Electrical device

Abstract

An electrical device (30) has a housing (50) provided with housing-side terminals (54, 55) that electrically connect electronic components, a substrate (60) that is a substantially plate-shaped component housed in the housing (50) and has substrate-side terminals (64, 65) that electrically connect electronic components, a heat dissipation component (70) that is provided in a manner overlapping one face (60a) of the substrate (60) using a raw material having a higher thermal conductivity than a base material of the substrate (60), and spring components (35, 36) that are provided at the other face (60b) of the substrate (60), electrically connect from the substrate-side terminals (64, 65) to the housing-side terminals (54, 55), and have an acting force that presses the substrate (60) against the heat dissipation component (70).

Description

Technical Field

[0001] This invention relates to an electrical device. Background Technology

[0002] For example, the vehicle's buffer is controlled by an electrical device. As prior art related to such an electrical device, there is the technology disclosed in Patent Document 1.

[0003] The electrical device shown in Patent Document 1 houses the substrate in a frame and electrically connects the substrate to the damper.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2019-83269 Summary of the Invention

[0007] The technical problem that the invention aims to solve

[0008] Typically, the substrate becomes hot due to the conduction of electricity. From the perspective of extending lifespan, it is desirable to suppress heat retention within the frame.

[0009] The objective of this invention is to provide an electrical device capable of suppressing heat retention within a housing.

[0010] Technical means for solving problems

[0011] The inventors conducted in-depth research and discovered that by overlapping a heat dissipation component with a thermal conductivity higher than that of the substrate material onto one side of the substrate, and by providing a spring component on the other side of the substrate to apply force to the substrate toward the heat dissipation component, it is possible to suppress heat retention within the frame. This invention is based on this insight.

[0012] The following is an explanation of this disclosure.

[0013] According to this disclosure, an electrical device is provided, comprising:

[0014] A frame, wherein the frame is provided with frame-side terminals for electrically connecting electronic components;

[0015] The substrate is a generally plate-shaped component housed in the frame and has substrate-side terminals for electrically connecting electronic components.

[0016] A heat dissipation component, wherein the heat dissipation component is made of a raw material with a higher thermal conductivity than the substrate material, and is disposed in a manner overlapping one side of the substrate; and

[0017] A spring component, disposed on the other side of the substrate, electrically connected from the substrate-side terminal to the frame-side terminal, and having a force for pressing the substrate against the heat dissipation component.

[0018] Invention Effects

[0019] According to the present invention, an electrical device capable of suppressing heat retention within the housing can be provided. Attached Figure Description

[0020] Figure 1 This is a perspective view illustrating the relationship between the electrical device, the buffer carrying the electrical device, and the external power source that supplies power to the electrical device in the embodiment.

[0021] Figure 2 yes Figure 1 An exploded perspective view of the electrical device shown.

[0022] Figure 3 yes Figure 2 3-3 line section view.

[0023] Figure 4 yes Figure 3 The top view of the substrate shown. Detailed Implementation

[0024] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Furthermore, the embodiments shown in the drawings are one example of the present invention, and the present invention is not limited to this embodiment.

[0025] <Example>

[0026] Reference Figure 1 .exist Figure 1 The image shows the head of a shock absorber 10 installed on a motorcycle. The shock absorber 10, for example, is a rear shock absorber, which is a device that attenuates energy such as vibrations received from the road surface.

[0027] The buffer 10 has a housing 20 at its lower part for inserting the electrical device 30. The electrical device 30 is used to control the buffer 10. That is, the buffer 10 is an electronically controlled suspension. The electrical device 30 is connected to a connector, namely an external power connector 15a, which is an external power source 15. The electrical device 30 receives power from the external power source 15.

[0028] Reference Figure 2 and Figure 3The electrical device 30 includes: a frame 50 serving as a housing; a generally rectangular plate-shaped substrate 60 housed within the frame 50 and capable of conducting electricity; a heat dissipation member 70 overlapping with the upper surface 60a (one side 60a) of the substrate 60 and serving as a cover for the frame 50 to dissipate heat from the substrate 60; an electrical component side seal 34 disposed on the outer periphery of the heat dissipation member 70 and preventing dust from entering the interior of the frame 50; spring members 35 and 36 abutting against the lower surface 60b (the other side 60b) of the substrate 60 and having a force that presses the substrate 60 against the heat dissipation member 70; a balance spring 37 abutting against the lower surface 60b of the substrate 60 and pressing the substrate 60 against the heat dissipation member 70 and applying a force in the opposite direction of rotation to the spring members 35 and 36; and an electric actuator 38 disposed inside the frame 50 and electrically connected to the substrate 60.

