Cleaning device for vacuum chuck and semiconductor apparatus

Abstract

This application relates to a cleaning device for vacuum suction cups and a semiconductor device. The cleaning device includes a cleaning chamber, a dry brush assembly, a shield, a blowing assembly, and a vacuum assembly. The shield is located inside the cleaning chamber, and the dry brush assembly is located inside the shield. A first opening is provided at the bottom of the shield to cover the vacuum suction cup. The dry brush assembly is used to brush away contaminants from the vacuum suction cup. The blowing assembly outputs blowing gas through a first outlet to blow the vacuum suction cup. The vacuum assembly includes a vacuum pipe with a first inlet and a second outlet. The first inlet communicates with the shield, and the second outlet is located outside the cleaning chamber. The vacuum assembly draws contaminants carried by the blowing gas into the vacuum pipe through the first inlet and discharges them through the second outlet. This technical solution enables automatic cleaning of vacuum suction cups on robotic arms in semiconductor devices, reducing particulate contamination of the vacuum suction cups.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically to a vacuum suction cup cleaning device and semiconductor equipment. Background Technology

[0002] In related technologies, robotic arms are used in semiconductor equipment to transfer wafers within the equipment. The robotic arm includes grippers equipped with vacuum chucks. When the grippers hold the wafer, the back side of the wafer contacts the vacuum chucks, causing the wafer to be adhered to the robotic arm.

[0003] However, the surface of the vacuum chuck is at risk of being contaminated by particles. If the surface of the vacuum chuck is contaminated, the vacuum tubing of the chuck and the back of the wafer are also at risk of contamination. Contamination could lead to a decrease in the suction power of the vacuum chuck, the robotic arm failing to detect the wafer, and consequently, the wafer falling or breaking. Summary of the Invention

[0004] The purpose of this application is to provide a vacuum suction cup cleaning device and a semiconductor device, which can clean the vacuum suction cup on the robotic arm in the semiconductor device, reduce the vacuum suction cup from particle contamination, and thus reduce wafer drop and breakage.

[0005] According to a first aspect of the embodiments of this application, a cleaning device for a vacuum suction cup is provided, comprising: a cleaning chamber, a dry brush assembly, an isolation cover, a blowing assembly, and an air extraction assembly; The isolation cover is located inside the cleaning chamber, the dry brush assembly is located inside the isolation cover, and the bottom of the isolation cover is provided with a first opening, which matches the edge of the vacuum suction cup to be cleaned on the robotic arm, so that the isolation cover covers the vacuum suction cup; After the isolation cover covers the vacuum suction cup, the dry brush assembly is used to dry brush the vacuum suction cup to remove contaminants on the vacuum suction cup. The purging assembly includes a first air outlet located inside the isolation cover. The purging assembly outputs purging gas through the first air outlet to purge the vacuum suction cup after dry brushing it, so that the brushed contaminants are removed from the vacuum suction cup and fly away with the purging gas. The extraction assembly includes an extraction pipe with a first air inlet and a second air outlet. The first air inlet is connected to the isolation cover, and the second air outlet is located outside the cleaning chamber. The extraction assembly draws pollutants carried by the purge gas into the extraction pipe through the first air inlet and discharges them through the second air outlet.

[0006] In one embodiment, the cleaning device for the vacuum suction cup further includes a first lifting mechanism; The dry brush assembly includes a first drive mechanism and a brush; the cleaning chamber includes a first top wall; The first lifting mechanism is located on the first top wall and is used to drive the isolation cover, the first drive mechanism and the brush to move up and down in the vertical direction; the first drive mechanism is connected to the brush and is used to drive the brush to rotate. Before the vacuum suction cup enters the cleaning chamber, the isolation cover, the first drive mechanism, and the brush are located on one side close to the first top wall; When the vacuum suction cup enters the cleaning chamber, the first lifting mechanism drives the isolation cover, the first driving mechanism, and the brush to move vertically toward the vacuum suction cup until the isolation cover covers the vacuum suction cup and the brush contacts the vacuum suction cup; when the brush contacts the vacuum suction cup, it covers the vacuum suction cup. When the brush comes into contact with the vacuum suction cup, the first driving mechanism drives the brush to rotate in order to dry brush the vacuum suction cup.

[0007] In one embodiment, the purging assembly further includes a second air inlet and a purging pipeline. The second air inlet is located outside the cleaning chamber and is connected to the first air outlet via the purging pipeline. The purging gas enters the purging pipeline through the second air inlet and is output through the first air outlet. The first driving mechanism includes a hollow rotating shaft, and the hollow rotating shaft includes a first through hole; The brush includes a mounting plate and brush bristles, the brush bristles are fixed on the mounting plate, and the hollow rotating shaft is fixedly connected to the mounting plate; the mounting plate includes a second through hole; The purging pipe passes through the first through hole and the second through hole. When the brush is dry brushing the vacuum suction cup, the distance between the first air outlet and the mounting plate is less than the distance between the end of the brush bristles away from the mounting plate and the mounting plate.

