An LED chip packaging device with uniform dispensing

Abstract

The application relates to the technical field of LED chip packaging, and particularly discloses an LED chip packaging device capable of uniform dispensing, which comprises a workbench, the side of the workbench is provided with a knock-resistant pad, the knock-resistant pad is in an annular structure and surrounds the side of the workbench, the top of the workbench is fixedly connected with a fixed part of a conveying guide rail, the movable part of the conveying guide rail is fixedly connected with a positioning mechanism, the top of the side of a fixed support is fixedly connected with a cross beam, and the side of the cross beam is fixedly connected with a packaging device. The LED chip packaging device capable of uniform dispensing is provided with the positioning mechanism, can realize automatic centering, clamping and positioning of LED chip materials, is provided with a stirring assembly, can automatically start linkage with the dispensing lifting, can stir and mix the packaging glue reciprocally in advance before dispensing, is provided with a defoaming assembly, relies on mechanical linkage to generate high-frequency micro-vibration, continuously knocks the side wall of the dispensing cylinder through elastic hitting balls, and makes the whole glue vibrate and defoam.

Description

Technical Field

[0001] This invention relates to the field of LED chip packaging technology, and in particular to an LED chip packaging device for uniform dispensing of adhesive. Background Technology

[0002] As a new generation of green solid-state lighting and display light source, LEDs have comprehensively penetrated many core application areas such as civil lighting, commercial lighting, outdoor large-screen displays, automotive lights, backlight displays, smart wearables, industrial special lighting, and smart city light sources, thanks to their multiple outstanding advantages including low energy consumption, long lifespan, high luminous efficiency, fast response speed, good shock resistance, and energy saving and environmental protection. With the rapid upgrading of the global optoelectronic industry and the continuous expansion of end-consumer market demand, the LED chip manufacturing and packaging industry has maintained a high-speed development trend. The industrial chain is becoming increasingly complete, and the production and manufacturing system is gradually evolving towards large-scale, automated, precise, and intelligent directions. The packaging process is a key core link in the LED chip manufacturing process, connecting upstream and downstream processes. The dispensing process plays a crucial role in protecting the internal circuitry of the chip, isolating it from external moisture and dust, and buffering mechanical impacts. It also directly affects the overall luminous efficacy, color temperature consistency, luminous stability, heat dissipation performance, and long-term service life of LED devices. As an indispensable and fundamental key process in the LED chip packaging process, the dispensing process is widely used in many important process nodes such as chip die bonding, phosphor coating, encapsulation dam formation, bottom thermal potting, and lens bonding and fixing. The dispensing stability, adhesive layer thickness consistency, adhesive dot morphology regularity, and overall coating uniformity directly determine the luminous quality, batch consistency, and packaging yield of the subsequent LED products. It is one of the core process links to ensure the stable production and quality of high-end LED products.

[0003] Chinese patent CN120325470A discloses an LED chip packaging equipment and process for automotive lights. When it is necessary to clean the nozzle on the dispensing head, a moving part and a driving part are activated. The moving part drives an adjusting ring to be fitted onto the nozzle of the dispensing head, and the driving part drives the adjusting ring to rotate. The adjusting ring drives the first brush to rotate, which can clean the outside of the nozzle on the dispensing head, preventing the adhesive from curing and clogging the nozzle, thus solving the problem of affecting the quality of LED chip packaging.

[0004] While the above methods can clean the dispensing nozzle, relying solely on a brush to clean residual adhesive after each dispensing is inefficient, requiring frequent brush replacements. Furthermore, unclean brushes can attract dust, and stringing occurs after each dispensing cycle. If these stringy adhesive strands are not promptly cut off, they can lead to irregular adhesive surface textures and even cause excess adhesive to adhere to the LED chip's light-emitting area, affecting overall dispensing efficiency. Additionally, static storage of the adhesive can cause sedimentation and stratification, reducing overall uniformity. Air can easily be incorporated during dispensing and filling, resulting in bubbles and voids in the adhesive layer, further impacting dispensing efficiency. Instable material placement can also cause dispensing deviation, affecting quality and accuracy. Summary of the Invention

[0005] To solve the above technical problems, the present invention provides the following technical solution: an LED chip packaging device for uniform dispensing, including a worktable, an anti-collision pad is provided on the side of the worktable, the anti-collision pad is in the form of a ring structure and surrounds the side of the worktable, a fixed part of a conveying guide rail is fixedly connected to the top of the worktable, and a positioning mechanism is fixedly connected to the movable part of the conveying guide rail.