[0029] Reference Figure 1 Additionally, the outer periphery of the frame 50 is provided with: an elastic member 41, which is capable of elastic deformation for positioning the frame 50 relative to the housing 20; and an O-ring 42, which inhibits dust from entering the interior of the housing 20.

[0030] Refer to together Figure 2 The frame 50 includes: an insertion part 51 that inserts into the housing 20 and has an electric actuator 38 disposed therein; a connector connection part 52 that can connect to an external power connector 15a; and a frame body 53 that houses a substrate 60, etc.

[0031] Reference Figure 1 and Figure 3 Inside the housing 50 are housing-side terminals 54 and 55 for electrically connecting electronic components. The housing-side terminals 54 and 55 have a connector terminal 54 for electrically connecting to an external power connector 15a and an actuator terminal 55 for connecting to an electric actuator 38.

[0032] The frame body 53 is generally rectangular in shape with an opening on the upper surface. A heat dissipation component locking part 53a is formed on the side of the frame body 53 for locking the heat dissipation component 70. The heat dissipation component locking part 53a is formed by a generally rectangular hole.

[0033] Reference Figure 3 A substrate support portion 53b is formed, which supports the substrate 60 from the bottom of the frame body 53 toward the lower surface 60b of the substrate 60. Normally, the substrate 60 is separated from the substrate support portion 53b. When the heat dissipation component 70 is pressed downward, the substrate 60 abuts against the substrate support portion 53b to prevent the heat dissipation component 70 from falling further.

[0034] The substrate 60 is, for example, an engine control unit substrate (ECU substrate). The substrate 60 is formed by printing copper lines on the surface of a glass plate, which serves as the base material, and mounting multiple components such as integrated circuits (ICs), resistors, capacitors, and transistors on the surface.

[0035] Reference Figure 4 The substrate 60 is roughly rectangular in shape. A pair of long sides are called long sides 60c, and a pair of short sides that are shorter than long sides 60c are called short sides 60d.

[0036] Here, the thermal conductivity of the glass used as a base material for the substrate 60 is 0.5~1.0 W / m·K.

[0037] Reference Figure 3 The substrate 60 is provided with substrate side terminals 64 and 65. The substrate side terminals 64 and 65 are electrically connected to the frame side terminals 54 and 55 via spring components 35 and 36, respectively.

[0038] Reference Figure 2 The heat dissipation component 70 is, for example, made of aluminum alloy. The heat dissipation component 70 has: a generally cylindrical heat dissipation component leg 71 that stands upright from the upper surface 60a of the substrate 60; a heat dissipation component cover 72 that closes the upper end of the heat dissipation component leg 71; and a claw-shaped heat dissipation component claw 73 that is formed on the outer peripheral surface of the heat dissipation component leg 71 and engages with the heat dissipation component locking portion 53a.

[0039] Here, aluminum, as an example of the raw material for the heat dissipation component 70, has a thermal conductivity of 195~250 W / m·K, and stainless steel has a thermal conductivity of 14~20 W / m·K.

[0040] The end of the heat dissipation component leg 71 abuts against the edge of the upper surface 60a of the substrate 60.

[0041] The heat dissipation component claw 73 is locked relative to the heat dissipation component locking portion 53a by a predetermined gap. The heat dissipation component 70 can move up and down by the amount of this gap.

[0042] In addition, the heat dissipation component 70 may also have heat dissipation component abutment portions 67 and 68 extending from the heat dissipation component cover portion 72 to the upper surface 60a of the substrate 60 and whose ends abut against the upper surface 60a (see reference). Figure 3 The heat dissipation component abutment 67 is preferably disposed corresponding to the portion of the lower surface 60b subjected to force by the spring components 35, 36. Alternatively, the heat dissipation component abutment 68 may also abut against the metal foil printed on the upper surface 60a of the substrate 60. With these configurations, heat dissipation can be performed more efficiently.