[0008] In one embodiment, the purging assembly further includes a first pressure gauge and a first control valve, the first pressure gauge and the first control valve being located on the side of the purging pipeline near the second air inlet; The first pressure gauge is used to detect the first gas pressure in the purge pipeline, and the first control valve is used to control the flow rate of the purge gas entering the purge pipeline based on the first gas pressure and the first pressure range, so that the first gas pressure is within the first pressure range.

[0009] In one embodiment, the second top wall of the isolation shroud includes an air extraction port, and the air extraction pipeline is connected to the air extraction port.

[0010] In one embodiment, the cleaning device for the vacuum suction cup includes two suction lines located on both sides of the purge line.

[0011] In one embodiment, the cleaning device for the vacuum suction cup further includes a scanning module, a processor, and a controller. The scanning module is located inside the cleaning chamber and on the first top wall of the cleaning chamber. The scanning module is electrically connected to the processor. The processor, the dry brush assembly, the blowing assembly, and the air extraction assembly are respectively electrically connected to the controller. The robotic arm is equipped with at least two of the vacuum suction cups; The scanning module is used to scan all the vacuum suction cups after the vacuum suction cups enter the cleaning chamber to obtain a first scan image; The processor is used to perform image processing on the first scanned image to obtain a first cleanliness level for each of the vacuum suction cups; The controller is used to determine whether the vacuum suction cup needs cleaning, the location of the vacuum suction cup that needs cleaning, the location of the vacuum suction cup that needs cleaning, the location of the vacuum suction cup that needs cleaning, and the control of the dry brush assembly, the blowing assembly and the air extraction assembly to clean the vacuum suction cup that needs cleaning based on the cleaning path.

[0012] In one embodiment, the controller is further configured to acquire the number of wafers transferred by the robotic arm during the time interval between two consecutive cleaning operations of the vacuum chucks on the robotic arm, and determine the cleaning cycle of the vacuum chucks on the robotic arm based on the number.

[0013] In one embodiment, after cleaning the vacuum suction cups, the scanning module is further used to scan all the vacuum suction cups to obtain a second scan image; The processor is further configured to perform image processing on the second scanned image to obtain a second cleanliness level for each of the vacuum suction cups, and determine the cleaning effect based on the second cleanliness level and a specified cleaning threshold; or, The processor is also used to compare and analyze the first scanned image and the second scanned image to determine the cleaning effect.

[0014] In one embodiment, the processor is further configured to perform image processing on the first scanned image to detect whether there is a target particle with a size larger than a specified size, and when the target particle is present, record the target position of the target particle and the first target image of the target particle; The processor is also configured to extract a second target image from the second scanned image based on the target location, and to compare and analyze the first target image and the second target image to determine the cleaning effect.

[0015] In one embodiment, the cleaning device for the vacuum suction cup further includes an exhaust port, an exhaust pipe, a second pressure gauge, and a second control valve; The exhaust port is located on the first side wall of the cleaning chamber, and the exhaust pipe is connected to the exhaust port to discharge the gas in the cleaning chamber and keep the cleaning chamber clean. The second pressure gauge is located inside the cleaning chamber and is used to detect the second gas pressure inside the cleaning chamber; The second control valve is located outside the cleaning chamber and on the exhaust pipe. The second control valve is used to control the exhaust volume of the exhaust pipe based on the second gas pressure and the second pressure range, so that the second gas pressure is within the second pressure range.

[0016] In one embodiment, the cleaning device of the vacuum suction cup further includes a gate and a second lifting mechanism; The second sidewall of the cleaning chamber is provided with a second opening, and the gate is movably installed on the second sidewall. The second lifting mechanism is used to drive the gate to move up and down in the vertical direction to expose or block the second opening; the second sidewall is opposite to the first sidewall. When the second lifting mechanism drives the gate to move upward in the vertical direction and exposes the second opening, the robotic arm enters the cleaning chamber through the second opening; After cleaning the vacuum suction cup is completed, the robotic arm exits the cleaning chamber through the second opening, and the second lifting mechanism drives the gate to move downward in the vertical direction and block the second opening.

