Wafer electroplating cleaning sump

Abstract

The application discloses a kind of wafer electroplating cleaning collecting cover, comprising: cover, cover is cylindrical structure, with inner wall surface and outer wall surface;Inner cover, the inner cover is set to the inside of the cover, and the inner cover is spaced apart from cover and forms collecting cavity;The inner wall surface of the cover and the outer wall surface of the inner cover are provided with flow guide groove, and the flow guide groove extends along the circumference and axial direction of the collecting cover;Spout, spout is set to the inside of the inner cover, for spraying cleaning chemical liquid to wafer surface;Liquid outlet, liquid outlet is connected to the bottom of the cover, and is communicated with the collecting cavity;Wafer is clamped in the inner cover by mechanical arm and rotates at high speed, and the cleaning chemical liquid sprayed by spout is thrown to the inner wall surface of the cover by centrifugal force, then is drained to the bottom of the collecting cavity by the flow guide groove and is discharged by the liquid outlet.The application avoids that chemical liquid is accumulated and dripped on the inner wall surface of cover body in large area, significantly improves the collection efficiency and discharge speed of chemical liquid.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more particularly to a wafer electroplating cleaning liquid collection cover. Background Technology

[0002] ECP (electrochemical plating) is a key process step in semiconductor manufacturing used to deposit one or more layers of metal (such as copper, aluminum, etc.) on semiconductor substrates. After the wafer electroplating process is completed, electroplating chemicals remain on the wafer surface and wafer jig, which need to be removed through a cleaning process. Typically, the wafer is held by a robotic arm and rotated at high speed, while a cleaning chemical solution is sprayed onto the wafer surface. Centrifugal force is then used to fling the cleaning solution off the wafer surface, thereby achieving the cleaning purpose.

[0003] During the cleaning process, the splashed cleaning chemicals need to be effectively collected to prevent splashing and environmental pollution, and also to avoid the cleaning solution falling into the electroplating tank, diluting the electroplating chemicals, and affecting the stability of the electroplating process. In existing technologies, a protective cover is typically installed above the wafer electroplating chamber to collect the splashed cleaning solution. However, existing collection covers have relatively simple structures, resulting in low collection efficiency, and the solution tends to accumulate and drip on the inner wall of the cover, making it difficult to quickly and smoothly drain it through the outlet.

[0004] In addition, the wafer electroplating cleaning process usually involves the sequential use of multiple different solutions. Existing liquid collection hoods are unable to achieve separate chamber collection and classified discharge of different solutions, which increases the risk of cross-contamination of solutions and the difficulty of post-processing.

[0005] Therefore, there is an urgent need for an ECP wafer electroplating cleaning liquid collection hood that can efficiently collect and divert cleaning chemical solutions. Summary of the Invention

[0006] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0007] In view of the problems existing in the current wafer electroplating cleaning liquid collection hood, the present invention is proposed.

[0008] Therefore, the purpose of this invention is to provide a wafer electroplating cleaning liquid collection cover, which avoids the accumulation and dripping of the liquid on a large area of ​​the inner wall of the cover, and significantly improves the collection efficiency and discharge speed of the liquid.

[0009] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a wafer electroplating cleaning liquid collection cover, comprising: The outer cover has a cylindrical structure and has an inner wall surface and an outer wall surface; An inner cover is disposed inside the outer cover, and a liquid collection cavity is formed between the inner cover and the outer cover; The inner wall surface of the outer cover and the outer wall surface of the inner cover are provided with guide grooves, which extend along the circumference and axial direction of the liquid collection cover. The nozzle is located inside the inner cover and is used to spray cleaning chemicals onto the wafer surface. A liquid outlet is connected to the bottom of the outer cover and communicates with the liquid collection chamber; The wafer is held in the inner cover by a robotic arm and rotated at high speed. The cleaning chemical solution sprayed from the nozzle is thrown to the inner wall of the outer cover by centrifugal force, and then guided to the bottom of the liquid collection chamber through the guide groove and discharged from the liquid outlet.

[0010] As a preferred embodiment of the wafer electroplating cleaning liquid collection cover of the present invention, the outer cover includes an upper section and a lower section, the upper section of the outer cover has a trumpet-shaped opening structure, the lower section of the outer cover has a straight cylindrical structure, and the lower end of the upper section of the outer cover is integrally connected to the upper end of the lower section of the outer cover.

[0011] As a preferred embodiment of the wafer electroplating cleaning liquid collection cover of the present invention, the inner cover includes an upper section and a lower section. The upper section of the inner cover has a trumpet-shaped opening structure, and the lower section of the inner cover has a straight cylindrical structure. The lower end of the upper section of the inner cover is integrally connected to the upper end of the lower section of the inner cover, and the opening diameter of the upper section of the inner cover is larger than the opening diameter of the upper section of the outer cover.