[0006] A fixed bracket is provided, which is provided in two sets and symmetrically fixedly connected to the top of the workbench. A crossbeam is fixedly connected to the top side of the fixed bracket, and a sealing device is fixedly connected to the side of the crossbeam.

[0007] The fixed column is a rectangular column structure. Two sets of the fixed columns are symmetrically fixed to the top of the workbench. A wedge-shaped seat is fixedly connected to the top of the fixed column.

[0008] The glue storage tank has a rectangular shell structure. The top of the rectangular shell is connected to the inlet of the conveying pump, and the outlet of the conveying pump is connected to the conveying pipe. The end of the conveying pipe away from the conveying pump is connected to the packaging device. The glue storage tank is fixedly connected to the side of the workbench.

[0009] The packaging device includes a fixing plate, which is fixedly connected to one side of the crossbeam. The fixed end of the packaging cylinder is fixedly connected to the top of the fixing plate, and the movable end of the packaging cylinder passes through the fixing plate and is fixedly connected to a connecting frame.

[0010] A dispensing cylinder is fixedly connected to the bottom of a connecting frame. The top of the dispensing cylinder is connected to a delivery pipe. A stirring assembly is rotatably connected through the top of the dispensing cylinder. Defoaming assemblies are fixedly connected to both sides of the dispensing cylinder. Filament breaking assemblies are fixedly connected to the portions of both sides of the dispensing cylinder below the defoaming assemblies. The bottom of the dispensing cylinder is connected to the inlet of a solenoid valve, and the outlet of the solenoid valve is connected to a dispensing tube.

[0011] Preferably, the packaging device further includes: a sliding bottom rod, the bottom of which passes through the top of the dispensing cylinder and is slidably connected to the dispensing cylinder; a toothed rod is fixedly connected to the top of the sliding bottom rod; one end of the toothed rod passes through and is rotatably connected to a pulley; and the movable end of an elastic telescopic rod is fixedly connected to the end of the toothed rod away from the pulley.

[0012] A constant temperature water tank has an annular shell structure. The annular shell is fitted and fixedly connected to the dispensing cylinder. The side of the constant temperature water tank is connected to an inlet pipe and an outlet pipe respectively.

[0013] The fixed frame has two sets and is fixedly connected to both sides of the fixed plate. A guide groove is opened on one side of the inner wall of the fixed frame. Obstruction blocks are evenly fixedly connected to the inner wall of the guide groove of the fixed frame located on the pulley side. The obstruction blocks have guide rounded corners on their sides. The inner wall of the guide groove is slidably connected to the fixed end of the elastic telescopic rod.

[0014] Preferably, the positioning mechanism includes a placement box with movable slots on both sides. A first spring is uniformly fixedly connected to one side of the inner wall of each movable slot. A clamping plate is fixedly connected to one end of each first spring. Both sides of the clamping plate are slidably connected to the inner wall of the movable slot. A guide radius is provided on the side of the clamping plate. A detection spring is uniformly fixedly connected to the bottom of the inner wall of the placement box. A heating plate is fixedly connected to the top of each detection spring. A contact rod is fixedly connected to the bottom of the heating plate. A reset trigger switch is fixedly connected to the bottom of the inner wall of the placement box. The placement box is fixedly connected to the movable part of the conveying guide rail. When the material to be packaged is placed into the placement box, the guide radius above the clamping plate is pressed, causing the clamping plate to compress the first spring. After the material is in place, the spring rebounds and clamps the material, achieving automatic positioning and preventing displacement during dispensing. Starting the packaging cylinder moves the dispensing cylinder downwards, opening the solenoid valve to complete dispensing. After dispensing, the increased weight of the material compresses the detection spring, triggering the switch to activate the heating plate to accelerate adhesive curing. After the material is removed, the spring resets, and the heating plate is de-energized, improving packaging efficiency and avoiding energy waste.