[0017] In one embodiment, the cleaning device for the vacuum suction cup further includes an output module, which is electrically connected to the processor; The scanning module is also used to scan the robotic arm after it enters the cleaning chamber to obtain a third scan image; The processor is used to perform image processing on the third scanned image to obtain the status information of the robotic arm. The status information includes at least one of the contaminant information on the vacuum suction cup, the scratch information of the robotic arm, and the deformation information. The output module is used to output the status information.

[0018] According to a second aspect of the present application, a semiconductor device is provided, including the robotic arm and the cleaning device for the vacuum suction cup described above; the robotic arm includes a vacuum suction cup.

[0019] Compared with the prior art, the beneficial effects of this application are as follows: The vacuum suction cup cleaning device includes a cleaning chamber, a dry brush assembly, an isolation cover, a blowing assembly, and a suction assembly. The isolation cover is located inside the cleaning chamber, and the dry brush assembly is located inside the isolation cover. A first opening is provided at the bottom of the isolation cover, which matches the edge of the vacuum suction cup to be cleaned on the robotic arm, so that the isolation cover covers the vacuum suction cup. After the isolation cover covers the vacuum suction cup, the dry brush assembly is used to dry brush the vacuum suction cup to remove contaminants. The blowing assembly includes a first air outlet located inside the isolation cover, and the blowing assembly outputs air through the first air outlet. The system uses purge gas to clean the vacuum suction cups after dry brushing, causing the brushed contaminants to detach from the vacuum suction cups and be carried away by the purge gas. The suction assembly includes a suction pipe with a first inlet and a second outlet. The first inlet is connected to an isolation cover, and the second outlet is located outside the cleaning chamber. The suction assembly draws the contaminants carried by the purge gas into the suction pipe through the first inlet and discharges them through the second outlet. This enables automatic cleaning of the vacuum suction cups on the robotic arm in semiconductor equipment, reducing particulate contamination of the vacuum suction cups and consequently reducing wafer drop and breakage. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a robotic arm according to an exemplary embodiment.

[0021] Figure 2 This is a schematic diagram of the structure of a robotic arm according to another exemplary embodiment.

[0022] Figure 3 This is a schematic diagram of the structure of a vacuum suction cup cleaning device according to an exemplary embodiment.

[0023] Figure 4 This is a schematic diagram of the structure of a vacuum suction cup cleaning device according to another exemplary embodiment.

[0024] Figure 5 This is a schematic diagram of the structure of a vacuum suction cup cleaning device according to another exemplary embodiment. Detailed Implementation

[0025] Unless otherwise defined, the technical or scientific terms used in this specification and claims shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. Specific embodiments of the invention will be described below with reference to the accompanying drawings. It should be noted that, in order to provide a concise description, this specification cannot provide a detailed description of all features of the actual embodiments. Without departing from the spirit and scope of the invention, those skilled in the art can make modifications and substitutions to the embodiments of the invention, and the resulting embodiments are also within the protection scope of the invention.

[0026] In related technologies, if the surface of the vacuum chuck is contaminated with particles, it may cause the following serious effects: when there are particulate contaminants on the back of the wafer, the wafer will be heated unevenly on the hot plate, resulting in fluctuations in the hot plate temperature, alarms after detecting the presence of particulate contaminants, and contamination of the wafer stage; low process yield.

[0027] Each foundry (FAB) cleans its vacuum chucks according to its own process characteristics, production volume, or the maintenance schedule recommended by the manufacturer.

[0028] After semiconductor equipment is shut down, maintenance personnel manually clean the vacuum suction cups inside the equipment. Equipment downtime affects shipment volume. Short maintenance cycles and high frequency of maintenance will impact shipment volume, while long maintenance cycles will affect product yield.

[0029] To address the aforementioned technical problems, this application proposes a vacuum chuck cleaning device and semiconductor equipment. This device enables automatic cleaning of the vacuum chuck on the robotic arm of the semiconductor equipment, reducing particle contamination of the vacuum chuck. This, in turn, reduces wafer drop and breakage, prevents uneven heating of the wafer on the hot plate causing temperature fluctuations, reduces the need for alarms triggered by particle contaminants, and avoids contamination of the wafer stage. Cleaning the vacuum chuck does not require stopping the semiconductor equipment or requiring maintenance personnel to manually clean it, thus extending the maintenance cycle and preventing impact on production volume. Furthermore, by reducing particle contamination of the vacuum chuck, it also improves product yield.

[0030] One embodiment of this application provides a cleaning device for a vacuum suction cup. This cleaning device can be installed or integrated into a semiconductor device, which may be a spin coater or developer, but is not limited thereto.