[0043] Reference Figure 3Spring components 35 and 36 are both compression coil springs made of steel. Spring components 35 and 36 are equipped with a power supply that draws power from an external power source 15 (see reference). Figure 1 The first spring component 35 is electrically connected to the substrate 60 and the electric actuator 38 (see reference) is connected from the substrate 60 to the substrate 60. Figure 1 The second spring component 36 is electrically connected. Normally, the spring components 35 and 36 always abut against both the frame-side terminals 54 and 55 and the substrate-side terminals 64 and 65.

[0044] Here, the stainless steel used as the raw material for spring components 35 and 36 has a thermal conductivity of 14~20 W / m·K. This is lower than the thermal conductivity of copper, which is 350~400 W / m·K.

[0045] Reference Figure 4 A first spring member 35 is disposed at a position overlapping a line L1 perpendicular to a pair of long sides 60c, 60c. A second spring member 36 is disposed on a line L2 parallel to the line L1 where the first spring members 35 are arranged. For example, six first spring members 35 are disposed, and for example, two second spring members 36 are disposed.

[0046] In addition, the first spring component 35 and the second spring component 36 are arranged symmetrically with reference to the line L3 that connects the center of a pair of short sides 60d and 60d.

[0047] The balance spring 37 is a compression coil spring made of steel. The balance spring 37 is positioned overlapping a line L4 perpendicular to a pair of long sides 60c, 60c. Furthermore, the balance spring 37 is arranged symmetrically with reference to a line L3 connecting the centers of a pair of short sides 60d, 60d.

[0048] Refer to together Figure 3 With the center G of the long side 60c as a reference, the force of the spring members 35 and 36 is applied in such a way that the substrate 60 is rotated in the first direction R1. On the other hand, the force of the balancing spring 37 is applied in such a way that the substrate 60 is rotated in the second direction R2, which is opposite to the first direction R1. Preferably, the forces applied in the rotational direction by the spring members 35 and 36 and the balancing spring 37 are balanced.

[0049] Reference Figure 3 The frame-side terminals 54 and 55 have pin-shaped frame-side terminal pins 54a and 55a and frame-side terminal support portions 54b and 55b integrally formed with the frame-side terminal pins 54a and 55a and abutting against the spring members 35 and 36.

[0050] A frame-side terminal pin 54a is the end connected to an external power supply 15 (see reference). Figure 1The connector terminal pin 54a abuts against the other housing side terminal pin 54b, which is from the electric actuator 38 (see reference). Figure 1 Extended actuator terminal pin 54b.

[0051] One frame-side terminal support 54b is a first frame-side terminal support 54b that abuts against the first spring member 35, and the other frame-side terminal support 55b is a second frame-side terminal support 55b that abuts against the second spring member 36.

[0052] That is, the connector terminal 54 is composed of a connector terminal pin 54a and a first frame side terminal support portion 54b, and the actuator terminal 55 is composed of an actuator terminal pin 54b and a second frame side terminal support portion 55b.

[0053] The substrate side terminals 64 and 65 have pin-shaped substrate side terminal pins 64a and 65a and substrate side terminal support portions 64b and 65b that extend radially from the substrate side terminal pins 64a and 65a in a circular plate shape and are abutted by the spring members 35 and 36.

[0054] One substrate-side terminal pin 64a is a first substrate-side terminal pin 64a extending toward the first frame-side terminal support portion 54b, and the other substrate-side terminal pin 64a is a second substrate-side terminal pin 65a extending toward the second frame-side terminal support portion 55b.

[0055] One substrate-side terminal support 64b is a first substrate-side terminal support 64b that is abutted by the first spring member 35, and the other substrate-side terminal support 65b is a second substrate-side terminal support 65b that is abutted by the second spring member 36.

[0056] The first substrate-side terminal 64 is formed by the first substrate-side terminal pin 64a and the first substrate-side terminal support portion 64b. The second substrate-side terminal 65 is formed by the second substrate-side terminal pin 65a and the second substrate-side terminal support portion 65b.

[0057] The electrical device 30 described above will be summarized below.

[0058] Reference Figure 3First, the electrical device 30 includes: a frame 50 having frame-side terminals 54 and 55 for electrically connecting electronic components; a substrate 60, which is a generally plate-shaped component housed in the frame 50, having substrate-side terminals 64 and 65 for electrically connecting electronic components; a heat dissipation component 70, which is made of a material with a higher thermal conductivity than the base material of the substrate 60 and is disposed in a manner overlapping the upper surface 60a (one surface 60a) of the substrate 60; and spring components 35 and 36, which are disposed on the lower surface 60b (the other surface 60b) of the substrate 60, electrically connecting the substrate-side terminals 64 and 65 to the frame-side terminals 54 and 55, and having a force for pressing the substrate 60 against the heat dissipation component 70.