[0015] Preferably, the stirring assembly includes a first rotating shaft, on which a first gear ring is sleeved and fixedly connected. A stirring ribbon is fixedly connected to the side of the first rotating shaft via a bracket. Arc-shaped guide vanes are uniformly fixedly connected to the bottom of the first rotating shaft. A connecting rod is fixedly connected to the portion of the side of the first rotating shaft below the stirring ribbon. A first scraper and an arc-shaped scraper are fixedly connected to the top and bottom of the connecting rod, respectively. The first rotating shaft passes through the top of the dispensing cylinder and is rotatably connected to the dispensing cylinder. The side of the first gear ring meshes with the gear rod. When the sealing cylinder moves the dispensing cylinder downward, the gear rod moves downward and is squeezed and reciprocated by the obstruction block, causing the first gear ring and the first rotating shaft to reciprocate. The stirring ribbon and the arc-shaped guide vanes stir the adhesive to prevent separation. At the same time, the first scraper and the arc-shaped scraper scrape off residual adhesive on the cylinder wall, preventing the adhesive from solidifying and affecting the dispensing accuracy, ensuring smooth dispensing and uniformity, and improving sealing efficiency.

[0016] Preferably, the defoaming component includes a fixed box, a second rotating shaft is rotatably connected through the top of the fixed box, a second toothed ring is sleeved and fixedly connected on the second rotating shaft, and a rotating ring is sleeved and fixedly connected to the part of the second rotating shaft located inside the fixed box. The rotating ring has uneven wall thickness and an annular groove is formed on the side of the rotating ring.

[0017] Preferably, a connecting column is fixedly connected to the bottom of the inner wall of the fixed box, and guide cylinders are uniformly fixedly connected to the side of the connecting column. A reciprocating slide rod is uniformly penetrated and slidably connected to the side of the connecting column. A connecting plate is fixedly connected to the end of the reciprocating slide rod away from the connecting column. The side of the connecting plate is slidably connected to the inner wall of the annular groove via a slider. The end of the reciprocating slide rod away from the connecting plate extends into the interior of the guide cylinder and is slidably connected to the inner wall of the guide cylinder. A second spring is fixedly connected to one side of the inner wall of the guide cylinder. An abutment plate is fixedly connected to one end of the second spring. The side of the abutment plate is slidably connected to the inner wall of the guide cylinder. The abutment plate is located away from the reciprocating slide rod. A vibrating rod is fixedly connected to one side of the sliding rod. The end of the vibrating rod away from the contact plate passes through the side of the guide cylinder and is fixedly connected to an elastic striking ball. Two sets of fixed boxes are provided and symmetrically fixedly connected to both sides of the dispensing cylinder. The side of the second gear ring meshes with the gear rod. When the gear rod reciprocates, it drives the second gear ring and the second rotating shaft to rotate. The eccentric rotating ring drives the reciprocating sliding rod to press the contact plate through the connecting plate. With the help of the second spring rebound, the vibrating rod drives the elastic striking ball to reciprocate to strike the dispensing cylinder. The vibration causes air bubbles in the glue to rise and burst, eliminating the risk of air bubbles and avoiding gaps in the dispensing, further improving the uniformity of dispensing and the quality of the product.

[0018] Preferably, the wire breaking assembly includes a connecting bracket, a sliding sleeve is fixedly connected to the bottom of the connecting bracket, a third spring is uniformly fixedly connected to one side of the inner wall of the sliding sleeve, a sliding plate is fixedly connected to one end of the third spring, both sides of the sliding plate are slidably connected to the inner wall of the sliding sleeve, and a wire breaking knife is fixedly connected to the side of the sliding plate away from the third spring.

[0019] Preferably, the sliding sleeve has linkage grooves on both sides, and a movable frame is slidably connected to the inner wall of the linkage groove via a bracket. The movable frame is fixedly connected to the side of the sliding plate via a bracket. A wedge-shaped slide is fixedly connected to both sides of the inner wall of the movable frame. Two sets of connecting brackets are provided and symmetrically distributed on both sides of the dispensing tube. The inclined sliding surface of the wedge-shaped slide is adapted to the inclined sliding surface of the wedge seat. Before dispensing, the wire-breaking knife is in a closed state. During dispensing, the sealing cylinder drives the wire-breaking assembly to move down, and the wedge-shaped slide contacts and squeezes the wedge seat, causing the wire-breaking knife to spread out to both sides to avoid the dispensing tube. After the dispensing is completed and reset, the squeezing force disappears, and the third spring rebounds and drives the wire-breaking knife to retract, cutting off the residual glue thread at the end of the dispensing tube, preventing glue thread adhesion and leakage, ensuring the stability of subsequent dispensing, and improving the sealing efficiency.