[0012] In a preferred embodiment of the wafer electroplating cleaning liquid collection hood of the present invention, an upper liquid collection cavity is formed between the inner wall surface of the upper section of the outer cover and the outer wall surface of the upper section of the inner cover, and a lower liquid collection cavity is formed between the inner wall surface of the lower section of the outer cover and the outer wall surface of the lower section of the inner cover, and the upper liquid collection cavity and the lower liquid collection cavity are interconnected.

[0013] As a preferred embodiment of the wafer electroplating cleaning liquid collection cover of the present invention, the guide channel includes a first guide channel and a second guide channel. The first guide channel is disposed on the inner wall surface of the outer cover, and the second guide channel is disposed on the outer wall surface of the inner cover. The first guide channel and the second guide channel are arranged opposite to each other or staggered in the radial direction.

[0014] As a preferred embodiment of the wafer electroplating cleaning liquid collection hood of the present invention, the first guide channel and the second guide channel are spiral guide channels, the spiral direction of the spiral guide channel is the same as or opposite to the rotation direction of the wafer, the bottom wall of the guide channel is an inclined surface, the inclined surface gradually decreases from the upper end to the lower end of the guide channel, and the inclination angle is 5° to 30°.

[0015] As a preferred embodiment of the wafer electroplating cleaning liquid collection hood of the present invention, wherein: the spraying direction of the nozzle 500 is toward the surface of the wafer, and the angle between the spraying direction of the nozzle and the normal direction of the wafer surface is 15° to 75°.

[0016] As a preferred embodiment of the wafer electroplating cleaning liquid collection cover of the present invention, the bottom of the outer cover is provided with a liquid collection tray, the bottom surface of the liquid collection tray is a conical bottom surface, and the connection port of the liquid outlet is opened at the lowest point of the conical bottom surface.

[0017] The beneficial effects of this invention are: This invention provides a flow guide channel on the inner wall of the outer cover and the outer wall of the inner cover, allowing the cleaning chemical solution thrown to the inner wall of the outer cover by centrifugal force to flow quickly and smoothly to the bottom of the collection chamber. This avoids the large-area accumulation and dripping of the solution on the inner wall of the cover, and significantly improves the collection efficiency and discharge speed of the solution.

[0018] This invention forms a dual flow channel by setting a first flow channel on the inner wall of the outer cover and a second flow channel on the outer wall of the inner cover, respectively. Whether the liquid medicine is thrown onto the inner wall of the outer cover or flows down along the outer wall of the inner cover, it can be effectively captured and guided by the flow channel, achieving liquid medicine collection without dead angles. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the overall structure of the wafer electroplating cleaning liquid collection cover of the present invention.

[0020] Figure 2 This is a bottom view of the wafer electroplating cleaning liquid collection cover of the present invention.

[0021] Figure 3 This is a side view of the wafer electroplating cleaning liquid collection cover of the present invention.

[0022] Figure 4 This is a schematic diagram of the inner cover structure of the wafer electroplating cleaning liquid collection cover of the present invention. Detailed Implementation

[0023] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0024] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0025] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0026] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0027] Reference Figures 1-4 This embodiment provides a wafer electroplating cleaning liquid collection cover, including an outer cover 100, an inner cover 200, a guide channel 400, a nozzle 500, and a liquid outlet 600.

[0028] The outer casing 100 has a cylindrical structure with an inner wall and an outer wall. In this embodiment, the outer casing 100 includes an upper section and a lower section. The upper section has a funnel-shaped opening, gradually narrowing from top to bottom. This structure increases the opening area, facilitating the collection of liquid ejected from the wafer surface and guiding the liquid to the lower section. The lower section has a straight cylindrical structure, with its inner diameter matching the lower inner diameter of the upper section. The lower end of the upper section and the upper end of the lower section are integrally connected to ensure the integrity and sealing of the structure. In other embodiments, the two sections can also be sealed together by means of flange connection, welding, etc.

[0029] The inner cover 200 is disposed inside the outer cover 100 and is coaxially arranged with the outer cover 100. The inner cover 200 also includes an upper section and a lower section. The upper section of the inner cover has a funnel-shaped opening structure, and the lower section of the inner cover has a cylindrical structure. The lower end of the upper section of the inner cover is integrally connected to or sealed to the upper end of the lower section of the inner cover. The opening diameter of the upper section of the inner cover is larger than the opening diameter of the upper section of the outer cover. This arrangement allows the upper edge of the inner cover 200 to extend outward beyond the upper edge of the outer cover 100, which can better receive and guide the liquid ejected from the wafer surface into the liquid collection chamber 300 between the outer cover 100 and the inner cover 200, preventing the liquid from splashing outside the liquid collection chamber.