[0031] like Figure 1 and Figure 2As shown, the semiconductor device includes a robotic arm 10, which includes grippers 11. At least two vacuum chucks 12 are mounted on the grippers 11. For details of the vacuum chucks 12, please refer to the enlarged view of part A on the grippers 11. For example, if four vacuum chucks 12 are mounted on the grippers 11, a wafer 19 can be placed on the vacuum chucks 12 from top to bottom. The vacuum chucks 12 hold the wafer 19, and the robotic arm 10 can move within the semiconductor device to transfer the wafer 19.

[0032] like Figure 3 As shown, the cleaning device for the vacuum suction cup includes a cleaning chamber 31, a dry brush assembly (not shown), a blowing assembly 33, an air extraction assembly 34, and an isolation cover 35.

[0033] like Figure 3 and Figure 4 As shown, the isolation cover 35 is located inside the cleaning chamber 31, and the dry brush assembly is located inside the isolation cover 35. The bottom of the isolation cover 35 is provided with a first opening (not shown), which matches the edge of the vacuum suction cup 12 to be cleaned on the robotic arm 10, so that the isolation cover 35 covers the vacuum suction cup 12.

[0034] After the isolation cover 35 covers the vacuum suction cup 12, the dry brush assembly can be activated to dry brush the vacuum suction cup 12 to remove contaminants. The isolation cover 35 can prevent contaminants on the vacuum suction cup 12 from spreading and contaminating other vacuum suction cups 12.

[0035] The purging assembly 33 includes a first air outlet (not shown), which is located inside the isolation cover 35. The purging assembly 33 outputs purging gas through the first air outlet to purge the vacuum suction cup 12 after the dry brush assembly purifies the vacuum suction cup 12, so that the brushed contaminants are removed from the vacuum suction cup 12 and fly away with the purging gas.

[0036] The extraction assembly 34 includes an extraction pipe 341, which includes a first air inlet (not shown) and a second air outlet (not shown). The first air inlet is connected to the isolation cover 35, and the second air outlet is located outside the cleaning chamber 31. The extraction assembly 34 draws the contaminants that are blown by the purge gas into the extraction pipe 341 through the first air inlet and discharges them through the second air outlet.

[0037] In this embodiment, the vacuum suction cup 12 is first covered by the isolation cover 35, and then the vacuum suction cup 12 is dry-brushed by the dry brush assembly to remove contaminants from the vacuum suction cup 12. Then, the blowing assembly 33 outputs blowing gas to the vacuum suction cup 12 so that the brushed contaminants are removed from the vacuum suction cup 12 and fly away with the blowing gas. During the cleaning process, the suction assembly 34 can always be in working condition. Once the brushed contaminants are removed from the vacuum suction cup 12 and fly away with the blowing gas, the contaminants flying away with the blowing gas can be sucked into the suction pipe 341 through the first air inlet and discharged through the second air outlet. In this way, the vacuum suction cup 12 on the robotic arm 10 in the semiconductor equipment can be automatically cleaned, reducing the vacuum suction cup 12 from being contaminated by particles. This can reduce wafer drop and breakage, prevent uneven heating of the wafer on the hot plate, avoid temperature fluctuations of the hot plate, reduce the detection of particulate contaminants and alarms, prevent contamination of the wafer stage, and improve product yield.

[0038] In one embodiment, such as Figure 3 and Figure 4 As shown, the vacuum suction cup cleaning device also includes a first lifting mechanism (not shown); the dry brush assembly includes a first drive mechanism (not shown) and a brush 32. The cleaning chamber 31 includes a first top wall 311.

[0039] The first lifting mechanism is located on the first top wall 311 of the cleaning chamber 31. The first lifting mechanism can be fixedly connected to the first top wall 311 of the isolation cover 35. The first driving mechanism is fixedly connected to the isolation cover 35 and is used to drive the isolation cover 35, the first driving mechanism and the brush 32 to move up and down in the vertical direction Y. The first lifting mechanism can be a cylinder, but is not limited to it.

[0040] The first drive mechanism is connected to the brush 32 via a transmission and is used to drive the brush 32 to rotate. The first drive mechanism can be a motor.

[0041] Before the vacuum suction cup 12 enters the cleaning chamber 31, the isolation cover 35, the first drive mechanism, and the brush 32 can be located on one side near the first top wall 311 of the cleaning chamber 31. After the vacuum suction cup 12 enters the cleaning chamber 31, the first lifting mechanism can be activated. The first lifting mechanism drives the isolation cover 35, the first drive mechanism, and the brush 32 to move towards the vacuum suction cup 12 in the vertical Y direction until the isolation cover 35 covers the vacuum suction cup 12 and the brush 32 contacts the vacuum suction cup 12. When the brush 32 contacts the vacuum suction cup 12, it covers the vacuum suction cup 12. After the brush 32 contacts the vacuum suction cup 12, the first drive mechanism can be activated. The first drive mechanism drives the brush 32 to rotate to dry brush the vacuum suction cup 12.

