as cleaning, consumable replacement, leak detection and calibration of the cooling chamber.

[0049] Specifically, in step S4, when the fixed plate assembly 5 is driven to move vertically to perform a reset action, the three-position five-way valve 62 switches to the right position. The CDA air source is output through connector C and flows into the corresponding Y-type connector 63, splitting into two paths: one path enters the pilot port of the first pilot-operated exhaust throttle valve 65, pushing the pilot check valve to open; the other path enters the working air path of the first pilot-operated exhaust throttle valve 65 through the second pneumatic connector 64, and then is delivered to the second connector 14 through the third pneumatic connector 67 to supply air to the closed chamber of the cylinder 12. At the same time, the gas in the open chamber of the cylinder 12 flows back through the first connector 13 and is discharged at a speed adjusted through the throttling end of the second pilot-operated exhaust throttle valve 66. The upward reset speed of the cylinder can be controlled by adjusting the opening of the throttle valve. The piston of cylinder 12 moves upward at a constant speed, pushing the connecting rod 7 to move upward. The lower guide roller 52 rolls upward along the vertical groove 81, and the upper guide roller 52 rolls backward along the arc groove 82. The fixed plate assembly 5 rotates inward in the opposite direction with the lower guide roller 52 as the axis of rotation. The hinge pin 53 and the double elbow joint adaptively adjust the transmission angle to eliminate the off-center stress and drive the cooling chamber to gradually rotate from the maintenance posture back to the vertical posture.

[0050] Specifically, in step S5, after the upper guide roller 52 has completely retracted into the vertical groove 81, the piston of cylinder 12 continues to move upward, pushing the connecting rod 7 to rise continuously. The two sets of guide rollers 52 synchronously roll smoothly upward along the vertical groove 81, driving the entire cooling chamber to rise vertically. Until the guide roller 52 reaches the upper limit position of the vertical groove 81, the piston of cylinder 12 reaches the upper dead point, and the cooling chamber returns to its initial vertical working posture, precisely aligned with the installation position inside the transmission cavity. At this time, the three-position five-way valve 62 can be switched to the middle position for locking, ensuring the stability of the working position of the cooling chamber. The entire opening and closing process is pneumatically driven and controlled, allowing the operation to be completed in the confined maintenance space of semiconductor equipment. There is no need for manual lifting of the heavy-duty cooling chamber, effectively preventing metal parts from scraping against the vacuum chamber and mounting bracket during disassembly and assembly, significantly reducing the physical exertion and operational difficulty for maintenance personnel, and significantly improving maintenance efficiency and operational safety.

[0051] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0052] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can occur depending on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A cooling chamber flipping device for semiconductor equipment, characterized in that, The system includes a base plate (2), on which two side plates are symmetrically arranged. Each side plate has a guide groove (8) on its side wall. The guide groove (8) includes a vertical groove (81) and an arc groove (82) that are connected. The inner arc side of the arc groove (82) faces the vertical groove (81). One end of the arc groove (82) is located in the middle of the vertical groove (81). A fixing plate assembly (5) is provided between the two side plates. The fixing plate assembly (5) includes an L-shaped plate (51). The vertical section of the L-shaped plate (51) is provided with two sets of guide rollers (52) from top to bottom. The two sets of guide rollers (52) are used to cooperate with the guide groove (8). The horizontal section of the L-shaped plate (51) is located at the top of the vertical section. The top of the horizontal section is provided with several first positioning pins (55).

2. The cooling chamber flipping device for semiconductor equipment according to claim 1, characterized in that, Each of the side plates has a horizontal connecting plate (9) at its top, and each of the connecting plates (9) has a second positioning pin (91) at its top.

3. The cooling chamber flipping device for semiconductor equipment according to claim 1, characterized in that, A linear motion mechanism (1) is provided below the base plate (2). The output end of the linear motion mechanism (1) is vertically arranged through the base plate (2). A cavity is provided in the middle of the vertical section of the L-shaped plate (51). The fixed plate assembly (5) also includes a hinge pin (53). The hinge pin (53) is horizontally arranged in the cavity. The hinge pin (53) is connected to the output end of the linear motion mechanism (1) through a connecting rod (7).

4. A cooling chamber flipping device for semiconductor equipment according to claim 1, characterized in that, Gaskets (54) are provided on both sides of the vertical section.