[0059] Springs 35 and 36 apply force to the substrate 60 toward the heat dissipation member 70, thus keeping the substrate 60 constantly pressed against the heat dissipation member 70. When the substrate 60 becomes hot, the heat from the substrate 60 is released to the outside via the heat dissipation member 70. An electrical device 30 is provided that can suppress heat retention within the housing 50.

[0060] Furthermore, spring components 35 and 36 electrically connect the substrate-side terminals 64 and 65 to the frame-side terminals 54 and 55. The spring components 35 and 36, which are used to press the substrate 60 toward the heat dissipation component 70, are also used for the electrical connection between the substrate-side terminals 64 and 65 and the frame-side terminals 54 and 55, thus contributing to the reduction of the number of components.

[0061] Furthermore, by using the spring reaction force to hold the substrate 60, the need for fastening components such as bolts can be reduced. Therefore, there is no need to create bolt holes in the substrate 60, allowing components to be adequately mounted even on a smaller substrate 60. As a result, miniaturization of the substrate 60 becomes possible.

[0062] Second, the first electrical installation device 30 also includes an electric actuator 38, which is electrically connected to the frame side terminals 54 and 55 and operates by energizing the frame side terminals 54 and 55. The spring components 35 and 36 are torsion coil springs.

[0063] The electric actuator 38 generates heat, which is then transmitted along the terminals. However, when the spring components 35 and 36 are torsion coil springs, the transmission path becomes longer, which suppresses heat transfer. In addition, the spring components 35 and 36 themselves act as inductors, thus noise can be suppressed.

[0064] Third, in the second electrical device 30, the spring components 35 and 36 are made of materials with lower thermal conductivity than copper. By using spring components 35 and 36 with low thermal conductivity, heat transfer from the electric actuator 38 can be suppressed.

[0065] Fourth, in the third electrical device 30, the frame-side terminals 54 and 55 include connector terminals 54 that can be connected to an external power source, and the spring components 35 and 36 include a first spring component 35 that connects the connector terminals 54 to the substrate-side terminals 64.

[0066] The connector terminal 54 for power supply is electrically connected to the substrate 60 via the first spring member 35. This allows for a stronger force to be applied to the substrate 60 toward the heat dissipation member 70. Consequently, the substrate 60 can be more reliably brought into contact with the heat dissipation member 70, and heat from the substrate 60 can be released to the outside.

[0067] Fifth, in any of the electrical devices 30 of the first to fourth categories, the substrate 60 is generally rectangular in shape. When the long pair of sides is designated as the long side 60c, the force of the spring members 35 and 36 is applied with reference to the center of the long side 60c in a manner that causes the substrate 60 to rotate in the first direction R1. A spring, namely a balance spring 37, is provided to apply a force that causes the substrate 60 to rotate in the second direction R2, which is opposite to the first direction R1.

[0068] By incorporating the balance spring 37, tilting of the substrate 60 can be suppressed, allowing the substrate 60 to more reliably contact the heat dissipation component 70. This enables more efficient heat dissipation from the substrate 60 to the outside.

[0069] Sixth, in any of the electrical devices 30 described in the first to fifth embodiments, the lower surface 60b of the substrate 60 is separated from the frame 50. The upper surface 60a of the substrate 60 is pressed against the heat dissipation member 70 by spring members 35 and 36, and the lower surface 60b of the substrate 60 is raised. This eliminates the need for fasteners such as bolts to fix the substrate 60 to the frame 50, and helps reduce the number of components. Furthermore, it eliminates the need for bolt holes in the substrate 60, allowing more components to be mounted on the same-sized substrate 60. Additionally, by separating it from the frame 50, heat transfer from the frame 50 can be suppressed.

[0070] Seventh, in any one of the electrical devices 30 from the first to the sixth, the substrate-side terminals 64 and 65 have substrate-side terminal support portions 64b and 65b that abut against the spring members 35 and 36. This prevents the spring members 35 and 36 from directly contacting the copper foil or the like on the substrate 60. This ensures a more reliable electrical connection and contributes to a longer product lifespan.