[0020] The beneficial effects of the technical solution provided by this invention include:

[0021] 1. This uniform dispensing LED chip packaging equipment is equipped with a positioning mechanism, which can automatically center and clamp the LED chip material, effectively preventing material deviation during dispensing and ensuring accurate and controllable dispensing position. When the material is placed, it relies on spring rebound and clamping plate to automatically center and position, ensuring dispensing accuracy. At the same time, the heating mode is triggered by gravity change after dispensing. Heating is automatically started after dispensing is completed to accelerate adhesive curing. Heating is automatically stopped after packaging and unloading, which improves the overall packaging efficiency and avoids energy consumption due to dry burning.

[0022] 2. This LED chip packaging equipment for uniform dispensing is equipped with a stirring component that automatically starts in conjunction with the dispensing lifting action. It can pre-stir and mix the packaging adhesive before dispensing, preventing the adhesive from settling and separating. The stirring screw, together with the guide vanes, stirs and guides the adhesive downwards, ensuring smooth and unobstructed dispensing. The stirring screw also prevents the formation of air bubbles. The scraper removes residual adhesive from the lower part of the cylinder wall in real time, preventing the adhesive from drying and sticking, which would affect the dispensing stability. No additional drive source is required throughout the process. The uniform dispensing and anti-sticking actions are completed simultaneously with the dispensing action, further improving the uniformity of dispensing and the efficiency of chip packaging.

[0023] 3. This uniform dispensing LED chip packaging equipment is equipped with a defoaming component. Relying on mechanical linkage to generate high-frequency micro-vibration, the elastic striking ball continuously taps the side wall of the dispensing cylinder, causing the glue to vibrate and defoam, promoting the rise and rupture of internal air bubbles. This reduces the potential risks of air bubbles inside the glue tank, avoiding defects such as dispensing gaps, glue breaks, or uneven glue layer thickness caused by air bubbles. No additional power source is needed for defoaming; the defoaming process is completed simultaneously during the dispensing preparation stage, stabilizing the glue flow rate and glue layer morphology, improving the uniformity of chip dispensing, and the entire process is integrated and continuous, effectively improving the continuity and efficiency of packaging.

[0024] 4. This uniform dispensing LED chip packaging equipment is equipped with a wire-breaking component. It automatically opens and closes via mechanical wedge linkage. During dispensing, the component automatically expands to avoid interference with normal dispensing operations. After the dispensing process resumes, the spring automatically resets, and the wire-breaking blade quickly retracts and cuts off any remaining adhesive filaments at the nozzle. This avoids problems such as residual adhesive stringing, adhesion, and dripping, keeping the dispensing nozzle clean and neat. It also prevents residual adhesive or adhesion dripping from affecting the accuracy and stability of subsequent dispensing operations. No manual handling of broken wires is required, ensuring the overall continuity of the dispensing and packaging operation and further improving the efficiency of chip dispensing and packaging. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the LED chip packaging equipment for uniform dispensing according to the present invention;

[0026] Figure 2 This is a schematic diagram of the packaging device structure of the present invention;

[0027] Figure 3 This is a schematic diagram of one side of the packaging device of the present invention;

[0028] Figure 4 This is a schematic diagram of the internal connection structure of the guide groove of the present invention;

[0029] Figure 5 This is a schematic diagram of the positioning mechanism structure of the present invention;

[0030] Figure 6 This is a schematic diagram of the internal connection structure of the positioning mechanism of the present invention;

[0031] Figure 7 This is a schematic diagram of the connection structure of the stirring assembly of the present invention;

[0032] Figure 8 This is a schematic diagram of the defoaming component structure of the present invention;

[0033] Figure 9 This is a schematic diagram of the internal connection structure of the defoaming component of the present invention;

[0034] Figure 10 This is a schematic diagram of the broken wire assembly structure of the present invention.