[0030] A liquid collection chamber 300 is formed between the inner cover 200 and the outer cover 100. Specifically, an upper liquid collection chamber is formed between the inner wall surface of the upper section of the outer cover and the outer wall surface of the upper section of the inner cover, and a lower liquid collection chamber is formed between the inner wall surface of the lower section of the outer cover and the outer wall surface of the lower section of the inner cover. The upper and lower liquid collection chambers are interconnected to form a complete liquid collection channel.

[0031] A nozzle 500 is disposed inside the inner cover 200 and is used to spray cleaning chemicals onto the wafer surface. In this embodiment, there are multiple nozzles 500, which are evenly distributed around the circumference of the inner cover 200 to ensure that all areas of the wafer surface are adequately cleaned. The spray direction of each nozzle 500 is directed towards the wafer surface. Preferably, the angle between the spray direction of the nozzle 500 and the normal direction of the wafer surface is 15° to 75°. Within this angle range, the cleaning solution can act on the wafer surface at an appropriate impact angle, ensuring the cleaning effect while also facilitating the ejection of the solution under centrifugal force.

[0032] The outlet 600 is connected to the bottom of the outer cover 100 and communicates with the collection chamber 300 to discharge the collected cleaning chemical solution from the collection cover.

[0033] The guide channel 400 is disposed on the inner wall surface of the outer cover 100 and the outer wall surface of the inner cover 200, and extends along the circumference and axial direction of the liquid collection cover. The cross-sectional shape of the guide channel 400 can be V-shaped, U-shaped, rectangular or trapezoidal, etc., preferably V-shaped or U-shaped, so as to facilitate the collection and flow of the liquid in the channel.

[0034] In this embodiment, the flow guide 400 includes a first flow guide trough and a second flow guide trough. The first flow guide trough is disposed on the inner wall surface of the outer cover 100, and the second flow guide trough is disposed on the outer wall surface of the inner cover 200. The first flow guide trough and the second flow guide trough are arranged opposite to each other or staggered in the radial direction. When they are arranged opposite to each other, the liquid medicine flows down from the inner wall of the outer cover 100 through the first flow guide trough, and at the same time flows down from the outer wall of the inner cover 200 through the second flow guide trough, forming a double flow guide channel that does not interfere with each other. When they are arranged staggered, the coverage density of the flow guide trough can be increased, and the flow guiding effect can be improved.

[0035] Specifically, the first and second guide channels are spiral-shaped. The spiral-shaped guide channels extend downwards in a circumferential spiral along the outer casing 100 or the inner casing 200. The spiral direction of the guide channels can be the same as or opposite to the wafer's rotation direction. When the spiral direction is the same as the wafer's rotation direction, the ejected liquid is more easily drawn into the guide channels and flows along the spiral direction under centrifugal force; when the spiral direction is opposite to the wafer's rotation direction, the collision between the liquid and the guide channel wall is more complete, which helps to break the surface tension of the liquid and accelerate its flow. In practical applications, a suitable spiral direction can be selected according to the properties of the liquid and process requirements.

[0036] The bottom wall of the guide channel 400 is an inclined surface, which gradually decreases from the upper end to the lower end of the guide channel 400, with an inclination angle α of 5° to 30°. The inclined bottom wall ensures that the liquid medicine, in addition to gravity, is also subjected to a downward component force along the inclined surface within the guide channel 400, further accelerating the flow of the liquid medicine towards the bottom of the collection chamber 300. If the inclination angle is too small, the acceleration effect will be insignificant; if the inclination angle is too large, the liquid medicine may splash due to excessive flow velocity. 5° to 30° is the optimal range.

[0037] A liquid collecting tray 700 is provided at the bottom of the outer cover 100. The liquid collecting tray 700 has a disc-shaped structure, and its outer edge is sealed to the bottom of the outer cover 100. The bottom surface of the liquid collecting tray 700 is conical, that is, the bottom surface of the liquid collecting tray 700 gradually decreases from the edge to the center, forming a conical funnel structure. A liquid outlet 600 is provided at the lowest point of the conical bottom surface.