[0042] In one embodiment, such as Figure 4As shown, the purging assembly 33 also includes a second air inlet E2 and a purging pipeline 331. The second air inlet E2 is located outside the cleaning chamber 31. The second air inlet E2 is connected to the first air outlet (not shown) via the purging pipeline 331. The purging gas enters the purging pipeline 331 through the second air inlet E2 and is output through the first air outlet.

[0043] In one embodiment, the purging gas provided by the purging assembly 33 may be an inert gas, such as nitrogen, but is not limited thereto.

[0044] In one embodiment, the first drive mechanism includes a hollow shaft (not shown), and the hollow shaft includes a first through hole (not shown).

[0045] In one embodiment, such as Figure 4 As shown, the brush 32 includes a mounting plate 321 and brush bristles 322. The brush bristles 322 are fixed to the mounting plate 321, and a hollow rotating shaft is fixedly connected to the mounting plate 321. The mounting plate 321 includes a second through hole 3211. A purge pipe 331 passes through the first through hole and the second through hole 3211. The purge pipe 331 does not contact the inner wall of the first through hole or the inner wall of the second through hole 3211, so that the purge pipe 331 is not affected when the brush 32 rotates. When the brush 32 is dry brushing the vacuum suction cup 12, the distance between the first air outlet and the mounting plate 321 is less than the distance between the end of the brush bristles 322 away from the mounting plate 321 and the mounting plate 321. In this way, the first air outlet can be prevented from affecting the brush 32's dry brushing of the vacuum suction cup 12.

[0046] In one embodiment, such as Figure 4 As shown, the purging assembly 33 also includes a first pressure gauge 332 and a first control valve 333, which are located on the side of the purging pipeline 331 near the second air inlet E2.

[0047] The first pressure gauge 332 is used to detect the first gas pressure in the purge line 331, and the first control valve 333 is used to control the flow rate of the purge gas entering the purge line 331 based on the first gas pressure and the first gas pressure range, so that the first gas pressure is within the first gas pressure range.

[0048] In one embodiment, such as Figure 4 As shown, the second top wall 351 of the isolation cover 35 includes an air extraction port 352, and the air extraction pipe 341 is connected to the air extraction port 352.

[0049] In one embodiment, such as Figure 4 As shown, the cleaning device of the vacuum suction cup 12 may include two suction pipes 341, and the second top wall 351 of the isolation cover 35 includes two suction ports 352. The two suction pipes 341 are respectively connected to different suction ports 352.

[0050] In one embodiment, such as Figure 3 As shown, the cleaning device of the vacuum suction cup 12 also includes a gate 36 and a second lifting mechanism 37.

[0051] A second opening 3121 is provided on the second side wall 312 of the cleaning chamber 31. A gate 36 is movably mounted on the second side wall 312. A second lifting mechanism 37 is used to drive the gate 36 to move up and down in the vertical direction Y to expose or block the second opening 3121. The second lifting mechanism 37 can be a cylinder, but is not limited to it.

[0052] When the second lifting mechanism 37 drives the gate 36 to move upward in the vertical direction and exposes the second opening 3121, the robotic arm 10 enters the cleaning chamber 31 through the second opening 3121.

[0053] After cleaning the vacuum suction cup 12 is completed, the robotic arm 10 exits the cleaning chamber 31 through the second opening 3121 and returns to the designated position. The second lifting mechanism 37 drives the gate 36 to move downward in the vertical direction Y and block the second opening 3121.

[0054] In one embodiment, such as Figure 3 As shown, the cleaning device of the vacuum suction cup 12 also includes an exhaust port 38, an exhaust pipe (not shown), a second pressure gauge (not shown), and a second control valve (not shown).

[0055] The exhaust port 38 is located on the first side wall 313 of the cleaning chamber 31. The exhaust pipe is connected to the exhaust port 38 and is used to discharge the gas in the cleaning chamber 31 to keep the cleaning chamber 31 clean. The second side wall 312 is opposite to the first side wall 313.

[0056] The second pressure gauge is located inside the cleaning chamber 31 and is used to detect the second gas pressure inside the cleaning chamber 31.

[0057] The second control valve is located outside the cleaning chamber 31 and on the exhaust pipe. The second control valve controls the exhaust volume of the exhaust pipe based on the second gas pressure and a second pressure range, ensuring that the second gas pressure remains within the second pressure range. The first and second control valves can be automatic or manual.