5. A cooling chamber flipping device for semiconductor equipment according to claim 1, characterized in that, The outer surfaces of the two side plates and the outer wall on the side away from the horizontal section are provided with protective covers.

6. A cooling chamber flipping device for semiconductor equipment according to claim 3, characterized in that, The linear motion mechanism (1) is a cylinder assembly, which includes a cylinder (12), a first connector (13), and a second connector (14). The first connector (13) is provided at the air inlet of the opening chamber of the cylinder (12), and the second connector (14) is provided at the air inlet of the closing chamber of the cylinder (12). The first connector (13) and the second connector (14) are respectively connected to the air circuit assembly (6).

7. A cooling chamber flipping device for semiconductor equipment according to claim 3, characterized in that, The output end of the linear motion mechanism (1) is a double elbow joint.

8. A cooling chamber flipping device for semiconductor equipment according to claim 3, characterized in that, The hinge pin (53) is in clearance fit with the connecting rod (7), and the guide groove (8) is in clearance fit with the guide roller (52).

9. A cooling chamber flipping device for semiconductor equipment according to claim 6, characterized in that, The pneumatic assembly (6) includes three first pneumatic connectors (61), a three-position five-way valve (62), two Y-type connectors (63), two second pneumatic connectors (64), a first pilot-operated exhaust throttle valve (65), a second pilot-operated exhaust throttle valve (66), and two third pneumatic connectors (67). The three first pneumatic connectors (61) are connector IN, connector C, and connector O, respectively. One side of the three-position five-way valve (62) is provided with connector IN, and the other side of the three-position five-way valve (62) is provided with connector C and connector O, respectively. Connector C and connector O are each connected to an independent end of a Y-type connector (63). The Y-type connector (63) includes a first Y-type connector and a second Y-type connector. The first end of the first Y-type connector passes through a second pneumatic connector. The connector (64) is connected to the first end of the first pilot-operated exhaust throttle valve (65), and the second end of the first Y-type connector is connected to the second end of the second pilot-operated exhaust throttle valve (66). The first end of the second Y-type connector is connected to the second end of the first pilot-operated exhaust throttle valve (65), and the second end of the second Y-type connector is connected to the first end of the second pilot-operated exhaust throttle valve (66) via a second pneumatic connector (64). The third end of the first pilot-operated exhaust throttle valve (65) is connected to the second connector (14) via a third pneumatic connector (67), and the third end of the second pilot-operated exhaust throttle valve (66) is connected to the first connector (13) via a third pneumatic connector (67).

10. A method for flipping a cooling chamber in a semiconductor device, based on a cooling chamber flipping device according to any one of claims 1-9, characterized in that, Includes the following steps: Step S1: The cooling chamber is positioned and fixed on the horizontal section of the L-shaped plate (51) by the first positioning pin (55). In the initial state, both sets of guide rollers (52) are located on the upper part of the vertical groove (81) of the guide groove (8), and the cooling chamber maintains a vertical working posture. Step S2: Drive the fixed plate assembly (5) to move downward in the vertical direction, and the two sets of guide rollers (52) roll downward in sync along the vertical groove (81), causing the cooling chamber to descend vertically; Step S3: When the upper guide roller (52) moves to the position where the vertical groove (81) and the arc groove (82) are connected, the upper guide roller (52) enters the arc groove (82) and rolls along its trajectory, while the lower guide roller (52) continues to move downward along the vertical groove (81). The fixed plate assembly (5) rotates outward with the lower guide roller (52) as the pivot axis, causing the cooling chamber to rotate and unfold from the vertical posture to the maintenance posture. Step S4: Drive the fixed plate assembly (5) to move up vertically, the lower guide roller (52) rolls upward along the vertical groove (81), the upper guide roller (52) rolls backward along the arc groove (82), and the fixed plate assembly (5) rotates inward in the opposite direction with the lower guide roller (52) as the axis of rotation, thereby driving the cooling chamber to gradually return from the maintenance posture to the vertical posture; Step S5: After the upper guide roller (52) retracts into the vertical groove (81), the two sets of guide rollers (52) roll upward along the vertical groove (81) in sync, driving the cooling chamber to rise vertically and reset to the initial vertical working posture.

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