[0035] In the diagram: 1. Workbench; 2. Anti-collision pad; 3. Conveyor rail; 4. Positioning mechanism; 5. Fixed bracket; 6. Crossbeam; 7. Sealing device; 8. Fixed column; 9. Wedge seat; 10. Glue storage tank; 11. Conveying pump; 12. Conveying pipe; 41. Placement box; 42. Movable groove; 43. First spring; 44. Clamping plate; 45. Detection spring; 46. Heating plate; 47. Contact rod; 48. Reset trigger switch; 71. Fixed plate; 72. Sealing cylinder; 73. Connecting frame; 74. Dispensing cylinder; 75. Stirring assembly; 76. Defoaming assembly; 77. Wire breakage assembly; 78. Solenoid valve; 79. Dispensing tube; 710. Sliding bottom rod; 711. Toothed rod; 712. Pulley; 713. Elastic telescopic rod; 714. Constant temperature water tank; 715. Water inlet pipe; 716. Water outlet pipe; 17. Fixed frame; 718. Guide groove; 719. Obstruction block; 751. First rotating shaft; 752. First gear ring; 753. Stirring ribbon; 754. Arc-shaped guide vane; 755. Connecting rod; 756. First scraper; 757. Arc-shaped scraper; 761. Fixed box; 762. Second rotating shaft; 763. Second gear ring; 764. Rotating ring; 765. Annular groove; 766. Elastic striking ball; 767. Connecting column; 768. Guide cylinder; 769. Reciprocating slide rod; 7610. Connecting plate; 7611. Second spring; 7612. Contact plate; 7613. Vibrating rod; 771. Connecting bracket; 772. Sliding sleeve; 773. Third spring; 774. Sliding plate; 775. Wire cutter; 776. Linkage groove; 777. Movable frame; 778. Wedge-shaped slide table. Detailed Implementation

[0036] For the first embodiment, please refer to... Figures 1-6This invention provides an LED chip packaging device for uniform dispensing. A positioning mechanism 4 is used to place the material to be packaged from the top of a placement box 41 into the box. During placement, the guide rounded corners above the clamping plate 44 are first squeezed, causing the clamping plate 44 to compress the first spring 43. The first spring 43 contracts after being compressed, providing space for the clamping plate 44 to move. After the material is fully inside the placement box 41, the clamping plates 44 on both sides clamp the material under the rebound of the first spring 43, completing automatic positioning and preventing material displacement during dispensing from affecting dispensing accuracy. After the material is placed, dispensing and packaging begin. The packaging cylinder 72 is activated, and the movable end of the packaging cylinder 72 extends, causing the connecting frame 73 to move downwards. The connecting frame 73 causes the dispensing tube 74 to move downwards. When the dispensing tube 79 moves to the appropriate dispensing height, the solenoid valve 78 is opened, and the dispensing tube... The adhesive inside cylinder 74 can flow out through dispensing tube 79 to encapsulate the chip. After dispensing, the movable end of the encapsulation cylinder 72 retracts, causing the dispensing tube 74 to return to its original position. When dispensing is complete, the gravity above the heating plate 46 increases, thereby compressing the detection spring 45. The heating plate 46 moves downward, causing the contact rod 47 to move downward. After the contact rod 47 moves downward, it presses the reset trigger switch 48. After the reset trigger switch 48 is triggered, it heats the heating plate 46. The heating plate 46 heats the chip placed in the placement box 41, which can also accelerate the thermal curing speed of the adhesive and improve the encapsulation efficiency. When the chip is encapsulated and removed, the detection spring 45 rebounds, causing the heating plate 46 to return to its original position. The contact rod 47 separates from the reset trigger switch 48, and the heating plate 46 stops heating, thereby avoiding the continuous idling heating of the heating plate 46 and reducing unnecessary energy consumption.