[0058] In one embodiment, such as Figure 5 As shown, the cleaning device of the vacuum suction cup 12 also includes a scanning module 39, a processor (not shown), and a controller (not shown).

[0059] The scanning module 39 is located inside the cleaning chamber 31 and on the first top wall 311 of the cleaning chamber 31. The scanning module 39 is electrically connected to the processor. The processor, dry brush assembly, blowing assembly 33, and vacuum assembly 34 are electrically connected to the controller. The robotic arm 10 is provided with at least two vacuum suction cups 12, for example, four vacuum suction cups 12.

[0060] After the vacuum suction cups 12 enter the cleaning chamber 31, the scanning module 39 scans all the vacuum suction cups 12 to obtain a first scan image. The scanning module 39 may include a guide rail and a scanning device. The guide rail is located on the first top wall 311 of the cleaning chamber 31, and the scanning device is located on the guide rail and can move along the guide rail to scan all the vacuum suction cups 12 to obtain the first scan image. The scanning device may be an electron microscope, an atomic force microscope, or other high-precision scanning equipment.

[0061] The processor performs image processing on the first scanned image to obtain a first cleanliness level for each vacuum suction cup 12. The controller can determine whether each vacuum suction cup 12 needs cleaning, the position of the vacuum suction cup 12 requiring cleaning, plan a cleaning path based on the position of the vacuum suction cup 12 requiring cleaning, and control the dry brush assembly, blowing assembly 33, and suction assembly 34 to clean the vacuum suction cup 12 requiring cleaning based on the cleaning path. After cleaning one vacuum suction cup 12, the controller can control the dry brush assembly, blowing assembly 33, suction assembly 34, and isolation cover 35 to move and clean the next vacuum suction cup 12 requiring cleaning.

[0062] In one embodiment, the controller can also be used to obtain the number of wafers transferred by the robotic arm 10 during the time interval between two consecutive cleaning operations of the vacuum chuck 12 on the robotic arm 10, and determine the cleaning cycle of the vacuum chuck 12 on the robotic arm 10 based on the number. For example, if the number of wafers transferred by the robotic arm 10 during the time interval between two consecutive cleaning operations of the vacuum chuck 12 on the robotic arm 10 is 2000, then the cleaning cycle of the vacuum chuck 12 on the robotic arm 10 is determined to be once every 2000 wafers transferred by the robotic arm 10.

[0063] In one embodiment, after the cleaning device for the vacuum suction cup 12 has completed cleaning the vacuum suction cup 12, the scanning module 39 is also used to scan all the vacuum suction cups 12 to obtain a second scan image.

[0064] In one embodiment, the processor performs image processing on the second scanned image to obtain a second cleanliness level for each vacuum suction cup 12, and determines the cleaning effect based on the second cleanliness level and a specified cleaning threshold. When the second cleanliness level is greater than the specified cleaning threshold, it is determined that the cleaning requirement has been met, and the cleaning effect is good. When the second cleanliness level is less than the specified cleaning threshold, it is determined that the cleaning requirement has not been met, and the cleaning effect is poor.

[0065] In another embodiment, the processor is further configured to compare and analyze the first scanned image and the second scanned image to determine the cleaning effect. In one embodiment, the ratio of the area of ​​contaminants in the second scanned image to the area of ​​contaminants in the first scanned image can be calculated. When this ratio is less than a specified ratio, the cleaning effect can be determined to be good; when the ratio is greater than a specified ratio, the cleaning effect can be determined to be poor. Of course, in other embodiments, other methods can also be used to compare and analyze the first scanned image and the second scanned image to determine the cleaning effect.

[0066] In one embodiment, the processor is further configured to perform image processing on the first scanned image to detect the presence of target particles larger than a specified size. When target particles are present, the processor records the target position of the target particles and a first target image of the target particles. After the cleaning device of the vacuum suction cup 12 completes cleaning of the vacuum suction cup 12, the processor is further configured to extract a second target image from the second scanned image based on the target position of the target particles, and compare and analyze the first target image and the second target image to determine the cleaning effect. In this way, the cleaning effect of large particulate pollutants can be determined.

[0067] In this embodiment of the application, the vacuum suction cup 12 can be cleaned without stopping the semiconductor equipment or requiring maintenance personnel to enter the equipment to manually clean the vacuum suction cup 12.

[0068] In this embodiment, cleaning parameters such as the automatic cleaning cycle and cleaning time can be preset. The controller can control the cleaning device of the vacuum suction cup 12 to perform automatic cleaning according to the cleaning parameters. Therefore, the maintenance cycle can be extended, thereby avoiding the impact on the output. Since the vacuum suction cup 12 is less susceptible to particulate contamination, the product yield can also be improved.