[0038] The conical bottom surface 710 allows the liquid medicine flowing into the collection tray 700 to automatically converge to the lowest point under the influence of gravity, and then be discharged through the connection port 720 into the outlet 600. This structure ensures that there is no liquid medicine residue in the collection tray 700, achieving complete drainage. The cone angle of the conical bottom surface 710 is preferably 120° to 160°, that is, the inclination angle of the bottom surface is 10° to 30°, which ensures that the liquid medicine can flow smoothly while avoiding an excessively steep cone that would cause the collection tray 700 to occupy too much vertical space.

[0039] Working process: The wafer is held in the inner casing 200 by a robotic arm and rotates at high speed under the drive of the drive device. The nozzle 500 sprays cleaning chemicals onto the wafer surface. Under centrifugal force, the chemicals are thrown onto the inner wall of the outer casing 100, flowing along the inner wall into the bottom of the collection chamber 300, and finally discharged from the outlet 600. After being thrown onto the inner wall of the outer casing 100, the chemicals flow downwards along the wall under gravity. Because the inner wall of the outer casing 100 is provided with a guide groove 400, the chemicals can be effectively captured and guided to the bottom of the collection chamber 300, avoiding the problems of large-area dispersion, retention, or dripping of the chemicals on the smooth wall surface, significantly improving collection efficiency.

[0040] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A wafer electroplating cleaning liquid collection cover, characterized in that, include: The outer cover (100) has a cylindrical structure and has an inner wall surface and an outer wall surface; Inner cover (200), the inner cover (200) is disposed inside the outer cover (100), and a liquid collection cavity (300) is formed between the inner cover (200) and the outer cover (100). The inner wall surface of the outer cover (100) and the outer wall surface of the inner cover (200) are provided with guide grooves (400), which extend along the circumference and axial direction of the liquid collection cover. The nozzle (500) is disposed on the inner side of the inner cover (200) and is used to spray cleaning chemical solution onto the surface of the wafer (10); The liquid outlet (600) is connected to the bottom of the outer cover (100) and communicates with the liquid collection chamber (300); The wafer is held in the inner cover (200) by a robotic arm and rotates at high speed. The cleaning chemical solution sprayed from the nozzle (500) is thrown to the inner wall of the outer cover (100) by centrifugal force, and then guided to the bottom of the liquid collection chamber (300) through the guide groove (400) and discharged from the liquid outlet (600).

2. The wafer electroplating cleaning liquid collection cover according to claim 1, characterized in that: The outer cover (100) includes an upper section and a lower section. The upper section has a trumpet-shaped opening structure, and the lower section has a straight cylindrical structure. The lower end of the upper section is integrally connected to the upper end of the lower section.

3. The wafer electroplating cleaning liquid collection cover according to claim 2, characterized in that: The inner cover (200) includes an upper section and a lower section. The upper section has a trumpet-shaped opening structure, and the lower section has a cylindrical structure. The lower end of the upper section is integrally connected to the upper end of the lower section. The opening diameter of the upper section is larger than the opening diameter of the upper section of the outer cover.

4. The wafer electroplating cleaning liquid collection cover according to claim 3, characterized in that: An upper liquid collection cavity is formed between the inner wall surface of the upper section of the outer cover and the outer wall surface of the upper section of the inner cover, and a lower liquid collection cavity is formed between the inner wall surface of the lower section of the outer cover and the outer wall surface of the lower section of the inner cover. The upper liquid collection cavity and the lower liquid collection cavity are interconnected.

5. The wafer electroplating cleaning liquid collection cover according to claim 1, characterized in that: The guide channel (400) includes a first guide channel and a second guide channel. The first guide channel is disposed on the inner wall surface of the outer cover (100), and the second guide channel is disposed on the outer wall surface of the inner cover (200). The first guide channel and the second guide channel are arranged opposite to each other or staggered in the radial direction.

6. The wafer electroplating cleaning liquid collection hood according to claim 5, characterized in that: The first and second guide channels are spiral guide channels. The spiral direction of the spiral guide channel is the same as or opposite to the rotation direction of the wafer. The bottom wall of the guide channel (400) is an inclined surface. The inclined surface gradually decreases from the upper end to the lower end of the guide channel (400), and the inclination angle is 5° to 30°.

7. The wafer electroplating cleaning liquid collection cover according to claim 1, characterized in that: The nozzle (500) sprays towards the surface of the wafer, and the angle between the spray direction of the nozzle (500) and the normal direction of the wafer surface is 15° to 75°.

8. The wafer electroplating cleaning liquid collection cover according to claim 1, characterized in that: The bottom of the outer cover (100) is provided with a liquid collection tray (700), the bottom surface of the liquid collection tray (700) is a conical bottom surface, and the connection port of the liquid outlet (600) is opened at the lowest point of the conical bottom surface.

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