[0037] Second embodiment, please refer to Figures 1-7By incorporating a stirring assembly 75, when the sealing cylinder 72 is activated before dispensing and sealing, its telescopic end extends, causing the connecting frame 73 to move downwards. The downward movement of the connecting frame 73 causes the dispensing cylinder 74 to move downwards as a whole. The downward movement of the dispensing cylinder 74 causes the rack 711 to move downwards. The downward movement of the rack 711 causes the pulley 712 to slide downwards along the inner wall of the guide groove 718 on the fixed frame 717. During this sliding process, the obstruction block 719 inside the guide groove 718 continuously presses against the pulley 712, causing the rack 711 to oscillate back and forth along the sliding direction. This oscillation of the rack 711 causes the first gear ring 752 to rotate back and forth, which in turn drives the first rotating shaft. The first shaft 751 rotates back and forth, driving the stirring screw 753 and the arc-shaped guide vane 754 to reciprocate and stir the adhesive, preventing the adhesive from stratifying and settling when left to stand, making the adhesive composition more uniform and thus improving the uniformity of subsequent dispensing. The arc-shaped guide vane 754 rotates to guide the adhesive to the bottom of the dispensing cylinder 74, ensuring smoother dispensing. At the same time, the first shaft 751 also drives the first scraper 756 and the arc-shaped scraper 757 to reciprocate and rotate, scraping off the adhesive residue in the middle and bottom of the inner wall of the dispensing cylinder 74, respectively, preventing the adhesive from sticking to the inner wall of the dispensing cylinder 74 and solidifying, which would affect the subsequent dispensing accuracy and the service life of the equipment, thereby improving the uniformity of dispensing and the efficiency of encapsulation.

[0038] Third embodiment, please refer to Figures 1-9 By incorporating a defoaming component 76, the rack 711, indirectly driven by the encapsulation cylinder 72, reciprocates, causing the meshing second gear ring 763 to rotate. The second gear ring 763 drives the second rotating shaft 762 to rotate, which in turn drives the rotating ring 764 to rotate. Due to the uneven wall thickness of the rotating ring 764, its rotation causes the connecting plate 7610 to reciprocate horizontally via the annular groove 765. This reciprocating horizontal movement of the connecting plate 7610 causes the reciprocating slide rod 769 to slide reciprocally along the inner wall of the guide cylinder 768, thus enabling the reciprocating slide rod to... 769 continuously presses the contact plate 7612, which in turn compresses and rebounds after pressing the second spring 7611, driving the vibrating rod 7613 to reciprocate. The vibrating rod 7613 drives the elastic striking ball 766 to continuously strike the side wall of the dispensing cylinder 74. The dispensing cylinder 74 vibrates from the impact, causing the internal glue to vibrate, which makes the air bubbles in the glue rise and burst, eliminating the air bubbles inside the glue. This prevents air bubbles inside the glue from causing gaps in the glue during dispensing, further improving the uniformity and quality of dispensing and packaging, and ensuring the packaging efficiency of the chip.

[0039] For the fourth embodiment, please refer to [link / reference]. Figures 1-10By incorporating a wire-breaking assembly 77, the wire-breaking knife 775 is in a closed state before dispensing and encapsulation. When dispensing and encapsulation begins, the encapsulation cylinder 72 moves the dispensing cylinder 74 downwards, which in turn moves the wire-breaking assembly 77 downwards. As the dispensing cylinder 74 approaches the dispensing position, the wedge-shaped slide 778 in the wire-breaking assembly 77 moves to contact the wedge-shaped seat 9. As the dispensing cylinder 74 continues to move downwards, the inclined sliding surface of the wedge seat 9 presses against the inclined sliding surface of the wedge-shaped slide 778, causing the two movable frames 777 to slide away from each other along the linkage groove 776. The movable frames 777 then drive the sliding plate 774 to compress the third spring 77. 3. Move outward from the sliding sleeve 772. The sliding plate 774 drives the wire breaker 775 to unfold to both sides, making room for the dispensing tube 79 and ensuring that the dispensing operation is not affected. After dispensing is completed, the encapsulation cylinder 72 drives the dispensing cylinder 74 to reset upward. The dispensing cylinder 74 drives the wire breaker assembly 77 to move upward. The wedge slide 778 and the wedge seat 9 gradually separate, and the squeezing force on the wedge slide 778 disappears. The third spring 773 rebounds and pushes the sliding plate 774 to reset. The two wire breakers 775 retract towards the middle, cutting off the residual glue thread at the end of the dispensing tube 79, preventing glue thread adhesion or leakage from affecting the next dispensing operation, and further improving the efficiency of chip encapsulation dispensing.