[0069] The cleaning device for the vacuum suction cup 12 provided in this application embodiment can also scan the robotic arm 10 through the scanning module 39 to check the status of the robotic arm 10.

[0070] The cleaning device for the vacuum suction cup 12 provided in this application embodiment reduces and avoids particulate contamination of the vacuum suction cup 12 on the robotic arm 10, thereby reducing downtime maintenance frequency and time, reducing loss of goods, and improving product yield.

[0071] The vacuum suction cup 12 cleaning device provided in this application embodiment can realize automated maintenance and upkeep of semiconductor equipment, and can also play a certain role in preventing process defects.

[0072] Another embodiment of this application provides a semiconductor device including a robotic arm 10 and a cleaning apparatus for vacuum suction cups 12 of any of the above embodiments. The robotic arm 10 includes at least two vacuum suction cups 12. The semiconductor device may be a spin coater or developer, but is not limited thereto.

[0073] In this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0074] The above description of the embodiments is intended to enable those skilled in the art to understand and apply this application. It will be apparent to those skilled in the art that various modifications can be easily made to these embodiments, and the general principles described herein can be applied to other embodiments without creative effort. Therefore, this application is not limited to the embodiments described herein, and any improvements and modifications made by those skilled in the art based on the disclosure of this application without departing from the scope and spirit of this application are within the scope of this application.

Claims

1. A cleaning device for a vacuum suction cup, characterized in that, include: Cleaning chamber, dry brush assembly, isolation hood, purging assembly and extraction assembly; The isolation cover is located inside the cleaning chamber, the dry brush assembly is located inside the isolation cover, and the bottom of the isolation cover is provided with a first opening, which matches the edge of the vacuum suction cup to be cleaned on the robotic arm, so that the isolation cover covers the vacuum suction cup; After the isolation cover covers the vacuum suction cup, the dry brush assembly is used to dry brush the vacuum suction cup to remove contaminants on the vacuum suction cup. The purging assembly includes a first air outlet located inside the isolation cover. The purging assembly outputs purging gas through the first air outlet to purge the vacuum suction cup after dry brushing it, so that the brushed contaminants are removed from the vacuum suction cup and fly away with the purging gas. The extraction assembly includes an extraction pipe with a first air inlet and a second air outlet. The first air inlet is connected to the isolation cover, and the second air outlet is located outside the cleaning chamber. The extraction assembly draws pollutants carried by the purge gas into the extraction pipe through the first air inlet and discharges them through the second air outlet.

2. The cleaning device for the vacuum suction cup as described in claim 1, characterized in that, It also includes the first lifting mechanism; The dry brush assembly includes a first drive mechanism and a brush; the cleaning chamber includes a first top wall; The first lifting mechanism is located on the first top wall and is used to drive the isolation cover, the first drive mechanism and the brush to move up and down in the vertical direction; the first drive mechanism is connected to the brush and is used to drive the brush to rotate. Before the vacuum suction cup enters the cleaning chamber, the isolation cover, the first drive mechanism, and the brush are located on one side close to the first top wall; When the vacuum suction cup enters the cleaning chamber, the first lifting mechanism drives the isolation cover, the first driving mechanism, and the brush to move vertically toward the vacuum suction cup until the isolation cover covers the vacuum suction cup and the brush contacts the vacuum suction cup; when the brush contacts the vacuum suction cup, it covers the vacuum suction cup. When the brush comes into contact with the vacuum suction cup, the first driving mechanism drives the brush to rotate in order to dry brush the vacuum suction cup.

3. The cleaning device for the vacuum suction cup as described in claim 2, characterized in that, The purging assembly further includes a second air inlet and a purging pipeline. The second air inlet is located outside the cleaning chamber. The second air inlet is connected to the first air outlet via the purging pipeline. The purging gas enters the purging pipeline through the second air inlet and is output through the first air outlet. The first driving mechanism includes a hollow rotating shaft, and the hollow rotating shaft includes a first through hole; The brush includes a mounting plate and brush bristles, the brush bristles are fixed on the mounting plate, and the hollow rotating shaft is fixedly connected to the mounting plate; the mounting plate includes a second through hole; The purging pipe passes through the first through hole and the second through hole. When the brush is dry brushing the vacuum suction cup, the distance between the first air outlet and the mounting plate is less than the distance between the end of the brush bristles away from the mounting plate and the mounting plate.

4. The cleaning device for the vacuum suction cup as described in claim 3, characterized in that, The purging assembly also includes a first pressure gauge and a first control valve, wherein the first pressure gauge and the first control valve are located on the side of the purging pipeline near the second air inlet; The first pressure gauge is used to detect the first gas pressure in the purge pipeline, and the first control valve is used to control the flow rate of the purge gas entering the purge pipeline based on the first gas pressure and the first pressure range, so that the first gas pressure is within the first pressure range.