[0071] Eighth, in any of the electrical devices 30 described in the first to seventh categories, the heat dissipation component 70 contacts the edge of the substrate 60. Heat is released to the outside via the edge of the substrate 60. The central portion of the substrate serves as a space for mounting components such as ICs, ensuring ample mounting space for the components, which is preferable.

[0072] Ninth, any one of the electrical devices 30 from the first to the eighth is mounted on a vehicle. Because the electrical device 30 is small and has a high heat dissipation efficiency, it is suitable for vehicles that mount high-temperature components such as engines and where space is limited.

[0073] Reference Figure 1 The tenth is an electrical device 30, any one of the first to ninth items, used for the buffer 10. Because the electrical device 30 is small and has high heat dissipation efficiency, it is suitable for buffers 10 that are typically placed in limited spaces and become hot during damping. In particular, it is preferred in portions where the placement space is limited, such as the rear buffer of a motorcycle-type vehicle.

[0074] Furthermore, while an example of the electrical device 30 of the present invention being mounted on the rear bumper of a motorcycle has been described, it can also be applied to the bumper of a passenger car, the front fork of a motorcycle, and is not limited to these forms.

[0075] As long as the functions and effects of the present invention are achieved, the present invention is not limited to the embodiments.

[0076] Industrial practicality

[0077] The electrical device of the present invention is preferably mounted on the rear bumper of a motorcycle.

[0078] Explanation of reference numerals in the attached figures

[0079] 10··· Buffer

[0080] 30. Electrical Installations

[0081] 35···First Spring Component (Spring Assembly)

[0082] 36···Second Spring Component (Spring Component)

[0083] 37··· Balance Spring

[0084] 38···Electric Actuator

[0085] 50···Frame

[0086] 54··· Connector Terminals (Frame Side Terminals)

[0087] 55···Actuator Terminal (Frame Side Terminal)

[0088] 60···Substrate, 60a···Top surface (one side), 60b···Bottom surface (the other side), 60c···Long side

[0089] 64··· First substrate side terminal (substrate side terminal), 64a··· First substrate side terminal pin (substrate side terminal pin), 64b··· First substrate side terminal support portion (substrate side terminal support portion)

[0090] 65···Second substrate side terminal (substrate side terminal), 65a···Second substrate side terminal pin (substrate side terminal pin), 65b···Second substrate side terminal support portion (substrate side terminal support portion)

[0091] 70··· Heat dissipation components

Claims

1. An electrical device, characterized in that, have: A frame, wherein the frame is provided with frame-side terminals for electrically connecting electronic components; The substrate is a generally plate-shaped component housed in the frame and has substrate-side terminals for electrically connecting electronic components. A heat dissipation component, wherein the heat dissipation component is made of a raw material with a higher thermal conductivity than the substrate material, and is disposed in a manner that overlaps with one side of the substrate; as well as A spring component, disposed on the other side of the substrate, electrically connected from the substrate-side terminal to the frame-side terminal, and having a force for pressing the substrate against the heat dissipation component.

2. The electrical device according to claim 1, characterized in that, The electrical device also includes an electric actuator electrically connected to the side terminals of the frame, which operates by being energized from the side terminals of the frame. The spring component is a torsion coil spring.

3. The electrical device according to claim 2, characterized in that, The spring component is made of a material with a lower thermal conductivity than copper.

4. The electrical device according to claim 3, characterized in that, The frame-side terminals include connector terminals capable of connecting to an external power source. The spring component includes a second spring component that connects the connector terminal to the substrate side terminal.

5. The electrical device according to claim 1, characterized in that, The substrate is generally rectangular in shape, with the longest pair of sides taken as the long side. The force of the spring component is applied in such a way that the substrate is rotated in a first direction with the center of the long side as a reference. A balance spring is provided to apply a force to rotate the substrate in a second direction opposite to the first direction.

6. The electrical device according to claim 1, characterized in that, The other side of the substrate is separated from the frame.

7. The electrical device according to claim 1, characterized in that, The substrate side terminal has a substrate side terminal support portion for the spring component to abut against.

8. The electrical device according to claim 1, characterized in that, The heat dissipation component is in contact with the edge of the substrate.

9. The electrical device according to claim 1, characterized in that, The electrical device is mounted on the vehicle.

10. The electrical device according to claim 1, characterized in that, The electrical device is used for a buffer.

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