[0040] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. The scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. An LED chip packaging device for uniform dispensing, characterized in that: include: Workbench (1), with anti-collision pads (2) on the side of the workbench (1). The anti-collision pads (2) are in the shape of a ring and surround the side of the workbench (1). The top of the workbench (1) is fixedly connected to the fixed part of the conveying guide rail (3), and the movable part of the conveying guide rail (3) is fixedly connected to the positioning mechanism (4). Fixed bracket (5), which has two sets and is symmetrically fixedly connected to the top of the workbench (1). A crossbeam (6) is fixedly connected to the top side of the fixed bracket (5), and a sealing device (7) is fixedly connected to the side of the crossbeam (6). Fixed column (8), which is a rectangular column structure, is provided in two sets and is symmetrically fixedly connected to the top of the workbench (1). A wedge-shaped seat (9) is fixedly connected to the top of the fixed column (8). The glue storage tank (10) has a rectangular shell structure. The top of the rectangular shell is connected to the inlet of the conveying pump (11). The outlet of the conveying pump (11) is connected to the conveying pipe (12). The end of the conveying pipe (12) away from the conveying pump (11) is connected to the packaging device (7). The glue storage tank (10) is fixedly connected to the side of the workbench (1). The packaging device (7) includes: A fixing plate (71) is fixedly connected to one side of the crossbeam (6). The top of the fixing plate (71) is fixedly connected to the fixed end of the sealing cylinder (72). The movable end of the sealing cylinder (72) passes through the fixing plate (71) and is fixedly connected to the connecting frame (73). A dispensing cylinder (74) is fixedly connected to the bottom of a connecting frame (73). The top of the dispensing cylinder (74) is connected to a conveying pipe (12). A stirring assembly (75) is rotatably connected through the top of the dispensing cylinder (74). Defoaming assemblies (76) are fixedly connected to both sides of the dispensing cylinder (74). A filament breaking assembly (77) is fixedly connected to the part of both sides of the dispensing cylinder (74) below the defoaming assembly (76). The bottom of the dispensing cylinder (74) is connected to the inlet of a solenoid valve (78). The outlet of the solenoid valve (78) is connected to a dispensing tube (79).

2. The LED chip packaging equipment for uniform dispensing according to claim 1, characterized in that: The packaging device (7) further includes: A sliding bottom rod (710) is provided, the bottom of which passes through the top of the dispensing cylinder (74) and is slidably connected to the dispensing cylinder (74). A toothed rod (711) is fixedly connected to the top of the sliding bottom rod (710). One end of the toothed rod (711) passes through and is rotatably connected to a pulley (712). The end of the toothed rod (711) away from the pulley (712) is fixedly connected to the movable end of an elastic telescopic rod (713). The constant temperature water tank (714) has an annular shell structure. The annular shell is fitted and fixedly connected to the dispensing cylinder (74). The side of the constant temperature water tank (714) is connected to the inlet pipe (715) and the outlet pipe (716). The fixed frame (717) has two sets and is fixedly connected to both sides of the fixed plate (71). A guide groove (718) is provided on one side of the inner wall of the fixed frame (717). Obstruction blocks (719) are evenly fixedly connected to the inner wall of the guide groove (718) of the fixed frame (717) located on the side of the pulley (712). The obstruction blocks (719) have guide rounded corners on their sides. The inner wall of the guide groove (718) is slidably connected to the fixed end of the elastic telescopic rod (713).

3. The LED chip packaging equipment for uniform dispensing according to claim 1, characterized in that: The positioning mechanism (4) includes a placement box (41), and movable grooves (42) are provided on both sides of the placement box (41). A first spring (43) is uniformly fixedly connected to one side of the inner wall of the movable groove (42). A clamping plate (44) is fixedly connected to one end of the first spring (43). Both sides of the clamping plate (44) are slidably connected to the inner wall of the movable groove (42). A guide rounded corner is provided on the side of the clamping plate (44).

4. The LED chip packaging equipment for uniform dispensing according to claim 3, characterized in that: The bottom of the inner wall of the placement box (41) is uniformly fixed with detection springs (45), the top of the detection springs (45) is fixed with a heating plate (46), the bottom of the heating plate (46) is fixed with a contact rod (47), the bottom of the inner wall of the placement box (41) is fixed with a reset trigger switch (48), and the placement box (41) is fixedly connected to the movable part of the conveying guide rail (3).