5. The cleaning device for the vacuum suction cup as described in claim 1, characterized in that, The second top wall of the isolation cover includes an air extraction port, and the air extraction pipeline is connected to the air extraction port.

6. The cleaning device for the vacuum suction cup as described in claim 1, characterized in that, It also includes a scanning module, a processor, and a controller. The scanning module is located inside the cleaning chamber and on the first top wall of the cleaning chamber. The scanning module is electrically connected to the processor. The processor, the dry brush assembly, the blowing assembly, and the air extraction assembly are respectively electrically connected to the controller. The robotic arm is equipped with at least two of the vacuum suction cups; The scanning module is used to scan all the vacuum suction cups after the vacuum suction cups enter the cleaning chamber to obtain a first scan image; The processor is used to perform image processing on the first scanned image to obtain a first cleanliness level for each of the vacuum suction cups; The controller is used to determine whether the vacuum suction cup needs cleaning, the location of the vacuum suction cup that needs cleaning, the location of the vacuum suction cup that needs cleaning, the location of the vacuum suction cup that needs cleaning, and the control of the dry brush assembly, the blowing assembly and the air extraction assembly to clean the vacuum suction cup that needs cleaning based on the cleaning path.

7. The cleaning device for the vacuum suction cup as described in claim 6, characterized in that, The controller is also used to obtain the number of wafers transferred by the robotic arm during the time period between two consecutive cleaning operations of the vacuum chuck on the robotic arm, and to determine the cleaning cycle of the vacuum chuck on the robotic arm based on the number.

8. The cleaning device for the vacuum suction cup as described in claim 6, characterized in that, After cleaning the vacuum suction cups, the scanning module is also used to scan all the vacuum suction cups to obtain a second scan image; The processor is further configured to perform image processing on the second scanned image to obtain a second cleanliness level for each of the vacuum suction cups, and determine the cleaning effect based on the second cleanliness level and a specified cleaning threshold; or, The processor is also used to compare and analyze the first scanned image and the second scanned image to determine the cleaning effect.

9. The cleaning device for the vacuum suction cup as described in claim 8, characterized in that, The processor is further configured to perform image processing on the first scanned image, detect whether there is a target particle with a size larger than a specified size, and when the target particle exists, record the target position of the target particle and the first target image of the target particle; The processor is also configured to extract a second target image from the second scanned image based on the target location, and to compare and analyze the first target image and the second target image to determine the cleaning effect.

10. The cleaning device for the vacuum suction cup as described in claim 1, characterized in that, It also includes an exhaust port, an exhaust pipe, a second pressure gauge, and a second control valve; The exhaust port is located on the first side wall of the cleaning chamber, and the exhaust pipe is connected to the exhaust port to discharge the gas in the cleaning chamber and keep the cleaning chamber clean. The second pressure gauge is located inside the cleaning chamber and is used to detect the second gas pressure inside the cleaning chamber; The second control valve is located outside the cleaning chamber and on the exhaust pipe. The second control valve is used to control the exhaust volume of the exhaust pipe based on the second gas pressure and the second pressure range, so that the second gas pressure is within the second pressure range.

11. The cleaning device for the vacuum suction cup as described in claim 10, characterized in that, It also includes the gate and the second lifting mechanism; The second side wall of the cleaning chamber is provided with a second opening, and the gate is movably installed on the second side wall. The second lifting mechanism is used to drive the gate to move up and down in the vertical direction to expose the second opening or cover the second opening. The second sidewall is opposite to the first sidewall; When the second lifting mechanism drives the gate to move upward in the vertical direction and exposes the second opening, the robotic arm enters the cleaning chamber through the second opening; After cleaning the vacuum suction cup is completed, the robotic arm exits the cleaning chamber through the second opening, and the second lifting mechanism drives the gate to move downward in the vertical direction and block the second opening.

12. The cleaning device for the vacuum suction cup as described in claim 6, characterized in that, It also includes an output module, which is electrically connected to the processor; The scanning module is also used to scan the robotic arm after it enters the cleaning chamber to obtain a third scan image; The processor is used to perform image processing on the third scanned image to obtain the status information of the robotic arm. The status information includes at least one of the contaminant information on the vacuum suction cup, the scratch information of the robotic arm, and the deformation information. The output module is used to output the status information.

13. A semiconductor device, characterized in that, The cleaning device includes the robotic arm and the vacuum suction cup as described in any one of claims 1 to 12; the robotic arm includes the vacuum suction cup.

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