5. The LED chip packaging equipment for uniform dispensing according to claim 1, characterized in that: The stirring assembly (75) includes a first rotating shaft (751), a first gear ring (752) is sleeved and fixedly connected to the first rotating shaft (751), a stirring ribbon (753) is fixedly connected to the side of the first rotating shaft (751) by a bracket, an arc-shaped guide vane (754) is evenly fixedly connected to the bottom of the first rotating shaft (751), and a connecting rod (755) is fixedly connected to the part of the side of the first rotating shaft (751) below the stirring ribbon (753). A first scraper (756) and an arc-shaped scraper (757) are fixedly connected to the top and bottom of the connecting rod (755), respectively.

6. The LED chip packaging equipment for uniform dispensing according to claim 5, characterized in that: The first rotating shaft (751) passes through the top of the dispensing tube (74) and is rotatably connected to the dispensing tube (74), and the side of the first gear ring (752) meshes with the gear rod (711).

7. The LED chip packaging equipment for uniform dispensing according to claim 1, characterized in that: The defoaming component (76) includes a fixed box (761), a second rotating shaft (762) is rotatably connected through the top of the fixed box (761), a second gear ring (763) is sleeved and fixedly connected on the second rotating shaft (762), a rotating ring (764) is sleeved and fixedly connected to the part of the second rotating shaft (762) located inside the fixed box (761), the wall thickness of the rotating ring (764) is uneven, and an annular groove (765) is opened on the side of the rotating ring (764).

8. The LED chip packaging equipment for uniform dispensing according to claim 7, characterized in that: A connecting column (767) is fixedly connected to the bottom of the inner wall of the fixed box (761). Guide cylinders (768) are evenly fixedly connected to the side of the connecting column (767). A reciprocating slide rod (769) is evenly penetrated and slidably connected to the side of the connecting column (767). A connecting plate (7610) is fixedly connected to the end of the reciprocating slide rod (769) away from the connecting column (767). The side of the connecting plate (7610) is slidably connected to the inner wall of the annular groove (765) through a slider. The end of the reciprocating slide rod (769) away from the connecting plate (7610) extends into the guide cylinder (768) and is slidably connected to the inner wall of the guide cylinder (768). A second spring (7611) is fixedly connected to one side, and a contact plate (7612) is fixedly connected to one end of the second spring (7611). The side of the contact plate (7612) is slidably connected to the inner wall of the guide cylinder (768). A shaking rod (7613) is fixedly connected to the side of the contact plate (7612) away from the reciprocating slide rod (769). The end of the shaking rod (7613) away from the contact plate (7612) passes through the side of the guide cylinder (768) and is fixedly connected to an elastic hitting ball (766). Two sets of fixed boxes (761) are provided and symmetrically fixedly connected to both sides of the glue dispensing cylinder (74). The side of the second gear ring (763) meshes with the gear rod (711).

9. The LED chip packaging equipment for uniform dispensing according to claim 1, characterized in that: The wire breaking assembly (77) includes a connecting bracket (771), a sliding sleeve (772) is fixedly connected to the bottom of the connecting bracket (771), a third spring (773) is evenly fixedly connected to one side of the inner wall of the sliding sleeve (772), a sliding plate (774) is fixedly connected to one end of the third spring (773), both sides of the sliding plate (774) are slidably connected to the inner wall of the sliding sleeve (772), and a wire breaking knife (775) is fixedly connected to the side of the sliding plate (774) away from the third spring (773).

10. The LED chip packaging equipment for uniform dispensing according to claim 9, characterized in that: The sliding sleeve (772) has a linkage groove (776) on both sides. The inner wall of the linkage groove (776) is slidably connected to a movable frame (777) via a bracket. The movable frame (777) is fixedly connected to the side of the sliding plate (774) via a bracket. The inner wall of the movable frame (777) is fixedly connected to a wedge-shaped slide (778) on both sides. The connecting bracket (771) has two sets and is symmetrically distributed on both sides of the dispensing cylinder (74). The inclined sliding surface of the wedge-shaped slide (778) is adapted to the inclined sliding surface of the wedge-shaped seat (9).

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